System and method for reconditioning resin in flow

Abstract

A system for reconditioning resin in flow includes a series of eductors to manage resins, chemicals, and waste during the resin transport process. The system includes one or more modules for injecting, flushing, offsetting, rinsing, and scrubbing the resin. The system includes pipes and valves for controlling resin slurry, chemical, and deionized water flow. At least one of the modules may include a flat pipe module.

Description

SYSTEM AND METHOD FOR RECONDITIONING RESIN IN FLOWRELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 567,900, filed March 20, 2024, titled “SYSTEM AND METHOD FOR CLEANING AND REGENERATING RESIN IN FLOW,” the entirety of the disclosure of which is hereby incorporated by this reference.TECHNICAL FIELD

[0002] This document relates generally to processes and systems for reconditioning resin (e.g., cleaning, restoring kinetics of, regenerating, and rinsing ion exchange resin), and more specifically to processes and systems that recondition the resin during the resin transport process.BACKGROUND

[0003] Traditional resin reconditioning processes incorporate bulk tanks that are used to manage ion exchange resins during all resin regeneration activities. Cleaning, regeneration, and rinse activities are conducted within large resin vessels of one kind or another. Unavoidable laminar flow anomalies and turbulence naturally occurs inside resin vessels, caused by disruptions in hydraulic flow around internal chemical and flush headers and rinse nozzles, including low-flow hide-out areas in the bottom comers of the vessels. Impossible to eliminate, these flow anomalies result in inadequate contact between chemical and resins, rinse inefficiencies, excessive chemical and deionized water usage, extended process times, excessive waste generation, and ultimately producing less effective and incomplete resin regenerations.SUMMARY

[0004] In some embodiments, a system for reconditioning resin in flow includes a crud flush module configured to receive a resin slurry. The crud flush module is configured to remove resin fines and suspended metal oxides from the resin slurry. The system also includes a scrubbing module configured to receive the resin slurry from the crud flush module. The scrubbing module is configured to introduce a scrubbing module contact-liquid into the resin slurry. The scrubbing module contact-liquid includes a sulfite solution (SO3). In someembodiments, the system includes an anion regeneration module configured to receive the resin slurry from the scrubbing module, the anion regeneration module configured to introduce an anion regeneration module contact-liquid into the resin slurry, wherein the anion regeneration module contact-liquid includes sodium hydroxide (NaOH). In some embodiments, the system includes a separation module configured to receive the resin slurry at an inlet to a separation vessel. The separation vessel having a separation liquid contained therein. The resin slurry includes an anion resin slurry and a cation resin slurry, and wherein the separation liquid is configured to separate the anion resin slurry from the cation resin slurry. The system may include an anion caustic flush module configured to receive the anion resin slurry from the separation module, the anion caustic flush module configured to introduce an anion caustic flush module contact-liquid into the anion resin slurry, wherein the anion caustic flush module contact-liquid includes sodium hydroxide (NaOH). In some embodiments, the system includes an ammonia rinse module configured to receive the anion resin slurry from the anion caustic flush module, the ammonia rinse module configured to introduce an ammonia rinse module contact-liquid into the anion resin slurry, wherein the ammonia rinse module contact-liquid includes ammonium hydroxide (NH4OH). The system also includes a cation caustic flush module configured to receive the cation resin slurry from the separation module, the cation caustic flush module configured to introduce a cation caustic flush module contact-liquid into the cation resin slurry, wherein the cation caustic flush module contact-liquid includes deionized water. In some embodiments, a cation regeneration module configured to receive the cation resin slurry from the cation caustic flush module, the cation regeneration module configured to introduce a cation regeneration module contact-liquid into the cation resin slurry, wherein the cation regeneration module contact-liquid includes sulfuric acid (H2SO4). The system may include an anion resin rinse module configured to receive the anion resin slurry from the ammonia rinse module, the anion resin rinse module configured to introduce an anion resin rinse module contact-liquid into the anion resin slurry, wherein the anion resin rinse module contact-liquid includes deionized water. In some embodiments, the system includes a cation resin rinse module configured to receive the cation resin slurry from the cation regeneration module, the cation resin rinse module configured to introduce a cation resin rinse module contact-liquid into the cation resin slurry, wherein the cation resin rinse module contact-liquid includes deionized water. A mixing module may be configured to receive the cation resin slurry from the cation resin rinse module and the anion resin slurry from the anion rinse module, the mixing module configured to combine the cation resin slurry and the anion resin slurry into a combined slurry. In some embodiments, the system includes a final rinsemodule configured to receive the combined slurry from the mixing module, the final rinse module configured to introduce a final rinse module contact-liquid into the resin slurry, wherein the final rinse module contact-liquid includes deionized water.

[0005] In some aspects, the techniques described herein relate to a system, wherein the scrubbing module contact-liquid includes about 7% sulfite solution (SO3). In some aspects, the techniques described herein relate to a system, wherein at least one of the contact-liquids is introduced to the resin slurry at approximately a right angle to a flow of the resin slurry. In some aspects, the techniques described herein relate to a system, wherein the at least one of the contact-liquids is introduced to the resin slurry at multiple points in the module. In some aspects, the techniques described herein relate to a system, wherein the anion regeneration module includes: contact loops, the resin slurry configured to pass through each of the contact loops sequentially; and an anion regeneration module contact-liquid path configured to carry the anion regeneration module contact-liquid through each of the contact loops in a reverse sequential order than an order that the resin slurry passes through each of the contact loops. In some aspects, the techniques described herein relate to a system, wherein at least one of the modules includes a filter. In some aspects, the filter is a wedge wire filter. In some embodiments, the filter is configured to filter resin fines and suspended metal oxides from the resin slurry. The filter is configured to permit passage of particles smaller than .010 inches in diameter.

[0006] In some embodiments, the separation vessel has a top and a bottom, wherein the anion resin slurry is drawn out the top of the separation vessel by an eductor suction source coupled to the top of the separation vessel, and wherein the cation resin slurry is drawn out the bottom of the separation vessel by an eductor suction source coupled to the bottom of the separation vessel. In some aspects, the techniques described herein relate to a system, wherein at least one of the modules is a flat pipe module.

[0007] In some embodiments, a system for reconditioning resin in flow includes a crud flush module configured to receive a resin slurry. The crud flush module may be configured to remove resin fines and suspended metal oxides from the resin slurry. The system may also include a scrubbing module configured to receive the resin slurry from the crud flush module, the scrubbing module having a scrubber section and a flush section, the scrubber section configured to introduce a motive liquid to the resin slurry to move the resin slurry through the scrubber section to the flush section, the flush section configured to introduce a contact-liquid to the resin slurry.

[0008] The system may include a final rinse module configured to receive the resin slurry, the final rinse module configured to introduce a final rinse module contact-liquid into the resin slurry. In some aspects, the techniques described herein relate to a system, wherein the final rinse module contact-liquid is deionized water. In some aspects, the techniques described herein relate to a system, further including a separation module configured to receive the resin slurry at an inlet to a separation vessel, the separation vessel having a separation liquid contained therein, wherein the resin slurry includes an anion resin slurry and a cation resin slurry, and wherein the separation liquid is configured to separate the anion resin slurry from the cation resin slurry.

[0009] In some aspects, the techniques described herein relate to a system for reconditioning resin in flow during a resin transport process, the system including: a plurality of modules configured to act on a resin slurry, each module having a plurality of contact loops, each contact loop configured to receive the resin slurry and introduce a contact-liquid to the resin slurry; and a plurality of eductors configured to move the resin slurry between the plurality of modules, each eductor configured to introduce a motive liquid to the resin slurry to move the resin slurry; wherein the contact-liquid is one of sulfite solution (SO3), ammonium hydroxide (NH4OH), sodium hydroxide (NaOH), and sulfuric acid (H2SO4). In some aspects, the techniques described herein relate to a system, wherein at least one of the plurality of modules includes a flat pipe module.

[0010] In some aspects, the techniques described herein relate to a system, wherein each module includes a filter configured to remove a waste product of the module. In some aspects, the techniques described herein relate to a system, wherein the system is configured to operate at a resin slurry pressure of approximately 5 psi or less. In some aspects, the techniques described herein relate to a system, further including a crud flush module configured to receive a resin slurry, the crud flush module configured to remove resin fines and suspended metal oxides from the resin slurry.

[0011] The foregoing and other aspects, features, and advantages will be apparent from the DESCRIPTION and DRAWINGS, and from the CLAIMS.BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Implementations will hereinafter be described in conjunction with the appended and / or included DRAWINGS.

[0013] FIG. 1 is a flow diagram that shows steps for cleaning and regenerating a resin according to some embodiments.

[0014] FIG. 2 shows a schematic view of a crud removal module according to some embodiments.

[0015] FIG. 3 shows a schematic view of a scrubbing module according to some embodiments.

[0016] FIG. 4 shows a schematic view of an anion regeneration module according to some embodiments.

[0017] FIG. 5 shows a schematic view of a resin separator according to some embodiments.

[0018] FIG. 6 shows a schematic view of an anion caustic flush module according to some embodiments.

[0019] FIG. 7 shows a schematic view of an ammonia rinse module according to some embodiments.

[0020] FIG. 8 shows a schematic view of a caustic flush module according to some embodiments.

[0021] FIG. 9 shows a schematic view of a cation regeneration module according to some embodiments.

[0022] FIG. 10 shows a schematic view of an anion resin rinse-to-specification module according to some embodiments.

[0023] FIG. 11 shows a schematic view of a cation resin rinse-to-specification module according to some embodiments.

[0024] FIG. 12 shows a schematic view of a resin rinse-to-specification module according to some embodiments.

[0025] FIG. 13 shows a schematic view of a clean-only (or resin restoration only) reconditioning system according to some embodiments.

[0026] FIG. 14 shows a schematic view of a cleaning and regenerating system for a resin according to some embodiments.

[0027] FIG. 15 shows a schematic view of a like-flow loop according to some embodiments.

[0028] FIG. 16A shows a schematic view of a like-flow loop according to some embodiments.

[0029] FIG. 16B shows a schematic view of a like-flow loop according to some embodiments.

[0030] FIG. 16C shows a schematic view of a like-flow loop according to some embodiments.

[0031] FIG. 17A shows a schematic view of an opposed-flow loop according to some embodiments.

[0032] FIG. 17B shows a schematic view of an opposed-flow loop according to some embodiments.

[0033] FIG. 17C shows a schematic view of an opposed-flow loop according to some embodiments.

[0034] FIG. 18 shows a schematic view of a flush-rinse system according to some embodiments.

[0035] FIG. 19 shows a schematic view of a flush -rinse system according to some embodiments.

[0036] FIG. 20A shows a schematic view of a flush-rinse system according to some embodiments.

[0037] FIG. 20B shows a schematic view of a flush-rinse system according to some embodiments.

[0038] FIG. 20C shows a schematic view of a flush-rinse system according to some embodiments.

[0039] FIG. 20D shows a schematic view of a flush-rinse system according to some embodiments.

[0040] FIG. 20E shows a schematic view of a flush-rinse system according to some embodiments.

[0041] FIG. 21 shows a schematic view of an inject flush offset rinse scrub system according to some embodiments.

[0042] FIG. 22 shows a schematic view of an inject flush offset rinse scrub system according to some embodiments.

[0043] FIG. 23 shows a schematic view of an inject flush offset rinse scrub system according to some embodiments.

[0044] FIG. 24 shows a schematic view of a flat pipe injection flush offset rinse scrub system according to some embodiments.

[0045] FIG. 25 shows a schematic view of a flat pipe injection flush offset rinse scrub system according to some embodiments.

[0046] FIG. 26 shows a cross section of the flat pipe injection flush offset rinse scrub system shown in FIG. 25 taken at the line 26 - 26’ .

[0047] FIG. 27A shows a schematic view of a screen according to some embodiments.

[0048] FIG. 27B shows a schematic view of screens according to some embodiments.

[0049] FIG. 28 A shows a schematic view of a flat pipe injection flush offset rinse scrub system according to some embodiments.

[0050] FIG. 28B shows a schematic view of a flat pipe injection flush offset rinse scrub system according to some embodiments.

[0051] FIG. 28C shows a cross section of the flat pipe injection flush offset rinse scrub system shown in FIG. 28B taken at the line 28C - 28C’.

[0052] FIG. 29 shows a schematic view of a cleaning and regenerating system for a resin according to some embodiments.

[0053] FIG. 30 shows a schematic view of a cleaning and regenerating system for a resin according to some embodiments.DETAILED DESCRIPTION

[0054] The following detailed description provides numerous specific details. Those skilled in the relevant arts understand that embodiments of the disclosure may be practiced without these specific details. The disclosure may also be practiced in different and alternative configurations.

[0055] Unless specifically noted, it is intended that the words and phrases in the specification and the claims be given their plain, ordinary, and accustomed meaning to those of ordinary skill in the applicable arts. The singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to “a step” includes a reference to one or more of such steps. The words “exemplary,” “example,” “embodiment,” or various forms thereof are used herein to mean serving as an example, instance, or illustration. Any aspect or feature described herein as “exemplary” or as an “example” is not necessarily to be construed as preferred or advantageous over other aspects or designs. The examples are provided solely for purposes of clarity and understanding and do not limit or restrict the disclosure. It is to be appreciated that a myriad of additional or alternate examples of varying scope could have been presented, but have been omitted for purposes of brevity.

[0056] Throughout the description and claims of this specification, the words “comprise” and “contain” and variations of the words, for example, “comprising” and “comprises”, mean “including but not limited to” and are not intended to (and do not) exclude other components.

[0057] When a range of values is expressed, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when values are expressed asapproximations, by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. All ranges are inclusive and combinable.

[0058] The present disclosure may be understood more readily by reference to the following detailed description taken in connection with the accompanying figures and examples, which form a part of this disclosure. It is to be understood that this disclosure is not limited to the specific materials, devices, methods, applications, conditions, or parameters described and / or shown herein, and that the terminology used herein is for the purpose of describing particular embodiments by way of example only and is not intended to be limiting of the claimed inventions. The term “plurality”, as used herein, means more than one.

[0059] The present disclosure is directed to systems and methods of removing suspended crud and resin fines from resin slurries, restoring ion exchange resin kinetics, regenerating ion exchange resins, and performing final rinses to specification on the resins during the actual resin transport process from the point of origin to its final destination. This provides improvements over the bulk tanks discussed in the background section. Providing regeneration while the resin is in transport provides a more cost-efficient system. In some embodiments, regenerating resin while it is in transport can improve contact between chemical and resins, lead to greater rinse efficiencies, reduce chemical and deionized water usage, shorten process times, reduce waste generation, and provide a more effective and complete resin regeneration.

[0060] The recondition systems disclosed herein exploit features of the resin transport to recondition the resin. The resin flows through flow loops that combine resin surface attrition (scrubbing) with the properties of chemically aggressive liquids used to create a slurry in which resin bead surfaces are cleaned by the low-impact effects of resin slurry flow inside piping loops. This physical “resin-tumbling” effect enhances the efficacy of the cleaning or regeneration chemical being used as the slurry medium and motive liquid. When removed, the absence of surface contaminants improves ion exchange kinetics, regenerations, and resin rinse effectiveness.

[0061] The present disclosure uses a motive liquid to move the resin slurry through the skid, which contains the equipment and flow path. In addition to a motive liquid, the present disclosure makes use of contact-liquids. Contact-liquids are liquids that are added to the resin slurry to act on the resin slurry. For example, the deionized water (DI water) may be used as a contact-liquid to rinse the resin in the resin slurry. As will be explained further, the contactliquid may be introduced to the resin slurry at an angle with respect to the flow of the resin slurry to employ shear fluid dynamics to increase the resin cleaning.

[0062] The present invention will be described in detail with reference to the figures.

[0063] An example process for reconditioning according to some embodiments is shown in FIG. 1. A process for reconditioning a resin includes removing crud 102, restoring kinetics 104, regenerating anion resins 106, separating the resin 108, rinsing the anion resins with NH4 110, regenerating cation resins 112, rinsing and mixing the anion and cation resins 114, and performing a final rinse 116. Each step of the process will be discussed in detail with reference to the figures.

[0064] FIG. 2 shows a schematic view of crud flush module 200. In some embodiments, resin slurry enters crud flush module 200 at resin inlet 210. Crud flush module 200 is configured to remove iron oxides suspended in the resin, resin fines (small pieces of resin), and other debris from resin slurry. Resin passes through loops 202A - D to resin outlet 220. Loops may be structures that have a loop shape or may be structures that are mostly straight. As used here, loop may mean a segment of the system that cleans or otherwise interacts with the resin slurry or resin slurry components to clean or rinse the resin slurry or resin slurry components. For improved understanding, the schematic views shown in FIGS. 2, 4, and 8 - 11 are presented in a schematic side view in FIG. 20C. FIG. 2’s loop 202B corresponds to FIG. 20C’s loop 2002B and FIG. 2’s loop 202C corresponds to FIG. 20C’s loop 2002A. Each of the schematics in FIGS. 2, 4, 8 - 11, and 20C represents a system with four loops. In FIG. 2, for example, the four loops are annotated as loops 202A - D. In FIG. 20C, loops 2002A and 2002B are labeled, but each obscures a third and fourth loop. That is, there are two loop segments not shown: one behind loop segment 2002 A and one behind loop segment 2002B. Motive fluids flow along loops to move the resin and contact-liquids flow along flow paths that interact with loops (for example, in a transverse direction to the flow of the resin). Although the above description of how the loops are shown in the figures focuses on FIGS. 2, 4, 8 - 11, and 20C, the schematics shown in FIGS. 3, 6 - 7, 12, 20A - 20B, 20D - 20E should be similarly understood as representing structures with loops or piping.

[0065] In some embodiments, each loop 202 is fluidly coupled to a contact-liquid source. Contact-liquid may be DI water or another liquid. Contact-liquid may be supplied to each loop 202 along the path shown in segments 204A - C or to a subset of the loops. In some embodiments, contact-liquid enters at loop 202D along flow path 204A. It then interacts with resin at loop 202D. Loop 202D is the last loop 202 of crud flush module 200. The contactliquid may flow in a direction that is perpendicular or transverse to the flow of the resin (this is referred to as counter current flow). Because the resin is cleaned as it passes through each loop 202, the resin in loop 202D is the cleanest resin in crud flush module 200. To ensure it remains clean, the resin in loop 202D interacts with the contact-liquid first. While this removescontamination and cleans the resin, it makes the contact-liquid dirtier. For reasons of efficiency explained below, the contact-liquid is reused in each subsequent loop 202 (202C, then 202B, and finally 202A). For example, the contact-liquid may exit loop 202D, then flow through loop 202C (in a perpendicular direction compared to the flow of the resin in loop 202C), and exit loop 202C to follow flow path 204B. The contact-liquid may then flow through loop 202B and 202A, exiting to follow flow path 204C to waste pump 206. Thus, the contact-liquid exiting crud flush module 200 along flow path 204C to waste pump 206 is “dirtier” than the contactliquid at 204B, which is “dirtier” than the contact-liquid at 204A.

[0066] The resin is drawn from crud flush module 200 by eductors that utilize ammonia sulfate (NH4) as the motive liquid to SO3 scrubbing module 300. FIG. 3 shows a schematic view of SO3 scrubbing module 300. SO3 scrubbing module 300 includes scrubber section 310 and flush section 320. Resin slurry enters at resin inlet 302 with ammonia sulfate as the motive liquid. In some embodiments, the motive liquid comprises about 7% of the resin slurry that enters at resin inlet 302. Resin slurry passes through segments 304. Segments 304 may be tortuous-path scrubbers, explained further below. The ammonium sulfite removes iron oxides and organic materials from the resin surfaces. After flowing through the tortuous-path scrubber, the ammonium sulfite is flushed from the fully exhausted resins in loops of flush section 320. The resin may be flushed with DI water that passes through the resin travelling in a countercurrent direction to the resin, in preparation for caustic injection. The DI water, acting as the contact-liquid moves along flow path 322A - C and is pumped out by pump 324. The resin is drawn from scrubbing module 300 at resin outlet 306 by an eductor using DI water as motive liquid and the resin slurry flows into the caustic regeneration module.

[0067] In some embodiments, if resin kinetics restoration (clean-only) using ammonium sulfite is desired, the resin does not receive a rinse with DI water during its path through the scrubbing module 300. Instead, the resin slurry, still immersed in ammonium sulfite solution, is drawn from scrubbing module 300 at resin outlet 306 by an eductor using ammonium sulfite as motive liquid and routed back to the plant resin-holding / regeneration vessel to soak in the sulfite solution. After a predetermined soak period, the resin is rinsed, separated, and regenerated using plant equipment.

[0068] If the restoration (clean-only) process is used, an offset volume of sulfite solution is diverted back to the ammonium sulfite pump from scrubbing module 300 to control resin slurry liquid volume. In some embodiments, two eductors back-to-back, will double the amount of motive liquid in the resin slurry unless one of the motive liquid volumes is “offset” and reused or routed to waste.

[0069] FIG. 4 shows regeneration module 400. Regeneration module 400 is configured to regenerate the anion resin and cause cation resin exhaustion. Resin enters regeneration module 400 at resin inlet 410 and flows through regeneration module 400 to resin outlet 420. A caustic injection module feeds a contact-liquid into regeneration module 400 along flow path 404 A - C. Flow path 404A - C introduces the contact-liquid to the resin slurry at loops 402A - D. In some embodiments, the contact-liquid may be a 16% sodium hydroxide solution. The contactliquid is fed in counter current flow to regenerate the anion resin component. The mixed resins consist of anion and cation resins; anion resin is regenerated with hydroxyl (OH-) molecules from the caustic rinse while changing the fully exhausted cation resin state from ammonium loaded, to sodium loaded with the sodium (Na++) component from NaOH.

[0070] After resin slurry exits regeneration module 400 at resin outlet 420, resin slurry is drawn from regeneration module 400 to separating system 500 (see FIG. 5). Separating system 500 is configured to fully separate the anion and cation resins relative to each’s respective density relative to the contact-liquid, here, 16% NaOH solution. Separating system 500 has a separation vessel 502 configured to hold the separation liquid and receive the flow resin in the 16% NaOH solution. Resin may enter at resin inlet 506. FIG. 5 shows flow 504 of the resin into separation vessel 502. Because the anion resins of flow 504 are less dense than the separation liquid in separation vessel 502, anion resins will flow to the top of separation vessel 502 along anion resin path 508. Because the cation resins of flow 504 are denser than the separation liquid, cation resins will flow to the bottom of separation vessel 502 along cation resin path 510. In some embodiments, anion resin 544 is drawn out of the top of the separation vessel 500 using DI water as motive liquid 540 through eductor 530. Cation resin 546 which has settled on the bottom of the separation vessel 500 is drawn out of the bottom of the vessel 502 by eductor 532 using DI water as motive liquid 542.

[0071] In some embodiments, eductor 530 and eductor 532 may be self-priming eductors. Separating system 500 may have a narrow separation vessel 502 with tapered interior channels 520, 522 to direct resins to eductors 530, 532. In some embodiments, the vessel pressure is maintained at <5 psi to provide adequate flow volume for eductors 530, 532. Sodium hydroxide density may be maintained at 15% - 16% concentration to ensure resin separation. In some embodiments, the eductors 530, 532 have balanced flow control to maintain vessel pressure. A supplemental caustic addition may help guide floating / sinking resins to eductors 530, 532 and maintain pressure. Diffuser / nozzles on resin inlet 506 to spread resin flow into thin arrays may minimize cross-contamination. In some embodiments, an optional “tipped-pipe” approach to channeling resins is possible, rather than tapered flow channels.

[0072] FIG. 6 shows an anion resin caustic flush module 600 according to some embodiments. Anion resin 544 is drawn out of separating system 500 using DI water as motive liquid 540 and is channeled into anion resin caustic flush module 600 at resin inlet 610. The flush phase of anion resin caustic flush module 600 incorporates a DI water flush of anion resin 544 to remove all caustic liquid prior to anion resin 544 being drawn out of anion resin caustic flush module 600 at resin outlet 620. FIG. 6 shows two contact-liquid flow paths. First contactliquid flow path 604 (e.g., 604A - C) uses the caustic solution from flow 804 (e.g., 804A - C) of cation resin caustic flush module 800 (see FIG. 8), described below. First contact-liquid passes through loops 602D, 602C, 602B, and 602A. After it passes through loops 602, first contact-liquid passes along route 604C to waste pump 606. The second contact-liquid may be DI water. Second contact-liquid flow path 608 (e.g., 608 A - C) passes through loops 602H, 602G, 602F, and 602E. After it passes through loops 602, second contact-liquid passes along route 608C to waste pump 606. The flush and offset liquid waste from the anion resin slurry is directed to waste.

[0073] FIG. 7 shows ammonia rinse module 700 according to some embodiments. Anion resin 544 moves from anion resin caustic flush module 600 using DI as the motive liquid. Anion resin 544 enters ammonia rinse module 700 at resin inlet 710 and exits at resin outlet 720. FIG. 7 shows two contact-liquid flow paths. First contact-liquid flow path 704 (e.g. 704A - C) has a 0.5% NFUOH solution. Ammonium hydroxide (NFUOH) removes sodium residues from anion resins and converts any cation resin from sodium form to ammonium form. First contact-liquid passes through loops 702D, 702C, 702B, and 702A. After it passes through loops 702, first contact-liquid passes along route 704C to waste pump 706. The second contact-liquid may be received from flow 1004 (e.g., 1004 A - C) of Anion Resin Rinse-to-spec assembly 1000 (see FIG. 10). Second contact-liquid flow path 708 (e.g., 708A - C) passes through loops 702H, 702G, 702F, and 702E. After it passes through loops 702, second contact-liquid passes along route 708C to waste pump 706. The flush and offset liquid waste from the anion resin slurry is directed to waste.

[0074] FIG. 8 shows cation resin caustic flush module 800 according to some embodiments. Cation slurry 546 is drawn out of separating system 500 by eductor 532 using DI water as motive liquid 542. In some embodiments, cation resin caustic flush module 800 receives flush DI water from flow 1104 (e.g., 1104A - C) of cation resin rinse-to-spec module 1100 (see FIG. 11) to use as contact-liquid. Contact-liquid passes along flow path 804 (e.g., 804A - C) and passes through loops 802 (e.g., 802D, 802C, 802B, 802A). Contact-liquid exits at 804C and flows to anion resin caustic flush module 600 (e.g., to flow path 604).

[0075] FIG. 9 shows cation resin regeneration module 900. Cation resin 546 flows through resin inlet 910, loops 902 (e.g., 902A - D), to resin outlet 920. In cation resin regeneration module 900, cation resin 546 encounters contact-liquid flowing along flow path 904 (e.g., 904A - C). In some embodiments, contact-liquid may be an 8% sulfuric acid regenerant. Waste is pumped out by waste pump 906.

[0076] FIG. 10 shows anion resin rinse-to-spec module 1000. Anion resin flows through resin inlet 1010, loops 1002 (e.g., 1002A - D), to resin outlet 1020. In some embodiments, anion resin rinse-to-spec module 1000 receives flush DI water as a contact-liquid along flow path 1004 (e.g., 1004A - C) from flow 1204 (e.g., 1204A - C) of final rinse-to-specification module 1200 (see FIG. 12). The DI water flows through loops 1002 (e.g., 1002D, 1002C, 1002B, 1002A). In anion resin rinse-to-spec module 1000, the sodium-free, ammonia-rinsed anion resin undergoes a rinse-to-spec (<1.0 p / S). In some embodiments, the contact-liquid exits at 1004C and is sent to ammonia rinse module 700 (e.g., to flow path 708).

[0077] FIG. 11 shows cation resin rinse-to-spec module 1100. Cation resin flows through resin inlet 1110, loops 1102 (e.g., 1102A - D), to resin outlet 1120. In some embodiments, cation resin rinse-to-spec module 1100 receives flush DI water along flow path 1104 (e.g., 1104A - C) from flow 1208 (e.g., 1208A - C) of final rinse-to-specification module 1200 (see FIG. 12). The DI water flows through loops 1102 (e.g., 1102D, 1102C, 1102B, 1102A). In cation resin rinse-to-spec module 1100, the regenerated cation resin is rinsed-to-spec (<1.0 p / S). In some embodiments, the contact-liquid exits at 1104C and is sent to cation resin caustic flush module 800 (e.g., to flow path 804).

[0078] Anion resins and cation resins that have been rinsed to specification are drawn out of the respective anion resin rinse-to-spec module 1000 and cation resin rinse-to-spec module 1100 by an eductor using DI water as motive liquid.

[0079] FIG. 12 shows final rinse-to-specification module 1200. The mixed resins enter final rinse-to-specification module 1200 at resin inlet 1210 and undergo a final rinse to specification (<0.08 p / S) as it passes through loops 1202A - H) to resin outlet 1220. The contact-liquid, here DI water, enters final rinse-to-specification module 1200 at two places forming two flow paths. The first flow path 1204 (e.g., 1204A - C) performs an initial rinse passing through loops 1202D, 1202C, 1202B, and 1202A and the waste DI water is pumped along flow path 1204C to anion resin rinse-to-spec module 1000 (e.g., to flow path 1004). The second flow path 1208 (e.g., 1208A - C) performs the final rinse passing through loops 1202H, 1202G, 1202F, and 1202E and the waste DI water is pumped along flow path 1208C to cation resin rinse-to-spec module 1100 (e.g., to flow path 1104).

[0080] FIG.13 shows resin regeneration system 1300. Resin regeneration system 1300 has risen inlet 1310. Resin regeneration system 1300 may be used when only resin regeneration is sought. In this embodiment, dirty resin slurry is thoroughly flushed to remove all suspended crud at module crud flush module 200. After the resin slurry exits crud flush module 200, the resin slurry enters scrubbing module 300. After the resin slurry exits scrubbing module 300, resin slurry exits at resin outlet 1320. Resin regeneration system 1300 includes low total dissolved solids (TDs) waste outlet 1316, DI water inlets 1312, and chemical plant outlet 1314. In the embodiment shown in FIG. 13, resin regeneration system 1300 includes chemical mix station 1317. Chemical mix station 1317 receives a solution 1318. In some embodiments, solution 1318 may be ammonium sulfite. Chemical mix station 1317 supplies solution 1318 to resin regeneration system 1300 through supply line 1338. Resin regeneration system 1300 also includes pumps 1322, 1326, and 1328. Each pump is configured to pump a liquid throughout resin regeneration system 1300.

[0081] FIG.14 shows an embodiment of resin regeneration system 1400. Resin regeneration system 1400 includes the modules described above. In sum, resin slurry enters at resin inlet 1410 and passes to crud flush module 200. From crud flush module 200, resin slurry passes to scrubbing module 300. The resin slurry continues to resin outlet 1420 if only restoration is sought, or continues to regeneration module 400 if further processing is necessary. Resin slurry continues to separating system 500 where it is divided into an anion resin slurry and a cation resin slurry. The anion resin slurry proceeds to anion resin caustic flush module 600 and ammonia rinse module 700. The cation resin slurry proceeds to cation resin caustic flush module 800 and cation resin regeneration module 900. Anion resin slurry is rinsed at anion resin rinse-to-spec module 1000 and cation resin slurry is rinsed at cation resin rinse-to-spec module 1100. The combined cation and anion resin slurries are recombined, and a final rinse is performed at final rinse-to-specification module 1200 and then continues to resin outlet 1420. Chemical plant outlet 1414 allows for chemicals to be transported to the chemical plant, DI water inlets 1412 supply DI water to resin regeneration system 1400, low TDs waste outlet 1416 removes low TDs waste, and high TDs outlet 1419 removes high TDs waste. Chemical mix assembly 1417 has ammonium sulfate inlet 1450, sodium hydroxide inlet 1452, ammonium hydroxide inlet 1454, and sulfite solution inlet 1456. Each is supplied to chemical mix assembly 1417. Pumps 1422, 1426, 1429, 1438, 1462, 1464, and 1466 pump fluids throughout resin regeneration system 1400.

[0082] In some embodiments, the flow loops used in the various modules discussed above deliver extremely efficient and thorough flushes of resin slurries. In some embodiments, theflow loops are simple to manufacture, simple to fabricate, and simple to maintain. The flowloop design supports compact and modular designs for mobile or permanent equipment. The flow loop design reduces piping complexity, promoting smaller equipment footprints for reconditioning resins. Utilizing flow loop technology enhances resin kinetics restoration processes during resin transfer processes, including crud removal, metal oxides removal, organics removal, anion regenerations, cation regenerations, sodium removal, and DI water rinses.

[0083] In some embodiments, the flow loops augment chemical efficacy by use of physical attrition on resin surfaces. In some embodiments, the flow loops are configured to exploit multiple tortuous path configurations, 45°, 90° and 180° elbows, etc. In some embodiments, the flow loops are used for the resin reconditioning process discussed herein. In some embodiments, heat-traced piping heats resin slurries by avoiding direct contact with slurry. In some embodiments, the flow loops use 7-10 gpm flush / rinse flow rates to replace slurry liquid. In some embodiments, multiple sources of motive force can be used to move resin slurry (e.g., eductor, pump, etc.).

[0084] During the course of transferring ion exchange resin in a liquid medium as a slurry, it is necessary to ensure proper mixing and adequate intimate contact time are provided between resin surfaces and chemical. To minimize potential resin damage via aggressive tortuous-path piping, simple 90° - 360° piping loops utilize gravitational and centrifugal forces to provide resin surface scrubbing effects between resin slurry and piping interiors, in direct contact with cleaning, regenerant, flush and rinse chemicals during transit. In some embodiments, the flow loops provide significant surface-area contact with resins in a small footprint. In some embodiments, the flow loops provide extremely low-impact scrubbing action on resin surfaces. In some embodiments, the flow loops are stackable (horizontally or vertically) for minimizing equipment footprint. The flow loops may comprise low-impact, tortuous-path piping configured as 360° piping loops, and threaded or flanged connection couplers attached to inlet and outlet flow-loop piping. In some embodiments, the flow loops may be provided in different configurations: Like-Flow; Opposed-Flow; Single Loop; Multiple Loops (circular arrangements). In some embodiments, the flow loops have piping that may be any diameter based on cleaning requirements. In some embodiments, piping loops may be any diameter or path based on cleaning requirements. In some embodiments, the loops may be constructed of poly materials or stainless steel. In some embodiments, the flow loops assist the chemical in removing metals and organics from resin surfaces. In some embodiments, the flow loops regenerate and rinse ion exchange resins.

[0085] Flow loops provide a pathway for scrubbing action, chemical mixing, and contact time of chemicals and DI water on resins while in transit through Inject Flush Offset Rinse Scrub modules (IFORS modules). The flow loops may contain a series of bends and connections between flow devices.

[0086] FIG. 15 shows an embodiment of a flow loop assembly 1600 according to some embodiments. As shown in FIG. 15, flow loop assembly 1600 has a single flow loop 1602. Single flow loop 1602 receives a resin slurry from resin inlet 1610. Resin inlet 1610 has a flush module 1604. Flush module 1604 is configured to receive flush water at 1608. In some embodiments, the flush water at 1608 is fed flush air at 1606, which may add bubbles to flush water. In some embodiments, flush module 1604 is fluidly coupled to pump 1614, which pumps waste 1616 from flush module 1604. After resin slurry passes through single flow loop 1602, it passes through fluid ejector 1618. Fluid ejector 1618 is fluidly connected to pump 1614, which pumps fluid 1624 to another portion of the resin skid. Resin slurry exits at resin outlet 1620 after passing through eductor 1630. Eductor 1630 is configured to receive fluid through 1628 that may act as a motive fluid. The motive fluid passing through 1628 may be partially composed of fluid pumped along 1624.

[0087] FIGS. 16A - C show configurations of single flow loop 1602. In the embodiment shown in FIG. 16C, single flow loop 1602 has multiple loops.

[0088] FIG. 17A shows an embodiment of flow loop assembly 1700. As shown in FIG. 17A, flow loop assembly 1700 has a single flow loop 1702 that receives resin slurry through resin slurry inlet 710. As with the embodiment shown in FIG. 15, the embodiment shown in FIG. 17A includes flush module 1704, fluid ejector 1718, and eductor 1730. The embodiment shown in FIG. 17A also includes pumps 1714. FIG. 17A also shows flush water inlet 1708 and flush air inlet 1706 along with waste line 1716 and output fluid path 1724. Eductor 1730 is configured to receive fluid through 1728 that may act as a motive fluid. The motive fluid passing through 1728 may be partially composed of fluid pumped along 1724.

[0089] FIG. 17B - C show flow loop 1702 according to some embodiments.

[0090] FIG. 18 shows multi -loop assembly 1800. Multi -loop assembly 1800 includes loop segments 1802 that are separated by flush modules 1805. Multi -loop assembly 1800 is supplied with resin slurry at resin inlet 1810. A flush module 1804 is supplied by pump 1803 with contact-liquid 1806. In some embodiments, contact-liquid 1806 is DI water. Valves 1822, throughout multi -loop assembly 1800, control the flow of contact-liquid 1806 through multiloop assembly 1800. A splitter 1807 divides contact-liquid 1806 to spread it among flush modules 1805. A flush module 1818 is located near resin outlet 1820. Contact-liquid 1806 mayflow through flush modules 1804, 1805, and 1818 to clean resin slurry flowing through multiloop assembly 1800. Used contact-liquid 1808 may be pumped by pump 1814 out along waste line 1816. An eductor 1830 is configured to receive contact-liquid 1806 and use contact-liquid 1806 as a motive liquid to drive resin slurry out resin outlet 1820.FIG. 19 shows multi-loop assembly 1900. Multi-loop assembly 1900 includes loop segments 1902 that are separated by flush modules 1905. Multi-loop assembly 1900 is supplied with resin slurry at resin inlet 1910. Unlike multi-loop assembly 1800 shown in FIG.18, multi-loop assembly 1900 shown in FIG. 19 includes a contact-liquid 1906 that moves through flush modules 1905 in series. As shown in FIG. 19, contact-liquid 1906 is pumped by pump 1903 to flush module 1918. Contact-liquid 1906 exits flush module 1918 and then passes in series through flush modules 1905 before passing to flush module 1904 and being pumped by pump 1914 to waste line 1916. In this embodiment, contact-liquid 1906 becomes progressively “dirtier” as it moves along its path. The “dirtiest” section of contact-liquid 1906 is interacting with the resin at flush module 1904 just after resin inlet 1910. At this point, the resin slurry will also be at its dirtiest, so interacting with the dirtiest contact-liquid 1906 will further foul contact-liquid 1906 but not foul resin slurry. Similarly, at flush module 1918, resin slurry is at its cleanest, having passed through four previous flush modules. And at flush module 1918, resin slurry encounters the “cleanest” contact-liquid 1906. Multi-loop assembly 1900 includes a plurality of valves 1922 to control the flow of contact-liquid 1906 through multi-loop assembly 1900. Multi-loop assembly 1900 includes eductor 1930 configured to receive contact-liquid 1906. Eductor 1906 uses contact-liquid 1906 as a motive liquid to move resin slurry through to resin outlet 1920.

[0091] FIG. 20A shows a single scrub loop 2000 according to some embodiments. FIG. 20B shows a Bi-IFORS loop according to some embodiments. The embodiment shown in FIG. 20B may be used to remove crud from resin. Scrub loop 2000 has loop 2002 A and 2002B. Each loop 2002A and 2002B receives a contact-liquid 2004. Contact-liquid 2004 passes first through loop 2002B and then through loop 2002A, before being pumped to waste by pump 2006.

[0092] FIG. 20C shows an embodiment of a scrub loop. The scrub loop has resin inlet 2010 and resin outlet 2020. As discussed above, FIG. 20C shows an alternate view of the arrangement shown in FIG. 2. Thus, after resin slurry enters at resin inlet 2010, it passes through a loop that is not visible in this view because it is disposed behind loop 2002B, and then through loop 2002B, which receives contact-liquid 2004 along contact-liquid flow path 2004B (traveling in a transverse direction compared to the flow of resin. Used contact-liquid2004 is pumped along contact-liquid flow path 2004C by pump 2006. Resin slurry then flows to loop 2002A and then through another loop disposed behind loop 2002A before going through resin outlet 2020. Loop 2002A receives contact-liquid 2004 from contact-liquid flow path 2004A, which may first pass through the loop disposed behind loop 2002A. Figures 20D and 20E show two different side views of an embodiment of a scrub loop having loops 2002 (e.g., 2002 A - F) and contact-liquid interacting with the resin through one or more flow paths 2004 transverse to the flow of the resin.

[0093] Injection-Flush-Offset-Rinse-Scrub (IFORS) flow-loop assemblies are the heart of the reconditioning process that effectively scrubs and processes fouled / impaired and exhausted resin in a liquid slurry during transport around system piping.

[0094] There are three phases of water / air displacement within the IFORS module: 1) Expansion region - increased diameter of wedge-wire resin containment flow path at the inlet of the solids-ejector increases expansion of the resin and the interstitial space between resin beads, promoting improved flush properties to remove suspended crud. 2) Displacement region - suspended crud entrained within the expanded resin slurry is captured and swept away from the resin slurry with displacement water / air, through wedge-wire screens, and into the suction of the waste pump for delivery to waste. 3) Compaction / suction region - the expanded resin slurry volume is reduced again to its previous inside pipe diameter flow dimensions to continue its exit from the solids-ejector device. Additional transport water is introduced to maintain sustained flow of the resin slurry as it is pulled from the module by an eductor or other form of suction.

[0095] Waste turbidity sample capability allows sampling of waste flush water for turbidity levels. Bulk-headers are affixed between the exterior of the wedge-wire resin containment and interior of certain IFORS module casings to channel flush water and air cross-sectionally through the wedge-wire resin containment to displace unwanted suspended crud, fines, and chemicals from the resin slurry. Forced crud displacement via transverse, cross-sectional water and air flow through moving resins to waste. Induced crud displacement via waste pump suction used in conjunction with forced displacement. Simultaneous use of pressure and suction may not be required, depending upon crud levels, flow and pressure conditions. Suction provided on the IFORS module resin outlet by an eductor or other source of suction ensures sustainable resin slurry flow / transfer conditions, independent of flow and pressure conditions established within the interior of the IFORS module

[0096] Overall length of the IFORS module can vary depending upon existing physical parameters: standard flow velocity of the resin slurry, pressure and flow characteristics ofsupplied flush water and / air, waste discharge pump (suction source) pressure and flow characteristics, solids eject device discharge resin slurry suction (resin transport suction source) pressure and flow characteristics, temperature / density of flush water / air supplied, and total piping distance of resin slurry transfer path. Each resin charge contains varying levels of crud and resin fines based on previous run cycles. Minimum requirements for thorough crud removal are uniquely inherent to each resin charge.

[0097] In some embodiments, the IFORS module is configured to displace 100% of slurry liquid content during resin transit. In some embodiments, an expanded flush chamber reduces resin velocity to aid in liquid displacement (variable diameter). In some embodiments, the IFORS module comprises a replaceable wedge-wire discharge screen (gap widths correlate to resin bead diameters). Different modules may have different characteristics. For example, some IFORS modules may be targeted for flushing while another may be targeted for offsetting. In some embodiments, a flush module and an offset module are identical except that an offsetmodule has no flush connections.

[0098] In some embodiments, bubbles (flush air) may improve flush efficiencies (increased surface tension = better flush). In some embodiments, a suction pump assists liquid / crud displacement (pressure DI water flow augmented with pump suction). In some embodiments, flow of flush-media is transverse to resin flow. In some embodiments, crud waste can be captured for volumetric determination. In some embodiments, a sight glass is included that provides direct visual observation of crud and fines flow. In some embodiments, the module evacuates all suspended crud and debris. In some embodiments, the IFORS module provides liquid balance between in-line eductors. In some embodiments, the IFORS module provides total evacuation of residual chemicals

[0099] In some embodiments, the IFORS module has a configuration that supports final resin rinses to end-point specification (can be elbow, wedge-wire pipe or wafers). In some embodiments, configurations can vary based on scrubbing, flushing, liquid offset and resin rinse-to-spec demands. In some embodiments, the IFORS module provides unlimited flow configurations to achieve crud flush and final rinse end-points. In some embodiments, countercurrent flushes and rinses achieve maximum efficiency use of DI water. In some embodiments, counter-current flows (flushes / rinses) start at the last IFORS module and flow backwards to 1st IFORS module. In some embodiments, stringent flow control monitoring manages waste volumes for maximum volume reduction. In some embodiments, small diameter piping is used to transport resin slurries for maximum control of slurry and liquid management.

[0100] In some embodiments, the IFORS Assembly provides for injecting various solutions to clean and regenerate resins, flushing metal oxides, resin fines and chemicals from resin slurry, offsetting excess fluid between eductors to eliminate slurry thinning, rinsing resin slurry to a required purity specification (pS), and scrubbing by incorporating physical scrubbing / agitation of resins to assist chemical efficacy.

[0101] IFORS modules eliminate, capture, or reuse excess motive liquid volumes necessary for maintaining proper slurry liquid volumes. To create resin flow, eductors use motive liquids to convey resin slurry around a skid containing the components of the resin regeneration process. Each eductor contributes an adjustable volume of motive liquid for creating the proper resin slurry using a predetermined volume of liquid to enable the transfer process. The volume of liquid of a resin slurry will increase from each eductor contribution of high-energy liquid. If not managed properly, resin slurry will increasingly gain liquid, thinning the slurry to an unbalanced liquid / resin ratio. This offset is accomplished via IFORS modules for maintaining the proper liquid-to-resin ratio in the slurry. IFORS modules remove or reroute slurry liquids to waste or for use as motive liquids at later stages in the resin flow path.

[0102] IFORS modules are used to pre-treat resin slurries containing unacceptable levels of suspended metal oxides and resin fines, by purging undesirable suspended solids from the slurry prior to applying chemicals. As a result, chemical concentrations remain unaffected, allowing maximum chemical concentration availability for chemical reactions on resin bead surfaces. Each skid normally contains at least one flush module used as a resin slurry pretreatment. However, multiple IFORS liquid offset modules may be used between process modules to enhance resin-fines removal efficiency.

[0103] IFORS modules make it possible to flush or rinse suspended metal oxides, crud, resin fines, cleaning solutions, and regenerant solutions from resin slurries while being transported through skid piping. Additionally, the IFORS module is used to offset liquid volumes between eductors to control slurry thinning, as part of the flow-loops and scrubber assemblies.

[0104] FIG. 21 shows IFORS system 2100. IFORS system 2100 has resin inlet 2110 flowing into module 2102. IFORS system 2100 has one or more wedge-wire wafers 2150. For example, wedge-wire wafers 2150 may be disposed at a flush water entrance to and flush water exit from the module 2102. In some embodiments, wedge-wire wafers 2150 may be replaceable. IFORS system 2100 uses a gas flush 2106 source and a liquid flush 2108 source. IFROS system 2100 includes suction source 2162. Suction source 2162 may be a pump or an eductor. Suction source 2162 is configured to remove waste from module 2102 and transfer itto crud and fines filter 2140. In some embodiments, IFORS system 2100 includes sight glass 2160. Sight glass 2160 enables an operator to observe the flow of the waste being removed from the system. IFORS system 2100 includes eductor 2130. Eductor 2130 receives motive liquid 2105 to move resin slurry along to outlet 2120. IFORS system 2100 includes a plurality of valves 2124 used to control the flow of gas flush 2106 and liquid flush 2108. Additionally, a series of monitors 2122 permit the operator to monitor the volume, pressure, velocity, or other indicators of the flow. In some embodiments, IFORS system 2100 includes ports for waste turbidity measurements.

[0105] FIG. 22 shows an embodiment of IFORS system 2200. IFORS system 2200 includes module 2202. Module 2202 is configured to receive resin from resin inlet 2110. Module 2202 is connected to liquid source 2208 and air source 2206. In some embodiments, such as the embodiment shown in FIG. 22, IFORS system 2200 has three sections for treating resin slurry. In first section 2202A, the resin slurry may receive air from air source 2206 and a liquid from liquid source 2208. In second section 2202B, resin slurry may be cleaned by a fresh supply liquid from liquid source 2208. In third section 2202C, resin slurry may be cleaned by yet another fresh supply of liquid from liquid source 2208. Resin slurry exits at resin slurry outlet 2220. In some embodiments, module 2202 contains one or more wedge-wire screens 2250. Wedge-wire screen 2250 may be disposed throughout module 2202 (e.g., in first section 2202A, second section 2202B, and third section 2202C. In some embodiments, IFORS system 2200 includes one or more sight port 2260. Sight ports 2260 allows an operator to view the flow of resin or waste through IFORS system 2200.

[0106] IFORS system 2200 includes pump 2262, which is configured to pump waste away from IFORS system 2200. Like IFORS system 2100 shown in FIG. 21, IFORS system 2200 includes a plurality of valves 2224 and monitors 2222.

[0107] FIG. 23 shows IFORS module 2300 according to some embodiments. IFORS module 2300 receives resin slurry at resin inlet 2310. Water flush 2308A joins resin slurry and acts as a motive liquid around elbow 2312. Resin slurry flows around elbow 2312, but resin fines and other debris will be captured because they can pass through wedge-wire wafer 2350. Resin fines and other debris are pumped out by pump 2306 to waste. In some embodiments, the resin slurry exits at resin outlet 2320 and is moved by motive liquid 2308B. Valves 2324 control the movement of motive liquid 2308. In some embodiments, IFORS module 2300 includes sight port 2360.

[0108] In some embodiments, IFORS modules have flat pipes (see FIGS. 24 and 26) instead of having a round pipe as shown in FIGS. 21 and 22. For example, in FIG. 24 IFORSsystem 2500 has flat pipes 2502. Flat pipes 2502 have a rectangular cross-section. As shown in FIG. 24, IFORS system 2500 includes three flat pipes 2502. IFORS system 2500 has resin inlet 2510 and resin outlet 2520. IFORS system 2500 may have an inlet diameter 2514 and an outlet diameter 2518. In some embodiments, inlet diameter 2514 and outlet diameter 2518 are the same. An inlet 2512 may be configured to transition resin slurry from flow in a round pipe to flow in a square or rectangular pipe. In some embodiments, the round pipe and the flat pipe may have the same cross-sectional area or substantially the same cross-sectional area (e.g., less than or equal to a square inch difference). Similarly, outlet 2516 transitions resin slurry from a square or rectangular pipe to a round pipe. Flat pipes 2502 have an inlet side and an outlet side for the resin. A contact-liquid 2504 is added to flat pipes 2502. Contact-liquid 2504 may be DI water, SO3, or regenerants. As shown in the embodiment of FIG. 24, contact-liquid 2504 is piped into the bottom side of the right most flat pipe 2502. Contact-liquid 2504 interact with the resin as the resin slurry is piped through flat pipe 2502. Contact-liquid 2504 is piped up and moved by motive liquid 2505 into the top portion of the next flat pipe 2502. Contact-liquid 2504 interacts with the resin in the second flat pipe 2502 and exits through the bottom of the second flat pipe 2502. This repeats. FIG. 24 shows three flat pipes 2502 in line, but other numbers are contemplated. Eductors 2530 draw contact-liquid 2504 through IFORS module system.

[0109] The flat pipe modules assembly shown in FIG. 24 is assembled so that the entering resin contacts the most used (or “dirtiest”) contact-liquid. In contrast, the exiting resin contacts the least used (or “cleanest”) portion of the contact-liquid. This layout enables the contactliquid to be reused in multiple flat pipe modules while still producing clean resin since only the cleanest contact-liquid will contact the resin as the resin exits each stage. The flat pipe modules are advantageous because they normalize the resin flow across the entire skid. The flat pipe modules maximize the interface between the resin and the contact-liquid. This also allows the resin and the liquid flow to be controlled with a single adjustment. Moreover, in some embodiments, this permits the operator to clean the resin in a single pass through the contactliquid.

[0110] The contact-liquid in the flat pipe modules employs 90° shear dynamics that allow for maximum contact between the resin and the contact-liquid. In the embodiment shown in FIG. 24, a triple-rinse counter-current contact-liquid stream is employed. This means that the contact-liquid travels through the system in the opposite direction of the resin flow. This induces blended forces and improves the flow, all while permitting fine adjustments to eitherthe resin flow rate or the contact-liquid flow rate. In some embodiments, this may permit operation without reference to complicated contact time calculations.

[0111] The flat pipe modules may reduce or eliminate the need for the traditional resin / liquid contact-times and the traditional resin backwash flow requirements may be eliminated as well. Because of the efficiencies of the high contact between the resin and the contact-liquid, chemical dosages can be reduced. DI water usage and waste stream volumes are also reduced. The resin mixture ratio can be maintained via separator flow control. Finally, the entire system can operate at low pressures, for example, below 5 psi.

[0112] FIG. 25 shows a top view of the flat pipe modules shown in FIG. 24. FIG. 25 shows resin inlet 2610. Resin slurry flows through resin inlet 2610 and enters inlet 2612 before passing through flat pipes 2602. Resin slurry flows through outlet 2616 and through resin outlet 2620.

[0113] FIG. 26 shows a cross-section view of the flat pipe modules shown in FIG. 25 taken at line 26 - 26’. FIG. 26 shows wedge-wire screens 2710 on the top and the bottom of the flat pipe 2706 through which the contact-liquid flows (from 2704A to 2704B) to interact with the resin.

[0114] FIGS. 27A - B show wedge-wire screens 2710 according to some embodiments. Wedge-wire screens 2710 include frame 2714 and wedge-wire 2716. Slots 2712 are formed in wedge-wire 2716 and may have a width 2702. In some embodiments, width 2702 is .010 inches.

[0115] FIGS. 28A - 28C show a schematic view of a flat pipe IFORS module 2800, according to some embodiments. Resin flows through inlet 2812 to resin inlet 2810 and across flat pipe modules 2806. Inlet 2812 transitions from a round pipe 2813 to flat pipe 2806. A contact-liquid 2804 is pumped throughout the system. The resin exits at resin outlet 2820 and then may transition to a round pipe (similar to round pipe 2813) at outlet 2814.

[0116] FIG. 29 shows a reconditioning skid 2900 according to some embodiments. Skid 2900 receives resin at resin inlet 2910. Resin inlet 2910 feeds resin slurry into resin separator 2902. Resin separator 2902 separates the resin slurry into cation resin slurry 2906 and anion resin slurry 2908. As shown in FIG. 29, reconditioning skid 2900 has cation resin slurry cleaning assemblies 2930. Each assembly includes three flat pipes. Cation resin slurry first passes to SO3 flush 2932, then to cation regeneration 2934, acid flush 2936, and cation final rinse 2938. Anion resin slurry 2908 is processed on anion cleaning assemblies 2950. Anion resin slurry 2908 passes to SO3 flush 2952, then to anion regeneration 2954, caustic flush 2956, NH4OH regeneration 2958, NH4OH flush 2960, and finally to anion final rinse 2962. Cationresin slurry 2906 and anion resin slurry 2908 are recombined at mixing point 2912 and proceed to pre-rinse 2970 into final rinse 2980 before exiting reconditioning skid 2900 through resin outlet 2920.

[0117] FIG. 30 shows an embodiment of a system 3000 for cleaning and regenerating a resin. System 3000 automatically performs scrubbing action on resin surfaces, controls chemical introduction, waste stream reject volumes, internal rinse / flush activities, level control, pressure control and liquid and resin slurry flow control. System 3000 has cleaning vessel 3004. Resins being processed through system 3000 are subjected to chemicals and scrubbed by being recirculated in cleaning vessel 3004. Dirty and exhausted resin may be pumped into cleaning vessel 3004 along resin inlet 3010 from plant 3006. Plant 3006 may be a power plant or may be another portion of a resin cleaning system or skid.

[0118] A motive liquid 3016 is recirculated by pump 3014. Resin entering cleaning vessel 3004 is introduced to the rigorous recirculation ongoing inside cleaning vessel 3004 generated by motive liquid 3016.

[0119] In some embodiments, resin from a poly-liner 3002 is supplied to the top of cleaning vessel 3004 via supply line 3012. As the dirty, exhausted, and fouled resins are pumped into cleaning vessel 3004, an equivalent amount of resin is pulled from cleaning vessel 3004 and routed to plant 3006 to be soaked in a bisulfite cleaning solution. The incoming and outgoing transfer of resins to and from cleaning vessel 3004 continues until the entire resin batch has been processed through cleaning vessel 3004, scrubbed, and transferred out of cleaning vessel 3004 to plant 3006. Hence, the resin cleaning process is descriptive of the process that reconditions mixed or singular (anion or cation) species of resins during transport of resins from an original source, through cleaning vessel 3004, and then back to plant 3006.

[0120] Cleaned / scrubbed resin is simultaneously drawn from the bottom of cleaning vessel 3004 to either return to plant 3006 along return line 3018 or to move with motive liquid 3016. When all the resin has been transferred to cleaning vessel 3004 from poly-liner 3002, a top resin inlet of cleaning vessel 3004 is closed as the bottom resin discharge of cleaning vessel 3004 continues until all resin has been evacuated to the plant 3006’ s resin holding vessel. In some embodiments, another resin charge is then transferred by plant 3006 into poly-liner 3002 along supply line 3026. Waste may be removed from cleaning vessel 3004 along waste line 3024.

[0121] Cleaning chemicals are mixed in mix tank 3008. Mix tank 300 may also be supplied with resins or slurry, or components thereof, along supply line 3020 and may return mixed resins or a resin slurry along return line 3022.

[0122] An unconventional cleaning process is achieved through utilizing eductors inside cleaning vessel 3004 to pull resins from the bottom of cleaning vessel 3004, up through the resin bed to “scrub” by self-cleaning resin surfaces as they contact other resins during the flow up through the resin bed. In some embodiments, the use of eductor motive liquid comprised of a bisulfite reconditioning solution to pull and discharge resin slurry to “scrub” resin outer surfaces during its travel pathway from the bottom of cleaning vessel 3004 to the top, and returning to the bottom. In some embodiments, the process reconditions ion exchange resin slurry in cleaning vessel 3004, which is then transferred to plant 3006 equipment for soak / regeneration activities. During the “scrubbing” process within cleaning vessel 3004, exhausted and / or fouled resins are introduced into the cleaning vessel 3004 to be reconditioned. Simultaneously, resins are pulled from cleaning vessel 3004 and transferred back to plant 3006 equipment to be soaked and / or regenerated.

[0123] In some embodiments, the components for this process include the resin reconditioning skid, eductors (and / or diaphragm or other positive displacement resin transfer pumps), pipes and valves for controlling resin slurry, chemical, and deionized water flows, electronic instrumentation needed for process control and data logging, and plant regeneration equipment (resin holding vessels).

[0124] During the course of transferring ion exchange resins in a liquid medium as a slurry, degraded physical attributes of exhausted, fouled, or otherwise impaired resins can be restored to “like-new” performance during the actual resin transport process. Combining resin-handling attributes of eductors, flow-loops, fluid-ejectors, and solids-ejectors, the use of traditional static bulk resin vessels can be eliminated during resin processing with the resin reconditioning process. Drastically reduced waste stream volumes are generated by the reconditioning process.

[0125] Impaired resins exhibit a varied and unique set of conditions obtained during prior service runs. The restoration process should address each unique set of degraded conditions the impaired resins possess for full resin restoration. Depending on actual equipment configuration, resins can be processed utilizing a single-pass, once-through approach, or transferred through the multiple flow loops, multiple times depending on the level of impairment the resin has acquired.

[0126] In some embodiments, ion exchange resin slurry (water and resin) is reconditioned during transfer through one or more series of variable piping loops, combining mixing and cleaning effects of chemicals, with physical attrition associated with resin slurry flows in low- impact zones. In some embodiments, resin slurry must have minimally sustained flows through piping but should not exceed velocities that result in damage to resin bead surfaces during resintransport activities. Flow loops are used in conjunction with IFORS modules to eliminate unwanted levels of physical and chemical impurities. In some embodiments, single or multiple flow loop configurations are utilized and are dependent upon deployment requirements (mobile or permanent installations) and desired effluent quality. In some embodiments, flow loops allow transition between chemical processes, eliminating the need for bulk tanks. Based on resin needs, eductors, IFORS module transfer flow-loops, can be assembled in multiple configurations as needed for unique resin needs (see figures throughout for examples).

[0127] In some embodiments, during the course of transferring ion exchange resin slurry using liquids as a transfer medium, degraded physical attributes of exhausted, fouled, or otherwise impaired resins are fully restored, regenerated, and rinsed to specification while the resin is in transit. In some embodiments, the reconditioning process incorporates a cleaning and regenerant solution flow that is counter-current to resin transport flows, offering huge savings in cleaning and regeneration chemicals, waste volumes produced and process times required to perform resin restoration and regenerations. In some embodiments, the need for traditional bulk resin tanks and vessels is eliminated with the resin reconditioning process disclosed herein. With the reconditioning process disclosed herein, waste streams may be automatically neutralized to meet regulatory release limits for immediate discharge to the waste sumps or the environment, eliminating the requirement for large neutralizing tanks prior to discharging reconditioning wastes to lakes, rivers, or the ocean.

[0128] In some embodiments, eductors physically transfer ion exchange resins throughout the resin process skid using chemicals that restore ion exchange kinetics (mass transfer coefficient) to resin, ensuring the health and readiness of ion exchange resins remains as that of new resin. Impaired resin kinetics can be restored, resin can be fully regenerated, and final rinses-to-specification are effectively achieved utilizing a series of eductors to manage resins, chemicals and waste during the resin transfer process.

[0129] In some embodiments, ion exchange resin slurry is pre-treated by removing suspended solids prior to chemical introduction. In some embodiments, the reconditioning process reconditions ion exchange resin slurry during resin transfer from one location to another. In some embodiments, excessive resin slurry liquid volumes are regulated by resin offset modules. In some embodiments, loop assemblies (eductors, flow-loop piping, IFORS modules) can be stacked horizontally or mounted vertically side-by-side, depending on size and space requirements. In some embodiments, flow-loop assemblies utilize pressure, pH, flow, and conductivity indication at various points to monitor and control system flow properties. In some embodiments, loop assemblies include resin transfer piping, IFORSmodules, deionized water flush feed, chemical feed, and control valves. In some embodiments, the process skid incorporates flow-loop assemblies utilizing feed chemical recirculation flow paths with common chemical feed for multiple flow-loop assemblies for enhanced chemical efficacy, reduced chemical feed volumes, and reduced waste stream generation.

[0130] In some embodiments, ion exchange resin slurry (water and resin) is transported in piping via air and / or water pressure. Resin slurry may contain resin fines (broken pieces of resin beads) and suspended metal oxides (rust / crud) in the resin slurry mixture. Suspended metal oxide materials and resin fines should be removed from resin slurry prior to injection of reconditioning chemicals to avoid premature consumption and / or chemical reactions with chemical and crud, preventing dilution effects of chemicals. Resin slurry velocity must be sustained to support continued flow through piping, but it must not exceed velocities that can potentially damage resin beads during transport. In some embodiments, DI water is supplied to the interior of the solids eject device casing to displace fluids containing suspended crud and fines in the resin slurry. In addition to DI water, increased surface tension associated with compressed air bubbles is supplied to the upstream interior of the casing to assist in the removal of suspended crud and fines from the resin slurry.

[0131] In some embodiments, suspended iron and resin fines can now be removed from resins during resin transport from one location to the final location. In some embodiments, metal oxides and organic foulants can be removed from resins during resin transport. In some embodiments, ion exchange resin kinetics (mass transfer coefficient - MTC) can be restored to like “brand new.” In some embodiments, fully exhausted ion exchange resins can be regenerated while mixed (anion and cation) in a slurry. In some embodiments, mixed (anion / cation) resins can be fully separated during resin transport. In some embodiments, mixed resin cross-contamination after separation is <0.5% cross-contaminated. In some embodiments, resins can be fully rinsed-to-specification during resin transport. In some embodiments, 93% savings on chemical usage requirements to regenerate anion and cation resins is achieved compared to known processes. In some embodiments, 87% savings on deionized water usage to fully clean, regenerate, and rinse resins to specification is achieved compared to known processes. In some embodiments, ion exchange resins can be used for up to 30 years without replacement, avoiding disposal in landfills. In some embodiments, > 90% reduction in total waste volume created during cleaning, regenerating, and rinsing resins is achieved compared to known processes. In some embodiments, 300 cubic feet of resin can be cleaned, kinetics restored, regenerated and rinsed in under 2 hours.

[0132] During the course of transferring ion exchange resin in a liquid medium as a slurry, it is necessary to remove suspended metal oxides, which exist in the form of rust, crud, and resin fines. This can be accomplished with a device utilizing a wedge-wire screen resin containment, having wedge-wire gaps large enough for fluids passage, resin fines and suspended solids, but small enough to restrict passage of whole resin beads inside the wedgewire containment during transport of resin slurries. In some embodiments, the gap width is less about .010 inches.

[0133] The assembly can be comprised of an outer casing in which the wedge-wire screen resin containments are housed. Fluids containing crud and suspended contaminants are displaced from the slurry mixture with flush water and air. As the cleaned resin continues its path towards the IFORS module outlet, additional water is injected into the resin slurry prior to exiting the solids-ejector to ensure slurry consistency is maintained for continued resin transport.

[0134] In some embodiments, the system may include auxiliary equipment, in addition to the various assemblies discussed above. The auxiliary equipment may include Pumps (Mag- Drives w / VFD), such as Waste Pump(s), DI Water Pump(s), SO3 Pump, NaOH Pump, NH40H Pump, H2SO4 Pump. The auxiliary equipment may include Flow Meter(s), such as Coriolis and others as required. The auxiliary equipment may include Conductivity measurement, Pressure measurement, pH measurement, Check valves, Manual Ball Valves, Motorized Ball Valves (Open / Close and Modulated), Chemical Mix Station (off the shelf), Eductors, Sight Glass(es), Separation Vessel, IFORS Assemblies (discussed above).

[0135] More specifically, this disclosure, its aspects and embodiments, are not limited to the specific material types, components, methods, or other examples disclosed herein. Many additional material types, components, methods, and procedures known in the art are contemplated for use with particular implementations from this disclosure. Accordingly, for example, although particular implementations are disclosed, such implementations and implementing components may comprise any components, models, types, materials, versions, quantities, and / or the like as is known in the art for such systems and implementing components, consistent with the intended operation.

[0136] It will be understood that implementations of the present system include but are not limited to the specific components disclosed herein, as virtually any components consistent with the intended operation of the present system may be utilized. Accordingly, for example, it should be understood that, while the drawings and accompanying text show and describe particular implementations, any such implementation may comprise any shape, size, style,type, model, version, class, grade, measurement, concentration, material, weight, quantity, and / or the like consistent with the intended operation the system.

[0137] The concepts disclosed herein are not limited to the specific systems shown herein. For example, it is specifically contemplated that the components included in the system may be formed of any of many different types of materials or combinations that can readily be formed into shaped objects and that are consistent with the intended operation of the system. For example, the components may be formed of rubbers (synthetic and / or natural) and / or other like materials; glasses (such as fiberglass), carbon-fiber, aramid-fiber, any combination therefore, and / or other like materials; elastomers and / or other like materials; polymers such as thermoplastics (such as ABS, fluoropolymers, polyacetal, polyamide, polycarbonate, polyethylene, polysulfone, and / or the like, thermosets (such as epoxy, phenolic resin, polyimide, polyurethane, and / or the like), and / or other like materials; plastics and / or other like materials; composites and / or other like materials; metals, such as zinc, magnesium, titanium, copper, iron, steel, carbon steel, alloy steel, tool steel, stainless steel, spring steel, aluminum, and / or other like materials; and / or any combination of the foregoing.

[0138] Furthermore, the present disclosure’s systems may be manufactured separately and then assembled together, or any or all of the components may be manufactured simultaneously and integrally joined with one another. Manufacture of these components separately or simultaneously, as understood by those of ordinary skill in the art, may involve 3-D printing, extrusion, pultrusion, vacuum forming, injection molding, blow molding, resin transfer molding, casting, forging, cold rolling, milling, drilling, reaming, turning, grinding, stamping, cutting, bending, welding, soldering, hardening, riveting, punching, plating, and / or the like. If any of the components are manufactured separately, they may then be coupled or removably coupled with one another in any manner, such as with adhesive, a weld, a fastener, any combination thereof, and / or the like for example, depending on, among other considerations, the particular material(s) forming the components.

[0139] In places where the description above refers to particular implementations or embodiments, it should be readily apparent that a number of modifications may be made without departing from the spirit thereof and that these implementations may be applied to other implementations disclosed or undisclosed. The presently disclosed systems are, therefore, to be considered in all respects as illustrative and not restrictive.

Claims

CLAIMSWhat is claimed is:

1. A system for reconditioning resin in flow, the system comprising: a crud flush module configured to receive a resin slurry, the crud flush module configured to remove resin fines and suspended metal oxides from the resin slurry; a scrubbing module configured to receive the resin slurry from the crud flush module, the scrubbing module configured to introduce a scrubbing module contactliquid into the resin slurry, wherein the scrubbing module contact-liquid comprises a sulfite solution (SO3); an anion regeneration module configured to receive the resin slurry from the scrubbing module, the anion regeneration module configured to introduce an anion regeneration module contact-liquid into the resin slurry, wherein the anion regeneration module contact-liquid comprises sodium hydroxide (NaOH); a separation module configured to receive the resin slurry at an inlet to a separation vessel, the separation vessel having a separation liquid contained therein, wherein the resin slurry comprises an anion resin slurry and a cation resin slurry, and wherein the separation liquid is configured to separate the anion resin slurry from the cation resin slurry; an anion caustic flush module configured to receive the anion resin slurry from the separation module, the anion caustic flush module configured to introduce an anion caustic flush module contact-liquid into the anion resin slurry, wherein the anion caustic flush module contact-liquid comprises sodium hydroxide (NaOH); an ammonia rinse module configured to receive the anion resin slurry from the anion caustic flush module, the ammonia rinse module configured to introduce an ammonia rinse module contact-liquid into the anion resin slurry, wherein the ammonia rinse module contact-liquid comprises ammonium hydroxide (NH4OH); a cation caustic flush module configured to receive the cation resin slurry from the separation module, the cation caustic flush module configured to introduce a cation caustic flush module contact-liquid into the cation resin slurry, wherein the cation caustic flush module contact-liquid comprises deionized water;a cation regeneration module configured to receive the cation resin slurry from the cation caustic flush module, the cation regeneration module configured to introduce a cation regeneration module contact-liquid into the cation resin slurry, wherein the cation regeneration module contact-liquid comprises sulfuric acid (H2SO4); an anion resin rinse module configured to receive the anion resin slurry from the ammonia rinse module, the anion resin rinse module configured to introduce an anion resin rinse module contact-liquid into the anion resin slurry, wherein the anion resin rinse module contact-liquid comprises deionized water; a cation resin rinse module configured to receive the cation resin slurry from the cation regeneration module, the cation resin rinse module configured to introduce a cation resin rinse module contact-liquid into the cation resin slurry, wherein the cation resin rinse module contact-liquid comprises deionized water; a mixing module configured to receive the cation resin slurry from the cation resin rinse module and the anion resin slurry from the anion rinse module, the mixing module configured to combine the cation resin slurry and the anion resin slurry into a combined slurry; and a final rinse module configured to receive the combined slurry from the mixing module, the final rinse module configured to introduce a final rinse module contact-liquid into the resin slurry, wherein the final rinse module contactliquid comprises deionized water.

2. The system of claim 1, wherein the scrubbing module contact-liquid comprises about 7% sulfite solution (SO3).

3. The system of claim 1, wherein at least one of the contact-liquids is introduced to the resin slurry at approximately a right angle to a flow of the resin slurry.

4. The system of claim 3, wherein the at least one of the contact-liquids is introduced to the resin slurry at multiple points in the module.

5. The system of claim 1, wherein the anion regeneration module comprises: contact loops, the resin slurry configured to pass through each of the contact loops sequentially; and an anion regeneration module contact-liquid path configured to carry the anion regeneration module contact-liquid through each of the contact loops in areverse sequential order than an order that the resin slurry passes through each of the contact loops.

6. The system of claim 1, wherein at least one of the modules comprises a filter.

7. The system of claim 6, wherein the filter is a wedge wire filter.

8. The system of claim 6, wherein the filter is configured to filter resin fines and suspended metal oxides from the resin slurry.

9. The system of claim 6, wherein the filter is configured to permit passage of particles smaller than .010 inches in diameter.

10. The system of claim 1, wherein the separation vessel has a top and a bottom, wherein the anion resin slurry is drawn out the top of the separation vessel by an eductor suction source coupled to the top of the separation vessel, and wherein the cation resin slurry is drawn out the bottom of the separation vessel by an eductor suction source coupled to the bottom of the separation vessel.

11. The system of claim 1, wherein at least one of the modules is a flat pipe module.

12. A system for reconditioning resin in flow, the system comprising: a crud flush module configured to receive a resin slurry, the crud flush module configured to remove resin fines and suspended metal oxides from the resin slurry; and a scrubbing module configured to receive the resin slurry from the crud flush module, the scrubbing module having a scrubber section and a flush section, the scrubber section configured to introduce a motive liquid to the resin slurry to move the resin slurry through the scrubber section to the flush section, the flush section configured to introduce a contact-liquid to the resin slurry.

13. The system of claim 12, further comprising a final rinse module configured to receive the resin slurry, the final rinse module configured to introduce a final rinse module contact-liquid into the resin slurry.

14. The system of claim 13, wherein the final rinse module contact-liquid is deionized water.

15. The system of claim 12, further comprising a separation module configured to receive the resin slurry at an inlet to a separation vessel, the separation vessel having a separation liquid contained therein, wherein the resin slurry comprises an anion resin slurry and a cation resin slurry, and wherein the separation liquid is configured to separate the anion resin slurry from the cation resin slurry.

16. A system reconditioning resin in flow, the system comprising:a plurality of modules configured to act on a resin slurry, each module having a plurality of contact loops, each contact loop configured to receive the resin slurry and introduce a contact-liquid to the resin slurry; and a plurality of eductors configured to move the resin slurry between the plurality of modules, each eductor configured to introduce a motive liquid to the resin slurry to move the resin slurry; wherein the contact-liquid is one of: sulfite solution (SO3), ammonium hydroxide (NH4OH), sodium hydroxide (NaOH), and sulfuric acid (H2SO4).

17. The system of claim 16, wherein at least one of the plurality of modules comprises a flat pipe module.

18. The system of claim 16, wherein each module comprises a filter configured to remove a waste product of the module.

19. The system of claim 16, wherein the system is configured to operate at a resin slurry pressure of approximately 5 psi or less.

20. The system of claim 16, further comprising a crud flush module configured to receive a resin slurry, the crud flush module configured to remove resin fines and suspended metal oxides from the resin slurry.

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