Sensor, thermal management system, and vehicle

Abstract

A sensor, a thermal management system, and a vehicle. The sensor comprises a housing, a temperature measurement assembly, a support frame, and a circuit board. The temperature measurement assembly is adapted to be in positioning fit with the housing, and the temperature measurement assembly is used for measuring the temperature of a medium. The support frame is arranged in the housing. The circuit board is adapted to be arranged on the support frame, and the temperature measurement assembly is electrically connected to the circuit board.

Description

Sensors, thermal management systems and vehicles

[0001] This application claims priority to Chinese patent application No. 202410338831.3, filed on March 20, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the technical field of detection equipment, and in particular to a sensor, a thermal management system, and a vehicle. Background Art

[0003] A sensor is a detection device that can sense the information being measured and convert the sensed information into electrical signals or other required forms of information output according to certain rules to meet the requirements of information transmission, processing, storage, display, recording and control. Summary of the Invention

[0004] The present disclosure aims to solve at least one of the technical problems existing in the related art. To this end, one purpose of the present disclosure is to provide a sensor that can prevent misalignment between a temperature measuring component and a housing during assembly, thereby ensuring the accuracy of the sensor during measurement. The circuit board is suitable for being arranged on a support frame, ensuring the stable and reliable electrical connection between the circuit board and the temperature measuring component, and ensuring the accuracy and stable reliability of temperature measurement. At the same time, the support frame can prevent the circuit board from colliding with the housing and being damaged, thereby protecting the circuit board. Moreover, the temperature measuring component and the support frame are both arranged in the housing, which is convenient for assembly and saves production costs.

[0005] The present disclosure further provides a thermal management system.

[0006] The present disclosure also provides a vehicle.

[0007] A sensor according to an embodiment of the first aspect of the present disclosure includes: a housing, a temperature measurement assembly, a support frame, and a circuit board. The temperature measurement assembly is adapted to be positioned and engaged with the housing and is used to measure the temperature of a medium; the support frame is disposed within the housing; the circuit board is adapted to be disposed on the support frame, and the temperature measurement assembly is electrically connected to the circuit board.

[0008] According to some embodiments of the present disclosure, the support frame is provided with a main body portion and a circuit board limiting portion, the circuit board limiting portion is provided on the main body portion, and the circuit board limiting portion is suitable for limiting cooperation with the side wall of the circuit board.

[0009] According to some embodiments of the present disclosure, the circuit board is a ceramic circuit board.

[0010] According to some embodiments of the present disclosure, a first edge is defined between the bottom wall of the circuit board and the side wall of the circuit board, and a plurality of contact points that contact the main body portion or the circuit board limiting portion are provided on the first edge, and any one of the plurality of contact points does not contact the main body portion and the circuit board limiting portion at the same time.

[0011] According to some embodiments of the present disclosure, a limiting surface is provided on a side surface of the circuit board limiting portion facing the circuit board, and the limiting surface is suitable for limiting cooperation with a side wall of the circuit board.

[0012] According to some embodiments of the present disclosure, a guide surface is further provided on a side surface of the circuit board limiting portion facing the circuit board, the guide surface is connected to the limiting surface, and the guide surface is used to guide the assembly of the circuit board.

[0013] According to some embodiments of the present disclosure, a avoiding portion is provided on the main body, and the avoiding portion is arranged opposite to the circuit board limiting portion.

[0014] According to some embodiments of the present disclosure, the avoidance portion is one of a groove, a through hole and an opening. When the avoidance portion is the groove, part of the circuit board limiting portion is arranged in the groove, and at least the side wall of the circuit board limiting portion facing the circuit board is spaced apart from the corresponding side wall of the groove.

[0015] According to some embodiments of the present disclosure, the circuit board limiting portion is connected to the bottom wall of the sink.

[0016] According to some embodiments of the present disclosure, the circuit board is non-circular, a second edge is defined between two side walls of the circuit board, and the main body is provided with an avoidance opening at a position corresponding to the second edge.

[0017] According to some embodiments of the present disclosure, one of the support frame and the shell is provided with a positioning hole, and the other of the support frame and the shell is provided with a positioning column, and the positioning column is fitted in the positioning hole.

[0018] According to some embodiments of the present disclosure, the temperature measurement assembly includes: a base and a temperature measurement element. The base is disposed in the housing and electrically connected to the circuit board; the temperature measurement element is disposed in the base and electrically connected to the base.

[0019] According to some embodiments of the present disclosure, the base includes: a base body, which is provided with a first through hole; a conductive sheet, which is matched with the first through hole, the first end of the conductive sheet is electrically connected to the temperature measuring element, and the second end of the conductive sheet is electrically connected to the circuit board.

[0020] According to some embodiments of the present disclosure, the seat body includes a seat plate and a boss, the boss is provided on the seat plate and protrudes from the seat plate along a first direction, and the boss is suitable for supporting the second end of the conductive sheet.

[0021] According to some embodiments of the present disclosure, the through hole penetrates the seat plate and the boss along a first direction.

[0022] According to some embodiments of the present disclosure, a receiving groove is formed on a surface of the boss away from the seat plate, and the second end is adapted to fit in the receiving groove.

[0023] According to some embodiments of the present disclosure, the seat body further includes an outer ring plate, which is arranged around the seat plate and extends along the first direction. The outer ring plate and the seat plate together enclose an open cavity, and the boss is arranged in the cavity.

[0024] According to some embodiments of the present disclosure, along the first direction, an end of the boss away from the seat plate does not exceed an end of the outer ring plate away from the seat plate.

[0025] According to some embodiments of the present disclosure, a plurality of spaced anti-collision protrusions are provided on one end of the base facing the circuit board, and the plurality of anti-collision protrusions are in abutment with the circuit board.

[0026] According to some embodiments of the present disclosure, the temperature measuring assembly further includes: a protective cover connected to the base and covering the temperature measuring element, the protective cover being provided with a temperature measuring hole for contact between the medium and the temperature measuring element.

[0027] According to some embodiments of the present disclosure, the shell is provided with a first positioning portion, and at least one of the base or the protective cover is provided with a second positioning portion, and the second positioning portion cooperates with the first positioning portion to fix the relative position of the temperature measuring component and the shell in at least one direction of the circumference or axial direction of the shell.

[0028] According to some embodiments of the present disclosure, the first positioning portion includes: a first circumferential positioning portion, which is arranged on the inner circumferential wall of the shell; the second positioning portion includes: a second circumferential positioning portion, which is arranged on the outer circumferential wall of the base, and the second circumferential positioning portion cooperates with the first circumferential positioning portion to fix the relative positions of the temperature measuring component and the shell in the circumferential direction of the shell.

[0029] According to some embodiments of the present disclosure, the first circumferential positioning portion is configured as one of a groove and a protrusion, the second circumferential positioning portion is configured as the other of the groove and the protrusion, and the protrusion is matched with the groove.

[0030] According to some embodiments of the present disclosure, the second circumferential positioning portion is configured as the groove, which is open on one axial side of the base to form the groove for the protrusion to enter and exit.

[0031] According to some embodiments of the present disclosure, the first positioning portion includes: a first axial positioning portion, which is arranged on the inner circumferential wall of the shell; the second positioning portion includes: a second axial positioning portion, which is arranged on the outer circumferential wall of the protective sleeve, and the second axial positioning portion cooperates with the first axial positioning portion to fix the relative positions of the temperature measuring component and the shell in the axial direction of the shell.

[0032] According to some embodiments of the present disclosure, the first axial positioning portion is configured as a housing stop step, and the second axial positioning portion is configured as a protective sleeve stop step, and the protective sleeve stop step and the housing stop step abut against each other in the axial direction of the housing.

[0033] According to some embodiments of the present disclosure, the base is provided with a base limiting portion, and the protective cover is provided with a protective cover limiting portion. The base limiting portion cooperates with the protective cover limiting portion to fix the relative positions of the base and the protective cover in the circumferential direction of the base.

[0034] According to some embodiments of the present disclosure, the base limiting portion is configured as one of a groove and a protrusion, the protective cover limiting portion is configured as the other of the groove and the protrusion, and the protrusion fits into the groove.

[0035] According to some embodiments of the present disclosure, the temperature measuring hole includes a first temperature measuring hole and at least one second temperature measuring hole, the first temperature measuring hole is arranged on the end surface of the protective cover away from the base, and the at least one second temperature measuring hole is arranged on the peripheral wall of the protective cover away from the base.

[0036] According to some embodiments of the present disclosure, the at least one second temperature measuring hole includes a plurality of second temperature measuring holes, and the plurality of second temperature measuring holes are distributed at intervals along the circumference of the protective cover.

[0037] According to some embodiments of the present disclosure, a channel is formed in the protective cover, the temperature measuring element is disposed in the channel, and a cross-section of the channel perpendicular to the axial direction of the channel is elliptical.

[0038] According to some embodiments of the present disclosure, the temperature measuring element is provided with a sensing part, the protective cover is provided with an extending part, the extending part extends outside the shell, the sensing part is arranged inside the extending part, and the length of the extending part extending from the shell is a, and the value range of a is: 0<a≤15mm.

[0039] According to some embodiments of the present disclosure, a distance between the sensing portion and an end surface of the extending portion away from the housing is b, and a value range of b is: 0<b≤2mm.

[0040] According to some embodiments of the present disclosure, the temperature measuring element is provided with a sensing portion, the protective cover is provided with a protruding portion, the protruding portion protrudes out of the shell, the sensing portion is provided inside the protruding portion, the distance between the sensing portion and the end face of the protruding portion away from the shell is b, and the distances between the two ends of the second temperature measuring hole along the axial direction of the protective cover and the end face of the protruding portion away from the shell are c and d, respectively; b, c and d satisfy one of the following: c<b<d; and d<b<c.

[0041] According to some embodiments of the present disclosure, the circuit board is a ceramic circuit board, which has a first surface and a second surface relative to each other, and is provided with at least one electrical connection hole, which can electrically connect the corresponding electrical connection point located on the first surface and the electrical connection point located on the second surface.

[0042] According to some embodiments of the present disclosure, the sensor also includes a pressure measuring element for detecting the pressure of the medium; the circuit board has a first surface and a second surface relative to each other, the first surface has a medium isolation area and a medium contact area, and the pressure measuring element is arranged in the medium contact area; the circuit board is provided with at least one electrical connection hole, and the at least one electrical connection hole is located in the medium isolation area. The at least one electrical connection hole can electrically connect the corresponding electrical connection point located on the first surface and the electrical connection point located on the second surface, and the pressure measuring element is electrically connected to the electrical connection point of the second surface through the electrical connection hole.

[0043] According to some embodiments of the present disclosure, the diameter of the electrical connection hole is D, the thickness of the circuit board is H, and D and H satisfy: 1 / 6H≤D≤1 / 3H.

[0044] According to some embodiments of the present disclosure, the diameter of the electrical connection hole is D, the minimum distance between the electrical connection hole and the edge of the circuit board is L, and D and L satisfy: D≤L≤2D.

[0045] According to some embodiments of the present disclosure, the at least one electrical connection hole includes N electrical connection holes, and N satisfies: N≥4.

[0046] According to some embodiments of the present disclosure, the sensor further includes a first seal, which is disposed between the housing and the circuit board to separate the first surface into the medium isolation area and the medium contact area.

[0047] According to some embodiments of the present disclosure, the circuit board further includes a signal conditioning component, which is disposed on the second surface of the circuit board, and the pressure measuring element is electrically connected to the signal conditioning component through the at least one electrical connection hole.

[0048] According to some embodiments of the present disclosure, the signal conditioning component is disposed in the middle of the second surface.

[0049] According to some embodiments of the present disclosure, the second surface is further provided with a plurality of first elastic conductive members, and the sensor further includes a connector; the plurality of first elastic conductive members abut and mate with the connector of the sensor.

[0050] According to some embodiments of the present disclosure, the sensor further includes: a first seal, which is arranged between the housing and the circuit board and surrounds the temperature measurement component.

[0051] According to some embodiments of the present disclosure, a mating groove is defined between the housing, the temperature measuring component and the support frame, and the first sealing member is disposed in the mating groove.

[0052] According to some embodiments of the present disclosure, the shell is provided with a placement surface, the first seal is provided on the placement surface, the temperature measuring component is located on the inner side of the placement surface, and part of the temperature measuring component is protruded from the placement surface, and the support frame is located on the outer side of the placement surface to form the mating groove.

[0053] According to some embodiments of the present disclosure, the support frame is formed with a second through hole, and the first seal is arranged in the second through hole; the sensor also includes a pressure measuring element, which is arranged on the side of the circuit board facing the second through hole and is surrounded by the first seal.

[0054] According to some embodiments of the present disclosure, the sensor further includes: a connector, the support frame is connected to the connector, and the circuit board is arranged between the support frame and the connector and is electrically connected to the connector.

[0055] According to some embodiments of the present disclosure, the support frame is provided with a first plug-in portion, the first plug-in portion has a first plug-in surface, the connector is provided with a second plug-in portion, the second plug-in portion has a second plug-in surface, and the first plug-in surface and the second plug-in surface can abut against each other so that the second plug-in portion is plugged into and matched with the first plug-in portion.

[0056] According to some embodiments of the present disclosure, after the sensor is assembled, there is a distance between the first plugging surface and the second plugging surface in the plugging direction.

[0057] According to some embodiments of the present disclosure, the distance between the first plug-in surface and the second plug-in surface is e,

[0058] A first elastic conductive member is connected to the circuit board and the connector respectively. The maximum compression size of the first elastic conductive member is f, and the relationship between e and f is: 0<e<f.

[0059] According to some embodiments of the present disclosure, 0.5f<e<f.

[0060] According to some embodiments of the present disclosure, the support frame is provided with a first support frame positioning portion, and the connector is provided with a connector positioning portion, and the first support frame positioning portion is positioned and matched with the connector positioning portion.

[0061] According to some embodiments of the present disclosure, the first support frame positioning portion is one of a positioning hole and a positioning column, and the connector positioning portion is the other of the positioning hole and the positioning column; the positioning column is positioned and matched with the positioning hole.

[0062] According to some embodiments of the present disclosure, the first support frame positioning portion and the connector positioning portion satisfy one of the following conditions: the first support frame positioning portion includes a plurality of positioning columns, and the cross-sectional areas of the plurality of positioning columns are different; the connector positioning portion includes a plurality of positioning holes, and the cross-sectional areas of the plurality of positioning holes are different; and the connector positioning portion includes a plurality of positioning columns, and the cross-sectional areas of the plurality of positioning columns are different; the first support frame positioning portion includes a plurality of positioning holes, and the cross-sectional areas of the plurality of positioning holes are different.

[0063] A thermal management system according to an embodiment of the second aspect of the present disclosure includes: the above-mentioned sensor.

[0064] According to the third aspect of the present disclosure, a vehicle satisfies one of the following conditions: the vehicle includes the thermal management system described above; and the vehicle includes the sensor described above.

[0065] Additional aspects and advantages of the present disclosure will be given in part in the description that follows and, in part, will be obvious from the description that follows, or will be learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] The above and / or additional aspects and advantages of the present disclosure will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0067] FIG1 is a schematic structural diagram of a sensor according to some embodiments of the present disclosure;

[0068] FIG2 is a cross-sectional view of a sensor according to some embodiments of the present disclosure;

[0069] FIG3 is an exploded view of a sensor according to some embodiments of the present disclosure;

[0070] FIG4 is a schematic structural diagram of a detection component according to some embodiments of the present disclosure;

[0071] FIG5 is a schematic diagram of the structure of a circuit board located on a support frame according to some embodiments of the present disclosure;

[0072] FIG6 is a schematic structural diagram of the bottom end surface of a connector according to some embodiments of the present disclosure;

[0073] FIG7 is a schematic structural diagram of a support frame according to some embodiments of the present disclosure;

[0074] FIG8 is a top view of a support frame according to some embodiments of the present disclosure;

[0075] FIG9 is a partial schematic diagram of a support frame including a circuit board fixing portion according to some embodiments of the present disclosure;

[0076] FIG10 is a schematic structural diagram of a temperature measurement assembly according to some embodiments of the present disclosure;

[0077] FIG11 is a schematic structural diagram of a protective cover according to some embodiments of the present disclosure;

[0078] FIG12 is a schematic structural diagram of a base including a conductive plate boss according to some embodiments of the present disclosure;

[0079] FIG13 is a schematic structural diagram of a temperature measuring element according to some embodiments of the present disclosure;

[0080] FIG14 is a schematic structural diagram of a first elastic conductive member according to some embodiments of the present disclosure;

[0081] FIG15 is a top view of a housing according to some embodiments of the present disclosure;

[0082] FIG16 is a schematic structural diagram of a circuit board and a support frame separated according to some embodiments of the present disclosure.

[0083] Reference numerals: 100, sensor; 10, housing; 11, first positioning portion; 111, first circumferential positioning portion; 112, first axial positioning portion; 113, third positioning portion; 12, placement surface; 20, temperature measuring assembly; 21, second positioning portion; 211, second circumferential positioning portion; 212, second axial positioning portion; 22, base; 221, base limiting portion; 222, base body; 2221, boss; 2222, first side; 2223, second side; 2224, outer ring plate; 2225, base plate; 2226, receiving groove; 223, conductive sheet; 2231, first end; 2232, second end; 224, anti-collision protrusion; 225, first through hole; 23, temperature measuring element; 231, sensing portion; 24. Protective cover; 241. Protective cover limiting portion; 242. Second temperature measuring hole; 243. First temperature measuring hole; 244. Extending portion; 31. Connector; 311. Connector positioning portion; 312. Second plug-in portion; 32. Support frame; 321. Main body; 3211. Sink; 3212. Abutting surface; 322. Circuit board limiting portion; 3221. Guide surface; 323. Limiting surface; 324. First support frame positioning portion; 325. Second support frame positioning portion; 326. Second through hole; 327. Avoidance opening; 328. First plug-in portion; 33. Circuit board; 331. Circuit board receiving groove; 332. First surface; 333. Second surface; 334. First edge; 335. Second edge; 336. Electrical connection hole; 34. Pressure measuring element; 35. First elastic conductive member; 36. Second elastic conductive member; 40. First sealing member; 50. Second sealing member; 60. Pin; 70. Cavity; 80. Medium isolation area; 81. Medium contact area; 90. First plugging surface; 91. Second plugging surface. DETAILED DESCRIPTION

[0084] In related technologies, temperature sensors mainly use temperature measurement modules for temperature measurement. The temperature measurement modules are connected to the circuit board, which can easily cause the temperature measurement modules to be misaligned, resulting in inaccurate temperature measurement by the temperature measurement modules and easily causing other components to be damaged due to position changes.

[0085] Embodiments of the present disclosure are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary.

[0086] The following describes a sensor 100 according to some embodiments of the present disclosure with reference to the accompanying drawings. The sensor 100 may be a temperature or pressure sensor, or other types of sensors.

[0087] As shown in Figures 1 to 3, a sensor 100 according to an embodiment of the first aspect of the present disclosure includes: a housing 10, a temperature measuring assembly 20, a support frame 32, and a circuit board 33. The temperature measuring assembly 20 is adapted to be positioned and matched with the housing 10 and is used to measure the temperature of a medium. The support frame 32 is disposed within the housing 10, and the circuit board 33 is adapted to be disposed on the support frame 32. The temperature measuring assembly 20 and the circuit board 33 are electrically connected.

[0088] In some embodiments, in the sensor 100, the temperature measuring component 20 is positioned and matched with the shell 10 to prevent misalignment between the temperature measuring component 20 and the shell 10 during the assembly process. In this way, the position of the temperature measuring component 20 can be confirmed, so that temperature measurement can be performed at a preset position, thereby ensuring the accuracy of the sensor 100 during the measurement process.

[0089] Moreover, by placing the circuit board 33 on the support frame 32 and placing the support frame 32 inside the shell 10, the relative position of the circuit board 33 and the shell 10 is ensured, thereby ensuring that the electrical connection between the circuit board 33 and the temperature measuring component 20 is stable and reliable, and the real-time and continuity of the sensor temperature measurement is ensured. At the same time, the temperature measuring component 20 and the support frame 32 are both placed inside the shell, which can make the assembly coherent, thereby facilitating assembly and saving production costs.

[0090] Furthermore, the circuit board 33 is placed on the support frame 32 , which can prevent the circuit board 33 from being damaged by direct collision with the housing 10 , thereby protecting the circuit board 33 .

[0091] Therefore, the sensor 100 can ensure the measurement accuracy and stability of the temperature measuring component 20, while protecting the circuit board 33. In addition, it is easy to assemble and save production costs.

[0092] According to some embodiments of the present disclosure, as shown in Figures 7 to 9, the support frame 32 is provided with a main body portion 321 and a circuit board limiting portion 322. The circuit board 33 is provided on the main body portion 321, and the circuit board limiting portion 322 is suitable for cooperating with the side wall of the circuit board 33.

[0093] In some embodiments, the circuit board 33 is arranged in the main body, and the circuit board limiting portion 322 is suitable for cooperating with the side wall of the circuit board 33 to limit the movement of the circuit board 33 in the plane, thereby ensuring the position of the circuit board 33, preventing the circuit board 33 from having a large offset during installation or causing unstable signal transmission due to rotation, and improving the reliability of the installation of the circuit board 33.

[0094] According to some embodiments of the present disclosure, as shown in FIG. 5 , the circuit board 33 is a ceramic circuit board.

[0095] It is understood that the ceramic circuit board 33 has good insulation performance, high-temperature stability, and good corrosion resistance. As such, it can be used in media such as refrigerants and can effectively isolate the signals and currents in the circuit. The ceramic circuit board 33 can maintain stable performance in high-temperature environments and is not easily affected by thermal expansion, making it suitable for high-temperature working environments. In addition, the ceramic circuit board 33 has good dimensional stability under temperature changes and is not prone to dimensional changes caused by thermal expansion, thereby improving the stability and reliability of the circuit. In addition, the ceramic circuit board 33 is harder than a flexible circuit board, which can avoid damage during the press-fit process.

[0096] According to some embodiments of the present disclosure, as shown in Figure 16, a first edge 334 is defined between the bottom wall of the circuit board 33 and the side wall of the circuit board 33, and a plurality of contact points that contact the main body portion 321 or the circuit board limiting portion 322 are provided on the first edge 334, and any one of the plurality of contact points does not contact the main body portion 321 and the circuit board limiting portion 322 at the same time.

[0097] In some embodiments, the first part of the contact points on the first edge 334 only contacts the main body 321 but not the circuit board limiting portion 322, and the second part of the contact points on the first edge 334 only contacts the circuit board limiting portion 322 but not the main body 321. This can avoid stress concentration on the circuit board 33 by the support frame 32, thereby reducing the stress between the support frame 32 and the circuit board 33 to avoid damage to the circuit board 33, increase the service life of the circuit board 33, and thus protect the sensor 100.

[0098] It should be noted that a third portion of contact points may be provided on the first edge 334 , which do not contact the main body 321 or the circuit board limiting portion 322 .

[0099] According to some embodiments of the present disclosure, as shown in FIG. 9 , a limiting surface is provided on a side surface of the circuit board limiting portion 322 facing the circuit board 33 , and the limiting surface is adapted to cooperate with a side wall of the circuit board 33 in limiting manner.

[0100] In some embodiments, the bottom surface of the main body 321 is formed as abutment surface 3212, and the inner wall surface of the circuit board limiting portion 322 is formed as a limiting surface 323, the abutment surface 3212 is suitable for abutting and cooperating with the bottom surface of the circuit board 33, and the limiting surface 323 is limited and cooperating with the side wall surface of the circuit board 33.

[0101] In some embodiments, both the abutment surface 3212 and the limiting surface 323 can function as position limiters. The abutment surface 3212 is formed on the bottom surface of the main body 321, and the limiting surface 323 is formed on the inner wall surface of the circuit board limiting portion 322. Thus, when the circuit board 33 is installed on the support frame 32, the bottom surface of the circuit board 33 can be pressed against the abutment surface 3212, and the limiting surface 323 will limit the side wall surface of the circuit board 33, thereby preventing the circuit board 33 from deviating or rotating significantly during installation, thereby affecting signal transmission.

[0102] According to some embodiments of the present disclosure, as shown in FIG9 , a guide surface 3221 is further provided on the side surface of the circuit board limiting portion 322 facing the circuit board 33 . The guide surface 3221 is connected to the limiting surface and is configured to guide the assembly of the circuit board 33 .

[0103] In some embodiments, the guide surface 3221 primarily serves as a guide. The guide surface 3221 is connected to the end of the limiting surface 323 that is distal to the abutment surface 3212. Thus, during the assembly of the circuit board 33 with the support frame 32, the guide surface 3221 guides the circuit board 33, thereby improving the accuracy of the installation of the circuit board 33 and enhancing assembly efficiency. Furthermore, the guidance of the circuit board 33 by the guide surface 3221 can accelerate the installation of the circuit board 33 and facilitate automated installation.

[0104] In some embodiments, the guide surface 3221 is tilted outward in a direction away from the limiting surface 323 .

[0105] For example, the guide surface 3221 is tilted outward in the direction away from the limiting surface 323. This arrangement is more reasonable. In the direction away from the limiting surface 323, the guide surface 3221 is tilted outward, so that the side of the guide surface 3221 away from the limiting surface 323 is more easily matched with the circuit board 33, facilitating the installation of the circuit board 33. When the circuit board 33 moves toward the abutting surface 3212, the guide surface 3221 guides the circuit board 33 until the bottom wall and side wall of the circuit board 33 respectively match the abutting surface 3212 and the limiting surface 323.

[0106] According to some embodiments of the present disclosure, as shown in FIG9 , a relief portion is provided on the main body portion 321 , which is at least one of the recess 3211 , the through hole or the opening in FIG9 , and is arranged opposite to the circuit board limiting portion 322 .

[0107] In some embodiments, the avoidance portion primarily serves a purpose of avoiding contact. The avoidance portion is positioned relative to the circuit board stopper 322, so that different locations on the first edge 334 of the circuit board 33 only contact the circuit board stopper 322 or the abutment surface 3212, respectively. For example, the same location on the first edge 334 will not simultaneously contact both the circuit board stopper 322 and the abutment surface 3212, thereby reducing stress exerted by the support frame 32 on the circuit board 33. Furthermore, this facilitates the placement of the circuit board stopper 322, thereby increasing the structural strength of the circuit board stopper 322.

[0108] It should be noted that the avoidance portion is provided on the bottom surface of the main body 321 , and the orthographic projection position of the circuit board limiting portion 322 on the bottom surface of the main body 321 is the position of the sink 3211 .

[0109] It can be understood that when the avoidance portion is a recessed groove 3211, the recessed groove 3211 is a groove with an opening facing upward as shown in Figure 7, the through hole can be a through hole passing through the main body 321 from the abutment surface 3212, and the opening can be a groove or notch with an opening facing other directions.

[0110] According to some embodiments of the present disclosure, as shown in Figure 9, the avoidance portion is a recessed groove 3211 or a through hole, part of the circuit board limiting portion 322 is located in the avoidance portion, and at least the side wall of the circuit board limiting portion 322 facing the circuit board 33 is spaced apart from the corresponding side wall of the avoidance portion.

[0111] For example, as shown in Figure 9, the avoidance portion is a groove 3211, and part of the circuit board limiting portion 322 is located in the groove 3211. At least the side wall of the circuit board limiting portion 322 facing the circuit board 33 is spaced apart from the corresponding side wall of the groove 3211.

[0112] For example, the limiting surface 323 of the circuit board limiting portion 322 is spaced apart from the side wall of the recess 3211 adjacent to the center of the main body 321. When the side wall of the circuit board 33 contacts the limiting surface 323, the portion of the recess 3211 corresponding to the first edge 334 of the circuit board 33 is suspended.

[0113] As a result, no point on the first edge 334 will contact both the limiting surface 323 and the abutting surface 3212 simultaneously, thereby avoiding stress concentration between the support frame 32 and the circuit board 33 and improving protection for the circuit board 33. Furthermore, interference between the sidewalls of the circuit board 33 and the corresponding sidewalls of the recess 3211 can be avoided.

[0114] According to some embodiments of the present disclosure, as shown in FIG9 , the avoidance portion is a recessed groove 3211, that is, at least one recessed groove 3211 is formed on the abutting surface 3212 of the main body 321. The circuit board retaining portion 322 is disposed on the bottom wall of the recessed groove 3211. For example, the portion of the abutting surface 3212 adjacent to the circuit board retaining portion 322 is recessed to form the recessed groove 3211. The bottom of the circuit board retaining portion 322 extends into the recessed groove 3211 and contacts the bottom wall of the recessed groove 3211.

[0115] In this way, a portion of the bottom of the circuit board limiting portion 322 extends into the interior of the sink 3211, which can prevent the corner line of the circuit board limiting portion 322 from contacting the corner line of the circuit board 33, thereby preventing stress concentration from occurring when the corner line of the circuit board limiting portion 322 contacts the corner line of the circuit board 33, thereby preventing damage to the circuit board 33.

[0116] In some embodiments, the lower end of the circuit board limiting portion 322 is connected to the bottom wall of the groove 3211, and the lower end of the circuit board limiting portion 322 and the bottom wall of the groove 3211 define a groove angle. When the circuit board 33 is matched with the support frame 32, the setting of the groove 3211 can prevent the equilateral corners of the first edge 334 of the circuit board 33 from contacting and colliding with the groove angle, causing fragmentation, thereby reducing the possibility of the circuit board 33 being broken and increasing protection for the circuit board 33.

[0117] In some embodiments, as shown in FIG. 9 , the support frame 32 includes a plurality of circuit board limiting portions 322 , and the plurality of circuit board limiting portions 322 are spaced apart in the circumferential direction of the main body portion 321 .

[0118] In some embodiments, by setting multiple circuit board limiting portions 322, the limiting points between the support frame 32 and the circuit board 33 can be increased, so that the circuit board 33 can be limited at multiple positions. This setting is more reasonable, so that the multiple limiting surfaces 323 can respectively limit the side wall surfaces of different positions of the circuit board 33.

[0119] According to some embodiments of the present disclosure, as shown in FIG16 , the circuit board 33 is non-circular. Here, the outer contour of the circuit board 33 may be a shape other than a circle. For example, the outer contour of the circuit board 33 may be a rectangle, etc. A second edge 335 is defined between the two side walls of the circuit board 33, and the main body 321 is provided with an escape opening 327 at a position corresponding to the second edge 335. For example, the support frame 32 is further provided with a plurality of escape openings 327, which are used to avoid the edges defined by the two side walls of the circuit board 33 to further protect the circuit board 33.

[0120] In some embodiments, the circuit board 33 is non-circular. The non-circular circuit board can better adapt to a specific device or package shape and can also reduce electromagnetic interference.

[0121] In addition, the avoidance opening 327 mainly plays a role of avoidance. By setting a plurality of avoidance openings 327, the avoidance openings 327 can correspond to the second edges 335 defined by the two side walls of the circuit board 33, so that the second edges 335 of the circuit board 33 can be avoided. In this way, a larger circuit board 33 can be accommodated without increasing the size of the support frame 32.

[0122] According to some embodiments of the present disclosure, as shown in FIG. 2 and FIG. 4 , one of the support frame 32 and the housing 10 is provided with a positioning hole, and the other of the support frame 32 and the housing 10 is provided with a positioning column, which fits in the positioning hole.

[0123] In some embodiments, when a positioning column is provided on the support frame 32, a corresponding positioning hole is provided on the shell 10, and the positioning column is positioned and matched with the positioning hole, thereby avoiding misalignment of the support frame 32 and the shell 10, and correspondingly improving the assembly efficiency of the support frame 32 and the shell 10.

[0124] According to some embodiments of the present disclosure, as shown in Figures 2 to 4, the temperature measuring component 20 includes: a base 22 and a temperature measuring element 23, the base 22 is arranged in the shell 10, and the base 22 is electrically connected to the circuit board 33, the temperature measuring element 23 is arranged in the base 22, and the temperature measuring element 23 is electrically connected to the base 22.

[0125] It can be understood that the base 22 is electrically connected to the circuit board 33, which can facilitate the transmission of signals. The temperature measuring element 23 is connected to the base 22, and the base 22 provides an installation position for the temperature measuring element 23. Moreover, the temperature measuring element 23 is electrically connected to the base 22, so that the temperature signal can be transmitted to the base 22 through the temperature measuring element 23, thereby ensuring the transmission of the signal.

[0126] According to some embodiments of the present disclosure, as shown in Figure 13, the base 22 includes: a base body 222, the base body 222 is provided with a first through hole 225 and a conductive sheet 223, the conductive sheet 223 is matched with the first through hole 225, the first end 2231 of the conductive sheet 223 is electrically connected to the temperature measuring element 23, and the second end 2232 of the conductive sheet 223 is electrically connected to the circuit board 33.

[0127] It can be understood that the conductive sheet 223 is penetrated by the first through hole 225, so that the second end 2232 of the conductive sheet 223 can be electrically connected to the circuit board 33, and the first end 2231 of the conductive sheet 223 is electrically connected to the temperature measuring element 23, so that the temperature signal can be easily transmitted from the temperature measuring element 23 to the conductive sheet 223, and the second end 2232 of the conductive sheet 223 is electrically connected to the circuit board 33, so that the temperature signal of the conductive sheet 223 can be transmitted to the circuit board 33, thereby ensuring the stability of signal transmission.

[0128] According to some embodiments of the present disclosure, as shown in Figures 2-4, the base 222 includes a base plate 2225 and a boss 2221. The boss 2221 is provided on the base plate 2225 and protrudes from the base plate 2225 along a first direction. The boss 2221 is suitable for supporting the second end 2232 of the conductive sheet 223. In this way, by providing the boss 2221 to support the second end 2232 of the conductive sheet 223, the conductive sheet 223 can be better positioned, while the connection strength between the conductive sheet 223 and the base 222 is improved, thereby preventing the conductive sheet 223 from shifting during transportation or use. In addition, since the temperature measuring element 23 is connected to the conductive sheet 223, the position of the temperature measuring element 23 can be guaranteed, and the accuracy of the temperature measurement by the temperature measuring element 23 can be guaranteed.

[0129] According to some embodiments of the present disclosure, as shown in Figures 2 and 12, the first through hole 225 passes through the seat plate 2225 and the boss 2221, and the seat body 222 has a first side 2222 and a second side 2223 opposite to each other along its axial direction. The direction in which the first side 2222 points to the second side 2223 is a first direction. The conductive sheet 223 is arranged corresponding to the boss 2221, so that the position of the conductive sheet 223 can be more accurate. In addition, the conductive sheet 223 can be prevented from interfering with other parts of the temperature measuring element 23.

[0130] According to some embodiments of the present disclosure, as shown in FIG12 , the first through hole 225 penetrates the seat plate 2225 and the boss 2221 along a first direction. In some embodiments, the conductive sheet 223 can pass through the first through hole 225 and sequentially penetrate the seat plate 2225 and the boss 2221, so that the second end 2232 of the conductive sheet 223 can be supported on the boss 2221.

[0131] According to some embodiments of the present disclosure, as shown in FIG. 12 , a receiving groove 2226 is formed on a surface of the boss 2221 away from the seat plate 2225 , and the second end 2232 is adapted to fit into the receiving groove 2226 .

[0132] In some embodiments, the second end 2232 can be placed in the receiving groove 2226, and the receiving groove 2226 wraps the second end 2232, which can not only limit the horizontal position of the second end 2232 to ensure the accuracy of measurement, but also protect the second end 2232.

[0133] According to some embodiments of the present disclosure, as shown in Figure 12, the seat body 222 also includes an outer ring plate 2224, which is arranged around the seat plate 2225 and extends along the first direction. The outer ring plate 2224 and the seat plate 2225 together enclose an open cavity 70, and the boss 2221 is arranged in the cavity 70.

[0134] In some embodiments, the seat body 222 also includes: an outer ring plate 2224, which is annular and surrounds the seat plate 2225 to form an open cavity 70. The cavity 70 can accommodate the boss 2221, and the conductive sheet 223 is arranged corresponding to the boss 2221, so that the setting position of the conductive sheet 223 can be positioned.

[0135] According to some embodiments of the present disclosure, along the first direction, the end of the boss 2221 away from the seat plate 2225 does not extend beyond the end of the outer ring plate 2224 away from the seat plate 2225. For example, the end of the boss 2221 away from the seat plate 2225 is closer to the seat plate 2225 than the end of the outer ring plate 2224 away from the seat plate 2225.

[0136] In some embodiments, the end of the boss 2221 away from the seat plate 2225 can be lower than the end of the outer ring plate 2224 away from the seat plate 2225. In this way, the outer ring plate 2224 can stop at the circuit board 33, and the conductive end of the conductive sheet 223 can be easily electrically connected to the circuit board 33 through the second elastic conductive member 36, and the second elastic conductive member 36 is partially accommodated in the cavity 70, so that the second elastic conductive member 36 can be protected by the outer ring plate 2224, and the structure can be made more compact by rationally utilizing space.

[0137] According to some embodiments of the present disclosure, as shown in FIG. 12 , a plurality of spaced anti-collision protrusions 224 are provided on one end of the base 22 facing the circuit board 33 , and the plurality of anti-collision protrusions 224 abut against the circuit board 33 .

[0138] In some embodiments, the circuit board 33 is located above the base 22 . The circuit board 33 is electrically connected to the base 22 and can transmit the electrical signal detected by the temperature measuring element 23 to the circuit board 33 .

[0139] In some embodiments, a plurality of anti-collision protrusions 224 are provided on the upper surface of the base 22 to eliminate the gap between the base 22 and the circuit board 33 during the assembly process and prevent the base 22 from colliding with the circuit board 33 .

[0140] In some embodiments, after the circuit board 33 is installed in place in the housing 10, the upper side of the housing 10 is riveted to fix the installation position of the circuit board 33 and ensure effective sealing. At the same time, vulcanized silicone rubber (RTV silicone) is applied around the riveting circle to prevent external water vapor from entering the circuit board 33 in the cavity and causing damage to the circuit board 33.

[0141] In some embodiments, as shown in FIG2 , a plurality of anti-collision protrusions 224 are spaced apart circumferentially around the base 22 to provide more uniform force between the base 22 and the circuit board 33 during contact and mating, thereby ensuring stability between the base 22 and the circuit board 33. The anti-collision protrusions 224 can be configured as cylinders or circular bumps.

[0142] According to some embodiments of the present disclosure, as shown in Figures 2 and 3, the temperature measuring component 20 also includes: a protective cover 24, which is connected to the base 22 and covers the temperature measuring element 23. The protective cover 24 is provided with a temperature measuring hole for the medium to contact the temperature measuring element 23.

[0143] In some embodiments, the protective cover 24 covers the temperature measuring element 23 , so that the protective cover 24 can protect the temperature measuring element 23 .

[0144] It should be noted that the provision of the temperature measuring hole can ensure that the medium contacts the temperature measuring element 23 in a timely manner, so that the temperature measuring element 23 can accurately obtain the temperature of the medium. The temperature measuring element 23 can be an NTC thermistor (Negative Temperature Coefficient thermistor).

[0145] In some embodiments, the outer wall of the protective cover 24 is provided with a groove, which can cooperate with the protrusion on the inner wall of the shell 10, not only playing a positioning role, but also preventing circumferential rotation between the protective cover 24 and the shell 10, thereby ensuring the correct installation of the protective cover 24 and the shell 10.

[0146] According to some embodiments of the present disclosure, as shown in Figures 10 and 15, the shell 10 is provided with a first positioning portion 11, and at least one of the base 22 or the protective cover 24 is provided with a second positioning portion 21. The second positioning portion 21 cooperates with the first positioning portion 11, so as to fix the relative position of the temperature measuring component 20 and the shell 10 in at least one direction of the circumference or axial direction of the shell 10.

[0147] According to some embodiments of the present disclosure, as shown in Figures 10 and 15, the first positioning portion 11 includes: a first circumferential positioning portion 111, and the first circumferential positioning portion 111 is arranged on the inner circumferential wall of the shell 10. The second positioning portion 21 includes: a second circumferential positioning portion 211, and the second circumferential positioning portion 211 is arranged on the outer circumferential wall of the base 22. The second circumferential positioning portion 211 cooperates with the first circumferential positioning portion 111, so as to fix the relative positions of the temperature measuring component 20 and the shell 10 in the circumferential direction of the shell 10.

[0148] In some embodiments, the outer wall of the base 22 is provided with a second circumferential positioning portion 211, and the base 22 is arranged in the shell 10. Accordingly, the inner wall of the shell 10 is provided with a first circumferential positioning portion 111. The second circumferential positioning portion 211 cooperates with the first circumferential positioning portion 111 to prevent the temperature measuring component 20 from rotating relative to the shell 10 in the circumferential direction of the shell 10, thereby fixing the relative position of the temperature measuring component 20 and the shell 10 in the circumferential direction of the shell 10 and ensuring the stability of the connection between the temperature measuring component 20 and the shell 10.

[0149] According to some embodiments of the present disclosure, the first circumferential positioning portion 111 is configured as one of a groove and a protrusion, and the second circumferential positioning portion 211 is configured as the other of a groove and a protrusion, with the protrusion fitting into the groove.

[0150] In some embodiments, when the first circumferential positioning portion 111 is configured as a groove, the second circumferential positioning portion 211 is correspondingly configured as a protrusion, which can extend into the groove, thereby preventing the temperature measuring component 20 from circumferentially rotating relative to the housing 10 .

[0151] In some embodiments, when the first circumferential positioning portion 111 is configured as a protrusion, the second circumferential positioning portion 211 is correspondingly configured as a groove, thereby preventing the temperature measuring component 20 from circumferentially rotating relative to the housing 10 .

[0152] In some embodiments, the first circumferential positioning portion 111 includes multiple grooves, and the second circumferential positioning portion 211 includes multiple protrusions. Alternatively, the second circumferential positioning portion 211 includes multiple grooves, and the first circumferential positioning portion 111 includes multiple protrusions. In this way, the corresponding cooperation of the multiple grooves and the multiple protrusions can better ensure the relative position of the temperature measurement assembly 20 and the housing 10.

[0153] According to some embodiments of the present disclosure, as shown in FIG. 10 and FIG. 15 , the second circumferential positioning portion 211 is configured as a groove that is open on one axial side of the base 22 , thereby forming a groove for the protrusion to enter and exit.

[0154] In some embodiments, the second circumferential positioning portion 211 on the outer peripheral wall of the base 22 is set as a groove, and the groove is open toward the shell 10. A first circumferential positioning portion 11 is set on the inner peripheral wall of the shell 10. The first circumferential positioning portion 11 is a protrusion, and the groove is opposite to the protrusion. During the assembly process, the protrusion extends into the groove, thereby preventing the temperature measuring component 20 from rotating circumferentially relative to the shell 10. Moreover, the opening set in this way can also facilitate the plug-in cooperation between the base 22 and the shell 10, which can further improve the assembly efficiency.

[0155] According to some embodiments of the present disclosure, as shown in FIG2 and FIG10 , the first positioning portion 11 includes: a first axial positioning portion, which is provided on the inner peripheral wall of the housing 10; the second positioning portion 21 includes: a second axial positioning portion 212, which is provided on the outer peripheral wall of the protective sleeve 24; the second axial positioning portion 212 cooperates with the first axial positioning portion to fix the relative position of the temperature measuring component 20 and the housing 10 in the axial direction of the housing 10. The axial direction of the housing 10 is the up-down direction shown in FIG2 .

[0156] It can be understood that a second axial positioning portion 212 is provided above the outer peripheral wall of the protective sleeve 24. Since the protective sleeve 24 is arranged inside the shell 10, the shell 10 provides an installation position for the placement of the protective sleeve 24. Therefore, a first axial positioning portion 112 is provided on the inner peripheral wall of the shell 10, and a second axial positioning portion 212 is provided on the outer peripheral wall of the protective sleeve 24. During the installation process, the second axial positioning portion 212 of the protective sleeve 24 cooperates with the first axial positioning portion 112 provided on the inner peripheral wall of the shell 10, which can prevent the temperature measuring component 20 from moving relative to the shell 10 in the axial direction, thereby fixing the relative position of the temperature measuring component 20 and the shell 10 in the axial direction of the shell 10, and avoiding the problem of misalignment of the temperature measuring component 20.

[0157] According to some embodiments of the present disclosure, as shown in Figures 2 and 10, the first axial positioning portion 112 is configured as a shell stop step, and the second axial positioning portion 212 is configured as a protective sleeve stop step. The protective sleeve stop step and the shell stop step abut each other in the axial direction of the shell 10.

[0158] In some embodiments, the first axial positioning portion 112 is configured as a housing stop step, which is formed by opening a groove inside the housing 10 , and the protective sleeve stop step is formed by providing a boss on the outer peripheral wall above the protective sleeve 24 .

[0159] For example, the shell stop step is a sunken platform, and the protective sleeve stop step is a boss. The protective sleeve stop step is accommodated in the space formed by the shell stop step. The protective sleeve stop step and the shell stop step contact and cooperate with each other, which can prevent the protective sleeve 24 from moving axially relative to the shell 10. The protective sleeve stop step and the shell stop step cooperate with each other through the step surface, so that they can stop each other in the axial direction of the shell 10, thereby ensuring the axial position of the entire temperature measuring component 20 relative to the shell 10.

[0160] In some embodiments, the second circumferential positioning portion 211 and the second axial positioning portion 212 can be set at the same time, and the first circumferential positioning portion 111 and the first axial positioning portion 112 can also be set correspondingly at the same time, so as to ensure the relative position of the temperature measuring component 20 and the shell 10 in at least one direction of the circumference or axial direction of the shell 10.

[0161] According to some embodiments of the present disclosure, as shown in Figure 13, the base 22 is provided with a base limiting portion 221, and the protective cover 24 is provided with a protective cover limiting portion 241. The base limiting portion 221 cooperates with the protective cover limiting portion 241 to fix the relative positions of the base 22 and the protective cover 24 in the circumferential direction of the base 22.

[0162] In some embodiments, the base 22 with the temperature measuring element 23 is installed in the protective cover 24, which can protect the temperature measuring element 23. In order to avoid circumferential rotation between the base 22 and the protective cover 24, the base limit portion 221 cooperates with the protective cover limit portion 241 to avoid contact between the temperature measuring element 23 and the protective cover 24, thereby ensuring the accuracy of temperature measurement.

[0163] According to some embodiments of the present disclosure, the base limiting portion 221 is configured as one of a groove and a protrusion, and the protective cover limiting portion 241 is configured as the other of a groove and a protrusion, and the protrusion fits in the groove.

[0164] In some embodiments, a base limiting portion 221 is provided at the lower end of the base 22, and a protective cover limiting portion 241 is provided at the upper end of the protective cover 24. When the base limiting portion 221 is set to a protrusion, the protective cover limiting portion 241 is correspondingly set to a groove. When the base limiting portion 221 is set to a groove, the protective cover limiting portion 241 is correspondingly set to a protrusion. In this way, the protrusion can be embedded in the groove, which can prevent circumferential rotation between the base 22 and the protective cover 24, thereby fixing the relative positions of the base 22 and the protective cover 24 in the circumferential direction of the base 22, thereby ensuring the accuracy of temperature measurement.

[0165] According to some embodiments of the present disclosure, as shown in Figure 11, the temperature measuring hole includes a first temperature measuring hole 243 and at least one second temperature measuring hole 242, the first temperature measuring hole 243 is arranged on the end surface of the protective cover 24 away from the base 22, and the at least one second temperature measuring hole 242 is arranged on the peripheral wall of the protective cover 24 away from the base 22.

[0166] It is understood that the provision of the first temperature measuring hole 243 facilitates the entry of the medium into the protective cover 24, allowing the medium to fully contact the temperature measuring element 23, thereby ensuring accurate temperature measurement. The provision of the second temperature measuring hole 242 on the peripheral wall of the protective cover 24 further allows the medium to contact the temperature measuring element 23 from the circumference of the protective cover 24, thereby accelerating the rate at which the medium and the temperature measuring element 23 come into contact.

[0167] According to some embodiments of the present disclosure, the at least one second temperature measuring hole 242 includes a plurality of second temperature measuring holes 242 , and the plurality of second temperature measuring holes 242 are spaced apart and distributed along the circumference of the protective cover 24 .

[0168] In some embodiments, multiple second temperature measuring holes 242 are provided on the peripheral wall of the protective cover 24 , and the multiple second temperature measuring holes 242 extend to positions that ensure contact between the medium and the temperature measuring element 23 , which can further accelerate the contact rate between the medium and the temperature measuring element 23 .

[0169] It is understood that the plurality of second temperature measuring holes 242 are spaced apart along the circumference of the protective cover 24, so that the medium and the temperature measuring element 23 are in uniform contact, thereby further ensuring the accuracy of the temperature measurement by the temperature measuring element 23. For example, the plurality of second temperature measuring holes 242 may include four second temperature measuring holes 242, which are evenly spaced along the circumference of the protective cover 24, and any two adjacent second temperature measuring holes 242 form a 90° angle along the circumference of the protective cover 24.

[0170] According to some embodiments of the present disclosure, as shown in FIG. 2 , a channel is formed in the protective cover 24 , and the temperature measuring element 23 is disposed in the channel. The channel has an elliptical cross-section perpendicular to its axial direction.

[0171] In some embodiments, the elliptical channel helps ensure a clear fit between the temperature measuring element 23 and the inner wall of the protective cover 24, thereby preventing temperature measurement errors caused by contact between the temperature measuring element 23 and the inner wall of the protective cover 24. Furthermore, the elliptical channel reduces resistance to the flow of the medium, allowing the medium to pass more smoothly, reducing fluid turbulence, and improving measurement accuracy.

[0172] According to some embodiments of the present disclosure, as shown in Figure 2, the temperature measuring element 23 is provided with a sensing portion 231, and the protective cover 24 is provided with an extension portion 244, the extension portion 244 extends outside the shell 10, and the sensing portion 231 is provided inside the extension portion 244, and the length of the extension portion 244 extending from the shell 10 is a, and the value range of a is: 0<a≤15mm.

[0173] In some embodiments, the extension portion 244 is the portion of the protective cover 24 extending outside the housing. The length of the extension portion 244 extending outside the housing 10 needs to meet certain requirements.

[0174] For example, the length of the extension portion 244 extending outside the shell 10 needs to be greater than zero. Since the temperature measuring element 23 is located in the protective cover 24, this ensures that the sensing portion 231 can be in contact with the medium while the protective cover 24 protects the temperature measuring element 23, thereby measuring the temperature information of the medium.

[0175] For example, the length of the extension portion 244 extending out of the shell 10 also needs to be less than or equal to 15 mm, because the longer the extension portion 244 extends out of the shell 10, the larger the impact area of ​​the medium on the protective cover 24 will be, which can easily cause the protective cover 24 to rupture. Therefore, the length of the protective cover 24 extending out of the shell 10 also needs to be less than or equal to 15 mm, so that the protective cover 24 can be protected.

[0176] According to some embodiments of the present disclosure, the distance between the sensing portion 231 and the end surface of the extending portion 244 away from the housing 10 is b, and the value range of b is: 0<b≤2 mm.

[0177] In some embodiments, the distance between the sensing portion 231 and the end surface of the extending portion 244 away from the housing 10 needs to meet a certain range.

[0178] For example, the distance between the sensing portion 231 and the end face of the extending portion 244 away from the shell 10 needs to be greater than zero, so as to prevent the sensing portion 231 from extending outside the protective cover 24, thereby preventing a large amount of medium from directly impacting the sensing portion 231 and protecting the sensing portion 231.

[0179] For example, the distance between the sensing portion 231 and the end face of the extending portion 244 away from the shell 10 also needs to be less than or equal to 2 mm. It can be understood that the greater the distance between the sensing portion 231 and the end face of the extending portion 244 away from the shell 10, the longer the time required for the sensing portion 231 to contact the medium, which will affect the response speed of the sensor 100.

[0180] According to some embodiments of the present disclosure, as shown in Figure 2, the temperature measuring element 23 is provided with a sensing portion 231, and the protective cover 24 is provided with an extension portion 244, the extension portion 244 extends out of the shell 10, and the sensing portion 231 is arranged in the extension portion 244, and the distance between the sensing portion 231 and the end face of the extension portion 244 away from the shell 10 is b, and the distances between the two ends of the second temperature measuring hole 242 along the axial direction of the protective cover 24 and the end face of the extension portion 244 away from the shell are c and d respectively, wherein c<b<d or d<b<c.

[0181] In this way, the projection of the sensing portion 231 along the axis perpendicular to the protective cover 24 can fall into the area of ​​the second temperature measuring hole 242, which allows the medium to contact the sensing portion 231 through the second temperature measuring hole 242 more quickly, thereby further improving the temperature measurement response speed of the sensor 100.

[0182] According to some embodiments of the present disclosure, as shown in Figure 5, the circuit board 33 is a ceramic circuit board, the circuit board 33 has a first surface 332 and a second surface 333 relative to each other, and the circuit board 33 is provided with at least one electrical connection hole 336, which can electrically connect the corresponding electrical connection point located on the first surface 332 and the electrical connection point located on the second surface 333.

[0183] In this way, by setting an electrical connection hole 336 on the ceramic circuit board to electrically connect the first surface 332 and the second surface 333, the volume of the circuit board 33 can be effectively reduced, which is conducive to the miniaturization of the sensor. In addition, by electrically connecting the first surface 332 and the second surface 333 through the electrical connection hole 336, the consistency and stability of the product can be ensured.

[0184] It is understandable that the electrical connection hole 336 can be formed by laser drilling on the ceramic circuit board and sintering silver on the inner wall of the hole, or can be formed in other ways.

[0185] According to some embodiments of the present disclosure, as shown in Figure 5, the sensor 100 also includes a pressure measuring element 34 for detecting the pressure of the medium. The circuit board 33 has a first surface 332 and a second surface 333 relative to each other. The first surface 332 has a medium isolation area 80 and a medium contact area 81. The pressure measuring element 34 is arranged in the medium contact area 81. The circuit board 33 is provided with at least one electrical connection hole 336. The electrical connection hole 336 is located in the medium isolation area 80. The electrical connection hole 336 can electrically connect the corresponding electrical connection point located on the first surface 332 and the electrical connection point located on the second surface 333. The pressure measuring element 34 is electrically connected to the electrical connection point on the second surface 333 through the electrical connection hole 336.

[0186] Therefore, by setting the medium isolation area 80 and the medium contact area 81 on the side of the circuit board 33 facing the medium to be measured, firstly, it can be ensured that the pressure measuring element 34 set in the medium contact area 81 is in full contact with the medium, thereby ensuring the pressure measurement accuracy.

[0187] Secondly, the medium contact area 81 is not connected to the medium isolation area 80, which can effectively prevent the medium in the medium contact area 81 from flowing to the medium isolation area 80, prevent the medium from leaking from the electrical connection hole 336 located in the medium isolation area 80, and increase the reliability and service life of the circuit board 33, so that the detected pressure data is more accurate.

[0188] Thirdly, by electrically connecting the electrical connection points on the first surface 332 and the electrical connection points on the second surface 333 through the electrical connection holes 336 , the volume of the circuit board 33 can be effectively reduced while ensuring the consistency and stability of the product.

[0189] According to some embodiments of the present disclosure, as shown in FIG. 5 , the diameter of the electrical connection hole 336 is D, and the thickness of the circuit board 33 is H, where D and H satisfy: 1 / 6H≤D≤1 / 3H.

[0190] It should be noted that if D is less than 1 / 6H, the diameter of the electrical connection hole 336 is relatively small, which is not conducive to the arrangement of the electrical connection hole 336 and the stability of the electrical connection between the first surface 332 and the second surface 333. If D is greater than 1 / 3H, the diameter of the electrical connection hole 336 is relatively large, occupying a larger area of ​​the circuit board 33, which is not conducive to the arrangement of components on the circuit board 33.

[0191] For example, D = 1 / 5 H. Thus, the diameter of the electrical connection hole 336 is limited relative to the thickness of the circuit board 33 , so that the circuit board 33 has good reliability, is convenient for placing components on the circuit board 33 , and helps ensure the stability of the electrical connection between the first surface 332 and the second surface 333 .

[0192] According to some embodiments of the present disclosure, as shown in FIG5 , the diameter of electrical connection hole 336 is D, and the minimum distance between electrical connection hole 336 and the edge of circuit board 33 is L, where D and L satisfy the following relationship: D ≤ L ≤ 2D. This allows electrical connection hole 336 to maintain an appropriate distance from the edge of circuit board 33, ensuring the structural strength of circuit board 33 while facilitating the placement of components on both sides of circuit board 33.

[0193] According to some embodiments of the present disclosure, the at least one electrical connection hole 336 includes N electrical connection holes 336 , where N satisfies: N≧4.

[0194] It can be understood that by providing at least four electrical connection holes 336 , the stability and reliability of the electrical signal transmission from the first surface 332 to the second surface 333 can be ensured.

[0195] According to some embodiments of the present disclosure, the sensor 100 further includes a first seal 40 , which is disposed between the housing 10 and the circuit board 33 to separate the first surface 332 into a medium isolation area 80 and a medium contact area 81 .

[0196] It is understandable that the first sealing member 40 can divide the first surface 332 into the medium isolation area 80 and the medium contact area 81 , which can effectively prevent the medium in the medium contact area 81 from flowing into the medium isolation area 80 .

[0197] According to some embodiments of the present disclosure, the circuit board 33 further includes signal conditioning components, which are disposed on the second surface 333 of the circuit board 33 , and the pressure measuring element 34 is electrically connected to the signal conditioning components via the electrical connection hole 336 .

[0198] In some embodiments, signal conditioning components are located on second surface 333. Electrical connection holes 336 connect the load cell 34 and the signal conditioning components to improve signal transmission reliability. Good electrical connection can reduce interference and loss during signal transmission, ensuring signal accuracy and stability. Using electrical connection holes 336 to connect the load cell 34 and the signal conditioning components provides greater layout flexibility.

[0199] According to some embodiments of the present disclosure, signal conditioning components are disposed in the middle of the second surface 333. For example, signal conditioning components located in the middle of the circuit board 33 can be more evenly distributed across the entire circuit board 33, facilitating balanced signal transmission and processing and reducing signal distortion and attenuation during transmission.

[0200] Furthermore, placing the signal conditioning components in the middle of the circuit board 33 can reduce the impact of external interference on them, and placing them away from the edges of the circuit board 33 can reduce electromagnetic interference from the surrounding environment.

[0201] According to some embodiments of the present disclosure, as shown in Figures 5 and 14 , the second surface 333 is further provided with a plurality of first elastic conductive members 35 , which abut against the connector 31 of the sensor 100 . This ensures the stability of electrical signal transmission between the connector 31 and the circuit board 33 .

[0202] According to some embodiments of the present disclosure, as shown in FIG. 2 and FIG. 5 , the sensor 100 further includes a first seal 40 , which is disposed between the housing 10 and the circuit board 33 and surrounds the temperature measurement component 20 .

[0203] It can be understood that the first seal 40 is located between the circuit board 33 and the housing 10. During the installation process, the circuit board 33 squeezes the first seal 40, and the first seal 40 surrounds the temperature measuring component 20. The medium is in the first seal 40. In this way, damage to the parts of the circuit board 33 caused by medium leakage can be avoided, thereby ensuring the sealing between the circuit board 33 and the housing 10.

[0204] Moreover, when the first sealing member 40 is pressed downward, since the connector 31 is provided with at least one pin 60, the at least one pin 60 can effectively contact the moving end of the first elastic conductive member 35, thereby ensuring the stability of the electrical connection.

[0205] According to some embodiments of the present disclosure, a mating groove is defined between the housing 10 , the temperature measuring assembly 20 and the support frame 32 , and the first sealing member 40 is disposed in the mating groove.

[0206] It can be understood that the mating groove can provide installation space for the setting of the first seal 40. The mating groove is defined by the cooperation of three parts (including the shell 10, the temperature measuring component 20 and the support frame 32), which can avoid grooving on the shell 10 and reduce production difficulty.

[0207] According to some embodiments of the present disclosure, as shown in Figure 2, the shell 10 is provided with a placement surface 12, the first sealing member 40 is provided on the placement surface 12, the temperature measuring component 20 is located on the inner side of the placement surface 12 and partially protrudes from the placement surface 12, and the support frame 32 is located on the outer side of the placement surface 12, so that a matching groove can be formed.

[0208] It can be understood that the placement surface 12 on the shell 10 can provide an installation position for the placement of the first seal 40. The placement surface 12 is annular, which can increase the contact area between the first seal 40 and the annular placement surface 12, thereby preventing the first seal 40 from being damaged due to overpressure, resulting in the failure of the sealing effect of the first seal 40.

[0209] According to some embodiments of the present disclosure, as shown in Figure 8, the support frame 32 is formed with a second through hole 326, the first seal 40 is arranged in the second through hole 326, and the sensor 100 also includes a pressure measuring element 34, which is arranged on the side of the circuit board 33 facing the second through hole 326, and the pressure measuring element 34 is surrounded by the first seal 40.

[0210] It is understandable that the support frame 32 is formed with a second through hole 326 , which facilitates the placement of the circuit board 33 . The support frame 32 not only provides an installation space for the circuit board 33 , but also protects the circuit board 33 .

[0211] The first seal 40 is located in the second through hole 326 of the support frame 32, and the pressure measuring element 34 is surrounded by the first seal 40. The first seal 40 contacts the circuit board 33 and the placement surface 12 respectively. The first seal 40 contains a medium. The first seal 40 can divide the circuit board 33 into a medium isolation area 80 and a medium contact area 81. In this way, it can be ensured that the pressure measuring element 34 in the medium contact area 81 is in full contact with the medium, thereby ensuring the pressure measurement accuracy and preventing medium leakage, thereby ensuring the sealing of the sensor 100.

[0212] According to some embodiments of the present disclosure, as shown in Figures 3, 4, and 6, the sensor 100 further includes a connector 31, a support frame 32 connected to the connector 31, a circuit board 33 disposed between the support frame 32 and the connector 31, and the circuit board 33 is electrically connected to the connector 31. Thus, the circuit board 33 is disposed on the support frame 32 and is electrically connected to the connector 31 and the temperature measurement component 20, respectively, thereby ensuring signal transmission.

[0213] According to some embodiments of the present disclosure, as shown in Figures 3, 4, 5 and 16, the support frame 32 is provided with a first plug-in portion 328, the first plug-in portion 328 has a first plug-in surface 90, and the connector 31 is provided with a second plug-in portion 312, the second plug-in portion 312 has a second plug-in surface 91, and the first plug-in surface 90 and the second plug-in surface 91 can abut against each other so that the second plug-in portion 312 and the first plug-in portion 328 are plugged and matched.

[0214] It can be understood that in order to facilitate the connection between the support frame 32 and the connector 31, a first plug-in portion 328 is provided on the support frame 32, and correspondingly, a second plug-in portion 312 is provided on the connector 31. The first plug-in portion 328 and the second plug-in portion 312 are snap-fitted together, thereby improving the efficiency of the connection between the support frame 32 and the connector 31.

[0215] According to some embodiments of the present disclosure, after the sensor is assembled, a spacing exists between the first plugging surface 90 and the second plugging surface 91 in the plugging direction. In other words, the support frame 32 and connector 31 are pre-assembled for plugging and then assembled with the housing by molded assembly, facilitating assembly and facilitating accurate positioning of the sensor components.

[0216] According to some embodiments of the present disclosure, as shown in Figure 3, the distance between the lower surface of the first plug-in portion 328 and the lower surface of the second plug-in portion 312 is e, the first elastic conductive member 35 is connected to the circuit board 33 and the connector 31 respectively, the maximum compression dimension of the first elastic conductive member 35 is f, and the relationship between e and f is: 0<e<f.

[0217] The first elastic conductive member 35 is mainly used for electrical connection between the circuit board 33 and the connector 31 . The signal on the circuit board 33 can be transmitted to the connector 31 through the first elastic conductive member 35 and then output to the outside of the sensor 100 .

[0218] Therefore, the first elastic conductive member 35 is connected to the side of the circuit board 33 away from the support frame 32. This arrangement is more reasonable, making the first elastic conductive member 35 closer to the circuit board, facilitating the connection between the first elastic conductive member 35 and the circuit board 33.

[0219] When the second plug-in portion 312 is plugged into and mated with the first plug-in portion 328 , the first plug-in surface 90 abuts against the second plug-in surface 91 .

[0220] It should be noted that the first plug-in portion 328 can be a plug-in protrusion, and the second plug-in portion 312 can be a plug-in groove. When the first plug-in portion 328 and the second plug-in portion 312 are plugged together, the lower surface of the plug-in groove abuts against the lower surface of the plug-in protrusion. The lower surface of the plug-in groove is the second plug-in surface 91, and the lower surface of the plug-in protrusion is the first plug-in surface 90.

[0221] When the support frame 32 is plugged into the connector 31, the support frame 32, the circuit board 33 and the connector 31 are molded and assembled with the shell 10 as a whole. At this time, the distance between the first plug-in surface 90 and the second plug-in surface 91 is e, and e and f also need to satisfy the relationship 0<e<f. This can ensure that after formal press-fitting, the connector 31 and the first elastic conductive part 35 can have better contact.

[0222] It should be noted that the first plug-in portion 328 may be a plug-in groove, and the second plug-in portion 312 may be a plug-in protrusion.

[0223] According to some embodiments of the present disclosure, 0.5f<e<f.

[0224] For example, after the formal press-fitting, the distance between the first plug-in surface 90 and the second plug-in surface 91 needs to be greater than 0.5f, that is, when the connector 31 pre-presses the first elastic conductive part 35, the pre-pressing amount of the connector 31 on the first elastic conductive part 35 is less than or equal to 0.5f. In this way, during the formal press-fitting process, the relative movement distance between the connector 31 and the support frame 32 can be relatively large, thereby facilitating the improvement of the product qualification rate.

[0225] According to some embodiments of the present disclosure, as shown in FIG. 3 and FIG. 9 , the support frame 32 is provided with a first support frame positioning portion 324 , and the connector 31 is provided with a connector positioning portion 311 . The first support frame positioning portion 324 is positioned and matched with the connector positioning portion 311 .

[0226] It is understandable that the positioning cooperation between the first support frame positioning portion 324 and the connector positioning portion 311 can enable the support frame 32 and the connector 31 to be accurately and quickly positioned and cooperated, thereby avoiding damage to the support frame 32 and the connector 31 during the installation process.

[0227] According to some embodiments of the present disclosure, the first support frame positioning portion 324 is one of a positioning hole and a positioning column, and the connector positioning portion 311 is the other of the positioning hole and the positioning column, and the positioning column is positioned and matched with the positioning hole.

[0228] In some embodiments, when the first support frame positioning portion 324 is set as a positioning hole, the connector positioning portion 311 is correspondingly set as a positioning column, and the positioning column is set at the lower end of the connector 31. The positioning column and the positioning hole are positioned and matched to realize the positioning installation of the support frame 32 and the connector 31.

[0229] In some embodiments, as shown in FIG6 , the at least one pin 60 includes four pins 60. Because the first elastic conductive member 35 is directional, the four pins 60 of the connector 31 have different functional definitions. Two directional posts are provided on the connector 31 to ensure the correct orientation of the connector 31, the support frame 32, and the circuit board 33. Furthermore, to avoid large chips, the first elastic conductive member 35 is positioned to ensure contact stability.

[0230] According to some embodiments of the present disclosure, the first support frame positioning portion 324 includes a plurality of positioning posts having different cross-sectional areas, and the connector positioning portion 311 includes a plurality of positioning holes having different cross-sectional areas.

[0231] In some embodiments, the connector positioning portion 311 includes a plurality of positioning posts having different cross-sectional areas. The first support frame positioning portion 324 includes a plurality of positioning holes having different cross-sectional areas.

[0232] In some embodiments, the connector 31 is provided with a plurality of positioning posts, and correspondingly, the support frame 32 is provided with a plurality of positioning holes. For example, the cross-sectional areas of the positioning posts may be different, and the sizes of the positioning holes may be different. This can avoid misalignment of the positioning posts, thereby achieving accurate installation of the connector 31 and the support frame 32.

[0233] For example, the positioning post is a cylinder, the cross section of the positioning hole is circular, and the diameters of the plurality of positioning posts are different.

[0234] In some embodiments, as shown in Figures 2 and 3, the sensor 100 also includes: a second seal 50, a threaded section is provided on the outer periphery of the shell 10, the second seal 50 is sleeved on the shell 10, and the second seal 50 is located on one side of the threaded section in the axial direction of the shell 10.

[0235] A threaded section is provided on the outer periphery of the shell 10. When the sensor 100 needs to be installed on a pipe for measurement, the threaded section of the shell 10 is connected to the pipe, and the shell 10 and the pipe are locked together by threads. The second seal 50 is located on one side of the threaded section in the axial direction of the shell 10, which can ensure the sealing between the pipe and the shell 10 and prevent liquid leakage in the pipe.

[0236] According to some embodiments of the present disclosure, as shown in FIG. 2 and FIG. 4 , the support frame 32 is provided with a second support frame positioning portion 325 , and the housing 10 is provided with a third positioning portion 113 , and the second support frame positioning portion 325 is positioned and matched with the third positioning portion 113 .

[0237] In some embodiments, a second support frame positioning portion 325 is provided at the bottom of the support frame 32, and a third positioning portion 113 is correspondingly provided on the shell 10. The second support frame positioning portion 325 is positioned and matched with the third positioning portion 113, thereby realizing the positioning and installation of the support frame 32 and the shell 10.

[0238] According to some embodiments of the present disclosure, the second support frame positioning portion 325 is one of a positioning hole and a positioning column, and the third positioning portion 113 is the other of the positioning hole and the positioning column, and the positioning column is positioned and matched with the positioning hole.

[0239] In some embodiments, when the second support frame positioning portion 325 is set as a positioning column, the third positioning portion 113 is correspondingly set as a positioning hole, and the positioning column is positioned and matched with the positioning hole, thereby avoiding misalignment of the support frame 32 and the shell 10, and correspondingly improving the assembly efficiency of the support frame 32 and the shell 10.

[0240] A thermal management system according to an embodiment of the second aspect of the present disclosure includes: the sensor 100 in any one of the above embodiments.

[0241] The vehicle according to the third aspect of the present disclosure includes the thermal management system in any one of the above embodiments, or includes the sensor in any one of the above embodiments.

[0242] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0243] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0244] Although the embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A sensor comprising: case; a temperature measuring assembly, the temperature measuring assembly being adapted to be positioned and matched with the housing, and the temperature measuring assembly being used to measure the temperature of the medium; A support frame, wherein the support frame is arranged in the shell; as well as A circuit board is suitable for being arranged on the support frame, and the temperature measuring component is electrically connected to the circuit board.

2. The sensor according to claim 1, wherein The support frame is provided with a main body and a circuit board limiting portion. The circuit board is arranged on the main body, and the circuit board limiting portion is suitable for limiting cooperation with the side wall of the circuit board.

3. The sensor according to claim 1 or 2, wherein: The circuit board is a ceramic circuit board.

4. The sensor according to claim 2 or 3, wherein: A first edge is defined between the bottom wall of the circuit board and the side wall of the circuit board, and a plurality of contact points that contact the main body or the circuit board limiting portion are provided on the first edge, and any one of the plurality of contact points does not contact the main body and the circuit board limiting portion at the same time.

5. The sensor according to any one of claims 2 to 4, wherein A limiting surface is provided on a side surface of the circuit board limiting portion facing the circuit board, and the limiting surface is suitable for limiting cooperation with a side wall of the circuit board.

6. The sensor according to claim 5, wherein A guide surface is further provided on a side surface of the circuit board limiting portion facing the circuit board. The guide surface is connected to the limiting surface and is used for guiding the assembly of the circuit board.

7. The sensor according to any one of claims 4 to 6, wherein: The main body is provided with an avoidance portion, and the avoidance portion is arranged opposite to the circuit board limiting portion.

8. The sensor according to claim 7, wherein The avoidance portion is one of a groove, a through hole and an opening. When the avoidance portion is the groove, part of the circuit board limiting portion is arranged in the groove, and at least the side wall of the circuit board limiting portion facing the circuit board is spaced apart from the corresponding side wall of the groove.

9. The sensor according to claim 8, wherein The circuit board limiting portion is connected to the bottom wall of the sink.

10. The sensor according to any one of claims 2 to 9, wherein The circuit board is non-circular, a second edge is defined between two side walls of the circuit board, and the main body is provided with an avoidance opening at a position corresponding to the second edge.

11. The sensor according to any one of claims 1 to 10, wherein: One of the support frame and the shell is provided with a positioning hole, and the other of the support frame and the shell is provided with a positioning column, and the positioning column is fitted in the positioning hole.

12. The sensor according to any one of claims 1 to 11, wherein The temperature measurement component includes: a base disposed in the housing and electrically connected to the circuit board; and A temperature measuring element is disposed on the base and electrically connected to the base.

13. The sensor according to claim 12, wherein The base comprises: a base body, wherein the base body is provided with a first through hole; and A conductive sheet is matched with the first through hole, a first end of the conductive sheet is electrically connected to the temperature measuring element, and a second end of the conductive sheet is electrically connected to the circuit board.

14. The sensor according to claim 13, wherein The seat body includes a seat plate and a boss. The boss is arranged on the seat plate and protrudes from the seat plate along a first direction. The boss is suitable for supporting the second end of the conductive sheet.

15. The sensor according to claim 14, wherein The through hole penetrates the seat plate and the boss along a first direction.

16. The sensor according to claim 14 or 15, wherein A receiving groove is formed on a surface of the boss away from the seat plate, and the second end is suitable for fitting in the receiving groove.

17. The sensor according to any one of claims 13 to 16, wherein The seat body further includes an outer ring plate, which is arranged around the seat plate and extends along a first direction. The outer ring plate and the seat plate together enclose an open cavity, and the boss is arranged in the cavity.

18. The sensor according to claim 17, wherein Along the first direction, the end of the boss away from the seat plate does not exceed the end of the outer ring plate away from the seat plate.

19. The sensor according to any one of claims 12 to 18, wherein A plurality of spaced anti-collision protrusions are provided on one end of the base facing the circuit board, and the plurality of anti-collision protrusions are in abutment with the circuit board.

20. The sensor according to any one of claims 12 to 19, wherein The temperature measurement component also includes: The protective cover is connected to the base and covers the temperature measuring element. The protective cover is provided with a temperature measuring hole for the medium to contact the temperature measuring element.

21. The sensor according to claim 20, wherein The shell is provided with a first positioning portion, and at least one of the base or the protective cover is provided with a second positioning portion, and the second positioning portion cooperates with the first positioning portion to fix the relative position of the temperature measuring component and the shell in at least one direction of the circumference or axial direction of the shell.

22. The sensor according to claim 21, wherein The first positioning portion includes: a first circumferential positioning portion, the first circumferential positioning portion being provided on the inner circumferential wall of the housing; The second positioning portion includes: a second circumferential positioning portion, which is arranged on the outer circumferential wall of the base, and cooperates with the first circumferential positioning portion to fix the relative positions of the temperature measuring component and the shell in the circumferential direction of the shell.

23. The sensor according to claim 22, wherein The first circumferential positioning portion is configured as one of a groove and a protrusion, and the second circumferential positioning portion is configured as the other of the groove and the protrusion, and the protrusion is matched with the groove.

24. The sensor according to claim 23, wherein The second circumferential positioning portion is configured as the groove, which is open at one axial side of the base to form the groove for the protrusion to enter and exit.

25. The sensor according to any one of claims 21 to 24, wherein The first positioning portion includes: a first axial positioning portion, the first axial positioning portion being provided on the inner peripheral wall of the housing; The second positioning portion includes: a second axial positioning portion, which is arranged on the outer peripheral wall of the protective sleeve, and cooperates with the first axial positioning portion to fix the relative positions of the temperature measuring component and the shell in the axial direction of the shell.

26. The sensor according to claim 25, wherein The first axial positioning portion is configured as a housing stop step, and the second axial positioning portion is configured as a protective sleeve stop step. The protective sleeve stop step and the housing stop step abut against each other in the axial direction of the housing.

27. The sensor according to any one of claims 21 to 26, wherein The base is provided with a base limiting portion, and the protective cover is provided with a protective cover limiting portion. The base limiting portion cooperates with the protective cover limiting portion to fix the relative positions of the base and the protective cover in the circumferential direction of the base.

28. The sensor according to claim 27, wherein The base limiting portion is configured as one of a groove and a protrusion, the protective cover limiting portion is configured as the other of the groove and the protrusion, and the protrusion is matched with the groove.

29. The sensor according to any one of claims 20 to 28, wherein The temperature measuring hole includes a first temperature measuring hole and at least one second temperature measuring hole. The first temperature measuring hole is arranged on the end surface of the protective cover away from the base, and the at least one second temperature measuring hole is arranged on the peripheral wall of the protective cover away from the base.

30. The sensor according to claim 29, wherein The at least one second temperature measuring hole includes a plurality of second temperature measuring holes, and the plurality of second temperature measuring holes are distributed at intervals along the circumference of the protective cover.

31. The sensor according to any one of claims 20 to 30, wherein A channel is formed in the protective cover, the temperature measuring element is arranged in the channel, and a cross section of the channel perpendicular to the axial direction of the channel is elliptical.

32. The sensor according to any one of claims 20 to 31, wherein The temperature measuring element is provided with a sensing part, the protective cover is provided with a protruding part, the protruding part protrudes outside the shell, the sensing part is arranged inside the protruding part, the length of the protruding part protruding from the shell is a, and the value range of a is: 0<a≤15mm.

33. The sensor according to claim 32, wherein The distance between the sensing portion and the end surface of the extending portion away from the housing is b, and the value range of b is: 0<b≤2mm.

34. A sensor according to any one of claims 29 to 33, wherein The temperature measuring element is provided with a sensing portion, the protective sleeve is provided with an extension portion, the extension portion extends outside the housing, the sensing portion is provided inside the extension portion, the distance between the sensing portion and an end surface of the extension portion away from the housing is b, and the distances between the two ends of the second temperature measuring hole along the axial direction of the protective sleeve and the end surface of the extension portion away from the housing are c and d, respectively; Where b, c, and d satisfy one of the following: c < b < d; and d<b<c.

35. The sensor according to any one of claims 1 to 34, wherein The circuit board is a ceramic circuit board having a first surface and a second surface relative to each other. The circuit board is provided with at least one electrical connection hole, and the at least one electrical connection hole can electrically connect the corresponding electrical connection point located on the first surface and the electrical connection point located on the second surface.

36. The sensor according to any one of claims 1 to 35, further comprising a load cell for detecting pressure of the medium; The circuit board has a first surface and a second surface opposite to each other, the first surface has a medium isolation area and a medium contact area, and the pressure measuring element is provided in the medium contact area; The circuit board is provided with at least one electrical connection hole, and the at least one electrical connection hole is located in the dielectric isolation area. The at least one electrical connection hole can electrically connect the corresponding electrical connection point located on the first surface and the electrical connection point located on the second surface. The pressure measuring element is electrically connected to the electrical connection point on the second surface through the electrical connection hole.

37. The sensor according to claim 36, wherein The diameter of the electrical connection hole is D, and the thickness of the circuit board is H, wherein D and H satisfy: 1 / 6H≤D≤1 / 3H.

38. The sensor according to claim 36 or 37, wherein The diameter of the electrical connection hole is D, and the minimum distance between the electrical connection hole and the edge of the circuit board is L, wherein D and L satisfy: D≤L≤2D.

39. A sensor according to any one of claims 36 to 38, wherein The at least one electrical connection hole includes N electrical connection holes, where N satisfies: N≥4.

40. The sensor according to any one of claims 36 to 39, further comprising a first seal disposed between the housing and the circuit board to separate the first surface into the media-isolating area and the media-contacting area.

41. A sensor according to any one of claims 36 to 40, wherein The circuit board further includes a signal conditioning component, which is disposed on the second surface of the circuit board. The pressure measuring element is electrically connected to the signal conditioning component through the at least one electrical connection hole.

42. The sensor according to claim 41, wherein The signal conditioning component is arranged in the middle of the second surface.

43. A sensor according to any one of claims 36 to 42, wherein The second surface is further provided with a plurality of first elastic conductive members, and the sensor further includes a connector; the plurality of first elastic conductive members are in abutment with and fit into the connector of the sensor.

44. The sensor according to any one of claims 1 to 43, further comprising: A first sealing member is provided between the housing and the circuit board and surrounds the temperature measuring component.

45. The sensor according to claim 44, wherein A matching groove is defined between the shell, the temperature measuring component and the support frame, and the first sealing member is arranged in the matching groove.

46. ​​The sensor according to claim 45, wherein The shell is provided with a placement surface, the first seal is provided on the placement surface, the temperature measuring component is located on the inner side of the placement surface, and part of the temperature measuring component is protruded from the placement surface, and the support frame is located on the outer side of the placement surface to form the matching groove.

47. A sensor according to any one of claims 44 to 46, wherein The support frame is formed with a second through hole, and the first sealing member is arranged in the second through hole; The sensor further includes a pressure measuring element, which is disposed on a side of the circuit board facing the second through hole and is surrounded by the first sealing member.

48. The sensor according to any one of claims 1 to 47, further comprising: The support frame is connected to the connector, and the circuit board is arranged between the support frame and the connector and is electrically connected to the connector.

49. The sensor according to claim 48, wherein The support frame is provided with a first plug-in portion, which has a first plug-in surface; the connector is provided with a second plug-in portion, which has a second plug-in surface; the first plug-in surface and the second plug-in surface can abut against each other so that the second plug-in portion is plugged into and matched with the first plug-in portion.

50. The sensor according to claim 49, wherein After the sensor is assembled, there is a distance between the first plug-in surface and the second plug-in surface in the plug-in direction.

51. The sensor according to claim 50, wherein The distance between the first plug-in surface and the second plug-in surface is e; The sensor further includes a first elastic conductive member, which is connected to the circuit board and the connector respectively. The maximum compression size of the first elastic conductive member is f, and the relationship between e and f is: 0<e<f.

52. The sensor according to claim 51, wherein 0.5f<e<f.

53. A sensor according to any one of claims 49 to 52, wherein The support frame is provided with a first support frame positioning portion, and the connector is provided with a connector positioning portion, and the first support frame positioning portion is positioned and matched with the connector positioning portion.

54. The sensor according to claim 53, wherein The first support frame positioning portion is one of a positioning hole and a positioning column, and the connector positioning portion is the other of the positioning hole and the positioning column; the positioning column is positioned and matched with the positioning hole.

55. The sensor of claim 53, wherein The first support frame positioning portion and the connector positioning portion satisfy one of the following conditions: The first support frame positioning portion includes a plurality of positioning columns, and the plurality of positioning columns have different cross-sectional areas; the connector positioning portion includes a plurality of positioning holes, and the plurality of positioning holes have different cross-sectional areas; as well as The connector positioning portion includes a plurality of positioning columns, and the plurality of positioning columns have different cross-sectional areas; the first support frame positioning portion includes a plurality of positioning holes, and the plurality of positioning holes have different cross-sectional areas.

56. A thermal management system comprising: A sensor according to any one of claims 1 to 55.

57. A vehicle that meets any of the following requirements: The vehicle comprises: The thermal management system of claim 56; and The vehicle comprises: a sensor according to any one of claims 1-55.

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