Photoelectric device film and photoelectric cell having same

Abstract

This photoelectric device film comprises: a base layer; a first organic layer coupled to the upper surface of the base layer; a transparent electrode layer coupled to the upper surface of the first organic layer; and a photoelectric device coupled to the upper surface of the transparent electrode layer.

Description

Photoelectric element film and photoelectric cell having the same

[0001] The present invention relates to a photoelectric device. Specifically, the present invention relates to a photoelectric device film incorporating a photoelectric device and a photoelectric cell having the same.

[0002] A photovoltaic device, such as a solar cell, is a photoelectric conversion device that converts solar energy into electrical energy, and usually has a form in which a photovoltaic device is formed on a film-shaped substrate layer.

[0003] Figure 1 is a cross-sectional view of a photoelectric element film according to the prior art.

[0004] As shown in Fig. 1, a conventional photoelectric element film is composed of a substrate layer (10), a transparent electrode layer (20), a photoelectric element (30), etc.

[0005] The substrate layer (10) is composed of a flexible polymer film such as polyethylene terephthalate (PET) that is flexible and shape-deformable.

[0006] The transparent electrode layer (20) functions as the lower electrode of the photoelectric element (30) and is usually composed of a metal oxide such as ITO (Indium Tin Oxide), AgO, etc.

[0007] The photovoltaic element (30) is an element that converts solar energy into electrical energy, and in the case of an inverted structure organic solar cell, it includes an electron transport layer (31), a photoactive layer (32), a hole transport layer (33), and an upper electrode (34).

[0008] A conventional photoelectric element film having this structure forms a transparent electrode layer (20) on the upper surface of a substrate layer (10), and a photoelectric element (30) on the transparent electrode layer (20), as shown in FIG. 1.

[0009] However, the substrate layer (10) is a polymer material such as PET, and the transparent electrode layer (20) is a metal oxide such as AgO. When affected by external influences (moisture, oxygen, heat, etc.), a difference in strain (e.g., expansion) occurs between the substrate layer (10) and the transparent electrode layer (20). For example, when moisture or heat is applied from the outside to the photovoltaic film and the substrate layer (10) expands, if the expansion rate of the substrate layer (10) is greater than that of the transparent electrode layer (20), cracks may occur in the transparent electrode layer (20) due to the difference in expansion rates. In this case, the conductivity of the transparent electrode layer (20) may decrease, resulting in a deterioration in performance.

[0010] The purpose of the present invention is to prevent cracks from occurring in a transparent electrode layer due to a difference in expansion rate between a substrate layer and a transparent electrode layer in a photoelectric element film, thereby preventing a deterioration in the performance of the transparent electrode layer.

[0011] To achieve this purpose, the photoelectric element film of the present invention includes a substrate layer, a first organic layer bonded to the upper surface of the substrate layer, a transparent electrode layer bonded to the upper surface of the first organic layer, and a photoelectric element bonded to the upper surface of the transparent electrode layer.

[0012] The photovoltaic film of the present invention may further include a second organic layer bonded to the lower surface of the substrate layer and a lower barrier layer bonded to the lower surface of the second organic layer.

[0013] In the photoelectric element film of the present invention, the lower barrier layer may be composed of an inorganic layer.

[0014] In the photoelectric element film of the present invention, the lower barrier layer may include a first inorganic layer bonded to the lower surface of the second organic layer and a third organic layer bonded to the lower surface of the first inorganic layer.

[0015] In the photoelectric element film of the present invention, the lower barrier layer can be configured as a multilayer film structure in which an inorganic layer and an organic layer are sequentially laminated in a downward direction from the lower surface of the second organic layer.

[0016] In the photoelectric element film of the present invention, the first organic layer or the second organic layer can be configured to have a thickness of 0.2 to 10 μm.

[0017] The photoelectric cell according to the present invention may include the photoelectric element film described above, and a photoelectric element encapsulation film that embeds the photoelectric element of the photoelectric element film and is bonded to the upper surface of the photoelectric element film.

[0018] In the photoelectric cell of the present invention, the photoelectric element encapsulation film may include a conductive adhesive layer, a conductive film, a heat-compression film, an upper barrier layer, etc.

[0019] The conductive adhesive layer can be spaced apart and bonded to the upper surface of the transparent electrode layer while embedding the photoelectric element.

[0020] The conductive film can be bonded to the upper surface of the conductive adhesive layer while embedding a photoelectric element.

[0021] The thermocompression film can be bonded to the gap between the conductive adhesive layer and the laminate of the conductive film while thermocompression-embedding the photovoltaic element.

[0022] The upper barrier layer can be bonded to at least the upper surface of the thermocompression film.

[0023] In the photoelectric cell of the present invention, the conductive film can function as a bus bar.

[0024] In the photovoltaic cell of the present invention, the photovoltaic element may be an inverted structure organic solar cell including an electron transport layer bonded to an upper surface of a transparent electrode layer, a photoactive layer bonded to an upper surface of the electron transport layer, a hole transport layer bonded to an upper surface of the photoactive layer, and an upper electrode bonded to an upper surface of the hole transport layer.

[0025] In the photoelectric cell of the present invention, a plurality of photoelectric elements can be connected in series.

[0026] The photoelectric element film of the present invention minimizes (absorbs) the difference in expansion rates between the substrate layer and the transparent electrode layer by inserting a buffer layer (stress absorption layer) composed of an organic material between the substrate layer and the transparent electrode layer, thereby preventing (blocking) cracks in the transparent electrode layer that may occur due to the difference in expansion rates between the substrate layer and the transparent electrode layer.

[0027] The photoelectric element film of the present invention can minimize (absorb) the difference in expansion rate between the substrate layer and the lower barrier layer by inserting an organic buffer layer (stress absorbing layer) between the substrate layer and the lower barrier layer when additionally forming a lower barrier layer under the substrate layer, thereby preventing (blocking) cracks from occurring in the lower barrier layer and maintaining the durability of the lower barrier layer.

[0028] Figure 1 is a cross-sectional view of a photoelectric element film according to the prior art.

[0029] Figure 2 is a cross-sectional view of a first embodiment photoelectric element film according to the present invention.

[0030] Figure 3 is a cross-sectional view of a second embodiment photoelectric element film according to the present invention.

[0031] Figure 4 is a flowchart illustrating a method for manufacturing a photoelectric element film according to the first embodiment of the present invention.

[0032] Figure 5 is a flowchart illustrating a method for manufacturing a second embodiment photoelectric element film according to the present invention.

[0033] Figure 6 is a cross-sectional view of a photoelectric cell in which a photoelectric element sealing film is bonded to a photoelectric element film according to the first embodiment of the present invention.

[0034] Figure 7 is a cross-sectional view of a photoelectric cell in which a photoelectric element sealing film is bonded to a photoelectric element film according to the second embodiment of the present invention.

[0035] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0036] Figure 2 is a cross-sectional view of a first embodiment photoelectric element film according to the present invention.

[0037] As shown in FIG. 2, the first embodiment photoelectric element film (100) may include a substrate layer (10), a first organic layer (40), a transparent electrode layer (20), a photoelectric element (30), etc.

[0038] The substrate layer (10) supports the first organic layer (40), transparent electrode layer (20), etc., which are bonded to the upper portion, and may be composed of a flexible material that is flexible and can be deformed in shape. Examples of the flexible material include polymer films such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polypropylene (PP), polyimide (PI), polyethylene sulfonate (PES), polyoxymethylene (POM), polyether ether ketone (PEEK), polyether sulfone (PES), polyether imide (PEI), acrylonitrile styrene copolymer (AS resin), acrylonitrile butadiene styrene copolymer (ABS resin), triacetyl cellulose (TAC), and polyarylate (PAR). Among these, it may be preferable to use PET, which has high chemical stability, mechanical strength, and transparency, and is easy to deform into various shapes.

[0039]

[0040] The first organic layer (40) can function as a buffer layer (stress absorption layer) that is bonded to the upper surface of the substrate layer (10), i.e., between the substrate layer (10) and the transparent electrode layer (20), to minimize (absorb) the difference in expansion rates between the substrate layer (10) and the transparent electrode layer (20).

[0041] The first organic layer (40) may use a resin having a molecular weight (weight average molecular weight (Mw)) of 500 or more, preferably 1000 or more, and more preferably 1500 or more.

[0042] The first organic layer (40) may be composed of an organic compound polymerized (crosslinked, cured) with, for example, a monomer, a dimer, an oligomer, etc. The organic compound may include a thermoplastic resin, an organosilicon compound, etc. The thermoplastic resin may include a polyester, a (meth)acrylic resin, a methacrylic acid-maleic acid copolymer, a polystyrene, a transparent fluororesin, a polyimide, a fluorinated polyimide, a polyamide, a polyamideimide, a polyetherimide, a cellulose acylate, a polyurethane, a polyetheretherketone, a polycarbonate, an alicyclic polyolefin, a polyarylate, a polyethersulfone, a polysulfone, a fluorene ring-modified polycarbonate, alicyclic modified polycarbonate, a fluorene ring-modified polyester, an acrylic compound, etc. The organosilicon compound may include a polysiloxane, etc.

[0043] The first organic layer (40) may include a radically curable compound and / or a cationic curable compound having an ether group in terms of strength and glass transition point (Tg).

[0044] The first organic layer (40) may include a (meth)acrylic resin whose main component is a polymer such as a monomer or oligomer of (meth)acrylate, from the viewpoint of lowering the refractive index. Lowering the refractive index can increase transparency and improve light transmittance.

[0045] The first organic layer (40) can be formed to a thickness of 0.2 to 10 μm, preferably 0.2 to 6 μm, and more preferably 1 to 3 μm. If the thickness is less than 0.2 μm, the mechanical strength is weak and may tear, and if it exceeds 10 μm, it is difficult to function as a buffer layer (stress absorbing layer) due to excessive expansion of the first organic layer (40).

[0046]

[0047] The transparent electrode layer (20) functions as a lower electrode of the photoelectric element (30) and can be formed on the upper surface of the first organic layer (40).

[0048] The transparent electrode layer (20) can be composed of a light-transmitting material, such as a metal oxide such as ITO (Indium Tin Oxide), FTO (Fluorinated Tin Oxide), IZO (Indium Zinc Oxide), AZO (Aluminum doped Zinc Oxide), ATO (Antimony Tin Oxide), or AgO, so that light passing through the substrate layer (10) can sufficiently reach the photoactive layer (32). The transparent electrode layer (20) can also be composed of a transparent conductor such as a silver (Ag) nanowire or a silver (Ag) mesh.

[0049] In the case of an inverted structure organic solar cell, the transparent electrode layer (20) can function as a cathode (-) that receives electrons generated in the photoactive layer (32) and transmits them to an external circuit.

[0050]

[0051] The photoelectric element (30) is an element that converts solar energy into electrical energy and can be formed on the upper surface of the transparent electrode layer (20).

[0052] In the case of an inverted structure organic solar cell, the photoelectric element (30) may include an electron transport layer (31) bonded to a transparent electrode layer (20), a photoactive layer (32) bonded to the electron transport layer (31), a hole transport layer (33) bonded to the photoactive layer (32), and an upper electrode (34) bonded to the hole transport layer (33).

[0053] The electron transport layer (31) can be composed of an inorganic oxide having a large work function. Specifically, zinc oxide (ZnO), titanium dioxide (TiO2), tin dioxide (SnO2), cesium carbonate (Cs2CO3), etc. can be used.

[0054] In the case of a low-molecular-weight photoactive layer (32), a donor and an acceptor can be stacked and used, and in the case of a high-molecular-weight photoactive layer (32), a donor and an acceptor can be dissolved in a solvent such as chlorobenzene or dichlorobenzene (1,2-di(ethenyl)benzene), mixed, and then formed into a single thin film.

[0055] The photoactive layer (32) can be composed of a high-efficiency ternary blend organic material, for example, PM6:Y6:PCBM60. Here, PM6 can function as a donor, and Y6 and PCBM60 can function as acceptors. The weight ratio of donor:acceptor can be mixed, for example, at 1:05 to 1:4.

[0056] The hole transport layer (33) can be composed of an organic material, an inorganic material, or an organic / inorganic composite material. Specifically, PEDOT:PSS (Poly(3,4-ethylenedioxythiophene:poly(styrenesulfonate)), MoO3, WO3, V2O5, NiO, etc. can be used.

[0057]

[0058] *The upper electrode (34) functions as an anode (+), collecting holes and transmitting them to an external circuit, and can be composed of a conductive metal such as copper (Cu), silver (Ag), gold (Au), tungsten (W), nickel (Ni), or titanium (Ti).

[0059]

[0060] In Fig. 2, a plurality of photoelectric elements (30) are connected to a transparent electrode layer (20) at the bottom to form a serial connection, thereby forming one sub-photoelectric cell.

[0061]

[0062] Figure 3 is a cross-sectional view of a second embodiment photoelectric element film according to the present invention.

[0063] As illustrated in FIG. 3, the second embodiment photoelectric element film (200) can further form a second organic layer (50) and a lower barrier layer (60) on the lower surface of the first embodiment photoelectric element film (100) described above.

[0064] The second organic layer (50) is bonded to the lower surface of the substrate layer (10) and can function as a buffer layer (stress absorbing layer) that minimizes (absorbs) the difference in expansion rate between the substrate layer (10) and the lower barrier layer (60) by having the same function as the first organic layer (40) described above.

[0065] The second organic layer (50) can be formed with the same material and thickness as the first organic layer (40), and a detailed description thereof is replaced with the related description of the first organic layer (40) above.

[0066]

[0067] The lower barrier layer (60) is bonded to the lower surface of the second organic layer (50) to protect the photoelectric element (30) from the external environment (impact, moisture, oxygen, etc.), and can be composed of an inorganic layer or an inorganic / organic mixed layer (multilayer film).

[0068] When the lower barrier layer (60) is composed of an inorganic layer, the inorganic layer can be made of any material that has excellent barrier performance and transparency, without limitation. For example, inorganic compounds such as metal oxides such as aluminum oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide, and indium tin oxide (ITO); metal nitrides such as aluminum nitride; metal carbides such as aluminum carbide; silicon oxides such as silicon oxide, silicon oxynitride, silicon oxycarbide, and silicon oxynitride carbide; silicon nitrides such as silicon nitride and silicon oxynitride carbide; silicon carbides such as silicon carbide; hydrides thereof; mixtures of two or more thereof; and hydrogen-containing substances thereof can be used. Among these materials, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and mixtures of two or more thereof are preferable because they have high transparency and excellent barrier performance.

[0069] The inorganic layer may have a thickness of 2 to 100 nm, preferably 2 to 50 nm, and more preferably 10 to 30 nm. If the thickness of the inorganic layer is less than 2 nm, it may be difficult to exhibit barrier performance, and if it exceeds 100 nm, flexibility or transparency may be reduced.

[0070] When the lower barrier layer (60) is composed of an inorganic / organic mixed layer (multilayer film), a multilayer film structure can be formed by sequentially stacking inorganic layers and organic layers going downward from the second organic layer (50). Here, the inorganic layer can use the silicon oxide described above. The organic layer can use EVA (ethylene-vinyl acetate copolymer), TPU (Thermoplastic Poly Urethane), PVB (Polyvinyl butyral), PU (Polyurethane), etc. EVA is a material jointly developed by NASA and DuPont as a material for solar cells used in satellites, and is currently used as a standard for encapsulant for solar cells.

[0071] The lower barrier layer (60) can be made of any material other than the materials exemplified above without any particular limitation, as long as it is a material that can protect the photoelectric element (30) from the external environment (impact, moisture, oxygen, etc.).

[0072]

[0073] Since the remaining configuration in the photoelectric element film (200) of the second embodiment is the same as the corresponding configuration in the photoelectric element film (100) of the first embodiment, the detailed description of the remaining configuration is replaced with the related description of the photoelectric element film (100) of the first embodiment.

[0074]

[0075] Figure 4 is a flowchart illustrating a method for manufacturing a photoelectric element film according to the first embodiment of the present invention.

[0076] As illustrated in Fig. 4, the method for manufacturing the first embodiment photoelectric element film (100) prepares a flexible substrate in the first step (S310). The flexible substrate may be made of a flexible material such as PET described above.

[0077] In the second step (S320), a first organic layer (40) can be formed on the upper surface of the flexible substrate. The first organic layer (40) can use an organic compound, such as a polymerized (crosslinked, cured) monomer, dimer, or oligomer, as described above. The first organic layer (40) can be formed by a coating method. For example, the organic layer composition can be a composition (resin composition) in which a resin (organic compound) is dissolved in a solvent. This resin composition can be applied to the upper surface of the flexible substrate and then dried. In the coating method, a process of polymerizing (crosslinking) the resin (organic compound) in the resin composition can be performed by irradiating it with ultraviolet rays, if necessary.

[0078] In the third step (S330), a transparent electrode layer (20) can be formed on the upper surface of the first organic layer (40). The transparent electrode layer (20) can be formed using a transparent conductor such as ITO or AgO by a method such as sputtering.

[0079] In the fourth step (S340), a photoelectric element (30) can be formed on the upper surface of the transparent electrode layer (20). The photoelectric element (30) can be composed of an electron transport layer (31) formed on the transparent electrode layer (20), a photoactive layer (32) formed on the electron transport layer (31), a hole transport layer (33) formed on the photoactive layer (32), and an upper electrode (34) formed on the hole transport layer (33).

[0080] The electron transport layer (31) can be formed by coating ZnO or the like using spin coating or the like.

[0081] The photoactive layer (32) can be formed by a method such as vacuum deposition or solution process. The solution process can use various methods such as spin coating, slot die coating, ink jet printing, and screen printing. For example, a photoactive layer material mixed with a donor polymer PTB7 and an acceptor polymer PC71BM in a weight ratio of 1:15 can be dissolved in a chlorobenzene solvent at a concentration of 15 wt%, and then the photoactive layer solution can be filtered through a 0.45 μm syringe filter and then spin coated on the electron transport layer (31). Thereafter, a 130 nm thick photoactive layer (32) can be formed by heat treatment at 120°C for 10 minutes.

[0082] The hole transport layer (33) can be formed by a method such as vacuum deposition of MoO3.

[0083] The upper electrode (34) can be formed by forming a conductive metal by a method such as vacuum deposition, electron beam deposition, sputtering, ion plating, or chemical deposition, or by applying a paste for forming an electrode including a conductive metal and then performing a heat treatment.

[0084]

[0085] Figure 5 is a flowchart illustrating a method for manufacturing a second embodiment photoelectric element film according to the present invention.

[0086] As illustrated in FIG. 5, the method for manufacturing the photoelectric element film (200) of the second embodiment is the same as steps 1 to 3 and 6 (S410 to S430, S460) of steps 1 to 4 (S310 to S340) of the manufacturing method of the first embodiment, so the detailed description of steps 1 to 3 and 6 (S410 to S430, S460) is replaced with the related description of the manufacturing method of the first embodiment.

[0087] The fourth step (S440) can form a second organic layer (50) on the lower surface of the flexible substrate, similarly to the second step (S320) of the manufacturing method of the first embodiment. The second organic layer (50) can use an organic compound, such as a polymerized (crosslinked, cured) monomer, dimer, or oligomer, as described above. The composition of the second organic layer (50) can use, for example, a composition (resin composition) in which a resin (organic compound) is dissolved in a solvent, and the composition can be formed by applying the resin composition to the lower surface of the flexible substrate and then drying it. In the formation of the second organic layer (50) by the application method, a process of polymerizing (crosslinking) the resin (organic compound) in the composition can be performed by irradiating it with ultraviolet rays, if necessary.

[0088] In the fifth step (S450), a lower barrier layer (60) can be formed on the open surface, i.e., the lower surface, of the second organic layer (50). The lower barrier layer (60) can be formed as an inorganic layer or an organic / inorganic mixed layer (multilayer film). The inorganic layer can be formed using a method such as plasma CVD (Chemical Vapor Deposition), atomic layer deposition, sputtering, or vacuum deposition. The organic / inorganic mixed layer (multilayer film) can be formed using the inorganic layer forming method described above and the organic layer forming method described in the second step (S320) of the manufacturing method of the first embodiment.

[0089]

[0090] Figure 6 is a cross-sectional view of a photoelectric cell in which a photoelectric element sealing film is bonded to a photoelectric element film according to the first embodiment of the present invention.

[0091] As shown in Fig. 6, the photoelectric element film (100) of the first embodiment can form a sub-photoelectric cell in the form of sealing the photoelectric element (30) by bonding a photoelectric element sealing film (70) to the upper portion.

[0092] As shown in Fig. 6, the photoelectric element encapsulation film (70) may include a conductive adhesive layer (71), a conductive film (72), a thermal compression film (73), an upper barrier layer (74), etc.

[0093] The conductive adhesive layer (71) simultaneously implements adhesive and conductive functions, and can be combined with the upper conductive film (72) and the lower transparent electrode layer (20) to conduct electricity between them.

[0094] The conductive adhesive layer (71) can be composed of a naturally curable conductive paste composition comprising conductive particles (filler), a binder containing a catechol-based compound and a laccase enzyme, and a solvent that disperses the conductive particles and is miscible with the binder. The conductive particles can be micro- or nano-sized conductive metal powders such as silver (Ag), copper (Cu), and nickel (Ni).

[0095] The challenge adhesive layer (12) can have a thickness of 5 to 100 μm and an adhesive strength of 0.1 N / 25 mm or more.

[0096]

[0097] The conductive film (72) is a conductor through which electricity flows and can function as a bus bar that connects a plurality of photoelectric elements (30) that are connected in series in parallel.

[0098] The conductive film (72) can be composed of a conductive metal, such as silver (Ag), a silver alloy, copper (Cu), a copper alloy, etc., and can also be composed of a conductive metal such as gold (Au), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), tungsten (W), titanium (Ti), tantalum (Ta), iron (Fe), cobalt (Co), nickel (Ni), zinc (Zn), tellurium (Te), vanadium (V), niobium (Nb), molybdenum (Mo), alloys of these metals (e.g., silver-palladium-copper (APC)), nanowires of metals or alloys, etc.

[0099]

[0100] The thermal compression film (73) is used to protect the photoelectric element (30) and can be inserted (bonded) into the gap between the laminate of the conductive adhesive layer (71) and the conductive film (72).

[0101] The heat-compression film (73) can use a hot melt adhesive. A hot melt adhesive can exhibit adhesive properties while fluidizing when a solid at room temperature is heated.

[0102] Hot melt adhesives may be based on an amorphous resin, such as an acrylic resin. The acrylic resin may be based on a resin formed by polymerizing a single acrylate monomer (acrylic homopolymer (homoacrylic polymer)).

[0103] The heat-compression film (72) can be fluidized and exhibit adhesive properties at 30 to 200°C, preferably at 40 to 180°C, and more preferably at 50 to 150°C.

[0104]

[0105] The upper barrier layer (74) protects the photoelectric element (30) from external moisture or oxygen (air), covers at least the thermal compression film (73), and can also be formed on the upper surface of the conductive film (72) if necessary.

[0106] The upper barrier layer (74) can use a hot melt type EVA film. EVA (ethylene-vinyl acetate copolymer) is a material jointly developed by NASA and DuPont as a material for solar cells used in satellites, and is currently used as a standard for solar cell encapsulation materials.

[0107] The upper barrier layer (74) can be made of any material capable of blocking moisture and oxygen, including, but not limited to, TPU (Thermoplastic Poly Urethane), PVB (Polyvinyl butyral), Silicon / PU (Polyurethane), etc., in addition to EVA.

[0108]

[0109] As shown in Fig. 6, when the photoelectric element sealing film (70) is bonded to the photoelectric element film (100) of the first embodiment by thermal compression, a plurality of photoelectric elements (30) constituting the sub-photoelectric cell can be compressed and embedded (inserted) inside the thermal compression film (73).

[0110]

[0111] Figure 7 is a cross-sectional view of a photoelectric cell in which a photoelectric element sealing film is bonded to a photoelectric element film according to the second embodiment of the present invention.

[0112] As shown in Fig. 7, the second embodiment photoelectric element film (200) can form a sub-photoelectric cell in the form of sealing the photoelectric element (30) by bonding a photoelectric element sealing film (70) to the upper portion.

[0113] As illustrated in FIG. 7, the photoelectric element encapsulation film (70) includes a conductive adhesive layer (71), a conductive film (72), a thermal compression film (73), an upper barrier layer (74), etc., and since these are the same as the photoelectric element encapsulation film (70) described in FIG. 6, a detailed description thereof will be replaced with the related description in FIG. 6.

[0114]

[0115] The present invention has been described in detail with several embodiments, which are intended to illustrate the invention. Those skilled in the art will readily appreciate the potential for modifications and variations to these embodiments. However, the scope of the present invention is defined by the claims below, and therefore, such modifications and variations are construed as falling within the scope of the present invention.

[0116] [Explanation of symbols]

[0117] 100,200: Photoelectric element film

[0118] 10: Substrate layer

[0119] 20: Transparent electrode layer

[0120] 30: Photoelectric element

[0121] 31: Electron transport layer

[0122] 32: Photoactive layer

[0123] 33: Hole transport layer

[0124] 34: Upper electrode

[0125] 40: First organic layer

[0126] 50: Second organic layer

[0127] 60: Lower barrier layer

[0128] 70: Photoelectric element encapsulation film

[0129] 71: Challenge adhesive layer

[0130] 72: Challenge Film

[0131] 73: Compressed film

[0132] 74: Upper barrier layer

Claims

1. Base layer; A first organic layer bonded to the upper surface of the above substrate layer; a transparent electrode layer bonded to the upper surface of the first organic layer; and A photoelectric element film comprising a photoelectric element bonded to the upper surface of the transparent electrode layer.

2. In paragraph 1, A second organic layer bonded to the lower surface of the above substrate layer; A photovoltaic device film comprising a lower barrier layer bonded to the lower surface of the second organic layer.

3. In the second paragraph, the lower barrier layer A photovoltaic film composed of an inorganic layer.

4. In the second paragraph, the lower barrier layer A first inorganic layer bonded to the lower surface of the second organic layer; A photovoltaic film comprising a third organic layer bonded to the lower surface of the first inorganic layer.

5. In the fourth paragraph, the lower barrier layer A photoelectric element film that forms a multilayer structure in which an inorganic layer and an organic layer are sequentially laminated in a downward direction on the lower surface of the second organic layer.

6. In any one of paragraphs 1 to 5, the first organic layer or the second organic layer A photoelectric element film having a thickness of 0.2 to 10 μm.

7. A photoelectric element film according to any one of claims 1 to 5; A photoelectric cell comprising a photoelectric element encapsulating film bonded to the upper surface of the photoelectric element film while embedding the photoelectric element of the photoelectric element film.

8. In the 7th paragraph, the photoelectric element sealing film A conductive adhesive layer that is spaced apart and bonded to the upper surface of the transparent electrode layer while embedding the photoelectric element; A conductive film bonded to the upper surface of the conductive adhesive layer while embedding the photoelectric element; A thermocompression film that is bonded to the space between the conductive adhesive layer and the laminate of the conductive film while embedding the photoelectric element by thermocompression; and A photovoltaic cell comprising at least an upper barrier layer bonded to the upper surface of the thermocompression film.

9. In the 8th paragraph, the conductive film Photoelectric cell, which is a bus-bar.

10. In the 9th paragraph, the photoelectric element An electron transport layer bonded to the upper surface of the transparent electrode layer; A photoactive layer bonded to the upper surface of the electron transport layer; a hole transport layer bonded to the upper surface of the photoactive layer; and A photovoltaic cell, which is an inverted structure organic solar cell including an upper electrode bonded to the upper surface of the hole transport layer.

11. In the 10th paragraph, the photoelectric element Photoelectric cells, connected in series in large numbers.

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