Component mounting apparatus

Abstract

In this component mounting apparatus, an imaging device images a substrate, a lead of a lead component is inserted into a through hole of the substrate imaged by the imaging device, the lead of the lead component inserted into the through hole of the substrate is clinched, the imaging device reimages the substrate after the lead has been clinched, and the positional deviation of the substrate is calculated on the basis of imaged data acquired by reimaging the substrate by using the imaging device.

Description

Component placement device

[0001] The present invention relates to a component mounting apparatus that calculates the positional deviation of a board based on image data acquired by an imaging device capturing an image of the board.

[0002] The following Patent Document describes a technique for calculating the positional deviation of a substrate based on image data acquired by an imaging device capturing an image of the substrate.

[0003] JP 2006-4981 A JP 2013-38198 A

[0004] An object of the present specification is to appropriately calculate the positional deviation of a substrate based on imaging data acquired by an imaging device capturing an image of the substrate.

[0005] In order to solve the above problem, this specification discloses a component mounting device in which an imaging device images a circuit board, the leads of a lead component are inserted into through holes in the circuit board imaged by the imaging device, the leads of the lead component inserted into the through holes in the circuit board are clinched, the imaging device images the circuit board again after clinching the leads, and the imaging device images the circuit board again, and calculates the positional misalignment of the circuit board based on the image data acquired by the imaging device after imaging the circuit board again.

[0006] According to the present disclosure, it is possible to appropriately calculate the positional deviation of a substrate based on the imaging data acquired by an imaging device capturing an image of the substrate.

[0007] FIG. 1 is a perspective view of a component mounting machine. FIG. 2 is a perspective view of a substrate conveying and holding device and a cut and clinch device. FIG. 3 is a perspective view of a component mounting device. FIG. 4 is a perspective view of a cut and clinch device. FIG. 5 is a perspective view of a cut and clinch unit. FIG. 6 is a cross-sectional view of a slider. FIG. 7 is a block diagram of a control device. FIG. 8 is a plan view of a circuit substrate. FIG. 9 is a schematic view of the cut and clinch unit immediately before the leads of a lead component are cut. FIG. 10 is a schematic view of the cut and clinch unit when bending the cut leads. FIG. 11 is a conceptual diagram of a production program that sets whether or not to recalculate the positional deviation of a circuit substrate depending on the components to be mounted.

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0009] 1 shows a component mounter 10. The component mounter 10 is a device for performing the operation of mounting components on a circuit board 12. The component mounter 10 includes a device main body 20, a substrate transport / holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a bulk component supply device 32, a cut-and-clinch device (see FIG. 4) 34, and a control device (see FIG. 7) 36. Examples of the circuit board 12 include a circuit board or a substrate with a three-dimensional structure, and examples of the circuit board include a printed wiring board or a printed circuit board.

[0010] The apparatus main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate conveying and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction, and as shown in FIG. 2 , includes a conveying device 50 and a clamping device 52. The conveying device 50 has a pair of conveying lanes 53 and conveys the circuit substrate 12 disposed on the pair of conveying lanes 53. The clamping device 52 includes a pair of lifting plates 55 (only one of which is shown in the figure) and a pair of clamping plates 56. The pair of lifting plates 55 are disposed below the pair of conveying lanes 53 so as to be able to move up and down, and the pair of clamping plates 56 are disposed fixedly above the pair of conveying lanes 53. When the pair of lifting plates 55 rise, the circuit substrate 12 disposed on the pair of conveying lanes 53 is lifted, and the pair of lifting plates 55 and the pair of clamping plates 56 clamp the circuit substrate 12. This causes the clamp device 52 to clamp the circuit board 12. In this way, the substrate conveying and holding device 22 conveys the circuit board 12 while holding it fixedly at a predetermined position. In the following description, the conveying direction of the circuit board 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. In other words, the width direction of the component mounter 10 is the X direction, and the front-to-rear direction is the Y direction.

[0011] The component mounting device 24 is mounted on the beam 42 and includes two work heads 60, 62 and a work head moving device 64. As shown in FIG. 3, a suction nozzle 66 is provided on the lower end surface of each work head 60, 62, and the suction nozzle 66 is used to suck and hold components. The work head moving device 64 also includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60, 62 together to any desired position on the frame 40. The work heads 60, 62 are removably positioned and attached to sliders 74, 76 without the need for tools by the operator, and the Z-direction moving device 72 moves the sliders 74, 76 individually up and down. In other words, the work heads 60, 62 are moved individually up and down by the Z-direction moving device 72.

[0012] The mark camera 26 is attached to the slider 74 facing downward on a vertical line, and moves in the X, Y, and Z directions together with the work head 60. This allows the mark camera 26 to capture an image of any position on the frame 40. The part camera 28, as shown in FIG. 1, is disposed on the frame 40 between the substrate material conveying and holding device 22 and the component supply device 30 facing upward on a vertical line. This allows the part camera 28 to capture an image of a component held by the suction nozzle 66 of the work heads 60, 62. The mark camera 26 and the part camera 28 are two-dimensional cameras that capture two-dimensional images.

[0013] The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 78 and a feeder-type component supply device 80. The tray-type component supply device 78 is a device that supplies components placed on a tray. The feeder-type component supply device 80 is a device that supplies components using a tape feeder or stick feeder (not shown).

[0014] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 aligns a plurality of components scattered loosely and supplies the aligned components. In other words, it aligns a plurality of components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0015] As shown in FIG. 4 , the cut-and-clinch device 34 is disposed between a pair of conveying lanes 53 of the conveying device 50. The cut-and-clinch device 34 includes a cut-and-clinch unit 100 and a unit moving device 102. The cut-and-clinch unit 100 is a device that cuts and bends leads (see FIG. 9 ) 108 of a lead component (see FIG. 9 ) 106 inserted into a through-hole (see FIG. 8 ) 104 formed in a circuit board 12. As shown in FIG. 5 , the cut-and-clinch unit 100 includes a unit main body 110 and a pair of slide bodies 112. A slide rail 116 is disposed at the upper end of the unit main body 110 so as to extend linearly. The slide rail 116 slidably supports the pair of slide bodies 112. This allows the pair of slide bodies 112 to approach and move away from each other. The distance between the pair of slide bodies 112 is controllably changed by driving an electromagnetic motor 118 (see FIG. 7).

[0016] Each of the pair of slide bodies 112 has a fixed part 120 and a movable part 122, and is slidably held by a slide rail 116 at the fixed part 120. Two slide rails 126 are fixed to the rear side of the fixed part 120 so as to extend in the direction in which the pair of slide bodies 112 are aligned, and the movable part 122 is slidably held by these two slide rails 126. The movable part 122 slides controllably relative to the fixed part 120 when driven by an electromagnetic motor 128 (see FIG. 7 ).

[0017] As shown in FIG. 6 , the upper end of the fixed part 120 is tapered, and a first insertion hole 130 is formed so as to penetrate the upper end in the vertical direction. The edge of the opening at the upper end surface of the first insertion hole 130 is a fixed blade 131 (see FIG. 9 ). The lower end of the first insertion hole 130 opens toward the side surface on the front side of the fixed part 120. A disposal box 132 is fixed to the upper surface of the unit main body 110 on the front side of the side surface of the fixed part 120 where the lower end of the first insertion hole 130 opens, and the opening at the lower end of the first insertion hole 130 faces the opening of the disposal box 132.

[0018] Meanwhile, the upper end of the movable part 122 is also tapered, and an L-shaped bent part 133 is formed at the upper end. The bent part 133 extends above the upper end surface of the fixed part 120. The first insertion hole 130 opening on the upper end surface of the fixed part 120 is covered by the bent part 133, and a second insertion hole 136 is formed in the bent part 133 so as to face the first insertion hole 130. The edge of the opening of the second insertion hole 136 toward the lower end surface of the bent part 133 forms a movable blade 138 (see FIG. 9 ).

[0019] As shown in FIG. 4 , the unit moving device 102 includes an X-direction moving device 150, a Y-direction moving device 152, a Z-direction moving device 154, and a rotation device 156. The X-direction moving device 150 includes a slide rail 160 and an X-slider 162. The slide rail 160 is disposed so as to extend in the X direction, and the X-slider 162 is slidably held on the slide rail 160. The X-slider 162 moves in the X direction by driving an electromagnetic motor (see FIG. 7 ) 164. The Y-direction moving device 152 includes a slide rail 166 and a Y-slider 168. The slide rail 166 is disposed on the X-slider 162 so as to extend in the Y direction, and the Y-slider 168 is slidably held on the slide rail 166. The Y-slider 168 moves in the Y direction by driving an electromagnetic motor (see FIG. 7 ) 170. Z-direction movement device 154 includes a slide rail 172 and a Z slider 174. Slide rail 172 is disposed on Y slider 168 so as to extend in the Z direction, and Z slider 174 is slidably held on slide rail 172. Z slider 174 is moved in the Z direction by the drive of an electromagnetic motor 176 (see FIG. 7).

[0020] The rotation device 156 also has a generally disk-shaped rotation table 178. The rotation table 178 is supported by a Z-slider 174 so as to be rotatable about its axis, and is rotated by an electromagnetic motor (see FIG. 7) 180. The cut and clinch unit 100 is disposed on the rotation table 178. With this structure, the cut and clinch unit 100 can be moved to any position by the X-direction movement device 150, the Y-direction movement device 152, and the Z-direction movement device 154, and can be rotated at any angle by the rotation device 156. This allows the cut and clinch unit 100 to be positioned and stopped at any position and angle below the circuit board 12 held by the clamp device 52.

[0021] As shown in FIG. 7 , the control device 36 includes a controller 190, multiple drive circuits 192, and an image processing device 196. The multiple drive circuits 192 are connected to the transport device 50, clamp device 52, work heads 60 and 62, work head moving device 64, tray-type component supply device 78, feeder-type component supply device 80, bulk component supply device 32, and electromagnetic motors 118, 128, 164, 170, 176, and 180. The controller 190 is primarily a computer, including a CPU, ROM, RAM, etc., and is connected to the multiple drive circuits 192. This allows the controller 190 to control the operation of the substrate material transport and holding device 22, component mounting device 24, etc. The controller 190 is also connected to the image processing device 196. The image processing device 196 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 190 acquires various information from the image data. A production program 200 is programmed into the controller 190, and the controller 190 executes the operation of mounting components on the circuit board 12 in accordance with the processing of the production program 200. The component mounter 10 is capable of mounting various components on the circuit board 12, but the following describes the case where a lead component 106 is mounted on the circuit board 12.

[0022] Specifically, the circuit board 12 is transported to the work position and fixedly held at that position by the clamp device 52. Next, the mark camera 26 moves above the circuit board 12 and captures an image of the circuit board 12. As shown in FIG. 8 , three fiducial marks 210 are marked on three of the four corners of the circuit board 12. The fiducial marks 210 are symbols for identifying the position of the circuit board 12, and the mark camera 26 captures images of at least two of the fiducial marks 210. The controller 190 then calculates the holding position of the circuit board 12 based on the image data of the fiducial marks 210 captured by the mark camera 26. Furthermore, the component supply device 30 or the bulk component supply device 32 supplies the lead components 106 at a predetermined supply position. Then, one of the work heads 60, 62 moves above the component supply position, and the suction nozzle 66 suction-holds the component body 210 (see FIG. 9 ) of the lead component 106.

[0023] Next, the work heads 60, 62 holding the lead component 106 move above the part camera 28, which captures an image of the lead component 106 held by the suction nozzle 66. The controller 190 then calculates the component's holding position, holding posture, and other parameters based on the image data of the lead component 106 captured by the part camera 28. The work heads 60, 62 holding the lead component 106 then move above the circuit board 12. The work heads 60, 62 then move and stop so that the XY coordinates of the leads 108 of the lead component 106 coincide with the XY coordinates of the through-holes 104 in the circuit board 12. The stop positions of the work heads 60, 62 are corrected based on the holding position of the circuit board 12, the holding position and holding posture of the component, and other parameters calculated by the controller 190. As a result, the leads 108 of the lead component 106 and the through-holes 104 in the circuit board 12 are vertically aligned. Then, as the work heads 60, 62 are lowered, the leads 108 of the lead component 106 held by suction with the suction nozzles 66 are inserted into the through holes 104 formed in the circuit board 12. At this time, the cut and clinch unit 100 is moving below the circuit board 12.

[0024] Specifically, in the cut-and-clinch unit 100, the distance between the pair of slide bodies 112 is adjusted by operation of the electromagnetic motor 118 so that the distance between the second insertion holes 136 of the pair of slide bodies 112 is the same as the distance between the two through holes 104 formed in the circuit board 12. In addition, the operation of the rotation device 156 is controlled so that the direction in which the two through holes 104 of the circuit board 12 are aligned coincides with the direction in which the two second insertion holes 136 of the pair of slide bodies 112 are aligned.

[0025] Then, by operation of the X-direction moving device 150 and the Y-direction moving device 152, the cut and clinch unit 100 moves so that the coordinates in the X and Y directions of the second insertion holes 136 coincide with the coordinates in the X and Y directions of the through holes 104 in the circuit board 12. At this time, the movement position of the cut and clinch unit 100 is corrected based on the holding position of the circuit board 12 calculated by the controller 190. As a result, by moving the cut and clinch unit 100 along the X and Y directions, the pair of second insertion holes 136 in the slider 112 and the pair of through holes 104 in the circuit board 12 come into a state where they overlap in the vertical direction.

[0026] Next, the cut and clinch unit 100 is raised by operation of the Z-direction movement device 154 so that the upper surface of the movable part 122 comes into contact with the lower surface of the circuit board 12 or is positioned slightly below the lower surface of the circuit board 12. By controlling the operations of the X-direction movement device 150, the Y-direction movement device 152, the Z-direction movement device 154, and the rotation device 156 in this manner, the cut and clinch unit 100 stops in a state where the second insertion holes 136 of the pair of slide bodies 112 and the pair of through-holes 104 of the circuit board 12 are overlapped, and the cut and clinch unit 100 is positioned below the circuit board 12.

[0027] When the pair of leads 108 of the lead component 106 held by suction nozzle 66 are inserted into the pair of through-holes 104 of the circuit board 12, the tips of the pair of leads 108 are inserted into the first insertion hole 130 of the fixed part 120 through the second insertion hole 136 of the movable part 122 of the cut and clinch unit 100, as shown in FIG. 9 . Next, when the tips of the leads 108 are inserted into the first insertion hole 130 of the fixed part 120, the pair of movable parts 122 slide apart by operation of electromagnetic motor 128. As a result, the leads 108 are cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136, as shown in FIG. 10 . The tips of the cut and separated leads then fall through the internal path of the first insertion hole 130 and are collected in the disposal box 132.

[0028] Furthermore, the pair of movable parts 122 continue to slide in the direction separating them even after cutting the tips of the leads 108. As a result, the leads 108 whose tips have been cut are bent as the movable parts 122 slide. At this time, the leads 108 come into contact with the inner walls that define the through holes 104, and are bent around the points where they come into contact with the inner walls as fulcrums. As a result, the pair of leads 108 are bent in the direction separating them from each other, and the lead component 106 is mounted on the circuit board 12 in a state in which the leads 108 are prevented from coming out of the through holes 104.

[0029] In this way, by clinching the leads 108, the lead component 106 is mounted on the circuit board 12 while preventing the leads 108 from coming out of the through-holes 104. However, when the leads 108 are clinched, the leads 108 may come into contact with the inner walls defining the through-holes 104, which may cause the holding position of the circuit board 12 to shift. More specifically, the circuit board 12 is held vertically between the pair of lifting plates 55 and the pair of clamping plates 56. When the leads 108 are clinched, they bend around the points where they come into contact with the inner walls defining the through-holes 104 as fulcrums, so that the leads 108 press the inner walls defining the through-holes 104 in the left-right direction. As a result, the circuit board 12 held between the pair of lifting plates 55 and the pair of clamping plates 56 may shift left-right, causing the holding position of the circuit board 12 held by the pair of lifting plates 55 and the pair of clamping plates 56 to shift. If the holding position of the circuit board 12 is shifted in this way, there is a risk that the leads 108 of the new lead component 106 cannot be properly inserted into the through holes 104 of the circuit board 12 .

[0030] Therefore, after the leads 108 of the lead component 106 are inserted into the through holes 104 of the circuit board 12 and the leads 108 inserted into the through holes 104 are clinched, the mark camera 26 again images the fiducial marks 210 on the circuit board 12, and the positional deviation of the circuit board 12 is calculated based on the image data of the second image. Specifically, as described above, when the circuit board 12 is carried into the component mounter 10 and clamped by the clamp device 52, the mark camera 26 images the fiducial marks 210 on the circuit board 12. Then, the controller 190 calculates the holding position of the circuit board 12 based on the image data. At this time, the calculated holding position of the circuit board 12 is the first holding position calculated for this circuit board 12.

[0031] Then, when the circuit board 12 is clamped by the clamping device 52, the leads are inserted into the through holes 104 of the clamped circuit board 12. At this time, the controller 190 corrects the lead insertion position based on the first holding position of the circuit board 12 calculated. In other words, when the working heads 60, 62 holding the lead component 106 move above the circuit board 12, the controller 190 corrects the stopping positions of the working heads 60, 62 based on the first holding position of the circuit board 12 calculated. Then, the working heads 60, 62 are lowered, so that the leads 108 of the lead component 106 are inserted into the through holes 104 of the circuit board 12. Next, the cut-and-clinch device 34 is operated according to the procedure described above, so that the leads inserted into the through holes 104 are cut and clinched.

[0032] In this way, when the lead inserted into the through hole 104 is cut and clinched, the mark camera 26 captures an image of the fiducial mark 210 on the circuit board 12 again, and the controller 190 recalculates the holding position of the circuit board 12 based on the image data from the recapture. At this time, the calculated holding position of the circuit board 12 is the second holding position calculated for this circuit board 12. The controller 190 then calculates the difference between the first and second holding positions calculated for the circuit board 12, and calculates this difference as the positional deviation of the circuit board 12.

[0033] In this way, after calculating the positional misalignment of circuit board 12, controller 190 inserts the leads of a lead component other than the previously mounted lead component into through-hole 104 of circuit board 12 based on the calculated positional misalignment of circuit board 12. In other words, when the leads of lead component 106a are inserted into through-hole 104a (see FIG. 8 ) of circuit board 12, the insertion position of the leads is corrected based on the first holding position, as described above. Then, after the leads of lead component 106a mounted in through-hole 104a are clinched, mark camera 26 images circuit board 12 again, and controller 190 calculates the second holding position based on the image data, thereby calculating the positional misalignment of circuit board 12.

[0034] Furthermore, after the lead of lead component 106a is inserted into through hole 104a and clinched, the lead of lead component 106b, which is different from lead component 106a, is inserted into through hole 104b (see FIG. 8), which is different from through hole 104a. Therefore, when the lead of lead component 106b is inserted into through hole 104b, controller 190 corrects the insertion position of the lead based on the calculated positional misalignment of circuit board 12. This allows the lead of lead component 106b to be properly inserted into through hole 104b, even if the position of circuit board 12 is misaligned when the lead of lead component 106a inserted into through hole 104a is clamped.

[0035] Note that there are lead components that are prone to causing displacement of the circuit board 12 when the leads inserted into the through holes 104 are clinched, and there are lead components that are unlikely to cause displacement of the circuit board 12. For example, if the leads 108 of the lead component 106 are made of a hard material or if the leads 108 of the lead component 106 have a large diameter, a large load is applied to the inner walls of the through holes 104 when the leads 108 are clinched, making it easy for the holding position of the circuit board 12 to be displaced. On the other hand, if the leads 108 of the lead component 106 are made of a soft material or if the leads 108 of the lead component 106 have a small diameter, a small load is applied to the inner walls of the through holes 104 when the leads 108 are clinched, making it difficult for the holding position of the circuit board 12 to be displaced. In view of this, whether or not mark camera 26 takes an image of circuit board 12 again and controller 190 executes a process of calculating the positional misalignment of circuit board 12 is set according to the lead components mounted on circuit board 12. Note that the process of mark camera 26 taking an image of circuit board 12 again and controller 190 calculating the positional misalignment of circuit board 12 is abbreviated to a process of mark camera 26 taking an image of circuit board 12 again.

[0036] Specifically, as described above, the work of placing components on the circuit board 12 is carried out in accordance with the processing of the production program 200, which is programmed with the placement order, placement position, etc. for each component to be placed. Therefore, the production program 200 is programmed to determine whether or not the mark camera 26 will re-image the circuit board 12. Specifically, as shown in Fig. 11, the production program 200 is programmed so that the mark camera 26 will not re-image the circuit board 12 for the first, third, fourth, sixth, and eighth lead components, but will re-image the circuit board 12 for the second, fifth, and seventh lead components.

[0037] For this reason, first, when inserting the leads of the first lead component held by the work head into through-hole 104 of the circuit board, controller 190 corrects the insertion position of the leads based on the calculated first holding position of the circuit board. Then, after clinching the leads of the first lead component inserted into through-hole 104, controller 190 does not execute the process of re-imaging the circuit board 12 with mark camera 26. Therefore, controller 190 corrects the insertion position for inserting the leads of the second lead component held by the work head into through-hole 104 of the circuit board based on the calculated first holding position. Then, after clinching the leads of the second lead component inserted into through-hole 104, controller 190 executes the process of re-imaging the circuit board 12 with mark camera 26. Then, based on the image data acquired by again imaging the circuit board 12, controller 190 calculates the second holding position of the circuit board 12. Then, the controller 190 calculates the difference between the calculated first holding position and second holding position of the circuit board as the positional deviation of the circuit board 12 caused by clinching the leads of the first lead component.

[0038] Next, controller 190 corrects the lead insertion position based on the calculated positional deviation of circuit board 12, and the work head inserts the lead of the held third lead component into through hole 104. Then, the lead of the third lead component inserted into through hole 104 is clinched, but after the lead of the third lead component is clinched, controller 190 does not execute the process of re-imaging the circuit board 12 with mark camera 26. Next, controller 190 corrects the lead insertion position based on the calculated positional deviation of circuit board 12, and the work head inserts the lead of the held fourth lead component into through hole 104. Then, the lead of the fourth lead component inserted into through hole 104 is clinched, but after the lead of the fourth lead component is clinched, controller 190 does not execute the process of re-imaging the circuit board 12 with mark camera 26.

[0039] Next, controller 190 corrects the lead insertion position based on the calculated positional misalignment of circuit board 12, and the work head inserts the lead of the held fifth lead component into through hole 104. Then, after clinching the lead of the fifth lead component inserted into through hole 104, controller 190 executes a process of imaging circuit board 12 again with mark camera 26. Then, based on the image data acquired by imaging circuit board 12 again, controller 190 calculates a third holding position of circuit board 12. Then, controller 190 calculates the difference between the calculated holding position and the calculated holding position of circuit board 12 as the positional misalignment of circuit board 12 caused by clinching the lead of the fifth lead component, and updates the calculated positional misalignment of circuit board 12 as the new positional misalignment of circuit board 12. Next, controller 190 corrects the lead insertion position based on the updated positional misalignment of circuit board 12, and the work head inserts the lead of the held sixth lead component into through hole 104. Then, the leads of the sixth lead component inserted into the through hole 104 are clinched, but after clinching the leads of the sixth lead component, the controller 190 does not execute the process of taking an image of the circuit board 12 again with the mark camera 26.

[0040] In this way, by setting whether or not mark camera 26 performs the process of re-imaging circuit board 12 depending on the lead component to be mounted on circuit board 12, it is possible to prevent the cycle time for mounting lead components on a circuit board from becoming long. In other words, if mark camera 26 were to perform the process of re-imaging circuit board 12 for all lead components to be mounted on circuit board 12, the cycle time would be long. On the other hand, if mark camera 26 performs the process of re-imaging circuit board 12 only for lead components that are prone to misalignment on circuit board 12, and does not perform the process of re-imaging circuit board 12 for lead components that are less likely to misalign on circuit board 12, it is possible to prevent the cycle time from becoming long.

[0041] The component mounter 10 is an example of a component mounting device. The circuit board 12 is an example of a substrate. The mark camera 26 is an example of an imaging device. The through hole 104 is an example of a through hole. The lead component 106 is an example of a lead component. The lead 108 is an example of a lead. The fiducial mark 210 is an example of a fiducial mark.

[0042] Furthermore, the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the fiducial mark 210 is marked on the circuit board 12 as a symbol for identifying the position of the circuit board 12, but a hole, protrusion, or the like for identifying the position of the circuit board 12 may be used instead of the fiducial mark 210. Furthermore, a characteristic portion of the circuit board 12, specifically a through-hole, pattern, land, or the like, may be used instead of the fiducial mark 210.

[0043] Furthermore, in the above embodiment, whether or not the mark camera 26 executes the process of re-imaging the circuit board 12 is programmed into the production program 200. However, instead of programming this into the production program 200, this may be stored in the memory of the control device 36 or the like. Furthermore, in the above embodiment, whether or not the mark camera 26 executes the process of re-imaging the circuit board 12 is set depending on the component to be mounted on the circuit board 12. In other words, whether or not the mark camera 26 executes the process of re-imaging the circuit board 12 is set for each component to be mounted on the circuit board 12. On the other hand, components for which the mark camera 26 executes the process of re-imaging the circuit board 12 may be set. In such a case, the controller 190 causes the mark camera 26 to execute the process of re-imaging the circuit board 12 only for the set component, and does not cause the mark camera 26 to execute the process of re-imaging the circuit board 12 for components that are not set. Furthermore, whether or not the mark camera 26 executes the process of re-imaging the circuit board 12 may be set depending on the type of component to be mounted on the circuit board 12. For example, the control device 36 may store type A components as the type of components for which the mark camera 26 will execute the process of re-imaging the circuit board 12. In such a case, the controller 190 causes the mark camera 26 to execute the process of re-imaging the circuit board 12 for type A components, but does not cause the mark camera 26 to execute the process of re-imaging the circuit board 12 for components other than type A.

[0044] Furthermore, in the above embodiment, mark camera 26 performs a process of re-imaging circuit board 12 for some of all lead components to be mounted on circuit board 12, but mark camera 26 may also perform a process of re-imaging circuit board 12 for all lead components to be mounted on circuit board 12. In such a case, it becomes possible to properly insert the leads of all lead components to be mounted on circuit board 12 into through holes 104.

[0045] Furthermore, in the above embodiment, the cut and clinch unit 100 is used to cut and bend the leads of the lead component, but a clinching device that only bends the leads of the lead component without cutting them may also be used.

[0046] The contents disclosed in this specification are not limited to the dependent relationships described in the claims. For example, this specification also discloses the technical idea of ​​replacing "the component mounting device according to claim 1" in claim 3 with "the component mounting device according to claim 1 or claim 2."

[0047] 10: Component mounter (component mounting device) 12: Circuit substrate (substrate) 26: Mark camera (imaging device) 104: Through hole 106: Lead component 108: Lead 210: Fiducial mark

Claims

1. A component mounting device in which an imaging device images a circuit board, the leads of a lead component are inserted into through holes in the circuit board imaged by the imaging device, the leads of the lead component inserted into the through holes in the circuit board are clinched, the imaging device images the circuit board again after the leads have been clinched, and the positional misalignment of the circuit board is calculated based on the image data obtained by the imaging device after imaging the circuit board again.

2. A component mounting device as described in claim 1, wherein, based on the calculated positional misalignment of the board, the leads of a lead component other than the lead component having the clinched leads are inserted into a through-hole in the board other than the through-hole into which the clinched leads are inserted.

3. The component mounting device according to claim 1, wherein whether or not said imaging device takes another image of said board is set according to the lead component having the leads to be clinched.

4. A component mounting device according to any one of claims 1 to 3, which captures an image of a fiducial mark on a board.

Images