Chip-type LED lamp bead structure capable of emitting multi-color light, and production method

Abstract

The present invention relates to the technical field of LED lamp beads. Disclosed are a chip-type LED lamp bead structure capable of emitting multi-color light, and a production method. The chip-type LED lamp bead structure comprises an LED lamp bead, which comprises a support, wherein the support provides the physical support and electrical conduction foundation for the whole LED lamp bead; a first electrode sheet is fixedly connected to one side of the top surface of the support, and a second electrode sheet is fixedly connected to the other side of the top surface of the support; the first electrode sheet and the second electrode sheet are arranged in a mutually nested manner; LED dies are fixedly connected to each of the first electrode sheet and the second electrode sheet; and both the first electrode sheet and the second electrode sheet are electrically connected to the LED dies, etc. In the present invention, the layout of the LED dies and the design of electrodes are improved, such that a plurality of LED dies connected in parallel can be integrated inside one chip-type LED lamp bead, each die can independently emit light, and different colors are controlled, thereby overcoming the limitations of traditional single-color or dual-color LED lamp beads; and the innovative design enables free mixing of various colors within the same LED lamp bead.

Description

A chip-type lamp bead structure capable of emitting multi-color light and its production method Technical Field

[0001] The present invention relates to the technical field of LED lamp beads, and in particular to a chip-type lamp bead structure capable of emitting multi-color light and a production method thereof. Background Art

[0002] With the continuous advancement of technology and environmental awareness, LED lamp beads have become the mainstream choice in the global lighting and display industries due to their unparalleled advantages. LED lamp beads excel in energy conservation, consuming far less energy than traditional lighting sources. Their long lifespan and fast response time make them widely applicable in a wide range of scenarios, from general lighting in homes and commercial spaces to advanced lighting solutions for automotive interiors and exteriors, from high-definition displays on large screens to precise control of traffic signal systems and the delicate performance of backlighting in consumer electronics. LED lamp beads play a key role in all of these applications, from general lighting in homes and commercial spaces to advanced lighting solutions for automotive interiors and exteriors, from high-definition displays on large screens to precise control of traffic signal systems and the delicate performance of backlighting in consumer electronics. Technical issues

[0003] When currently encapsulating LED chips, the encapsulation glue used cannot flow toward the electrode sheets on both sides of the LED lamp bead holder due to multiple factors such as packaging effect, current transmission and pin hole smoothness. It can only flow in the direction perpendicular to the electrode sheets on both sides. This ensures that the encapsulation glue covers the surface of the LED chip to form an effective protective layer, while avoiding affecting current transmission and pin hole smoothness.

[0004] Since the electrode sheet of the LED lamp bead holder is distributed in half, the single or multiple LED chips installed on the electrode sheet can only be packaged in a unified way during dispensing. Once multiple LED chips are packaged separately, the gold wire used to weld the LED chip to the electrode sheet will be exposed outside the packaging material, which can easily cause damage. This means that no matter how many LED chips are installed on the electrode sheet, they will be covered by the same packaging material and cannot be packaged separately. The same packaging material only uses one color, which results in an LED lamp bead only emitting one color of light and not multi-color light.

[0005] The purpose of the present invention is to solve the problem that the current chip-type lamp bead bracket can only be molded with one color. If two colors are required, the chip is also used for lighting and the packaging material cannot be used for debugging. Technical Solutions

[0006] In order to solve the problem that the current chip-type lamp bead bracket can only be molded with one color, if two colors are required, the chip is also used for lighting and the packaging material cannot be used for debugging, the present invention adopts the following technical solutions:

[0007] A chip-type lamp bead structure capable of emitting multi-color light and a production method, comprising an LED lamp bead, wherein the LED lamp bead comprises a bracket, wherein the bracket provides physical support and a basis for electrical conduction for the entire LED lamp bead, a first electrode sheet being fixedly connected to one side of the top surface of the bracket, and a second electrode sheet being fixedly connected to the other side of the top surface of the bracket, the first electrode sheet and the second electrode sheet being nested with each other, both the first electrode sheet and the second electrode sheet being fixedly connected to an LED chip, both the first electrode sheet and the second electrode sheet being electrically connected to the LED chip, a packaging material being fixedly connected to the top of the LED chip, the packaging material being fixedly connected to the bracket, and the packaging material being used to cover and protect the LED chip.

[0008] Preferably, the overall shape of the first electrode sheet and the second electrode sheet is L-shaped, one end of the first electrode sheet faces one side of the second electrode sheet, the other side of the second electrode sheet faces the other end of the first electrode sheet, and the first electrode sheet and the second electrode sheet are enclosed to form a U-shape.

[0009] Preferably, the packaging material is a transparent epoxy resin, and colored phosphor is mixed in the packaging material.

[0010] Preferably, a method for producing a chip-type lamp bead capable of emitting multi-color light comprises the following steps:

[0011] The first step is die bonding, which involves fixing the chip to the support plate;

[0012] The second step is wire bonding to connect the positive and negative terminals of the chip to the bracket;

[0013] The third step, mold top, uses epoxy resin to encapsulate the material with bonded die and wires. Different luminous colors can be achieved by combining different phosphors.

[0014] The fourth process is cutting, which is to cut the formed material into single pieces according to the size requirements;

[0015] The fifth process is splitting, which involves splitting the cut materials according to customer requirements;

[0016] The sixth step: taping / packaging for shipment.

[0017] Preferably, the first process further comprises the following steps:

[0018] Through PR recognition technology, it is ensured that during the crystal bonding process, the special mark on the bracket plate can be accurately identified: the green oil dot, to ensure that the first LED chip is fixed in the predetermined position, that is, the direction of the green oil dot. The bracket plate is the raw material of the bracket, and the bracket plate is cut to form several brackets.

[0019] Preferably, the third process further comprises the following steps:

[0020] After receiving the glue cake formed by the encapsulation material, the operator places it into the mold hole of the pre-prepared mold top. Before the mold top operation, the upper and lower molds of the machine are evenly sprayed with a release agent to ensure that the encapsulation material does not stick to the mold when in contact, facilitating subsequent separation. During the mold top operation, the bracket is first placed upside down on the lower mold of the mold top. The upper and lower molds are pressed together and heated to melt the glue cake, forming a glue mixture. The glue flows to and covers the LED chip. After the mold temperature drops and the glue solidifies, the mold can be opened to remove the material.

[0021] Preferably, the top mold includes a lower mold, the lower mold includes a first mold top area and a second mold top area, the second mold top area has the same structure as the first mold top area, and the first mold top area includes a first bracket plate placement area and a second bracket plate placement area.

[0022] Preferably, the first mold top area includes a first glue cake hole position and a second glue cake hole position, the first glue cake hole position and the second glue cake hole position are opened on the top surface of the lower mold, the first glue cake hole position is used to place the first color glue cake, the second glue cake hole position is used to place the second color glue cake, the positions of the first glue cake hole position and the second glue cake hole position are between the first bracket plate placement area and the second bracket plate placement area, the lower mold is provided with a first main glue path at the position on both sides of the first glue cake hole position, the lower mold is provided with a plurality of first auxiliary glue paths on one side of the main glue path, the main glue path is connected to the first auxiliary glue path, the lower mold is provided with a second main glue path at the position on both sides of the second glue cake hole position, the lower mold is provided with a plurality of second auxiliary glue paths on one side of the second main glue path, the second main glue path is connected to the second auxiliary glue path.

[0023] Preferably, the lower mold is provided with exhaust holes at one end of the first auxiliary glue channel and the second auxiliary glue channel.

[0024] Preferably, positioning holes are provided at the four corners of the bracket plate, and the positioning holes are correspondingly placed on the mold top mold to prevent the bracket from shifting. The hole positions on both sides of the bracket plate are asymmetrical to prevent the bracket plate from being placed upside down. Beneficial effects

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. In this invention, by improving the layout of LED chips and electrode design, multiple LED chips can be integrated in parallel within a chip-type lamp bead. Each chip can emit light independently and be independently packaged. Each independently packaged LED chip can emit different colors of light depending on the color of the packaging material, breaking the limitations of traditional single-color lamp beads. This innovative design enables the free mixing of multiple colors in the same lamp bead, greatly expanding the application range of LED lamp beads in the lighting and decoration fields, especially in applications requiring colorful lighting effects and dynamic changes;

[0027] 2. In this invention, chip-type lamp beads that can emit multi-color light integrate multiple LED chips of different colors within a single lamp bead and connect them in parallel, so that only one lamp bead is required to achieve two or more colors of light effects in a light string. This innovative design greatly improves production efficiency, reduces the number of lamp beads to be installed, and directly reduces the material cost of the light string. At the same time, due to the reduction in the number of lamp beads, the number of welding points and potential failure points is also halved, which not only simplifies the production process, but also significantly improves the overall yield rate and reliability of the light string.

[0028] 3. The LED lamp bead packaging method in this invention fully utilizes existing packaging technology. By adjusting the spacing between the packaging flow channels of the top mold, LED chips with different spacings can be packaged without requiring major improvements or upgrades to existing packaging technology. This not only reduces production costs but also improves production efficiency, making this new LED lamp bead structure more competitive in practical applications.

[0029] In summary, the present invention solves the problem that the current chip-type lamp bead bracket can only be molded with one color. If two colors are required, the chip is also used for lighting and phosphor cannot be used for debugging. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0031] FIG1 is a schematic diagram of a chip-type lamp bead structure capable of emitting multi-color light and a production method of the present invention;

[0032] FIG2 is a schematic diagram of the chip-type lamp bead structure after packaging according to a chip-type lamp bead structure and production method capable of emitting multi-color light of the present invention;

[0033] FIG3 is a schematic structural diagram of a support plate of a chip-type lamp bead structure capable of emitting multi-color light and a production method thereof according to the present invention;

[0034] FIG4 is a schematic structural diagram of a lower mold of a chip-type lamp bead structure capable of emitting multi-color light and a production method according to the present invention;

[0035] FIG5 is a schematic diagram of the structure after the A in FIG4 is enlarged;

[0036] FIG6 is a schematic diagram of the structure after the enlargement of B in FIG4;

[0037] Figure 7 is a diagram of the original chip-type bracket package;

[0038] Figure 8 is a schematic structural diagram of the original chip-type bracket;

[0039] Figure 9 shows a conventional die top mold. Modes for Carrying Out the Invention

[0040] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0041] Embodiment: This embodiment provides a chip-type lamp bead structure and production method that can emit multi-color light, see Figure 1-2, including an LED lamp bead 1, the LED lamp bead 1 includes a bracket 101, the bracket 101 provides physical support and electrical conduction basis for the entire LED lamp bead 1, one side of the top surface of the bracket 101 is fixedly connected to a first electrode sheet 102, and the other side of the top surface of the bracket 101 is fixedly connected to a second electrode sheet 103, the first electrode sheet 102 and the second electrode sheet 103 are arranged crosswise with each other, the first electrode sheet 102 and the second electrode sheet 103 are both fixedly connected to an LED chip 104, the first electrode sheet 102 and the second electrode sheet 103 are both electrically connected to the LED chip 104, and several LED chips 104 are in parallel relationship, and a packaging material 105 is fixedly connected above the LED chip 104, and the packaging material 105 is fixedly connected to the bracket 101, and the packaging material 105 is used to cover and protect the LED chip 104.

[0042] The overall shape of the first electrode sheet 102 and the second electrode sheet 103 is L-shaped, one end of the first electrode sheet 102 faces one side of the second electrode sheet 103, and the other side of the second electrode sheet 103 faces the other end of the first electrode sheet 103, and the first electrode sheet 103 and the second electrode sheet 103 together form a U-shape.

[0043] The packaging material 105 is a transparent epoxy resin, and colored phosphor is mixed in the packaging material 105 .

[0044] In the specific implementation process, as shown in Figures 1 to 11, when the external power supply is turned on, the current enters the bracket 101 through the pins or connecting wires of the LED lamp bead. The bracket 101 not only provides physical support for the entire lamp bead structure, but also serves as the basis for electrical conduction, evenly distributing the current to the first electrode sheet 102 and the second electrode sheet 103.

[0045] The first electrode sheet 102 and the second electrode sheet 103 are respectively connected to a plurality of LED chips 104. These chips are connected in series in a parallel manner and can independently draw current from the electrode sheet and emit light of a specific color according to their own characteristics. The advantage of this parallel structure design is that even if a problem occurs in a single LED chip, it will not affect the normal operation of other chips, thereby improving the reliability and flexibility of the entire system. If the multiple LED chips 104 are in a series relationship, gold wire is required to connect the multiple LED chips 104 in series when the LED chips 104 are installed upright. Due to the presence of gold wire between the LED chips 104, it is impossible to achieve independent packaging of a single LED chip 104. When the LED chips 104 are flipped, that is, the electrodes of the LED chips 104 are directly in contact with the electrode sheet, the multiple LED chips 104 cannot be connected in series.

[0046] The layout design of the electrode sheet breaks through the limitation of the traditional LED lamp bead bracket electrode sheet distribution in half. The first electrode sheet 102 and the second electrode sheet 103 are not simply distributed on both sides of the bracket 101, but are arranged in a mutually nested and staggered manner. This layout design not only optimizes space utilization, so that multiple LED chips 104 can be installed on the limited area of ​​the bracket 101, but also provides the possibility of individually packaging each LED chip 104, because each LED chip 104 can be independently connected to the electrode sheet part adjacent to it. After individual packaging, the gold wire used for welding the electrode sheet will not be exposed outside the packaging material 105. This individual packaging method also makes full use of existing packaging technology. By adjusting the spacing between the packaging flow channels of the mold top mold, the packaging of LED chips 104 with different spacings can be achieved without major improvements or upgrades to the existing packaging technology. This not only reduces production costs, but also improves production efficiency, making this new LED lamp bead structure more competitive in practical applications.

[0047] When the LED chip 104 emits light, the emitted light passes upward through the packaging material 105. The packaging material 105 is typically made of a transparent epoxy resin mixed with colored phosphors. The phosphors absorb some of the light emitted by the LED chip and emit light of another color. Therefore, inside the packaging material 105, the original light from the LED chip and the light converted by the phosphors overlap and mix with each other, creating a richer and softer color effect. Because multiple individually packaged LED chips 104 are mounted on the electrode sheet, the LED lamp beads using the new lamp bead structure can emit light of different colors.

[0048] After being mixed and diffused by the packaging material 105, the multi-color light is emitted from the LED lamp bead through the transparent portion of the packaging material, forming a visible multi-color light effect. This multi-color light can be used in various lighting and indication applications to provide a colorful atmosphere and visual effects for the environment.

[0049] The luminous color of the LED chip 104 and the type and ratio of the phosphor in the packaging material can be adjusted according to specific needs to achieve different multi-color light effects.

[0050] In addition, as shown in Figures 3-6, the present invention also provides a method for producing chip-type lamp beads capable of emitting multi-color light, including the following steps:

[0051] The first step is die bonding, which involves fixing the chip to the support plate.

[0052] Step S1: Dehumidify the support plate. This is a process to ensure that the support plate is dry and free of moisture in advance to prevent moisture from affecting the subsequent bonding effect. In this step, the support plate will be dehumidified at a high temperature of 170°C for 1 hour to fully remove the moisture inside and on the surface.

[0053] Step S2: The dehumidified bracket plate will be placed in a special material box and then sent to the production line for crystal bonding. During this period, the production equipment will be equipped with a fool-proof mechanism to prevent product quality problems caused by operational errors. At the same time, through PR recognition technology, it is ensured that during the crystal bonding process, special marks on the bracket plate, such as the "green oil dot", can be accurately identified to ensure that the first LED chip is fixed in the predetermined position, that is, in the direction of the green oil dot. This is because the green oil dot often represents the best crystal bonding position, which is beneficial to improving the luminous efficiency and stability of the lamp beads. The bracket plate is the raw material of the bracket 101, and the bracket plate is cut to form a number of brackets 101.

[0054] Step S3: During the die bonding process, identical or similar-looking LED chips with different parameters are placed in different work areas to avoid confusion and ensure product quality. Once the die bonding is complete, the material is dehumidified again, as a small amount of moisture may have been introduced during the die bonding process. After dehumidification, the material is transferred to the next step: wire bonding. This ensures a reliable connection between the chip and the electrodes on the support plate, forming a complete circuit path.

[0055] The second step is to solder wires to connect the positive and negative poles of the chip to the bracket.

[0056] Step S1: Before welding begins, carefully confirm the relevant parameters of the wire, including the welding time (1-6 milliseconds), the required welding power (40-70 watts), and the pressure applied during welding (15-25 MPa). The precise setting of these parameters is crucial to the quality of the wire and the performance of the LED.

[0057] Step S2: After ensuring all materials are correct, wire bonding begins. The bonded materials are stored in a moisture-proof cabinet, awaiting the next step. This prevents moisture from affecting the bonded LEDs, ensuring their electrical performance and reliability.

[0058] Step S3. In order to ensure the quality of wire bonding, the factory will regularly test the chip anti-foolproofing function of the wire bonding station, and the night shift staff will perform a comprehensive test once a week. Without affecting normal operations, a bracket board will be selected as a test sample, and the wire bonding starting unit on this bracket board will be reversed to perform anti-foolproofing tests on all wire bonding machines on the entire production line. For some machines that only contain a single electrode, there is no need to perform such anti-foolproofing tests. However, no matter what the circumstances, as long as it involves machine debugging, changing product models or chip types, it must be verified through the machine anti-foolproofing test before it can be turned on for operation, so as to prevent errors to the greatest extent possible and ensure the smoothness of the production process and the stability of product quality.

[0059] The third step is to use epoxy resin to encapsulate the material with solid die bonding wires. Different luminous colors can be achieved by combining different phosphors.

[0060] Step S1: Technicians adjust the ratio of phosphors based on the desired color to ensure the correct color is mixed during the packaging process. After the phosphors are mixed, the packaging material is formed into a gel cake and passed to the operator for the next step.

[0061] Step S2, after the operator receives the glue cake, he places it in the mold hole on the pre-prepared mold top mold. Before performing the mold top operation, the upper and lower molds of the machine will be evenly sprayed with a release agent to ensure that the packaging material does not stick to the mold when in contact with the mold, so as to facilitate subsequent separation. During the mold top operation, the bracket is first placed upside down on the lower mold 2 of the mold top mold, and the upper and lower molds are pressed and heated to melt the glue cake to form a glue mixture. The glue flows to and covers the LED chip. After the mold temperature drops and the glue solidifies, the mold can be opened to take out the material. During the mold top operation, the mold top mold pressure is set at 70-150 kilograms per square centimeter to ensure that the packaging material can fully penetrate and wrap the LED chip. The speed is set within the range of 50-100 seconds to ensure that the packaging material solidifies within the appropriate time; the temperature is controlled at 120-170 degrees Celsius to ensure that the packaging material melts and solidifies at a suitable temperature to form good optical and mechanical properties. Through the above rigorous operations and fine parameter control, the mold top process of the LED lamp bead is finally completed.

[0062] The top mold includes a lower mold 2, which includes a first mold top area 201 and a second mold top area 202. The second mold top area 202 has the same structure as the first mold top area 201. The first mold top area 201 includes a first support plate placement area 203 and a second support plate placement area 204.

[0063] The first mold top area 201 includes a first glue cake hole position 205 and a second glue cake hole position 206. The first glue cake hole position 205 is used to place the first color glue cake, and the second glue cake hole position 206 is used to place the second color glue cake. The first glue cake hole position 205 and the second glue cake hole position 206 are opened on the top surface of the lower mold 2. The positions of the first glue cake hole position 205 and the second glue cake hole position 206 are between the first bracket plate placement area 203 and the second bracket plate placement area 204. The lower mold 2 is provided with a plurality of holes on both sides of the first glue cake hole position 205. A first main glue channel 207 is provided on the lower mold 2 with a plurality of first auxiliary glue channels 208 on one side of the main glue channel 207, the main glue channel 207 is communicated with the first auxiliary glue channel 208, the lower mold 2 is provided with second main glue channels 209 on both sides of the second glue cake hole 206, the lower mold 2 is provided with a plurality of second auxiliary glue channels 210 on one side of the second main glue channel 209, the second main glue channel 209 is communicated with the second auxiliary glue channel 210, and the lower mold 2 is provided with exhaust holes 211 at one end of the first auxiliary glue channel 208 and the second auxiliary glue channel 210.

[0064] The bracket plate has positioning holes at each corner, which are placed on the top mold to prevent the bracket from shifting. The holes on both sides of the bracket plate are asymmetrical to prevent the bracket plate from being placed upside down.

[0065] The fourth process is cutting, which involves cutting the formed material into individual pieces according to size requirements.

[0066] Step S1: The operator selects a material that has completed the mold top process and applies high-temperature tape to the back of the material to facilitate fixation and subsequent cutting. The tape-covered material is placed with the backside facing up on the board mounting jig, ensuring that the holes in the support plate on the material align with the holes in the board mounting jig to achieve precise size and shape during cutting.

[0067] Step S2: Prepare a base film in advance and place it between the material with the aligned holes and the jig to ensure that the base film is tightly bonded to the material and the high-temperature tape. Use a cloth to smooth out the air and uneven areas between the base film and the material to enhance the bonding effect.

[0068] Step S3: Precisely cut the material that has been taped and fixed to the jig. After cutting, use an air gun to quickly dry any moisture on the surface of the material and remove any excess scraps.

[0069] Step S4: Use a jig to separate the cut material from the high-temperature tape, and place the material into a screening and shaking machine to further remove residual scraps to ensure the neatness and uniformity of the product.

[0070] Step S5: After completing the above steps, the screened material enters the polishing process, where it is polished using a grinder to ensure a smooth and even surface. After polishing, the material is cleaned to remove impurities such as grinding debris. After cleaning, the material is placed in an oven for dehumidification to ensure that the moisture inside the material is effectively removed. Finally, the dehumidified material is properly stored in a moisture-proof cabinet for subsequent processing.

[0071] The fifth process is splitting, splitting the cut materials according to customer requirements

[0072] Step S1: Arrange the LED lamp bead materials that have been cut, polished and cleaned to ensure that they are clean and dust-free. The spectrometer needs to be cleared before starting to work to remove the remaining debris or product fragments from the previous batch inside the machine. At the same time, the surface of the machine should be carefully cleaned to prevent the mixing of products from different batches or different specifications, which will affect the accuracy of the spectrometry results.

[0073] Step S2: Then, according to the customer's specific requirements and standards, set the various parameters of the spectrometer, such as spectral range, brightness level, color consistency, etc., to ensure that the LED lamp beads that meet the specifications can be accurately distinguished and screened. After the material sorting is completed, the qualified LED lamp beads are placed one by one in an electrostatic bag for packaging. The electrostatic bag can effectively prevent the damage caused by static electricity to the LED lamp beads and help keep them dry. The packaged lamp beads should be quickly placed in a moisture-proof cabinet for storage to prevent moisture from affecting product quality. After the spectroscopic process is completed, this batch of lamp beads can be transferred to the next process for further processing or packaged for shipment.

[0074] The sixth step: taping / packaging for shipment

[0075] Step S1: Transfer the LED lamp beads that meet the specifications after spectral separation to the backup area for classification and preparation. Lamp beads with the same parameters are placed in the same material box to facilitate management and subsequent automated operations. The sorted backup materials are loaded onto the taping machine.

[0076] Step S2: Before braiding, the braiding machine is thoroughly cleaned to ensure that there are no impurities or dust inside the equipment to prevent any impact on the quality of the LEDs and the braiding process. The prepared LED material is then poured into the circular vibrating plate. Vibration is used to evenly arrange the material, and the braiding process begins, securing the LEDs in an orderly manner to the carrier tape. The finished material is labeled on the reel, indicating important information such as the product model, specifications, and quantity.

[0077] Step S3: After the taping machine completes taping a roll of material, it scans and files it to ensure data accuracy. The fully taped reel of LED lamp beads is then placed in a dedicated aluminum foil bag for further moisture and anti-static protection. Finally, the sealed aluminum foil bag is placed in a cardboard box for storage. At this point, the LED lamp beads have completed the entire process, from production to packaging, and are ready for shipment to customers.

[0078] In contrast example 1, as shown in FIG7 and FIG8, conventional LED lamp beads generally adopt an electrode structure designed in half, that is, an anode and a cathode are located on opposite sides of the bracket 101, and the LED chip 104 is installed on the electrode sheet on one side when it is installed upright. In order to energize the LED chip 104, a gold wire must be used to connect the electrode of the LED chip 104 to the corresponding electrode sheet. At this time, one end of the gold wire crosses the insulating tape from the electrode sheet on one side and is connected to the electrode sheet on the other side. When packaging the LED chip 104, the gold wire must also be packaged. Therefore, no matter how many LED chips 104 are installed on the electrode sheet or which side of the electrode sheet the LED chip 104 is installed on, the packaging material must be used during packaging. The electrode sheets on both sides must be covered. When the LED chip 104 is flipped, there is no need to use gold wire to solder the LED chip 104 and the electrode sheets. However, the positive and negative electrodes of the LED chip 104 must be in contact with the electrode sheets on both sides respectively. Therefore, when the LED chip 104 is flipped, the LED chip 104 needs to be installed between the two electrode sheets. Due to the limitation of the installation position of the LED chip 104, when the flipped LED chip 104 is packaged, no matter how many LED chips 104 are installed on the bracket 101, they will all be covered by the same packaging material. In summary, the design of traditional electrode sheets often makes it possible for a single LED lamp bead 1 to only encapsulate and activate one color of phosphor, so that the light emitted by each chip is of a single color.

[0079] The chip-type lamp bead capable of emitting multi-color light of the present application, the first electrode sheet 102 and the second electrode sheet 103 are not simply arranged in half, but are nested on both sides of the bracket 101, and each electrode sheet can be fixed and connected with multiple individually packaged LED chips 104. Each individually packaged LED chip 104 can emit different light according to the color of the packaging material 105. The LED chips 104 are connected in parallel, which means that each chip 104 can be independently controlled and lit, thereby achieving different colors of light in the same lamp bead or producing more color effects through mixing.

[0080] Comparative Example 2, as shown in FIG9 , the conventional packaging mold has four adhesive cake placement areas, which are divided into two pairs. The main adhesive paths of the adhesive cake placement areas of the same pair are connected, and it is impossible to realize the simultaneous operation of two colors of adhesive powder.

[0081] The mold top mold rubber cake placement areas of the present application are different from each other, which can realize the simultaneous operation of two colors of rubber powder.

[0082] Based on the embodiments and comparative examples, the present invention solves the problem that the current chip-type lamp bead bracket can only be molded with one color. If two colors are required, the chip is also used for lighting, and the packaging material cannot be used for debugging.

[0083] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A chip-type lamp bead structure capable of emitting multi-color light, comprising an LED lamp bead (1), characterized in that: The LED lamp bead (1) comprises a bracket (101), wherein the bracket (101) provides a physical support and electrical conduction basis for the entire LED lamp bead (1); a first electrode sheet (102) is fixedly connected to one side of the top surface of the bracket (101); a second electrode sheet (103) is fixedly connected to the other side of the top surface of the bracket (101); the first electrode sheet (102) and the second electrode sheet (103) are nested with each other; the first electrode sheet (102) and the second electrode sheet (103) are both fixedly connected to an LED chip (104); the first electrode sheet (102) and the second electrode sheet (103) are both electrically connected to the LED chip (104); a packaging material (105) is fixedly connected above the LED chip (104); the packaging material (105) is fixedly connected to the bracket (101); and the packaging material (105) is used to cover and protect the LED chip (104).

2. The chip-type lamp bead structure capable of emitting multi-color light according to claim 1, characterized in that: The overall shape of the first electrode sheet (102) and the second electrode sheet (103) is L-shaped, one end of the first electrode sheet (102) faces one side of the second electrode sheet (103), and the other side of the second electrode sheet (103) faces the other end of the first electrode sheet (103), and the first electrode sheet (103) and the second electrode sheet (103) are enclosed to form a U-shaped.

3. The chip-type lamp bead structure capable of emitting multi-color light according to claim 1, characterized in that: The packaging material (105) is a transparent epoxy resin, and colored fluorescent powder is mixed in the packaging material (105).

4. A method for producing a chip-type lamp bead capable of emitting multi-color light according to any one of claims 1 to 3, characterized in that: The process includes the following steps: The first step is die bonding, which involves fixing the chip to the support plate; The second step is wire bonding to connect the positive and negative terminals of the chip to the bracket; The third step, mold top, uses epoxy resin to encapsulate the material with bonded die and wires. Different luminous colors can be achieved by combining different phosphors. The fourth process is cutting, which is to cut the formed material into single pieces according to the size requirements; The fifth process is splitting, which involves splitting the cut materials according to customer requirements; The sixth step: taping / packaging for shipment.

5. The method for producing a chip-type lamp bead capable of emitting multi-color light according to claim 4, characterized in that: The first process further comprises the following steps: By using PR recognition technology, it is ensured that during the crystal bonding process, the special mark on the bracket plate: the green oil dot can be accurately identified to ensure that the first LED chip is fixed in the predetermined position, i.e., the direction of the green oil dot. The bracket plate is the raw material of the bracket (101), and the bracket plate is cut to form a plurality of brackets (101).

6. The method for producing a chip-type lamp bead capable of emitting multi-color light according to claim 4, characterized in that: The third process further comprises the following steps: After receiving the glue cake formed by the packaging material, the operator places it in the mold hole on the pre-prepared mold top mold. Before performing the mold top operation, the upper and lower molds of the machine are evenly sprayed with a release agent to ensure that the packaging material does not stick to the mold when in contact, which is convenient for subsequent separation. During the mold top operation, the bracket is first placed upside down on the lower mold (2) of the mold top mold, and the upper and lower molds are pressed and heated to melt the glue cake and form a glue mixture. The glue flows to and covers the LED chip (104). After the mold temperature drops and the glue solidifies, the mold can be opened to remove the material.

7. The method for producing a chip-type lamp bead capable of emitting multi-color light according to claim 6, characterized in that: The top mold comprises a lower mold (2), the lower mold (2) comprising a first top mold area (201) and a second top mold area (202), the second top mold area (202) and the first top mold area (201) having the same structure in all parts, and the first top mold area (201) comprising a first support plate placement area (203) and a second support plate placement area (204).

8. The method for producing a chip-type lamp bead capable of emitting multi-color light according to claim 7, characterized in that: The first mold top area (201) includes a first rubber cake hole position (205) and a second rubber cake hole position (206). The first rubber cake hole position (205) and the second rubber cake hole position (206) are opened on the top surface of the lower mold (2). The first rubber cake hole position (205) is used to place a first color rubber cake, and the second rubber cake hole position (206) is used to place a second color rubber cake. The first rubber cake hole position (205) and the second rubber cake hole position (206) are located between the first support plate placement area (203) and the second support plate placement area (204). The lower mold (2) is A first main glue channel (207) is provided at both sides of the first glue cake hole (205), the lower mold (2) is provided with a plurality of first auxiliary glue channels (208) on one side of the main glue channel (207), the main glue channel (207) and the first auxiliary glue channels (208) are communicated with each other, the lower mold (2) is provided with a second main glue channel (209) at both sides of the second glue cake hole (206), the lower mold (2) is provided with a plurality of second auxiliary glue channels (210) on one side of the second main glue channel (209), the second main glue channel (209) and the second auxiliary glue channels (210) are communicated with each other.

9. The method for producing a chip-type lamp bead capable of emitting multi-color light according to claim 8, characterized in that: The lower mold (2) is provided with exhaust holes (211) at one end of each of the first auxiliary glue channel (208) and the second auxiliary glue channel (210).

10. The method for producing a chip-type lamp bead capable of emitting multi-color light according to claim 5, characterized in that: The four corners of the bracket plate are provided with positioning holes, and the positioning holes are placed correspondingly on the mold top mold to prevent the bracket from shifting. The hole positions on both sides of the bracket plate are asymmetrical to prevent the bracket plate from being placed upside down.

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