Power module and manufacturing method therefor

Abstract

Provided in the present disclosure are a power module and a manufacturing method therefor. The power module is used for driving an electric motor and an electric heater, and comprises an electric-motor control portion and an electric-heater control portion, wherein a plurality of power chips of the electric-motor control portion and a plurality of power chips of the electric-heater control portion are integrated in the power module.

Description

Power Module and Manufacturing Method

[0001] Related applications

[0002] This disclosure claims priority to Chinese patent application filed on February 29, 2024, application number 202410224095.9, entitled "Power Module for Driving an Integrated Motor and Electric Heater and a Method for Manufacturing the Same Thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of power electronics technology, specifically to a power module that integrates motor and electric heater drive and its manufacturing method. Background Technology

[0004] Currently, automotive electric compressor and electric heater combo controllers require the combined use of multiple IGBTs, each individually installed within the controller. This space-consuming configuration hinders product miniaturization. Individual IGBTs require thermally conductive insulating cloth or ceramic sheets for insulation and heat dissipation. However, thermally conductive insulating cloth has low thermal conductivity, hindering heat dissipation, and ceramic sheets are fragile, making assembly difficult. Furthermore, external temperature sensors are used to detect IGBT temperatures, which are susceptible to inaccurate readings due to ambient temperature and thermal resistance, leading to IGBT overheating and failure.

[0005] Summary of the Invention

[0006] In view of this, the present disclosure provides a power module and a method for manufacturing the same.

[0007] In a first aspect, this disclosure provides a power module, including:

[0008] The motor control section includes multiple power chips for driving the motor;

[0009] The electric heater control section includes multiple power chips for driving the electric heater;

[0010] Multiple power chips of the motor control section and multiple power chips of the electric heater control section are integrated in the power module.

[0011] Optionally, the power chip of the motor control section includes at least one of IGBT chip, SiC chip, MOSFET chip and GaN chip.

[0012] Optionally, the multiple power chips in the electric heater control section include at least one of IGBT chips, SiC chips, MOSFET chips, and GaN chips.

[0013] Optionally, the multiple power chips of the motor control section include a first chip unit, a second chip unit, a third chip unit, a fourth chip unit, a fifth chip unit, and a sixth chip unit.

[0014] Optionally, the first chip unit, the second chip unit, the third chip unit, the fourth chip unit, the fifth chip unit, and the sixth chip unit all include IGBT chips.

[0015] Optionally, the multiple power chips in the electric heater control section include a seventh chip unit, an eighth chip unit, and a ninth chip unit.

[0016] Optionally, the seventh chip unit, the eighth chip unit, and the ninth chip unit are all IGBT chips.

[0017] Optionally, each of the power chips is a chip including a first port, a second port, and a third port, wherein the first port is the gate, the second port is the collector, and the third port is the emitter.

[0018] Optionally, the first port of the first chip unit is connected to the first pin of the power module;

[0019] The second port of the first chip unit is connected to the second port of the second chip unit, the second port of the third chip unit, the second port of the seventh chip unit, and the eighteenth pin of the power module, respectively.

[0020] The third port of the first chip unit is connected to the second pin of the power module, the second port of the fourth chip unit, and the nineteenth pin of the power module, respectively.

[0021] The first port of the second chip unit is connected to the third pin of the power module;

[0022] The third port of the second chip unit is connected to the fourth pin of the power module, the second port of the fifth chip unit, and the twentieth pin of the power module, respectively.

[0023] The first port of the third chip unit is connected to the fifth pin of the power module;

[0024] The third port of the third chip unit is connected to the sixth pin of the power module, the second port of the sixth chip unit, and the twenty-first pin of the power module, respectively.

[0025] The first port of the fourth chip unit is connected to the seventh pin of the power module;

[0026] The third port of the fourth chip unit is connected to the eighth pin and the twenty-second pin of the power module, respectively.

[0027] The first port of the fifth chip unit is connected to the ninth pin of the power module;

[0028] The third port of the fifth chip unit is connected to the tenth pin and the twenty-third pin of the power module, respectively.

[0029] The first port of the sixth chip unit is connected to the eleventh pin of the power module;

[0030] The third port of the sixth chip unit is connected to the twelfth pin and the twenty-fourth pin of the power module, respectively.

[0031] Optionally, the first pin is pin GUH; the second pin is pin KUH; the third pin is pin GVH; the fourth pin is pin KVH; the fifth pin is pin GWH; the sixth pin is pin KWH; the seventh pin is pin GUL; the eighth pin is pin KUL; the ninth pin is pin GVL; the tenth pin is pin KVL; the eleventh pin is pin GWL; the twelfth pin is pin KWL; the eighteenth pin is pin P; the nineteenth pin is pin U; ​​the twentieth pin is pin V; the twenty-first pin is pin W; the twenty-second pin is pin NU; the twenty-third pin is pin NV; and the twenty-fourth pin is pin NW.

[0032] Optionally, the first port of the seventh chip unit is connected to the thirteenth pin of the power module;

[0033] The emitter stage of the seventh chip unit is connected to the fourteenth pin and the twenty-fifth pin of the power module, respectively.

[0034] The first port of the eighth chip unit is connected to the fifteenth pin of the power module;

[0035] The second port of the eighth chip unit is connected to the twenty-sixth pin of the power module;

[0036] The third port of the eighth chip unit is connected to the third port of the ninth chip unit, the seventeenth pin of the power module, and the twenty-eighth pin of the power module, respectively.

[0037] The first port of the ninth chip unit is connected to the sixteenth pin of the power module.

[0038] The second port of the ninth chip unit is connected to the twenty-seventh pin of the power module.

[0039] Optionally, the thirteenth pin is pin G1; the fourteenth pin is pin K1; the fifteenth pin is pin G2; the sixteenth pin is pin G3; the seventeenth pin is pin K23; the twenty-fifth pin is pin E1; the twenty-sixth pin is pin C2; the twenty-seventh pin is pin C3; and the twenty-eighth pin is pin E23.

[0040] Optionally, the power module further includes:

[0041] A copper-clad ceramic substrate, on which multiple power chips of the motor control section and multiple power chips of the electric heater control section are mounted.

[0042] Optionally, it also includes:

[0043] Multiple temperature sensors are used to detect the temperature of multiple power chips in the motor control section and the temperature of multiple power chips in the electric heater control section.

[0044] Optionally, the plurality of temperature sensors include a first temperature sensor and a second temperature sensor;

[0045] One end of the first temperature sensor is connected to the twenty-ninth pin of the power module;

[0046] The other end of the first temperature sensor is connected to the thirtieth pin of the power module.

[0047] One end of the second temperature sensor is connected to the thirty-first pin of the power module;

[0048] The other end of the second temperature sensor is connected to the thirty-second pin of the power module;

[0049] The 29th pin is pin T1-1, the 30th pin is pin T1-2, the 31st pin is pin T2-1, and the 32nd pin is pin T2-2.

[0050] Secondly, this disclosure provides a method for manufacturing a power module, which integrates multiple power chips for driving a motor and multiple power chips for driving an electric heater on a copper-clad ceramic substrate by employing processes including reflow soldering and aluminum wire ultrasonic bonding to jointly form a power module.

[0051] Optionally, multiple temperature sensors, along with multiple power chips for driving the motor and multiple power chips for driving the electric heater, are co-encapsulated in the power module using processes including reflow soldering and ultrasonic bonding of aluminum wire. Attached Figure Description

[0052] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 is a schematic diagram of the structure of a power module according to one or more embodiments of the present disclosure.

[0054] Figure 2 is a schematic diagram of the structure of a power module according to one or more embodiments of the present disclosure. Detailed Implementation

[0055] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this disclosure.

[0056] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0057] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this disclosure. The drawings only show the components related to this disclosure and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0058] Additionally, the details provided in the following description are intended to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be undertaken without these specific details.

[0059] In-depth research on power modules, specifically those driving motors and electric heaters, revealed that integrated controllers for automotive electric compressors and heaters require 8 to 10 IGBTs (Insulated-Gate Bipolar Transistors). Six IGBTs form a 3-way H-bridge to control the motor, while the remaining 2 to 4 IGBTs control the electric heater. These multiple IGBTs are used in combination and distributed throughout the controller. External temperature sensors are needed to monitor the IGBT temperature for thermal protection, and thermally conductive insulating pads are used for insulation and heat dissipation.

[0060] However, in related technologies, the combined controller for automotive electric compressors and heaters uses multiple IGBTs, which occupy a significant amount of space and hinders product miniaturization. Each IGBT requires thermally conductive insulating cloth or ceramic sheets for insulation and heat conduction. Thermally conductive insulating cloth has low thermal conductivity, which is detrimental to heat dissipation, while ceramic sheets are fragile and difficult to assemble. Each IGBT uses an external temperature sensor to detect its temperature. However, due to the influence of ambient temperature and thermal resistance, external temperature sensors cannot accurately detect IGBT temperatures, making the IGBTs prone to overheating and failure. Furthermore, the combined controller for automotive electric compressors and heaters in related technologies requires mounting multiple discrete IGBT devices onto a heat sink, resulting in low installation and heat dissipation efficiency.

[0061] Based on this, the technical solutions provided by the embodiments of this disclosure will be described below with reference to Figures 1 and 2.

[0062] This specification provides an embodiment of a power module for driving a motor and an electric heater. As shown in Figure 1, the power module includes a motor control section and an electric heater control section. The motor control section includes multiple power chips for driving the motor, and the electric heater control section includes multiple power chips for driving the electric heater. The multiple power chips in the motor control section and the multiple power chips in the electric heater control section are integrated in the power module.

[0063] In this embodiment, the power module integrates the power chip for controlling the motor and the power chip for controlling the electric heater into a single module. Using a single power module to control both the motor and the electric heater reduces the module's size, thereby reducing the size of the combined motor and electric heater controller and simplifying the manufacturing process. Furthermore, since the power module integrates both the motor and electric heater control chips, heat dissipation for multiple power chips can be achieved simply by mounting the power module on a heat sink, eliminating the need to install each chip individually. This improves both the installation efficiency and the heat dissipation efficiency of the power module.

[0064] In some embodiments, the power chip of the motor control section includes at least one of IGBT chips, SiC chips, MOSFET chips, and GaN chips. That is, the power chip integrated in the power module of this embodiment is not limited to IGBTs, but can also be an integrated SiC (silicon carbide), MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), and GaN (gallium nitride), etc.

[0065] In some embodiments, the multiple power chips of the electric heater control section include at least one of IGBT chips, SiC chips, MOSFET chips, and GaN chips.

[0066] In some embodiments, the power module further includes a plurality of temperature sensors, which are built into the power module and are used to detect the temperature of a plurality of power chips in the motor control section and the temperature of a plurality of power chips in the electric heater control section.

[0067] In this way, by incorporating a temperature sensor into the power module, the temperature of the power chip inside the power module can be accurately detected, reducing the risk of thermal failure of the power chip.

[0068] It is understandable that packaging technologies, such as reflow soldering and ultrasonic bonding of aluminum wires, can be used to package the temperature sensor and multiple power chips together in the power module.

[0069] In some embodiments, the power module further includes a copper-clad ceramic substrate, on which a plurality of power chips of the motor control section and a plurality of power chips of the electric heater control section are mounted.

[0070] In this way, multiple power chips in the motor control section and multiple power chips in the electric heater control section are mounted on a copper-clad ceramic substrate. The power chips inside the copper-clad ceramic substrate are insulated from the heat dissipation surface of the copper-clad ceramic substrate. The power module can be directly mounted on the heat sink for use without the need to add thermally conductive insulating cloth or ceramic sheet to the outside of the power module for insulation and heat conduction. This avoids the increase in thermal resistance of the module caused by adding thermally conductive insulating cloth or ceramic sheet, which is conducive to increasing the thermal conductivity of each power chip and reducing the risk of thermal failure of each power chip.

[0071] In some embodiments, the multiple power chips of the motor control section include a first chip unit, a second chip unit, a third chip unit, a fourth chip unit, a fifth chip unit, and a sixth chip unit.

[0072] The electric heater control section includes multiple power chips, including a seventh chip unit, an eighth chip unit, and a ninth chip unit.

[0073] In some embodiments, each power chip is a chip including a first port, a second port and a third port, wherein the first port is the gate; the second port is the collector; and the third port is the emitter.

[0074] In some embodiments, the power module includes at least 32 pins, numbered from pin 1 to pin 32.

[0075] The first port of the first chip unit is connected to the first pin of the power module. The second port of the first chip unit is connected to the second port of the second chip unit, the second port of the third chip unit, the second port of the seventh chip unit, and the eighteenth pin of the power module. The third port of the first chip unit is connected to the second pin of the power module, the second port of the fourth chip unit, and the nineteenth pin of the power module.

[0076] The first port of the second chip unit is connected to the third pin of the power module; the third port of the second chip unit is connected to the fourth pin of the power module, the second port of the fifth chip unit, and the twentieth pin of the power module; the first port of the third chip unit is connected to the fifth pin of the power module.

[0077] The third port of the third chip unit is connected to the sixth pin of the power module, the second port of the sixth chip unit, and the twenty-first pin of the power module.

[0078] The first port of the fourth chip unit is connected to the seventh pin of the power module; the third port of the fourth chip unit is connected to the eighth pin and the twenty-second pin of the power module respectively; the first port of the fifth chip unit is connected to the ninth pin of the power module.

[0079] The third port of the fifth chip unit is connected to the tenth pin and the twenty-third pin of the power module, respectively; the first port of the sixth chip unit is connected to the eleventh pin of the power module.

[0080] The third port of the sixth chip unit is connected to the twelfth pin and the twenty-fourth pin of the power module, respectively; the first port of the seventh chip unit is connected to the thirteenth pin of the power module.

[0081] The emitter of the seventh chip unit is connected to the fourteenth and twenty-fifth pins of the power module, respectively; the first port of the eighth chip unit is connected to the fifteenth pin of the power module; and the second port of the eighth chip unit is connected to the twenty-sixth pin of the power module.

[0082] The third port of the eighth chip unit is connected to the third port of the ninth chip unit, the seventeenth pin of the power module, and the twenty-eighth pin of the power module.

[0083] The first port of the ninth chip unit is connected to the sixteenth pin of the power module.

[0084] The second port of the ninth chip unit is connected to the twenty-seventh pin of the power module.

[0085] In some embodiments, the first chip unit, the second chip unit, the third chip unit, the fourth chip unit, the fifth chip unit, and the sixth chip unit all include IGBT chips. The seventh chip unit, the eighth chip unit, and the ninth chip unit are all IGBT chips.

[0086] In some embodiments, the first chip unit is a first IGBT chip; the second chip unit is a second IGBT chip; the third chip unit is a third IGBT chip; the fourth chip unit is a fourth IGBT chip; the fifth chip unit is a fifth IGBT chip; and the sixth chip unit is a sixth IGBT chip. Referring to Figure 1, 1 represents the first IGBT chip, 2 represents the second IGBT chip, 3 represents the third IGBT chip, 4 represents the fourth IGBT chip, 5 represents the fifth IGBT chip, and 6 represents the sixth IGBT chip, totaling six IGBT chips, which form a three-phase full-bridge control motor. 7 represents the seventh IGBT chip, 8 represents the eighth IGBT chip, and 9 represents the ninth IGBT chip, totaling three IGBT chips used to control the electric heater.

[0087] In other embodiments, the first chip unit includes an anti-parallel first IGBT chip and a first FRD chip; the second chip unit includes an anti-parallel second IGBT chip and a second FRD chip; the third chip unit includes an anti-parallel third IGBT chip and a third FRD chip; the fourth chip unit includes an anti-parallel fourth IGBT chip and a fourth FRD chip; the fifth chip unit includes an anti-parallel fifth IGBT chip and a fifth FRD chip; the sixth chip unit includes an anti-parallel sixth IGBT chip and a sixth FRD chip; the seventh chip unit is a seventh IGBT chip; the eighth chip unit is an eighth IGBT chip; and the ninth chip unit is a ninth IGBT chip. Referring to Figure 2, 1 represents the first chip unit, 2 represents the second chip unit, 3 represents the third chip unit, 4 represents the fourth chip unit, 5 represents the fifth chip unit, and 6 represents the sixth chip unit, which together form a three-phase full-bridge controlled motor. 7 represents the seventh chip unit, 8 represents the eighth chip unit, and 9 represents the ninth chip unit, which consists of three IGBT chips used to control the electric heater.

[0088] Referring to Figures 1 and 2, the gate of the first IGBT chip is connected to the first pin of the power module; the collector of the first IGBT chip is connected to the collectors of the second, third, and seventh IGBT chips, and the eighteenth pin of the power module; the emitter of the first IGBT chip is connected to the second pin of the power module, the collector of the fourth IGBT chip, and the nineteenth pin of the power module; the gate of the second IGBT chip is connected to the third pin of the power module; the emitter of the second IGBT chip is connected to the fourth pin of the power module, the collector of the fifth IGBT chip, and the twentieth pin of the power module; the gate of the third IGBT chip is connected to the fifth pin of the power module; the emitter of the third IGBT chip is connected to the sixth pin of the power module, the collector of the sixth IGBT chip, and the twenty-first pin of the power module; the gate of the fourth IGBT chip is connected to the seventh pin of the power module; the emitter of the fourth IGBT chip is connected to the eighth pin of the power module, and the collector of the fifth IGBT chip, and the collector of the sixth IGBT chip, and the collector of the seventh IGBT chip, and the collector of the eighth IGBT chip, and the collector of the ninth IGBT chip, and the collector of the eleventh pin of the power module; Pin 22 of the power module; the gate of the fifth IGBT chip is connected to pin 9 of the power module; the emitter of the fifth IGBT chip is connected to pin 10 and pin 23 of the power module respectively; the gate of the sixth IGBT chip is connected to pin 11 of the power module; the emitter of the sixth IGBT chip is connected to pin 12 and pin 24 of the power module respectively; the gate of the seventh IGBT chip is connected to pin 13 of the power module; the emitter of the seventh IGBT chip is connected to pin 14 and pin 25 of the power module respectively; the gate of the eighth IGBT chip is connected to pin 15 of the power module; the collector of the eighth IGBT chip is connected to pin 26 of the power module; the emitter of the eighth IGBT chip is connected to the emitter, pin 17 of the ninth IGBT chip, and pin 28 of the power module respectively; the gate of the ninth IGBT chip is connected to pin 16 of the power module; the collector of the ninth IGBT chip is connected to pin 27 of the power module.

[0089] In some embodiments, the first pin is pin GUH; the second pin is pin KUH; the third pin is pin GVH; the fourth pin is pin KVH; the fifth pin is pin GWH; the sixth pin is pin KWH; the seventh pin is pin GUL; the eighth pin is pin KUL; the ninth pin is pin GVL; the tenth pin is pin KVL; the eleventh pin is pin GWL; the twelfth pin is pin KWL; the thirteenth pin is pin G1; the fourteenth pin is pin K1; the fifteenth pin is pin G2; the sixteenth pin is pin G3; the seventeenth pin is pin K23; the eighteenth pin is pin P; the nineteenth pin is pin U; ​​the twentieth pin is pin V; the twenty-first pin is pin W; the twenty-second pin is pin NU; the twenty-third pin is pin NV; the twenty-fourth pin is pin NW; the twenty-fifth pin is pin E1; the twenty-sixth pin is pin C2; the twenty-seventh pin is pin C3; and the twenty-eighth pin is pin E23.

[0090] In some embodiments, the multiple temperature sensors built into the power module include a first temperature sensor and a second temperature sensor; one end of the first temperature sensor is connected to the twenty-ninth pin of the power module, and the other end of the first temperature sensor is connected to the thirtieth pin of the power module; one end of the second temperature sensor is connected to the thirty-first pin of the power module; the other end of the second temperature sensor is connected to the thirty-second pin of the power module, the twenty-ninth pin is pin T1-1, the thirtieth pin is pin T1-2, the thirty-first pin is pin T2-1, and the thirty-second pin is pin T2-2.

[0091] Referring to Figure 1, 10 represents the first temperature sensor and 11 represents the second temperature sensor. Both the first temperature sensor 10 and the second temperature sensor 11 are built-in temperature sensors of the power module, used to detect the temperature of the power chip in the power module.

[0092] According to an exemplary embodiment, this embodiment provides a method for manufacturing a power module. By employing a process including reflow soldering and aluminum wire ultrasonic bonding, multiple power chips for driving a motor and multiple power chips for driving an electric heater are integrated on a copper-clad ceramic substrate to form a power module. The multiple power chips for driving the motor constitute the motor control part of the power module, and the multiple power chips for driving the electric heater constitute the electric heater control part of the power module.

[0093] In some embodiments, multiple temperature sensors and power chips are packaged in a power module using a process that includes reflow soldering and ultrasonic bonding of aluminum wires.

[0094] The power module and its manufacturing method disclosed herein are applied in fields such as power electronics, motor drives, power semiconductors, and semiconductor packaging. The power module of this disclosure overcomes the challenge of having separate power modules for controlling the motor and the heater in a combined controller product for automotive electric compressors and heaters. Through power semiconductor module packaging technology, employing processes such as reflow soldering and ultrasonic wire bonding, multiple IGBT chips can be packaged and integrated into a single module, resulting in a small power module size that further reduces the size of the controller. The power module uses DBC (copper-clad ceramic substrate) for heat dissipation, increasing the thermal conductivity of the IGBTs and reducing the risk of IGBT thermal failure. The power module's installation process is simple, simplifying the controller's production steps and improving production reliability. The power module incorporates a temperature sensor for more accurate temperature detection, further reducing the risk of IGBT thermal failure.

[0095] In this specification, the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the descriptions of the embodiments described later are relatively simple, and relevant parts can be referred to the descriptions of the foregoing embodiments.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the scope of protection of this disclosure. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A power module, characterized in that, include: The motor control section includes multiple power chips for driving the motor; The electric heater control section includes multiple power chips for driving the electric heater; Multiple power chips of the motor control section and multiple power chips of the electric heater control section are integrated in the power module.

2. The power module according to claim 1, characterized in that, The power chip of the motor control section includes at least one of IGBT chip, SiC chip, MOSFET chip and GaN chip.

3. The power module according to claim 1, characterized in that, The multiple power chips in the electric heater control section include at least one of IGBT chips, SiC chips, MOSFET chips, and GaN chips.

4. The power module according to claim 1, characterized in that, The multiple power chips in the motor control section include a first chip unit, a second chip unit, a third chip unit, a fourth chip unit, a fifth chip unit, and a sixth chip unit.

5. The power module according to claim 4, characterized in that, The first chip unit, the second chip unit, the third chip unit, the fourth chip unit, the fifth chip unit, and the sixth chip unit all include IGBT chips.

6. The power module according to claim 4, characterized in that, The electric heater control section includes a seventh chip unit, an eighth chip unit, and a ninth chip unit.

7. The power module according to claim 6, characterized in that, The seventh chip unit, the eighth chip unit, and the ninth chip unit are all IGBT chips.

8. The power module according to claim 6, characterized in that, Each of the power chips is a chip including a first port, a second port, and a third port, wherein the first port is the gate, the second port is the collector, and the third port is the emitter.

9. The power module according to claim 8, characterized in that, The first port of the first chip unit is connected to the first pin of the power module; The second port of the first chip unit is connected to the second port of the second chip unit, the second port of the third chip unit, the second port of the seventh chip unit, and the eighteenth pin of the power module, respectively. The third port of the first chip unit is connected to the second pin of the power module, the second port of the fourth chip unit, and the nineteenth pin of the power module, respectively. The first port of the second chip unit is connected to the third pin of the power module; The third port of the second chip unit is connected to the fourth pin of the power module, the second port of the fifth chip unit, and the twentieth pin of the power module, respectively. The first port of the third chip unit is connected to the fifth pin of the power module; The third port of the third chip unit is connected to the sixth pin of the power module, the second port of the sixth chip unit, and the twenty-first pin of the power module, respectively. The first port of the fourth chip unit is connected to the seventh pin of the power module; The third port of the fourth chip unit is connected to the eighth pin and the twenty-second pin of the power module, respectively. The first port of the fifth chip unit is connected to the ninth pin of the power module; The third port of the fifth chip unit is connected to the tenth pin and the twenty-third pin of the power module, respectively. The first port of the sixth chip unit is connected to the eleventh pin of the power module; The third port of the sixth chip unit is connected to the twelfth pin and the twenty-fourth pin of the power module, respectively.

10. The power module according to claim 9, characterized in that, The first pin is pin GUH; the second pin is pin KUH; the third pin is pin GVH; the fourth pin is pin KVH; the fifth pin is pin GWH; the sixth pin is pin KWH; the seventh pin is pin GUL; the eighth pin is pin KUL; the ninth pin is pin GVL; the tenth pin is pin KVL; the eleventh pin is pin GWL; the twelfth pin is pin KWL; the eighteenth pin is pin P; the nineteenth pin is pin U; ​​the twentieth pin is pin V; the twenty-first pin is pin W; the twenty-second pin is pin NU; the twenty-third pin is pin NV; and the twenty-fourth pin is pin NW.

11. The power module according to claim 10, characterized in that, The first port of the seventh chip unit is connected to the thirteenth pin of the power module; The emitter stage of the seventh chip unit is connected to the fourteenth pin and the twenty-fifth pin of the power module, respectively. The first port of the eighth chip unit is connected to the fifteenth pin of the power module; The second port of the eighth chip unit is connected to the twenty-sixth pin of the power module; The third port of the eighth chip unit is connected to the third port of the ninth chip unit, the seventeenth pin of the power module, and the twenty-eighth pin of the power module, respectively. The first port of the ninth chip unit is connected to the sixteenth pin of the power module. The second port of the ninth chip unit is connected to the twenty-seventh pin of the power module.

12. The power module according to claim 11, characterized in that, The thirteenth pin is pin G1; the fourteenth pin is pin K1; the fifteenth pin is pin G2; the sixteenth pin is pin G3; the seventeenth pin is pin K23; the twenty-fifth pin is pin E1; the twenty-sixth pin is pin C2; the twenty-seventh pin is pin C3; and the twenty-eighth pin is pin E23.

13. The power module according to any one of claims 1-12, characterized in that, The power module also includes: A copper-clad ceramic substrate, on which multiple power chips of the motor control section and multiple power chips of the electric heater control section are mounted.

14. The power module according to any one of claims 1-12, characterized in that, Also includes: Multiple temperature sensors are used to detect the temperature of multiple power chips in the motor control section and the temperature of multiple power chips in the electric heater control section.

15. The power module according to claim 14, characterized in that, The plurality of temperature sensors include a first temperature sensor and a second temperature sensor; One end of the first temperature sensor is connected to the twenty-ninth pin of the power module; The other end of the first temperature sensor is connected to the thirtieth pin of the power module. One end of the second temperature sensor is connected to the thirty-first pin of the power module; The other end of the second temperature sensor is connected to the thirty-second pin of the power module; The 29th pin is pin T1-1, the 30th pin is pin T1-2, the 31st pin is pin T2-1, and the 32nd pin is pin T2-2.

16. A method for manufacturing a power module, characterized in that, Multiple power chips for driving the motor and multiple power chips for driving the electric heater are integrated on a copper-clad ceramic substrate using processes including reflow soldering and ultrasonic bonding of aluminum wire to form a power module.

17. The method for manufacturing a power module according to claim 16, characterized in that, Multiple temperature sensors, along with multiple power chips for driving the motor and multiple power chips for driving the electric heater, are co-encapsulated in the power module using processes including reflow soldering and ultrasonic bonding of aluminum wire.

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