Piezoelectric pump and electronic device

Abstract

A piezoelectric pump and an electronic device, relating to the technical field of heat dissipation. The piezoelectric pump (10) comprises a plate body (1101), a piezoelectric layer (1102) and a first housing (12), the plate body (1101) and the piezoelectric layer (1102) being stacked, the plate body (1101) being fixedly connected to the first housing (12), the first housing (12) having a first recessed cavity (121), and the plate body (1101) covering the first recessed cavity (121). In the stacking direction, the piezoelectric pump (10) has a connection hole (111) which passes through the plate body (1101) and the piezoelectric layer (1102), a first end (111a) of the connection hole (111) extending into the first recessed cavity (121). The first housing (12) is provided with a first through hole (122), one end of the first through hole (122) extending into the first recessed cavity (121). The vertical projection of the first through hole (122) in the stacking direction does not overlap with the vertical projection of the connection hole (111) in the stacking direction.

Description

Piezoelectric pump and electronic device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on February 29, 2024, with application number 202410234330.0 and application name "A Piezoelectric Pump and Electronic Device", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of heat dissipation technology, and in particular to a piezoelectric pump and electronic equipment. Background Art

[0004] In current electronic devices, heat dissipation is necessary to ensure performance and safety. Currently, passive cooling is commonly used. For example, in mobile phones, the chip is one of the main components that generates significant heat. Materials with high thermal conductivity, such as graphene, are often used to conduct heat from the chip to the phone's casing, where it is then dissipated to the outside world, thereby dissipating the heat from the chip. However, as chip power consumption and heat generation continue to increase, passive cooling methods are no longer sufficient. Therefore, fans are commonly used to enhance airflow and improve chip cooling efficiency. However, fans are large, making them unsuitable for use in space-sensitive electronic devices.

[0005] Summary of the Invention

[0006] The present application provides a piezoelectric pump and electronic equipment with a simple structure that can effectively prevent backflow and increase flow.

[0007] In a first aspect, the present application provides a piezoelectric pump comprising a plate, a piezoelectric layer, and a first housing. The plate and piezoelectric layer are stacked, with the piezoelectric layer driving the plate to vibrate along the stacking direction. The plate is fixedly connected to the first housing, which has a first cavity. The plate covers the first cavity. When the plate and piezoelectric layer vibrate along the stacking direction, the volume of the first cavity changes, thereby allowing a fluid medium to enter the first cavity or to be discharged from the first cavity, thereby achieving fluid flow. For ease of explanation, the entire structure of the plate and piezoelectric layer will be referred to as a vibrating plate. The vibrating plate has a connection hole extending through the thickness of the plate, that is, the connection hole extends through the plate and the piezoelectric layer along the stacking direction. A first end of the connection hole extends into the first cavity, and a second end of the connection hole communicates with the outside world, allowing external fluid medium to enter the first cavity through the connection hole. The first housing has a first through hole, one end of which extends into the first cavity. Fluid medium in the first cavity can be discharged outward through the first through hole. The vertical projection of the first through hole in the stacking direction does not overlap with the vertical projection of the connecting hole in the stacking direction.

[0008] In the piezoelectric pump provided herein, the sheet is fixedly connected to the first housing and covers the first cavity in the first housing. This simple structure and compact thickness make the piezoelectric pump well-suited for use in electronic devices with high space requirements. Alternatively, it can be understood that the configuration of the piezoelectric pump facilitates the realization of a lightweight and thinner electronic device design and effectively improves the heat dissipation performance of the electronic device.

[0009] In one example, along the vibration direction of the vibrating plate (i.e., the thickness direction or stacking direction of the vibrating plate), the first cavity includes a surface facing the first end of the connecting hole, and the distance between the surface and the first end of the connecting hole is less than or equal to 100 microns, which can effectively prevent the fluid medium from generating backflow, thereby achieving unidirectional flow of the fluid medium. In the example provided in the present application, in the vibration direction of the vibrating plate, the first shell includes a surface facing the vibrating plate, and the distance between the surface and the first end of the connecting hole is less than or equal to 100 microns. When the vibrating plate vibrates in the direction of the surface, the distance between the surface and the edge of the first end of the connecting hole will decrease, and the surface can form a sealing effect on the connecting hole, making it difficult for the fluid medium in the first cavity to be discharged from the connecting hole, thereby promoting the fluid medium in the first cavity to be discharged from the first through hole, thereby achieving unidirectional flow of the fluid medium, thereby effectively improving the flow rate of the piezoelectric pump. In addition, the vertical projection of the first through hole in the stacking direction does not overlap with the vertical projection of the connecting hole in the stacking direction, which can prevent the first through hole from causing a cut or loss on the surface, thereby ensuring the sealing effect of the surface on the first end of the connecting hole.

[0010] In a specific configuration, the distance between the surface and the first end of the connection hole can be greater than or equal to 50 microns and less than or equal to 70 microns. By properly setting the distance between the surface and the first end of the connection hole, the overall performance of the piezoelectric pump can be effectively improved. For example, the unidirectional flowability of the fluid in the piezoelectric pump can be effectively improved, thereby increasing the flow rate of the piezoelectric pump. Alternatively, parameters such as the amplitude or operating frequency of the vibrating plate in the piezoelectric pump can be well matched.

[0011] In one example, the distance between the surface and the first end of the connecting hole is greater than or equal to the amplitude of the sheet to avoid a hard collision between the surface and the first end of the connecting hole, thereby improving the safety and reliability of the piezoelectric pump.

[0012] In one example, the edge of the sheet is fixedly connected to the first shell, the center of the piezoelectric layer coincides with the center of the sheet, and the connection hole is located in the center of the sheet and the piezoelectric layer. After the edge of the sheet is fixedly connected to the first shell, a larger connection area is provided between the sheet and the first shell, which can effectively improve the connection effect between the sheet and the first shell. The center of the piezoelectric layer coincides with the center of the sheet, so that when the piezoelectric layer vibrates, it can drive the central area of ​​the sheet to produce a larger amplitude, which is beneficial to improving the flow rate of the piezoelectric pump. In addition, setting the connection hole in the center of the vibrating sheet (that is, the sheet and the piezoelectric layer as a whole) can allow more air to enter the first cavity from the connection hole, thereby effectively improving the flow rate of the piezoelectric pump.

[0013] In one example, the vibrating plate has a through-groove extending through the thickness of the vibrating plate, the through-groove extending from the connecting hole toward the edge of the vibrating plate. When the vibrating plate vibrates in a direction away from the first cavity, the through-groove can gradually expand, allowing fluid to enter the first cavity through the through-groove. When the vibrating plate vibrates in a direction toward the first cavity, the through-groove can gradually close to prevent the fluid in the first cavity from flowing out through the through-groove, thereby encouraging the fluid in the first cavity to be discharged outward from the first through-hole, thereby increasing the flow rate of the piezoelectric pump.

[0014] In a specific configuration, the through slot has a first end and a second end along the stacking direction. The first end and the second end are the two ends of the through slot in the stacking direction, respectively, and the first end faces the first concave cavity. The distance between the first end of the through slot and the vibration neutral plane of the vibrating plate (or plate body) is smaller than the distance between the second end of the through slot and the vibration neutral plane of the vibrating plate. During the vibration of the vibrating plate, the through slot can expand and close to prevent air from overflowing from the through slot, thereby promoting air to be discharged from the first through hole, which is beneficial to increasing the flow rate of the piezoelectric pump.

[0015] In one example, the through-slot can be a straight through-slot. That is, the cross-sectional area of ​​the through-slot is substantially the same along the stacking direction. Alternatively, the cross-sectional area of ​​the through-slot at the first end is larger than the cross-sectional area of ​​the through-slot at the second end. During the vibration of the vibrating plate, the through-slot can expand and close to prevent air from escaping from the through-slot, thereby encouraging air to be discharged outward through the first through-hole, which is beneficial for increasing the flow rate of the piezoelectric pump.

[0016] In one example, the width of the through groove decreases linearly from the connection hole to the edge of the vibration plate, which can reasonably utilize the deformation amplitude of the vibration plate to effectively increase the flow rate of the piezoelectric pump.

[0017] In one example, the vibration plate further includes an end hole, which is located at one end of the through slot near the edge of the vibration plate. By providing the end hole, stress can be effectively dispersed, thereby improving the reliability of the vibration plate.

[0018] In one example, the vibration plate includes a plurality of through grooves, and the plurality of through grooves are evenly distributed around the connecting hole, thereby effectively improving the flow rate of the piezoelectric pump.

[0019] In one example, the sheet further includes a groove, located on a surface of the sheet facing the first cavity, or on a surface of the sheet facing away from the first cavity. The provision of the groove can be used to improve the performance of the piezoelectric pump. For example, the provision of the groove can reduce the cantilever stiffness of the sheet, making it easier for the sheet to vibrate, or increase the amplitude of the sheet, thereby increasing the flow rate of the piezoelectric pump.

[0020] In a specific setting, the groove is arranged around the center of the vibration plate, thereby significantly reducing the cantilever stiffness of the plate body and effectively improving the vibration performance of the vibration plate and the flow rate of the piezoelectric pump.

[0021] In one example, the first cavity includes a protrusion extending toward the first end of the connection hole, with the surface located on top of the protrusion. Providing the protrusion improves manufacturing convenience and processing precision. It also facilitates greater flexibility in the volume and shape of the first cavity, thereby increasing the flow rate of the piezoelectric pump.

[0022] In one example, the piezoelectric layer is located on a surface of the sheet away from the first cavity, so as to avoid the piezoelectric layer occupying the space of the first cavity and also improve the vibration neutral plane of the entire vibrating body.

[0023] In one example, the piezoelectric pump further includes a flow guide member, which includes a flow guide channel connected to the first through hole. The flow guide channel is used to guide the fluid medium discharged from the first through hole to improve the flexibility of use of the piezoelectric pump.

[0024] In one example, the piezoelectric pump further includes a second shell. The second shell has a second concave cavity, the vibrating plate covers the second concave cavity, and the first concave cavity and the second concave cavity are arranged relative to each other. The second end of the connecting hole extends into the second concave cavity, the second shell has a second through hole, and one end of the second through hole extends into the second concave cavity. The first-order resonance frequency of the vibrating plate is f1, the first-order acoustic resonance frequency of the second concave cavity is f2, and (f1-f2) / f2<10%. By providing a second shell, the unidirectional fluidity of the fluid medium in the piezoelectric pump can be improved, which is beneficial to improving the flow rate of the piezoelectric pump.

[0025] In a second aspect, the present application further provides an electronic device comprising a device to be cooled and the aforementioned piezoelectric pump, wherein the piezoelectric pump is in thermal contact with the device to be cooled, or the piezoelectric pump is configured to direct a fluid medium to a surface of the device to be cooled. Specifically, the piezoelectric pump can cool the device to be cooled by thermal contact, or the piezoelectric pump can cool the device by directing the fluid medium toward the device to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic cross-sectional view of a vibrating plate provided in an embodiment of the present application;

[0027] FIG2 is a schematic diagram of a cross-sectional structure of an electronic device provided in an embodiment of the present application;

[0028] FIG3 is a schematic diagram of the cross-sectional structure of another electronic device provided in an embodiment of the present application;

[0029] FIG4 is a schematic diagram of the three-dimensional structure of a piezoelectric pump provided in an embodiment of the present application;

[0030] FIG5 is a schematic diagram of the exploded structure of a piezoelectric pump provided in an embodiment of the present application;

[0031] FIG6 is a schematic cross-sectional view of a piezoelectric pump according to an embodiment of the present application;

[0032] FIG7 is a schematic cross-sectional view of another piezoelectric pump provided in an embodiment of the present application;

[0033] FIG8 is a schematic diagram of a planar structure of a vibrating plate provided in an embodiment of the present application;

[0034] FIG9 is a schematic diagram of the cross-sectional structure of AA in FIG8 ;

[0035] FIG10 is a schematic diagram of a partial cross-sectional structure of a vibration plate provided in an embodiment of the present application when it is in a certain vibration position;

[0036] FIG11 is a schematic diagram of a partial cross-sectional structure of a vibration plate provided by an embodiment of the present application when it is in another vibration position;

[0037] FIG12 is a schematic diagram of a partial cross-sectional structure of another vibration plate provided in an embodiment of the present application when in a non-vibrating position;

[0038] FIG13 is a schematic cross-sectional view of another piezoelectric pump provided in an embodiment of the present application;

[0039] FIG14 is a schematic diagram of a planar structure of a sheet provided in an embodiment of the present application;

[0040] FIG15 is a schematic diagram of a planar structure of another sheet provided in an embodiment of the present application;

[0041] FIG16 is a schematic diagram of a partial cross-sectional structure of another vibration plate provided by an embodiment of the present application when in a non-vibrating position;

[0042] FIG17 is a schematic cross-sectional view of another piezoelectric pump provided in an embodiment of the present application;

[0043] FIG18 is a schematic diagram of the exploded structure of another piezoelectric pump provided in an embodiment of the present application;

[0044] FIG19 is a schematic cross-sectional view of another piezoelectric pump provided in an embodiment of the present application;

[0045] FIG20 is a schematic diagram of a three-dimensional structure of a second housing provided in an embodiment of the present application;

[0046] FIG21 is a schematic cross-sectional view of a piezoelectric pump according to an embodiment of the present application;

[0047] FIG22 is a schematic cross-sectional view of another piezoelectric pump provided in an embodiment of the present application;

[0048] FIG23 is a schematic cross-sectional view of another piezoelectric pump provided in an embodiment of the present application;

[0049] FIG24 is a schematic diagram of a cross-sectional structure of an electronic device provided in an embodiment of the present application;

[0050] FIG25 is a schematic diagram of the cross-sectional structure of another electronic device provided in an embodiment of the present application;

[0051] FIG26 is a schematic diagram of the cross-sectional structure of another electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0052] To facilitate understanding of the piezoelectric pump provided in the embodiments of the present application, the following first introduces its application scenarios.

[0053] The piezoelectric pump provided in the embodiment of the present application can be used in various types of terminal devices such as mobile phones, tablet computers, and laptop computers to improve the heat dissipation performance of the terminal devices.

[0054] In some current electronic devices, fans are often used to drive air flow and improve heat dissipation. However, fans have disadvantages such as high noise, low air pressure, and large size. With the continuous development of electronic devices, the operating power and heat generation of components such as processors in electronic devices have also increased significantly. Therefore, to ensure the heat dissipation performance of electronic devices, they need to be equipped with larger or higher-speed fans. However, larger fans occupy more space, which is not conducive to achieving the lightweight design of electronic devices. In addition, as the fan speed increases, the noise generated by the fan also increases significantly, which significantly reduces the user experience.

[0055] Compared to fans, piezoelectric pumps offer advantages such as low noise, compact size, and high air pressure, making them ideal for use in electronic devices to improve heat dissipation. In a piezoelectric pump, the vibration of a vibrating plate is primarily used to drive fluid flow.

[0056] For example, as shown in FIG1 , an embodiment of the present application provides a schematic cross-sectional structure diagram of a conventional vibration plate 11. Specifically, the vibration plate 11 includes a stacked plate body 1101 and a piezoelectric layer 1102. The piezoelectric layer 1102 is specifically a ceramic piezoelectric layer. Specifically, the piezoelectric layer 1102 includes a stacked positive electrode layer 11021, a ceramic layer 11022, and a negative electrode layer 11023. The surface or edge of the positive electrode layer 11021 can be connected to a wire by welding or the like, and the surface or edge of the negative electrode layer 11023 can be connected to a wire by welding or the like. The piezoelectric layer 1102 is driven to vibrate by applying an alternating voltage to the positive electrode layer 11021 and the negative electrode layer 11022. The piezoelectric layer 1102 is fixed to the plate body 1101, thereby driving the plate body 1101 to vibrate.

[0057] It should be noted that the above-mentioned piezoelectric layer 1102 is only an example. In actual applications, the specific type and wiring structure of the piezoelectric layer 1102 or the entire vibration plate 11 used in the piezoelectric pump can adopt other current types or methods, and this application does not limit this.

[0058] As shown in Figure 2, in one example provided herein, a piezoelectric pump 10 can be disposed within a housing 22 of an electronic device 20. The piezoelectric pump 10 can be in direct contact with a device 21 to be dissipated heat, and heat generated by the device 21 can be transferred to the piezoelectric pump 10. The solid arrows in the figure indicate the air flow path. The airflow through the piezoelectric pump 10 can quickly remove heat from the piezoelectric pump 10, thereby cooling the electronic device.

[0059] Alternatively, as shown in Figure 3, in another example provided in the present application, the piezoelectric pump 10 can be connected to the device to be cooled 21 through a heat conducting member 23 such as a heat spreader. The heat generated by the device to be cooled 21 can be transferred to the piezoelectric pump 10 through the heat conducting member 23. The airflow flowing through the piezoelectric pump 10 can quickly take away the heat in the piezoelectric pump 10, thereby cooling the device to be cooled 21.

[0060] It is understood that in some examples, a thermal connection may not be established between the piezoelectric pump 10 and the device to be cooled 21. For example, the device to be cooled 21 may be located at the air outlet of the piezoelectric pump 10. The airflow discharged from the piezoelectric pump 10 can quickly remove heat from the device to be cooled 21 as it flows over the surface of the device to be cooled 21, thereby cooling the device to be cooled 21.

[0061] However, the current structural design of piezoelectric pumps is still immature, with problems such as complex structure, easy backflow and small air volume.

[0062] To this end, the present application provides a piezoelectric pump with a simple structure that can effectively increase air volume.

[0063] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] As shown in Figures 4, 5 and 6, in an example provided in the present application, the piezoelectric pump 10 includes a sheet 1101, a piezoelectric layer 1102 and a first shell 12. The sheet 1101 and the piezoelectric layer 1102 are stacked, and the piezoelectric layer 1102 is used to drive the sheet 1101 to generate vibrations along the stacking direction. That is, the sheet 1101 and the piezoelectric layer 1102 are a fixedly connected integral structure, the piezoelectric layer 1102 serves as an active component for generating vibrations, and the sheet 1102 serves as a driven component, so that the vibration sheet 11 formed by the sheet 1101 and the piezoelectric layer 1102 generates vibrations along the stacking direction. The sheet body 1101 is fixedly connected to the first shell 12. The first shell 12 has a first concave cavity 121. The sheet body 1101 in the vibration sheet 11 covers the first concave cavity 121. When the vibration sheet 11 generates vibration along the stacking direction, the volume of the first concave cavity 121 can be changed, thereby allowing the fluid medium to enter the first concave cavity 121, or the fluid medium in the first concave cavity 121 can be discharged, thereby realizing the flow of the fluid medium. Among them, the vibration sheet 11 has a connection hole 111 that passes through the thickness of the vibration sheet 11. That is, along the stacking direction, the connection hole 111 passes through the sheet body 1101 and the piezoelectric layer 1102. The first end 111a of the connection hole 111 extends into the first concave cavity 121, and the second end 111b of the connection hole 111 is connected to the outside world, so that the external fluid medium can enter the first concave cavity 121 through the connection hole 111. The first housing 12 has a first through-hole 122, one end of which extends into the first cavity 121. Fluid medium in the first cavity 121 can be discharged outward through the first through-hole 122. The vertical projection of the first through-hole 122 in the stacking direction does not overlap with the vertical projection of the connecting hole 111 in the stacking direction to ensure the performance of the piezoelectric pump 10. Alternatively, it can be understood that the piezoelectric pump 10 relies on the volume change of the first cavity 121 to achieve unidirectional fluid flow. When the vertical projection of the first through-hole 122 in the stacking direction overlaps with the vertical projection of the connecting hole 111 in the stacking direction, fluid flows directly between the first through-hole 122 and the connecting hole 111, thereby weakening the unidirectional flow effect caused by the volume change of the first cavity 121. Therefore, when the vertical projection of the first through-hole 122 in the stacking direction does not overlap with the vertical projection of the connecting hole 111 in the stacking direction, the piezoelectric pump 10 can ensure its ability to drive the fluid medium in a unidirectional manner.

[0065] In the example provided herein, the sheet 1101 is fixedly connected to the first housing 12 and covers the first cavity 121 in the first housing 11. This simple structure and compact thickness make the piezoelectric pump 10 suitable for use in electronic devices with high space requirements. Alternatively, it can be understood that the configuration of the piezoelectric pump 10 facilitates the realization of a lightweight and thinner electronic device design and effectively improves the heat dissipation performance of the electronic device.

[0066] In addition, in the example provided in the present application, along the stacking direction of the vibration plate 11 (i.e., the thickness direction or vibration direction of the vibration plate 11), the first concave cavity 121 includes a surface 123 facing the first end 111a of the connecting hole 111, and the distance between the surface 123 and the first end 111a of the connecting hole 111 is less than or equal to 100 microns, which can effectively prevent the backflow of the fluid medium, thereby realizing the unidirectional flow of the fluid medium.

[0067] Specifically, in the example provided in the present application, the first end 111a of the connecting hole 111 can be directly connected to the outside world, that is, the connecting hole 111 can serve as an inlet and the first through hole 122 can serve as an outlet. The external fluid medium can enter the first concave cavity 121 in the piezoelectric pump 10 from the connecting hole 111 and be discharged outward from the first through hole 122, thereby achieving effective circulation of the fluid medium. In addition, in the example provided in the present application, in the vibration direction of the vibration plate 11, the first shell 12 includes a surface 123 facing the vibration plate 11, and the distance between the surface 123 and the first end 111a of the connecting hole 111 is less than or equal to 100 microns. When the vibration plate 11 vibrates toward the surface 123, the distance between the surface 123 and the edge of the first end 111a of the connection hole 111 decreases. The surface 123 can form a sealing effect on the connection hole 111, making it difficult for the fluid medium in the first concave cavity 121 to be discharged outward from the connection hole 111, thereby prompting the fluid medium in the first concave cavity 121 to be discharged outward from the first through hole 122, thereby achieving one-way flow of the fluid medium. In addition, when the vibration plate 11 vibrates in a direction away from the surface 123, the distance between the surface 123 and the edge of the first end 111a of the connection hole 111 increases, thereby allowing external fluid medium to flow from the connection hole 111 into the first concave cavity 121.

[0068] In summary, in the example provided herein, by properly setting the distance between the first end 111a of the connection hole 111 and the surface 123, the fluid medium can be encouraged to enter the first cavity 121 through the connection hole 111, and the fluid medium in the first cavity 121 can be encouraged to be discharged outward from the first through-hole 122, thereby effectively increasing the flow rate of the piezoelectric pump 10. In addition, the vertical projection of the first through-hole 122 in the stacking direction does not overlap with the vertical projection of the connection hole 111 in the stacking direction, which can prevent the first through-hole 122 from causing a break or loss on the surface 123, thereby ensuring that the surface 123 seals the first end 111a of the connection hole 111.

[0069] It should be noted that the sealing effect of the surface 123 on the connection hole 111 specifically refers to that when the distance between the surface 123 and the first end 111a of the connection hole 111 is less than or equal to 100 microns and greater than 0 microns, a large flow resistance is generated for the fluid medium, making it difficult for the fluid medium to flow through the connection hole 111. Alternatively, when the distance between the surface 123 and the first end 111a of the connection is approximately equal to 0 microns, the surface 123 will form a capping effect on the first end 111a of the connection hole 111, thereby achieving a better sealing effect.

[0070] In specific configurations, the distance between the surface 123 and the first end 111a of the connection hole 111 can be any value between 50 microns and 70 microns. By properly configuring the distance between the surface 123 and the first end 111a of the connection hole 111, the overall performance of the piezoelectric pump 10 can be effectively improved. For example, the unidirectional flowability of the fluid in the piezoelectric pump 10 can be effectively improved, thereby increasing the flow rate of the piezoelectric pump 10. Alternatively, parameters such as the amplitude or operating frequency of the vibrating plate 11 in the piezoelectric pump 10 can be optimally matched.

[0071] For example, during specific configuration, the distance between the surface 123 and the first end 111a of the connection hole 111 can be greater than or equal to the vibration amplitude of the vibrating plate 11 to avoid hard collisions between the surface 123 and the first end 111a of the connection hole 111, thereby improving the safety and reliability of the piezoelectric pump 10. Furthermore, noise generated by collisions between the surface 123 and the first end 111a of the connection hole 111 can be effectively prevented, thereby reducing the operating noise of the piezoelectric pump 10.

[0072] In specific settings, the specific distance between the surface 123 and the first end 111a of the connecting hole 111 can be 0 microns, 1 micron, 20 microns, 50 microns or 100 microns, etc. That is, the specific distance between the surface 123 and the first end 111a of the connecting hole 111 can be any value between 0 microns and 100 microns. Alternatively, in other examples, the specific distance between the surface 123 and the first end 111a of the connecting hole 111 can be greater than 100 microns. In specific settings, the specific distance between the surface 123 and the first end 111a of the connecting hole 111 can be reasonably set according to actual needs so that the surface 123 can effectively seal the first end 111a of the connecting hole 111, which will not be described in detail here. Alternatively, it can be understood that the minimum value of the distance between the surface 123 and the first end 111a of the connecting hole 111 can be achieved based on existing processes, that is, the minimum value can be the minimum value that can be achieved based on the current process.

[0073] It should be noted that the piezoelectric pump 10 provided in the embodiments of the present application can be used to drive the flow of a fluid medium. In terms of physical form, the fluid medium can be a gas or a liquid. For example, the fluid medium can be air, water, or oil, and the present application does not limit the specific physical form and type of the fluid medium. To facilitate understanding of the technical solutions of the present application, the following examples will be illustrative of the fluid medium being air.

[0074] In specific configurations, the specific structural type of the piezoelectric pump 10 can be varied.

[0075] For example, as shown in FIG6 , in an example provided in the present application, the edge of the vibration plate 11 is fixedly connected to the first shell 12, and the connection hole 111 is located at the center of the vibration plate 11. That is, the edge of the vibration plate 11 is fixedly connected to the first shell 12. When the vibration plate 11 vibrates, the center of the vibration plate 11 is the area with the largest amplitude. Therefore, after the connection hole 111 is set at the center of the vibration plate 11, more air can enter the first concave cavity 121 from the connection hole 111, thereby effectively improving the flow rate of the piezoelectric pump 10. In addition, after the edge of the vibration plate 11 is fixedly connected to the first shell 12, a larger connection area is provided between the vibration plate 11 and the first shell 12, which can effectively improve the connection effect between the vibration plate 11 and the first shell 12, thereby preventing problems such as falling off or poor connection between the vibration plate 11 and the first shell 12.

[0076] It is understandable that in other examples, the vibration plate 11 can also be fixedly connected to the first shell 12 in a centrally fixed manner, that is, the edge of the vibration plate 11 can be in a suspended state, so that the edge of the vibration plate 11 is the area with the largest amplitude. In this case, the connection hole 111 can be located at the edge of the vibration plate 11. Alternatively, the gap between the edge of the vibration plate 11 and the first shell 12 can constitute the connection hole 111. In addition, the first through hole 122 can also be arranged close to the edge of the first concave cavity 121, which is not described in detail here. In addition, in the specific setting, the vibration plate 11 can be a circular sheet 1101, an elliptical sheet 1101, or a polygonal sheet 1101 such as a hexagon. The present application does not limit the specific shape of the vibration plate 11.

[0077] To facilitate understanding of the technical solution of the present application, the following exemplary description will be given in which the vibration plate 11 is a substantially circular plate 1101 and the edge of the vibration plate 11 is fixedly connected to the first housing 12 .

[0078] Specifically, as shown in Figures 5 and 6, in one example provided in this application, the vibration plate 11 includes a stacked plate 1101 and a piezoelectric layer 1102, and the area of ​​the piezoelectric layer 1102 is smaller than that of the plate 1101. The edge of the plate 1101 is fixedly connected to the first shell 12, the center of the piezoelectric layer 1102 coincides with the center of the plate 1101, and the connection hole 111 is located at the center of the plate 1101 and the piezoelectric layer 1102.

[0079] Specifically, the piezoelectric layer 1102 can be a sintered piezoelectric ceramic or a sputtered piezoelectric film. The material of the piezoelectric layer 1102 can include piezoelectric materials such as lead zirconate titanate, scandium aluminum nitride, or zinc oxide. It is understood that when a voltage is applied to the piezoelectric layer 1102, the piezoelectric layer 1102 undergoes mechanical deformation, thereby generating vibration.

[0080] The piezoelectric layer 1102 is fixed on the sheet 1101 so that the sheet 1101 can vibrate along with the piezoelectric layer 1102. The piezoelectric layer 1102 can be fixed to the surface of the sheet 1101 by gluing, or the piezoelectric layer 1102 can be directly sputtered and deposited on the surface of the sheet 1101. In the specific setting, a suitable method can be selected to fix it to the sheet 1101 according to the specific type and material of the piezoelectric layer 1102. It should be noted that in actual application, the vibration sheet 11 can also include an electrode connected to the piezoelectric layer 1102, and an external controller can be connected to the electrode to apply a voltage to the piezoelectric layer 1102 to drive the piezoelectric layer 1102 to vibrate. The specific material of the electrode can include silver or platinum, etc. In the specific setting, the piezoelectric layer 1102 can be similarly set according to the currently commonly used structural types, which will not be described here.

[0081] In addition, in actual application, when the piezoelectric layer 1102 is a piezoelectric ceramic, it may be difficult to make it into a more complex shape, and the amplitude of the vibration may be small. Therefore, in the example provided in the present application, the piezoelectric layer 1102 is combined with the sheet 1101 to form the vibration plate 11, which can effectively improve the overall structural flexibility and amplitude of the vibration plate 11. Alternatively, when the piezoelectric layer 1102 is a piezoelectric film, its structural strength is relatively low and it is difficult to use alone. Therefore, in the example provided in the present application, the piezoelectric layer 1102 is combined with the sheet 1101 to form the vibration plate 11, which can effectively improve the overall structural strength and ease of use of the vibration plate 11. Of course, in other examples, the vibration plate 11 may also only include the piezoelectric layer 1102, which will not be elaborated here.

[0082] The sheet 1101 can be made of a metal or alloy material such as copper, steel, aluminum, or titanium. Alternatively, the sheet 1101 can be made of a non-metallic material such as resin, polyethylene, or single-crystal silicon. In other words, the sheet 1101 has the advantages of being easy to process and form, having a low production cost, and having good vibration performance.

[0083] In summary, in the example provided in this application, the entire vibration plate 11 is composed of the piezoelectric layer 1102 and the plate body 1101, so that the entire vibration plate 11 has good mechanical properties and vibration properties, which is conducive to improving the working performance and reliability of the piezoelectric pump 10.

[0084] In addition, in the example provided in the present application, the sheet 1101 is a circular sheet 1101, and the edge of the sheet 1101 is fixed to the first shell 12. The piezoelectric layer 1102 is located in the central area of ​​the sheet 1101, so that the piezoelectric layer 1102 can excite the central area of ​​the sheet 1101 to produce a larger amplitude when vibrating. In addition, the connecting hole 111 is located at the center of the vibration sheet 11. That is, the center of the piezoelectric layer 1102 coincides with the center of the sheet 1101, and the connecting hole 111 is located at the center of the sheet 1101 and the piezoelectric layer 1102. When the vibration sheet 11 vibrates, the central area of ​​the vibration sheet 11 is the area with a larger amplitude.

[0085] In other examples, the areas of the piezoelectric layer 1102 and the sheet 1101 may be substantially the same. That is, the piezoelectric layer 1102 may cover the entire surface of the sheet 1101. Alternatively, when the area of ​​the piezoelectric layer 1102 is smaller than that of the sheet 1101, the piezoelectric layer 1102 may be located in a non-central area of ​​the sheet 1101. In specific configurations, the area and placement of the piezoelectric layer 1102 may be flexibly adjusted based on actual needs.

[0086] In the example provided in this application, the piezoelectric layer 1102 is located on the surface of the sheet 1101 facing away from the first cavity 121 to avoid the piezoelectric layer 1102 occupying the space of the first cavity 121, so that more air can be accommodated in the first cavity 121, which is beneficial to increasing the flow rate of the piezoelectric pump 10.

[0087] As shown in FIG5 , in an example provided in this application, the first housing 12 is a generally disc-shaped structure having a groove structure, which constitutes the aforementioned first cavity 121. The bottom wall of the groove structure is flat, and the surface 123 is located in the bottom wall of the groove structure.

[0088] During specific configuration, the depth of the groove structure may be reasonably configured according to actual needs, so that the distance between the surface 123 and the first end 111 a of the connecting hole 111 meets the actual needs.

[0089] Alternatively, as shown in Figure 7, in another example provided in the present application, the first cavity 121 has a protrusion 124 extending toward the first end 111a of the connecting hole 111, and the surface 123 is located on the top of the protrusion 124. Alternatively, it can be understood that the bottom wall of the groove structure in the first shell 12 has an extended protrusion 124, and the top surface of the protrusion 124 can constitute the surface 123. By providing the protrusion 124, it is beneficial to effectively control the distance between the surface 123 and the first end 111a of the connecting hole 111, which can improve the convenience and processing accuracy during production. In addition, after providing the protrusion 124, it is also beneficial to improve the flexibility of the volume and shape of the first cavity 121, so that the first cavity 121 can accommodate more air, which is beneficial to increase the flow rate of the piezoelectric pump 10.

[0090] In a specific configuration, the cross-section of the connection hole 111 can be circular, elliptical, or polygonal. Furthermore, the vibration plate 11 can include one connection hole 111 or two or more connection holes 111. In a specific configuration, the cross-sectional shape, number, and position layout of the connection holes 111 can be appropriately configured based on actual needs.

[0091] In addition, the surface 123 can be a flat surface, a convex surface, a concave surface, etc. The area of ​​the surface 123 can be larger than the cross-sectional area of ​​the first end 111a of the connection hole 111, or the area of ​​the surface 123 can be substantially the same as the cross-sectional area of ​​the first end 111a of the connection hole 111, or the area of ​​the surface 123 can be slightly smaller than the cross-sectional area of ​​the first end 111a of the connection hole 111. In actual applications, the shape of the surface 123, the area of ​​the surface 123, and the cross-sectional area of ​​the first end 111a of the through hole can be reasonably set according to actual conditions, and no further details are given here.

[0092] In addition, when the first through holes 122 in the first shell 12 are provided, the number, shape and position of the first through holes 122 may also be varied.

[0093] For example, as shown in Figures 5 and 7, in one example provided in the present application, the first housing 12 includes four arc-shaped first through holes 122, all of which are located on the bottom wall of the first concave cavity 121 and are evenly distributed around the center of the first housing 12. The distance between each first through hole 122 and the center of the first housing 12 is greater than or equal to 1 / 4L and less than or equal to 1 / 2L, where L is the radius of the first concave cavity 121. By properly setting the positions of the first through holes 122, the air in the first concave cavity 121 can be discharged outward from the first through holes 122 relatively smoothly, which is beneficial to increasing the flow rate of the piezoelectric pump 10.

[0094] It is understood that in other examples, the first housing 12 may include one, two, or more first through holes 122. The cross-section of the first through holes 122 may also be circular, elliptical, or other shapes. Alternatively, in some examples, the first through holes 122 may be located on a sidewall of the first cavity 121, etc., which will not be described in detail here.

[0095] In addition, in the example provided in this application, the piezoelectric layer 1102 is located on the surface of the sheet 1101 away from the first cavity 121 , which is also beneficial for cooperating with other structures in the vibration sheet 11 to increase the flow rate of the piezoelectric pump 10 .

[0096] For example, referring to Figures 6 and 8 , in one example provided in the present application, the vibrating plate 11 has a through-groove 112 that runs through the thickness of the vibrating plate 11. That is, along the stacking direction of the plate body 1101 and the piezoelectric layer 1102, the through-groove 112 runs through the plate body 1101 and the piezoelectric layer 1102. The through-groove 112 extends from the connection hole 111 to the edge of the vibrating plate 11. The first end 112a of the through-groove 112 is located on the first surface of the vibrating plate 11 (such as the lower surface in Figure 6 ), and the second end 112b of the through-groove 112 is located on the second surface of the vibrating plate 11 (such as the upper surface in Figure 6 ). The first surface and the second surface are respectively two opposite surfaces of the vibrating plate 11, and the first surface faces the first concave cavity 121. The distance between the first end 112a of the through-groove 112 and the vibration neutral plane C of the vibrating plate 11 is smaller than the distance between the second end 112b of the through-groove 112 and the vibration neutral plane C of the vibrating plate 11. It should be noted that the vibration neutral plane C specifically refers to a virtual plane, which is a plane in the vibration plate 11 that has neither tension nor pressure during the vibration process of the vibration plate 11. When the vibration plate 11 vibrates in a direction away from the first concave cavity 121, the through groove 112 can expand to allow more air to enter the first concave cavity 121 through the through groove 112. When the vibration plate 11 vibrates in the direction of the first concave cavity 121, the through hole can be closed to prevent air from overflowing from the through groove 112, thereby prompting the air to be discharged outward from the first through hole 122, which is beneficial to increasing the flow rate of the piezoelectric pump 10. In addition, it should be noted that in the example provided in the present application, the sheet body 1101 in the vibration plate 11 is fixedly connected to the first shell 12, and therefore, the neutral plane C is also the neutral plane of the sheet body 1101.

[0097] Specifically, referring to Figures 7 and 9 , the edge of the plate 1101 is fixedly connected to the first housing 12, and the plate 1101 has a certain thickness. Therefore, the vibration neutral plane C of the entire vibrating plate 11 substantially coincides with the center plane of the plate 1101. The piezoelectric layer 1102 is located on the surface of the plate 1101 facing away from the first cavity 121. Therefore, the distance between the first end 112a of the through-slot 112 and the vibration neutral plane C is smaller than the distance between the second end 112b and the vibration neutral plane C.

[0098] When the vibrating plate 11 vibrates, the portions of the vibrating plate 11 located on either side of the through slot 112 can be simplified to rotating clockwise and counterclockwise about point A. The distance between the first end 112a of the through slot 112 and the neutral vibration plane C is smaller than the distance between the second end 112b and the neutral vibration plane C. Therefore, the rotation radius of the first end 112a is smaller than the rotation radius of the second end 112b. Therefore, the widths of the first end 112a and the second end 112b of the through slot 112 can vary to varying degrees.

[0099] Specifically, as shown in FIG. 9 , the vibration plate 11 is in a non-vibrating position, and the cross-section of the through-slot 112 is substantially the same from the first end 112 a to the second end 112 b of the through-slot 112 .

[0100] As shown in Figure 10, when the vibrating plate 11 vibrates upward, the width of the second end 112b increases significantly, while the width of the first end 112a decreases less significantly. As a result, the entire through-slot 112 appears to expand. At this point, the volume of the first concave cavity 121 increases, allowing more air to enter the first concave cavity 121 through the through-slot 112.

[0101] As shown in Figure 11, when the vibrating plate 11 vibrates downward, the width of the second end 112b decreases significantly, while the width of the first end 112a increases slightly, thus closing the entire through-slot 112. At this time, the volume of the first cavity 121 decreases, allowing air in the first cavity 121 to be discharged through the first through-hole 122.

[0102] In summary, in the example provided herein, by rationally setting the distances between the first end 112a, the second end 112b of the through-slot 112 and the vibration neutral plane C, the air intake process of the first cavity 121 is made smoother. Furthermore, when exhausting the first cavity 121, the through-slot 112 creates a sealed effect, which allows the air in the first cavity 121 to be discharged outward through the first through-hole 122, effectively reducing backflow and thereby increasing the flow rate of the piezoelectric pump 10.

[0103] In the above example, when the vibrating plate 11 is in the non-vibrating position, the cross-sections of the through-slot 112 are substantially the same from the first end 112a to the second end 112b. However, in other examples, the cross-sectional area or width of the first end 112a may be larger than the cross-sectional area or width of the second end 112b.

[0104] For example, as shown in Figure 12, in another example provided in the present application, the width dimension of the through groove 112 gradually decreases from the first end 112a of the through groove 112 to the second end 112b. Therefore, when the vibration plate 11 vibrates upward, a better expansion effect can be achieved, and when the vibration plate 11 vibrates downward, a better closing effect can be achieved, which is beneficial to improving the flow rate of the piezoelectric pump 10. Among them, the closing effect can specifically include closure in the strict sense and also includes approximate closure. For example, when the width dimension of the through groove 112 is zero, it can be considered to be closed in the strict sense. Alternatively, when the width dimension of the through groove 112 is close to zero, the fluid has a greater resistance when flowing through the through groove 112, making it difficult for the fluid to flow through the through groove 112, or the flow rate of the fluid flowing through the through groove 112 can be ignored.

[0105] It is understandable that, in actual application, the change in the cross-sectional shape of the through slot 112 from the first end 112a to the second end 112b of the through slot 112 can be reasonably set according to actual needs, which will not be elaborated here.

[0106] During specific configuration, the shape of the through slot 112 may be varied along the extending direction of the through slot 112 .

[0107] For example, as shown in FIG8 , in an example provided in the present application, the width dimension of the through groove 112 decreases linearly from the connecting hole 111 to the edge of the vibrating plate 11. Specifically, the edge of the vibrating plate 11 is fixedly connected to the first shell 12. Therefore, the amplitude of the vibrating plate 11 gradually decreases from the center of the vibrating plate 11 to the edge of the vibrating plate 11. Therefore, when the vibrating plate 11 vibrates, the deformation amplitude of the vibrating plate 11 also gradually decreases from the center of the vibrating plate 11 to the edge of the vibrating plate 11. In other words, when the vibrating plate 11 vibrates, the change amplitude of the width dimension of the through groove 112 also gradually decreases from the center of the vibrating plate 11 to the edge of the vibrating plate 11. Therefore, in the example provided in the present application, the width dimension of the through groove 112 decreases linearly from the center of the vibrating plate 11 to the edge of the vibrating plate 11, which can reasonably apply the deformation amplitude of the vibrating plate 11 to effectively increase the flow rate of the piezoelectric pump 10.

[0108] In a specific configuration, the angle between the two opposing planes in the through slot 112 can be any value between 1° and 5°. Alternatively, it can be any other angle value. The angle value and the width of the through slot 112 can be reasonably set according to actual needs.

[0109] In addition, in the example provided herein, the vibrating plate 11 also includes an end hole 113 extending through the thickness of the vibrating plate 11. The end hole 113 is located at the end of the through-slot 112 near the edge of the vibrating plate 11. Alternatively, it can be understood that without the end hole 113, the end of the through-slot 112 near the edge of the vibrating plate 11, due to its smaller width, is prone to stress concentration, making the vibrating plate 11 susceptible to cracking and other problems during long-term use. Therefore, by providing the end hole 113, stress can be effectively dispersed, thereby improving the reliability of the vibrating plate 11.

[0110] In specific settings, the shape of the end hole 113 can be reasonably set according to actual needs, and this application does not impose any restrictions on this.

[0111] In addition, in specific configuration, the number and position layout of the through slots 112 may also be varied.

[0112] For example, as shown in FIG8 , in an example provided in the present application, the vibration plate 11 includes four through slots 112 , and the four through slots 112 are evenly distributed around the connection hole 111 , so that the four through slots 112 form a star-shaped structure.

[0113] It is understandable that in other examples, the vibration plate 11 may also include one, two, or more through slots 112. In practical applications, the shape, number, and position layout of the through slots 112 may be reasonably set according to actual needs.

[0114] In addition, it should be noted that, in actual applications, the cross-sectional shape of the connecting hole 111 can be a circle, an ellipse, a polygon or other irregular shapes. When the vibration plate 11 includes both the connecting hole 111 and the through slot 112, the boundary between the connecting hole 111 and the through slot 112 can be defined based on different functions. For example, as mentioned above, when the vibration plate 11 is vibrating downward, the through slot 112 will be closed or roughly closed in a certain state, so when the boundary between the connecting hole 111 and the through slot 112 cannot be intuitively determined, it can be considered that the part that can produce an obvious closure or closing effect is the through slot 112, and the remaining part can be considered to be the connecting hole 111.

[0115] In addition, as shown in FIG. 13 , in an example provided in the present application, the vibration plate 11 further includes a groove 114 . The groove 114 is located on a surface of the vibration plate 11 that is away from the first cavity 121 .

[0116] Specifically, in the example provided in this application, the groove 114 is provided in the sheet 1101 and is provided around the center of the sheet 1101. By providing the groove 114, the stiffness of the sheet 1101 can be effectively reduced, which is conducive to increasing the amplitude of the entire vibration sheet 11, thereby improving the flow rate of the piezoelectric pump 10. Alternatively, it can be understood that after the groove 114 is provided, the thickness of the sheet 1101 in the area corresponding to the groove 114 will be reduced. Therefore, when the piezoelectric layer 1102 vibrates, the area corresponding to the groove 114 is more likely to generate bending deformation, so that under the same voltage drive, the entire vibration sheet 11 is more likely to achieve vibration with a larger amplitude.

[0117] In specific configurations, the shape of the groove 114 can be varied.

[0118] For example, as shown in FIG. 14 , in an example provided in the present application, the groove 114 is in a continuous circular shape.

[0119] Alternatively, as shown in Figure 15, in another example provided by the present application, the groove 114 is composed of two discontinuous arcuate grooves. Of course, in other examples, the groove 114 can also be composed of three or more discontinuous arcuate grooves, and the present application is not limited to this.

[0120] In addition, by providing the groove 114 , the vibration neutral plane C of the vibration plate 11 can be effectively adjusted, thereby optimizing the flow rate of the piezoelectric pump 10 .

[0121] Specifically, after the groove 114 is provided on the surface of the plate 1101 facing away from the first cavity 121 , the vibration neutral plane C of the vibration plate 11 will be closer to the first groove 114 .

[0122] Please refer to FIG. 12 and FIG. 16 . In FIG. 12 , the vibration neutral plane C of the vibration plate 11 substantially coincides with the central plane of the plate body 1101 .

[0123] In Figure 16 , after the groove 114 is provided, the neutral vibration plane C of the vibrating plate 11 moves downward. That is, when the vibrating plate 11 vibrates, the portion of the vibrating plate 11 located on either side of the through-slot 112 can be simplified to rotating clockwise and counterclockwise about point A. The distance between the first end 112a of the through-slot 112 and the neutral vibration plane C is reduced, while the distance between the second end 112b and the neutral vibration plane C is increased. This makes it easier to expand and close the through-slot 112, which helps increase the flow rate of the piezoelectric pump 10.

[0124] In a specific configuration, the depth of the groove 114 may be slightly smaller than half the thickness of the sheet 1101 , so as to effectively balance the vibration performance and structural strength of the sheet 1101 .

[0125] Of course, in specific configuration, the groove 114 may also be located at other positions of the sheet 1101 .

[0126] For example, as shown in FIG17 , in another example provided herein, the grooves 114 may also be located on the surface of the sheet 1101 facing the first cavity 121. The provision of the grooves 114 can increase the volume of the first cavity 121, thereby facilitating an increase in the flow rate of the piezoelectric pump 10. In specific configurations, the shape, number, and location of the grooves 114 can be appropriately selected and adjusted based on actual needs, and are not described in detail here.

[0127] It should be noted that in the above example, the second end 112b of the connecting hole 111 is directly connected to the outside world. In actual applications, other cavities connected to the second end 112b can also be provided to increase the flow rate of the piezoelectric pump 10.

[0128] For example, as shown in Figures 18, 19, and 20, in one example provided herein, the piezoelectric pump 10 further includes a second housing 13. The second housing 13 has a second cavity 131, which is covered by the vibrating plate 11. Furthermore, the first cavity 121 and the second cavity 131 are disposed opposite each other. The second end of the connecting hole 111 extends into the second cavity 131. The second housing 13 has a second through hole 132, one end of which extends into the second cavity 131.

[0129] The vibration plate 11 is used to vibrate between the first concave cavity 121 and the second concave cavity 131. When the vibration plate 11 vibrates, the volume change of the first concave cavity 121 and the second concave cavity 131 can be achieved, so that the fluid medium can effectively circulate between the first concave cavity 121 and the second concave cavity 131. In the example provided in the present application, the second through hole 132 can be used as an inlet, and the first through hole 122 can be used as an outlet. When the vibration plate 11 vibrates, the air in the second concave cavity 131 can be caused to flow into the second concave cavity 131 through the second through hole 132. The air in the second concave cavity 131 can flow into the first concave cavity 121 through the connecting hole 111, and finally be discharged outward from the first through hole 122, thereby realizing one-way circulation of air. In the specific setting, the cross-sectional size of the first through hole 122 can be smaller to increase the flow rate of the air when it is discharged outward from the first through hole 122, thereby achieving the effect of a jet.

[0130] In addition, in the example provided in the present application, the first-order resonance frequency of the vibration plate 11 is f1, the first-order acoustic resonance frequency of the second cavity 131 is f2, and (f1-f2) / f2<10%, that is, the first-order resonance frequency of the vibration plate 11 matches the first-order acoustic resonance frequency of the second cavity 131.

[0131] When the vibrating plate 11 vibrates upward, the volume of the second cavity 131 decreases, while the volume of the first cavity 121 increases. Therefore, the air in the second cavity 131 can flow into the first cavity 121 through the connecting hole 111. At the same time, because the first-order resonant frequency of the vibrating plate 11 matches the first-order acoustic resonant frequency of the second cavity 131, the second through-hole 132 can always be a node of pressure fluctuations, thereby reducing the possibility of air in the second cavity 131 flowing outward from the second through-hole 132 and forming reverse air leakage. This encourages the air in the second cavity 131 to enter the first cavity 121 through the connecting hole 111, thereby facilitating an increase in the flow rate of the piezoelectric pump 10.

[0132] When the vibrating plate 11 vibrates downward, the volume of the second cavity 131 increases, allowing outside air to enter the second cavity 131 through the second through-hole 132. Furthermore, because the surface 123 in the first cavity 121 seals the connection hole 111, air in the first cavity 121 is effectively prevented from flowing into the second cavity 131 through the connection hole 111. Furthermore, during this process, the volume of the first cavity 121 decreases, allowing air in the first cavity 121 to be discharged from the first through-hole 122.

[0133] It should be noted that, as shown in Figures 20 and 21, in the example provided in the present application, the second shell 13 has a groove structure, and the groove structure can constitute the second cavity 131. The cross-sections of the first cavity 121 and the second cavity 131 are both roughly circular, and the radii of the first cavity 121 and the second cavity 131 are both roughly L. The first-order acoustic resonance frequency of the second cavity 131 can be expressed as: f2 = v / (4*L), where v is the stagnation speed of sound. By setting the parameter of (f1-f2) / f2<10%, the air in the second cavity 131 can be effectively prevented from being discharged outward from the second through hole 132. In the specific setting, (f1-f2) / f2 can also be less than 5% to achieve better matching of the first-order resonance frequency of the vibration plate 11 and the first-order acoustic resonance frequency of the second cavity 131.

[0134] In addition, in a specific configuration, the ratio of h2 to h1 can be any value in the range of 10:1 to 5:1. For example, h2 can be 300 microns and h1 can be 50 microns. Here, h1 is the depth of the first cavity 121, and h2 is the depth of the second cavity 131.

[0135] It should be noted that, in other examples, the vibration plate 11 can also be fixedly connected to the first shell 12 or the second shell 13 in a centrally fixed manner, that is, the edge of the vibration plate 11 can be in a suspended state, so that the edge of the vibration plate 11 is the area with the largest amplitude. At this time, the connection hole 111 can be located at the edge of the vibration plate 11. Alternatively, the gap between the edge of the vibration plate 11 and the first shell 12 can constitute the connection hole 111. In addition, the first through hole 122 can also be arranged close to the edge of the first concave cavity 121, and the second through hole 132 can be located at the center of the second concave cavity 131. In the specific setting, the fixing method of the vibration plate 11 and the connection hole 111, the first through hole 122 and the second through hole 132 can be reasonably set according to actual needs, which will not be elaborated here.

[0136] It is understood that, in specific configurations, the specific shapes and sizes of the first shell 12 and the second shell 13 can be reasonably set according to actual needs. Alternatively, it is understood that the specific shapes and sizes of the first cavity 121 and the second cavity 131 can be reasonably set according to actual needs, and are not further described here.

[0137] In addition, during specific configuration, the natural frequency of the sheet 1101 can be changed by providing the groove 114 , so that the operating frequency of the sheet 1101 and the piezoelectric sheet 1102 can be effectively adapted, thereby improving the amplitude and other performance of the entire vibration sheet 11 .

[0138] For example, referring to FIG. 22 and FIG. 23 , in FIG. 22 and FIG. 23 , the thickness of the vibration plate 11 is approximately 200 microns, and the distance between the plane 123 and the first end 111 a of the through hole 111 is approximately 60 microns.

[0139] In addition, FIG22 includes two annular grooves 114, and FIG23 includes a larger annular groove 114. The design frequency (or natural frequency) of the vibration plate 11 in FIG22 is approximately 37kHz, and the design frequency of the vibration plate 11 in FIG23 is approximately 34kHz. By simulating the piezoelectric pump 10 in FIG22 and FIG23, it can be obtained that the amplitude of the vibration plate 11 of the piezoelectric pump 10 in FIG22 is approximately 44 microns, and the simulated flow rate is 6.2LPM. The amplitude of the vibration plate 11 of the piezoelectric pump 10 in FIG23 is approximately 41 microns, and the simulated flow rate is 8.7LPM.

[0140] In summary, in the piezoelectric pump 10 provided herein, good flow performance can be achieved by properly configuring parameters such as the design frequency, thickness, and distance between the plane 123 and the first end 111a of the vibrating plate 11. Furthermore, in practical applications, parameters such as the vibrator's size, design frequency, and distance between the plane 123 and the first end 111a can be appropriately configured to achieve desired flow performance based on actual needs. This is not detailed here.

[0141] In specific applications, the piezoelectric pump 10 can be used in various types of terminal devices such as mobile phones, tablet computers, and laptop computers to improve the heat dissipation performance of the terminal devices.

[0142] For example, as shown in Figure 24, in an example provided in the present application, the electronic device 20 may include a device to be cooled 21 and a piezoelectric pump 10. The piezoelectric pump 10 may be in thermal contact with the device to be cooled 21. The heat generated by the device to be cooled 21 may be conducted to the piezoelectric pump 10. The air flowing through the piezoelectric pump 10 may quickly take away the heat of the piezoelectric pump 10, thereby cooling the device to be cooled 21.

[0143] In a specific configuration, the heat dissipation device 21 can be directly attached to the first housing 12. Alternatively, the heat dissipation device 21 can be attached to the first housing 12 via a heat conducting member such as a heat spreader. Alternatively, the heat dissipation device 21 can be attached to the second housing 13.

[0144] Alternatively, in some examples, the device to be cooled 21 may also be located at the first through hole 122 , and the air exhausted from the first through hole 122 may be blown toward the surface of the device to be cooled 21 to cool the device to be cooled 21 .

[0145] Alternatively, in some examples, a flow guide structure may be provided in the piezoelectric pump 10 to guide the air.

[0146] For example, as shown in Figure 25, in an example provided in the present application, the piezoelectric pump 10 also includes a guide member 14, the guide member 14 includes a guide channel, the guide channel is connected to the first through hole 122, and the guide channel is used to guide the air discharged from the first through hole 122 to effectively cool the heat dissipation device 21.

[0147] In specific configurations, the flow guide 14 may have various structural types.

[0148] For example, as shown in Figure 25, in an example provided in the present application, the guide member 14 includes a support column 141 and a guide plate 142. The guide plate 142 is a circular plate-like structure, and the support column 141 is located at the center of the guide plate 142 and is connected between the guide plate 142 and the first shell 12. Among them, the gap between the guide plate 142 and the first shell 12 can constitute a guide channel. The air discharged outward by the first through hole 122 can be discharged outward from the outer periphery of the guide plate 142, thereby realizing a 360° exhaust structure. Among them, multiple heat dissipation devices 21 can be distributed on the outer periphery of the guide plate 142, so that effective cooling of multiple heat dissipation devices 21 can be achieved.

[0149] Alternatively, as shown in FIG. 26 , in another example provided in the present application, the support column 141 is located at a portion of the edge of the guide plate 142 , thereby achieving a one-sided exhaust effect.

[0150] Of course, in some examples, the heat dissipation device 21 may also be in direct contact with the guide plate 142 , which will not be elaborated here.

[0151] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0152] In this application, "plurality" refers to two or more. "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural.

[0153] It is understood that the various numbers used in the embodiments of this application are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The order of the sequence numbers of the above-mentioned processes does not necessarily imply a specific order of execution; the order of execution of the processes should be determined by their functions and inherent logic.

Claims

1. A piezoelectric pump, characterized in that: It includes a sheet body, a piezoelectric layer and a first shell; The sheet and the piezoelectric layer are stacked, the sheet is fixedly connected to the first shell, and the piezoelectric layer is used to drive the sheet to vibrate along the stacking direction; The first shell has a first concave cavity, and the sheet covers the first concave cavity; The piezoelectric pump further has a connecting hole, the connecting hole passes through the sheet body and the piezoelectric layer in the stacking direction, and a first end of the connecting hole extends into the first cavity; The first housing has one or more first through holes, and one end of each of the first through holes extends into the first concave cavity; A vertical projection of the first through hole in the stacking direction does not overlap with a vertical projection of the connecting hole in the stacking direction.

2. The piezoelectric pump according to claim 1, wherein Along the stacking direction, the first cavity includes a surface facing the first end of the connecting hole, and a distance between the surface and the first end of the connecting hole is less than or equal to 100 micrometers.

3. The piezoelectric pump according to claim 2, wherein: A distance between the surface and the first end of the connecting hole is greater than or equal to 50 micrometers and less than or equal to 70 micrometers.

4. The piezoelectric pump according to any one of claims 1 to 3, characterized in that A distance between the surface and the first end of the connecting hole is greater than or equal to the amplitude of the sheet.

5. The piezoelectric pump according to any one of claims 1 to 4, characterized in that The edge of the sheet is fixedly connected to the first shell, the center of the piezoelectric layer coincides with the center of the sheet, and the connection hole is located at the center of the sheet and the piezoelectric layer.

6. The piezoelectric pump according to any one of claims 1 to 5, characterized in that The piezoelectric pump further comprises a through groove, the through groove penetrating the sheet body and the piezoelectric layer in the stacking direction, and the through groove extends from the connecting hole to the edge of the sheet body; Along the stacking direction, the through slot includes a first end and a second end, and the first end faces the first cavity; Wherein, the distance between the first end of the through slot and the neutral plane of the sheet body is smaller than the distance between the second end of the through slot and the vibration neutral plane of the sheet body.

7. The piezoelectric pump according to claim 6, wherein: The cross-sectional area of ​​the first end of the through slot is larger than the cross-sectional area of ​​the second end of the through slot.

8. The piezoelectric pump according to claim 6 or 7, characterized in that: When the sheet body and the piezoelectric layer vibrate in a direction away from the first concave cavity, the through groove gradually expands; when the sheet body and the piezoelectric layer vibrate in a direction approaching the first concave cavity, the through groove gradually closes.

9. The piezoelectric pump according to any one of claims 1 to 5, characterized in that The piezoelectric pump further comprises a through groove, the through groove penetrating the sheet body and the piezoelectric layer in the stacking direction, and the through groove extending from the connecting hole to the edge of the sheet body; Along the stacking direction, the through slot includes a first end and a second end, and the first end faces the first cavity; Wherein, the cross-sectional area of ​​the first end of the through slot is larger than the cross-sectional area of ​​the second end of the through slot.

10. The piezoelectric pump according to any one of claims 1 to 5, characterized in that The piezoelectric pump further comprises a through groove, the through groove penetrating the sheet body and the piezoelectric layer in the stacking direction, and the through groove extends from the connecting hole to the edge of the sheet body; When the sheet body and the piezoelectric layer vibrate in a direction away from the first concave cavity, the through groove gradually expands; when the sheet body and the piezoelectric layer vibrate in a direction approaching the first concave cavity, the through groove gradually closes.

11. The piezoelectric pump according to any one of claims 6 to 10, characterized in that The width of the through groove decreases linearly from the connecting hole to the edge of the sheet body.

12. The piezoelectric pump according to any one of claims 6 to 11, characterized in that The piezoelectric pump further includes an end hole, which penetrates the sheet body and the piezoelectric layer in the stacking direction, and is located at one end of the through-slot close to the edge of the sheet body.

13. The piezoelectric pump according to any one of claims 6 to 12, characterized in that The piezoelectric pump includes a plurality of through grooves, and the plurality of through grooves are evenly distributed around the connecting hole.

14. The piezoelectric pump according to any one of claims 1 to 13, characterized in that The sheet body further includes a groove, and the groove is located on a surface of the sheet body facing the first cavity, or the groove is located on a surface of the sheet body facing away from the first cavity.

15. The piezoelectric pump according to claim 14, wherein The groove is arranged around the center of the sheet.

16. The piezoelectric pump according to any one of claims 1 to 15, characterized in that A protrusion extending toward the first end of the connecting hole is provided in the first cavity, and the surface is located on the top of the protrusion.

17. The piezoelectric pump according to any one of claims 1 to 16, characterized in that The piezoelectric layer is located on a surface of the sheet facing away from the first cavity.

18. The piezoelectric pump according to any one of claims 1 to 17, characterized in that The piezoelectric pump further includes a flow guide member, which includes a flow guide channel. The flow guide channel is connected to the first through hole, and the flow guide channel is used to guide the fluid medium discharged from the first through hole.

19. The piezoelectric pump according to any one of claims 1 to 18, characterized in that The piezoelectric pump further includes a second housing; The second shell has a second concave cavity, the sheet covers the second concave cavity, and the first concave cavity and the second concave cavity are arranged opposite to each other; The second end of the connecting hole extends into the second cavity; The second shell has a second through hole, one end of which extends into the second concave cavity; The first-order resonance frequency of the sheet and the piezoelectric layer as a whole is f1, the first-order acoustic resonance frequency of the second cavity is f2, and (f1-f2) / f2<10%.

20. An electronic device, characterized in that: The device comprises a device to be cooled and a piezoelectric pump as claimed in any one of claims 1 to 19, wherein the piezoelectric pump is in thermal contact with the device to be cooled, or the piezoelectric pump is used to guide a fluid medium to a surface of the device to be cooled.

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