Immersion cooling apparatus and electronic device

Abstract

The present application discloses an immersion cooling apparatus and an electronic device. The immersion cooling apparatus comprises a condensation module, a liquid storage module, a pump body and a heat exchange module. The condensation module is used to connect to a cooling module, and the cooling module is used accommodate a heating device. The liquid storage module is connected to the condensation module, and the liquid storage module is connected to the cooling module by means of the pump body. The pump body is used to convey a working medium contained in the liquid storage module to the cooling module. A housing of the heat exchange module is provided with a first heat exchange interface and a second heat exchange interface, a heat exchange flow channel is disposed in the heat exchange module, and the heat exchange flow channel is connected to the first heat exchange interface and the second heat exchange interface. The first heat exchange interface is in communication with the liquid storage module, and the second heat exchange interface is connected to the pump body. In the described solution, the heat exchange module can exchange heat with a liquid working medium in the liquid storage module, reducing the temperature of the liquid working medium, increasing the degree of supercooling of the liquid working medium, and preventing cavitation of the pump body, which can improve reliability of the pump body, and thereby improve reliability of a whole working medium circulating refrigeration system.

Description

Immersion cooling device and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on February 29, 2024, with application number 202410225182.6 and application name “Immersed cooling device and electronic equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of electrical equipment, and in particular to an immersion cooling device and electronic equipment. Background Art

[0004] With the rapid development of information technologies such as artificial intelligence, cloud computing, big data, and 5G, the amount of data in data centers is growing exponentially, leading to increasingly prominent energy consumption issues. As the integration and power of electronic devices continue to increase, cooling systems in data centers account for over 30% of energy consumption. Data centers face the enormous challenge of pursuing high performance, low energy consumption, and high power usage effectiveness (PUE). However, traditional single-phase cooling methods cannot meet this significantly increased cooling demand.

[0005] Two-phase immersion cooling is a new data center cooling technology that offers improved cooling performance, lower energy consumption, and significantly improved energy efficiency, showing promising development prospects. However, a challenge with two-phase immersion cooling systems lies in the requirement for the two-phase fluid to have a certain degree of subcooling (generally 5-10°C, where subcooling = saturation temperature minus liquid temperature) before entering the pump. This is primarily due to the vacuum created at the impeller inlet during pump operation. If the liquid fluid is not sufficiently subcooled, it will undergo a phase change and produce gas. The vaporized bubbles, impacted by the liquid particles, will erode metal surfaces such as the impeller, a phenomenon known as cavitation, which can damage the pump's impeller and other metal components. Therefore, controlling the subcooling of the liquid fluid before entering the pump is crucial. Summary of the Invention

[0006] The present application provides an immersion cooling device and electronic equipment to improve the supercooling degree of a liquid working medium, thereby preventing cavitation in a pump.

[0007] In a first aspect, the present application provides an immersion cooling device, which may include a condensing module, a liquid storage module, a pump body, and a heat exchange module. The condensing module may be connected to at least one cooling module; wherein the cooling module may accommodate a heating device and may exchange heat with the heating device. The liquid storage module may accommodate a working fluid, the liquid storage module may be connected to the condensing module, and the liquid storage module may be connected to the cooling module through a pump body, and the pump body may transport the working fluid accommodated in the liquid storage module to the cooling module. The heat exchange module housing may have a first heat exchange interface and a second heat exchange interface, and a heat exchange channel may be provided inside the heat exchange module, and the heat exchange channel may be connected to the first heat exchange interface and the second heat exchange interface; the first heat exchange interface may be in communication with the liquid storage module, and the second heat exchange interface may be connected to the pump body.

[0008] In the technical solution provided in the present application, the cooling module can accommodate liquid working fluid, the liquid working fluid can exchange heat with the heating device, the liquid working fluid is vaporized into gaseous working fluid by heat, the gaseous working fluid can enter the condensing module from the cooling module, the gas working fluid is cooled and condensed into liquid working fluid in the condensing module, the liquid working fluid can enter the liquid storage module from the condensing module, and the pump body can transport the liquid working fluid inside the liquid storage module to the cooling module, thereby forming a working fluid circulation refrigeration system, the first heat exchange interface of the heat exchange module is connected to the liquid storage module, and the second heat exchange interface is connected to the pump body, the heat exchange module can exchange heat with the liquid working fluid in the liquid storage module, reduce the temperature of the liquid working fluid, increase the supercooling of the liquid working fluid, achieve precise control of the supercooling of the liquid working fluid, avoid cavitation of the pump body, and improve the reliability of the pump body, thereby improving the reliability of the entire refrigeration system.

[0009] In a specific embodiment, the liquid storage module can be connected to the cooling module via a first transmission channel, the pump body is connected in the first transmission channel, and the second heat exchange interface is connected to the first transmission channel, so that the liquid storage module, the pump body, and the cooling module are connected in series in sequence through the first transmission channel.

[0010] In one specific embodiment, the heat exchange module can be disposed within the liquid storage module, with a first heat exchange interface communicating with the internal storage space of the liquid storage module; and a second heat exchange interface connected to the first transmission channel for connection to the pump body and the cooling module. Liquid working fluid within the liquid storage module can enter the heat exchange module through the first heat exchange interface of the heat exchange module, then flow through the pump body, and finally enter the cooling module. The liquid working fluid within the liquid storage module is cooled as it flows through the heat exchange module, thereby increasing the degree of supercooling of the liquid working fluid. The cooled liquid working fluid then enters the pump body, thereby preventing cavitation in the pump body and improving pump reliability.

[0011] In one specific embodiment, the heat exchange module is disposed outside the liquid storage module and connected to a first transmission channel. The first transmission channel includes a first transmission pipeline, and the second heat exchange interface is connected to the pump body via the first transmission pipeline. The liquid storage module, pump body, and cooling module can be connected in series, allowing the liquid working medium in the liquid storage module to flow through the pump body via the first transmission channel and then enter the cooling module.

[0012] In one specific embodiment, a heat exchange module can be connected between the liquid reservoir module and the pump body. The first transmission channel includes a second transmission pipeline, and the first heat exchange interface communicates with the liquid reservoir module via the second transmission pipeline. With the heat exchange module connected in series before the pump body in terms of liquid flow, the liquid in the liquid reservoir module is cooled as it flows through the heat exchange module, increasing its subcooling. The cooled liquid then enters the pump body, preventing cavitation in the pump body.

[0013] In one specific embodiment, the pump housing may have a first delivery interface and a second delivery interface, the second heat exchange interface being connected to the first delivery interface via a first delivery pipeline; the first delivery channel includes a third delivery pipeline, and the second delivery interface is connected to the cooling module via the third delivery pipeline. This allows the heat exchange module to be connected in series before the pump body in the direction of liquid working medium flow.

[0014] In a specific feasible implementation scheme, the heat exchange module can be connected between the pump body and the cooling module; the heat exchange module shell can have a third heat exchange interface, and the third heat exchange interface can be connected to the heat exchange channel; the first transmission channel includes a third transmission pipeline, and the third heat exchange interface can be connected to the cooling module through the third transmission pipeline. The liquid working medium in the liquid storage module can flow through the pump body and the heat exchange module in sequence, and then part of the liquid working medium flows back to the liquid storage module through the first heat exchange interface, and the other part of the liquid working medium enters the cooling module through the third transmission pipeline. The liquid working medium is cooled when flowing through the heat exchange module, and the supercooling degree of the liquid working medium is improved. The liquid working medium flowing back to the liquid storage module through the first heat exchange interface is mixed with the original liquid working medium in the liquid storage module. The temperature of the liquid working medium in the liquid storage module can be reduced, and the supercooling degree of the mixed liquid working medium can be improved. In the working medium circulation refrigeration process, the mixed liquid working medium enters the pump body from the liquid storage module. The liquid working medium can meet the supercooling requirements, avoid cavitation of the pump body, and improve the reliability of the pump body.

[0015] In one specific embodiment, the pump housing may have a first delivery interface and a second delivery interface, the first delivery channel may include a second delivery pipeline, the first delivery interface may be connected to the liquid storage module via the second delivery pipeline, and the second heat exchange interface may be connected to the second delivery interface via the first delivery pipeline. This allows the heat exchange module to be connected in series after the pump body in the direction of liquid working medium flow.

[0016] In one specific embodiment, the heat exchange module housing may have a first liquid cooling interface and a second liquid cooling interface. A liquid cooling channel may be provided within the heat exchange module, and the liquid cooling channel may be connected to the first and second liquid cooling interfaces. The first and second liquid cooling interfaces may be connected to a cold source, thereby connecting the liquid cooling channel and the cold source, and the liquid cooling channel may exchange heat with the heat exchange channel. Heat exchange between the cold source and the liquid working medium flowing through the heat exchange channel may be achieved, thereby enabling heat exchange between the cold source and the heat-generating device contained in the cooling module through the heat exchange module.

[0017] In one specific embodiment, the immersion cooling device further includes at least one cooling module. The cooling module housing may have a liquid inlet and an air outlet. The liquid inlet may be connected to the liquid storage module via a pump body, and the air outlet may be connected to the condensing module. The air outlet may be higher than the liquid inlet in the height of the cooling module. This can, to a certain extent, prevent liquid working medium entering the cooling module from entering the condensing module via the air outlet, ensuring that the liquid working medium in the cooling module maintains a certain level, sufficient to submerge at least a portion of the heat-generating device, thereby improving the heat exchange efficiency between the liquid working medium and the heat-generating device.

[0018] In a specific embodiment, the immersion cooling device may further include a diversion module. The diversion module housing may have a main liquid inlet interface and multiple diversion interfaces. Multiple diversion pipelines may be provided within the diversion module, each diversion interface being connected to the main liquid inlet interface via a diversion pipeline. The main liquid inlet interface may be connected to the liquid storage module via a pump body. There may be multiple cooling modules, and the multiple cooling modules may be arranged along the height of the cooling module. The liquid inlet interface of each cooling module may be connected to a diversion interface. This allows liquid to be supplied to multiple cooling modules via a single pipeline connected to the main liquid inlet interface, thereby simplifying the structural complexity of the device and improving the overall operating efficiency of the device.

[0019] In one specific embodiment, the condensing module can be taller than the liquid storage module in the height direction of the liquid storage module; the condensing module housing can have a first opening at one end facing the liquid storage module housing, and a second opening at the other end facing the condensing module housing. The first opening and the second opening are connected, so that the condensing module housing and the liquid storage module housing form a closed shell, thereby achieving communication between the internal storage space of the condensing module and the internal storage space of the liquid storage module.

[0020] In one specific embodiment, a condenser may be provided within the condensing module, and the condenser may be connected to a cold source. The heat exchange module housing may have a first liquid cooling interface and a second liquid cooling interface. A liquid cooling channel may be provided within the heat exchange module, and the liquid cooling channel may be connected to the first and second liquid cooling interfaces. The first and second liquid cooling interfaces may be connected to the cold source, thereby connecting the liquid cooling channel and the cold source. The liquid cooling channel may be connected in series or in parallel with the condenser. The cold source can exchange heat with the gas working medium entering the condensing module through the condenser, causing the gas working medium to cool and condense into liquid working medium.

[0021] In a second aspect, the present application provides an immersion cooling device, which may include a condensing module, a liquid storage module, a pump body, and a heat exchange module. The condensing module may be connected to at least one cooling module; wherein the cooling module may accommodate a heating device and may exchange heat with the heating device. The liquid storage module may accommodate a working fluid, the liquid storage module may be connected to the condensing module, and the liquid storage module may be connected to the cooling module via a pump body, which may transport the working fluid contained in the liquid storage module to the cooling module. The heat exchange module may be disposed inside the liquid storage module, and the heat exchange module may exchange heat with the working fluid contained in the liquid storage module.

[0022] In the technical solution provided in the present application, the heat exchange module can be arranged inside the liquid storage module. The heat exchange module is not in the working fluid circulation loop. The heat exchange module directly exchanges heat with the working fluid, which can reduce the temperature of the liquid working fluid, increase the supercooling of the liquid working fluid, avoid cavitation of the pump body, and improve the reliability of the pump body, thereby improving the reliability of the entire refrigeration system.

[0023] In one specific embodiment, the heat exchange module housing may have a first liquid cooling interface and a second liquid cooling interface, and a liquid cooling channel may be provided within the heat exchange module. The liquid cooling channel may be connected to the first and second liquid cooling interfaces, and the first and second liquid cooling interfaces may be connected to a cold source, thereby connecting the liquid cooling channel and the cold source. The cold source can exchange heat with the liquid working medium contained in the liquid storage module through the heat exchange module, thereby enabling the cold source to exchange heat with the heat-generating device contained in the cooling module through the heat exchange module.

[0024] In a specific feasible embodiment, the immersion cooling device also includes at least one cooling module, the cooling module shell has a liquid inlet interface and an air outlet interface, the liquid inlet interface is connected to the liquid storage module through a pump body, and the air outlet interface is connected to the condensing module; in the height direction of the cooling module, the air outlet interface is higher than the liquid inlet interface.

[0025] In a specific feasible implementation scheme, the immersion cooling device also includes a diversion module, the diversion module shell has a liquid inlet main interface and multiple diversion interfaces, and multiple diversion pipelines are arranged inside the diversion module, each diversion interface is connected to the liquid inlet main interface through a diversion pipeline; the liquid inlet main interface is connected to the liquid storage module through a pump body; there are multiple cooling modules, and the multiple cooling modules are arranged along the height direction of the cooling module, and the liquid inlet interface of each cooling module is connected to a diversion interface.

[0026] In a specific feasible embodiment, in the height direction of the liquid storage module, the condensing module is higher than the liquid storage module; the condensing module shell has a first opening at one end facing the liquid storage module shell, and the liquid storage module shell has a second opening at one end facing the condensing module shell, and the first opening is connected to the second opening so that the condensing module shell and the liquid storage module shell form a closed shell.

[0027] In a specific feasible implementation plan, a condenser is provided inside the condensing module, and the condenser is used to be connected to a cold source; the heat exchange module shell has a first liquid cooling interface and a second liquid cooling interface, and a liquid cooling channel is provided inside the heat exchange module, and the liquid cooling channel is connected to the first liquid cooling interface and the second liquid cooling interface, and the first liquid cooling interface and the second liquid cooling interface are used to be connected to a cold source to connect the liquid cooling channel and the cold source; the liquid cooling channel and the condenser are connected in series or in parallel.

[0028] In a third aspect, the present application further provides an electronic device that may include at least one service board corresponding to at least one cooling module and an immersion cooling device as described in any of the possible implementations of the first or second aspects above, wherein each service board is immersed in the corresponding cooling module. The pump body of the immersion cooling device has a high reliability, and thus the overall reliability of the refrigeration system formed by the immersion cooling device is high, the service boards can be cooled more reliably, and the stability of the electronic device is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic structural diagram of an immersion cooling device provided in this application;

[0030] FIG2 is another schematic structural diagram of the immersion cooling device provided by the present application;

[0031] FIG3 is another schematic structural diagram of the immersion cooling device provided by the present application;

[0032] FIG4 is another schematic structural diagram of the immersion cooling device provided by the present application;

[0033] FIG5 is a schematic diagram of a partial structure of an immersion cooling device provided in the present application;

[0034] FIG6 is a schematic diagram of a partial structure of an immersion cooling device provided in the present application;

[0035] FIG7 is another schematic structural diagram of the immersion cooling device provided in this application.

[0036] Figure markings: 100-cooling module; 200-condensing module; 300-liquid storage module; 400-pump body; 500-heat exchange module; 600-first transmission channel; 700-second transmission channel; 800-cold source; 900-diversion module; 101-liquid inlet interface; 102-gas outlet interface; 201-first opening; 202-condenser; 301-second opening; 401-first delivery interface; 402-second delivery interface; 501-first heat exchange interface; 502-second heat exchange interface; 503-heat exchange channel; 504-third heat exchange interface; 505-first liquid cooling interface; 506-second liquid cooling interface; 507-liquid cooling channel; 901-liquid inlet main interface; 902-diversion interface. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all explained with reference to the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings in the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0038] The following description sets forth specific details to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotations of the embodiments of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0039] For ease of understanding, the application scenario of the immersion cooling device involved in the present application is first explained. The immersion cooling device provided in the embodiment of the present application can be adapted to electronic equipment such as servers, and as a cooling device for electronic equipment, it is used to dissipate heat for heat-generating devices such as business boards and chips on business boards. In actual application, the electronic equipment may include at least one business board corresponding to at least one cooling module and an immersion cooling device. The cooling module may be arranged inside a cabinet, and a liquid working medium may be contained inside the cooling module, and each business board is immersed in the corresponding cooling module. Specifically, the business board can be immersed in the liquid working medium. When the business board is working, the liquid working medium boils on the surface of heat-generating devices such as the business board and the chip on the business board to generate gas, thereby realizing heat exchange with the heat-generating device.

[0040] In the related art, two-phase immersion cooling is a new type of cooling technology that uses a gas-liquid two-phase working fluid to cool the heating device. This cooling technology has a good cooling effect, low energy consumption, and can significantly improve energy utilization efficiency. However, the difficulty of the two-phase immersion cooling system is that the two-phase working fluid is required to have a certain degree of supercooling before entering the pump to avoid cavitation in the pump. Cavitation refers to the situation where the liquid working fluid is not sufficiently supercooled, and the liquid working fluid will undergo a phase change to produce gas in a vacuum environment. The bubbles will erode the metal surface of the impeller and other metal components under the impact of the particles of the liquid working fluid, thereby damaging the impeller and other metal components of the pump. Based on this, the embodiment of the present application provides an immersion cooling device to increase the supercooling of the liquid working fluid before entering the pump, thereby avoiding cavitation in the system pump.

[0041] First, refer to Figure 1, which shows a schematic structural diagram of the immersion cooling device provided by the present application. As shown in Figure 1, the immersion cooling device provided by the embodiment of the present application may include a cooling module 100, a condensing module 200, a liquid storage module 300, a pump body 400 and a heat exchange module 500. The cooling module 100 can be a sealed shell, and the cooling module 100 can accommodate a liquid working medium. The cooling module 100 can accommodate a heating device and exchange heat with the heating device. Specifically, the heating device can be immersed in the liquid working medium. When the heating device is working, the liquid working medium exchanges heat with the heating device. The boiling point of the liquid working medium is relatively low, and the liquid working medium boils when heated and vaporizes into a gaseous working medium. The condensing module 200 can be connected to the cooling module 100, and the gaseous working medium can enter the condensing module 200 from the cooling module 100. The gaseous working medium is cooled and condensed into a liquid working medium in the condensing module 200.

[0042] The liquid storage module 300 is connected to the condensing module 200, and the liquid working medium in the condensing module 200 can enter the liquid storage module 300. The liquid storage module 300 can be connected to the cooling module 100 via the pump body 400. The pump body 400 can transport the liquid working medium contained in the liquid storage module 300 to the cooling module 100, thereby forming a working medium circulation refrigeration system, which can achieve continuous cooling of the heating device.

[0043] The heat exchange module 500 housing may have a first heat exchange interface 501 and a second heat exchange interface 502. A heat exchange channel 503 is provided inside the heat exchange module 500. The heat exchange channel 503 is connected to the first heat exchange interface 501 and the second heat exchange interface 502. The heat exchange channel 503 can exchange heat with the working fluid flowing through the heat exchange channel 503 to cool the working fluid. When specifically connected, the first heat exchange interface 501 is connected to the liquid storage module 300, and the second heat exchange interface 502 is connected to the pump body 400. The heat exchange module 500 can exchange heat with the liquid working fluid in the liquid storage module 300, thereby reducing the temperature of the liquid working fluid and increasing the supercooling of the liquid working fluid. This allows for precise control of the supercooling of the liquid working fluid, ensures that cavitation does not occur in the pump body 400, and improves the reliability of the pump body 400.

[0044] The immersion cooling device provided in the present application adopts a two-phase working fluid to exchange heat with the heating device. Boiling heat exchange occurs during the two-phase cooling process. The heat transfer coefficient is larger than that of single-phase heat exchange, and the cooling effect is better. In addition, the introduction of heat exchange module 500 and heat exchange with the liquid working fluid in the liquid storage module 300 can improve the supercooling of the liquid working fluid in the refrigeration system, avoid cavitation of the pump body 400, improve the reliability of the pump body 400, and thus improve the reliability of the entire refrigeration system.

[0045] In a specific implementation, heat exchange module 500 can employ a plate heat exchanger. Plate heat exchangers have a high heat transfer coefficient, are compact, and are easy to install. They can also achieve high heat exchange efficiency with low power consumption. Furthermore, plate heat exchangers can increase the flow rate of the working fluid, further improving heat exchange efficiency.

[0046] As a possible embodiment, the liquid storage module 300 can be connected to the cooling module 100 through the first transmission channel 600, and the pump body 400 can be connected to the first transmission channel 600, that is, the liquid storage module 300, the pump body 400 and the cooling module 100 are connected in series in sequence through the first transmission channel 600. The liquid working medium in the liquid storage module 300 can flow through the pump body 400 through the first transmission channel 600 and then enter the cooling module 100. The first heat exchange interface 501 of the heat exchange module 500 is in communication with the liquid storage module 300, and the heat exchange module 500 can exchange heat with the liquid working medium in the liquid storage module 300. The second heat exchange interface 502 can be connected to the first transmission channel 600 to connect to the pump body 400.

[0047] In a specific implementation, the heat exchange module 500 can be disposed outside the liquid storage module 300, that is, the heat exchange module 500 can be disposed outside the housing of the liquid storage module 300. Specifically, the heat exchange module 500 can be connected to the first transmission channel 600, with the first heat exchange interface 501 of the heat exchange module 500 communicating with the liquid storage module 300, and the second heat exchange interface 502 of the heat exchange module 500 connected to the pump body 400 through the first transmission channel 600. The heat exchange module 500 can exchange heat with the liquid working medium flowing through the first transmission channel 600 to reduce the temperature of the liquid working medium.

[0048] In one possible implementation, the heat exchange module 500 can be connected between the liquid storage module 300 and the pump body 400. The first heat exchange interface 501 of the heat exchange module 500 communicates with the liquid storage module 300 via a first transmission channel 600, and the second heat exchange interface 502 of the heat exchange module 500 connects to the pump body 400 via the first transmission channel 600. In this implementation, the heat exchange module 500 is connected in series before the pump body 400 in the direction of liquid flow. The liquid in the liquid storage module 300 can flow sequentially through the heat exchange module 500 and the pump body 400 via the first transmission channel 600, and then enter the cooling module 100. The liquid in the liquid storage module 300 is cooled when flowing through the heat exchange module 500, and the degree of supercooling of the liquid is improved. The cooled liquid then enters the pump body 400, which can prevent cavitation in the pump body 400 and improve the reliability of the pump body 400.

[0049] In specific implementation, the outer shell of the pump body 400 can have a first delivery interface 401 and a second delivery interface 402. The second heat exchange interface 502 of the heat exchange module 500 is connected to the first delivery interface 401 of the pump body 400 through the first transmission channel 600, and the second delivery interface 402 of the pump body 400 is connected to the cooling module 100 through the first transmission channel 600, so that the heat exchange module 500 is connected in series before the pump body 400 in the flow direction of the liquid working medium.

[0050] Specifically, the first transmission channel 600 can be implemented based on a multi-section pipeline connection. For example, the first transmission channel 600 includes three sections of pipelines. For ease of description, these three sections of pipelines are respectively referred to as the first transmission pipeline 601, the second transmission pipeline 602, and the third transmission pipeline 603. The first heat exchange interface 501 of the heat exchange module 500 is connected to the liquid storage module 300 through the second transmission pipeline 602. The second heat exchange interface 502 of the heat exchange module 500 is connected to the first delivery interface 401 of the pump body 400 through the first transmission pipeline 601. The second delivery interface 402 of the pump body 400 is connected to the cooling module 100 through the third transmission pipeline 603. The liquid working medium in the liquid storage module 300 can flow through the second transmission pipeline 602, the heat exchange module 500, the first transmission pipeline 601, the pump body 400, and the third transmission pipeline 603 in sequence, and then enter the cooling module 100.

[0051] Figure 2 shows another structural schematic diagram of the immersion cooling device provided in the present application. As shown in Figure 2, in another possible specific implementation, the heat exchange module 500 can be connected between the pump body 400 and the cooling module 100, and the first heat exchange interface 501 of the heat exchange module 500 is connected to the liquid storage module 300 through the second transmission channel 700, and the second heat exchange interface 502 of the heat exchange module 500 is connected to the pump body 400 through the first transmission channel 600. In this specific implementation, in the flow direction of the liquid working medium, the heat exchange module 500 is connected in series after the pump body 400. At this time, the outer shell of the heat exchange module 500 also has a third heat exchange interface 504, the third heat exchange interface 504 is connected to the heat exchange channel 503, and the third heat exchange interface 504 of the heat exchange module 500 is connected to the cooling module 100 through the first transmission channel 600. The liquid working medium in the liquid storage module 300 can flow through the first transmission channel 600, the pump body 400, the first transmission channel 600, and the heat exchange module 500 in sequence. A portion of the liquid working medium then flows back to the liquid storage module 300 through the second transmission channel 700, while another portion of the liquid working medium enters the cooling module 100 through the first transmission channel 600. The liquid working medium is cooled while flowing through the heat exchange module 500, increasing its subcooling. The liquid working medium that flows back to the liquid storage module 300 through the second transmission channel 700 mixes with the original liquid working medium in the liquid storage module 300, lowering the temperature of the liquid working medium in the liquid storage module 300. For example, if the temperature of the liquid working medium entering the liquid storage module 300 from the condensing module 200 is 10°C and the temperature of the liquid working medium cooled by the heat exchange module 500 is 5°C, the temperature of the mixed liquid working medium in the liquid storage module 300 is between 5 and 10°C. As a result, the supercooling degree of the mixed liquid working fluid is improved. During the working fluid circulation refrigeration process, the mixed liquid working fluid enters the pump body 400 from the liquid storage module 300. Compared with the situation where the original liquid working fluid in the liquid storage module 300 enters the pump body 400 from the liquid storage module 300, the liquid working fluid is more likely to meet the supercooling requirement, and can also avoid cavitation of the pump body 400, and can also achieve the purpose of improving the reliability of the pump body 400.

[0052] During specific implementation, the first delivery interface 401 of the pump body 400 is connected to the liquid storage module 300 through the first transmission channel 600, and the second heat exchange interface 502 of the heat exchange module 500 is connected to the second delivery interface 402 of the pump body 400 through the first transmission channel 600, so that the heat exchange module 500 is connected in series after the pump body 400 in the flow direction of the liquid working medium.

[0053] Similar to the embodiment shown in FIG1 , the first transmission channel 600 can be implemented based on a multi-section pipeline connection. For example, the first transmission channel 600 includes three sections of pipelines. For the convenience of description, these three sections of pipelines are respectively referred to as the first transmission pipeline 601, the second transmission pipeline 602, and the third transmission pipeline 603. Different from the embodiment shown in FIG1 , in the embodiment shown in FIG2 , the first heat exchange interface 501 of the heat exchange module 500 is connected to the liquid storage module 300 through the second transmission channel 700, the second heat exchange interface 502 of the heat exchange module 500 is connected to the second delivery interface 402 of the pump body 400 through the first transmission pipeline 601, the third heat exchange interface 504 of the heat exchange module 500 is connected to the cooling module 100 through the third transmission pipeline 603, and the first delivery interface 401 of the pump body 400 is connected to the liquid storage module 300 through the second transmission pipeline 602. The liquid working medium in the liquid storage module 300 can flow through the second transmission pipeline 602, the pump body 400, the first transmission pipeline 601, the heat exchange module 500, and the third transmission pipeline 603 in sequence, and then enter the cooling module 100. After being cooled by the heat exchange module 500, a portion of the liquid working medium is diverted through the second transmission channel 700 and flows back to the liquid storage module 300.

[0054] FIG3 shows another structural schematic diagram of the immersion cooling device provided in the present application. As shown in FIG3 , as another possible embodiment, the heat exchange module 500 can be arranged inside the liquid storage module 300, the first heat exchange interface 501 of the heat exchange module 500 is connected to the internal accommodation space of the liquid storage module 300, and the second heat exchange interface 502 of the heat exchange module 500 is connected to the first transmission channel 600 to connect to the pump body 400 and the cooling module 100. The liquid working medium in the liquid storage module 300 can enter the heat exchange module 500 through the first heat exchange interface 501 of the heat exchange module 500, and then flow through the first transmission channel 600, the pump body 400, the first transmission channel 600 in sequence, and then enter the cooling module 100. The liquid working medium in the liquid storage module 300 is cooled when flowing through the heat exchange module 500, and the supercooling degree of the liquid working medium is improved. The cooled liquid working medium then enters the pump body 400, which can avoid cavitation of the pump body 400 and improve the reliability of the pump body 400.

[0055] In a specific implementation, the first transmission channel 600 can extend into the interior of the liquid storage module 300, and the second heat exchange interface 502 of the heat exchange module 500 is connected to the first transmission channel 600. Alternatively, the first transmission channel 600 can be connected to the outer shell of the liquid storage module 300, and the second heat exchange interface 502 of the heat exchange module 500 is connected to the first transmission channel 600 via a pipeline and necessary connectors. Specifically, the second heat exchange interface 502 of the heat exchange module 500 is connected to the first delivery interface 401 of the pump body 400 via the first transmission channel 600, and the second delivery interface 402 of the pump body 400 is connected to the cooling module 100 via the first transmission channel 600.

[0056] In a specific implementation, the shell of the heat exchange module 500 may also have a first liquid cooling interface 505 and a second liquid cooling interface 506, and a liquid cooling channel 507 is provided inside the heat exchange module 500, and the liquid cooling channel 507 is connected to the first liquid cooling interface 505 and the second liquid cooling interface 506. In actual application, the first liquid cooling interface 505 and the second liquid cooling interface 506 of the heat exchange module 500 can be connected to the cold source 800 outside the device. Specifically, the cold source 800 can be connected between the first liquid cooling interface 505 and the second liquid cooling interface 506 of the heat exchange module 500. In this way, the cold source 800 and the liquid cooling flow channel 507 of the heat exchange module 500 can be connected. Heat exchange can be achieved between the liquid cooling flow channel 507 of the heat exchange module 500 and the heat exchange flow channel 503. The cold source 800 can exchange heat with the liquid working medium flowing through the heat exchange flow channel 503, thereby achieving heat exchange between the cold source 800 and the heat-generating device contained in the cooling module 100 through the heat exchange module 500. In a specific implementation, the cold source 800 can be a cooling tower or liquid cooling module of an electronic device, etc., and the cold source 800 can provide cold water to the heat exchange module 500.

[0057] FIG4 shows another structural schematic diagram of the immersion cooling device provided by the present application. As shown in FIG4, the embodiment of the present application also provides another immersion cooling device. Similar to the above embodiment, the immersion cooling device may include a cooling module 100, a condensing module 200, a liquid storage module 300, a pump body 400 and a heat exchange module 500. The cooling module 100 can accommodate a heating device and exchange heat with the heating device; the condensing module 200 is connected to the cooling module 100; the liquid storage module 300 contains a working medium, the liquid storage module 300 is connected to the condensing module 200, and the liquid storage module 300 is connected to the cooling module 100 via the pump body 400. The pump body 400 can transport the working medium contained in the liquid storage module 300 to the cooling module 100, thereby forming a working medium circulation refrigeration system. Different from the above embodiment, the heat exchange module 500 can be arranged inside the liquid storage module 300. The heat exchange module 500 is not in the working fluid circulation loop. The heat exchange module 500 directly exchanges heat with the working fluid, reduces the temperature of the liquid working fluid, increases the supercooling degree of the liquid working fluid, avoids cavitation of the pump body 400, improves the reliability of the pump body 400, and thus improves the reliability of the entire refrigeration system.

[0058] In a specific implementation, the heat exchange module 500 can employ a tube-and-fin heat exchanger. The heat exchange module 500 housing can have a first liquid cooling interface 505 and a second liquid cooling interface 506. A liquid cooling channel 507 is provided within the heat exchange module 500, and the liquid cooling channel 507 is connected to the first liquid cooling interface 505 and the second liquid cooling interface 506. The first liquid cooling interface 505 and the second liquid cooling interface 506 can be connected to a cold source 800 outside the device, thereby connecting the liquid cooling channel 507 and the cold source 800. This allows the cold source 800 to exchange heat with the liquid working medium contained in the liquid storage module 300 through the heat exchange module 500, thereby allowing the cold source 800 to exchange heat with the heat-generating device contained in the cooling module 100 through the heat exchange module 500.

[0059] In specific implementation, the liquid storage module 300 can be connected to the cooling module 100 through the first transmission channel 600, the pump body 400 is connected in the first transmission channel 600, the liquid storage module 300, the pump body 400 and the cooling module 100 are connected in series in sequence through the first transmission channel 600, and the liquid working medium in the liquid storage module 300 can flow through the first transmission channel 600, the pump body 400, the first transmission channel 600 in sequence, and then enter the cooling module 100 to cool the heating device contained in the cooling module 100.

[0060] Several possible embodiments of the immersion cooling device are described above. The above immersion cooling devices may also have some common configurations, which will be described in detail below.

[0061] FIG5 shows a partial structural diagram of the immersion cooling device provided in the present application. As shown in FIG1 and FIG5 , the outer shell of the cooling module 100 may have a liquid inlet interface 101 and an air outlet interface 102. The liquid inlet interface 101 is connected to the liquid storage module 300 via the pump body 400, and the air outlet interface 102 is connected to the condensing module 200. In terms of the height of the cooling module 100, the air outlet interface 102 is higher than the liquid inlet interface 101. This can, to a certain extent, prevent the liquid working medium entering the cooling module 100 from entering the condensing module 200 via the air outlet interface 102, thereby ensuring that the liquid working medium in the cooling module 100 has a certain liquid level, which can immerse at least part of the heat-generating device and improve the heat exchange efficiency between the liquid working medium and the heat-generating device. Of course, when the liquid level of the liquid working medium in the cooling module 100 reaches the height of the gas outlet interface 102, the liquid working medium in the cooling module 100 can also enter the condensing module 200 through the gas outlet interface 102. That is, the gas outlet interface 102 can pass both gaseous working medium and liquid working medium, and the liquid working medium entering the condensing module 200 can continue to enter the liquid storage module 300. In a specific implementation, the gas outlet interface 102 of the cooling module 100 can be higher than the bottom of the housing of the liquid storage module 300 to prevent the liquid working medium in the liquid storage module 300 from flowing back into the cooling module 100 through the gas outlet interface 102 of the cooling module 100.

[0062] In actual configuration, the immersion cooling device may further include a diverter module 900. The outer shell of the diverter module 900 may have a liquid inlet main interface 901 and multiple diverter interfaces 902. Multiple diverter pipelines may be provided inside the diverter module 900, and each diverter interface 902 is connected to the liquid inlet main interface 901 through a diverter pipeline. The liquid inlet main interface 901 is connected to the liquid storage module 300 through the pump body 400. Specifically, the liquid inlet main interface 901 may be connected to the pump body 400 through the first transmission channel 600. When there are multiple cooling modules 100, the multiple cooling modules 100 may be arranged along the height direction of the cooling module 100, and the liquid inlet interface 101 of each cooling module 100 may be connected to a diverter interface 902. In this way, liquid can be supplied to multiple cooling modules 100 through a pipeline connected to the liquid inlet main interface 901, which can simplify the structural complexity of the device and improve the overall operating efficiency of the device.

[0063] FIG6 shows a schematic diagram of the partial structure of the immersion cooling device provided in the present application. As shown in FIG6 , in a specific implementation, in the height direction of the liquid storage module 300, the condensing module 200 is higher than the liquid storage module 300, so that the liquid working medium formed by cooling and condensing the gas working medium in the condensing module 200 can enter the liquid storage module 300 only by gravity, which can reduce the overall energy consumption of the device. Specifically, the end of the condensing module 200 shell facing the liquid storage module 300 shell can have a first opening 201, and the end of the liquid storage module 300 shell facing the condensing module 200 shell can have a second opening 301, and the first opening 201 is connected to the second opening 301 so that the condensing module 200 shell and the liquid storage module 300 shell form a closed shell. The first opening 201 and the second opening 301 can both be circular, and the radial dimension of the first opening 201 can be the same as the radial dimension of the second opening 301. The first opening 201 and the second opening 301 can be connected to achieve communication between the internal storage space of the condensing module 200 and the internal storage space of the liquid storage module 300.

[0064] In a specific implementation, the outer shell of the condensing module 200 and the outer shell of the liquid storage module 300 can both be cylindrical, and the radial dimensions of the two can be the same. The radial dimension of the first opening 201 can be the same as the radial dimension of the outer shell of the condensing module 200, and the radial dimension of the second opening 301 can be the same as the radial dimension of the outer shell of the liquid storage module 300. After the first opening 201 and the second opening 301 are docked, the outer shell of the condensing module 200 and the outer shell of the liquid storage module 300 are also cylindrical as a whole. In this case, the outer shell of the condensing module 200 and the outer shell of the liquid storage module 300 can be integrally formed. Alternatively, the radial dimension of the first opening 201 can be smaller than the radial dimension of the outer shell of the condensing module 200, and the radial dimension of the second opening 301 can be smaller than the radial dimension of the outer shell of the liquid storage module 300. After the first opening 201 and the second opening 301 are docked, the internal storage space of the condensing module 200 is connected to the internal storage space of the liquid storage module 300.

[0065] In another specific implementation, the housing of the condensing module 200 and the housing of the liquid storage module 300 can be connected by a pipeline, and the condensing module 200 can be higher than the liquid storage module 300, or the condensing module 200 can be lower than the liquid storage module 300. When the condensing module 200 is lower than the liquid storage module 300, the liquid working medium accumulated in the condensing module 200 can be pumped into the liquid storage module 300 by a pump.

[0066] In a specific implementation, a condenser 202 may be provided inside the condensing module 200. As shown in FIG3 , the condenser 202 may be connected to a cold source 800 outside the device. The cold source 800 exchanges heat with the gaseous working medium entering the condensing module 200 through the condenser 202, so that the gaseous working medium is cooled and condensed into a liquid working medium. In a specific implementation, the first liquid cooling interface 505 and the second liquid cooling interface 506 of the heat exchange module 500 are connected to the cold source 800 to connect the liquid cooling channel 507 of the heat exchange module 500 to the cold source 800. The liquid cooling channel 507 and the condenser 202 may be connected in series or in parallel with the cold source 800, that is, the heat exchange module 500 and the condenser 202 may be connected in series or in parallel with the cold source 800. FIG1 to FIG4 illustrate the case where the heat exchange module 500 and the condenser 202 are connected in series. FIG7 illustrates a case where the heat exchange module 500 and the condenser 202 are connected in parallel to the cold source 800, i.e., the cold source 800 exchanges heat with the condenser 202 and the heat exchange module 500 separately, rather than first passing through one of the heat dissipation devices (such as the condenser 202) and then passing through the other (such as the heat exchange module 500). Of course, in the case of parallel connection, some pipelines can still be reused (such as first reusing a pipeline to output the cold source and then separating through two pipelines; the cold source passes through the heat exchange module 500 and the condenser 202 respectively and then reuses a pipeline for return). It is only necessary to ensure that after passing through one of the heat dissipation devices, it does not pass through the other. When the heat exchange module 500 and the condenser 202 are connected in parallel, the cold water temperature in the heat exchange module 500 is lower than when the heat exchange module 500 and the condenser 202 are connected in series, and the heat exchange effect between the heat exchange module 500 and the liquid working medium is more significant, which can meet higher subcooling requirements.

[0067] In this application, "at least one" means one or more, and "more" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. In the text description of this application, the character " / " generally indicates that the previous and next associated objects are in an "or" relationship; in the formula of this application, the character " / " indicates that the previous and next associated objects are in a "division" relationship. "Including at least one of A, B and C" can mean: including A; including B; including C; including A and B; including A and C; including B and C; including A, B and C.

[0068] It is understood that the various numbers used in the embodiments of this application are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The order of the sequence numbers of the above-mentioned processes does not necessarily imply a specific order of execution; the order of execution of the processes should be determined by their functions and inherent logic.

[0069] The above is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in this application should be covered by the protection scope of the present application.

Claims

1. An immersion cooling device, characterized in that: Including condensing module, liquid storage module, pump body and heat exchange module; The condensing module is used to connect to at least one cooling module; wherein the cooling module is used to accommodate a heating device and to exchange heat with the heating device; The liquid storage module is used to accommodate the working medium, the liquid storage module is connected to the condensing module, and the liquid storage module is used to be connected to the cooling module through the pump body, and the pump body is used to transport the working medium accommodated in the liquid storage module to the cooling module; The heat exchange module shell has a first heat exchange interface and a second heat exchange interface. A heat exchange channel is provided inside the heat exchange module, and the heat exchange channel is connected to the first heat exchange interface and the second heat exchange interface; the first heat exchange interface is connected to the liquid storage module, and the second heat exchange interface is connected to the pump body.

2. The immersion cooling device according to claim 1, wherein: The liquid storage module is used to be connected to the cooling module through a first transmission channel, and the pump body is connected in the first transmission channel; The second heat exchange interface is connected to the first transmission channel.

3. The immersion cooling device according to claim 2, wherein: The heat exchange module is arranged inside the liquid storage module, and the first heat exchange interface is communicated with the internal accommodation space of the liquid storage module.

4. The immersion cooling device according to claim 2, wherein: The heat exchange module is arranged outside the liquid storage module, and the heat exchange module is connected in the first transmission channel; The first transmission channel includes a first transmission pipeline, and the second heat exchange interface is connected to the pump body through the first transmission pipeline.

5. The immersion cooling device according to claim 4, characterized in that: The heat exchange module is connected between the liquid storage module and the pump body; The first transmission channel includes a second transmission pipeline, and the first heat exchange interface is connected to the liquid storage module through the second transmission pipeline.

6. The immersion cooling device according to claim 5, characterized in that: The pump housing has a first delivery interface and a second delivery interface, and the second heat exchange interface is connected to the first delivery interface through the first transmission pipeline; The first transmission channel includes a third transmission pipeline, and the second delivery interface is used to be connected to the cooling module through the third transmission pipeline.

7. The immersion cooling device according to claim 4, wherein: The heat exchange module is used to connect between the pump body and the cooling module; The heat exchange module shell has a third heat exchange interface, which is connected to the heat exchange channel; the first transmission channel includes a third transmission pipeline, and the third heat exchange interface is used to connect to the cooling module through the third transmission pipeline.

8. The immersion cooling device according to claim 7, characterized in that: The pump body shell has a first delivery interface and a second delivery interface. The first transmission channel includes a second transmission pipeline. The first delivery interface is connected to the liquid storage module through the second transmission pipeline. The second heat exchange interface is connected to the second delivery interface through the first transmission pipeline.

9. The immersion cooling device according to any one of claims 1 to 8, characterized in that: The heat exchange module shell has a first liquid cooling interface and a second liquid cooling interface. A liquid cooling channel is provided inside the heat exchange module, and the liquid cooling channel is connected to the first liquid cooling interface and the second liquid cooling interface; the first liquid cooling interface and the second liquid cooling interface are used to connect to a cold source to connect the liquid cooling channel and the cold source, and the liquid cooling channel is used to exchange heat with the heat exchange channel.

10. An immersion cooling device, characterized in that: Including condensing module, liquid storage module, pump body and heat exchange module; The condensing module is connected to at least one cooling module; wherein the cooling module is used to accommodate a heating device and to exchange heat with the heating device; The liquid storage module is used to accommodate the working medium, the liquid storage module is connected to the condensing module, and the liquid storage module is used to be connected to the cooling module through the pump body, and the pump body is used to transport the working medium accommodated in the liquid storage module to the cooling module; The heat exchange module is arranged inside the liquid storage module, and is used for exchanging heat with the working medium contained in the liquid storage module.

11. The immersion cooling device according to claim 10, wherein: The heat exchange module shell has a first liquid cooling interface and a second liquid cooling interface. A liquid cooling channel is provided inside the heat exchange module. The liquid cooling channel is connected to the first liquid cooling interface and the second liquid cooling interface. The first liquid cooling interface and the second liquid cooling interface are used to connect to a cold source to connect the liquid cooling channel and the cold source.

12. The immersion cooling device according to any one of claims 1 to 11, characterized in that: The system further comprises at least one cooling module, wherein the cooling module housing has a liquid inlet interface and an air outlet interface, the liquid inlet interface is connected to the liquid storage module through the pump body, and the air outlet interface is connected to the condensing module; In the height direction of the cooling module, the air outlet interface is higher than the liquid inlet interface.

13. The immersion cooling device according to claim 12, wherein: The system further comprises a diversion module, wherein the diversion module housing has a main liquid inlet interface and a plurality of diversion interfaces, and a plurality of diversion pipelines are provided inside the diversion module, each of the diversion interfaces is connected to the main liquid inlet interface via a diversion pipeline; the main liquid inlet interface is connected to the liquid storage module via the pump body; There are multiple cooling modules, and the multiple cooling modules are arranged along the height direction of the cooling module. The liquid inlet interface of each cooling module is connected to one diversion interface.

14. The immersion cooling device according to any one of claims 1 to 13, characterized in that: In the height direction of the liquid storage module, the condensing module is higher than the liquid storage module; The condensing module shell has a first opening at one end facing the liquid storage module shell, and the liquid storage module shell has a second opening at one end facing the condensing module shell. The first opening is connected to the second opening so that the condensing module shell and the liquid storage module shell form a closed shell.

15. The immersion cooling device according to any one of claims 1 to 14, characterized in that: A condenser is provided inside the condensing module, and the condenser is used to be connected to a cold source; The heat exchange module housing has a first liquid cooling interface and a second liquid cooling interface. A liquid cooling channel is provided inside the heat exchange module, and the liquid cooling channel is connected to the first liquid cooling interface and the second liquid cooling interface. The first liquid cooling interface and the second liquid cooling interface are used to connect to the cold source, so as to connect the liquid cooling channel and the cold source; The liquid cooling channel is connected in series or in parallel with the condenser.

16. An electronic device, characterized in that: It comprises at least one service board corresponding to the at least one cooling module and the immersion cooling device according to any one of claims 1 to 15, and each service board is immersed in the corresponding cooling module.

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