Switch

Abstract

The purpose of the present invention is to provide a switch which can be miniaturized and / or thinned even when a sensor and a contact switch are arranged on a straight line. The switch comprises: a substrate provided with a housing part; a plurality of fixed contacts which are arranged on the upper surface of the substrate; a movable contact which is disposed on the upper surface of the substrate and deforms by being pressed so as to cause the fixed contacts to be conductive to each other; a pressing member which is for pressing the movable contact; and a semiconductor element which is connected to the lower surface of the substrate and is disposed at a position facing the movable contact in the housing part.

Description

switch

[0001] The present invention relates to a switch.

[0002] Conventionally, switches have been known that include a sensor and a spring member that reverses in response to depression of a dome portion as a movable contact. For example, International Publication No. 2010 / 35705 discloses an input device 1 that includes a capacitance sensor 9 and a dome-shaped contact switch 10, in which the capacitance sensor 9 and the dome-shaped contact switch 10 are arranged in a straight line.

[0003] However, in the switch structure described in WO 2010 / 35705, there is a space for the switch 10 between the base substrate 8 and the support substrate 20, and there is a space S for the sensor 9 between the base substrate 8 and the light guide sheet 5, so the height of the switch structure in the depression direction is large. Therefore, it is difficult to make the switch structure smaller and thinner.

[0004] An object of the present disclosure is to provide a switch that can be made smaller or thinner even when a sensor and a contact switch are arranged in a straight line.

[0005] The switch according to the present disclosure includes a substrate having a housing portion, a plurality of fixed contacts arranged on the upper surface of the substrate, a movable contact arranged on the upper surface of the substrate and deformed when pressed to connect the plurality of fixed contacts to each other, a pressing member for pressing the movable contact, and a semiconductor element connected to the lower surface of the substrate and arranged in the housing portion in a position opposite the movable contact.

[0006] In the switch according to the present disclosure, the substrate preferably includes a first substrate and a second substrate, a plurality of fixed contacts are arranged on the upper surface of the first substrate, and the second substrate is joined to the lower surface of the first substrate and has the accommodating portion formed by a through hole.

[0007] The switch according to the present disclosure further includes a first lower surface wiring pattern disposed on the lower surface of the first substrate and connected to the semiconductor element, a first lower surface conductor surface disposed on the lower surface of the first substrate, a plurality of second upper surface conductor surfaces disposed on the upper surface of the second substrate, and a plurality of second lower surface conductor surfaces disposed on the lower surface of the second substrate, and it is preferable that the lower surface wiring pattern and a portion of the first lower surface conductor surface, a portion of the first lower surface conductor surface and a portion of the second upper surface conductor surface, and a portion of the second upper surface conductor surface and a portion of the second lower surface conductor surface are electrically connected to each other.

[0008] The switch according to the present disclosure further has a first upper conductor surface connected to a plurality of fixed contacts, and it is preferable that the first upper conductor surface and another portion of the first lower conductor surface, the other portion of the first lower conductor surface and another portion of the second upper conductor surface, and the other portion of the second upper conductor surface and another portion of the second lower conductor surface are electrically connected to each other.

[0009] It is preferable that the switch according to the present disclosure further includes a first substrate through-hole connecting the first upper conductor surface and the first lower conductor surface, and a second substrate through-hole connecting the second upper conductor surface and the second lower conductor surface.

[0010] Preferably, the switch according to the present disclosure further includes a sealing resin disposed in the through hole and sealing the first lower surface wiring pattern and the terminal of the semiconductor element connected to the first lower surface wiring pattern.

[0011] In the switch according to the present disclosure, the pressing member is preferably a magnet, and the semiconductor element is preferably a magnetic sensor that detects a change in a magnetic field caused by movement of the magnet in the pressing direction.

[0012] Preferably, the switch according to the present disclosure further includes a contact prevention portion that prevents contact between the lower surface of the magnet and the movable contact.

[0013] In the switch according to the present disclosure, a portion of the magnet is preferably located at the same position as the outer edge of the housing portion in a plan view.

[0014] According to the switch of the present disclosure, the substrate is provided with a housing portion for housing a semiconductor element, so that it is possible to provide a switch that can be made smaller and / or thinner even when the sensor and contact switch are arranged in a straight line.

[0015] 1 is a perspective view of a switch 1; 2 is an exploded perspective view of the switch 1 shown in FIG. 1; and 3 is a cross-sectional view of the switch 1 taken along line A-A' in FIG. 1. (a) is a top view of the first substrate, (b) is a bottom view of the first substrate, (c) is a top view of the second substrate, and (d) is a bottom view of the second substrate. (a) is a diagram showing the positional relationship between the first substrate and the second substrate, and (b) is a cross-sectional view taken along line B-B' in (a). (a) is a diagram showing the relationship between the stroke and the operating load in the switch 1, and (b) is a diagram showing the relationship between the stroke and the operating load in a comparative example. 4 is a perspective view of a switch 2; and 5 is an exploded perspective view of the switch 2 shown in FIG. 7; and 6 is a cross-sectional view of the switch 2 taken along line A-A' in FIG. 7. (a) is a partial perspective view of the first resin case, including a cross-section of the first resin case taken along line A-A' in FIG. 7; and (b) is a partial cross-sectional view showing the positional relationship between the first resin case and the magnet. 14A and 14B are top and bottom views of the first substrate of the switch 2, respectively. (a) is a top view showing the positional relationship between the second substrate of the switch 2 and the magnet, respectively. (b) is a cross-sectional view taken along line B-B' in (a). (b) is a perspective view of the switch 3. (c) is an exploded perspective view of the switch 3 shown in FIG. 14A. (c) is a cross-sectional view of the switch 3 taken along line A-A' in (a). (a) is a perspective view of the second resin case of the switch 3 as seen from below, respectively. (b) is a bottom view showing the positional relationship between the second resin case and the magnet shown in (a). (c) is a top view of the first substrate of the switch 3. (a) is a top view of the second substrate of the switch 3, respectively. (b) is a bottom view of the second substrate shown in (a). (c) is a perspective view of the switch 4. (c) is an exploded perspective view of the switch 4 shown in FIG. 20A. (a) is a top view of the substrate, respectively. (a) is a perspective view of a lead frame arranged in a substrate as seen obliquely from above, and (b) is a perspective view of a lead frame arranged in a substrate as seen obliquely from below. A cross-sectional view of switch 4 taken along line A-A' shown in Figure 20. (a) is a top view of switch 5, (b) is a bottom view of switch 5, and (c) is a cross-sectional view of switch 5 taken along line A-A' shown in (a). A perspective view of switch 6. A cross-sectional view of switch 6 taken along line A-A' shown in Figure 26.6A is a top view of the substrate 300 of the switch 6, and FIG. 6B is a bottom view of the substrate 300 of the switch 6. FIG.

[0016] A switch according to the present disclosure will be described below with reference to the drawings. However, please note that the technical scope of the present invention is not limited to these embodiments, but extends to the inventions set forth in the claims and their equivalents. In the following description, X-axis, Y-axis, and Z-axis directions will be used as necessary. Each direction is perpendicular to the other. The Y-axis direction corresponds to the pressing direction.

[0017] (Embodiment 1) FIG. 1 is a perspective view of a switch 1 according to embodiment 1, FIG. 2 is an exploded perspective view of the switch 1 shown in FIG. 1, and FIG. 3 is a cross-sectional view of the switch 1 taken along line AA' shown in FIG.

[0018] The switch 1 includes a first substrate 11, a second substrate 12, a magnetic sensor 14, three fixed contacts 21a, 21b, and 21f, a movable contact 30, a first sheet 40, a magnet 50, a first frame member 60, a second frame member 61, and a second sheet 70. The three fixed contacts 21a, 21b, and 21f are arranged on the top surface of the first substrate 11.

[0019] The second substrate 12 has a housing portion 13 in the center that houses the magnetic sensor 14. The housing portion 13 is formed by a through-hole that penetrates the second substrate 12. Since the height of the second substrate 12 in the Y-axis direction is higher than the height of the magnetic sensor 14, the magnetic sensor 14 is housed in the housing portion (through-hole) 13. The upper surface of the second substrate 12 is bonded to the lower surface of the first substrate 11. Bonding includes bonding, adhesion, fastening, welding, crimping, or cases where the first substrate 11 and the second substrate 12 are joined and / or fastened together. In the switch 1, the first substrate 11 and the second substrate 12 are bonded together using an adhesive.

[0020] The magnetic sensor 14 is an example of a semiconductor element, and detects changes in the magnetic field caused by movement of the magnet 50 in the Y-axis direction. The magnetic sensor 14 is a Hall element that detects changes in the magnetic field using the Hall effect. The Hall element is formed using, for example, a semiconductor such as InSb, GaAs, or InAs. The magnetic sensor 14 is disposed on the underside of the first substrate 11, facing the movable contact 30 with the first substrate 11 interposed therebetween. In the switch 1, the magnetic sensor 14 has five terminals 141.

[0021] The movable contact 30 is composed of a first spring member 31 and a second spring member 32. Each spring member 31, 32 is a flexible conductive member having a convex shape, in other words, a dome-like shape curved so that the center protrudes. In this embodiment, the first spring member 31 and the second spring member 32 have the same shape and are stacked in the Y-axis direction. The first spring member 31 and the second spring member 32 are positioned opposite the magnetic sensor 14 across the first substrate 11. Both ends of the second spring member 32 are positioned on the substrate 11 so as to contact the peripheral fixed contacts 21b, 21f, respectively. The first spring member 31 and the second spring member 32 are made of, for example, stainless steel.

[0022] The first sheet 40 is a flexible insulating resin sheet. The first sheet 40 has a contact prevention function that prevents the magnet 50 from coming into contact with the movable contact 30. The first sheet 40 is arranged to cover the fixed contacts 21a, 21b, 21f and the movable contact 30. An end of the lower surface of the first sheet 40 is bonded to the upper surface of the second frame member 61. The upper surface of the first sheet 40 is in contact with the magnet 50. An end of the upper surface of the first sheet 40 is bonded to the lower surface of the first frame member 60. The first sheet 40 is bonded to the first frame member 60 and the second frame member 61 using an adhesive.

[0023] The magnet 50 is an example of a pressing member and is a cylindrical permanent magnet. The magnet 50 presses the movable contact 30 via the first sheet 40. The magnet 50 is arranged in a straight line with the magnetic sensor 14 in the pressing direction. Therefore, when the magnet 50 is pressed, the distance between the magnet 50 and the magnetic sensor 14 becomes shorter, and the magnetic sensor 14 can detect a change in the magnetic field even if the magnetic force of the magnet 50 is weak.

[0024] The upper surface of the magnet 50 is bonded to the lower surface of the second sheet 70. This bonding is done with an adhesive. The lower surface of the magnet 50 is in contact with the upper surface of the first sheet 40. In other words, the magnet 50 is sandwiched between the upper surface of the first sheet 40 and the lower surface of the second sheet 70.

[0025] The first frame member 60 has a rectangular opening in the center. The lower surface of the first frame member 60 is joined to the edge of the upper surface of the first sheet 40. The upper surface of the first frame member 60 is joined to the edge of the lower surface of the second sheet 70. The joining of the first frame member 60 to the first sheet 40 and the second sheet 70 is carried out by applying an adhesive to the top and bottom of the first frame member 60 and bonding them together.

[0026] The second frame member 61 has a rectangular opening in the center. The second frame member 61 is disposed on the upper surface of the first substrate 11 so that the fixed contacts 21a, 21b, 21f and the movable contact 30 are positioned inside the opening. The lower surface of the second frame member 61 is joined to the upper edge of the first substrate 11. The upper surface of the second frame member 61 is joined to the lower edge of the first sheet 40. The second frame member 61 is joined to the first substrate 11 and the first sheet 40 by applying an adhesive to the top and bottom of the second frame member 61 and adhering them together.

[0027] The second sheet 70 is a flexible insulating resin sheet. The lower end of the second sheet 70 is joined to the upper surface of the first frame member 60. The lower surface of the second sheet 70 is joined to the magnet 50.

[0028] When magnet 50 is pressed down via second sheet 70, first spring member 31 is pressed down via first sheet 40. As a result, the convex shapes of first spring member 31 and second spring member 32 are inverted, and the center of second spring member 32 also comes into contact with central fixed contact 21 a. Because both ends of second spring member 32 are in contact with peripheral fixed contacts 21 b, 21 f, respectively, central fixed contact 21 a and peripheral fixed contacts 21 b, 21 f are conductive, and the switch is turned on.

[0029] Figure 4(a) is a top view of the first substrate 11 (movable contact 30 side), Figure 4(b) is a bottom view of the first substrate 11, Figure 4(c) is a top view of the second substrate (first substrate 11 side), and Figure 4(d) is a bottom view of the second substrate.

[0030] 4(a), first upper surface wiring patterns 22a, 22b, 22f electrically connected to fixed contacts 21a, 21b, 21f, respectively, and first upper surface lands 24a, 24b, 24f electrically connected to first upper surface wiring patterns 22a, 22b, 22f, respectively, are arranged on the upper surface of first substrate 11. In addition, first upper surface lands 24c, 24d, 24e, 24g, 24h that are not connected to first upper surface wiring patterns 22a, 22b, 22f are also arranged on the upper surface of first substrate 11.

[0031] 4(b), first undersurface wiring patterns 23c, 23d, 23e, 23g, and 23h are arranged on the undersurface of the first substrate 11. The first undersurface wiring patterns 23c, 23d, 23e, 23g, and 23h are electrically connected to the terminals 141 of the magnetic sensor 14, and first undersurface lands 25c, 25d, 25e, 25g, and 25h are electrically connected to the first undersurface wiring patterns 23c, 23d, 23e, 23g, and 23h, respectively. Also arranged on the undersurface of the first substrate 11 are first undersurface lands 25a, 25b, and 25f that are not connected to the first undersurface wiring patterns 23c, 23d, 23e, 23g, and 23h. The magnetic sensor 14 is not shown in FIG. 4(b).

[0032] As shown in Figure 4(c), eight second upper surface lands 26a to 26h are arranged on the upper surface of the second substrate 12, and as shown in Figure 4(d), eight second lower surface lands 27a to 27h are arranged on the lower surface of the second substrate 12.

[0033] Eight first-substrate end-face through-holes 16a to 16h are arranged on the side surface of the first substrate 11. The first-substrate end-face through-holes 16a to 16h are electrically connected to the first upper-surface lands 24a to 24h and the first lower-surface lands 25a to 25h of the first substrate 11, respectively. Eight second-substrate end-face through-holes 17a to 17h are arranged on the side surface of the second substrate 12. The second-substrate end-face through-holes 17a to 17h are electrically connected to the second upper-surface lands 26a to 26h and the second lower-surface lands 27a to 27h of the second substrate 12, respectively. Hereinafter, the first-substrate end-face through-holes 16a to 16h and the second-substrate end-face through-holes 17a to 17h may be simply referred to as "end-face through-holes 15a to 15h."

[0034] Each of the first substrate end-face through-holes 16a to 16h and each of the second substrate end-face through-holes 17a to 17h are arranged in a generally straight line in the Y-axis direction. Therefore, each of the first lower-face lands 25a to 25h and each of the second upper-face lands 26a to 26h are arranged in a generally straight line in the Y-axis direction and are electrically connected via solder, for example. As a result, the first upper-face lands 24a to 24h, the first lower-face lands 25a to 25h, the second upper-face lands 26a to 26h, and the second lower-face lands 27a to 27h are electrically connected to each other via the end-face through-holes 15a to 15h.

[0035] Fig. 5(a) is a diagram showing the positional relationship between the first substrate 11 and the second substrate 12, and Fig. 5(b) is a cross-sectional view taken along line B-B' shown in Fig. 5(a). Fig. 5(a) shows the switch 1 as viewed from below in Fig. 1, with the magnetic sensor 14 and sealing resin 19 omitted.

[0036] Parts of the first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h are arranged in positions facing the magnetic sensor 14 within the accommodation portion (through hole) 13 of the second substrate 12. The first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h are connected to five terminals 141 of the magnetic sensor 14, respectively.

[0037] 5B, the sealing resin 19 is filled in the through-hole 13 of the second substrate 12 in the portion where the underside of the first substrate 11 is exposed. As a result, the terminal 141 and the first underside wiring patterns 23c, 23d, 23e, 23g, and 23h arranged in a position facing the through-hole 13 are sealed with the sealing resin 19. The sealing resin 19 seals the terminal 141 and a portion of the main body of the magnetic sensor 14 (portions other than the terminal 141) in the Y-axis direction. The sealing resin 19 is formed of, for example, epoxy resin.

[0038] FIG. 6( a) is a graph showing the relationship between the stroke and the operating load for switch 1, and FIG. 6( b) is a graph showing the relationship between the stroke and the operating load for a comparative example. In the graphs shown in FIGS. 6( a) and 6(b), the horizontal axis represents the stroke (unit: millimeters), the left vertical axis represents the operating load (unit: Newtons), and the right vertical axis represents the output of magnetic sensor 40. In FIG. 6( a), curve 601 represents the relationship between the stroke and the operating load for switch 1, and curve 602 represents the relationship between the stroke and the output of magnetic sensor 40 for switch 1. In FIG. 6( b), curve 603 represents the relationship between the stroke and the operating load for the comparative example, and curve 604 represents the relationship between the stroke and the output of magnetic sensor 40 for the comparative example. FIG. 6( b) also shows curve 602, which represents the relationship between the stroke and the output of magnetic sensor 40 for switch 1.

[0039] 3, in switch 1, the upper surface of magnet 50 is pressed against spring member 30 by second sheet 70. Therefore, as shown by curves 601 and 602 in FIG. 6(a), the initial values ​​of the operating load for the stroke and the magnetic sensor output are the same, and changes in the output of magnetic sensor 14 are linked to changes in the reaction force of movable contact 30. In this way, switch 1 has both a switching function based on the presence or absence of conduction between fixed contacts 21a, 21b, and 21f and spring member (movable contact) 30, and a function to detect changes in pressure of spring member 30 when pressed.

[0040] 6B, the comparative example assumes that the pressing member 50 of the switch 1 is made of resin and is not a magnet, but a magnet separate from the switch 1 is placed above the pressing member 50. In the comparative example, other configurations are the same as those of the switch 1. On the other hand, as shown by curve 604, in the comparative example, a gap occurs between the switch 1 and the magnet, and the magnet starts to move earlier than the pressing action of the switch 1, so the output of the magnetic sensor 14 starts before the change in the operating load.

[0041] In the switch 1, the magnetic sensor 14 is disposed on the underside of the first substrate 11, while the second substrate 12 joined to the underside of the first substrate 11 has an accommodation portion (through-hole) 13 for accommodating the magnetic sensor 14. Therefore, even if the magnetic sensor 14 and the movable contact 30 are disposed on a straight line in the switch 1, the height of the switch 1 in the pressing direction can be reduced, and the switch 1 can be made smaller and / or thinner.

[0042] In the switch 1, the housing portion 13 that houses the magnetic sensor 14 is formed by a through hole that penetrates the second substrate 12, and is provided with a sealing resin 19 that seals the first underside wiring patterns 23c, 23d, 23e, 23g, and 23h that are arranged in the through hole 13 and the terminal 141 of the magnetic sensor 14. Therefore, in the switch 1, the terminal 141 and the first underside wiring patterns 23c, 23d, 23e, 23g, and 23h that are arranged in the through hole 13 are protected from dust and water, and the terminal 141 can be prevented from coming off the first substrate 11.

[0043] The switch 1 includes a first sheet 40 that is provided between the magnet 50 and the movable contact 30 and that prevents contact between the magnet 50 and the movable contact 30. Without the first sheet 40, the end of the lower surface of the magnet 50 would be worn away and potentially chipped due to repeated contact with the movable contact 30. In particular, if the conductive material of the movable contact 30 is a hard material such as metal, there is a high possibility that the magnet 50 will chip. Therefore, by including the first sheet 40 in the switch 1, contact between the magnet 50 and the movable contact 30 can be prevented, and wear of the magnet 50 can be suppressed.

[0044] In switch 1, magnet 50 is sandwiched between first sheet 40 and second sheet 70, first sheet 40 is arranged to cover fixed contacts 21a, 21b, 21f and movable contact 30, and first sheet 40 and second sheet 70 are joined to first frame member 60. Therefore, in switch 1, a cover structure that protects fixed contacts 21a, 21b, 21f and movable contact 30 from dust and water can be easily provided, positional deviation in the depression direction of magnet 50 can be suppressed, and high detection accuracy of magnetic sensor 14 can be maintained.

[0045] In the switch 1, the various substrates (for example, the first substrate 11 and the second substrate 12) may be configured as printed wiring boards, or may be made of insulating material with wiring patterns and lands formed using conductive ink or conductive adhesive. The same applies to the switches 2, 3, and 6 described below.

[0046] (Embodiment 2) FIG. 7 is a perspective view of a switch 2 according to embodiment 2, FIG. 8 is an exploded perspective view of the switch 2 shown in FIG. 7, FIG. 9 is a cross-sectional view of the switch 2 taken along line A-A' in FIG. 7 (the sealing resin is not shown), FIG. 10(a) is a partial perspective view of the first resin case 80 including a cross-section of the first resin case 80 taken along line A-A' in FIG. 7, and FIG. 10(b) is a partial cross-sectional view showing the positional relationship between the first resin case 80 and the magnet 50. The switch 2 differs from the switch 1 in the cover structure, magnet housing structure, fixed contact structure, upper and lower wiring patterns of the first board, and shape of the housing portion of the second board. Note that in FIGS. 7 to 10, the same components as those of the switch 1 described above are denoted by the same reference numerals, and descriptions thereof will be omitted where appropriate.

[0047] The switch 2 includes a first substrate 11', a second substrate 12', a magnetic sensor 14, five fixed contacts 21a' to 21e', a movable contact 30', a magnet 50, an adhesive member 62', and a first resin case 80. The five fixed contacts 21a' to 21e' are arranged on the top surface of the first substrate 11'.

[0048] The upper surface of the second substrate 12' is joined to the lower surface of the first substrate 11'. The second substrate 12' has a housing portion 13' in the center that houses the magnetic sensor 14. In the switch 2, the housing portion 13' is formed in an elliptical shape in a plan view. When the switch 2 is viewed from above, part of the outer edge of the housing portion 13' is in the same position as part of the magnet 50. The height of the second substrate 12' in the Y-axis direction is greater than the height of the magnetic sensor 14.

[0049] The movable contact 30' is composed of a third spring member 30'. The third spring member 30' is a flexible, conductive member having a curved, dome-shaped configuration with a protruding center. The third spring member 30' includes a depression portion 301' and four legs 302'. The depression portion 301' is formed to protrude downward from the dome-shaped ceiling of the third spring member 30' and contacts the central fixed contact 21a' when the third spring member 30' is pressed down. The four legs 302' are each formed to protrude diagonally downward from an end of the third spring member 30'. The third spring member 30' is disposed on the substrate 11' so that each of the four legs 302' contacts each of the peripheral fixed contacts 21b' to 21e'. The third spring member 30' is disposed in a position facing the magnetic sensor 14 across the first substrate 11'. The third spring member 30' is formed, for example, from stainless steel.

[0050] When the third spring member 30' is pressed down, the convex shape of the third spring member 30' is inverted, bringing the depression portion 301' into contact with the central fixed contact 21a', thereby conducting the central fixed contact 21a' and each of the peripheral fixed contacts 21b' to 21e' and turning on the switch.

[0051] The adhesive member 62' is a pressure-sensitive adhesive sheet with an opening in the center. The opening of the adhesive member 62' roughly matches the contour and shape of the third spring member 30' and accommodates the third spring member 30'. The adhesive member 62' is arranged along the edge of the substrate 11' so that the peripheral fixed contacts 21b' to 21e' are located inside the opening. The adhesive member 62' is adhered at its bottom surface to the first substrate 11' and at its top surface to the first resin case 80.

[0052] The first resin case 80 is a flexible resin case having a convex shape, and its outline roughly matches that of the switch 2. The first resin case 80 has functions such as accommodating the magnet 50, accommodating the movable contact 30′ and the like to provide dustproof and waterproof protection, and pressing down the movable contact 30′. The first resin case 80 has a first depression portion 81, a first magnet accommodating portion 82, a first cover portion 83, a first frame portion 84, an opening 85, and a contact prevention portion 86. The first resin case 80, including the portions 81 to 84 and 86, is integrally formed from resin.

[0053] The first depressing portion 81 is disposed on the upper surface of the magnet 50, and when depressed, it presses the magnet 50 toward the movable contact 30'.

[0054] The first magnet housing portion 82 is disposed below the first depression portion 81 and houses the magnet 50 therein. The interior of the first magnet housing portion 82 roughly matches the contour and shape of the magnet 50, preventing misalignment of the magnet 50 in the X, Y, and Z axis directions. The first cover portion 83 connects the first magnet housing portion 82 and the first frame portion 84.

[0055] The first frame portion 84 has a shape that generally matches the outline of the third spring member 30' and has a movable contact opening 851 in the center that accommodates the third spring member 30'. Because the shape of the movable contact opening 851 of the first frame portion 84 generally matches the outline of the third spring member 30', it prevents the movable contact 30' from shifting in position when the third spring member 30' is placed on the upper surface of the first substrate 11'. The lower surface of the first frame portion 84 is adhered to the adhesive member 62'.

[0056] The opening 85 is composed of a movable contact opening 851 and a magnet opening 852. The movable contact opening 851 is an opening for accommodating the movable contact 30′, and its shape roughly matches the outline of the third spring member 30′. The movable contact opening 851 has a recess for accommodating the leg portion 302′ of the movable contact 30′, similar to the second resin case 90 of the switch 3 described below.

[0057] The magnet opening 852 is an opening for accommodating the magnet 50 in the first magnet accommodating portion 82. A contact prevention portion 86 is disposed on the outer edge of the magnet opening 852. The contact prevention portion 86 is disposed below the underside of the magnet 50 in the pressing direction, and comes into contact with the movable contact 30'. In other words, the contact prevention portion 86 ensures a space for preventing contact between the magnet 50 and the movable contact 30' in the pressing direction. When pressed down, the movable contact 30' is deformed by the force from the contact prevention portion 86, and does not come into contact with the magnet 50.

[0058] The contact prevention portion 86 is composed of a protrusion 861 and a notch 862. The protrusion 861 is formed to protrude inward of the magnet 50 in the XZ plane. The protrusion 861, together with the first pressing portion 81, holds the magnet 50 in place. The protrusion 861 prevents contact between the magnet 50 and the movable contact 30′ and suppresses misalignment of the magnet 50 in the pressing direction.

[0059] The cutout portion 862 is a cutout formed in a part of the protrusion 861 in order to accommodate the magnet 50 in the magnet accommodating portion 82. The outer edge of the opening formed by the protrusion 861 is smaller than the outer edge of the magnet 50. Therefore, by forming the cutout portion 862 in a part of the protrusion 861, the magnet 50 can be more easily accommodated in the magnet accommodating portion 82.

[0060] 11(a) is a top view of the first substrate 11' of the switch 2 (movable contact 30' side), (b) is a bottom view of the first substrate 11' of the switch 2, and FIG. 12 is a perspective view of the second substrate 12' of the switch 2.

[0061] 11(a), first upper surface wiring patterns 22a', 22bc, 22cd, and 22de, which are electrically connected to five fixed contacts 21a' to 21e', and first upper surface lands 24a to 24c, which are electrically connected to first upper surface wiring patterns 22a', 22bc, 22cd, and 22de, are arranged on the upper surface of first substrate 11'. In addition, first upper surface lands 24d to 24h, which are not connected to first upper surface wiring patterns 22a', 22bc, 22cd, and 22de, are also arranged on the upper surface of first substrate 11'.

[0062] 11(b), first lower surface wiring patterns 23d'-23h', which are electrically connected to the terminals 141 of the magnetic sensor 14, and first lower surface lands 25d-25h, which are electrically connected to the first lower surface wiring patterns 23d'-23h', are arranged on the lower surface of the first substrate 11'. In addition, first lower surface lands 25a-25c, which are not connected to the first lower surface wiring patterns 23d'-23h', are also arranged on the lower surface of the first substrate 11'.

[0063] Fig. 12 is a perspective view of the second substrate 12' of the switch 2. As shown in Fig. 12, eight second upper surface lands 26a to 26h are arranged on the upper surface of the second substrate 12'. Furthermore, eight second lower surface lands (not shown) are arranged on the lower surface of the second substrate 12' at positions corresponding to the second upper surface lands 26a to 26h, respectively.

[0064] Eight first-substrate end-face through-holes 16a to 16h are arranged on the side surface of the first substrate 11'. Each of the first-substrate end-face through-holes 16a to 16h is electrically connected to each of the first upper-surface lands 24a to 24h and each of the first lower-surface lands 25a to 25h of the first substrate 11'. Eight second-substrate end-face through-holes 17a to 17h are arranged on the side surface of the second substrate 12'. Each of the second-substrate end-face through-holes 17a to 17h is electrically connected to each of the second upper-surface lands 26a to 26h and each of the second lower-surface lands of the second substrate 12'.

[0065] In the switch 2, the first substrate end-face through-holes 16a to 16h and the second substrate end-face through-holes 17a to 17h are also arranged in a generally straight line in the Y-axis direction. Therefore, the first bottom-face lands 25a to 25h and the second top-face lands 26a to 26h are also arranged in a generally straight line in the Y-axis direction and are electrically connected, for example, via soldering. As a result, the first top-face lands 24a to 24h, the first bottom-face lands 25a to 25h, the second top-face lands 26a to 26h, and the second bottom-face lands are electrically connected to one another via the end-face through-holes 15a to 15h.

[0066] 13(a) is a top view showing the positional relationship between the second substrate 12' and the magnet 50 in the switch 2, and FIG. 13(b) is a cross-sectional view taken along line B-B' shown in (a). The accommodation portion 13' is formed by a through-hole that penetrates the second substrate 12'. In the switch 2, too, the terminal 141 of the magnetic sensor 14 and the first underside wiring patterns 23d' to 23h', which are positioned so that a portion of the terminal 141 faces the accommodation portion (through-hole) 13', are sealed with a sealing resin (not shown).

[0067] In switch 2, a portion of magnet 50 is located at the same position as the outer edge of through hole 13' in a plan view. Therefore, when magnet 50 is pressed down, the force of magnet 50 in the pressing direction is transmitted to the vicinity of the outer edge of through hole 13' in second substrate 12'. When a portion of magnet 50 is located at the same position as the outer edge of through hole 13' in a plan view, this also includes the case where the outlines of magnet 50 and through hole 13' in a plan view are the same.

[0068] In the switch 2, the magnetic sensor 14 is disposed on the underside of the first substrate 11', while a housing portion (through-hole) 13' for housing the magnetic sensor 14 is disposed on the second substrate 12' joined to the underside of the first substrate 11'. Therefore, in the switch 2, even if the magnetic sensor 14 and the movable contact 30' are disposed on a straight line, the switch 2 can be made smaller and / or thinner.

[0069] In the switch 2, a portion of the magnet 50 is located at the same position as the outer edge of the housing portion (through hole) 13' in a plan view, so when the magnet 50 is pressed down, the force of the magnet 50 in the pressing direction is also transmitted to the second substrate 12' located at the outer edge of the housing portion 13'. Therefore, in the switch 2, bending of the third spring member 30' and the first substrate 11' when pressed down can be suppressed. This is effective when a permanent magnet is used as the magnet 50, when the magnet 50 is large, or when the weight of the magnet 50 is increased.

[0070] In the switch 2, the first resin case 80 includes a first depression portion 81, a first magnet accommodating portion 82, a first cover portion 83, a first frame portion 84, and a contact prevention portion 86. Therefore, in the switch 2, a case can be provided that combines the function of accommodating the magnet 50, the function of providing dustproof and waterproof protection for the movable contact 30′ and the like, and the function of depressing the movable contact 30′. By providing the first resin case 80 with multiple functions, the number of parts can be reduced, and the switch 2 can be made smaller and / or thinner.

[0071] In switch 2, contact prevention portion 86 is formed on the outer edge of magnet opening 852 formed in the lower surface of first magnet accommodating portion 82. Therefore, in switch 2, with a simple configuration, magnet 50 can be easily accommodated in first magnet accommodating portion 82, and the lower surface of magnet 50 can be prevented from contacting movable contact 30′.

[0072] (Embodiment 3) Fig. 14 is a perspective view of a switch 3 according to embodiment 3, Fig. 15 is an exploded perspective view of the switch 3 shown in Fig. 14, Fig. 16 is a cross-sectional view of the switch 3 taken along line A-A' shown in Fig. 14, Fig. 17(a) is a perspective view of the second resin case 90 of the switch 3 as seen from below, and Fig. 17(b) is a diagram showing the positional relationship between the second resin case 90 and the magnet 50 shown in Fig. 17(a). Note that in the switch 3, the same components as those in the above-described switches 1 and 2 are denoted by the same reference numerals, and descriptions thereof will be omitted where appropriate.

[0073] The switch 3 includes a first substrate 11", a second substrate 12", a magnetic sensor 14, five fixed contacts 21a", 21c", 21d", 21e", and 21f", a movable contact 30", a magnet 50, an adhesive member 62', and a second resin case 90. The top surface of the first substrate 11" is bonded to the bottom surface of the second substrate 12". The first substrate 11" and the second substrate 12" are bonded together with an adhesive.

[0074] The second substrate 12" has a housing portion 13" in the center that houses the magnetic sensor 14. The housing portion 13" is formed by a through-hole that penetrates the second substrate 12". As with switches 1 and 2, the height of the second substrate 12" in the Y-axis direction is higher than the height of the magnetic sensor 14, so the magnetic sensor 14 is housed in the through-hole (housing portion) 13". Five fixed contacts 21a", 21c", 21d", 21e", 21f", etc. are arranged on the upper surface of the second substrate 12".

[0075] The movable contact 30" is composed of a fourth spring member 30". The fourth spring member 30" is a flexible, conductive member having a dome-like shape that is curved so that the center protrudes. The fourth spring member 30" has a depression portion 301" and multiple legs 302". The depression portion 301" is formed on the dome-shaped ceiling of the fourth spring member 30", and comes into contact with the fixed contact 21a" when the fourth spring member 30" is pressed down. The multiple legs 302" are each formed to protrude diagonally downward from an end of the fourth spring member 30". The fourth spring member 30" is arranged on the second substrate 12" so that the multiple legs 302" each come into contact with the peripheral fixed contacts 21c" to 21f". A magnetic sensor 14 is arranged below the fourth spring member 30". The fourth spring member 30" is made of, for example, stainless steel.

[0076] When the fourth spring member 30'' is pressed down, the convex shape of the fourth spring member 30'' is inverted, causing the press-down portion 301'' to come into contact with the central fixed contact 21a'', thereby conducting the central fixed contact 21a'' and the peripheral fixed contacts 21c'' to 21f'', and turning the switch on.

[0077] The second resin case 90 is a flexible resin case having a convex shape, and its outline generally matches that of the switch 3. The second resin case 90 has the same functions as the first resin case 80. The second resin case 90 has a second depression portion 91, a second magnet accommodating portion 92, a second cover portion 93, a second frame portion 94, a second side wall portion 98, etc. The second depression portion 91, the second magnet accommodating portion 92, the second cover portion 93, the second frame portion 94, and the second side wall portion 98 are integrally formed from resin.

[0078] The second push-down portion 91 is positioned below the magnet 50, and when pressed down, presses the magnet 50 towards the movable contact 30" side. The second push-down portion 91 also serves as a contact prevention portion that prevents contact between the movable contact 30" and the magnet 50. In other words, the second push-down portion 91, which is also a contact prevention portion, is positioned between the lower surface of the magnet 50 and the movable contact 30" in the pressing direction, at a position that prevents contact between the magnet 50 and the movable contact 30". The upper surface of the second push-down portion 91 is joined to the lower surface of the magnet 50. The upper surface of the second push-down portion 91 and the lower surface of the magnet 50 are joined with an adhesive.

[0079] The second magnet housing portion 92 is formed above the second depression portion 91 and houses the magnet 50 therein. The interior of the second magnet housing portion 92 has a shape that roughly matches the contour of the magnet 50, thereby suppressing misalignment of the magnet 50 in the XZ plane. The second cover portion 93 is connected to the second magnet housing portion 92 and the second frame portion 94.

[0080] The second frame portion 94 has a shape that generally matches the outline of the fourth spring member 30″ and has an opening in the center that accommodates the fourth spring member 30″. The opening of the second frame portion 94 has a recess 99 for accommodating the leg portion 302″ of the movable contact 30″. This, together with the shape of the opening generally matching the outline of the fourth spring member 30″, prevents the movable contact 30″ from shifting in position when the movable contact (fourth spring member) 30″ is placed on the upper surface of the second substrate 12″. The lower surface of the second frame portion 94 is adhered to the adhesive member 62′. This, together with the second cover portion 93 and the like, provides dustproof and waterproof functionality to the upper surface of the second substrate 12″. The second side wall portion 98 is a side wall that forms the second magnet accommodating portion 92. The second side wall portion 98 prevents the magnet 50 from shifting in position in the XZ plane.

[0081] FIG. 18 is a top view (second substrate 12″ side) of the first substrate 11″ of the switch 3. As shown in FIG. 18, on the top surface of the first substrate 11″, there are arranged first top surface wiring patterns 22b″, 22d″, 22f″, 22g″, 22h″ which are electrically connected to each terminal 141 of the magnetic sensor 14, and first top surface lands 24b, 24d, 24f, 24g, 24h which are electrically connected to the first top surface wiring patterns 22b″, 22d″, 22f″, 22g″, 22h″.

[0082] On the upper surface of first substrate 11", third upper surface wiring patterns 28a to 28f are arranged at positions different from first upper surface wiring patterns 22b", 22d", 22f", 22g", 22h", and first upper surface lands 24a, 24c, 24e are arranged which are electrically connected to third upper surface wiring patterns 28a, 28c, 28e, respectively. On the lower surface of first substrate 11", eight first lower surface lands (not shown) are arranged which respectively correspond to first upper surface lands 24a to 24h.

[0083] The third upper surface wiring patterns 28a to 28f have connection surfaces 281a to 281f, respectively. The connection surfaces 281a to 281f are arranged in positions opposite the second lower surface lands 27a to 27f, respectively, and are electrically connected to the second lower surface lands 27a to 27f, for example, by soldering.

[0084] 19(a) is a top view (movable contact 30'' side) of the second substrate 12'' of the switch 3, and FIG. 19(b) is a bottom view of the second substrate 12'' shown in FIG. 19(a).

[0085] As shown in FIG. 19(a), second upper surface wiring patterns 23ab′, 23cd′, 23ef′ electrically connected to fixed contacts 21a″, 21c″, 21d″, 21e″, 21f″, and second upper surface lands 26a to 26f electrically connected to second upper surface wiring patterns 23ab′, 23cd′, 23ef′ are arranged on the upper surface of second substrate 12″.

[0086] As shown in FIG. 19(b), six second lower surface lands 27a to 27f are arranged on the lower surface of the second substrate 12''.

[0087] Eight first substrate end face through holes 16a to 16h are arranged on the side surface of the first substrate 11". Each of the first substrate end face through holes 16a to 16h is electrically connected to each of the first upper surface lands 24a to 24h and each of the first lower surface lands of the first substrate 11". Six second substrate through holes 18a to 18f are arranged outside the accommodation portion (through hole) 13" in the XZ plane of the second substrate 12". The second substrate through holes 18a to 18f are electrically connected to each of the second upper surface lands 26a to 26f and each of the second lower surface lands 27a to 27f of the second substrate 12".

[0088] In the switch 3, the magnetic sensor 14 is disposed on the upper surface of the first substrate 11″, and the housing portion (through hole) 13″ for housing the magnetic sensor 14 is disposed on the second substrate 12″. Therefore, even if the magnetic sensor 14 and the movable contact 30″ are disposed on a straight line, the switch 3 can be made smaller and / or thinner.

[0089] In switch 3, connection surfaces 281a, 281c, 281e of third upper surface wiring patterns 28a, 28c, 28e connected to first upper surface lands 24a, 24c, 24e, respectively, are electrically connected to second lower surface lands 27a, 27c, 27e, respectively. Therefore, fixed contacts 21a", 21c", 21d", 21e", 21f" are electrically connected to third upper surface wiring patterns 28a to 28f of first substrate 11" via second upper surface wiring pattern 23" of second substrate 12", and are electrically connected to other electronic components via first substrate end surface through holes 16a to 16h and lands.

[0090] In the switch 3, the second resin case 90 includes a second push-down portion 91 that also serves as a contact prevention portion, a second magnet accommodating portion 92, a second cover portion 93, and a second frame portion 94. Therefore, the switch 3 can provide a case that combines the function of accommodating the magnet 50, the function of dustproofing and waterproofing the movable contact 30" and the like, and the function of depressing the movable contact 30".

[0091] In the switch 3, the second depression portion 91 also serves as a contact prevention portion. Therefore, in the switch 3, the magnet 50 can be prevented from contacting the movable contact 30" with a simple configuration.

[0092] (Embodiment 4) Figure 20 is a perspective view of a switch 4 according to embodiment 4, Figure 21 is an exploded perspective view of the switch 4, Figure 22(a) is a top view of the substrate 10 (movable contact 30 side), Figure 22(b) is a bottom view of the substrate 10, Figure 23(a) is a perspective view of lead frames 210, 230 arranged in the substrate 10 seen obliquely from above, Figure 23(b) is a perspective view of lead frames 210, 230 arranged in the substrate 10 seen obliquely from below, and Figure 24 is a cross-sectional view of the switch 4 taken along line A-A' shown in Figure 20.

[0093] Switch 4 differs from switch 1 in that the functions of the first and second substrates are provided on a single substrate (in other words, the first and second substrates are integrally formed), and in that a lead frame is used instead of wiring patterns, lands, etc. In switch 4, the same components as those in switch 1 are designated by the same numbers and their description will be omitted.

[0094] The switch 4 comprises a substrate 10, a magnetic sensor 14, a movable contact 30, a first sheet 40, a magnet 50, a first frame member 60, a second sheet 70, and seven lead frames 210a, 210b, 230a to 230e arranged within the substrate 10.

[0095] The substrate 10 is a component integrally formed by fixing seven lead frames 210a, 210b, 230a to 230e shown in Figures 23(a) and 23(b) with resin or the like, and has a recess 200 on the upper surface side and a housing portion 213 on the lower surface side. The housing portion 213 houses the magnetic sensor 14. A portion of the outer edge of the housing portion 213 is located in the same position as a portion of the outer edge of the magnet 50, similar to the switch 2. The height of the substrate 10 in the Y-axis direction is greater than the height of the magnetic sensor 14.

[0096] The lead frames 210a and 210b are arranged in a recess 200 of the substrate 10 so that portions of them are exposed. When a central portion of the movable contact 30 is pressed down, it comes into contact with a portion of the lead frame 210a exposed in the recess 200. The end of the movable contact 30 is arranged so that it comes into contact with a portion of the lead frame 210b exposed in the recess 200, so that when the movable contact 30 is pressed down, the lead frames 210a and 210b are electrically connected, turning on the switch. In other words, the lead frames 210a and 210b function as fixed contacts. The tip portions of the lead frames 210a and 210b protrude outside the substrate 10 as contacts 211a and 211b, respectively.

[0097] The lead frames 230a to 230e are arranged so that a portion of each is exposed within the storage section 213. The portions of the lead frames 230a to 230e exposed within the storage section 213 are electrically connected to the terminals 141 of the magnetic sensor 14. In the switch 4, the lead frames 230a to 230e exposed within the storage section 213 and the terminals 141 of the magnetic sensor 14 are sealed within the storage section 213 with a sealing resin (not shown). Furthermore, the tips of the lead frames 230a to 230e protrude outside the substrate 10 as contacts 231a to 231e, respectively.

[0098] The lead frames 210a, 210b and the lead frames 230a to 230e are arranged in a spaced-apart and insulated state within the substrate 10. The lead frames 210a, 210b and the lead frames 230a to 230e are formed so as to have portions where they do not overlap in the pressing direction of the movable contact 30. By clamping and fixing these non-overlapping portions with a mold or pins, the lead frames are fixed with resin while maintaining their spaced-apart and insulated state, and the substrate 10 is created. Furthermore, in the center of the substrate 10, the lead frames 210a, 210b are arranged closer to the movable contact 30 than the lead frames 230a to 230e.

[0099] In the switch 4, the magnetic sensor 14 is housed in the housing portion 213 of the substrate 10, which reduces the height of the switch 4 in the depression direction. By using the substrate 10, the first substrate 11 and the second substrate 12 in the switch 1 do not peel off from each other, and the durability of the switch 4 is improved.

[0100] 25(a) is a top view of the switch 5, (b) is a bottom view of the switch 5, and (c) is a cross-sectional view of the switch 5 taken along line AA' shown in (a).

[0101] Switch 5 is a modified example of switch 4, and contacts 211a, 211b, 231a to 231e that protrude from substrate 10 in switch 4 are arranged in switch 5 so that they move from the side to the underside so as not to protrude from substrate 10. Switch 5 is the same as switch 4 in that the first and second substrates are integrally formed, and switch 5 uses a lead frame instead of wiring patterns, lands, etc. In switch 5, the same components as switch 4 are assigned the same numbers, and their description will be omitted.

[0102] Contacts 211a', 211b', and 231a' to 231e' in switch 5 correspond to contacts 211a, 211b, and 231a' to 231e' in switch 4. In the top view of switch 5 shown in FIG. 25(a), contacts 211a', 211b', and 231a' to 231e' are not visible, but in the bottom view of switch 5 shown in FIG. 25(c), it is visible that contacts 211a', 211b', and 231a' to 231e' are arranged on the bottom surface of switch 5. Switch 5 is connected to an external board or the like by the various contacts arranged on the bottom surface of switch 5.

[0103] Switch 5 is similar to switch 4 in that the magnetic sensor 14 is disposed in a recess 213 formed in the substrate 10. However, recess 213 is completely filled with sealing resin 291, and is configured so that the magnetic sensor 14 is not exposed to the outside air.

[0104] In the switch 5, a recess 213 is formed in the substrate 10, the magnetic sensor 14 is disposed in the recess 213, and the magnetic sensor 14 is filled with sealing resin 291 to isolate it from the outside. However, when forming the substrate 10 including the lead frames 230a to 230e, the magnetic sensor 14 may also be included, and the substrate 10 may be formed integrally.

[0105] (Embodiment 5) Figure 26 is a perspective view of a switch 6 according to embodiment 5, Figure 27 is a cross-sectional view of the switch 6 taken along line A-A' shown in Figure 26, Figure 28(a) is a top view of a substrate 300 of the switch 6, and Figure 28(b) is a bottom view of the substrate 300 of the switch 6.

[0106] Switch 6 is a modified example of switch 1, and differs in that the first substrate 11 and the second substrate 12 of switch 1 are combined into a single substrate 300. Switch 6 includes substrate 300, magnetic sensor 14, movable contact 30, first sheet 40, magnet 50, first frame member 60, second frame member 61, and second sheet 70. The magnetic sensor 14, movable contact 30, first sheet 40, magnet 50, first frame member 60, second frame member 61, and second sheet 70 have the same configuration as switch 1, and therefore description thereof will be omitted.

[0107] 28(a), three fixed contacts 21a, 21b, 21f, etc. are arranged on the upper surface of substrate 300. Also arranged on the upper surface of substrate 300 are first upper surface wiring patterns 22a, 22b, 22f electrically connected to fixed contacts 21a, 21b, 21f, respectively, and first upper surface lands 24a, 24b, 24f electrically connected to first upper surface wiring patterns 22a, 22b, 22f, respectively.

[0108] 28(b), bottom surface wiring patterns 323c, 323d, 323e, 323g, and 323h, which are electrically connected to the terminals 141 of the magnetic sensor 14, and bottom surface lands 327c, 327d, 327e, 327g, and 327h, which are electrically connected to the bottom surface wiring patterns 323c, 323d, 323e, 323g, and 323h, respectively, are arranged on the bottom surface of the substrate 300. Note that the magnetic sensor 14 is not shown in FIG. 28(b).

[0109] The bottom surface wiring patterns 323c, 323d, 323e, 323g, and 323h are each formed continuously from the inner bottom surface of the accommodation portion 13 formed on the underside of the substrate 300, via the inner side surface of the accommodation portion 13, to the underside of the substrate 300. The terminals 141 of the magnetic sensor 14 and the bottom surface wiring patterns 323c, 323d, 323e, 323g, and 323h are connected at the inner bottom surface of the accommodation portion 13.

[0110] Three substrate end face through holes 316a, 316b, and 316f are arranged on the side surface of the substrate 300. The substrate end face through hole 316a electrically connects the top surface land 24a and the bottom surface land 327a of the substrate 300, the substrate end face through hole 316b electrically connects the top surface land 24b and the bottom surface land 327b of the substrate 300, and the substrate end face through hole 316f electrically connects the top surface land 24f and the bottom surface land 327f of the substrate 300.

[0111] On the underside of the substrate 300, there are arranged underside lands 327a, 327b, and 327f electrically connected to the three fixed contacts 21a, 21b, and 21f, and underside lands 327c, 327d, 327e, 327g, and 327h electrically connected to the magnetic sensor 14. In this way, in the switch 6, connections can be made with the three fixed contacts 21a, 21b, and 21f and the magnetic sensor 14 only on the underside of the substrate 300, and the switch 6 can be easily electrically connected to an external substrate or the like.

[0112] In the switch 6, the bottom surface wiring patterns 323c, 323d, 323e, 323g, and 323h are arranged inside the housing portion 13, and therefore the entire inside of the housing portion 13, including the magnetic sensor 14, is sealed with sealing resin 319. The sealing resin 319 is a resin made of the same material as the sealing resin 19.

[0113] (Modifications of Each Switch) In switch 4, a recess 200 is provided in the upper surface of substrate 10 and movable contact 30 is disposed therein, but the recess 200 does not have to be provided in the upper surface of substrate 10. For example, the upper surface of substrate 10 may be flat, and a frame member that houses movable contact 30 may be provided between substrate 10 and first sheet 40.

[0114] In the switch 4, the lead frames 210, 230 are arranged within the substrate 10 formed from resin, but the substrate 10 may be configured from a number of stacked substrates.

[0115] In the switches 2 and 4, a part of the magnet 50 is arranged at the same position as the outer edge of the through-hole (accommodation portion) 13' in a plan view, but the same configuration may be adopted in the switches 1 and 3 as well.

[0116] In the switches 1 to 3, the housing portion is formed by a through hole that penetrates the substrate, but the housing portion may be a recess that does not penetrate the substrate as long as it can accommodate the magnetic sensor 14.

[0117] Although switches 1 to 6 use magnetic sensors 14, which are semiconductor elements, other semiconductor elements such as LEDs may also be used. When an LED, which is a light-emitting element, is used instead of magnetic sensors 14, it becomes possible to visually recognize whether the switch is on or off by making the light-emitting element emit light when the switch is turned on, or vice versa.

[0118] In the switches 1, 2 and 6, an end face through hole is given as an example of a through hole, but a through hole that passes through the substrate may be disposed at the end of each substrate.

[0119] In the switch 1, a portion of the magnetic sensor 14 (semiconductor element) is sealed by filling the sealing resin 19, but the entire body of the magnetic sensor 14 (semiconductor element) may be sealed. The same applies to the switches 2 and 4.

[0120] In switches 1 and 2, the first upper surface lands connected to the first upper surface wiring pattern and the first upper surface lands connected to the first lower surface wiring pattern are connected to different first substrate through holes. However, some of the first upper surface lands connected to the first upper surface wiring pattern and some of the first lower surface lands connected to the first lower surface wiring pattern may be connected to different first substrate through holes. In other words, some of the first substrate through holes may be wiring patterns that are conductive to both the fixed contacts and the magnetic sensor 14 (semiconductor element). Even in this case, the first substrate end surface through holes are effectively utilized, simplifying the wiring pattern.

[0121] In switches 2 and 3, lands located at the edges of the substrate are used to establish electrical continuity between the top and bottom surfaces of the substrate, but pads located at locations other than the edges of the substrate may also be used instead of lands. Note that lands and pads are examples of conductive surfaces formed from conductive materials.

[0122] In switches 1 to 6, the movable contact has a convex (dome-like) shape, but the shape of the movable contact does not have to be convex as long as it deforms when pressed down to connect the multiple fixed contacts to each other. For example, in switch 1, the height of fixed contacts 21b and 21f may be made higher than substrate 11, while movable contact 30 may be made flat, leaving a gap between fixed contact 21a and movable contact 30. In this case, the same effect as when movable contact 30 is made curved and dome-shaped can be obtained.

[0123] In the switches 1 to 6, the movable contact 30 is configured with two spring members 30 and 31, but the number of spring members is not particularly limited, and may be three or more, or may be one.

[0124] In the switches 1 and 4, the first sheet 40 and the first frame member 60 may be integrally formed. In this case, the first sheet 40 and the first frame member 60 are unlikely to peel off from each other, improving the durability of the cover structure.

[0125] In the switches 1 and 4, the first sheet 40 and the magnet 50 may be joined together. The first sheet 40 and the magnet 50 may be joined together by adhesive, adhesive sheet, or a combination thereof.

[0126] In switches 1 to 6, the magnet 50 is a cylindrical permanent magnet, but is not limited to this. For example, the shape of the magnet 50 may be a polygonal prism. Furthermore, the magnet 50 is not limited to a permanent magnet, and may be, for example, an electromagnet that has a magnetic effect only when a current is flowing.

[0127] In the switches 1 to 6, the magnet 50 is used as the pressing member, but the present invention is not limited to this and may be, for example, a member having a predetermined rigidity.

[0128] In the switches 1 and 4, the openings of the second frame member 61 may be shaped so that their outlines and shapes generally match the contours of the spring members 31 and 32 and accommodate the spring members 31 and 32. In this case, the second frame member 61 can prevent the movable contact 30 from shifting in position when the movable contact 30 is placed on the upper surface of the first substrate 11.

[0129] In the switch 2, the first resin case 80 has the notch 862 formed in the contact prevention portion 86, but the notch 862 does not have to be formed.

[0130] In switch 2, the underside of first depressing portion 81 may be joined to the upper surface of magnet 50. This eliminates the need for notch 862 and even protrusion 861. The underside of first depressing portion 81 may be joined to the upper surface of magnet 50 by applying an adhesive to the underside of first depressing portion 81 or by using a pressure-sensitive adhesive sheet.

[0131] In switches 2 and 3, the openings of adhesive member 62' have a shape that generally matches the contours of each spring member, but the openings may also be rectangular.

[0132] In the switches 2 and 3, it is sufficient that each substrate and each resin case are joined together, and the adhesive member 62′ does not have to be provided. For example, the first substrate 11′ (second substrate 12″) and the first resin case 80 (second resin case 90) may be joined together with an adhesive or an adhesive sheet.

[0133] In switches 1 to 3, the first substrate and the second substrate are bonded together using an adhesive, but the bonding is not limited to bonding and may be bonded together using a pressure-sensitive adhesive sheet. The same applies to bonding between other components. For example, the second depression portion 91 of the second resin case 90 and the magnet 50 may be bonded together using an adhesive sheet.

[0134] The combinations of the cover structures and the substrates in the switches 1 to 4 are merely examples and are not limiting. For example, a second cover member 90 may be disposed on each of the substrates 11' and 12' of the switch 2, or each of the resin cases 80 and 90 may be disposed on the substrate 10. The same applies to the combinations of the movable contacts and the cover structures.

[0135] In the switch 3, six second substrate through holes 18a to 18f arranged in the center of the second substrate 12" are used to provide electrical continuity between the top and bottom surfaces of the second substrate 12". However, a configuration such as eight first substrate end face through holes 16a to 16h arranged on the side surface of the first substrate 11" and lands arranged around them may also be used to provide electrical continuity between the top and bottom surfaces of the second substrate 12".

[0136] In the switches 1 to 5, the first substrate may be configured to include a plurality of components or substrates. Similarly, in the switches 1 to 5, the second substrate may be configured to include a plurality of components or substrates.

[0137] The following supplementary notes are further disclosed regarding the above-described embodiments and their modified examples: (Supplementary Note 1) A switch comprising: a substrate, a plurality of fixed contacts arranged on an upper surface of the substrate, a movable contact arranged on the upper surface of the substrate, the movable contact being deformed when pressed to bring the plurality of fixed contacts into electrical contact with each other, a pressing member for pressing down the movable contact, and a semiconductor element arranged on the lower surface of the substrate in a position facing the movable contact with the substrate interposed therebetween, the substrate comprising an accommodation portion for accommodating the semiconductor element. a first substrate; a plurality of fixed contacts arranged on an upper surface of the first substrate; a movable contact arranged on the upper surface of the first substrate, the movable contact being deformed when pressed to bring the plurality of fixed contacts into electrical contact with each other; a pressing member for pressing down the movable contact; a semiconductor element arranged on a lower surface of the first substrate at a position facing the movable contact with the first substrate interposed therebetween; a plurality of first lower conductor surfaces arranged on the lower surface of the first substrate at an end of the first substrate; a first lower wiring pattern arranged on the lower surface of the first substrate and connected to the semiconductor element and portions of the plurality of first lower conductor surfaces; a second substrate bonded to the lower surface of the first substrate, the second substrate having an accommodating portion for accommodating the semiconductor element; and a plurality of second upper conductor surfaces arranged on an upper surface of the second substrate at an end of the second substrate, wherein the first lower conductor surface connected to the first lower wiring pattern and portions of the plurality of second upper conductor surfaces are electrically connected. (Supplementary Note 3) The switch according to Supplementary Note 2, further comprising: a plurality of first substrate through holes arranged at an end of the first substrate; and a plurality of second substrate through holes arranged at an end of the second substrate, wherein the first lower surface conductor surface is a first lower surface land connected to the first substrate through holes; and the second upper surface conductor surface is a second upper surface land connected to the second substrate through holes.(Supplementary Note 4) The switch according to Supplementary Note 3, further comprising: a plurality of first upper surface lands arranged on an upper surface of the first substrate, each connected to the first substrate through hole; and a first upper surface wiring pattern arranged on the upper surface of the first substrate, connected to the fixed contact and some of the plurality of first upper surface lands, wherein some of the plurality of first upper surface lands connected to the first upper surface wiring pattern and some of the plurality of first lower surface lands connected to the first lower surface wiring pattern are connected to different first substrate through holes. (Supplementary Note 5) The switch according to Supplementary Note 2, further comprising: a sealing resin arranged in the through hole and sealing the first lower surface wiring pattern and a terminal of the semiconductor element connected to the first lower surface wiring pattern. a first substrate bonded to a lower surface of the second substrate; a semiconductor element disposed on the upper surface of the first substrate and below the movable contact; a plurality of first upper conductor surfaces disposed on an end of the first substrate; a first upper wiring pattern disposed on the upper surface of the first substrate and connected to the semiconductor element and portions of the plurality of first upper conductor surfaces; an accommodating section provided on the second substrate for accommodating the semiconductor element; and a plurality of second lower conductor surfaces disposed on the lower surface of the second substrate, wherein the first upper conductor surface connected to the first upper wiring pattern and portions of the plurality of second lower conductor surfaces are electrically connected. (Supplementary Note 7) The switch described in Supplementary Note 6 further comprises: a plurality of first substrate through holes arranged at an end of the first substrate; and a plurality of first lower surface lands on the lower surface of the first substrate, each connected to the first substrate through holes; and the first upper surface conductor surface is a first upper surface land connected to the first substrate through holes.(Supplementary Note 8) The switch according to Supplementary Note 7, further comprising: a plurality of second substrate through-holes arranged outside the accommodating portion on the second substrate; a plurality of second upper surface lands arranged on the upper surface of the second substrate, each connected to the second substrate through-holes; a plurality of second lower surface lands arranged on the lower surface of the second substrate, each connected to the second substrate through-holes; a second upper surface wiring pattern arranged on the upper surface of the second substrate, connected to the fixed contacts and the second upper surface lands; and a third upper surface wiring pattern arranged on the upper surface of the first substrate, connected to the plurality of second lower surface lands. (Supplementary Note 9) The switch according to any one of Supplements 1 to 8, further comprising: a contact prevention part that prevents contact between a lower surface of the magnet and the movable contact. (Supplementary Note 10) The switch according to Supplementary Note 9, wherein the pressing member is a magnet; the semiconductor element is a magnetic sensor that detects a change in a magnetic field caused by movement of the magnet in a pressing direction. (Supplementary Note 11) The switch according to Supplementary Note 9, wherein the contact prevention portion is a first sheet arranged to cover the plurality of fixed contacts and movable contacts, and further comprising: a frame member arranged on an upper surface of the first sheet; and a second sheet arranged on an upper surface of the frame member, sandwiching the magnet between it and the first sheet. (Supplementary Note 12) The switch according to Supplementary Note 11, wherein the first sheet and the frame member are integrally formed. (Supplementary Note 13) The switch according to Supplementary Note 9, further comprising a first resin case having the contact prevention portion formed on a part thereof, the first resin case comprising: a first depression portion arranged on an upper surface of the magnet, a first magnet accommodating portion in which the magnet is accommodated, a first frame portion arranged so that the movable contact is located inside thereof, and a first cover portion connecting the first magnet accommodating portion and the first frame portion and covering the movable contact, and the contact prevention portion is formed on the outer edge of an opening formed in a lower surface of the first magnet accommodating portion.(Supplementary Note 14) The switch according to Supplementary Note 9, further comprising a second resin case having the contact prevention portion formed in a part thereof, wherein the second resin case comprises: a second magnet accommodating portion in which the magnet is accommodated, a second frame portion arranged so that the movable contact is located inside the second frame portion, and a second cover portion connecting the second magnet accommodating portion and the second frame portion and covering the movable contact, wherein the contact prevention portion is formed on a lower surface of the magnet and also serves as a depression portion that depresses the movable contact when depressed. (Supplementary Note 15) The switch according to any of Supplementary Notes 2 to 8, wherein the first substrate and the second substrate are integrally formed. (Supplementary Note 16) A switch comprising: a first substrate, a plurality of fixed contacts arranged on an upper surface of the first substrate, a movable contact arranged on the upper surface of the first substrate, the movable contact being deformed when pressed to bring the plurality of fixed contacts into electrical contact with each other, a press-down member for pressing down the movable contact, and a semiconductor element arranged on a lower surface of the first substrate in a position facing the movable contact with the first substrate interposed therebetween, wherein the first substrate has a housing portion for housing the semiconductor element. (Supplementary Note 17) The switch according to Supplementary Note 16, further comprising: a second substrate bonded to the lower surface of the first substrate, a second upper-surface wiring pattern arranged on the upper surface of the second substrate and connected to the semiconductor element, a second upper-surface conductor surface arranged on the upper surface of the second substrate, and a plurality of second lower-surface conductor surfaces arranged on the lower surface of the second substrate, wherein the second upper-surface wiring pattern and a portion of the second upper-surface conductor surface, and a portion of the second upper-surface conductor surface and a portion of the second lower-surface conductor surface are electrically connected, respectively. (Appendix 18) The switch described in Appendix 17, further comprising: a first upper conductor surface disposed on the upper surface of the first substrate and connected to the plurality of fixed contacts; and a first lower conductor surface disposed on the lower surface of the first substrate, wherein the upper conductor surface and the first lower conductor surface are electrically connected; and the first lower conductor surface and another part of the second upper conductor surface, and the other part of the second upper conductor surface and another part of the second lower conductor surface are electrically connected, respectively.(Supplementary Note 19) A switch having: a substrate including a accommodating portion, a plurality of first fixed contacts arranged on an upper surface of the substrate, a plurality of second fixed contacts arranged in the accommodating portion, a plurality of second fixed contacts arranged on a side or lower surface of the substrate, a movable contact arranged on the upper surface of the substrate and deformed when pressed to bring the plurality of fixed contacts into electrical contact with each other, a pressing member for pressing down the movable contact, and a semiconductor element connected to the plurality of second fixed contacts and arranged in the accommodating portion at a position facing the movable contact. (Supplementary Note 20) The switch according to Supplementary Note 19, further having: a first lead frame electrically connecting the plurality of first fixed contacts to some of the plurality of third fixed contacts, and a second lead frame electrically connecting the plurality of second fixed contacts to another portion of the plurality of third fixed contacts.

Claims

1. A switch having: a substrate having a housing portion; a plurality of fixed contacts arranged on an upper surface of the substrate; a movable contact arranged on the upper surface of the substrate and deformed when pressed to bring the plurality of fixed contacts into electrical contact with each other; a pressing member for pressing down the movable contact; and a semiconductor element connected to the lower surface of the substrate and arranged within the housing portion in a position opposite the movable contact.

2. The switch according to claim 1, wherein the substrate includes a first substrate and a second substrate, the plurality of fixed contacts are arranged on an upper surface of the first substrate, and the second substrate is joined to a lower surface of the first substrate and has the accommodating portion formed by a through hole.

3. A switch as described in claim 2, further comprising: a first lower surface wiring pattern disposed on the lower surface of said first substrate and connected to said semiconductor element; a first lower surface conductor surface disposed on the lower surface of said first substrate; a plurality of second upper surface conductor surfaces disposed on the upper surface of said second substrate; and a plurality of second lower surface conductor surfaces disposed on the lower surface of said second substrate, wherein said lower surface wiring pattern and a portion of said first lower surface conductor surface, a portion of said first lower surface conductor surface and a portion of said second upper surface conductor surface, and a portion of said second upper surface conductor surface and a portion of said second lower surface conductor surface are electrically connected, respectively.

4. A switch as described in claim 2 or 3, further comprising a first upper conductor surface connected to the plurality of fixed contacts, wherein the first upper conductor surface and another part of the first lower conductor surface, the other part of the first lower conductor surface and another part of the second upper conductor surface, and the other part of the second upper conductor surface and another part of the second lower conductor surface are electrically connected to each other.

5. A switch as described in claim 3 or 4, further comprising: a first substrate through-hole connecting the first upper conductor surface and the first lower conductor surface; and a second substrate through-hole connecting the second upper conductor surface and the second lower conductor surface.

6. A switch as claimed in any one of claims 2 to 5, further comprising a sealing resin disposed within the through hole, for sealing the first lower surface wiring pattern and the terminal of the semiconductor element connected to the first lower surface wiring pattern.

7. A switch as claimed in any one of claims 1 to 6, wherein the pressing member is a magnet, and the semiconductor element is a magnetic sensor that detects changes in the magnetic field caused by movement of the magnet in the pressing direction.

8. The switch according to claim 7, further comprising a contact prevention portion that prevents contact between the lower surface of the magnet and the movable contact.

9. The switch according to claim 8, wherein a portion of the magnet is located at the same position as the outer edge of the housing portion in a plan view.

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