Electroplating chuck for square substrate and electroplating method

Abstract

Provided in the present invention is an electroplating chuck for a square substrate, comprising: a substrate chuck plate, which has an inner edge for supporting a substrate; a pressing plate, which is arranged above the substrate chuck plate, wherein a guide post is provided between the substrate chuck plate and the pressing plate, the pressing plate can ascend or descend along the guide post, the bottom of the pressing plate is provided with a first reinforcement rib which is used for coming into contact with the edge of the substrate when the pressing plate presses the substrate, and the first reinforcement rib is square and has an inner side length that is less than the side length of the substrate; and at least one suction member, which is fixed on the pressing plate and is used for suctioning the substrate. The present invention effectively solves the inherent warpage problem of large-sized square substrate products, significantly improves the electroplating uniformity of the square substrates, reliably ensures both product quality and yield in continuous production, and has a simple structure and low production cost.

Description

Electroplating chuck and electroplating method for square substrate Technical Field

[0001] The present application relates to the field of semiconductor manufacturing equipment, and in particular to an electroplating chuck and an electroplating method for a square substrate. Background Art

[0002] Currently, semiconductor copper electroplating equipment primarily targets wafers, with a maximum size of 12 inches and a maximum warpage range of ±3mm. Pressing the plating chuck's pressure plate directly against the wafer surface can flatten the wafer to meet the requirements of the electroplating process.

[0003] With the increasing popularity of fan-out advanced packaging technology and changes in substrate materials, the use of square substrates is increasing. Square substrates typically come in two sizes: 515mm*510mm and 600mm*600mm, with a thickness of 1 to 3mm. Due to their large size and glass substrate, square substrates undergo a certain degree of warping after undergoing multiple front-end processes. The maximum warping range reaches ±10mm, resulting in both concave and convex shapes.

[0004] When a wafer plating chuck is applied to a square substrate, it can flatten a convex substrate. However, for concave substrates, the plating chuck only grips the edges, leaving the center unsupported. Consequently, pressure is applied to the periphery of the platen, while the center of the platen cannot contact the substrate. This prevents the concave substrate from being flattened, ultimately leading to uneven plating. Summary of the Invention

[0005] The object of the present invention is to provide an electroplating chuck and an electroplating method for a square substrate, so as to solve the problem in the prior art that the square substrate is warped and causes uneven electroplating.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides an electroplating chuck for a square substrate, comprising:

[0007] a substrate chuck having an inner edge for supporting the substrate;

[0008] A pressure plate is arranged above the substrate chuck, a guide column is provided between the substrate chuck and the pressure plate, the pressure plate can rise or fall along the guide column, and a first reinforcing rib is provided at the bottom of the pressure plate, which is used to contact the edge of the substrate when the pressure plate presses the substrate, and the first reinforcing rib is square, and the inner side length is smaller than the side length of the substrate;

[0009] At least one adsorption member is fixed on the pressing plate and is used for adsorbing the substrate.

[0010] Preferably, the adsorption component is a suction cup, one end of the suction cup is an adsorption end, and the other end is an air hole, and the suction cup is penetrated through the pressure plate.

[0011] Preferably, the device further comprises a pump and a plurality of air tubes, wherein the pump is connected to the air hole of each suction cup through the air tube.

[0012] Preferably, the layout of the plurality of suction cups on the pressing plate forms a plurality of concentric squares, and the squares are consistent with the shape of the substrate.

[0013] Preferably, the height of the first reinforcing rib is less than or equal to the distance from the adsorption end of the suction cup in a relaxed state to the bottom of the pressing plate.

[0014] Preferably, a plurality of second reinforcing ribs are further provided in the area surrounded by the first reinforcing ribs at the bottom of the pressing plate. The plurality of second reinforcing ribs are square and are all concentrically arranged with the first reinforcing ribs.

[0015] Preferably, evenly distributed second reinforcing ribs are further provided in the area surrounded by the first reinforcing ribs at the bottom of the pressing plate, for dividing the area surrounded by the first reinforcing ribs into a plurality of equal areas.

[0016] Preferably, a third reinforcing rib is further provided in the square annular area divided into the bottom of the pressing plate by the plurality of second reinforcing ribs, and the third reinforcing rib divides the square annular area into equal parts along each side.

[0017] Preferably, the end surface of the first reinforcing rib in contact with the substrate is provided with a tooth-shaped protrusion, and the second reinforcing rib is also evenly distributed with a plurality of bumps, and the distances between the ends of the plurality of bumps and the tooth-shaped protrusion and the bottom of the pressure plate are equal.

[0018] Preferably, it further comprises at least one spring pin, wherein the spring pin is inserted into the pressing plate, and when the pressing plate presses the substrate, the spring in the spring pin is in a contracted state.

[0019] Preferably, the suction cups are evenly distributed on the pressing plate and are arranged opposite to the non-electroplating area of ​​the substrate.

[0020] Preferably, the suction cups are evenly distributed on the center line of the pressing plate.

[0021] Preferably, two channels are further provided inside the pressure plate at the corresponding midline, the bottom of the channel is communicated with the air hole of the suction cup on the corresponding midline, and the top of the channel is provided with an airway opening, which is connected to the pump.

[0022] Preferably, the device further comprises a sealing member, wherein the sealing member extends from the bottom of the substrate chuck and covers the inner edge of the substrate chuck.

[0023] Preferably, a fourth reinforcing rib is provided in the area surrounded by the first reinforcing rib at the bottom of the pressing plate, the fourth reinforcing rib is arranged opposite to the non-electroplating area of ​​the substrate, and the adsorption part is a groove provided on the fourth reinforcing rib.

[0024] Preferably, the fourth reinforcing rib is arranged on the center line of the pressing plate.

[0025] Preferably, the opening of the vacuum groove faces downward, and an airway opening is provided at the bottom of the vacuum groove, and the airway opening is connected to a pump.

[0026] The present invention also provides an electroplating method for a square substrate, comprising the following steps:

[0027] Loading a substrate to be electroplated onto a substrate chuck, applying a first pressure to a pressing plate, pressing the pressing plate onto the substrate, and bringing the pressing plate into contact with the substrate;

[0028] exhausting air from the adsorption member so that the adsorption member adsorbs the substrate;

[0029] Applying a second pressure to the pressure plate to seal the inner edge of the substrate chuck and the edge of the substrate; wherein the second pressure is greater than the first pressure;

[0030] introducing gas into the adsorption member to cause the adsorption member to release the substrate;

[0031] The substrate is electroplated.

[0032] The present invention also provides an electroplating method for a square substrate, comprising the following steps:

[0033] Loading the substrate to be electroplated onto the robot arm, and controlling the robot arm to load the substrate to a corresponding position below the pressing plate, so that the substrate contacts the pressing plate;

[0034] exhausting air from the adsorption member on the pressing plate so that the adsorption member adsorbs the substrate;

[0035] After the robot arm leaves the bottom of the pressing plate, it applies pressure to the pressing plate to push the substrate downward, so that the inner edge of the substrate chuck and the edge of the substrate are sealed;

[0036] introducing gas into the adsorption member to cause the adsorption member to release the substrate;

[0037] The substrate is electroplated.

[0038] As described above, the present invention provides an electroplating chuck and an electroplating method for a square substrate. An adsorption component is added to the pressure plate, which can provide pressure for the substrate and provide adsorption force for the substrate through the adsorption component. The substrate in a concave state is flattened by the positive and negative dual forces, effectively solving the warping problem of large-sized square substrate products themselves. The electroplating uniformity of the square substrate is significantly improved, and the product quality and continuous production yield are reliably guaranteed. In addition, the structure is simple and the production cost is low.

[0039] Summary of the Figures

[0040] The features and performance of the present application are further described by the following examples and drawings.

[0041] FIG1 is a schematic diagram of an electroplating chuck according to a first embodiment of the present invention;

[0042] FIG2 is a schematic diagram showing the bottom of a pressure plate in a first embodiment of the present invention;

[0043] FIG3 is a schematic diagram showing the top of the pressure plate in the first embodiment of the present invention;

[0044] FIG4 is a schematic cross-sectional view of a pressure plate in a first embodiment of the present invention;

[0045] FIG5 is a schematic diagram of the suction cup in FIG4 ;

[0046] FIG6 is a bottom view of the pressure plate in the first embodiment of the present invention;

[0047] FIG7 is another cross-sectional view of the pressure plate in the first embodiment of the present invention;

[0048] FIG8 is a cross-sectional view of a substrate chuck according to a first embodiment of the present invention;

[0049] FIG9 is a schematic diagram showing the top of the pressure plate in the second embodiment of the present invention;

[0050] FIG10 is a schematic diagram showing the bottom of the pressure plate in the second embodiment of the present invention;

[0051] FIG11 is a bottom view of the pressure plate in the second embodiment of the present invention;

[0052] FIG12 is a cross-sectional view of a pressure plate in a second embodiment of the present invention;

[0053] FIG13 is a schematic diagram showing the top of the pressure plate in the third embodiment of the present invention;

[0054] FIG14 is a schematic diagram showing the bottom of the pressure plate in the third embodiment of the present invention;

[0055] FIG15 is a bottom view of the pressure plate in the third embodiment of the present invention;

[0056] FIG16 is a schematic cross-sectional view of a pressure plate in the third embodiment of the present invention.

[0057] Preferred embodiment of this application

[0058] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0059] It should be noted that the illustrations provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Although the illustrations only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation, the form, quantity, and proportion of each component in actual implementation may be varied arbitrarily, and the component layout may be more complex. Furthermore, parts with the same reference numerals in multiple figures represent identical or equivalent parts or components.

[0060] Example 1

[0061] This first embodiment proposes a plating chuck for a square substrate, which is used to clamp the substrate and immerse the substrate w downward into the plating tank during electroplating. As shown in Figures 1 and 2, the plating chuck includes a pressure plate 11, a substrate chuck 12, and a suction cup 13. The substrate chuck 12 is connected to the pressure plate 11 via a guide post 14. The pressure plate 11 is connected to a drive mechanism 15, which controls the pressure plate 11 to rise or fall along the guide post 14 to load and unload the substrate w. The substrate chuck 12 is a hollow structure with an inner edge that supports the substrate w. When the substrate chuck 12 is loaded with the substrate w, the outer edge of the substrate w is placed on the inner edge of the substrate chuck 12. As shown in Figure 8 , a seal 121 is also provided on the inner edge of the substrate chuck 12. When the pressure plate 11 presses against the substrate w, a seal is formed between the outer edge of the substrate w and the inner edge of the substrate chuck 12, isolating the substrate w to be plated. This prevents the plating solution from invading the non-plating areas of the substrate w, causing uneven plating thickness, and preventing the plating solution from invading and contaminating the internal components of the substrate chuck 12. As shown in Figure 4 , a suction cup 13 is fixed to the pressure plate 11. When the substrate chuck 12 is loaded with a substrate w, the pressure plate 11 descends along the guide posts 14, pressing the substrate w. The suction force of the suction cup 13 on the substrate w flattens the substrate w.

[0062] To prevent the center of the pressing plate 11 from being unable to contact the substrate w, at least one suction cup 13 is provided at the center of the pressing plate 11. Preferably, a plurality of suction cups 13 are provided on the pressing plate 11, and the layout of the plurality of suction cups 13 on the pressing plate 11 forms a plurality of concentric squares that are consistent with the shape of the substrate w.

[0063] As shown in FIG5 , each suction cup 13 includes an air hole 131 and a suction end 132. The air hole 131 is provided at the top of the suction end 132. The suction cup 13 is disposed within the pressure plate 11 and absorbs and flattens the substrate w via the suction end 132. Preferably, the distance between the suction end 132 and the bottom of the pressure plate 11 is adjustable. For example, the suction cup 13 may be provided with a thread on its exterior that cooperates with a nut to adjust the position of the suction end 132.

[0064] The air holes 131 of each suction cup 13 are connected to an air pipe, and each air pipe is connected to a pump through a main air pipe. Specifically, a plurality of air pipes are respectively connected to the air holes 131 and the main air pipe of a plurality of suction cups 13, and the main air pipe is connected to a pump. After the adsorption end 132 contacts the substrate w, the pump removes the air inside the adsorption end 132 through the air holes 131, so that a vacuum state is formed inside the adsorption end 132. At this time, the air pressure inside the adsorption end 132 is lower than the air pressure outside the adsorption end 132. The substrate w is adsorbed under the action of the external pressure. The higher the vacuum degree inside the adsorption end 132, the tighter the adsorption end 132 and the substrate w are attached. The originally warped substrate w is flattened by the adsorption force of the adsorption end 132. When the substrate w needs to be released, the pump vents air to the inside of the adsorption end 132 through the air holes 131, increases the air pressure inside the adsorption end 132, and separates the adsorption end 132 from the substrate w.

[0065] As shown in Figure 2, a first reinforcing rib 111 is provided on the bottom outer edge of the pressure plate 11, which is used to contact the edge of the substrate w when the pressure plate 11 is pressed against the substrate w. The first reinforcing rib 111 is square, with an inner side length smaller than the side length of the substrate. Preferably, the height of the reinforcing rib is slightly smaller than the distance between the suction end 132 of the suction cup 13 in the relaxed state and the pressure plate 11, so that the suction cup 13 can contact and absorb the substrate w.

[0066] Preferably, a plurality of second reinforcing ribs 112 are further provided in the area surrounded by the first reinforcing ribs 111 at the bottom of the pressing plate 11. The second reinforcing ribs 112 may be square and are all arranged concentrically with the first reinforcing ribs 111. The second reinforcing ribs 112 may also be evenly distributed at the bottom of the pressing plate 11, dividing the area surrounded by the first reinforcing ribs 111 at the bottom of the pressing plate 11 into a plurality of square areas. The second reinforcing ribs 112 may also be provided at the diagonal lines of the area surrounded by the first reinforcing ribs 111 at the bottom of the pressing plate 11. When the substrate w is convexly warped, the substrate w can be directly pressed flat by the first reinforcing ribs 111 and the second reinforcing ribs 112 on the pressing plate 11. More reinforcing ribs may also be provided to increase the contact area between the pressing plate 11 and the substrate w, so that the leveling effect of the substrate w is better.

[0067] In this embodiment, as shown in Figures 2, 3, and 6, multiple concentrically arranged second reinforcing ribs 112 at the bottom of the pressure plate 11 divide the area enclosed by the first reinforcing ribs 111 at the bottom of the pressure plate 11 into a central square area and multiple square annular areas. Third reinforcing ribs 113 are also provided along the outer edges of each square annular area, evenly dividing the square annular area into multiple areas. Each area is provided with a suction cup 13. Dividing adjacent square annular areas by equal length along the first reinforcing ribs 111 and providing suction cups 13 can better ensure uniform distribution of suction force around the edge of the substrate w. At least one suction cup 13 is provided in the central square area of ​​the pressure plate 11.

[0068] Specifically, as shown in Figures 2, 3 and 6, in this embodiment, the pressing plate 11 is divided from the center to the edge into a central square area A, a first square annular area B, and a second square annular area C by the first reinforcing rib 111 and the second reinforcing rib 112. The central square area A is provided with four suction cups 13 distributed along the square. The first square annular area B is divided into four equal areas by the third reinforcing rib 113, each area is provided with a suction cup 13, and the suction cups 13 in the four areas are distributed along the square. The third reinforcing rib 113 is set to divide the outer ring length of the second square annular area C into 12 areas, and similarly, the suction cups 13 in these 12 areas are distributed along the square. Since the warping range of the square substrate w is large, more suction cups 13 are set at the edge and center of the pressing plate 11 so that the pressing plate 11 can be more tightly attached to the substrate w through the suction cups 13, ensuring the uniformity of the pressing and achieving a better leveling effect on the substrate w.

[0069] As shown in Figures 2 and 6, the first reinforcing rib 111 is also provided with a circle of tooth-shaped protrusions 114. When the pressure plate 11 is pressed against the substrate w, the end surface of the tooth-shaped protrusions 114 just presses the edge of the substrate w, causing the substrate w to be squeezed against the seal 121 on the inner edge of the substrate chuck 12. The tooth-shaped protrusions 114 can be used to discharge the gas between the pressure plate 11 and the substrate w, preventing the outer edge of the pressure plate 11 from being too close to the substrate w, resulting in vacuum adsorption, and preventing the pressure plate 11 from sticking to the substrate w when it rises. Correspondingly, as shown in Figures 2 and 6, a plurality of protrusions 115 are evenly distributed on the second reinforcing rib 112. The plurality of protrusions 115 are equal in height to the tooth-shaped protrusions 114. When the pressure plate 11 is pressed against the substrate w, the tooth-shaped protrusions 114 and the protrusions 115 contact the substrate w, preventing the central area of ​​the pressure plate 11 from not contacting the substrate w and affecting the leveling effect. Moreover, it can also avoid the situation where the adsorption force of the adsorption end 132 is too strong, causing a convex warping of a part of the substrate w.

[0070] As shown in Figure 7, multiple spring pins 16 are also inserted into the pressure plate 11. When the pressure plate 11 presses the substrate w, the spring is in a contracted state. After the substrate w is pressed flat, gas is introduced into the interior of the adsorption end 132 to release the substrate w from the adsorption end 132. At the same time, the elastic force of the spring pins 16 pushes the substrate w away, preventing the substrate w from being adsorbed on the adsorption end 132 during electroplating. The adsorption end 132 still exerts an adsorption force on the substrate w, affecting the electroplating effect. In the embodiments shown in Figures 2, 3, and 6, the spring pins 16 are arranged on the third reinforcing rib 113 at the edge of the pressure plate 11.

[0071] As shown in Figure 8 , the seal 121 on the inner edge of the substrate chuck 12 can be a rubber member extending from the bottom of the substrate chuck 12 and covering the inner edge of the substrate chuck 12. This ensures a better seal between the outer edge of the substrate w and the inner edge of the substrate chuck 12, while also reducing the stress exerted on the substrate w by the inner edge of the substrate chuck 12 when the pressure plate 11 is pressed downward. Furthermore, the one-piece design eliminates the need for cumbersome installation. A through-hole is also provided on the inner edge of the substrate chuck 12 for filling and securing the seal 121, ensuring structural stability of the seal 121 and the substrate chuck 12.

[0072] Example 2

[0073] This second embodiment provides a plating chuck for square substrates. Compared to the first embodiment, the layout of the ribs and suction cups 13 on the pressure plate 21 differs from that in the first embodiment. As shown in Figures 9 to 12 , the pressure plate 21 is provided with only a first rib 111. When the pressure plate 21 presses against the substrate w, the end surface of the first rib 111 contacts the edge of the substrate w and presses against the seal 121 on the inner edge of the substrate chuck 12. Multiple suction cups 13 are distributed along the centerline of the pressure plate 21.

[0074] The electroplating chuck for the square substrate proposed in the second embodiment is suitable for double-sided electroplating process. The area outside the center line of the square substrate w is the electroplating area, and the center line and the surrounding area are the non-electroplating area. Therefore, the suction cup 13 is only provided at the center line of the pressing plate 21, and the reinforcing ribs are only provided at the outer edge of the pressing plate 21 to prevent the suction cup 13 from adsorbing the electroplating area of ​​the substrate w or the pressing plate 21 from pressing the electroplating area of ​​the substrate w and affecting the electroplating effect.

[0075] As shown in Figure 12, two channels 212 are provided within the pressure plate 21, corresponding to the centerline. The bottoms of the channels 212 communicate with the air holes 131 of the suction cups 13 on the two centerlines, respectively. Airway openings 213 are provided at the tops of the channels 212. These openings 213 are connected to a pump for introducing gas into the suction cups 13 and for vacuuming them. In this embodiment, five airway openings 213 are provided, evenly distributed along the centerline and center of the pressure plate 21, ensuring a more uniform suction force of the suction cups 13 on the substrate w.

[0076] The other configurations of this embodiment are the same as those of the first embodiment and will not be described again here.

[0077] Example 3

[0078] This third embodiment proposes a plating chuck for a square substrate. Compared to the second embodiment, the difference is that a groove 312 is used instead of the suction cup 13 to evacuate the interior of the pressure plate 31. As shown in Figures 13 to 16, two fourth reinforcing ribs 311 are provided at the center line of the pressure plate 31 in a cross shape. The height of the fourth reinforcing ribs 311 is consistent with the height of the first reinforcing ribs 111. The fourth reinforcing rib 311 is provided with a groove 312, which is connected to an airway port 313. The airway port 313 is connected to a pump for introducing gas into the groove 312 and evacuating the interior.

[0079] The other configurations of this embodiment are the same as those of the second embodiment and will not be described again here.

[0080] Example 4

[0081] This fourth embodiment provides an electroplating method for a square substrate, comprising the following steps:

[0082] S1: loading the substrate to be electroplated onto the substrate chuck, applying a first pressure to the pressing plate, pressing the pressing plate onto the substrate to be electroplated, so that the pressing plate contacts the substrate;

[0083] S2: vacuuming the interior of the adsorbent on the pressing plate so that the adsorbent adsorbs the substrate;

[0084] S3: applying a second pressure to the pressure plate to seal the inner edge of the substrate chuck and the edge of the substrate; wherein the second pressure is greater than the first pressure;

[0085] S4: introducing gas into the adsorption member to release the substrate from the adsorption member;

[0086] S5: electroplating the substrate.

[0087] The adsorption member may be the suction cup described in embodiments one to two, or the groove described in embodiment three.

[0088] Example 5

[0089] This fifth embodiment provides an electroplating method for a square substrate, comprising the following steps:

[0090] S11: Loading the substrate to be electroplated onto the robot arm, and controlling the robot arm to load the substrate to the corresponding position below the pressing plate, so that the substrate contacts the pressing plate;

[0091] S21: vacuuming the interior of the adsorbent on the pressing plate so that the adsorbent adsorbs the substrate;

[0092] S31: After the robot arm leaves the bottom of the pressing plate, pressure is applied to the pressing plate to push the substrate downward, so that the inner edge of the substrate chuck and the edge of the substrate are sealed;

[0093] S41: introducing gas into the adsorption member to release the substrate from the adsorption member;

[0094] S51: electroplating the substrate.

[0095] The adsorption member may be the suction cup described in the first and second embodiments, or the groove described in the third embodiment.

[0096] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A plating chuck for a square substrate, characterized in that: include: a substrate chuck having an inner edge for supporting the substrate; A pressure plate is arranged above the substrate chuck, a guide column is provided between the substrate chuck and the pressure plate, the pressure plate can rise or fall along the guide column, and a first reinforcing rib is provided at the bottom of the pressure plate, which is used to contact the edge of the substrate when the pressure plate presses the substrate, and the first reinforcing rib is square, and the inner side length is smaller than the side length of the substrate; At least one adsorption member is fixed on the pressing plate and is used for adsorbing the substrate.

2. The electroplating chuck for a square substrate according to claim 1, characterized in that: The adsorption component is a suction cup, one end of the suction cup is an adsorption end, and the other end is an air hole, and the suction cup is penetrated through the pressing plate.

3. The electroplating chuck for a square substrate according to claim 2, characterized in that: The device also comprises a pump and a plurality of air tubes, wherein the pump is connected to the air hole of each suction cup through the air tube.

4. The electroplating chuck for a square substrate according to claim 2, characterized in that: The layout of the plurality of suction cups on the pressing plate forms a plurality of concentric squares, and the squares are consistent with the shape of the substrate.

5. The electroplating chuck for a square substrate according to claim 2, characterized in that: The height of the first reinforcing rib is less than or equal to the distance from the adsorption end of the suction cup in a relaxed state to the bottom of the pressing plate.

6. The electroplating chuck for a square substrate according to claim 1, characterized in that: A plurality of second reinforcing ribs are further provided in the area surrounded by the first reinforcing ribs at the bottom of the pressing plate. The plurality of second reinforcing ribs are square and are all concentrically arranged with the first reinforcing ribs.

7. The electroplating chuck for a square substrate according to claim 1, characterized in that: Evenly distributed second reinforcing ribs are further provided in the area surrounded by the first reinforcing ribs at the bottom of the pressing plate, for dividing the area surrounded by the first reinforcing ribs into a plurality of equal areas.

8. The electroplating chuck for a square substrate according to claim 6, characterized in that: A third reinforcing rib is further provided in the square annular region divided into the bottom of the pressing plate by the plurality of second reinforcing ribs. The third reinforcing rib divides the square annular region into equal parts along each side.

9. The electroplating chuck for a square substrate according to claim 6, characterized in that: The end surface of the first reinforcing rib in contact with the substrate is provided with a tooth-shaped protrusion, and the second reinforcing rib is also evenly distributed with a plurality of bumps, and the distances between the plurality of bumps and the end of the tooth-shaped protrusion and the bottom of the pressure plate are equal.

10. The electroplating chuck for a square substrate according to claim 1, characterized in that: It also includes at least one spring pin, which is inserted into the pressing plate. When the pressing plate presses the substrate, the spring in the spring pin is in a contracted state.

11. The electroplating chuck for a square substrate according to claim 2, characterized in that: The suction cups are evenly distributed on the pressing plate and are arranged opposite to the non-electroplating area of ​​the substrate.

12. The electroplating chuck for a square substrate according to claim 11, characterized in that: The suction cups are evenly distributed on the center line of the pressing plate.

13. The electroplating chuck for a square substrate according to claim 12, characterized in that: Two channels are further provided inside the pressure plate at the corresponding midline. The bottom of the channel is communicated with the air hole of the suction cup on the corresponding midline. The top of the channel is provided with an airway opening, which is connected to the pump.

14. The electroplating chuck for a square substrate according to claim 1, wherein: A sealing member is also included, which extends from the bottom of the substrate chuck and covers the inner edge of the substrate chuck.

15. The electroplating chuck for a square substrate according to claim 1, characterized in that: A fourth reinforcing rib is further provided in the area surrounded by the first reinforcing ribs at the bottom of the pressing plate. The fourth reinforcing rib is arranged opposite to the non-electroplating area of ​​the substrate. The adsorption member is a groove provided on the fourth reinforcing rib.

16. The electroplating chuck for a square substrate according to claim 15, characterized in that: The fourth reinforcing rib is arranged on the center line of the pressing plate.

17. The electroplating chuck for a square substrate according to claim 15, characterized in that: The opening of the groove faces downward, and an airway opening is provided at the bottom of the groove, and the airway opening is connected to a pump.

18. A method for electroplating a square substrate, using the electroplating chuck for a square substrate according to any one of claims 1 to 17, characterized in that: The following steps are involved: Loading a substrate to be electroplated onto a substrate chuck, applying a first pressure to a pressing plate, pressing the pressing plate onto the substrate, and bringing the pressing plate into contact with the substrate; exhausting air from the adsorption member so that the adsorption member adsorbs the substrate; Applying a second pressure to the pressure plate to seal the inner edge of the substrate chuck and the edge of the substrate; wherein the second pressure is greater than the first pressure; introducing gas into the adsorption member to cause the adsorption member to release the substrate; The substrate is electroplated.

19. A method for electroplating a square substrate, using the electroplating chuck for a square substrate according to any one of claims 1 to 17, characterized in that: The following steps are involved: Loading the substrate to be electroplated onto the robot arm, and controlling the robot arm to load the substrate to a corresponding position below the pressing plate, so that the substrate contacts the pressing plate; exhausting air from the adsorption member on the pressing plate so that the adsorption member adsorbs the substrate; After the robot arm leaves the bottom of the pressing plate, it applies pressure to the pressing plate to push the substrate downward, so that the inner edge of the substrate chuck and the edge of the substrate are sealed; introducing gas into the adsorption member to cause the adsorption member to release the substrate; The substrate is electroplated.

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