Frame for electronic device and manufacturing method thereof

Abstract

This method for manufacturing a frame used in an electronic device may comprise the steps of: generating a peripheral part including a recess part through a first metal material; forming a support part, including a portion to be inserted into the recess part, through a second metal material; applying a conductive adhesive material on the recess part; inserting the portion of the support part into the recess part so that the conductive adhesive material is pressed by the portion of the support part of the frame; and manufacturing the frame by attaching the support part of the frame to the peripheral part through a bonding agent formed by curing the conductive adhesive material after the insertion.

Description

Frame for electronic devices and method for manufacturing the same

[0001] The present disclosure relates to a frame for an electronic device and a method for manufacturing the same.

[0002] An electronic device may include a frame that forms at least a portion of an exterior surface. The frame may include a peripheral portion defining a side surface of the electronic device, a support portion for supporting components located within the electronic device (e.g., a battery, a printed circuit board, etc.), and a display. The support portion may be coupled to the peripheral portion. To meet the needs of a user, the frame may require a structure that improves the coupling between the support portion and the peripheral portion.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] A method for manufacturing a frame used in an electronic device is disclosed. According to one embodiment, a method for manufacturing a frame used in an electronic device may include forming a component to be provided as a periphery of the frame using a first metal material. The periphery may define at least a portion of a side surface of the electronic device. The method may include removing a portion of the component to create the periphery, which includes a recessed portion defined by a recess formed by removing the portion of the component. The method may include injecting a second metal material into a mold. The method may include forming a support portion of the frame to be positioned below a display of the electronic device by curing the second metal material injected into the mold. The support portion of the frame may include a portion to be inserted into the recess. The portion included in the support portion may include one or more grooves. The size of the portion included in the support portion may be smaller than the size of the recess. The method may include applying a conductive adhesive material to the recessed portion included in the periphery of the frame. The method may include a step of inserting the portion included in the support portion of the frame into the recess such that the conductive adhesive material applied to the recess portion is pressed by the portion included in the support portion of the frame. The one or more grooves may be filled with the conductive adhesive material by the insertion. The method may include a step of manufacturing the frame by attaching the support portion of the frame to the peripheral portion of the frame through a bonding agent formed by curing the conductive adhesive material after the insertion. At least a portion of the bonding agent positioned within the one or more grooves may engage the support portion of the frame and the peripheral portion of the frame.

[0005] An electronic device is disclosed. According to one embodiment, the electronic device may include a display and a frame supporting the display. The frame may include a peripheral portion including a recessed portion surrounding an edge of the display and positioned within the electronic device. The frame may include a support portion including a protruding portion disposed below the display and at least partially inserted into a space provided by the recessed portion. The protruding portion may include one or more grooves. The frame may include a bonding agent positioned at least partially between the recessed portion of the peripheral portion and the protruding portion of the support portion. The bonding agent may include a first portion attached to the recessed portion of the peripheral portion and a second portion engaged with the protruding portion by filling the one or more recesses such that the support portion is coupled to the peripheral portion.

[0006] An electronic device is disclosed. According to one embodiment, the electronic device may include a display and a frame supporting the display. The frame may include a peripheral portion that surrounds at least a portion of an edge of the display and includes a recessed portion positioned within the electronic device. The frame may include a support portion that is disposed below the display and includes a protruding portion that is at least partially inserted into a space provided by the recessed portion. The protruding portion may include one or more grooves. The frame may include a bonding agent that attaches the protruding portion to the recessed portion. The bonding agent may include a first portion that attaches to the recessed portion of the peripheral portion, and a second portion that extends from the first portion and is positioned within the one or more grooves so as to engage the protruding portion of the support portion with the recessed portion of the peripheral portion.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0009] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0010] Figure 3a is a perspective view of an exemplary frame.

[0011] Figure 3b is a partial cross-sectional view of an exemplary frame taken along line A-A' of Figure 3a.

[0012] Figure 4 illustrates a portion of an exemplary frame.

[0013] Figures 5a, 5b, and 5c illustrate the connection of the periphery and the support of an exemplary frame.

[0014] Figures 6a and 6b illustrate the connection of the periphery and support of an exemplary frame.

[0015] Figures 7a and 7b illustrate the connection of the periphery and the support of an exemplary frame.

[0016] Figure 8 is a flowchart illustrating the manufacturing process of an exemplary frame.

[0017] Figure 9 illustrates the connection of the periphery and support of an exemplary frame.

[0018] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0034] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0042] Referring to FIG. 2A, an electronic device (200) (e.g., electronic device (101)) according to one embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0043] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0044] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials.

[0045] An electronic device (200) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a side surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0046] Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that extends seamlessly from its edge portion toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0047] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0048] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)) or may additionally include other components.

[0049] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0050] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0051] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (200)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed from the front, at least a portion of an edge part of the screen display area (201A) may substantially coincide with an edge part of the front surface (200A) (or the front plate (202)).

[0052] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0053] In one embodiment, the display (201) may include an area where a first camera (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge part of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0054] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0055] According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0056] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0057] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0058] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (200). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (200), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (200). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0059] According to one embodiment, the electronic device (200) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole (not shown).

[0060] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] According to one embodiment, the camera module (205, 212, 213) may include a first camera (205) positioned to face the front (200A) of the electronic device (200), a second camera (212) positioned to face the rear (200B), and a flash (213).

[0062] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0063] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0064] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0065] According to one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (200). According to one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (201).

[0066] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

[0067] According to one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0068] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0069] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0070] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270).

[0071] According to one embodiment, the frame structure (240) may include a side bezel structure (218) forming an exterior of the electronic device (200) (e.g., side surface (200C) of FIG. 2A) and a support portion (243) extending inwardly from the side bezel structure (218). According to one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). According to one embodiment, the side bezel structure (218) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support portion (243) of the frame structure (240) may extend from the side bezel structure (218) within the space.

[0072] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (200). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) may each be mounted in a recess defined by the side bezel structure (218) and / or the support portion (243) of the frame structure (240).

[0073] According to one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0074] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -z direction.

[0075] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). Through this, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0076] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0077] According to one embodiment, the display (201) may be disposed between a frame structure (240) and a front plate (202). For example, the front plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0078] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0079] According to one embodiment, the front plate (202) may be coupled with the frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side bezel structure (218)). However, the present invention is not limited to the above-described example.

[0080] According to one embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0081] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0082] An electronic device (200) according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with the external device.

[0083] According to one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support portion (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 1).

[0084] In one embodiment, the second camera (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0085] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 1). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0086] According to one embodiment, the housing of the electronic device (200) (e.g., the housing (210) of FIG. 2A) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0087] Fig. 3a is a perspective view of an exemplary frame. Fig. 3b is a partial cross-sectional view of the exemplary frame taken along line A-A' of Fig. 3a.

[0088] Referring to FIGS. 3A and 3B, the electronic device (101) may include a display (201) and a frame (300) (e.g., the frame structure (240) of FIG. 2B). The frame (300) may include a peripheral portion (301) and a support portion (302).

[0089] In one embodiment, the frame (300) can support the display (201). For example, the frame (300) can be coupled with at least a portion of the display (201). The frame (300) can support the display (201) by being coupled with the display (201). The frame (300) may be referred to as the housing (210) of the electronic device (101) of FIG. 2A, or may form at least a portion of the housing (210), but is not limited thereto. For example, the frame (300) can provide a space for electronic components within the electronic device (101). At least some of the electronic components can be electrically connected to the display (201). For example, the frame (300) can form at least a portion of the exterior of the electronic device (101) together with the display (201).

[0090] According to one embodiment, the peripheral portion (301) may surround an edge of the display (201). For example, the peripheral portion (301) may be arranged along an edge of the display (201). The peripheral portion (301) may surround at least a portion of the edge of the display (201). For example, the peripheral portion (301) may be coupled to the display (201) by being attached to an edge of the display (201). For example, the peripheral portion (301) may be a portion of the frame (300) that forms the exterior of the electronic device (101). The peripheral portion (301) may form, for example, a side surface (200C) of the electronic device (101). The display (201) surrounded by the peripheral portion (301) may form a front surface (200A) of the electronic device (101). The above peripheral portion (301) may be referred to as a side bezel structure of the electronic device (101) (e.g., the side bezel structure (218) of FIG. 2A) in that it forms the side surface (200C) of the electronic device (101), but is not limited thereto.

[0091] According to one embodiment, the support (302) may be positioned below the display (201). For example, the support (302) may be a portion of the frame (300) located inside the electronic device (101). The support (302) may overlap the display (201) when the display (201) is viewed from above (e.g., when viewed in the +z direction). For example, the support (302) may be configured to support components of the electronic device (101). The support (302) may, for example, be positioned below the display (201) to support the display (201). For example, electronic components such as a printed circuit board (e.g., a first printed circuit board (250), a second printed circuit board (252) of FIG. 2B), a battery (e.g., a battery (270) of FIG. 2B), and a camera (e.g., a first camera (205) of FIG. 2B) within the electronic device (101) may be supported by the support (302) by being placed on the support (302). The support (302) may be referred to as a support portion (243) of a frame structure (240) referred to as a frame (300) of FIG. 2B in that it supports components of the electronic device (101), but is not limited thereto.

[0092] According to one embodiment, the support (302) can be coupled with the peripheral portion (301). The support (302) can be fixed to the peripheral portion (301) by being attached to the peripheral portion (301) inside the electronic device (101). For example, one side (302a) of the support (302) can be coupled to the inner surface (301a) of the peripheral portion (301) by being attached to the inner surface (301a) of the peripheral portion (301) opposite the side surface (200C). Although not shown, the one side (302a) of the support (302) can be attached to the inner surface (301a) of the peripheral portion (301) through an adhesive member between the support (302) and the peripheral portion (301).

[0093] According to one embodiment, the peripheral portion (301) may be visually exposed to the outside of the electronic device (101) because it forms at least a portion of the side surface (200C) of the electronic device (101). Since the peripheral portion (301) forms at least a portion of the exterior appearance of the electronic device (101), it may be required to have relatively high strength and excellent surface properties in order to protect components within the electronic device (101) from external impact or provide aesthetic appeal to the user. For high strength and excellent surface properties, the peripheral portion (301) may include a metal having high strength and excellent surface properties. The metal may include, for example, titanium (Ti) and / or stainless steel, but is not limited thereto.

[0094] According to one embodiment, the support portion (302) may be manufactured through metal injection molding. The support portion (302) may be formed of a metal that is relatively lighter or has lower strength than the peripheral portion (301) to reduce the weight of the electronic device (101) and facilitate processing. The metal may include, but is not limited to, aluminum (Al), which has a relatively lower strength than titanium.

[0095] According to one embodiment, the frame (300) may include a peripheral portion (301) and a non-conductive material (303) coupled with a support portion (302). For example, the non-conductive material may be coupled to the support portion (302) and the peripheral portion (301) through an injection molding process after the support portion (302) is coupled to the peripheral portion (301). Through the non-conductive material (303), a segmented structure including one or more conductive portions and one or more non-conductive portions may be formed on a side surface (200C) formed by the peripheral portion (301). The segmented structure may function as an antenna radiator for communication with an external electronic device (e.g., the electronic device (102) of FIG. 1), but is not limited thereto.

[0096] According to one embodiment, the frame (300) may have a face-to-face bonding structure between the inner surface (301a) of the peripheral portion (301) and one surface (302a) of the support portion (302), so that the bonding force between the peripheral portion (301) and the support portion (302) may be reduced. For example, the frame (300) may have a face-to-face bonding structure between the inner surface (301a) of the peripheral portion (301) and one surface (302a) of the support portion (302), so that a gap is formed between the inner surface (301a) of the peripheral portion (301) and the one surface (302a) of the support portion (302), or the inner surface (301a) of the peripheral portion (301) may be separated from the one surface (302a) of the support portion (302) by an external impact. The above frame (300) may require a structure for improving the bonding force between the peripheral portion (301) and the support portion (302). In the description below in FIG. 4, a structure for improving the bonding force between the peripheral portion (301) of the frame (300) and the support portion (302) is illustrated and described.

[0097] Figure 4 illustrates a portion of an exemplary frame.

[0098] Referring to FIG. 4, an electronic device (e.g., the electronic device (101) of FIG. 1) may include a display (e.g., the display (201) of FIG. 2A) and a frame (300) supporting the display (201) (e.g., the frame structure (240) of FIG. 2B). The frame (300) may include a peripheral portion (301) surrounding an edge of the display (201), a support portion (302) positioned below the display (201), and a bonding agent (420). According to one embodiment, the peripheral portion (301) may be formed of a metal including titanium. The support portion (302) may be formed of a metal including aluminum. However, the present invention is not limited thereto.

[0099] According to one embodiment, the peripheral portion (301) may include a recessed portion (310) positioned inside the electronic device (101). For example, the recessed portion (310) may be formed on an inner surface (301a) of the peripheral portion (301). The recessed portion (310) may be recessed (e.g., in the -x direction) from the inner surface (301a) of the peripheral portion (301) toward a side surface (e.g., the side surface (200C) of FIG. 2A) forming at least a portion of the outer appearance of the electronic device (101). For example, the recessed portion (310) may have a concave shape, thereby providing a space (S) into which the support portion (302) (or the protruding portion (320) of the support portion (302)) can be inserted. For example, the recessed portion (310) of the peripheral portion (301) may be formed through CNC machining (computerized numerical control processing) to have a shape for accommodating the protruding portion (320) of the support portion (302) for assembly with the protruding portion (320), but is not limited thereto.

[0100] In one embodiment, the support portion (302) can include a protruding portion (320) that is inserted at least partially into a space (S) provided by a recessed portion (310) of the peripheral portion (301). The protruding portion (320) can include one or more grooves (410). For example, the protruding portion (320) can be a portion that is inserted into a recess (or space (S)) defined by the recessed portion (310) of the support portion (302). The protruding portion (320) can be engaged with the recessed portion (310) by being inserted into the recess. For example, the protruding portion (320) can be at least partially surrounded by the recessed portion (310). For example, the protruding portion (320) can be engaged with the recessed portion (310) by filling at least a portion of the space (S) formed by the recessed portion (310). For example, the protruding portion (320) may protrude from one side (e.g., one side (302a) of FIG. 3B) of the support portion (302) toward the periphery (301) (and / or the recessed portion (310)). For example, the protruding portion (320) may be positioned at least partially within a space (S) formed by the recessed portion (310). The protruding portion (320) may be fastened to the recessed portion (310) by being positioned within the space (S). The protruding portion (320) may have a shape substantially corresponding to the space (S) formed by the recessed portion (310) in order to be fastened to the recessed portion (310), but is not limited thereto. The above protruding portion (320) can be configured to connect the support portion (302) to the peripheral portion (301) by being fastened to the recess portion (310).

[0101] For example, one or more grooves (410) may be formed along the protruding portion (320). For example, one or more grooves (410) may be at least partially positioned within a space (S) formed by the recessed portion (310). The one or more grooves (410) may face at least a portion (e.g., a bottom surface (310a)) of the recessed portion (310). For example, the one or more grooves (410) may be surrounded by the recessed portion (310). The one or more grooves (410) may be referred to as, but are not limited to, one or more recesses and / or recessed portions formed in the protruding portion (320) that are distinct from the recessed portion (310) formed in the periphery (301). For example, one or more grooves (410) may be recessed from one side of the protruding portion (320) (e.g., the first protruding surface (320a)) toward the inside of the support portion (302) (e.g., in the +x direction). For example, the protruding portion (320) of the support portion (302) and / or the one or more grooves (410) may be formed through CNC machining, but is not limited thereto.

[0102] In one embodiment, the bonding agent (420) can be at least partially positioned between the recessed portion (310) of the peripheral portion (301) and the protruding portion (320) of the support portion (302). For example, the bonding agent (420) can be interposed between the recessed portion (310) and the protruding portion (320). For example, the bonding agent (420) can fill a gap between the protruding portion (320) and the recessed portion (310) in the space (S) formed by the recessed portion (310). For example, the bonding agent (420) can attach the protruding portion (320) to the recessed portion (310). The bonding agent (420) can surround the protruding portion (320) by being disposed along an inner surface (e.g., a bottom surface (310a), a side surface (310b)) of the recessed portion (310). For example, the bonding agent (420) may include a conductive material. The bonding agent (420) may electrically connect the peripheral portion (301) and the support portion (302) by coming into contact with the recessed portion (310) and the protruding portion (320). The bonding agent (420) may include, for example, silver (Ag) for electrical connection between the peripheral portion (301) and the support portion (302), but is not limited thereto. For example, the bonding agent (420) may include, but is not limited to, various materials that have conductivity and are hardened, such as a curable and / or cured conductive adhesive material, and a curable and / or cured conductive adhesive, and the bonding agent (420) may include a conductive material that can change from a liquid state to a solid state to have rigidity, thereby electrically and mechanically connecting the peripheral portion (301) and the support portion (302).

[0103] For example, the bonding agent (420) may be hardened as the assembly process of the frame (300) progresses. For example, after the bonding agent (420) (or conductive adhesive material) having a liquid property is applied to the recessed portion (310), the protruding portion (320) is inserted into the space (S) formed by the recessed portion (310), so that the bonding agent (420) having a liquid property can at least partially flow to fill the gap between the recessed portion (310) and the protruding portion (320) within the space (S). After the protruding portion (320) is inserted into the space (S), the bonding agent (420) may be hardened over time to fasten the protruding portion (320) to the recessed portion (310). The process of fastening the protruding portion (320) to the recessed portion (310) through the above bonding agent (420) is described later in FIGS. 5a to 5c.

[0104] In one embodiment, the bonding agent (420) may include a first portion (421) that is attached to a recessed portion (310) of the peripheral portion (301), and a second portion (422) that is engaged with the protruding portion (320) by filling one or more grooves (410) such that the support portion (302) is coupled to the peripheral portion (301).

[0105] For example, the first portion (421) may be a portion that is attached to and / or in contact with the recess portion (310) of the bonding agent (420). For example, the first portion (421) may be disposed along the recess portion (310) (or the bottom surface (310a) of the recess portion (310). The first portion (421) may form a face-to-face attachment structure with the recess portion (310) by covering at least a portion of the recess portion (310). For example, the first portion (421) may be a portion that is in contact with the bottom surface (310a) of the recess portion (310) and the first protruding surface (320a) of the protruding portion (320) that face each other. The first part (421) is positioned between the bottom surface (310a) and the first protruding surface (320a), thereby allowing the first protruding surface (320a) to be attached to the bottom surface (310a).

[0106] For example, the second portion (422) may be connected to the first portion (421). For example, the second portion (422) may be a portion that is positioned within one or more grooves (410) of the protruding portion (320) of the bonding agent (420). The second portion (422) may be surrounded by the one or more grooves (410) by filling the one or more grooves (410). For example, the second portion (422) may be coupled to the protruding portion (320) by being fastened within the one or more grooves (410). For example, the second portion (422) may be formed by a portion of the bonding agent (420) permeating into one or more grooves (410) of the protruding portion (320) inserted into the space (S) formed by the recessed portion (310), and then the portion of the bonding agent (420) hardening. The second portion (422) may be formed by the hardening of the portion of the bonding agent (420), thereby engaging the one or more grooves (410). The second portion (422) may enhance the bonding force between the protruding portion (320) and the recessed portion (310) by engaging the one or more grooves (410).

[0107] In one embodiment, the one or more grooves (410) and the second portion (422) of the coupling agent (420) may be interlocked to form a dovetail joint. For example, the second portion (422) of the coupling agent (420) may form a dovetail joint by being engaged with each of the one or more grooves (410) to reduce the protruding portion (320) from being dislodged from the coupling agent (420). For example, as illustrated, the second portion (422) may include a plurality of angled portions (422a, 422b, 422c, 422d). The one or more grooves (410) may include a plurality of grooves (410a, 410b, 410c, 410d) having a shape corresponding to each of the plurality of angled tenons (422a, 422b, 422c, 422d) so as to accommodate the plurality of angled tenons (422a, 422b, 422c, 422d). The plurality of grooves (410a, 410b, 410c, 410d) may be referred to as dovetail recesses or as molds for forming the shape of the second portion (422) at the point where they engage each of the plurality of angled tenons (422a, 422b, 422c, 422d), but are not limited thereto.

[0108] For example, each of the plurality of angled sections (422a, 422b, 422c, 422d) may include a trapezoidal shape having an acute angle (a1) at an edge that engages with each of the plurality of grooves (410a, 410b, 410c, 410d) so as to engage with each of the plurality of grooves (410a, 410b, 410c, 410d). The plurality of grooves (410a, 410b, 410c, 410d) may have a shape corresponding to a trapezoidal shape having the angle (a1) such that the plurality of angled portions (422a, 422b, 422c, 422d) are respectively engaged with the plurality of grooves (410a, 410b, 410c, 410d) in a shape having the angle (a1). However, the present invention is not limited thereto, and the one or more grooves (410) may have various shapes such that the second portion (422) of the bonding agent (420) that fills the one or more grooves (410) and hardens, and the one or more grooves (410) form a dovetail joint.

[0109] According to one embodiment, the recessed portion (310) may include a bottom surface (310a) that contacts the first portion (421), and a side surface (310b) that extends from the bottom surface (310a) and surrounds the protruding portion (320) of the support portion (302). The side surface (310b) may be inclined toward the protruding portion (320) of the support portion (302).

[0110] For example, the bottom surface (310a) of the recessed portion (310) may be a surface on which the bonding agent (420) is settled. The bottom surface (310a) may be a surface on which the first part (421) of the bonding agent (420) is attached. The bottom surface (310a) may be a surface facing the first protruding surface (320a) of the protruding part (320) that presses the first part (421). For example, the side surface (310b) of the recessed portion (310) may be a surface that surrounds the bonding agent (420) together with the bottom surface (310a) of the recessed portion (310). The side surface (310b) may be a surface that forms the recessed portion (310) by having a step from the inner surface (301a) of the peripheral portion (301). The above side surface (310b) may be a surface configured to surround a second protruding surface (320b) extending from a first protruding surface (320a) of a protruding portion (320).

[0111] For example, the side surface (310b) of the recessed portion (310) may be inclined toward the second protruding surface (320b) of the protruding portion (320), thereby being inclined with respect to the second protruding surface (320b). For example, the side surface (310b) of the recessed portion (310) may be inclined toward the protruding surface (320b) with respect to an imaginary line (l) that is parallel to the second protruding surface (320b) of the protruding portion (320). The side surface (310b) may be configured to have a trapezoidal shape in which the angle (a2) between the bottom surface (310a) and the side surface (310b) is an acute angle by being inclined toward the second protruding surface (320b). However, the present invention is not limited thereto. The recessed portion (310) has a shape in which the side surface (310b) is inclined toward the protruding portion (320), thereby reducing the protruding portion (320) from being separated from the space (S) formed by the recessed portion (310) or the bonding agent (420) from being leaked out of the space (S).

[0112] In one embodiment, the bonding agent (420) may include a third portion (423) extending from the first portion (421) and interposed between the side surface (310b) of the recessed portion (310) and the protruding portion (320) of the support portion (302). For example, the third portion (423) may be a portion that fills a gap between the side surface (310b) of the recessed portion (310) and the second protruding surface (320b) of the protruding portion (320) within the space (S) formed by the recessed portion (310). The third portion (423) may attach the second protruding surface (320b) to the side surface (310b) by filling the gap between the side surface (310b) and the second protruding surface (320b). For example, the third portion (423) of the bonding agent (420) may surround at least a portion of the protruding portion (320). For example, since the side surface (310b) of the recessed portion (310) is inclined toward the second protruding surface (320b) of the protruding portion (320), the third portion (423) can be interposed between the side surface (310b) and the second protruding surface (320b) without flowing out from the space (S) formed by the recessed portion (310).

[0113] According to one embodiment, the protruding portion (320) can be inserted at least partially into a space (S) provided by the recessed portion (310) to form a dovetail joint together with the recessed portion (310) and the bonding agent (420). For example, after a bonding agent (420) having a liquid property is applied to the recessed portion (310), the bonding agent (420) can be inserted into the space (S) formed by the recessed portion (310), thereby causing the bonding agent (420) to be pressed by the protruding portion (320). A portion of the pressed bonding agent (420) can be filled into one or more grooves (410) formed in the protruding portion (320). The remaining portion of the pressurized bonding agent (420) may fill a gap between a first protruding surface (320a) of the protruding portion (320) and a bottom surface (310a) of the recessed portion (310) and a gap between a second protruding surface (320b) of the protruding portion (320) and a side surface (310b) of the recessed portion (310) that is inclined toward the second protruding surface (320b). The portion of the bonding agent (420) filled within the one or more grooves (410) may be formed into a second portion (422) that, when cured, engages with the one or more grooves (410) to form a dovetail joint. The remaining portion of the bonding agent (420) filling the gap between the first protruding surface (320a) and the bottom surface (310a) and the gap between the second protruding surface (320b) and the side surface (310b) may be formed into a first portion (421) and a third portion (423) that, when cured, interlock with the recessed portion (310) together with the protruding portion (320) to form a dovetail joint. For example, the interlocking structure between the second portion (422) filled in one or more grooves (410) of the protruding portion (320) and the one or more grooves (410) may be referred to as a first dovetail joint of the peripheral portion (301) and the support portion (302).The structure in which the protruding portion (320) is engaged with the recessed portion (310) by the first portion (421) and the third portion (423) between the protruding portion (320) and the recessed portion (310) may be referred to as a second dovetail joint between the peripheral portion (301) and the support portion (302). However, it is not limited thereto.

[0114] Although not shown, the frame (300) may include various structures that engage at least a portion of the protruding portion (320) and / or the recessed portion (310) by hardening a bonding agent (420) positioned within the space (S) formed by the recessed portion (310). Exemplary embodiments of the structures for enhancing the bonding strength of the peripheral portion (301) and the support portion (302) are illustrated and described in FIGS. 6A to 7B.

[0115] According to the above-described embodiment, the frame (300) of the electronic device (101) includes a peripheral portion (301) including a recessed portion (310), and a support portion (302) including a protruding portion (320) configured to be inserted into a space (S) formed by the recessed portion (310), thereby improving the bonding force between the peripheral portion (301) and the support portion (302). The frame (300) includes a bonding agent (420) that is engaged with the protruding portion (320) by filling at least one of the grooves (410) formed in the protruding portion (320), thereby improving the bonding force between the peripheral portion (301) and the support portion (302). The above bonding agent (420) can improve the bonding strength between the peripheral portion (301) and the support portion (302) by filling the gap between the protruding portion (320) and the recessed portion (310) within the space (S) formed by the recessed portion (310).

[0116] Figures 5a, 5b, and 5c illustrate the connection of the periphery and the support of an exemplary frame.

[0117] Referring to FIGS. 5A, 5B, and 5C, an electronic device (101) may include a display (e.g., a display (201) of FIG. 2A) and a frame (300) supporting the display (201) (e.g., a frame structure (240) of FIG. 2B). The frame (300) may include a peripheral portion (301) including a recessed portion (310), a support portion (302) including a protruding portion (320) including one or more grooves (410), and a bonding agent (420) configured to bond the support portion (302) to the peripheral portion (301).

[0118] Referring to Fig. 5a, a bonding agent (420) can be applied within a space (S) formed by a recessed portion (310) of a peripheral portion (301). For example, the bonding agent (420) can be attached to the recessed portion (310) so as to cover the bottom surface (310a) of the recessed portion (310). The bonding agent (420) attached to the recessed portion (310) can be flowable by having a liquid property. The protruding portion (320) of the support portion (302) can protrude from one surface (302a) of the support portion (302) facing the peripheral portion (301). The recessed portion (310) may include a bottom surface (310a) for receiving the protruding portion (320) and a side surface (310b) that extends from the bottom surface (310a) and is formed to be stepped from the inner surface (301a) of the peripheral portion (301). The protruding portion (320) may include protruding faces (320a, 320b) that form the surface of the protruding portion (320).

[0119] Referring sequentially to FIGS. 5a and 5b, the protruding portion (320) of the support portion (302) can be inserted into the space (S) formed by the recessed portion (310). A fluidizable binder (420) can flow into one or more grooves (410) formed in the protruding portion (320) or into the gap between the protruding portion (320) and the recessed portion (310) by being pressed by the protruding portion (320) (or the first protruding surface (320a) of the protruding portion (320). A portion of the bonding agent (420) between the bottom surface (310a) of the recessed portion (310) and the first protruding surface (320a) of the protruding portion (320) may be formed, by hardening, into a first portion (421) of the bonding agent (420) that attaches the first protruding surface (320a) to the bottom surface (310a). A portion of the bonding agent (420) that has flowed into one or more grooves (410) of the protruding portion (320) may be formed, by hardening, into a second portion (422) of the bonding agent (420) that engages the one or more grooves (410). A portion of the bonding agent (420) that has flowed into the gap between the side surface (310b) of the recessed portion (310) and the second protruding surface (320b) of the protruding portion (320) may be formed into a third portion (423) of the bonding agent (420) that attaches the second protruding surface (320b) to the side surface (310b) by being hardened. Since the side surface (310b) is configured to be inclined toward the second protruding surface (320b), the side surface (310b) can reduce the third portion (423) from flowing out of the space (S) formed by the recessed portion (310).

[0120] Referring sequentially to FIGS. 5b and 5c, a non-conductive material (303) can be bonded to the peripheral portion (301) and the support portion (302). The non-conductive material (303) can seal a space (S) provided by the recessed portion (310) of the peripheral portion (301). For example, after the protruding portion (320) is inserted into the space (S) formed by the recessed portion (310), a portion of the peripheral portion (301) and / or the support portion (302) can be removed or processed for bonding with the non-conductive material (303). The non-conductive material (303) can be injected into the peripheral portion (301) and / or the support portion (302) to seal a space (S) in which a bonding agent (420) is disposed. For example, the non-conductive material (303) can be attached to the inner surface (301a) of the peripheral portion (301) to prevent the bonding agent (420) from leaking out through the gap between the side surface (310b) of the recessed portion (310) and the second protruding surface (320b) of the protruding portion (320). However, the present invention is not limited thereto, and the frame (300) may include sealing members that are coupled with the peripheral portion (301) and / or the support portion (302) to prevent the bonding agent (420) from leaking out.

[0121] According to the above-described embodiment, the frame (300) of the electronic device (101) includes a peripheral portion (301) including a recessed portion (310), and a support portion (302) including a protruding portion (320) configured to be inserted into a space (S) formed by the recessed portion (310), thereby improving the bonding force between the peripheral portion (301) and the support portion (302). The frame (300) includes a bonding agent (420) that is engaged with the protruding portion (320) by filling at least one of the grooves (410) formed in the protruding portion (320), thereby improving the bonding force between the peripheral portion (301) and the support portion (302). The above bonding agent (420) can improve the bonding strength between the peripheral portion (301) and the support portion (302) by filling the gap between the protruding portion (320) and the recessed portion (310) within the space (S) formed by the recessed portion (310).

[0122] Figures 6a and 6b illustrate the connection of the periphery and support of an exemplary frame.

[0123] Referring to FIGS. 6A and 6B , an electronic device (e.g., the electronic device (101) of FIG. 1 ) may include a display (e.g., the display (201) of FIG. 2A ) and a frame (300) supporting the display (201) (e.g., the frame structure (240) of FIG. 2B ). The frame (300) may include a peripheral portion (301) that surrounds an edge of the display (201) and includes a recessed portion (310) positioned within the electronic device (101). The frame (300) may include a support portion (302) that includes a protruding portion (320) that is positioned below the display (201) and is at least partially inserted into a space (S) provided by the recessed portion (310). The protruding portion (320) may include one or more grooves (410). The frame (300) may include a bonding agent (420) positioned at least partially between the recessed portion (310) of the peripheral portion (301) and the protruding portion (320) of the support portion (302). The bonding agent (420) may include a first portion (421) attached to the recessed portion (310) of the peripheral portion (301), and a second portion (422) that engages the protruding portion (320) by filling the one or more grooves (410) so that the support portion (302) is coupled to the peripheral portion (301).

[0124] Hereinafter, descriptions of overlapping configurations having the same reference numerals as those described in FIGS. 4 to 5c are omitted.

[0125] According to one embodiment, the protruding portion (320) may include a first protruding surface (320a) that contacts the first portion (421). One or more grooves (410) may extend inwardly (e.g., in the +x direction) of the support portion (302) from the first protruding surface (320a). The one or more grooves (410) may be arranged along the first protruding surface (320a) (e.g., in the +z direction). For example, the first protruding surface (320a) may be a surface facing the bottom surface (310a) of the recessed portion (310) of the protruding portion (320). The first portion (421) of the bonding agent (420) may be disposed between the bottom surface (310a) and the first protruding surface (320a). For example, one or more grooves (410) may extend from the first protruding surface (320a) through the protruding portion (320) into the inside of the support portion (302). For example, referring to FIGS. 6A and 6B, the protruding portion (320) may be inserted into the space (S) formed by the recessed portion (310). Since the one or more grooves (410) formed in the protruding portion (320) extend from the first protruding surface (320a) toward the inside of the support portion (302), at least a portion of the one or more grooves (410) may be positioned outside the space (S). The second portion (422) of the bonding agent (420) filling the one or more grooves (410) may flow into the one or more grooves (410), thereby being positioned at least partially outside the space (S).

[0126] For example, although not shown, the frame (300) may include a structure (e.g., a structure of the side surface (310b) inclined toward the second protruding surface (320b) of FIG. 4, a non-conductive material (303) of FIG. 5c) to reduce leakage of the bonding agent (420) through a gap between the side surface (310b) of the recessed portion (310) and the second protruding surface (320b) of the protruding portion (320). The frame (300) may include one or more grooves (410) extending from the first protruding surface (320a) through the protruding portion (320) into the interior of the support portion (302), thereby increasing the contact area between the second portion (422) of the bonding agent (420) filled into the one or more grooves (410) through the first protruding surface (320a) and the one or more grooves (410). The frame (300) can increase the bonding force between the support (302) and the peripheral portion (301) by increasing the contact area between the second portion (422) and the one or more grooves (410) and provide additional space for the second portion (422). The frame (300) can guide the bonding agent to flow into the one or more grooves (410) by including a structure for reducing the outflow of the bonding agent (420) through the gap between the second protruding surface (320b) extending from the first protruding surface (320a) and the side surface (310b) of the recessed portion (310).

[0127] In one embodiment, the protruding portion (320) may include a second protruding surface (320b) extending from the support portion (302) to the first protruding surface (320a), and a channel (600) penetrating the second protruding surface (320b) and the one or more grooves (410). The bonding agent (420) may include a fourth portion (424) that is connected to the second portion (422) and fills the channel (600) to engage the protruding portion (320). For example, the second protruding surface (320b) may be a surface that forms the protruding portion (320) by having a step from one surface (302a) facing the inner surface (301a) of the periphery (301) of the support portion (302). The second protruding surface (320b) may be a surface connecting the one surface (302a) of the support portion (302) and the first protruding surface (320a) of the protruding portion (320). The second protruding surface (320b) may be a surface facing the side surface (310b) of the recessed portion (310) when the protruding portion (320) is inserted into the space (S) formed by the recessed portion (310).

[0128] For example, one or more grooves (410) of the protruding portion (320) may each extend from a first protruding surface (320a) of the protruding portion (320) facing the bottom surface (310a) of the recessed portion (310) toward the inside of the support portion (302) (e.g., in the +x direction). A channel (600) may extend from the first protruding surface (320a) and penetrate a second protruding surface (320b) facing the side surface (310b) of the recessed portion (310). The channel (600) may extend from the second protruding surface (320b) to penetrate each of the one or more grooves (410) (e.g., in the +z direction). For example, the channel (600) may be connected to each of the one or more grooves (410) by penetrating each of the one or more grooves (410). For example, the channel (600) may be positioned within the space (S) formed by the recessed portion (310) by being positioned within the protruding portion (320) of the support portion (302), but is not limited thereto, and the channel (600) may be positioned within the support portion (302) or outside the space (S) by penetrating each of the one or more grooves (410) extending into the support portion (302) through the protruding portion (320).

[0129] For example, referring sequentially to FIGS. 6A and 6B , a portion of the bonding agent (420) may be pressed by the protruding portion (320) to fill one or more grooves (410) formed within the protruding portion (320), and an interior of a channel (600) penetrating each of the one or more grooves (410) and connected to the one or more grooves (410). The portion of the bonding agent (420) filling the one or more grooves (410) and the channel (600) may be hardened over time to engage the one or more grooves (410) and the channel (600). For example, referring to FIG. 6b, a second portion (422) of the bonding agent (420) filling one or more grooves (410) can be connected to a fourth portion (424) of the bonding agent (420) filling the interior of a channel (600) penetrating the one or more grooves (410). The second portion (422) is connected to the first portion (421) of the bonding agent (420) attached to the bottom surface (310a) of the recessed portion (310), and the fourth portion (424) is connected to the third portion (423) of the bonding agent (420) attached to the side surface (310b) of the recessed portion (310), thereby fixing the protruding portion (320) to the recessed portion (310). The frame (300) can improve the bonding force between the peripheral portion (301) and the support portion (302) by including a fourth portion (424) of the bonding agent (420) that is engaged with the protruding portion (320) by filling the channel (600) and connecting with the one or more grooves (410).

[0130] According to the above-described embodiment, the frame (300) of the electronic device (101) includes a peripheral portion (301) including a recessed portion (310), and a support portion (302) including a protruding portion (320) configured to be inserted into a space (S) formed by the recessed portion (310), thereby improving the bonding force between the peripheral portion (301) and the support portion (302). The frame (300) includes at least one groove (410) formed in the protruding portion (320), and a bonding agent (420) that fills a channel (600) penetrating the at least one groove (410) and engages the protruding portion (320), thereby improving the bonding force between the peripheral portion (301) and the support portion (302).

[0131] Figures 7a and 7b illustrate the connection of the periphery and the support of an exemplary frame.

[0132] Referring to FIGS. 7A and 7B , an electronic device (e.g., the electronic device (101) of FIG. 1 ) may include a display (e.g., the display (201) of FIG. 2A ) and a frame (300) supporting the display (201) (e.g., the frame structure (240) of FIG. 2B ). The frame (300) may include a peripheral portion (301) that surrounds an edge of the display (201) and includes a recessed portion (310) positioned within the electronic device (101). The frame (300) may include a support portion (302) that includes a protruding portion (320) that is positioned below the display (201) and is at least partially inserted into a space (S) provided by the recessed portion (310). The protruding portion (320) may include one or more grooves (410). The frame (300) may include a bonding agent (420) positioned at least partially between the recessed portion (310) of the peripheral portion (301) and the protruding portion (320) of the support portion (302). The bonding agent (420) may include a first portion (421) attached to the recessed portion (310) of the peripheral portion (301), and a second portion (422) that engages the protruding portion (320) by filling the one or more grooves (410) so that the support portion (302) is coupled to the peripheral portion (301).

[0133] According to one embodiment, the recessed portion (310) may include a bottom surface (310a) that contacts the first portion (421), a side surface (310b) extending from the bottom surface (310a) and surrounding the protruding portion (320) of the support portion (302), and one or more other grooves (710) formed on at least a portion of the bottom surface (310a) and the side surface (310b) and filled by the bonding agent (420). For example, the one or more other grooves (710) may be disposed along the bottom surface (310a) and / or the side surface (310b) of the recessed portion (310). The one or more other grooves (710) may extend from the bottom surface (310a) and / or the side surface (310b) of the recessed portion (310) toward the exterior of the electronic device (101) (e.g., in the +z direction and / or the -x direction).

[0134] For example, one or more of the other grooves (710) may include first grooves (711) formed in the side surface (310b). The bonding agent (420) may include a fifth portion (425) that engages the recessed portion (310) by filling the first grooves (711). For example, referring sequentially to FIGS. 7A and 7B , the protruding portion (320) may be inserted into the space (S) formed by the recessed portion (310). The bonding agent (420) may be pressed by the protruding portion (320) such that at least a portion thereof flows into the gap between the side surface (310b) of the recessed portion (310) and the second protruding surface (320b) of the protruding portion (320). A portion of the bonding agent (420) that has flowed into the gap between the side surface (310b) and the second protruding surface (320b) may flow into the first grooves (711) formed in the side surface (310b). The portion of the bonding agent (420) that fills the gap between the side surface (310b) and the second protruding surface (320b) and the first grooves (711) may harden over time. By hardening, the portion of the bonding agent (420) may attach the second protruding surface (320b) to the side surface (310b) and engage the recessed portion (310) through the first grooves (711). For example, the fifth portion (425) of the bonding agent (420) filling the first grooves (711) can be connected to the third portion (423) of the bonding agent (420) filling the gap between the side surface (310b) of the recessed portion (310) and the second protruding surface (320b) of the protruding portion (320). Since the third portion (423) is connected to the first portion (421) of the bonding agent (420) attaching the first protruding surface (320a) of the protruding portion (320) to the bottom surface (310a) of the recessed portion (310), the fifth portion (425) can improve the bonding force between the protruding portion (320) and the recessed portion (310).

[0135] For example, one or more of the other grooves (710) may include second grooves (712) formed in the bottom surface (310a). The bonding agent (420) may include a sixth portion (426) that engages the recessed portion (310) by filling the second grooves (712). For example, referring to FIG. 7A, the bonding agent (420) may be applied on the bottom surface (310a) of the recessed portion (310) to fill the second grooves (712) formed in the bottom surface (310a). Referring sequentially to FIGS. 7A and 7B, after the protruding portion (320) is inserted into the space (S) formed by the recessed portion (310), a portion of the bonding agent (420) that fills the second grooves (712) may be cured. The above-mentioned part of the bonding agent (420) may be hardened to engage with the recessed portion (310) (or the bottom surface (310a) of the recessed portion (310). For example, the sixth part (426) of the bonding agent (420) that engages with the recessed portion (310) by filling the second grooves (712) may form a dovetail joint with the second grooves (712). For example, similar to the joint structure between one or more grooves (410) and the second part (422) of the bonding agent (420) exemplarily illustrated in FIG. 4, the second grooves (712) may have a shape corresponding to the angled tenons such that the sixth part (426) of the bonding agent (420) filling the second grooves (712) is hardened to form the angled tenons. However, the above-mentioned embodiments are exemplary and not limited thereto.

[0136] In one embodiment, the second grooves (712) may each face one or more grooves (410) of the protruding portion (320). For example, the second grooves (712) may be formed along a bottom surface (310a) of the recessed portion (310). The one or more grooves (410) may be formed along a first protruding surface (320a) of the protruding portion (320) facing the bottom surface (310a). The second grooves (712) may each be positioned at a position corresponding to the one or more grooves (410). For example, the second portion (422) of the bonding agent (420) filling the one or more grooves (410) may face the sixth portion (426) of the bonding agent (420) filling the second grooves (712) with respect to the first portion (421) of the bonding agent (420). However, the embodiment is not limited thereto, and the recessed portion (310) may include various groove structures to improve the bonding force with the protruding portion (320) by engaging with the bonding agent (420).

[0137] It should be noted that the embodiments described in FIGS. 4 to 7b are exemplary embodiments for improving the bonding force between the periphery (301) of the frame (300) and the support (302) using a bonding agent (420), and are not limited thereto, and the present disclosure may include a combination of the embodiments described in FIGS. 4 to 7b.

[0138] According to the above-described embodiment, the frame (300) of the electronic device (101) includes a peripheral portion (301) including a recessed portion (310), and a support portion (302) including a protruding portion (320) configured to be inserted into a space (S) formed by the recessed portion (310), thereby improving the bonding force between the peripheral portion (301) and the support portion (302). The frame (300) includes a bonding agent (420) that engages the protruding portion (320) by filling at least one groove (410) formed in the protruding portion (320) and one or more other grooves (710) formed in the recessed portion (310), thereby improving the bonding force between the peripheral portion (301) and the support portion (302).

[0139] Figure 8 is a flowchart illustrating the manufacturing process of an exemplary frame.

[0140] The processes of FIG. 8 may be processes for manufacturing the frame structure (240) of FIG. 2b or the frame (300) of FIGS. 3a to 7b.

[0141] In process (801), a peripheral portion (e.g., the side bezel structure (218) of FIG. 2A, the peripheral portion (301) of FIG. 3A) may be manufactured by processing a first metal material. For example, process (801) may include a step of forming a component to be provided as the peripheral portion (301) through the first metal material. The process (801) may include a step of generating the peripheral portion (301) including a recessed portion (e.g., the recessed portion (310) of FIG. 4) defined by a recess (or space (S) of FIG. 4) formed by removing a portion of the component. For example, process (801) may include a step of injecting the first metal material into a mold having a shape corresponding to the recessed portion (310). The above process (801) may include a step of creating a peripheral portion (301) including the recessed portion (310) by injecting the first metal material into the mold and then hardening the first metal material. For example, the peripheral portion (301) may be manufactured to include the recessed portion (310) through CNC machining or casting of the first metal material and / or a component formed by the first metal material. The first metal material may include, but is not limited to, at least one of titanium and stainless steel, for example.

[0142] In the process (803), the support (e.g., the support portion (243) of FIG. 2B, the support portion (302) of FIG. 3A) may be manufactured by processing a second metal material different from the first metal material. For example, the process (803) may include a step of injecting the second metal material into a mold. The process (803) may include a step of forming the support (302) by hardening the second metal material injected into the mold. The support (302) may include a protruding portion (e.g., the protruding portion (320) of FIG. 4) to be inserted into a recess (or space (S)) provided by the recess portion (310) of the peripheral portion (301). The protruding portion (320) included in the support (302) may include one or more grooves (e.g., one or more grooves (410) of FIG. 4). For example, the mold into which the second metal material is injected may be configured such that the size of the protruding portion (320) of the support portion (302) to be formed by the mold is smaller than the size of the recess to be provided by the recess portion (310). The mold may be configured such that the protruding portion (320) including the one or more recesses (410) is formed in the support portion (302) by having a shape corresponding to one or more grooves (410) through the second metal material injected into the mold. For example, the process (803) may include a step of forming a component to be provided as the support portion (302) through the second metal material. The process (803) may include a step of creating the protruding portion (320) and the one or more recesses (410) formed in the protruding portion (320) by removing a portion of the component. For example, a support member (302) including a protruding portion (e.g., a protruding portion (320) of FIG. 4) having one or more grooves (e.g., one or more grooves (410) of FIG. 4) formed therein may be manufactured through CNC machining or casting of a second metal. The second metal may include, but is not limited to, aluminum, for example.

[0143] In process (805), a conductive adhesive material to be provided as a bonding agent (e.g., bonding agent (420) of FIG. 4) may be applied to the recessed portion (310) of the peripheral portion (301). For example, the conductive adhesive material may be referred to as a bonding agent (420) having liquid properties. The conductive adhesive material may be applied on the bottom surface (e.g., bottom surface (310a) of FIG. 4) of the recessed portion (310), for example, by being injected into a space (e.g., space (S) of FIG. 4) formed by the recessed portion (310). The conductive adhesive material may include, but is not limited to, at least one of epoxy and silver (Ag).

[0144] In process (807), the protruding portion (320) included in the support member (302) can be inserted into a recess (or space (S)) provided by the recessed portion (320) so that one or more grooves (410) formed in the protruding portion (320) are filled with a conductive adhesive material applied to the recessed portion (310). The conductive adhesive material having a liquid property applied within the space (S) can be pressed by the protruding portion (320). A portion of the bonding agent (420) (e.g., the second portion (422) of FIG. 4) can fill one or more grooves (410) formed in the protruding portion (320) by the protruding portion (320). The one or more grooves (410) may be filled with the conductive adhesive material to form a structure for electrical and mechanical bonding with a bonding agent (e.g., a bonding agent (420) of FIG. 4) to be formed by the conductive adhesive material.

[0145] In process (809), after the protruding portion (320) of the support portion (302) is inserted into the recess provided by the recess portion (310) of the peripheral portion (301), the conductive adhesive material may be cured over time. For example, the conductive adhesive material may be cured while the protruding portion (320) is inserted into the space (S) formed by the recess portion (310). For example, in process (809), at least a portion of the conductive adhesive material interposed between the protruding portion (320) and the bottom surface (310a) of the recess portion (310) may be cured to form a first portion (e.g., the first portion (421) of FIG. 4) of the bonding agent (420) that attaches the protruding portion (320) to the bottom surface (310a). For example, in process (809), at least a portion of the conductive adhesive material filling one or more grooves (410) formed in the protruding portion (320) may be formed into a second portion (422) of the bonding agent (420) that is interlocked with the protruding portion (320) by curing. The second portion (422) may form a dovetail joint with the one or more grooves (410) formed in the protruding portion (320), but is not limited thereto. For example, in process (809), at least a portion of the conductive adhesive material interposed between the protruding portion (320) and the side surface (310b) of the recessed portion (310) may be formed into a third portion (e.g., the third portion (423) of FIG. 4) of a bonding agent (420) that attaches the protruding portion (320) to the side surface (310b) by curing.

[0146] Figure 9 illustrates the connection of the periphery and the support of an exemplary frame.

[0147] Referring to FIG. 9, unlike FIGS. 4 to 7B, a frame (300) of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a support portion (302) including a recessed portion (910), a peripheral portion (301) including a protruding portion (920), and a bonding agent (420) disposed between the recessed portion (910) and the protruding portion (920). The protruding portion (920) may be inserted into a space provided by the recessed portion (910). The protruding portion (920) may include a plurality of recesses (930) (or grooves). The above bonding agent may include a portion (941) that is attached to the recessed portion (910) of the support portion (302), and a portion (942) that fills the plurality of recesses (930) of the protruding portion (920) to engage the protruding portion (920). In one embodiment, the bonding agent may include a portion (943) that fills the gap between the protruding portion (920) of the peripheral portion (301) and the recessed portion (910) of the support portion (302) to bond the protruding portion (920) to the recessed portion (910). However, the above-described embodiment is exemplary and is not limited thereto.

[0148] For example, the joint structure of the peripheral portion (301) including the protruding portion (920) including a plurality of recesses (930) and the support portion (302) including the recessed portion (910) may be applied to examples of the mechanical interlocking structures and / or mechanisms of the frame (300) illustrated in FIGS. 4 to 7B, respectively. For example, as illustrated, the recessed portion (910) of the support portion (302) and the protruding portion (920) of the peripheral portion (301) may form a dovetail joint. For example, as illustrated, the plurality of recesses (930) formed in the protruding portion (920) of the peripheral portion (301) and the portion (942) of the bonding agent (420) filling the plurality of recesses (930) may be interlocked with each other to form a dovetail joint. For example, as illustrated in FIGS. 6A and 6B, the peripheral portion (301) may include a channel penetrating the protruding portion (920). The bonding agent (420) may be engaged with the protruding portion (920) (or the peripheral portion (301)) by filling the channel. For example, as illustrated in FIGS. 7A and 7B, the supporting portion (302) may include one or more grooves formed in the recessed portion (910) and engaged with the bonding agent (420). However, the embodiment is not limited thereto, and the frame (300) may be configured to enhance the bonding strength between the peripheral portion (301) and the supporting portion (302) by including a structure in which the peripheral portion (301) and the supporting portion (302) are engaged using a solidifiable bonding agent (420).

[0149] According to one embodiment, a method for manufacturing a frame (e.g., frame structure (240) of FIG. 2B, frame (300) of FIG. 3A) used in an electronic device (e.g., electronic device (101) of FIG. 1) may include a step of forming a component to be provided as a periphery of the frame (e.g., side bezel structure (218) of FIG. 2A, periphery (301) of FIG. 3A) using a first metal material. The periphery may define at least a portion of a side surface of the electronic device (e.g., side surface (200C) of FIG. 2A). The method may include a step of generating the periphery by removing a portion of the component, the periphery including a recessed portion (e.g., recessed portion (310) of FIG. 4) defined by a recess formed by removing the portion of the component. The method may include a step of injecting a second metal material into a mold. The method may include a step of forming a support portion (e.g., a support portion (243) of FIG. 2B, a support portion (302) of FIG. 3A) of the frame to be placed under a display (e.g., a display (201) of FIG. 2A) of the electronic device by hardening the second metal material injected into the mold. The support portion of the frame may include a portion (e.g., a protruding portion (320) of FIG. 4) to be inserted into the recess. The portion included in the support portion may include one or more grooves (e.g., one or more grooves (410) of FIG. 4). A size of the portion included in the support portion may be smaller than a size of the recess. The method may include a step of applying a conductive adhesive material to the recess portion included in the peripheral portion of the frame. The method may include a step of inserting the portion included in the support portion of the frame into the recess such that the conductive adhesive material applied to the recess portion is pressed by the portion included in the support portion of the frame.The one or more grooves may be filled with the conductive adhesive material by the insertion. The method may include a step of manufacturing the frame by attaching the support portion of the frame to the peripheral portion of the frame through a bonding agent (e.g., bonding agent (420) of FIG. 4) formed by curing the conductive adhesive material after the insertion. At least a portion of the bonding agent positioned within the one or more grooves may engage the support portion of the frame and the peripheral portion of the frame.

[0150] For example, the first metal material may include titanium (Ti). The second metal material may include aluminum (Al).

[0151] For example, the conductive adhesive material may include at least one of epoxy and silver (Ag).

[0152] For example, the recessed portion may include a bottom surface (e.g., a bottom surface (310a) of FIG. 4)) and a side surface extending from the bottom surface and surrounding the portion of the support (e.g., a side surface (310b) of FIG. 4). The side surface may be inclined toward the portion of the support.

[0153] For example, the bonding agent may include a first portion (e.g., a first portion (421) of FIG. 4) interposed between the bottom surface of the recessed portion and the portion of the support. The bonding agent may include a second portion (e.g., a second portion (422) of FIG. 4) protruding from the first portion and positioned within the one or more grooves. The bonding agent may include a third portion (e.g., a third portion (423) of FIG. 4) interposed between the side surface of the recessed portion and the portion of the support.

[0154] For example, the second portion may include a plurality of angled tenons (e.g., tenons 422a, 422b, 422c, 422d of FIG. 4). The one or more grooves may have a shape corresponding to each of the plurality of angled tenons so as to accommodate the plurality of angled tenons.

[0155] For example, the method may further include, after the insertion, a step of injecting a non-conductive material (e.g., the non-conductive material (303) of FIG. 3A) onto the support portion of the frame using another mold. The method may further include a step of curing the non-conductive material so that the non-conductive material seals the recess.

[0156] For example, the method may further include a step of forming a channel (e.g., channel (600) of FIG. 6a) penetrating the one or more grooves using the mold. The method may further include a step of filling the channel with the conductive adhesive material by the insertion. At least a portion of the bonding agent formed by the curing of the conductive adhesive material after the insertion (e.g., fourth portion (424) of FIG. 6b) may be positioned within the channel so as to engage the support portion of the frame and the peripheral portion of the frame.

[0157] For example, the bonding agent can electrically and mechanically bond the support portion of the frame to the periphery of the frame through the curing.

[0158] For example, the method may further include a step of creating one or more other grooves (e.g., one or more other grooves (710) of FIG. 7A) formed in at least a portion of the recessed portion by removing another portion of the component. The method may further include a step of filling the one or more other grooves with the conductive adhesive material by the insertion. At least a portion of the bonding agent formed by the curing of the conductive adhesive material after the insertion may be positioned within the one or more other grooves to engage the support portion of the frame and the periphery of the frame.

[0159] For example, the one or more other grooves may include first grooves formed on a side surface of the recessed portion (e.g., the first grooves (711) of FIG. 7A). The bonding agent may include a portion (e.g., the fifth portion (425) of FIG. 7B) that engages the recessed portion by filling the first grooves.

[0160] For example, the one or more other grooves may include second grooves formed on the bottom surface of the recessed portion (e.g., second grooves (712) of FIG. 7a). The bonding agent may include a portion (e.g., sixth portion (426) of FIG. 7b) that engages the recessed portion by filling the second grooves.

[0161] For example, the second grooves may each face one or more of the grooves of the protruding portion.

[0162] For example, each of the one or more grooves of the support member may have a dovetail shape.

[0163] For example, the recess in the peripheral portion may have a dovetail shape.

[0164] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a display (e.g., display (201) of FIG. 2A) and a frame (e.g., frame structure (240) of FIG. 2B, frame (300) of FIG. 3A) supporting the display. The frame may include a peripheral portion (e.g., peripheral portion (301) of FIG. 3A) that surrounds an edge of the display and includes a recessed portion (e.g., recessed portion (310) of FIG. 4) positioned within the electronic device. The frame may include a support portion (e.g., support portion (302) of FIG. 3A) that includes a protruding portion (e.g., protruding portion (320) of FIG. 4) positioned below the display and at least partially inserted into a space (e.g., space (S) of FIG. 4) provided by the recessed portion. The protruding portion may include one or more grooves (e.g., one or more grooves (410) of FIG. 4). The frame may include a bonding agent (e.g., bonding agent (420) of FIG. 4) positioned at least partially between the recessed portion of the peripheral portion and the protruding portion of the support portion. The bonding agent may include a first portion (e.g., first portion (421) of FIG. 4) attached to the recessed portion of the peripheral portion, and a second portion (e.g., second portion (422) of FIG. 4) engaged with the protruding portion by filling the one or more grooves such that the support portion is coupled to the peripheral portion.

[0165] For example, the peripheral portion may be formed of a metal including titanium (Ti). The supporting portion may be formed of a metal including aluminum (Al).

[0166] For example, the recessed portion may include a bottom surface (e.g., bottom surface (310a) of FIG. 4) and a side surface (e.g., side surface (310b) of FIG. 4) extending from the bottom surface and surrounding the protruding portion of the support. The side surface may be inclined toward the protruding portion of the support.

[0167] For example, the bonding agent may further include a third portion (e.g., the third portion (423) of FIG. 4) interposed between the side surface of the recessed portion and the protruding portion of the support.

[0168] For example, the one or more grooves and the second portion of the bonding agent may be interlocked with each other to form a dovetail joint.

[0169] For example, the second portion may include a plurality of angled tenons (e.g., the plurality of angled tenons (422a, 422b, 422c, 422d) of FIG. 4). The one or more grooves may have a shape corresponding to each of the plurality of angled tenons so as to accommodate the plurality of angled tenons.

[0170] For example, the frame may further include a non-conductive material (e.g., non-conductive material (303) of FIG. 3A) that is coupled to the support portion and the peripheral portion and seals the space provided by the recess portion.

[0171] For example, the protruding portion may further include a first protruding surface (e.g., the first protruding surface (320a) of FIG. 4) that contacts the first portion. The one or more grooves may extend inward from the first protruding surface into the support portion and be arranged along the first protruding surface.

[0172] For example, the protruding portion may further include a second protruding surface (e.g., the second protruding surface (320b) of FIG. 4) extending from the support portion to the first protruding surface, and a channel (e.g., the channel (600) of FIG. 6a) penetrating the second protruding surface and the one or more grooves. The bonding agent may further include a fourth portion (e.g., the fourth portion (424) of FIG. 6a) that is connected to the second portion and interlocks with the protruding portion by filling the channel.

[0173] For example, the recessed portion may include a bottom surface in contact with the first portion, a side surface extending from the bottom surface and surrounding the protruding portion of the support, and one or more other grooves formed in at least a portion of the bottom surface and the side surface and filled by the bonding agent (e.g., one or more other grooves (710) of FIG. 7A).

[0174] For example, the one or more other grooves may include first grooves formed on the side (e.g., first grooves (711) of FIG. 7A).

[0175] The above bonding agent may include a fifth portion (e.g., the fifth portion (425) of FIG. 7a) that engages with the recessed portion by filling the first grooves.

[0176] For example, the one or more other grooves may include second grooves formed on the bottom surface (e.g., second grooves (712) of FIG. 7A). The bonding agent may include a sixth portion (e.g., sixth portion (426) of FIG. 7A) that engages the recessed portion by filling the second grooves.

[0177] For example, the second grooves may each face one or more of the grooves of the protruding portion.

[0178] For example, the binder may include silver (Ag).

[0179] For example, the protruding portion may be inserted at least partially into the space provided by the recessed portion to form a dovetail joint together with the recessed portion and the bonding agent.

[0180] In one embodiment, an electronic device may include a display and a frame supporting the display. The frame may include a peripheral portion that surrounds an edge of the display and includes a recessed portion positioned within the interior of the electronic device. The frame may include a support portion that is disposed below the display and includes a protruding portion that is at least partially inserted into a space provided by the recessed portion. The protruding portion may include one or more grooves. The frame may include a non-conductive material that is disposed along the edge of the display to be coupled with the support portion and to seal the space provided by the recessed portion. The frame may include a bonding agent that is at least partially positioned between the recessed portion of the peripheral portion and the protruding portion of the support portion. The bonding agent may include a first portion that is attached to the recessed portion of the peripheral portion and a second portion that fills the one or more recesses to form a dovetail joint with the protruding portion so that the support portion is coupled to the peripheral portion.

[0181] For example, the peripheral portion may be formed of a metal including titanium. The support portion may be formed of a metal including aluminum.

[0182] For example, the recessed portion may include a bottom surface that contacts the first portion, and a side surface that extends from the bottom surface and is inclined toward the protruding portion, surrounding the protruding portion of the support. The bonding agent may further include a third portion that is interposed between the side surface of the recessed portion and the protruding portion of the support.

[0183] For example, the recessed portion may include one or more other grooves formed on at least a portion of the bottom surface and the side surface and filled by the bonding agent.

[0184] For example, the protruding portion may further include a first protruding surface that contacts the first portion, a second protruding surface that extends from the support portion to the first protruding surface, and a channel that penetrates the second protruding surface and the one or more grooves. The bonding agent may further include a fourth portion that is connected to the second portion and interlocks with the protruding portion by filling the channel.

[0185] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0186] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0187] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0188] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0189] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0190] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a method for manufacturing a frame (240; 300) used in an electronic device (101), A step of forming a component to be provided as a periphery (301) of the frame (240; 300) through a first metal material, the periphery (301) defining at least a part of a side surface (200C) of the electronic device (101); A step of creating a peripheral portion (301) including a recess portion (310) defined by a recess formed by removing a portion of the component; A step of injecting a second metal material into a mold; A step of forming a support portion (302) of the frame (240; 300) to be placed under the display (201) of the electronic device by hardening the second metal material injected into the mold, the support portion (302) of the frame (240; 300) including a portion (320) to be inserted into the recess, the portion (320) included in the support portion (302) including one or more grooves (410), and the size of the portion (320) included in the support portion (302) is smaller than the size of the recess; A step of applying a conductive adhesive material to the recessed portion (310) included in the peripheral portion (301) of the frame (240; 300); A step of inserting the part (320) included in the support part (302) of the frame into the recess so that the conductive adhesive material applied to the recess part (310) is pressed by the part (320) included in the support part (302) of the frame, wherein the one or more grooves (410) are filled with the conductive adhesive material by the insertion; and A step of manufacturing the frame (240; 300) by attaching the support portion (302) of the frame (240; 300) to the peripheral portion (301) of the frame (240; 300) through a bonding agent (420) formed by hardening the conductive adhesive material after the insertion, At least a portion of the bonding agent (420) positioned within the one or more grooves (410) engages the support portion (302) of the frame (240; 300) and the peripheral portion (301) of the frame (240; 300). method.

2. In paragraph 1, The above first metal material is, Contains titanium (Ti), The above second metal material is, Containing aluminum (Al), method.

3. In paragraph 1 or 2, The above-mentioned conductive adhesive material is, Containing at least one of epoxy, or silver (Ag), method.

4. In any one of paragraphs 1 to 3, The above recessed portion (310) is floor surface (310a); and extending from the above bottom surface (310a) and including a side surface (310b) surrounding the above portion (320) of the above support member (302), The above side (310b) is inclined toward the above part (320) of the above support (302). method.

5. In paragraph 4, The above bonding agent (420) is A first part (421) interposed between the bottom surface (310a) of the recessed part (310) and the part (320) of the support part (302); A second part (422) protruding from the first part (421) and positioned within one or more grooves (410); and Including a third part (423) interposed between the side surface (310b) of the recessed part (310) and the part (320) of the support part (302). method.

6. In paragraph 5, The above second part (422) is, Contains multiple angled joints (422a, 422b, 422c, 422d), The above one or more homes (410) are, In order to accommodate the plurality of angled sections (422a, 422b, 422c, 422d), each of the plurality of angled sections (422a, 422b, 422c, 422d) has a shape corresponding to each of the plurality of angled sections (422a, 422b, 422c, 422d). method.

7. In any one of paragraphs 1 to 6, After the above insertion, a step of injecting a non-conductive material onto the support part (302) of the frame (240; 300) using another mold; and further comprising a step of curing the non-conductive material so that the non-conductive material seals the recess; method.

8. In any one of paragraphs 1 to 7, A step of forming a channel (600) penetrating one or more of the grooves (410) using the mold; and By the above insertion, the step of filling the channel (600) with the conductive adhesive material is further included, At least a portion of the bonding agent (420) formed by the hardening of the conductive adhesive material after the insertion is positioned within the channel (600) so that the support portion (302) of the frame (240; 300) and the peripheral portion (301) of the frame (240; 300) are engaged. method.

9. In any one of paragraphs 1 to 8, The above bonding agent (420) is Electrically and mechanically connecting the support portion (302) of the frame (240; 300) to the peripheral portion (301) of the frame (240; 300) through the above hardening. method.

10. In any one of paragraphs 1 to 9, A step of creating one or more other grooves (710) formed in at least a portion of the recess portion (310) by removing another portion of the above component; and By the above insertion, further comprising the step of filling the conductive adhesive material into the one or more other grooves (710), At least a portion of the bonding agent (420) formed by the hardening of the conductive adhesive material after the insertion is positioned within the one or more other grooves (710) so that the support portion (302) of the frame (240; 300) and the peripheral portion (301) of the frame (240; 300) are engaged. method.

11. In paragraph 10, One or more of the other homes (710) above, Including first grooves (711) formed on the side (310b) of the above recessed portion (310), The above bonding agent (420) is By filling the first grooves (711) above, including a part (425) that engages with the recessed part (310), method.

12. In paragraph 10, One or more of the other homes (710) above, Including second grooves (712) formed on the bottom surface (310a) of the above recessed portion (310), The above bonding agent (420) is By filling the second grooves (712), including a portion (426) that engages with the recessed portion (310), method.

13. In paragraph 12, The above second grooves (712) are, Each of the above-described one or more grooves (410) of the above-described portion (320) faces, method.

14. In any one of paragraphs 1 to 13, Each of the one or more grooves (410) of the above support member (302) is Having a dovetail shape, method.

15. In the electronic device (101), display (201); and It comprises a frame (240; 300), and the frame (240; 300) comprises: A peripheral portion (301) comprising a recessed portion (310) positioned inside the electronic device (101) and surrounding at least a portion of the edge of the display (201); A support (302) including a protruding portion (320) disposed below the display (201) and inserted at least partially into a space (S) provided by the recess portion (310), the protruding portion (320) including one or more grooves (410); and It includes a bonding agent (420) that attaches the protruding portion (320) to the recessed portion (310), and the bonding agent (420) is A first part (421) attached to the recessed part (310) of the peripheral part (301); and A second portion (422) extending from the first portion (421) and positioned within one or more grooves (410) so as to engage the protruding portion (320) of the support portion (302) with the recessed portion (310) of the peripheral portion (301), Electronic device (101).

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