Mechanically coupling multiple wires to improve robustness of wire bond interconnections against mechanical vibrations and shock

Abstract

An electronics module and a method of manufacture. A first wire is bonded between a first conductive surface and a second conductive surface and proximate a second wire. The first wire has a first eigenfrequency. The first wire is mechanically coupled to the second wire via a coating to form a coating coupled wire. The coating coupled wire has a second eigenfrequency greater than the first eigenfrequency of the first wire.

Description

MECHANICALLY COUPLING MULTIPLE WIRES TO IMPROVE ROBUSTNESS OF WIRE BOND INTERCONNECTIONS AGAINST MECHANICAL VIBRATIONS ANDSHOCKCROSS REFERENCE TO RELATED APPLICATIONSThis application claims the benefit of an earlier filing date from U.S. Provisional Application Serial No. 63 / 556,150, filed February 21, 2024.BACKGROUND

[0001] In the resource recovery industry, a drill string is used to drill a borehole in a formation. The drill string includes a drill bit for drilling into the formation and an electronics system that is used to control various aspects of the drilling operation. The electronic system is made up from multiple electronic modules. Wire bond interconnections are used for multiple applications inside the electronic package, e.g., to connect substrates or printed circuit boards to pins for making electrical connections to the tool- wiring and other electronic modules. Electronic packages using organic pottings or moldings are typically unstable in harsh environments such as in drilling operations and / or at high temperatures (T>125°C). As the drill bit rotates to drill the borehole, shocks and vibrations caused by drilling can be transmitted along the drill string. Vibrations at frequencies above 1 kHz can be especially damaging to the electronics. For example, in the presence of high-frequency torsional oscillations (HFTO), metal-metal shocks, insufficient fixturing, etc., vibrations with frequencies higher than 1 kHz can occur, thereby exciting resonant oscillations of the wire bonds. Due to the high quality factors of the wire bond eigen-resonances, the wire bonds rupture or disconnect from their pins, leaving the electronic package non-functional. Therefore, there is a need for a high-temperature stable electronics package that can withstand high frequency vibrational forces induced while drilling by either introducing damping systems to lower quality factors or by shifting resonances to frequencies well above typical excitation due to effects described above.SUMMARY

[0002] Disclosed herein is a method of manufacturing an electronics module. The method includes bonding a first wire between a first conductive surface and a second conductive surface and proximate a second wire, wherein the first wire has a first eigenfrequency, and mechanically coupling the first wire to the second wire via a coating toform a coating coupled wire, wherein the coating coupled wire has a second eigenfrequency greater than the first eigenfrequency of the first wire.

[0003] Also disclosed herein is an electronics module for use in a downhole tool. The electronics module includes a first wire bonded between a first conductive surface and a second conductive surface, the first wire having a first eigenfrequency, a second wire proximate the first wire, and a coating that mechanical couples the first wire to the second wire to form a coating coupled wire, wherein the coating coupled wire has a second eigenfrequency greater than the first eigenfrequency.BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:

[0005] Figure 1 shows a drill string in an illustrative embodiment;

[0006] Figure 2 shows an electronics module usable in a downhole device of the drill string;

[0007] Figure 2A shows an interior cross-sectional view of the electronics module;

[0008] Figure. 3 shows a side view of the connecting bond wire;

[0009] Figure 3 A shows a top view of a single coated bond wire;

[0010] Figures 4A-4F shows top views of bond wires in various coupling configurations for mechanically coupling bond wires to alter a vibration frequency.

[0011] Figures 5A-5C show top views of two bond wires coupled to each other in various coupling configurations;

[0012] Figures 6A-6C show front, side and top views, respectively, of a wire pair coupled by a coating in an illustrative embodiment.

[0013] Figure 7 shows two diagrams illustrating oscillation directions of the composite ribbon structure formed by the bonding shown in FIG. 6;

[0014] Figures 8A-8C show front, side and top views, respectively, of a wire triplet coupled by a coating in an illustrative embodiment; and

[0015] Figures 9A-9C show front, side and top views, respectively, of a crossed wire pair coupled by a coating in an illustrative embodiment.DETAILED DESCRIPTION

[0016] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0017] Referring to FIG. 1, a drilling system 100 including a drill string 102 is shown in an illustrative embodiment. While a land-based rig is shown, these concepts and the methods are equally applicable to offshore drilling systems. The drill string 102 can be suspended from a rig 104 and may include jointed tubulars 106 or coiled tubing for drilling a borehole 108 in a rock formation 110. The drill string 102 comprises an inner bore to flow a drilling fluid from the surface location 105 to a drill bit 112 at the bottom of the drill string 102 and back to the surface through an annulus between the wall of the borehole 108 and the drill string 102. The drill string 102 includes a bottomhole assembly (BHA) 114 uphole of the drill bit 112. In one configuration, the BHA 104 includes the drill bit 112 and a downhole tool. The downhole tool may be a sensor sub 116 a bidirectional telemetry device 118, a formation evaluation (FE) device 120, a steering unit 122 and rotary power devices such as drilling motors 124. The sensor sub 116 may include sensors for measuring near-bit direction (e.g., BHA azimuth and inclination, BHA coordinates, etc.) and sensors and tools for making rotary directional surveys. The drilling system 100 can also include information processing devices such as a surface controller 126 and / or a downhole controller 128. Communication between the surface location 105 and the BHA 114 can use uplinks and / or downlinks generated by a mud-driven telemetry device, such as a mud pulser and / or conveyed using hard wires (e.g., electrical conductors, fiber optics), acoustic signals, EM or RF. One or more electronics modules 130 incorporated into the BHA 114 or other component of the drill string 102 can include components as necessary to provide for data storage and processing, communication and / or control of the BHA 114. These components may be disposed in suitable compartments formed in or on the drill string 102. Exemplary electronics in the electronics module include printed circuit board assemblies (PCBA) and multiple chip modules (MCMs).

[0018] Figure 2 shows an electronics module 200 usable at the downhole device 106 of the drill string 100. The electronics module 200 includes a housing 202 and a pin section 204 through which a connection can be made to an external device. Figure 2A shows an interior cross-sectional view 210 of the electronics module 200. The housing 202 includes an electronics package 212 having a substrate 214 and a die 216 attached to the substrate 214. The die 216 can include a chip assembly or other electronics. A bond wire 218 forms aconnection between the substrate 214 and a pin of the pin section 204 of the housing 202. A bond wire is typically made from gold, copper, silver, aluminum, or alloys, such as aluminum alloy. Another bond wire 220 can connect the substrate 214 to a pin on the die 216.Although only one bond wire 218 is shown connecting the substrate 214 to the pin section 204 of the housing 202, it is to be understood that multiple bond wires can be used for making multiple connections between the substrate 214 and pins of the pin section 204 of the housing 202. Additionally, there can be multiple bond wires 220 that connect from the substrate 214 to the die 216. The electronics module in FIG. 2A can be a Multi Chip Module (MCM). MCMs use ceramic substrates to build the circuit board and comprise electronic components. Electronic components may be active or passive components. In embodiments electronic components may be built on or within the ceramic substrate. Electronics components are built from semi-conductor materials like Silicon and / or Germanium or alternative materials that are capable of surviving temperatures up to 150° C. to 175° C., 175° C. to 200° C„ 200° C. to 225° C„ 225° C. to 250° C„ or 250° C. to 275° C. MCMs in high temperature applications can avoid using organic materials. Semiconductor components are often not soldered to the metallization of the ceramics substrate but interconnected by wirebonding or using adhesives. Semiconductor components may be wire-bonded to the substrate as a so called “bare die”. Wire-bonding is a welding technique not using flux material. The coefficient of thermal expansion may be taken into account when selecting materials to build electronic components to be bonded to ceramic substrates. Electronic components are attached to at least one side of the ceramic substrate. In alternative embodiments electronics components are attached to both sides of the ceramic substrate (front side and backside). MCMs are encapsulated in housings to protect the substrate as well as the electronics components from environments, which may lead to degradation of materials used in MCMs (environmental gases, such as, for example, gases originating from organic materials used in potting material, solder, isolation material or polymer seals). The MCM housings are in many applications hermetically sealed by either closing the housing using welding technologies or sealing the housing by using metal seals. Electronics boards comprising circuit boards in downhole applications may reside in the downhole tool inside a cavity in a collar closed by a hatch cover or a sleeve. Alternatively, the circuit board may reside inside a container inside the inner bore of a downhole tool through which the drilling fluid travels downhole (probe based downhole tool). Electronic boards (with or without housings) may be either fixedly connected inside the downhole tool (collar, container in inner bore (probe), mega frame) by using a fixation member, which may be a screw, an adhesive, or a clamp.The fixation can include a biasing member such as a spring or an elastomeric material which may be located somewhere inside the cavity in which the electronic board or electronic housing resides. The biasing member compensates for vibration and shocks generated during the downhole operation of the downhole tool.

[0019] Figure 3 shows a side view of the electrically connecting bond wire 218. The bond wire 218 extends from point A at the pin section 204 to point B at the electronics package 212. The bond wire 206 forms an arc between point A and point B. Point A is located at a height h above point B. A horizontal distance between point A and point B is denoted by x. The vertical height of the bond wire hwis measured between point B and a top of the arc of the bond wire 218. The length of the bond wire 218 is denoted by Zw. For illustrative purposes, the height h is about 2.0 millimeters (mm), the horizontal distance x is about 5.0 mm, the vertical height hwis about 2.5 mm and the bond wire length lwis about 6.0 mm. At the connection points A or B, the bond wire 218 is welded using common wire bonding techniques, such as ball bonding, wedge bonding, or compliant bonding. At the connection points the wire bond forms a heel 220. A simulation of this bond wire indicates that it has a resonance at a frequency of about 2.7 kHz (resonance frequency or eigenfrequency). The resonance frequency of the bond wire is determined by the stiffness and the length of the bond wire 218. Only very limited excitation occurs at frequencies significantly less or greater than this resonance frequency. The resonance frequency (~2.7 kHz) is within a frequency range of oscillations along the drill string 100, originating from the cutting process of the rock formation. The vibration may be lateral, axial or torsional vibrations, such as high frequency torsional oscillations (HFTO) which are typically above of 50 Hz. However, the bond wire 218 is susceptible to rupture due to the vibrations in the drill string 100 that occur at the eigenfrequency and higher-order resonance frequencies. In an embodiment, the resonance frequency of a bond wire may be between 1 kHz and 3 kHz, between 2 kHz and 5 kHz, between 2 kHz and 10 kHz, or between 2 kHz and 20 kHz. The eigenfrequency (resonance frequency) may be the fundamental eigenfrequency (fundamental frequency).

[0020] A coating can be deposited on the bond wire 218 to form a coating-wire compound, referred to herein as a coated bond wire. The coated bond wire has different properties, especially a different eigenfrequency, different quality factor of the resonant eigenfrequency, and different mechanical properties (e.g., tensile strength and elastic modulus). The coating increases the stiffness of the bond wire and correspondingly affects its the resonance frequency. In various embodiments, the coating 406 is made of a parylenecoating. Parylene has a density of about 1.1 - 1.8 g / cm3, a Young’s module of about 2.6 to 3.0 GigaPascals (GPa) and a Poisson ratio of 0.35 to 0.4. The eigenfrequency of the bond wire changes with the thickness of the coating. For a single uncoated bond wire (i.e., bond wire without a coating), the eigenfrequency is about 2.8 kHz. For a coated bond wire having a coating 406 with a thickness of about 25 micrometers (pm), the eigenfrequency is about 3.0 kHz. For a single coated bond wire having a coating with a thickness of about 60 pm, the eigenfrequency is about 4.0 kHz. In other embodiments, the coating can be made of a material from a group of Poly(para-Xylylen) materials, from a polymer from the group of poly siloxanes, from an epoxy resin, etc. The coating may be applied to a bond wire by vapor deposition or by spraying.

[0021] FIG. 3 A shows a top view 300 of a single bond wire in a coating configuration. The bond wire 302 includes a first end 304 and a second end 306. The first end connects to a first conductive surface (first contact pad 308) and the second end 306 connects to a second conductive surface (second contact pad 310). A coating 305 coats the bond wire 306 between the first end 304 and the second end 306. The coating 305 may coat the entire bond wire 306 from the first end 304 to the second end 306, or may coat only a portion of the bond wire, such as 30%, 50%, or 80% of the length L of the bond wire. In other embodiments (shown, for example, in Figures 4A-4F and 5A-5C), a coating can be applied to two or more bond wires. An entire coating of the bond wire included the heels 220, which stabilizes the region where the bond wire is bonded to the connection points.

[0022] Figure 4A shows a top view 400 of two bond wires in a first connecting configuration, which increases the eigenfrequency of the resulting mechanically coupled bond wire system. Instead of having only one bond wire, Figure 4A includes a first bond wire 403 (first bond wire) and a second bond wire 404 (second bond wire), both of which connect to a first conductive surface (first contact pad 401) and a second conductive surface (second contact pad 402). A coating 405 of sufficient thickness is deposited on both the first bond wire 403 and the second bond wire 404 along an entire length of the first bond wire 403 and the second bond wire 404, thereby creating a mechanical connection or mechanical coupling between the first bond wire 403 and the second bond wire 404. Individually, both the first bond wire 403 and the second bond wire 404 have a resonance eigenfrequency fres(first eigenfrequency). After coupling the bond wires, the mechanically coupled system possesses an eigenfrequency (second eigenfrequency) which is higher than the first eigenfrequency of the single bond wires fresand which lies outside the range of vibration frequencies along the drill string 100. The second eigenfrequency of the coupled bond wiresis also significantly higher compared to the eigenfrequency of a single coated wire with identical thickness of the coating. The coupled bond wire pair also has a mechanical strength that is in at least one direction greater than the mechanical strength of a single bond wire and / or an elastic module that is greater than the elastic module of a single bond wire. The first eigenfrequency may be a first fundamental eigenfrequency and the second eigenfrequency may be a second fundamental eigenfrequency. In an embodiment coating may be deposited on only a portion of the bond wires, such as 30%, 50%, or 80% of the length of the bond wires 403 or 404. In one more embodiments, the length of the first bond wire 403 coated by the coating may be different to the length of the second bond wire 404 coated by the coating. The first bond wire 403 may have the same length as the second bond wire 404 or may have a different length. The first bond wire 403 has a first diameter and the second bond wire 404 has a second diameter. The first diameter may be the same as the second diameter or the first diameter may be different than the second diameter. A typical bond wire diameter is in the range of 20 pm to 100 pm. Depending on the properties of the first and second bond wire the eigenfrequency may be the same or may be different. Same properties for the first bond wire 403 and the second bond wire 404 result in the same eigenfrequency for the first bond wire and the second bond wire.

[0023] It is understood that the same concept can be applied to various interconnection configurations. In Figure 4B, the first bond wire 403 connects between a first single-wire contact pad 406 and the second contact pad 402 while the second bond wire 404 connects between a second single-wire contact pad 407 and the same second contact pad 402. In Figure 4C, the first bond wire 403 connects between a first single-wire contact pad 406 and a third single-wire contact pad 408, while the second bond wire 404 connects between a second single-wire contact pad 407 and a fourth single-wire contact pad 409. Although, FIGS. 4A, 4B and 4C show a coupling between only two bond wires, it is understood that more than two bond wires can be coupled together by the coating shown in the figures. As an example, the same coupling configurations as in FIGS. 4A, 4B and 4C are shown in FIGS. 4D, 4E and 4F with a first bond wire, a second bond wire and a third bond wire. In FIG. 4D, three bond wires extend between two contact pads (a first contact pad and a second contact pad). In FIG. 4E, each bond wire is connected to an individual single-wire contact pad at one end and all three are connected to a second contact pad at the other end. In FIG. 4F, each bond wire is connected to an individual single-wire contact pad at one end as well as an individual single-wire contact pad at the other end.

[0024] In order to mechanically couple the bond wires and increase the eigenfrequency, it is not necessary to coat the bond wires completely. Also, a local mechanical coupling can be sufficient. Figure 5A shows a top view 500 of two bond wires in a first coupling configuration for coupling bond wires to alter a resonance frequency. The first bond wire 502 is connected at one end to a first pin Al of the substrate 212 (FIG. 2) and at an opposite end to a first pin B 1 of the pin section 204. The second bond wire 504 is connected at one end to a second pin A2 of the substrate 214 and at an opposite end to a second pin B2 of the pin section 204. Individually, both the first bond wire 502 and the second bond wire 504 have a eigenfrequency fres. Coating 406 is deposited on both the first bond wire 502 and the second bond wire 404 along an entire length of the first bond wire and the second bond wire 504, or at least along 30%, 50%, or 80% of the length of the bond wire, thereby creating a mechanical connection or mechanical coupling between the first bond wire 502 and the second bond wire 504. Although a first and second bond wires may be coated along the entire length of the first and second bond wire, the coupling between the first and second bond wire may be formed only along a limited length interval of the first and second bond wire. The length interval may be 11% to 50%, 11% to 80%, 11% to 95%, or 11% to 100% of the bond wires entire length L. Figure 5B shows a top view 510 of the bond wires in a second coupling configuration. In the second coupling configuration, a single dot of coating 506 is applied to bind the first bond wire 502 to the second bond wire 504 at a single local location or local spot along the first bond wire 502 and the second bond wire 504. The local spot may extend along around 0.5% to 10% of the length L of the bond wire. Figure 5C shows a top view 512 of the bond wires in a third coupling configuration. In the third bonding configuration, a plurality of dots of coating 506 are used to couple the first bond wire 502 to the second bond wire 504. Each dot is at a single local spot along the first bond wire 502 and the second bond wire 504. Although FIGS. 5 A, 5B and 5C show a coupling between only two bond wires, it is understood that more than two bond wires can be coupled together by the coating shown in the figures.

[0025] In Figures 5A, 5B and 5C, upon coupling the bond wires to form the coupled bond wire pair including the first bond wire 502 and the second bond 504, a eigenfrequency of the coupled bond wire pair is higher than the eigenfrequency of either the first bond wire 502 (i.e., as an uncoated bond wire) and the second bond wire 504 (i.e., as an uncoated bond wire), which results in the eigenfrequency of the coupled bond wire pair being outside of the range of vibration frequencies typically occurring along the drill string 100. In variousembodiments, the coating 506 is made of a parylene coating but can be also made of e.g., silicone or epoxy adhesives. The coating is made from an electrically nonconductive material.

[0026] Figure 6A is a front view 600 showing a cross-section of a bond wire pair coupled by a coating in an illustrative embodiment. The coating ensures electrical isolation between the bond wires. The bond wire pair includes the first bond wire 502 and the second bond wire 504. In various non-limiting embodiments, the diameter of each bond wire is 50 pm and the center-to-center distance (cc) is 125 pm. The thickness t of the (parylene) coating 506 is 60 pm. In one embodiment the diameter of each bond wire is 50 pm, the center-to- center distance is 100 pm and the thickness t of the coating 506 is 50 pm. In one more embodiments, the diameter of each bond wire is 50 pm, the center-to-center distance is 60 pm and the thickness t of the coating 506 is 15 pm. In yet another embodiment, the diameter of each bond wire is 50 pm, the center-to-center distance is 250 pm and the thickness t of the coating 506 is 110 pm. An effect of the coating 506 is to raise the eigenfrequency of each bond wire to about 10 kHz. Although, two bond wires are shown in Figure 6A, any number of bond wires can be coupled to each other, in alternative embodiments. FIG. 6B shows a side view 610 of the bond wire pair. FIG. 6C shows a top view 612 of the bond wire pair. The bond wires are coupled together in a coating coupled parallel bond wire configuration or form a coating coupled parallel wired pair.

[0027] Figure 7 shows two diagrams illustrating oscillation directions of the parallel bond wire configuration formed by the coupling shown in FIG. 6. A first oscillation diagram 700 shows an out-of-plane oscillation 702 for which the eigenfrequency is 9.9 kHz. A second diagram 704 shows an in-plane oscillation 706 for which the eigenfrequency is 10 kHz.

[0028] Figure 8A is a front view 800 showing a cross-section of a bond wire triplet coupled by a coating in an illustrative embodiment. The bond wire triplet includes the first bond wire 502 and the second bond wire 504 and a third bond wire 802. The diameter of each bond wire is 50 pm and the center-to-center distance (cc) is 125pm. The thickness t of the (parylene) coating 506 is 60 pm. At this thickness, the coating 506 raises the eigenfrequency of the out-of plane oscillation mode of the bond wire triplet to about 13.2 kHz (out of plane resonances). The eigenfrequency is now at 10.1 kHz (in-plane oscillation) as this particular coupling does not affect the in-plane oscillation mode (in plane resonance frequency). FIG. 8B shows a side view 810 of the bond wire triplet. FIG. 8C shows a top view 812 of the bond wire triplet.

[0029] Figure 9A is a front view 900 of a cross-section of a coating coupled crossed bond wire pair. An uncoated first bond wire and an uncoated second bond wire are crossed (cross wire). The cross wire is coupled by a coating in an illustrative embodiment. The first bond wire 502 connects from pin Al to pin B2 and the second bond wire 504 connects from pin A2 to pin Bl. The pins B2 and B 1 and the pins Al and A2 may be on different electrical potentials or on same electrical potential or may carry different electrical signals or same electrical signals. The rotation (and crossing) of the bond wires relative to each other (by about 15 degrees) results in further suppression of out-of-plane oscillations once the coating is applied. For a coating 506 having a thickness of 60 pm, the eigenfrequency of the coating coupled crossed bond wires configuration is about 10.1 kHz (out-of-plane oscillation). The next oscillation mode (eigenfrequency) is found at about 10.3 kHz (in-plane oscillation). FIG. 9B shows a side view 910 of the crossed bond wire pair. FIG. 9C shows a top view 912 of the crossed bond wire pair.

[0030] By rotating the bond wires, the stiffness of the completed structure of coating coupled crossed bond wires is increased. The higher stiffness results in a higher eigenfrequency. In an illustrative example, for standard configuration of parallel, coated bond wires (coating coupled parallel bond wires), such as shown in Figures 6A, 6B, 6C, a eigenfrequency is about 9.9 kHz (for an out-of-plane oscillation). By rotating the bond wires relative to each other and crossing them (coating coupled crossed bond wires), the eigenfrequency is about 10.1 kHz (for the out-of-plane oscillation). In alternative embodiments, multiple bond wires can be crossed over each other to further increase the stiffness of the completed structure of coating coupled crossed bond wires and thereby further raise the eigenfrequency associated with the completed structure. The angle a between bond wires 502 and 504 at a crossing point 902 may be between 1 degree to 90 degrees. In an alternative embodiment, the angle may be between 5 degrees and 80 degrees. In one more embodiment, the angle may be between 10 and 70 degrees. In yet another embodiment, the angle may be between 10 and 50 degrees.

[0031] To achieve thicker coating thickness which facilitate the coupling of bond wires either in a coating coupled parallel bond wire configuration or in a coating coupled crossed bond wire configuration the coating may be applied in two layers. A first layer may be formed from a coating with low quality, including voids in the coating layer (void-rich layer). A thin second layer is applied on the first layer. The second layer is a high-quality coating from the same material that is void-free or substantially void-free. The second coating layer has a higher density than the first layer. The first layer can be formed requiringless time than the second layer due to the lower quality requirements. The first layer coupled the bond wires while the second layer protects the bond wire from chemical interaction with the environment which would lead to detrimental chemical processes, destroying or damaging the bond wires.

[0032] Set forth below are some embodiments of the foregoing disclosure:

[0033] Embodiment 1. A method of manufacturing an electronics module includes bonding a first wire between a first conductive surface and a second conductive surface and proximate a second wire, wherein the first wire has a first eigenfrequency, and mechanically coupling the first wire to the second wire via a coating to form a coating coupled wire, wherein the coating coupled wire has a second eigenfrequency greater than the first eigenfrequency of the first wire.

[0034] Embodiment 2. The method of any prior embodiment, wherein one of: (i) the second wire is bonded between the first conductive surface and the second conductive surface; (ii) the second wire is bonded between first conductive surface and a third conductive surface other than the second conductive surface; (iv) the second wire is bonded between a third surface and a fourth surface.

[0035] Embodiment 3. The method of any prior embodiment, further comprising coupling via the coating a third wire to the first wire and the second wire.

[0036] Embodiment 4. The method of any prior embodiment, further comprising coupling the first wire to the second wire with a center-to-center distance between the first wire and the second wire that is in a range of between about 25 micrometers to 250 micrometers.

[0037] Embodiment 5. The method of any prior embodiment, further comprising coupling the first wire to the second wire at one of: (i) a single local spot along the first wire and the second wire; (ii) multiple local spots along the first wire and the second wire; and (iii) along at least 11 % of an entire length of the first wire and the second wire.

[0038] Embodiment 6. The method of any prior embodiment, wherein a thickness of the coating is in a range between one of: (i) about 5 micrometers and 15 micrometers; (ii) about 16 micrometers and 30micrometers; (iii) about 31 micrometers and 50 micrometers; and (iv) about 51 micrometers and 300 micrometers.

[0039] Embodiment 7. The method of any prior embodiment, wherein a material of the coating is selected from at least one of: (i) a group of Poly(para-Xylylen); (ii) a polymer from the group of poly siloxanes; (iii) an epoxy resin; and (iv) a combination of an epoxy and a silicone.

[0040] Embodiment 8. The method of any prior embodiment, further comprising crossing the first wire over the second wire to form a cross wire and coupling the first wire to the second wire of the cross wire via the coating to for a coating coupled cross wire.

[0041] Embodiment 9. The method of any prior embodiment, wherein the first eigenfrequency is within a vibrational frequency range of a downhole tool and the second eigenfrequency is outside of the vibrational frequency range of the downhole tool.

[0042] Embodiment 10. The method of any prior embodiment, wherein the coating is applied by vapor deposition.

[0043] Embodiment 11. The method of any prior embodiment, wherein the coating includes a first layer and a second layer, wherein the density of the first layer is lower than the density of the second layer.

[0044] Embodiment 12. An electronics module for use in a downhole tool. The electronics module includes a first wire bonded between a first conductive surface and a second conductive surface, the first wire having a first eigenfrequency, a second wire proximate the first wire, and a coating that mechanical couples the first wire to the second wire to form a coating coupled wire, wherein the coating coupled wire has a second eigenfrequency greater than the first eigenfrequency.

[0045] Embodiment 13. The electronics module of any prior embodiment, wherein a center-to-center distance between the first wire and the second wire is in a range of between about 25 micrometers to 250 micrometers.

[0046] Embodiment 14. The electronics module of any prior embodiment, wherein the coating couples the first wire to the second wire at one of: (i) a single local spot along the first wire and the second wire; (ii) multiple local spots along the first wire and the second wire; and (iii) along at least 11% of an entire length of the first wire and the second wire.

[0047] Embodiment 15. The electronics module of any prior embodiment, wherein a thickness of the coating is in a range between one of: (i) 5 micrometers and 15 micrometers; (ii) about 16 micrometers and 30 micrometers; (iii) about 31 micrometers and 50 micrometers; and (iv) about 51 micrometers and 300 micrometers.

[0048] Embodiment 16. The electronics module of any prior embodiment, wherein a material of the coating is selected from at least one of: (i) a group of Poly(para-Xylylen) materials; (ii) a polymer from the group of poly siloxanes; (iii) an epoxy resin; and (iv) a combination of an epoxy and a silicone.

[0049] Embodiment 17. The electronics module of any prior embodiment, wherein the first wire crosses over the second wire to form a coating coupled cross wire and the coating covers at least partially the coating coupled cross wire.

[0050] Embodiment 18. The electronics module of any prior embodiment, wherein the first eigenfrequency is within a vibrational frequency range of the downhole tool and the second eigenfrequency is outside of the vibrational frequency range of the downhole tool.

[0051] Embodiment 19. The electronics module of any prior embodiment, wherein the coating includes a first layer and a second layer, wherein the first layer has a lower density than the second layer.

[0052] Embodiment 20. The electronics module of any prior embodiment, wherein the first wire is located parallel to the second wire to form a coating coupled parallel wire and the coating covers at least partially the coating coupled parallel wire.

[0053] The use of the terms “a” and “an” and “the” and similar referents in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. Further, it should be noted that the terms “first,” “second,” and the like herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The terms “about”, “substantially” and “generally” are intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application. For example, “about” and / or “substantially” and / or “generally” can include a range of ± 8% of a given value.

[0054] While the invention has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the claims. Also, in the drawings and the description, there have been disclosed exemplary embodiments of the invention and, although specific terms may have been employed, they are unless otherwise stated used in a generic and descriptive sense only and not for purposes of limitation, the scope of the invention therefore not being so limited.

Claims

CLAIMSWhat is claimed is:

1. A method of manufacturing an electronics module, comprising: bonding a first wire between a first conductive surface and a second conductive surface and proximate a second wire, wherein the first wire has a first eigenfrequency; and mechanically coupling the first wire to the second wire via a coating to form a coating coupled wire, wherein the coating coupled wire has a second eigenfrequency greater than the first eigenfrequency of the first wire.

2. The method of claim 1, wherein one of: (i) the second wire is bonded between the first conductive surface and the second conductive surface; (ii) the second wire is bonded between first conductive surface and a third conductive surface other than the second conductive surface; (iv) the second wire is bonded between a third surface and a fourth surface.

3. The method of claim 1, further comprising coupling via the coating a third wire to the first wire and the second wire.

4. The method of claim 1, further comprising coupling the first wire to the second wire with a center-to-center distance between the first wire and the second wire that is in a range of between about 25 micrometers to 250 micrometers.

5. The method of claim 1, further comprising coupling the first wire to the second wire at one of: (i) a single local spot along the first wire and the second wire; (ii) multiple local spots along the first wire and the second wire; and (iii) along at least 11 % of an entire length of the first wire and the second wire.

6. The method of claim 1, wherein a thickness of the coating is in a range between one of: (i) about 5 micrometers and 15 micrometers; (ii) about 16 micrometers and 30micrometers; (iii) about 31 micrometers and 50 micrometers; and (iv) about 51 micrometers and 300 micrometers.

7. The method of claim 1, wherein a material of the coating is selected from at least one of: (i) a group of Poly(para-Xylylen); (ii) a polymer from the group of poly siloxanes; (iii) an epoxy resin; and (iv) a combination of an epoxy and a silicone.

8. The method of claim 1, further comprising crossing the first wire over the second wire to form a cross wire and coupling the first wire to the second wire of the cross wire via the coating to for a coating coupled cross wire.

9. The method of claim 1, wherein the first eigenfrequency is within a vibrational frequency range of a downhole tool and the second eigenfrequency is outside of the vibrational frequency range of the downhole tool.

10. The method of claim 1, wherein the coating is applied by vapor deposition.

11. The method of claim 1, wherein the coating includes a first layer and a second layer, wherein the density of the first layer is lower than the density of the second layer.

12. An electronics module for use in a downhole tool, comprising: a first wire bonded between a first conductive surface and a second conductive surface, the first wire having a first eigenfrequency; a second wire proximate the first wire; and a coating that mechanical couples the first wire to the second wire to form a coating coupled wire , wherein the coating coupled wire has a second eigenfrequency greater than the first eigenfrequency.

13. The electronics module of claim 12, wherein a center-to-center distance between the first wire and the second wire is in a range of between about 25 micrometers to 250 micrometers.

14. The electronics module of claim 12, wherein the coating couples the first wire to the second wire at one of: (i) a single local spot along the first wire and the second wire; (ii) multiple local spots along the first wire and the second wire; and (iii) along at least 11 % of an entire length of the first wire and the second wire.

15. The electronics module of claim 12, wherein a thickness of the coating is in a range between one of: (i) 5 micrometers and 15 micrometers; (ii) about 16 micrometers and 30 micrometers; (iii) about 31 micrometers and 50 micrometers; and (iv) about 51 micrometers and 300 micrometers.

16. The electronics module of claim 12, wherein a material of the coating is selected from at least one of: (i) a group of Poly(para-Xylylen) materials; (ii) a polymer from the group of poly siloxanes; (iii) an epoxy resin; and (iv) a combination of an epoxy and a silicone.

17. The electronics module of claim 12, wherein the first wire crosses over the second wire to form a coating coupled cross wire and the coating covers at least partially the coating coupled cross wire.

18. The electronics module of claim 12, wherein the first eigenfrequency is within a vibrational frequency range of the downhole tool and the second eigenfrequency is outside of the vibrational frequency range of the downhole tool.

19. The electronics module of claim 12, wherein the coating includes a first layer and a second layer, wherein the first layer has a lower density than the second layer.

20. The electronics module of claim 12, wherein the first wire is located parallel to the second wire to form a coating coupled parallel wire and the coating covers at least partially the coating coupled parallel wire.

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