Cutting device and method for manufacturing cut article

Abstract

Provided is a cutting device capable of performing cutting and inspection with high productivity. A cutting device (1) comprises a first transport mechanism (7) and a second transport mechanism (11) that hold and transport a cut article (S1), a first inspection mechanism (8) that inspects a first surface (F1) of the cut article (S1) in a state in which the cut article (S1) is disposed at a first inspection position (Q1), and a second inspection mechanism (9) that inspects a second surface (F2) of the cut article (S1) in a state in which the cut article (S1) is disposed at a second inspection position (Q2), the first transport mechanism (7) being configured to be capable of transporting a plurality of cut articles (S1) to both the first inspection position (Q1) and the second inspection position (Q2), and the second transport mechanism (11) also being configured to be capable of transporting the plurality of cut articles (S1) to both the first inspection position (Q1) and the second inspection position (Q2).

Description

Cutting device and method for manufacturing cut products

[0001] The present disclosure relates to a cutting device and a method for producing a cut product.

[0002] Japanese Patent Laid-Open Publication No. 2023-076250 (Patent Document 1) discloses an invention related to a cutting device. This cutting device cuts an object (package substrate) into a plurality of cut products (electronic components). This cutting device is equipped with separate inspection mechanisms for inspecting the bottom surfaces of the electronic components and the top surfaces of the electronic components. More specifically, a first optical inspection camera is disposed upstream in the transport direction of the electronic components, and a second optical inspection camera is disposed downstream.

[0003] In the above-described cutting apparatus, a first optical inspection camera inspects the mold surface of the electronic component, and then a second optical inspection camera inspects the ball / lead surface of the electronic component. The inspection mechanism typically includes lighting suitable for the object being inspected. In the above-described cutting apparatus, lighting used with the first optical inspection camera is suitable for inspecting the mold surface, and lighting used with the second optical inspection camera is suitable for inspecting the ball / lead surface.

[0004] Japanese Patent Application Laid-Open No. 2023-076250

[0005] In recent years, the needs for cutting devices have become more diverse. For example, it is desirable to be able to efficiently cut a wider variety of objects and efficiently inspect the cut products obtained by cutting. For example, there is a case where one surface of the object to be cut is a molded surface entirely sealed with resin, and the other surface of the object to be cut is a ball / lead surface partially sealed with resin. Suppose that the cutting device disclosed in Patent Document 1 (JP 2023-076250 A) is used to obtain multiple cut products from such an object to be cut.

[0006] In order to properly cut the workpiece using the above-mentioned cutting device, the workpiece is fixed on the processing table with its mold surface facing upward, and the blade is brought close to the workpiece from the mold surface side to cut the workpiece. If the device configuration of Patent Document 1 is then used as is, the ball / lead surface of the workpiece is inspected by the first optical inspection camera on the upstream side, and the mold surface is inspected by the second optical inspection camera on the downstream side.

[0007] In this state, the lighting is not suitable for the object being inspected, so in order to perform a proper inspection, the lighting used with the first optical inspection camera must be replaced with lighting suitable for inspecting the ball / lead surface, and the lighting used with the second optical inspection camera must be replaced with lighting suitable for inspecting the mold surface, and adjustments such as alignment and focus of each inspection mechanism must also be made. Such replacements and adjustments require time and effort.

[0008] An object of the present disclosure is to provide a cutting device capable of performing cutting and inspection with high productivity, and a method for manufacturing a cut product.

[0009] The cutting device disclosed herein comprises a processing table that holds an object to be cut; a cutting mechanism that cuts the object to be cut held on the processing table to individualize it into a plurality of cut products; a first conveying mechanism that holds and conveys the plurality of cut products; a second conveying mechanism that holds and conveys the plurality of cut products; a first inspection mechanism that inspects first sides of the plurality of cut products while the plurality of cut products are arranged at a first inspection position; and a second inspection mechanism that inspects second sides of the plurality of cut products while the plurality of cut products are arranged at a second inspection position, wherein the first conveying mechanism is configured to be able to transport the plurality of cut products to both the first inspection position and the second inspection position, and the second conveying mechanism is also configured to be able to transport the plurality of cut products to both the first inspection position and the second inspection position.

[0010] The method for manufacturing cut products disclosed herein includes the steps of: using the cutting device to cut the object to be cut held on the processing table to separate it into a plurality of cut products; inspecting the second sides of the plurality of cut products with the second inspection mechanism while the first conveying mechanism positions the plurality of cut products at the second inspection position; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the first sides of the plurality of cut products with the first inspection mechanism while the second conveying mechanism positions the plurality of cut products at the first inspection position.

[0011] The method for manufacturing cut products disclosed herein includes the steps of: using the cutting device to cut the object to be cut held on the processing table to separate it into a plurality of cut products; inspecting the first surfaces of the plurality of cut products using the first inspection mechanism while the first conveying mechanism positions the plurality of cut products at the first inspection position; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the second surfaces of the plurality of cut products using the second inspection mechanism while the second conveying mechanism positions the plurality of cut products at the second inspection position.

[0012] According to the present disclosure, it is possible to obtain a cutting device and a method for manufacturing a cut product that are capable of cutting and inspecting with high productivity.

[0013] 1 is a plan view schematically showing the cutting device 1. FIG. 2 is a front view schematically showing the portion between the processing table 5M and the mounting table 14 in the cutting device 1, and shows a state SA1 in which the first transport mechanism 7 is disposed at the pick-up position T1 and picks up the cut product S1 held on the processing table 5M from above. FIG. 3 shows a state SA2 in which the first transport mechanism 7 has placed the cut product S1 at the first inspection position Q1. FIG. 4 shows a state SA3 in which the second transport mechanism 11, disposed at the receiving position U1, receives and holds the cut product S1 held by the first transport mechanism 7 from the first transport mechanism 7. FIG. 5 shows a state SA4 in which the second transport mechanism 11 has placed the cut product S1 at the second inspection position Q2. FIG. 6 shows a state SA5 in which the second transport mechanism 11 places the cut product S1 on the mounting table 14 at the mounting position U2. FIG. 7 shows a state SB1 in which the first transport mechanism 7 is disposed at the pick-up position T1 and picks up the cut product S1 held on the processing table 5M from above. 1 shows a state SB2 in which the cut products S1 are placed at the second inspection position Q2 by the first transport mechanism 7. It also shows a state SB3 in which the second transport mechanism 11, located at the receiving position U1, receives the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7 and holds them. It also shows a state SB4 in which the second transport mechanism 11 places the cut products S1 at the first inspection position Q1. It also shows a state SB5 in which the second transport mechanism 11 places the cut products S1 on the placement table 14 at the placement position U2. It also shows a state SC5 in which the first transport mechanism 7 receives the cut products S1 held by the second transport mechanism 11 from the second transport mechanism 11 and holds them. It also shows a state SC6 in which the first transport mechanism 7 places the cut products S1 on the placement table 14 at the placement position U2.

[0014] The following describes embodiments of the present disclosure. In the embodiments described below, when numbers, quantities, etc. are mentioned, the scope of the present disclosure is not necessarily limited to those numbers, quantities, etc., unless otherwise specified. Each component is not necessarily essential to the present disclosure, unless otherwise specified. The same reference numbers are used for the same and corresponding components, and redundant descriptions may not be repeated.

[0015] (Cutting Apparatus 1) FIG. 1 is a plan view schematically illustrating the cutting apparatus 1. The cutting apparatus 1 includes a cutting module A1 (FIG. 1) and an inspection and storage module B1. The cutting apparatus 1 is equipped with a monitor 20 and a computer 50, and operates by receiving various input commands. Note that in FIG. 1, the monitor 20 and the computer 50 are provided in the inspection and storage module B1, but they may also be provided in the cutting module A1. The cutting apparatus 1 cuts an object to be cut (a package substrate) to separate the object into a plurality of cut products (package components). Below, details of the cutting apparatus 1 will be described, along with a method for manufacturing cut products S1 using the cutting apparatus 1.

[0016] (Cutting object P1) In the case of a package substrate, for example, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin. Examples of package substrates include a ball grid array (BGA) package substrate, a land grid array (LGA) package substrate, a chip size package (CSP) package substrate, a light emitting diode (LED) package substrate, and a quad flat no-leaded (QFN) package substrate.

[0017] The cutting device 1 further inspects each of the plurality of individual cut products (electronic components). An image of each cut product is captured, and each cut product is inspected based on the captured image. Inspection data is generated through the inspection, and each cut product is classified as either a "good product" or a "defective product."

[0018] Here, a package substrate is used as the cutting object P1 (FIG. 1), and the cutting object P1 is divided into a plurality of cut products S1 (FIG. 2) by the cutting device 1. In the following description, of both surfaces of the cutting object P1 or the cut product S1, the resin-sealed surface will be referred to as the mold surface F1 (FIG. 2), and the surface opposite to the mold surface F1 will be referred to as the ball / lead surface F2 (FIG. 2).

[0019] [Embodiment 1] (Cutting Module A1) The cutting module A1 cuts a cutting target P1 (FIG. 1) to produce a plurality of cut products S1 (FIG. 2). The inspection and storage module B1 inspects each of the plurality of cut products S1 and then stores the cut products S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to the other components.

[0020] The cutting module A1 includes a substrate supply unit 3, a positioning unit 4, processing tables 5M and 5N, a cutting mechanism 6, and a first transport mechanism 7. The substrate supply unit 3 pushes out the workpieces P1 one by one from the magazine M1, thereby supplying the workpieces P1 one by one to the positioning unit 4. The workpieces P1 are arranged with their ball / lead surfaces F2 (FIG. 2) facing upward.

[0021] The positioning unit 4 places the workpiece P1 pushed out from the substrate supply unit 3 on the rail unit 4a and positions the workpiece P1. The cutting device 1 has a twin-cut table configuration with two processing tables 5M and 5N. The positioning unit 4 transports the workpiece P1 to the processing tables 5M and 5N, and the processing tables 5M and 5N hold the workpiece P1.

[0022] Each of the processing tables 5M, 5N includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the workpiece P1 transported by the positioning unit 4 by suction from below. The rotation mechanism 5b rotates the holding member 5a in the θ1 direction in FIG. 1 (i.e., rotates it on the XY plane in FIG. 1). The movement mechanism 5c moves the holding member 5a along the Y axis in the figure.

[0023] For example, after the processing table 5M has adsorbed the workpiece P1, the first position confirmation camera 5d captures an image of the workpiece P1 and confirms the position of the workpiece P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the workpiece P1. The mark is, for example, a mark for determining the cutting position of the workpiece P1.

[0024] Thereafter, the processing table 5M moves toward the cutting mechanism 6 along the Y axis in the figure. After the processing table 5M moves below the cutting mechanism 6, alignment is performed, and then the processing table 5M and the cutting mechanism 6 are moved relative to each other to cut the workpiece P1. The cutting mechanism 6 cuts the workpiece P1 using a blade 6a, thereby dividing the workpiece P1 into a plurality of cut products S1.

[0025] Every time the workpiece P1 is cut by the blade 6a of the cutting mechanism 6, the workpiece P1 (cut product S1) is imaged and confirmed by the second position confirmation camera 6b provided in the cutting mechanism 6. Confirmation using the second position confirmation camera 6b includes, for example, confirmation of the cut position and the cut width of the workpiece P1.

[0026] After cutting of the workpiece P1 is completed, the processing table 5M, with the plurality of individual cut products S1 held by suction, moves along the Y axis in the drawing in a direction away from the cutting mechanism 6. During this movement, the first cleaner 5e cleans and dries the top surfaces (ball / lead surfaces F2 (FIG. 2)) of the cut products S1.

[0027] 2 is a front view schematically showing the portion between the processing table 5M and the loading table 14 in the cutting device 1. The first transport mechanism 7 has a main body 7a and a moving shaft 7b, and can transport the cut workpiece S1 along the moving shaft 7b while the main body 7a holds the cut workpiece S1.

[0028] After cleaning and drying by the first cleaner 5e (FIG. 1) is completed, the first transport mechanism 7 is positioned at the pick-up position T1, as shown in FIG. 2, and picks up the cut products S1 held on the processing table 5M from above. FIG. 2 shows a state SA1 in which the first transport mechanism 7 is positioned at the pick-up position T1 and picks up the cut products S1 held on the processing table 5M from above. After picking up the cut products S1 from the processing table 5M, the first transport mechanism 7 transports the cut products S1 toward the first inspection mechanism 8 and the second inspection mechanism 9 of the inspection and storage module B1.

[0029] As shown in Figure 3, the cut products S1 are transported upward (arrow AR1) and then positioned so as to face the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10, respectively (arrows AR2 and AR3), where the underside (mold surface F1) of the cut products S1 is cleaned and dried. The cut products S1 are then further transported by the first transport mechanism 7 and placed at a position (first inspection position Q1) facing the first inspection mechanism 8 (arrow AR4). Figure 3 shows a state SA2 in which the cut products S1 have been placed at the first inspection position Q1 by the first transport mechanism 7.

[0030] 1 and 3, the inspection and storage module B1 (FIG. 1) includes a first inspection mechanism 8, a second inspection mechanism 9, a second conveying mechanism 11, a mounting table 14, and an extraction unit 15. The first inspection mechanism 8 has a first optical inspection camera 12 and a first illuminator 16. The first illuminator 16 is provided above the first optical inspection camera 12, and the first illuminator 16 irradiates light onto the cut product S1 during inspection by the first optical inspection camera 12.

[0031] 3, the first optical inspection camera 12 images the mold surface F1 (first surface) of the cut product S1 when the cut product S1 is placed at the first inspection position Q1 by the first conveying mechanism 7. The first optical inspection camera 12 is positioned near the cut product S1 placed at the first inspection position Q1 so as to image the area above.

[0032] Referring to Figure 4, after imaging by the first optical inspection camera 12, the first conveying mechanism 7 moves together with the cut product S1 (arrow AR5) to reach a position opposite the second conveying mechanism 11, and places the cut product S1 on the main body 11a of the second conveying mechanism 11.

[0033] The second transport mechanism 11 has a main body 11a and a moving shaft 11b, and can transport the cut products S1 along the moving shaft 11b while the main body 11a is holding the cut products S1. The second transport mechanism 11 shown in Figure 4 is located at a receiving position U1. While located at the receiving position U1, the second transport mechanism 11 receives and holds the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7. Figure 4 shows a state SA3 in which the second transport mechanism 11, located at the receiving position U1, receives and holds the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7.

[0034] 5, the main body 11a of the second conveying mechanism 11 is turned upside down while holding the cut products S1. The cut products S1 are placed by the second conveying mechanism 11 at a position (second inspection position Q2) facing the second inspection mechanism 9. Fig. 5 shows a state SA4 in which the cut products S1 are placed at the second inspection position Q2 by the second conveying mechanism 11.

[0035] The second inspection mechanism 9 has a second optical inspection camera 13 and a second illuminator 17. The second illuminator 17 is provided above the second optical inspection camera 13, and the second illuminator 17 irradiates the cut product S1 with light during inspection by the second optical inspection camera 13. When the cut product S1 is placed at the second inspection position Q2 by the second conveying mechanism 11, the second optical inspection camera 13 images the ball / lead surface F2 (second surface) of the cut product S1. The second optical inspection camera 13 is positioned near the cut product S1 placed at the second inspection position Q2 so as to image an area above it.

[0036] 6, after the second optical inspection camera 13 captures the image, the second transport mechanism 11 moves together with the cut products S1 to a position opposite the loading table 14 and places the cut products S1 on the loading table 14. The second transport mechanism 11 shown in Fig. 6 is located at loading position U2. Fig. 6 shows a state SA5 in which the second transport mechanism 11 places the cut products S1 on the loading table 14 at loading position U2.

[0037] In this embodiment, when a reference direction (X direction) extending linearly is defined, the positions in the reference direction are, from the left on the page, pick-up position T1 (FIG. 2), first inspection position Q1 (FIG. 3), second inspection position Q2 (FIG. 5), and placement position U2 (FIG. 6).

[0038] 1 , inspected cut products S1 are placed on the placement table 14. The placement table 14 is movable along the Y axis in the figure. The extraction unit 15 transfers the cut products S1 placed on the placement table 14 to a tray. The cut products S1 are sorted into "good products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each cut product S1 to a tray for good products 15a or a tray for defective products 15b based on the results of the sorting.

[0039] In the first embodiment described above, when cutting of the object P1 is completed, the cut product S1 is arranged with the ball / lead surface F2 ( FIG. 2 ) facing upward. On the other hand, even when the cut product S1 is arranged with the mold surface F1 ( FIG. 2 ) facing upward when cutting of the object P1 is completed, that is, when the object P1 is supplied from the magazine M1 ( FIG. 1 ) to the positioning unit 4, the cutting device 1 can efficiently perform inspection.

[0040] As shown in Fig. 7, when the first transport mechanism 7 is positioned at the pick-up position T1, the first transport mechanism 7 picks up the cut product S1 held on the processing table 5M from above. Fig. 7 shows a state SB1 in which the first transport mechanism 7 is positioned at the pick-up position T1 and picks up the cut product S1 held on the processing table 5M from above. After picking up the cut product S1 from the processing table 5M, the first transport mechanism 7 transports the cut product S1 toward the first inspection mechanism 8 and the second inspection mechanism 9 of the inspection and storage module B1.

[0041] As shown in Figure 8, the cut product S1 is transported upward (arrow AR1) and then placed opposite the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10 (arrows AR2, AR3), respectively, where the underside (ball / lead surface F2) of the cut product S1 is cleaned and dried.

[0042] The cut products S1 are then further transported by the first transport mechanism 7 and placed at a position (second inspection position Q2) facing the second inspection mechanism 9 (arrow AR4). Figure 8 shows a state SB2 in which the cut products S1 have been placed at the second inspection position Q2 by the first transport mechanism 7. With the cut products S1 placed at the second inspection position Q2 by the first transport mechanism 7, the second optical inspection camera 13 images the ball / lead surface F2 (second surface) of the cut products S1.

[0043] Referring to Figure 9, after imaging by the second optical inspection camera 13, the first conveying mechanism 7 moves together with the cut product S1 (arrow AR5) to reach a position opposite the second conveying mechanism 11, and places the cut product S1 on the main body 11a of the second conveying mechanism 11.

[0044] The second transport mechanism 11 shown in Fig. 9 is located at the receiving position U1. While located at the receiving position U1, the second transport mechanism 11 receives and holds the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7. Fig. 9 shows a state SB3 in which the second transport mechanism 11, located at the receiving position U1, receives and holds the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7.

[0045] As shown in Fig. 10 , the main body 11a of the second conveying mechanism 11 is turned upside down while holding the cut product S1. The cut product S1 is placed by the second conveying mechanism 11 at a position (first inspection position Q1) facing the first inspection mechanism 8. Fig. 10 shows a state SB4 in which the cut product S1 has been placed at the first inspection position Q1 by the second conveying mechanism 11. With the cut product S1 placed at the first inspection position Q1 by the second conveying mechanism 11, the first optical inspection camera 12 captures an image of the mold surface F1 (first surface) of the cut product S1.

[0046] 11 , after the first optical inspection camera 12 captures the image, the second transport mechanism 11 moves together with the cut products S1 to a position opposite the loading table 14 and places the cut products S1 on the loading table 14. The second transport mechanism 11 shown in Fig. 11 is located at loading position U2. Fig. 11 shows a state SB5 in which the second transport mechanism 11 places the cut products S1 on the loading table 14 at loading position U2.

[0047] Thereafter, as in embodiment 1, in the extraction unit 15, the cut product S1 is sorted into "good" or "defective" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13.

[0048] (Actions and Effects) As described in the above-mentioned first and second embodiments, in the cutting device 1, the first conveying mechanism 7 is configured to be able to transport the cut product S1 to both the first inspection position Q1 (Figure 3) and the second inspection position Q2 (Figure 8), and the second conveying mechanism 11 is also configured to be able to transport the cut product S1 to both the first inspection position Q1 (Figure 10) and the second inspection position Q2 (Figure 5).

[0049] Therefore, when cutting of the cutting object P1 is completed, whether the cut product S1 is placed with the ball / lead surface F2 ( FIG. 2 ) facing up or the mold surface F1 ( FIG. 7 ) facing up, inspection can be performed without changing the lighting or adjusting the first inspection mechanism 8 or the second inspection mechanism 9 (to optimize the inspection). Furthermore, a cutting apparatus equipped with two inspection mechanisms can provide high versatility as a cutting apparatus, as it can increase the number of inspection sequences. Therefore, the cutting apparatus 1 provides high versatility as a cutting apparatus, and can perform cutting and inspection with high productivity.

[0050] [Variation of Second Embodiment] In the second embodiment described above, after the first inspection mechanism 8 has performed the inspection, the cut product S1 is placed on the placement table 14 with the mold surface F1 facing downward. As a variation thereof, as shown in Fig. 12, after the first inspection mechanism 8 has performed the inspection, the main body 11a of the second transport mechanism 11 may be turned upside down while holding the cut product S1.

[0051] The first conveying mechanism 7 receives and holds the cut products S1 held by the second conveying mechanism 11 from the second conveying mechanism 11. Figure 12 shows a state SC5 in which the first conveying mechanism 7 receives and holds the cut products S1 held by the second conveying mechanism 11 from the second conveying mechanism 11.

[0052] The first transport mechanism 7 moves together with the cut products S1 to a position opposite the loading table 14 and places the cut products S1 on the loading table 14. The first transport mechanism 7 shown in Figure 13 is located at loading position U2. Figure 13 shows a state SC6 in which the first transport mechanism 7 is loading the cut products S1 onto the loading table 14 at loading position U2.

[0053] Here, the first transport mechanism 7 is configured to be movable between a pick-up position T1 where it picks up and holds multiple cut products S1 on the processing table 5M, and a placement position U2 where it places multiple cut products S1 on the placement table 14. With the above configuration, it is possible to place the cut products S1 on the placement table 14 with the ball / lead surface F2 facing downward.

[0054] [Supplementary Notes] The embodiments of the present disclosure have been described above, but the contents of the embodiments of the present disclosure can be summarized as shown in the following supplementary notes.

[0055] [Supplementary Note 1] A cutting device comprising: a processing table that holds an object to be cut; a cutting mechanism that cuts the object held on the processing table to separate it into a plurality of cut products; a first transport mechanism that holds and transports the plurality of cut products; a second transport mechanism that holds and transports the plurality of cut products; a first inspection mechanism that inspects first sides of the plurality of cut products while the plurality of cut products are arranged at a first inspection position; and a second inspection mechanism that inspects second sides of the plurality of cut products while the plurality of cut products are arranged at a second inspection position, wherein the first transport mechanism is configured to be able to transport the plurality of cut products to both the first inspection position and the second inspection position, and the second transport mechanism is also configured to be able to transport the plurality of cut products to both the first inspection position and the second inspection position.

[0056] According to the configuration described in Supplementary Note 1, each of the first and second conveying mechanisms is configured to be capable of conveying multiple cut products to both the first and second inspection positions. Therefore, inspection of the cut products can be flexibly initiated, for example, whether the first side of the cut products faces downward (e.g., facing the inspection mechanism) or the second side of the cut products faces downward at the time of starting inspection. For example, compared to a configuration in which the first conveying mechanism is configured to convey multiple cut products only to the first inspection position and the second conveying mechanism is configured to convey multiple cut products only to the second inspection position, the configuration described in Supplementary Note 1 allows for relatively flexible inspection order, such as inspecting the first side before the second side, or inspecting the second side before the first side, and enables cutting and inspection to be performed with high productivity.

[0057] [Appendix 2] The cutting device described in Appendix 1 further includes a loading table on which a plurality of the cut products can be placed, and the second conveying mechanism is configured to be movable between a receiving position where it receives and holds the plurality of cut products held by the first conveying mechanism from the first conveying mechanism, and a loading position where it places the plurality of cut products on the loading table.

[0058] According to the configuration described in Appendix 2 above, the second conveying mechanism receives and holds multiple cut products from the first conveying mechanism at the receiving position, and then the second conveying mechanism moves to the loading position and loads the multiple cut products onto the loading table.

[0059] [Appendix 3] The cutting device according to Appendix 2, wherein the first transport mechanism is configured to be movable between a pick-up position where the first transport mechanism picks up and holds the plurality of cut products on the processing table, and a placement position where the first transport mechanism places the plurality of cut products on the placement table.

[0060] According to the configuration described in Supplementary Note 3, for example, the following operations can be realized: the first transport mechanism transports the plurality of cut products to one of the first inspection position and the second inspection position to inspect the plurality of cut products, then the second transport mechanism transports the plurality of cut products to the other of the first inspection position and the second inspection position to inspect the plurality of cut products, and then the first transport mechanism receives and holds the plurality of cut products from the second transport mechanism, and then the first transport mechanism moves to the placement position to place the plurality of cut products on the placement table. This makes it possible to select the state of the cut products (whether the first side or the second side faces down) when storing them in the good-product tray 15 a or the defective-product tray 15 b.

[0061] [Appendix 4] The cutting device described in Appendix 3, wherein the first conveying mechanism receives and holds the plurality of cut products held by the second conveying mechanism, and the first conveying mechanism moves together with the plurality of cut products to a position opposite the loading table, and places the plurality of cut products on the loading table.

[0062] According to the configuration described in Appendix 4 above, for example, the following operations can be realized: the first conveying mechanism conveys multiple cut products to one of the first inspection position and the second inspection position and performs inspection on the multiple cut products; then the second conveying mechanism conveys multiple cut products to the other of the first inspection position and the second inspection position and performs inspection on the multiple cut products; and then the first conveying mechanism receives and holds the multiple cut products from the second conveying mechanism, and then the first conveying mechanism moves to the loading position and places the multiple cut products on the loading table.

[0063] [Supplementary Note 5] The cutting device according to any one of Supplementary Notes 1 to 4, wherein the second transport mechanism is configured to be able to reverse the orientation of the plurality of cut products while holding the plurality of cut products.

[0064] According to the configuration described in Appendix 5 above, for example, when carrying out an inspection, it becomes easier to switch between the first and second surfaces of the cut product to be inspected, and when placing the cut product, it becomes easier to set which of the first and second surfaces of the cut product should face up or down.

[0065] [Supplementary Note 6] A method for manufacturing cut products using the cutting device according to any one of Supplementary Notes 1 to 5, comprising: a step of cutting the object to be cut held on the processing table to separate it into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the first conveying mechanism has placed the plurality of cut products at the second inspection position; a step of transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the second conveying mechanism has placed the plurality of cut products at the first inspection position.

[0066] According to the configuration described in Appendix 6 above, each of the first conveying mechanism and the second conveying mechanism is configured to be capable of transporting multiple cut products to both the first inspection position and the second inspection position, making it possible to inspect the second surface before the first surface.This makes it possible to perform cutting and inspection with higher productivity than, for example, when the first conveying mechanism is configured to be capable of transporting multiple cut products only to the first inspection position and the second conveying mechanism is configured to be capable of transporting multiple cut products only to the second inspection position.

[0067] [Supplementary Note 7] A method for manufacturing cut products using the cutting device according to any one of Supplementary Notes 1 to 5, comprising: a step of cutting the object to be cut held on the processing table to separate it into a plurality of cut products; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the first conveying mechanism has placed the plurality of cut products at the first inspection position; a step of transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the second conveying mechanism has placed the plurality of cut products at the second inspection position.

[0068] According to the configuration described in Appendix 7 above, each of the first conveying mechanism and the second conveying mechanism is configured to be capable of transporting multiple cut products to both the first inspection position and the second inspection position, making it possible to inspect the first surface before the second surface, and cutting and inspection can be performed with higher productivity than, for example, when the first conveying mechanism is configured to be capable of transporting multiple cut products only to the first inspection position and the second conveying mechanism is configured to be capable of transporting multiple cut products only to the second inspection position.

[0069] [Supplementary Note 8] A method for manufacturing cut products using the cutting device described in Supplementary Note 3 or 4, comprising: a step of cutting the object to be cut held on the processing table to separate it into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the first conveying mechanism places the plurality of cut products at the second inspection position; a step of transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the second conveying mechanism places the plurality of cut products at the first inspection position; a step of transferring the plurality of cut products from the second conveying mechanism to the first conveying mechanism; and a step of the first conveying mechanism placing the plurality of cut products on the placement table.

[0070] According to the configuration described in Supplementary Note 8, for example, the posture of the cut products can be changed from a posture for inspecting the second side to a posture for inspecting the first side by transferring the cut products from the first transport mechanism to the second transport mechanism. Furthermore, by transferring the cut products from the second transport mechanism to the first transport mechanism, it is possible to change the posture from a posture for inspecting the first side to a posture suitable for the first transport mechanism to place the cut products on the placement table. Furthermore, it is possible to select the state of the cut products (whether the first side or the second side faces down) when storing the cut products in the non-defective product tray 15a or the defective product tray 15b.

[0071] Although the embodiments of the present disclosure have been described above, the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the scope of the claims, and it is intended to include all modifications within the meaning and scope of the claims.

[0072] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5M, 5N Processing table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Cutting mechanism, 6a Blade, 6b Second position confirmation camera, 7 First conveying mechanism, 7a, 11a Main body, 7b, 11b Moving axis, 8 First inspection mechanism, 9 Second inspection mechanism, 10 Second cleaner, 10a Cleaning nozzle, 10b Drying nozzle, 11 Second conveying mechanism, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement table, 15 Extraction unit, 15a Tray for good products, 15b Tray for defective products, 16 First lighting, 17 Second lighting, 20 Monitor, 50 Computer, A1 Cutting module, B1 Inspection and storage module, F1 Mold surface (first surface), F2 Lead surface (second surface), M1 magazine, P1 cutting object, Q1 first inspection position, Q2 second inspection position, S1 cut product, T1 pick-up position, U1 receiving position, U2 placing position.

Claims

1. A cutting device comprising: a processing table that holds an object to be cut; a cutting mechanism that cuts the object held on the processing table to separate it into a plurality of cut products; a first transport mechanism that holds and transports the plurality of cut products; a second transport mechanism that holds and transports the plurality of cut products; a first inspection mechanism that inspects first sides of the plurality of cut products while the plurality of cut products are arranged at a first inspection position; and a second inspection mechanism that inspects second sides of the plurality of cut products while the plurality of cut products are arranged at a second inspection position, wherein the first transport mechanism is configured to be able to transport the plurality of cut products to both the first inspection position and the second inspection position, and the second transport mechanism is also configured to be able to transport the plurality of cut products to both the first inspection position and the second inspection position.

2. A cutting device as described in claim 1, further comprising a loading table on which a plurality of the cut products can be placed, and the second transport mechanism is configured to be movable between a receiving position where it receives and holds the plurality of cut products held by the first transport mechanism from the first transport mechanism, and a loading position where it places the plurality of cut products on the loading table.

3. The cutting device according to claim 2, wherein the first transport mechanism is configured to be movable between a pick-up position where it picks up and holds a plurality of the cut pieces on the processing table, and a placement position where it places a plurality of the cut pieces on the placement table.

4. The cutting device described in claim 3, wherein the first conveying mechanism receives and holds the plurality of cut products held by the second conveying mechanism, and the first conveying mechanism moves together with the plurality of cut products to a position opposite the placement table and places the plurality of cut products on the placement table.

5. A cutting device according to any one of claims 1 to 4, wherein the second transport mechanism is configured to be able to reverse the orientation of the plurality of cut pieces while holding the plurality of cut pieces.

6. A method for manufacturing cut products using the cutting device according to any one of claims 1 to 5, comprising: a step of cutting the object to be cut held on the processing table to separate it into a plurality of cut products; a step of inspecting the second sides of the plurality of cut products with the second inspection mechanism while the first transport mechanism has placed the plurality of cut products at the second inspection position; a step of transferring the plurality of cut products from the first transport mechanism to the second transport mechanism; and a step of inspecting the first sides of the plurality of cut products with the first inspection mechanism while the second transport mechanism has placed the plurality of cut products at the first inspection position.

7. A method for manufacturing cut products using the cutting device according to any one of claims 1 to 5, comprising the steps of: cutting the object to be cut held on the processing table to separate it into a plurality of cut products; inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the first transport mechanism places the plurality of cut products at the first inspection position; transferring the plurality of cut products from the first transport mechanism to the second transport mechanism; and inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the second transport mechanism places the plurality of cut products at the second inspection position.

8. A method for manufacturing cut products using the cutting device described in any one of claims 3 or 4, comprising the steps of: cutting the object to be cut held on the processing table to separate it into a plurality of cut products; inspecting the second sides of the plurality of cut products with the second inspection mechanism while the first conveying mechanism places the plurality of cut products at the second inspection position; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; inspecting the first sides of the plurality of cut products with the first inspection mechanism while the second conveying mechanism places the plurality of cut products at the first inspection position; transferring the plurality of cut products from the second conveying mechanism to the first conveying mechanism; and placing the plurality of cut products on the placement table by the first conveying mechanism.

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