Shower head for vapor deposition of metal-organic chemical

Abstract

The present invention relates to a shower head for vapor deposition of a metal-organic chemical, the shower head comprising: a spray unit connected to a gas supply line and provided with a plurality of spray lines so as to transfer gas individually; and fine holes, on one side of the spray unit, provided so as to spray gas onto an object to be processed, wherein the spray lines are wound, arrayed side by side.

Description

Showerhead for organometallic chemical vapor deposition

[0001] The present invention relates to a showerhead for organometallic chemical vapor deposition, and relates to a showerhead for organometallic chemical vapor deposition in which each component does not react with each other and is easy to manufacture.

[0002] A superconductor is a material that has zero electrical resistance below a critical temperature (Tc) and exhibits perfect diamagnetism, known as the Meissner effect.

[0003] The first generation of superconductivity was first discovered in 1911 when the electrical resistance of mercury became zero at a temperature of 4.2 K in liquid helium, and the second generation of superconductivity was discovered in 1986 when copper oxide superconductors were discovered.

[0004] Oxide superconductor (REBCO: RE is one or two rare earth elements (Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu)), or RE, Ba, Cu are individual oxide particles, or two or more of these elements are complex oxide particles.

[0005] In order to apply REBCO thin film superconductors to the power transmission field, a process that allows for long-term formation while maintaining a high critical current density (Jc) and has a low manufacturing cost must be applied. Therefore, various processes are being applied for the buffer layer and superconducting layer thin film.

[0006] The buffer layer is applied by sputtering and deposition, and the superconducting layer of the high-temperature superconductor wire can be manufactured by methods such as pulsed laser deposition (PLD), reactive co-evaporation (REC), metal organic chemical vapor deposition (MOCVD), and metal organic deposition (MOD).

[0007] Among them, metalorganic chemical vapor deposition (MOCVD) refers to a chemical vapor deposition method that uses a liquid-state organometallic compound raw material. Since this compound is incomplete and easily decomposed, it is vaporized and a gas phase reaction occurs and a chemical vapor deposition reaction occurs on the surface of a substrate (wire) to obtain a solid-state deposition layer.

[0008] This organic metal chemical vapor deposition method utilizes a deposition element for spraying vaporized compounds. Conventional deposition elements are composed of multiple plates, resulting in a complex structure to prevent individual compounds from reacting, and present manufacturing challenges.

[0009] Therefore, there is a need to improve this.

[0010] The background technology for the present invention is disclosed in Korean Patent Publication No. 10-1429553 (registered on August 6, 2014, title of the invention: Superconducting wire and method for forming superconducting wire).

[0011] The purpose of the present invention is to provide a showerhead for organometallic chemical vapor deposition that can uniformly spray an organometallic raw material onto a deposition portion of a processing target, can securely partition the components so that they do not react internally, and is easy to manufacture.

[0012] A showerhead for organic metal chemical vapor deposition according to the present invention comprises: a spraying part formed of a plurality of spraying lines so as to be respectively connected to a plurality of gas supply lines; and micro-holes formed on one side of the spraying part so as to spray gas onto a processing object; and the spraying lines can be arranged in a shape in which they are wound in parallel with each other.

[0013] The above-mentioned injection unit includes a fixing unit that fixes the injection line, and the fixing unit may include a base plate on which the injection line is fixed and a guide that prevents the injection line from being separated from the base plate.

[0014] The above injection unit may be formed by connecting injection lines formed as pipes through which gas is transported to each of the gas supply lines.

[0015] The cross-sectional shape of the pipe of the above injection line can be formed into a polygon or circle.

[0016] The above-mentioned injection unit may include a base plate; an injection plate spaced apart from the base plate so as to face the base plate; and a partition provided between the injection plate and the base plate to form a plurality of the injection lines.

[0017] The above injection unit can be formed to correspond to the shape of the processing portion of the processing object.

[0018] The above injection unit may include a cooling unit that exchanges heat with the injection line.

[0019] The above cooling unit may include a cooling line formed between the injection lines.

[0020] According to the showerhead for organometallic chemical vapor deposition according to the present invention, organometallic raw materials can be uniformly sprayed onto a deposition portion of a processing target, and each vaporized organometallic raw material is formed as an independent spray line to independently transport it, thereby fundamentally blocking each component from reacting internally.

[0021] The present invention can be manufactured with a simple structure in which the injection line forming the injection section is formed as an independent pipe and is bent and spirally wound, thereby facilitating manufacturing and reducing manufacturing costs.

[0022] The present invention can be achieved by combining a spray line forming a spray section with a spray plate having a partition wall, thereby facilitating manufacturing and reducing manufacturing costs.

[0023] The present invention is characterized in that the injection unit is formed in a shape corresponding to the processing portion of the object to be processed, so that the vaporized organic metal raw material can be uniformly injected onto the processing portion.

[0024] The present invention enables modularization of components and maintains rigidity by fixing an injection line composed of independent pipes to a fixing member, and prevents vibration and noise caused by steam pressure.

[0025] The present invention can prevent components from chemically reacting within the injection lines by preventing heat generation from occurring in the injection lines by providing cooling lines between the injection lines.

[0026] FIG. 1 is a perspective view schematically illustrating a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention.

[0027] FIG. 2 is an exploded perspective view schematically illustrating a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention.

[0028] Figure 3 is a cross-sectional view taken along line AA of Figure 1.

[0029] FIG. 4 is a plan view schematically illustrating a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention.

[0030] FIG. 5 is a cross-sectional view of a showerhead injection line for organic metal chemical vapor deposition according to one embodiment of the present invention.

[0031] FIG. 6 is a schematic drawing of a deposition apparatus to which a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention is applied.

[0032] FIG. 7 is a perspective view schematically illustrating a modified example of a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention.

[0033] FIG. 8 is an exploded perspective view schematically illustrating a modified example of a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention.

[0034] Fig. 9 is a BB cross-sectional view of Fig. 8.

[0035] Hereinafter, an embodiment of a showerhead for organic metal chemical vapor deposition according to the present invention will be described with reference to the attached drawings.

[0036] In this process, the thickness of lines and the sizes of components depicted in the drawings may be exaggerated for clarity and convenience. The terms described below are defined based on their functions in the present invention and may vary depending on the intent or custom of the user or operator. Therefore, the definitions of these terms should be based on the overall content of this specification.

[0037] In this specification, when it is said that a part is "connected (or connected)" to another part, this includes not only cases where it is "directly connected (or connected)" but also cases where it is "indirectly connected (or connected)" with another member in between. In this specification, when it is said that a part "includes (or comprises)" a certain component, this does not mean that other components are excluded, but rather that it may "include (or comprise)" other components, unless specifically stated otherwise.

[0038] Throughout this specification, the same reference numerals may refer to the same components. Even if the same or similar reference numerals are not mentioned or described in a specific drawing, they may be described based on other drawings. Even if a part is not indicated by a reference numeral in a specific drawing, that part may be described based on other drawings. The number, shape, size, and relative size differences of detailed components included in the drawings of this application are set for the convenience of understanding, and do not limit the embodiments and may be implemented in various forms.

[0039] FIG. 1 is a perspective view schematically illustrating a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention, FIG. 2 is an exploded perspective view schematically illustrating a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line AA of FIG. 1, FIG. 4 is a plan view schematically illustrating a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention, FIG. 5 is a cross-sectional view showing an injection line of a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention, FIG. 6 is a view schematically illustrating a deposition apparatus to which a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention is applied, FIG. 7 is a perspective view schematically illustrating a modified example of a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention, FIG. 8 is an exploded perspective view schematically illustrating a modified example of a showerhead for organometallic chemical vapor deposition according to an embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along line BB of FIG. 8.

[0040] First, referring to Fig. 6, the deposition process is performed in a vacuum-connected chamber in a reel-to-reel format in the deposition device (1).

[0041] The deposition device (1) may include a deposition chamber (10), a guide portion (20), and a deposition portion (30). The deposition chamber (10) is maintained in a vacuum state by a vacuum pump.

[0042] The guide unit (20) is provided in the deposition chamber (10) to guide the movement of the workpiece supplied and to heat the workpiece.

[0043] Here, in this embodiment, the object to be processed includes a wire having a buffer layer formed thereon, and in the following, the object to be processed is described as a wire for convenience of explanation.

[0044] The guide section (20) is formed with a length corresponding to the width of the wire, and a heating unit (25) is provided inside.

[0045] As illustrated in (a) of Fig. 6, the guide portion (20) may be formed as a guide drum. As illustrated in (b) of Fig. 6, the guide portion (20) may be formed as a conveyor. A heating unit (25) is provided inside each guide portion (20), and can heat the wire conveyed by the guide portion (20) to a temperature suitable for depositing a superconducting layer.

[0046] The deposition unit (30) may include a shower head (100) and an organic metal raw material supply unit (32).

[0047] Referring to FIGS. 1 to 6, a showerhead (100) for organic metal chemical vapor deposition according to one embodiment of the present invention may include a spraying unit (110) and micro-holes (115).

[0048] The injection unit (110) can be formed of a plurality of injection lines (112) connected to the gas supply line (35) so that gas can be transported independently.

[0049] In more detail, as shown in FIGS. 1 to 3, the injection unit (110) can be formed by connecting the gas supply line (35) to the injection line (112), which is formed as a pipe through which gas is transported.

[0050] The injection lines (112) are arranged in a shape that is wound in parallel with each other. As shown in Fig. 4, the injection lines (112) can be wound in a square spiral shape or can be wound in a circular spiral shape.

[0051] In each injection line (112) made of a pipe, micro holes (115) are formed at regular intervals.

[0052] The gas supply line (35) is connected to the organic metal raw material supply unit (32), and the organic metal raw material supply unit (32) includes a vaporization device (33). The organic metal raw material can be vaporized by the vaporization device (33) and sprayed toward the heated wire side through the micro-holes (115) of the spray line (112).

[0053] According to this embodiment, the organometallic material of the organometallic raw material supply unit (32) is composed of a ternary system of Y (Yttrium), Ba (Barium), and Cu (Copper), and the injection line (112) of the injection unit (110) is formed in three parts so that each component is transported independently.

[0054] Accordingly, each component can be independently transported to the injection line (112) and sprayed through the microhole (115) to be deposited on the surface of the wire.

[0055] In this embodiment, the injection line (112) is illustrated as a ternary system consisting of three, but it is not limited thereto, and can be designed as a 2-component or more injection line (112).

[0056] The injection unit (110) may include a fixing unit (120) that fixes the injection line (112).

[0057] The fixed part (120) may include a base plate (122) on which the injection line (112) is mounted and a guide (124) that prevents the injection line (112) from being separated from the base plate (122).

[0058] A connecting pipe is formed on the base plate (122) so that three gas supply lines (35) are drawn out to the outside and connected to the organic metal raw material supply unit (32), and each injection line (112) is connected to the gas supply line (35) and is installed on the base plate (122).

[0059] At this time, each injection line (112) may be mutually coupled to form an injection unit (110) and be installed, or the injection lines (112) may be individually installed to form an injection unit (110). The guide (124) may be coupled to the edge of the base plate (122) and may fix the injection unit (110) installed on the upper portion of the base plate (122).

[0060] The injection unit (110) may include a cooling unit (130) that exchanges heat with the injection line (112). The cooling unit (130) may include a cooling line (132) formed between the injection lines (112). The cooling line (132) is formed as a pipe in the same manner as the injection line (112), and may be arranged in a shape in which the cooling line (132) is wound in parallel with each other between the injection lines (112).

[0061] That is, a cooling line (132) is provided between the injection lines (112) and can be wound in a square or circular spiral shape.

[0062] The cooling line (132) can prevent heat generated in the injection line (112) and prevent chemical reactions between components from occurring inside the injection line (112).

[0063] In this embodiment, the cooling unit (130) is depicted as being formed of cooling lines (132) and arranged between injection lines (112) and wound in a spiral shape, but is not limited thereto, and various design changes are possible, such as being provided on a separate base plate (122) and performing heat exchange.

[0064] Referring to Fig. 6, it is preferable that the injection part (110) be formed to correspond to the shape of the processing part of the wire.

[0065] In the case where the guide part (20) is formed as a guide drum as in (a) of Fig. 6, the wire rod being transported thereby has the same curvature as the outer surface of the guide drum, and the spray part (110) is formed to have a curvature corresponding to the outer surface of the guide (124) drum, so that gas can be evenly sprayed onto the processing area of ​​the wire rod. In the case where the guide part (20) is formed as a conveyor as in (b) of Fig. 6, the spray part (110) is formed in a flat shape so that the vaporized organic metal raw material can be sprayed.

[0066] Referring to FIGS. 7 to 9, as a modified example of the injection unit (210), the injection unit (210) may include injection plates (212) that are spaced apart from each other and face each other, and a partition wall (214) that is provided between the injection plates (212) to form a plurality of injection lines (112).

[0067] That is, the injection plate (212) is composed of a lower injection plate (212) and an upper injection plate (212), and a partition wall (214) is formed on the lower injection plate (212), so that an injection line (112) can be formed by combining the upper injection plate (212) and the lower injection plate (212). At this time, a joining groove (215) is formed on the inner surface of the upper injection plate (212) into which the upper end of the partition wall (214) is fitted.

[0068] A cooling line (132) can be formed between the injection lines (112) by a partition wall (214).

[0069] Hereinafter, the operation and effect of a showerhead for organic metal chemical vapor deposition according to one embodiment of the present invention will be described.

[0070] First, the manufacturing process of superconducting wire is carried out in a reel-to-reel format and is carried out in a vacuum chamber.

[0071] The showerhead (100) for organometallic chemical vapor deposition according to the present invention can independently transport and spray the ternary system of organometallic elements Y (Yttrium), Ba (Barium), and Cu (Copper) in the process of depositing a superconducting layer, and has the effect of being easy to manufacture due to its simple structure.

[0072] To explain this in detail, the wire moved by the guide unit (20) is heated to a temperature suitable for deposition by the heating unit (25), and the spray unit (110) can spray vaporized organic metal raw materials onto the wire heated by the heating unit (25) through a plurality of micro-holes (115).

[0073] Therefore, a superconducting layer can be formed by forming a film of Y (Yttrium), Ba (Barium), and Cu (Copper) components on the surface of the wire by spraying vaporized gas of an organometallic raw material.

[0074] The injection unit (110) is formed by injection lines (112) each made of pipes, and each vaporized organic metal raw material is transported through each independent injection line (112), so the possibility of mutual contact within the injection unit (110) can be fundamentally eliminated, thereby preventing the components from reacting with each other.

[0075] The injection line (112) composed of each pipe is arranged in a bent manner so as to be wound in parallel, thereby facilitating its manufacture, and can form a structure capable of uniformly injecting vaporized organic metal raw materials onto the surface of the wire.

[0076] At this time, each injection line (112) may be formed in various shapes, such as being wound in a square spiral as shown in (a) of FIG. 4, or being wound in a circular spiral as shown in (b) of FIG. 4.

[0077] As illustrated in Fig. 5, each injection line (112) can be formed into various cross-sectional shapes, such as a square cross-section or a circular cross-section.

[0078] As illustrated in Fig. 6, the injection unit (110) is formed in a shape corresponding to the processing area of ​​the wire, and has the effect of uniformly spraying the vaporized organic metal raw material onto the processing area.

[0079] The injection line (112) can be modularized into a single component by being fixed by a fixing member (120), and can maintain rigidity. As illustrated in FIG. 2, each injection line (112) is secured to a base plate (122) and can be firmly fixed to an accurate position by a guide (124) formed at the edge of the base plate (122). Therefore, vibration and noise that may occur due to vapor pressure can be prevented.

[0080] A cooling line (132) is provided between the injection lines (112) each consisting of pipes to prevent heat generated in the injection lines (112) and to prevent chemical reactions between components inside the injection lines (112).

[0081] Referring to FIGS. 7 to 9, as a modified example of the injection unit (210), the injection unit (210) may be formed with a partition wall (214) that independently divides the space formed by the facing injection plates (212).

[0082] That is, since the partition wall (214) formed on the lower injection plate (212) is fitted into the upper injection plate (212), an injection line (112) through which each vaporized organic metal raw material can be transported can be formed, thereby facilitating its manufacture.

[0083] According to the present invention described above, the organic metal raw material can be uniformly sprayed onto the deposition portion of the processing target, and each vaporized organic metal raw material is formed as an independent spray line to independently transport it, thereby fundamentally blocking each component from reacting internally, and the spray line can be manufactured by a simple structure through bending of an independent pipe or combining spray plates, so that manufacturing is easy and manufacturing costs can be reduced.

[0084] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

[0085] Therefore, the technical protection scope of the present invention should be defined by the following patent claims.

Claims

1. An injection unit formed of a plurality of injection lines so as to be connected to a plurality of gas supply lines; It includes a micro hole formed on one side of the above injection unit so that gas is sprayed onto the processing object; A showerhead for organic metal chemical vapor deposition, characterized in that the above injection lines are arranged in a shape that is wound in parallel with each other.

2. In paragraph 1, The above injection unit includes a fixing unit that fixes the injection line; The above fixed part is a base plate on which the injection line is mounted; and A showerhead for organic metal chemical vapor deposition, characterized in that it includes a guide that prevents the spray line from being separated from the base plate.

3. In paragraph 1, A showerhead for organic metal chemical vapor deposition, characterized in that the above-mentioned injection unit is formed by mutually connecting the injection lines formed as pipes through which gas is transported, each connected to the above-mentioned gas supply line.

4. In paragraph 3, A showerhead for organic metal chemical vapor deposition, characterized in that the cross-sectional shape of the pipe of the above injection line is formed into a polygon or circle.

5. In paragraph 1, The above injection unit is a base plate; A spray plate spaced apart from the base plate; and A showerhead for organic metal chemical vapor deposition, characterized in that it includes a partition wall provided between the injection plate and the base plate to form a plurality of the injection lines.

6. In paragraph 1, A showerhead for organic metal chemical vapor deposition, characterized in that the above-mentioned injection unit is formed to correspond to the shape of the processing portion of the processing target.

7. In paragraph 1, A showerhead for organic metal chemical vapor deposition, characterized in that the above-mentioned injection unit includes a cooling unit that exchanges heat with the above-mentioned injection line.

8. In paragraph 7, A showerhead for organic metal chemical vapor deposition, characterized in that the cooling unit includes a cooling line formed between the injection lines.

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