Refrigerator

The integration of a thermoelectric module assembly with a heat sink, cooling sink, and heat dissipation duct, along with a polyethylene foam cover, addresses heat dissipation and gap issues in refrigerators, improving cooling efficiency and reducing noise and airflow.

WO2025178218A1PCT designated stage Publication Date: 2025-08-28SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2024/020917
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-30
Filing Date
2024-12-23
Publication Date
2025-08-28

AI Technical Summary

Technical Problem

Existing refrigerators using thermoelectric elements for cooling face challenges in efficiently dissipating heat and minimizing gaps between the thermoelectric module assembly and the refrigerator body, leading to noise and airflow issues.

Method used

A thermoelectric module assembly is integrated with a heat sink, cooling sink, and heat dissipation duct, coupled to the refrigerator's upper surface, with a module plate and fastening members to minimize gaps and enhance heat dissipation, using a side cover member made of polyethylene foam to cover any remaining gaps.

Benefits of technology

The solution effectively prevents airflow and noise by minimizing gaps between the thermoelectric module assembly and the refrigerator body, enhancing cooling efficiency and reducing noise and airflow disturbances.

✦ Generated by Eureka AI based on patent content.

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Abstract

This refrigerator comprises: a main body; a storage chamber formed inside the main body; and a thermoelectric module assembly. The thermoelectric module assembly comprises: a module plate; a thermoelectric element having a heat generation unit and a heat absorption unit; a heat dissipation sink coupled to the module plate so as to come into contact with the heat generation unit; a cooling sink coupled to the module plate so as to come into contact with the heat absorption unit; and a heat dissipation duct coupled to the module plate so as to dissipate heat from the heat dissipation sink. The module plate has a plate coupling unit provided to be coupled to the upper portion of the main body, and a lower end portion of the side surface of the heat dissipation duct is positioned below a virtual plane extending from the bottom surface of the plate coupling unit.
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Description

refrigerator

[0001] The present disclosure relates to a refrigerator, and more particularly, to a refrigerator having a thermoelectric element for cooling a storage compartment.

[0002] A refrigerator is a home appliance that has a main body having a storage compartment and a cold air supply device that supplies cold air to the storage compartment to keep food fresh.

[0003] A thermoelectric element can be used as a cooling device in a refrigerator. The thermoelectric element may have a heat generating element formed on one side and a heat absorbing element formed on the opposite side. When current is applied to the thermoelectric element, heat generation occurs in the heat generating element and heat absorption occurs in the heat absorbing element.

[0004] The refrigerator may include a heat sink in contact with one side of the thermoelectric element to increase the efficiency of cooling through the thermoelectric element, a cooling sink in contact with the other side of the thermoelectric element, and a heat dissipation duct for dissipating heat from the heat sink. The thermoelectric element, the heat dissipation sink, the cooling sink, and the heat dissipation duct may be assembled integrally to form a thermoelectric module assembly. The thermoelectric module assembly may be coupled to the upper surface of the refrigerator body.

[0005] One aspect of the present disclosure discloses a refrigerator comprising a thermoelectric module assembly having a thermoelectric element, a heat sink, a cooling sink, and a heat dissipation duct.

[0006] One aspect of the present disclosure discloses a refrigerator having a thermoelectric module assembly coupled to an upper surface of a body.

[0007] One aspect of the present disclosure discloses a refrigerator in which no gap occurs or is minimized between a thermoelectric module assembly and a top surface of a body.

[0008] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0009] According to one embodiment of the present disclosure, a refrigerator includes a main body; a storage compartment formed inside the main body; and a thermoelectric module assembly including a module plate, a thermoelectric element having a heat generating portion and a heat absorbing portion, a heat sink coupled to the module plate so as to contact the heat generating portion, a cooling sink coupled to the module plate so as to contact the heat absorbing portion, and a heat dissipation duct coupled to the module plate so as to radiate heat from the heat sink; wherein the module plate includes a plate coupling portion provided to be coupled to an upper portion of the main body, and a lower end of a side surface of the heat dissipation duct is positioned below an imaginary plane extending from a bottom surface of the plate coupling portion.

[0010] The bottom surface of the above plate joint can contact the upper surface of the above main body.

[0011] The lower part of the side of the above heat dissipation duct can contact the upper surface of the above body.

[0012] The above refrigerator may further include a fastening member that fastens the plate joint to the upper portion of the main body.

[0013] The upper wall of the main body includes an installation opening to connect the storage room and the exterior of the main body, and the plate joint can be coupled around the installation opening on the upper surface of the main body.

[0014] The module plate may include a plate base having a module plate opening in which the thermoelectric element is arranged, the heat sink may be coupled to one side of the plate base, and the cooling sink may be coupled to the opposite side of the plate base.

[0015] The above module plate includes a connecting portion extending upward from a rim of the plate base, and the plate joint portion can extend horizontally from an upper end of the connecting portion.

[0016] The above installation hole is formed on the left side based on the front-back center line (X) of the upper surface of the main body, and the lower part of the right side of the heat dissipation duct according to the left-right center line (Y) of the upper surface of the main body can be located below an imaginary plane extending from the bottom surface of the plate joint.

[0017] The above installation hole is formed on the right side based on the front-back center line (X) of the upper surface of the main body, and the lower part of the left side of the heat dissipation duct according to the left-right center line (Y) of the upper surface of the main body can be located below an imaginary plane extending from the bottom surface of the plate joint.

[0018] The above installation hole is formed in the center along the left-right direction of the upper surface of the main body, and the lower part of the right side of the heat dissipation duct along the left-right direction center line (Y) of the upper surface of the main body and the lower part of the left side of the heat dissipation duct along the left-right direction center line (Y) of the upper surface of the main body can be positioned below an imaginary plane extending from the bottom surface of the plate joint.

[0019] The lower end of the left side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body may be positioned a first length lower than an imaginary plane extending from the bottom surface of the plate joint, and the lower end of the right side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body may be positioned a second length lower than an imaginary plane extending from the bottom surface of the plate joint.

[0020] The above installation hole is formed on the left side based on the front-back center line (X) of the upper surface of the main body, and the second length may be greater than the first length.

[0021] The above installation hole is formed on the right side based on the front-back center line (X) of the upper surface of the main body, and the first length may be greater than the second length.

[0022] The above installation hole is formed at the center of the left and right directions of the upper surface of the main body, and the first length and the second length may be the same.

[0023] The above installation hole is formed on the rear side based on the left-right center line (Y) of the upper surface of the main body, and the lower part of the front side of the heat dissipation duct according to the front-back center line (X) of the upper surface of the main body can be located below an imaginary plane extending from the bottom surface of the plate joint.

[0024] In another aspect, according to one embodiment of the present disclosure, a refrigerator includes a main body; a storage compartment formed inside the main body; a module plate; a thermoelectric element having a heat generating portion and a heat absorbing portion; a heat sink coupled to the module plate so as to contact the heat generating portion; a cooling sink coupled to the module plate so as to contact the heat absorbing portion; and a heat dissipation duct coupled to the module plate so as to radiate heat from the heat sink, the refrigerator including a thermoelectric module assembly coupled to an upper portion of the main body; and a side cover member provided between a lower portion of a side surface of the heat dissipation duct and an upper surface of the main body so as to cover a gap between the lower portion of a side surface of the heat dissipation duct and an upper surface of the main body.

[0025] The above side cover member may be formed of polyethylene foam.

[0026] The above cover member can be attached to the lower part of the side of the above heat dissipation duct.

[0027] The above module plate includes a plate joint portion that is arranged to be joined to the upper portion of the main body, and the lower end of the side of the heat dissipation duct can be positioned below an imaginary plane extending from the bottom surface of the plate joint portion.

[0028] The upper wall of the main body includes an installation opening to connect the storage room and the exterior of the main body, and the plate joint can be coupled around the installation opening on the upper surface of the main body.

[0029] According to one embodiment of the present disclosure, when the thermoelectric module assembly is coupled to the upper surface of the main body, a gap between the thermoelectric module assembly and the upper surface of the main body is not generated or is minimized, thereby preventing flow and noise of the thermoelectric module assembly.

[0030] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0031] FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure.

[0032] FIG. 2 is a drawing showing the doors of a refrigerator in an open state according to one embodiment of the present disclosure.

[0033] FIG. 3 is a drawing illustrating a storage compartment of a refrigerator according to one embodiment of the present disclosure.

[0034] FIG. 4 is a schematic cross-sectional side view of a refrigerator according to one embodiment of the present disclosure.

[0035] Figure 5 is a cross-sectional view taken along line I-I of Figure 2.

[0036] FIG. 6 is a drawing showing a top cover and a thermoelectric module assembly separated from the main body of a refrigerator according to one embodiment of the present disclosure.

[0037] FIG. 7 is a drawing illustrating a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module according to one embodiment of the present disclosure.

[0038] FIG. 8 is a bottom perspective view illustrating a heat dissipation duct cover, a heat dissipation duct body, and a thermoelectric module according to one embodiment of the present disclosure.

[0039] FIG. 9 is a perspective view illustrating an exploded view of a thermoelectric module according to one embodiment of the present disclosure.

[0040] FIG. 10 is a cross-sectional view illustrating a main portion of a structure in which a thermoelectric module assembly is coupled to an upper wall of a main body according to one embodiment of the present disclosure.

[0041] FIG. 11 is a cross-sectional view showing a state in which a thermoelectric module assembly according to one embodiment of the present disclosure is separated from the upper wall of the main body, and is a cross-sectional view along the center line (Y) in the left-right direction of the upper surface of the main body.

[0042] FIG. 12 is a cross-sectional view showing a state in which a thermoelectric module assembly according to one embodiment of the present disclosure is coupled to an upper wall of a main body, and is a cross-sectional view along the center line (Y) in the left-right direction of the upper surface of the main body.

[0043] FIG. 13 is a drawing showing the thermoelectric module assembly with the plate joint of the module plate in FIG. 12 deleted.

[0044] Figure 14 is an enlarged view of the “AA” portion of Figure 12.

[0045] Figure 15 is an enlarged view of the “BB” portion of Figure 12.

[0046] FIG. 16 is a drawing illustrating a thermoelectric module assembly according to one embodiment of the present disclosure.

[0047] FIG. 17 is a drawing illustrating a side cover member according to one embodiment of the present disclosure.

[0048] FIG. 18 is a schematic drawing of the upper surface of the main body and the thermoelectric module assembly according to one embodiment of the present disclosure.

[0049] FIG. 19 is a schematic drawing of the upper surface of the main body and the thermoelectric module assembly according to one embodiment of the present disclosure.

[0050] FIG. 20 is a schematic drawing of the upper surface of the main body and the thermoelectric module assembly according to one embodiment of the present disclosure.

[0051] FIG. 21 is a side view of a thermoelectric module assembly coupled to an upper surface of a main body according to one embodiment of the present disclosure.

[0052] It should be understood that the various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or substitutes of the embodiments.

[0053] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0054] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0055] In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0056] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0057] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0058] In addition, terms such as 'front', 'rear', 'top', 'bottom', 'side', 'left', 'right', 'upper', and 'lower' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0059] Terms such as "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the present disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0060] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0061] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0062] A refrigerator according to one embodiment may include a body.

[0063] The body may include insulation. The insulation may insulate the interior and exterior of the storage compartment so that the temperature inside the storage compartment can be maintained at a set temperature without being affected by the external environment of the storage compartment. In one embodiment, the insulation may include a foam insulation, such as polyurethane foam. In another embodiment, the insulation may additionally include a vacuum insulation in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation instead of the foam insulation.

[0064] A storage room can store various items such as food, medicine, and cosmetics, and the storage room can be formed so that at least one side is open for taking items in and out.

[0065] A refrigerator may include one or more storage compartments. When a refrigerator includes two or more storage compartments, each compartment may have a different purpose and be maintained at different temperatures. To achieve this, each storage compartment may be separated from the others by a partition wall containing insulation.

[0066] The storage room may be designed to maintain an appropriate temperature range depending on its intended use, and may include a "refrigerator," a "freezer," or a "variable temperature room," which are distinguished by their intended use and / or temperature range. A refrigerator may be maintained at a temperature appropriate for refrigerating items, and a freezer may be maintained at a temperature appropriate for freezing items. "Refrigeration" may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius. "Freezing" may mean cooling items to freeze them or keep them frozen, and for example, a freezer may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. A variable temperature room may be used as either a refrigerator or a freezer, at the user's option or not.

[0067] In addition to names such as "refrigerator," "freezer," and "variable temperature room," a storage room may also be called by various other names such as "vegetable room," "fresh room," "cooling room," and "ice room." The terms "refrigerator," "freezer," and "variable temperature room" used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.

[0068] In one embodiment, the refrigerator may include at least one door configured to open and close an open side of a storage compartment. The door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments. The door may be installed on the front of the main body in a pivotal or sliding manner.

[0069] The door may be configured to seal the storage compartment when the door is closed. The door may include insulation, similar to the body, to insulate the storage compartment when the door is closed.

[0070] According to one embodiment, the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.

[0071] The door inner panel may be provided with a gasket that seals the storage compartment by contacting the front of the body when the door is closed. The door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.

[0072] In one embodiment, the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door. The door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.

[0073] Depending on the arrangement of the door and storage compartment, refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.

[0074] According to one embodiment, the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.

[0075] The cold air supply device may include a system of machines, devices, electronic devices and / or combinations thereof that can generate cold air and guide the cold air to cool the storage room.

[0076] In one embodiment, the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant. To this end, the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle. In one embodiment, the cold air supply device can include a semiconductor, such as a thermoelectric element. The thermoelectric element can cool a storage compartment by generating heat and cooling through the Peltier effect.

[0077] According to one embodiment, the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.

[0078] The machine room may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room. The interior of the machine room may be configured to be connected to the exterior of the main body to dissipate heat from components placed within the machine room.

[0079] In one embodiment, the refrigerator may include a dispenser provided on the door to provide water and / or ice. The dispenser may be provided on the door so that it is accessible to a user without having to open the door.

[0080] In one embodiment, a refrigerator may include an ice-making device configured to produce ice. The ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.

[0081] According to one embodiment, the refrigerator may include a control unit for controlling the refrigerator.

[0082] The control unit may include a memory that stores or memorizes a program and / or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and / or data memorized in the memory.

[0083] Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator. Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator. Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.

[0084] The processor controls the overall operation of the refrigerator. The processor can control the components of the refrigerator by executing programs stored in memory. The processor may include a separate NPU that performs the operations of an artificial intelligence model. The processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like. The processor may generate control signals to control the operation of the cooling system. For example, the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.

[0085] Additionally, the processor may process user input of the user interface and control the operation of the user interface based on programs and / or data stored / stored in the memory. The user interface may be provided using an input interface and an output interface. The processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.

[0086] The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one subprocessor. The memory may include one or more memories.

[0087] In one embodiment, a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator. For example, the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor. Additionally, the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.

[0088] The communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.

[0089] The input interface may include keys, a touchscreen, a microphone, etc. The input interface may receive user input and transmit it to the processor.

[0090] The output interface may include a display, a speaker, etc. The output interface may output various notifications, messages, information, etc. generated by the processor.

[0091] Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the attached drawings.

[0092] FIG. 1 is a drawing illustrating a refrigerator according to an embodiment of the present disclosure. FIG. 2 is a drawing illustrating a state in which doors of a refrigerator according to an embodiment of the present disclosure are opened. FIG. 3 is a drawing illustrating a storage compartment of a refrigerator according to an embodiment of the present disclosure. FIG. 4 is a schematic side cross-sectional view of a refrigerator according to an embodiment of the present disclosure. FIG. 5 is a cross-sectional view taken along line I-I of FIG. 2. FIG. 6 is a drawing illustrating a top cover and a thermoelectric module assembly separated from a main body of a refrigerator according to an embodiment of the present disclosure. FIG. 7 is a drawing illustrating a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module according to an embodiment of the present disclosure. FIG. 8 is a bottom perspective view illustrating a heat dissipation duct cover, a heat dissipation duct body, and a thermoelectric module according to an embodiment of the present disclosure.

[0093] Referring to FIGS. 1 to 8, a refrigerator (1) may include a main body (100), storage chambers (11, 12, 13) formed inside the main body (100), and doors (21, 22, 23, 24) provided to open and close the storage chambers (11, 12, 13).

[0094] The main body (100) may include an inner case (170), an outer case (180) coupled to the outer side of the inner case (170), and an insulating material (190) provided between the inner case (170) and the outer case (180). The inner case (170) may form a storage chamber (11, 12, 13), and the outer case (180) may form the outer appearance of the main body (100). The insulating material (190) may be a urethane foam insulating material.

[0095] In another aspect, the main body (100) may include an upper wall (110), a lower wall (120), a left wall (130), a right wall (140), and a rear wall (150). The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may form an upper surface (111), a lower surface, a left surface, a right surface, and a rear wall of the main body (100), respectively.

[0096] The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may each be formed of an inner surface (170), an outer surface (180), and an insulating material (190). For example, the upper surface (111) of the upper wall (110) is formed by the outer surface (180), the lower surface of the upper wall (110) is formed by the inner surface (170), and an insulating material (190) may be provided on the inside of the upper wall (110).

[0097] The upper wall (110) may include an installation opening (115, FIG. 6). The storage chamber (11) and the exterior of the main body (100) may be connected through the installation opening (115). At least a portion of the thermoelectric module (500), which will be described later, may be placed inside the installation opening (115). The thermoelectric module (500) may be placed so as to penetrate the installation opening (115).

[0098] The storage compartments (11, 12, 13) can accommodate items. The storage compartments (11, 12, 13) can be formed to have an open front side so that items can be put in or taken out. The main body (100) can include a horizontal partition wall (160) that divides the storage compartments (11, 12, 13) into a first storage compartment (11) at the top and lower storage compartments (12, 13), and a vertical partition wall (161) that divides the lower storage compartments (12, 13) into a second storage compartment (12) and a third storage compartment (13). The first storage compartment (11) can be a refrigerator compartment, the second storage compartment (12) can be a freezer compartment, and the third storage compartment (13) can be a variable temperature room.

[0099] Doors (21, 22, 23, 24) can open and close storage rooms (11, 12, 13). The first door (21) and the second door (22) can open and close the first storage room (11), the third door (23) can open and close the second storage room (12), and the fourth door (24) can open and close the third storage room (13). The doors (21, 22, 23, 24) can be rotatably coupled to the main body (100).

[0100] The doors (21, 22, 23, 24) can be rotatably coupled to the main body (100) by hinges. For example, the first door (21) and the second door (22) can be rotatably coupled to the main body (100) by a hinge (31) provided at the upper portion of the main body (100) and a hinge provided in the middle of the main body (100), respectively.

[0101] A rotating bar (40) may be provided on one of the first door (21) and the second door (22) to cover the gap formed between the first door (21) and the second door (22) when the first door (21) and the second door (22) are closed. The rotating bar (40) may be provided to be rotatable on one of the first door (21) and the second door (22). A guide protrusion (46) may be provided on the upper end of the rotating bar (40), and a rotating guide (119) may be provided on the upper end of the main body (100) to guide the rotation of the guide protrusion (46).

[0102] The doors (21, 22, 23, 24) may include a gasket (51). The gasket (51) may be provided on the back surface of the doors (21, 22, 23, 24). The gasket (51) may be in close contact with the front surface of the body (100) when the doors (21, 22, 23, 24) are closed. The doors (21, 22, 23, 24) may include a ditch (52) that protrudes rearward. A door shelf (53) capable of storing items may be mounted on the ditch (52). A rotating bar (40) may be rotatably installed on the ditch (52).

[0103] Although the number and arrangement of storage compartments and the number and arrangement of doors have been described above, there is no limitation on the number and arrangement of storage compartments and the number and arrangement of doors of a refrigerator according to one embodiment of the present disclosure.

[0104] The refrigerator (1) may include a thermoelectric cooling device (400) configured to cool a storage compartment (11). The thermoelectric cooling device (400) may be provided on the upper side of the storage compartment (11) to cool the storage compartment (11). That is, the thermoelectric cooling device may be provided on the upper wall (110) of the main body (100).

[0105] A thermoelectric cooling device (400) may include a thermoelectric module assembly (450). The thermoelectric module assembly (450) may include a thermoelectric module (500) and a heat dissipation duct (700). The thermoelectric module (500) and the heat dissipation duct (700) may be assembled together to form a thermoelectric module assembly (450).

[0106] The thermoelectric module assembly (450) can be coupled from top to bottom to the upper wall (110) of the main body (100). After the thermoelectric module assembly (450) is coupled from top to bottom to the upper wall (110) of the main body (100), a cooling duct (900), which will be described later, can be coupled from bottom to top to the lower surface of the upper wall (110) of the main body (100).

[0107] The thermoelectric module assembly (450) can be coupled to the upper wall (110) of the main body (100) by at least one fastening member (S2, FIG. 6). The at least one fastening member (S2) can be a mechanical element for coupling, such as a screw, a bolt, or the like.

[0108] A thermoelectric module (500) may include a thermoelectric element (530), a heat sink (520), a cooling sink (570), and a module plate (550).

[0109] A thermoelectric element (530) may be a semiconductor element that converts thermal energy into electrical energy using the thermoelectric effect, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, etc.

[0110] The thermoelectric element (530) may include a heat generating portion (531) and a heat absorbing portion (532). When current is applied to the thermoelectric element (530), a heat generating action may occur in the heat generating portion (531) and a heat absorbing action may occur in the heat absorbing portion (532). The thermoelectric element (530) may have a thin hexahedral shape. The heat generating portion (531) may be provided on one surface of the thermoelectric element (530) and the heat absorbing portion (532) may be provided on the opposite surface.

[0111] The thermoelectric element (530) may be provided on the upper wall (110) such that the heating portion (531) faces above the thermoelectric element (530) and the heat absorption portion (532) faces below the thermoelectric element (530). That is, the heating portion (531) faces the outside of the main body (100), and the heat absorption portion (532) may face the inside of the storage chamber (11) through the installation hole (115) of the upper wall (110). Accordingly, air that has been warmed through heat exchange with the heating portion (531) can be discharged to the outside of the main body (100), and air that has been cooled through heat exchange with the heat absorption portion (532) can be supplied to the storage chamber (11) to cool the storage chamber (11).

[0112] The heat sink (520) can contact the heat generating part (531) to absorb the heat of the heat generating part (531) and release the heat to the outside of the main body (100). The heat sink (520) may also be referred to as a hot sink, a heat dissipation heat sink, a hot heat sink, etc. The heat sink (520) may be formed of a metal material with good thermal conductivity. For example, the heat sink (520) may be formed of aluminum or copper.

[0113] A heat sink (520) may include a heat sink base (521) that contacts a heat generating portion (531) and a plurality of heat dissipation fins (525) that protrude from the heat sink base (521) to expand a heat transfer area. The heat sink base (521) is arranged horizontally, and the plurality of heat dissipation fins (525) may protrude upward from the heat sink base (521). The heat sink base (521) and the plurality of heat dissipation fins (525) may be formed integrally.

[0114] The cooling sink (570) can cool the storage compartment (11) by taking heat from the storage compartment (11) and transferring it to the heat absorbing portion (532). The cooling sink (570) may also be referred to as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, a cooling heat sink, etc. The cooling sink (570) may be formed of a metal material with good thermal conductivity. For example, the cooling sink (570) may be formed of aluminum or copper.

[0115] The cooling sink (570) may include a cooling sink base (571) that contacts the heat absorbing portion (532) and a plurality of cooling fins (575) that protrude from the cooling sink base (571) to expand the heat transfer area. The cooling sink base (571) is arranged horizontally, and the plurality of cooling fins (525) may protrude downward from the cooling sink base (571). The cooling sink base (571) and the plurality of cooling fins (575) may be formed integrally.

[0116] The module plate (550) can support a heat sink (520) and a cooling sink (570). The heat sink (520) can be placed on one side of the module plate (550) and the cooling sink (570) can be placed on the other side of the module plate (570). Specifically, the heat sink (520) can be placed on the upper side of the module plate (550) and the cooling sink (570) can be placed on the lower side of the module plate (550).

[0117] The thermoelectric module (500) may include a heat dissipation fan (600) that flows air to ensure efficient heat exchange between the heat dissipation sink (520) and the air outside the main body (100). The heat dissipation fan (600) may be a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions. The centrifugal fan may include a blower fan. The rotation axis (610) of the heat dissipation fan (600) may be arranged vertically. The heat dissipation fan (600) may be installed in a fan case (650). The fan case (650) and the module plate (550) may be formed integrally. However, unlike the present embodiment, the fan case (650) and the module plate (550) may be formed separately.

[0118] The heat dissipation duct (700) can guide air outside the main body (100) to exchange heat with the heat dissipation sink (520), and guide air that has exchanged heat with the heat dissipation sink (520) to be discharged back to the outside of the main body (100).

[0119] A heat dissipation duct (700) may be coupled to the upper side of a thermoelectric module (500). A duct coupling portion (722) may be provided on the heat dissipation duct body (720), and a module coupling portion (651) may be provided on the thermoelectric module (500). The duct coupling portion (722) and the module coupling portion (651) may be coupled in a hook or fitting manner. In FIGS. 7 and 8, the module coupling portion (651) is illustrated as being provided on the fan case (650), but the module coupling portion (651) may also be provided on the module plate (550).

[0120] The heat dissipation duct (700) may include a heat dissipation duct body (720), a heat dissipation duct cover (710), and an extension duct (740).

[0121] A heat dissipation duct cover (710) may be coupled to the upper portion of the heat dissipation duct body (720) so as to cover the upper portion of the heat dissipation duct body (720). A duct cover coupling portion (711) may be provided on the heat dissipation duct cover (710), and a duct body coupling portion (721) coupled to the duct cover coupling portion (711) may be provided on the heat dissipation duct body (720). The duct cover coupling portion (711) and the duct body coupling portion (721) may be coupled in a hook or fitting manner.

[0122] The upper surface (701) of the heat dissipation duct (700) may be formed by the upper surface of the heat dissipation duct cover (710). The lower surface (702) of the heat dissipation duct (700) may be formed by the lower surface of the heat dissipation duct body (720). The side surface (703) of the heat dissipation duct (700) may be formed by the side surface of the heat dissipation duct cover (710).

[0123] An extension duct (740) may be provided in front of the heat dissipation duct body (720) so as to be connected to the heat dissipation duct body (720). The extension duct (740) may be formed separately from the heat dissipation duct body (720). However, alternatively, the extension duct (740) may be formed integrally with the heat dissipation duct body (720).

[0124] The extension duct (740) can be placed under the top cover (300) and can be coupled to the lower part of the top cover (300). For this purpose, the extension duct (740) can be provided with an extension duct coupling portion (745) coupled to the top cover (300).

[0125] A heat dissipation duct body (720) may be provided on the upper side of the thermoelectric module (500) to cover the heat dissipation fan (600) and the heat dissipation sink (520). An outside air intake port (751) is formed on the upper surface of the front portion of the heat dissipation duct body (720), and the outside air intake port (751) may be covered by a top cover (300) to be described later.

[0126] The heat dissipation duct (700) may include outside air outlets (782, 794) that discharge air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100). The outside air outlets (782, 794) may include a first outside air outlet (782) that discharges warm air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100), and a second outside air outlet (794) that discharges the warm air toward the rotating bar (40).

[0127] The heat dissipation duct body (720) may include a first external air discharge port (782). The first external air discharge port (782) may include a connection port (784) provided to guide air inside the heat dissipation duct (700) to the inside of the top cover (300), and an external discharge port (783) provided to be separated from the connection port (784) to discharge air in the heat dissipation duct (700) to the outside of the top cover (300).

[0128] High-temperature air guided into the interior of the top cover (300) through the connection port (784) can heat the upper surface (111) of the main body (100) while passing through the interior of the top cover (300). Therefore, condensation can be prevented from occurring on the upper front surface of the main body (100).

[0129] The extension duct (740) may include a second external air outlet (794). High temperature air discharged toward the rotary bar (40) through the second external air outlet (794) may heat the rotary bar (40). Accordingly, condensation may be prevented from occurring on the rotary bar (40).

[0130] However, the heat dissipation duct (700) does not have to include both the first outdoor air discharge port (782) and the second outdoor air discharge port (794), and depending on the embodiment, the second outdoor air discharge port (794) may be omitted.

[0131] Additionally, the first external air discharge port (782) of the heat dissipation duct (700) does not have to include both a connection port (784) and an external discharge port (783), and depending on the embodiment, the connection port (784) may be omitted.

[0132] The heat dissipation duct body (720) may include a fan accommodation space (762) that accommodates a heat dissipation fan (600). The fan accommodation space (762) may be formed on the bottom surface of the heat dissipation duct body (720). The heat dissipation duct body (720) may include a fan inlet (761) through which air is introduced into the fan accommodation space (762).

[0133] The heat dissipation duct body (720) may include a sink accommodation space (771) formed on the downstream side of the fan accommodation space (762) to accommodate a heat dissipation sink (520).

[0134] The heat dissipation duct body (720) may include an intake space (752) formed on an upper surface of the heat dissipation duct body (720) to guide air sucked in through an outside air intake port (751) to a fan receiving space (762). The upper side of the intake space (752) may be formed to be open, and the open upper side of the intake space (752) may be covered by a heat dissipation duct cover (710). The intake space (752) may be formed on an upstream side of the fan receiving space (762). The intake space (752) may be connected to the fan receiving space (762) through a fan inlet port (761).

[0135] The heat dissipation duct body (720) may include a first exhaust space (781) formed on an upper surface of the heat dissipation duct body (720) to guide air that has exchanged heat with the heat dissipation sink (520) to a first outside air exhaust port (782). The upper side of the first exhaust space (781) may be open, and the open upper side of the first exhaust space may be covered by a heat dissipation duct cover (710). The first exhaust space (781) may be formed on a downstream side of the sink receiving space (771).

[0136] The heat dissipation duct body (720) may include a second exhaust space (791) formed on the upper surface of the heat dissipation duct body (720) to guide air that has exchanged heat with the heat dissipation sink (520) to a second outside air outlet (794). The upper side of the second exhaust space (791) may be open, and the open upper side of the second exhaust space (791) may be covered by a heat dissipation duct cover (710). The second exhaust space (791) may be formed on the downstream side of the sink receiving space (771).

[0137] The extension duct (740) may include an extension exhaust space (746) connected to a second exhaust space (791) of the heat dissipation duct body (720). Air in the second exhaust space (791) may be guided to a second outside air outlet (794) through the extension exhaust space (746).

[0138] The refrigerator (1) may include a top cover (300) coupled to a front portion of the upper surface (111) of the main body (100) to cover a plurality of hinges (31). After the thermoelectric module assembly (450) is coupled to the upper wall (110) of the main body (100), the top cover (300) may be coupled to the upper wall (110) of the main body (100). The top cover (300) may be coupled to the upper wall (110) of the main body (100) via at least one fastening member (S3).

[0139] The thermoelectric cooling device (400) may include a dust filter (390) designed to filter foreign substances from air flowing into the outside air intake (751). The dust filter (390) may be slidably mounted on the top cover (300) in the front-back direction.

[0140] The top cover (300) may include a suction grill portion (350) formed on the upper surface (310) of the top cover. The suction grill portion (350) may be located above the dust filter (390). The suction grill portion (350) may primarily block foreign substances from being sucked into the interior of the heat dissipation duct (700) before the dust filter (390). The suction grill portion (350) may protect the dust filter (390) by preventing external force from being applied to the dust filter (390).

[0141] The top cover (300) may include forward protrusions (313) protruding forward from both ends of the top cover (300) to cover a plurality of hinges (31). A top cover outlet (340) through which air inside the top cover (300) is discharged to the outside of the top cover (300) may be formed in the forward protrusions (313).

[0142] The thermoelectric cooling device (400) may include a cooling fan (800) that circulates air to ensure efficient heat exchange between the cooling sink (570) and the air inside the storage compartment (11). The cooling fan (800) may be arranged to blow air toward the cooling sink (570). The cooling fan (800) may be positioned in a horizontal direction of the cooling sink (570). The cooling fan (800) may be arranged inside the storage compartment (11). The cooling fan (800) may be arranged on the lower side of the upper wall (110).

[0143] The cooling fan (800) may be a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions. The rotation axis (810) of the cooling fan (800) may be arranged perpendicular to the bottom surface of the upper wall (110).

[0144] The thermoelectric cooling device (400) may include a cooling duct (900) provided to guide air flowing by a cooling fan (800). The cooling duct (900) may guide air inside the storage room (11) to exchange heat with the cooling sink (570), and guide air that has exchanged heat with the cooling sink (570) to be discharged back into the storage room (11).

[0145] A cooling fan (800) may be positioned inside a cooling duct (900). A cooling sink (570) may be positioned inside the cooling duct (900) by penetrating the upper portion of the cooling duct (900). The cooling duct (900) may be coupled to the lower surface of the upper wall (110).

[0146] The cooling duct (900) may include an intake port (991) for drawing air inside the storage room (11) into the interior of the cooling duct (900), and an exhaust port (992) for discharging air that has exchanged heat with the cooling sink (570) into the interior of the storage room (11).

[0147] A refrigerator (1) may include a refrigeration cycle device to cool a storage compartment through a refrigeration cycle. The refrigeration cycle device may include a compressor (2), a condenser (not shown), an expansion device (not shown), and an evaporator (3). The evaporator (3) may be provided at the rear of the storage compartment (12, 13).

[0148] The refrigerator (1) may include evaporator ducts (60, 70) that guide cold air generated in the evaporator (3). The first evaporator duct (60) may be provided at the rear side of the second storage compartment (12) and the third storage compartment (13). The second evaporator duct (70) may be provided at the rear side of the first storage compartment (11).

[0149] The cold air generated in the evaporator (3) can be sucked into the interior of the first evaporator duct (60) by the evaporator fan (80). The cold air sucked into the interior of the first evaporator duct (60) can be discharged to the second storage chamber (12) or the third storage chamber (13) through a cold air discharge port (not shown) formed on the front. In addition, the cold air sucked into the interior of the first evaporator duct (60) can be guided to the internal passage (78) of the second evaporator duct (70). The first evaporator duct (60) may be provided with a damper (61) that controls the supply of the cold air inside the first evaporator duct (60) to the second evaporator duct (70). A connecting duct (90) may be provided between the first evaporator duct (60) and the second evaporator duct (70) to connect the first evaporator duct (60) and the second evaporator duct (70).

[0150] Cold air introduced into the internal passage (78) of the second evaporator duct (70) can be supplied to the first storage chamber (11) through the cold air discharge port (72) formed on the front of the second evaporator duct (70).

[0151] Thus, according to one embodiment of the present disclosure, the refrigerator may include a thermoelectric cooling device (400) and a refrigeration cycle device, but is not limited thereto, and the refrigerator may include only a thermoelectric cooling device (400).

[0152] FIG. 9 is a perspective view illustrating an exploded view of a thermoelectric module according to one embodiment of the present disclosure.

[0153] Referring to FIG. 9, a thermoelectric module according to one embodiment of the present disclosure will be described in detail.

[0154] A thermoelectric module (500) may include a thermoelectric element (530) having a heat generating portion (531) and a heat absorbing portion (532), a heat dissipation sink (520) in contact with the heat generating portion (531) of the thermoelectric element (530), a cooling sink (570) in contact with the heat absorbing portion (532) of the thermoelectric element (530), and a module plate (550) on which the thermoelectric element (530), the heat dissipation sink (520), and the cooling sink (570) are installed.

[0155] The module plate (550) can serve as a skeleton of the thermoelectric module (500). The module plate (550) can be formed of a resin material with low thermal conductivity. The module plate (550) can support a heat sink (520) and a cooling sink (570). The module plate (550) can maintain a gap between the heat sink (520) and the cooling sink (570).

[0156] The module plate (550) may include a plate base (552). The plate base (552) may be provided horizontally. The plate base (552) may support a heat sink (520). The plate base (552) may contact a bottom surface of the heat sink base (521) to support the heat sink (520). The plate base (552) may have a size and shape corresponding to the heat sink (520). The plate base (552) may have a rectangular shape.

[0157] The module plate (550) may include a plate coupling portion (557) that is provided to be supported on the upper surface of the main body (100). The plate coupling portion (557) may be supported on the upper surface (111) of the upper wall (110) of the main body around the installation hole (115).

[0158] The plate joint (557) can be formed horizontally. The plate joint (557) can be formed to have a step with respect to the plate base (552). That is, the plate joint (557) can be provided at a higher position than the plate base (552). Accordingly, when the plate joint (557) is supported on the upper surface of the main body around the installation hole (115), the plate base (552) can be placed inside the installation hole (115).

[0159] The module plate (550) may include a connecting portion (556) connecting a plate base (552) and a plate coupling portion (557). The connecting portion (556) may extend upward from the edge of the plate base (552). The plate coupling portion (557) may extend horizontally from the top of the connecting portion (556).

[0160] A heat sink (520) can be placed in the space formed by the plate base (552) and the connecting portion (556). The plate base (552), the plate connecting portion (557), and the connecting portion (556) can be formed integrally.

[0161] The module plate (550) may include a module plate opening (551). A thermoelectric element (530) may be positioned inside the module plate opening (551). The thermoelectric element (530) may be positioned at an upper portion of the module plate opening (551).

[0162] Since the thermoelectric element (530) is positioned at the upper end of the module plate opening (551), the cooling sink (570) may include a cooling conductive portion (574) protruding from the cooling sink base (571) for contact with the heat absorbing portion (532) of the thermoelectric element (530). The cooling conductive portion (574) may be formed integrally with the cooling sink base (571). The cooling conductive portion (574) may be inserted from below into the module plate opening (551) so as to contact the heat absorbing portion (532) of the thermoelectric element (530).

[0163] The thermoelectric module (500) may include a module plate (550) and an element insulator (540) that insulates the thermoelectric element (530). The element insulator (540) may be placed in the module plate opening (551) to prevent the thermoelectric element (530) from contacting the module plate (550). The element insulator (540) may be arranged to surround a side of the thermoelectric element (530). The element insulator (540) may be formed of a resin material having low thermal conductivity. For example, the element insulator (540) may be formed of a silicone material.

[0164] The thermoelectric module (500) may include a sink insulation (580) provided between the module plate (550) and the cooling sink (570). The sink insulation (580) may prevent heat from being transferred between the heat sink (520) and the cooling sink (570) through the module plate (550). The sink insulation (580) may include a sink insulation opening (581).

[0165] The sink insulation (580) can support the upper surface of the cooling sink (570). However, depending on the embodiment, the sink insulation (580) may be omitted, in which case the cooling sink (570) may be supported by contacting the lower surface of the module plate (550). Alternatively, the sink insulation (580) may be provided between the heat dissipation sink (520) and the module plate (550).

[0166] The heat sink (520) may include a heat sink base (521) and a plurality of heat sink fins (525) protruding from the heat sink base (521). The bottom surface of the heat sink base (521) may be supported on a module plate (550).

[0167] The heat sink (520) and the cooling sink (570) can be coupled to the module plate (550) via a fastening member (S1). The fastening member (S1) can be a mechanical element for coupling, such as a screw or bolt.

[0168] A heat sink through-hole may be formed in the heat sink (520) so that the fastening member (S1) may pass through it. A plate through-hole (553) may be formed in the module plate (550) so that the fastening member (S1) may pass through it. The plate through-hole (553) may be formed in the plate base (552). A cooling sink through-hole (573) may be formed in the cooling sink (570) so that the fastening member (S1) may pass through it.

[0169] The thermoelectric module (500) may include a washer member (510) supported between the head portion of the fastening member (S1) and the heat sink (520). The washer member (510) is provided between the head portion of the fastening member (S1) and the heat sink (520) to prevent the fastening member (S1) and the heat sink (520) from contacting each other and to reduce heat of the heat sink (520) from being transferred through the fastening member (S1). A loosening prevention member (502) may be provided between the head portion of the fastening member (S1) and the washer member (510) to prevent loosening of the fastening member (S1).

[0170] The thermoelectric module (500) may include a nut member (590) to which an end opposite the head of the fastening member (S1) is fastened. The nut member (590) may be supported on a cooling sink (570). The nut member (590) may be provided between the end opposite the head of the fastening member (S1) and the cooling sink (570) to prevent the fastening member (S1) and the cooling sink (570) from contacting each other and reduce the transfer of cold air from the cooling sink (570) through the fastening member (S1).

[0171] When the heat sink (520) and the cooling sink (570) are coupled to the module plate (550) via the fastening member (S1), the heat sink (520) and the cooling sink (570) can be coupled to the module plate (550) via the fastening member (S1) while the element insulation (540) and the thermoelectric element (530) are placed in the opening (551) of the module plate (550). Accordingly, the heat sink (520) and the cooling sink (570) can be fixed to the module plate (550) while the thermoelectric element (530) is also fixed at the same time.

[0172] The heat generating part (531) of the thermoelectric element (530) is supported and fixed by a heat sink (520), the heat absorbing part (532) of the thermoelectric element (530) is supported and fixed by a cooling sink (570), and the side connecting the heat generating part (531) and the heat absorbing part (532) of the thermoelectric element (530) can be supported and fixed by the inner surface of the element insulation material (540).

[0173] In this way, the heat sink (520) and the cooling sink (570) can be easily assembled to the module plate (550) by the fastening member (S1). In addition, the heat sink (520) and the heat generating portion (531) of the thermoelectric element (530) can be in close contact, and the cooling sink (570) and the heat absorbing portion (532) of the thermoelectric element (530) can be in close contact, so that heat exchange between the heat sink (520) and the heat dissipating portion (531) of the thermoelectric element (530) and heat exchange between the cooling sink (570) and the heat absorbing portion (532) of the thermoelectric element (530) can be efficiently performed, thereby increasing the efficiency of the thermoelectric module (500).

[0174] FIG. 10 is a cross-sectional view illustrating a main portion of a structure in which a thermoelectric module assembly is coupled to an upper wall of a main body according to one embodiment of the present disclosure.

[0175] Referring to FIGS. 6 and 10, a structure in which a thermoelectric module assembly is coupled to the upper wall of the main body is described.

[0176] The thermoelectric module (500) can be coupled to the upper wall (110) through at least one fastening member (S2, FIGS. 6 and 10). The fastening member (S2) can be coupled to the upper wall (100) by penetrating the thermoelectric module (500). Specifically, the fastening member (S2) can be coupled to the upper wall (110) by penetrating the plate coupling portion (557) of the module plate (550). At this time, the bottom surface (558) of the plate coupling portion (557) can be supported by contacting the upper surface (111) of the main body (100) around the installation hole (115).

[0177] The upper wall (110) of the main body (100) includes a connecting frame (200) provided between the inner case (170) and the outer case (180), and the fastening member (S) can be fastened to the connecting frame (200). The aforementioned installation hole (115) can be formed by the connecting frame (200). The connecting frame (200) can include a frame base (210) and a frame body (270) provided on the upper side of the frame base (210). The frame base (210) can include a sink end support (220) provided to support an end (571a) of a cooling sink (570). The frame body (270) can include an intermediate support (275) protruding to support an end of a plate base (552) of a module plate (550).

[0178] Although four fastening members (S2) are illustrated in the drawing, there is no limitation on the number of fastening members (S2). The fastening members (S2, FIGS. 6 and 10) that connect the thermoelectric module (500) to the main body (100) can be distinguished from the fastening members (S1, FIG. 9) for assembling the thermoelectric module (500) itself described above.

[0179] A plate penetration hole (554) through which a fastening member (S2) passes may be formed in the plate joint portion (557) of the module plate (550). A trauma penetration hole (182) through which a fastening member (S2) passes may be formed in the outer surface (180). A fastening hole (290) through which a fastening member (S2) is fastened may be formed in the frame body (270) of the connecting frame (200).

[0180] As described above, the thermoelectric module (500) can be firmly and stably fixed to the upper wall (110) by the fastening member (S2). In addition, the thermoelectric module (500) can be easily installed by fastening the fastening member (S2) while the plate joint (557) of the thermoelectric module (500) is placed on the upper surface (111) of the main body (100) around the installation hole (115). In addition, the thermoelectric module (500) can be easily separated by releasing the fastening member (S2).

[0181] In addition, the heat dissipation duct (700) can also be connected to the main body (100) via the fastening member (S2). That is, the fastening member (S2) can be connected to the connecting frame (200) of the main body (100) by passing through the heat dissipation duct (700) and the module plate (550) in sequence. In other words, the fastening member (S2) can be connected to the main body (100) by passing through the thermoelectric module assembly (450).

[0182] A duct cover penetration hole (719) may be formed in the heat dissipation duct cover (710), and a duct body penetration hole (729) may be formed in the heat dissipation duct body (720). The fastening member (S2) may be fastened to the connecting frame (200) by penetrating the duct cover penetration hole (719), the duct body penetration hole (729), and the plate penetration hole (554).

[0183]

[0184] FIG. 11 is a cross-sectional view illustrating a state in which a thermoelectric module assembly according to an embodiment of the present disclosure is separated from an upper wall of a main body, and is a cross-sectional view along a left-right center line (Y) of an upper surface of the main body. FIG. 12 is a cross-sectional view illustrating a state in which a thermoelectric module assembly according to an embodiment of the present disclosure is coupled to an upper wall of a main body, and is a cross-sectional view along a left-right center line (Y) of an upper surface of the main body. FIG. 13 is a view illustrating the thermoelectric module assembly with the exception of the plate coupling portion of the module plate in FIG. 12 deleted. FIG. 14 is an enlarged view illustrating a portion “AA” of FIG. 12. FIG. 15 is an enlarged view illustrating a portion “BB” of FIG. 12. FIG. 16 is a view illustrating a thermoelectric module assembly according to an embodiment of the present disclosure. FIG. 17 is a view illustrating a side cover member according to an embodiment of the present disclosure. FIG. 18 is a view schematically illustrating an upper surface of a main body and a thermoelectric module assembly according to an embodiment of the present disclosure. FIG. 19 is a schematic drawing of a top surface of a main body and a thermoelectric module assembly according to one embodiment of the present disclosure. FIG. 20 is a schematic drawing of a top surface of a main body and a thermoelectric module assembly according to one embodiment of the present disclosure. FIG. 21 is a side view of a thermoelectric module assembly coupled to a top surface of a main body according to one embodiment of the present disclosure.

[0185] As described above, the plate joint (557) of the module plate (550) is supported on the upper wall (110) of the main body (100), and the fastening member (S2) penetrates the module plate (550) and is fastened to the upper wall (110) of the main body (100), so that the thermoelectric module assembly (450) can be fastened to the upper wall (110) of the main body (100).

[0186] The main body (100) is formed by filling a liquid foam solution between the inner case (170) and the outer case (180) and foaming it. The shape of the outer case (180) may be deformed during or after foaming the foam solution. That is, depending on the foaming process, the outer case (180) may be deformed to be convex toward the outside (bulging phenomenon). For example, the center (112) of the upper surface (111) of the main body (100) may gently protrude upward (see FIG. 11).

[0187] Due to this phenomenon of being full, a phenomenon may occur in which the bottom surface of another part of the thermoelectric module assembly (450), excluding the plate joint (557) that is joined to the upper surface (111) of the main body (100) through the fastening member (S2), is lifted off from the upper surface (111) of the main body (100) (lifting phenomenon).

[0188] In particular, the gap between the bottom surface of the thermoelectric module assembly (450) and the top surface (111) of the main body (100) may increase as the distance from the installation hole (115) increases.

[0189] Specifically, as illustrated in FIGS. 13 to 15, when the plate coupling portion (557) of the module plate (550) is coupled to the upper surface (111) of the main body (100), a gap (G1, G2) may occur between a plane (PL) including a bottom surface (558) of the plate coupling portion (557) and the upper surface (111) of the main body (100), and this gap (G1, G2) may increase toward both ends (113, 114) of the upper surface (111) of the main body. The plane (PL) including the bottom surface (558) of the plate coupling portion (557) is a virtual plane (PL) extending from the bottom surface (558) of the plate coupling portion (557).

[0190] In this way, if a gap occurs between the thermoelectric module assembly (450) and the upper surface (111) of the main body (100), the thermoelectric module assembly (450) may not be fixed and may flow. In addition, noise may occur due to a collision between the thermoelectric module assembly (450) and the main body (100). In addition, dust or foreign substances may penetrate the gap between the thermoelectric module assembly (450) and the upper surface (111) of the main body (100), which may deteriorate the aesthetic appeal.

[0191] In order to prevent a gap from occurring between the thermoelectric module assembly (450) and the upper surface (111) of the main body (100) due to the swelling phenomenon according to the foaming process as described above and to enable the thermoelectric module assembly (450) to be fixed, the lower end (704, 706, 707) of the side surface (703) of the heat dissipation duct (700) according to one embodiment of the present disclosure may be formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557) (FIGS. 14, 15, and 21).

[0192] Specifically, the lower part (706) of the left side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) can be formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557) (Fig. 14).

[0193] The lower part (706) of the left side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) may be positioned below a virtual plane (PL) extending from the bottom surface (558) of the plate joint (557) by a first length (D1).

[0194] On the other hand, the left side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) may protrude below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557).

[0195] With this structure, the lower part (706) of the left side of the heat dissipation duct (700) can contact the upper surface (111) of the main body (100) without being separated from the upper surface (111) of the main body (100).

[0196] In addition, the lower part (707) of the right side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) can be formed to be positioned below a plane (PL) including the bottom surface (558) of the plate joint (557) (Fig. 15).

[0197] The lower part (707) of the right side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) can be positioned lower by a second length (D2) than the plane (PL) including the bottom surface (558) of the plate joint (557).

[0198] On the other hand, the right side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) may protrude below a plane (PL) including the bottom surface (558) of the plate joint (557).

[0199] With this structure, the lower part (706) of the right side of the heat dissipation duct (700) can contact the upper surface (111) of the main body (100) without being separated from the upper surface (111) of the main body (100).

[0200] The lower part (706) of the left side and the lower part (707) of the right side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) can be formed so that they are both positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557).

[0201] At this time, depending on the position of the installation hole (115), the first length (D1), which is the distance between the lower end (706) of the left side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) and the imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557), and the second length (D2), which is the distance between the lower end (707) of the right side of the heat dissipation duct (700) along the left-right center line (Y) of the upper surface (111) of the main body (100) and the imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557), may be different from each other.

[0202] That is, as shown in FIGS. 11 to 15, when the installation hole (115) is formed on the left side based on the front-back center line (X) of the upper surface (111) of the main body (100), an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557) can be inclined in an upward direction toward the right end (114) of the upper surface (111) of the main body (100).

[0203] Accordingly, when the installation hole (115) is formed on the left side based on the front-back center line (X) of the upper surface (111) of the main body (100), the second length (D2) may be greater than the first length (D1).

[0204] Conversely, when the installation hole (115) is formed on the right side based on the front-back center line (X) of the upper surface (111) of the main body (100), an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557) can be inclined in an upward direction toward the left end (113) of the upper surface (111) of the main body (100).

[0205] Accordingly, when the installation hole (115) is formed on the left side based on the front-back center line (X) of the upper surface (111) of the main body (100), the first length (D2) may be greater than the second length (D1).

[0206] As illustrated in Fig. 20, when the installation hole (115) is formed at the center of the left and right directions of the upper surface (111) of the main body (100), an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557) can be formed horizontally with respect to the upper surface (111) of the main body (100).

[0207] Accordingly, when the installation hole (115) is formed at the center of the left and right direction of the upper surface (111) of the main body (100), the first length (D1) and the second length (D2) may be the same.

[0208] Unlike the embodiments described above, either the lower part (706) of the left side of the heat dissipation duct (700) or the lower part (707) of the right side along the left-right center line (Y) of the upper surface (111) of the main body (100) may be formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557).

[0209] As illustrated in Fig. 18, when the installation hole (115) is formed on the left side based on the front-back center line (X) of the upper surface (111) of the main body (100), only the lower part (707) of the right side of the heat dissipation duct (700) according to the left-right center line (Y) of the upper surface (111) of the main body (100) can be formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557).

[0210] As illustrated in Fig. 19, when the installation hole (115) is formed on the right side based on the front-back center line (X) of the upper surface (111) of the main body (100), only the lower part (706) of the left side of the heat dissipation duct (700) according to the left-right center line (Y) of the upper surface (111) of the main body (100) can be formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557).

[0211] In some embodiments, instead of the lower end (704, 706, 707) of the side surface (703) of the heat dissipation duct (700) being formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557), a side cover member (797) may be provided between the lower end (704, 706, 707) of the side surface (703) of the heat dissipation duct and the upper surface (111) of the main body (100) to cover the gap between the lower end (704, 706, 707) of the side surface (703) of the heat dissipation duct and the upper surface (111) of the main body (100).

[0212] The side cover member (797) covers the gap between the lower portion (704, 706, 707) of the side of the heat dissipation duct (703) and the upper surface (111) of the main body (100), and may have elasticity to prevent movement of the thermoelectric module assembly (450) and absorb impact. The side cover member (797) may be formed of polyethylene foam. However, the material of the side cover member (797) is not limited to polyethylene foam, and may include various members that can eliminate the gap between the lower portion (704, 706, 707) of the side of the heat dissipation duct (703) and the upper surface (111) of the main body (100) and alleviate impact.

[0213] One side of the side cover member (797) may be provided to have adhesive or bonding properties. Accordingly, the side cover member (797) may be bonded to the lower portion (704, 706, 707) of the side of the heat dissipation duct (703).

[0214] As illustrated in Fig. 21, the installation hole (115) is formed on the rear side based on the left-right center line (Y) of the upper surface (111) of the main body (100), and the lower part (704) of the front side of the heat dissipation duct (700) according to the front-back center line (X) of the upper surface (111) of the main body (100) can be formed to be positioned below an imaginary plane (PL) extending from the bottom surface (558) of the plate joint (557).

[0215] Accordingly, the lower part (704) of the front side of the heat dissipation duct (700) along the front-back center line (X) of the upper surface (111) of the main body (100) can contact the upper surface (111) of the main body (100) without being separated from the upper surface (111) of the main body (100).

[0216] While the technical concept of the present invention has been described above through specific examples, the scope of the present invention is not limited to these examples. Various embodiments that can be modified or altered by those skilled in the art without departing from the spirit of the present invention as defined in the claims are also within the scope of the present invention.

Claims

1. Main body; A storage room formed inside the main body; and A thermoelectric module assembly comprising a module plate, a thermoelectric element having a heat generating portion and a heat absorbing portion, a heat sink coupled to the module plate so as to contact the heat generating portion, a cooling sink coupled to the module plate so as to contact the heat absorbing portion, and a heat dissipation duct coupled to the module plate so as to dissipate heat from the heat sink; The above module plate includes a plate joint portion that is provided to be joined to the upper portion of the main body, A refrigerator in which the lower end of the side of the above heat dissipation duct is positioned below an imaginary plane extending from the bottom surface of the above plate joint.

2. In paragraph 1, A refrigerator in which the bottom surface of the above plate joint is in contact with the upper surface of the main body.

3. In paragraph 1, A refrigerator in which the lower part of the side of the above heat dissipation duct contacts the upper surface of the above body.

4. In paragraph 1, A refrigerator further comprising a fastening member for fastening the plate joint to the upper portion of the main body.

5. In paragraph 1, The upper wall of the main body includes an installation hole to connect the storage room and the exterior of the main body, The above plate joint is a refrigerator joined around the installation hole on the upper surface of the main body.

6. In paragraph 1, The above module plate includes a plate base having a module plate opening in which the thermoelectric element is placed, A refrigerator wherein the heat sink is coupled to one side of the plate base and the cooling sink is coupled to the opposite side of the plate base.

7. In paragraph 6, The above module plate includes a connecting portion extending upward from the edge of the plate base, The above plate joint is a refrigerator extending horizontally from the top of the connecting part.

8. In paragraph 5, The above installation hole is formed on the left side based on the front-back center line (X) of the upper surface of the main body, A refrigerator in which the lower part of the right side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body is located below an imaginary plane extending from the bottom surface of the plate joint.

9. In paragraph 5, The above installation hole is formed on the right side based on the front-back center line (X) of the upper surface of the main body, A refrigerator in which the lower part of the left side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body is located below an imaginary plane extending from the bottom surface of the plate joint.

10. In paragraph 5, The above installation hole is formed at the center of the left and right directions of the upper surface of the main body, The lower part of the right side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body, and the lower part of the left side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body, A refrigerator located below an imaginary plane extending from the bottom surface of the above plate joint.

11. In paragraph 5, The lower part of the left side of the heat dissipation duct according to the left-right center line (Y) of the upper surface of the main body is located a first length lower than an imaginary plane extending from the bottom surface of the plate joint, A refrigerator in which the lower part of the right side of the heat dissipation duct along the left-right center line (Y) of the upper surface of the main body is located a second length lower than an imaginary plane extending from the bottom surface of the plate joint.

12. In paragraph 11, The above installation hole is formed on the left side based on the front-back center line (X) of the upper surface of the main body, A refrigerator wherein the second length is greater than the first length.

13. In paragraph 11, The above installation hole is formed on the right side based on the front-back center line (X) of the upper surface of the main body, A refrigerator wherein the first length is greater than the second length.

14. In paragraph 11, The above installation hole is formed at the center of the left and right directions of the upper surface of the main body, A refrigerator wherein the first length and the second length are the same.

15. In paragraph 5, The above installation hole is formed on the rear side based on the left and right center line (Y) of the upper surface of the main body, A refrigerator in which the lower part of the front side of the heat dissipation duct along the front-back center line (X) of the upper surface of the main body is located below an imaginary plane extending from the bottom surface of the plate joint.

Citation Information

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