BGA test socket

Abstract

Disclosed in an exemplary embodiment of the present invention is a BGA test socket for implementing impedance matching, comprising a socket body having contacts, including ground pins and signal pins, and a plurality of holes into which the contacts are inserted so as to be elastically supported, wherein the socket body includes: first holes into which the ground pins are inserted; second holes into which the signal pins are inserted; and via holes formed between the contacts so as to correspond to a pin map of the test socket, the inner surface of each via hole has a first shielding plating layer formed of a conductive member, and the top and bottom surfaces of the socket body have second shielding plating layers, which are formed of a conductive member and connect the first shielding plating layers.

Description

BGA test socket

[0001] The present invention relates to a test socket used for testing semiconductor devices.

[0002] Semiconductor devices are densely packed with microscopic electronic circuits, and during the manufacturing process, each electronic circuit undergoes a testing process to determine whether it is functioning properly. This testing process utilizes a testing device that applies test signals to the terminals of the semiconductor device being tested. The testing device is not directly connected to the terminals of the semiconductor device being tested, but rather through a test socket. The test socket consists of probes that connect each terminal of the semiconductor device to a terminal on the testing device's test PCB, and a socket that supports the probes.

[0003] The probes and sockets that make up these test sockets come in a variety of shapes, taking into account the operating frequency of the semiconductor device, the type of terminal (BGA, LGA, etc.), and the pitch between terminals.

[0004] Fig. 1 is a cross-sectional configuration diagram of a semiconductor element test socket device according to the prior art, and the socket device includes a plurality of probes (1) and a socket body (2)(3) that supports the plurality of probes (1).

[0005] The socket body (2)(3) is for electrically insulating a plurality of probes (1), and is composed of an upper body (2) that supports the upper end of the probe (1), and a lower body (3) that supports the lower end of the probe (2). The probe (1) is supported by the upper and lower ends of the socket body (2)(3), has its own elasticity in the longitudinal direction (vertical direction), and electrically connects the terminal of the semiconductor element mounted on the upper end of the socket device with the terminal (pad) of the test PCB on the lower end.

[0006] Meanwhile, as semiconductor devices develop and become faster and the pitch between terminals becomes smaller, crosstalk between probes (1) becomes a problem, and therefore noise shielding between probes becomes a very important factor.

[0007] To solve these problems, various technological developments are being made on test socket devices. For example, a coaxial type probe is adopted by plating the inner surface of the hole where the probe is received in the socket body of the insulator, or the socket body is manufactured from a metal body to shield noise between the probes.

[0008] However, these conventional socket devices have many difficulties in noise shielding between probes due to miniaturization and high-speed semiconductor devices, rapid increase in terminals, and fine pitch of terminals, and the manufacturing process becomes complex and difficult.

[0009] Accordingly, the present invention aims to provide a BGA test socket for implementing impedance matching to solve the above-described problem.

[0010] One of the various tasks of the present invention is to provide a test socket for implementing impedance matching to maximize power transmission and prevent signal distortion when testing devices optimized for specific impedances according to customer needs.

[0011] One of the various tasks of the present invention is to provide a test socket with improved noise shielding effect between fine pitches corresponding to a pin map.

[0012] One of the various tasks of the present invention is to provide a test socket having contacts having the same shape but different physical resistance values ​​due to differences in diameter in order to increase cost-effectiveness in manufacturing the test socket.

[0013] Various embodiments for solving the problem of the present invention disclose a BGA test socket for implementing impedance matching, which comprises a contact including a ground pin and a signal pin, and a socket body in which the contact is inserted and elastically supported and in which a plurality of holes are formed, wherein the plurality of holes include a first hole in which the ground pin is inserted, a second hole in which the signal pin is inserted, and a via hole formed between the contacts corresponding to a pin map of the test socket, and a first shielding plating layer made of a conductive member is formed on an inner surface of the via hole, and a second shielding plating layer made of a conductive member is formed on upper and lower surfaces of the socket body to connect the first shielding plating layer.

[0014] The second shielding plating layer may be formed to surround the second hole on the upper and lower surfaces of the socket body.

[0015] The above ground pin and the above signal pin may be characterized by having the same shape.

[0016] The above ground pin and the above signal pin may be characterized by having different maximum diameters.

[0017] The above ground pin and the above signal pin may be characterized by being provided with different shapes.

[0018] It may be characterized by further including a floating plate provided on one side of the socket body and having a third hole formed therein for accommodating a contact end of the contact that makes contact with the terminal of the BGA in the contact.

[0019] The floating plate may be characterized by including a fourth hole formed at a position corresponding to the via hole.

[0020] It may be characterized in that a third shielding plating layer is formed on the inner surface of the fourth hole by a conductive member.

[0021] The above contact may be characterized by including a pair of contact pins and a spring coupled between the pair of contact pins to provide elastic force.

[0022] The above pair of contact pins may be characterized in that they are provided with different shapes and are coupled in a direction that intersects each other.

[0023] Each feature of the above-described embodiments may be implemented in combination in other embodiments as long as it is not inconsistent with or exclusive of other embodiments.

[0024] According to various embodiments of the present invention, a shielding plating layer is formed between via holes surrounding a signal pin to individually ground the signal signal, thereby improving impedance matching and high-frequency signal transmission.

[0025] Additionally, the noise shielding effect between fine pitches can be improved by the shielding material surrounding the contact point on the pin map.

[0026] Additionally, since the signal pin and ground pin are adopted to have the same shape but different diameters, there is an effect that makes it easy to manufacture the test socket.

[0027] In addition, in a test socket device for a semiconductor device for testing a semiconductor device including a plurality of ground probes and a plurality of signal probes, the device includes an insulating socket body in which a ground hole and a signal hole are formed, a conductive ground plating layer formed on the surface of the ground hole, and a conductive shielding element formed to penetrate the upper and lower surfaces of the socket body to shield noise between adjacent signal probes, thereby providing an excellent noise shielding effect between signal probes and being easy to manufacture.

[0028] The effects of the present invention are not limited to those described above, and other effects not mentioned will be clearly recognized by those skilled in the art from the description below.

[0029] Fig. 1 is a drawing showing a cross-section of a semiconductor element test socket device according to the prior art.

[0030] FIG. 2 is a drawing showing a pin map of a test socket according to an exemplary embodiment of the present invention.

[0031] Figure 3 is a drawing showing the AA cross section in Figure 2.

[0032] Figure 4 is a drawing showing a BB cross-section in Figure 2.

[0033] FIGS. 5 and 6 are drawings showing contacts according to exemplary embodiments of the present invention.

[0034] FIG. 7 is a cross-sectional view of a test socket according to another embodiment of the present invention.

[0035] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to facilitate a comprehensive understanding of the methods, devices, and / or systems described herein. However, these are merely examples and the present invention is not limited thereto.

[0036] In describing embodiments of the present invention, detailed descriptions of known technologies related to the present invention will be omitted if they are deemed to unnecessarily obscure the gist of the invention. Furthermore, the terms described below are defined based on their functions in the present invention and may vary depending on the intent or custom of the user or operator. Therefore, their definitions should be based on the overall content of this specification.

[0037] The terminology used in this detailed description is for the purpose of describing embodiments of the present invention only and should not be construed as limiting. Unless expressly stated otherwise, singular forms include plural forms.

[0038] In this description, expressions such as "including" or "having" are intended to indicate certain features, numbers, steps, operations, elements, portions or combinations thereof, and should not be construed to exclude the presence or possibility of one or more other features, numbers, steps, operations, elements, portions or combinations thereof other than those described.

[0039] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by the terms.

[0040]

[0041] FIG. 2 is a drawing showing a pin map of a test socket according to an exemplary embodiment of the present invention, FIG. 3 is a drawing showing a cross-section AA in FIG. 2, and FIG. 4 is a drawing showing a cross-section BB in FIG. 2.

[0042] The AA cross-section of FIG. 3 shows a cross-section of a part where a ground pin (15), a via hole (13h), a signal pin (11), a via hole (13h), and a ground pin (15) are located sequentially from the left in the drawing, and the BB cross-section of FIG. 4 is a drawing showing a cross-section of a part where a signal pin (11), a ground pin (15), and a signal pin (11) are located sequentially from the left in the drawing.

[0043] That is, the AA cross-section of FIG. 3 represents a cross-section of a portion to which a via hole (13h) is applied, and the BB cross-section of FIG. 4 represents a cross-section of a portion to which a via hole (13h) is not applied.

[0044] A test socket according to one embodiment of the present invention will be described with reference to FIGS. 2 to 4 below.

[0045] The test socket (10) can form various pin maps depending on the device (IC chip or module, etc.) to be tested, and Fig. 2 is an example of one of various pin maps that can be applied to the test socket of the present embodiment.

[0046] In a test socket, a pin map provides information about the pin layout of a specific device or chip, defining what function each pin performs and what electrical connection is made, and thus the information necessary to properly perform contact and signal transmission for each pin during the test process.

[0047] Pin maps are especially important for BGA (Ball Grid Array) and other complex packages because the pins of BGA packages are arranged in a grid of tiny balls, making direct access difficult. Pin maps ensure that the test sockets correctly connect to each pin on the package.

[0048] That is, as described above, the pin map may vary depending on the design of the test socket and the pin layout of a specific device or chip, and an accurate pin map is required when performing a test task, so that the correct pins can be contacted to send and receive test signals.

[0049] Meanwhile, the test socket of the present embodiment may have a shielding plating layer formed thereon to improve insulation between fine pitches when performing high-frequency or high-speed signal semiconductor device testing.

[0050] In more detail, the test socket includes a contact including a ground pin (15) and a signal pin (11), and a socket body (110, 120) into which the contact is inserted and elastically supported, and in which a plurality of holes are formed.

[0051] The socket body includes an upper plate (120) and a lower plate (110), and the plurality of holes are formed through the upper plate (120) and the lower plate (110).

[0052] The above plurality of holes may include a first hole (15h) into which a ground pin (15) is inserted, a second hole (11h) into which a signal pin (11) is inserted, and a via hole (13h) formed between contacts (11, 15) corresponding to the pin map of the test socket.

[0053] The first hole (15h) and the second hole (11h) are formed in the form of step holes in the upper plate (120) and the lower plate (110) so that the ground pin (15) and the signal pin (11) can be inserted, respectively, and can be formed by penetrating the socket body when the upper plate (120) and the lower plate (110) are combined.

[0054] If the above step hole is described in more detail with respect to the ground pin (15), a hole forming a diameter (d2) corresponding to the maximum diameter of the ground pin (15) and a hole forming a diameter (d1) corresponding to the contact point of the ground pin can be sequentially formed to form the above step hole.

[0055] A via hole (13h) can be formed between contacts (11, 15). That is, the via hole (13h) can be positioned between ground pins (15) and ground pins (15), between ground pins (15) and signal pins (11), or between signal pins (11) and signal pins (11) according to a reference line such as a horizontal axis or a vertical axis of the pin map.

[0056] Preferably, the via hole (13h) can be formed to surround the signal pin (11), and the via hole (13h) of the present embodiment can be formed on the upper, lower, left, and right sides of the signal pin (11).

[0057] Meanwhile, crosstalk between fine pitches can be prevented by the first shielding plating layer (131) formed on the inner surface of the via hole (13h). More specifically, a first shielding plating layer (131) made of a conductive material can be formed on the inner surface of the via hole (13h), and a second shielding plating layer (133) connected to the first shielding plating layer (131) can be formed on the upper and lower surfaces of the socket body (110, 120) by a conductive material.

[0058] In this structure, the second shielding plating layer (133) can individually ground the signal signal by connecting the via holes (13h) formed around the signal pin (11) on the pin map (upper and lower surfaces of the socket body), thereby improving impedance matching and high-frequency signal transmission.

[0059] And, for example, the first shielding plating layer (131) and the second shielding plating layer (133) may be conductive materials such as gold, copper, nickel, etc., but are not limited thereto, and it goes without saying that different materials may be applied to the first shielding plating layer (131) and the second shielding plating layer (133).

[0060] Meanwhile, the ground pin (15) and the signal pin (11) can form different resistance values. More specifically, the resistance value of the ground pin (15) can form a higher resistance value than the resistance value of the signal pin (11), thereby ensuring the accuracy of the signal when testing the test socket.

[0061] In the present embodiment, by forming a difference in resistance value due to the physical difference between the ground pin (15) and the signal pin (11), more precise design and optimization of the resistance value are facilitated when testing high-frequency or high-speed signals.

[0062] In more detail, the ground pin (15) and the signal pin (11) may be provided with the same shape, but may be characterized by having different maximum diameters. That is, in the present embodiment, the difference in resistance values ​​between the ground pin (15) and the signal pin (11) may be created not by a difference in shape, but by a difference in diameter (size).

[0063] For example, the ground pin (15) and the signal pin (11) may be formed to have the same shape and height, but different maximum diameters. The maximum diameter of the ground pin (15) may be formed to be smaller than the maximum diameter of the signal pin (11). In this way, by forming the pin of the signal pin (11) thicker than the ground pin (15), the electrical flow can be improved, and the resistance can be formed to be lower.

[0064] As described above, by making the maximum diameter of the ground pin (15) smaller than the maximum diameter of the signal pin (11), the resistance value of the ground pin (15) can be formed higher than the resistance value of the signal pin (11).

[0065] Of course, the difference in resistance value between the ground pin (15) and the signal pin (11) is not limited to what was described above, and the difference in resistance value can be created by making the shapes of the ground pin (15) and the signal pin (11) different from each other.

[0066] Meanwhile, the test socket of the present embodiment may further include a floating plate (130) provided on one side of the socket body and having a third hole formed therein for accommodating a contact end of a contact that contacts a terminal (Ball) of a BGA at a contact (11, 15).

[0067] Since the BGA package has a large number of contact points in a grid shape composed of small balls, which may be difficult to contact, the test socket of the present embodiment can improve IC semiconductor testing and connectivity through the floating plate (130).

[0068] More specifically, the floating plate (130) is connected to the upper plate (130) through a kind of fluid connection structure to ensure stable contact with each ball of the BGA package. Therefore, in this structure, the connection can be maintained stably even when the package is moved or pressure is applied.

[0069] The above third hole is formed with a predetermined diameter (d3) to accommodate a ball of the BGA package, and may be formed with a step hole and a diameter (d1) corresponding to a contact end that contacts the ball in the contact.

[0070]

[0071] FIGS. 5 and 6 are drawings showing contacts according to exemplary embodiments of the present invention.

[0072] The contact of this embodiment includes a signal pin (11) and a ground pin (15). As described above, the shape and configuration of the signal pin (11) and the ground pin (15) are the same, with only a difference in diameter. Therefore, the contact of this embodiment will be described below based on the signal pin (11) illustrated in FIGS. 5 and 6.

[0073] The signal pin (11) is a type of spring contact pin that has elasticity in the pressing direction by the spring (113), including a first contact pin (11a), a second contact pin (12a) and a spring (113).

[0074] The first contact pin (11a) and the second contact pin (12a) can be assembled in a direction intersecting each other with respect to the spring (113) so as to be elastically supported by the spring (113).

[0075] The spring (113) may be a coil-shaped compression spring having a predetermined thickness based on the outer diameter and the inner diameter and a predetermined length along the longitudinal direction of the signal pin (11), and may be positioned between the first contact pin (11a) and the second contact pin (12a) in the signal pin (11), and when the first contact pin (11a) and the second contact pin (12a) are compressed in the longitudinal direction, the spring (113) may provide a restoring force to return each contact pin (11a, 12a) to a position before being compressed.

[0076] The first contact pin (11a) may include a contact portion (111), a body portion (113), and a leg portion (115).

[0077] The contact portion (111) is formed at one end of the body portion (113) and can contact either the circuit pattern of the test printed circuit board installed in the test device or the contact ball or land of the BGA type or LGA type semiconductor IC when testing the semiconductor device (IC) through the test socket.

[0078] The contact portion (111) of the present embodiment may be provided in the form of a rolled crown, which is a plate-shaped strip having a plurality of tip portions (1111) formed thereon. For example, the contact portion (111) may be manufactured by stamping a strip having a plurality of tip portions (111) formed thereon, and then rolled. Through this shape, the contact portion (111) may improve its contact ability with the BGA terminal.

[0079] The body part (113) may include a guide groove (S1) formed along the longitudinal direction of the body part (113) and a shoulder (1131) formed protrudingly on both sides of the body part (113).

[0080] The shoulder (1131) enables the spring (113) to be elastically supported and coupled between the first contact pin (11a) and the second contact pin (12a) together with the shoulder (1231) of the second contact pin (12a).

[0081] Additionally, the signal pin (11) can be supported in a step hole formed in the upper plate (120) through a shoulder (1131), and can be supported in a step hole formed in the lower plate (110) through a shoulder (1231).

[0082] The guide home (S1) can improve the assembling ability of the second contact pin (12a) by guiding the leg portion (125) of the second contact pin (12a) when the first contact pin (11a) and the second contact pin (12a) are assembled in a direction in which they intersect each other, and can also improve the electrical contact capability.

[0083] In more detail, the leg portions of the second contact pin (12a) are formed as a pair extending symmetrically to each other while forming a predetermined space (S2) at a predetermined distance from the body portion (123). Each contact pin can be cross-coupled to each other by the predetermined space (S2) formed by each leg portion.

[0084] Meanwhile, a tip (1251) is formed at one end of the leg portion (125), a contact surface (1252) is formed from the tip (1251) in a direction in which a pair of leg portions face each other, and a catch (1253) may be formed in a stepwise direction from the contact surface (1251) in the leg portion.

[0085] In this structure, when the first contact pin (11a) and the second contact pin (12a) are assembled in a direction in which they intersect each other, the contact surface (1252) moves along the guide groove (S1) while in contact with the bottom surface of the guide groove (S1), thereby improving the assembling ability of the first contact pin (11a) and the second contact pin (12a) and also improving the electrical contact capability.

[0086] In addition, a catch groove (1133) is formed in the guide groove (S1), so that when the signal pin (11) is stretched to the maximum by the spring, the catch protrusion (1253) catches on the catch groove (1133), thereby preventing the signal pin (11) from being separated.

[0087] And, a groove (1135) is formed in the part where the body part (113) is connected to the leg part (115), so that the second contact pin (12a) can be more easily connected by making contact with the contact surface (1252) when cross-connecting with the first contact pin (11a).

[0088] Meanwhile, the structure of the leg portion (115) of the first contact pin (11a) is identical to the structure of the leg portion (125) of the second contact pin (12a) described above.

[0089] The contact portion (121) of the second contact pin (12a) can be formed in a shape in which the width becomes narrower as it goes toward the contact end (1211).

[0090] The guide groove (S2) may be formed in a form that extends from the engaging groove (1233) along the longitudinal direction of the body portion (123) and passes through the contact end (1211). In this structure, when the first contact pin (11a) and the second contact pin (12a) are assembled in a direction in which they intersect each other, the contact surface (1152) of the first contact pin (11a) moves along the guide groove (S2) while in contact with the bottom surface of the guide groove (S2) of the second contact pin (12a), and when the signal pin (11) is compressed to the maximum, the tip (1151) of the first contact pin (11a) is positioned on the same plane as the contact end (1121) of the second contact pin (12a), thereby improving electrical connectivity with the terminal.

[0091] That is, when the signal pin (11) is compressed, the leg portion (115) of the first contact pin (11a) moves along the guide groove (S2) of the second contact pin (12a), and when the signal pin (11) is compressed to the maximum, the tip (1151) of the first contact pin (11a) forms an electrical contact point with the test terminal (e.g., PCB pad) together with the contact end (1211) of the second contact pin (12a).

[0092]

[0093] Fig. 7 is a cross-sectional view of a test socket according to another embodiment of the present invention. The test socket of this embodiment is an embodiment in which a shielding plating layer is formed on the floating plate (130) to enhance the effect of blocking noise signals and impedance matching between fine pitches. The differences from the embodiment of the present invention described above with reference to Figs. 2 to 6 will be mainly explained with reference to Fig. 7.

[0094] In this embodiment, the floating plate (130) may include a plurality of fourth holes (1301) penetrating the floating plate (130).

[0095] In more detail, the fourth hole (1301) may be formed at a position corresponding to a via hole (13h) formed in the socket body (110, 120) in the floating plate (130), and a third shielding plating layer (1302) made of a conductive material may be formed on the inner surface of the fourth hole (1301). In this structure, the shielding plating layer is formed to extend to the contact end of the contact (the portion that contacts the BGA terminal), so that the effect of blocking noise signals between fine pitches and impedance matching can be further improved.

[0096] While various embodiments of the present invention have been described in detail above, those skilled in the art will appreciate that various modifications to the above-described embodiments are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims set forth below but also by equivalents thereof.

Claims

1. Contacts including ground pins and signal pins; and A socket body into which the contact is inserted and elastically supported, and in which a plurality of holes are formed; The above plurality of holes are, A first hole into which the above ground pin is inserted; a second hole into which the signal pin is inserted; and including a via hole formed between the contacts corresponding to the pin map of the test socket; A first shielding plating layer made of a conductive material is formed on the inner surface of the above via hole, A BGA test socket for implementing impedance matching, characterized in that a second shielding plating layer connecting the first shielding plating layer is formed on the upper and lower surfaces of the socket body by a conductive member.

2. In paragraph 1, A BGA test socket for implementing impedance matching, characterized in that the second shielding plating layer is formed to surround the second hole on the upper and lower surfaces of the socket body.

3. In paragraph 2, A BGA test socket for implementing impedance matching, characterized in that the ground pin and the signal pin have the same shape.

4. In paragraph 3, A BGA test socket for implementing impedance matching, wherein the ground pin and the signal pin have different maximum diameters.

5. In paragraph 2, A BGA test socket for implementing impedance matching, characterized in that the ground pin and the signal pin are provided with different shapes.

6. In paragraph 1, A BGA test socket for implementing impedance matching, characterized in that it further includes a floating plate provided on one side of the socket body and having a third hole formed therein for accommodating a contact end of the contact that makes contact with the terminal of the BGA in the contact.

7. In paragraph 6, The above floating plate, A BGA test socket for implementing impedance matching, characterized in that it includes a fourth hole formed at a position corresponding to the above via hole.

8. In paragraph 7, A BGA test socket for implementing impedance matching, characterized in that a third shielding plating layer is formed by a conductive member on the inner surface of the fourth hole.

9. In paragraph 1, The above contact is, a pair of contact pins; and A BGA test socket for implementing impedance matching, characterized in that it includes a spring that is coupled between the pair of contact pins to provide elasticity.

10. In paragraph 9, A hybrid test socket characterized in that the above pair of contact pins are provided with different shapes and are joined in an intersecting direction.

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