Induction heating cooking device

Abstract

This induction heating cooking device comprises: a plate for placing a cooking container thereon; a heating device configured to heat the cooking container by receiving a driving current from a printed circuit board; and a user interface for receiving a user input for operating the heating device. In addition, the induction heating cooking device comprises: a heat dissipation member disposed below the user interface and provided to be able to exchange heat with the printed circuit board; and a cooling fan provided to generate an air flow for cooling the heat dissipation member. In addition, the induction heating cooking device comprises a branch guide for guiding a portion of the air flow generated by the cooling fan to the user interface, the branch guide including a second flow path disposed above and separated from a first flow path through which air for cooling the heat dissipation member flows.

Description

Induction cooker

[0001] The present invention relates to an induction heating cooker.

[0002] Induction heating cookers heat objects such as frying pans and pots by passing high-frequency current through a heating coil, generating high-frequency magnetic flux that passes through the object to be heated on the surface. This electromagnetic induction heats the object. In induction heating (IH), high-frequency magnetic flux passes through the object to induce eddy currents in the object, which in turn heats the object due to its own electrical resistance.

[0003] In an induction cooker, when the object to be heated is heated by induction heating, the heating coil generates heat due to a phenomenon that causes energy loss called the skin effect or proximity effect.

[0004] Regarding the operation of induction cookers, various smart technologies can be incorporated to enhance user convenience. For example, one side of the induction cooker can be equipped with a user interface device, such as an LED or LCD panel, that controls the operation of the heating coil and displays other information, thereby enhancing user convenience.

[0005] One aspect of the present disclosure provides an induction heating cooker capable of cooling a user interface device.

[0006] One aspect of the present disclosure provides an induction cooker including a structure that guides a portion of a cooling airflow flowing through a heat sink to a user interface device.

[0007] One aspect of the present disclosure provides an induction heating cooker including a structure that does not impede the heat exchange effect of a heat dissipation member when guiding a portion of a cooling airflow to a user interface device.

[0008] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0009] An induction heating cooker according to the invention comprises a plate on which a cooking vessel is to be placed, a heating device configured to heat the cooking vessel by receiving a driving current from a printed circuit board, and a user interface configured to receive a user input for operating the heating device. The induction heating cooker comprises a heat dissipation member arranged below the user interface and provided to be capable of heat exchange with the printed circuit board, and a cooling fan arranged to generate an airflow for cooling the heat dissipation member. The induction heating cooker comprises a branch guide for guiding a portion of the airflow generated by the cooling fan to the user interface, the branch guide including a first flow path through which air for cooling the heat dissipation member flows and a second flow path arranged above the first flow path.

[0010] In one embodiment, an induction heating cooker includes a plate on which a cooking vessel is mounted, a heating device configured to heat the cooking vessel by receiving a driving current from a printed circuit board, a user interface electrically connected to the printed circuit board and receiving a user input for operating the heating device, a heat dissipation member disposed below the user interface and including a heat absorbing member for absorbing heat generated from the printed circuit board and a heat generating member for dissipating the absorbed heat of the printed circuit board, and a cooling fan provided to generate an airflow for cooling the heat dissipation member. The induction heating cooker includes a branch guide for guiding a portion of the airflow generated by the cooling fan to the user interface. The heat generating member includes an inlet portion into which another portion of the airflow generated by the cooling fan is introduced, an outlet portion through which the introduced airflow is discharged, and a first flow path communicating the inlet portion and the outlet portion. The branch guide includes an extension portion extending along the first euro, and a curved portion curved from one end of the extension portion adjacent to the discharge portion into the interior of the user interface and positioned above the discharge portion.

[0011] An induction heating cooker according to one embodiment includes a plate on which a cooking vessel is mounted, a heating device configured to heat the cooking vessel by receiving a driving current from a printed circuit board, a user interface configured to receive a user input for operating the heating device, a heat dissipation member arranged below the user interface and configured to absorb and dissipate heat generated from the printed circuit board, the heat dissipation member including an inlet portion into which airflow that receives heat emitted from the printed circuit board flows in and an outlet portion through which the airflow is discharged, and a cooling fan that generates airflow that cools the user interface and the heat dissipation member. The induction heating cooker includes a first duct that covers the heat dissipation member so as to guide a portion of the airflow generated from the cooling fan to the heat dissipation member, and a second duct that guides another portion of the airflow generated from the cooling fan to the user interface, and is arranged between the outlet portion and the user interface, and is distinct from the first duct.

[0012] According to the invention, airflow can be directed into the interior of the user interface device through the branch guide, thereby effectively cooling the user interface device.

[0013] According to the invention, the user interface device can be cooled to prevent deterioration of the user interface device, thereby extending the service life of the induction heating cooker.

[0014] According to the idea of ​​the present disclosure, the branch guide includes a curved portion that is curved on the upper side of the discharge portion of the heat dissipation member, so that the discharge portion can be exposed to the outside without being covered, and thus the heat exchange effect of the heat dissipation member can be prevented.

[0015] According to the idea of ​​the present disclosure, the branch guide is positioned at a height corresponding to the first heat dissipation fin located at the top among the plurality of heat dissipation fins, so that the discharge portion of the heat dissipation member can be exposed to the outside without covering it, and thus the heat exchange effect of the heat dissipation member can not be hindered.

[0016] According to the invention of the present disclosure, since the branch guide includes an insulating material, even if it is placed adjacent to a heat dissipation member, the airflow flowing in the branch guide may not be heated, thereby effectively cooling the user interface device.

[0017] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0018] FIG. 1 is a drawing illustrating an induction heating cooker according to one embodiment.

[0019] FIG. 2 is an exploded view of an induction heating cooker according to one embodiment.

[0020] FIG. 3 is a drawing showing the main module separated from an induction heating cooker according to one embodiment.

[0021] Figure 4 is a drawing showing the main module of Figure 3 in an exploded view.

[0022] Figure 5 is a drawing showing the main module of Figure 3 from a different angle.

[0023] Figure 6 is a drawing showing the main module of Figure 5 in an exploded view.

[0024] Fig. 7 is a front view enlarged view of a portion of the main module of Fig. 3.

[0025] Fig. 8 is a cross-sectional drawing of the main module of Fig. 7 cut along the a-a' cutting line.

[0026] FIG. 9 is a cross-sectional view of an induction heating cooker according to one embodiment, taken along a-a' cutting line along a portion of the main module.

[0027] FIG. 10 is a front view enlarged view of a portion of a main module in an induction heating cooker according to one embodiment.

[0028] Fig. 11 is a cross-sectional drawing of the main module of Fig. 10 taken along the a-a' cutting line.

[0029] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and there may be various modified examples that can replace the embodiments and drawings of this specification at the time of filing of this application.

[0030] Additionally, the same reference numbers or symbols presented in each drawing of this specification represent parts or components that perform substantially the same function.

[0031] In addition, the terminology used in this specification is used to describe embodiments and is not intended to limit and / or restrict the disclosed invention. The singular expression includes plural expressions unless the context clearly indicates otherwise. In this specification, the terms "comprises" or "has" and the like are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0032] Additionally, terms including ordinal numbers such as “first,” “second,” etc. used herein may be used to describe various components, but the components are not limited by the terms, and the terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term “and / or” includes any combination of a plurality of related listed items or any item among a plurality of related listed items.

[0033] Meanwhile, the shape and position of each component are not limited by the terms such as “front”, “back”, “left”, “right”, “up” and “down” used in the description below.

[0034] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0035] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0036] When referring to the direction of rotation, clockwise may be referred to as the first direction, and counterclockwise, the direction opposite to the first direction, may be referred to as the second direction. While these expressions may be commonly used to describe specific details for implementing the invention, the rotational direction of the components of the present invention is not limited by these terms.

[0037] Hereinafter, an induction heating cooker according to various embodiments will be specifically described with reference to the attached drawings.

[0038] Fig. 1 is a drawing illustrating an induction heating cooker according to one embodiment. Fig. 2 is an exploded drawing illustrating an induction heating cooker according to one embodiment.

[0039] Referring to FIGS. 1 and 2, an induction heating cooker (1) may include a plate (10) on which a cooking vessel (not shown) is mounted, and a case (20) that is covered by the plate (10) and can accommodate other components.

[0040] For convenience of explanation, the plate (10) is illustrated in a dashed line in Fig. 1. For example, the plate (10) may include a flat shape so that a cooking vessel can be placed on it.

[0041] The upper surface (11) of the plate can be in contact with the cooking vessel, and the lower surface (12) of the plate can be arranged to face the case (20) and can be in contact with the case (20).

[0042] For example, the plate (10) may include a reinforced glass material such as ceramic glass. For example, the plate (10) may include a heat-resistant material.

[0043] The plate (10) may include guide marks (13, 14a, 14b) where the heating devices (170, 270a, 270b) to be described later are positioned. When the plate (10) covers the case (20), the guide marks (13, 14a, 14b) may be positioned corresponding to the positions where the heating devices (170, 270a, 270b) are positioned.

[0044] The user can check the position of the heating device (170, 270a, 270b) through the guide marks (13, 14a, 14b) and place the cooking container on the heating device (170, 270a, 270b).

[0045] In the city, three guide marks (13, 14a, 14b) are shown formed on the plate (10), but this is only an example, and the number and shape of the guide marks (13, 14a, 14b) can be provided in various ways corresponding to the number of heating devices (170, 270a, 270b).

[0046] The case (20) may include a case body (25) forming an outer shape and a receiving portion (26) formed on the inside of the case body (25) and capable of receiving components of the induction heating cooker (1).

[0047] For example, the case body (25) may include a hexahedral shape that is open toward the upper side. The receiving portion (26) formed on the inner side of the case body (25) may be connected to the outside by the shape of the case body (25) that is open toward the upper side.

[0048] The plate (10) can be combined with the case (20) so that the lower surface (12) of the plate faces the receiving portion (26), and the plate (10) can partition the receiving portion (26) from the external space (S).

[0049] For example, an induction heating cooker (1) may include a main module (100) configured to heat a cooking vessel and accommodated in a receiving portion (26), a first module (200a), and a second module (200b).

[0050] In the city, the configuration for heating the cooking vessel is shown as having three modules: a main module (100), a first module (200a), and a second module (200b), but this is only an example, and the number of modules may vary depending on the purpose and use.

[0051] For example, the main module (100) may include a heating device (170) configured to heat a cooking vessel by receiving driving current from a printed circuit board (120), a heat dissipation member (140) configured to absorb and release heat, and a fan assembly (110) configured to generate airflow to cool the heat dissipation member (140). The heating device (170) may include a heating coil (171, see FIG. 4).

[0052] Hereinafter, the heat dissipation member (140) is described based on absorbing and releasing heat generated from the printed circuit board (120). However, it should be understood that the heat dissipation member (140) may be configured to absorb and release heat generated from the heating device (170) as well as various types of heat generated inside the induction heating cooker.

[0053] For example, the heat dissipation member (140) may be configured to exchange heat with the printed circuit board (120) and receive and dissipate heat generated from the printed circuit board (120).

[0054] The printed circuit board (120) can supply a driving current to the heating device (170) so that heat is generated in the heating device (170). More specifically, the printed circuit board (120) can supply a driving current that varies over time, i.e., an alternating current, to the heating device (170). When the heating device (170) is supplied with an alternating current, a magnetic field whose size and direction vary over time can be induced around the heating coil (171).

[0055] Because of the magnetic field that changes over time, eddy currents (EI) can be generated in the cookware, which rotate around the magnetic field.

[0056] In this way, the phenomenon of generating eddy currents (EI) due to a magnetic field that changes over time is called electromagnetic induction. Eddy currents (EI) can generate electrical resistance heat in the cooking vessel. Electrical resistance heat, which is the heat generated in a resistor when current flows through it, is called Joule heat. As described above, the cooking vessel can be heated by electrical resistance heat, and the food contained in the cooking vessel can be heated.

[0057] In the process of supplying driving current to the heating device (170) through the printed circuit board (120), heat may be generated in the printed circuit board (120).

[0058] The heat dissipation member (140) can be configured to receive heat generated from the printed circuit board (120).

[0059] For example, the printed circuit board (120) may include a roughly rectangular PCB board and electronic components mounted on the PCB board. For example, the electronic components may include switching components, integrated circuit components, etc. for supplying driving current to the heating device (170).

[0060] For example, the heat dissipation member (140) is arranged to be in contact with the printed circuit board (120) so as to absorb heat generated from electronic components of the printed circuit board (120).

[0061] For example, the heat dissipation member (140) may be placed on the side of the printed circuit board (120), and the fan assembly (110) may be placed on the rear of the printed circuit board (120).

[0062] The fan assembly (110) can generate an airflow that cools the heat dissipation member (140). For example, the main module (100) can include a guide duct (130) configured to connect the fan assembly (110) and the heat dissipation member (140) so that the airflow flows from the fan assembly (110) to the heat dissipation member (140).

[0063] For example, the guide duct (130) may include a curved shape to connect a fan assembly (110) positioned at the rear of the printed circuit board (120) and a heat dissipation member (140) positioned at the side of the printed circuit board (120).

[0064] For example, the curved shape may include a convex shape facing away from the printed circuit board (120). Accordingly, airflow generated in the fan assembly (110) can flow to the heat dissipation member (140) through the guide duct (130) (F2, see FIG. 5).

[0065] The main module (100) may include a cover duct (150) that covers a heat dissipation member (140). The cover duct (150) may guide a portion of the airflow generated from the cooling fan (113) to the heat dissipation member (140). For example, the cover duct (150) may be referred to as a first duct (150) in that it is provided to allow a portion of the airflow of the cooling fan (113) to flow.

[0066] For example, the inside of the cover duct (153) is connected to the inside of the guide duct (130) and can receive airflow generated from the fan assembly (110).

[0067] Since the cover duct (150) covers the heat dissipation member (140), the airflow (F) flowing in the heat dissipation member (140) 41 , see Fig. 5) may be covered by a cover duct (150) and may not leak out to the outside. Therefore, the airflow can effectively contact the heat dissipation member (140) and cool the heat dissipation member (140).

[0068] For example, the cover duct (150) may include a lead portion (152) that guides the airflow exchanged with the heat dissipation member (140) to the lower surface of the case (20). The case (20) may include a lower case hole (23) formed on the lower surface of the case body (25) and communicating with the interior of the lead portion (152).

[0069] The lower case hole (23) can be formed through the lower surface of the case body (25) to connect the interior of the lid portion (152) and the external space (S). The air current heated by heat exchange with the heat dissipation member (140) can be guided to the lower surface of the case (20) by the lid portion (152). The air current guided to the lower surface of the case (20) can pass through the lower case hole (23) and ultimately be discharged to the external space (S) (F42, see FIG. 5).

[0070] For example, the case (20) may include a front case hole (22) formed at the front of the case body (25). The front case hole (22) is formed to penetrate the case body (25), so as to connect the receiving portion (26) of the case (20) with the external space (S).

[0071] For example, the case (20) may include a first case hole (21a) and a second case hole (21b) formed on the left and right sides of the front case hole (22), respectively. The first case (20) hole and the second case hole (21b) may also communicate with the receiving portion (26) and the external space (S). The front case hole (22), the first case hole (21a), and the second case hole (21b) will be described later.

[0072] A series of descriptions regarding the method of heating the heating device (170) of the above-mentioned main module (100), the arrangement structure with the heat dissipation member (140) for cooling the printed circuit board (120), the method of cooling the heat dissipation member (140) by the air current generated from the fan assembly (110), and the process of discharging the heat-exchanged air current to the external space (S) can be equally applied to the first module (200a) and the second module (200b) below.

[0073] For example, the first module (200a) may include a first heating device (270a) configured to receive a driving current from a first printed circuit board (220a) to heat a cooking vessel, a first heat dissipation member (240a) configured to be heat-exchangeable with the first printed circuit board (220a) and to receive and dissipate heat generated from the first printed circuit board (220a), and a first fan assembly (210a) configured to generate an airflow to cool the first heat dissipation member (240a). For example, the first module (200a) may include a first guide duct (230a) connecting the first fan assembly (210a) and the first heat dissipation member (240a).

[0074] For example, the second module (200b) may include a second heating device (270b) configured to heat a cooking vessel by receiving a driving current from the second printed circuit board (220b), a second heat dissipation member (240b) configured to be capable of heat exchange with the second printed circuit board (220b) and to receive and dissipate heat generated from the second printed circuit board (220b), and a second fan assembly (210b) configured to generate an airflow to cool the second heat dissipation member (240b). For example, the second module (200b) may include a second guide duct (230b) connecting the second fan assembly (210b) and the second heat dissipation member (240b).

[0075] For example, the first module (200a) and the second module (200b) can be placed on the left and right sides of the main module (100), respectively.

[0076] An induction heating cooker (1) may include a heating device (170), a first heating device (270a), and a second heating device (270b) that receives user input for operating the heating device, and a user interface (160) that displays information about the induction heating cooker (1).

[0077] For example, the user interface (160) may include an input unit (161) that can receive a user's input and an output unit (161) that displays information of the induction heating cooker (1).

[0078] The input unit (161) of the user interface (160) may include a GUI, i.e., software device, such as a touch pad for user input. The touch pad may be implemented as a touch screen panel and form a mutual layer structure with the output unit (161) of the user interface (160).

[0079] The user interface (160) may include, but is not limited to, a cathode ray tube, a digital light source processing panel, a plasma display panel, a liquid crystal display panel, an electroluminescent panel, an electrophoretic display panel, an electrochromic display panel, a light emitting diode panel, or an organic light emitting diode panel, etc., to display information of the induction heating cooker (1).

[0080] As previously described, when the user interface (160) is configured with a touch screen panel forming a mutual layer structure with a touch pad, the output unit (161) of the user interface (160) can also be used as an input unit (161). For convenience of explanation, the user interface (160) will be described below as being configured with a touch screen panel and performing the roles of both the input unit (161) and the output unit (161).

[0081] For example, the user interface (160) may be positioned so that its left-right position corresponds to that of the main module (100) with respect to the case (20). In other words, the user interface (160) may be positioned between the first module (200a) and the second module (200b).

[0082] For example, the user interface (160) may be installed on the lower surface (12) of the plate. In such a case, the user interface (160) may be placed on the upper side of the receiving portion (26) of the case (20), so that it may be located higher than the heating device (170), the heat dissipation member (140), and the cover duct covering them.

[0083] FIG. 3 is a diagram illustrating the main module of an induction heating cooker according to one embodiment, in an exploded view. FIG. 4 is a diagram illustrating the main module of FIG. 3 in an exploded view. FIG. 5 is a diagram illustrating the main module of FIG. 3 from a different angle. FIG. 6 is a diagram illustrating the main module of FIG. 5 in an exploded view.

[0084] Referring to FIGS. 3 to 6, the main module (100) may include a module case (190) that accommodates a heating device (170), a cooling fan (113), a heat dissipation member (140), a printed circuit board (120), etc. The module case (190) may be accommodated in the receiving portion (26) and mounted on the case (20). For example, the module case (190) of the main module (100) may be placed on the center side in the left-right direction (+-Y direction) of the receiving portion (26).

[0085] The module case (190) may include a module case (190) receiving portion (26) formed therein. The module case (190) receiving portion (26) may receive a heating device (170), a heat dissipation member (140), a printed circuit board (120), a cover duct (150), etc.

[0086] The module case (190) may include a plurality of support protrusions (121) protruding upward (+Z side). The plurality of support protrusions (121) may protrude upward from the lower surface of the module case (190). The plurality of support protrusions (121) may protrude upward and penetrate the printed circuit board (120).

[0087] A plurality of support protrusions (121) may be arranged to be spaced apart from each other to support the heating device (170). For example, the plurality of support protrusions (121) may be arranged along the outer circumference of the heating coil (171) of the heating device (170).

[0088] A fan assembly (110) may include a cooling fan (113) that generates airflow, a fan housing (111) that includes a shape that is open toward the top to form a fan receiving groove (112) in which the cooling fan (113) is received, and a fan housing cover (114) that can be coupled to the fan housing (111) to cover the fan receiving groove (112).

[0089] For example, the cooling fan (113) may include, but is not limited to, a sirocco fan.

[0090] For example, the fan housing (111) may be placed on the rear side of the module case (190). For example, the fan housing (111) may be placed on the rear side of the printed circuit board (120) mounted on the module case (190).

[0091] The fan housing (111) may include an airflow supply port (115) through which airflow (F1) is supplied from the outside to the inside of the fan housing (111) as the cooling fan (113) rotates. The airflow (F1) supplied to the inside of the fan housing (111) through the airflow supply port (115) may be discharged (F2) to the guide duct (130) by the cooling fan (113).

[0092] For example, the airflow supply port (115) may be placed on the rear side of the fan housing (111).

[0093] The fan housing (111) may have a roughly hollow cylindrical shape. The fan receiving groove (112) may be a hollow portion formed on the inside of the fan housing (111). The fan housing (111) may protrude upward to partition the fan receiving groove (112) and the module case (190) receiving portion (26).

[0094] For example, the fan housing (111) may be formed integrally with the module case (190). For example, the fan housing (111) may be formed as a part of the module case (190).

[0095] A flow path forming portion (194) may be provided on the side of the module case (190). The flow path forming portion (194) may extend in the forward and backward direction (+-X direction) along the module case (190). For example, the flow path forming portion (194) may be a part of the receiving portion (26) of the module case (190). As will be described later, a heat dissipation member (140) and a cover duct (150) may be positioned in the flow path forming portion (194).

[0096] A heat dissipation member (140) and a cover duct (150) can be mounted on the module case (190). The heat dissipation member (140) and the cover duct (150) can be mounted on the module case (190) so as to extend in the front-back direction (+-X direction). The cover duct (150) can be arranged so that the lead portion (152) faces forward (+X direction).

[0097] As described above, the guide duct (130) may be formed to connect the fan assembly (110), the heat dissipation member (140), and the cover duct (150). The guide duct (130) may include a guide duct body (132) forming an outer shape, and a guide duct passage (131) extending along the guide duct body (132) on the inside of the guide duct body (132). The guide duct body (132) and the guide duct passage (131) may be formed to be curved.

[0098] The cooling fan (113) can rotate to generate airflow. The airflow generated from the cooling fan (113) can be discharged to the outside of the fan housing (111), and the discharged airflow (F2) can flow into the guide duct passage (131). The airflow flowing into the guide duct passage (131) can be guided to the heat dissipation member (140) (F 41 ).

[0099] For example, the guide duct body (132) may be formed integrally with the module case (190). For example, the guide duct body (132) may be a part of the module case (190).

[0100] The heating device (170) may include a heating coil (171) that generates heat and a plurality of coupling protrusions (172) arranged along the outer periphery of the heating coil (171). For example, the plurality of coupling protrusions (172) may be formed to protrude in the radial direction of the heating coil (171).

[0101] A plurality of coupling protrusions (172) can be respectively coupled with a plurality of supporting protrusions (121) of the module case (190) described above, and the heating coil (171) can be stably supported on the module case (190).

[0102] The heat dissipation member (140) may be placed in the euro forming portion (194) of the module case (190). For example, the heat dissipation member (140) may be placed so as to be located on the lower side (-Z side) of the user interface (160).

[0103] For example, the heat dissipation member (140) may include a heat absorbing portion (141) that absorbs heat from the printed circuit board (120), and a heat dissipating portion (142) that receives the heat absorbed by the heat absorbing portion (141) and dissipates it to the outside. For example, the heat dissipating portion (142) may be formed to protrude from the heat absorbing portion (141). For example, the heat absorbing portion (141) and the heat dissipating portion (142) may be formed integrally.

[0104] The heat dissipation member (140) may be arranged so that the heat absorption portion (141) faces the printed circuit board (120). When the heat absorption portion (141) faces the printed circuit board (120), the heat dissipation portion (142) may be positioned on the opposite side of the printed circuit board (120) with respect to the heat absorption portion (141).

[0105] For example, the heat absorbing portion (141) may include a heat absorbing block (141) that absorbs heat from the printed circuit board (120) and extends in the front-back direction (+-X direction). For example, the heat absorbing block (141) may be arranged to be in contact with the printed circuit board (120).

[0106] For example, the heat dissipation unit (142) may be a heat dissipation fin (142) protruding from the side of the heat absorption block (141). The heat dissipation fin (142) may include a plurality of heat dissipation fins (142) protruding from the heat absorption block (141) and arranged in a vertical direction. The plurality of heat dissipation fins (142) may receive heat absorbed by the heat absorption block (141) and release the same to the outside.

[0107] For example, a plurality of heat dissipation fins (142) can extend in the front-back direction along the heat absorption block (141).

[0108] For example, a plurality of heat sink fins (142) are guided by a guide duct (130) to provide airflow (F 41 ) can be arranged to come into contact with the heat dissipating member (140). The airflow (F) flowing through the heat dissipating member (140) 41 ) can absorb the heat emitted by multiple heat dissipation fins (142).

[0109] The plurality of heat dissipation fins (142) may include an inlet portion (144) into which airflow (F2) generated from the cooling fan (113) flows. The inlet portion (144) may be formed by spacing out each end of the plurality of heat dissipation fins (142) adjacent to the cooling fan (113). In other words, the airflow (F2) may flow into the space where the plurality of heat dissipation fins (142) are spaced apart from each other and come into contact with the plurality of heat dissipation fins (142).

[0110] A plurality of heat dissipation fins (142) are used to transfer airflow (F) introduced into the inlet (144). 41 ) may include a discharge portion (145) through which the heat dissipation fins (142) are discharged. The discharge portion (145) may be formed by having the ends of a plurality of heat dissipation fins (142) spaced apart from each other.

[0111] The heat dissipation member (140) may include a first passage (146) that connects the inlet (144) and the outlet (145). The first passage (146) may extend along a plurality of heat dissipation fins (142).

[0112] That is, the air flow (F) introduced into the inlet (144) 41 ) flows in the first euro (146) and absorbs the heat discharged by the plurality of heat dissipation fins (142) and can be discharged to the discharge part (145) (F 42 ). Through this, the heat dissipation member (140) can be cooled.

[0113] For example, the first heat dissipation fin (142a) positioned at the top of the plurality of heat dissipation fins (142) may have a shorter protrusion length from the heat absorption block (141) than the other plurality of heat dissipation fins (142) except for the first heat dissipation fin (142a). Accordingly, the heat dissipation member (140) may include a spare space (143) formed by the first heat dissipation fin (142a) protruding from the heat absorption block (141) shorter than the remaining heat dissipation fins except for the first heat dissipation fin (142a).

[0114] The spare space (143) may be formed at a height corresponding to the height at which the first heat dissipation fin (142a) is positioned. The spare space (143) may be a space surrounded by one end of the first heat dissipation fin (142a) protruding from the heat absorption block (141) and the side surface of the second heat dissipation fin positioned below the first heat dissipation fin (142a). A description of the spare space (143) will be provided later.

[0115] The cover duct (150) can cover the heat dissipation member (140). For example, the cover duct (150) can cover a plurality of heat dissipation fins (142). The first flow path (146) can be covered by the cover duct (150) and partitioned from the module receiving portion (192) of the module case (190). Therefore, the airflow (F) flowing in the first flow path (146) 41 ) can flow stably without leaking out.

[0116] The cover duct (150) may include a cover duct body (151) that extends in the front-back direction and forms an outer shape, and a lead portion (152) that is arranged at the front of the cover duct body (151). A cover duct passage (153) may be formed inside (153) of the cover duct body. The cover duct passage (153) may extend in the longitudinal direction of the cover duct body (151). The cover duct passage (153) may refer to an inner hollow space of the cover duct (150).

[0117] The cover duct (150) may include a duct inlet (155) formed at one end of the cover duct body (151) facing the cooling fan (113) and communicating with one end of the cover duct passage (153), and a duct outlet (154) formed at one end of the lower side of the lead portion (152) and communicating with the other end of the cover duct passage (153).

[0118] The duct inlet (155) and the duct outlet (154) can be formed to communicate with the cover duct flow path (153).

[0119] For example, the cover duct (150) may include a cut portion (156) formed by cutting one side of the cover duct body (151). The cut portion (156) may be formed by penetrating one side of the cover duct body (151) to connect the cover duct path (153) with the outside.

[0120] As will be described later, when the heat dissipation member (140) is covered by the cover duct (150), the spare space (143) and the cutout (156) can be connected to each other. Since the spare space (143) is arranged on one end side of the first heat dissipation fin (142a) that protrudes away from the heat absorption block (141) toward the printed circuit board (120), the cutout (156) can also be positioned on the opposite side of the printed circuit board (120) with respect to the heat dissipation member (140).

[0121] When the cover duct (150) covers the heat dissipation member (140), a plurality of heat dissipation fins (142) can be arranged so that the spare space (143) is in communication with the cutout (156). In other words, the cutout (156) can be mounted on the module case (190) so as to face the opposite side of the printed circuit board (120) and cover the heat dissipation member (140).

[0122] When the heat dissipation member (140) is placed in the flow path forming part (194), the cover duct (150) can be placed in the flow path forming part (194) while covering the heat dissipation member (140). The cover duct (150) can be mounted on the module case (190).

[0123] The cover duct (150) can cover the heat dissipation member (140) by being arranged so that the heat dissipation member (140) is accommodated in the cover duct passage (153). When the cover duct (150) accommodates the heat dissipation member (140), the duct inlet (155) of the cover duct (150) can be communicated with the inlet (144) of the heat dissipation member (140), and the duct outlet (154) of the cover duct (150) can be communicated with the outlet (145) of the heat dissipation member (140).

[0124] The airflow (F2) generated from the cooling fan (113) can flow into the duct inlet (155) and into the inlet (144) of the heat dissipation member (140). Thereafter, the airflow (F) flows in the first flow path (146) and exchanges heat with a plurality of cooling fins. 41 ) is discharged to the discharge port (145) and can then be discharged to the outside of the cover duct (150) through the cover duct (150) discharge port (F 42 ).

[0125] The airflow discharged to the outside of the cover duct (150) can be introduced into the lower case hole (23) of the case (20) described above and ultimately discharged to the external space (S).

[0126] The user interface (160) may include a panel portion (161) including an input portion (161) and an output portion (161), an electrical portion (162) configured to be electrically connected to the panel portion (161) to process a user input signal input to the panel portion (161) and display information on the panel portion (161), and a support portion (163) that supports the panel portion (161).

[0127] For example, the user interface (160) may be arranged so that the left-right positions correspond to the printed circuit board (120) with respect to the module case (190). In other words, the user interface (160) and the printed circuit board (120) correspond in left-right positions (+-Y direction), and the heat dissipation member (140) and the cover duct (150) may be arranged on the side of the user interface (160).

[0128] For example, the support member (163) can be coupled to the module case (190) to support the panel member (161). The panel member (161) and the electric part (162) can be spaced apart from each other.

[0129] For example, a support member (163) may be placed between the panel member (161) and the front member (162). For example, the support member (163) and the front member (162) may be placed spaced apart from each other.

[0130] The panel portion (161) and the support portion (163) may be positioned above the heat dissipation member (140). The electric part (162) may be positioned at a position corresponding to the upper position of the heat dissipation member (140).

[0131] For example, the panel portion (161) may be arranged on the lower surface (12) of the plate. For example, the panel portion (161) may be configured so that a user can input an input signal through the upper surface (11) of the plate. For example, the panel portion (161) may be configured so that a user can check information displayed on the panel portion (161) through the upper surface (11) of the plate.

[0132] In the process of the electric part (162) receiving an input signal input to the panel part (161) and displaying information of the induction heating cooker (1) on the panel part (161), heat may be generated in the electric part (162).

[0133] The induction heating cooker (1) is a part of the airflow (F) generated from the cooling fan (113) 31 ) may include a branch guide (180) to guide the user interface (160).

[0134] The branch guide (180) may include an extension (181) extending in the forward and backward direction (+-X direction).

[0135] The extension portion (181) may be positioned so that one end faces the cooling fan (113). The branch guide (180) may include a curved portion (183) extending from the other end of the extension portion (181) and curved into the interior of the user interface (160).

[0136] The branch guide (180) can be placed in the spare space (143). More specifically, the extension (181) can be inserted into the cutout (156) of the cover duct (150) and positioned in the spare space (143).

[0137] For example, the branch guide (180) may be inserted into the cut portion (156) and positioned to come into contact with the cover duct (150). The branch guide (180) and the cover duct (150) may be formed to be separable, but this is merely an example, and it is also conceivable that the branch guide (180) and the cover duct (150) are formed integrally.

[0138] When the branch guide (180) is placed in the spare space (143), the branch guide (180) can be placed apart from a plurality of heat dissipation fins (142).

[0139] More specifically, the extension (181) can be positioned so as not to come into contact with the plurality of heat dissipation fins (142). Accordingly, the phenomenon of heat discharged from the plurality of heat dissipation fins being transferred to the extension (181) can be minimized.

[0140] For example, the branch guide (180) may include an insulating material. Therefore, even if heat is discharged from a plurality of heat dissipation fins, the airflow (F) flowing in the branch guide (180) 31, F 32 ) may not be heated.

[0141] The extension portion (181) may extend along the longitudinal direction (+-X direction) of the first heat dissipation fin (142a). The extension portion (181) may include an extension path (182) formed on the inside through which airflow may flow. The extension path (182) may extend along the longitudinal direction of the extension portion (181). The extension path (182) may be formed to be separated from the first path (146).

[0142] The extension path (182) may include an extension path inlet (182a) formed at one end of the extension path (182) adjacent to the cooling fan (113), and an extension path outlet (182b) formed at the other end of the extension path.

[0143] The extension duct inlet (182a) may be placed adjacent to the duct inlet (155) of the cover duct (150) and the inlet (144) of the heat dissipation member (140). A portion of the airflow (F) generated from the cooling fan (113) 41 ) flows to the inlet (144) of the heat dissipation member (140), another part of the airflow (F 31 ) can be introduced into the inlet of the extension path (182). Therefore, another part (F) of the airflow of the cooling fan (113) 31 ) can be introduced into the extension section (181) and flow on the extension path (182).

[0144] The curved part (183) is formed on the inside to form an airflow (F 32) may include a curved path (184) through which the flow can occur. The curved path (184) may extend from the other end of the extension path (182) into the interior of the user interface (160). The curved path (184) may be formed to be curved. The curved path (184) may be formed to be separated from the first path (146).

[0145] The curved path (184) may include a curved path inlet (184a) formed at one end of the curved path (184) and connected to an extension path outlet (182b), and a curved path outlet (184b) formed at the other end of the curved path (184) and communicating with the interior of the user interface (160).

[0146] Since the extension (181) is placed in the cut portion (156), and the cut portion (156) is located on the opposite side of the printed circuit board (120) with respect to the heat dissipation member (140), the extension (181) can also be placed on the opposite side of the printed circuit board (120) with respect to the heat dissipation member (140).

[0147] Since the user interface (160) is positioned so that the left and right positions of the printed circuit board (120) correspond to the module case (190), the extension (181) can be positioned on the opposite side of the user interface (160) with respect to the heat dissipation member (140).

[0148] For example, since the curved portion (183) is curved from the other end of the extension portion (181) to the user interface (160), the curved portion (183) can be formed to extend from the extension portion (181) and surround the heat dissipation member (140).

[0149] More specifically, the curved portion (183) may be formed to surround the first heat dissipation fin (142a) and the heat absorption block (141). In other words, the curved portion (183) may extend to the user interface (160) while covering the front of the first heat dissipation fin (142a) and the heat absorption block (141).

[0150] As will be described later, the air current generated from the cooling fan (113) can flow into the interior of the user interface (160) through the extension path (182) and the curved path (184), and can absorb the heat generated in the electric part (162) to cool the user interface (160). A detailed description of the process of the air current flowing into the interior of the user interface (160) will be described later.

[0151] The user interface (160) is an airflow (F) introduced into the interior of the user interface (160). 32 ) may include an outlet (164) from which the discharged fluid is discharged (F 33 ) In the city, the outlet (164) is shown as being formed in front of the user interface (160), but this is only an example, and the outlet (164) can be formed in various locations to discharge the airflow inside the user interface (160).

[0152] For example, the outlet (164) can be connected to the front case hole (22) of the case (20). Therefore, the air current that has absorbed the heat of the electric part (162) can be discharged to the outlet (164) and pass through the front case hole (22) (F 33 ), which can ultimately be discharged into the external space (S).

[0153] Fig. 7 is a front view enlarged view of a portion of the main module of Fig. 3. Fig. 8 is a cross-sectional view of the main module of Fig. 7 taken along the a-a' cutting line.

[0154] Referring to FIGS. 7 and 8, as previously discussed, the extension section (181) and the curve section (183) can be connected. The extension path (182) and the curve path (184) can be connected.

[0155] The flow path formed by connecting the extension flow path (182) and the curve flow path (184) may be referred to as a second flow path (182, 184). A portion of the airflow generated from the cooling fan (113) (F 31 , F 32) can float in the second euro (182, 184).

[0156] The curved portion (183) is positioned on the upper side of the discharge portion (145) so that the discharge portion (145) is exposed, and can be curved from the extension portion (181) into the interior of the user interface (160). The curved outlet (184b) can be communicated with the interior of the user interface (160).

[0157] By arranging the above-mentioned curved portion (183), the curved portion (183) may not obstruct the flow of air discharged from the discharge portion (145) of the heat dissipating member (140), so that cooling of the heat dissipating member (140) may be performed more smoothly.

[0158] The second euro (182, 184) can direct a portion of the airflow generated from the cooling fan (113) into the interior of the user interface (160). For example, the interior of the user interface (160) may refer to the space between the electric part (162) and the panel part (161).

[0159] The second euro (182, 184) may be positioned higher than the first euro (146). The second euro (182, 184) may be separated from the first euro (146). For example, the height at which the second euro (182, 184) is positioned may correspond to the height at which the first heat dissipation fin (142a) is positioned.

[0160] The airflow generated from the cooling fan (113) can flow into the interior of the user interface (160) through the second yuan (182, 184) (F 32 ) Airflow (F) flowing inside the user interface (160) 32 ) can absorb heat generated in the front part (162). Therefore, the user interface (160) can be cooled.

[0161] The heat generated and the heat-exchanged air current in the user interface (160) can be discharged to the outside of the user interface (160) through the outlet (164) (F 33) Afterwards, it flows into the front case hole (22) of the case (20) and can finally be discharged into the external space (S).

[0162] Another portion of the airflow generated from the cooling fan (113) may flow on the first flow path (146) formed by a plurality of heat dissipation fins (142) spaced vertically apart.

[0163] Air current flowing in the first euro (146) (F 41 ) absorbs the heat emitted from a plurality of heat dissipation fins (142) and can be discharged to the outside of the heat dissipation member (140) through the discharge portion (145) (F 42 ) Thereafter, the discharged airflow is guided downward by the lead portion (152) of the cover duct (150) and can be discharged to the external space (S) through the duct discharge port (154) and the lower case hole (23).

[0164] FIG. 9 is a cross-sectional view of a portion of a main module cut along line a-a' in an induction heating cooker according to one embodiment. Descriptions of any content overlapping with the above will be omitted below.

[0165] Referring to Fig. 9, for example, the induction heating cooker (2) can be arranged to be operable even when the cover duct does not cover the heat dissipation member (340). In the above case, the branch guide (380) can be placed in the spare space (343) without contacting the cover duct to form the second flow path (382, 384).

[0166] More specifically, the branch guide (380) may be spaced apart from the plurality of heat dissipation fins (342) and placed in the spare space (343). For example, the branch guide (380) may be positioned on the spare space (343) with each end supported by a module case (390).

[0167] The spare space (343) can be positioned at a height corresponding to the first heat dissipation fin (342a), since the first heat dissipation fin (342a) is formed by protruding shorter from the heat absorption block (341) than the heat dissipation fins other than the first heat dissipation fin (342a). That is, it can be positioned higher than the heat dissipation fins other than the first heat dissipation fin (342a).

[0168] Accordingly, even if the branch guide (380) is positioned in the spare space (343) and the curved portion (383) of the branch guide (380) is curved and extended to the user interface (360), the discharge portion (345) formed by the plurality of heat dissipation fins (342) spaced apart may not be covered by the curved portion (383). That is, the airflow flowing in the first flow path (346) can be smoothly discharged to the discharge portion (345).

[0169] Fig. 10 is a front view enlarged view of a portion of the main module of an induction heating cooker according to one embodiment. Fig. 11 is a cross-sectional view of the main module of Fig. 10 taken along the a-a' section line. Any description of any content that overlaps with the above will be omitted.

[0170] Referring to FIGS. 40 and 44, the heat dissipation member (440) may include a plurality of heat dissipation fins (442). The plurality of heat dissipation fins (442) may be formed to protrude from the heat absorption block (444) by the same length. The plurality of heat dissipation fins (442) may be arranged to be spaced apart from each other in the vertical direction on the heat absorption block (444).

[0171] The induction heating cooker (3) may include a cover duct (450) that covers a heat dissipation member (440). The cover duct (450) may cover a plurality of heat dissipation fins (442) so that the plurality of heat dissipation fins (442) are blocked from the module receiving portion (492) of the module case (490). For example, each end of the plurality of heat dissipation fins (442) protruding from the heat absorption block (444) may be arranged to be in contact with one surface of the cover duct (450).

[0172] The induction heating cooker (3) may include a branch guide (480) that guides the airflow generated from the cooling fan (413) to the user interface (460).

[0173] The branch guide (480) may include an extension portion (484) that is secured to the upper surface (451) of the cover duct (450) and extends in the forward-backward direction, and a cover portion that is curved to connect the interior of the user interface (460) from one end of the extension portion (484) facing forward.

[0174] For example, when the branch guide (480) is positioned on the upper surface of the cover duct (450), the height at which the second flow path (482, 484) formed by the branch guide (480) is located may correspond to the height of the internal space of the user interface (460).

[0175] The second flow path (482, 484) formed by the branch guide (480) can be positioned higher than the first flow path (446) formed by a plurality of heat dissipation fins (442) spaced apart from each other.

[0176] Accordingly, even if the curved path (484) of the curved portion (483) forming part of the second path (482, 484) is curved into the interior of the user interface (460), it may not cover the exhaust portion (445) formed by one end of the plurality of heat dissipation fins (442). Therefore, the airflow flowing in the first path (446) can be smoothly discharged to the exhaust portion (445).

[0177] An induction heating cooker (1) according to one embodiment includes a plate (10) on which a cooking vessel is to be placed, a heating device (170) configured to heat the cooking vessel by receiving a driving current from a printed circuit board (120), and a user interface (160) configured to receive a user input for operating the heating device (170). The induction heating cooker (1) includes a heat dissipation member (140) arranged below the user interface (160) and provided to be capable of heat exchange with the printed circuit board (120), and a cooling fan (113) provided to generate an airflow for cooling the heat dissipation member (140). The above induction heating cooker (1) includes a branch guide (180) for guiding a portion of the airflow generated by the cooling fan (113) to the user interface (160), and includes a first flow path (146) through which air flows for cooling the heat dissipation member (140) and a second flow path (182, 184) disposed above the first flow path (146).

[0178] The above heat dissipation member (140) may include a heat absorption block (141) that absorbs heat from the printed circuit board (120) and a plurality of heat dissipation fins (142) that protrude from the side of the heat absorption block (141) and are arranged in the vertical direction, release the heat absorbed by the heat absorption block (141), and are arranged to come into contact with the airflow generated by the cooling fan (113). The second flow path (182, 184) may be arranged at a height corresponding to the height at which the first heat dissipation fin (142a) located at the uppermost end among the plurality of heat dissipation fins (142) is arranged.

[0179] The plurality of heat dissipation fins (142) may include an inlet (144) into which airflow generated from the cooling fan (113) flows in, and each end of the plurality of heat dissipation fins (142) adjacent to the cooling fan (113) may be spaced apart from each other to form an inlet. The plurality of heat dissipation fins (142) may include an outlet (145) into which the introduced airflow flows out, and each end of the plurality of heat dissipation fins (142) may be spaced apart from each other to form an outlet. The first flow path (146) may be formed to communicate the inlet (144) and the outlet (145).

[0180] The branch guide (180) may include an extension portion (181) extending along the length of the first heat dissipation fin (142a) and a curved portion (183) formed to surround the first heat dissipation fin (142a) and the heat absorption block (141), and disposed above the discharge portion (145) so that the discharge portion (145) is exposed, and curved from the extension portion (181) to the inside of the user interface (160).

[0181] The above heat dissipation member (140) includes a spare space (143) formed by the first heat dissipation fin (142a) protruding shorter from the heat absorption block (141) than the remaining heat dissipation fins excluding the first heat dissipation fin (142a), and the branch guide (180) can be placed in the spare space (143).

[0182] When the branch guide (180) is placed in the spare space (143), the branch guide (180) can be placed apart from the plurality of heat dissipation fins (142).

[0183] The above induction heating cooker (1) may further include a case (20) covered by the plate (10) and accommodating the cooling fan (113), the branch guide (180), and the user interface (160). The user interface (160) may include an outlet (164) through which airflow introduced into the interior of the user interface (160) is discharged. The case (20) may include a case hole that connects the outlet (164) and the exterior to discharge the airflow discharged from the user interface (160) to the exterior.

[0184] The hole of the above case (20) can be formed to communicate with the outside and the discharge portion (145) of the heat dissipation member (140).

[0185] The above branch guide (180) may include an insulating material.

[0186] The above induction heating cooker (1) may further include a cover duct (150) that covers the heat dissipation member (140) to guide another portion of the airflow generated from the cooling fan (113) to the heat dissipation member (140). The cover duct (150) and the branch guide (180) may be arranged to be in contact with each other.

[0187] The above cover duct (150) may include a cut portion (156) formed to communicate with the spare space (143). The branch guide (180) may be inserted into the cut portion (156) and placed in the spare space (143).

[0188] The above cover duct (150) and the above branch guide (180) can be formed integrally.

[0189] The above induction heating cooker (3) may further include a cover duct (350) that covers the heat dissipation member (340) to guide another portion of the airflow generated from the cooling fan (313) to the heat dissipation member (140). The branch guide (380) may be arranged to be seated on the upper surface of the cover duct (350).

[0190] The above induction heating cooker (1) may further include a case (20) covered by the plate (10) and accommodating the cooling fan (113), the branch guide (180), and the user interface (160). The cover duct (150) may further include a lead portion (152) that guides the airflow discharged from the discharge portion (145) to the lower surface of the case (20). The case (20) may include a case hole that connects the lead portion (152) with the outside so as to discharge the airflow discharged from the discharge portion (145) to the outside.

[0191] The above branch guide (180) may include an insulating material.

[0192] An induction heating cooker (1) according to one embodiment includes a plate (10) for placing a cooking vessel on, a heating device (170) configured to heat the cooking vessel by receiving a driving current from a printed circuit board (120), a user interface (160) electrically connected to the printed circuit board (120) and receiving a user input for operating the heating device (170), a heat dissipation member (140) disposed below the user interface (160) and including a heat absorbing member (141) for absorbing heat generated from the printed circuit board (120) and a heat generating member for dissipating the absorbed heat of the printed circuit board (120), and a cooling fan (113) provided to generate an airflow for cooling the heat dissipation member (140). The induction heating cooker (1) includes a branch guide (180) for guiding a portion of the airflow generated by the cooling fan (113) to the user interface (160). The above-described heat generating unit includes an inlet (144) into which another portion of the airflow generated from the cooling fan (113) is introduced, an outlet (145) into which the introduced airflow is discharged, and a first flow path (146) connecting the inlet (144) and the outlet (145). The branch guide (180) includes an extension (181) extending along the first flow path (146), and a curved portion (183) that is curved from one end of the extension (181) adjacent to the outlet (145) into the interior of the user interface (160) and is disposed on the upper side of the outlet (145).

[0193] The heat absorption portion (141) may include a heat absorption block (141) extending along the longitudinal direction of the first flow path (146). The heat generating portion may include a plurality of heat dissipation fins (142) that protrude from the side of the heat absorption block (141) and are arranged in the vertical direction, and are arranged to contact the airflow generated from the cooling fan (113). The extension portion (181) and the curved portion (183) form a second flow path (182, 184) that is partitioned from the first flow path (146), and may be arranged at a height corresponding to a height at which a first heat dissipation fin (142a) located at the uppermost end among the plurality of heat dissipation fins (142) is arranged.

[0194] The above heat dissipation member (140) includes a spare space (143) formed by the first heat dissipation fin (142a) protruding shorter from the heat absorption block (141) than the remaining heat dissipation fins excluding the first heat dissipation fin (142a), and the branch guide (180) can be placed in the spare space (143).

[0195] The above induction heating cooker (1) further includes a cover duct (150) that covers the heat dissipation member (140) so as to guide another portion of the airflow generated from the cooling fan (113) to the heat dissipation member (140), and the cover duct (150) and the branch guide (180) can be arranged to be in contact with each other.

[0196] An induction heating cooker (1) according to one embodiment includes a plate (10) for placing a cooking vessel on, a heating device (170) configured to heat the cooking vessel by receiving a driving current from a printed circuit board (120), a user interface (160) for receiving a user input for operating the heating device (170), a heat dissipation member (140) disposed below the user interface (160) and provided to absorb and dissipate heat generated from the printed circuit board (120), the heat dissipation member (140) including an inlet (144) into which air current that receives heat emitted from the printed circuit board (120) is introduced and an outlet (145) through which the air current is discharged, and a cooling fan (113) for generating an air current that cools the user interface (160) and the heat dissipation member (140). The above induction heating cooker (1) includes a first duct (150) that covers the heat dissipation member (140) to guide a portion of the airflow generated from the cooling fan (113) to the heat dissipation member (140), and a second duct (180) that guides another portion of the airflow generated from the cooling fan (113) to the user interface (160), and is arranged between the discharge portion (145) and the user interface (160), and is distinct from the first duct (150).

[0197] The above illustrates and describes specific embodiments. However, the invention is not limited to the above-described embodiments, and those skilled in the art will readily appreciate that various modifications and implementations can be made without departing from the spirit and scope of the invention as set forth in the claims below.

Claims

1. A plate for the cooking vessel to be placed on; A heating device configured to heat the cooking vessel by receiving driving current from a printed circuit board; A user interface for receiving user input to operate the heating device; A heat dissipation member arranged on the lower side of the user interface and provided to exchange heat with the printed circuit board; A cooling fan provided to generate airflow to cool the above heat dissipation member; and An induction heating cooker comprising a branch guide for guiding a portion of the airflow generated by the cooling fan to the user interface, the branch guide including a first flow path through which air flows for cooling the heat dissipating member and a second flow path disposed above the first flow path; 2. In paragraph 1, The above heat dissipation member is, A heat absorbing block that absorbs heat from the printed circuit board; and A plurality of heat dissipation fins protruding from the side of the heat absorption block and arranged in the vertical direction, and provided to release heat absorbed by the heat absorption block and contact the airflow generated from the cooling fan; An induction heating cooker in which the second fin is positioned at a height corresponding to the height at which the first fin, which is located at the top of the plurality of radiating fins, is positioned.

3. In paragraph 2, The above plurality of heat dissipation fins are, An inlet into which airflow generated from the cooling fan flows in, the inlet formed by each end of the plurality of heat dissipation fins adjacent to the cooling fan being spaced apart from each other, As an exhaust port through which the introduced airflow is exhausted, the exhaust port is formed by the ends of the plurality of heat dissipation fins being spaced apart from each other, An induction heating cooker in which the first euro is formed to connect the inlet and the outlet.

4. In paragraph 3, The above branch guide is, An extension extending along the longitudinal direction of the first heat dissipation fin and An induction heating cooker comprising a curved portion formed to surround the first heat dissipation fin and the heat absorption block, positioned above the discharge portion so that the discharge portion is exposed, and curved from the extension portion into the interior of the user interface.

5. In paragraph 3, The above heat dissipation member includes a spare space formed by the first heat dissipation fin protruding shorter from the heat absorption block than the remaining heat dissipation fins excluding the first heat dissipation fin, The above branch guide is an induction heating cooker placed in the above spare space.

6. In paragraph 5, An induction heating cooker in which the branch guide is arranged in the spare space, and the branch guide is arranged spaced apart from the plurality of heat dissipation fins.

7. In paragraph 3, A case covered by the above plate and accommodating the cooling fan, the branch guide and the user interface; The above user interface includes an outlet through which airflow introduced into the interior of the above user interface is discharged, An induction heating cooker, wherein the case includes a case hole that connects the outlet and the outside to discharge airflow discharged from the user interface to the outside.

8. In paragraph 7, An induction heating cooker in which the case hole is formed to communicate the discharge portion of the heat dissipation member with the outside.

9. In paragraph 2, The above branch guide is an induction heating cooker including an insulating material.

10. In paragraph 5, Further comprising a cover duct covering the heat dissipation member to guide another portion of the airflow generated from the cooling fan to the heat dissipation member; An induction heating cooker in which the above cover duct and the above branch guide are arranged to be in contact with each other.

11. In paragraph 10, The above cover duct includes a cutout formed to communicate with the spare space, An induction heating cooker in which the above branch guide is inserted into the above cut portion and placed in the above spare space.

12. In paragraph 11, An induction heating cooker in which the cover duct and the branch guide are formed integrally.

13. In paragraph 1, Further comprising a cover duct covering the heat dissipation member to guide another portion of the airflow generated from the cooling fan to the heat dissipation member; An induction heating cooker wherein the above branch guide is positioned to be seated on the upper surface of the above cover duct.

14. In paragraph 10, A case covered by the above plate and accommodating the cooling fan, the branch guide and the user interface; The above cover duct further includes a lead portion that guides the airflow discharged from the discharge portion to the lower surface of the case, An induction heating cooker, wherein the case includes a case hole that connects the lid portion with the outside to discharge airflow discharged from the discharge portion to the outside.

15. In paragraph 10 or 13, The above branch guide is an induction heating cooker including an insulating material.

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