Poly(arylene sulfide) resin composition for plate-shaped electroconductive member, electroconductive member, and production method therefor

Abstract

Provided are a poly(arylene sulfide) resin composition for plate-shaped electroconductive members which has excellent high- and low-temperature impact resistance, an electroconductive member, and a production method therefor. The poly(arylene sulfide) resin composition for plate-shaped electroconductive members comprises (A) a poly(arylene sulfide) resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound, wherein the poly(arylene sulfide) resin (A) has a crystallization temperature (Tc) during cooling of 215°C or higher, the fibrous inorganic filler (B) includes a fibrous inorganic filler (b1) having an aspect ratio of 3.0 or higher, the content of the fibrous inorganic filler (b1) is 50-100 mass% in the fibrous inorganic filler (B), and the content of the fibrous inorganic filler (B) and the content of the alkoxysilane compound (C) are 55-250 parts by mass and 0.3-10 parts by mass, respectively, per 100 parts by mass of the poly(arylene sulfide) resin (A).

Description

Polyarylene sulfide resin composition for plate-shaped conductive member, conductive member, and method for producing the same

[0001] The present disclosure relates to a polyarylene sulfide resin composition for a plate-shaped conductive member, a conductive member, and a method for producing the same.

[0002] Plate-shaped conductive members such as bus bars are often used in components that carry large currents, such as inverter current sensors for automotive parts, because they can efficiently supply power. Such plate-shaped conductive members often have a structure in which a resin insulating layer is provided on the surface of a conductive substrate such as a metal. Because the temperature-dependent expansion and contraction rates (so-called linear expansion coefficients) of the conductive substrate such as a metal and the resin are extremely different, the plate-shaped conductive member may crack or break when used in an environment with large temperature fluctuations, such as in automotive parts. Therefore, it is desirable to use a resin that has excellent high- and low-temperature impact resistance when combined with a metal or the like as the resin constituting the insulating layer, so that the plate-shaped conductive member can maintain reliability and withstand temperature changes even when used in an environment with large temperature fluctuations. Patent Document 1 describes an insert-molded product using a polyarylene sulfide resin with improved high- and low-temperature impact resistance.

[0003] Japanese Patent Application Laid-Open No. 2005-161693

[0004] An object of the present disclosure is to provide a polyarylene sulfide resin composition for a plate-shaped conductive member that has excellent high- and low-temperature impact resistance, a conductive member, and a method for producing the same.

[0005] The present disclosure includes the following aspects: [1] A polyarylene sulfide resin composition for a plate-shaped conductive member, comprising: (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; and (C) an alkoxysilane compound; wherein the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, where the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a difference diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher; and the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the (B) fibrous inorganic filler. a content of the fibrous inorganic filler (B) being 55 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A); and a content of the alkoxysilane compound (C) being 0.3 to 10 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A).[2] A plate-shaped conductive member comprising at least a plate-shaped conductive substrate and an insulating layer covering at least a part of the plate-shaped conductive substrate, wherein the insulating layer comprises a polyarylene sulfide resin composition, and the polyarylene sulfide resin composition comprises: (A) a polyarylene sulfide resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound, wherein the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, and the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min, and the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher, a plate-shaped conductive member, wherein the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B); the content of the fibrous inorganic filler (B) is 55 to 250 mass parts per 100 mass parts of the polyarylene sulfide resin (A); and the content of the alkoxysilane compound (C) is 0.3 to 10 mass parts per 100 mass parts of the polyarylene sulfide resin (A).

[0006] According to the present disclosure, it is possible to provide a polyarylene sulfide resin composition for a plate-shaped conductive member, which has excellent high- and low-temperature impact resistance, a conductive member, and a method for producing the same.

[0007] An embodiment of the present disclosure will be described in detail below. However, the scope of the present disclosure is not limited to the embodiment described herein, and various modifications can be made without departing from the spirit of the present disclosure. Each aspect disclosed in this specification can be combined with any other feature disclosed in this specification. Furthermore, when multiple upper and lower limit values ​​are described for a specific parameter, any of these upper and lower limit values ​​can be combined to form a suitable numerical range. Furthermore, the lower and / or upper limit values ​​of a numerical range described in this disclosure are numerical values ​​within that numerical range and may be replaced with numerical values ​​shown in the examples. The expression "X to Y" indicating a numerical range means "X or more and Y or less." If a specific description described for one embodiment also applies to other embodiments, that description may be omitted in other embodiments.

[0008] [Polyarylene sulfide resin composition] The polyarylene sulfide resin composition (hereinafter also simply referred to as "resin composition") according to the present disclosure is a polyarylene sulfide resin composition for plate-shaped conductive members, and contains (A) a polyarylene sulfide resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound. The "polyarylene sulfide resin composition" refers to a resin composition containing a polyarylene sulfide resin. The term "for plate-shaped conductive members" refers to a resin composition used to manufacture plate-shaped conductive members. The term "plate-shaped conductive member" refers to a conductive member that is at least partially or entirely plate-shaped, and the specific shape is selected depending on the application. The shape of the main surface of the plate-shaped conductive member is not particularly limited, and examples thereof include polygonal shapes (e.g., rectangular), circular shapes, and elliptical shapes. The cross-sectional shape of the plate-shaped conductive substrate (the shape of the surface perpendicular to the main surface) is also not particularly limited, and examples thereof include polygonal shapes (e.g., rectangular), circular shapes, and elliptical shapes. When the thickness of the plate-shaped conductive substrate is large (for example, when the thickness is equal to or greater than half the width in a plan view), the shape of the plate-shaped conductive member can also be called columnar. When the columnar shape has a small (thin) thickness and a long length, the shape of the plate-shaped conductive member can also be called rod-shaped. In other words, the term "plate-shaped conductive member" also includes shapes such as "columnar" and "rod-shaped." The plate-shaped conductive member may have a shape that combines multiple shapes described above.

[0009] <(A) Polyarylene sulfide resin> The resin composition contains (A) polyarylene sulfide resin as a resin component. The content of (A) polyarylene sulfide resin in the resin component is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, still more preferably 98% by mass or more, and particularly preferably 99.9% by mass or more. In one embodiment, the resin component constituting the resin composition may be configured so as to consist solely of (A) polyarylene sulfide resin. The content of (A) polyarylene sulfide resin in the resin composition is preferably 30% by mass or more, more preferably 35% by mass or more. In one embodiment, the content of (A) polyarylene sulfide resin in the resin composition may be 30 to 70% by mass, 30 to 65% by mass, or 35 to 60% by mass.

[0010] (A) Polyarylene sulfide resin is a resin having a repeating unit represented by the following general formula (I): -(Ar-S)- (I) (where Ar represents an arylene group).

[0011] The arylene group is not particularly limited, and examples thereof include a p-phenylene group, an m-phenylene group, an o-phenylene group, a substituted phenylene group, a p,p'-diphenylene sulfone group, a p,p'-biphenylene group, a p,p'-diphenylene ether group, a p,p'-diphenylene carbonyl group, a naphthalene group, etc. The (A) polyarylene sulfide resin can be a homopolymer using the same repeating unit among the repeating units represented by the general formula (I) above, or a copolymer containing different repeating units depending on the application.

[0012] As the homopolymer, one having a p-phenylene group as the arylene group and a p-phenylene sulfide group as a repeating unit is preferred. This is because homopolymers having a p-phenylene sulfide group as a repeating unit have extremely high heat resistance and exhibit high strength, high rigidity, and high dimensional stability over a wide temperature range. By using such homopolymers, molded articles with excellent physical properties can be obtained.

[0013] As the copolymer, a combination of two or more different arylene sulfide groups among the above-mentioned arylene group-containing arylene sulfide groups can be used. Among these, a combination containing a p-phenylene sulfide group and an m-phenylene sulfide group is preferred from the viewpoint of obtaining a molded product with high physical properties such as heat resistance, moldability, and mechanical properties. A polymer containing 70 mol% or more of p-phenylene sulfide groups is more preferred, and a polymer containing 80 mol% or more is even more preferred. The polyarylene sulfide resin (A) having phenylene sulfide groups is a polyphenylene sulfide resin (PPS resin).

[0014] Generally, polyarylene sulfide resins are known to have molecular structures that are substantially linear and have no branched or crosslinked structures, and structures that have branches or crosslinks, depending on the production method, and either type may be used as the polyarylene sulfide resin (A).

[0015] (A) Polyarylene sulfide resin at 310°C and a shear rate of 1200 sec －１ From the viewpoint of improving moldability and toughness, the melt viscosity measured by is preferably 3 to 250 Pa·s, more preferably 5 to 150 Pa·s, and even more preferably 8 to 80 Pa·s.

[0016] The cooling crystallization temperature (Tc) of the (A) polyarylene sulfide resin is 215°C or higher, preferably greater than 215°C, more preferably 216°C or higher, even more preferably 217°C or higher, and particularly preferably 218°C or higher. Surprisingly, when the cooling crystallization temperature (Tc) of the (A) polyarylene sulfide resin is 215°C or higher, a synergistic effect can be sufficiently obtained by combining it with the (C) alkoxysilane compound described below, and the high and low temperature impact resistance of the conductive member used in combination with a plate-shaped conductive substrate such as a metal can be improved. The upper limit of the cooling crystallization temperature (Tc) of the (A) polyarylene sulfide resin is preferably 260°C or lower, more preferably 250°C or lower, and particularly preferably 240°C or lower, from the viewpoint of transferability during molding. In one embodiment, the temperature-decreasing crystallization temperature (Tc) of the polyarylene sulfide resin (A) may be 215 to 260° C., may be greater than 215° C. and not greater than 260° C., may be 216 to 250° C., or may be 216 to 240° C. In one embodiment, the temperature-decreasing crystallization temperature (Tc) of the polyarylene sulfide resin (A) may be 219° C., or may be within the upper or lower limit of the above-mentioned numerical range.

[0017] The temperature-decreasing crystallization temperature (Tc) is defined as the exothermic peak temperature associated with crystallization observed when the polyarylene sulfide resin (A) is heated to 340°C by a differential scanning calorimeter to melt it, and then cooled at a rate of 10°C / min.

[0018] Methods for adjusting the temperature-drop crystallization temperature (Tc) of the (A) polyarylene sulfide resin to 215°C or higher include adjusting the molecular weight of the (A) polyarylene sulfide resin and adjusting the presence or absence of a post-polymerization washing treatment and its conditions. A method using a post-polymerization washing treatment is preferable because it is simple in terms of process, but is not necessarily limited to this method. When the molecular weight of the (A) polyarylene sulfide resin is low, the temperature-drop crystallization temperature (Tc) tends to be high. Therefore, when the temperature-drop crystallization temperature (Tc) is too low, the temperature-drop crystallization temperature (Tc) can be increased by blending a (A) polyarylene sulfide resin with a low molecular weight. Examples of methods using a washing treatment include washing the polymer after polymerization with an acidic aqueous solution of appropriate acidity. In this case, examples of acids used as the acidic aqueous solution include inorganic acids such as hydrochloric acid, sulfuric acid, and ammonium chloride; saturated fatty acids such as acetic acid, formic acid, propionic acid, butyric acid, valeric acid, and caproic acid; unsaturated fatty acids such as acrylic acid, crotonic acid, and oleic acid; aromatic carboxylic acids such as benzoic acid, phthalic acid, and salicylic acid; dicarboxylic acids such as oxalic acid, maleic acid, and fumaric acid; methanesulfonic acid and paratoluenesulfonic acid. Among these, the use of hydrochloric acid, acetic acid, and ammonium chloride tends to increase the temperature-lowering crystallization temperature (Tc) of the (A) polyarylene sulfide resin. Furthermore, regarding the conditions of the washing treatment, the temperature-lowering crystallization temperature (Tc) can be further increased by increasing the acid concentration of the acidic aqueous solution. Furthermore, before and after washing with the acidic aqueous solution, washing with an organic solvent such as acetone or water may be performed as needed.

[0019] The method for producing the polyarylene sulfide resin (A) is not particularly limited, and it can be produced by a conventionally known production method. For example, it can be produced by synthesizing a low-molecular-weight polyarylene sulfide resin and then polymerizing it at high temperature in the presence of a known polymerization aid to increase the molecular weight. It can also be produced by blending multiple types of polyarylene sulfide resins. In this case, it can also be produced by combining polyarylene sulfide resins with different melt viscosities. When combining polyarylene sulfide resins with different melt viscosities, it is preferable that the melt viscosity of the resulting resin be within the above range. It is also possible to combine two or more polyarylene sulfide resins with different cooling crystallization temperatures (Tc) within a range in which the cooling crystallization temperature (Tc) of the resulting resin is 215°C or higher.

[0020] Polyarylene sulfide resins produced by a general polymerization method are usually washed several times with an organic solvent such as water or acetone to remove by-product impurities, etc. As described above, in one embodiment, the polyarylene sulfide resin (A) may then be further washed with acetic acid, ammonium chloride, etc.

[0021] <(B) Fibrous Inorganic Filler> The resin composition contains (B) a fibrous inorganic filler. By including (B) the fibrous inorganic filler in the resin composition, it is possible to increase the mechanical strength, and by including the following fibrous inorganic filler (b1), it is possible to increase the high and low temperature impact resistance of a conductive member used in combination with a plate-like conductive substrate such as a metal.

[0022] (Fiberous inorganic filler (b1)) The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) (hereinafter simply referred to as "fibrous inorganic filler (b1)") having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more. By containing the fibrous inorganic filler (b1) in the (B) fibrous inorganic filler in the resin composition, the high-low temperature impact resistance of the plate-shaped conductive member used in combination with metals, etc. can be improved through a synergistic effect with the (C) alkoxysilane compound described below. In addition, the (B) fibrous inorganic filler can contain a fibrous inorganic filler other than the fibrous inorganic filler (b1). However, when the (B) fibrous inorganic filler contains a fibrous inorganic filler with a round cross section, conductive members having edges (corners) are prone to cracking at the edges due to sudden temperature changes. However, surprisingly, it has been found that by including a fibrous inorganic filler (b1) in the (B) fibrous inorganic filler, the resin composition can prevent edge cracking due to sudden temperature changes, even when the resin composition contains a fibrous inorganic filler with a round cross section. In addition, when the resin composition contains a fibrous inorganic filler with a round cross section in the (B) fibrous inorganic filler, it is difficult to obtain the effect of improving high and low temperature impact resistance by adding the (C) alkoxysilane compound described below. In fact, adding the (C) alkoxysilane compound may actually reduce high and low temperature impact resistance. However, surprisingly, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b1), the synergistic effect with the (C) alkoxysilane compound can improve the high and low temperature impact resistance of a plate-shaped conductive member used in combination with a metal or the like. Furthermore, even when the resin composition contains a fibrous inorganic filler with a round cross section, a resin composition with excellent high and low temperature impact resistance can be obtained.

[0023] The "major diameter of a cross section perpendicular to the longitudinal direction" is the longest linear distance in a cross section perpendicular to the longitudinal direction of the fiber, and the "minor diameter of a cross section perpendicular to the longitudinal direction" is the longest linear distance in a direction perpendicular to the major diameter of the cross section. The diameter difference ratio refers to the diameter difference ratio of the initial shape (shape before melt-kneading). The diameter difference ratio can be calculated using a scanning electron microscope and image processing software, and is the arithmetic average value measured for 10 (B) fibrous inorganic fillers. The diameter difference ratio can also be the manufacturer's value (a value published by the manufacturer in a catalog, etc.).

[0024] The diameter ratio of the fibrous inorganic filler (b1) is 3.0 or more, preferably 3.5 or more, and more preferably 3.8 or more. The upper limit of the diameter ratio is 10.0 or less, preferably 8.0 or less, and more preferably 6.0 or less. In one embodiment, the diameter ratio of the fibrous inorganic filler (B) may be 3.0 to 10.0, 3.5 to 8.0, or 3.8 to 6.0. In one embodiment, the diameter ratio of the fibrous inorganic filler (B) may be 4.0, or may be the upper or lower limit of the above-mentioned numerical range.

[0025] Examples of the fibrous inorganic filler (b1) include fibrous inorganic fillers whose cross-sectional shape perpendicular to the longitudinal direction of the fiber is oval, semicircular, cocoon-shaped (an oval shape with a portion of the longitudinal direction recessed inward), rectangular, or similar shapes.

[0026] The major axis of the cross section perpendicular to the longitudinal direction of the fibrous inorganic filler (b1) is preferably 10 to 40 μm, more preferably 20 to 30 μm. The minor axis of the cross section perpendicular to the longitudinal direction of the fibrous inorganic filler (b1) is preferably 1 to 20 μm, more preferably 3 to 10 μm. The major axis and minor axis of the cross section perpendicular to the longitudinal direction can both be calculated using a scanning electron microscope and image processing software, and are the arithmetic average values ​​measured for 10 pieces of (B) fibrous inorganic filler. In addition, the major axis and minor axis of the cross section perpendicular to the longitudinal direction can both be manufacturer values ​​(values ​​published by the manufacturer in a catalog, etc.)

[0027] From the viewpoint of further increasing the bending strength and impact strength of the molded article, the average fiber length of the fibrous inorganic filler (b1) is preferably 0.01 to 3.5 mm, more preferably 0.05 to 3.5 mm, even more preferably 0.1 to 3.5 mm, and particularly preferably 0.5 to 3 mm, as the average fiber length (cut length) before melt-kneading into the resin composition. The average fiber length can be calculated using a scanning electron microscope and image processing software, and is the arithmetic average value measured for 1,000 pieces of fibrous inorganic filler (B). The average fiber length can also be determined by the manufacturer (a value published by the manufacturer in a catalog, etc.).

[0028] The average fiber length of the fibrous inorganic filler (b1) in the molded article is preferably 50 to 1,000 μm, more preferably 100 to 900 μm, from the viewpoint of easily improving the high-low temperature impact resistance of the molded article. The average fiber length of the fibrous inorganic filler (b1) in the molded article can be calculated by heating the molded article at 600° C. for 3 to 5 hours, dispersing 3 mg of the incinerated residue in a 5% polyethylene glycol aqueous solution, stirring thoroughly, transferring 10 mL to a Petri dish, and using an image measuring device to calculate the arithmetic average value measured for 1,000 fibrous inorganic fillers (b1).

[0029] The cross-sectional area of ​​the fibrous inorganic filler (b1) is set to 1 × 10 in terms of ease of production. －５ ~1 x 10 －３ mm ２ It is preferable that the －４ ~5 x 10 －４ mm ２ The "cross-sectional area" can be calculated by multiplying the value obtained by dividing the longest linear distance of the cross section of the fibrous inorganic filler (b1) measured using a scanning electron microscope and image processing software by the longest linear distance and the shortest linear distance, respectively, by the value obtained by dividing the longest linear distance by 2 and the value obtained by dividing the shortest linear distance by 2, and then multiplying the result by the constant π. The cross-sectional area is the arithmetic average value measured for 10 pieces of fibrous inorganic filler (b1).

[0030] Examples of materials for the fibrous inorganic filler (b1) include mineral fibers such as glass fiber, carbon fiber, zinc oxide fiber, titanium oxide fiber, wollastonite, silica fiber, silica-alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, and potassium titanate fiber, as well as metal fibrous materials such as stainless steel fiber, aluminum fiber, titanium fiber, copper fiber, and brass fiber, and it is preferable to use one or more materials selected from these. Among these, it is more preferable to include glass fiber. Furthermore, hollow fibers can also be used as the fibrous inorganic filler (b1) for the purpose of reducing the specific gravity of the resin composition, etc.

[0031] The fibrous inorganic filler (b1) may be surface-treated with various commonly known surface treatment agents such as epoxy compounds, isocyanate compounds, titanate compounds, and fatty acids. The surface treatment can improve adhesion to the polyarylene sulfide resin (A). The surface treatment agent may be applied to the fibrous inorganic filler (B) in advance of material preparation to perform surface treatment or convergence treatment, or may be added simultaneously during material preparation.

[0032] The content of the fibrous inorganic filler (b1) in the total amount of the fibrous inorganic filler (B) is 50 to 100 mass% in the total amount (100 mass%) of the fibrous inorganic filler (B) from the viewpoint of obtaining excellent high and low temperature impact resistance by a synergistic effect with the alkoxysilane compound (C). In one embodiment, the content of the fibrous inorganic filler (b1) in the total amount of the fibrous inorganic filler (B) may be 80 to 100 mass%, 90 to 100 mass%, 95 to 100 mass%, 98 to 100 mass%, or 99 to 100 mass%. In one embodiment, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction described below, of less than 3.0, the content of the fibrous inorganic filler (b1) in the total amount of the (B) fibrous inorganic filler may be 50 to 80 mass%, 50 to 78 mass%, or 50 to 75 mass%.

[0033] In one embodiment, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction described below, of less than 3.0, the content ratio (b1 / b2) of the fibrous inorganic filler (b1) to the fibrous inorganic filler (b2) may be 1.0 to 4.0, or may be 1.0 to 3.0.

[0034] The content of the fibrous inorganic filler (b1) in the resin composition is preferably 15 to 70 mass%, more preferably 18 to 65 mass%, and even more preferably 20 to 60 mass%, based on the total amount (100 mass%) of the resin composition.

[0035] The content of the fibrous inorganic filler (b1) is preferably 25 to 180 parts by mass, more preferably 30 to 170 parts by mass, more preferably 30 to 160 parts by mass, and even more preferably 33 to 155 parts by mass, relative to 100 parts by mass of the (A) polyarylene sulfide resin, from the viewpoint of easily obtaining a synergistic effect by combination with the (C) alkoxysilane compound described below. In one embodiment, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction described below, of less than 3.0, the content of the fibrous inorganic filler (b1) is preferably 20 to 60 parts by mass, more preferably 25 to 55 parts by mass, more preferably 28 to 53 parts by mass, and even more preferably 33 to 51 parts by mass, relative to 100 parts by mass of the (A) polyarylene sulfide resin. In one embodiment, the content of the fibrous inorganic filler (b1) may be 33 parts by mass, 34 parts by mass, 51 parts by mass, 67 parts by mass, 101 parts by mass, or 152 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A), or may be within a range with these as upper or lower limits.

[0036] (Fiberous inorganic filler (b2)) From the viewpoint of easily increasing mechanical strength while suppressing costs, the (B) fibrous inorganic filler may further contain a fibrous inorganic filler (b2) (hereinafter also simply referred to as "fibrous inorganic filler (b2)") having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of less than 3.0. The diameter ratio of the fibrous inorganic filler (b2) may be less than 2.0, may be 1.5 or less, or may be 1.0. The diameter ratio is as described above. Examples of the fibrous inorganic filler (b2) include fibrous inorganic fillers having a round or square cross section perpendicular to the longitudinal direction of the fiber.

[0037] As mentioned above, when the (B) fibrous inorganic filler contains a fibrous inorganic filler having a round cross section, the conductive member having an edge (corner) is likely to crack at the edge due to a sudden temperature change, and when the (C) alkoxysilane compound is added, the high-temperature and low-temperature impact resistance may be reduced. However, in this embodiment, since the (B) fibrous inorganic filler contains the fibrous inorganic filler (b1), even when the cross section contains a fibrous inorganic filler having a round cross section, a resin composition having excellent high-temperature and low-temperature impact resistance can be obtained. That is, by containing the (B) fibrous inorganic filler (b1) and the fibrous inorganic filler (b2), it is possible to reduce costs and increase mechanical strength, and even when used in combination with a plate-shaped conductive substrate having an edge (corner), it is possible to increase high-temperature and low-temperature impact resistance.

[0038] The material of the fibrous inorganic filler (b2) can be exemplified by the same compounds as those of the fibrous inorganic filler (b1). The fibrous inorganic filler (b1) and the fibrous inorganic filler (b2) can be the same or different materials. The average fiber length and average fiber diameter of the fibrous inorganic filler (b2) are not limited. Like the fibrous inorganic filler (b1), the fibrous inorganic filler (b2) may be surface-treated with various surface treatment agents.

[0039] The content of the fibrous inorganic filler (b2) in the (B) fibrous inorganic filler is 50% by mass or less, preferably 0 to 50% by mass or less, and more preferably 0 to 35% by mass or less, based on the total amount (100% by mass) of the (B) fibrous inorganic filler, from the viewpoint of easily obtaining high and low temperature impact resistance due to the synergistic effect of the fibrous inorganic filler (b1) and the (C) alkoxysilane compound. In one embodiment, the content of the fibrous inorganic filler (b2) in the (B) fibrous inorganic filler may be 5 to 50% by mass or may be 10 to 30% by mass, based on the total amount (100% by mass) of the (B) fibrous inorganic filler.

[0040] The content of the fibrous inorganic filler (b2) in the resin composition is preferably 0 to 35 mass %, more preferably 0 to 30 mass %, based on the total amount (100 mass %) of the resin composition.

[0041] The content of the fibrous inorganic filler (b2) is preferably 0 to 40 parts by mass, more preferably 0 to 35 parts by mass, per 100 parts by mass of the polyarylene sulfide resin (A), and may be less than 20 parts by mass.

[0042] In one embodiment, from the viewpoint of easily increasing mechanical strength while suppressing costs, the content of the fibrous inorganic filler (b2) may be 1 part by mass or more, 0.5 parts by mass or more, or 0.1 parts by mass or more relative to 100 parts by mass of the polyarylene sulfide resin (A).

[0043] In another embodiment, from the viewpoint of reducing the content of the fibrous inorganic filler (b2) and more easily achieving the effect of improving high and low temperature impact resistance by blending the (C) alkoxysilane compound, the content of the fibrous inorganic filler (b2) may be less than 1 part by mass, less than 0.5 parts by mass, or less than 0.1 parts by mass per 100 parts by mass of the (A) polyarylene sulfide resin.

[0044] In one embodiment, the fibrous inorganic filler (B) may be composed solely of the fibrous inorganic filler (b1). In another embodiment, the fibrous inorganic filler (B) may be composed of the fibrous inorganic filler (b1) and the fibrous inorganic filler (b2).

[0045] (Other inorganic fillers) (B) The fibrous inorganic filler may contain other inorganic fillers other than the fibrous inorganic filler (b1) and the fibrous inorganic filler (b2), as necessary. Examples of other inorganic fillers include non-fibrous inorganic fillers (b3). By including the non-fibrous inorganic filler (b3), mechanical strength and flatness can be further improved.

[0046] Examples of the non-fibrous inorganic filler (b3) include granular inorganic fillers, plate-like inorganic fillers, and the like. Examples of granular inorganic fillers include carbon black, silica, quartz powder, glass beads, glass powder, talc (granular), silicates such as calcium silicate, aluminum silicate, and diatomaceous earth, metal oxides such as iron oxide, titanium oxide, zinc oxide, and alumina, metal carbonates such as calcium carbonate and magnesium carbonate, metal sulfates such as calcium sulfate and barium sulfate, silicon carbide, silicon nitride, boron nitride, and various metal powders, and may contain one or more selected from these. Examples of plate-like inorganic fillers include glass flakes, talc (platy), mica, kaolin, clay, alumina, and various metal foils, and may contain one or more selected from these. The average particle size (D50) of the non-fibrous inorganic filler is not limited and can be, for example, 0.1 to 100 μm.

[0047] The content of the non-fibrous inorganic filler (b3) is not limited, and is, for example, 50% by mass or less, preferably 0 to 50% by mass or less, and more preferably 0 to 40% by mass or less, based on the total amount (100% by mass) of the (B) fibrous inorganic filler. The content of the non-fibrous inorganic filler (b3) in the resin composition is preferably 0 to 35% by mass, more preferably 0 to 30% by mass, based on the total amount (100% by mass) of the resin composition. The content of the non-fibrous inorganic filler (b3) can be 0 to 40 parts by mass, or can also be 0 to 35 parts by mass, based on 100 parts by mass of the (A) polyarylene sulfide resin.

[0048] (Content of (B) fibrous inorganic filler) The content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, and from the viewpoint of more easily obtaining a synergistic effect by combined use of the fibrous inorganic filler (b1) and the (C) alkoxysilane compound, the content is preferably 58 to 230 parts by mass, more preferably 60 to 220 parts by mass, even more preferably 65 to 200 parts by mass, and particularly preferably 67 to 152 parts by mass.

[0049] The content of the fibrous inorganic filler (B) in the resin composition is preferably 15 to 70 mass %, more preferably 18 to 65 mass %, and even more preferably 20 to 60 mass %, based on the total amount (100 mass %) of the resin composition.

[0050] <(C) Alkoxysilane Compound> The resin composition contains (C) an alkoxysilane compound. By including the (C) alkoxysilane compound, a synergistic effect with the fibrous inorganic filler (b1) can be achieved, thereby improving the high- and low-temperature impact resistance of the plate-shaped conductive member used in combination with a metal or the like.

[0051] The alkoxysilane compound (C) preferably contains one or more alkoxysilane compounds having one or more groups selected from an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, and a mercapto group.

[0052] In one embodiment, the alkoxysilane compound (C) is preferably represented by the following formula (II): １ ｎ Si(OR ２ ) ４－ｎ (II) In formula (II), R １ is an alkyl group having 1 to 18 (preferably 1 to 10) carbon atoms and having an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, or a mercapto group, and R ２ is an alkyl group having 1 to 4 carbon atoms, and n is an integer of 1 to 3.

[0053] Examples of the (C) alkoxysilane compound include alkoxysilanes such as epoxyalkoxysilanes, aminoalkoxysilanes, vinylalkoxysilanes, (meth)acrylicalkoxysilanes, isocyanatealkoxysilanes, and mercaptoalkoxysilanes, and it is preferable to contain one or more of these. The number of carbon atoms in the alkoxy group is preferably 1 to 10, and particularly preferably 1 to 4. The (C) alkoxysilane compound can be one or more of these.

[0054] Examples of epoxyalkoxysilanes include γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ-glycidoxypropyltriethoxysilane.

[0055] Examples of aminoalkoxysilanes include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-diallylaminopropyltrimethoxysilane, and γ-diallylaminopropyltriethoxysilane.

[0056] Examples of vinylalkoxysilanes include vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltris(β-methoxyethoxy)silane.

[0057] Examples of (meth)acrylalkoxysilanes include γ-acryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, and γ-methacryloxypropylmethyldiethoxysilane.

[0058] Examples of the isocyanate alkoxysilane include γ-isocyanate propyl triethoxysilane and γ-isocyanate propyl trimethoxysilane.

[0059] Examples of mercaptoalkoxysilanes include γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane.

[0060] Among these, it is more preferable to include one or more selected from epoxyalkoxysilanes and aminoalkoxysilanes, and it is particularly preferable to include γ-aminopropyltriethoxysilane.

[0061] The content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass, preferably 0.3 to 8 parts by mass, more preferably 0.4 to 4.5 parts by mass, even more preferably 0.4 to 1.4 parts by mass, and particularly preferably 0.5 to 1.3 parts by mass, relative to 100 parts by mass of the (A) polyarylene sulfide resin. By setting the content of the (C) alkoxysilane compound to 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, a synergistic effect with the fibrous inorganic filler (b1) can be fully exerted, and excellent high and low temperature impact resistance can be achieved when combined with metals, etc. In one embodiment, the content of the (C) alkoxysilane compound may be 0.3 parts by mass, 0.7 parts by mass, 0.8 parts by mass, 1.0 parts by mass, 1.2 parts by mass, or 1.5 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, or may be within a range with these as upper or lower limits.

[0062] In one embodiment, the (B) fibrous inorganic filler may be surface-treated with a silane-based compound or the like, but the content of the (C) alkoxysilane compound does not include the content of the alkoxysilane compound derived from the surface treatment agent.

[0063] (Other Additives, etc.) The resin composition may contain known additives generally added to thermoplastic resins and thermosetting resins to impart desired properties according to the intended purpose, as long as the effects of the present invention are not impaired. Examples of additives include burr inhibitors, release agents, lubricants, plasticizers, flame retardants, colorants such as dyes and pigments, crystallization accelerators, crystal nucleating agents, various antioxidants, heat stabilizers, weather resistance stabilizers, and corrosion inhibitors. Examples of release agents include polyethylene wax, fatty acid esters, fatty acid amides, etc. Examples of crystal nucleating agents include boron nitride, talc, kaolin, carbon black, carbon nanotubes, etc. Examples of corrosion inhibitors include zinc oxide and zinc carbonate. The content of the above additives may be 5% by mass or less of the total resin composition.

[0064] In addition to the above components, the resin composition may also contain a small amount of other auxiliary thermoplastic resin components depending on the purpose. The other thermoplastic resin used here may be any resin stable at high temperatures. Examples include aromatic polyesters such as polyethylene terephthalate and polybutylene terephthalate, which are composed of aromatic dicarboxylic acids and diols or oxycarboxylic acids, polyamides, polycarbonates, ABS, polyphenylene oxide, polyalkyl acrylates, polysulfones, polyethersulfones, polyetherimides, polyether ketones, fluororesins, liquid crystal polymers, and cyclic olefin copolymers. Two or more of these thermoplastic resins may also be used in combination. The content of the other thermoplastic resin components in the resin components may be 20% by mass or less.

[0065] (Method for producing polyarylene sulfide resin composition) The method for producing the resin composition is not particularly limited, and the resin composition can be produced by melt-kneading the above-mentioned components by a known method. For example, any of a method in which the components are mixed and then kneaded and extruded in an extruder to prepare pellets, a method in which pellets with different compositions are first prepared, a predetermined amount of the pellets are mixed, and then molded to obtain a molded product of the desired composition, and a method in which one or more of the components are directly charged into a molding machine can be used.

[0066] (High and low temperature impact resistance) As an index of high and low temperature impact resistance, the resin composition is subjected to a cycle of insert injection molding of a test piece into an 8 mm × 23 mm × 40 mm insert metal so that the thickness of the resin portion is 1 mm, and then cooling at −40 ° C. for 0.5 hours, followed by heating at 140 ° C. for 0.5 hours. The number of cycles until cracks occur is preferably 100 or more, more preferably 120 or more, even more preferably 130 or more, still more preferably 140 or more, and particularly preferably 200 or more.

[0067] The resin composition was heated at 310°C and a shear rate of 1000 sec －１ The melt viscosity at 2000 kJ / s is preferably 600 Pa·s or less, more preferably 50 to 500 Pa·s, and even more preferably 100 to 400 Pa·s.

[0068] (Uses) The resin composition according to the present embodiment can provide a molded article having excellent high and low temperature impact resistance when used in combination with a metal, and therefore can be preferably used as a resin composition for producing a plate-shaped conductive member such as a bus bar (preferably for forming an insulating layer of a plate-shaped conductive member). In one embodiment, the present disclosure provides use of the above-mentioned polyarylene sulfide resin composition as an insulating layer of a plate-shaped conductive member.

[0069] [Conductive member] The conductive member according to the present disclosure includes at least a plate-shaped conductive substrate and an insulating layer covering at least a portion of the plate-shaped conductive substrate. This conductive member may be a plate-shaped conductive member that is at least partially or entirely plate-shaped. The "plate-shaped conductive member" is as described above.

[0070] <Plate-shaped conductive substrate> The term "plate-shaped conductive substrate" refers to a conductive substrate that is at least partially or entirely plate-shaped, and the detailed shape is selected depending on the application. The shape of the main surface of the plate-shaped conductive substrate is not particularly limited, and examples thereof include polygonal (e.g., rectangular), circular, and elliptical shapes. The cross-sectional shape of the plate-shaped conductive substrate (the surface shape perpendicular to the main surface) is also not particularly limited, and examples thereof include polygonal (e.g., rectangular), circular, and elliptical shapes. When the thickness of the plate-shaped conductive substrate is large (for example, when the thickness is 1 / 2 or more of the width in a planar view), the shape of the plate-shaped conductive substrate can also be called columnar. When the columnar shape has a small thickness (thin) and a long length, the shape of the plate-shaped conductive substrate can also be called rod-shaped. In other words, the term "plate-shaped conductive substrate" also includes shapes such as "columnar" and "rod-shaped". The plate-shaped conductive substrate may have a shape that combines multiple shapes described above.

[0071] In one embodiment, the thickness of the plate-shaped conductive substrate is preferably 0.1 to 50 mm, more preferably 30 mm or less, and even more preferably 1 to 25 mm. The thickness of the plate-shaped conductive substrate is an arithmetic mean value measured with a vernier caliper.

[0072] Examples of materials for the plate-shaped conductive substrate include metals and alloys, and for example, copper or copper alloys, aluminum or aluminum alloys, etc. are generally used.

[0073] <Insulating Layer> The insulating layer is formed so as to cover at least a portion of the plate-shaped conductive base material. The insulating layer may be formed on the entire conductive base material except for the contact portion, or may be formed only on the portion other than the contact portion.

[0074] The insulating layer contains the polyarylene sulfide resin composition described above. The polyarylene sulfide resin composition is as described above. Since the insulating layer contains the polyarylene sulfide resin composition described above, cracks and breakages are unlikely to occur even when there are large temperature changes in the environment in which the insulating layer is used, and a conductive member having excellent high- and low-temperature impact resistance can be obtained.

[0075] The thickness of the insulating layer is preferably 5 mm or less, more preferably 3 mm or less. The thickness of the insulating layer is an arithmetic mean value measured with a vernier caliper.

[0076] The insulating layer can be formed by a known method. For example, the polyarylene sulfide resin composition described below can be integrally molded onto the conductive substrate by injection molding, melt extrusion molding, compression molding, transfer molding, or the like.

[0077] In one embodiment, the dimensions of the plate-shaped conductive member are not particularly limited and are appropriately selected depending on the application, location of use, and the like.

[0078] In one embodiment, the plate-shaped conductive member may have one or more bent portions, or may have two or more bent portions. The bent portions may be bent so as to be along the same plane, or may be bent so as to rise from one plane at a predetermined angle. In one embodiment, the plate-shaped conductive member has one or more contact portions for electrical connection with other conductive members. The thickness of the contact portion is preferably 3 mm or less, and more preferably 2 mm or less.

[0079] The conductive member according to the present disclosure has excellent high- and low-temperature impact resistance, and can therefore be preferably used in environments with large temperature changes, for example, as a conductive member for automobile parts (e.g., a bus bar for automobile parts).

[0080] [Method for manufacturing conductive member] The method for manufacturing a conductive member according to the present disclosure includes forming an insulating layer containing a polyarylene sulfide resin composition on at least a part of the surface of a plate-shaped conductive substrate. The plate-shaped conductive substrate, the polyarylene sulfide resin composition, the insulating layer, and the method for forming the insulating layer are as described above.

[0081] A non-limiting list of exemplary embodiments and combinations of exemplary embodiments of the present disclosure are disclosed below. [1] A polyarylene sulfide resin composition for a plate-shaped conductive member, comprising: (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; and (C) an alkoxysilane compound; wherein the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, and the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a difference diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher; and the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the (B) fibrous inorganic filler. 1. A polyarylene sulfide resin composition according to claim 1, wherein the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, and the content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin. [2] The polyarylene sulfide resin composition according to claim 1, wherein the (B) fibrous inorganic filler further contains a fibrous inorganic filler (b2) having a difference-in-diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of less than 3.0, and the content of the fibrous inorganic filler (b2) is 50% by mass or less of the total amount of the (B) fibrous inorganic filler. [3] The polyarylene sulfide resin composition according to [1] or [2], wherein the alkoxysilane compound (C) comprises one or more alkoxysilane compounds having one or more selected from an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, and a mercapto group. [4] The polyarylene sulfide resin composition according to any one of [1] to [3], wherein the fibrous inorganic filler (b1) comprises glass fiber. [5] The polyarylene sulfide resin composition according to any one of [1] to [4], for forming an insulating layer of the plate-shaped conductive member.[6] The polyarylene sulfide resin composition according to any one of [1] to [5], which is for use in a bus bar. [7] A conductive member comprising at least a plate-shaped conductive substrate and an insulating layer covering at least a part of the plate-shaped conductive substrate, wherein the insulating layer comprises a polyarylene sulfide resin composition, and the polyarylene sulfide resin composition comprises: (A) a polyarylene sulfide resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound, wherein the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, and the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min, and the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher, A conductive member, wherein the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the (B) fibrous inorganic filler, the content of the (B) fibrous inorganic filler is 55 to 250 mass parts per 100 mass parts of the (A) polyarylene sulfide resin, and the content of the (C) alkoxysilane compound is 0.3 to 10 mass parts per 100 mass parts of the (A) polyarylene sulfide resin. [8] The conductive member according to [7], wherein the thickness of the plate-shaped conductive substrate is 3 mm or less. [9] The conductive member according to [7] or [8], which is a bus bar for an automobile part.

[10] A method for producing a plate-shaped conductive member, comprising forming an insulating layer containing a polyarylene sulfide resin composition on at least a part of the surface of a plate-shaped conductive substrate, wherein the polyarylene sulfide resin composition comprises: (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; and (C) an alkoxysilane compound; the temperature-decreasing crystallization temperature (Tc) of the (A) polyarylene sulfide resin is 215°C or higher, and the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; and the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a difference diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher. a content of the fibrous inorganic filler (b1) being 50 to 100 mass% of the total amount of the fibrous inorganic filler (B); a content of the fibrous inorganic filler (B) being 55 to 250 mass parts relative to 100 mass parts of the polyarylene sulfide resin (A); and a content of the alkoxysilane compound (C) being 0.3 to 10 mass parts relative to 100 mass parts of the polyarylene sulfide resin (A).

[11] Use of a polyarylene sulfide resin composition as an insulating layer of a plate-shaped conductive member, the polyarylene sulfide resin composition comprising: (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; and (C) an alkoxysilane compound; the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, where the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher; The content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the fibrous inorganic filler (B) is 55 to 250 mass parts per 100 mass parts of the polyarylene sulfide resin (A), and the content of the alkoxysilane compound (C) is 0.3 to 10 mass parts per 100 mass parts of the polyarylene sulfide resin (A).

[0082] The configurations and combinations thereof in each embodiment are merely examples, and additions, omissions, substitutions, and other modifications of the configurations are possible as appropriate within the scope that does not deviate from the gist of this disclosure.

[0083] The present disclosure will be described in more detail below with reference to examples, but interpretation of the present disclosure is not limited to these examples. [Examples 1 to 10, Comparative Examples 1 to 10] Using the materials shown below, a polyarylene sulfide resin, an inorganic filler, and an alkoxysilane compound were dry-blended in the compositions and content ratios shown in Tables 1 and 2. This was fed into a twin-screw extruder with a cylinder temperature of 320°C and melt-kneaded to obtain resin composition pellets of the examples and comparative examples.

[0084] (Polyarylene sulfide resin) PPS: polyphenylene sulfide resin, manufactured by Kureha Corporation, Fortron (registered trademark) KPS, melt viscosity 30 Pa·s (shear rate 1200 sec －１, 310°C), Tc: 219°C

[0085] The Tc of the PPS resin was measured as follows: Approximately 5 mg of the PPS resin was weighed, and using a PerkinElmer DSC-8500 differential scanning calorimeter, the temperature was increased at a rate of 10°C / min, held at 340°C for 5 minutes, and then decreased at a rate of 10°C / min, and the crystallization peak (exothermic peak) temperature was read from the resulting DSC chart to determine Tc.

[0086] The melt viscosity of the PPS resin was measured as follows: using a Capillograph manufactured by Toyo Seiki Seisakusho Co., Ltd., a flat die of 1 mmφ×20 mmL was used as a capillary, and the barrel temperature was 310° C. and the shear rate was 1200 sec －１ The melt viscosity was measured at 100°C.

[0087] (Inorganic fillers) GF1: Nippon Electric Glass Co., Ltd., flat glass fiber ESC03T-760-FGF, oval cross section, major axis 28 μm, minor axis 7 μm, major axis / minor axis ratio 4.0, average fiber length 3 mm GF2: Nippon Electric Glass Co., Ltd., chopped strand ECS 03 T-747H, approximately circular cross section, major axis / minor axis ratio 1.0, average fiber diameter 10 μm, average fiber length 3 mm GF3: Nippon Electric Glass Co., Ltd., chopped strand ECS 03T-747, approximately circular cross section, major axis / minor axis ratio 1.0, average fiber diameter 13 μm, average fiber length 3 mm GF4: Nippon Electric Glass Co., Ltd., chopped strand ECS 03T-747N, cross section is approximately circular, major axis / minor axis ratio is 1.0, average fiber diameter is 17 μm, average fiber length is 3 mm

[0088] (Alkoxysilane Compound) γ-aminopropyltriethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., KBE-903P

[0089] [Evaluation] (High- and Low-Temperature Impact Resistance: HS Test) The resin compositions obtained in the examples and comparative examples were used with a plate-shaped insert metal (8 mm x 23 mm x 40 mm) made of S35C as specified in JIS G4051:2005 Carbon Steel for Machine Structures. Insert injection molding was performed using a cylinder temperature of 320°C, a mold temperature of 150°C, an injection time of 40 seconds, and a cooling time of 60 seconds to produce an insert molded product with a resin thickness of 1 mm. This test specimen was a matchbox-shaped plate-shaped test specimen with corners. This test specimen was subjected to a thermal shock test using a thermal shock tester (manufactured by Espec Corporation) by repeatedly cooling at -40°C for 0.5 hours and then heating at 140°C for 0.5 hours. The molded product was observed every 20 cycles. The number of cycles at which cracks occurred in the molded product was evaluated as an index of high- and low-temperature impact resistance. The results are shown in Tables 1 and 2. When the number of cycles is 100 or more, the high and low temperature impact resistance is excellent, when it is 120 or more, the high and low temperature impact resistance is even better, when it is 130 or more, the high and low temperature impact resistance is even better, when it is 140 or more, the high and low temperature impact resistance is still better, and when it is 200 or more, the high and low temperature impact resistance is particularly excellent.

[0090]

[0091] As shown in Table 1, the resin compositions of Examples 1 to 10 all had 100 or more cycles in the HS resistance test, even when test pieces with corners that are prone to cracking due to temperature changes were used, and thus had excellent high- and low-temperature impact resistance.

[0092] The conductive member of this embodiment has excellent high and low temperature impact resistance when combined with a conductive member such as a metal, and therefore has industrial applicability as a conductive member in various fields, for example.

Claims

1. A polyarylene sulfide resin composition for a plate-shaped conductive member, comprising: (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; and (C) an alkoxysilane compound; wherein the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, and the temperature-decreasing crystallization temperature (Tc) is the exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a difference diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher; and the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the (B) fibrous inorganic filler. a content of the fibrous inorganic filler (B) being 55 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A); and a content of the alkoxysilane compound (C) being 0.3 to 10 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A).

2. The polyarylene sulfide resin composition according to claim 1, wherein the (B) fibrous inorganic filler further contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of less than 3.0, and the content of the fibrous inorganic filler (b2) is 50 mass% or less of the total amount of the (B) fibrous inorganic filler.

3. The polyarylene sulfide resin composition according to claim 1 or 2, wherein the alkoxysilane compound (C) comprises one or more alkoxysilane compounds having one or more groups selected from the group consisting of an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, and a mercapto group.

4. The polyarylene sulfide resin composition according to claim 1 or 2, wherein the fibrous inorganic filler (b1) comprises glass fiber.

5. The polyarylene sulfide resin composition according to claim 1 or 2, for forming an insulating layer of a plate-shaped conductive member.

6. The polyarylene sulfide resin composition according to claim 1 or 2, which is used for a bus bar.

7. A conductive member comprising at least a plate-shaped conductive substrate and an insulating layer covering at least a portion of the plate-shaped conductive substrate, wherein the insulating layer comprises a polyarylene sulfide resin composition, and the polyarylene sulfide resin composition comprises: (A) a polyarylene sulfide resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound, wherein the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, and the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C using a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min, and the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher, The conductive member has a content of the fibrous inorganic filler (b1) of 50 to 100 mass% based on the total amount of the fibrous inorganic filler (B), a content of the fibrous inorganic filler (B) of 55 to 250 mass parts relative to 100 mass parts of the polyarylene sulfide resin (A), and a content of the alkoxysilane compound (C) of 0.3 to 10 mass parts relative to 100 mass parts of the polyarylene sulfide resin (A).

8. The conductive member according to claim 7, wherein the thickness of the plate-shaped conductive substrate is 3 mm or less.

9. The conductive member according to claim 7 or 8, which is a bus bar for an automobile part.

10. A method for producing a conductive member, comprising forming an insulating layer containing a polyarylene sulfide resin composition on at least a portion of the surface of a plate-shaped conductive substrate, wherein the polyarylene sulfide resin composition comprises: (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; and (C) an alkoxysilane compound; the temperature-lowering crystallization temperature (Tc) of the (A) polyarylene sulfide resin is 215°C or higher, and the temperature-lowering crystallization temperature (Tc) is the exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C using a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; and the (B) fibrous inorganic filler comprises a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis in a cross section perpendicular to the longitudinal direction, of 3.0 or higher. a content of the fibrous inorganic filler (b1) being 50 to 100 mass% of the total amount of the fibrous inorganic filler (B); a content of the fibrous inorganic filler (B) being 55 to 250 mass parts relative to 100 mass parts of the polyarylene sulfide resin (A); and a content of the alkoxysilane compound (C) being 0.3 to 10 mass parts relative to 100 mass parts of the polyarylene sulfide resin (A).

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