Display chip and method for forming same

Abstract

The present application relates to the technical field of chips, and in particular to a display chip and a method for forming same. The method comprises: providing a display device, the display device comprising a plurality of display units arranged at intervals; forming on the display device at least one initial filling layer and at least one initial functional layer, forming a groove integrally penetrating through the initial filling layers and the initial functional layers, to obtain at least one filling layer, at least one functional layer and a groove structure, wherein each functional layer comprises a plurality of functional units, the at least one filling layer surrounds at least side walls of the display units, the groove structure surrounds the display units and the functional units, and a groove bottom of the groove structure exposes the display device; and forming a reflective layer on the groove structure, wherein the reflective layer covers a side wall of the groove structure and exposes the groove bottom of the groove structure and light-emitting areas corresponding to the display units. In the present application, light isolation between a functional area and a non-functional area can be realized by means of a disposable reflective material forming process, significantly reducing the process complexity and requirements of alignment precision.

Description

Display chip and method for forming the same Technical Field

[0001] The present application relates to the field of chip technology, and in particular to a display chip and a method for forming the same. Background Art

[0002] A display chip is a chip with display functionality. It achieves high-resolution display through densely integrated display units. It also enables pixel-level controllable light emission, enhancing the visual quality of microdisplays. Display chips typically have a multi-layer structure, requiring reflective material between functional and non-functional areas within each layer to prevent optical crosstalk within the display unit. This complicates the manufacturing process and requires high alignment precision. The smaller the display unit, the more difficult it is to prepare the reflective material, hindering the miniaturization of display chips. Summary of the Invention

[0003] In response to the above-mentioned problems in the prior art, the present application provides a display chip and a method for forming the same. The specific technical solutions are as follows:

[0004] In one aspect, the present application provides a method for forming a display chip, the method comprising:

[0005] Providing a display device, the display device comprising a plurality of display units arranged at intervals;

[0006] forming at least one initial filling layer and at least one initial functional layer on the display device;

[0007] Grooves are formed integrally through each of the initial filling layers and each of the initial functional layers to obtain at least one filling layer, at least one functional layer, and a groove structure, wherein the functional layer includes a plurality of functional units, each of which is located on the display unit and allows at least a portion of light emitted by the display unit to pass through, and the at least one filling layer at least surrounds the sidewalls of the display unit; the groove structure surrounds the display unit and the functional units, and the bottom of the groove structure exposes the display device; the at least one functional layer includes a wavelength conversion layer, and the functional units in the wavelength conversion layer are wavelength conversion units for converting the wavelength of light emitted by the display unit;

[0008] A reflective layer is formed on the groove structure, wherein the reflective layer covers the sidewalls of the groove structure and exposes the groove bottom of the groove structure and the light emitting area corresponding to the display unit.

[0009] In a possible embodiment, the initial filling layer is filled in the spaced area between adjacent display units or the spaced area between adjacent functional units; and the forming of a groove integrally penetrating each of the initial filling layer and each of the initial functional layer to obtain at least one filling layer, at least one functional layer, and a groove structure includes:

[0010] The initial filling layers and the initial functional layers are subjected to overall pattern etching to obtain the at least one filling layer, the at least one functional layer and the groove structure.

[0011] In a possible implementation manner, the etching method used for the overall pattern etching is dry etching.

[0012] In a possible implementation manner, forming a reflective layer on the groove structure includes:

[0013] forming a whole reflective film layer covering the bottom of the groove structure, the sidewalls of the groove structure, and the light emitting area corresponding to the display unit;

[0014] The light-emitting area and the reflective film layer area on the bottom of the groove structure are removed by full-surface etching to obtain the reflective layer.

[0015] In a possible implementation manner, the at least one initial filling layer includes a first initial filling layer, and forming the at least one initial filling layer and the at least one initial functional layer on the display device includes:

[0016] A first initial filling layer is formed on the display device to fill the space between adjacent display units. The first initial filling layer exposes the light-emitting surface of the display unit, or the first initial filling layer covers the display unit and is formed of a light-transmitting material.

[0017] An initial functional layer corresponding to the wavelength conversion layer is formed on the display device. The initial functional layer corresponding to the wavelength conversion layer includes a plurality of wavelength conversion units arranged at intervals. The wavelength conversion units are arranged in alignment with the display units.

[0018] In a possible implementation manner, the at least one initial filling layer includes a second initial filling layer, and after forming the initial functional layer corresponding to the wavelength conversion layer on the display device, the forming method further includes:

[0019] A second initial filling layer is formed on the initial functional layer corresponding to the wavelength conversion layer, and the second initial filling layer fills the spaced regions between adjacent wavelength conversion units.

[0020] In a possible implementation manner, the at least one functional layer includes a first reflective layer, and before forming the initial functional layer corresponding to the wavelength conversion layer on the display device, the forming method further includes:

[0021] An initial functional layer corresponding to the first reflective layer is formed on the display device. The first reflective layer at least covers the display unit and is located between the wavelength conversion layer and the display device. The first reflective layer is used to selectively transmit or selectively reflect light emitted from the display unit to emit a first color light.

[0022] In a possible implementation manner, the at least one functional layer includes a second reflective layer, and after forming an initial functional layer corresponding to the wavelength conversion layer on the display device, the forming method further includes:

[0023] An initial functional layer corresponding to the second reflective layer is formed on the initial functional layer corresponding to the wavelength conversion layer. The second reflective layer at least covers the wavelength conversion unit and is used to purify light emitted from the wavelength conversion unit.

[0024] In a possible embodiment, the at least one functional layer further includes a filter layer, and the functional units in the filter layer are color filter units. After forming the initial functional layer corresponding to the wavelength conversion layer on the display device, the forming method further includes:

[0025] An initial functional layer corresponding to the filter layer is formed above the initial functional layer corresponding to the wavelength conversion layer. The initial functional layer corresponding to the filter layer includes a plurality of color filter units arranged at intervals. The color filter units are aligned with the wavelength conversion units.

[0026] In a possible implementation manner, the at least one initial filling layer further includes a third initial filling layer, and after forming the initial functional layer corresponding to the filter layer above the initial functional layer corresponding to the wavelength conversion layer, the forming method further includes:

[0027] The third initial filling layer is formed on the initial functional layer corresponding to the filter layer, and the third initial filling layer fills the spacing area between adjacent color filter units.

[0028] In a possible implementation manner, after forming the reflective layer on the groove structure, the forming method further includes:

[0029] A grid layer is formed to fill the groove structure, wherein the grid layer includes a plurality of grid holes, and the grid holes are aligned with the wavelength conversion unit and expose the light exit area.

[0030] In a possible implementation manner, after forming the grid layer filling the trench structure, the forming method further includes:

[0031] A plurality of micro lenses are formed on the grid layer, and the micro lenses are aligned with the grid holes and cover the light exit area.

[0032] In another aspect, the present application provides a display chip, comprising:

[0033] A display device comprising a plurality of display units arranged at intervals;

[0034] At least one initial filling layer, at least one functional layer, and a groove structure, wherein the functional layer includes a plurality of functional units, the functional units are located on the display unit and allow at least part of the light emitted by the display unit to pass through, and the at least one initial filling layer at least surrounds the sidewalls of the display unit; the groove structure surrounds the display unit and the functional units, and the bottom of the groove structure exposes the display device; the at least one functional layer includes a wavelength conversion layer, and the functional units in the wavelength conversion layer are wavelength conversion units for converting the wavelength of light emitted by the display unit;

[0035] The reflective layer covers the sidewalls of the groove structure and exposes the groove bottom of the groove structure and the light emitting area corresponding to the display unit.

[0036] In a possible implementation manner, the wavelength conversion layer includes a plurality of wavelength conversion units arranged at intervals, and the wavelength conversion units are arranged in alignment with the display units.

[0037] In a possible implementation manner, the display chip further includes a grid layer; the grid layer fills the groove structure and includes a plurality of grid holes, and the grid holes are aligned with the wavelength conversion unit and expose the light exit area.

[0038] In a possible implementation manner, the display chip further includes a plurality of micro lenses; the micro lenses are arranged in alignment with the grid holes and cover the light exit area.

[0039] In a possible embodiment, the at least one functional layer includes a first reflective layer, which covers at least the display unit and is located between the wavelength conversion layer and the display device, and is used to selectively transmit or selectively reflect the light emitted by the display unit to emit a first color light.

[0040] In a possible implementation manner, the at least one functional layer includes a second reflective layer, where the second reflective layer is located on the wavelength conversion layer and at least covers the wavelength conversion unit, and is configured to purify light emitted from the wavelength conversion unit.

[0041] In a possible implementation manner, the at least one functional layer includes a filter layer, and the functional units in the filter layer are color filter units;

[0042] The filter layer is located on the second reflective layer and includes a plurality of color filter units arranged at intervals. The color filter units are aligned with the wavelength conversion units.

[0043] On the other hand, the present application provides a display device, which includes the above-mentioned display chip.

[0044] On the other hand, the present application provides an electronic device, which includes the above-mentioned display chip.

[0045] Based on the above technical solution, this application has the following beneficial effects:

[0046] The technical solution of the present application provides a display device, comprising a plurality of display units arranged at intervals, at least one initial filling layer and at least one initial functional layer formed on the display device, and grooves integrally penetrating each initial filling layer and each initial functional layer to obtain at least one filling layer, at least one functional layer, and a groove structure, wherein the functional layer comprises a plurality of functional units, the functional units being located on the display units and allowing at least a portion of light emitted by the display units to pass therethrough, and the at least one filling layer at least surrounding the sidewalls of the display units; the groove structure surrounding the display units and the functional units, with the bottom of the groove structure exposing the display units; and a reflective layer formed on the groove structure, covering the sidewalls of the groove structure and exposing the bottom of the groove structure and the light-emitting areas corresponding to the display units. In this way, by penetrating each functional layer and the initial filling layer and extending to the surface of the display device to surround a functional area including the display units and each functional unit above the display units, optical isolation between the functional area and the non-functional area can be achieved through a one-time reflective material formation process, significantly reducing process complexity and alignment accuracy requirements, and improving the optical isolation effect between the display units, effectively avoiding optical crosstalk. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] To more clearly illustrate the technical solution of this application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0048] FIG1 is a cross-sectional view of a display chip provided in an embodiment of the present application;

[0049] FIG2 is a cross-sectional view of another display chip provided in an embodiment of the present application;

[0050] FIG3 is a cross-sectional view of another display chip provided in an embodiment of the present application;

[0051] FIG4 is a cross-sectional view of a display device provided in an embodiment of the present application;

[0052] Figure 5-12 is a cross-sectional view of a structure of a display chip during the formation process provided by an embodiment of the present application;

[0053] Figures 13-21 are cross-sectional views of a display chip during its formation according to an embodiment of the present application;

[0054] 22-28 are cross-sectional views of a display chip during its formation according to an embodiment of the present application;

[0055] Figure 100 - display device, 110 - display unit, 111 - light-emitting unit, 112 - first electrode layer, 113 - second electrode layer, 114 - passivation layer, 115 - light-emitting surface of display unit, 120 - driving substrate, 121 - first contact, 122 - second contact, 123 - substrate, 130 - first filling structure, 210 - groove structure, 220 - wavelength conversion layer, 221 - wavelength conversion unit, 221a - first wavelength conversion unit, 221b - second wavelength conversion unit, 221c - third wavelength conversion unit, 230 - first reflection layer, 231 - first reflection unit, 240 - second reflection layer , 241-second reflecting unit, 250-filter layer, 251-color filter unit, 260-light exit area, 270-reflecting layer, 280-grid layer, 290-microlens, 310-fourth filling structure, 320-third filling structure; 410-whole layer of reflective film, 420-first initial filling layer, 430-second initial filling layer, 440-initial functional layer corresponding to the first reflecting layer, 450-initial functional layer corresponding to the wavelength conversion layer, 460-initial functional layer corresponding to the second reflecting layer, 461-opening, 470-initial functional layer corresponding to the filter layer, 480-third initial filling layer, 490-photolithography mask. DETAILED DESCRIPTION

[0056] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0057] It should be noted that in the description of this application, for the following defined terms, these definitions should be applied unless a different definition is given in the claims or elsewhere in this specification. All numerical values, whether or not explicitly indicated, are defined herein as being modified by the term "about". The term "about" generally refers to a numerical range that a person of ordinary skill in the art would consider to be equivalent to the stated value to produce substantially the same properties, functions, results, etc. A numerical range indicated by a low value and a high value is defined to include all numerical values ​​included in the numerical range and all subranges included in the numerical range.

[0058] It should be noted that, in the description of this application, the terms "first," "second," etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0059] It should be noted that, in the description of this application, the meaning of the terms "on...", "above...", "above...", and "above..." should be interpreted in the broadest sense, meaning that the description containing these terms is interpreted as "the component can be set on another component in a direct contact manner, or there can be an intermediate component or layer between the components". In addition, for the convenience of description, this application may also use spatially relative terms such as "under...", "under...", "under...", "on...", "above...", "above...", "lower", "upper", etc. to describe the relationship between one element or component and another element or component shown in the drawings. In addition to the orientations described in the figures, the spatially relative terms are also intended to cover different orientations of the device in use or operation. The device can be oriented in other ways (rotated 90° or in other orientations), and the spatially relative descriptors used in this application can be interpreted accordingly.

[0060] The term "layer" as used in this application refers to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying or superstructure, or may extend over a localized area of ​​the underlying or superstructure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and / or along a tapered surface. A layer may comprise multiple layers. For example, a semiconductor layer may comprise one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0061] In the description of this application, the use of "micro" LEDs and "micro" devices refers to the descriptive size of certain devices or structures according to embodiments of the present application. The term "micro" device or structure as used herein is intended to represent a scale of 100 nm to 100 μm. However, it should be understood that embodiments of the present invention are not necessarily limited to this, and certain aspects of the embodiments may be applicable to larger and possibly smaller size scales.

[0062] The following describes the method for forming a display chip provided by an embodiment of the present application in conjunction with Figures 1-28. This specification provides method operation steps such as embodiments or flow charts, but more or fewer operation steps may be included based on conventional or non-creative work. The order of steps listed in the embodiment is only one way of executing the order of many steps and does not represent the only execution order. When the actual preparation method is executed, it can be executed in the order of the methods shown in the embodiments or the drawings or in parallel. The packaging method may include S1-S4:

[0063] S1: providing a display device 100 , which includes a plurality of display units 110 arranged at intervals.

[0064] In some embodiments, referring to FIG4 , a plurality of display units 110 spaced apart are arranged in an array, which may be a regular array arrangement or an irregular array arrangement. The display units 110 may be pixels of the display device 100 and may be selected from any one or more of an organic light-emitting diode (OLED), a micro light-emitting diode (Micro-LED), or a liquid crystal display unit 110 (LCD).

[0065] In one embodiment, the display unit 110 is a micro light emitting diode with a size of 100 nm-10 μm, and a plurality of display units 110 arranged at intervals form a highly integrated Micro-LED array.

[0066] In some embodiments, referring to FIG4 , the display device 100 includes a driver substrate 120 , on which multiple display units 110 are integrated and electrically connected to the driver substrate 120 to achieve light emission control of each display unit 110 . In some embodiments, the distance between adjacent display units 110 is less than 5 μm. Specifically, the driver substrate 120 may be, but is not limited to, a silicon-based CMOS (Complementary Metal Oxide Semiconductor), a complementary metal oxide semiconductor, or a thin film field effect transistor. The multiple display units 110 may be formed on an epitaxial layer of the driver substrate 120 .

[0067] In some embodiments, referring to FIG4 , the driving substrate 120 includes a substrate 123, a driving circuit, a first contact 121 and a second contact 122 electrically connected to the driving circuit, and the first contact 121 and the second contact 122 are respectively electrically connected to the display unit 110. The material of the substrate 123 can be a semiconductor material such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, or a non-conductive material such as glass, plastic, or a sapphire wafer.

[0068] In some embodiments, referring to FIG. 4 , the display unit 110 includes a light-emitting unit 111, a passivation layer 114, a first electrode layer 112, and a second electrode layer 113. The light-emitting unit 111 is electrically excited to emit light. The passivation layer 114 surrounds the light-emitting unit 111 and exposes the light-emitting surface of the light-emitting unit 111. The second electrode layer 113 is electrically connected to the second contact 122 and includes a plurality of second connection units. The second connection units can be located between the light-emitting unit 111 and the driving substrate 120. The first electrode layer 112 is electrically connected to the first contact 121 and is isolated from the second electrode layer 113 by the passivation layer 114. In some embodiments, the second electrode layer 113 is a first-doped semiconductor layer, and the first electrode layer 112 is a second-doped semiconductor layer. In one embodiment, the second electrode layer 113 can include a p-type metal layer, and the first electrode layer 112 can include an n-type metal layer.

[0069] Specifically, the display units 110 of the driving substrate 120 may share a common cathode and / or a common anode, or the cathode and anode may be independently provided and connected.

[0070] In one embodiment, the first electrode layer 112 surrounds the light-emitting unit 111 and exposes the light-emitting surface of the light-emitting unit 111. In one embodiment, referring to FIG4 , the second connection units connected to each display unit 110 on the drive substrate 120 are isolated from each other, and each second contact 122 is isolated from each other. The first contact 121 is connected to the cathode. Through each first contact 121 and the first electrode layer, each display unit 110 shares a common cathode, and the second contact 122 is connected to the anode, that is, the anodes are not shared, to achieve individual control of the display units. Preferably, the first electrode layer 112 can be a continuous structure formed on the drive substrate 120 and the display unit 110.

[0071] S2: forming at least one initial filling layer and at least one initial functional layer on the display device 100 .

[0072] Specifically, the initial functional layer can be a continuous structure formed on the display device 100 or a discontinuous structure. The initial filling layer is filled in the spacing area between adjacent display units 110 or the spacing area between adjacent functional units to be used for flattening the display unit array or for flattening the functional layer of the discontinuous structure.

[0073] S2: forming a groove that integrally penetrates each initial filling layer and each initial functional layer to obtain at least one filling layer, at least one functional layer and a groove structure 210 .

[0074] Specifically, the functional layer is used to process light emitted from the display unit 110 to form the desired target light beam. It includes multiple functional units. The functional units are located on the display unit 110 and allow at least a portion of the light emitted from the display unit 110 to pass through. A functional unit refers to the area of ​​the functional layer covering the display unit 110 and is used to process light directly emitted from the display unit 110 or light emitted through other functional layers. It will be understood that a display chip typically forms one or more functional layers to perform color conversion, filtering, and other processing on the light emitted from the display unit 110. The functional layers are stacked above the display device 100, and the stacking of the functional units above the display unit 110 forms a functional area for light beam emission. Specifically, at least one functional layer includes at least a wavelength conversion layer 220. The functional units in the wavelength conversion layer 220 are wavelength conversion units 221 for converting the wavelength of light emitted from the display unit 110. In some embodiments, in addition to the wavelength conversion layer 220, at least one functional layer may also include a reflective layer and / or a filter layer, etc. The reflective layer may include but is not limited to a DBR (Distributed Bragg Reflector), etc., and the filter layer may include but is not limited to a CF (Color Filter) layer, etc.

[0075] Specifically, the groove structure 210 penetrates each functional layer and surrounds the display unit 110 and the functional units. It integrally penetrates each initial functional layer and each initial filling layer and is formed by a single groove process. The bottom of the groove structure 210 exposes the display device 100. The groove structure 210 surrounds the display unit 110 and each functional unit located above the display unit 110, that is, surrounds the functional region formed corresponding to each display unit 110. The bottom of the groove exposes the drive substrate 120 to achieve isolation between the functional regions corresponding to each display unit 110. In some embodiments, at least one functional layer includes at least a wavelength conversion layer 220, and a single functional region includes at least a display unit and a wavelength conversion unit 221 located above the display unit. In this case, the groove structure 210 surrounds at least the display unit 110 and the wavelength conversion unit 221 located above the display unit 110.

[0076] In some embodiments, referring to FIG. 5-9 , FIG. 13 - FIG. 18 and FIG. 22 - FIG. 25 , S3 includes the following S31 : performing overall patterned etching on each initial filling layer and each initial functional layer to obtain at least one functional layer and a trench structure 210 .

[0077] Specifically, the functional layer can be a continuous structure formed on the display device 100, or a discontinuous structure. Specifically, the groove structure 210 is obtained by performing a one-time overall patterned etching on each functional layer and each initial filling layer on the display device 100, covering the light-emitting area 260 corresponding to each display unit 110 through a mask plate, and then etching away the other areas covered by the mask plate to expose the driving substrate 120, so as to form grooves that penetrate the functional layers and each initial filling layer above the driving substrate 120. The light-emitting area 260 is located at the topmost structure in the longitudinal direction and at least includes the light-emitting surface covering the display unit 110. The longitudinal direction here refers to the direction perpendicular to the plate surface of the driving substrate 120. It can be understood that through the overall patterned etching, the sides of the display unit 110 and the functional units above it are surrounded by the groove structure 210, forming a continuous and flat groove structure sidewall, which is conducive to the evaporation or deposition of the entire layer of reflective material.

[0078] In this way, after forming each functional layer and the initial filling layer, a groove structure 210 that reaches deep into the non-display unit area of ​​the display device 100 is formed through a one-time integrated etching, thereby achieving flattening of the sidewalls of the entire functional area. This is conducive to the subsequent formation of a whole layer of reflective layer 270, eliminating the need for independent and complicated reflective layer deposition and patterning after the display unit 110 and each functional layer are formed, greatly reducing the complexity of chip preparation and saving process costs.

[0079] In some embodiments, referring to Figures 8, 18 and 24, a photolithography mask plate 490 covering the light output area 260 is formed on the topmost structure of each functional layer and each initial filling layer above the display device 100, and the non-functional area not covered by the photolithography mask plate 490 is removed by a one-time integrated etching to form a groove structure 210, and then the mask plate is removed to facilitate the subsequent formation of a reflective layer.

[0080] In some embodiments, the etching method used for the above-mentioned overall patterned etching is dry etching. Dry whole-layer etching can achieve deep etching of the multi-layer structure and is beneficial to the flattening of the side walls of the functional area. By using larger etching parameters and controllable adjustment parameters, the groove structure 210 can be efficiently formed while being adaptable to the preparation of display chips with different numbers of functional layers.

[0081] S4 : forming a reflective layer 270 on the trench structure 210 . The reflective layer 270 covers the sidewalls of the trench structure 210 and exposes the bottom of the trench structure 210 and the light emitting area 260 corresponding to the display unit 110 .

[0082] Specifically, the reflective layer 270 covers the sidewalls of the functional areas and can reflect light emitted from the display units 110 within the functional areas, effectively preventing light leakage from the sidewalls and optical crosstalk between the functional areas. It can also achieve initial convergence and / or collimation of light, thereby improving the light processing efficiency of the functional units, such as improving the wavelength conversion efficiency of the wavelength conversion layer 220. After the groove structure 210 is formed, the reflective layer 270 that covers each functional area can be formed through a one-time deposition, evaporation, or sputtering process to achieve light reflection, convergence, and collimation for each display unit 110 on the display device 100, significantly reducing process complexity. In addition, the one-time formation of the reflective material layer in the groove structure 210 helps improve the material continuity of the sidewalls of each display unit 110 and each functional unit, reducing the risk of local damage or loss of the reflective layer 270 caused by repeated etching.

[0083] The present embodiment does not impose any specific restrictions on the material of the reflective layer 270. The reflective layer 270 can be made of an organic material, including but not limited to highly reflective organic coatings, or an inorganic material, including but not limited to metal materials, such as at least one selected from the group consisting of Al, Cu, and Ag.

[0084] Based on the above technical solution, the groove structure 210 is penetrated through each functional layer and extended to the surface of the display device 100 to surround the functional area including the display unit 110 and each functional unit above the display unit 110, and then the light isolation between the functional areas can be achieved through a one-time reflective material forming process, which significantly reduces the process complexity and alignment accuracy requirements, and improves the light isolation effect between the display units 110, effectively avoiding light crosstalk.

[0085] In some embodiments, referring to FIG. 10-11 , FIG. 19-20 , and FIG. 26-27 , S4 may specifically include S41-S42:

[0086] S41: forming a whole reflective film layer 410 covering the bottom of the groove structure 210 , the sidewall of the groove structure 210 , and the light emitting area 260 corresponding to the display unit 110 ;

[0087] S42 : removing the light emitting region 260 and the reflective film region on the bottom of the groove structure 210 by full-surface etching to obtain a reflective layer 270 .

[0088] In some embodiments, the entire reflective film layer 410 can be formed on the bottom of the groove structure 210, the sidewalls of the groove structure 210, and the light-emitting area 260 corresponding to the display unit 110 by atomic layer deposition (ALD), chemical vapor deposition (CVD), evaporation, sputtering, etc., that is, the reflective material is deposited as a whole layer to form a continuous film layer.

[0089] It can be understood that the sidewalls of the groove structure extend longitudinally. After forming a whole layer of reflective film layer 410, the whole surface can be directly etched to remove the reflective material on the bottom surface of the groove and the surface of the light-emitting area 260 without the need for patterning masks, drying, developing and other photolithography processes, thereby simplifying the preparation process.

[0090] In some embodiments, the reflective layer 270 is formed using a dry etching method to achieve full-surface etching of the entire reflective film layer 410 to expose the light-emitting region 260. During the etching process, the film layer region at the bottom of the groove structure 210 and the film layer region above the light-emitting region 260 produce a plasma re-deposition effect on the sidewalls, thickening the sidewall reflective layer and further enhancing the reflective effect and the overall structural strength and stability of the functional region. Specifically, dry etching includes but is not limited to ion beam etching (IBE) and inductively coupled plasma (ICP) etching.

[0091] In some embodiments, the at least one initial filling layer includes a first initial filling layer 420. Referring to FIG. 5 and FIG. 6 , S2 may include S21-S22:

[0092] S21: forming a first initial filling layer 420 on the display device 100 to fill the space between adjacent display units 110;

[0093] S22 : forming an initial functional layer 450 corresponding to the wavelength conversion layer on the display device 100 .

[0094] Specifically, the first initial filling layer 420 exposes the light emitting surface 115 of the display unit, or the first initial filling layer 420 covers the display unit 110 and is formed of a light-transmitting material. The first initial filling layer 420 achieves planarization of the display unit array, which is beneficial to planarization of subsequent functional layers.

[0095] In one embodiment, the first initial filling layer 420 exposes the light-emitting surfaces 115 of the display units and fills the gaps between adjacent display units 110. The material of the first initial filling layer 420 can be either transparent or non-transparent. In another embodiment, the first initial filling layer 420 fills the intervening areas and covers the light-emitting surfaces 115 of the display units, which facilitates forming a flat surface. In this case, the first initial filling layer 420 is formed of a transparent material.

[0096] Optionally, the material of the first initial filling layer 420 may include an inorganic material or an organic material. The inorganic material may be selected from any one or a combination of Al, Al2O3, Ag, SiO2, Si3N4, ZrO2, TiO2, and HfO2; the organic material may be selected from any one or a combination of black matrix photoresist, polyimide, styrene-propylcyclobutene, color filter photoresist, overcoat glue, barrier glue (BANK), and near-ultraviolet negative photoresist.

[0097] In some embodiments, after the entire surface etching step S31, a portion of the first initial filling layer 420 located on the sidewalls of the display unit 110 remains, forming a first filling layer comprising a plurality of first filling structures 130. The first filling structures 130 encapsulate the sidewalls of the display unit to enhance the stability of the display unit 110 and separate the display unit 110 from the reflective layer 270, enabling reuse as a barrier material without the need for barrier layer deposition. It is understood that the trench structure surrounds the first filling structure 130, and the sidewalls of the first filling structure 130 form part of the sidewalls of the trench structure.

[0098] Specifically, the initial functional layer 450 corresponding to the wavelength conversion layer includes a plurality of wavelength conversion units 221 arranged at intervals. The wavelength conversion unit 221 is arranged in alignment with the display unit 110 and is used to convert the wavelength of the light emitted by the display unit 110, thereby realizing the light color conversion of the light emitted by the display unit 110.

[0099] It is understood that the initial functional layer 450 corresponding to the wavelength conversion layer is fully etched in S31 to form the wavelength conversion layer 220. Preferably, the wavelength conversion unit 221 is arranged in a one-to-one correspondence with the display unit 110 to achieve independent light conversion of a single display unit 110.

[0100] In some embodiments, referring to Figures 1-3 , at least one initial filling layer includes a second initial filling layer 430. After forming an initial functional layer 450 corresponding to the wavelength conversion layer on the display device 100 at step S22 , referring to Figure 7 , step S2 may further include forming a second initial filling layer 430 on the initial functional layer 450 corresponding to the wavelength conversion layer, with the second initial filling layer 430 filling the space between adjacent wavelength conversion units 221. In this manner, the second initial filling layer 430 planarizes the initial functional layer 450 corresponding to the wavelength conversion layer, facilitating the subsequent formation of other layer structures and the overall etching effect, while also improving the stability of the functional regions.

[0101] In some embodiments, the display unit 110 is capable of emitting a first color of light, which may be, for example, but not limited to, blue light. Each wavelength conversion unit 221 in the wavelength conversion layer 220 can convert the first color of light into at least one other color of light to meet color display requirements. In one embodiment, each wavelength conversion unit 221 includes a first wavelength conversion unit 221a and a second wavelength conversion unit 221b. The first wavelength conversion unit 221a is capable of converting the first color of light into the second color of light, and the second wavelength conversion unit 221b is capable of transmitting the first color of light. In another embodiment, each wavelength conversion unit 221 also includes a third wavelength conversion unit 221c. The third wavelength conversion unit 221c is capable of converting the first color of light into the third color of light. For example, the first color of light, the second color of light, and the third color of light can be blue light, red light, and green light, respectively. It can be understood that the above-mentioned colors of light are only examples and can also be other light colors that can be used for color display. In addition, the wavelength conversion layer 220 can also include a wavelength conversion unit 221 that can convert the first color light into more other colors of light, such as a fourth wavelength conversion unit 221 or a fifth wavelength conversion unit 221, etc., which can be set based on actual application requirements and is not limited in this application.

[0102] In some embodiments, the wavelength conversion layer 220 may be made of a colloid containing a wavelength-converting substance, such as, but not limited to, quantum dots, phosphors, and the like. Furthermore, the wavelength conversion unit 221 in the wavelength conversion layer 220, which transmits the first color of light, such as the aforementioned second wavelength conversion unit 221b, may be made of a transparent material that does not contain a wavelength-converting substance, or a colloid containing a wavelength-converting substance that converts other colors of light into the first color of light. The transparent material may be a photoresist, including but not limited to overcoat glue, SU8 near-ultraviolet negative photoresist, BCB (Benzocyclobutene), benzocyclobutene, and the like, or may be SiO2, Al2O3, Si3N4, and the like.

[0103] In some embodiments, the initial functional layer 450 corresponding to the wavelength conversion layer can be formed by at least one process, such as spin coating or spray coating, exposure, and development. Specifically, material spin coating or spray coating, exposure, and development can be performed once for each wavelength conversion unit 221 corresponding to each color of light to form the wavelength conversion unit 221 corresponding to each color of light. For example, the material layer of the first wavelength conversion unit 221a is formed first, and then exposed and developed to form the first wavelength conversion unit 221a. Then, the second wavelength conversion unit 221b and the third wavelength conversion unit 221c are formed in sequence.

[0104] Specifically, the second initial filling layer 430 exposes the surface of the wavelength conversion unit 221 facing away from the display unit 110 to facilitate light emission. The material and formation method of the second initial filling layer 430 are similar to those of the first initial filling layer 420 and are not repeated here.

[0105] In some embodiments, the initial functional layer 450 corresponding to the wavelength conversion layer is located on the first initial filling layer 420 and covers each display unit 110. Light emitted from the display unit 110 enters the wavelength conversion layer 220 and then emits wavelength-converted light. Furthermore, after forming the second initial filling layer 430, referring to Figures 8-9, S31 includes: performing overall patterned etching on the second initial filling layer 430, the first initial filling layer 420, and the initial functional layer 450 corresponding to the wavelength conversion layer to obtain the wavelength conversion layer 220 and the groove structure 210. The functional area includes the wavelength conversion units 221 and the display units 110, and the groove structure 210 surrounds the functional area. Accordingly, referring to Figures 10-11, the entire reflective film 410 covers the sidewalls, bottom wall, and surface of the wavelength conversion units 221 of the groove. After the entire surface is etched, the film layer area on the surface of the wavelength conversion units 221 and the bottom wall of the groove structure is removed to obtain the reflective layer 270. It can be understood that the second initial filling layer 430 can be completely removed after the overall patterned etching, or it can partially remain to obtain multiple second filling structures, which can cover the side walls of the wavelength conversion unit to align with the first filling structure on the outer wall of the display unit 110 to facilitate the subsequent formation of the reflective layer 410.

[0106] In some other embodiments, referring to FIG2 and FIG3 , a reflective layer is further present between the display unit 110 and the wavelength conversion layer 220 for selectively transmitting or reflecting light of a specific wavelength from the display unit 110, so as to reduce the optical noise of the first color light incident on the wavelength conversion unit 221. Accordingly, referring to FIG2 and FIG3 , at least one functional layer includes a first reflective layer 230. Before S22: forming an initial functional layer 450 corresponding to the wavelength conversion layer on the display device 100, referring to FIG13-14 , S2 may further include: forming an initial functional layer 440 corresponding to the first reflective layer on the display device 100, the first reflective layer 230 at least covering the display unit 110, being located between the wavelength conversion layer 220 and the display device 100, and being configured to selectively transmit or reflect the light emitted from the display unit 110, so as to emit the first color light.

[0107] In some embodiments, the initial functional layer 440 corresponding to the first reflective layer covers the first initial filling layer 420 and the display unit 110. In one embodiment, the first reflective layer 230 can transmit the first color light and reflect other colors of light, such as transmitting blue light and reflecting red and green light.

[0108] The first reflective layer 230 can be formed by epitaxial growth or deposition processes, such as molecular beam epitaxy or chemical vapor deposition. In some embodiments, the first reflective layer 230 can be a distributed Bragg reflector (DBR); the first reflective layer 230 can include alternating TiO2 layers / SiO2 layers or alternating SiO2 layers / HfO2 layers.

[0109] Accordingly, the initial functional layer 450 corresponding to the wavelength conversion layer is formed on the initial functional layer 440 corresponding to the first reflective layer, and receives the first color light filtered by the first reflective layer 230. After the entire surface etching in S31, the initial functional layer 450 corresponding to the wavelength conversion layer and the initial functional layer 440 corresponding to the first reflective layer are etched simultaneously into the wavelength conversion layer 220 and the first reflective layer 230. The formed first reflective layer 230 includes a plurality of first reflective units 231 separated by the groove structure 210. The first reflective units 231 are arranged corresponding to the display unit 110 and cover the display unit 110.

[0110] In other embodiments, referring to Figures 2 and 3, at least one functional layer includes a second reflective layer 240. After S22: an initial functional layer 450 corresponding to the wavelength conversion layer is formed on the display device 100, referring to Figure 16, S2 may also include: forming an initial functional layer 460 corresponding to the second reflective layer on the initial functional layer 450 corresponding to the wavelength conversion layer, and the second reflective layer 240 at least covers the wavelength conversion unit 221, and is used to purify the light emitted through the wavelength conversion unit 221.

[0111] Specifically, the second reflective layer 240 is capable of transmitting at least a portion of the light emitted by each wavelength conversion unit 221 and reflecting stray light. In some embodiments, the second reflective layer 240 is capable of transmitting at least one of the first color light, the second color light, and the third color light, while reflecting light of other colors. In one example, the second reflective layer 240 is capable of transmitting the first color light, the second color light, and the third color light, while reflecting light of other wavelengths. In another example, the second reflective layer 240 is capable of transmitting the second color light and the third color light, while reflecting the first color light.

[0112] In some embodiments, the second reflective layer 240 is capable of transmitting light emitted from each wavelength conversion unit 221, and the initial functional layer 460 corresponding to the second reflective layer can be a continuous structure stacked on the initial functional layer 450 corresponding to the wavelength conversion layer (Figure 16); or, the second reflective layer 240 is capable of transmitting light emitted from part of the wavelength conversion unit 221, and the functional layer corresponding to the second reflective layer 240 is stacked on the initial functional layer 450 corresponding to the wavelength conversion layer and exposes the wavelength conversion unit 221 where the emitted light is reflected (Figure 17), such as the second reflective layer 240 covers the first wavelength conversion unit 221a and the third wavelength conversion unit 221c, and exposes the second wavelength conversion unit 221b.

[0113] It can be understood that the formation process of the second reflective layer 240 is similar to that of the aforementioned first reflective layer 230, such as a DBR layer, which will not be described here. The difference is that in some cases, patterned etching is required to form an opening 461 (Figure 17) that exposes part of the wavelength conversion unit 221.

[0114] In some embodiments, referring to Figure 18, at least one filling layer also includes a fourth filling layer, and the fourth filling layer includes a fourth filling structure 310. After forming the opening 461, S2 also includes forming a fourth filling structure 310 in the opening 461 to flatten the initial functional layer 460 corresponding to the second reflective layer. The fourth filling structure 310 uses a transparent material to pass through the light emitted from the covered wavelength conversion unit 221. Furthermore, after forming the second reflective layer 240 and the fourth filling structure 310, the first initial filling layer 420, the initial functional layer 440 corresponding to the first reflective layer, the initial functional layer 450 corresponding to the wavelength conversion layer, the second initial filling layer 430 and the initial functional layer 460 corresponding to the second reflective layer are patterned and etched as a whole through the aforementioned S31 to obtain the first reflective layer 230, the wavelength conversion layer 220, the second reflective layer 240 and the groove structure 210, the second reflective layer 240 includes a plurality of second reflective units 241, the second reflective unit 241 is arranged in alignment with the display unit 110, and a single functional area includes the display unit 110, the first reflective unit 231, the wavelength conversion unit 221 and the second reflective unit 241, and the groove structure 210 surrounds the side walls of the display unit 110, the first reflective unit 231, the wavelength conversion unit 221 and the second reflective unit 241 to facilitate the formation of the reflective layer 270 (refer to Figure 2).

[0115] In some other embodiments, referring to Figure 3, at least one functional layer further includes a filter layer 250, and the functional unit in the filter layer 250 is a color filter unit 251. In S22: after the initial functional layer 450 corresponding to the wavelength conversion layer is formed on the display device 100, referring to Figure 22, S2 may further include: forming an initial functional layer 470 corresponding to the filter layer above the initial functional layer 450 corresponding to the wavelength conversion layer, the initial functional layer 470 corresponding to the filter layer includes a plurality of spaced color filter units 251, and the color filter unit 251 is aligned with the wavelength conversion unit 221.

[0116] Specifically, the initial functional layer 470 corresponding to the filter layer is located on the second reflective layer 240. The color filter unit covers the wavelength conversion unit 221 to filter and purify the light emitted therefrom, remove stray light, and reduce optical noise. In some embodiments, the color filter unit 251 can be a color filter (CF) for further purifying the color of the light emitted by the wavelength conversion unit 221. The color corresponding to the color filter unit 251 is consistent with the color of the light emitted by the wavelength conversion unit 221 it covers. For example, the color filter unit 251 above the first wavelength conversion unit 221a uses a second color filter material, the color filter unit 251 above the third wavelength conversion unit 221c uses a third color filter material, and the color filter unit 251 above the second wavelength conversion unit 221b uses a first color filter material, or no color filter unit 251 is formed.

[0117] Correspondingly, referring to FIG23 , at least one initial filling layer further includes a third initial filling layer 480. After forming the initial functional layer 470 corresponding to the filter layer above the initial functional layer 450 corresponding to the wavelength conversion layer, S2 may further include: forming the third initial filling layer 480 on the initial functional layer 470 corresponding to the filter layer. The third initial filling layer 480 fills the spacing between adjacent color filter units 251 to planarize the initial functional layer 470 corresponding to the filter layer, thereby improving the stability of the filter layer 250 and facilitating subsequent overall pattern etching. It is understood that after overall pattern etching, the third initial filling layer 480 forms a third filling layer including a third filling structure 320. The third filling structure 320 is flush with the color filter units 251 to achieve planarization. The material of the third filling structure 320 is a light-transmitting material.

[0118] In some cases, the initial functional layer 460 corresponding to the second reflective layer exposes a portion of the wavelength conversion unit 221, such as the wavelength conversion unit 221 corresponding to the first color light. The initial functional layer 470 corresponding to the filter layer also exposes this portion of the wavelength conversion unit 221. The third initial filling layer 480 can then fill the gaps above this portion of the wavelength conversion unit 221, achieving planarization while protecting the wavelength conversion unit 221. Accordingly, the third initial filling layer 480 is made of a transparent material. It is understood that the formation process and materials of the third initial filling layer 480 are similar to those of the first initial filling layer 420 or the second initial filling layer 430 described above, and are not further described here.

[0119] Accordingly, after forming the third initial filling layer 480, the first initial filling layer 420, the initial functional layer 440 corresponding to the first reflective layer, the initial functional layer 450 corresponding to the wavelength conversion layer, the second initial filling layer 430, the initial functional layer 460 corresponding to the second reflective layer, the initial functional layer 470 corresponding to the filter layer and the third initial filling layer 480 are patterned and etched as a whole through the aforementioned S31 to obtain the first reflective layer 230, the wavelength conversion layer 220, the second reflective layer 240, the filter layer 250 and the groove structure 210 ( 25 ), the filter layer 250 includes a plurality of color filter units 251, a single functional area includes a display unit 110, a first reflection unit 231, a wavelength conversion unit 221, a second reflection unit 241 and a color filter unit 251, or includes a third filling structure 320 formed by a display unit 110, a first reflection unit 231, a wavelength conversion unit 221, a second reflection unit 241 and a third initial filling layer 480, and a groove structure 210 surrounds the sidewall of the functional area to facilitate the formation of a reflective layer 270.

[0120] Based on some or all of the above embodiments, in an embodiment of the present application, referring to Figures 12, 21 and 28, after S4, the formation method also includes S5: forming a grid layer 280 that fills the groove structure 210, the grid layer 280 includes a plurality of grid holes, the grid holes are aligned with the wavelength conversion unit 221 and expose the light area 260, so that the light area is exposed through the grid holes to achieve light transmission and improve the stability and flatness of each functional area.

[0121] In some embodiments, the material of the grid layer 280 can be transparent or non-transparent, and can include inorganic or organic materials. The inorganic material can be selected from any one or a combination of Al, Al2O3, Ag, SiO2, Si3N4, ZrO2, TiO2, and HfO2; the organic material can be selected from any one or a combination of black matrix photoresist, polyimide, styrene-propylcyclobutene, color filter photoresist, overcoat glue, barrier glue (BANK), and near-ultraviolet negative photoresist. The grid layer 280 can be formed by at least one process such as spin coating or spray coating.

[0122] In some embodiments, after S5, referring to Figures 1-3, the forming method further includes S6: forming a plurality of microlenses 290 on the grid layer 280. The microlenses 290 are aligned with the grid holes and cover the light-emitting area 260. The microlenses cover the light-emitting surface of the functional area to converge light emitted from the functional area, thereby increasing the convergence and brightness of the emitted light.

[0123] In some embodiments, the material of the microlens array 290 may include a dielectric material or an organic material, specifically a dielectric material such as silicon oxide and silicon nitride, such as SiO 2 , TiO 2 , SiN, HfO or AIN.

[0124] In some embodiments, referring to FIG1 , the grid holes expose the wavelength conversion unit 221, and the microlenses 290 cover the wavelength conversion unit 221. In other embodiments, referring to FIG2 , the grid holes expose the second reflective unit 241, and the microlenses 290 cover the second reflective unit 241. In other embodiments, referring to FIG3 , the grid holes expose the color filter unit 251, and the microlenses 290 cover the color filter unit 251.

[0125] The display chip of the present application is described below with reference to Figures 1-3. It should be understood that the packaging structure in the accompanying drawings is only a technical solution for a specific embodiment of the present application. The packaging structure of the present application may include fewer or more structural features and is not limited to the proposed device structure described in the accompanying drawings. Referring to Figures 1-3, the display chip includes:

[0126] The display device 100 includes a plurality of display cells 110 arranged at intervals; at least one initial filling layer; at least one functional layer; and a groove structure 210 comprising a plurality of functional cells. The functional cells are located on the display cells 110 and allow at least a portion of light emitted by the display cells 110 to pass through. The at least one initial filling layer surrounds at least the sidewalls of the display cells 110. The groove structure 210 surrounds the display cells 110 and the functional cells, with the bottom of the groove structure 210 exposing the display device 100. The at least one functional layer includes a wavelength conversion layer 220. The functional cells in the wavelength conversion layer 220 are wavelength conversion cells 221 for converting the wavelength of light emitted by the display cells 110. A reflective layer 270 covers the sidewalls of the groove structure 210 and exposes the bottom of the groove structure 210 and the light emitting area 260 corresponding to the display cells 110. Each functional cell and the display cell 110 form a functional area. The plurality of functional areas are arranged at intervals, and the reflective layer 270 surrounds the functional areas. The display cells 110 are configured to emit light of a first color.

[0127] In some embodiments, referring to Figures 1-3, at least one filling layer includes a first filling layer, the first filling layer includes a plurality of first filling structures, the first filling structure 130 surrounds the side wall of the display unit 110 and exposes the light-emitting surface of the display unit 110 to flatten the side wall of the display unit 110 and improve its stability.

[0128] In some embodiments, referring to Figures 1-3, the wavelength conversion layer 220 includes a plurality of wavelength conversion units 221 arranged at intervals. The wavelength conversion units 221 are arranged in alignment with the display unit 110 to convert the wavelength of light emitted by the display unit 110.

[0129] In one embodiment, each wavelength conversion unit 221 includes a first wavelength conversion unit 221a, a second wavelength conversion unit 221b and a third wavelength conversion unit 221c. The first wavelength conversion unit 221a can convert the first color light into the second color light, the second wavelength conversion unit 221b can transmit the first color light, and the third wavelength conversion unit 221c can convert the first color light into the third color light.

[0130] In some embodiments, referring to FIG. 1-3 , the display chip further includes a grid layer 280 ; the grid layer 280 fills the trench structure 210 and includes a plurality of grid holes, which are aligned with the wavelength conversion unit 221 and expose the light region 260 .

[0131] In some embodiments, referring to FIG. 1-3 , the display chip further includes a plurality of micro lenses 290 ; the micro lenses 290 are aligned with the grid holes and cover the light exit area 260 .

[0132] In some embodiments, referring to FIG1 , the functional area includes the display unit 110 and the wavelength conversion layer 220. The groove structure 210 surrounds the sidewalls of the display unit 110 and the sidewalls of the wavelength conversion layer 220. Accordingly, the reflective layer 270 covers the sidewalls of the display unit 110 and the sidewalls of the wavelength conversion layer 220 to achieve light reflection and light convergence. The light-emitting region 260 is located on the surface of the wavelength conversion unit 221 and is covered with microlenses 290 to emit monochromatic light.

[0133] In some embodiments, referring to Figures 2 and 3 , at least one functional layer includes a first reflective layer 230. The first reflective layer 230 covers at least the display unit 110 and is located between the wavelength conversion layer 220 and the display device 100. The first reflective layer 230 is configured to selectively transmit or selectively reflect light emitted from the display unit 110 to emit light of a first color. Specifically, the functional unit of the first reflective layer 230 is a first reflective unit 231. The first reflective unit 231 is aligned with the display unit 110 and covers the light-emitting surface 115 of the display unit.

[0134] In some embodiments, referring to Figures 2 and 3 , at least one functional layer includes a second reflective layer 240. The second reflective layer 240 is located on the wavelength conversion layer 220 and covers at least the wavelength conversion unit 221, and is configured to purify light emitted through the wavelength conversion unit 221. Specifically, the functional unit of the second reflective layer 240 is the second reflective unit 241, which is aligned with the wavelength conversion unit 221 and covers the light-emitting surface of the wavelength conversion unit 221.

[0135] In some embodiments, if the second reflective layer 240 is unable to transmit a portion of the color light emitted by the wavelength conversion unit 221, the second reflective layer 240 exposes that portion of the wavelength conversion unit 221. For example, if the second reflective layer 240 reflects the first color light, the second wavelength conversion unit 221b is correspondingly exposed. Accordingly, a fourth filling structure 310 is formed on the wavelength conversion unit 221 exposed by the second reflective layer 240. The fourth filling structure 310 is flush with the second reflective layer 240 to achieve layer planarization. The fourth filling structure 310 is made of a transparent material.

[0136] In some embodiments, in conjunction with FIG2 , the functional area includes the display unit 110, the first reflective unit 231, the wavelength conversion layer 220, and the second reflective unit 241, or includes the display unit 110, the first reflective unit 231, the wavelength conversion layer 220, and the fourth filling structure 310. The groove structure 210 surrounds the sidewalls of the display unit 110, the sidewalls of the first reflective unit 231, the sidewalls of the wavelength conversion layer 220, and the sidewalls of the second reflective unit 241, or surrounds the sidewalls of the display unit 110, the sidewalls of the first reflective unit 231, the sidewalls of the wavelength conversion layer 220, and the sidewalls of the fourth filling structure 310. Accordingly, the reflective layer 270 covers the sidewalls of the functional area to achieve light reflection and light convergence. The light emitting area 260 is located on the surface of the second reflective unit 241 or the surface of the fourth filling structure 310 and is covered with a microlens 290 to emit monochromatic light.

[0137] In some embodiments, in combination with Figure 3, at least one functional layer includes a filter layer 250, and the functional unit in the filter layer 250 is a color filter unit 251; the filter layer 250 is located on the second reflective layer 240, and includes a plurality of spaced color filter units 251, and the color filter units 251 are arranged in alignment with the wavelength conversion units 221, and the color filter units 251 cover the wavelength conversion units 221.

[0138] In some embodiments, the second reflective layer 240 exposes a portion of the wavelength conversion unit 221. Accordingly, the color filter unit 251 is not set on the portion of the wavelength conversion unit 221. Referring to the figure, a third filling structure 320 is formed thereon. The third filling structure 320 is flush with the color filter unit 251 to achieve planarization. The material of the third filling structure 320 is a light-transmitting material.

[0139] In some embodiments, in combination with Figure 3, the functional area includes the display unit 110, the first reflection unit 231, the wavelength conversion layer 220, the second reflection unit 241 and the color filter unit 251, or includes the display unit 110, the first reflection unit 231, the wavelength conversion layer 220, the color filter unit 251 and the third filling structure 320, and the groove structure 210 surrounds the side wall of the display unit 110, the side wall of the first reflection unit 231, the side wall of the wavelength conversion layer 220, the side wall of the second reflection unit 241 and the side wall of the color filter unit 251, or surrounds the side wall of the display unit 110, the side wall of the first reflection unit 231, the side wall of the wavelength conversion layer 220, the side wall of the color filter unit 251 and the side wall of the third filling structure 320; accordingly, the reflective layer 270 covers the side wall of the functional area to achieve light reflection and light convergence. The light emitting region 260 is located on the surface of the color filter unit 251 or the surface of the third filling structure 320 and is covered with a micro lens 290 to emit monochromatic light.

[0140] It can be understood that the above-mentioned display chip embodiment, display chip embodiment, and display chip forming method embodiment are based on the same application concept; the display chip can be manufactured using the above-mentioned display chip forming method or display chip.

[0141] The present application further provides a display device 100 , which includes a display chip provided by any of the above embodiments. The display chip can be manufactured using the aforementioned display chip or display chip forming method.

[0142] The present application also provides an electronic device, comprising the aforementioned display chip, which can be manufactured using the aforementioned display chip or display chip forming method. Specifically, the electronic device can be a near-eye display device, such as a NED device, AR glasses, etc.

[0143] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0144] The above description has fully disclosed the specific embodiments of this application. It should be noted that any changes made by those skilled in the art to the specific embodiments of this application do not depart from the scope of the claims of this application. Accordingly, the scope of the claims of this application is not limited to the above specific embodiments.

Claims

1. A method for forming a display chip, characterized in that: The forming method comprises: A display device (100) is provided, wherein the display device (100) includes a plurality of display units (110) arranged at intervals; forming at least one initial filling layer and at least one initial functional layer on the display device (100); Grooves are formed integrally penetrating each of the initial filling layers and each of the initial functional layers to obtain at least one filling layer, at least one functional layer, and a groove structure (210), wherein the functional layer comprises a plurality of functional units, the functional units being located on the display unit (110) and allowing at least a portion of light emitted by the display unit (110) to pass through, and the at least one filling layer at least surrounds the sidewall of the display unit (110); the groove structure (210) surrounds the display unit (110) and the functional units, and the bottom of the groove structure (210) exposes the display device (100); the at least one functional layer comprises a wavelength conversion layer (220), and the functional units in the wavelength conversion layer (220) are wavelength conversion units (221) for performing wavelength conversion on light emitted by the display unit (110); A reflective layer (270) is formed on the groove structure (210), wherein the reflective layer (270) covers the sidewalls of the groove structure (210) and exposes the bottom of the groove structure (210) and the light emitting area (260) corresponding to the display unit (110).

2. The forming method according to claim 1, wherein: The initial filling layer is filled in the spaced area between adjacent display units (110) or the spaced area between adjacent functional units; the grooves integrally formed through each of the initial filling layer and each of the initial functional layers to obtain at least one filling layer, at least one functional layer and a groove structure (210) include: Each of the initial filling layers and each of the initial functional layers is subjected to overall pattern etching to obtain the at least one filling layer, the at least one functional layer and the groove structure (210).

3. The forming method according to claim 2, wherein: The etching method used for the overall pattern etching is dry etching.

4. The forming method according to claim 1, wherein: The forming of the reflective layer (270) on the groove structure (210) includes: forming a whole reflective film layer (410) covering the bottom of the groove structure (210), the sidewalls of the groove structure (210), and the light exit area (260) corresponding to the display unit (110); The light-emitting area (260) and the reflective film layer area on the bottom of the groove structure (210) are removed by full-surface etching to obtain the reflective layer (270).

5. The forming method according to any one of claims 1 to 4, characterized in that: The at least one initial filling layer includes a first initial filling layer (420), and forming at least one initial filling layer and at least one initial functional layer on the display device (100) includes: forming a first initial filling layer (420) on the display device (100) to fill the space between adjacent display units (110), wherein the first initial filling layer (420) exposes the light-emitting surface (115) of the display unit, or the first initial filling layer (420) covers the display unit (110) and is formed of a light-transmitting material; An initial functional layer (450) corresponding to the wavelength conversion layer is formed on the display device (100), wherein the initial functional layer (450) corresponding to the wavelength conversion layer includes a plurality of wavelength conversion units (221) arranged at intervals, and the wavelength conversion units (221) are arranged in alignment with the display unit (110).

6. The forming method according to claim 5, wherein: The at least one initial filling layer includes a second initial filling layer (430), and after forming the initial functional layer (450) corresponding to the wavelength conversion layer on the display device (100), the forming method further includes: The second initial filling layer (430) is formed on the initial functional layer (450) corresponding to the wavelength conversion layer, and the second initial filling layer (430) fills the interval area between adjacent wavelength conversion units (221).

7. The forming method according to claim 5, wherein: The at least one functional layer includes a first reflective layer (230), and before forming an initial functional layer (450) corresponding to the wavelength conversion layer on the display device (100), the forming method further includes: An initial functional layer (440) corresponding to the first reflective layer is formed on the display device (100). The first reflective layer (230) at least covers the display unit (110) and is located between the wavelength conversion layer (220) and the display device (100), and is used for selectively transmitting or selectively reflecting light emitted by the display unit (110) to emit first color light.

8. The forming method according to claim 5, wherein: The at least one functional layer includes a second reflective layer (240), and after forming an initial functional layer (450) corresponding to the wavelength conversion layer on the display device (100), the forming method further includes: An initial functional layer (460) corresponding to the second reflective layer is formed on the initial functional layer (450) corresponding to the wavelength conversion layer, and the second reflective layer (240) at least covers the wavelength conversion unit (221) and is used for purifying light emitted from the wavelength conversion unit (221).

9. The forming method according to claim 5, wherein: The at least one functional layer further comprises a filter layer (250), the functional unit in the filter layer (250) being a color filter unit (251), and after forming the initial functional layer (450) corresponding to the wavelength conversion layer on the display device (100), the forming method further comprises: An initial functional layer (470) corresponding to the filter layer is formed above the initial functional layer (450) corresponding to the wavelength conversion layer, wherein the initial functional layer (470) corresponding to the filter layer comprises a plurality of color filter units (251) arranged at intervals, and the color filter units (251) are arranged in alignment with the wavelength conversion units (221).

10. The forming method according to claim 9, wherein: The at least one initial filling layer further comprises a third initial filling layer (480), and after forming the initial functional layer (470) corresponding to the filter layer above the initial functional layer (450) corresponding to the wavelength conversion layer, the forming method further comprises: The third initial filling layer (480) is formed on the initial functional layer (470) corresponding to the filter layer, and the third initial filling layer (480) fills the interval area between adjacent color filter units (251).

11. The forming method according to any one of claims 1 to 4, characterized in that: After forming the reflective layer (270) on the groove structure (210), the forming method further comprises: A grid layer (280) is formed to fill the groove structure (210), wherein the grid layer (280) includes a plurality of grid holes, and the grid holes are aligned with the wavelength conversion unit (221) and expose the light exit area (260).

12. The forming method according to claim 11, wherein: After forming the grid layer (280) filling the trench structure (210), the forming method further comprises: A plurality of micro lenses (290) are formed on the grid layer (280), and the micro lenses (290) are arranged in alignment with the grid holes and cover the light exit area (260).

13. A display chip, characterized in that: The display chip includes: A display device (100) comprising a plurality of display units (110) arranged at intervals; At least one initial filling layer, at least one functional layer, and a groove structure (210), wherein the functional layer includes a plurality of functional units, the functional units are located on the display unit (110) and allow at least part of the light emitted by the display unit (110) to pass through, and the at least one initial filling layer at least surrounds the sidewall of the display unit (110); the groove structure (210) surrounds the display unit (110) and the functional units, and the bottom of the groove structure (210) exposes the display device (100); the at least one functional layer includes a wavelength conversion layer (220), and the functional units in the wavelength conversion layer (220) are wavelength conversion units (221) for performing wavelength conversion on the light emitted by the display unit (110); A reflective layer (270) covers the sidewalls of the groove structure (210) and exposes the groove bottom of the groove structure (210) and the light exit area (260) corresponding to the display unit (110).

14. The display chip according to claim 13, wherein: The wavelength conversion layer (220) comprises a plurality of wavelength conversion units (221) arranged at intervals, and the wavelength conversion units (221) are arranged in alignment with the display unit (110).

15. The display chip according to claim 14, wherein: The display chip further comprises a grid layer (280); the grid layer (280) fills the groove structure (210) and comprises a plurality of grid holes, wherein the grid holes are aligned with the wavelength conversion unit (221) and expose the light exit area (260).

16. The display chip according to claim 15, wherein: The display chip further comprises a plurality of micro lenses (290); the micro lenses (290) are arranged in alignment with the grid holes and cover the light exit area (260).

17. The display chip according to any one of claims 14 to 16, characterized in that: The at least one functional layer comprises a first reflective layer (230), the first reflective layer (230) at least covering the display unit (110), being located between the wavelength conversion layer (220) and the display device (100), and being used for selectively transmitting or selectively reflecting light emitted by the display unit (110) to emit light of a first color.

18. The display chip according to any one of claims 14 to 16, characterized in that: The at least one functional layer comprises a second reflective layer (240), wherein the second reflective layer (240) is located on the wavelength conversion layer (220) and at least covers the wavelength conversion unit (221), and is used for purifying light emitted through the wavelength conversion unit (221).

19. The display chip according to any one of claims 18, wherein: The at least one functional layer comprises a filter layer (250), and the functional unit in the filter layer (250) is a color filter unit (251); The filter layer (250) is located on the second reflective layer (240), and comprises a plurality of color filter units (251) arranged at intervals, wherein the color filter units (251) are arranged in alignment with the wavelength conversion units (221).

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