Coating device and method therefor

Abstract

The present disclosure relates to the field of integrated circuits, and particularly relates to a coating device and a method therefor. The coating device comprises: a chamber; a carrier plate located within the chamber, the carrier plate being used to place a substrate, and the carrier plate being insulated from the chamber; a power supply apparatus, comprising a bias power supply, a suppression power supply, a power supply switching unit and a detection unit, the bias power supply and the suppression power supply being electrically connected to the carrier plate by means of the power switching unit, the power switching unit being used to switch the carrier plate between connection to the bias power supply and the suppression power supply, and the detection unit being used to detect a current value of a bias loop during coating and send an arc signal when the current value exceeds a preset current value; a coating apparatus, comprising a target material and a coating power supply, the coating power supply being used to apply voltage to the target material during coating; and a control apparatus, connected to the detection unit, the power switching unit and the coating power supply, the control apparatus being used to, upon receiving the arc signal from the detection unit, control the power switching unit to electrically connect the suppression power supply to the carrier plate, and cause the bias power supply to output an idle load.

Description

Coating equipment and method Technical Field

[0001] The present disclosure relates to the technical field of integrated circuits, and in particular to a coating device and a method thereof. Background Art

[0002] When vacuum coating a substrate, a coating power supply is typically used in conjunction with a magnetron cathode to generate a plasma. Ions bombard the target material, which then settles onto the substrate surface, completing the coating process. This causes a large amount of electrons to accumulate on the carrier plate used to hold the substrate during the coating process. When this accumulation reaches a certain level, arcing occurs at the contact point between the carrier plate and the substrate, damaging the substrate.

[0003] In the related art, when arcing is about to occur, the coating power is often turned off, and the coating process is continued after the electrons on the substrate dissipate. In order to improve the efficiency of the coating process, a method of accelerating the rate of electron dissipation on the substrate is urgently needed. Summary of the Invention

[0004] Based on this, it is necessary to provide a coating device and method thereof to address the problem of slow electron dissipation on the carrier in the prior art.

[0005] In order to achieve the above object, a coating device is provided, comprising:

[0006] cavity;

[0007] A carrier plate is located in the cavity, the carrier plate is used to place the substrate, and the carrier plate is insulated from the cavity;

[0008] A power supply device, comprising a bias power supply, a suppression power supply, a power conversion unit, and a detection unit, wherein the bias power supply and the suppression power supply are both electrically connected to the carrier via the power conversion unit, the power conversion unit being used to switch the carrier between the bias power supply and the suppression power supply, and the detection unit being used to detect a current value of the bias circuit during film deposition and to send an arc signal when the current value exceeds a preset current value;

[0009] A film coating device, comprising a target material and a film coating power supply, wherein the film coating power supply is used to apply a voltage to the target material during film coating;

[0010] A control device is connected to the detection unit, the power conversion unit and the coating power supply. The control device is used to control the power conversion unit to electrically connect the suppression power supply and the carrier board and make the bias power supply output no-load when receiving the arc signal sent by the detection unit.

[0011] In one embodiment, the power conversion unit includes a switching circuit, which is connected between the bias power supply and the carrier, and between the suppression power supply and the carrier. When the control device receives the arc signal sent by the detection unit, it controls the switching circuit to disconnect the circuit between the bias power supply and the carrier, and to connect the circuit between the suppression power supply and the carrier.

[0012] In one embodiment, the bias power supply provides a negative voltage to the carrier, the suppression power supply provides a ground potential to the carrier, and the suppression power supply has the same potential as the housing surface of the coating device.

[0013] In one embodiment, the bias power supply provides a negative voltage to the carrier, and the suppression power supply provides a positive voltage to the carrier.

[0014] In one embodiment, the carrier is provided with a guide rail, and a plurality of power supply rollers are provided at the bottom of the cavity. The power supply rollers are matched with the guide rail so that the carrier moves on the plurality of power supply rollers, and the power supply rollers are electrically connected to the bias power supply and the suppression power supply.

[0015] In one embodiment, the power roller includes:

[0016] a supporting base, contacting the cavity;

[0017] A bias feed interface, located on the surface of the support base, for connecting to the bias power supply and the suppression power supply;

[0018] A transmission member is located on a side of the power supply roller away from the support base and is used for overlapping the guide rail. The transmission member is electrically connected to the bias feed interface.

[0019] In one embodiment, the bias voltage feed interface is electrically connected to the bias power supply and the suppression power supply through the power conversion unit.

[0020] In one aspect, a coating method is provided, which uses the aforementioned coating device, comprising:

[0021] Controlling the coating power supply to provide a coating voltage to the target material, and controlling the bias power supply to provide power to the carrier board;

[0022] Detecting the current value of the bias circuit;

[0023] When the arc signal is received, the carrier is controlled to switch from being electrically connected to the bias power supply to being electrically connected to the suppression power supply.

[0024] In one embodiment, when the arc signal is received, controlling the carrier to switch from being electrically connected to the bias power supply to being electrically connected to the suppression power supply includes:

[0025] When the duration of the carrier board being electrically connected to the suppression power source reaches a preset duration, the carrier board is controlled to switch from being electrically connected to the suppression power source to being electrically connected to the bias power source.

[0026] In one embodiment, the preset time length is between 10 μs and 1000 μs.

[0027] The present disclosure relates to a coating device in which a bias power supply and a detection unit are provided, enabling the detection unit to detect the current in the bias circuit in real time. When the current exceeds a preset value, the detection unit sends an arcing signal to a control device. Simultaneously, the control device controls a power conversion unit to electrically connect a suppression power supply to a carrier board and to idle the bias power supply output. This further accelerates the diffusion of electrons on the substrate, thereby preventing arcing and protecting the substrate. This shortens the duration of the coating power supply shutdown and increases the efficiency of the coating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the traditional technology, the following briefly introduces the drawings required for use in the embodiments or the description of the traditional technology. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] FIG1 is a schematic diagram of a coating device provided in one embodiment;

[0030] FIG2 is a schematic diagram of a carrier board provided in one embodiment;

[0031] 3 to 5 are schematic diagrams of coating equipment provided in different embodiments;

[0032] FIG6 is a diagram showing the relationship between detection current and time provided in one embodiment;

[0033] FIG7 is a schematic diagram of a carrier board provided in another embodiment;

[0034] FIG8 is a schematic diagram of a power supply roller provided in one embodiment;

[0035] FIG9 is a schematic diagram of a coating device provided in yet another embodiment;

[0036] 10 and 11 are schematic diagrams of process chambers provided in different embodiments;

[0037] 12 to 13 are flow charts of coating methods provided in different embodiments.

[0038] Explanation of the reference numerals: coating device 100; chamber 110; transition chamber 111; deposition chamber 112; carrier 120; guide rail 121; power supply 130; bias power supply 131; suppression power supply 132; power conversion unit 133; detection unit 134; coating device 140; control device 150; power supply roller 160; support base 161; bias feed interface 162; transmission member 163; support member 164; bearing 165; insulating screw sleeve 166; insulating spacer 167; insulating roller 170; vacuum feed electrode 180; high temperature resistant wire 190; substrate 200; electronics 300.

[0039] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more of the accompanying drawings. The additional details or examples used to describe the accompanying drawings should not be considered to limit the scope of the disclosed inventions, the presently described embodiments and / or examples, and any of the best modes currently understood for these inventions. DETAILED DESCRIPTION

[0040] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0042] In each embodiment, unless otherwise specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two elements, or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in each embodiment based on the specific circumstances.

[0043] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0044] It will be understood that when an element or layer is referred to as being “on,” “adjacent,” or “connected to” another element or layer, it can be directly on, adjacent, or connected to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly adjacent,” or “directly connected to” another element or layer, there are no intervening elements or layers present.

[0045] Spatially relative terms such as "under," "beneath," "beneath," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0046] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0047] While the embodiments are described herein with reference to schematic diagrams representing idealized embodiments of the present disclosure, variations in the illustrated shapes due to, for example, manufacturing techniques are to be expected. Therefore, the embodiments should not be limited to the specific shapes of the regions illustrated herein, but rather include deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature; their shapes do not represent the actual shape or specific location of a device and do not limit the scope of the embodiments.

[0048] As discussed in the background, referring to Figures 1 and 2 , when electrons 300 accumulate to a certain level, arcing may occur at the contact point between carrier 120 and substrate 200, damaging substrate 200. For example, when preparing a transparent conductive oxide (TCO) film for a heterojunction cell, a coating power supply delivers power to the target, ionizing the gas to generate plasma and coating. The target can be a cylindrical target, and the coating process can be physical vapor deposition (PVD).

[0049] When carrier 120 is suspended, the difference in conductivity between substrate 200 (e.g., a silicon wafer) and carrier 120 (e.g., a metal carrier 120) causes a difference in the amount of electrons accumulated on substrate 200 and carrier 120, resulting in a potential difference between the two. Since electrons 300 are more easily transported on carrier 120, arcing occurs at the edge of substrate 200 (e.g., point A in FIG2 ). At this point, the arc generated between substrate 200 and carrier 120 is sufficient to penetrate substrate 200, rendering it unreworkable and scrapped. Furthermore, in the prior art, arcing between substrate 200 and carrier 120 cannot be suppressed.

[0050] Based on this, in one embodiment, referring to FIG3 to FIG5 , this embodiment provides a coating device 100 , which includes a chamber 110 , a carrier plate 120 , a power supply 130 , a coating device 140 , and a control device 150 .

[0051] The cavity 110 may be a housing for performing a coating process. The cavity 110 includes an outer shell and an internal accommodating space. This embodiment does not impose specific restrictions on parameters such as the size and shape of the cavity 110.

[0052] The carrier 120 is used to hold the substrate 200. The carrier 120 and the substrate 200 are located within the cavity 110. It is understood that the carrier 120 can be insulated from the cavity 110. For example, the carrier 120 can be made of a conductive material such as metal, while the cavity 110 can be made of an insulating material. The carrier 120 can be located at the bottom of the cavity 110 and connected via a support structure.

[0053] The coating apparatus 140 includes a target and a coating power supply. The coating power supply is used to apply voltage to the target during coating. For example, the coating power supply may include a cathode. During coating, the cathode transmits power to the target by emitting electrons 300. The coating apparatus 140 may be located on the top or sidewall of the chamber 110.

[0054] The power supply device 130 may be located outside the cavity 110. The power supply device 130 includes a power supply, a power conversion unit 133, and a detection unit 134. The power supply includes a bias power supply 131 and a suppression power supply 132.

[0055] The bias power supply 131 and the suppression power supply 132 are both electrically connected to the carrier 120 through the power conversion unit 133 to supply power to the carrier 120. As an example, the bias power supply 131 can provide a negative bias voltage to the carrier 120, and the suppression power supply 132 can provide a positive bias voltage or a ground potential to the carrier 120. Specifically, when the suppression power supply 132 provides a positive bias voltage to the carrier 120, the suppression power supply 132 can be a regulated power supply, or the suppression power supply 132 can be a pulse power supply. When the suppression power supply 132 provides a ground potential (the ground potential can be 0V voltage) to the carrier 120, the suppression power supply 132 is a grounded power supply. At this time, illustratively, the suppression power supply 132 can be located on the surface of the outer shell. At this time, the suppression power supply 132 is at the same potential as the shell surface of the coating equipment 100. This embodiment does not limit the specific voltages of the bias power supply 131 and the suppression power supply 132.

[0056] The power conversion unit 133 is used to switch the carrier 120 between the bias power supply 131 and the suppression power supply 132. As an example, the power conversion unit 133 controls one of the bias power supply 131 and the suppression power supply 132 to supply power to the carrier 120, while the other outputs no load.

[0057] The detection unit 134 is used to detect the current value of the bias circuit during film deposition. As an example, the detection unit 134 includes an ammeter. During film deposition, the coating power supply is turned on, and the bias power supply 131 supplies power to the carrier 120. Plasma fills the chamber 110, creating a bias circuit between the bias power supply 131, the carrier 120, the plasma, and the ground. As the coating process progresses, the number of electrons 300 accumulated on the carrier 120 gradually increases, causing the current in the circuit to gradually increase. The detection unit 134 detects the current value of this circuit to determine whether arcing is about to occur.

[0058] The detection unit 134 can be connected to the carrier 120 to detect the current value in the circuit of the carrier 120. The detection unit 134 can also be integrated with the bias power supply 131 to obtain the current value in the circuit through the change of the bias power supply 131.

[0059] The control device 150 is connected to the detection unit 134, the power conversion unit 133, and the coating power supply. For example, the control device 150 can be connected to the detection unit 134, the power conversion unit 133, and the coating power supply via a wireless network, Bluetooth, or other means. Alternatively, the control device 150 can be electrically connected to the detection unit 134, the power conversion unit 133, and the coating power supply via wires or other means.

[0060] 6 , when the current value exceeds a preset current value, indicating that arcing is about to occur, the detection unit 134 sends an arcing signal to the control device 150. As an example, when the detection unit 134 and the control device 150 are electrically connected, the arcing signal can be a high or low level.

[0061] During film deposition, the control device 150 can control the on and off of the deposition power supply. When the deposition power supply is on, the control device 150 controls the power conversion unit 133 to electrically connect the bias power supply 131 to the carrier 120. When the control device 150 receives an arc signal, the control device 150 controls the power conversion unit 133 to switch the connection between the suppression power supply 132 and the carrier 120 and to set the bias power supply 131 to an idle state.

[0062] When the control device 150 receives an arc signal, the coating power supply can remain on, without interrupting the coating process. Of course, the coating power supply can also be temporarily turned off to allow the electrons 300 to diffuse into the plasma more quickly. This embodiment does not limit the state of the coating power supply when the control device 150 receives an arc signal.

[0063] Referring to Figure 6 , the control device 150 can start timing after receiving an arcing signal. When the timing reaches a preset duration, the control device 150 controls the power conversion unit 133 to switch the connection between the bias power supply 131 and the carrier 120. For example, the preset duration can be between 10 μs and 1000 μs. The control device 150 can be equipped with electronic components such as a timer or structures such as gears to achieve timing.

[0064] In this embodiment, a bias power supply 131 and a detection unit 134 are provided so that the detection unit 134 can detect the current in the carrier 120 circuit in real time. When the current exceeds a preset value, the detection unit 134 sends an arcing signal to the control device 150. A power conversion unit 133 is provided to switch the connection between the suppression power supply 132 and the bias power supply 131 to control the suppression power supply 132 to supply power to the carrier 120. This accelerates the diffusion of electrons 300 on the substrate 200, prevents arcing, protects the substrate 200, and improves the efficiency of the coating process.

[0065] In one embodiment, the power conversion unit 133 includes a switching circuit.

[0066] The switching circuit is connected between the bias power supply 131 and the carrier 120, and between the suppression power supply 132 and the carrier 120. During deposition, the switching circuit connects the bias power supply 131 and the carrier 120. Upon receiving an arc signal from the detection unit 134, the control device 150 controls the switching circuit to disconnect the circuit between the bias power supply 131 and the carrier 120 and connect the circuit between the suppression power supply 132 and the carrier 120.

[0067] In one example, the switch circuit may include a single-pole double-throw switch, wherein one end of the single-pole double-throw switch is connected to the carrier board 120 , and the other end is connected to the bias power supply 131 or the suppression power supply 132 .

[0068] In another example, the switching circuit may include two metal oxide semiconductor field effect (MOS) transistors. Specifically, one of a PMOS tube or an NMOS tube is set between the bias power supply 131 and the carrier 120, and the other is set between the suppression power supply 132 and the carrier 120. The gate of the PMOS tube and the gate of the NMOS tube are commonly connected to the detection unit 134. When the current value exceeds the preset current value, the detection unit 134 sends a high level (or low level) arc signal to the control device 150. When a high level (or low level) is received, one of the PMOS tube or the NMOS tube is turned on and the other is turned off. In this way, the purpose of switching the power conversion unit 133 to connect the bias power supply 131 or the suppression power supply 132 can be achieved.

[0069] It can be understood that the above-mentioned switching circuit can also adopt other forms such as relays, and is not limited to the forms mentioned in the above embodiments, as long as it can achieve the function of completing the switching circuit.

[0070] In one embodiment, as shown in Figure 7 , the carrier 120 is provided with guide rails 121. The guide rails 121 are located on opposite sides of the carrier 120. Furthermore, a plurality of power rollers 160 are provided at the bottom of the cavity 110. When the power rollers 160 are connected to a power source, they engage with the guide rails 121. This allows the carrier 120 to move along the plurality of power rollers 160 within the cavity 110.

[0071] As an example, referring to FIG. 8 , the power roller 160 includes a support base 161 , a bias voltage feeding interface 162 , and a transmission member 163 .

[0072] The support base 161 contacts the cavity 110. In this case, the support base 161 can be insulated from the cavity 110. As an example, the material of the support base 161 can be rubber or plastic. Further, a schematic diagram of the support base 161 is shown in the left figure of Figure 8.

[0073] The bias feed port 162 is located on the surface of the support base 161. The bias feed port 162 can be used to connect a wire to the power supply. For example, the bias feed port 162 can be located on the surface of the support base 161. In this case, an insulating screw sleeve 166 can be provided between the bias feed port 162 and the support base 161.

[0074] The transmission member 163 is used to overlap the guide rail 121. It is understood that the material of the transmission member 163 can include conductive metals such as copper, aluminum or tungsten.

[0075] Furthermore, the power roller 160 may include a metal support member 164 and a bearing 165. The support member 164 and the bearing 165 electrically connect the bias feed interface 162 and the transmission member 163. For example, the support member 164 extends from the interior of the support base 161 to the transmission member 163. In this case, an insulating spacer 167 is provided between the support member 164 and the support base 161. The bearing 165 is located on the side of the support member 164 near the transmission member 163 to facilitate the rotation of the transmission member 163.

[0076] In one example, referring to Figures 9 to 11, the bias feed interface 162 is located inside the cavity 110. At this time, the coating device 100 also includes a vacuum feed electrode 180. The vacuum feed electrode 180 can pass through the cavity 110. Specifically, one end of the vacuum feed electrode 180 can be located outside the cavity 110 to connect to the power supply, and the other end can be located inside the cavity 110 to connect to the bias feed interface 162 of the power roller 160. As an example, the vacuum feed electrode 180 can include a ceramic shell and an internal copper electrode, and the power supply is connected to the copper electrode of the vacuum feed electrode 180. At this time, the bias feed interface 162 is electrically connected to the power supply through the power conversion unit 133.

[0077] The vacuum feeding electrode 180 can connect a bias power supply 131 and one or more power rollers 160. Alternatively, the vacuum feeding electrode 180 can connect multiple bias power supplies 131 and multiple power rollers 160. For example, the vacuum feeding electrode 180 can be connected to the bias feeding interface 162 of each power roller 160 via a high-temperature resistant wire 190.

[0078] In another example, the bias voltage feed interface 162 is located outside the cavity 110. In this case, as shown in FIG10 , power can also be supplied to the carrier 120 via the support member 164 and bearing 165 of the power roller 160. It will be appreciated that the bias voltage feed interface 162 in this embodiment is not limited to that shown in FIG10 or FIG11 , as long as the location where the bias power supply 131 and the suppression power supply 132 connect to the power roller 160 is insulated from the cavity 110 and ensures effective electrical connection to the carrier 120.

[0079] In this embodiment, a power supply roller 160 is provided at the bottom of the cavity 110, so that the transmission member 163 of the power supply roller 160 is overlapped with the carrier 120 through the gravity of the carrier 120 and / or the substrate 200 itself, thereby enabling the bias power supply 131 and the suppression power supply 132 to better supply power to the carrier 120 through the power supply roller 160.

[0080] In one embodiment, an insulating roller 170 may be further provided at the bottom of the cavity 110. The insulating roller 170 may be made entirely of insulating material. The shape and size of the outer shell of the insulating roller 170 may be consistent with the shape and size of the power supply roller 160, so that the insulating roller 170 can also be matched with the guide rail 121.

[0081] Referring to Figure 11 , the coating apparatus further includes alternating transition chambers 111 and deposition chambers 112. In the direction of movement of the carrier plate 120, the length of the carrier plate 120 is shorter than the length of the transition chamber 111, preventing the carrier plate 120 from spanning the two chambers 110. This ensures that chambers for different target materials and processes do not interfere with each other.

[0082] The deposition chamber 112 may be a chamber for depositing a film layer, in which case the transition chamber 111 serves as a transition, and no target is disposed in the transition chamber 111. The transition chamber 111 may be the chamber 110 between two adjacent deposition chambers 112, or the transition chamber 111 may surround the deposition chamber 112.

[0083] The bottom of the transition chamber 111 can be entirely lined with insulating rollers 170. It will be appreciated that there is no target material within the transition chamber 111, so the bottom of the transition chamber 111 can be entirely lined with insulating rollers 170. The bottom of the deposition chamber 112 can be entirely lined with power rollers 160, or the bottom of the deposition chamber 1122 can have insulating rollers 170 and power rollers 160 arranged alternately to reduce costs.

[0084] In addition, in the deposition chamber 112, the position selection for the power roller 160 is related to the width of the chamber 110 and the length of the carrier 120. When the carrier 120 is in the deposition chamber 112, it is necessary to contact one or more power rollers 160 in the deposition chamber 112.

[0085] In one embodiment, the bias power supply 131 provides a bias voltage to the carrier 120 , the absolute value of which is greater than the floating potential of the carrier 120 .

[0086] When the absolute value of the bias voltage provided by the bias power supply 131 to the carrier 120 is smaller than the floating potential of the carrier 120, the carrier 120 is still at the floating potential. In this case, the bias power supply 131 has little effect on the carrier 120 (or substrate 200).

[0087] When the bias power supply 131 provides the carrier 120 with a bias voltage whose absolute value is greater than the floating potential of the carrier 120, the carrier 120 is set to a negative potential. At this time, for example, by adjusting this negative potential, it is possible to control the sheath voltage drop on the surface of the carrier 120, thereby reducing the bombardment energy of negative ions (mainly oxygen negative ions as a sputtering byproduct) with large kinetic energy on the surface of the substrate 200 during the TCO thin film coating process. The negative potential carrier 120 repels negative ions, thereby effectively slowing down the negatively charged particles and reducing the number of negatively charged particles arriving, thereby reducing the damage to the product caused by the bombardment of negatively charged particles and improving the performance of the substrate 200 device. Of course, this potential cannot be too large. If it is too large, there will be strong bombardment of argon ions, thereby damaging the device.

[0088] Based on the same inventive concept, one or more embodiments of the present application further provide a coating method involving a coating device. The solution to the problem provided by this method can be applied to the coating device involved in any of the aforementioned embodiments, and this method is similar to the solution described in the aforementioned embodiments. Therefore, the specific limitations in one or more method embodiments provided below can refer to the limitations on the coating device described above.

[0089] In one embodiment, the coating method can be applied to the control device 150. Referring to FIG. 12 and FIG. 13 , the coating method includes the following steps:

[0090] Step S2 : controlling the coating power supply to provide a coating voltage to the target, and controlling the bias power supply 131 to provide power to the carrier 120 .

[0091] Step S4: Detecting the current value of the bias circuit.

[0092] Step S6 : When an arc signal is received, the carrier board 120 is controlled to switch from being electrically connected to the bias power supply 131 to being electrically connected to the suppression power supply 132 .

[0093] In step S2, when the substrate 200 and carrier 120 reach a designated position (e.g., when the substrate 200 and carrier 120 are below the target), the control device 150 turns on the deposition power supply, which emits electrons 300 to bombard the target. The control device 150 controls the power conversion unit 133 to electrically connect the bias power supply 131 to the carrier 120. A bias circuit is established between the bias power supply 131, the carrier 120, the plasma, and the ground.

[0094] In step S4, the detection unit 134 can detect the current value in the bias circuit in real time. When the current value exceeds a preset current value, it indicates that arcing is about to occur. At this time, the detection unit 134 sends an arcing signal to the control device 150.

[0095] In step S6, when an arc signal is received, the control device 150 further controls the power conversion unit 133 to switch to the suppression power supply 132. At this time, the electrons 300 on the carrier 120 can be accelerated to diffuse into the plasma.

[0096] In this embodiment, a detection unit 134 is provided to detect the current value and send an arcing signal to the control device 150, thereby achieving real-time current detection and preventing arcing. Furthermore, the power conversion unit 133 switches between the suppression power supply 132 and the bias power supply 131, so that the suppression power supply 132 supplies power to the carrier 120, accelerating the diffusion of electrons 300 and shortening the diffusion time of electrons 300, thereby improving the coating efficiency.

[0097] In one embodiment, after step S6, the following steps are included:

[0098] Step S8 : When the duration of the carrier 120 being electrically connected to the suppression power source 132 reaches a predetermined duration, the carrier 120 is controlled to switch from being electrically connected to the suppression power source 132 to being electrically connected to the bias power source 131 .

[0099] When the control device 150 receives the arc signal, it can start timing. When the timing reaches a preset time, the control device 150 controls the power conversion unit 133 to switch the connection between the bias power supply 131 and the carrier 120. For example, the preset time can be between 10μs and 1000μs.

[0100] It should be understood that, although the steps in the flowcharts of FIG. 12 and FIG. 13 are shown sequentially as indicated by the arrows, these steps are not necessarily executed sequentially in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Furthermore, referring to FIG. 12 and FIG. 13 , at least a portion of the steps may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times. The order of execution of these steps or stages is not necessarily sequential, but can be executed in rotation or alternation with other steps or at least a portion of steps or stages in other steps.

[0101] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the patent disclosed herein shall be determined by the appended claims.

Claims

1. A coating device, characterized in that: include: cavity; A carrier plate is located in the cavity, the carrier plate is used to place the substrate, and the carrier plate is insulated from the cavity; A power supply device, comprising a bias power supply, a suppression power supply, a power conversion unit, and a detection unit, wherein the bias power supply and the suppression power supply are both electrically connected to the carrier via the power conversion unit, the power conversion unit being used to switch the carrier between the bias power supply and the suppression power supply, and the detection unit being used to detect a current value of the bias circuit during film deposition and to send an arc signal when the current value exceeds a preset current value; A film coating device, comprising a target material and a film coating power supply, wherein the film coating power supply is used to apply a voltage to the target material during film coating; A control device is connected to the detection unit, the power conversion unit and the coating power supply. The control device is used to control the power conversion unit to electrically connect the suppression power supply and the carrier board and make the bias power supply output no-load when receiving the arc signal sent by the detection unit.

2. The coating equipment according to claim 1, characterized in that: The power conversion unit includes a switching circuit, which is connected between the bias power supply and the carrier, and between the suppression power supply and the carrier. When the control device receives the arc signal sent by the detection unit, it controls the switching circuit to disconnect the circuit between the bias power supply and the carrier, and to connect the circuit between the suppression power supply and the carrier.

3. The coating equipment according to claim 1, characterized in that: The bias power supply provides a negative voltage to the carrier board, the suppression power supply provides a ground potential to the carrier board, and the suppression power supply has the same potential as the shell surface of the coating device.

4. The coating equipment according to claim 1, characterized in that: The bias power supply provides a negative voltage to the carrier board, and the suppression power supply provides a positive voltage to the carrier board.

5. The coating equipment according to claim 1, characterized in that: The carrier is provided with a guide rail, and a plurality of power supply rollers are provided at the bottom of the cavity. The power supply rollers are matched with the guide rail so that the carrier moves on the plurality of power supply rollers. The power supply rollers are electrically connected to the bias power supply and the suppression power supply.

6. The coating equipment according to claim 5, characterized in that: The power supply roller includes: a supporting base, contacting the cavity; A bias feed interface, located on the surface of the support base, for connecting to the bias power supply and the suppression power supply; A transmission member is located on a side of the power supply roller away from the support base and is used for overlapping the guide rail. The transmission member is electrically connected to the bias feed interface.

7. The coating equipment according to claim 6, characterized in that: The bias voltage feeding interface is electrically connected to the bias power supply and the suppression power supply through the power conversion unit.

8. A coating method, using the coating device according to any one of claims 1 to 7, characterized in that: include: Controlling the coating power supply to provide a coating voltage to the target material, and controlling the bias power supply to provide power to the carrier board; Detecting the current value of the bias circuit; When the arc signal is received, the carrier is controlled to switch from being electrically connected to the bias power supply to being electrically connected to the suppression power supply.

9. The film coating method according to claim 8, characterized in that: When the arc signal is received, the carrier is controlled to switch from being electrically connected to the bias power supply to being electrically connected to the suppression power supply, comprising: When the duration of the carrier board being electrically connected to the suppression power source reaches a preset duration, the carrier board is controlled to switch from being electrically connected to the suppression power source to being electrically connected to the bias power source.

10. The film coating method according to claim 9, characterized in that: The preset time length is between 10 μs and 1000 μs.

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