Display panel and display apparatus

Abstract

The present disclosure belongs to the technical field of display. Provided are a display panel and a preparation method therefor, and a display apparatus. The display panel of the present disclosure comprises a base substrate, and a light-emitting functional layer, a packaging layer and a peeping prevention structure which are sequentially arranged on the base substrate, wherein the light-emitting functional layer comprises a plurality of light-emitting devices. The peeping prevention structure comprises an electrochromic layer, a first electrode arranged on the side of the electrochromic layer that faces away from the base substrate, and a second electrode arranged on the side of the electrochromic layer that is close to the base substrate, wherein the electrochromic layer comprises a plurality of contact portions, and connecting portions which connect every two adjacent contact portions; both the first electrode and the second electrode are in contact with the contact portions, one of the first electrode and the second electrode is in contact with the connecting portions, and the other one of the first electrode and the second electrode is spaced apart from the connecting portions; and the connecting portions and the light-emitting devices are arranged in a manner of corresponding to each other on a one-to-one basis.

Description

Display panel and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 2024102317607 filed with the China National Intellectual Property Administration on February 29, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure belongs to the field of display technology, and particularly relates to a display panel and a display device. Background Art

[0004] Organic Light-Emitting Diode (OLED) screens, with their advantages such as self-luminescence, low power consumption, thinness, flexibility, brilliant colors, high contrast, and fast response time, have attracted widespread attention and are becoming the next generation of displays, gradually replacing Liquid Crystal Display (LCD) screens. As users' demands for privacy continue to rise, display privacy protection is gaining increasing attention. The standard privacy protection solution involves applying a privacy film, but this significantly reduces brightness and requires regular replacement. Furthermore, it's impossible to switch between privacy mode and normal mode. Summary of the Invention

[0005] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provide a display panel and a display device.

[0006] In a first aspect, the technical solution adopted to solve the technical problem of the present disclosure is a display panel, comprising a base substrate, and a light-emitting functional layer, an encapsulation layer and an anti-peeping structure sequentially arranged on the base substrate;

[0007] The light-emitting functional layer includes a plurality of light-emitting devices;

[0008] The anti-peeping structure includes an electrochromic layer, a first electrode disposed on a side of the electrochromic layer away from the base substrate, and a second electrode disposed on a side of the electrochromic layer close to the base substrate, wherein:

[0009] The electrochromic layer includes a plurality of contact portions and a connecting portion connecting two adjacent contact portions; the first electrode and the second electrode are both in contact with the contact portions, one of the first electrode and the second electrode is in contact with the connecting portion, and the other is spaced apart from the connecting portion;

[0010] The connecting parts are arranged in a one-to-one correspondence with the light-emitting devices.

[0011] In some embodiments, a first isolation pillar is provided between any one of the first electrode and the second electrode and the connecting portion.

[0012] In some embodiments, any one of the first electrode and the second electrode is a hollow structure, and the hollow structure includes a plurality of openings and connecting electrodes forming the plurality of openings; the openings are arranged in a one-to-one correspondence with the connecting portions.

[0013] In some embodiments, the second electrode is a hollow structure, and at least a portion of the connecting portion falls into the corresponding opening.

[0014] In some embodiments, the display panel has a display area and a peripheral area surrounding the display area;

[0015] The display panel further includes a first insulating layer disposed on the base substrate, a first conductive layer located in the peripheral region and disposed on a side of the first insulating layer close to the base substrate, a spacer layer disposed on a side of the encapsulation layer away from the light-emitting functional layer, a second conductive layer located in the peripheral region and disposed on a side of the spacer layer away from the encapsulation layer, and a second insulating layer disposed on a side of the second conductive layer away from the spacer layer; the spacer layer surrounds the encapsulation layer.

[0016] The second conductive layer includes a first overlapping structure and a second overlapping structure that are spaced apart, and the first overlapping structure is farther away from the display area than the second overlapping structure;

[0017] The first electrode is electrically connected to the first overlapping structure through a first via hole penetrating the second insulating layer; the second electrode is electrically connected to the second overlapping structure through a second via hole penetrating the second insulating layer.

[0018] In some embodiments, the display panel further includes a second isolation pillar disposed between the second insulating layer and the first electrode, and an orthographic projection of the second isolation pillar on the base substrate is located between an orthographic projection of the first overlapping structure and an orthographic projection of the second overlapping structure on the base substrate;

[0019] The side of the second isolation pillar close to the display area abuts against the electrochromic layer.

[0020] In some embodiments, the display panel further includes a third isolation pillar disposed on a side of the second insulating layer facing away from the base substrate, and an orthographic projection of the third isolation pillar on the base substrate is located on a side of the orthographic projection of the first overlapping structure on the base substrate away from an orthographic projection of the second isolation pillar on the base substrate;

[0021] The side of the third isolation pillar close to the display area abuts against the first electrode.

[0022] In some embodiments, the display panel also includes a first pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against an edge of the encapsulation layer, a second pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against an edge of the raising layer, a third insulating layer arranged on a side of the anti-peep structure away from the raising layer, and a third pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against an edge of the third insulating layer.

[0023] In some embodiments, the display panel further includes a second isolation pillar disposed between the second insulating layer and the electrochromic layer, and a third isolation pillar disposed between the elevated layer and the first electrode, wherein the orthographic projections of the second isolation pillar and the third isolation pillar on the base substrate are both located between the orthographic projections of the first overlapping structure and the second overlapping structure on the base substrate, and the second isolation pillar is closer to the second overlapping structure than the third isolation pillar;

[0024] The side of the second isolation pillar close to the display area abuts against the second electrode; the side of the third isolation pillar close to the display area abuts against the electrochromic layer.

[0025] In some embodiments, the display panel also includes a first pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against an edge of the encapsulation layer, a second pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against an edge of the raising layer, a third insulating layer arranged on a side of the anti-peep structure away from the raising layer, and a third pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against an edge of the third insulating layer.

[0026] In some embodiments, the display panel further includes a fourth isolation pillar disposed on a side of the second pad structure facing away from the first insulating layer and wrapping a side of the second pad structure close to the display area;

[0027] The side of the fourth isolation pillar close to the display area abuts against the first electrode.

[0028] In some embodiments, the display panel further includes a fifth isolation pillar disposed between the second insulating layer and the third insulating layer, and an orthographic projection of the fifth isolation pillar on the base substrate is located between an orthographic projection of the first overlapping structure and the second pad structure on the base substrate;

[0029] The side of the fifth isolation pillar close to the display area abuts against the first electrode.

[0030] In some embodiments, the display panel further includes a touch function layer disposed on a side of the third insulating layer away from the anti-peeping structure; an edge of the touch function layer abuts against a side of the third pad structure close to the display area.

[0031] In some embodiments, the second overlapping structure surrounds the display area, and the first overlapping structure semi-surrounds the second overlapping structure;

[0032] The first conductive layer includes a first electrode source connecting portion and a second electrode source connecting portion that are spaced apart;

[0033] The second conductive layer further includes at least one first lead-out portion and at least one second lead-out portion, wherein the first lead-out portion and the second lead-out portion are spaced apart from each other;

[0034] The first overlap structure is electrically connected to the first lead-out portion, and the second overlap structure is electrically connected to the second lead-out portion; the first lead-out portion extends from the connection position of the first overlap structure to between the second pad structure and the third pad structure, and is electrically connected to the first electrode source connection portion through a third via hole penetrating the first insulating layer; the second lead-out portion extends from the connection position of the second overlap structure to between the second pad structure and the third pad structure, and is electrically connected to the first electrode source connection portion through a fourth via hole penetrating the first insulating layer.

[0035] In some embodiments, the second insulating layer is located in the peripheral region, and the second electrode is located on a surface of the elevated layer away from the base substrate.

[0036] In some embodiments, the second insulating layer is a whole-layer structure located in the display area and the peripheral area, and the second electrode is located on a surface of the second insulating layer away from the base substrate.

[0037] In a second aspect, an embodiment of the present disclosure further provides a display device, which includes a display panel as described in any one of the first aspects.

[0038] In a third aspect, the present disclosure further provides a method for manufacturing a display panel, for manufacturing the display panel as described in any one of the first aspects; wherein the method for manufacturing the display panel comprises:

[0039] providing a substrate;

[0040] A light-emitting functional layer and an encapsulation layer are sequentially formed on the substrate; the light-emitting functional layer includes a plurality of light-emitting devices;

[0041] A second electrode, an electrochromic layer, and a first electrode are sequentially formed on a side of the encapsulation layer facing away from the base substrate; the first electrode, the second electrode, and the electrochromic layer constitute an anti-peeping structure;

[0042] The electrochromic layer includes a plurality of contact portions and a connecting portion connecting two adjacent contact portions; the first electrode and the second electrode are both in contact with the contact portion, one of the first electrode and the second electrode is in contact with the connecting portion, and the other is spaced apart from the connecting portion; the connecting portion is arranged corresponding to the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] FIG1 is a schematic plan view of a display panel provided by an embodiment of the present disclosure;

[0044] FIG2 a is a cross-sectional view of a first side of the structure shown in FIG1 under a first example;

[0045] FIG2 b is a cross-sectional view of an example of the structure shown in FIG1 along the AA′ direction;

[0046] FIG2c is a cross-sectional view of the first side of the structure shown in FIG1 under the second example

[0047] FIG3 a is a schematic diagram of the light path of the light emitting device in the normal display mode of the display panel;

[0048] FIG3 b is a schematic diagram of the light path of the light emitting device in the display panel anti-peep mode;

[0049] FIG4 is a specific plan view of a portion of the structure in FIG2a;

[0050] FIG5a is a schematic diagram of the overlapping of the first electrode on the first side provided by an embodiment of the present disclosure;

[0051] FIG5 b is a schematic diagram of the overlapping of the second electrode on the first side provided by an embodiment of the present disclosure;

[0052] FIG6 is a schematic diagram of electrode overlap on the second side provided by an embodiment of the present disclosure;

[0053] FIG7 is a cross-sectional view of the first side of the structure shown in FIG1 under a third example;

[0054] FIG8 is a cross-sectional view of the first side of the structure shown in FIG1 under a fourth example;

[0055] FIG9 is a cross-sectional view of the first side of the structure shown in FIG1 according to a fifth example;

[0056] FIG10 a is a cross-sectional view of the first side of the structure shown in FIG1 according to a sixth example;

[0057] FIG10 b is a cross-sectional view of the first side of the structure shown in FIG1 according to the seventh example;

[0058] 11a to 11i are schematic diagrams of intermediate structures in the process of forming the display panel shown in FIG. 2a ;

[0059] 12a to 12i are schematic diagrams of intermediate structures in the process of forming the display panel shown in FIG. 7 . DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the disclosure for which protection is sought, but merely represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure.

[0061] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0062] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0063] It should be noted that, in the present disclosure, the first direction X, the second direction Y, and the third direction Z intersect with each other in pairs. In the present disclosure, the first direction X and the second direction Y are perpendicular to each other in the plane where the substrate is located, the first direction X is a horizontal direction, the second direction Y is a vertical direction, and the third direction Z is a vertical direction, which are perpendicular to the plane where the substrate is located, are used as an example for explanation, but this does not constitute a limitation to the present disclosure.

[0064] Figure 1 is a planar schematic diagram of the display panel provided by an embodiment of the present disclosure, Figure 2a is a cross-sectional view of the first side of the structure shown in Figure 1 under the first example, and Figure 2b is a cross-sectional view of the structure shown in Figure 1 under an example of the A-A' direction. The structure shown in Figure 2a is mainly a cross-sectional structure of the first side 01 (for example, the lower frame) of the display panel; the structure shown in Figure 2b is mainly a cross-sectional structure of the second side 02 (for example, the upper frame), the third side 03 (for example, the left frame) or the fourth side 04 (for example, the right frame) of the display panel.

[0065] As shown in FIG1 , the display panel has a display area AA and a peripheral area BB surrounding the display area AA. The display area AA is provided with light-emitting devices of different colors and an anti-peeping structure 3 , and the peripheral area BB is provided with overlapping traces of the anti-peeping structure 3 .

[0066] As shown in Figures 2a and 2b, the display panel includes a base substrate 1, and a light-emitting functional layer, an encapsulation layer 2, and an anti-peep structure 3 arranged on the base substrate 1. The light-emitting functional layer includes a plurality of light-emitting devices. For example, a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B to emit light of different colors to the outside. The plurality of light-emitting devices located in the display area AA can be arranged in an array. The display panel also includes a pixel defining layer PDL for defining the light-emitting layer in the light-emitting device. The encapsulation layer 2 is used to encapsulate the plurality of light-emitting devices to prevent corrosion by external water and oxygen.

[0067] The privacy protection structure 3 includes an electrochromic layer 33, a first electrode 31 disposed on the side of the electrochromic layer 33 facing away from the base substrate 1, and a second electrode 32 disposed on the side of the electrochromic layer 33 closer to the base substrate 1. The electrochromic layer 33 is made of an electrochromic material. By applying different voltages to the first electrode 31 and the second electrode 32, the electrochromic layer 33 undergoes an electrochemical reaction under the influence of an external electric field. The electrochromic material undergoes a stable and reversible color change by gaining and losing electrons. This change is manifested in a reversible change in color and transparency.

[0068] The orthographic projection of the anti-peeping structure 3 on the base substrate 1 at least partially or completely covers the orthographic projection of each light-emitting device in the display area AA on the base substrate 1 .

[0069] The electrochromic layer 33 includes a plurality of contact portions 331 and a connecting portion 332 connecting two adjacent contact portions 331. Both the first electrode 31 and the second electrode 32 are in contact with the contact portions 331. In one example, both the first electrode 31 and the second electrode 32 are in direct contact with the contact portions 331. For example, the surface of the first electrode 31 closest to the substrate 1 is in direct contact with the surface of the contact portion 331 facing away from the substrate 1, and the surface of the second electrode 32 facing away from the substrate 1 is in direct contact with the surface of the contact portion 331 closest to the substrate 1.

[0070] In another example, the contact between the first electrode 31 (or the second electrode 32) and the contact portion 331 may also be achieved through indirect contact in addition to direct contact. For example, the first electrode 31 (or the second electrode 32) may be in indirect contact with the contact portion 331 via an auxiliary electrode. Of course, the indirect contact described in this disclosure may also be achieved through other structures, which will not be described in detail here.

[0071] One of the first electrode 31 and the second electrode 32 is in contact with the connecting portion 332, and the other is spaced apart from the connecting portion 332. In one example, one of the first electrode 31 and the second electrode 32 is in direct contact with the connecting portion 332, and the other is spaced apart from the connecting portion 332. In another example, the contact method between one of the first electrode 31 and the second electrode 32 and the connecting portion 332 may also be an indirect contact method other than direct contact. For example, the first electrode 31 (or the second electrode 32) is in indirect contact with the connecting portion 332 through an auxiliary electrode. For ease of understanding, the present disclosure is described using direct contact as an example.

[0072] For example, the first electrode 31 may be in direct contact with the connecting portion 332, and the second electrode 32 may be spaced apart from the connecting portion 332. Here, direct contact may be understood as the surface of the first electrode 31 closest to the base substrate 1 being in direct contact with the surface of the connecting portion 332 facing away from the base substrate 1. Spaced apart may be understood as the surface of the second electrode 32 facing away from the base substrate 1 not being in contact with the surface of the connecting portion 332 closest to the base substrate 1, for example, being insulated, staggered, or having a gap therebetween.

[0073] As another example, the second electrode 32 may be in direct contact with the connecting portion 332, and the first electrode 31 may be spaced apart from the connecting portion 332. Here, direct contact may be understood as the surface of the second electrode 32 facing away from the base substrate 1 being in direct contact with the surface of the connecting portion 332 close to the base substrate 1. Spaced apart may be understood as the surface of the first electrode 31 close to the base substrate 1 being non-contacting with the surface of the connecting portion 332 facing away from the base substrate 1 (e.g., their orthographic projections on the base substrate 1), for example, being insulated, staggered, or having a gap between them.

[0074] The connecting portion 332 is provided corresponding to the light emitting device; for example, the connecting portion 332 is provided in a one-to-one correspondence with the light emitting device. Specifically, the orthographic projection of the connecting portion 332 on the base substrate 1 may cover the orthographic projection of the corresponding light emitting device on the base substrate 1.

[0075] The contact portion 331 is provided corresponding to the pixel defining layer PDL. Specifically, the pixel defining layer PDL 1 may be an orthographic projection on the base substrate 1 , covering the corresponding orthographic projection of the contact portion 331 on the base substrate 1 .

[0076] Figure 3a is a schematic diagram of the optical path of the light-emitting device in the normal display mode of the display panel, and Figure 3b is a schematic diagram of the optical path of the light-emitting device in the anti-peeping mode of the display panel. Figures 3a and 3b show the change in the optical path when the display panel switches from normal display mode to anti-peeping mode. As shown in Figure 3a, in normal display mode, no voltage is applied to the first electrode 31 and the second electrode 32, or the same voltage is applied to the two electrodes, and no electric field is formed. At this time, the electrochromic layer 33 is completely transparent, and the light emitted by the light-emitting device can pass through the entire electrochromic layer 33, achieving display at a wide viewing angle. As shown in Figure 3b, when switching to anti-peeping mode, different voltages are applied to the first electrode 31 and the second electrode 32. At this time, the contact portion 331 turns black under the action of the external electric field. Since the connecting portion 332 is not in contact with the first electrode 31 or the second electrode 32, it is not affected by the external electric field and remains transparent, allowing light to pass through, thereby achieving display at a narrow viewing angle, that is, achieving an anti-peeping effect.

[0077] The embodiment of the present disclosure provides a display panel, which realizes an anti-peeping effect of the display panel by providing an electrochromic layer 33 that undergoes a stable and reversible color change under the action of an external electric field.

[0078] In some embodiments, electrochromic materials can be divided into two categories: inorganic electrochromic materials and organic electrochromic materials. Inorganic electrochromic materials primarily include transition metal oxides and their derivatives, while organic electrochromic materials include polythiophenes and their derivatives, viologens, tetrathiafulvalene, and metal phthalocyanine compounds.

[0079] In some embodiments, the materials of the first electrode 31 and the second electrode 32 may include, but are not limited to, phosphorescent nanomaterials, conductive nanowires, nanoparticles, graphene, and the like. Phosphorescent nanomaterials have better electrical conductivity than indium tin oxide (ITO) materials at the same thickness, and are thinner and lighter at the same electrical conductivity. Furthermore, phosphorescent nanomaterials have higher transmittance than indium tin oxide (ITO), thereby improving the luminous flux of the light-emitting device.

[0080] In some embodiments, the thickness of the electrochromic layer 33 may be set between 0.1 μm and 20 μm.

[0081] In some embodiments, the thickness of the first electrode 31 may be set between 0.5 μm and 10 μm. The thickness of the second electrode 32 may be set between 0.5 μm and 10 μm.

[0082] In some embodiments, the orthographic projection of the first electrode 31 on the base substrate 1 covers the orthographic projection of the electrochromic layer 33 on the base substrate 1 ; the orthographic projection of the electrochromic layer 33 on the base substrate 1 covers the orthographic projection of the second electrode 32 on the base substrate 1 .

[0083] In some embodiments, as shown in Figures 2a to 9, in the area corresponding to the contact portion 331, there is a first spacing between the first electrode 31 and the second electrode 32 in the third direction Z; in the area corresponding to the connecting portion 332, there is a second spacing between the first electrode 31 and the second electrode 32 in the third direction Z; the first spacing H1 is smaller than the second spacing H2.

[0084] Here, the first distance H1 can be understood as the distance between the surface of the first electrode 31 close to the base substrate 1 and the surface of the second electrode 32 facing away from the base substrate 1 in the region corresponding to the contact portion 331 in the third direction Z. The second distance H2 can be understood as the distance between the surface of the first electrode 31 close to the base substrate 1 and the surface of the second electrode 32 facing away from the base substrate 1 in the region corresponding to the connection portion 332 in the third direction Z.

[0085] In some embodiments, as shown in FIG. 2 a and FIG. 2 b , a first isolation pillar 41 is provided between the connecting portion 332 and either the first electrode 31 or the second electrode 32 .

[0086] If the first electrode 31 and the connecting portion 332 are in contact, and the second electrode 32 is spaced apart from the connecting portion 332, a first isolation pillar 41 is provided between the second electrode 32 and the connecting portion 332. If the second electrode 32 and the connecting portion 332 are in direct contact, and the first electrode 31 and the connecting portion 332 are spaced apart from each other, a first isolation pillar 41 is provided between the first electrode 31 and the connecting portion 332.

[0087] The first isolation pillar 41 may include a non-conductive material, such as but not limited to a low-temperature negative photoresist, and its process preparation conditions are low-temperature conditions, thereby avoiding the influence of high-temperature process preparation conditions on the light-emitting device when the first isolation pillar 41 is prepared.

[0088] The first isolation pillar 41 has a high light transmittance, for example, it is always transparent or nearly transparent, allowing light to pass through.

[0089] Exemplarily, the thickness of the first isolation pillar 41 is greater than the sum of the thicknesses of the first electrode 31 and the electrochromic layer 33. For example, in some embodiments, the thickness of the first isolation pillar 41 can range from 0.1 μm to 20 μm, thereby avoiding the upper electrode from breaking due to a long climbing path across the line. At the same time, a groove structure is also formed between adjacent first isolation pillars 41, which is conducive to controlling light emission.

[0090] In some embodiments, the difference between the structure shown in Figure 2a and the structure shown in Figure 2b is that the structure shown in Figure 2a is provided with a lap trace of the anti-peep structure 3 in the area where the first side 01 (for example, the lower frame) is located. As shown in Figure 2a, the display panel also includes a first insulating layer 5 provided on the base substrate 1, a first conductive layer 6 located in the peripheral area BB and provided on the side of the first insulating layer 5 close to the base substrate 1, a raised layer 7 provided on the side of the encapsulation layer 2 away from the light-emitting functional layer, a second conductive layer 8 located in the peripheral area BB and provided on the side of the raised layer 7 away from the encapsulation layer 2, and a second insulating layer 9 provided on the side of the second conductive layer 8 away from the raised layer 7. The raised layer 7 covers the encapsulation layer 2. Here, "covering" can be understood as the raised layer 7 covering the remaining surfaces of the encapsulation layer 2 except the surface close to the base substrate 1.

[0091] The second conductive layer 8 is arranged between the anti-peeping structure 3 and the elevated layer 7, and is configured to transmit voltage signals to the first electrode 31 and the second electrode 32 respectively. The second conductive layer 8 includes a first overlap structure 81 and a second overlap structure 82 that are spaced apart and independent of each other, and the first overlap structure 81 is further away from the display area AA than the second overlap structure 82. Figure 4 is a specific planar schematic diagram of part of the structure in Figure 2a. As shown in Figure 4, although the first overlap structure 81 and the second overlap structure 82 are arranged in the same layer, there is a gap between the two. The first overlap structure 81 and the second overlap structure 82 are both located in the peripheral area BB, and the first overlap structure 81 is further away from the display area AA than the second overlap structure 82 in the peripheral area BB. The first overlap structure 81 semi-surrounds the second overlap structure 82, and the second overlap structure 82 surrounds the display area AA.

[0092] 2a, 2b, 3a, 3b and 4, the first bridge structure 81 is electrically connected to the first electrode 31, and the second bridge structure 82 is electrically connected to the second electrode 32. The first bridge structure 81 is configured to independently transmit a first voltage signal to the first electrode 31, and the second bridge structure 82 is configured to independently transmit a second voltage signal to the second electrode 32. A voltage difference may exist between the first voltage signal and the second voltage signal.

[0093] Exemplarily, the thickness of the padding layer 7 is between 2μm and 100μm. The setting of the padding layer 7 can be used to adjust the anti-peeping angle. The number of padding layers can be one layer or multiple layers. When the number of padding layers is multiple layers, the refractive index of each layer can be different. It should be noted that for the light-emitting device to uniformly emit light at the same angle, the closer the anti-peeping structure 3 is to the light-emitting device, the narrower the visible viewing angle in the anti-peeping mode; conversely, the farther the anti-peeping structure 3 is from the light-emitting device, the wider the visible viewing angle in the anti-peeping mode. Therefore, the thickness of the padding layer 7 can determine the angle of the visible viewing angle in the anti-peeping mode.

[0094] Exemplarily, the second insulating layer 9 can be arranged in the area where the first overlap structure 81 and the second overlap structure 82 are located as shown in Figures 2a to 2c, that is, the second insulating layer 9 is arranged in the peripheral area BB and covers the first overlap structure 81 and the second overlap structure 82, and the second insulating layer 9 is provided with a first via V1 and a second via V2, wherein the first overlap structure 81 is exposed through the second via V2, and the first overlap structure 82 is exposed through the first via V1, for example: the orthographic projections of the first overlap structure 81 and the second overlap structure 82 on the base substrate 1 fall within the range of the orthographic projection of the second insulating layer 9 on the base substrate 1, and the first electrode 31 is electrically connected to the first overlap structure 81 through the first via V1 of the second insulating layer 9; the second electrode 32 is electrically connected to the second overlap structure 82 through the second via V2 of the second insulating layer 9. Alternatively, the second insulating layer 9 can be provided as a whole layer as shown in other figures (for example, Figures 3a to 10), that is, the second insulating layer 9 is provided in the display area AA and the peripheral area BB, and, in the peripheral area, the second insulating layer 9 covers the first overlapping structure 81 and the second overlapping structure 82, and the second insulating layer 9 is provided with a first via V1 and a second via V2, wherein the first overlapping structure 81 is exposed through the second via V2, and the first overlapping structure 82 is exposed through the first via V1. More specifically, the orthographic projections of the first overlapping structure 81 and the second overlapping structure 82 on the base substrate 1 fall within the range of the orthographic projection of the second insulating layer 9 on the base substrate 1, and the first electrode 31 is electrically connected to the first overlapping structure 81 through the first via V1 of the second insulating layer 9; the second electrode 32 is electrically connected to the second overlapping structure 82 through the second via V2 of the second insulating layer 9. This disclosure only gives two exemplary structures of the second insulating layer 9 to facilitate a better understanding of other film layers in the embodiments of the present invention. It should be understood that the provision of the second insulating layer 9 does not constitute a limitation on the protection scope of the embodiments of the invention.

[0095] Exemplarily, the second insulating layer 9 can be as shown in Figures 2a to 2c, for example: the orthographic projection of the second insulating layer 9 on the substrate 1 away from the boundary of the display area AA is located between the orthographic projection of the first pad structure dam1 and the second pad structure dam2 on the substrate 1, and the orthographic projection of the second insulating layer 9 on the substrate 1 close to the boundary of the display area AA is located between the orthographic projection of the light-emitting functional layer and the first pad structure dam1 on the substrate 1.

[0096] Figure 5a is a schematic diagram of the overlap of the first electrode on the first side provided in an embodiment of the present disclosure, Figure 5b is a schematic diagram of the overlap of the second electrode on the first side provided in an embodiment of the present disclosure, and Figure 6 is a schematic diagram of the overlap of the first electrode and the second electrode on the second side provided in an embodiment of the present disclosure, wherein the schematic diagram of the overlap of the first electrode 31 and the second electrode 32 corresponding to the third side 03 and the fourth side 04 can be seen in Figure 6.

[0097] As shown in FIG. 5 a to FIG. 6 , the first electrode 31 is electrically connected to the first overlapping structure 81 through a first via hole V1 penetrating the second insulating layer 9 ; the second electrode 32 is electrically connected to the second overlapping structure 82 through a second via hole V2 penetrating the second insulating layer 9 .

[0098] The portion of the first insulating layer 5 located in the display area AA is located above the base substrate 1. For example, as shown in Figures 2a to 3b, portions of the first insulating layer 5 are in direct contact with the base substrate 1. Of course, multiple insulating and / or conductive layers may be provided between the first insulating layer 5 and the base substrate 1. For example, a first conductive layer 6 is provided between portions of the first insulating layer 5 located in the peripheral area BB and the base substrate 1. The first conductive layer 6 includes first and second electrode source connection portions 61 and 62 spaced apart. Due to the limited cross-sectional view angle, Figure 2a only shows one of the first and second electrode source connection portions 61 and 62. As shown in Figure 4, the first and second electrode source connection portions 61 and 62 are arranged side by side in the first direction X. Although the first and second electrode source connection portions 61 and 62 are provided in the same layer, a gap exists between them. For example, as shown in Figure 4, multiple first and second electrode source connection portions 61 and 62 may be provided.

[0099] In some embodiments, as shown in FIG4 , the first conductive layer 6 includes a first electrode source connection portion 61 and a second electrode source connection portion 62 that are spaced apart. The second conductive layer 8 also includes at least one first lead portion 83 and at least one second lead portion 84, with the first lead portion 83 and the second lead portion 84 spaced apart.

[0100] As shown in Figures 5a and 5b, the first overlap structure 81 is electrically connected to the first lead-out portion 83, and the second overlap structure 82 is electrically connected to the second lead-out portion 84; the first lead-out portion 83 extends from the connection position of the first overlap structure 81 along the second direction Y to between the second pad structure dam2 and the third pad structure dam3 (dam2 and the third pad structure dam3 are not shown in Figures 5a and 5b, see Figure 2a for details), and is electrically connected to the first electrode source connection portion 61 through the third via V3 passing through the first insulating layer 5; the second lead-out portion 84 extends from the connection position of the second overlap structure 82 along the second direction Y to between the second pad structure dam2 and the third pad structure dam3, and is electrically connected to the second electrode source connection portion 62 through the fourth via V4 passing through the first insulating layer 5.

[0101] As shown in Figures 4, 5a and 5b, the first lead-out portion 83 and the first overlapping structure 81 are integrally formed. The second lead-out portion 84 and the second overlapping structure 82 are integrally formed.

[0102] As shown in FIG4 , the number of first lead-out portions 83 is the same as the number of first electrode source connection portions 61 , and the two are connected in a one-to-one correspondence; the number of second lead-out portions 84 is the same as the number of second electrode source connection portions 62 , and the two are connected in a one-to-one correspondence.

[0103] In some embodiments, as shown in Figures 2a to 4, the distance between the first electrode source connection portion 61 and the second electrode source connection portion 62 on the same side (for example, the distance between the first electrode source connection portion 61 and the second electrode source connection portion 62 on the right side of the lower frame) is smaller than the distance between the first overlap structure 81 and the second overlap structure 82. Such a design is conducive to reducing the frame area.

[0104] In some embodiments, Figure 2c is a cross-sectional view of the second example of the first side of the structure shown in Figure 1. As shown in Figures 2a, 2b and 2c, the display panel also includes a second isolation pillar 42 arranged between the second insulating layer 9 and the first electrode 31, and the positive projection of the second isolation pillar 42 on the base substrate 1 is located between the positive projections of the first overlap structure 81 and the second overlap structure 82 on the base substrate 1; the side of the second isolation pillar 42 close to the display area AA is against the electrochromic layer 33. In some embodiments, the side of the second isolation pillar 42 close to the display area AA can also be against the electrochromic layer 33 and the second electrode 32.

[0105] The surface of the second isolation pillar 42 near the second insulating layer 9 contacts the surface of the second insulating layer 9 facing away from the elevated layer 7. The surface of the second isolation pillar 42 facing away from the second insulating layer 9 contacts the surface of the first electrode 31 near the second insulating layer 9. For example, the surface of the second isolation pillar 42 near the second insulating layer 9 can directly contact the surface of the second insulating layer 9 facing away from the elevated layer 7. The surface of the second isolation pillar 42 facing away from the second insulating layer 9 can directly contact the surface of the first electrode 31 near the second insulating layer 9. The side of the second isolation pillar 42 near the display area AA abuts the electrochromic layer 33. The combined thickness of the second overlapping structure 82, the second electrode 32, and the electrochromic layer 33 is less than the combined thickness of the second isolation pillar 42 and the second insulating layer 9. In other words, the combined thickness of the second electrode 32 and the electrochromic layer 33 where they abut against the second isolation pillar 42 is less than the thickness of the second isolation pillar. The second isolation pillar 42 is used to prevent material overflow from the second electrode 32 and the electrochromic layer 33 during the manufacturing process. The second isolation pillar 42 may include, but is not limited to, a low-temperature negative photoresist, and its process preparation conditions are low-temperature conditions, thereby avoiding the impact of high-temperature process preparation conditions on the light-emitting device when the second isolation pillar 42 is prepared. At the same time, the slope angle of the second isolation pillar 42 formed by the low-temperature negative photoresist is relatively large, which is more conducive to suppressing the overflow of materials from the second electrode 32 and the electrochromic layer 33 during the process preparation. However, under normal circumstances, the height of the second isolation pillar 42 is insufficient to prevent the overflow of materials from the first electrode 31. Therefore, in this embodiment, the first electrode 31 extends from the display area AA toward the peripheral area BB to exceed the electrochromic layer 33, and its orthographic projection on the base substrate 1 overlaps the orthographic projection of the second isolation pillar 42 on the base substrate 1.

[0106] The structure shown in FIG2c differs from the structure shown in FIG2a in that the structure shown in FIG2c does not include a third isolation pillar 43. In some embodiments, as shown in FIG2a and FIG2b , in addition to providing a second isolation pillar 42, a third isolation pillar 43 is further provided to suppress material overflow from the first electrode 31 during the manufacturing process. Specifically, the display panel further includes a third isolation pillar 43 provided on the side of the second insulating layer 9 facing away from the base substrate 1. The orthographic projection of the third isolation pillar 43 on the base substrate 1 is located on the side of the orthographic projection of the first lap joint structure 81 on the base substrate 1 away from the orthographic projection of the second isolation pillar 42 on the base substrate 1. The side of the third isolation pillar 43 near the display area AA abuts against the first electrode 31.

[0107] The surfaces of the second isolation pillar 42 and the third isolation pillar 43 near the second insulating layer 9 are in contact with the surface of the second insulating layer 9 facing away from the raising layer 7. For example, the surfaces of the second isolation pillar 42 and the third isolation pillar 43 near the second insulating layer 9 can be in direct contact with the surface of the second insulating layer 9 facing away from the raising layer 7. The side of the third isolation pillar 43 near the display area AA abuts against the first electrode 31; the total thickness of the first lap structure 81 and the first electrode 31 is less than the thickness of the third isolation pillar 43. In other words, the thickness of the first electrode 31 at the point where it abuts against the third isolation pillar 43 is less than the thickness of the third isolation pillar 43.

[0108] The third isolation pillar 43 is used to block the first electrode 31, thereby preventing material overflow from the first electrode 31 during the fabrication process. The third isolation pillar 43 may comprise, but is not limited to, a low-temperature negative photoresist, which is fabricated at low temperatures. This prevents the effects of high-temperature fabrication conditions on the light-emitting device. Furthermore, the third isolation pillar 43 formed with the low-temperature negative photoresist has a steeper slope angle, further preventing material overflow from the first electrode 31.

[0109] In some embodiments, as shown in Figures 2a and 2b, the second isolation pillar 42 and the third isolation pillar 43 are arranged in the same layer and are in direct contact with the surface of the second insulating layer 9 facing away from the padding layer 7, and can be prepared simultaneously during the preparation process, for example, using a mask process to form the second isolation pillar 42 and the third isolation pillar 43 through one composition.

[0110] In some embodiments, as shown in FIG. 4 , the second isolation pillar 42 surrounds the display area AA, and the third isolation pillar 43 surrounds the second isolation pillar 42 .

[0111] In some embodiments, as shown in Figures 2a and 2b, the display panel also includes: a first pad structure dam1 arranged on a side of the first insulating layer 5 away from the base substrate 1 and abutting against the edge of the encapsulation layer 2; a second pad structure dam2 arranged on a side of the first insulating layer 5 away from the base substrate 1 and abutting against the edge of the raising layer 7; a third insulating layer 11 arranged on a side of the anti-peep structure 3 away from the raising layer 7; and a third pad structure dam3 arranged on a side of the first insulating layer 5 away from the base substrate 1 and abutting against the edge of the third insulating layer 11.

[0112] The first liner structure dam1 is used to suppress material overflow of the encapsulation layer 2 during the manufacturing process. The second liner structure dam2 is used to suppress material overflow of the raised layer 7 during the manufacturing process. The third liner structure dam3 is used to suppress material overflow of the third insulating layer 11 during the manufacturing process.

[0113] The first pad structure dam1, the second pad structure dam2 and the third pad structure dam3 are arranged in the same layer and are in contact with the surface of the first insulating layer 5 facing away from the base substrate 1. They can be prepared simultaneously during the preparation process, for example, by using a mask process to form the first pad structure dam1, the second pad structure dam2 and the third pad structure dam3 through one composition.

[0114] In some embodiments, as shown in Figures 2a and 2b, the elevation layer 7 wraps around the encapsulation layer 2, that is, the orthographic projection of the elevation layer 7 on the base substrate 1 completely covers the orthographic projection of the encapsulation layer 2 on the base substrate 1. The first liner structure dam1 surrounds the encapsulation layer 2 and is disposed at the end surface of the elevation layer 7 and on the surface of the first insulating layer 5 facing away from the base substrate 1. The orthographic projection of the third insulating layer 11 on the base substrate 1 completely covers the orthographic projection of the elevation layer 7 on the base substrate 1, and the anti-peeping structure 3 is disposed between the third insulating layer 11 and the elevation layer 7. The second liner structure dam2 surrounds the elevation layer 7 and is disposed at the end surface of the third insulating layer 11 and on the surface of the first insulating layer 5 facing away from the base substrate 1. The third liner structure dam3 surrounds the third insulating layer 11.

[0115] In some embodiments, as shown in Figures 2a to 7, the thickness of the padding layer 7 is greater than the thickness of the encapsulation layer 2, which is beneficial to controlling the anti-peeping angle; the refractive index of the second insulating layer 9 is similar to that of the padding layer 7, and the thickness of the second insulating layer 9 is less than the thickness of the third insulating layer 11. Such a design is beneficial to jointly control the anti-peeping angle with the padding layer 7.

[0116] In some embodiments, Figure 7 is a cross-sectional view of the third example of the first side of the structure shown in Figure 1. Compared with the structure shown in Figure 2a, the difference between the structure shown in Figure 7 is that the structure shown in Figure 7 uses a second isolation pillar 42 to block the second electrode 32 and uses a third isolation pillar 43 to block the electrochromic layer 33.

[0117] Specifically, as shown in Figure 7, the second insulating layer 9 is set as a whole layer, and the display panel also includes a second isolation pillar 42 arranged between the second insulating layer 9 and the electrochromic layer 33, and a third isolation pillar 43 arranged between the second insulating layer 9 and the first electrode 31. There is a gap between the second isolation pillar 42 and the third isolation pillar 43 in the positive projection on the base substrate 1, and both are located between the positive projections of the first overlap structure 81 and the second overlap structure 82 on the base substrate 1, and the second isolation pillar 42 is closer to the second overlap structure 82 than the third isolation pillar 43.

[0118] The surfaces of the second isolation pillar 42 and the third isolation pillar 43 near the second insulating layer 9 are in contact with the surface of the second insulating layer 9 facing away from the elevated layer 7; the surface of the second isolation pillar 42 facing away from the second insulating layer 9 is in contact with the surface of the electrochromic layer 33 near the second insulating layer 9. For example, the surfaces of the second isolation pillar 42 and the third isolation pillar 43 near the second insulating layer 9 can be in direct contact with the surface of the second insulating layer 9 facing away from the elevated layer 7; the surface of the second isolation pillar 42 facing away from the second insulating layer 9 can be in direct contact with the surface of the electrochromic layer 33 near the second insulating layer 9. The side of the second isolation pillar 42 near the display area AA abuts against the second electrode 32, thereby suppressing material overflow from the second electrode 32 during the manufacturing process.

[0119] The surface of the third isolation pillar 43 facing away from the elevated layer 7 contacts the surface of the first electrode 31 near the elevated layer 7. For example, the surface of the third isolation pillar 43 facing away from the elevated layer 7 can be in direct contact with the surface of the first electrode 31 near the elevated layer 7. That is, the orthographic projection of the first electrode 31 on the base substrate overlaps the orthographic projection of the third isolation pillar 43 on the base substrate. The side of the third isolation pillar 43 near the display area AA abuts against the electrochromic layer 33, thereby preventing material overflow from the electrochromic layer 33 during the manufacturing process.

[0120] At the same time, in this embodiment, the electrochromic layer 33 extends from the display area AA toward the peripheral area BB to exceed the second electrode 32, and its orthographic projection on the base substrate 1 covers the orthographic projection of the second isolation pillar 42 on the base substrate 1, which can avoid the failure of the electrochromic layer 33 due to process preparation conditions. For example, the printing process can easily cause the edge of the electrochromic layer 33 to be thinner. If the edge position of the second electrode 32 and the electrochromic layer 33 is the same, it is easy to cause electrostatic breakdown between the first electrode 31 and the second electrode 32, causing the anti-peeping structure 3 to fail.

[0121] In some embodiments, as shown in Figure 7, the display panel also includes: a first pad structure dam1 arranged on a side of the first insulating layer 5 away from the base substrate 1 and abutting against the edge of the encapsulation layer 2; a second pad structure dam2 arranged on a side of the first insulating layer 5 away from the base substrate 1 and abutting against the edge of the raising layer 7; a third insulating layer 11 arranged on a side of the anti-peep structure 3 away from the raising layer 7; and a third pad structure dam3 arranged on a side of the first insulating layer 5 away from the base substrate 1 and abutting against the edge of the third insulating layer 11.

[0122] The first liner structure dam1 is used to suppress material overflow of the encapsulation layer 2 during the manufacturing process. The second liner structure dam2 is used to suppress material overflow of the spacer layer 7 during the manufacturing process, and suppress material overflow of the first electrode 31 during the manufacturing process. The third liner structure dam3 is used to suppress material overflow of the third insulating layer 11 during the manufacturing process.

[0123] In some embodiments, the height of the first pad structure dam1 is less than or equal to the height of the second pad structure dam2; the height of the third pad structure dam3 is greater than the height of the second pad structure dam2. In this design, the height of the pad structure dam farthest from the display area AA is the largest (that is, the height of the outermost third pad structure dam3 is the largest), which can better suppress the overflow of material from the third insulating layer 11.

[0124] In some embodiments, Figure 8 is a cross-sectional view of the fourth example of the first side of the structure shown in Figure 1. The difference between the structure shown in Figure 8 and the structure shown in Figure 7 is that the structure shown in Figure 8 further provides a fourth isolation pillar 44 on the second pad structure dam2 to suppress material overflow of the first electrode 31 during the process preparation process.

[0125] Specifically, as shown in Figure 8, the display panel also includes a fourth isolation pillar 44 arranged on the side of the second pad structure dam2 away from the first insulating layer 5 and wrapping the side of the second pad structure dam2 close to the display area AA; the side of the fourth isolation pillar 44 close to the display area AA is against the first electrode 31.

[0126] Compared with the structure shown in FIG. 7 , the embodiment shown in FIG. 8 further adds a fourth isolation pillar 44 , which is equivalent to increasing the thickness of the second liner structure dam2 , thereby improving the effect of suppressing material overflow of the first electrode 31 .

[0127] In some embodiments, Figure 9 is a cross-sectional view of the fifth example of the first side of the structure shown in Figure 1. The difference between the structure shown in Figure 9 and the structure shown in Figure 7 is that the structure shown in Figure 9 further provides a fifth isolation pillar 45 between the first overlap structure 81 and the second pad structure dam2. The fifth isolation pillar 45 is located above the second insulating layer 9 and is used to suppress material overflow of the first electrode 31 during the process preparation process.

[0128] Specifically, as shown in Figure 9, the display panel also includes a fifth isolation pillar 45 arranged between the second insulating layer 9 and the third insulating layer 11, and the orthographic projection of the fifth isolation pillar 45 on the base substrate 1 is located between the orthographic projections of the first overlap structure 81 and the second pad structure dam2 on the base substrate 1; the side of the fifth isolation pillar 45 close to the display area AA is against the first electrode 31.

[0129] Compared with the structure shown in FIG. 7 , the embodiment shown in FIG. 9 further adds a fifth isolation pillar 45 , thereby improving the effect of suppressing material overflow of the first electrode 31 .

[0130] In some embodiments, as shown in Figures 2a-2c, 3a-3b, 7, 8 or 9, the display panel further includes a touch function layer 12 arranged on the side of the third insulating layer 11 away from the anti-peep structure 3; the edge of the touch function layer 12 is abutted against the side of the third pad structure dam3 close to the display area AA, thereby suppressing material overflow of the touch function layer 12 during the process preparation process.

[0131] The touch function layer 12 includes a first touch layer 121 and a second touch layer 122, and a touch insulation layer 123 interposed between the first touch layer 121 and the second touch layer 122. The second touch layer 122 includes a plurality of first touch electrodes and a plurality of second touch electrodes; one of the first touch electrodes and the second touch electrode can be a signal receiving electrode Rx, and the other can be a signal transmitting electrode Tx. The first touch layer 121 is provided with a plurality of bridges, which can electrically connect two adjacent first touch electrodes. The second touch layer 122 is also provided with a connection structure, which can electrically connect two adjacent second touch electrodes.

[0132] In some embodiments, as shown in Figures 2a, 2c, 3a-3b, 7, 8, or 9, the display panel further includes a touch electrode lead 124; the first conductive layer 6 further includes a touch power line 63 spaced apart from both the first electrode source connection portion 61 and the second electrode source connection portion 62. One end of the touch electrode lead 124 is electrically connected to the touch electrode (the first touch electrode or the second touch electrode), and the other end is electrically connected to the touch power line 63.

[0133] In some embodiments, Figure 10a is a cross-sectional view of the first side of the structure shown in Figure 1 under the sixth example. Compared to the structure shown in Figure 2a, the structure shown in Figure 10a differs in that the structure shown in Figure 10a lacks first isolation pillar 41 and third isolation pillar 43, and either first electrode 31 or second electrode 32 is a hollow structure. For other structures, refer to the detailed description of the structure shown in Figure 2a above, and any repetitive details will not be repeated. The structure shown in Figure 10 is described using the hollow structure of second electrode 32 as an example. The same applies to the case where first electrode 31 is a hollow structure, and any repetitive details will not be repeated.

[0134] As shown in FIG10a , the second electrode 32 is a hollow structure, which specifically includes a plurality of openings 321 and a connecting electrode 322 forming the plurality of openings 321. The openings 321 are arranged correspondingly to the connecting portion 332 of the electrochromic layer (for example, the openings 321 and the connecting portion 332 are arranged in a one-to-one correspondence).

[0135] In the anti-peeping mode, different voltages are applied to the first electrode 31 and the second electrode 32. At this time, the contact portion 331 becomes black under the action of the external electric field. Since the connecting portion 332 is arranged corresponding to the opening 321, the connecting portion 332 will not contact the electrode with the opening 321, and will not be affected by the external electric field. It remains transparent and allows light to pass through, thereby achieving display under a narrow viewing angle, that is, achieving an anti-peeping effect.

[0136] In some embodiments, as shown in FIG10a , when the second electrode 32 has a hollow structure, at least a portion of the connecting portion 332 falls within the opening 321. The connecting portion 332 falling within the opening 321 is spaced apart from the second electrode 32. Here, “spaced apart” can be understood as the orthographic projection of the connecting portion 332 falling within the opening 321 on the base substrate 1 does not overlap with the orthographic projection of the second electrode 32 (or the connecting electrode 322) on the base substrate 1. Alternatively, the spaced apart arrangement can be understood as the surface of the second electrode 32 facing away from the base substrate 1 and the surface of the connecting portion 332 close to the base substrate 1 being staggered.

[0137] In some embodiments, FIG10b is a cross-sectional view of the first side of the structure shown in FIG1 in the seventh example. The structure shown in FIG10b differs from FIG10a in that a filling structure is provided in the opening 321 to isolate the connecting portion 332 from the connecting electrode 322. The filling structure is a transparent insulating material, such as a photoresist material.

[0138] Exemplarily, as shown in FIG10 b , the surface of the filling structure facing away from the base substrate 1 is flush with the surface of the connecting electrode 322 facing away from the base substrate 1 .

[0139] Of course, for any structure in FIG. 2 a , FIG. 2 b , FIG. 2 c , FIG. 7 , FIG. 8 and FIG. 9 , the solution of replacing the first isolation pillar 41 with a solution that makes the second electrode 32 have a hollow structure is applicable, and the present disclosure will not list them one by one.

[0140] In addition, an embodiment of the present disclosure further provides a method for manufacturing a display panel, including steps S1 to S3.

[0141] In step S1 , a base substrate 1 is provided.

[0142] In step S2, a light-emitting functional layer and an encapsulation layer 2 are sequentially formed on the base substrate 1. The light-emitting functional layer includes a plurality of light-emitting devices.

[0143] In step S3 , the second electrode 32 , the electrochromic layer 33 and the first electrode 31 are formed in sequence on the side of the encapsulation layer 2 facing away from the base substrate 1 .

[0144] The first electrode 31, the second electrode 32, and the electrochromic layer 33 form the privacy protection structure 3. The electrochromic layer 33 includes a plurality of contact portions 331 and a connecting portion 332 connecting two adjacent contact portions 331. The first electrode 31 and the second electrode 32 both contact the contact portions 331. One of the first electrode 31 and the second electrode 32 contacts the connecting portion 332, while the other is spaced apart from the connecting portion 332. The connecting portion 332 is provided in correspondence with the light-emitting device.

[0145] The following describes in detail the preparation process of the structure shown in Figure 2a using an embodiment, specifically including steps S11 to S110. Figures 11a to 11i are schematic diagrams of intermediate structures in the process of forming the display panel shown in Figure 2a.

[0146] In step S11 , a base substrate 1 is provided.

[0147] A pixel driving circuit is formed on the base substrate 1 .

[0148] In step S12 , as shown in FIG. 11 a , a first conductive layer 6 and a first insulating layer 5 are sequentially formed on the base substrate 1 .

[0149] The first conductive layer 6 is located in the peripheral area BB. The first conductive layer 6 and the first insulating layer 5 can be prepared by a mask process, a printing process or a lamination process.

[0150] In step S13, as shown in Figure 11b, a pixel defining layer PDL and a light-emitting functional layer are formed on the surface of the portion of the first insulating layer 5 located in the display area AA, which is away from the substrate substrate 1, and a first pad structure dam1, a second pad structure dam2 and a third pad structure dam3 are formed on the surface of the portion of the first insulating layer 5 located in the peripheral area BB, which is away from the substrate substrate 1.

[0151] In step S14 , as shown in FIG11 c , an encapsulation layer 2 , a stepping layer 7 , a second conductive layer 8 and a second insulating layer 9 are sequentially formed on the side of the light-emitting functional layer away from the first insulating layer 5 .

[0152] Before forming the second conductive layer 8, it is also necessary to form a third via V3 and a fourth via V4 on the first insulating layer 5 to expose the first conductive layer 6 through the third via V3 and the fourth via V4; thereafter, the second conductive layer 8 is formed through a mask process, that is, a first overlap structure 81 and a second overlap structure 82 that are spaced apart and independent of each other, as well as a first lead-out portion 83 and a second lead-out portion 84 are formed, and the overlap of the first lead-out portion 83 with the first electrode source connection portion 61 and the overlap of the second lead-out portion 84 with the second electrode source connection portion 62 are realized.

[0153] The padding layer 7 can be formed by a mask process, a printing process or a lamination process. The padding layer 7 wraps the encapsulation layer 2.

[0154] The second insulating layer 9 covers the second conductive layer 8, wherein a first via hole V1 and a second via hole V2 are formed in the second insulating layer 9. The first overlapping structure 81 is exposed through the second via hole V2, and the first overlapping structure 82 is exposed through the first via hole V1. The second insulating layer 9 can be provided only in the peripheral area BB, as shown in Figures 2a, 2b, and 2c. Alternatively, the second insulating layer 9 can be provided as an entire layer, that is, the second insulating layer 9 is provided in the display area AA and the peripheral area BB, as shown in Figures 3a, 3b, 7, 8, 9, 10a, and 10b.

[0155] In step S15 , as shown in FIG. 11 d , a second isolation pillar 42 and a third isolation pillar 43 are formed on the surface of the second insulating layer 9 located in the peripheral area BB and facing away from the second conductive layer 8 .

[0156] The second isolation pillar 42 and the third isolation pillar 43 are formed by a mask process, which specifically includes depositing a low-temperature negative photoresist material, and then performing exposure, development, and etching to obtain the second isolation pillar 42 and the third isolation pillar 43.

[0157] In step S16, as shown in FIG11e , a second electrode 32 is formed on the surface of the portion of the elevation layer 7 located in the display area AA facing away from the base substrate 1 and on the surface of the second insulating layer 9 facing away from the base substrate, and the second electrode 32 extends from the display area AA to the peripheral area BB and overlaps with the second overlapping structure 82, and abuts against the side surface of the second isolation pillar 42 close to the display area. Please note that FIG11e shows the situation where the second insulating layer 9 is only located in the peripheral area BB.

[0158] In some embodiments, the second electrode 32 can be manufactured by printing.

[0159] In step S17 , as shown in FIG. 11 f , a first isolation pillar 41 is formed on a side of the second insulating layer 9 located in the display area AA away from the second conductive layer 8 .

[0160] The first isolation pillar 41 is formed by a mask process, specifically by depositing a low-temperature negative photoresist material, followed by exposure, development, and etching to obtain the first isolation pillar 41 .

[0161] In step S18 , as shown in FIG. 11 g , the electrochromic layer 33 and the first electrode 31 are sequentially formed on the side of the second electrode 32 away from the second insulating layer 9 .

[0162] As shown in FIG. 11 g , the first electrode 31 further extends from the second isolation pillar 42 to the first overlapping structure 81 and overlaps with the first overlapping structure 81 .

[0163] The electrochromic layer 33 and the first electrode 31 can be manufactured by a printing process, wherein the printed edge of the electrochromic layer 33 is located on the side of the second isolation pillar 42 away from the third isolation pillar 43, and the printed edge of the first electrode 31 is located on the side of the third isolation pillar 43 close to the second isolation pillar 42.

[0164] In step S19 , as shown in FIG11 h , a third insulating layer 11 is formed on a side of the first electrode 31 away from the electrochromic layer 33 . The third insulating layer 11 wraps the anti-peeping structure 3 and the second insulating layer 9 .

[0165] The third insulating layer 11 may be manufactured by a printing process, and a boundary of the third insulating layer 11 is located on a side of the third liner structure dam3 close to the second liner structure dam2 .

[0166] In step S110, as shown in FIG11i , a touch function layer 12 is formed on the side of the third insulating layer 11 away from the first electrode 31. The touch function layer 12 includes a first touch layer 121, a touch insulating layer 123 and a second touch layer 122.

[0167] This step specifically includes forming a first touch layer 121 , a touch insulation layer 123 , and a second touch layer 122 in sequence on a side of the third insulating layer 11 facing away from the first electrode 31 , and forming a touch electrode lead 124 to connect with a touch power line on the first conductive layer 6 .

[0168] The following describes in detail the manufacturing process of the structure shown in Figure 7 using an embodiment, specifically including steps S21 to S210. Figures 12a to 12i are schematic diagrams of intermediate structures in the process of forming the display panel shown in Figure 7.

[0169] In step S21 , a base substrate 1 is provided.

[0170] A pixel driving circuit is formed on the base substrate 1 .

[0171] In step S22 , as shown in FIG12 a , a first conductive layer 6 and a first insulating layer 5 are sequentially formed on the base substrate 1 .

[0172] The first conductive layer 6 is located in the peripheral area BB. The first conductive layer 6 and the first insulating layer 5 can be prepared by a mask process, a printing process or a lamination process.

[0173] In step S23, as shown in Figure 12b, a pixel defining layer PDL and a light-emitting functional layer are formed on the side of the first insulating layer 5 located in the display area AA away from the substrate substrate 1, and a first pad structure dam1, a second pad structure dam2 and a third pad structure dam3 are formed on the side of the first insulating layer 5 located in the peripheral area BB away from the substrate substrate 1.

[0174] In step S24, as shown in FIG12c, an encapsulation layer 2, a spacer layer 7, a second conductive layer 8, and a second insulating layer 9 are sequentially formed on the side of the light-emitting functional layer away from the first insulating layer 5. The second insulating layer 9 is provided as a whole layer, extending from the display area AA to the peripheral area BB.

[0175] Before forming the second conductive layer 8, it is also necessary to form a third via hole V3 and a fourth via hole V4 in the first insulating layer 5 to expose the first conductive layer 6 through the third via hole V3 and the fourth via hole V4; thereafter, the second conductive layer 8 is formed through a mask process, that is, a first overlapping structure 81 and a second overlapping structure 82 that are spaced apart and independent of each other, as well as a first lead-out portion 83 and a second lead-out portion 84 are formed, and the overlapping of the first lead-out portion 83 with the first electrode source connection portion 61 and the overlapping of the second lead-out portion 84 with the second electrode source connection portion 62 are realized.

[0176] The padding layer 7 can be formed by a mask process, a printing process or a lamination process. The padding layer 7 wraps the encapsulation layer 2.

[0177] The second insulating layer 9 covers the second conductive layer 8 , wherein a first via hole V1 and a second via hole V2 are formed in the second insulating layer 9 . The first overlapping structure 81 is exposed through the second via hole V2 , and the first overlapping structure 82 is exposed through the first via hole V1 .

[0178] In step S25 , as shown in FIG. 12 d , a second isolation pillar 42 and a third isolation pillar 43 are formed on the surface of the second insulating layer 9 located in the peripheral area BB and facing away from the second conductive layer 8 .

[0179] The second isolation pillar 42 and the third isolation pillar 43 are formed by a mask process, which specifically includes depositing a low-temperature negative photoresist material, and then performing exposure, development, and etching to obtain the second isolation pillar 42 and the third isolation pillar 43.

[0180] In step S26, as shown in Figure 12e, a second electrode 32 is formed on the side of the second insulating layer 9 located in the display area AA, which is away from the second conductive layer 8, and the second electrode 32 extends from the display area AA to the peripheral area BB and overlaps with the second overlap structure 82, and abuts against the side surface of the second isolation pillar 42 close to the display area.

[0181] The second electrode 32 can be manufactured by printing.

[0182] In step S27 , as shown in FIG. 12 f , a first isolation pillar 41 is formed on a side of the second insulating layer 9 located in the display area AA and away from the second conductive layer 8 .

[0183] The first isolation pillar 41 is formed by a mask process, specifically by depositing a low-temperature negative photoresist material, followed by exposure, development, and etching to obtain the first isolation pillar 41 .

[0184] In step S28 , as shown in FIG12 g , the electrochromic layer 33 and the first electrode 31 are sequentially formed on the side of the second electrode 32 away from the second insulating layer 9 .

[0185] 12g , the electrochromic layer 33 further extends from the second isolation pillar 42 to the side of the third isolation pillar 43 close to the display area AA. The first electrode 31 further extends from the second isolation pillar 42 to the first overlap structure 81 and overlaps with the first overlap structure 81 .

[0186] The electrochromic layer 33 and the first electrode 31 can be manufactured by a printing process, wherein the printed edge of the electrochromic layer 33 is located on the side of the second isolation pillar 42 away from the third isolation pillar 43, and the printed edge of the first electrode 31 is located on the side of the third isolation pillar 43 close to the second isolation pillar 42.

[0187] In step S29 , as shown in FIG12 h , a third insulating layer 11 is formed on the side of the first electrode 31 away from the electrochromic layer 33 . The third insulating layer 11 wraps the anti-peeping structure 3 and the second insulating layer 9 .

[0188] The third insulating layer 11 may be manufactured by a printing process, and a boundary of the third insulating layer 11 is located on a side of the third liner structure dam3 close to the second liner structure dam2 .

[0189] In step S210, as shown in FIG12i, a touch function layer 12 is formed on a side of the third insulating layer 11 away from the first electrode 31. The touch function layer 12 includes a first touch layer 121, a touch insulating layer 123 and a second touch layer 122.

[0190] This step specifically includes forming a first touch layer 121 , a touch insulation layer 123 , and a second touch layer 122 in sequence on a side of the third insulating layer 11 facing away from the first electrode 31 , and forming a touch electrode lead 124 to connect with a touch power line on the first conductive layer 6 .

[0191] The present disclosure first prepares and forms the second conductive layer 8 and then prepares and forms the second isolation pillar 42, the third isolation pillar 43, the fourth isolation pillar 44, and the fifth isolation pillar 45. Compared with the solution of first preparing and forming the isolation pillar and then forming the second conductive layer 8, the present disclosure can avoid the problem of broken wiring of the second conductive layer 8 when the slope angle of the isolation pillar is large.

[0192] The present disclosure also provides a display device comprising the display panel of any of the above-described embodiments. The display device may be, for example, a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, vehicle-mounted device, or any other product with a display function. Other essential components of the display device are readily understood by those skilled in the art and are not detailed here, nor should they be construed as limitations of the present disclosure.

[0193] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display panel comprising a base substrate, and a light-emitting functional layer, an encapsulation layer, and an anti-peeping structure sequentially disposed on the base substrate; The light-emitting functional layer includes a plurality of light-emitting devices; the anti-peeping structure includes an electrochromic layer, a first electrode arranged on the side of the electrochromic layer away from the base substrate, and a second electrode arranged on the side of the electrochromic layer close to the base substrate, wherein The electrochromic layer includes a plurality of contact portions and a connecting portion connecting two adjacent contact portions; the first electrode and the second electrode are both in contact with the contact portions, one of the first electrode and the second electrode is in contact with the connecting portion, and the other is spaced apart from the connecting portion; The connecting parts are arranged in a one-to-one correspondence with the light-emitting devices.

2. The display panel according to claim 1, wherein: A first isolation pillar is provided between the connecting portion and either the first electrode or the second electrode.

3. The display panel according to claim 1, wherein: Either the first electrode or the second electrode is a hollow structure, and the hollow structure includes a plurality of openings and a connecting electrode forming the plurality of openings; the openings are arranged in a one-to-one correspondence with the connecting portions.

4. The display panel according to claim 3, wherein: The second electrode has a hollow structure, and at least a portion of the connecting portion falls into the corresponding opening.

5. The display panel according to any one of claims 1 to 4, wherein The display panel has a display area and a peripheral area surrounding the display area; The display panel further includes: a first insulating layer disposed on the base substrate; a first conductive layer located in the peripheral region and disposed on a side of the first insulating layer close to the base substrate; a raised layer disposed on a side of the encapsulation layer away from the light-emitting functional layer; a second conductive layer located in the peripheral region and disposed on a side of the raised layer away from the encapsulation layer; and a second insulating layer disposed on a side of the second conductive layer away from the raised layer; the raised layer covering the encapsulation layer. The second conductive layer includes a first overlapping structure and a second overlapping structure that are spaced apart, and the first overlapping structure is farther away from the display area than the second overlapping structure; The first electrode is electrically connected to the first overlapping structure through a first via hole penetrating the second insulating layer; the second electrode is electrically connected to the second overlapping structure through a second via hole penetrating the second insulating layer. The display panel according to claim 5 , wherein: The display panel further includes a second isolation pillar disposed between the second insulating layer and the first electrode, and an orthographic projection of the second isolation pillar on the base substrate is located between an orthographic projection of the first overlapping structure and an orthographic projection of the second overlapping structure on the base substrate; The side of the second isolation pillar close to the display area abuts against the electrochromic layer.

7. The display panel according to claim 6, wherein: The display panel further includes a third isolation pillar disposed on a side of the second insulating layer facing away from the base substrate, and an orthographic projection of the third isolation pillar on the base substrate is located on a side of the orthographic projection of the first overlapping structure on the base substrate away from an orthographic projection of the second isolation pillar on the base substrate; The side of the third isolation pillar close to the display area abuts against the first electrode.

8. The display panel according to claim 7, wherein: The display panel also includes a first pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against the edge of the encapsulation layer, a second pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against the edge of the elevated layer, a third insulating layer arranged on a side of the anti-peep structure away from the elevated layer, and a third pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against the edge of the third insulating layer.

9. The display panel according to claim 5, wherein: The display panel further includes: a second isolation pillar disposed between the second insulating layer and the electrochromic layer; and a third isolation pillar disposed between the second insulating layer and the first electrode, wherein the orthographic projections of the second isolation pillar and the third isolation pillar on the base substrate are both located between the orthographic projections of the first and second overlap structures on the base substrate, and the second isolation pillar is closer to the second overlap structure than the third isolation pillar. The side of the second isolation pillar close to the display area abuts against the second electrode; the side of the third isolation pillar close to the display area abuts against the electrochromic layer.

10. The display panel according to claim 9, wherein: The display panel also includes a first pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against the edge of the encapsulation layer, a second pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against the edge of the elevated layer, a third insulating layer arranged on a side of the anti-peep structure away from the elevated layer, and a third pad structure arranged on a side of the first insulating layer away from the base substrate and abutting against the edge of the third insulating layer.

11. The display panel according to claim 10, wherein: The display panel further includes a fourth isolation pillar disposed on a side of the second pad structure away from the first insulating layer and wrapping a side of the second pad structure close to the display area; The side of the fourth isolation pillar close to the display area abuts against the first electrode.

12. The display panel according to claim 10, wherein: The display panel further includes a fifth isolation pillar disposed between the second insulating layer and the third insulating layer, and an orthographic projection of the fifth isolation pillar on the base substrate is located between an orthographic projection of the first overlapping structure and the second pad structure on the base substrate; The side of the fifth isolation pillar close to the display area abuts against the first electrode.

13. The display panel according to claim 10, wherein: The display panel further includes a touch function layer disposed on a side of the third insulating layer away from the anti-peeping structure; an edge of the touch function layer abuts against a side surface of the third pad structure close to the display area.

14. The display panel according to claim 10, wherein: The second overlapping structure surrounds the display area, and the first overlapping structure semi-surrounds the second overlapping structure; The first conductive layer includes a first electrode source connecting portion and a second electrode source connecting portion that are spaced apart; The second conductive layer further includes at least one first lead-out portion and at least one second lead-out portion, wherein the first lead-out portion and the second lead-out portion are spaced apart from each other; The first overlap structure is electrically connected to the first lead portion, and the second overlap structure is electrically connected to the second lead portion; the first lead portion extends from the connection position of the first overlap structure to between the second pad structure and the third pad structure, and is electrically connected to the first electrode source connection portion through a third via hole penetrating the first insulating layer; The second lead portion extends from the second overlapping structure connection position to between the second pad structure and the third pad structure, and is electrically connected to the first electrode-source connection portion through a fourth via hole penetrating the first insulating layer.

15. The display panel according to any one of claims 5 to 14, wherein: The second insulating layer is located in the peripheral region, and the second electrode is located on a surface of the elevated layer away from the base substrate.

16. The display panel according to any one of claims 5 to 14, wherein: The second insulating layer is a whole-layer structure located in the display area and the peripheral area, and the second electrode is located on a surface of the second insulating layer away from the base substrate.

17. A display device comprising the display panel according to any one of claims 1 to 16.

18. A method for preparing a display panel, for preparing the display panel according to any one of claims 1 to 16; wherein: The method for preparing the display panel includes: providing a substrate; A light-emitting functional layer and an encapsulation layer are sequentially formed on the substrate; the light-emitting functional layer includes a plurality of light-emitting devices; A second electrode, an electrochromic layer, and a first electrode are sequentially formed on a side of the encapsulation layer facing away from the base substrate; the first electrode, the second electrode, and the electrochromic layer constitute an anti-peeping structure; The electrochromic layer includes a plurality of contact portions and a connecting portion connecting two adjacent contact portions; the first electrode and the second electrode are both in contact with the contact portion, one of the first electrode and the second electrode is in contact with the connecting portion, and the other is spaced apart from the connecting portion; the connecting portion is arranged corresponding to the light-emitting device.

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