Temperature control device

Abstract

Provided is a temperature control device that is capable of properly adjusting the temperature of each one of a plurality of test objects, and allows the plurality of test objects to be simultaneously tested for a plurality of temperature settings using a test device having a simple structure. A temperature control device 1 of the present invention controls the temperature of a plurality of test objects 9 and performs an evaluation test thereon. The temperature control device 1 includes a holder 8 for storing the plurality of test objects 9, and a heat exchange plate 2 through which a temperature-controlled heat medium circulates. The temperature of the heat medium flowing into the heat exchange plate 2 is controlled to a predetermined temperature by changing the ratio of the heat medium from a high-temperature-side heat medium tank 5a and the heat medium from a low-temperature-side heat medium tank 5b.

Description

Temperature Control Device

[0001] The present invention relates to a temperature control device that is provided in a testing device that requires temperature control of a test object.

[0002] Conventionally, in tests in which the temperature of a test object is controlled, a temperature control device is known that controls the temperature of the test object via a heat exchange plate through which a heat medium whose temperature is controlled in a heat medium tank circulates (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2022-178211

[0004] In conventional temperature control devices of this type, when simultaneously testing test objects set to multiple temperatures using a heat transfer medium, it was necessary to prepare a heat transfer medium tank in which the heat transfer medium was regulated to the set temperature for each temperature setting.

[0005] However, installing as many heat transfer medium tanks as there are set temperatures has the disadvantages of increasing the power consumption required to maintain and change the temperature of the heat transfer medium, raising the environmental temperature of the test room, and increasing the installation costs.

[0006] In view of the above-mentioned disadvantages, an object of the present invention is to provide a temperature control device that can efficiently control the temperature of a test object to a plurality of temperature settings.

[0007] In order to achieve this object, the present invention provides a temperature control device that controls the temperature of a test object to a plurality of set temperatures, comprising a plurality of holders that store the test object, a plurality of heat exchange plates through which a temperature-controlled heat medium circulates, a high-temperature heat medium tank that supplies a heat medium that is higher than the set temperature to the heat exchange plates, and a low-temperature heat medium tank that supplies a heat medium that is lower than the set temperature to the heat exchange plates, wherein the heat medium flowing into each of the plurality of heat exchange plates is controlled to a plurality of different set temperatures by changing the mixing ratio of the heat medium in the high-temperature heat medium tank and the heat medium in the low-temperature heat medium tank, and the holders are detachably attached to the heat exchange plates, and the temperature of the test object stored in the holders is controlled to the different set temperatures by heat from each heat exchange plate.

[0008] According to the present invention, simply by providing the high-temperature-side heat medium tank and the low-temperature-side heat medium tank, the temperatures of the heat exchange plates can be efficiently controlled to the different set temperatures.

[0009] Furthermore, the present invention is characterized in that each of the plurality of heat exchange plates is connected in parallel to the high-temperature side heat medium tank and the low-temperature side heat medium tank, and the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank supplied to the heat exchange plate is changed so that the heat exchange plate can be set to a plurality of temperatures ranging from a high set temperature to a lower set temperature.

[0010] According to the present invention, by changing the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank, each of the plurality of heat exchange plates can be efficiently set to a plurality of different set temperatures, ranging from a high set temperature to a lower set temperature.

[0011] Furthermore, the present invention is characterized in that the high-temperature heat medium tank is connected in parallel to each of the plurality of heat exchange plates, a flow path from the low-temperature heat medium tank is further connected to the heat medium flow path from the high-temperature heat medium tank to the heat exchange plates, both flow paths are provided with flow control valves, and both flow control valves are controlled based on temperatures detected by temperature sensors provided on each heat exchange plate, so that the heat medium from the high-temperature heat medium tank and the heat medium from the low-temperature heat medium tank are mixed to achieve the plurality of set temperatures.

[0012] Furthermore, the present invention is characterized in that the high-temperature heat medium and the low-temperature heat medium are mixed by opening and closing the flow control valves provided in the flow paths of the high-temperature side heat medium tank and the low-temperature side heat medium tank in response to temperatures detected by temperature sensors provided on the heat exchanger plates, so that the heat exchanger plates are kept at a predetermined temperature.

[0013] According to the present invention, the temperature of each heat exchange plate can be adjusted to a plurality of set temperatures with a simple structure.

[0014] Furthermore, the present invention is characterized in that, of the heat transfer medium from the plurality of heat exchange plates set to a plurality of set temperatures ranging from a high set temperature to a lower set temperature, the heat transfer medium from the plurality of heat exchange plates set to the higher set temperature is returned to the high-temperature side heat transfer medium tank, and the heat transfer medium from the plurality of heat exchange plates set to the lower set temperature is returned to the low-temperature side heat transfer medium tank.

[0015] Furthermore, the present invention is characterized in that a return heat medium tank is provided upstream of the return flow path of the high-temperature heat medium tank, through which the heat medium from multiple heat exchange plates with a high-temperature setting is returned, and that the return flow path of the low-temperature heat medium tank is provided upstream of the return flow path of the low-temperature heat medium tank, through which the heat medium from multiple heat exchange plates with a low-temperature setting is returned.The two return heat medium tanks are connected by a pipeline, so that when there is an excess of heat medium in one return heat medium tank, the excess heat medium can flow into the other return heat medium tank.

[0016] According to the present invention, the temperatures of the high-temperature side heat medium tank and the low-temperature side heat medium tank can be efficiently controlled.

[0017] According to the present invention, the temperature control device can simultaneously control the temperatures of heat exchange plates that are set to multiple set temperatures, from a high set temperature to a lower set temperature, while reducing the number of heat medium tanks used.This reduces the cost of installing the heat medium tanks, reduces the amount of power consumed by the heat medium tanks, and prevents the environmental temperature from increasing due to heat generated by the heat medium tanks.In addition, because it is not necessary to change the set temperature of the heat medium tank every time the temperature setting of the heat exchange plate is changed, there is no need to wait for the heat medium in the heat medium tank to reach the set temperature, and the temperature setting for the test can be quickly changed.

[0018] In the above invention, the test is preferably a secondary battery charge / discharge test.

[0019] 1 is a perspective view showing a temperature control device according to an embodiment of the present invention; 2 is a perspective view showing the back side of the temperature control device according to the embodiment; 3 is an explanatory view showing the holder according to the embodiment in an exploded state; 4 is a heat medium circulation circuit diagram according to the embodiment; 5 is an explanatory diagram of a heat medium temperature control method according to the embodiment; 6 is a flow diagram of processing before the start of testing according to the embodiment; 7 is a flow diagram of temperature monitoring processing according to the embodiment; 8 is a flow diagram of temperature deviation determination processing during testing according to the embodiment; 9 is a heat medium circulation circuit diagram according to another embodiment;

[0020] A temperature control device according to an embodiment of the present invention will be described with reference to the drawings. Referring to Figures 1 and 2, a temperature control device 1 according to this embodiment is provided in a test device 100 that requires temperature control of a test object 9. A test that requires temperature control is, for example, a secondary battery charge / discharge test in which a secondary battery is used as the test object.

[0021] The test device 100 in which the temperature control device 1 of this embodiment is installed comprises a fixed plate 3 to which a heat exchange plate 2 is fixed, a frame body 4 that aligns the fixed plate 3 in the vertical direction and supports it on the front and back, and a plurality of heat medium tanks 5 that can adjust the temperature of the heat medium to a predetermined temperature and supply it to the heat exchange plate 2.

[0022] 3, the heat exchange plate 2 is provided with two parallel flow paths 7, an outward path and a return path, through which the heat medium supplied from the heat medium tank 5 flows. Two holders 8 for accommodating test objects are detachably fixed to one heat exchange plate 2, side by side, so as to straddle the two flow paths 7.

[0023] Referring to FIG. 3, the holder 8 includes a base 10 having four storage sections 10a with an arc-shaped cross section, each of which is a space capable of storing four cylindrical secondary batteries, that is, test objects 9, in a parallel arrangement, and a lid 11 having four storage sections 11a with an arc-shaped cross section, which sandwich and hold the test objects 9 between the storage sections 10a, 11a to prevent the test objects 9 from falling off the base 10.

[0024] The base 10 has four screw holes 10b through which screws 10e can be inserted, and the base 10 is detachably fastened to the female threads 2a of the heat exchange plate 2 by the screws 10e inserted into the screw holes 10b. Heat transfer sheets 12 are sandwiched between the base 10 and the test object 9, and between the lid 11 and the test object 9, to ensure efficient heat transfer with as few gaps as possible. If the test object is a secondary battery that requires temperature control as well as charging and discharging, it is advisable to provide an opening in the holder 8 for attaching an operation terminal 13 (charge and discharge terminal).

[0025] A hook 10c is provided on the side of the base 10. A snap lock 11b that can be engaged with the hook 10c is provided on the lid 11, and the lid 11 is detachably fixed to the base 10 by this snap lock 11b. The base 10 is also provided with a positioning pin 10d that protrudes toward the lid 11. The lid 11 is provided with a positioning hole 11c that can receive the positioning pin 10d.

[0026] In the testing device of this embodiment, the heat exchange plates 2 are arranged side by side in the vertical direction, so that the surfaces of the heat exchange plates 2 are aligned vertically, and the work of fixing the holder 8 to the heat exchange plate 2 or the work of fixing the fixing plate 3 to which the heat exchange plate 2 and holder 8 are fixed to the frame 4 can be done from one direction, making it easy. In addition, because the heat exchange plates 2 can be attached to the front and back of the frame 4, it is possible to effectively use the installation space and test a large number of test objects 9 with a compact device.

[0027] FIG. 4 shows the heat transfer medium circulation circuit of this embodiment. For ease of explanation, the number of heat exchange plates 2 in FIG. 4 is five, half the number of heat exchange plates 2 in FIG. 1 . In the parallel circulation circuit of this embodiment, the heat transfer medium supplied from the high-temperature heat transfer medium tank 5a is controlled by the high-temperature flow control valve block 14a, and the heat transfer medium supplied from the low-temperature heat transfer medium tank 5b is controlled by the low-temperature flow control valve block 14b, and the heat transfer medium is distributed to junctions M1 to M5. The heat transfer medium discharged from each heat exchange plate 2 passes through a check valve 15 and is returned to the return heat transfer medium tank 16, and then returned to the high-temperature heat transfer medium tank 5a and the low-temperature heat transfer medium tank 5b, where its temperature is again adjusted. The test object 9 held by the holder 8 is adjusted to a predetermined temperature by the heat transfer medium via the heat exchange plates 2.

[0028] The inflow rates of the heat medium discharged from the high-temperature side heat medium tank 5a and the heat medium discharged from the low-temperature side heat medium tank 5b, which mix at confluence points M1 to M5, are controlled by high-temperature side flow control valves A1 to A5 and low-temperature side flow control valves B1 to B5, respectively, and by controlling the ratio of the heat medium discharged from the high-temperature side heat medium tank 5a to the heat medium discharged from the low-temperature side heat medium tank 5b, it is possible to adjust the temperature to different predetermined temperatures for each heat exchange plate 2. The flow control valves are connected to the temperature control unit 6 via a flow control block 14 such as a solenoid valve and a wired or wireless communication line.

[0029] For example, when simultaneously testing the heat exchange plates 2a, 2b, 2c, 2d, and 2e while adjusting their temperatures to 10°C, 20°C, 30°C, 40°C, and 50°C, respectively, the set temperature of the heat medium in the high-temperature heat medium tank 5a is set to 50°C or higher (e.g., 60°C), and the set temperature of the heat medium in the low-temperature heat medium tank 5b is set to 10°C or lower (e.g., 0°C), and the two heat mediums are mixed to adjust the temperature of each heat exchange plate 2 to the predetermined temperature.

[0030] The method for controlling the temperature of the heat medium flowing into the heat exchanger plate 2 will be explained in more detail with reference to Figure 5. Temperature sensors T1 to T5 are provided downstream of the confluence points M1 to M5, respectively, and measure the temperature of the heat medium flowing into the heat exchanger plate 2. Although not shown, the temperature sensor T may be provided inside the heat exchanger plate 2 or downstream of the heat exchanger plate 2 as long as it is downstream of the confluence point M. The measured temperature of the heat medium is sent to the temperature control unit 6 connected to the temperature sensors via a wired or wireless communication line, and temperature monitoring processing is performed.

[0031] The processing before the start of the test will be explained using the flow diagram in Figure 6A. After the user sets the set temperature, the temperature control device 6 acquires the set temperature (STEP 1) and opens the high-temperature side flow control valve A and the low-temperature side flow control valve B at a predetermined ratio set in advance according to the set temperature (STEP 2). Thereafter, a temperature monitoring process (STEP 3) is performed, and if the temperature monitoring process result is positive (STEP 4...YES), a test start command is sent to the test control device (not shown), and the test begins (STEP 5). If the temperature monitoring process result is negative (STEP 4...NO), the temperature monitoring process is repeated.

[0032] Details of the temperature monitoring process (STEP 3) will be explained using the flow diagram in Figure 6B. The temperature control device 6 acquires the temperature of the heat medium (hereinafter sometimes referred to as the sensor temperature) measured by the temperature sensor T (STEP 31), and determines whether the set temperature and the sensor temperature are the same or within a predetermined range (STEP 32). If the set temperature and the sensor temperature are the same or within the predetermined range, it recognizes that the heat medium temperature is appropriate (STEP 33), maintains the heat medium flow rate setting as is, terminates the temperature monitoring process, and proceeds to STEP 5. If the sensor temperature is lower than the set temperature, the temperature control unit 6 opens the high-temperature side flow control valve A at a predetermined rate (n １ %), and the low-temperature side flow control valve B is opened at a predetermined rate (n ２ %) to close (STEP 321). １After a lapse of 10 seconds (STEP 322), the process from STEP 31 onwards is repeated. If the sensor temperature is higher than the set temperature, the temperature control unit 6 opens the high temperature side flow control valve A at a predetermined rate (N １ %), and the low-temperature side flow control valve B is closed at a predetermined rate (N ２ %) release instruction (STEP 323). ２ After the elapse of n seconds (STEP 324), the process from STEP 31 onwards is carried out again. The opening / closing rate of each control valve according to the difference between the set temperature and the sensor temperature (n １ %, n ２ %, N １ %, N ２ %) is controlled by, for example, a PI control method or a PID control method. １ Seconds and S ２ The number of seconds may be the same or different, and may be a fixed, predetermined time or may be changed depending on the set temperature. By repeating these processes, the test can be started after the temperature control of the heat transfer medium is completed.

[0033] Also, n １ % and n ２ Sum of %, N １ % and N ２ By making the sum of the percentages 100%, the amount of heat medium flowing into the heat exchange plate 2 can be kept constant, while the temperature of the heat medium can be controlled.

[0034] The temperature deviation determination process during testing is described using the flow diagram in Figure 6C. The temperature deviation determination process (STEP 6) is performed at a preset or arbitrary timing after the start of the test. The temperature control device 6 acquires the sensor temperature (STEP 61) and determines whether the set temperature and the sensor temperature are the same or within a predetermined range (STEP 62). If the set temperature and the sensor temperature are the same or within the predetermined range (YES in STEP 62), the heat transfer medium temperature is recognized as appropriate (STEP 63) and the process from STEP 61 onward is repeated. If the set temperature and the sensor temperature are different or outside the predetermined range (NO in STEP 62), the heat transfer medium temperature is recognized as abnormal. By accumulating the process results and the sensor temperature during the process, it is possible to determine whether a temperature deviation occurred during the test. Alternatively, the test may be terminated if an abnormality is detected in any of the steps described in Figures 6A-6C. Examples of abnormalities include the inability to obtain sensor temperature, the recognition that the temperature of the heat medium is abnormal, or the recognition that the temperature of the heat exchange plate 2 is abnormal due to a drop in the water level (flow rate) caused by an abnormality in the chiller.

[0035] Referring to FIG. 7 , a description of components with the same reference numerals will be omitted, and another embodiment will be described. By operating the return heat medium control valves C1 to C5, it is possible to select whether the heat medium returning from the heat exchange plate 2 is returned to the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b. The return heat medium control valves C1 to C5 can be operated by the user or by the return heat medium control unit 17, which is connected to the return heat medium control valves C1 to C5 via a wired or wireless communication line via the flow control valve block 14c. The return heat medium control unit 17 determines which of the set temperatures of the high-temperature return heat medium tank 5a or the low-temperature return heat medium tank 5b the temperatures measured by the temperature sensors T1 to T5 are closest to, and controls the return heat medium control valves C1 to C5 so that the heat medium is returned to either the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b. This configuration reduces the power consumption required to return the heat medium returning to the heat medium tank 5 to the set temperature.

[0036] The flow of heat medium returning to the return heat medium tank 16 will be explained in more detail using Figure 8. The return heat medium control valves C1 to C5 are connected so that the heat medium flowing into the high-temperature return heat medium tank 16a is returned to the high-temperature return heat medium tank 5a, and the heat medium flowing into the low-temperature return heat medium tank 16b is returned to the low-temperature return heat medium tank 5b. If the heat medium flows unevenly into either the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b, the high-temperature return heat medium tank 16a and the low-temperature return heat medium tank 16b are connected by an overflow prevention pipe 18 to prevent the heat medium from flowing back into the heat exchange plate 2. When the volume of heat medium contained in either the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b exceeds a certain level, the heat medium flows into the other return heat medium tank. The overflow prevention pipe 18 prevents the heat medium from overflowing from the return heat medium tank 16 while limiting the capacity of each return heat medium tank. The temperature control unit 6 and the return heat medium control unit 17 are so-called processors that are composed of an arithmetic processing device such as a CPU (Central Processing Unit), a memory, and an I / O (Input / Output) device, and may be composed of the same device or different devices.

[0037] DESCRIPTION OF SYMBOLS 1...Temperature control device, 2...Heat exchange plate, 2a...Female thread portion, 3...Fixing plate, 4...Frame, 5...Heat medium tank, 5a...High temperature side heat medium tank, 5b...Low temperature side heat medium tank, 6...Temperature control unit, 7...Flow path, 8...Holder, 9...Test object, 10...Base portion, 10a...Storage portion, 10b...Screw hole, 10c...Hook, 10d...Locating pin, 10e...Screw, 11...Cover portion, 11a...Storage portion, 11b...Snap lock, 11c...Locating hole, 12...Heat transfer sheet, 13...Operation terminal, 14...Flow rate control block, 14a...High temperature side flow rate control valve block, 14b...Low temperature side flow rate control valve block, 15...Check valve, 16...Return heat medium tank, 16a...High temperature side return heat medium tank, 16b...low-temperature side return heat medium tank, 18...overflow prevention piping, 100...test equipment, T...temperature sensor, M...junction, A...high-temperature side flow control valve, B...low-temperature side flow control valve, C...return heat medium control valve

Claims

1. A temperature control device for adjusting the temperature of a test object to a plurality of set temperatures, comprising: a plurality of holders for storing the test object; a plurality of heat exchange plates through which a temperature-adjusted heat medium circulates; a high-temperature heat medium tank for supplying a heat medium having a temperature higher than the set temperature to the heat exchange plates; and a low-temperature heat medium tank for supplying a heat medium having a temperature lower than the set temperature to the heat exchange plates, wherein the heat medium flowing into each of the plurality of heat exchange plates is adjusted to a plurality of different set temperatures by changing the mixing ratio of the heat medium in the high-temperature heat medium tank and the heat medium in the low-temperature heat medium tank, and the holders are detachably attached to the heat exchange plates, and the temperature of the test object stored in the holders is adjusted to the different set temperatures by heat from each heat exchange plate.

2. A temperature testing device according to claim 1, wherein each of the plurality of heat exchange plates of the present invention is connected in parallel to the high-temperature heat medium tank and the low-temperature heat medium tank, and the mixing ratio of the heat medium from the high-temperature heat medium tank and the heat medium from the low-temperature heat medium tank supplied to the heat exchange plate is changed so that the heat exchange plate can be set to a plurality of temperatures ranging from a high set temperature to a lower set temperature.

3. A temperature control device according to claim 2, wherein the high-temperature heat medium tank is connected in parallel to each of the plurality of heat exchange plates, a flow path from the low-temperature heat medium tank is further connected to the heat medium flow path from the high-temperature heat medium tank to the heat exchange plate, flow control valves are provided on both flow paths, and both flow control valves are controlled by the temperatures of temperature sensors provided on each heat exchange plate to mix the heat medium from the high-temperature heat medium tank and the heat medium from the low-temperature heat medium tank so as to reach the plurality of set temperatures.

4. A temperature control device according to claim 2, characterized in that the flow control valve provided in the flow path of the high-temperature side heat medium tank and the flow control valve provided in the flow path of the low-temperature side heat medium tank are opened and closed in accordance with the temperature of a temperature sensor provided on the heat exchange plate, thereby mixing the high-temperature heat medium and the low-temperature heat medium, so that the heat exchange plate reaches a predetermined temperature.

5. A temperature control device as claimed in claim 1, characterized in that, of the heat transfer media from the plurality of heat exchange plates set to a plurality of set temperatures ranging from a high set temperature to a lower set temperature, the heat transfer media from the plurality of heat exchange plates set to the higher set temperature is returned to the high-temperature side heat transfer media tank, and the heat transfer media from the plurality of heat exchange plates set to the lower set temperature is returned to the low-temperature side heat transfer media tank.

6. A temperature control device as claimed in claim 5, characterized in that a return heat medium tank is provided which is connected to the upstream of the return path of the high-temperature heat medium tank, through which the heat medium from multiple heat exchange plates with a set temperature on the high-temperature side is returned, and to the upstream of the return path of the low-temperature heat medium tank, through which the heat medium from multiple heat exchange plates with a set temperature on the low-temperature side is returned, and both return heat medium tanks are connected by a pipe so that when there is an excess of heat medium in one return heat medium tank, the heat medium can flow into the other return heat medium tank.

7. A temperature control device according to any one of claims 1 to 6, wherein the test is a secondary battery charge / discharge test.

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