Display substrate and manufacturing method therefor

Abstract

Disclosed are a display substrate and a manufacturing method therefor. The display substrate comprises: a driving backplane; a plurality of light-emitting devices arranged on the driving backplane; and a deformable layer arranged on the side of the plurality of light-emitting devices distant from the driving backplane, wherein the orthographic projection of the deformable layer on the driving backplane overlaps the orthographic projection of each light-emitting device on the driving backplane.

Description

Display substrate and manufacturing method thereof Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof. Background Art

[0002] With the development of display technology, LED (mini Light-Emitting Diode) display substrates are becoming the most advantageous next-generation display media due to their advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle, and stable and reliable operation. LED display substrates include multiple LED light-emitting chips arranged in an array. The research and development of LED light-emitting chips, especially mini-LED and micro-LED light-emitting chips, has become a major issue in the display field. Summary of the Invention

[0003] The present disclosure provides a display substrate and a manufacturing method thereof.

[0004] The present disclosure provides a display substrate, comprising:

[0005] Driver backplane;

[0006] A plurality of light-emitting devices are arranged on the driving backplane;

[0007] The deformable layer is arranged on a side of the plurality of light-emitting devices away from the driving backplane, and the deformable layer overlaps with an orthographic projection of each of the light-emitting devices on the driving backplane.

[0008] In some embodiments, the deformable layer is made of elastic material.

[0009] In some embodiments, the material of the deformable layer includes acrylic resin or silicone resin.

[0010] In some embodiments, the thickness of the deformable layer is between 2 μm and 50 μm.

[0011] In some embodiments, the orthographic projection of the deformable layer on the driving backplane covers the orthographic projection of the light-emitting device on the driving backplane.

[0012] In some embodiments, the deformable layer includes a plurality of elastic portions arranged at intervals, and the elastic portions correspond to the light-emitting devices one by one.

[0013] In some embodiments, an orthographic projection of the deformable layer on the driving backplane and an orthographic projection of the light-emitting device on the driving backplane have a first overlapping region, and the first overlapping region is only located at an edge of the light-emitting device.

[0014] In some embodiments, the first overlapping region is annular in shape;

[0015] The first overlapping region extends along an edge of the light emitting device.

[0016] In some embodiments, the minimum width of the ring is greater than or equal to 3 μm.

[0017] In some embodiments, the deformable layer is a first dark film layer, which is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device;

[0018] Wherein, the transmittance of the first dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

[0019] In some embodiments, the display substrate further comprises a second dark film layer, the second dark film layer being located on a side of the deformable layer away from the plurality of light-emitting devices; the second dark film layer being configured to transmit a portion of the light emitted by the light-emitting devices and absorb a portion of the light emitted by the light-emitting devices; the color of the light transmitted through the light-emitting devices being the same as the color of the light emitted by the light-emitting devices;

[0020] Wherein, the transmittance of the second dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

[0021] In some embodiments, the second dark film layer is a continuously distributed film layer;

[0022] At least a portion of the orthographic projection of the light-emitting device on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.

[0023] In some embodiments, an orthographic projection of the second dark film layer on the driving backplane and an orthographic projection of the light-emitting device on the driving backplane have a second overlapping area, and the second overlapping area is only located at an edge of the light-emitting device.

[0024] In some embodiments, the orthographic projection of the deformable layer on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.

[0025] In some embodiments, the display substrate further comprises a third dark film layer located on a side of the light-emitting device away from the driving backplane, wherein the third dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device, and the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device;

[0026] The transmittance of the third dark film layer to the light emitted by the light emitting device is between 20% and 75%; the third dark film layer has openings corresponding to the light emitting devices one by one, and the orthographic projection of the openings on the driving backplane overlaps with the orthographic projection of the light emitting device on the driving backplane;

[0027] At least a portion of the deformable layer is located inside the opening.

[0028] In some embodiments, the deformable layer includes a plurality of elastic portions that are spaced apart from each other, and the elastic portions are located in the openings.

[0029] In some embodiments, the display substrate further includes an adhesive layer located between the deformable layer and the light-emitting device, and the adhesive layer is fixedly connected to the deformable layer and the light-emitting device respectively.

[0030] In some embodiments, the adhesive layer is a flexible adhesive layer.

[0031] In some embodiments, the material of the deformable layer is a viscous material.

[0032] In some embodiments, the deformable layer is a fourth dark film layer, and the fourth dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitting through the light-emitting device is the same as the color of the light emitted by the light-emitting device;

[0033] Wherein, the transmittance of the fourth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

[0034] In some embodiments, the display substrate further includes a cover plate located on a side of the deformable layer away from the light-emitting device.

[0035] In some embodiments, the display substrate further comprises a cover plate located on a side of the deformable layer away from the light-emitting device, wherein the cover plate is a dark cover plate configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the dark cover plate is the same as the color of the light emitted by the light-emitting device;

[0036] The transmittance of the dark cover plate to the light emitted by the light-emitting device is between 20% and 75%.

[0037] In some embodiments, the display substrate further includes: a cover plate located on a side of the deformable layer away from the light-emitting device; a fifth dark film layer located on a side of the cover plate away from the light-emitting device, the fifth dark film layer being configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitting through the light-emitting device is the same as the color of the light emitted by the light-emitting device; wherein the transmittance of the fifth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

[0038] The present disclosure also provides a method for manufacturing a display substrate, comprising:

[0039] forming a deformable layer on the carrier plate;

[0040] forming a plurality of light-emitting devices on a side of the deformable layer away from the carrier plate;

[0041] The carrier plate is arranged opposite to the driving back plate, and pressure is applied to the carrier plate to bond the plurality of light-emitting devices to the driving back plate.

[0042] In some embodiments, the step of forming a plurality of light-emitting devices on a side of the deformable layer away from the carrier plate includes: forming a plurality of light-emitting devices on a substrate; and transferring the plurality of light-emitting devices to the carrier plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0044] FIG1 is a schematic diagram of a first structure of a display substrate provided in some embodiments of the present disclosure.

[0045] FIG2 is a schematic diagram of a second structure of a display substrate provided in some embodiments of the present disclosure.

[0046] FIG3 is a schematic diagram of a third structure of a display substrate provided in some embodiments of the present disclosure.

[0047] FIG4 is a schematic diagram of a fourth structure of a display substrate provided in some embodiments of the present disclosure.

[0048] FIG5 is a schematic diagram of a fifth structure of a display substrate provided in some embodiments of the present disclosure.

[0049] FIG6 is a sixth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0050] FIG. 7 is a schematic diagram of a seventh structure of a display substrate provided in some embodiments of the present disclosure.

[0051] FIG8 is a schematic top view of a deformable layer and a plurality of light-emitting devices provided in some embodiments of the present disclosure.

[0052] FIG9 is a schematic diagram of an eighth structure of a display substrate provided in some embodiments of the present disclosure.

[0053] FIG10A is a ninth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0054] FIG10B is a schematic diagram of a tenth structure of a display substrate provided in some embodiments of the present disclosure.

[0055] FIG11A is a schematic diagram of an eleventh structure of a display substrate provided in some embodiments of the present disclosure.

[0056] FIG11B is a schematic diagram of a twelfth structure of a display substrate provided in some embodiments of the present disclosure.

[0057] FIG12 is a thirteenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0058] FIG13 is a schematic diagram of the fourteenth structure of a display substrate provided in some embodiments of the present disclosure.

[0059] FIG14 is a schematic diagram of a fifteenth structure of a display substrate provided in some embodiments of the present disclosure.

[0060] FIG15 is a schematic diagram of the sixteenth structure of a display substrate provided in some embodiments of the present disclosure.

[0061] FIG16 is a schematic diagram of the seventeenth structure of a display substrate provided in some embodiments of the present disclosure.

[0062] FIG17 is a schematic diagram of the eighteenth structure of a display substrate provided in some embodiments of the present disclosure.

[0063] FIG18 is a nineteenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0064] FIG19 is a schematic diagram of the twentieth structure of a display substrate provided in some embodiments of the present disclosure.

[0065] FIG20 is a twenty-first structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0066] FIG21 is a schematic diagram of the twenty-second structure of a display substrate provided in some embodiments of the present disclosure.

[0067] FIG22 is a schematic diagram of a method for manufacturing a display substrate provided in some embodiments of the present disclosure.

[0068] FIG23 is a schematic diagram of a method for manufacturing a display substrate provided in other embodiments of the present disclosure. DETAILED DESCRIPTION

[0069] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0070] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0071] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should have the usual meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0072] As used herein, "parallel" and "perpendicular" include the conditions described and conditions similar to the conditions described, and the range of the similar conditions is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range for approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range for approximate perpendicularity can also be, for example, a deviation within 5°.

[0073] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0074] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0075] The typical method for manufacturing a light-emitting diode (LED) display substrate involves first forming LED chips on a carrier board, then transferring the multiple LED chips from the carrier board to a driver backplane using mass transfer technology, and finally bonding the multiple LED chips to the driver substrate. During the bonding process, high voltage must be applied to the carrier board. However, when a large number of LED chips are placed on the carrier board, the pressure applied to the LED chips at different locations can vary, resulting in poor bonding between some LED chips and the driver backplane.

[0076] 1 to 13 illustrate various structural schematic diagrams of a display substrate provided in some embodiments of the present disclosure. As shown in FIG1 to 13 , the display substrate includes: a driving backplane 10 , a plurality of light-emitting devices 20 and a deformable layer 30 .

[0077] In some examples, the light-emitting device 20 may be a light-emitting diode chip. The light-emitting device 20 includes a light-emitting body 23 and an electrode structure electrically connected to the light-emitting body 23. The electrode structure includes a first electrode 21 and a second electrode 22. The light-emitting body 23 may include a first semiconductor layer, a second semiconductor layer, and a light-emitting layer located therebetween. Multiple light-emitting devices 20 are disposed on a driving backplane 10 and configured to emit light when driven by the driving backplane 10. For example, the driving backplane 10 includes a base substrate 11 and multiple driving circuits 12 located on the base substrate 11. Each driving circuit 12 is electrically connected to the light-emitting device 20 via a gasket, thereby driving the light-emitting device 20 to emit light. For example, a planarization layer is provided on the side of the driving circuit 12 facing away from the base substrate 11. The first electrode 21 is bonded to a first gasket 15, which is electrically connected to the driving circuit 12 via a via in the planarization layer 13. The second electrode 22 is bonded to a second gasket 14, which is electrically connected to the driving circuit 12 via a via in the planarization layer 13.

[0078] The deformable layer 30 is disposed on a side of the plurality of light-emitting devices 20 away from the driving backplane 10, and the deformable layer 30 overlaps with the orthographic projection of each light-emitting device 20 on the driving backplane 10. The deformable layer 30 is a film layer that can deform when subjected to pressure.

[0079] In the embodiment of the present disclosure, since a deformable layer 30 is provided on the side of the multiple light-emitting devices 20 away from the driving backplane 10, and the deformable layer 30 overlaps with the positive projection of the light-emitting device 20, the deformable layer 30 can provide a certain buffering effect in the bonding process between the light-emitting device 20 and the driving backplane 10, so that the pressure received by the light-emitting devices 20 at different positions is more uniform, thereby improving the bonding yield of each light-emitting device 20 and the driving backplane 10.

[0080] In some embodiments, the deformable layer 30 is made of an elastic material, wherein the elastic material refers to a material that can generate elastic restoring force when subjected to stress, that is, the deformation of the deformable layer 30 is reversible.

[0081] In some embodiments, the elastic material has an elastic recovery rate of 85% or more, so that the deformable layer 30 has a high deformation recovery ability, thereby improving the pressure buffering effect of the deformable layer 30. For example, the elastic material has an elastic recovery rate of 90% or more, or 95% or more.

[0082] For example, the material of the deformable layer 30 includes acrylic system resin or silicone system resin.

[0083] In some embodiments, the thickness of the deformable layer 30 is between 2 and 50 μm. The thicker the deformable layer 30, the better the cushioning effect of the pressure during bonding, thereby improving the bonding yield rate of the light-emitting device 20 and the driver backplane 10 at each location. The thinner the deformable layer 30, the smaller the overall thickness of the display substrate, which is more conducive to a thinner and lighter display product. In the disclosed embodiment, setting the thickness of the deformable layer 30 between 2 and 50 μm ensures that the deformable layer 30 has a good cushioning effect while achieving a smaller overall thickness of the display substrate. Furthermore, setting the thickness of the deformable layer 30 between 5 and 30 μm ensures a further thinner and lighter display substrate while ensuring a good bonding yield rate of the light-emitting device 20 and the driver backplane 10. Furthermore, setting the thickness of the deformable layer 30 between 10 and 20 μm ensures a minimum thickness of the display substrate while ensuring a good bonding yield rate of the light-emitting device 20 and the driver backplane 10. For example, the thickness of the deformable layer 30 is between 10 and 12 μm, or between 12 and 15 μm, or between 15 and 20 μm.

[0084] In some embodiments, the orthographic projection of the deformable layer 30 on the driving backplane 10 covers the orthographic projection of the light emitting device 20 on the driving backplane 10 , so that the pressure at each position of the single light emitting device 20 is evenly distributed.

[0085] For example, as shown in FIG. 1 and FIG. 2 , the deformable layer 30 may be a continuous whole film layer, that is, there are no openings or gaps on the deformable layer 30 .

[0086] For another example, as shown in Figures 3 to 5, the deformable layer 30 includes a plurality of elastic portions arranged at intervals, the elastic portions corresponding to the light-emitting devices 20 one-to-one, and the orthographic projection of each elastic portion on the driving backplane 10 covers the orthographic projection of the corresponding light-emitting device 20 on the driving backplane 10.

[0087] In other embodiments, as shown in Figures 6, 7, and 9, the orthographic projection of the deformable layer 30 on the driver backplane 10 only covers a portion of the orthographic projection of the light-emitting device 20 on the driver backplane 10. Specifically, Figure 8 is a top view schematic diagram of the deformable layer 30 and multiple light-emitting devices 20 provided in some embodiments of the present disclosure. As shown in Figure 8, the orthographic projection of the deformable layer 30 on the driver backplane 10 and the orthographic projection of the light-emitting device 20 on the driver backplane 10 have a first overlapping region, and the first overlapping region is only located at the edge of the light-emitting device 20. In other words, the deformable layer 30 is provided with a plurality of holes, and the orthographic projection of each hole on the driver backplane 10 is located within the orthographic projection range of a light-emitting device 20 on the driver backplane 10, and is spaced apart from the edge of the orthographic projection of the light-emitting device 20. In this case, the deformable layer 30 can also make each light-emitting device 20 be subjected to uniformly distributed pressure, and since the positive projection of the deformable layer 30 only covers the edge part of the positive projection of the light-emitting device 20, the obstruction of the deformable layer 30 on the light emitted by the light-emitting device 20 can be reduced, thereby improving the light extraction efficiency of the light-emitting device 20.

[0088] In some embodiments, the first overlapping region is annular. The first overlapping region extends along the edge of the light-emitting device 20. The annular shape depends on the shape of the surface of the light-emitting device 20 away from the driver backplate 10. For example, if the surface of the light-emitting device 20 away from the driver backplate 10 is circular, the first overlapping region may be annular. For another example, if the surface of the light-emitting device 20 away from the driver backplate 10 is rectangular, the first overlapping region may be a rectangular ring (i.e., a U-shaped ring).

[0089] In one example, the minimum width at different locations within the ring is greater than or equal to 3 μm, ensuring that the deformable layer 30 covers the edge of the light-emitting device 20 even with process errors. When the ring is rectangular, that is, the distance between the straight line edge of the outer edge and the straight line edge of the inner edge of the ring is greater than or equal to 3 μm. The upper limit of the minimum width can be set based on actual needs, but it should ensure that the deformable layer 30 does not completely cover the light-emitting device 20. For example, the minimum width at different locations within the ring is 3 μm, 4 μm, or 5 μm.

[0090] In some embodiments, as shown in Figures 2 to 10B, the deformable layer 30 is a film layer with a high visible light transmittance (for example, more than 90%) and is visually transparent. In this case, the display substrate may further include a second dark film layer 50. For example, as shown in Figures 2 to 9, the second dark film layer 50 is located on the side of the deformable layer 30 away from the multiple light-emitting devices 20, or, as shown in Figures 10A and 10B, the second dark film layer 50 is located on the side of the deformable layer 30 close to the multiple light-emitting devices 20. The second dark film layer 50 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20; the color of the light transmitting the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. By providing the second dark film layer 50, the surface of the display substrate can be made dark when not displaying.

[0091] Specifically, the second dark film layer 50 may be a film having a low transmittance (for example, a transmittance between 20% and 75%) to the light emitted by the light emitting device 20 and visually appearing to be a dark color such as black or dark gray.

[0092] In one example, as shown in Figures 2 to 7, 10A, and 10B, the second dark film layer 50 may be a continuously distributed film layer, and at least a portion of the orthographic projections of the light-emitting devices 20 on the driver backplane 10 are located within the orthographic projections of the second dark film layer 50 on the driver backplane 10. The term "continuously distributed film layer" herein means that there are no openings or gaps in the film layer.

[0093] In another example, as shown in Figure 9, the second dark film layer 50 is a discontinuously distributed film layer. Specifically, there is a second overlapping area between the orthographic projection of the second dark film layer 50 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10. The second overlapping area is only located at the edge of the light-emitting device 20, thereby reducing the obstruction of the second dark film layer 50 on the light emitted by the light-emitting device 20 and improving the light extraction efficiency of the light-emitting device 20.

[0094] For example, the second overlapping region is annular. The second overlapping region extends along the edge of the light-emitting device 20. The annular shape here depends on the shape of the surface of the light-emitting device 20 away from the driver backplane 10. For example, if the surface of the light-emitting device 20 away from the driver backplane 10 is circular, the second overlapping region can be annular. For another example, if the surface of the light-emitting device 20 away from the driver backplane 10 is rectangular, the second overlapping region can be a rectangular ring (i.e., a U-shaped). The minimum width of the annular second overlapping region can be greater than or equal to 3μm.

[0095] For example, as shown in Figure 9, when the second dark film layer 50 is a discontinuously distributed film layer, the orthographic projection of the second dark film layer 50 on the driving backplane 10 can overlap with the orthographic projection of the spacing area between adjacent light-emitting devices 20 on the driving backplane 10, thereby reducing the light crosstalk between adjacent light-emitting devices 20.

[0096] For example, when the second dark film layer 50 is a continuously distributed film layer or a discontinuously distributed film layer, the orthographic projection of the deformable layer 30 on the driver backplane 10 is located within the orthographic projection of the second dark film layer 50 on the driver backplane 10. Of course, when the second dark film layer 50 is a discontinuously distributed film layer, the orthographic projection of the deformable layer 30 on the driver backplane 10 may also exceed the orthographic projection of the second dark film layer 50 on the driver backplane 10. For example, as shown in FIG9 , the orthographic projections of the deformable layer 30 and the second dark film layer 50 on the driver backplane 10 overlap, so that the deformable layer 30 and the second dark film layer 50 can be patterned using the same patterning process during the manufacturing process, simplifying the process.

[0097] The embodiments shown in Figures 1 to 10B illustrate the case where the deformable layer 30 is a transparent film layer. However, in other embodiments, such as those shown in Figures 11A and 11B, the deformable layer 30 is a first dark film layer 301. The first dark film layer 301 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. That is, the deformable layer 30 does not change the color of the light when transmitting a portion of the light from the light-emitting device 20. In this case, the second dark film layer 50 is not required.

[0098] The first dark film layer 301 may be a film having a low transmittance to visible light (e.g., not exceeding 75%) and visually appearing dark in color such as black or dark gray. The first dark film layer 301 may include a matrix of elastic material and a black pigment doped in the matrix.

[0099] For example, as shown in FIG11A , the first dark film layer 301 can be a continuously distributed film layer, thereby making the surface of the display substrate appear dark when not displaying. For another example, as shown in FIG11B , the first dark film layer 301 is a discontinuously distributed film layer, and the orthographic projection of the first dark film layer 301 on the driver backplane 10 can overlap with the orthographic projection of the spacing region between adjacent light-emitting devices 20 on the driver backplane 10, thereby reducing crosstalk between the light emitted by adjacent light-emitting devices 20. Furthermore, the orthographic projection of the first dark film layer 301 on the driver backplane 10 in FIG11B can have a first overlapping region with the orthographic projection of the light-emitting device 20 on the driver backplane 10. For details, please refer to the description of FIG7 above.

[0100] In some further embodiments, as shown in FIG12 , the display substrate may further include a third dark film layer 51 in addition to a plurality of light-emitting devices 20 and a deformable layer 30. The third dark film layer 51 is located on a side of the plurality of light-emitting devices 20 away from the driving backplane 10. The third dark film layer 51 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light passing through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20, that is, the third dark film layer 51 does not change the color of the light when transmitting part of the light from the light-emitting device 20.

[0101] In Figure 12, the third dark film layer 51 has openings corresponding one to one with the light-emitting devices 20, and the orthographic projections of the openings on the driver backplane 10 overlap with the orthographic projections of the light-emitting devices 20 on the driver backplane 10. At least a portion of the deformable layer 30 is located within the openings.

[0102] For example, a portion of the deformable portion is located inside the opening, and another portion is located on a side of the third dark film layer 51 facing the driving backplane 10 .

[0103] For another example, as shown in Figure 12 , the deformable layer 30 includes a plurality of elastic portions 31 spaced apart from each other, with the elastic portions 31 located within the opening. Figure 12 illustrates an example where the thickness of the deformable layer 30 is equal to the thickness of the third dark film layer 51 . Of course, in other examples, the thickness of the elastic portion 31 may also be less than or greater than the thickness of the third dark film layer 51 .

[0104] Optionally, in the above embodiments, as shown in Figures 1 to 7 and Figures 8 to 12, the display substrate may further include an adhesive layer 40 located between the deformable layer 30 and the light-emitting device 20, and the adhesive layer 40 is fixedly connected to the deformable layer 30 and the light-emitting device 20, respectively, to ensure the connection stability between the light-emitting device 20 and the deformable layer 30, so that when the deformable layer 30 is subjected to pressure, the pressure can be evenly dispersed.

[0105] It should be noted that the "fixed connection" here can be a direct fixed connection or an indirect fixed connection. For example, as shown in Figures 1 to 7 and 9, the bonding layer 40 can be fixedly connected to the deformable layer 30 and the light-emitting device 20, respectively. For another example, as shown in Figures 10A and 10B, the second dark film layer 50 is located on the side of the deformable layer 50 close to the multiple light-emitting devices 20, and the bonding layer 40 is directly connected to the light-emitting device 20 and the second dark film layer 50, respectively, thereby indirectly connected to the deformable layer 30. In one example, as shown in Figures 1 and 2, the deformable layer 30 is a continuously distributed film layer. In this case, the bonding layer 40 can be a continuously distributed film layer to facilitate the formation of the bonding layer 40.

[0106] In another example, in Figures 4 and 5, the deformable layer 30 includes a plurality of elastic portions 31 spaced apart, and the adhesive layer 40 may be a continuously distributed film layer to facilitate the formation of the adhesive layer 40. For example, as shown in Figure 4, a portion of the adhesive layer 40 is located on the surface of the elastic portion 31 facing the drive back plate 10, and another portion is located in the spacing region between adjacent elastic portions 31, and the adhesive layer 40 is formed into a flat surface facing the drive back plate 10. For another example, as shown in Figure 5, the adhesive layer is relatively thin, so that a first portion of the adhesive layer 40 is located on the surface of the elastic portion 31 facing the drive back plate 10, and a second portion is located in the spacing region between adjacent elastic portions 31, and the second portion is a curved structure that bends away from the drive back plate 10.

[0107] In another example, as shown in FIG3 and FIG13 , the deformable layer 30 includes a plurality of elastic portions 31 spaced apart from each other, and the adhesive layer 40 includes adhesive portions 41 corresponding one to one with the elastic portions 31. The orthographic projections of the adhesive portions 41 on the driver backplane 10 are within the orthographic projections of the elastic portions 31 on the driver backplane 10, thereby reducing the blocking of light emitted by the adhesive layer 40 on the light emitting device 20 and ensuring the light extraction efficiency of the light emitting device 20. For example, the orthographic projections of the adhesive portions 41 and the corresponding elastic portions 31 on the driver backplane 10 overlap or substantially overlap, thereby ensuring the stability of the connection between the elastic portions 31 and the light emitting device 20 and reducing the impact of the adhesive layer 40 on the light emission of the light emitting device 20.

[0108] In another example, as shown in Figure 6, there is a first overlapping area between the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10, and the first overlapping area is only located at the edge of the light-emitting device 20. At this time, the orthographic projection of the adhesive layer 40 on the driving backplane 10 can be located within the range of the orthographic projection of the deformable layer 30 on the driving backplane 10. For example, the orthographic projections of the adhesive layer 40 and the deformable layer 30 on the driving backplane 10 coincide or basically coincide.

[0109] Optionally, the thickness of the adhesive layer 40 located on the side of the formable layer 30 facing the light emitting device 20 is between 0.5 and 20 microns, thereby ensuring the bonding effect while reducing the impact of the adhesive layer 40 on the light emitted by the light emitting device 20. Furthermore, the thickness of the adhesive layer 40 located on the side of the formable layer 30 facing the light emitting device 20 is between 2 and 5 microns, thereby ensuring the bonding effect while further reducing the impact of the adhesive layer 40 on the light emitted by the light emitting device 20.

[0110] Specifically, the adhesive layer 40 may be at least one of a flexible material, a deformable material that does not rebound, and a material with an elastic recovery rate less than 85%.

[0111] FIG14 illustrates a different scenario from FIG1 through FIG13 . Specifically, in the display substrate shown in FIG14 , the deformable layer 30 is made of a viscous material. The composition and thickness of the viscous material can be adjusted to enable the viscous material to deform under pressure. In this case, the aforementioned adhesive layer 40 is not required.

[0112] In one example, when the deformable layer 30 is made of a viscous material, it also has a certain elasticity. For example, the elastic recovery rate of the deformable layer 30 is above 85%.

[0113] In one example, as shown in Figures 14 and 15, when the deformable layer 30 is made of a sticky material, the deformable layer 30 can be a continuously distributed film layer; or, as shown in Figure 16, the deformable layer 30 can include a plurality of sticky portions 32 corresponding one-to-one to a plurality of light-emitting devices 20, and the orthographic projection of each sticky portion 32 on the driving backplane 10 covers the orthographic projection of the corresponding light-emitting device 20 on the driving backplane 10; or, as shown in Figure 17, the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10 have a third overlapping area, and the third overlapping area is only located at the edge of the light-emitting device 20, for example, the third overlapping area extends along the edge of the light-emitting device 20.

[0114] For example, the third overlapping region is annular, and the minimum width at different locations within the annular region is greater than or equal to 3 μm. This ensures that even with process errors, the deformable layer 30 can cover the edge of the light-emitting device 20. When the annular region is a rectangular ring, that is, the distance between the straight line edge of the outer edge and the straight line edge of the inner edge of the ring is greater than or equal to 3 μm. The upper limit of the minimum width can be set according to actual needs, but it should ensure that the deformable layer 30 does not completely cover the light-emitting device 20. For example, the minimum width at different locations within the annular region is 3 μm, 4 μm, or 5 μm.

[0115] In one example, when the deformable layer 30 is made of a viscous material, as shown in FIG14 , the viscous material can be a dark viscous material. In this case, the deformable layer 30 is a fourth dark film layer 304. The fourth dark film layer 304 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. For example, the transmittance of the fourth dark film layer 304 for the light emitted by the light-emitting device 20 is between 20% and 75%.

[0116] Of course, the deformable layer 30 may also be made of a transparent viscous material. In this case, the display substrate may further include the aforementioned second dark film layer 50. The second dark film layer 50 is located on a side of the deformable layer 30 away from the plurality of light-emitting devices 20. The second dark film layer 50 is configured to transmit a portion of the light emitted by the light-emitting devices 20 and absorb a portion of the light emitted by the light-emitting devices 20. The color of the light from the light-emitting devices 20 that is transmitted through the second dark film layer 50 is the same as the color of the light emitted by the light-emitting devices 20. For example, the transmittance of the second dark film layer 50 for the light emitted by the light-emitting devices 20 is between 20% and 75%.

[0117] The second dark film layer 50 may be a continuously distributed film layer or may not be a continuously distributed film layer. Please refer to the above description for details.

[0118] In addition, when the deformable layer 30 is made of a transparent viscous material, the display substrate may further include the aforementioned third dark film layer 51. The third dark film layer 51 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. The transmittance of the third dark film layer 51 for the light emitted by the light-emitting device 20 is between 20% and 75%. The third dark film layer 51 has openings corresponding one to one with the light-emitting device 20. The orthographic projections of the openings on the driving backplane 10 overlap with the orthographic projections of the light-emitting device 20 on the driving backplane 10. At least a portion of the deformable layer 30 is located within the openings.

[0119] For example, the deformable layer 30 includes a plurality of adhesive portions 32 arranged at intervals, and the plurality of adhesive portions 32 are located in the opening.

[0120] 19 to 21 illustrate various structures of display panels provided in some further embodiments of the present disclosure. As shown in FIG. 19 and FIG. 21 , the display substrate further includes a cover plate 60 , which is located on a side of the deformable layer 30 away from the plurality of light-emitting devices 20 .

[0121] The cover plate 60 may be a transparent cover plate 60 so as to transmit the light emitted by the light emitting device 20. For example, the cover plate 60 is made of glass.

[0122] It should be noted that the display substrates shown in Figures 19 and 20 are described using a continuous distribution of the deformable layer 30 as an example. Of course, the deformable layer 30 may also have other distribution forms. That is, for each of the embodiments described in Figures 1 to 18 above, a cover plate 60 may be provided. When the display substrate includes, for example, a second dark film layer 50 or a third dark film layer 51, the dark film layer may be located on the side of the cover plate 60 facing the light-emitting device 20 (as shown in Figure 19).

[0123] As shown in FIG20 , when the display substrate includes a transparent cover plate 60, no dark film layer is provided on the side of the cover plate 60 facing the driver backplane 10. Instead, a fifth dark film layer 65 is provided on the side of the cover plate 60 facing away from the driver backplane 10. The fifth dark film layer 65 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. For example, the transmittance of the fifth dark film layer 65 for the light emitted by the light-emitting device 20 is between 20% and 75%.

[0124] As shown in Figure 21, the display substrate also includes a cover plate 60. Unlike the one shown in Figure 19, the cover plate 60 in Figure 21 can be a dark-colored cover plate. The dark-colored cover plate is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light transmitted through the dark-colored cover plate 60 is the same as the color of the light emitted by the light-emitting device 20. For example, the dark-colored cover plate has a transmittance of 20% to 75% for the light emitted by the light-emitting device 20, resulting in a dark surface on the display substrate when not displaying.

[0125] In this case, the cover plate 60 and the plurality of light-emitting devices 20 may no longer be provided with a dark film layer, that is, the deformable layer 30 may be a transparent film layer, and the second dark film layer 50 and the third dark film layer 51 are no longer provided between the deformable layer 30 and the cover plate 60. When an adhesive layer 40 is provided between the deformable layer 30 and the plurality of light-emitting devices 20, the adhesive layer 40 is a transparent film layer, wherein the deformable layer 30 may be a continuously distributed film layer as shown in Figures 1 and 2, or may include a plurality of elastic portions 31 as shown in Figures 3 to 5, or may be as shown in Figures 6 and 7, where the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10 have a first overlapping region. The adhesive layer 40 can be a continuously distributed film layer as shown in Figures 1 and 2, and Figures 4 to 6, or can include multiple adhesive portions 41 as shown in Figure 3, or as shown in Figure 7, the orthographic projection of the adhesive layer 40 on the driver backplane 10 and the orthographic projection of the light-emitting device 20 on the driver backplane 10 have an overlapping area, and the overlapping area is only located at the edge of the light-emitting device 20. When the cover plate 60 uses a dark cover plate, the deformable layer 30 can also use a transparent adhesive material to simultaneously play a buffering and bonding role. In this case, the deformable layer 30 can also be a continuously distributed film layer as shown in Figure 15, or can include multiple adhesive portions 41 as shown in Figure 16, or can be as shown in Figure 17, the orthographic projection of the deformable layer 30 on the driver backplane 10 and the orthographic projection of the light-emitting device 20 on the driver backplane 10 have a third overlapping area.

[0126] FIG22 is a schematic diagram of a method for manufacturing a display substrate provided in some embodiments of the present disclosure. The present disclosure further provides a method for manufacturing a display substrate, as shown in FIG22 , comprising:

[0127] S1. Forming a deformable layer 30 on a carrying plate 70 .

[0128] S2. Form a plurality of light-emitting devices 20 on a side of the deformable layer 30 away from the carrier board 70 .

[0129] S3 , arranging the carrier plate 70 and the driving back plate 10 opposite to each other, and applying pressure to the carrier plate 70 to bond the plurality of light-emitting devices 20 to the driving back plate 10 .

[0130] Since a deformable layer 30 is provided between the carrier plate 70 and the plurality of light-emitting chips, when pressure is applied to the carrier plate 70, the deformable layer 30 acts as a buffer against the pressure, so that the pressure exerted on the light-emitting devices 20 at different positions is more uniform, thereby improving the bonding yield between the light-emitting devices 20 and the driving backplane 10.

[0131] In some embodiments, the carrier plate 70 is a mid-mount substrate, and step S2 specifically includes the following steps S21 and S22:

[0132] S21 , forming a plurality of light-emitting devices 20 on each of a plurality of substrates.

[0133] For example, step S21 may specifically include: forming an epitaxial layer group for a plurality of light-emitting devices 20 on each of a plurality of substrates; then, forming electrode structures corresponding to the light-emitting devices 20 on a side of the epitaxial layer group away from the substrate; and then, segmenting the epitaxial layer group and the plurality of electrode structures to form a plurality of light-emitting devices 20. During segmentation, the epitaxial layer group and the plurality of electrode structures may be segmented using an etching process.

[0134] For example, the substrate may be a sapphire substrate. Of course, the embodiments of the present disclosure include but are not limited to this, and the substrate may also be other suitable substrates such as a silicon carbide substrate.

[0135] S22 , transferring the plurality of light-emitting devices 20 on the plurality of substrates to the carrier plate 70 .

[0136] For example, step S22 may include: transferring the substrate formed with the light-emitting devices 20 to a transfer substrate, then peeling the substrate from the transfer substrate; and then transferring the light-emitting devices 20 on the transfer substrate to the carrier plate 70 .

[0137] For example, the area of ​​the transfer substrate may be substantially equal to the area of ​​the substrate; the area of ​​the carrier plate 70 may be greater than or equal to the sum of the areas of the plurality of substrates.

[0138] In some embodiments, the deformable layer 30 formed in step S1 may be a continuous or discontinuously distributed film layer. When the display substrate to be prepared further includes an adhesive layer 40, the following steps may be further included between step S1 and step S2: S15, forming the adhesive layer 40 on the side of the deformable layer 30 away from the carrier plate 70. The adhesive layer 40 may be a continuous or discontinuously distributed film layer.

[0139] In some embodiments, the carrier plate 70 may not be removed, thereby forming the cover plate 60 in the above embodiment.

[0140] In the case where the carrier plate 70 is not removed, in some embodiments, before step S1, the second dark film layer 50 or the third dark film layer 51 may be formed. Alternatively, after step S3, the fifth dark film layer 65 may be formed on the side of the carrier plate 70 away from the light-emitting device 20.

[0141] FIG23 is a schematic diagram of a method for manufacturing a display substrate provided in some other embodiments of the present disclosure. As shown in FIG23 , in some other embodiments, the manufacturing method includes a step of removing the carrier plate 70. Specifically, in addition to the aforementioned steps S1 to S3, the manufacturing method may further include, before step S1, step S0: forming a sacrificial layer 80 on the carrier plate 70; and, after step S3, step S4: removing the sacrificial layer 80 to remove the carrier plate 70.

[0142] For example, the material of the sacrificial layer 80 may include UV-reducing adhesive, which can reduce the viscosity of the sacrificial layer 80 by irradiating UV light, thereby allowing the carrier plate 70 to be removed. For another example, the material of the sacrificial layer 80 may include laser-degradable adhesive, which can reduce the viscosity of the sacrificial layer 80 by irradiating laser light. For another example, the material of the sacrificial layer 80 may include pyrolytic adhesive, which can reduce the viscosity of the sacrificial layer 80 by heating. Of course, the sacrificial layer 80 may also be made of other materials, such as materials that can reduce viscosity or be decomposed in an acid pickling process.

[0143] In the case of removing the carrier plate 70, in some embodiments, the following step may be further included between step S0 and step S1: forming the above-mentioned second dark film layer 50 or third dark film layer 51. Alternatively, after step S4, the above-mentioned second dark film layer 50 or third dark film layer 51 is formed, so that the finally formed display substrate includes the second dark film layer 50 or third dark film layer 51 located on the side of the deformable layer 30 away from the base substrate 11. Alternatively, the second dark film layer 50 may be formed before steps S1 and S15, and the second dark film layer 50 may be located on the side of the deformable layer 30 away from the intermediate carrier substrate 70, and then the adhesive layer 40 may be formed, so that in the finally formed display substrate, the second dark film layer 50 is located on the side of the deformable layer 30 close to the base substrate 11.

[0144] The present disclosure also provides a display device, including the display substrate of the above embodiment. The display device can include any device or product with a display function. For example, the display device can be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, etc.

[0145] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display substrate, comprising: Driver backplane; A plurality of light-emitting devices are arranged on the driving backplane; The deformable layer is arranged on a side of the plurality of light-emitting devices away from the driving backplane, and the deformable layer overlaps with an orthographic projection of each of the light-emitting devices on the driving backplane.

2. The display substrate according to claim 1, wherein The material of the deformable layer is elastic material.

3. The display substrate according to claim 2, wherein: The material of the deformable layer includes acrylic resin or silicone resin.

4. The display substrate according to claim 2, wherein: The thickness of the deformable layer is between 2 μm and 50 μm.

5. The display substrate according to claim 2, wherein: The orthographic projection of the deformable layer on the driving backplane covers the orthographic projection of the light-emitting device on the driving backplane. The display substrate according to claim 5 , wherein: The deformable layer includes a plurality of elastic parts arranged at intervals, and the elastic parts correspond to the light emitting devices one by one.

7. The display substrate according to claim 2, wherein: An orthographic projection of the deformable layer on the driving backplane and an orthographic projection of the light-emitting device on the driving backplane have a first overlapping area, and the first overlapping area is only located at an edge of the light-emitting device.

8. The display substrate according to claim 7, wherein: The first overlapping area is in the shape of a ring; The first overlapping region extends along an edge of the light emitting device.

9. The display substrate according to claim 8, wherein: The minimum width of the ring is greater than or equal to 3 μm.

10. The display substrate according to any one of claims 2 to 9, wherein: The deformable layer is a first dark film layer, which is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device; Wherein, the transmittance of the first dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

11. The display substrate according to any one of claims 1 to 9, wherein: The display substrate further includes a second dark film layer, the second dark film layer being located on a side of the deformable layer away from the plurality of light-emitting devices, or on a side of the deformable layer close to the plurality of light-emitting devices; the second dark film layer being configured to transmit a portion of the light emitted by the light-emitting devices and absorb a portion of the light emitted by the light-emitting devices; the color of the light transmitted through the light-emitting devices being the same as the color of the light emitted by the light-emitting devices; Wherein, the transmittance of the second dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

12. The display substrate according to claim 11, wherein: The second dark film layer is a continuously distributed film layer; At least a portion of the orthographic projection of the light-emitting device on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.

13. The display substrate according to claim 11, wherein: There is a second overlapping area between the orthographic projection of the second dark film layer on the driving backplane and the orthographic projection of the light-emitting device on the driving backplane, and the second overlapping area is only located at the edge of the light-emitting device.

14. The display substrate according to claim 13, wherein: The orthographic projection of the deformable layer on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.

15. The display substrate according to any one of claims 1 to 9, wherein: The display substrate further includes a third dark film layer located on a side of the light-emitting device away from the driving backplane, wherein the third dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device, and the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device; The transmittance of the third dark film layer to the light emitted by the light emitting device is between 20% and 75%; the third dark film layer has openings corresponding to the light emitting devices one by one, and the orthographic projection of the openings on the driving backplane overlaps with the orthographic projection of the light emitting device on the driving backplane; At least a portion of the deformable layer is located inside the opening.

16. The display substrate according to claim 15, wherein: The deformable layer includes a plurality of elastic portions arranged at intervals, and the elastic portions are located in the openings.

17. The display substrate according to any one of claims 1 to 16, wherein: The display substrate further includes an adhesive layer located between the deformable layer and the light-emitting device, and the adhesive layer is fixedly connected to the deformable layer and the light-emitting device respectively.

18. The display substrate according to claim 17, wherein: The adhesive layer is a flexible adhesive layer.

19. The display substrate according to claim 1, wherein The material of the deformable layer is a viscous material.

20. The display substrate according to claim 19, wherein The deformable layer is a fourth dark film layer, and the fourth dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device; Wherein, the transmittance of the fourth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

21. The display substrate according to any one of claims 1 to 20, wherein: The display substrate further includes a cover plate located on a side of the deformable layer away from the light emitting device.

22. The display substrate according to any one of claims 1 to 9, wherein: The display substrate further comprises a cover plate located on a side of the deformable layer away from the light-emitting device, wherein the cover plate is a dark cover plate configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the dark cover plate is the same as the color of the light emitted by the light-emitting device; The transmittance of the dark cover plate to the light emitted by the light-emitting device is between 20% and 75%.

23. The display substrate according to any one of claims 1 to 9, wherein: The display substrate further includes: a cover plate located on a side of the deformable layer away from the light-emitting device; a fifth dark film layer located on a side of the cover plate away from the light-emitting device, the fifth dark film layer being configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device being the same as the color of the light emitted by the light-emitting device; Wherein, the transmittance of the fifth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.

24. A method for manufacturing a display substrate, comprising: forming a deformable layer on the carrier plate; forming a plurality of light-emitting devices on a side of the deformable layer away from the carrier plate; The carrier plate is arranged opposite to the driving back plate, and pressure is applied to the carrier plate to bond the plurality of light-emitting devices to the driving back plate.

25. The production method according to claim 24, wherein: The step of forming a plurality of light-emitting devices on a side of the deformable layer away from the carrier plate comprises: forming a plurality of light emitting devices on a substrate; The plurality of light emitting devices are transferred to the carrier plate.

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