Resin substrate, light guide plate, waveguide device, optical member for eyewear, and wearable device

Abstract

A resin substrate according to an embodiment of the present disclosure contains an episulfide resin having a refractive index of 1.60 or more or a thiourethane resin having a refractive index of 1.60 or more. A light guide plate according to an embodiment of the present disclosure comprises the aforementioned resin substrate. A waveguide device according to an embodiment of the present disclosure is provided with the aforementioned light guide plate and a diffraction grating or a hologram element formed on the light guide plate. An optical member for eyewear according to an embodiment of the present disclosure comprises a resin lens base material and the aforementioned waveguide device . A wearable device according to an embodiment of the present disclosure is provided with the aforementioned optical member for eyewear.

Description

Resin substrates, light guide plates, waveguide devices, optical components for eyewear, and wearable devices

[0001] The present disclosure relates to a resin substrate, a light guide plate, a waveguide device, an optical member for eyewear, and a wearable device.

[0002] In augmented reality (AR) wearable devices such as head-mounted displays, it has been proposed to use a light guide plate made of a high-refractive index glass substrate in order to expand the field of view (FOV) (for example, Patent Document 1).

[0003] The projected light emitted from this type of AR wearable device passes through a light guide plate and travels to the field of vision of the device wearer, where it is focused using a diffraction grating or the like, and transmitted light from outside is delivered to the field of vision of the device wearer together with the projected light.

[0004] JP 2022-97824 A

[0005] High density (3.0-5.5 g / cm ３ While it is possible to increase the refractive index of a glass substrate by selecting a glass composition, this hinders weight reduction in wearable devices and reduces the manufacturing yield and processability of the glass substrate. Therefore, efforts have been made to manufacture light guide plates using resin compositions with low density and high refractive index. Therefore, the present disclosure aims to provide novel resin substrates, light guide plates, waveguide devices, optical components for eyewear, and wearable devices.

[0006] A resin substrate according to an embodiment of the present disclosure contains an episulfide resin having a refractive index of 1.60 or more, or a thiourethane resin having a refractive index of 1.60 or more.

[0007] The light guide plate according to an embodiment of the present disclosure is made of the resin substrate described above.

[0008] A waveguide device according to an embodiment of the present disclosure includes the above-described light guide plate and a diffraction grating or hologram element formed on the light guide plate.

[0009] An eyewear optical member according to an embodiment of the present disclosure includes a resin lens substrate and the aforementioned waveguide device.

[0010] A wearable device according to one embodiment of the present disclosure includes the aforementioned optical member for eyewear.

[0011] The present disclosure can provide novel resin substrates, light guide plates, waveguide devices, optical components for eyewear, and wearable devices.

[0012] FIG. 1 is a schematic cross-sectional view showing one embodiment of a light guide plate according to this embodiment. FIG. 2 is a conceptual diagram showing one embodiment of a resin substrate according to this embodiment. FIG. 3 is a diagram showing a method for manufacturing a resin substrate according to this embodiment. FIG. 4 is a diagram showing the transmittance of the resin substrate of Example 1. FIG. 5 is a diagram showing the internal transmittance of the resin substrate of Example 1. FIG. 6 is a diagram showing the transmittance of the resin substrate of Example 2. FIG. 7 is a diagram showing the internal transmittance of the resin substrate of Example 2. FIG. 8 is a diagram showing the transmittance of the resin substrate of Example 3. FIG. 9 is a diagram showing the internal transmittance of the resin substrate of Example 3.

[0013] Hereinafter, an embodiment of the present disclosure (hereinafter referred to as "the present embodiment") will be described in detail, but the present invention is not limited thereto, and various modifications are possible without departing from the gist of the present invention. In this specification, for example, when a numerical range is expressed as "1 to 100," it is intended to include both the lower limit "1" and the upper limit "100." The same applies to other numerical ranges.

[0014] 1 is a schematic cross-sectional view showing an embodiment of a waveguide device according to the present invention. The waveguide device 1 includes a light guide plate 10 containing a resin, a diffraction grating 52, and a diffraction grating 32. The diffraction grating 52 and the diffraction grating 32 are each formed on one main surface of the light guide plate 10. Light of each wavelength is introduced into the diffraction grating 52 from the image display device 24.

[0015] The image display device 24 is, for example, a transmissive liquid crystal (LCD T-LCOS) panel driven by a field sequential method. The image display device 24 modulates light of each wavelength in accordance with an image signal generated by an image engine (not shown) of the signal processing device 5. The light of each wavelength modulated by the pixels in the effective area of ​​the image display device 24 is incident on the light guide plate 10 with a predetermined luminous flux cross section (approximately the same shape as the effective area). Note that the image display device 24 can also be replaced with other types of display elements, such as a DMD (Digital Mirror Device), a reflective liquid crystal (LCOS) panel, a MEMS (Micro Electro Mechanical Systems), an organic EL (Electro-Luminescence), or an inorganic EL.

[0016] 1, a diffraction grating 52 is laminated on the second surface 10b of the light guide plate 10. The diffraction grating 52 may have, for example, an interference fringe pattern pitch. A hologram element may also be used as the diffraction grating 52.

[0017] The light of each wavelength modulated by the image display device 24 is sequentially incident on the first surface 10a into the light guide plate 10.

[0018] The diffraction grating 52 diffracts the light of each wavelength incident sequentially at a predetermined angle to guide it to the wearer's eye. The light of each wavelength diffracted by the diffraction grating 52 is repeatedly totally reflected at the interface between the light guide plate 10 and the air, propagates inside the light guide plate 10, and is then incident on the diffraction grating 32.

[0019] The light of each wavelength incident on the diffraction grating 32 is diffracted by the diffraction grating 32 and sequentially emitted approximately perpendicularly to the outside from the second surface 10b of the light guide plate 10. The light of each wavelength thus emitted as approximately parallel light is formed on the wearer's retina as a virtual image I of the image generated by the image display device 24.

[0020] <Light Guide Plate> The light guide plate 10 in the waveguide device 1 according to this embodiment contains a resin. By using a base material containing a resin as the base material, it is possible to use a material that has a high refractive index but a relatively low density, which enables the weight of the wearable device to be reduced.

[0021] The shape of the substrate of the light guide plate is not particularly limited, but may be a quadrilateral plate.

[0022] [Resin Substrate] The light guide plate described above may be produced by molding a resin into a desired shape, or by cutting it out of a resin substrate. Fig. 2 is a diagram showing the outline of the resin substrate according to this embodiment. The resin substrate 100 has a disk shape. A base material 10 of the light guide plate is cut out from the resin substrate 100 and used.

[0023] The thickness of the resin substrate is preferably 0.1 to 2.0 mm, more preferably 0.2 to 1.5 mm, and even more preferably 0.3 to 1.0 mm. The thickness of the resin substrate is the thickness of the light guide plate. The thickness of the resin substrate or the substrate of the light guide plate can be measured using an ultrasonic thickness gauge.

[0024] The resin substrate according to this embodiment may have a disk-like shape, but is not particularly limited thereto. The diameter of the disk is also not particularly limited, but may be, for example, 50 mm to 450 mm, or 60 mm to 150 mm. The resin substrate according to this embodiment may have a shape that does not have a base curve, such as a convex or concave surface, like a lens substrate, and may be, for example, a flat plate shape.

[0025] Examples of resins used for the resin substrate include episulfide resins and urethane resins.

[0026] (Episulfide Resin) The episulfide resin is a cured product of a polymerizable composition containing an epithio compound. Here, the polymerizable composition may contain other monomers.

[0027] The episulfide resin preferably has an elemental composition with an oxygen atom content of 10% by mass or less. When a monomer is blended so that oxygen atoms that easily impart polarity are present in the resin at 10% by mass or less, the resin becomes hydrophobic and a resin with excellent weather resistance is obtained. The oxygen atom content in the episulfide resin is preferably 8% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less. The oxygen content of the episulfide resin can be measured by elemental analysis.

[0028] Examples of the epithio compound include bis(β-epithiopropyl) sulfide, bis(β-epithiopropyl) disulfide, etc. The content of the epithio compound in the polymerizable composition is preferably 50 to 98% by mass, more preferably 60 to 96% by mass, and even more preferably 70 to 96% by mass.

[0029] The polymerizable composition for forming the episulfide resin preferably contains a thioether compound having a mercapto group in addition to the epithio compound. By containing the thioether compound having a mercapto group in the polymerizable composition, the transparency of the resulting episulfide resin can be increased. The thioether compound having a mercapto group preferably does not contain an oxygen atom. The thioether compound having a mercapto group is preferably a compound having a cyclic thioether skeleton. The thioether compound having a mercapto group is preferably a compound represented by the formula (T1): (In the formula, R １ and R ２ are each independently a divalent hydrocarbon group having 1 to 6 carbon atoms, and m and n are each independently 0 or 1.

[0030] Specific examples of the thioether compound having a mercapto group include bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptoethyl)dithiane, and bis(mercaptomethyl)dithiane. The thioether compound having a mercapto group preferably includes at least one selected from the group consisting of these compounds.

[0031] Among the above, the episulfide resin is preferably a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond and bis(mercaptomethyl)dithiane.

[0032] The content of the thioether compound having a mercapto group is 10 to 20% by mass, more preferably 12 to 19% by mass, and more preferably 13 to 18% by mass, based on the total amount of the polymerizable composition.

[0033] The polymerizable composition preferably further contains elemental sulfur in combination with the epithio compound. The content of elemental sulfur in the polymerizable composition is preferably 1 to 30% by mass, more preferably 5 to 20% by mass, and even more preferably 10 to 20% by mass or more.

[0034] The polymerizable composition preferably contains a polymerization catalyst, for example, a tin compound such as dibutyltin diacetate, dibutyltin dilaurate, dibutyltin dichloride, or dimethyltin dichloride, a nitrogen-containing compound such as a tertiary amine, a quaternary ammonium salt, an imidazole compound, or a pyrazole compound, or a phosphorus-containing compound such as tetrabutylphosphonium bromide.

[0035] When an epithio compound is contained, the amount of the polymerization catalyst added in the polymerizable composition is preferably 0.001 to 2 parts by mass, more preferably 0.005 to 1 part by mass, and still more preferably 0.01 to 0.5 parts by mass, relative to 100 parts by mass of the total amount of the epithio compounds.

[0036] (Urethane-based resin) Urethane-based resin is the cured product of the polymerizable composition that comprises isocyanate component and active hydrogen compound component.As urethane-based resin, there can be mentioned the thiourethane resin that comprises the polymerization site of isocyanate component and polythiol component; the thiourethane resin that is the polymerization site of isocyanate component and polyol component; and the urethane-urea resin that has the polythiourethane site that is the polymerization site of isocyanate component and thiol component and the polyurea site that is the polymerization product of isocyanate component and polyamine component.

[0037] Examples of the isocyanate component include bis(isocyanatomethyl)bicyclo[2.2.1]heptane, bis(isocyanatomethyl)cyclohexane, bis(isocyanatomethyl)benzene, tolylene diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate, hexamethylene diisocyanate, and pentamethylene diisocyanate.

[0038] Examples of the active hydrogen compound component include toluenediamine, pentaerythritol tetrakismercaptoacetate, pentaerythritol tetrakismercaptopropionate, trimethylolpropane trismercaptoacetate, trimethylolpropane trismercaptopropionate, bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptoethyl)dithiane, and bis(mercaptomethyl)dithiane. Among these, it is preferable to use polythiol components such as pentaerythritol tetrakismercaptoacetate, pentaerythritol tetrakismercaptopropionate, trimethylolpropane trismercaptoacetate, trimethylolpropane trismercaptopropionate, bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptoethyl)dithiane, and bis(mercaptomethyl)dithiane.

[0039] The equivalent ratio of the active hydrogen groups of the active hydrogen compound component to the isocyanato groups of the polyisocyanate component (active hydrogen groups / isocyanato groups) is preferably 40 / 60 to 60 / 40, more preferably 45 / 55 to 55 / 45. Examples of the active hydrogen groups include hydroxy groups, mercapto groups, and —NH groups.

[0040] The resin substrate may contain other additives such as an ultraviolet absorber, a release agent, a colorant, an antioxidant, a refractive index adjuster, a birefringence adjuster, a coloring inhibitor, a fluorescent brightener, etc. These may be used alone or in combination of two or more.

[0041] The resin substrate preferably contains an ultraviolet absorber. By containing an ultraviolet absorber, the weather resistance of the resin substrate and the resin light guide plate can be improved, deterioration over time and yellowing can be prevented, and transparency can be maintained during use.

[0042] Examples of ultraviolet absorbers include benzotriazole compounds, benzophenone compounds, dibenzoylmethane, 4-tert-butyl-4'-methoxybenzoylmethane, etc. Among these, benzotriazole compounds are preferred.

[0043] The resin substrate contains a benzophenone-based compound represented by formula (1): (In the formula R 3 is an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms, and m is an integer of 1 or 2. By using this ultraviolet absorber, it is possible to suppress deterioration of the resin due to absorption of high-energy light, while causing almost no absorption in the visible light region, and suppressing deterioration of image information passing through the light guide plate.

[0044] R 3 is preferably an alkoxy group having 1 to 20 carbon atoms. 3 The number of carbon atoms in the alkoxy group of R is preferably 1 to 20, more preferably 3 to 18, and even more preferably 6 to 16. 3 Examples of the alkoxy group include a methoxy group, an ethoxy group, a propyloxy group, a hexyloxy group, an octyloxy group, a dodecenyloxy group, and a lauryloxy group.

[0045] R 3 The number of carbon atoms in the alkyl group of R is preferably 1 to 20, more preferably 3 to 18, and even more preferably 6 to 16. 3 Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a tertiary butyl group, a hexyl group, an octyl group, a dodecenyl group, and a lauryl group.

[0046] m is preferably 1.

[0047] Examples of benzotriazole compounds include 2-(2-hydroxy-5-methylphenyl)-2H-benzotriazole, 2-(2-hydroxy-3,5-di-tert-amylphenyl)-2H-benzotriazole, 2-(2-hydroxy-3,5-di-tert-butylphenyl)-2H-benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)-2H-benzotriazole, and 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole. These may be used alone or in combination of two or more. Of these, 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole is preferred.

[0048] Examples of benzophenone compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-n-dodecyloxybenzophenone, 2-hydroxy-4-benzyloxybenzophenone, and 2,2'-dihydroxy-4-methoxybenzophenone.

[0049] The amount of the ultraviolet absorber added is preferably 0.001 to 5% by mass, more preferably 0.01 to 3% by mass, and even more preferably 0.05 to 1% by mass, based on the total mass of the substrate.

[0050] In terms of obtaining a resin substrate having high internal transmittance, the content of a colorant (hereinafter also referred to as "colorant L") having a maximum absorption wavelength of 550 nm or more and 600 nm or less in a 20 ppm by mass toluene solution is preferably 0.1 mass% or less.

[0051] From the viewpoint of obtaining a resin substrate with a slightly bluish, favorable color tone, colorant L has a maximum absorption wavelength of 550 nm or more and 600 nm or less in a 20 ppm by mass toluene solution. Note that 20 ppm by mass toluene solution refers to the ratio of solute to the entire toluene solution. Furthermore, from the viewpoint of obtaining a lens substrate with a slightly bluish, favorable color tone, the maximum absorption wavelength of colorant L is preferably 550 nm or more, preferably 560 nm or more, and preferably 580 nm or more. Furthermore, from the viewpoint of obtaining a resin composition with a slightly bluish, favorable color tone, the maximum absorption wavelength of colorant L is preferably 600 nm or less, preferably 590 nm or less.

[0052] Examples of colorant L include C.I. Solvent Violet 11, 13, 14, 26, 31, 33, 36, 37, 38, 45, 47, 48, 51, 59, and 60; and C.I. Disperse Violet 26, 27, and 28. Among these, C.I. Disperse Violet 27, C.I. Solvent Violet 13, and 31 are preferred, and C.I. Disperse Violet 27 and C.I. Solvent Violet 13 are more preferred, and C.I. Disperse Violet 27 is even more preferred, from the viewpoint of high stability and little change in color tone even when the polymerizable composition is polymerized.

[0053] The content of colorant L is preferably 0.01% by mass or less, more preferably 0.001% by mass or less, and even more preferably 0.001% by mass or less.

[0054] Examples of antioxidants include phenol-based antioxidants, sulfur-based antioxidants, and phosphorus-based antioxidants.

[0055] Examples of phenol-based antioxidants include 2,6-di-t-butyl-4-methylphenol and phenol. Examples of sulfur-based antioxidants include dilauryl 3,3'-thiodipropionate. Examples of phosphorus-based antioxidants include phosphite compounds such as triphenyl phosphite, trioctyl phosphite, and tridecyl phosphite. Antioxidants can be used alone or in combination of two or more.

[0056] The amount of antioxidant added is preferably 0.01 to 5% by mass, more preferably 0.05 to 3% by mass, and even more preferably 0.1 to 2% by mass, based on the total mass of the substrate.

[0057] The resin substrate preferably contains a refractive index adjuster. By containing a refractive index adjuster, even when a resin with a low refractive index is used, the refractive index of the resin light guide plate can be improved, thereby enabling a wider viewing angle. Examples of refractive index adjusters include inorganic particles. Examples of inorganic particle materials include silica, alumina, zirconia, titania, and zeolite. The inorganic particles are preferably surface-modified with a silane coupling agent, and preferably have a particle size of 100 nm or less. The particle size of the inorganic particles is preferably 5 to 40 nm, more preferably 10 to 35 nm, and even more preferably 10 to 30 nm. The particle size of the inorganic particles is the average particle size.

[0058] If the amount of refractive index adjuster added is large, the density of the material for the entire substrate increases, making it difficult to achieve a lightweight light guide plate. Furthermore, if inorganic particles are added as a refractive index adjuster at a ratio of 20 parts by mass or more per 100 parts by mass of the substrate resin, the fluidity of the resin itself decreases and internal stress occurs due to the orientation of the material, causing birefringence. Therefore, the amount of refractive index adjuster added is preferably 0.1 to 15 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.1 to 5 parts by mass per 100 parts by mass of the substrate resin.

[0059] The resin substrate preferably contains a birefringence adjuster. By containing a birefringence adjuster, it becomes easier to adjust the retardation value to 30 nm or less. Examples of birefringence adjusters include triazine-based birefringence adjusters and birefringence adjusters made of compounds having a fluorene skeleton. Examples of triazine-based birefringence adjusters include 2-hydroxyphenyl-s-triazine derivatives. Commercially available triazine-based birefringence adjusters include Tinuvin 1600, Tinuvin 460, Tinuvin 477, Tinuvin 479, and Tinuvin 1577 from BASF, and LA-F70 and LA46 from ADEKA.

[0060] The amount of birefringence adjuster added is preferably 1 to 30 parts by mass, more preferably 5 to 20 parts by mass, and even more preferably 10 to 15 parts by mass, per 100 parts by mass of the resin of the substrate.

[0061] The density of the resin used in the resin substrate is preferably 0.93 to 2.10 g / cm ３ and more preferably 1.20 to 1.80 g / cm ３ and more preferably 1.30 to 1.50 g / cm ３ The density of the resin can be measured by the underwater displacement method in accordance with JIS K7112-1:2023.

[0062] The refractive index of the resin used for the resin substrate is preferably 1.60 or more, more preferably 1.65 or more, and even more preferably 1.70 or more. The upper limit of the refractive index of the resin is not particularly limited, but is, for example, 2.00 or less. By setting the refractive index of the substrate within this range, the viewing angle can be widened. The refractive index can be measured in accordance with JIS K7142:2014.

[0063] Average internal transmittance IT of light with wavelengths of 420 nm to 780 nm in a resin substrate ４２０－７８０ From the viewpoint of suppressing the influence on the color tone of the image passing through the light guide plate, the average internal transmittance IT is preferably 95% or more, more preferably 97% or more, and even more preferably 98% or more. ４２０－７８０is the internal transmittance IT of light at wavelengths of 420 nm to 780 nm ｗ The internal transmittance IT is the average value of ｗ Two samples with different thicknesses are prepared, and the value is calculated for each wavelength using the following formula: However, T ｗ1 is the transmittance of light of wavelength w (nm) in a measurement sample having a specific thickness, and T ｗ２ Is T ｗ1 is the transmittance of light of wavelength w (nm) in a measurement sample having a thickness greater than the thickness of T ｗ２ and T ｗ1 The difference in thickness (mm) between the above-mentioned internal transmittance IT ｗ means the internal transmittance at a thickness of 10 mm. The transmittance at each wavelength can be measured using an ultraviolet-visible-near-infrared spectrophotometer "UH4150" (product name, Hitachi High-Tech Corporation). The average internal transmittance IT ４２０－７８０ This is achieved by using a resin material that is less colored and does not contain any pigments such as bluing agents.

[0064] Internal transmittance IT in a resin substrate ｗ However, from the viewpoint of suppressing the influence on the color tone of the image passing through the light guide plate, it is preferable that the internal transmittance IT is 83% or more for light having a wavelength of 420 nm to 780 nm. ｗ From the viewpoint of further suppressing the influence on the color tone of the image passing through the light guide plate, the internal transmittance IT is more preferably 85% or more, even more preferably 90% or more, and even more preferably 95% or more for all light having a wavelength of 420 nm to 780 nm. ｗ The measurement method for the internal transmittance IT is as described above. ｗ The condition (2) can be achieved by using a resin material that is less colored and does not contain a pigment such as a bluing agent.

[0065] In order to suppress the influence of the resin substrate on the color tone of the image passing through the light guide plate, the average internal transmittance IT of light with a wavelength of 550 nm to 650 nm ５５０－６５０ is preferably 95% or more, more preferably 96% or more, and even more preferably 98% or more.５５０－６５０ is the internal transmittance IT of light at wavelengths of 420 nm to 780 nm ｗ The measurement and calculation methods are the same as those of the above-mentioned average internal transmittance IT, except that the wavelength range of light is different. ４２０－７８０ is the same as:

[0066] (IT ４２０－７８０ -IT ５５０－６５０ ) / IT ４２０－７８０ From the viewpoint of further suppressing the influence on the color tone of the image passing through the light guide plate, the value of is preferably 5% or less, more preferably 3% or less, and even more preferably 1% or less. ４２０－７８０ and the average internal transmittance IT ５５０－６５０ Calculated from.

[0067] Average internal transmittance IT of light with wavelengths of 300 to 380 nm in a resin substrate ３００－３８０ From the viewpoint of improving the light resistance of the resin, the average internal transmittance IT is preferably 50% or less, more preferably 30% or less, even more preferably 10% or less, and still more preferably 1% or less. ３００－３８０ is the internal transmittance IT of light at wavelengths of 300 nm to 380 nm ｗ The measurement and calculation methods are the same as those of the above-mentioned average internal transmittance IT, except that the wavelength range of light is different. ４２０－７８０ is the same as:

[0068] Average internal transmittance IT of light with a wavelength of 300 to 320 nm in a resin substrate ３００－３２０ From the viewpoint of improving the light resistance of the resin, the average internal transmittance IT is preferably 30% or less, more preferably 10% or less, even more preferably 1% or less, and still more preferably 0.1% or less. ３００－３２０ is the internal transmittance IT of light at wavelengths of 300 nm to 320 nm ｗ The measurement and calculation methods are the same as those of the above-mentioned average internal transmittance IT, except that the wavelength range of light is different. ４２０－７８０ is the same as:

[0069] The parallelism of the resin substrate is preferably 10 μm or less, more preferably 1 μm or less, even more preferably 0.5 μm or less, and even more preferably 0.1 μm or less. By setting the parallelism within this range, good performance as a light guide plate can be obtained. The lower limit of the parallelism of the resin substrate is not particularly limited, but is, for example, 0.01 μm or more. The parallelism is defined in JIS B 0621-1984 and is measured using a coordinate measuring machine.

[0070] The flatness of the resin substrate is preferably 25.0 μm or less, more preferably 20.0 μm or less, even more preferably 12.0 μm or less, and even more preferably 10.0 μm or less. The lower limit of the flatness is not particularly limited, but is, for example, 0.1 μm or more. The flatness is measured by measuring the flatness of one side of the substrate, and tends to be higher when the substrate is curved or warped. The flatness can be measured using a flatness tester (FT-15) manufactured by Nidek Co., Ltd. By removing residual stress, it is possible to adjust the flatness value of the resin substrate to a smaller value.

[0071] The TTV of the resin substrate is preferably 3 μm or less, more preferably 1 μm or less, and even more preferably 0.5 μm or less. The lower limit of the TTV is not particularly limited, but is, for example, 0.01 μm or more. TTV refers to the difference between the maximum and minimum values ​​of the thickness (i.e., the distance between the first surface 10 a and the second surface 10 b of the light guide plate substrate) (i.e., TTV (Total Thickness Variation)). TTV can be measured using a Bow / Warp measurement device SBW-331ML / d manufactured by Kobelco Research Institute, Ltd.

[0072] The resin substrate is preferably used for a light guide plate of a cross reality device. Cross reality is a technology that combines images from the real world and the virtual world, and is a comprehensive general term that includes VR (virtual reality), AR (augmented reality), MR (mixed reality), etc. A cross reality device is a device used for the cross reality, such as a head-mounted display. As mentioned above, a light guide plate is used in a cross reality device to project images onto the wearer's retina. The resin substrate of this embodiment is preferably used for the light guide plate. A substrate to be used for the light guide plate is cut out from the resin substrate of this embodiment.

[0073] The resin substrate according to this embodiment can be produced by, for example, a cast polymerization method in which a resin substrate is obtained by cast-polymerizing a polymerizable composition, or an injection molding method in which a molten resin is injected into a mold.

[0074] As shown in FIG. 3 , in the case of the cast polymerization method, the method for producing a resin substrate includes a cast polymerization step of obtaining a resin substrate by cast-polymerizing a polymerizable composition, and may further include a slicing step of slicing the resin substrate to obtain resin substrates having a desired thickness. The method may also include an annealing step of removing residual stress by heat treatment and a polishing step of polishing the resin substrate with a polishing device, for the purposes of providing the resin substrate with predetermined roughness and flatness and further reducing variations in the distribution of residual stress.

[0075] Specifically, a resin substrate raw material liquid is poured into a cavity formed by two molds arranged at a predetermined distance. A resin substrate is formed by a curing reaction of the raw material liquid, and then released from the mold. The released resin substrate is then sliced ​​to a predetermined thickness of 0.3 to 2.0 mm using a wire saw, and then polished with a polishing device with sufficient removal allowance until the wire saw marks disappear, resulting in a resin substrate with a thickness of 0.1 to 1.5 mm. Note that the released resin substrate may be cut at its periphery to create a smooth surface, if necessary, and then sliced ​​with a wire saw.

[0076] The polishing device may be any device capable of polishing without imparting anisotropy to the substrate surface, and specifically, a lapping device is preferably used. A resin substrate is placed on a flat surface plate, and a slurry such as alumina or silica is poured onto the surface plate. The surface plate and the resin substrate are rotated relative to each other while being pressed with a predetermined pressure, thereby removing scratches and residual stress from the resin substrate surface. Either a single-sided polishing device or a double-sided polishing device can be used to polish resin substrates. These devices can uniformly remove wire saw marks and other processing marks and residual stresses on both sides of the substrate, thereby minimizing flatness.

[0077] [Optical Component for Eyewear] The optical component for eyewear according to this embodiment includes a resin lens substrate and a waveguide device according to this embodiment. The refractive index (RW) of the light guide plate is greater than the refractive index (RT) of the lens substrate. The difference (RW - RT) between the refractive index (RW) of the light guide plate and the refractive index (RT) of the light-transmitting substrate is preferably 0.2 to 1.0, more preferably 0.3 to 0.8, and even more preferably 0.3 to 0.5.

[0078] The eyewear optical component is not particularly limited as long as it is applicable to wearable devices, but may be, for example, a spectacle lens applied to a spectacle-type wearable device. In this case, the light-transmitting substrate has the shape of a spectacle lens substrate. The spectacle lens substrate does not necessarily have to have a spherical surface, but may be a flat plate shaped to fit into a spectacle frame.

[0079] [Wearable Device] An example of a wearable device using the light guide plate according to this embodiment is a head-mounted display. The head-mounted display includes, for example, a spectacle-type frame worn on the head of a wearer and an eyewear optical element according to this embodiment attached to the frame. The spectacle-type frame may be equipped with a backlight for illuminating images, a signal processing device for displaying images, a speaker for reproducing sound, and the like.

[0080] As described above, the present disclosure provides the following embodiments. <1> A resin substrate containing an episulfide resin having a refractive index of 1.60 or more. <2> The resin substrate according to <1>, wherein the episulfide resin has an elemental composition with an oxygen atom content of 10% by mass or less. <3> The resin substrate according to <1> or <2>, wherein the episulfide resin is a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond. <4> The resin substrate according to <3>, wherein the content of the epithio compound is 80 to 95% by mass with respect to the total amount of the polymerizable composition. <5> The resin substrate according to <4>, wherein the polymerizable composition contains a thioether compound having a mercapto group. <6> The resin substrate according to <5>, wherein the thioether compound includes at least one compound selected from the group consisting of bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptoethyl)dithiane, and bis(mercaptomethyl)dithiane. <7> The resin substrate according to <6>, wherein the bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol is a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol. <8> The resin substrate according to any one of <5> to <7>, wherein the content of the thioether compound is 10 to 20 mass% with respect to the total amount of the polymerizable composition. <9> The episulfide resin is a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond and a compound represented by formula (T1): (In the formula, R １ and R ２are each independently a divalent hydrocarbon group having 1 to 6 carbon atoms, and m and n are each independently 0 or 1. The resin substrate according to any one of <1> to <8>, which is a cured product of a polymerizable composition containing a compound represented by the formula (I), and a compound represented by the formula (II). <10> The resin substrate according to any one of <1> to <9>, wherein the episulfide resin is a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond, and bis(mercaptomethyl)dithiane. <11> The resin substrate according to any one of <3> to <10>, wherein the polymerizable composition contains elemental sulfur. <12> The resin substrate according to <12>, which contains a thiourethane resin having a refractive index of 1.60 or more. <13> The resin substrate according to <12>, wherein the thiourethane resin has an elemental composition with an oxygen atom content of 20% or less. <14> The resin substrate according to <12> or <13>, wherein the thiourethane resin is a cured product of an isocyanate component containing an alicyclic polyisocyanate and a polythiol component. <15> The resin substrate according to <14>, wherein the alicyclic polyisocyanate is a cured product of an isocyanate component containing at least one selected from the group consisting of bis(isocyanatomethyl)bicyclo[2.2.1]heptane, bis(isocyanatomethyl)cyclohexane, and dicyclohexylmethane diisocyanate, and a polythiol component. <16> The resin substrate according to <14> or <15>, wherein the polythiol component is a thioether compound having a mercapto group. <17> The resin substrate according to <16>, wherein the polythiol component includes at least one selected from the group consisting of bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, and bis(mercaptomethyl)dithiane. <18> The resin substrate according to <17>, wherein the bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol is a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol.<19> The resin substrate according to any one of <1> to <18>, wherein the content of a colorant having a maximum absorption wavelength of 550 nm or more and 600 nm or less in a 20 ppm by mass toluene solution is 0.1 mass% or less. <20> Formula (1): (In the formula R 3 <21> The resin substrate according to any one of <1> to <19>, further comprising an ultraviolet absorber represented by the following formula: ４２０－７８０ <22> The resin substrate according to any one of <1> to <20>, wherein the internal transmittance IT is 95% or more. ｗ <23> The resin substrate according to any one of <1> to <21>, wherein the average internal transmittance IT of light having a wavelength of 300 to 380 nm is 83% or more in all cases for light having a wavelength of 420 nm to 780 nm. ３００－３８０ <24> The resin substrate according to any one of <1> to <22>, wherein the average internal transmittance IT of light having a wavelength of 300 to 320 nm is 50% or less. ３００－３２０ <25> The resin substrate according to any one of <1> to <23>, wherein the average internal transmittance IT of light having a wavelength of 550 nm to 650 nm is 30% or less. ５５０－６５０ <26> The resin substrate according to any one of <1> to <24>, wherein the ratio of the surface area to the surface area of ​​the resin substrate is 95% or more. ４２０－７８０ -IT ５５０－６５０ ) / IT ４２０－７８０The resin substrate according to any one of <1> to <25>, wherein the value of is 5% or less. <27> The resin substrate according to any one of <1> to <26>, wherein the parallelism of the resin substrate is 10 μm or less. <28> The resin substrate according to any one of <1> to <27>, wherein the thickness of the resin substrate is 0.1 to 2.0 mm. <29> The resin substrate according to any one of <1> to <28>, wherein the resin substrate is used for a cross reality device light guide plate. <30> A light guide plate comprising the resin substrate according to any one of <1> to <29>. <31> A waveguide device comprising the light guide plate according to <30> and a diffraction grating or a hologram element formed on the light guide plate. <32> An optical element for eyewear comprising: a resin lens substrate; and the waveguide device according to <31>. <33> A wearable device comprising the optical element for eyewear according to <32>.

[0081] <40> Contains a resin having a refractive index of 1.60 or more, and has an average internal transmittance IT of light having a wavelength of 420 nm to 780 nm ４２０－７８０ <41> A resin substrate, wherein the internal transmittance IT is 95% or more. ｗ <42> The resin substrate according to any one of <40>, wherein the internal transmittance IT is 83% or more for light having a wavelength of 420 nm to 780 nm. ｗ <43> A resin substrate in which the average internal transmittance IT of light having a wavelength of 300 to 380 nm is 83% or more in all cases for light having a wavelength of 420 nm to 780 nm. ３００－３８０ <44> The resin substrate according to any one of <40> to <42>, wherein the average internal transmittance IT of light having a wavelength of 300 to 320 nm is 50% or less. ３００－３２０ <45> The resin substrate according to any one of <40> to <43>, wherein the average internal transmittance IT of light having a wavelength of 550 nm to 650 nm is 30% or less. ５５０－６５０ <46> The resin substrate according to any one of <40> to <44>, wherein the ratio of the surface area to the surface area of ​​the resin substrate is 95% or more. ４２０－７８０ -IT ５５０－６５０ ) / IT ４２０－７８０is 5% or less. <47> The resin substrate according to any one of <40> to <45>, wherein the resin contains an episulfide resin. <48> The resin substrate according to <47>, wherein the episulfide resin has an elemental composition with an oxygen atom content of 10% by mass or less. <49> The resin substrate according to <48>, wherein the episulfide resin is a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond. <50> The resin substrate according to <49>, wherein the content of the epithio compound is 80 to 95% by mass, relative to the total amount of the polymerizable composition. <51> The resin substrate according to any one of <49> or <50>, wherein the polymerizable composition contains a thioether compound having a mercapto group. <52> The resin substrate according to <51>, wherein the thioether compound comprises at least one compound selected from the group consisting of bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptoethyl)dithiane, and bis(mercaptomethyl)dithiane. <53> The resin substrate according to <52>, wherein the bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol is a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol. <54> The resin substrate according to any one of <49> to <53>, wherein the content of the thioether compound is 10 to 20 mass% with respect to the total amount of the polymerizable composition. <55> The episulfide resin is a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond and a compound represented by formula (T1): (In the formula, R １ and R ２are each independently a divalent hydrocarbon group having 1 to 6 carbon atoms, and m and n are each independently 0 or 1. The resin substrate according to any one of <40> to <54>, wherein the resin is a cured product of a polymerizable composition containing a compound represented by the formula (I), and a compound represented by the formula (II). <56> The resin substrate according to any one of <40> to <54>, wherein the episulfide resin is a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond, and bis(mercaptomethyl)dithiane. <57> The resin substrate according to any one of <49> to <56>, wherein the polymerizable composition contains elemental sulfur. <58> The resin substrate according to any one of <40> to <46>, wherein the resin contains a thiourethane resin. <59> The resin substrate according to <58>, wherein the thiourethane resin has an elemental composition with an oxygen atom content of 20% or less. <60> The resin substrate according to <58> or <59>, wherein the thiourethane resin is a cured product of an isocyanate component containing an alicyclic polyisocyanate and a polythiol component. <61> The resin substrate according to <60>, wherein the alicyclic polyisocyanate is a cured product of an isocyanate component containing at least one selected from the group consisting of bis(isocyanatomethyl)bicyclo[2.2.1]heptane, bis(isocyanatomethyl)cyclohexane, and dicyclohexylmethane diisocyanate, and a polythiol component. <62> The resin substrate according to <60> or <61>, wherein the polythiol component is a thioether compound having a mercapto group. <63> The resin substrate according to <62>, wherein the polythiol component includes at least one selected from the group consisting of bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, and bis(mercaptomethyl)dithiane.<64> The resin substrate according to <63>, wherein the bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol is a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol. <65> The resin substrate according to any one of <40> to <64>, wherein the content of a colorant having a maximum absorption wavelength of 550 nm or more and 600 nm or less in a 20 ppm by mass toluene solution is 0.1% by mass or less. <66> The resin substrate according to formula (1): (In the formula R 3 is an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms, and m is an integer of 1 or 2. The resin substrate according to any one of <40> to <65>, further containing an ultraviolet absorber represented by the following formula: <67> The resin substrate according to any one of <40> to <66>, wherein the parallelism of the resin substrate is 10 μm or less. <68> The resin substrate according to any one of <40> to <67>, wherein the thickness of the resin substrate is 0.1 to 2.0 mm. <69> The resin substrate according to any one of <40> to <68>, wherein the resin substrate is used for a cross reality device light guide plate. <70> A light guide plate comprising the resin substrate according to any one of <40> to <69>. <71> A waveguide device comprising the light guide plate according to <70> and a diffraction grating or hologram element formed on the light guide plate. <72> An optical element for eyewear, comprising: a resin lens substrate; and the waveguide device according to <71>. <73> A wearable device comprising the eyewear optical member according to <72>.

[0082] The present embodiment will be described in more detail below with reference to examples, but the present embodiment is not limited to the following examples.

[0083] <Refractive Index and Abbe Number> Using a precision refractometer "KPR-2000" (manufactured by Kalnew Optical Co., Ltd.), the refractive index of the sample was measured at 20°C using the F line (486.1 nm), C line (656.3 nm), d line (587.6 nm), e line (546.1 nm), r line (706.52 nm), C' line (643.9 nm), and F' line (488.0 nm). The Abbe number was then calculated using the following formula: Abbe number vd=(nd-1) / (nF-nC), where nd is the refractive index measured with the d line, nF is the refractive index measured with the F line, and nC is the refractive index measured with the C line.

[0084] <Transmittance> The transmittance of light of each wavelength was measured using an ultraviolet-visible-near-infrared spectrophotometer "UH4150" (product name, Hitachi High-Tech Corporation).

[0085] <Internal transmittance IT ｗ > Internal transmittance IT ｗ Two samples with different thicknesses were prepared, and the values ​​were calculated for each wavelength using the following formula: However, T ｗ1 is the transmittance of light of wavelength w (nm) in a measurement sample having a specific thickness, and T ｗ２ Is T ｗ1 is the transmittance of light of wavelength w (nm) in a measurement sample having a thickness greater than the thickness of T ｗ２ and T ｗ1 The transmittance of light at each wavelength was measured by the method described above under "Transmittance." Internal transmittance IT ｗ indicates the value of the internal transmittance at a thickness of 10 mm.

[0086] <Glass transition temperature (Tg)> Measurement was performed using a thermomechanical analyzer "Thermo Plus EVO2" (manufactured by Rigaku Corporation) by the penetration method (sample thickness 3 mm, pin diameter 0.5 mm, load 10 g, heating rate 10°C / min), and the temperature at which the thermal expansion changed peak value was taken as the glass transition temperature (Tg). When no peak value was observed, the glass transition temperature was evaluated as undetectable.

[0087] Example 1: 100.00 parts by mass of bis(β-epithiopropyl) sulfide, 15 parts by mass of bismercaptoethyldithiane, 0.03 parts by mass of tetrabutylphosphonium bromide as a catalyst, and 0.1 parts by mass of 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole as an ultraviolet absorber were added and stirred and mixed for 10 minutes under a reduced pressure of 10 mmHg to obtain a polymerizable composition. The polymerizable composition was injected into a cavity formed by two flat molds spaced a predetermined distance apart. A resin substrate was formed by the curing reaction of the polymerizable composition and released from the mold. Resin substrates of different thicknesses were similarly formed and released from the mold. The thicknesses of the resulting resin substrates were 2.90 mm and 4.98 mm, respectively. The transmittance of the two resin substrates was measured to calculate the internal transmittance. The results of measuring the transmittance of the 4.98 mm resin substrate are shown in Figure 4, and the calculated internal transmittance is shown in Figure 5. The refractive indices were d: 1.7094, C: 1.7036, F: 1.7232, e: 1.7140, r: 1.7004, C': 1.7045, F': 1.7245, and the Abbe numbers were vd: 36.1, ve: 35.8. The glass transition temperature was undetectable. The density of the resin was 1.41 g / cm ３ The various internal transmittances were the values ​​shown in Table 1. The average internal transmittance IT ３００－３８０ = 0, average internal transmittance IT ３００－３２０ = 0. The obtained resin substrate had low water absorption.

[0088] Example 2 50.6 parts by mass of 1,3-bis(isocyanatomethyl)benzene, 0.06 parts by mass of dimethyltin dichloride as a catalyst, 0.15 parts by mass of acidic phosphate ester "JP-506H" (trade name, manufactured by Johoku Chemical Industry Co., Ltd.) as a mold release agent, and 1.0 part by mass of 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole as an ultraviolet absorber were added, mixed, dissolved, and homogenized. Then, 49.4 parts by mass of a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol was added, and the mixture was stirred and mixed under a reduced pressure of 10 mmHg for 30 minutes to obtain a polymerizable composition. The polymerizable composition was injected into a cavity formed by two flat molds arranged at a predetermined distance. A resin substrate was formed by the curing reaction of the polymerizable composition and then released from the mold. Resin substrates of different thicknesses were similarly formed and released from the mold. The resulting resin substrates had thicknesses of 9.44 mm and 16.17 mm, respectively. The transmittance of the two resin substrates was measured to calculate the internal transmittance. The results of measuring the transmittance of the 9.44 mm resin substrate are shown in Figure 6, and the calculated results of the internal transmittance are shown in Figure 7. The refractive index was d: 1.6642, C: 1.6581, F: 1.6792, e: 1.6692, r: 1.6548, C': 1.6590, F': 1.6805, and the Abbe number was vd: 31.5, ve: 31.2. The glass transition temperature was 103°C. The resulting resin substrate had higher water absorption than the resin substrate of Example 1.

[0089] Example 3 50.6 parts by mass of 1,3-bis(isocyanatomethyl)benzene, 0.06 part by mass of dimethyltin dichloride as a catalyst, 0.15 part by mass of acidic phosphate ester "JP-506H" (trade name, manufactured by Johoku Chemical Industry Co., Ltd.) as a mold release agent, 1.0 part by mass of 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole as an ultraviolet absorber, 0.1037 part by mass of Disperse Violet 27 (maximum absorption wavelength of 586 nm in a 20 ppm by mass toluene solution), and 0.0013 part by mass of Solvent Red 52 (maximum absorption wavelength of 543 nm in a 20 ppm by mass toluene solution) were added, mixed, dissolved, and homogenized. Subsequently, 49.4 parts by mass of a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol was added, and the mixture was stirred and mixed under a reduced pressure of 10 mmHg for 30 minutes to obtain a polymerizable composition. The polymerizable composition was injected into a cavity formed by two flat molds arranged at a predetermined distance. A resin substrate was formed by the curing reaction of the polymerizable composition and released from the mold. Resin substrates of different thicknesses were similarly formed and released from the mold. The thicknesses of the obtained resin substrates were 3.00 mm and 4.99 mm, respectively. The transmittance of the two types of resin substrates was measured to calculate the internal transmittance. The results of measuring the transmittance of the 4.99 mm resin substrate are shown in Figure 8, and the results of calculating the internal transmittance are shown in Figure 9. The obtained resin substrate had higher water absorption than the resin substrate of Example 1.

[0090]

[0091] Example 4: 100.00 parts by mass of bis(β-epithiopropyl) sulfide, 10 parts by mass of bismercaptoethyldithiane, 0.03 parts by mass of tetrabutylphosphonium bromide as a catalyst, and 0.1 parts by mass of 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole as an ultraviolet absorber were added and stirred and mixed under a reduced pressure of 10 mmHg for 10 minutes to obtain a polymerizable composition. The polymerizable composition was injected into a cavity formed by two flat molds arranged at a predetermined distance. A resin substrate was formed by the curing reaction of the polymerizable composition and then released from the mold. The resulting resin substrate had a thickness of 2.90 mm. The refractive indices were d: 1.7103, C: 1.7045, F: 1.7244, e: 1.7151, r: 1.7015, C': 1.7055, F': 1.7257, and the Abbe numbers were vd: 35.7, ve: 35.5. The glass transition temperature was undetectable.

[0092] Example 5: 100.00 parts by mass of bis(β-epithiopropyl) sulfide, 12.5 parts by mass of bismercaptoethyldithiane, 0.03 parts by mass of tetrabutylphosphonium bromide as a catalyst, and 0.1 parts by mass of 2-(2-hydroxy-4-octyloxyphenyl)-2H-benzotriazole as an ultraviolet absorber were added and stirred and mixed under a reduced pressure of 10 mmHg for 10 minutes to obtain a polymerizable composition. The polymerizable composition was injected into a cavity formed by two flat molds spaced a predetermined distance apart. A resin substrate was formed by the curing reaction of the polymerizable composition and then released from the mold. The resulting resin substrate had a thickness of 2.90 mm. The refractive indices were d: 1.7082, C: 1.7023, F: 1.7226, e: 1.7131, r: 1.6992, C': 1.7033, F': 1.7239, and the Abbe numbers were vd: 34.9, ve: 34.7. The glass transition temperature was undetectable.

[0093] Example 6 The polymerizable composition described in Example 1 was injected into a cavity formed by two molds arranged at a predetermined distance. A resin substrate was formed by the curing reaction of the raw material liquid and then released from the mold. The released resin substrate was then sliced ​​using a wire saw to obtain multiple resin substrates with a thickness of 1.1 mm. To remove residual stress caused by slicing due to scratches during processing, the multiple resin substrates were stacked with spacers interposed between them and annealed at 170°C for 3 hours. Subsequently, the resin substrates were polished at a pressure of 6 kPa using a double-side lapping polishing machine using an alumina slurry with an average particle size of 0.5 μm. A resin substrate with a thickness of 1.0 mm was formed using the above method. The flatness of the resin substrate was 3.5 μm, and the total thickness variation (TTV) of the resin substrate was 0.8 μm.

[0094] 1 Waveguide device 10 Light guide plate 24 Image display device 32, 52 Diffraction grating

Claims

1. A resin substrate containing an episulfide resin having a refractive index of 1.60 or greater.

2. The resin substrate according to claim 1, wherein the episulfide resin has an elemental composition with an oxygen atom content of 10% by mass or less.

3. The resin substrate according to claim 1, wherein the episulfide resin is a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond.

4. The resin substrate according to claim 3, wherein the content of the epithio compound is 80 to 95% by mass based on the total amount of the polymerizable composition.

5. The resin substrate according to claim 4, wherein the polymerizable composition contains a thioether compound having a mercapto group.

6. The resin substrate according to claim 5, wherein the thioether compound comprises at least one compound selected from the group consisting of bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptoethyl)dithiane, and bis(mercaptomethyl)dithiane.

7. The resin substrate according to claim 6, wherein the bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol is a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol.

8. The resin substrate according to claim 5, wherein the content of the thioether compound is 10 to 20% by mass based on the total amount of the polymerizable composition.

9. The resin substrate according to claim 1, wherein the episulfide resin is a cured product of a polymerizable composition containing an epithio compound having a thioether bond or a dithioether bond and bis(mercaptomethyl)dithiane.

10. The resin substrate according to claim 3, wherein the polymerizable composition contains elemental sulfur.

11. A resin substrate containing a thiourethane resin having a refractive index of 1.60 or greater.

12. The resin substrate according to claim 11, wherein the thiourethane resin has an elemental composition with an oxygen atom content of 20% or less.

13. The resin substrate according to claim 11, wherein the thiourethane resin is a cured product of an isocyanate component containing an alicyclic polyisocyanate and a polythiol component.

14. The resin substrate according to claim 13, wherein the alicyclic polyisocyanate is a cured product of an isocyanate component containing at least one member selected from the group consisting of bis(isocyanatomethyl)bicyclo[2.2.1]heptane, bis(isocyanatomethyl)cyclohexane, and dicyclohexylmethane diisocyanate, and a polythiol component.

15. The resin substrate according to claim 13, wherein the polythiol component is a thioether compound having a mercapto group.

16. The resin substrate according to claim 15, wherein the polythiol component comprises at least one member selected from the group consisting of bis(mercaptoethylthio)mercaptopropane, bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol, dimercaptoethyl sulfide, bis(mercaptomethyl)dithiane, and bis(mercaptomethyl)dithiane.

17. The resin substrate according to claim 16, wherein the bis(mercaptomethyl)-3,6,9-trithiaundecanedithiol is a mixture of 4,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, 4,8-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol, and 5,7-bis(mercaptomethyl)-3,6,9-trithiaundecane-1,11-dithiol.

18. The resin substrate according to claim 1, wherein the content of a colorant having a maximum absorption wavelength of 550 nm or more and 600 nm or less in a 20 ppm by mass toluene solution is 0.1 mass % or less.

19. Formula (1): (In the formula R 3 is an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms, and m is an integer of 1 or 2.

20. Average internal transmittance (IT) of light with wavelengths between 420 nm and 780 nm ４２０－７８０ The resin substrate according to any one of claims 1 to 19, wherein the surface roughness is 95% or more.

21. Internal transmittance IT ｗ The resin substrate according to any one of claims 1 to 19, wherein the transmittance is 83% or more for light having a wavelength of 420 nm to 780 nm.

22. Average internal transmittance (IT) of light with wavelengths of 300 to 380 nm ３００－３８０ The resin substrate according to any one of claims 1 to 19, wherein the surface roughness is 50% or less.

23. Average internal transmittance IT of light with wavelengths of 300 to 320 nm ３００－３２０ The resin substrate according to any one of claims 1 to 19, wherein the surface roughness is 30% or less.

24. Average internal transmittance IT of light with wavelengths between 550 nm and 650 nm ５５０－６５０ The resin substrate according to any one of claims 1 to 19, wherein the surface roughness is 95% or more.

25. (IT ４２０－７８０ -IT ５５０－６５０ ) / IT ４２０－７８０ The resin substrate according to any one of claims 1 to 19, wherein the value of is 5% or less.

26. The resin substrate according to any one of claims 1 to 19, wherein the parallelism of the resin substrate is 10 μm or less.

27. The resin substrate according to any one of claims 1 to 19, wherein the thickness of the resin substrate is 0.1 to 2.0 mm.

28. The resin substrate according to any one of claims 1 to 19, which is used for a cross reality device light guide plate.

29. A light guide plate comprising the resin substrate according to any one of claims 1 to 19.

30. A waveguide device comprising the light guide plate according to claim 29 and a diffraction grating or hologram element formed on said light guide plate.

31. An optical component for eyewear, comprising: a resin lens substrate; and the waveguide device according to claim 30.

32. A wearable device comprising the eyewear optical element according to claim 31.

Images