Mounting device and mounting method

Abstract

A mounting device for mounting a component by moving a head for collecting the component using a collection member comprises: an imaging unit that images an upper surface image of the component; a control unit that controls the imaging unit so as to capture an upper surface image of the specific component under a specific condition in which the imaging frequency is a plurality of times when the specific component having a prescribed feature unit formed on the upper surface is mounted; and a setting unit that processes a plurality of upper surface images and sets a collection position of the specific component.

Description

Mounting device and mounting method

[0001] This specification discloses a mounting apparatus and a mounting method.

[0002] Conventionally, a mounting device has been proposed that checks the positions of characteristic features such as light-emitting parts formed on the top surfaces of components, and then picks up and mounts the components using a picking member of a head (see, for example, Patent Document 1). In this mounting device, components supplied from a supply device are first picked up by the picking member and then placed on a temporary placement table, an image of the top surface of the component is captured while the component is placed on the temporary placement table, and the positions of the characteristic features are recognized from the image to set the picking position of the component.

[0003] Patent No. 6892552

[0004] The mounting device described above captures images of components placed on a temporary placement table, so it is possible to set the component pick-up position from images captured in a state that is less susceptible to vibration. However, depending on the device configuration, the image may be captured in a state that is more susceptible to vibration, making it impossible to set the appropriate pick-up position.

[0005] A primary object of the present disclosure is to more appropriately pick and mount components that are to be mounted by recognizing their top surfaces.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The mounting device of the present disclosure is a mounting device that mounts components by moving a head that picks up components using a picking member, and includes: an imaging unit that captures a top surface image of the component; a control unit that controls the imaging unit so that, when mounting a specific component having a predetermined feature formed on its top surface, the top surface image of the specific component is captured under specific conditions such that the number of images is set to multiple times; and a setting unit that processes the multiple top surface images and sets the picking position of the specific component.

[0008] The mounting device of the present disclosure can more appropriately pick and mount components to be mounted using the feature portions on the top surface as a reference.

[0009] 1 is a schematic configuration diagram of a mounting device 10. A block diagram showing a configuration related to control of the mounting device 10 and a management device 30. A flowchart showing an example of a specific component picking process. An explanatory diagram showing an example of a vibration waveform. An explanatory diagram showing an example of a top surface image IM. An explanatory diagram showing an example of a top surface image IM. An explanatory diagram showing an example of relationship information 23a between the number of feeders Fn and the vibration period Vp, and an example of a set time interval Ti. An explanatory diagram showing an example of a time interval Ti. A flowchart showing a specific component picking process of a modified example. An explanatory diagram showing an example of a top surface image IM of a modified example. A schematic configuration diagram of a mounting device 10B of a modified example. A flowchart showing an example of a component picking process.

[0010] An embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a schematic configuration diagram of a mounting apparatus 10. Fig. 2 is a block diagram showing a configuration related to control of the mounting apparatus 10 and a management apparatus 30. Note that the left-right direction in Fig. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] As shown in FIG. 1, the mounting device 10 includes a tape feeder 11, a substrate transport unit 12, a head 13, a head moving unit 15, a mark camera 17, a parts camera 18, and a control unit 20 (see FIG. 2).

[0012] The tape feeder 11 supplies components to a predetermined supply position by unwinding a tape having multiple recesses in which components are accommodated at predetermined intervals from a reel and feeding the tape backward along the Y-axis direction. The components accommodated in the recesses are protected by a film covering the surface of the tape, and the film is peeled off just before the supply position to expose them. A feeder table 25 is provided at the front of the mounting device 10. The feeder table 25 has multiple slots 25a to which the tape feeder 11 is attached and detached, and multiple connectors 25b corresponding to each slot 25a. The tape feeder 11 is attached to the feeder table 25 by inserting rails (not shown) into each slot 25a and sliding them along the Y-axis direction, electrically connecting the connectors (not shown) to each connector 25b.

[0013] 1 with a gap therebetween and spanning the X-axis direction, and drives the conveyor belts to transport the substrate S. The substrate transport unit 12 may, for example, have two pairs of conveyor belts and can transport two substrates S simultaneously.

[0014] The head 13 is equipped with one or more nozzles 14 (picking members) that pick up (suck) components using negative pressure. The head 13 is configured, for example, as a rotary head with multiple nozzles 14 mounted so that they can rotate in the circumferential direction, and the nozzles 14 at predetermined rotation positions can be raised and lowered in the Z-axis direction (up and down direction). This head 13 picks up components supplied to a supply position by the tape feeder 11 using the nozzles 14, and mounts them at a mounting position on the board S transported by the board transport unit 12.

[0015] The head moving unit 15 includes an X-axis moving unit 15a that moves the slider to which the head 13 is attached in the X-axis direction, and a Y-axis moving unit 15b that moves the head 13 in the Y-axis direction together with the slider 16 to which the X-axis moving unit 15a is mounted. The head 13 is moved in the X and Y directions by the head moving unit 15 to a position above the supply position or above the mounting position. For example, the X-axis moving unit 15a is configured using a ball screw mechanism, and the Y-axis moving unit 15b is configured using a linear motor.

[0016] Mark camera 17 is disposed on the underside of the slider to which head 13 is attached so as to move in the X and Y directions in accordance with the movement of head 13. Note that mark camera 17 may also be disposed on the underside of head 13. The area below mark camera 17 is an imaging area, and the mark camera 17 captures images of reference marks and the upper surfaces of components attached to board S and outputs the images to control unit 20.

[0017] The parts camera 18 is disposed in front of the board transport unit 12. The parts camera 18 has an imaging range above it, and captures an image of the parts picked up by the nozzle 14 from below, and outputs the image to the control unit 20.

[0018] In this embodiment, the mounting device 10 is divided into two halves, with heads 13L and 13R and head movement units 15L and 15R disposed in each of the two halves. The left-side head 13L and head movement unit 15L are also referred to as the first head and first head movement unit, respectively, and the right-side head 13R and head movement unit 15R are also referred to as the second head and second head movement unit, respectively. Furthermore, part cameras 18L and 18R are disposed in each of the left and right sides of the mounting device 10, and mark cameras 17L and 17R are disposed on the sliders to which the heads 13L and 13R are attached. In the following description, the left and right configurations will not be distinguished from each other unless necessary.

[0019] The control unit 20 is configured as a microprocessor centered around a CPU 21, and includes a ROM 22 that stores processing programs, an HDD 23 as a storage unit that stores various data, a RAM 24 used as a work area, an input / output interface, etc. The storage unit is not limited to the HDD 23 and may be an SSD or the like. The control unit 20 outputs control signals to each tape feeder 11, the substrate transport unit 12, the heads 13 (13L, 13R), the head movement unit 15 (15L, 15R), the mark cameras 17 (17L, 17R), the part cameras 18 (18L, 18R), etc. The control unit 20 also receives inputs of various signals from the tape feeders 11, the substrate transport unit 12, the heads 13, the head movement unit 15, etc., as well as images captured by the mark camera 17 and the part camera 18.

[0020] The management device 30 is, for example, a general-purpose computer. As shown in FIG. 2 , the management device 30 is composed of a CPU 31, a ROM 32, a HDD 33, a RAM 34, and the like. It also includes an input device 35, such as a keyboard and a mouse, and a display 36, such as an LCD. The HDD 33 stores production jobs for the boards S. The production jobs are information that determines which components are to be mounted on the boards S in the mounting device 10, in what order, and how many boards S with such components mounted are to be produced. The production jobs also include information about the components to be mounted, such as the mounting order of the components, mounting position information, and component type information, such as the component shape and whether the component is a normal or specific component. A specific component is, for example, a component that has a specific feature formed on its top surface and requires recognition of the position and shape of the feature (referred to as top-surface recognition). A specific component is, for example, an LED component that has a light-emitting element on its top surface as a feature. On the other hand, a normal component is a component that does not require such top-surface recognition. The management device 30 is communicably connected to the control unit 20 of the mounting device 10, outputs a production job to the control unit 20 to start production, and receives information about the production status from the control unit 20.

[0021] The component mounting process of the mounting device 10 will be described below. When the component to be mounted is a standard component, the control unit 20 first controls the head moving unit 15 to move the head 13 above the supply position of the tape feeder 11 and lower the nozzle 14 to allow the nozzle 14 to pick up (suck) the component supplied to the supply position. The control unit 20 repeatedly moves each nozzle 14 to a predetermined rotation position and causes the nozzle 14 to pick up the component until each nozzle 14 has picked up a component. Next, the control unit 20 controls the head moving unit 15 to move the head 13 above the part camera 18 and controls the part camera 18 to capture an image of the bottom surface of the component picked up by the nozzle 14. Next, the control unit 20 determines the misalignment of the component picked up by the nozzle 14 based on the image of the bottom surface and corrects the target mounting position of the component to eliminate the misalignment. The control unit 20 then controls the head moving unit 15 to move the head 13 above the board S and lower the nozzle 14 to mount the component at the target mounting position on the board S. The control unit 20 repeats the operation of sequentially moving each nozzle 14 to a predetermined rotation position and causing the nozzle 14 to mount the component until the picked component is mounted on each nozzle 14. Furthermore, if the component to be mounted is a specific component, the above-mentioned top surface recognition is performed when picking up the component supplied to the supply position. The following is an explanation of the picking process when picking up a specific component, part of the mounting process for a specific component.

[0022] 3 is a flowchart showing an example of the specific component picking process. In the specific component picking process, the control unit 20 moves the head 13 to above the supply position of the tape feeder 11 (S100). Next, the control unit 20 sets specific conditions for causing the mark camera 17 to capture an upper surface image IM of the specific component Ps. Note that the control unit 20 may set the specific conditions before moving the head 13. The specific conditions are set as follows to suppress the influence of displacement of the specific component Ps due to vibration.

[0023] As described above, the tape feeder 11 is attached by being inserted into the slot 25a of the feeder table 25 and is not fixed in place, so it may vibrate due to the operation of the mounting device 10. This vibration occurs mainly in the X-axis direction, i.e., in a direction perpendicular to the component feed direction by the tape feeder 11. In particular, the mounting device 10 has two heads 13 and two head moving units 15. While the mark camera 17 of one head 13 is capturing a top surface image IM, the other head 13 may perform operations such as picking up and moving components or mounting the components. Due to the influence of such operation of the other head 13, the tape feeder 11 is likely to vibrate while capturing the top surface image IM. Furthermore, the vibration of the tape feeder 11 also causes the specific component Ps at the supply position to vibrate in the X-axis direction.

[0024] FIG. 4 is an explanatory diagram showing an example of a vibration waveform. FIG. 4 shows a vibration waveform of the tape feeder 11 obtained in advance through experiments, etc., with the horizontal axis representing time and the vertical axis representing displacement in the X-axis direction. FIGS. 5 and 6 are explanatory diagrams showing examples of top surface images IM. In each top surface image IM, the position of the specific component Ps when stationary is indicated by a dotted line, and the specific component Ps captured at a displaced position due to vibration is indicated by a solid line. Note that the specific component Ps is shown with a dotted line for illustrative purposes, but the specific component Ps actually captured in the top surface image IM is the solid line. When the specific component Ps is captured at time t1 in FIG. 4 , the specific component Ps is captured in the top surface image IM with a positional deviation of, for example, ΔX to the left (see FIG. 5 ). When the specific component Ps is captured at time t2 in FIG. 4 , the specific component Ps is captured in the top surface image IM with a positional deviation of, for example, ΔX to the right (see FIG. 6 ). Furthermore, it is difficult to grasp the vibration status of each tape feeder 11, and it is difficult to capture the top surface image IM at a timing when the amplitude is close to 0. For this reason, depending on the timing at which the top surface image IM is captured, the specific component Ps may be captured at a position different from its original position (the position indicated by the dotted line), causing the control unit 20 to erroneously recognize the position of the specific component Ps. Therefore, in this embodiment, the influence of vibration is suppressed by capturing the top surface image IM under specific conditions.

[0025] Therefore, the control unit 20 first acquires the number of feeders Fn, which is the number of tape feeders 11 attached to the mounting device 10 (feeder table 25), and acquires the vibration period Vp, which is the period of vibration of the tape feeders 11 corresponding to the number of feeders Fn (S110). Next, the control unit 20 sets the time interval (imaging interval) Ti for capturing multiple images of the top surface IM of one specific component Ps based on the vibration period Vp (S120).

[0026] In this embodiment, the HDD 23 stores relationship information 23a defining the relationship between the number of feeders Fn and the vibration period Vp. FIG. 7 is an explanatory diagram showing an example of the relationship information 23a between the number of feeders Fn and the vibration period Vp and the set time interval Ti. This relationship information 23a defines the vibration period Vp, determined in advance through experiments or the like, for each interval obtained by dividing the number of feeders Fn into integer multiples of the predetermined number Np. Furthermore, the control unit 20 calculates and sets the time interval Ti, which is offset from at least the interval between wave peaks, based on the vibration period Vp. For example, if the predetermined number Np is 10 and the current number of feeders Fn is 6, the control unit 20 acquires the vibration period Vp1 in S110 and sets the time interval Ti1 in S120. Furthermore, if the current number of feeders Fn is 25, the control unit 20 acquires the vibration period Vp3 in S110 and sets the time interval Ti3 in S120. In this manner, in this embodiment, the time interval Ti is set as the specific condition.

[0027] Next, the control unit 20 controls the mark camera 17 to capture a top surface image IM of the specific component Ps at the supply position multiple times at the set time interval Ti (S130). The control unit 20 then processes each top surface image IM and acquires the position of the specific component Ps from each top surface image IM (S140). The control unit 20 extracts the region of the specific component Ps from the top surface image IM and acquires a predetermined position, such as the center position of the region or a predetermined location on the outer shape, as the position of the specific component Ps. Alternatively, the control unit 20 may acquire the position of a characteristic portion F on the top surface as the position of the specific component Ps. Next, the control unit 20 recognizes the average position of the positions acquired from each top surface image IM in S140 as the position of the specific component Ps (S150).

[0028] FIG. 8 is an explanatory diagram showing an example of the time interval Ti. FIG. 8 shows, as an example, the time interval Ti when capturing the top surface image IM three times. The number of times the image is captured may be at least two or more times, preferably three to five times. As shown in the figure, by setting the time interval Ti to be at least the distance between the crests of the waves, it is possible to prevent the top surface image IM from being captured multiple times only at the maximum amplitude of the vibration, thereby suppressing the effects of vibration. Furthermore, in each top surface image IM, the position of the specific part Ps is acquired as a position shifted by ΔX1, ΔX2, or ΔX3, respectively. At S150, the control unit 20 recognizes the average position as the position of the specific part Ps, thereby suppressing the effects of vibration and more appropriately recognizing the position of the specific part Ps.

[0029] Next, the control unit 20 sets a pick-up position Pc for the specific component Ps based on the position of the specific component Ps recognized in S150 (S160). Subsequently, the control unit 20 moves the head 13 above the set pick-up position Pc and causes the nozzle 14 to pick up the specific component Ps (S170), thereby completing the specific component pick-up process.

[0030] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The mark camera 17 of this embodiment corresponds to the imaging unit of the present disclosure, the control unit 20 that executes S110 to S130 of the specific component collection process corresponds to the control unit, and the control unit 20 that executes S140 to S160 of the same process corresponds to the setting unit. Note that this embodiment also clarifies an example of the mounting method of the present disclosure by explaining the operation of the mounting device 10.

[0031] In the mounting apparatus 10 of the embodiment described above, the control unit 20 controls the mark camera 17 to capture top surface images IM of the specific component Ps under specific conditions, such as capturing images multiple times. The control unit 20 then processes the multiple top surface images IM to set a collection position Pc for the specific component Ps, and causes the nozzle 14 to collect the specific component Ps at the set collection position Pc. This allows the mounting apparatus 10 to more appropriately collect and mount the specific component Ps.

[0032] Furthermore, the control unit 20 recognizes the position of the specific component Ps based on the average of the positions of the specific component Ps obtained from the multiple top view images IM, and sets the pick position Pc of the specific component Ps based on the recognized position, thereby suppressing the influence of positional deviation of the specific component Ps due to vibration.

[0033] The mounting device 10 is also equipped with a plurality of detachable tape feeders 11 that feed a tape containing a plurality of components in the Y-axis direction (a predetermined direction) and supply the components to a predetermined supply position. The control unit 20 controls the mark camera 17 to capture a top surface image IM of the specific component Ps at the supply position. Since the specific component Ps at the supply position is susceptible to vibration when being imaged, it is highly significant to apply the present disclosure.

[0034] Furthermore, the control unit 20 controls the mark camera 17 to capture the top surface image IM multiple times at time intervals Ti corresponding to the vibration period Vp of the tape feeder 11 in the X-axis direction. This allows multiple top surface images IM to be captured appropriately, thereby further suppressing the effects of misalignment of the specific component Ps.

[0035] Furthermore, the control unit 20 determines the time interval Ti based on relationship information 23a in which the relationship between the number of feeders Fn, which is the number of attached tape feeders 11, and at least one of the vibration period Vp and the time interval Ti is predetermined, and controls the mark camera 17. Therefore, in a configuration in which the vibration period Vp changes depending on the number of feeders Fn, it is possible to more appropriately capture multiple top surface images IM and further suppress the effects of misalignment of the specific component Ps.

[0036] Furthermore, the mounting device 10 is configured so that the multiple heads 13 can be moved individually by the head moving unit 15. For this reason, the tape feeder 11 is likely to vibrate while capturing the top surface image IM, and therefore, the application of the present disclosure is highly significant.

[0037] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0038] In the above-described embodiment, different time intervals Ti are set depending on the number of feeders Fn, but this is not limiting. For example, in a configuration in which the vibration period Vp does not change significantly depending on the number of feeders Fn, a constant time interval Ti may be set regardless of the number of feeders Fn.

[0039] In the embodiment, the relationship information 23a defines the relationship between the number of feeders Fn and the vibration period Vp, but it is sufficient if the relationship between the number of feeders Fn and at least one of the vibration period Vp and the time interval Ti is defined. Also, while the mounting device 10 stores the relationship information 23a in the HDD 23, this is not limiting, and the relationship information 23a does not necessarily have to be stored in the HDD 23. The control unit 20 may obtain the time interval Ti, for example, by communicating with an external device such as the management device 30.

[0040] In the embodiment, the specific condition is exemplified as a condition of capturing an image multiple times at time intervals Ti, but this is not limited to this. For example, the mark camera 17 may be controlled at a shutter speed (exposure time) such that blurring of the specific component Ps due to vibration is captured in the top surface image IM, i.e., a shutter speed slower than normal. Figure 9 is a flowchart showing a specific component collection process according to a modified example. Note that in the modified example, the same steps as in the embodiment are assigned the same step numbers, and descriptions thereof will be omitted.

[0041] In the specific component collection process of the modified example, the control unit 20 sets a shutter speed SS1 slower than normal as a specific condition (S200). Note that the mark camera 17 is set to a normal shutter speed by default, and the specific component Ps is captured at this normal shutter speed in the above-described embodiment. In the top surface image IM captured at the normal shutter speed, the specific component Ps is clearly captured with almost no blur. Next, the control unit 20 controls the mark camera 17 to capture a top surface image IM of the specific component Ps at the supply position once at the set shutter speed SS1 (S210). The control unit 20 then acquires an area A of the specific component Ps, including blur, from the top surface image IM (S220) and recognizes, for example, the center of the area A as the center position of the specific component Ps (S230).

[0042] FIG. 10 is an explanatory diagram showing an example of a top surface image IM according to a modified example. By capturing an image at a shutter speed SS1 slower than normal, the specific part Ps is captured in the top surface image IM, blurred by a lateral deviation ΔX caused by vibration. The region of the specific part Ps containing this blur is designated as region A (see dashed line). For example, the control unit 20 may set the shutter speed SS1 based on the vibration period Vp so that the exposure time includes the maximum lateral amplitude (times t1 and t2 in FIG. 4 ). Alternatively, the control unit 20 may set the shutter speed SS1 so that the exposure time is approximately twice the time interval Ti (see FIGS. 7 and 8 ) in the embodiment. By setting these shutter speeds SS1, the blur (deviation ΔX) contained in region A can be prevented from being limited to one side in the lateral direction. Therefore, by recognizing the center of region A as the center position of the specific part Ps, the effects of positional deviation of the specific part Ps due to vibration can be reduced.

[0043] Thus, in this modified example, the control unit 20 controls the mark camera 17 to capture the top surface image IM of the specific component Ps under specific conditions, using a predetermined shutter speed (SS1) that captures the blur of the specific component Ps. The control unit 20 then processes the top surface image IM to set a pick-up position Pc for the specific component Ps and causes the nozzle 14 to pick up the specific component Ps at the set pick-up position Pc. This allows the mounting device 10 to more appropriately pick up and mount the specific component Ps. Furthermore, the control unit 20 recognizes the position of the specific component Ps based on the position of the specific component Ps, including any blur, obtained from the top surface image IM, and sets the pick-up position Pc for the specific component Ps based on the recognized position. This reduces the effects of positional deviation of the specific component Ps due to vibration.

[0044] In the embodiment, the top surface image IM of the specific component Ps is captured when the specific component Ps is in a predetermined supply position, i.e., when the specific component Ps is in the tape (recess) of the tape feeder 11. However, this is not limited to this. FIG. 11 is a schematic configuration diagram of a modified mounting apparatus 10B. As shown in the figure, the mounting apparatus 10B includes a mounting table 19 in front of the board transport unit 12. The mounting table 19 has a horizontal top surface and is used, for example, as a temporary placement table for the specific component Ps. In the modified mounting apparatus 10B, the control unit 20 may temporarily pick up the specific component Ps supplied to the supply position by the tape feeder 11 using the nozzle 14, and then temporarily place the specific component Ps on the mounting table 19, and capture the top surface image IM in the temporarily placed state.

[0045] The control unit 20 may capture the top surface image IM of the specific component Ps temporarily placed on the placement table 19 under specific conditions. Note that, because the placement table 19 is fixed, it is less affected by vibrations than the supply position of the tape feeder 11. For this reason, the control unit 20 may capture the top surface image IM of the specific component Ps temporarily placed on the placement table 19 under normal conditions rather than under specific conditions. Note that the placement table 19 may be provided in each of the left and right areas of the mounting device 10, or may be provided in only one of the areas.

[0046] FIG. 12 is a flowchart illustrating an example of a component picking process. In this process, the control unit 20 determines whether the component Ps to be picked are specific components (S300). If the control unit 20 determines that the component Ps is not a specific component, the control unit 20 executes a normal component picking process (S310) and terminates the process. In the normal component picking process, the control unit 20 controls the head moving unit 15 to move the head 13 above the supply position of the tape feeder 11 and lower the nozzle 14 to pick up the component supplied to the supply position. Furthermore, if the control unit 20 determines that the component Ps to be picked are specific components (S320), the control unit 20 determines whether the mounting table 19 will be used. For example, the production job may include information regarding whether the mounting table 19 will be used for each type of specific component Ps, i.e., whether a top-view image IM will be captured while the component Ps are temporarily placed on the mounting table 19. Alternatively, if the mounting table 19 is provided in only one of the left and right regions of the mounting device 10, the control unit 20 may determine whether the mounting table 19 is available.

[0047] If the control unit 20 determines that the mounting table 19 will not be used, it executes a first collection process of the specific component, including capturing a top surface image IM under specific conditions (S330), and then terminates this process. Note that in S330, either the specific component collection process shown in FIG. 3 or FIG. 9 is executed. On the other hand, if the control unit 20 determines that the mounting table 19 will be used, it executes a second collection process of the specific component, including capturing a top surface image IM under normal conditions (S340), and then terminates this process. Capturing the top surface image IM under normal conditions is performed by controlling the mark camera 17 to capture a single image of the specific component Ps temporarily placed on the mounting table 19 at a normal shutter speed. In this way, the control unit 20 can switch between the specific condition, which captures multiple images at time intervals Ti, and the normal condition, which captures a single image, and between the specific condition, which uses a shutter speed SS1 slower than normal, and the normal condition, which uses a normal shutter speed. This allows the top surface image IM of the specific component Ps to be captured more appropriately in response to the effects of vibration.

[0048] In this modified example, the specific conditions and normal conditions are switched based on whether or not the mounting table 19 is used, but this is not limited to this, and the specific conditions and normal conditions may also be switched based on other conditions, such as the type of specific part Ps.

[0049] In the embodiment, the mounting device 10 includes two heads 13, and each head 13 is independently movable, but the number of heads is not limited to two, and the mounting device 10 may include three or more heads 13, and each head 13 may be independently movable. Alternatively, the mounting device 10 is not limited to one including multiple heads 13, and may include only one head 13.

[0050] Here, the mounting method of the present disclosure allows components to be more appropriately picked and mounted using the top surface characteristic portions as a reference, similar to the mounting apparatus described above and the modified mounting apparatuses 10 and 10B. In this mounting method, various aspects of the mounting apparatuses 10 and 10B may be employed, or configurations or steps may be added to realize the respective functions of the mounting apparatuses 10 and 10B.

[0051] This specification also discloses the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 5 at the time of filing to "the mounting device according to any one of claims 1 to 4," the technical idea of ​​changing "the mounting device according to claim 1" in claim 8 at the time of filing to "the mounting device according to claim 1 or 3," the technical idea of ​​changing "the mounting device according to claim 2" in claim 9 at the time of filing to "the mounting device according to claim 2 or 4," and the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 10 at the time of filing to "the mounting device according to any one of claims 1 to 9."

[0052] The present disclosure can be used in technical fields such as component mounting processing.

[0053] 10, 10B Mounting device, 11 Tape feeder, 12 Substrate transport unit, 13 (13L, 13R) Head, 14 Nozzle, 15 (15L, 15R) Head movement unit, 15a X-axis movement unit, 15b Y-axis movement unit, 16 Slider, 17 (17L, 17R) Mark camera, 18 (18L, 18R) Parts camera, 19 Placement table, 20 Control unit, 21, 31 CPU, 22, 32 ROM, 23, 33 HDD, 23a Related information, 24, 34 RAM, 25 Feeder table, 25a Slot, 25b Connector, 30 Management device, 35 Input device, 36 Display, S Substrate.

Claims

1. A mounting device that mounts components by moving a head that picks up components using a picking member, comprising: an imaging unit that captures top surface images of the components; a control unit that controls the imaging unit to capture top surface images of the specific component under specific conditions such that the number of images is multiple when mounting a specific component with a predetermined characteristic portion formed on its top surface; and a setting unit that processes the multiple top surface images and sets the pick-up position of the specific component.

2. A mounting device that mounts components by moving a head that picks up components using a picking member, comprising: an imaging unit that captures a top surface image of the component; a control unit that controls the imaging unit so that, when mounting a specific component having a predetermined characteristic portion formed on its top surface, the top surface image of the specific component is captured under specific conditions using a predetermined shutter speed that captures blurring of the specific component due to vibration; and a setting unit that processes the top surface image and sets the pick-up position of the specific component.

3. The mounting device according to claim 1, wherein the setting unit recognizes the position of the specific component or the characteristic feature based on the position of the specific component determined from the multiple top view images, and sets the picking position of the specific component based on the recognized position.

4. The mounting device according to claim 2, wherein the setting unit recognizes the position of the specific component or the characteristic feature based on the position of the specific component including the blur obtained from the top view image, and sets the picking position of the specific component based on the recognized position.

5. A mounting device as described in claim 1 or 2, wherein a plurality of feeders are detachably attached which feed a tape containing a plurality of components in a predetermined direction and supply the components to a predetermined supply position, and the control unit controls the imaging unit to capture an image of the top surface of the specific component at the supply position.

6. The mounting device according to claim 5, wherein the control unit controls the imaging unit to capture the top surface image multiple times at time intervals according to the vibration period of the feeder in a direction perpendicular to the predetermined direction.

7. The mounting device according to claim 6, wherein the control unit determines the time interval and controls the imaging unit based on relationship information in which the relationship between the number of attached feeders and at least one of the vibration period and the time interval is predetermined.

8. The mounting device according to claim 1, wherein the control unit is capable of selecting, when mounting the specific component, either taking an image under the specific conditions or taking an image under normal conditions in which the number of images taken is one.

9. The mounting device according to claim 2, wherein when mounting the specific component, the control unit can select between capturing an image under the specific conditions and capturing an image under normal conditions with a shutter speed that captures the specific component without blur.

10. The mounting device according to claim 1 or 2, comprising a plurality of said heads, and mounting components by moving the plurality of said heads individually.

11. A mounting method for mounting components by moving a head that picks up components using a picking member, comprising: (a) when mounting a specific component having a predetermined feature formed on its top surface, capturing a top surface image of the specific component under specific conditions in which the number of images is set to multiple times; and (b) processing the multiple top surface images to set a pick-up position for the specific component.

12. A mounting method for mounting components by moving a head that picks up components using a picking member, comprising: (a) when mounting a specific component having a predetermined characteristic portion formed on its top surface, capturing an image of the top surface of the specific component under specific conditions using a predetermined shutter speed that captures blurring of the specific component due to vibration; and (b) processing the image of the top surface to set the picking position of the specific component.

Images