Packaging layer and display screen

By setting a translucent substrate layer and a microstructure layer on the light-emitting side of the light board of the Mini-LED display, the refractive effect of the micro-protrusions is used to solve the problem of uneven brightness of the Mini-LED display at a wide viewing angle, thereby improving the display effect and user experience.

WO2025195488A1PCT designated stage Publication Date: 2025-09-25SHENZHEN JUFEI OPTOELECTRONICS CO LTD +1
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Patent Information

Application Number
PCT/CN2025/083954
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-22
Filing Date
2025-03-21
Publication Date
2025-09-25

AI Technical Summary

Technical Problem

The brightness attenuation of different colors of LED chips on Mini-LED displays is inconsistent at large viewing angles, resulting in color cast problems on the display and poor user experience.

Method used

An encapsulation layer is set on the light-emitting side of the light board of the display screen. The encapsulation layer consists of a light-transmitting substrate layer and a microstructure layer. The microstructure layer consists of a number of micro-protrusions. The surface of the micro-protrusions is curved and the sizes are randomly distributed. The refraction effect of the micro-protrusions uniformizes the light and reduces the brightness attenuation difference of different colors.

Benefits of technology

It improves the light mixing uniformity of the display at a wide viewing angle, reduces color cast, and enhances display effects and user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a packaging layer and a display screen. The packaging layer is arranged on a light-emitting side of a lamp panel of the display screen and comprises a light-transmissive substrate layer and a micro-structured layer; the substrate layer is arranged on the lamp panel; the micro-structured layer is arranged on the surface of the substrate layer distant from the lamp panel, and is composed of a plurality of micro bumps; the plurality of micro bumps correspond to one light-emitting element; and each micro bump has an arc-shaped surface and a random size. Light emitted from the lamp panel is refracted by the surfaces of the micro bumps and then emitted, improving the light-emitting angle and the light mixing uniformity; and the light-emitting angle difference is small after light of different colors is refracted by the surfaces of the micro bumps, so that the problem of color cast of the display screen when being observed at a large viewing angle can be mitigated. Additionally, a gap is present between at least some adjacent micro bumps among the plurality of micro bumps, the reflectivity of the gap area is different from that of each micro bump, and the overall reflectivity of the display screen can be adjusted by means of the gap area, thereby furthering improving the display effect of the display screen.
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Description

Encapsulation layer and display screen Technical Field

[0001] The present invention relates to the field of display, and in particular to a packaging layer and a display screen. Background Art

[0002] A light-emitting diode (LED) is a semiconductor light-emitting device widely used in the display field. Its light-emitting component is a light-emitting chip containing a P-N junction. By applying voltage to the electrodes of the light-emitting chip, electrons and holes in the chip recombine and radiate energy, thereby emitting visible light.

[0003] Displays made with Mini-LED (Mini-Light Emitting Diode) are a next-generation display technology, offering advantages such as high brightness, a wide color gamut, high contrast, and wider viewing angles, and have become a growing trend. The pixel units of these displays typically include LED chips in the three primary colors of red (R), green (G), and blue (B), emitting light in the three colors of R, G, and B. Due to the varying luminous properties of LED chips of different colors, the brightness attenuation of these LED chips at wide viewing angles within each pixel unit varies. Consequently, the brightness attenuation of these LED chips at wide viewing angles differs compared to the normal viewing angle. This, in turn, leads to color cast when viewing the display at wide viewing angles, resulting in poor display quality and low user satisfaction. Summary of the Invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the present application provides an encapsulation layer and a display screen to solve the problem of how to improve the color cast of existing display screens when observed at a wide viewing angle.

[0005] In order to solve the above technical problems, the present application provides an encapsulation layer, which is used for a display screen, wherein the display screen includes a light board, and a plurality of light-emitting elements are provided on the light board;

[0006] The encapsulation layer is arranged on the light-emitting side of the lamp board and covers each light-emitting element on the lamp board; the encapsulation layer includes a base material layer and a microstructure layer;

[0007] The substrate layer is light-transmissive and is arranged on the lamp board; the microstructure layer is arranged on a side of the substrate layer away from the lamp board; the microstructure layer is composed of a plurality of micro-protrusions, at least some of the adjacent micro-protrusions among the plurality of micro-protrusions have gaps, and a plurality of the micro-protrusions correspond to one light-emitting element, the surface of each micro-protrusion is a curved surface, and the sizes of each micro-protrusion are randomly distributed.

[0008] Optionally, the maximum diameter of each of the micro protrusions is randomly distributed between 1 μm and 20 μm, and the maximum height of each of the micro protrusions is randomly distributed between 0.5 μm and 10 μm.

[0009] Optionally, the substrate layer and each of the micro-protrusions are integrally formed.

[0010] Optionally, the substrate layer and each of the micro-protrusions may be formed of the same colloid.

[0011] Optionally, the hardness of each of the micro-protrusions is greater than 1H, and the adhesion of each of the micro-protrusions on the substrate layer is greater than 2B.

[0012] Optionally, the reflectivity of the surface of each micro-protrusion is less than 10%.

[0013] Optionally, some of the micro-protrusions overlap with each other, or there is a gap between adjacent micro-protrusions.

[0014] Optionally, the surface of the substrate layer between adjacent micro-protrusions is flat.

[0015] Optionally, the ratio of the sum of the orthographic projection areas of the micro protrusions within a unit area on the substrate layer to the unit area is 30% to 95%.

[0016] Based on the same inventive concept, the present application also provides a display screen, comprising a light board and the packaging layer as described above, wherein the packaging layer is arranged on the light-emitting side of the light board and covers each light-emitting element on the light board. Beneficial effects

[0017] The encapsulation layer provided by the present application is arranged on the light-emitting side of the light board of the display screen, covering each light-emitting element on the light board; the encapsulation layer includes a light-transmitting substrate layer and a microstructure layer, that is, the light emitted by the light-emitting element on the light board is emitted through the substrate layer and the microstructure layer; wherein the substrate layer is arranged on the light board, and the microstructure layer is arranged on the side of the substrate layer away from the light board, which is composed of a plurality of micro-protrusions, and the surface of each micro-protrusion is an arc surface, that is, each micro-protrusion is a lens-like shape similar to a convex lens, and the size of each micro-protrusion is randomly distributed. On the one hand, the light emitted from the light board is refracted by the surface of each micro-protrusion and then emitted, thereby improving the light emission angle and light mixing uniformity. On the other hand, the light of different colors (such as R, G, B) emitted from the light board can be refracted by the surface of each micro-protrusion. The difference in the light emission angle is small, which can ensure that the brightness attenuation of light of different colors at each viewing angle is consistent as much as possible, thereby avoiding or improving the color cast problem of the display screen when observed at a wide viewing angle, thereby improving the display effect and user experience satisfaction;

[0018] In the present application, the multiple micro-protrusions of the microstructure layer correspond to one light-emitting element on the light board, that is, the orthographic projection areas of the multiple micro-protrusions on the light board are located within or intersect with the orthographic projection area of ​​one light-emitting element on the light board, so that the light emitted from the light-emitting surface of one light-emitting element can be fully mixed by the multiple micro-protrusions;

[0019] In addition, among the several micro-protrusions of the present application, there are gaps between at least some adjacent micro-protrusions, and the reflectivity of the gap area between adjacent micro-protrusions is different from the reflectivity of each micro-protrusion. Therefore, the overall reflectivity of the display screen can be comprehensively adjusted according to needs through the gap area, thereby further improving the display effect of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a schematic diagram of a longitudinal cross-sectional structure of an encapsulation layer according to an embodiment of the present invention;

[0021] FIG2 is a schematic diagram of the longitudinal cross-sectional structure and dimensions of a micro-protrusion provided by an embodiment of the present invention;

[0022] FIG3 is a schematic diagram of encapsulation layer rendering according to an embodiment of the present invention;

[0023] FIG4 is a second schematic diagram of a longitudinal cross-sectional structure of an encapsulation layer provided in an embodiment of the present invention;

[0024] FIG5 is a third schematic diagram of a longitudinal cross-sectional structure of an encapsulation layer provided in an embodiment of the present invention;

[0025] FIG6 is a fourth schematic diagram of a longitudinal cross-sectional structure of an encapsulation layer provided in an embodiment of the present invention;

[0026] FIG7 is a fifth schematic diagram of a longitudinal cross-sectional structure of an encapsulation layer provided in an embodiment of the present invention;

[0027] FIG8 is a sixth schematic diagram of a longitudinal cross-sectional structure of an encapsulation layer provided in an embodiment of the present invention;

[0028] FIG9 is a schematic diagram of a longitudinal cross-sectional structure of a light panel of a display screen provided by an embodiment of the present invention, in which an encapsulation layer is provided;

[0029] FIG10 is a rendering diagram of a light panel of a display screen provided by an embodiment of the present invention, in which an encapsulation layer is provided;

[0030] FIG11 is a microscope image of micro-protrusions provided in an embodiment of the present invention;

[0031] FIG12 is a schematic diagram of a longitudinal cross-sectional structure of a triangular prism-shaped protrusion provided by an embodiment of the present invention;

[0032] FIG13 is a microscope image of flocculent irregular texture protrusions provided by an embodiment of the present invention;

[0033] FIG14 is a schematic diagram of a placement method of a display screen in a test environment according to an embodiment of the present invention;

[0034] FIG15 is a schematic diagram showing a comparison of color temperature curves provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0035] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0037] Displays using Mini‑LEDs are a growing trend as a next-generation display technology. For example, Mini COB (Chip On Board) displays utilize a COB packaging method, where Mini LED chips are directly soldered to a PCB using solder paste. The Mini LED chips that make up a pixel typically include LED chips for the three primary colors of red (R), green (G), and blue (B). Due to the varying luminous properties of LED chips of different colors, the brightness of the different colors within each pixel varies across wide viewing angles. For example, in some applications, the attenuation of the red light at wide viewing angles results in only a composite light composed primarily of the two colors, red and blue (G). Compared to the composite light of red, green, and blue seen at normal viewing angles, this results in a noticeable color cast when viewed from wide viewing angles. For ease of understanding, the normal viewing angle in this embodiment is the angle perpendicular to the display screen, that is, 90°, that is, the angle at which the user looks directly at the display screen; the wide viewing angle is the angle at which the user looks at the display screen from the side (such as the left, right, top or bottom, etc.) of the display screen. For example, taking the left and right sides as examples, the wide viewing angle can be set to but not limited to 150° to 180° and 0° to 30°. Of course, the wide viewing angle in this embodiment can be flexibly adjusted, for example, it can also be set to a specific value (such as 170° and 10°), or to a range of values, such as 170° to 180° and 0° to 10°, etc.

[0038] In response to the above problems, this embodiment provides a packaging layer applied to a display screen. The display screen in this embodiment includes a light board, on which a number of light-emitting elements are provided. In some examples of this embodiment, the light-emitting elements may be LED chips, which are provided on the light board using a COB packaging method; in other examples, the light-emitting elements may also be LED chip packaging devices, such as but not limited to CSP (Chip Scale Package) LED packaging devices and NCSP (Near Chip Scale Package) LED packaging devices.

[0039] In this embodiment, the encapsulation layer is disposed on the light-emitting side of the light panel, covering each light-emitting element on the light panel. As shown in FIG1 , the encapsulation layer comprises a light-transmissive substrate layer 1 and a microstructure layer 2. The substrate layer 1 is disposed on the light panel, and the microstructure layer 2 is disposed on the side of the substrate layer 1 facing away from the light panel. The microstructure layer 2 comprises a plurality of microprotrusions 21, with gaps between at least some of the adjacent microprotrusions 21 (i.e., at least some of the adjacent microprotrusions 21 are separated from each other). Each of the microprotrusions 21 corresponds to a light-emitting element on the light panel, i.e., the orthographic projections of the microprotrusions 21 on the light panel are located within or intersect with the orthographic projections of a light-emitting element on the light panel. This allows the microprotrusions 21 to effectively mix the light emitted from the light-emitting surface of a light-emitting element, enhancing the display effect. In this embodiment, the surface of each microprotrusion 21 is a curved surface (i.e., each microprotrusion 21 has a lens-like shape similar to a convex lens), and the sizes of the microprotrusions 21 are randomly distributed (thus facilitating random light mixing and enhancing the light mixing effect). In this embodiment, the above-mentioned microstructure layer 2 is provided. On the one hand, the light emitted from the light board is refracted by the surface of each micro-protrusion 21 and then emitted, thereby improving the light output angle and light mixing uniformity. On the other hand, the light of different colors emitted from the light board is refracted by the surface of each micro-protrusion 21, and the difference in the light output angle is small. This can ensure that the brightness attenuation of different colors of light at each viewing angle is consistent as much as possible, especially the brightness attenuation difference at a wide viewing angle is minimized as much as possible, thereby avoiding or improving the color cast problem of the display screen when observed at a wide viewing angle, and improving the display effect and user experience satisfaction. At least some adjacent micro-protrusions 21 are provided with gaps. Since the reflectivity of the gap area between adjacent micro-protrusions 21 is different from the reflectivity of each micro-protrusion 21, the overall reflectivity of the display screen can be comprehensively adjusted according to demand through the gap area, thereby further improving the display effect of the display screen.

[0040] It should be understood that in this embodiment, on the basis that the surface of each micro-protrusion 21 is a curved surface, the specific shape of each micro-protrusion 21 can be flexibly set. For example, in some examples, the specific shape of each micro-protrusion 21 can be the same, or it can be set so that a part of the micro-protrusions 21 have the same shape and a part of the micro-protrusions 21 have different shapes. In other examples, the specific shape of each micro-protrusion 21 can be randomly formed on the basis of the above, thereby further enhancing the randomness and effect of light mixing. Taking Figure 1 as an example, it can be seen from Figure 1 that the overall shape of the longitudinal section of each micro-protrusion 21 is hemispherical, but the specific shapes of some of the micro-protrusions 21 are different, and the specific shapes of some of the micro-protrusions 21 are the same; the specific shape of each micro-protrusion 21 shown in Figure 1 can be formed in a random manner or in a fixed arrangement rule.

[0041] It should be understood that in this embodiment, the specific size range of each micro-protrusion 21 can be flexibly set according to, but not limited to, specific application scenarios. For example, in some examples, the maximum diameter of each micro-protrusion 21 is randomly distributed between 1 μm and 20 μm, and the maximum height of each micro-protrusion 21 is randomly distributed between 0.5 μm and 10 μm. In some of these application scenarios, the maximum diameter of the micro-protrusion 21 can be set in association with its maximum height. Taking a single micro-protrusion 21 as an example, as shown in Figure 2, its maximum diameter D can be understood as the maximum width of the micro-protrusion 21, and its maximum height H is the largest of the heights from each point on the surface of the micro-protrusion 21 to the side of the substrate layer 1 away from the light board. Taking the Mini COB (Chip On Board) display as an example, the several light-emitting elements on the light board of the display are Mini LED chips, where the side length of the Mini LED chip is 100μm to 300μm, and the maximum diameter of each micro-protrusion 21 is randomly distributed between 1μm and 20μm. For example, the specific value may be greater than or equal to 1μm and less than 3μm, or greater than or equal to 3μm and less than or equal to 10μm, or greater than or equal to 10μm and less than or equal to 20μm, etc.; the maximum height H of each micro-protrusion 21 is randomly distributed between 0.5μm and 10μm, for example, the specific value may be greater than or equal to 0.5μm and less than or equal to 2.5μm, or greater than 2.5μm and less than or equal to 10μm, or greater than or equal to 5μm and less than or equal to 10μm, etc. A rendering schematic diagram of the encapsulation layer shown in Figure 1 is shown in Figure 3. The maximum diameter of each micro-protrusion 21 is much smaller than the side length of the light-emitting element. A plurality of micro-protrusions 21 are correspondingly arranged on a light-emitting element. The light emitted from the light-emitting surface of a light-emitting element can be fully mixed through the plurality of micro-protrusions 21.

[0042] In some examples of this embodiment, the density of the micro-protrusions 21 per unit area on the substrate layer 1 is uniform. That is, the density of the micro-protrusions 21 per unit area on the substrate layer 1 is uniform, thereby ensuring that the light on the light panel is emitted uniformly per unit area after passing through the packaging layer, thereby improving the display effect.

[0043] In this embodiment, the density of the micro-protrusions 21 per unit area on the substrate layer 1 can be flexibly set according to specific application requirements. In some examples, when a higher overall reflectivity is required, the density of the micro-protrusions 21 per unit area on the substrate layer 1 is reduced. In other examples, when a lower overall reflectivity is required, the density of the micro-protrusions 21 per unit area on the substrate layer 1 is increased. That is, in this embodiment, the reflectivity of the gaps between adjacent micro-protrusions 21 is higher than the reflectivity of the micro-protrusions 21. When the density of the micro-protrusions 21 is lower, the corresponding gaps are larger, thereby increasing the overall reflectivity. When the density of the micro-protrusions 21 is higher, the corresponding gaps are smaller, thereby decreasing the overall reflectivity. For example, referring to Figures 1 and 4 , the density of the micro-protrusions 21 in the encapsulation layer shown in Figure 4 is lower than the density of the micro-protrusions 21 in the encapsulation layer shown in Figure 1 , and the overall reflectivity of the encapsulation layer shown in Figure 4 is greater than that of the encapsulation layer shown in Figure 1 . It can be seen from this that in this embodiment, the overall reflectivity of the packaging layer can be flexibly adjusted by adjusting the density of the micro-protrusions 21 within each unit area on the substrate layer 1 (the corresponding gap area between adjacent micro-protrusions 21 changes accordingly), thereby adapting to the needs of various application scenarios, with good flexibility and a wide range of applications.

[0044] In some examples of this embodiment, the density of the micro-protrusions 21 per unit area on the substrate layer 1 can be characterized by the ratio of the sum of the orthographic projection areas of the micro-protrusions 21 per unit area on the substrate layer 1 to the unit area. In this example, the ratio of the sum of the orthographic projection areas of the micro-protrusions 21 per unit area on the substrate layer 1 to the unit area can be set to 30% to 95%, and the specific ratio can be flexibly set based on the overall reflectivity requirements of the display screen. For example, in some application scenarios, when the overall reflectivity of the display screen is required to be higher, the ratio of the sum of the orthographic projection areas of the micro-protrusions 21 per unit area on the substrate layer 1 per unit area to the unit area can be set to a smaller value within 30% to 95%, such as 30% to 40%, 30% to 50%, 40% to 50%, etc.; in other application scenarios, when the overall reflectivity of the display screen is required to be lower, the ratio of the sum of the orthographic projection areas of the micro-protrusions 21 per unit area on the substrate layer 1 per unit area to the unit area can be set to a larger value within 30% to 95%, such as greater than 50%, less than or equal to 60%, 60% to 70%, 70% to 80%, 80% to 90%, 90% to 95%, greater than 50%, less than or equal to 70%, greater than or equal to 70%, less than or equal to 90%, greater than 50%, less than or equal to 60%, less than or equal to 95%, etc. Of course, it should be understood that in other examples of this embodiment, the density of the micro-protrusions 21 per unit area on the substrate layer 1 can also be represented by the number of micro-protrusions 21 per unit area on the substrate layer 1. This equivalent replacement method will not be repeated here.

[0045] In some examples of this embodiment, the reflectivity of the surface of each micro-protrusion 21 can be set to be less than 10%, and accordingly, the reflectivity of the gap area between each adjacent micro-protrusion 21 can be greater than 10%; in this application example, the reflectivity of the surface of each micro-protrusion 21 can be set to be the same. Of course, it can also be set according to requirements so that the reflectivity of the surface of some micro-protrusions 21 is the same and the reflectivity of the surface of some micro-protrusions 21 is different. In this application example, the reflectivity of the gap area between adjacent micro-protrusions 21 can be set to be the same, or the reflectivity of the gap area between some adjacent micro-protrusions 21 can be set to be the same and the reflectivity of the gap area between some adjacent micro-protrusions 21 can be different. The specific settings can be flexibly made according to application requirements and have good applicability.

[0046] In some examples of this embodiment, gaps may be provided between adjacent micro-protrusions 21, that is, each micro-protrusion 21 is separated from each other. For example, as shown in FIG4 , a gap C is provided between each adjacent micro-protrusion 21. In some examples of this embodiment, the surface of the substrate layer 1 not covered by the micro-protrusions 21 may be provided as a plane. Of course, it may also be provided as a curved surface or an inclined surface as required. For example, in some application scenarios, the surface of the substrate layer 1 between adjacent micro-protrusions 21 may be provided as a plane, thereby improving the controllability and consistency of the light mixing effect, reducing the manufacturing difficulty, simplifying the structure, and improving the yield rate.

[0047] In some examples of this embodiment, some adjacent micro-protrusions 21 may overlap with each other. For example, as shown in FIG5 , two adjacent micro-protrusions 21 shown in region D1 overlap vertically. Another example, as shown in FIG5 , two adjacent micro-protrusions 21 shown in region D2 overlap horizontally. Of course, the above overlapping methods are only some examples for ease of understanding. Other overlapping methods may also be included. For example, three or more micro-protrusions 21 may overlap, and the overlapping methods include but are not limited to at least one of the above methods. For example, three or more micro-protrusions 21 may overlap in sequence in the height direction, or may overlap in the horizontal direction, or may overlap in part in the height direction and in part in the horizontal direction. By overlapping some adjacent micro-protrusions 21 2, the shapes and sizes formed after the micro-protrusions 21 overlap are enriched, thereby enriching the light mixing effect and improving the display effect.

[0048] In some examples of this embodiment, the encapsulation layer includes a substrate layer 1 and each micro-protrusion 21 integrally formed. This simplifies the structure and manufacturing process, reducing costs, while also improving the adhesion of the micro-protrusions 21 to the substrate layer 1, thereby improving reliability. For example, in some examples, as shown in FIG6 , the substrate layer 1 and each micro-protrusion 21 can be formed from the same colloid, such as, but not limited to, silicone or epoxy resin. In this example, the substrate layer 1 and micro-protrusions 21 can be formed integrally by embossing the surface of an epoxy resin layer or silicone layer with, but not limited to, a release film. In this case, the release film can be pre-formed with recesses corresponding to each micro-protrusion 21. The release film is then embossed onto the semi-cured epoxy resin layer or silicone layer to form the micro-protrusions 21 (i.e., to form the microstructure layer 2). Alternatively, a liquid epoxy resin layer or silicone layer can be directly filled onto the side of the release film where the recesses are formed and then cured, forming the micro-protrusions 21 on the surface of the epoxy resin layer or silicone layer that contacts the release film. In this example, a semi-cured epoxy resin layer or silicone layer can be formed first, and then the micro-protrusions 21 can be formed by rolling the surface of the epoxy resin layer or silicone layer using, but not limited to, a roller (such as a copper roller) having a corresponding concave-convex structure on its surface. Accordingly, in this example, when the surface of the substrate layer 1 located between adjacent micro-protrusions 21 needs to be set as a plane, the corresponding surface area of ​​the release film or roller is set as a plane; when the surface of the substrate layer 1 located between adjacent micro-protrusions 21 needs to be set as a curved surface (such as a concave curved surface) or an inclined surface, the corresponding surface area of ​​the release film or roller is set as a curved surface of a corresponding shape (such as a corresponding convex curved surface) or an inclined surface; it can be seen that the material used for the encapsulation layer in this example is highly versatile, the manufacturing process is simple and easy to implement, and the cost is low and the yield rate is high.

[0049] In other examples of this embodiment, the substrate layer 1 and the micro-protrusions 21 included in the encapsulation layer may also be non-integrally molded structures. That is, the substrate layer 1 and the micro-protrusions 21 are different physical layers. Both may be adhesive layers, or the substrate layer 1 may be an adhesive layer and the micro-protrusions 21 may be a coating layer formed by coating, or the substrate layer 1 may be a film layer and the micro-protrusions 21 may be an adhesive layer or a coating layer formed by coating. The micro-protrusions 21 may be formed by coating, but not limited to, adding spherical particles to the glue in the coating layer. After the glue cures, the spherical particles may be exposed from a portion of the glue surface, forming a surface raised pattern. For example, as shown in FIG7 , an application example is shown. The substrate layer 1 includes a film layer 11, and the micro-protrusions 21 included in the microstructure layer 2 are a coating layer disposed on a surface of the film layer 11 away from the light panel. For example, the micro-protrusions 21 may be formed by coating a PET (Polyethylene terephthalate, commonly known as polyester resin) film layer, but not limited to. Of course, in some application examples, the substrate layer 1 includes not only the film layer 11 , as shown in FIG8 , but also a sealing layer 12 or other layers provided under the film layer 11 , which will not be described in detail here.

[0050] The above are just a few examples to facilitate understanding of the packaging layer structure and manufacturing process. It should be understood that the micro-protrusions 21 in this embodiment are not limited to being formed by the coating method shown in the above examples, but can also be formed by at least one of but not limited to etching process, physical sandblasting process, and exposure and development process, which will not be described one by one here.

[0051] In this embodiment, in order to improve the stability of the packaging layer structure and its reliability during use, the hardness of each micro-protrusion 21 can be set to be greater than 1H, and the adhesion force of each micro-protrusion 21 on the substrate layer 1 can be set to be greater than 2B; thereby preventing each micro-protrusion 21 from being easily broken by external force or falling off from the substrate layer 1 during use.

[0052] This embodiment also provides a display screen, which can be applied to but not limited to televisions, curtain walls, vehicle-mounted equipment, mobile devices, and wearable devices. It includes a light board and a packaging layer. The packaging layer is arranged on the light-emitting side of the light board. The packaging layer is a packaging layer as shown in any of the above examples.

[0053] An example display screen 100 is shown in FIG9 , which includes a light board 3 , wherein the light board 3 includes a conductive substrate 31 (such as various circuit boards, ceramic substrates, glass substrates, etc.), light-emitting elements 32 disposed on the conductive substrate 31, and an encapsulation layer disposed on the conductive substrate 31 to cover the light-emitting elements 32 . The encapsulation layer has the structure shown in any of the above examples, including a base material layer 1 and a microstructure layer 2 disposed on a side of the base material layer 1 facing away from the light board 3 , wherein the microstructure layer 2 is formed by a plurality of microprotrusions 21 . An example rendering of a portion of the display screen 100 is shown in FIG10 , and an actual microscope image of a portion of the microprotrusions 21 is shown in FIG11 .

[0054] In this embodiment, the researchers found that the micro-protrusions 21 in the microstructure layer 2 were replaced with protrusions with floc-like irregular patterns under a microscope as shown in FIG13 , wherein the longitudinal cross-sectional schematic diagram of the protrusions with floc-like irregular patterns shown in FIG13 is shown in FIG12 , which are in the shape of a prism, and the protrusions 4 in the shape of each prism are connected in sequence. After the red, green and blue lights are refracted by the prism-shaped protrusions 4, there are large differences in the light output angles. As a result, at a wide viewing angle, only blue-green synthetic light can be seen, and there is no or greatly reduced red light, which leads to the existence of a relatively obvious color cast problem.

[0055] For ease of understanding, the display screen 100 shown in FIG10 is used as comparative example 2, and the display screen in which the micro protrusions 21 in FIG10 are replaced with prism-shaped protrusions 4 is used as comparative example 1. The light panels in both comparative examples have a P1.25 pixel pitch, use flip-chip LED chips, and are produced in the same batch to ensure consistency and comparability between the two as much as possible. As shown in FIG14 , the two display screens 100 are placed vertically on the test platform under the same test environment. Both display screens display white at maximum brightness. A color temperature meter (also known as a colorimeter) is used to measure the color temperature data at intervals of 10° from a horizontal angle of 0° to 180° and record the data. The resulting record table is shown in Table 1 below:

[0056] Table 1

[0057] Angle Example 1 Color Temperature (K) Example 2 Color Temperature (K)0°13957.4511508.7610°9300819820°8673783630°8057756040°7591729750°7249711160°7078700970°7020699280°7057705090°71967148100°73247277110°74857431120°77547647130°81277959140°86188314150°91428675160°98528981170°101838985180°1053710521

[0058] Figure 15 shows a comparison of the color temperature curves obtained from the test data above. Combining Table 1 and Figure 15, we can see that the color temperature curve for the display in Example 1 from 0° to 180° is shown in Curve A in Figure 15 for Example 1. At wide viewing angles, the color temperature varies significantly compared to a 90° viewing angle, with a maximum difference of 3163K (170° minus 70°, with data at 0° and 180° excluded). However, a noticeable color cast still occurs. The color temperature curve for the display in Example 1 from 0° to 180° is shown in Curve B in Figure 15 for Example 2. At wide viewing angles, the color temperature varies slightly compared to a 90° viewing angle, with a maximum difference of 1993K (170° minus 70°, with data at 0° and 180° excluded). This difference is nearly halved compared to the maximum difference of 3163K in Example 1, resulting in no noticeable color cast. This effectively avoids or improves the color cast issue associated with wide viewing angles, improving display quality and user experience.

[0059] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A packaging layer, the packaging layer is used for a display screen, the display screen includes a light board, and the light board is provided with a plurality of light-emitting elements, characterized in that: The encapsulation layer is arranged on the light-emitting side of the light board and covers each of the light-emitting elements; The encapsulation layer includes a substrate layer and a microstructure layer; The substrate layer is light-transmissive and is disposed on the light board; The microstructure layer is arranged on the side of the substrate layer away from the light board; the microstructure layer is composed of a plurality of micro-protrusions, at least some of the adjacent micro-protrusions among the plurality of micro-protrusions have gaps, and a plurality of the micro-protrusions correspond to one light-emitting element, the surface of each micro-protrusion is a curved surface, and the size of each micro-protrusion is randomly distributed.

2. The encapsulation layer according to claim 1, wherein The maximum diameter of each micro protrusion is randomly distributed between 1 μm and 20 μm, and the maximum height of each micro protrusion is randomly distributed between 0.5 μm and 10 μm.

3. The encapsulation layer according to claim 1, wherein The base material layer and each of the micro protrusions are integrally formed.

4. The encapsulation layer according to claim 1, wherein The substrate layer includes a film material layer, and the microstructure layer is a coating layer provided on a side of the film material layer away from the light panel.

5. The encapsulation layer according to any one of claims 1 to 4, characterized in that: The hardness of each of the micro-protrusions is greater than 1H, and the adhesion of each of the micro-protrusions on the substrate layer is greater than 2B.

6. The encapsulation layer according to any one of claims 1 to 4, characterized in that: The reflectivity of the surface of each micro-protrusion is less than 10%.

7. The encapsulation layer according to any one of claims 1 to 4, characterized in that: Some of the micro-protrusions overlap with each other, or there are gaps between adjacent micro-protrusions.

8. The encapsulation layer according to any one of claims 1 to 4, characterized in that: The surface of the substrate layer located between adjacent micro protrusions is a plane.

9. The encapsulation layer according to any one of claims 1 to 4, characterized in that: The ratio of the sum of the orthographic projection areas of the micro protrusions within a unit area of ​​the substrate layer to the unit area is 30% to 95%.

10. A display screen, characterized in that: It comprises a lamp board and the packaging layer according to any one of claims 1 to 9, wherein the packaging layer is arranged on the light-emitting side of the lamp board and covers each light-emitting element on the lamp board.

Citation Information

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