Sensor module

Abstract

An embodiment provides a sensor module comprising: a first camera actuator; a second camera actuator which is arranged at the rear end of the first camera actuator; a circuit board including an image sensor disposed at a rear end of the second camera actuator; a shield can surrounding the first camera actuator, the second camera actuator, and the circuit board; a body surrounding the shield can; and a heat dissipation unit in contact with the body and the circuit board, wherein the body comprises a first groove overlapping the image sensor in an optical axis direction, and the heat dissipation unit is disposed to surround the side surface of the first groove.

Description

sensor module

[0001] The embodiment relates to a sensor module. Specifically, the embodiment relates to a sensor module that can facilitate heat dissipation generated from a sensor.

[0002] A camera is a device that captures images or videos of a subject, and is installed in portable devices, drones, vehicles, etc. Camera modules may have an image stabilization (IS) function that compensates for or prevents image shaking caused by the user's movements to improve image quality, an auto focusing (AF) function that automatically adjusts the distance between the image sensor and the lens to align the focal length of the lens, and a zooming function that increases or decreases the magnification of a distant subject and captures it using a zoom lens.

[0003] However, since the heat generated from the image sensor is only slightly transferred to the outside, there is a problem that a temperature difference occurs between the image sensor and the bracket surrounding the outside of the sensor module. When heat is transferred between solids within the camera module, the air layer at the bonded area may be large, which may be detrimental to heat dissipation. The heat generated from the image sensor may cause a decrease in the performance of the image sensor or lens. Therefore, a method to facilitate the heat dissipation generated from such an image sensor is required.

[0004] The embodiment provides a sensor module that is advantageous in dissipating heat generated internally.

[0005] The embodiment provides a sensor module with improved heat dissipation effect.

[0006] The embodiment provides a sensor module in which the temperature difference between the image sensor and the bracket is reduced.

[0007] The embodiment provides a sensor module with reduced manufacturing cost and improved manufacturing stability.

[0008] The embodiment provides a sensor module with reduced size.

[0009] The embodiment provides a sensor module with increased durability.

[0010] The problem to be solved in the embodiment is not limited to this, and it can be said that the purpose or effect that can be understood from the solution or embodiment of the problem described below is also included.

[0011] A sensor module according to an embodiment includes: a first camera actuator; a second camera actuator disposed at a rear end of the first camera actuator; a circuit board including an image sensor disposed at a rear end of the second camera actuator; a shield can surrounding the first camera actuator, the second camera actuator, and the circuit board; a body surrounding the shield can; and a heat dissipation unit in contact with the body and the circuit board; wherein the body includes a first groove overlapping the image sensor in an optical axis direction, and the heat dissipation unit can be disposed to surround a side surface of the first groove.

[0012] The first groove may include a first side and a second side spaced apart in a first direction and a third side perpendicular to the first side and the second side, and the heat dissipation portion may be in contact with the first side to the third side, the first direction may be a direction perpendicular to the optical axis direction, and the second direction may be a direction perpendicular to the optical axis direction and the first direction.

[0013] The above heat dissipation part includes a first heat dissipation part to a third heat dissipation part, and the first heat dissipation part may partially overlap the first side in the first direction, and the second heat dissipation part may partially overlap the second side in the first direction.

[0014] The heat dissipation member includes an outer surface in contact with a side surface of the first groove and an inner surface spaced apart from the outer surface, and the outer surface may be flat and the inner surface may be curved.

[0015] The first heat dissipation portion and the second heat dissipation portion can be bent in the second direction from the third heat dissipation portion.

[0016] The heat dissipation unit may overlap the circuit board in the optical axis direction, and the heat dissipation unit may include an upper surface that contacts the circuit board.

[0017] The shield can may include the circuit board and a second groove overlapping the first groove and the optical axis direction.

[0018] The first direction width of the second groove may be greater than the first direction width of the first groove, and the second direction width of the second groove may be greater than the second direction width of the first groove.

[0019] The second groove includes a fourth side and a fifth side spaced apart in the first direction and a sixth side perpendicular to the fourth side and the fifth side, the sixth side overlapping the heat dissipation portion in the second direction, and the fourth side and the fifth side overlapping the heat dissipation portion in the first direction.

[0020] The fourth side to the sixth side may be spaced apart from the outer surface of the heat dissipation portion by a certain distance.

[0021] The first groove includes a first side and a second side spaced apart in a first direction, the first groove penetrates the body in a second direction, the first direction is a direction perpendicular to the optical axis direction, and the second direction may be a direction perpendicular to the optical axis direction and the first direction.

[0022] The heat dissipation unit includes a first heat dissipation unit and a second heat dissipation unit, and the first heat dissipation unit and the second heat dissipation unit partially overlap with the shield can in the second direction and can come into contact with the lower surface of the shield can.

[0023] The shield can includes the image sensor and a second groove overlapping the first groove and the optical axis direction, and a width of the second groove in the first direction may be smaller than a width of the first groove in the first direction.

[0024] The second groove includes a fourth side and a fifth side spaced apart in the first direction and a sixth side perpendicular to the fourth side and the fifth side, and the first heat dissipation portion can be in contact with the fourth side, and the second heat dissipation portion can be in contact with the fifth side.

[0025] The first heat dissipation portion includes a first protrusion protruding in the first direction, the second heat dissipation portion includes a second protrusion protruding in the first direction and spaced apart from the first protrusion, the first protrusion can be in contact with the first side surface, and the second protrusion can be in contact with the second side surface.

[0026] A sensor module according to an embodiment includes: a first camera actuator; a second camera actuator disposed at a rear end of the first camera actuator; a circuit board including an image sensor disposed at a rear end of the second camera actuator; a shield can surrounding the first camera actuator, the second camera actuator, and the circuit board; a body surrounding the shield can; and a heat dissipation unit in contact with the shield can and the circuit board, wherein the body includes a first groove overlapping the image sensor in an optical axis direction, the shield can includes a second groove overlapping the image sensor and the first groove in an optical axis direction, and the heat dissipation unit may be disposed to surround a side surface of the second groove.

[0027] The above heat dissipation member includes a lower surface spaced apart from the circuit board and the shield can, and the lower surface may be curved.

[0028] The heat dissipation member includes a third protrusion protruding in the direction of the optical axis, and an outer surface of the third protrusion can come into contact with a side surface of the second groove.

[0029] The circuit board may include a first frame in contact with the shield can, and the first frame may include a fourth protrusion overlapping the second groove in the first direction.

[0030] The upper surface of the third protrusion can contact the lower surface of the first frame, and the inner surface of the third protrusion can contact the side surface of the fourth protrusion.

[0031] The material of the above heat dissipation part may be the same as the material of the first frame, the shield can, and the body.

[0032] According to an embodiment, a sensor module advantageous for heat dissipation generated internally can be provided.

[0033] According to an embodiment, a sensor module with improved heat dissipation effect can be provided.

[0034] According to an embodiment, a sensor module with a reduced temperature difference between an image sensor and a bracket can be provided.

[0035] According to an embodiment, a sensor module with reduced manufacturing cost and improved manufacturing stability can be provided.

[0036] According to an embodiment, a sensor module with a reduced size can be provided.

[0037] According to an embodiment, a sensor module with increased durability can be provided.

[0038] The various advantageous and beneficial effects of the present invention are not limited to the above-described contents, and will be more easily understood in the course of explaining specific embodiments of the present invention.

[0039] Figure 1 is a perspective view of a sensor module according to an embodiment.

[0040] Fig. 2 is an exploded perspective view of a sensor module according to an embodiment.

[0041] Figure 3 is a cross-sectional view taken along line AA' in Figure 1.

[0042] Fig. 4 is an exploded perspective view of a sensor module according to an embodiment.

[0043] Fig. 5 is a front view of a sensor module according to an embodiment.

[0044] Fig. 6 is a rear view of a sensor module according to an embodiment.

[0045] Fig. 7 is a perspective view of a body according to an embodiment.

[0046] Fig. 8 is a bottom view of a body according to an embodiment.

[0047] Fig. 9 is a perspective view of a shield can according to an embodiment.

[0048] Fig. 10 is a bottom view of a shield can according to an embodiment.

[0049] Fig. 11 is a perspective view of a circuit board according to an embodiment.

[0050] Fig. 12 is a perspective view of a heat dissipation unit according to an embodiment.

[0051] Fig. 13 is a bottom view of a heat dissipation unit according to an embodiment.

[0052] Figure 14 is an enlarged view of part A of Figure 5.

[0053] Fig. 15 is a bottom view of a sensor module according to an embodiment.

[0054] Fig. 16 is a partial enlarged view of the cross-section cut along BB' in Fig. 5.

[0055] Fig. 17 is an enlarged view showing the arrangement of the body, shield can, and heat dissipation unit according to the embodiment.

[0056] Fig. 18 is a front view of a sensor module according to another embodiment.

[0057] Fig. 19 is a perspective view of a body according to an embodiment.

[0058] Fig. 20 is a bottom view of a body according to an embodiment.

[0059] Fig. 21 is a perspective view of a shield can according to an embodiment.

[0060] Fig. 22 is a bottom view of a shield can according to an embodiment.

[0061] Fig. 23 is a perspective view of a heat dissipation unit according to an embodiment.

[0062] Fig. 24 is a bottom view of a heat dissipation unit according to an embodiment.

[0063] Figure 25 is an enlarged view of part B of Figure 18.

[0064] Fig. 26 is a bottom view of a sensor module according to an embodiment.

[0065] Fig. 27 is a front view of a sensor module according to another embodiment.

[0066] Fig. 28 is a perspective view of a circuit board according to an embodiment.

[0067] Fig. 29 is a partially enlarged view of a front view of a circuit board according to an embodiment.

[0068] Fig. 30 is a bottom view of a circuit board according to an embodiment.

[0069] Fig. 31 is a perspective view of a heat dissipation unit according to an embodiment.

[0070] Fig. 32 is a bottom view of a heat dissipation unit according to an embodiment.

[0071] Figure 33 is an enlarged view of part C of Figure 27.

[0072] Fig. 34 is a bottom view of a sensor module according to an embodiment.

[0073] Figure 35 is a table showing the heat dissipation effect of a sensor module according to an embodiment.

[0074] Fig. 36 is a perspective view of a mobile terminal to which a sensor module according to an embodiment is applied.

[0075] Fig. 37 is a perspective view of a vehicle to which a sensor module according to an embodiment is applied.

[0076] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0077] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0078] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0079] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0080] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0081] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0082] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0083] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0084] Additionally, when described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below", it can include the meaning of a downward direction as well as an upward direction based on one component.

[0085] FIG. 1 is a perspective view of a sensor module according to an embodiment, FIG. 2 is an exploded perspective view of a sensor module according to an embodiment, and FIG. 3 is a view taken along line AA' in FIG. 1.

[0086] Referring to FIGS. 1 and 2, a sensor module (1000) according to an embodiment may be composed of a cover (CV), a first camera actuator (1100), a second camera actuator (1200), and a circuit board (1500). Here, the first camera actuator (1100) may be used interchangeably as a first actuator, and the second camera actuator (1200) may be used interchangeably as a second actuator.

[0087] The cover (CV) can cover the first camera actuator (1100) and the second camera actuator (1200). The coupling force between the first camera actuator (1100) and the second camera actuator (1200) can be improved by the cover (CV).

[0088] Furthermore, the cover (CV) may be made of a material that blocks electromagnetic waves. Accordingly, the first camera actuator (1100) and the second camera actuator (1200) within the cover (CV) can be easily protected.

[0089] A sensor module (1000) according to an embodiment may include a first camera actuator (1100).

[0090] The first camera actuator (1100) may be an OIS (Optical Image Stabilizer) actuator. For example, the first camera actuator (1100) may move an optical element in a direction perpendicular to the optical axis (axis of incident light).

[0091] The first camera actuator (1100) may include a fixed focal length lens arranged in a predetermined barrel (not shown). The fixed focal length lens may also be referred to as a “single focal length lens” or “single lens.”

[0092] The first camera actuator (1100) can change the path of light. In an embodiment, the first camera actuator (1100) can change the path of light vertically through an internal optical member (e.g., a prism or a mirror). For example, the optical member can change the light from the X-axis direction to the Z-axis direction. Or, the optical member can change the light from the first axis to the second axis. By this configuration, even if the thickness of the mobile terminal is reduced, a lens configuration larger than the thickness of the mobile terminal can be placed inside the mobile terminal through the change of the light path, thereby performing magnification, auto-focusing (AF), zoom, and OIS functions.

[0093] However, it is not limited thereto, and the first camera actuator (1100) can change the optical path vertically or at a predetermined angle multiple times.

[0094] The first camera actuator (1100) may include a housing, back cover epoxy, housing epoxy, and FPCB.

[0095] A sensor module (1000) according to an embodiment may include a second camera actuator (1200) positioned at the rear end of a first camera actuator (1100).

[0096] The second camera actuator (1200) may be positioned behind the first camera actuator (1100). The second camera actuator (1200) may be coupled to the first camera actuator (1100). The coupling between the two may be achieved in various ways.

[0097] Additionally, the second camera actuator (1200) may be a zoom actuator or an auto focus (AF) actuator. For example, the second camera actuator (1200) may support one or more lenses and move the lenses according to a control signal from a predetermined control unit to perform an auto focus function or a zoom function.

[0098] The second camera actuator (1200) may include a PCB, a main barrel, a barrel cover, a front cover tape, a top cover tape, and a rear cover tape.

[0099] A lens assembly may be placed between the first camera actuator (1100) and the second camera actuator (1200).

[0100] The circuit board (1500) may be placed at the rear end of the second camera actuator (1200). The circuit board (1500) may be electrically connected to the second camera actuator (1200) and the first camera actuator (1100). In addition, there may be a plurality of circuit boards (1300).

[0101] The first camera actuator (1100), the second camera actuator (1200), and the circuit board (1500) can be sequentially arranged along the optical axis direction.

[0102] A sensor module according to an embodiment may be composed of a single or multiple sensor modules. For example, the multiple sensor modules may include a first sensor module and a second sensor module. Furthermore, the sensor module may be used interchangeably with terms such as "sensor device," "camera device," "camera module," "camera device," "imaging device," "imaging module," and "imaging device."

[0103] And the first sensor module may include a single or multiple actuators. For example, the first sensor module may include a first camera actuator (1100) and a second camera actuator (1200).

[0104] And the second sensor module may be placed in a predetermined housing (not shown) and may include an actuator (not shown) capable of driving the lens unit. The actuator may be a voice coil motor, a micro actuator, a silicon actuator, etc., and may be applied in various ways such as an electrostatic method, a thermal method, a bimorph method, an electrostatic force method, etc., but is not limited thereto. In addition, the camera actuator in the present specification may be referred to as an actuator, etc. In addition, a camera module composed of a plurality of camera modules may be mounted in various electronic devices such as a mobile terminal. Furthermore, the actuator may be a device that moves or tilts a lens or an optical member. However, below, the actuator is described as a concept including a lens or an optical member. Furthermore, the actuator may be called a 'lens transport device', 'lens transport device', 'optical member transport device', 'optical member moving device', etc.

[0105] Referring to FIG. 3, a sensor module according to an embodiment may include a first camera actuator (1100) having an OIS function and a second camera actuator (1200) having a zooming function and an AF function.

[0106] Light can be incident into the sensor module or the first camera actuator through an opening area located on the upper surface of the first camera actuator (1100). That is, the light is initially incident into the interior of the first camera actuator (1100) along a vertical direction (e.g., X-axis direction, based on incident light), and the light path can be changed to the optical axis direction (e.g., Z-axis direction) through an optical member. Then, the light can pass through the second camera actuator (1200) and be incident on an image sensor (IS) located at one end of the second camera actuator (1200) (PATH).

[0107] Additionally, in the present specification, the inner side may be a direction toward the first camera actuator from the cover (CV), and the outer side may be a direction opposite to the inner side. That is, the first camera actuator and the second camera actuator may be located inside the cover (CV), and the cover (CV) may be located outside the first camera actuator or the second camera actuator.

[0108] In this specification, the bottom means one side in the first direction. And the first direction is the X-axis direction in the drawing and can be used interchangeably with the second-axis direction, etc. The second direction is the Y-axis direction in the drawing and can be used interchangeably with the first-axis direction, etc. The second direction is a direction perpendicular to the first direction. In addition, the third direction is the Z-axis direction in the drawing and can be used interchangeably with the third-axis direction, etc. It is a direction perpendicular to both the first direction and the second direction. Here, the third direction (Z-axis direction) corresponds to the direction of the optical axis, and the first direction (X-axis direction) and the second direction (Y-axis direction) are directions perpendicular to the optical axis. In addition, in the description of the sensor module (1000) below, the optical axis direction corresponds to the optical path and is the third direction (Z-axis direction), and the following description will be made based on this.

[0109] Fig. 4 is an exploded perspective view of a sensor module according to an embodiment, Fig. 5 is a front view of a sensor module according to an embodiment, and Fig. 6 is a back view of a sensor module according to an embodiment.

[0110] Referring to FIGS. 4 to 6, a sensor module (1000) according to an embodiment may include a first camera actuator (1100), a second camera actuator (1200), a body (1300), a shield can (1400), a circuit board (1500), a heat dissipation portion (1600), a tape (1700), and an epoxy portion (1800).

[0111] Fig. 7 is a perspective view of a body according to an embodiment, and Fig. 8 is a bottom view of a body according to an embodiment.

[0112] Referring to FIGS. 4 to 8, a sensor module (1000) according to an embodiment may include a body (1300) that surrounds a shield can (1400).

[0113] The body (1300) may be placed outside the sensor module (1000). For example, the body (1300) may surround the first camera actuator (1100), the second camera actuator (1200), the shield can (1400), and the circuit board (1500) located inside the sensor module (1000). With this configuration, the body (1300) may absorb external impacts on the sensor module (1000) or prevent foreign substances from entering. In other words, the body (1300) may improve the reliability of the sensor module (1000).

[0114] Specifically, the body (1300) may be positioned on a side portion of the sensor module (1000). Accordingly, the body (1300) may surround the side portions of the first camera actuator (1100), the second camera actuator (1200), the shield can (1400), and the circuit board (1500).

[0115] For example, the body (1300) may surround the exterior of the shield can (1400). The body (1300) may be in contact with the shield can (1400). In addition, the body (1300) may be in contact with the heat dissipation unit (1600). The body (1300) may include an Al bracket. With this configuration, the body (1300) can improve structural stability and perform effective heat dissipation.

[0116] Furthermore, the sensor module (1000) can protect the shield can (1400) and the circuit board (1500) placed inside the shield can (1400) from external impact by wrapping the side of the shield can (1400). The body (1300) can be in contact with the heat dissipation unit (1600). By being in contact with the heat dissipation unit (1600), the body (1300) can release heat generated from the image sensor to the outside through the heat dissipation unit (1600).

[0117] The body (1300) may include a first groove (1310). The first groove (1310) may overlap with the circuit board (1500) in the optical axis direction. In addition, the first groove (1310) may be located at the rear end of the circuit board (1500). Accordingly, the first groove (1310) may partially overlap with the circuit board (1500) in the optical axis direction. In addition, the first groove (1310) may also partially overlap with the first camera actuator (1100) and the second camera actuator (1200) in the optical axis direction.

[0118] The first groove (1310) may overlap with the heat dissipation unit (1600) in the optical axis direction. A portion of the first groove (1310) may overlap with a portion of the heat dissipation unit (1600) in the first direction or the second direction. The first groove (1310) may be in contact with the heat dissipation unit (1600). A portion of the side surface of the first groove (1310) may be in contact with a portion of the side surface of the heat dissipation unit (1600).

[0119] The first groove (1310) may be formed in a structure in which a portion of one side of the body (1300) is dug out. The first groove (1310) may be located in a portion of one side of the body (1300). The first groove (1310) may be located on the lower surface of the body (1300). The first groove (1310) may be positioned on a side of the body (1300) adjacent to the image sensor.

[0120] The first groove (1310) may include a first side (S1) and a second side (S2) spaced apart in a first direction, and a third side (S3) perpendicular to the first side (S1) and the second side (S2). The first side (S1) and the second side (S2) may be spaced apart from each other by a certain distance in the first direction. The first side (S1) and the second side (S2) may extend along the second direction. The third side (S3) may be perpendicular to the first side (S1) and the second side (S2). The third side (S3) may extend in the second direction.

[0121] Fig. 9 is a perspective view of a shield can according to an embodiment, and Fig. 10 is a bottom view of a shield can according to an embodiment.

[0122] Referring to FIGS. 4 to 6, 9 and 10, the sensor module (1000) according to the embodiment may include a shield can (1400).

[0123] The shield can (1400) can surround the first camera actuator (1100), the second camera actuator (1200), and the circuit board (1500). The shield can (1400) can surround the first and second camera actuators (1100, 1200) from the outside. The shield can (1400) can be arranged to be surrounded by the body (1600). The outer side surface of the shield can (1400) can be in contact with the inner surface of the body (1600).

[0124] The shield can (1400) may include a second groove (1410). The second groove (1410) may overlap with the circuit board (1500) in the optical axis direction. The second groove (1410) may be located at the rear end of the circuit board (1500). Accordingly, the second groove (1410) may partially overlap with the circuit board (1500) in the optical axis direction. In addition, the second groove (1410) may also partially overlap with the first camera actuator (1100) and the second camera actuator (1200) in the optical axis direction. The first groove (1310) may overlap with the heat dissipation unit (1600) in the optical axis direction.

[0125] The second groove (1410) may be formed in a structure in which a portion of one side of the shield can (1400) is dug out. The second groove (1410) may be located in a portion of one side of the shield can (1400). The second groove (1410) may be located on the lower surface of the shield can (1400). The second groove (1410) may be positioned on the side of the shield can (1400) adjacent to the image sensor.

[0126] The second groove (1410) may include a fourth side (S4) and a fifth side (S5) spaced apart in the first direction and a sixth side (S6) perpendicular to the fourth side (S4) and the fifth side (S5). The fourth side (S4) and the fifth side (S5) may be spaced apart from each other by a certain distance in the first direction. The fourth side (S4) and the fifth side (S5) may extend along the second direction. The sixth side (S6) may be perpendicular to the fourth side (S4) and the fifth side (S5). The sixth side (S6) may extend in the second direction.

[0127] Fig. 11 is a perspective view of a circuit board according to an embodiment.

[0128] Referring to FIGS. 4 to 6 and 11, a sensor module (1000) according to an embodiment may include a circuit board (1500).

[0129] In the sensor module (1000) according to the embodiment, the circuit board (1500) may include an image sensor (IS), and the image sensor (IS) may be fixed inside the sensor module (1000). The circuit board (1500) may be placed inside the shield can (1400). The circuit board (1500) may be in contact with the heat dissipation unit (1600). In addition, the circuit board (1500) may be electrically connected to another sensor module in the terminal or a processor of the terminal. Through this, the above-described camera actuator and the sensor module including the same may transmit and receive various signals in the terminal. The circuit board (1300) may include a circuit board having a wiring pattern that can be electrically connected, such as a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB), or a rigid-flexible printed circuit board (Rigid-Flexible PCB). However, the present invention is not limited to these types.

[0130] The circuit board (1500) may include a first unit board (1510), a second unit board (1520), an image sensor (IS), a first frame (1530), and a connector (CN). The first unit board (1510) may fix the image sensor (IS). The image sensor (IS) may be arranged on one surface of the first unit board (1510). The first unit board (1510) and the image sensor (IS) may be electrically connected.

[0131] The first unit substrate (1510) may be arranged on the same optical axis as the heat dissipation unit (1600). The second unit substrate (1520) may be located on the side of the sensor module (1000). The second unit substrate (1520) may be connected to the first unit substrate (1510). The second unit substrate (1520) may be connected to a connector (CN). The image sensor (IS) may receive light. The image sensor (IS) may receive light and convert the received light into an electrical signal. In addition, the image sensor (IS) may be formed of a plurality of pixels in an array form. And the image sensor (IS) may be located on the optical axis. The image sensor (IS) may be arranged at the rear end of the second camera actuator. The image sensor (IS) may be arranged on the first unit substrate (1510). The image sensor (IS) may be electrically connected to the first unit substrate (1510). The image sensor (IS) may be arranged on the same optical axis as the first unit substrate (1510) and the heat dissipation unit (1600). The sensor unit may include the image sensor (IS) and a base. The base may be in contact with the first unit substrate (1510). The connector (CN) may be connected to the second unit substrate (1520). Through the connector (CN), the sensor module or the circuit board may be electrically connected to an external electronic device. For example, the connector (CN) may be electrically connected to a processor or the like of an electronic device such as a terminal.

[0132] Fig. 12 is a perspective view of a heat dissipation unit according to an embodiment, and Fig. 13 is a bottom view of a heat dissipation unit according to an embodiment.

[0133] Referring to FIGS. 4 to 6, 12 and 13, the sensor module (1000) according to the embodiment may include a heat dissipation unit (1600).

[0134] The heat dissipation unit (1600) can transfer heat generated from the image sensor. The heat dissipation unit (1600) can be in contact with the body (1300) and the circuit board (1500). By being in contact with the body (1300) and the circuit board (1500), the heat dissipation unit (1600) can release heat generated from the image sensor of the circuit board (1500) to the outside of the sensor module (1000) through the body (1300).

[0135] The heat dissipation unit (1600) may include first to third heat dissipation units (1610, 1620, 1630). The first heat dissipation unit (1610) and the second heat dissipation unit (1620) may be arranged along the second direction. The first heat dissipation unit (1610) and the second heat dissipation unit (1620) may be arranged to be spaced apart from each other in the first direction. The third heat dissipation unit (1630) may be arranged along the first direction. The third heat dissipation unit (1630) may be connected to the first heat dissipation unit (1610) and the second heat dissipation unit (1620). The first heat dissipation unit (1610) and the second heat dissipation unit (1620) may be portions bent in the second direction from the third heat dissipation unit (1630). The first heat dissipation portion (1610) and the second heat dissipation portion (1620) may be portions protruding in the second direction from both ends of the third heat dissipation portion (1630).

[0136] The heat dissipation unit (1600) may include an outer surface (F1) and an inner surface (F2). The outer surface (F1) and the inner surface (F2) may be spaced apart from each other. The outer surface (F1) and the inner surface (F2) may be perpendicular to a first direction or a second direction. The outer surface (F1) may be flat. The inner surface (F2) may be curved. The heat dissipation unit (1600) may include an upper surface (F3). The upper surface (F3) may be in contact with the outer surface (F1) and the inner surface (F2). The upper surface (F3) may be perpendicular to the optical axis direction.

[0137] FIG. 14 is a partially enlarged view of a front view of a sensor module according to an embodiment, FIG. 15 is a bottom view of a sensor module according to an embodiment, FIG. 16 is a partially enlarged view of a cross-sectional view taken along line BB' in FIG. 5, and FIG. 17 is an enlarged view showing the arrangement of a body, a shield can, and a heat dissipation unit according to an embodiment.

[0138] Referring to FIGS. 14 to 17, the heat dissipation unit (1600) may be arranged to surround the side surface of the first groove (1310). The heat dissipation unit (1600) may be arranged to surround the first side surface to the third side surface (S1, S2, S3) of the first groove (1310). The heat dissipation unit (1600) may be in contact with the first side surface to the third side surface (S1, S2, S3). The first heat dissipation unit (1610) may be in contact with the first side surface (S1). The first heat dissipation unit (1610) may partially overlap with the first side surface (S1) in the first direction. A portion of the first heat dissipation unit (1610) may not overlap with the first side surface (S1) in the first direction and may not be in contact with the first side surface (S1). The second heat dissipation unit (1620) may be in contact with the second side surface (S2). The second heat dissipation portion (1620) may partially overlap with the second side surface (S2) in the first direction. A portion of the second heat dissipation portion (1620) may not overlap with the second side surface (S2) in the first direction and may not be in contact with the second side surface (S2). The third heat dissipation portion (1630) may be in contact with the third side surface (S3). The third heat dissipation portion (1630) may partially overlap with the third side surface (S3) in the second direction. A portion of the third heat dissipation portion (1630) may not overlap with the third side surface (S3) in the second direction and may not be in contact with the third side surface (S3).

[0139] The outer surface (F1) of the heat dissipation unit (1600) may be in contact with the side surface of the first groove (1310). The outer surface (F1) of the heat dissipation unit (1600) may be arranged to surround the first side surface to the third side surface (S1, S2, S3). The outer surface (F1) of the heat dissipation unit (1600) may partially overlap with the first side surface (S1) and the second side surface (S2) in the first direction. The outer surface (F1) of the heat dissipation unit (1600) may partially overlap with the third side surface (S3) in the second direction. The outer surface (F1) of the heat dissipation unit (1600) may overlap with the second groove (1410) of the shield can (1400) in the first direction or the second direction. However, the outer surface (F1) of the heat dissipation unit (1600) may not be in contact with the side surface of the second groove (1410). By having the outer surface (F1) of the heat dissipation unit (1600) in contact with the side surface of the first groove (1310), the heat dissipation unit (1600) can connect the body (1300) and the circuit board (1500), and can facilitate the release of heat generated from the image sensor of the circuit board (1500). In addition, the heat dissipation unit (1600) can improve the durability of the sensor module by being physically connected to the body (1300) and the circuit board (1500).

[0140] The inner surface (F2) of the heat dissipation unit (1600) may be spaced apart from the outer surface (F1) of the heat dissipation unit (1600). The inner surface (F2) of the heat dissipation unit (1600) may not be in contact with the body (1300) and the circuit board (1500). The upper surface (F3) of the heat dissipation unit (1600) may be in contact with the circuit board (1500). The upper surface (F3) of the heat dissipation unit (1600) may be in contact with the outer surface (F1) and the inner surface (F2). The upper surface (F3) of the heat dissipation unit (1600) may overlap with the circuit board (1500) in the optical axis direction. The upper surface (F3) of the heat dissipation unit (1600) may overlap with the first groove (1310) and the second groove (1410) in the optical axis direction.

[0141] The second groove (1410) of the shield can (1400) may overlap with the circuit board (1500) and the first groove (1310) in the optical axis direction. The second groove (1410) may overlap with the heat dissipation unit (1600) in the first direction, the second direction, or the optical axis direction. However, the second groove (1410) may not be in contact with the heat dissipation unit (1600). The fourth side surface (S4) of the second groove (1410) may be spaced apart from the first heat dissipation unit (1610) by a certain distance in the first direction. The fifth side surface (S5) may be spaced apart from the second heat dissipation unit (1620) by a certain distance in the first direction. The sixth side surface (S6) may be spaced apart from the third heat dissipation unit (1630) by a certain distance in the optical axis direction. The second groove (1410) of the shield can (1400) may be positioned further away from the image sensor in the optical axis direction than the upper surface (F3) of the heat dissipation unit (1600).

[0142] The first direction width of the second groove (1410) may be greater than the first direction width of the first groove. Additionally, the second direction width of the second groove (1410) may be greater than the second direction width of the first groove. The area of ​​the second groove (1410) may be greater than the area of ​​the first groove (1310).

[0143] Fig. 18 is a front view of a sensor module according to another embodiment.

[0144] Referring to FIG. 18, a sensor module (2000) according to an embodiment may include a first camera actuator (2100), a second camera actuator (2200), a body (2300), a shield can (2400), a circuit board (2500), a heat dissipation part (2600), a tape (2700), and an epoxy part (2800).

[0145] Fig. 19 is a perspective view of a body according to an embodiment, and Fig. 20 is a bottom view of a body according to an embodiment.

[0146] Referring to FIGS. 18 to 20, a sensor module (2000) according to an embodiment may include a body (2300).

[0147] The body (2300) may be placed outside the sensor module (2000). For example, the body (2300) may surround the first camera actuator (2100), the second camera actuator (2200), the shield can (2400), and the circuit board (2500) located inside the sensor module (2000). With this configuration, the body (2300) may absorb external impacts on the sensor module (2000) or prevent foreign substances from entering. In other words, the body (2300) may improve the reliability of the sensor module (2000).

[0148] Specifically, the body (2300) may be positioned on a side portion of the sensor module (2000). Accordingly, the body (2300) may surround the side portions of the first camera actuator (2100), the second camera actuator (2200), the shield can (2400), and the circuit board (2500).

[0149] For example, the body (2300) may surround the exterior of the shield can (2400). The body (2300) may be in contact with the shield can (2400). In addition, the body (2300) may be in contact with the heat dissipation unit (2600). The body (2300) may include an Al bracket. With this configuration, the body (2300) can improve structural stability and perform effective heat dissipation.

[0150] Furthermore, the sensor module (2000) can protect the shield can (2400) and the circuit board (2500) placed inside the shield can (2400) from external impact by covering the side of the shield can (2400). The body (2300) can be in contact with the heat dissipation unit (2600). By being in contact with the heat dissipation unit (2600), the body (2300) can release heat generated from the image sensor to the outside through the heat dissipation unit (2600).

[0151] The body (2300) may include a first groove (2310). The first groove (2310) may overlap with the circuit board (2500) in the optical axis direction. In addition, the first groove (2310) may be located at the rear end of the circuit board (2500). Accordingly, the first groove (2310) may partially overlap with the circuit board (2500) in the optical axis direction. In addition, the first groove (2310) may also partially overlap with the first camera actuator (2100) and the second camera actuator (2200) in the optical axis direction.

[0152] The first groove (2310) may overlap with the heat dissipation unit (2600) in the optical axis direction. A portion of the first groove (2310) may overlap with a portion of the heat dissipation unit (2600) in the first direction or the second direction. The first groove (2310) may be in contact with the heat dissipation unit (2600). A portion of the side surface of the first groove (2310) may be in contact with a portion of the side surface of the heat dissipation unit (2600).

[0153] The first groove (2310) can penetrate the body (2300) in a second direction. The width of the first groove (2310) in the second direction can be the same as the width of the body (2300) in the second direction. The first groove (2310) can be formed in a structure in which one side of the body (2300) is dug out. The first groove (2310) can be located in a portion of one side of the body (2300). The first groove (2310) can be located on the lower surface of the body (2300). The first groove (2310) can be arranged on a side of the body (2300) adjacent to the image sensor.

[0154] The first home (2310) may include a first side (S1) and a second side (S2) spaced apart in a first direction. The first side (S1) and the second side (S2) may be arranged spaced apart from each other by a certain distance in the first direction. The first side (S1) and the second side (S2) may extend along the second direction.

[0155] Fig. 21 is a perspective view of a shield can according to an embodiment, and Fig. 22 is a bottom view of a shield can according to an embodiment.

[0156] The shield can (2400) can surround the first camera actuator (2100), the second camera actuator (2200), and the circuit board (2500). The shield can (2400) can surround the first and second camera actuators (2100, 2200) from the outside. The shield can (2400) can be arranged to be surrounded by the body (2600). The outer side surface of the shield can (2400) can be in contact with the inner surface of the body (2600).

[0157] The shield can (2400) may include a second groove (2410). The second groove (2410) may overlap with the circuit board (2500) in the optical axis direction. The second groove (2410) may be located at the rear end of the circuit board (2500). Accordingly, the second groove (2410) may partially overlap with the circuit board (2500) in the optical axis direction. In addition, the second groove (2410) may also partially overlap with the first camera actuator (2100) and the second camera actuator (2200) in the optical axis direction. The first groove (2310) may overlap with the heat dissipation unit (2600) in the optical axis direction.

[0158] The second groove (2410) may be formed in a structure in which a portion of one side of the shield can (2400) is dug out. The second groove (2410) may be located in a portion of one side of the shield can (2400). The second groove (2410) may be located on the lower surface of the shield can (2400). The second groove (2410) may be positioned on the side of the shield can (2400) adjacent to the image sensor.

[0159] The second groove (2410) may include a fourth side (S4) and a fifth side (S5) spaced apart in the first direction and a sixth side (S6) perpendicular to the fourth side (S4) and the fifth side (S5). The fourth side (S4) and the fifth side (S5) may be spaced apart from each other by a certain distance in the first direction. The fourth side (S4) and the fifth side (S5) may extend along the second direction. The sixth side (S6) may be perpendicular to the fourth side (S4) and the fifth side (S5). The sixth side (S6) may extend in the second direction.

[0160] Fig. 23 is a perspective view of a heat dissipation unit according to an embodiment, and Fig. 24 is a bottom view of a heat dissipation unit according to an embodiment.

[0161] The heat dissipation unit (2600) can transfer heat generated from the image sensor. The heat dissipation unit (2600) can be in contact with the body (2300), the shield can (2400), and the circuit board (2500). By being in contact with the body (2300), the shield can (2400), and the circuit board (2500), the heat dissipation unit (2600) can release heat generated from the image sensor of the circuit board (2500) to the outside of the sensor module (2000) through the body (2300) and the shield can (2400).

[0162] The heat dissipation unit (2600) may include a first heat dissipation unit (2610) and a second heat dissipation unit (2620). The first heat dissipation unit (2610) and the second heat dissipation unit (2620) may be arranged along the second direction. The first heat dissipation unit (2610) and the second heat dissipation unit (2620) may be arranged to be spaced apart from each other in the first direction. The first heat dissipation unit (2610) and the second heat dissipation unit (2620) may partially overlap the shield can (2400) in the second direction and may be in contact with the lower surface of the shield can (2400). The first heat dissipation unit (2610) and the second heat dissipation unit (2620) can release heat generated from the image sensor of the circuit board (2500) to the outside of the sensor module (2000) through the body (2300) and the shield can (2400) by contacting the lower surface of the shield can (2400).

[0163] The first heat dissipation unit (2610) may include a first protrusion unit (2611) protruding in a first direction. The first protrusion unit (2611) may be a portion protruding in the first direction from the first heat dissipation unit (2610). The first protrusion unit (2611) may be disposed on the outside of the sensor module (2000) in the first direction from the first heat dissipation unit (2610). The first protrusion unit (2611) may be a portion in which a portion of the outer surface of the first heat dissipation unit (2610) protrudes. The width of the first protrusion unit (2611) in the optical axis direction may be smaller than the width of the first heat dissipation unit (2610) in the optical axis direction.

[0164] The second heat dissipation unit (2620) may include a second protrusion unit (2621) protruding in the first direction. The second protrusion unit (2621) may be a portion protruding in the first direction from the second heat dissipation unit (2620). The second protrusion unit (2621) may be disposed on the outside of the sensor module (2000) in the first direction from the second heat dissipation unit (2620). The second protrusion unit (2621) may be a portion in which a portion of the outer surface of the second heat dissipation unit (2620) protrudes. The width of the second protrusion unit (2621) in the optical axis direction may be smaller than the width of the second heat dissipation unit (2620) in the optical axis direction. The second protrusion unit (2621) may be spaced apart from the first protrusion unit (2611).

[0165] The heat dissipation unit (1600) may include an outer surface (F1) and an inner surface (F2). The outer surface (F1) and the inner surface (F2) may be spaced apart from each other. The outer surface (F1) and the inner surface (F2) may be perpendicular to a first direction or a second direction. The outer surface (F1) may be flat. The inner surface (F2) may be curved. The heat dissipation unit (1600) may include an upper surface (F3). The upper surface (F3) may contact the outer surface (F1) and the inner surface (F2). The upper surface (F3) may be perpendicular to the optical axis direction. The first heat dissipation unit (1610) and the second heat dissipation unit (1620) may include an outer surface (F1) and an inner surface (F2), respectively.

[0166] Fig. 25 is an enlarged view of part B of Fig. 18, and Fig. 26 is a bottom view of a sensor module according to an embodiment.

[0167] Referring to FIGS. 25 and 26, the first heat dissipation unit (2610) and the second heat dissipation unit (2620) may partially overlap with the shield can (2400) in the second direction. In addition, the first heat dissipation unit (2610) and the second heat dissipation unit (2620) may contact the side surface of the shield can (2400). The first heat dissipation unit (2610) and the second heat dissipation unit (2620) may partially overlap with the shield can (2400) in the optical axis direction. In addition, the first heat dissipation unit (2610) and the second heat dissipation unit (2620) may contact the lower surface of the shield can (2400). The first heat dissipation unit (2610) and the second heat dissipation unit (2620) may overlap with the circuit board (2500) in the optical axis direction. The first heat dissipation unit (2610) and the second heat dissipation unit (2620) may be in contact with the lower surface of the circuit board (2500). A portion of the first heat dissipation unit (2610) and the second heat dissipation unit (2620) may be positioned in the second groove (2410). The first heat dissipation unit (2610) may be in contact with the fourth side surface (S4). The second heat dissipation unit (2620) may be in contact with the fifth side surface (S5).

[0168] The first protrusion (2611) of the first heat dissipation portion (2610) and the second protrusion (2621) of the second heat dissipation portion (2620) can be in contact with the body (2300). The first protrusion (2611) and the second protrusion (2621) can be arranged in the first groove (2310). The first protrusion (2611) can be in contact with the first side surface (S1). The second protrusion (2621) can be in contact with the second side surface (S2). The outer surface (F1) of the first heat dissipation portion (2610) can be in contact with the first side surface (S1). The outer surface (F1) of the second heat dissipation portion (2620) can be in contact with the second side surface (S2). The first protrusion (2611) and the second protrusion (2621) can come into contact with the shield can (2400). The first protrusion (2611) and the second protrusion (2621) can come into contact with the lower surface of the shield can (2400).

[0169] Fig. 27 is a front view of a sensor module according to another embodiment.

[0170] Referring to FIG. 27, a sensor module (3000) according to an embodiment may include a first camera actuator (3100), a second camera actuator (3200), a body (3300), a shield can (3400), a circuit board (3500), a heat dissipation part (3600), a tape (3700), and an epoxy part (3800).

[0171] Fig. 28 is a perspective view of a circuit board according to an embodiment, Fig. 29 is a partially enlarged view of a front view of a circuit board according to an embodiment, and Fig. 30 is a bottom view of a circuit board according to an embodiment.

[0172] In the sensor module (3000) according to the embodiment, the circuit board (3500) may include an image sensor (IS), and the image sensor (IS) may be fixed inside the sensor module (3000). The circuit board (3500) may be placed inside the shield can (3400). The circuit board (3500) may be in contact with the heat dissipation unit (3600). In addition, the circuit board (3500) may be electrically connected to another sensor module in the terminal or a processor of the terminal. Through this, the camera actuator described above and the sensor module including the same may transmit and receive various signals in the terminal. The circuit board (3300) may include a circuit board having a wiring pattern that can be electrically connected, such as a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB), or a rigid-flexible printed circuit board (Rigid-Flexible PCB). However, the present invention is not limited to these types.

[0173] The circuit board (3500) may include a first unit board (3510), a second unit board (3520), an image sensor (IS), a first frame (3530), and a connector (CN). The first unit board (3510) may fix the image sensor (IS). The image sensor (IS) may be arranged on one surface of the first unit board (3510). The first unit board (3510) and the image sensor (IS) may be electrically connected.

[0174] The first unit substrate (3510) may be disposed on the same optical axis as the heat dissipation unit. The second unit substrate (3520) may be located on the side of the sensor module (3000). The second unit substrate (3520) may be connected to the first unit substrate (3510). The second unit substrate (3520) may be connected to a connector (CN). The image sensor (IS) may receive light. The image sensor (IS) may receive light and convert the received light into an electrical signal. In addition, the image sensor (IS) may be formed of a plurality of pixels in an array form. And the image sensor (IS) may be disposed on the optical axis. The image sensor (IS) may be disposed at the rear end of the second camera actuator. The image sensor (IS) may be disposed on the first unit substrate (3510). The image sensor (IS) may be electrically connected to the first unit substrate (3510). The image sensor (IS) may be arranged on the same optical axis as the first unit substrate (3510) and the heat dissipation unit. The sensor unit may include the image sensor (IS) and a base. The base may be in contact with the first unit substrate (3510). The connector (CN) may be connected to the second unit substrate (3520). Through the connector (CN), the sensor module or the circuit board may be electrically connected to an external electronic device. For example, the connector (CN) may be electrically connected to a processor or the like of an electronic device such as a terminal.

[0175] The first frame (3530) may be disposed below the first unit substrate (3510). The first frame (3530) may be disposed spaced apart from the image sensor (IS). The first frame (3530) may secure the circuit board (3500) inside the sensor module. The first frame (3530) may overlap the image sensor (IS) in the optical axis direction. The first frame (3530) may include a fourth protrusion (3531). The fourth protrusion (3531) may be disposed below the first frame (3530). The fourth protrusion (3531) may include a shape in which a portion of the lower surface of the first frame (3530) protrudes. The fourth protrusion (3531) may protrude in the optical axis direction. The first or second direction width of the fourth protrusion (3531) may be smaller than the first or second direction width of the first frame (3530). The first frame (3530) may include the fourth protrusion (3531) to facilitate welding of the heat dissipation portion to the circuit board (3500).

[0176] Fig. 31 is a perspective view of a heat dissipation unit according to an embodiment, and Fig. 32 is a bottom view of a heat dissipation unit according to an embodiment.

[0177] The heat dissipation unit (3600) can transfer heat generated from the image sensor. The heat dissipation unit (3600) can be in contact with the shield can (3400) and the circuit board (3500). By being in contact with the shield can (3400) and the circuit board (3500), the heat dissipation unit (3600) can release heat generated from the image sensor of the circuit board (3500) to the outside of the sensor module (3000) through the shield can (3400). The heat dissipation unit (3600) can improve the durability of the sensor module by being physically connected to the shield can (3400) and the circuit board (3500).

[0178] The heat dissipation unit (3600) may include first to third heat dissipation units (3610, 3620, 3630). The first heat dissipation unit (3610) and the second heat dissipation unit (3620) may be arranged along the second direction. The first heat dissipation unit (3610) and the second heat dissipation unit (3620) may be arranged to be spaced apart from each other in the first direction. The third heat dissipation unit (3630) may be arranged along the first direction. The third heat dissipation unit (3630) may be connected to the first heat dissipation unit (3610) and the second heat dissipation unit (3620). The first heat dissipation unit (3610) and the second heat dissipation unit (3620) may be portions bent in the second direction from the third heat dissipation unit (3630). The first heat dissipation portion (3610) and the second heat dissipation portion (3620) may be portions protruding in the second direction from both ends of the third heat dissipation portion (3630).

[0179] The heat dissipation unit (3600) may include an outer surface (F1) and an inner surface (F2). The outer surface (F1) and the inner surface (F2) may be spaced apart from each other. The outer surface (F1) and the inner surface (F2) may be perpendicular to the first direction or the second direction. The outer surface (F1) and the inner surface (F2) may be flat. The heat dissipation unit (1600) may include an upper surface (F3). The upper surface (F3) may be in contact with the outer surface (F1) and the inner surface (F2). The upper surface (F3) may be perpendicular to the optical axis direction. The heat dissipation unit (3600) may include a lower surface. The lower surface may be perpendicular to the optical axis direction. The lower surface may be curved.

[0180] The heat dissipation unit (3600) may include a third protrusion (3640) protruding in the direction of the optical axis. The third protrusion (3640) may be a portion of the heat dissipation unit (3600) protruding in the direction of the optical axis. The third protrusion (3640) may protrude toward the upper surface of the heat dissipation unit (3600) in the direction of the optical axis. The third protrusion (3640) may protrude from the upper surfaces of the first to third heat dissipation units (3610, 3620, 3630).

[0181] Fig. 33 is an enlarged view of part C of Fig. 27, and Fig. 34 is a bottom view of a sensor module according to an embodiment.

[0182] The heat dissipation unit (3600) may be arranged to surround the side surface of the second groove (3410). The first to third heat dissipation units (3610, 3620, 3630) may be in contact with the side surface of the second groove (3410). The outer surface (F1) of the third protrusion (3640) of the heat dissipation unit (3600) may be in contact with the side surface of the second groove (3410). The upper surface (F3) of the third protrusion (3640) may be in contact with the lower surface of the first frame (3530). The inner surface (F2) of the third protrusion (3640) may be in contact with the side surface of the fourth protrusion (3531). The third protrusion (3640) may be arranged to surround the fourth protrusion (3531) of the circuit board (3500). The third protrusion (3640) may be positioned between the fourth protrusion (3531) and the shield can (3400). The heat dissipation portion (3600) may be in contact with the lower surface of the shield can (3400). The heat dissipation portion (3600) may be in contact with the lower surface of the fourth protrusion (3531). The third protrusion (3640) may be in contact with the lower surface of the first frame (3530). The heat dissipation portion (3600) may overlap with the first groove (3310) in the optical axis direction. However, the heat dissipation portion (3600) may not be in contact with the body (3300). The first direction or the second direction width of the fourth protrusion (3531) may be smaller than the first direction or the second direction width of the second groove (3410). The heat dissipation unit (3600) is arranged to surround the side of the second groove (3410), and is in contact with the lower surface of the shield can (3400) and the lower surface of the fourth protrusion (3531), so that heat generated from the image sensor of the circuit board (3500) can be released to the outside of the sensor module (3000) through the shield can (3400).

[0183] The material of the heat dissipation unit according to the embodiment may be the same as the material of the first frame, the shield can, and the body. By making the material of the heat dissipation unit the same as the material of the first frame, the shield can, and the body, the efficiency of heat transfer can be increased. The material of the heat dissipation unit, the first frame, the shield can, and the body may include a metal material. The material of the heat dissipation unit may include lead, copper, aluminum, or iron. The heat dissipation unit may be a welding material made of a metal material. The heat dissipation unit may be attached to a circuit board, a shield can, or the body by welding. When the heat dissipation unit is welded, the equipment cost is reduced compared to when a conventional heat dissipation structure is used, and the process stabilization is facilitated. When a heat dissipation unit made of lead is used, the heat dissipation effect can be improved by about 30% compared to when a heat dissipation unit is not used, and the heat dissipation effect can be improved by about 15% compared to a conventional heat dissipation structure. In addition, the heat dissipation unit is physically attached to the shield can and the body by welding, thereby improving the durability of the sensor module.

[0184] Figure 35 is a table showing the heat dissipation effect of a sensor module according to an embodiment.

[0185] Referring to Fig. 35, when using the heat dissipation part of the sensor module according to the embodiment, the heat dissipation effect can be improved compared to when not using a heat dissipation structure and when using a conventional heat dissipation structure. In all four embodiments, when using the heat dissipation part according to the embodiment, the temperature increase of the sensor module over time is lower compared to when not using a heat dissipation structure and when using a conventional heat dissipation structure. For example, in embodiment 1, when using the conventional heat dissipation structure, the temperature of the sensor module increased by 16 degrees after 300 seconds, but when using the heat dissipation part according to the embodiment, the temperature of the sensor module increased by 14 degrees after 300 seconds.

[0186] Fig. 36 is a perspective view of a mobile terminal to which a sensor module according to an embodiment is applied.

[0187] Referring to FIG. 36, the mobile terminal (1) of the embodiment may include a sensor module (1000), a flash module (1020), and an autofocus device (1010) provided on the rear.

[0188] The sensor module (1000) may include an image capturing function and an auto-focus function. For example, the sensor module (1000) may include an auto-focus function using an image.

[0189] The sensor module (1000) processes image frames of still images or moving images obtained by the image sensor in shooting mode or video call mode.

[0190] The processed image frame can be displayed on a predetermined display unit and stored in memory. A camera (not shown) may also be placed on the front of the mobile terminal body.

[0191] For example, the sensor module (1000) may include a first sensor module and a second sensor module, and the first sensor module may be capable of implementing OIS together with AF or zoom functions. In addition, the second sensor module may be capable of implementing AF, zoom, and OIS functions. In this case, since the first sensor module includes both the first sensor module and the second sensor module described above, miniaturization of the sensor module can be easily achieved through changing the optical path.

[0192] The flash module (1020) may include a light-emitting element that emits light internally. The flash module (1020) may be operated by the camera operation of the mobile terminal or by user control.

[0193] The autofocus device (1010) may include one of the packages of surface-emitting laser devices as a light-emitting unit.

[0194] The autofocus device (1010) may include an autofocus function using a laser. The autofocus device (1010) may be primarily used in conditions where the autofocus function using the image of the sensor module (1000) is degraded, such as at a close range of 10 m or less or in a dark environment.

[0195] The autofocus device (1010) may include a light emitting unit including a vertical cavity surface emitting laser (VCSEL) semiconductor element and a light receiving unit that converts light energy into electrical energy, such as a photodiode.

[0196] Fig. 37 is a perspective view of a vehicle to which a sensor module according to an embodiment is applied.

[0197] For example, FIG. 37 is an exterior view of a vehicle equipped with a vehicle driving assistance device to which a sensor module according to an embodiment is applied.

[0198] Referring to FIG. 37, the vehicle (700) of the embodiment may be equipped with wheels (13FL, 13FR) that rotate by a power source and a predetermined sensor. The sensor may be a camera sensor (2), but is not limited thereto.

[0199] The camera sensor (2) may be a camera sensor to which a sensor module according to an embodiment is applied. The vehicle (700) of the embodiment can obtain image information through the camera sensor (2) that captures a front image or a surrounding image, and can use the image information to determine a lane non-identification situation and create a virtual lane when the lane is not identified.

[0200] For example, a camera sensor (2) can capture the front of a vehicle (700) to obtain a front image, and a processor (not shown) can analyze an object included in the front image to obtain image information.

[0201] For example, if objects such as a center divider, curb, or street tree, which correspond to lanes, adjacent vehicles, traffic obstructions, or indirect road markings, are captured in the image captured by the camera sensor (2), the processor can detect these objects and include them in the image information. At this time, the processor can obtain distance information from the objects detected through the camera sensor (2) to further supplement the image information.

[0202] The image information may be information about an object captured in the image. The camera sensor (2000) may include an image sensor and an image processing module.

[0203] The camera sensor (2) can process still images or moving images obtained by an image sensor (e.g., CMOS or CCD).

[0204] The image processing module can process still images or videos acquired through an image sensor, extract necessary information, and transmit the extracted information to the processor.

[0205] At this time, the camera sensor (2) may include a stereo camera to improve the measurement accuracy of the object and to secure more information such as the distance between the vehicle (700) and the object, but is not limited thereto.

[0206] Although the above description focuses on examples, these are merely examples and do not limit the present invention. Those skilled in the art will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present invention. For example, each component specifically shown in the examples can be modified and implemented. In addition, differences related to such modifications and applications should be construed as being included within the scope of the present invention defined in the appended claims.

Claims

1. First camera actuator; A second camera actuator arranged at the rear end of the first camera actuator; A circuit board including an image sensor arranged at the rear end of the second camera actuator; A shield can surrounding the first camera actuator, the second camera actuator, and the circuit board; A body surrounding the above shield can; and including a heat dissipation part in contact with the body and the circuit board; The above body includes a first groove overlapping the image sensor in the optical axis direction, A sensor module in which the heat dissipation member is arranged to surround the side of the first groove.

2. In paragraph 1, The first groove includes a first side and a second side spaced apart in a first direction and extending in a second direction, and a third side perpendicular to the first side and the second side, The above heat dissipation part is in contact with the first side to the third side, A sensor module wherein the first direction is a direction perpendicular to the optical axis direction, and the second direction is a direction perpendicular to the optical axis direction and the first direction.

3. In paragraph 2, The above heat dissipation unit includes a first heat dissipation unit to a third heat dissipation unit, The first heat dissipation portion partially overlaps the first side and the first direction, A sensor module in which the second heat dissipation portion partially overlaps the second side and the first direction.

4. In paragraph 3, The heat dissipation member includes an outer surface in contact with the side surface of the first groove and an inner surface spaced apart from the outer surface, A sensor module in which the outer surface is flat and the inner surface is curved.

5. In paragraph 3, A sensor module in which the first heat dissipation part and the second heat dissipation part are bent in the second direction from the third heat dissipation part.

6. In paragraph 1, The above heat dissipation part overlaps the circuit board in the optical axis direction, A sensor module including an upper surface that contacts the circuit board, wherein the heat dissipation portion is above.

7. In paragraph 4, The above shield can is a sensor module including the circuit board and the first groove and the second groove overlapping in the optical axis direction.

8. In paragraph 7, The first direction width of the second groove is greater than the first direction width of the first groove, A sensor module wherein the second direction width of the second groove is greater than the second direction width of the first groove.

9. In paragraph 8, The second groove includes a fourth side and a fifth side spaced apart in the first direction and a sixth side perpendicular to the fourth side and the fifth side, The sixth side overlaps the heat dissipation part and the second direction, The fourth side and the fifth side are sensor modules that overlap with the heat dissipation part in the first direction.

10. In paragraph 9, The above fourth side to the above sixth side are sensor modules spaced apart from the outer surface of the heat dissipation part by a certain distance.

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