Circuit assembly and battery

Abstract

The present application belongs to the field of electronics and electricity, and provides a circuit assembly and a battery. The circuit assembly comprises: a substrate, an end portion of the substrate being divided to form multiple terminals; multiple circuits arranged on the substrate, the multiple terminals being electrically connected to the multiple circuits; an adapter, provided with multiple mounting grooves arranged at intervals; a wire harness, multiple wires in the wire harness corresponding one-to-one with the multiple mounting grooves, one end of each wire being at least partially located in the corresponding mounting groove, and the other end of each wire being connected to an external data port; and multiple terminals, corresponding one-to-one with the multiple mounting grooves, the terminals being at least partially located in the corresponding mounting grooves, and a terminal and a wire located in the same mounting groove being electrically connected.

Description

Circuit components and batteries Cross-references

[0001] This application refers to Chinese Patent Application No. 202410361717.2, filed on March 27, 2024, entitled “Circuit Components and Batteries,” which is incorporated herein by reference in its entirety. Technical Field

[0002] The present application relates to the field of electronic and electrical technology, and in particular to a circuit component and a battery. Background Art

[0003] Circuit boards play a role in signal control and transmission. Flexible printed circuits (FPCs) are circuit boards supported by a flexible insulating substrate, offering advantages such as good bendability, lightweight, and flexible manufacturing processes.

[0004] FPCs are commonly used to connect electronic devices. Printed circuits on the FPCs enable functions such as signal acquisition and transmission from the electronic devices. For example, FPCs can be used to connect a battery management system (BMS) to a battery module, thereby monitoring the module's status and improving battery safety.

[0005] However, in the related art, the FPC is connected to the electronic device by plugging. This connection method results in low flexibility in connecting the FPC to the electronic device, which in turn leads to the problem that the overall space occupied by the FPC is large and the cost is high. Summary of the Invention

[0006] The present application aims to solve at least one of the technical problems in the background art. To this end, one purpose of the present application is to provide a circuit assembly and a battery to solve the problem of low flexibility in connection between FPC and other electronic devices in the related art.

[0007] An embodiment of the first aspect of the present application provides a circuit assembly, which includes: a substrate, the ends of which are divided to form multiple terminals; multiple circuits arranged on the substrate, and the multiple terminals are electrically connected to the multiple circuits; an adapter, which has multiple installation slots arranged at intervals; a wiring harness, in which multiple wires in the wiring harness correspond one-to-one to the multiple installation slots and one end of the wire is at least partially located in the corresponding installation slot, and the other end of the wire is used to connect to an external data port; multiple terminals correspond one-to-one to the multiple installation slots and the terminals are at least partially located in the corresponding installation slots, and the terminals and wires located in the same installation slot are electrically connected.

[0008] In the technical solution of the embodiment of the present application, the multiple wires in the wiring harness are directly electrically connected to the multiple terminals at the end of the substrate, and because the wires and terminals electrically connected to each other are at least partially located in the mounting groove, they are insulated from each other, thereby enabling multiple circuits to be connected to different data ports respectively, and the multiple circuits will not cause electrical interference with each other, thereby improving the reliability of the communication connection between the data port and the corresponding circuit. Compared with the direct plug-in method to connect multiple circuits to multiple data ports, the connection position of the multiple wires in the wiring harness to different data ports can be flexibly adjusted, thereby enabling multiple circuits to be connected to the corresponding data ports respectively to form a communication connection. In this way, by only providing a connector and a wiring harness, not only can multiple circuits be cross-used, the flexibility of connecting multiple circuits in the circuit assembly to multiple data ports is improved, and the flexibility of connecting the circuit assembly to the electronic devices where the multiple data ports are located is improved, but also the space occupied and the cost of the entire circuit assembly are reduced.

[0009] In some embodiments, the adapter includes a bottom cover having a plurality of mounting slots therein and a top cover for engaging with the bottom cover. This allows the terminals and wires in the mounting slots to be located within the accommodation space defined by the bottom and top covers, thereby protecting the electrically connected terminals and wires and improving the reliability of the electrical connection between the terminals and wires.

[0010] In some embodiments, the bottom cover has multiple protrusions spaced apart along a predetermined direction, and the protrusions are used to define multiple mounting slots. That is, adjacent protrusions define mounting slots, and the protrusions isolate electrically connected terminals and wires, reducing the possibility of electrical interference between adjacent circuits and improving the reliability of signal transmission within the circuits.

[0011] In some embodiments, the substrate is a flexible substrate. This makes the circuit assembly flexible, enhancing its installation flexibility. Furthermore, because the multiple terminals electrically connected to the multiple wires are separated by mounting slots, the possibility of deformation of the flexible terminals, which could lead to electrical contact between adjacent terminals, is significantly reduced, significantly improving the reliability of the circuit assembly.

[0012] In some embodiments, when the adapter includes a bottom cover having a plurality of protrusions spaced apart along a predetermined direction, the plurality of terminals are spaced apart along the predetermined direction. The arrangement direction of the plurality of terminals aligns with the arrangement direction of the plurality of protrusions, allowing the plurality of terminals to be neatly positioned one by one in the mounting slots and isolated from each other, further reducing the possibility of electrical contact between adjacent terminals.

[0013] In some embodiments, the wire includes a first connection end, the terminal includes a second connection end, the second connection end is joined to the first connection end to electrically connect the terminal and the wire, and the joined first and second connection ends are both located in the mounting groove. That is, the portion where the second connection end joins the first connection end is both located in the mounting groove, thereby improving the isolation between adjacent terminals and the joined portions of adjacent wires, further reducing the probability of electrical interference between adjacent circuits.

[0014] In some embodiments, the second connection end includes a pad, and the first connection end is bonded to the pad to thereby bond to the second connection end. In this way, the first connection end and the second connection end are connected by welding, thereby improving the reliability of the bonding.

[0015] In some embodiments, the circuit assembly further comprises: a sealing film layer extending along the arrangement direction of the plurality of terminals, the sealing film layer being located on a side of the first connection end away from the second connection end and covering at least the first connection end. Thus, the sealing film layer can seal the first connection end, reducing damage to the first connection end from moisture or air, maintaining good electrical conductivity at the first connection end, and thereby maintaining good electrical connection performance between the first connection end and the second connection end.

[0016] In some embodiments, the conductive wire includes an electrical conductor and an insulating layer covering a portion of the outer circumference of the electrical conductor, wherein the insulating layer exposes a first connection end. The insulating layer can protect the portion of the conductive wire other than the first connection end and can insulate adjacent portions of the conductive wire other than the first connection end.

[0017] In some embodiments, the entire terminal constitutes the second connection end. This allows for a larger area of ​​the second connection end joined to the first connection end, reduces the contact resistance between the first connection end and the second connection end, and thereby provides better electrical connection performance between the first connection end and the second connection end.

[0018] In some embodiments, the substrate includes a first surface and a second surface facing each other, the conductive wires being in electrical contact with the terminals on the first surface, and the circuit assembly further including a first reinforcement layer located on the second surface, the first reinforcement layer covering at least the plurality of terminals. The first reinforcement layer can enhance the strength of the terminals and reduce the likelihood of them warping.

[0019] In some embodiments, the substrate includes a main body portion and a folded portion that are connected to each other. The folded portion is bent relative to the main body portion, and the terminal extends from the folded portion on a side away from the main body portion. The first reinforcement layer also covers at least a portion of the folded portion connected to the terminal. This allows the first reinforcement layer to cover the interface between the terminal and the folded portion, making the interface more rigid and reducing the probability of the folded portion bending along the interface.

[0020] In some embodiments, the circuit assembly further includes a second reinforcement layer located on the first surface and covering at least a portion of the folded portion connected to the plurality of terminals. This allows the surface of the terminals to be exposed, thereby achieving electrical connection between the terminals and the wires while also strengthening the folded portion connected to the terminals, reducing the probability of deformation of the folded portion, and thereby reducing the probability of deformation of the terminals connected thereto due to deformation of the folded portion, thereby ensuring more reliable separation between adjacent terminals.

[0021] In some embodiments, the folded portion includes: a first folded portion and a second folded portion, the second folded portion being bent relative to the first folded portion and extending in the same direction as the main portion; a plurality of terminals extending from a side of the second folded portion away from the first folded portion; and a first reinforcement layer and a second reinforcement layer covering two opposing surfaces of the second folded portion, respectively. This allows the first folded portion to define a height difference between the main portion and the second folded portion, adapting to different installation requirements of the circuit assembly. The first reinforcement layer and the second reinforcement layer covering two opposing surfaces of the second folded portion can enhance the strength of the second folded portion connected to the terminal, reduce the probability of deformation of the second folded portion, and ensure more reliable separation between adjacent terminals.

[0022] In some embodiments, when the adapter includes a bottom cover and a top cover, the second folded portion is further located in the accommodation space formed by the top and bottom covers. That is, the second folded portion connected to the terminal and the terminal are both located in the accommodation space, allowing the terminal to be located away from the edge of the accommodation space, reducing the probability of the terminal falling out of the gap between the top and bottom covers, and ensuring that the terminal is more firmly located in the accommodation space.

[0023] In some embodiments, the circuit assembly further includes: an adhesive layer corresponding to at least the plurality of terminals, the adhesive layer being located on a side of the first reinforcement layer away from the second surface, and being used to secure the plurality of terminals to the bottom of the mounting slot. This can enhance the securement of the terminals within the mounting slot, further reducing the probability of electrical contact between adjacent terminals, and improving the reliability of the circuit assembly.

[0024] In some embodiments, a circuit is used to detect signals from a battery module. The circuit includes: a detection unit integrated into a substrate, the detection unit including a voltage detection unit or a temperature detection unit; and a sampling circuit, one end of the sampling circuit being electrically connected to the detection unit, and the other end of the sampling circuit being electrically connected to a terminal, so that the sampling circuit detects the signal from the battery module through the detection unit. Because multiple circuits can be cross-used, it is possible to flexibly adjust the connection between multiple voltage detection units or multiple temperature detection units and different sampling circuits, thereby enabling the voltage detection unit to detect the voltage of the battery module at different locations in the battery module, or enabling the temperature detection unit to detect the temperature at different locations in the battery module, thereby meeting different voltage detection requirements or temperature detection requirements, and improving the effectiveness and reliability of detecting the signal from the battery module.

[0025] The embodiment of the second aspect of the present application provides a battery, which includes a battery module; the circuit assembly in the above embodiment, the circuit of the circuit assembly is used to detect the signal of the battery module; a battery management system, the wiring harness of the circuit assembly is connected to the data port of the battery management system, so that the battery module is connected to the battery management system through the circuit assembly. Since multiple circuits can be cross-used, the positions of multiple voltage detection units or multiple temperature detection units in the battery module can be flexibly adjusted, thereby enabling the voltage detection unit to detect the voltage of the battery module at different positions of the battery module, or enabling the temperature detection unit to detect the temperature of different parts of the battery module, to meet different voltage detection requirements or temperature detection requirements, thereby improving the effectiveness and reliability of the battery management system in monitoring the battery module.

[0026] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0028] FIG1 is a schematic diagram of the exploded structure of a battery according to some embodiments of the present application;

[0029] FIG2 is a schematic diagram of the exploded structure of a battery cell according to some embodiments of the present application;

[0030] FIG3 is a schematic diagram of an exploded structure of a circuit assembly according to some embodiments of the present application;

[0031] FIG4 is a schematic top view of a circuit assembly according to some embodiments of the present application;

[0032] FIG5 is a schematic diagram of a partial top view of a circuit assembly according to some embodiments of the present application;

[0033] FIG6 is an enlarged schematic diagram of the structure in the dotted box in FIG5 ;

[0034] FIG7 is a schematic top view of the bottom cover of the circuit assembly in some embodiments of the present application;

[0035] FIG8 is a schematic side view of the bottom cover of the circuit assembly in some embodiments of the present application;

[0036] FIG9 is a schematic top view of the structure of a top cover in a circuit assembly according to some embodiments of the present application;

[0037] FIG10 is a schematic side view of the top cover in the circuit assembly of some embodiments of the present application;

[0038] FIG11 is a schematic diagram of a partial top view of a circuit assembly according to some other embodiments of the present application;

[0039] FIG12 is a schematic diagram of the exploded structure of circuit components according to other embodiments of the present application;

[0040] FIG13 is a schematic top view of the folded portion of a circuit assembly according to some embodiments of the present application;

[0041] FIG14 is an enlarged structural diagram of the dotted box in FIG13 . DETAILED DESCRIPTION

[0042] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0044] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0045] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0046] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0047] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0048] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0049] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0050] An FPC typically consists of a conductive substrate and a flexible insulating film covering two opposing surfaces of the substrate, with multiple circuits formed on the conductive substrate. Unlike a PCB (Process Control Block), the PCB's surface has exposed circuitry. Therefore, plug-ins or other connectors can be used to directly connect different circuits from the PCB surface to the corresponding plug-in terminals of an electronic device, providing a more flexible connection method. However, because the FPC's circuit surface is covered with a flexible insulating film, plug-ins or other connectors are typically used to connect the FPC to the ends of the FPC, thereby connecting multiple circuits to the plug-in terminals of the electronic device.

[0051] The plug-in end of an electronic device usually has multiple data ports, each of which has a corresponding connection relationship with multiple circuits on the FPC. The circuit needs to be connected to the corresponding data port to achieve communication between the electronic device and the corresponding circuit.

[0052] In related art, connectors use a direct plug-in method to connect an FPC to the plug-in terminal of an electronic device. This results in multiple circuits in the FPC being able to connect only to one row of data ports on the plug-in terminal and unable to connect to data ports in other rows. Alternatively, if the electronic device has multiple plug-ins, it cannot connect to multiple data ports on the plug-in terminal. In other words, the connection position is relatively fixed, resulting in a low degree of flexibility in the connection between the electronic device and the FPC. This can cause one or more of the multiple circuits connected to a row of data ports in the electronic device to mismatch with the connected data ports, making it impossible for the electronic device to communicate with the circuits, and further leading to the problem of multiple circuits in the FPC being unable to be used interchangeably.

[0053] In some embodiments, the electronic device may be a battery management system. The FPC can connect the battery management system and the battery module to enable communication between the battery management system and the battery module. Due to the use of a direct plug-in connection, the connection positions of the FPC's multiple circuits and the multiple data ports in the battery management system are relatively fixed, resulting in low flexibility in the connection between the battery management system and the FPC. As a result, one or more of the multiple circuits connected to a row of ports in the battery management system may not match the connected data ports, making it impossible for the battery management system to communicate with or connect and disconnect these circuits, thereby preventing the battery management system from monitoring the signals collected by all circuits.

[0054] For example, multiple circuits can collect signals from the battery module and transmit the collected signals to the battery management system as a basis for the battery management system to control battery safety, battery charging and discharging strategies, and driving safety. Multiple circuits can collect temperature signals or voltage signals from the battery module.

[0055] For example, when the circuit is used to collect the temperature signal of the battery module, each circuit includes a temperature sensor, and the temperature sensors of different circuits are located at different positions of the battery module, thereby monitoring the temperature of different positions of the battery module. If the multiple circuits on the FPC cannot be used crosswise, the battery management system will not be able to fully monitor the temperature of different positions of the battery module. In addition, since the connection positions of the multiple circuits in the FPC and the battery management system are relatively fixed, the positions of the multiple temperature sensors on the substrate are also relatively fixed. Otherwise, the battery management system will not be able to collect the signal of the temperature sensor, and will not be able to adjust the measurement position of the temperature sensor in the battery module according to the temperature measurement requirements.

[0056] To address the aforementioned issues of low flexibility in the connection between FPCs and electronic devices and the inability to cross-use circuits, double-sided boards (circuitry on both opposing surfaces) are often used to communicate with multiple data ports of electronic devices. This allows as many circuits as possible to be connected to multiple data ports, allowing the data ports to establish communication connections with as many circuits on the FPC as possible, thereby collecting or receiving more signals. Alternatively, multiple single-sided boards (circuitry on one surface) are used to directly connect to different rows of data ports on the plug-in end of the electronic device, thereby achieving electrical connections between different rows of data ports on the electronic device and the corresponding circuits.

[0057] However, the use of double-panel panels will result in higher costs, and the use of multiple single-panel panels will result in a larger space occupation problem.

[0058] In addition, when the FPC is far away from the electronic device, it is impossible to connect the FPC and the data port of the electronic device by direct plug-in.

[0059] Based on the above considerations, and to address the problem of low flexibility in connecting FPCs to electronic devices in the related art, a circuit assembly has been designed. The circuit assembly includes a substrate having multiple circuits, and the ends of the substrate are divided into multiple terminals, each of which is electrically connected to a circuit. A connector and a wiring harness are also provided, wherein one end of multiple wires in the wiring harness is electrically connected to each of the multiple terminals. Because the electrically connected wires and terminals are at least partially located in the mounting slots, they are insulated from each other. This allows the multiple circuits to be connected to different data ports separately, preventing electrical interference between the multiple circuits and improving the reliability of the communication connection between the data ports and the corresponding circuits. Compared to connecting multiple circuits to multiple data ports using a direct plug-in method, the connection positions of the multiple wires in the wiring harness to different data ports can be flexibly adjusted, allowing the multiple circuits to be connected to the corresponding data ports separately to form a communication connection. In this way, by simply providing a connector and a wiring harness, multiple circuits can be used interchangeably, improving the flexibility of connecting the multiple circuits in the circuit assembly to multiple data ports, and reducing the space occupied and the cost of the entire circuit assembly.

[0060] The circuit assembly disclosed in the embodiments of the present application can be used for electrical connections between different electronic devices, for example, including but not limited to connections between a battery management system and a battery module.

[0061] The following description takes the connection between the battery management system and the battery module as an example.

[0062] Please refer to Figure 1, which is a schematic diagram of the exploded structure of a battery provided in some embodiments of the present application. Battery 100 includes a housing 10 and a battery module, which is housed within housing 10. Housing 10 is used to provide storage space for the battery module and can have a variety of structures. In some embodiments, housing 10 can include a first portion 11 and a second portion 12, which overlap each other and together define a storage space for the battery module. Second portion 12 can be a hollow structure with one end open. First portion 11 can be a plate-like structure, with first portion 11 overlapping the open side of second portion 12, so that the first and second portions 11, 12 together define a storage space. Alternatively, first portion 11 and second portion 12 can each be a hollow structure with one end open, with the open side of first portion 11 overlapping the open side of second portion 12. Of course, housing 10 formed by first portion 11 and second portion 12 can have a variety of shapes, such as a cylinder or a rectangular parallelepiped.

[0063] In the battery 100, a battery module may include multiple battery cells 20. The multiple battery cells 20 may be connected in series, in parallel, or in a hybrid connection. A hybrid connection refers to a combination of series and parallel connections among the multiple battery cells 20. The multiple battery cells 20 may be directly connected in series, in parallel, or in a hybrid connection, and then the entire battery module 20 may be housed within the housing 10. Alternatively, the battery 100 may be constructed by first connecting multiple battery cells 20 in series, in parallel, or in a hybrid connection to form a battery module. The multiple battery modules are then connected in series, in parallel, or in a hybrid connection to form an entire battery module, and then housed within the housing 10. The battery 100 may also include other structures. For example, the battery 100 may include a busbar component for electrically connecting the multiple battery cells 20.

[0064] Each battery cell 20 may be a secondary battery or a primary battery, and may also be a lithium-sulfur battery, a sodium-ion battery, or a magnesium-ion battery, but is not limited thereto. The battery cell 20 may be cylindrical, flat, rectangular, or in other shapes.

[0065] The battery may also include a battery management system (BMS), located within the housing, for monitoring the status of the battery modules. For example, it may monitor at least one of the temperature or voltage of the battery modules. The circuitry within the circuit assembly may collect at least one of the temperature or voltage signals from the battery modules and transmit the collected temperature or voltage signals to the BMS, which serves as a basis for controlling battery safety, battery charging and discharging, and driving safety.

[0066] Please refer to Figure 2, which is a schematic diagram of the exploded structure of a battery cell provided in some embodiments of the present application. A battery cell 20 is the smallest unit that makes up a battery. As shown in Figure 2, a battery cell 20 includes an end cap 21, a housing 22, a cell assembly 23, and other functional components.

[0067] The end cap 21 is a component that covers the opening of the housing 22 to isolate the internal environment of the battery cell 20 from the external environment. The shape of the end cap 21 can be adapted to the shape of the housing 22 to fit the housing 22. The electrode terminal 21a can be used to electrically connect to the battery cell assembly 23 to transmit or receive electrical energy from the battery cell 20.

[0068] The housing 22 is a component that cooperates with the end cap 21 to form the internal environment of the battery cell 20. This internal environment can be used to accommodate the battery cell assembly 23, electrolyte, and other components. The housing 22 can have a variety of shapes and sizes, such as a rectangular parallelepiped, a cylinder, a hexagonal prism, etc. For example, the shape of the housing 22 can be determined based on the specific shape and size of the battery cell assembly 23.

[0069] The battery cell assembly 23 is a component in the battery cell 20 where electrochemical reactions occur. One or more battery cell assemblies 23 may be contained in the shell 22. The battery cell assembly 23 is mainly formed by winding or stacking positive and negative electrode sheets, and a separator is usually provided between the positive and negative electrode sheets. The parts of the positive and negative electrode sheets with active substances constitute the main body of the battery cell assembly, and the parts of the positive and negative electrode sheets without active substances each constitute a tab 23a. The positive and negative electrode tabs may be located together at one end of the main body or respectively at both ends of the main body. During the charge and discharge process of the battery, the positive electrode active substance and the negative electrode active substance react with the electrolyte, and the tabs 23a connect the electrode terminals to form a current loop.

[0070] Referring to Figures 3 to 6, Figure 3 is a schematic diagram of the decomposed structure of the circuit components of some embodiments of the present application; Figure 4 is a schematic diagram of the top-down structure of the circuit components of some embodiments of the present application; Figure 5 is a schematic diagram of the partial top-down structure of the circuit components of some embodiments of the present application; and Figure 6 is an enlarged structural diagram of the dotted box in Figure 5.

[0071] An embodiment of the present application provides a circuit assembly, comprising: a substrate 101, the ends of the substrate 101 being segmented to form a plurality of terminals 101a; and a plurality of circuits disposed on the substrate 101, the plurality of terminals 101a being electrically connected to the plurality of circuits. The circuit assembly further comprises: an adapter 102 having a plurality of mounting slots 103 arranged at intervals. The circuit assembly further comprises: a wiring harness 104, wherein a plurality of wires 1041 in the wiring harness 104 correspond one-to-one with the plurality of mounting slots 103, one end of each wire 1041 being at least partially located in a corresponding mounting slot 103, and the other end of each wire 1041 being connected to an external data port; a plurality of terminals 101a corresponding one-to-one with the plurality of mounting slots 103, the terminals 101a being at least partially located in a corresponding mounting slot 103, and the terminals 101a and wires 1041 located in the same mounting slot 103 being electrically connected.

[0072] Multiple terminals 101a are formed by segmenting the ends of substrate 101. That is, terminals 101a are part of substrate 101, allowing them to serve as output terminals for circuits on substrate 101. Furthermore, because terminals 101a are part of substrate 101, the electrical connection between terminals 101a and the circuits is improved, increasing the rate of transmitted signals within the circuits and maximizing the integrity of transmitted signals, ensuring that signals transmitted to the data port have a high degree of authenticity.

[0073] In some embodiments, dividing the end portion of the substrate 101 may be cutting the end portion of the substrate 101 .

[0074] In some embodiments, the terminals 101a may be arranged at intervals to form a comb-like shape. The terminal 101a may be in a strip shape, such as a rectangle, which increases the area of ​​the terminal 101a and enables a more reliable electrical connection with one end of the wire 1041.

[0075] The terminal 101 a is conductive, and at least one surface of the terminal 101 a is a conductive surface, so that the surface of the terminal 101 a can be electrically connected to the wire 1041 , thereby increasing the area of ​​electrical connection between the terminal 101 a and the wire 1041 .

[0076] In some embodiments, substrate 101 may include a substrate and a conductive film pattern disposed on the substrate, with multiple circuits located on the conductive film pattern. For example, the multiple circuits may be formed on the conductive film pattern through an etching process. The multiple circuits may also be multiple chips soldered to substrate 101. The conductive film pattern includes multiple terminals 101a formed by segmenting the ends of the conductive film layer, so that the terminals 101a are conductive.

[0077] The circuit can be used to form an electrical connection between two electronic devices, collect signals from one electronic device, and transmit the collected signals to the other electronic device. For example, one end of the circuit is connected to terminal 101a, and the other end can be connected to another electronic device to collect signals from the other electronic device and transmit them to a data port via terminal 101a and wire 1041. The data port can be a port for receiving signals on an electronic device other than the electronic device connected to the other end of the circuit, and can include, but is not limited to, any device capable of receiving signals, such as a battery management system.

[0078] In some embodiments, after the circuit collects the signal, it also processes the signal. For example, sampling processing can be performed to convert the received signal into a measurable voltage or current signal, and the measurable voltage or current signal is transmitted to the data port.

[0079] In some embodiments, the substrate 101 may further include insulating film layers covering two opposite surfaces of the conductive film layer. The insulating film layers may protect the circuits on the surfaces of the conductive film layer.

[0080] In some embodiments, in order to make at least one surface of the end portion conductive, before forming the terminal 101a, at least part of the insulating film layer on at least one surface of the end portion of the substrate 101 is peeled off to expose the conductive film layer on one surface of the end portion of the substrate 101.

[0081] In other embodiments, after the end portion of the substrate 101 is divided, at least a portion of the insulating film layer on one surface of the terminal 101 a may be stripped off.

[0082] In some embodiments, the entire insulating film layer on one surface of the terminal 101a can be stripped off so that the entire surface of the terminal 101a is conductive. In other embodiments, a portion of the insulating film layer on one surface of the terminal 101a can be stripped off so that the portion of the surface of the terminal 101a is conductive.

[0083] In some embodiments, the material of the conductive film layer may include but is not limited to metal materials, such as aluminum, copper, or tungsten.

[0084] In some embodiments, the material of the insulating film layer may include but is not limited to polyimide (PI) plastic or polyethylene terephthalate (PET) plastic.

[0085] The plurality of wires 1041 are bundled together to form the wiring harness 104. For example, the plurality of wires 1041 may be bundled together except for both ends so that the ends of the plurality of wires 1041 are separated from each other.

[0086] Since the multiple wires 1041 in the wiring harness 104 are directly electrically connected to the multiple terminals 101a at the end of the substrate 101, and since the wires 1041 and terminals 101a electrically connected to each other are isolated by the installation slots 103 arranged at intervals, they are insulated from each other, thereby enabling multiple circuits to be connected to different data ports respectively, thereby improving the reliability of the communication connection between the data ports and the corresponding circuits. Compared to connecting multiple circuits to multiple data ports using a direct plug-in method, the connection positions of the multiple wires 1041 in the wiring harness 104 and different data ports can be flexibly adjusted, thereby enabling multiple circuits to be connected to corresponding data ports respectively to form a communication connection. In this way, multiple circuits can be used crosswise, improving the flexibility of connecting multiple circuits in the circuit assembly to multiple data ports, thereby improving the flexibility of the connection between the circuit assembly and the electronic devices where the multiple data ports are located.

[0087] It is not difficult to see that because terminal 101a is part of substrate 101 and wire 1041 is directly electrically connected to terminal 101a, that is, wire 1041 is directly electrically connected to the end of substrate 101, thereby connecting the circuit. Compared with the related art that requires the use of a separate connector to extract the circuit's electrical signals, the entire circuit assembly occupies less space. Moreover, by only providing a connector and wiring harness 104, the cost of the circuit assembly is also reduced. While improving the flexibility of the connection between the circuit assembly and other electronic devices, it can also achieve a circuit assembly with a smaller footprint and cost.

[0088] 3 , according to some embodiments of the present application, the adapter 102 includes: a bottom cover 102 a , in which a plurality of mounting slots 103 are disposed; and a top cover 102 b , for covering the bottom cover 102 a .

[0089] The top cover 102b and the bottom cover 102a are covered to define an accommodation space. A plurality of mounting slots 103 are located in the accommodation space, so that the wires 1041 and the terminals 101a located in the mounting slots 103 are located in the accommodation space.

[0090] In some embodiments, the top cover 102b and the bottom cover 102a are detachably connected so that the top cover 102b and the bottom cover 102a are covered. For example, in some embodiments, the top cover 102b and the bottom cover 102a can be connected by bolts.

[0091] For example, in some embodiments, the bottom cover 102a has at least one first mounting hole 41, and the top cover 102b has at least one second mounting hole 42 that matches the first mounting hole 41. Bolts can be inserted into the first mounting hole 41 and the second mounting hole 42 to connect the top cover 102b to the bottom cover 102a.

[0092] In the above technical solution, the terminal 101a and the wire 1041 located in the mounting groove 103 are located within the accommodation space defined by the bottom cover 102a and the top cover 102b, thereby protecting the electrically connected terminal 101a and the wire 1041 and improving the reliability of the electrical connection between the terminal 101a and the wire 1041. In addition, the top cover 102b and the bottom cover 102a also serve as reinforcement, which can greatly reduce the probability of deformation of the terminal 101a and the wire 1041.

[0093] Referring to Figures 3 and 7 to 10, Figure 7 is a schematic diagram of the top view structure of the bottom cover in the circuit assembly of some embodiments of the present application; Figure 8 is a schematic diagram of the side view structure of the bottom cover in the circuit assembly of some embodiments of the present application; Figure 9 is a schematic diagram of the top view structure of the top cover in the circuit assembly of some embodiments of the present application; Figure 10 is a schematic diagram of the side view structure of the top cover in the circuit assembly of some embodiments of the present application.

[0094] According to some embodiments of the present application, the bottom cover 102 a has a plurality of protrusions 30 arranged at intervals along a preset direction X, and the plurality of protrusions 30 are used to define a plurality of mounting grooves 103 .

[0095] The gap between two adjacent protrusions 30 can be used to form a mounting groove 103 .

[0096] In some embodiments, the bottom cover 102a may include a mounting portion 1021 and a receiving portion 1022. The mounting portion 1021 may be located on two opposite sides of the receiving portion 1022 in a predetermined direction X.

[0097] In some embodiments, the height of the mounting portion 1021 is higher than the height of the receiving portion 1022. A plurality of protrusions 30 are located on the surface of the receiving portion 1022, and the mounting portion 1021 is used to connect to the top cover 102b. In order to enable the mounting portion 1021 to better engage with the top cover 102b, the height of the mounting portion 1021 is not lower than the height of the protrusions 30, so that when the bottom cover 102a is covered with the top cover 102b, the surface of the mounting portion 1021 facing the top cover 102b can contact the top cover 102b. The height of the mounting portion 1021, the height of the receiving portion 1022, and the height of the protrusions 30 referred to here can be respectively: the height of the top surface of the mounting portion 1021 compared to the bottom surface of the bottom cover 102a, the height of the top surface of the receiving portion 1022 compared to the bottom surface of the bottom cover 102a, and the height of the top surface of the protrusions 30 compared to the bottom surface of the bottom cover 102a. The top surfaces of the mounting portion 1021 , the receiving portion 1022 and the protrusion 30 are all surfaces facing the top cover 102 b .

[0098] In some embodiments, the height of the mounting portion 1021 can be the same as the height of the protrusion 30, that is, the top surface of the mounting portion 1021 can be flush with the top surface of the protrusion 30. The surface of the top cover 102b facing the mounting portion 1021 can be flat. In this way, when the bottom cover 102a and the top cover 102b are covered, the top surface of the mounting portion 1021 and the top surface of the protrusion 30 are both in contact with the top cover 102b, thereby making the top of the mounting groove 103 between two adjacent protrusions 30 blocked by the top cover 102b, which can better limit the movement of the terminal 101a and the wire 1041 in the mounting groove 103, and greatly reduce the risk of the terminal 101a and the wire 1041 in the mounting groove 103 falling out of the mounting groove 103.

[0099] It is understandable that in other embodiments, the height of the mounting portion 1021 may also be slightly higher than the height of the protrusion 30, and the height difference between the height of the mounting portion 1021 and the height of the protrusion 30 only needs to be sufficient to prevent the terminal 101a and the wire 1041 located in the mounting groove 103 from falling out.

[0100] In some embodiments, the plurality of protrusions 30 may be located only on a portion of the surface of the receiving portion 1022 . For example, the plurality of protrusions 30 may be located in a middle portion of the receiving portion 1022 perpendicular to the preset direction X.

[0101] In some embodiments, the dimension of the mounting groove 103 perpendicular to the predetermined direction X can be greater than or equal to the length dimension of the terminal 101a. This can effectively isolate adjacent terminals 101a even when all terminals 101a are located within the mounting groove 103. The length dimension of the terminal 101a is the dimension of the terminal 101a perpendicular to the arrangement direction of the plurality of terminals 101a, i.e., the dimension of the terminal 101a in the extension direction of the substrate 101.

[0102] In other embodiments, the height of the mounting portion 1021 may be flush with the height of the accommodating portion 1022, and the plurality of mounting slots 103 may be a plurality of grooves located within the accommodating portion 1022, each groove extending perpendicularly to the predetermined direction X. When the top cover 102b and the bottom cover 102a are closed, the mounting portion 1021 and the top surface of the accommodating portion 1022 both contact the top cover 102b, thereby confining the wire 1041 and the terminal 101a located within the mounting slot 103. In some embodiments, each groove may extend perpendicularly to the predetermined direction X from one end of the accommodating portion 1022 to the opposite end. This can reduce deformation of the wire 1041 and the terminal 101a within the mounting slot 103.

[0103] In the above technical solution, mounting grooves 103 are defined between adjacent protrusions 30, and the electrically connected terminals 101a and wires 1041 are isolated by the protrusions 30, thereby reducing the probability of electrical interference between adjacent circuits and improving the reliability of signal transmission in the circuits.

[0104] According to some embodiments of the present application, the substrate 101 is a flexible substrate.

[0105] In other words, the substrate 101 can be easily deformed and can adapt to different installation environments.

[0106] In some embodiments, the substrate 101 includes a conductive film layer, and multiple circuits are located on the surface of the conductive film layer. The conductive film layer can be made of metal foil, thereby making the substrate 101 flexible. The metal foil can be made of copper foil or aluminum foil.

[0107] In some embodiments, the substrate 101 further includes insulating film layers covering two opposite surfaces of the conductive film layer, and the insulating film layers may be made of insulating film material, such as PI film or PET film, etc. In this way, the substrate 101 is flexible as a whole.

[0108] It is understood that in order to adapt the substrate 101 to different installation environments, the substrate 101 is configured to be flexible. This makes the terminals 101a at the ends of the substrate 101 also flexible. Even if the multiple terminals 101a are arranged at intervals, the terminals 101a are easily deformed, which may cause the deformation of the terminals 101a to cause contact between adjacent terminals 101a.

[0109] In order to prevent electrical interference between adjacent circuits and ensure the accuracy of signal transmission, multiple terminals 101a are placed one by one in multiple installation grooves 103, and each terminal 101a is limited. This can solve the problem of electrical contact between adjacent terminals 101a due to the easy deformation of the flexible terminals 101a, which in turn causes electrical interference between adjacent circuits.

[0110] In the above technical solution, the circuit assembly is made flexible and easily adaptable to different installation environments, which improves the flexibility of circuit assembly installation. At the same time, the possibility of electrical contact between adjacent terminals 101a is greatly reduced, thereby improving the reliability of the circuit assembly.

[0111] 3 to 10 , according to some embodiments of the present application, when the adapter 102 includes a bottom cover 102 a and the bottom cover 102 a has a plurality of protrusions 30 arranged at intervals along a preset direction X, the plurality of terminals 101 a are arranged at intervals along the preset direction X.

[0112] The preset direction X may be an extending direction of the bottom cover 102 a . In the case where the bottom cover 102 a includes a mounting portion 1021 and a receiving portion 1022 , the preset direction X may be a direction from the mounting portion 1021 to the receiving portion 1022 .

[0113] The terminals 101a are inserted one by one into the mounting grooves 103 defined by the protrusions 30. Since the arrangement direction of the terminals 101a is consistent with the arrangement direction of the protrusions 30, the protrusions 30 can be located one by one in the gap between two adjacent terminals 101a in the terminals 101a to isolate the two adjacent terminals 101a.

[0114] In the above technical solution, the arrangement direction of the multiple terminals 101a is consistent with the arrangement direction of the multiple protrusions 30, so that the multiple terminals 101a can be neatly positioned one by one in the installation groove 103 and isolated from each other, further reducing the possibility of electrical contact between adjacent terminals 101a.

[0115] Referring to Figures 3, 5 and 6, according to some embodiments of the present application, the wire 1041 includes a first connection end 104a, the terminal 101a includes a second connection end, the second connection end is joined to the first connection end 104a to electrically connect the terminal 101a to the wire 1041, and the joined first connection end 104a and second connection end are both located in the installation groove 103.

[0116] The joined first connection end 104a and second connection end referred to herein refer to the portion where the first connection end 104a and the second connection end are joined together. In this way, the mounting groove 103 isolates the portion where the first connection end 104a and the second connection end are joined together, thereby increasing the isolation area and improving the isolation effect.

[0117] In some embodiments, the first connection end 104a is formed at the end of the wire 1041, and the first connection end 104a is the exposed conductive portion of the wire 1041. The second connection end may be the portion of the terminal 101a that is joined to the first connection end 104a.

[0118] In some embodiments, part of the terminal 101a is joined to the first connection end 104a, and the second connection end may be a portion of the terminal 101a. In other embodiments, the entire terminal 101a is joined to the first connection end 104a, and the entire terminal 101a may constitute the second connection end.

[0119] In some embodiments, the entire first connection end 104 a may be engaged with the second connection end, so that the entire first connection end 104 a is located in the mounting groove 103 .

[0120] In other embodiments, part of the first connection end 104a is engaged with the second connection end, and only the first connection end 104a engaged with the second connection end is located in the mounting groove 103. For example, the first connection end 104a may overlap with the terminal 101a and part of the substrate 101 other than the terminal 101a. The portion of the first connection end 104a that overlaps with the terminal 101a is engaged with the terminal 101a, while the portion of the first connection end 104a that overlaps with the substrate 101 other than the terminal 101a is not engaged with the terminal 101a. For example, only the surface of the terminal 101a in the substrate 101 is a conductive surface, and the surface other than the terminal 101a is an insulating film layer, and the insulating film layer is not engaged with the first connection end 104a. Therefore, the first connection end 104a that overlaps with the substrate 101 other than the terminal 101a may not be located in the mounting groove 103.

[0121] In the above technical solution, the joint portion between the second connection end and the first connection end 104a is located in the mounting groove 103, thereby improving the isolation effect on the joint portion between the adjacent terminals 101a and the adjacent wires 1041, and further reducing the probability of electrical interference between adjacent circuits.

[0122] According to some embodiments of the present application, the second connection end includes a pad, and the first connection end 104 a is bonded to the pad, thereby joining the second connection end.

[0123] The pad is an area of ​​the second connection end used for welding. The first connection end 104a is bonded to the pad, that is, the first connection end 104a is electrically connected to the second connection end through a welding process.

[0124] In some embodiments, the pad can be a conductive area exposed on the surface of the terminal 101a. For example, when the substrate 101 includes a conductive film layer, the conductive area exposed on the surface of the terminal 101a can be the surface of the conductive film layer at the end of the substrate 101. That is, the exposed conductive film surface at the terminal 101a serves as the pad. In one example, one of the surfaces of the terminal 101a is a conductive area. In another example, a portion of one of the surfaces of the terminal 101a serves as a conductive area.

[0125] For another example, the pad may also be a metal sheet additionally formed on the surface of the exposed conductive film layer in the terminal 101 a , such as a copper sheet.

[0126] In some embodiments, the pad may be located on one surface of the second connection end.

[0127] In some embodiments, the orthographic projection of the first connection end 104a on the pad surface is located within the pad, that is, the orthographic projection area of ​​the first connection end 104a on the pad surface is smaller than the area of ​​the pad. This helps improve the reliability of the process of soldering the first connection end 104a to the pad.

[0128] In some embodiments, the pad may be located on a surface of the second connection end facing the top cover 102 b , that is, the pad is located on a surface of the terminal 101 a facing the top cover 102 b .

[0129] In the above technical solution, the first connection end 104a and the second connection end are connected by welding, so that the first connection end 104a and the second connection end are fixedly connected, thereby making it difficult for the first connection end 104a to fall off from the second connection end, thereby improving the reliability of the connection and thus improving the reliability of the circuit component in signal transmission.

[0130] In addition, through the welding connection, the electrical conductivity between the first connection end 104a and the second connection end is good, and the contact resistance after the first connection end 104a and the second connection end are connected is small, which is conducive to signal transmission.

[0131] Referring to Figure 11, which is a partial top view of the circuit assembly of some other embodiments of the present application, it is worth noting that the sealing film layer in Figure 11 is shown with a certain degree of transparency in order to illustrate the positional relationship between the sealing film layer and the first connection end.

[0132] According to some embodiments of the present application, the circuit assembly further includes: a sealing film layer 60 extending along the arrangement direction of the plurality of terminals 101a, the sealing film layer 60 is located on a side of the first connection end 104a away from the second connection end, and at least covers the first connection end 104a.

[0133] Because the first connection terminals 104a are electrically connected to the second connection terminals one by one, the arrangement direction of the plurality of terminals 101a corresponds to the arrangement direction of the plurality of first connection terminals 104a. The sealing film layer 60 extends along the arrangement direction of the plurality of first connection terminals 104a and covers the plurality of first connection terminals 104a, so that the sealing film layer 60 can effectively seal the plurality of first connection terminals 104a.

[0134] In some embodiments, the arrangement direction of the plurality of terminals 101 a is consistent with the arrangement direction of the plurality of mounting slots 103 , both being a preset direction X.

[0135] In some embodiments, the orthographic projection of the first connection end 104a on the surface of the second connection end is located within the surface of the second connection end, that is, after the first connection end 104a is joined with a portion of the second connection end, the surface of the remaining portion of the second connection end is still exposed. In this case, the sealing film layer 60 not only covers the surface of the first connection end 104a, but also covers the exposed surface of the second connection end.

[0136] In some embodiments, the surface of the second connection end has a solder pad, and the first connection end 104a is bonded to the solder pad. The sealing film layer 60 also covers the area after the first connection end 104a and the second connection end are welded, and the joint position between the first connection end 104a and the second connection end is sealed, which can improve the reliability of the joint between the first connection end 104a and the second connection end.

[0137] In some embodiments, the sealing film layer 60 may further cover a portion of the surface of the substrate 101 connected to the terminal 101 a. For example, there may be multiple sealing film layers 60, which are spaced apart and arranged perpendicular to the arrangement direction of the multiple terminals 101 a. One sealing film layer 60 may cover the surfaces of the multiple terminals 101 a, and another sealing film layer 60 may be located on a side of the multiple terminals 101 a away from the wiring harness 104, covering the portion of the surface of the substrate 101 connected to the terminal 101 a.

[0138] In some embodiments, the sealing film layer 60 can be formed on the surface of the first connection end 104a by a dispensing process. In some embodiments, the sealing film layer 60 can be made of glue, which can be made of at least one of epoxy resin, polyurethane, acrylic acid, polyurethane, silicone resin, and the like.

[0139] In the above technical solution, the sealing film layer 60 can seal the first connection end 104a, reduce the damage caused by water vapor or air to the first connection end 104a, maintain the good conductivity of the first connection end 104a, and thus maintain the good electrical connection performance between the first connection end 104a and the second connection end.

[0140] 3 , according to some embodiments of the present application, a wire 1041 includes an electrical conductor and an insulating layer 104 b covering a portion of an outer surface of the electrical conductor, wherein the insulating layer 104 b exposes a first connection end 104 a .

[0141] That is, the first connection end 104a may be an end portion of an electrical conductor.

[0142] An electrical conductor is an object that can conduct electricity. The insulating layer 104b covers the outer surface of the electrical conductor, which can protect and isolate the parts of the wires 1041 that are not used for electrical connection, so that electrical interference will not occur between adjacent wires 1041.

[0143] In some embodiments, the material of the electrical conductor may include but is not limited to metal, such as copper, aluminum, etc.

[0144] In some embodiments, the material of the insulating layer 104b may include, but is not limited to, resin, plastic, silicone rubber, PVC (Polyvinyl chloride), and other insulating materials.

[0145] In some embodiments, the wire 1041 further includes a third connection end, which is the end of the electrical conductor opposite the first connection end 104a. The third connection end is used to electrically connect to an external data port. The insulating layer 104b may also expose the third connection end. It is understood that the insulating layer 104b may cover the outer circumference of the electrical conductor except for the outer circumference of the first connection end 104a and the third connection end.

[0146] In the above technical solution, the insulating layer 104 b can protect the portion of the conductive wire 1041 except the first connection end 104 a and can insulate the portions of adjacent conductive wires 1041 except the first connection end 104 a.

[0147] According to some embodiments of the present application, the entire terminal 101 a constitutes the second connection end.

[0148] That is, the entire terminal 101 a is used to engage with the first connection end 104 a , and the engaged first connection end 104 a and the terminal 101 a are located in the mounting groove 103 .

[0149] In some embodiments, a portion of the first connection end 104 a is joined to the entire terminal 101 a .

[0150] In other embodiments, all of the first connection ends 104 a may be joined to the entire terminal 101 a .

[0151] In the above technical solution, all terminals 101a constitute the second connection end, so that the area of ​​the second connection end and the first connection end 104a joined is larger, which can reduce the contact resistance between the first connection end 104a and the second connection end, thereby ensuring better electrical connection performance between the first connection end 104a and the second connection end.

[0152] Refer to FIG12 , which is a schematic diagram of the exploded structure of circuit components according to other embodiments of the present application.

[0153] According to some embodiments of the present application, the substrate 101 includes a first surface and a second surface relative to each other, the wire 1041 is in electrical contact with the terminal 101a on the first surface, and the circuit component further includes: a first reinforcement layer 105 located on the second surface, and the first reinforcement layer 105 at least covers multiple terminals 101a.

[0154] The first reinforcement layer 105 covers the surface of the terminal 101 a that is not connected to the wire 1041 , exposing the conductive area of ​​the terminal 101 a on the first surface, thereby allowing the wire 1041 to electrically contact the conductive area.

[0155] In some embodiments, substrate 101 includes a conductive film layer and two insulating film layers covering two opposing surfaces of the conductive film layer. Specifically, the two insulating film layers are located on a first surface and a second surface of substrate 101, respectively, and multiple circuits can be formed on the surface of the conductive film layer closer to the first surface. Before forming terminal 101a, the insulating film layer on the first surface of the end portion of substrate 101 can be peeled off, exposing a portion of the conductive film layer surface for subsequent formation of solder pads. The insulating film layer on the second surface of the end portion of substrate 101 is retained, so that one surface of the formed terminal 101a has a solder pad and the other surface has an insulating film layer.

[0156] The first reinforcement layer 105 may cover the surface of the remaining insulating film layer in the terminal 101 a .

[0157] It is understandable that, in some embodiments, the insulating film layers on two opposite surfaces of the terminal 101 a are peeled off, and the first reinforcement layer 105 may also directly cover the surface of the conductive film layer in the terminal 101 a .

[0158] In some embodiments, the first reinforcement layer 105 may be formed on the second surface of the end portion of the substrate 101 before being divided to form the terminals 101 a .

[0159] In some embodiments, the material of the first reinforcement layer 105 may include, but is not limited to, at least one of PI or FR4. It is worth noting that FR4 is a designation for a flame-resistant material grade, indicating that the resin material must be able to self-extinguish after combustion. It is not a material name, but rather a material grade. For example, FR4 can be a composite material comprising epoxy resin, filler, and glass fiber.

[0160] In the above technical solution, the first reinforcement layer 105 can enhance the strength of the terminal 101 a and reduce the probability of warping of the terminal 101 a.

[0161] Continuing to refer to Figure 12, according to some embodiments of the present application, the substrate 101 includes a main body portion 1011 and a folded portion 1012 connected to each other, the folded portion 1012 is bent compared to the main body portion 1011, and the terminal 101a extends from the side of the folded portion 1012 away from the main body portion 1011, and the first reinforcement layer 105 also covers at least a portion of the folded portion 1012 connected to the terminal 101a.

[0162] The main body 1011 can extend perpendicular to the arrangement of the multiple terminals 101a. The folded portion 1012 is bent relative to the main body 1011, and the terminals 101a extend from the folded portion 1012 on a side away from the main body 1011, so that the horizontal plane of the terminals 101a is not at the same level as the horizontal plane of the main body 1011. This creates a height difference between the terminals 101a and the main body 1011. In some embodiments, the input terminals of multiple circuits can be formed in the main body 1011. In the case of a circuit assembly connecting two different electronic devices, the main body 1011 primarily serves to electrically connect to one of the electronic devices to receive signals from it. The terminals 101a primarily serve to connect to the data port of one of the electronic devices to transmit signals from the circuit to the data port. The folded portion 1012 creates a height difference between the terminals 101a and the main body 1011, making it suitable for use in situations where the two electronic devices are not installed at the same level.

[0163] It is understood that the terminals 101a extend from the side of the folded portion 1012 away from the main body 1011, and a boundary line exists between the terminals 101a and the folded portion 1012. The boundary line referred to here is only used to indicate the intersection between the terminals 101a and the folded portion 1012, and does not represent a real structure.

[0164] The folded portion 1012 on one side of the junction is a continuous film layer, while the multiple terminals 101a on the other side of the junction are multiple film layers arranged at intervals. This results in different film tensions on both sides of the junction, making it more susceptible to tearing at the junction. To this end, the first reinforcement layer 105 also covers at least part of the folded portion 1012 connected to the terminals 101a, that is, the first reinforcement layer 105 also covers the junction.

[0165] In the above technical solution, the first reinforcement layer 105 can cover the boundary line between the terminal 101a and the folding portion 1012, thereby increasing the strength and hardness of the location where the boundary line is located, greatly reducing the risk of tearing at the boundary line, improving the stability of multiple terminals 101a connected to one side of the folding portion 1012, reducing the probability of bending at the boundary line, and improving the stability of signal transmission.

[0166] According to some embodiments of the present application, the circuit assembly further includes: a second reinforcement layer, which is located on the first surface and covers at least a portion of the folded portion 1012 connected to the plurality of terminals 101 a .

[0167] It is understandable that, since the folded portion 1012 is directly connected to the terminals 101a, when the substrate 101 is flexible, the folded portion 1012 is easily deformed, thereby causing the terminals 101a directly connected to one side of the folded portion 1012 to deform.

[0168] Based on this, a second reinforcement layer is provided to cover at least part of the folded portion 1012 connected to the terminal 101a, so that the folded portion 1012 connected to the terminal 101a is clamped by the first reinforcement layer 105 and the second reinforcement layer, which can at least enhance the strength and hardness of the folded portion 1012 connected to the terminal 101a and reduce the probability of deformation of the folded portion 1012.

[0169] It is worth noting that the second reinforcement layer may also cover a portion of the surface of the terminal 101a. For example, the second reinforcement layer covers the non-conductive area on the surface of the terminal 101a. In some embodiments, if the surface of the terminal 101a is only partially conductive, the second reinforcement layer may also cover the non-conductive area on the surface of the terminal 101a.

[0170] 13 and 14 , FIG13 is a schematic top view of the folded portion of the circuit assembly of some embodiments of the present application; FIG14 is an enlarged schematic view of the dotted box in FIG13 .

[0171] For example, in some embodiments, the substrate 101 includes a conductive film layer and an insulating film layer, and part of the insulating film layer on the first surface of the terminal 101a is peeled off, that is, part of the insulating film layer is retained on the first surface of the terminal 101a, so that the first surface of the terminal 101a is only partially conductive. The insulating film layer on the first surface of the terminal 101a can be connected to the insulating film layer on the surface of the folded portion 1012. In other words, the insulating film layer on the surface of the folded portion 1012 extends all the way to part of the surface of the terminal 101a, thereby enabling it to cover the boundary between the multiple terminals 101a and the folded portion 1012, thereby enhancing the strength of the boundary position. Then, the second reinforcement layer 106 (as shown in FIG. 14 ) can also cover the surface of the insulating film layer on the surface of the multiple terminals 101a, further enhancing the strength of the boundary between the multiple terminals 101a and the folded portion 1012.

[0172] In some embodiments, the material of the second reinforcement layer may include but is not limited to at least one of PI or FR4 materials.

[0173] In the above technical solution, the second reinforcement layer can expose the surface of the terminal 101a, and while realizing the electrical connection between the terminal 101a and the wire 1041, it enhances the strength of the folded portion 1012 connected to the terminal 101a, reduces the probability of deformation of the folded portion 1012, and further reduces the probability of deformation of the terminal 101a connected thereto due to deformation of the folded portion 1012, so that adjacent terminals 101a can be separated more reliably.

[0174] 12 and 14 , according to some embodiments of the present application, the folding portion 1012 includes: an adjacent first folding portion 1012a and a second folding portion 1012b, the second folding portion 1012b is bent compared to the first folding portion 1012a, and the extension direction of the second folding portion 1012b is the same as the extension direction of the main body 1011, a plurality of terminals 101a extend from a side of the second folding portion 1012b away from the first folding portion 1012a, and the first reinforcement layer 105 and the second reinforcement layer 106 respectively cover two opposite surfaces of the second folding portion 1012b.

[0175] The first folding portion 1012a is connected to the main body 1011 and is bent relative to the main body 1011. The second folding portion 1012b is bent relative to the first folding portion 1012a in a direction parallel to the extension direction of the main body 1011, such that the extension direction of the second folding portion 1012b is the same as the extension direction of the main body 1011. The extension direction of the plurality of terminals 101a is the same as the extension direction of the second folding portion 1012b. In other words, the plurality of terminals 101a and the second folding portion 1012b are located in the same plane.

[0176] That is, the first folded portion 1012 a is used to define a height difference between the main body 1011 and the second folded portion 1012 b , thereby defining a height difference between the plurality of terminals 101 a and the main body 1011 .

[0177] In some embodiments, the first folded portion 1012a may extend in a direction perpendicular to the surface of the main body 1011 compared to the main body 1011 , that is, the extending direction of the first folded portion 1012a is perpendicular to the extending direction of the main body 1011 .

[0178] It can be understood that the first reinforcement layer 105 also covers the surfaces of the multiple terminals 101 a , and the second reinforcement layer 106 can also cover the non-conductive areas on the surfaces of the multiple terminals 101 a .

[0179] In some embodiments, a first reinforcement layer and a second reinforcement layer can be formed at the end of the substrate 101 to impart greater hardness to the end of the substrate 101. Subsequently, the end of the substrate 101 is segmented to form comb-shaped terminals 101a. This can address the issue of the flexible substrate 101 deforming during segmentation, which can lead to the terminal 101a having an undesirable morphology.

[0180] In this way, the first reinforcing layer 105 is formed to have the same shape as the terminals 101a and the second folded portion 1012b. That is, the orthographic projection of the first reinforcing layer 105 on the surfaces of the terminals 101a and the second folded portion 1012b overlaps with the surfaces of the terminals 101a and the second folded portion 1012b.

[0181] The second reinforcing layer 106 is formed to have at least the same shape as the second folded portion 1012b. That is, the orthographic projection of the second reinforcing layer 106 on the surface of the second folded portion 1012b coincides with the surface of the second folded portion 1012b.

[0182] Referring to Figure 11, in some embodiments, the circuit component also includes a sealing film layer 60, which extends along the arrangement direction of the multiple terminals 101a. The sealing film layer 60 is located on the surface of the first connection end 104a away from the terminal 101a, covering the surfaces of the multiple first connection ends 104a electrically connected to the multiple terminals 101a, and is also located on the surface of the second reinforcement layer 106 of at least a portion of the second folded portion 1012b.

[0183] In some embodiments, there can be multiple sealing film layers 60, and the multiple sealing film layers 60 can be arranged at intervals along an arrangement direction perpendicular to the multiple terminals 101a, one sealing film layer 60 can cover the surface of the multiple first connection ends 104a, and another sealing film layer 60 can cover at least part of the surface of the second reinforcement layer 106.

[0184] In the above technical solution, the first folded portion 1012a can define the height difference between the main body 1011 and the second folded portion 1012b, which is suitable for different installation requirements of circuit components. The first reinforcement layer 105 and the second reinforcement layer 106 cover the two opposite surfaces of the second folded portion 1012b, which can enhance the strength of the second folded portion 1012b connected to the terminal 101a, reduce the probability of deformation of the second folded portion 1012b, and enable adjacent terminals 101a to be more reliably separated.

[0185] 4 and 12 , according to some embodiments of the present application, when the adapter 102 includes a bottom cover 102a and a top cover 102b , the second folded portion 1012b is further located in the accommodation space formed by the top cover 102b and the bottom cover 102a .

[0186] In some embodiments, the bottom cover 102a includes a mounting portion 1021 and a receiving portion 1022. The receiving portion 1022 is lower than the mounting portion 1021, and the plurality of protrusions 30 used to form the plurality of mounting grooves 103 may be located only on a portion of the surface of the receiving portion 1022. This allows a receiving space to be formed between the top cover 102b and the surface of the receiving portion 1022 where the plurality of protrusions 30 are not formed after the top cover 102b and the bottom cover 102a are covered. In other words, the second folded portion 1012b may be located in an area of ​​the receiving portion 1022 outside the area where the plurality of protrusions 30 are located.

[0187] 7 , the plurality of protrusions 30 may be arranged along a predetermined direction X. The receiving portion 1022 may include a middle region and side regions of the middle region perpendicular to the predetermined direction X. The side regions are closer to the edge of the bottom cover 102 a than the middle region.

[0188] A plurality of protrusions 30 may be formed in the middle region of the accommodation portion 1022 , so that the plurality of terminals 101 a are located in the middle region of the accommodation portion 1022 and the second folded portion 1012 b is located in the side region of the accommodation portion 1022 .

[0189] Referring to Figure 12, in some embodiments, to enhance the secure fit of the second folded portion 1012b on the bottom cover 102a, the second folded portion 1012b further comprises at least one third mounting hole 43, and the bottom cover 102a comprises at least one mounting post 50 adapted to fit within the third mounting hole 43. The second folded portion 1012b is positioned on the bottom cover 102a, and the third mounting hole of the second folded portion 1012b fits over the outer periphery of the mounting post 50, thereby reducing the risk of the second folded portion 1012b falling off the bottom cover 102a. In some embodiments, the mounting post 50 may be located on the side of the receiving portion 1022.

[0190] In some embodiments, the first reinforcing layer 105 and the second reinforcing layer 106 further cover two opposing surfaces of the second folded portion 1012b. The first reinforcing layer 105 has a fourth mounting hole 44 that is opposite and connected to the third mounting hole 43, and the second reinforcing layer 106 has a fifth mounting hole that is opposite and connected to the third mounting hole 43. The third mounting hole 43, the fourth mounting hole 44, and the fifth mounting hole are all located on the outer periphery of the mounting post 50.

[0191] It is understood that in some embodiments, before welding the first connection end 104a and the second connection end, the second folded portion 1012b and the terminal 101a can be placed on the bottom cover 102a, and then the first connection end 104a of the wire 1041 and the second connection end of the terminal 101a can be welded. After the first connection end 104a and the second connection end are joined, the top cover can be directly closed.

[0192] Therefore, the provision of the third mounting hole 43 and the mounting column can solve the problem of displacement of the second folded portion 1012b and the terminal 101a in the bottom cover 102a during the welding process, so that the first connection end 104a and the second connection end can be accurately docked during the welding process, thereby improving the reliability of the electrical connection between the first connection end 104a and the second connection end.

[0193] In some embodiments, the sealing film layer 60 covers the surfaces of multiple first connection ends 104a away from the terminal 101a and at least part of the surface of the second reinforcement layer 106, so that after the second folded portion 1012b and the first connection end 104a are located in the accommodation space, the sealing film layer 60 can contact the top cover 102b. On the one hand, it can better seal the accommodation space and reduce the entry of water vapor or air into the accommodation space. On the other hand, the sealing film layer 60 also has a certain bonding effect on the top cover 102b, so that the terminal 101a and the wire 1041 can be more firmly located in the accommodation space.

[0194] In the above technical solution, the second folding portion 1012b connected to the terminal 101a and the terminal 101a are located together in the accommodating space, so that the terminal 101a can be located away from the edge of the accommodating space, reducing the probability of the terminal 101a falling out from the gap between the top cover 102b and the bottom cover 102a, so that the terminal 101a can be located more firmly in the accommodating space.

[0195] According to some embodiments of the present application, the circuit assembly further includes: an adhesive layer (not shown) corresponding to at least multiple terminals 101a, the adhesive layer being located on the side of the first reinforcement layer 105 away from the second surface, and the adhesive layer being used to fix the multiple terminals 101a to the bottom of the mounting groove 103.

[0196] That is, the surface of the terminal 101 a with the adhesive layer faces the bottom of the mounting groove 103 , and the adhesive layer contacts the bottom of the mounting groove 103 , thereby causing the terminal 101 a to adhere to the bottom of the mounting groove 103 .

[0197] In some embodiments, the plurality of protrusions 30 located on the surface of the accommodation portion 1022 are used to define a plurality of mounting grooves 103 , and the bottom of the mounting groove 103 may be the surface of the accommodation portion 1022 exposed between adjacent protrusions 30 .

[0198] In some embodiments, the adhesive layer may correspond only to the plurality of terminals 101 a. For example, an orthographic projection of the adhesive layer on the surface of the terminal 101 a may at least partially overlap with the surface of the terminal 101 a.

[0199] In other embodiments, the adhesive layer may also correspond to at least part of the second folded portion 1012b, that is, the positive projection of the adhesive layer on the surface of the second folded portion 1012b may at least partially overlap with the surface of the second folded portion 1012b to enhance the firmness of the terminal 101a in the mounting groove 103.

[0200] In some embodiments, the material of the adhesive layer may include, but is not limited to, any material having an adhesive function, such as a pressure-sensitive adhesive.

[0201] In the above technical solution, the adhesive layer can improve the firmness of the terminal 101a in the mounting groove 103, thereby further reducing the probability of electrical contact between adjacent terminals 101a and improving the reliability of the circuit assembly.

[0202] In addition, since the adhesive layer improves the firmness of the terminal 101a in the installation groove 103, the terminal 101a is not easily displaced during the welding process, which can further improve the accuracy of the connection between the first connection end 104a and the second connection end during the welding process.

[0203] 3 and 4 , according to some embodiments of the present application, a circuit is used to detect a signal from a battery module, and the circuit includes: a detection unit 107 integrated in a substrate 101 , the detection unit 107 including a voltage detection unit or a temperature detection unit; and a sampling circuit (not shown), one end of the sampling circuit being electrically connected to the detection unit 107 , and the other end of the sampling circuit being electrically connected to the terminal 101 a , so that the sampling circuit detects the signal from the battery module through the detection unit 107 .

[0204] The voltage detection unit can monitor the voltage of the battery cell in real time and transmit the voltage signal to the sampling circuit. The sampling circuit connected to the voltage detection unit can be a voltage sampling circuit.

[0205] In some embodiments, multiple detection units in multiple circuits can all be voltage detection units, and the number of voltage detection units can be equal to the number of battery cells in the battery module. Each voltage detection unit can be connected to a corresponding battery cell. For example, the multiple battery cells are connected via a busbar, and each voltage detection unit is electrically connected to the busbar, which can transmit the voltage of the battery cell to the voltage detection unit.

[0206] In some embodiments, the voltage detection unit may be a voltage collection nickel sheet. A plurality of voltage collection nickel sheets may be integrated on the main body 1011 , for example, on two opposite side walls of the main body 1011 .

[0207] The temperature detection unit can detect the temperature of various parts of the battery module to obtain a temperature signal. In other embodiments, multiple detection units in multiple circuits can also be temperature detection units. Different temperature detection units can also detect the temperature of different parts of the same battery cell, thereby enabling real-time monitoring of the temperature of the battery module. The sampling circuit can receive the temperature signal obtained by the temperature detection unit and convert the temperature signal into a measurable voltage or current signal. The sampling circuit connected to the temperature detection unit can be a temperature sampling circuit.

[0208] In some embodiments, the temperature detection unit may be a temperature sensor, which may be an NTC (Negative Temperature Coefficient) thermistor. The resistance of an NTC changes with temperature, and the change in the NTC's resistance can be used to infer the temperature change of the battery cell. A circuit can receive the NTC's resistance value, convert it into a current or voltage signal, and transmit it to a data port.

[0209] In some embodiments, multiple temperature sensors can be integrated into the main body 1011, for example, in the area where the voltage-collecting nickel plate resides. Temperature sensors can be placed directly in the battery cell where the temperature needs to be monitored. Therefore, the main body 1011 can be positioned in correspondence with the battery module.

[0210] In some further embodiments, the detection units in the multiple circuits may also include both multiple voltage detection units and multiple temperature detection units, some of the multiple sampling circuits are connected to the voltage detection units in a one-to-one correspondence, and the remaining sampling circuits in the multiple sampling circuits are connected to the temperature detection units in a one-to-one correspondence.

[0211] Since multiple circuits can be cross-used, it is possible to flexibly adjust multiple voltage detection units or multiple temperature detection units to connect with different sampling circuits, thereby enabling the voltage detection unit to detect the voltage of the battery module at different positions of the battery module, or enabling the temperature detection unit to detect the temperature at different locations of the battery module, thereby realizing different voltage detection requirements or temperature detection requirements, and improving the effectiveness and reliability of detecting the battery module signal.

[0212] The present application also provides a battery comprising: a battery module; the circuit assembly of the aforementioned embodiment, wherein the circuit of the circuit assembly is configured to detect signals from the battery module; and a battery management system, wherein a wiring harness of the circuit assembly is connected to a data port of the battery management system, such that the battery module communicates with the battery management system via the circuit assembly.

[0213] For the description of the battery module and the description of the signal generated by the circuit assembly detecting the battery module, reference may be made to the relevant description in the above embodiments, which will not be repeated below.

[0214] In some embodiments, the battery management system may include at least one plug-in terminal 108 (see FIG4 ), and multiple data ports may be provided in the at least one plug-in terminal 108. The data port may establish a communication connection with a corresponding circuit on the circuit assembly, thereby enabling signals in the circuit to be transmitted through the data port. The battery management system collects the signals transmitted by the data port and may detect signals from the battery module. For example, signals such as the voltage or temperature of the battery module may be detected.

[0215] In some embodiments, the battery may include at least one circuit component, for example, may include one, two, three, or more circuit components.

[0216] Since multiple circuits can be cross-used, the positions of multiple voltage detection units or multiple temperature detection units in the battery module can be flexibly adjusted, so that the voltage detection unit can detect the voltage of the battery module at different positions of the battery module, or the temperature detection unit can detect the temperature at different locations of the battery module, thereby realizing different voltage detection requirements or temperature detection requirements, and improving the effectiveness and reliability of the battery management system in monitoring the battery module.

[0217] The present application also provides a circuit assembly. Referring to Figures 3 to 14 , the circuit assembly includes: a substrate 101, the ends of which are segmented to form a plurality of comb-shaped terminals 101a spaced apart along a predetermined direction X; and a plurality of circuits disposed on the substrate 101, the plurality of terminals 101a being electrically connected to the plurality of circuits. The substrate 101 is a flexible substrate.

[0218] The circuit assembly also includes: an adapter 102, which includes: a bottom cover 102a, the bottom cover 102a having a plurality of protrusions 30 arranged at intervals along a preset direction X, the plurality of protrusions 30 being used to define a plurality of mounting grooves 103; a top cover 102b, which is used to cover the plurality of mounting grooves 103 arranged at intervals with the bottom cover 102a.

[0219] The circuit assembly also includes: a wiring harness 104, wherein multiple wires 1041 in the wiring harness 104 correspond one-to-one to multiple mounting slots 103 and one end of the wire 1041 is at least partially located in the corresponding mounting slot 103, and the other end of the wire 1041 is used to connect to the data port of the battery management system; multiple terminals 101a correspond one-to-one to multiple mounting slots 103 and the terminals 101a are at least partially located in the corresponding mounting slots 103, and the terminals 101a and the wires 1041 located in the same mounting slot 103 are electrically connected through a welding process.

[0220] The wire 1041 includes a first connection end 104 a , and the terminal 101 a includes a second connection end. The second connection end is coupled to the first connection end 104 a to electrically connect the terminal 101 a and the wire 1041 .

[0221] The conductive wire 1041 includes an electrical conductor and an insulating layer 104b covering a portion of the outer circumference of the electrical conductor. The insulating layer 104b exposes the first connecting end 104a.

[0222] The circuit assembly further includes a sealing film layer 60 extending along the arrangement direction of the plurality of terminals 101a. The sealing film layer 60 is located on a side of the first connection end 104a away from the second connection end, covering the first connection end 104a and the welding area between the first connection end 104a and the second connection end. The sealing film layer 60 can be formed using a dispensing process.

[0223] The substrate 101 includes a main body 1011 and a folded portion 1012. The folded portion 1012 is bent relative to the main body 1011 and includes a first folded portion 1012a and a second folded portion 1012b. The second folded portion 1012b is bent relative to the first folded portion 1012a and extends in the same direction as the main body 1011. A plurality of terminals 101a extend from a side of the second folded portion 1012b away from the first folded portion 1012a. The second folded portion 1012b is also located in a receiving space formed by the top cover 102b and the bottom cover 102a.

[0224] The circuit assembly further includes a first reinforcing layer 105 and a second reinforcing layer 106. The first reinforcing layer 105 is located on the second surface, and the second reinforcing layer 106 is located on the first surface. The first reinforcing layer 105 covers the plurality of terminals 101a and the second folded portion 1012b, while the second reinforcing layer 106 covers the second folded portion 1012b and the non-conductive area on the surface of the terminal 101a.

[0225] The circuit assembly further includes an adhesive layer located on a side of the first reinforcement layer 105 away from the first surface. The adhesive layer is used to fix the plurality of terminals 101a and the second folded portion 1012b to the bottom of the mounting groove 103. The adhesive layer may be a pressure-sensitive adhesive.

[0226] The circuit is used to detect the signal of the battery module. The circuit includes: a detection unit 107 integrated into the substrate, the detection unit 107 includes at least one of a voltage detection unit or a temperature detection unit; a sampling circuit, one end of the sampling circuit is electrically connected to the detection unit, and the other end of the sampling circuit is electrically connected to the terminal 101a, so that the sampling circuit detects the signal of the battery module through the detection unit.

[0227] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A circuit assembly comprising: a substrate having ends divided to form a plurality of terminals; a plurality of circuits disposed on the substrate, the plurality of terminals being electrically connected to the plurality of circuits; An adapter having a plurality of installation slots arranged at intervals; a wiring harness, wherein a plurality of wires in the wiring harness correspond one-to-one to the plurality of mounting slots, one end of the wires being at least partially located in the corresponding mounting slot, and the other end of the wires being used to connect to an external data port; The plurality of terminals correspond to the plurality of mounting slots one by one and the terminals are at least partially located in the corresponding mounting slots. The terminals and wires located in the same mounting slot are electrically connected.

2. The circuit assembly according to claim 1, wherein The adapter comprises: a bottom cover, wherein the plurality of mounting slots are provided in the bottom cover; The top cover is used to cover the bottom cover.

3. The circuit assembly according to claim 2, wherein: The bottom cover has a plurality of protrusions arranged at intervals along a preset direction, and the plurality of protrusions are used to define the plurality of installation slots.

4. The circuit assembly according to any one of claims 1 to 3, wherein: The substrate is a flexible substrate.

5. The circuit assembly according to any one of claims 1 to 4, wherein: In a case where the adapter includes a bottom cover and the bottom cover has a plurality of protrusions arranged at intervals along a preset direction, the plurality of terminals are arranged at intervals along the preset direction.

6. The circuit assembly according to any one of claims 1 to 5, wherein: The wire includes a first connection end, and the terminal includes a second connection end. The second connection end is joined with the first connection end to electrically connect the terminal to the wire. The joined first connection end and the second connection end are both located in the installation groove.

7. The circuit assembly according to claim 6, wherein: The second connection end includes a pad, and the first connection end is bonded to the pad, thereby joining the second connection end.

8. The circuit assembly according to claim 7, wherein: The circuit assembly further includes: a sealing film layer extending along the arrangement direction of the plurality of terminals, the sealing film layer being located on a side of the first connection end away from the second connection end and covering at least the first connection end.

9. The circuit assembly according to claim 7, wherein: The conductive wire includes an electrical conductor and an insulating layer covering a portion of an outer circumference of the electrical conductor, wherein the insulating layer exposes the first connecting end.

10. The circuit assembly according to claim 6, wherein The entire terminal constitutes the second connection end.

11. The circuit assembly according to any one of claims 1 to 10, wherein: The substrate includes a first surface and a second surface opposite to each other. The wire is in electrical contact with the terminals on the first surface. The circuit component further includes a first reinforcement layer located on the second surface. The first reinforcement layer at least covers the multiple terminals.

12. The circuit assembly according to claim 11, wherein The substrate includes a main body portion and a folded portion connected to each other. The folded portion is bent compared to the main body portion. The terminal extends from a side of the folded portion away from the main body portion. The first reinforcement layer also covers at least a portion of the folded portion connected to the terminal.

13. The circuit assembly of claim 12, wherein: The circuit assembly further includes a second reinforcement layer, which is located on the first surface and covers at least a portion of the folded portion connected to the plurality of terminals.

14. The circuit assembly of claim 13, wherein: The folding portion includes: an adjacent first folding portion and a second folding portion, the second folding portion is bent compared to the first folding portion, and the extension direction of the second folding portion is the same as the extension direction of the main body portion, the multiple terminals extend from the side of the second folding portion away from the first folding portion, and the first reinforcement layer and the second reinforcement layer respectively cover two opposite surfaces of the second folding portion.

15. The circuit assembly of claim 14, wherein: In the case where the adapter includes a bottom cover and a top cover, the second folding portion is also located in the accommodating space formed by the top cover and the bottom cover.

16. The circuit assembly according to any one of claims 11 to 15, wherein: The circuit assembly further includes: an adhesive layer corresponding to at least the plurality of terminals, the adhesive layer being located on a side of the first reinforcement layer away from the second surface, and being used to fix the plurality of terminals to the bottom of the mounting groove.

17. The circuit assembly according to any one of claims 1 to 16, wherein: The circuit is used to detect the signal of the battery module, and the circuit includes: a detection unit integrated into the substrate, the detection unit comprising a voltage detection unit or a temperature detection unit; A sampling circuit, one end of the sampling circuit is electrically connected to the detection unit, and the other end of the sampling circuit is electrically connected to the terminal, so that the sampling circuit detects the signal of the battery module through the detection unit.

18. A battery comprising: Battery modules; The circuit assembly according to any one of claims 1 to 17, wherein the circuit of the circuit assembly is used to detect a signal from the battery module; A battery management system, wherein the wiring harness of the circuit assembly is connected to a data port of the battery management system so that the battery module is communicatively connected with the battery management system through the circuit assembly.

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