Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing electronic component

Abstract

Provided is a liquid compression molding material which has excellent injectability and forms a cured product containing few aggregates.　This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used for at least sealing a gap between an element and a substrate, wherein the initial viscosity at 25ºC is 10-250 Pa∙s, and a cured product obtained by curing the liquid compression molding material under condition (1) satisfies condition (2). (1) The molding temperature is 150ºC, the molding time is 700 seconds, the curing temperature is 180ºC, and the curing time is 60 minutes. (2) When a region of 250 μm×180 μm in length and width on a cross section of the cured product is observed with a scanning electron microscope (magnification: 500 times), the area ratio of aggregates, which have a circle equivalent diameter of at least 1 μm and are present in said region, is at most 1.0%.

Description

Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing electronic component

[0001] The present invention relates to a liquid compression molding material, an electronic component, a semiconductor device, and a method for manufacturing an electronic component.

[0002] Many semiconductor elements, such as integrated circuits, that constitute semiconductor devices are encapsulated with an encapsulant. Various resin compositions have been proposed for use in such encapsulants (see, for example, Patent Documents 1 and 2). While several molding methods exist for encapsulating semiconductor elements, compression molding, which is more suitable for producing relatively large molded products, has recently been increasingly adopted for encapsulating semiconductor elements. This is due to the increasing popularity of wafer-level chip-size packaging technology (a technology for encapsulating wafers that have not yet been cut into chips after circuit formation has been completed). Furthermore, when manufacturing various devices using compression molding, organic substrates may also be used as substrates in addition to inorganic substrates such as silicon wafers.

[0003] Conventional curable resin compositions used for encapsulating semiconductor elements by compression molding have mainly been solid resin compositions such as granular ones. However, with the recent development of new compression molding techniques, liquid curable resin compositions (so-called liquid compression molding materials) have been increasingly used. Hereinafter, liquid compression molding materials may be abbreviated as "LCM (Liquid Compression Molding) materials."

[0004] LCM materials are required to have excellent injectability during compression molding as well as storage stability. Latent curing catalysts are used to achieve this storage stability. A typical example of a latent curing catalyst is a microencapsulated latent curing catalyst, which is used in many resin compositions, including LCM materials, due to its high storage stability. For example, in the liquid resin composition for electronic components described in Patent Document 2, a microencapsulated imidazole derivative is used as a microencapsulated latent curing catalyst.

[0005] JP 2021-161206 A JP 2007-182562 A

[0006] On the other hand, when compression molding is performed using an LCM material, foreign matter contained in the LCM material or its cured product can cause poor injection of the LCM material during compression molding, and poor appearance of the LCM material and / or its cured product. Therefore, the inventors conducted a composition analysis of the foreign matter in the cured product. As a result, it was found that the main component constituting the foreign matter was a resin component. From this analysis result, the inventors inferred that the foreign matter contained in the LCM material containing a microencapsulated latent curing catalyst and its cured product originated from aggregates of the microencapsulated latent curing catalyst.

[0007] The reasons for this are as follows. First, in a microencapsulated latent curing catalyst, the curing catalyst component is enclosed in tiny capsules. Therefore, to prepare an LCM material containing a microencapsulated latent curing catalyst without destroying the capsules, a dispersion process must be performed by applying a relatively weaker shear force to the raw material solution used to prepare the LCM material, compared to an LCM material containing a non-microencapsulated curing catalyst. As a result, in an LCM material containing a microencapsulated latent curing catalyst, the latent curing catalysts are more likely to form aggregates. When heat is applied to the LCM material during compression molding in this state, the curing catalyst inside the capsules is released from the capsules, and the curing reaction proceeds. At the same time, the inorganic filler cannot penetrate into the capsules that form the aggregates after the curing catalyst is released, and the resin component penetrates and hardens. As a result, the cured LCM material also contains aggregates primarily composed of resin components, as revealed by the above-mentioned analysis results.

[0008] The present invention has been made in view of the above circumstances, and an object of the first invention is to provide a liquid compression molding material that has excellent injectability during compression molding and contains few aggregates in the cured product, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material.An object of the second invention is to provide a liquid compression molding material that has excellent injectability during compression molding and contains few aggregates in the cured product, and also has excellent storage stability and fast curing properties, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material.

[0009] The above object can be achieved by the present invention described below. That is, the liquid compression molding material of the first aspect of the present invention comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used in an electronic component including a substrate and an element disposed on the substrate to at least seal a gap between the element and the substrate, wherein the liquid compression molding material has an initial viscosity of 10 Pa s to 460 Pa s at 25°C, and a cured product obtained by curing the liquid compression molding material under the conditions shown in (1) below satisfies the conditions shown in (2) below: (1) molding temperature: 150°C, molding time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes (2) when a cross section of the cured material is observed with a scanning electron microscope (magnification: 500x) over an area of ​​250 μm × 180 μm, the area ratio of aggregates with a circle-equivalent diameter of 1 μm or more present in the area is 1.0% or less.

[0010] In one embodiment of the liquid compression molding material of the first invention, the (D) curing catalyst is preferably a non-microencapsulated curing catalyst.

[0011] In another embodiment of the liquid compression molding material of the first present invention, it is preferable that the non-microencapsulated curing catalyst includes at least one selected from the group consisting of imidazole compounds and modified aliphatic polyamine compounds.

[0012] In another embodiment of the liquid compression molding material of the first present invention, it is preferable that the non-microencapsulated curing catalyst contains at least one compound selected from the group consisting of imidazole compounds having a melting point of 200°C or higher and modified aliphatic polyamine compounds having a melting point of 130°C or higher.

[0013] A second liquid compression molding material of the present invention comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an imidazole compound having a melting point of 200°C or higher as a curing catalyst, and has an initial viscosity of 10 Pa s to 460 Pa s at 25°C. The liquid compression molding material is used at least for sealing a gap between a substrate and an element disposed on the substrate in an electronic component having the element and the substrate.

[0014] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, it is preferable that the (B) curing agent includes at least one selected from the group consisting of acid anhydride curing agents and phenolic curing agents.

[0015] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the (B) curing agent preferably includes an acid anhydride curing agent and a phenolic curing agent.

[0016] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is preferably 60% by mass or more but less than 80% by mass.

[0017] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is preferably 60% by mass to 78.5% by mass.

[0018] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the initial viscosity at 25° C. is preferably 10 Pa·s to 250 Pa·s.

[0019] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the inorganic filler (C) preferably has an average particle size of 0.03 μm to 3 μm.

[0020] The electronic component of the present invention comprises an encapsulant made of a cured product of the liquid compression molding material of the first or second invention.

[0021] The semiconductor device of the present invention comprises a substrate, a semiconductor element disposed on the substrate, and a cured product of the first or second liquid compression molding material of the present invention that seals the gap between the semiconductor element and the substrate.

[0022] In one embodiment of the semiconductor device of the present invention, it is preferable that the cured product contains aggregates, and that the maximum equivalent circle diameter of the aggregates is 4 μm or less.

[0023] The method for producing an electronic component of the present invention includes at least a compression molding step using the liquid compression molding material of the first or second present invention, and produces an electronic component including a substrate, an element disposed on the substrate, and a sealing material made of a cured product of the liquid compression molding material that seals the gap between the element and the substrate.

[0024] In one embodiment of the method for producing an electronic component of the present invention, the cured product preferably contains aggregates, and the aggregates have a maximum equivalent circle diameter of 4 μm or less.

[0025] According to the first aspect of the present invention, it is possible to provide a liquid compression molding material that has excellent injectability during compression molding and contains little agglomerates in the cured product, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material. Also, according to the second aspect of the present invention, it is possible to provide a liquid compression molding material that has excellent injectability during compression molding and contains little agglomerates in the cured product, and that also has excellent storage stability and rapid curing properties, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material.

[0026] The LCM material of the first embodiment includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst. The LCM material of the first embodiment has an initial viscosity of 10 Pa·s to 460 Pa·s at 25°C, and a cured product obtained by curing the LCM material under the conditions shown in (1) below satisfies the conditions shown in (2) below: (1) Mold temperature: 150°C, mold time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes. (2) When a cross section of the cured material is observed under a scanning electron microscope (magnification: 500x) in an area of ​​250 μm x 180 μm, the area ratio of aggregates with a circle-equivalent diameter of 1 μm or more present in the area is 1.0% or less.

[0027] This allows for an LCM material that has excellent injectability during compression molding and contains few aggregates in the cured product. The area ratio is preferably 0.5% or less, more preferably 0.2% or less, even more preferably 0.1% or less, and most preferably 0%.

[0028] Since the aggregates contained in the cured product are thought to correspond to the aggregates present in the LCM material before curing, it is presumed that the maximum diameter of the aggregates observed in the cured product roughly corresponds to the maximum diameter of the aggregates present in the LCM material. The presence or absence and size of aggregates present in the LCM material affect the injectability of the LCM material during compression molding to some extent, particularly when the LCM material is injected through a gap of a size relatively similar to the maximum diameter of the aggregates (e.g., a gap length of several microns to several tens of microns). Taking these points into consideration, in terms of improving injectability, particularly at narrower gap lengths, the maximum diameter (maximum diameter of the circle equivalent diameter) of the aggregates contained in the cured product is preferably 4 μm or less, more preferably 3 μm or less, and even more preferably 1 μm or less.

[0029] Furthermore, the LCM material of the first embodiment and the LCM material of the second embodiment described below are resin compositions used at least to seal the gap between a substrate and an element (such as a semiconductor element) arranged on the substrate in an electronic component (such as a semiconductor device) including the substrate and the element. Compression molding is generally performed by a process such as (i) supplying the LCM material into a mold, pressing a laminate formed by stacking the substrate and the element with a gap between them against the LCM material that has spread horizontally in the mold, and then clamping the mold to harden the LCM material in this state, or (ii) applying the LCM material to a laminate formed by stacking the substrate and the element with a gap between them, clamping the mold, and then curing the LCM material in this state. In these processes, the LCM material is injected into the gap formed between the substrate and the element, covering the element, and curing in this state to complete the sealing process. Electronic components such as semiconductor devices are manufactured through these processes. Therefore, the cured LCM material is present in the electronic component, covering the element and interposed between the element and the substrate.

[0030] The length of gaps in electronic components such as semiconductor devices manufactured using LCM material is generally 10 μm to 30 μm. Therefore, in order to quickly inject the LCM material into the entire narrow gap during compression molding and prevent poor injection performance, the LCM material needs to have appropriate fluidity (low viscosity).

[0031] Next, the components contained in the LCM material of the first embodiment will be described in detail below.

[0032] (A) Epoxy Resin The epoxy resin used in the LCM material of the first embodiment is not particularly limited as long as it is a variety of epoxy resins commonly used for semiconductor encapsulation. However, from the viewpoint of the viscosity and injectability required for LCM, it is preferable to use a liquid epoxy resin. Furthermore, the epoxy resin blended into the LCM material may be a single type of epoxy resin, or two or more types of epoxy resins may be used in combination. The epoxy resin may further contain functional groups other than epoxy groups (e.g., acrylic groups, methacrylic groups, etc.) as necessary, but it is not necessary to contain other functional groups such as acrylic groups or methacrylic groups.

[0033] Specific examples of epoxy resins include, but are not limited to, aromatic epoxy resins and aliphatic epoxy resins. Examples of aromatic epoxy resins include bisphenol A-type epoxy resins such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether; bisphenol F-type epoxy resins; novolac-type epoxy resins; fluorene-type epoxy resins; biphenyl aralkyl epoxy resins; diepoxy resins such as p-tert-butylphenyl glycidyl ether and 1,4-phenyldimethanol diglycidyl ether; biphenyl-type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; aminophenol-type epoxy resins such as diglycidylaniline, diglycidyltoluidine, triglycidyl-p-aminophenol, and tetraglycidyl-m-xylylenediamine; naphthalene-type epoxy resins; and epoxy resins having a plant-derived skeleton.

[0034] Specific examples of aliphatic epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule, such as alkyl alcohol glycidyl ethers (butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.) and alkenyl alcohol glycidyl ethers (vinyl glycidyl ether, allyl glycidyl ether, etc.); difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as polyalkylene glycol diglycidyl ethers (e.g., alkylene glycol diglycidyl ether, polytetramethylene glycol diglycidyl ether), and alkenylene glycol diglycidyl ether; and polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, such as polyglycidyl ethers of trifunctional or higher alcohols (e.g., trimethylolpropane triglycidyl ether, pentaerythritol (tri- or tetra-)glycidyl ether, dipentaerythritol (tri-, tetra-, penta-, or hexa-)glycidyl ether, etc.).

[0035] Among these epoxy resins, liquid bisphenol-type epoxy resins, liquid naphthalene-type epoxy resins, and liquid aminophenol-type epoxy resins are preferred from the viewpoints of workability and injectability. The content of the epoxy resin relative to the total amount of the LCM material is preferably 3% by mass to 40% by mass, more preferably 4% by mass to 30% by mass, and even more preferably 5% by mass to 25% by mass.

[0036] (B) Curing Agent Any known curing agent for epoxy resins can be used for the LCM material of the first embodiment, but it is preferable to use a phenol-based curing agent and / or an acid anhydride-based curing agent.

[0037] (B1) Phenolic Curing Agents Phenolic curing agents have the effect of lowering the glass transition temperature (Tg) of the cured product. Any monomer, oligomer, or polymer having a phenolic hydroxyl group can be used as the phenolic curing agent. Examples include phenol novolac resins, alkylated phenol novolac resins, allylated phenol novolac resins, cresol novolac resins, phenol aralkyl resins (resins containing a phenylene skeleton and / or a biphenylene skeleton), naphthol aralkyl resins, triphenolmethane resins, dicyclopentadiene-type phenolic resins, and imide-modified phenolic resins (including liquid types). However, it is preferable to use phenolic curing agents other than imide-modified phenolic resins. Furthermore, when using imide-modified phenolic resins, their amount in the curing agent is preferably greater than 0% by mass and less than 50% by mass, more preferably greater than 0% by mass and 30% by mass or less, and even more preferably greater than 0% by mass and 10% by mass or less. The phenolic curing agent to be blended into the LCM may be a single type of phenolic curing agent or a combination of two or more types of phenolic curing agents. From the viewpoint of workability, it is preferable to use a phenolic curing agent that is liquid at 25°C. Furthermore, from the viewpoint of the effect of lowering the glass transition temperature Tg of the cured product, a phenolic novolac resin with particularly little steric hindrance is preferred.

[0038] (B2) Acid Anhydride Curing Agents Acid anhydride curing agents reduce the viscosity of the LCM material and increase the glass transition temperature (Tg) of the cured product. Examples of acid anhydride curing agents include phthalic anhydride (e.g., alkylated hydrophthalic anhydrides such as methyltetrahydrophthalic anhydride and methylhexahydrophthalic anhydride; hexahydrophthalic anhydride, etc.), methyl hydric anhydride, alkenyl-substituted succinic anhydride, methyl nadic anhydride, and glutaric anhydride. The acid anhydride curing agent blended into the LCM material may be a single type of acid anhydride curing agent, or two or more types of acid anhydride curing agents may be used in combination. Among these acid anhydride curing agents, methyltetrahydrophthalic anhydride and methylhexahydrophthalic anhydride are preferred because they have excellent electrical insulation properties and heat resistance, and are liquid at room temperature (25°C).

[0039] In the LCM material of the first embodiment, it is particularly preferable to use a combination of a (B1) phenolic curing agent and a (B2) acid anhydride curing agent as the (B) curing agent. In this case, the blending ratio of the (B1) phenolic curing agent and the (B2) acid anhydride curing agent is not particularly limited, but the ratio of the phenol equivalent b1 of the (B1) phenolic curing agent to the acid anhydride equivalent b2 of the (B2) acid anhydride curing agent, i.e., the equivalent ratio b1:b2, is preferably 10:90 to 90:10, more preferably 15:85 to 85:15, even more preferably 35:65 to 80:20, particularly preferably 45:55 to 80:20, and most preferably 45:55 to 55:45. The phenol equivalent b1 is calculated by dividing the mass of the component (B1) by the hydroxyl group equivalent in the component (B1), and the acid anhydride equivalent b2 is calculated by dividing the mass of the component (B2) by the acid anhydride group equivalent in the component (B2).

[0040] When the equivalent ratio b1:b2 is within the range of 10:90 to 90:10, (i) it is easier to ensure the excellent fast curing properties of the LCM material, and (ii) it is easier to adjust the glass transition temperature Tg of the cured product to within the range of 50°C to 120°C, thereby making it easier to suppress warpage of encapsulated articles such as semiconductor devices manufactured using the LCM material. The reason for the effect of (ii) is as follows. First, the elastic modulus of the cured product of a resin composition generally changes significantly with the glass transition temperature Tg as the boundary, and the cured product has a relatively very high elastic modulus in the temperature range below the glass transition temperature Tg when the cured product is in a glassy state, and a relatively very low elastic modulus in the temperature range above the glass transition temperature Tg when the cured product is in a rubbery state. Meanwhile, in a compression molding process using an LCM material, the heating temperature during molding and the heating temperature for the post-cure performed after molding are usually carried out at temperatures exceeding approximately 130°C. Therefore, if the glass transition temperature Tg of the cured product is set to 120°C or less, the elastic modulus of the cured product can be made very low near the heating temperature during molding or post-cure, thereby alleviating internal stress caused by differences in the degree of shrinkage of the components constituting the sealed article during the cooling process after heating, and as a result, warping of the sealed article can be suppressed. The glass transition temperature Tg can be measured by the DMA (Dynamic Mechanical Analysis) method described below.

[0041] The mass ratio of the (B1) phenolic curing agent to the (B2) acid anhydride curing agent is not particularly limited as long as the equivalent ratio b1:b2 can be adjusted within the range of 10:90 to 90:10. However, the mass ratio is usually preferably 10:90 to 90:10, more preferably 15:85 to 85:15, and even more preferably 35:65 to 80:20.

[0042] The content of the (B) curing agent in the entire resin composition constituting the LCM material is preferably 2% by mass or more, more preferably 5% by mass or more, and even more preferably 8% by mass or more, from the viewpoint of ensuring sufficient curability. On the other hand, the upper limit of the content is not particularly limited, but from the viewpoint of the blending balance with other components blended in the resin composition, it is practically preferably 50% by mass or less, more preferably 30% by mass or less, and even more preferably 20% by mass or less.

[0043] (C) Inorganic Filler The inorganic filler is not particularly limited as long as it has the effect of reducing the linear expansion coefficient of the cured product obtained by curing the LCM material. Examples of inorganic filler materials include silica, alumina, aluminum, aluminum nitride, silicon carbide, and silicon nitride. As the inorganic filler, silica or alumina is particularly suitable from the viewpoint of being able to increase the amount of inorganic filler blended (filling amount) in the resin composition. In addition, the inorganic filler may be surface-treated with a surface treatment agent such as a silane coupling agent. In addition, the inorganic filler blended in the resin composition may be one type of inorganic filler alone, or two or more types of inorganic fillers may be used in combination.

[0044] The shape of the inorganic filler is not particularly limited and may be spherical, amorphous, flaky, or any other shape. Meanwhile, as described above, the gap length into which the LCM material is injected during compression molding is generally 10 to 30 μm. However, if the LCM material contains particles with a relatively large particle size (5 to 10 μm or more) in relation to this gap length, problems such as poor injection of the LCM material during compression molding are likely to occur. From this perspective, the average particle size of the inorganic filler is preferably 0.001 μm to 4 μm, more preferably 0.005 μm to 4 μm, even more preferably 0.01 μm to 3 μm, and particularly preferably 0.03 μm to 3 μm. If the average particle size of the inorganic filler exceeds 4 μm, it becomes extremely difficult to seal the gap between an element such as a semiconductor element and a substrate using the LCM material of this embodiment. The average particle size refers to the volume average particle size D50 (particle size at 50% of the cumulative size from the small diameter side of the volume-based particle size distribution) value measured using a laser diffraction particle size distribution measuring device.

[0045] To further reduce the viscosity of the LCM material while maintaining a high inorganic filler content, it is preferable to use a combination of two inorganic fillers with different volume average particle diameters D50. In this case, the ratio (DL / DS) of the volume average particle diameter D50 (DL) of the large inorganic filler to the volume average particle diameter D50 (DS) of the small inorganic filler is preferably 4 to 30, more preferably 8 to 15, and the ratio (AL / AS) of the content (AL) of the large inorganic filler to the content (AS) of the small inorganic filler is preferably 1 to 5, more preferably 2 to 4.

[0046] The inorganic filler content of the entire LCM material is preferably less than 80% by mass, more preferably 78.5% by mass or less, even more preferably 77% by mass or less, and particularly preferably 74.5% by mass or less, from the viewpoint of facilitating the preparation of the LCM material and ensuring viscosity suitable for compression molding. If the inorganic filler content exceeds 78.5% by mass, particularly 80% by mass or more, the viscosity of the LCM material becomes too high, significantly deteriorating its injectability into the gap between an element such as a semiconductor element and a substrate, making its use as an LCM material difficult. Furthermore, from the viewpoint of reducing the thermal expansion coefficient of the cured product and further suppressing warpage, the inorganic filler content is preferably 60% by mass or more, more preferably 65% ​​by mass or more, even more preferably 67% by mass or more, and particularly preferably 70% by mass or more. Suitable combinations of the upper and lower limits of the inorganic filler content include a combination of any value selected from the above-mentioned upper limits and any value selected from the above-mentioned lower limits.

[0047] (D) Curing Catalyst The curing catalyst used in the LCM material of the first embodiment is not particularly limited as long as it satisfies condition (2) when the cross section of the cured product obtained by curing the LCM material under the aforementioned condition (1) is observed with a scanning electron microscope (SEM). However, a non-microencapsulated curing catalyst can be suitably used as such a curing catalyst. Note that, in this specification, the term "non-microencapsulated curing catalyst" does not refer to a curing catalyst having a core portion and a shell portion covering the core portion, in which the core portion contains a curing catalyst component, and the shell portion is composed of an epoxy compound or the like, thereby suppressing the curing-accelerating function at room temperature or a relatively low temperature range above room temperature, but rather refers to a curing catalyst in which the curing catalyst component is not covered by a protective material such as a shell portion and is in an exposed state. Suitable specific examples of non-microencapsulated curing catalysts include non-microencapsulated imidazole compounds and non-microencapsulated modified aliphatic polyamine compounds (hereinafter simply referred to as "imidazole compounds" and "modified aliphatic polyamine compounds," respectively). By incorporating these into an LCM material, it is possible to suppress the occurrence of aggregates in the LCM material and its cured product.

[0048] Among imidazole compounds and modified aliphatic polyamine compounds, it is preferable to use an imidazole compound with a melting point of 200°C or higher and / or a modified aliphatic polyamine compound with a melting point of 130°C or higher as the curing catalyst to be incorporated into the LCM material, from the viewpoint of realizing an excellent pot life (storage stability), and it is even more preferable to use an imidazole compound with a melting point of 200°C or higher as the curing catalyst to be incorporated into the LCM material, from the viewpoint of realizing even superior rapid curing properties.

[0049] Examples of the imidazole compound include 2-methylimidazole, 2-undecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 2,4-diamino-6-[2'-methylimidazoline-(1')]-ethyl-s-triazine, and the like. Commercially available products include 2E4MZ, 2P4MHZ, 2MA-OK, 2MZ-A, and 2PHZ manufactured by Shikoku Chemicals Corporation. Among these, imidazole compounds having a melting point of 200°C or higher include 2,4-diamino-6-[2'-methylimidazoline-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2,4-diamino-6-vinyl-s-triazine, and commercially available products thereof include 2MA-OK, 2PHZ, and 2MZ-A manufactured by Shikoku Chemicals Corporation. Commercially available modified aliphatic polyamine compounds include EH-4357S manufactured by ADEKA Corporation and Fujicure FXR-1020 and FXR-1030 manufactured by T&K Toka Corporation. Of these, a commercially available modified aliphatic polyamine compound having a melting point of 130°C or higher includes Fujicure FXR-1030 manufactured by T&K Toka Corporation.

[0050] The reasons why the occurrence of agglomerates in the LCM material and its cured product is suppressed when an imidazole compound or a modified aliphatic polyamine compound is used as a curing catalyst are thought to be: (i) there are no capsule-like residues that constitute the microcapsule-type latent curing catalyst; and (ii) when preparing an LCM material containing an imidazole compound or a modified aliphatic polyamine compound, there is no need to consider the destruction of capsules during the dispersion process of the raw material solution, so it is possible to apply a shear force that is sufficient to prevent the occurrence of agglomerates.

[0051] The non-microencapsulated curing catalyst may be used alone or in combination of two or more. When at least one of an imidazole compound having a melting point of 200°C or higher and a modified aliphatic polyamine compound having a melting point of 130°C or higher is used, a curing catalyst other than these may be used in combination.

[0052] From the viewpoint of obtaining an LCM material that has few aggregates in the LCM material and the cured product thereof, has excellent storage stability, and also has excellent fast-curing properties, it is preferable to use an imidazole compound having a melting point of 200°C or higher as the curing catalyst (D), and from the viewpoint of obtaining even better effects, it is more preferable to use 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct (a commercially available product, for example, 2MA-OK).

[0053] From the viewpoint of obtaining an LCM material and its cured product with minimal agglomerates, it is preferable that the curing catalyst used in the LCM material of the first embodiment substantially does not contain a microencapsulated latent curing catalyst. If the curing catalyst blended into the LCM material of the first embodiment contains a microencapsulated curing catalyst as a main component, the aforementioned condition (2) cannot be satisfied. From this viewpoint, it is preferable that the LCM material of the first embodiment does not contain any microencapsulated latent curing catalyst. Even if the LCM material contains a microencapsulated latent curing catalyst, in order to suppress the occurrence of agglomerates in the cured product, the content of the microencapsulated latent curing catalyst is preferably greater than 0% by mass and less than or equal to 5% by mass, more preferably greater than 0% by mass and less than or equal to 2% by mass, and even more preferably greater than 0% by mass and less than or equal to 1% by mass, based on the total LCM material.

[0054] The amount of non-microencapsulated curing catalyst blended into the LCM material is not particularly limited, but is typically about 0.5 to 10 parts by weight per 100 parts by weight of epoxy resin. When the non-microencapsulated curing catalyst is 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, the blending amount is preferably 2.0 to 3.8 parts by weight, more preferably 2.3 to 3.4 parts by weight, per 100 parts by weight of epoxy resin. This allows for a good balance between suppressing warpage of intermediate products produced using the LCM material before being singulated by dicing or the like, and suppressing cracks that occur during dicing.

[0055] (E) Other Components The LCM material of the first embodiment may further contain other components in addition to the above components (A) to (D), as necessary. Examples of other optional components include resin components other than epoxy resins, alcohol compounds, coupling agents, pigments, ion trapping agents, leveling agents, antioxidants, antifoaming agents, flame retardants, colorants, reactive diluents, and elastomers. The amount of other components added can be selected appropriately depending on the type of component.

[0056] Examples of resin components other than epoxy resin include acrylic copolymers, but other resin components may not be used at all. When using other resin components other than epoxy resin, such as acrylic copolymers, the amount of the resin added is preferably more than 0% by mass and less than 50% by mass, more preferably more than 0% by mass and not more than 30% by mass, and even more preferably more than 0% by mass and not more than 10% by mass, based on the total mass of the LCM material.

[0057] Examples of the alcohol compound include polycarbonate diol compounds having a tetramethylene glycol structure as an alkylene glycol structure, and polytetramethylene ether glycol. Commercially available alcohol compounds include PEPCD NT2006 (a polycarbonate diol compound having a tetramethylene glycol structure as an alkylene glycol structure, liquid (transparent) at 25°C, number average molecular weight 2000, glass transition temperature -84°C, manufactured by Mitsubishi Chemical Corporation), PEPCD NT2002 (a polycarbonate diol compound having a tetramethylene glycol structure as an alkylene glycol structure, liquid (transparent) at 25°C, number average molecular weight 2000, glass transition temperature -71°C, manufactured by Mitsubishi Chemical Corporation), PTMG 2000 (polytetramethylene ether glycol, number average molecular weight: 2000, manufactured by Mitsubishi Chemical Corporation), and PTMG 3000 (polytetramethylene ether glycol, number average molecular weight: 3000, manufactured by Mitsubishi Chemical Corporation). By blending 0.1% to 5% by mass of an alcohol compound with respect to the entire LCM material, warpage after compression molding can be reduced.

[0058] The LCM material of the first embodiment has an initial viscosity at 25°C (viscosity measured within one hour after preparation of the LCM material) of 10 Pa·s to 460 Pa·s. By setting the initial viscosity at 10 Pa·s to 460 Pa·s, it is possible to achieve both easy handling and injectability of the LCM material. The initial viscosity is preferably 10 Pa·s to 350 Pa·s, more preferably 20 Pa·s to 300 Pa·s, and even more preferably 30 Pa·s to 250 Pa·s. From the viewpoint of the storage stability of the LCM material, the 24-hour viscosity increase ratio is preferably 5 times or less, more preferably 3 times or less, and the closer to 1 times the better. Here, the 24-hour viscosity increase ratio refers to the ratio of the 24-hour viscosity at 25°C (viscosity measured 24 hours after preparation of the LCM material) to the initial viscosity at 25°C.

[0059] The LCM material of the first embodiment is prepared by mixing and stirring components (A) to (D) and, optionally, other components (E). Known mixing and stirring means, such as a roll mill or planetary mixer, can be used as appropriate for mixing and stirring. If the epoxy resin (A) is solid, it is preferably liquefied or fluidized by heating or other means before mixing with the other components. Furthermore, when mixing the components, all components may be mixed simultaneously, or some components may be mixed first, and the remaining components may be added and mixed later. The mixing procedure is not particularly limited. If it is difficult to uniformly disperse the inorganic filler (C) in the epoxy resin (A), the remaining components may be added and mixed later to a mixture prepared by first mixing the epoxy resin (A) and the inorganic filler (C).

[0060] Next, the LCM material of the second embodiment will be described. The LCM material of the second embodiment includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an imidazole compound having a melting point of 200°C or higher as a curing catalyst, and has an initial viscosity of 10 Pa·s to 460 Pa·s at 25°C. Like the LCM material of the first embodiment, the LCM material of the second embodiment has excellent injectability during compression molding and can provide an LCM material with few aggregates in the cured product. In addition, the LCM material of the second embodiment also has excellent storage stability and rapid curing properties. In the LCM material of the second embodiment, the components (A) to (C) and the optional additional component (E) can be the same as those in the LCM material of the first embodiment, and the component (D) is the imidazole compound having a melting point of 200°C or higher (a non-microencapsulated curing catalyst) used in the LCM material of the first embodiment. Furthermore, the preferred ranges of the initial viscosity and 24-hour viscosity increase ratio of the LCM material of the second embodiment are preferably the same as those of the LCM material of the first embodiment.

[0061] The LCM material of the first and second embodiments can be used to manufacture any component or product that is produced through at least a compression molding process using the LCM material. Representative examples of such components or products include electronic components that include an encapsulant made of a cured LCM material of the first or second embodiment. Examples of such electronic components include a substrate, an element disposed on the substrate, and a cured LCM material of the first or second embodiment that seals the gap between the element and the substrate. A specific example of an electronic component having such a structure is a semiconductor device that uses semiconductor elements as the elements. In components or products with such gaps, it is preferable that the maximum diameter (maximum circle-equivalent diameter) of the aggregates contained in the cured material be 4 μm or less, as described above, especially when the gap length of the gap is small.

[0062] Specific examples of the present invention will be described below with reference to examples, but the present invention is not limited to the examples described below. In the following description, Experimental Example A is an example corresponding to the LCM materials of the first and second aspects of the present invention, Experimental Example B is an example corresponding to the LCM material of the first aspect of the present invention and a comparative example corresponding to the LCM material of the second aspect of the present invention, and Experimental Example C is a comparative example corresponding to the LCM materials of the first and second aspects of the present invention.

[0063] 1. Preparation of LCM Materials The LCM materials of each experimental example were prepared by mixing and stirring a raw material solution containing the components to obtain the formulation shown in Tables 1 to 3. The raw material solution for preparing the LCM materials of the examples, which used a non-microencapsulated curing catalyst (D) as the curing catalyst, was mixed and stirred under the following mixing and stirring condition 1. The raw material solution for preparing the LCM materials of the comparative examples, which used a microencapsulated latent curing catalyst (D) as the curing catalyst, was mixed and stirred under the following mixing and stirring condition 2. Furthermore, when a phenolic curing agent and an acid anhydride curing agent were used in combination as the (B) curing agent, the curing agent composition was adjusted so that the ratio of the phenol equivalent (b1) of the phenolic curing agent to the acid anhydride equivalent (b2) of the acid anhydride curing agent was 49:51. <Mixing and Stirring Condition 1> The raw material solution obtained by manually mixing the components with a spatula was dispersed using a three-roll mill. <Mixing and Stirring Condition 2> The components were manually mixed with a spatula to obtain a raw material solution, which was then mixed and stirred at 20 rpm for 10 minutes in a vessel equipped with a baffle.

[0064] 2. Raw materials used in preparing the LCM material Details of the components constituting the LCM material shown in Tables 1 to 3 are as follows.

[0065] (A) Epoxy resins: YDF-870GS (bisphenol F type epoxy resin: manufactured by Nippon Steel Chemical & Materials Co., Ltd.), HP-4032D (naphthalene type epoxy resin: manufactured by DIC), jER630LSD (aminophenol type epoxy resin: manufactured by Mitsubishi Chemical Corporation).

[0066] (B) Curing Agent <Phenol-based curing agents> MEH-8005 (liquid phenol novolac resin: manufactured by UBE, hydroxyl equivalent: 135 g / eg) BRM-553 (solid phenol novolac resin: manufactured by AICA Kogyo, hydroxyl equivalent: 108 g / eg) <Acid anhydride-based curing agents> MH-700 (mixture of 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride: manufactured by New Japan Chemical Co., Ltd., acid anhydride equivalent: 164 g / eq) HN-2200 (methyltetrahydrophthalic anhydride: manufactured by Resonac, acid anhydride equivalent: 166 g / eq)

[0067] (C) Inorganic filler SE2200-SME (methacrylic surface-treated silica filler, average particle size 0.5 μm, manufactured by Admatechs) YA050C-SM1 (methacrylic surface-treated silica filler, average particle size 0.05 μm, manufactured by Admatechs) AG2051 SXM (phenylamino surface-treated alumina filler, average particle size: 1 μm, manufactured by Admatechs)

[0068] (D) Curing catalyst <Non-microencapsulated curing catalyst> 2MA-OK (2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct: manufactured by Shikoku Chemical Industries, melting point 260°C) FXR-1030 (amine adduct latent curing agent: manufactured by T&K TOKA, melting point 140°C) 2PHZ (2-phenyl-4,5-bis(hydroxymethyl)imidazole: manufactured by Shikoku Chemical Industries, melting point 230°C) 2E4MZ (2-ethyl-4-methylimidazole: manufactured by Shikoku Chemical Industries, melting point 40°C) 2P4MHZ (2-phenyl-4-methyl-5-hydroxymethylimidazole: manufactured by Shikoku Chemical Industries, melting point 195°C)・EH-4357S (polyamine type latent curing agent: manufactured by ADEKA, melting point 78°C) ・FXR-1020 (amine adduct type latent curing agent: manufactured by T&K TOKA, melting point 124°C) <Microcapsule type latent curing agents> ・HX-3088FR (microcapsule type latent curing agent: manufactured by Asahi Kasei) ・HX-3742 (microcapsule type latent curing agent: manufactured by Asahi Kasei)

[0069] (E) Other components: KBM-403 (silane coupling agent: manufactured by Shin-Etsu Chemical Co., Ltd.) Special Black 4 (pigment: manufactured by Orien Engineered Carbons)

[0070] 3. Evaluation and Measurement Methods Details of the various evaluation and measurement methods for the LCM materials and their cured products in each experimental example are as follows.

[0071] 3.1 Area ratio of aggregates A pre-cured product was obtained by compression molding the LCM material (mold temperature: 150°C, mold time: 700 seconds). This pre-cured product was then heat-treated (curing temperature: 180°C, curing time: 60 minutes) to obtain a cured product (sample for area ratio measurement). The cured product was then cut and the resulting cross section was polished. The polished cross section was then observed at 500x magnification using a scanning electron microscope (SEM) from Hitachi High-Technologies Corporation within an area of ​​250 μm x 180 μm. The area ratio of aggregates with a circle-equivalent diameter of 1 μm or more present in this area (100 × total area of ​​aggregates with a circle-equivalent diameter of 1 μm or more (μm ２ ) / total area of ​​the observation region (250 μm×180 μm) was calculated.

[0072] The cross section of the cured product to be observed by SEM was polished in sequence under the polishing conditions (i) to (vi) below. (i) Polishing with abrasive paper (240 grit) for 3 minutes; (ii) Polishing with abrasive paper (600 grit) for 3 minutes; (iii) Polishing with a polishing pad (LAMPLAN, polishing cloth LAMPLAN410) and a polishing liquid (LAMPLAN, high-press diamond slurry 3 μm) for 3 minutes; (iv) Polishing with a polishing pad (LAMPLAN, polishing cloth LAMPLAN410) and a polishing liquid (LAMPLAN, high-press diamond slurry 1 μm) for 3 minutes; (v) Polishing with a polishing pad (Buehler, Mastertex 0.05 μm) and a polishing liquid (Buehler, Masterprep 0.05 μm) for 3 minutes; (vi) Polishing with a polishing pad (Buehler, Mastertex 0.05 μm) and water instead of a polishing liquid for 30 seconds.

[0073] The area ratio was calculated using WinROOF2018, an image analysis and measurement software from Mitani Corporation. Furthermore, before performing image analysis of the SEM image of the polished cross section, a composition analysis of the granular matter present on the cross section was performed to distinguish between granular matter derived from pigments and inorganic fillers and granular matter derived from aggregates primarily composed of resin, and the contrast differences between each granular matter on the SEM image were identified. Using this information, only the granular matter corresponding to the aggregates was selected for analysis, and image analysis was performed to calculate the area ratio.

[0074] 3.2 Initial Viscosity The viscosity of the LCM material was measured within 1 hour after completion of preparation using a Brookfield HB type viscometer at 25°C and 20 rpm.

[0075] The viscosity of the LCM material 24 hours after preparation (viscosity after 24 hours) was measured at 25°C and 20 rpm using a Brookfield HB viscometer. The ratio of the viscosity after 24 hours to the initial viscosity (viscosity after 24 hours / initial viscosity) was calculated as the viscosity after 24 hours.

[0076] 3.4 Gel Time The time it takes for the LCM material to gel (gel time) was measured using an automatic curing time measuring device "Madoka" manufactured by Matsuo Sangyo Co., Ltd. under the measurement conditions of a rotation speed of 120 rpm, a test temperature of 150°C, and a sample volume of 0.3 ml. The shorter the gel time, the better the rapid curing property. However, if the gel time is too short, there is a high possibility that the LCM material will harden after the start of supply by coating the LCM material on the substrate or release film, etc., but before molding. Therefore, the lower limit of the gel time is practically around 100 to 120 seconds or more, depending on the operating speed of the compression molding device actually used.

[0077] 3.5 Injectability Evaluation Two pieces of tape (thickness: 30 μm) were placed along both ends of the vertical side of a first glass substrate placed on a flat table, and a second glass substrate with the same length and width as the first glass substrate was placed on top of them. However, the second glass substrate was slightly offset in the vertical direction relative to the first glass substrate. In this state, a laminate consisting of the two glass substrates and the two tapes was clamped with clips to fix the glass substrates so that they did not shift horizontally, thereby obtaining a test specimen with two parallel tapes placed between the two glass substrates. In this test specimen, a gap was formed between the two glass substrates and the two tapes. The distance between the two glass substrates (the distance in the thickness direction of the test specimen) was 30 μm, and the distance between the two tapes (the distance in the horizontal direction of the test specimen) was 1 cm.

[0078] Next, the test piece was placed on a hot plate heated to 150°C, and 0.2 g of LCM material was applied to the opening of the gap formed at one end of the test piece in the longitudinal direction. The LCM material was applied so as to be approximately uniform along the horizontal direction of the test piece. After application, the test piece was left for 700 seconds, allowing the LCM material to penetrate from the opening into the gap from one end of the longitudinal direction of the test piece to the other end. After 700 seconds, a CCD camera installed above the test piece was used to measure the maximum penetration distance of the LCM material that penetrated from the opening into the gap in the longitudinal direction of the test piece, with the opening being set as 0 μm (reference position). The evaluation criteria were as follows: A: Maximum penetration distance of the LCM material was 1500 μm or more; B: Maximum penetration distance of the LCM material was 1000 μm or more but less than 1500 μm; and C: Maximum penetration distance of the LCM material was less than 1000 μm.

[0079] 3.6 Glass Transition Temperature Tg The glass transition temperature Tg of the LCM material was measured by DMA (Dynamic Mechanical Analysis) using a DMS6100 from Seiko Instruments Inc. (SII) on a cured product obtained by heating and curing the LCM material at 150°C for 60 minutes. The glass transition temperature Tg is the temperature at which the loss tangent (tanδ) reaches its maximum value in the change curve of tanδ versus temperature measured by the DMA method. Tanδ is calculated by dividing the loss modulus at a given temperature by the storage modulus at that temperature.

[0080] 3.7 Warpage Evaluation Warpage was evaluated using the following procedure. First, the upper and lower molds in the compression molding machine were heated to 150°C, and then an FR4 substrate (GN74240, manufactured by Global Net Co., Ltd.) measuring 74 mm in length, 240 mm in width, and 300 μm in thickness was placed on the upper mold. Next, an LCM material was applied to the release film, and the release film was placed on the lower mold in the compression molding machine with the LCM-coated side facing up. The lower mold was then operated, and compression molding was performed at 150°C / 700 seconds. The size of the cured product formed on the FR4 substrate was 67 mm in length, 233 mm in width, and 250 μm in thickness. After compression molding was completed, the FR4 substrate with the cured product formed thereon was removed from the mold and placed in a dryer set to 180°C for 1 hour. This resulted in the preparation of an evaluation sample in which a layer of cured LCM material was formed on one side of the FR4 substrate. Next, this evaluation sample was placed on a horizontal table so that the surface on which the cured layer was formed faced upward. In this state, the distance from the lower surface of the evaluation sample to the table was measured. The distance measurements were performed at eight locations on the outer periphery of the evaluation sample (four corners of the FR4 substrate and the midpoints (four locations) between adjacent corners), and the average of these measurements was taken as the warpage value.

[0081] 3.8 Dicing Crack Evaluation An LCM material was printed at 30 mm x 30 mm and 300 μm on an FR4 substrate (product name: L6504C1, manufactured by Nikkan Industries Co., Ltd.) measuring 40 mm x 40 mm and 800 μm thick, and then cured in a curing oven at 180° C. for 60 minutes to produce a test specimen in which a cured layer of the LCM material was formed on the FR4 substrate. Dicing tape (YHP-1510M3-30A, manufactured by Denka Co., Ltd.) was attached to the surface of the obtained test specimen on which the cured layer had been formed. A dicing blade (Microblade 59D-0.265T-40H, manufactured by Futawa Diamond Co., Ltd.) was attached to a dicing device (DAD3360, manufactured by Disco Corporation), and the rotation speed was set to 35,000 rpm and the dicing speed to 350 mm / sec. The test piece attached to the dicing tape was diced so that the length and width of the cured layer of the LCM material was 20 mm x 20 mm. The resulting diced test piece was peeled from the dicing tape, placed with the side on which the cured layer of the LCM material was formed facing up, and placed on the base of an optical microscope. The four sides along which the cured layer of the LCM material was diced were observed at 200x magnification to confirm the presence or absence of cracks in the cured layer of the LCM material. The evaluation criteria are as follows: A: No cracks were observed. B: Cracks were observed.

[0082] 4. Evaluation Results The composition of each Experimental Example, together with the area ratio of aggregates, initial viscosity, viscosity increase ratio after 24 hours, gel time, maximum particle size of aggregates, Tg, warpage evaluation, and dicing crack evaluation, are shown in Tables 1 to 3. Note that in both Experimental Example A and Experimental Example B, in the SEM observation performed to determine the area ratio of aggregates, no aggregates with a maximum equivalent circle diameter of 4 μm or more were observed within an SEM observation area of ​​250 μm x 180 μm.

[0083]

[0084]

[0085]

Claims

1. A liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and used at least to seal a gap between a substrate and an element disposed on the substrate in an electronic component, the liquid compression molding material having an initial viscosity of 10 Pa·s to 460 Pa·s at 25°C, and a cured product obtained by curing the liquid compression molding material under the conditions shown in (1) below satisfies the conditions shown in (2) below: (1) Molding temperature: 150°C, molding time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes (2) When a cross section of the cured material is observed under a scanning electron microscope (magnification: 500x) in an area measuring 250 μm x 180 μm, the area ratio of aggregates with a circle-equivalent diameter of 1 μm or more present in the area is 1.0% or less.

2. The liquid compression molding material according to claim 1, wherein the curing catalyst (D) is a non-microencapsulated curing catalyst.

3. The liquid compression molding material according to claim 2, wherein the non-microencapsulated curing catalyst comprises at least one selected from the group consisting of imidazole compounds and modified aliphatic polyamine compounds.

4. The liquid compression molding material according to claim 2 or 3, wherein the non-microencapsulated curing catalyst comprises at least one compound selected from the group consisting of imidazole compounds having a melting point of 200°C or higher and modified aliphatic polyamine compounds having a melting point of 130°C or higher.

5. A liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an imidazole compound having a melting point of 200°C or higher as a curing catalyst, and having an initial viscosity of 10 Pa·s to 460 Pa·s at 25°C, said liquid compression molding material being used at least for sealing a gap between a substrate and an element disposed on the substrate in an electronic component.

6. The liquid compression molding material according to any one of claims 1 to 5, wherein the (B) curing agent includes at least one selected from the group consisting of acid anhydride curing agents and phenolic curing agents.

7. The liquid compression molding material according to any one of claims 1 to 5, wherein the (B) curing agent includes an acid anhydride curing agent and a phenolic curing agent.

8. A liquid compression molding material according to any one of claims 1 to 7, wherein the blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is 60 mass % or more and less than 80 mass %.

9. A liquid compression molding material according to any one of claims 1 to 7, wherein the blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is 60% by mass to 78.5% by mass.

10. The liquid compression molding material according to any one of claims 1 to 9, having an initial viscosity at 25°C of 10 Pa·s to 250 Pa·s.

11. The liquid compression molding material according to any one of claims 1 to 10, wherein the inorganic filler (C) has an average particle size of 0.03 μm to 3 μm.

12. An electronic component comprising a sealing material made of a cured product of the liquid compression molding material according to any one of claims 1 to 11.

13. A semiconductor device comprising: a substrate; a semiconductor element disposed on the substrate; and a cured product of the liquid compression molding material according to any one of claims 1 to 11, sealing a gap between the semiconductor element and the substrate.

14. The semiconductor device according to claim 13, wherein the cured product contains aggregates having a maximum equivalent circle diameter of 4 μm or less.

15. A method for manufacturing an electronic component comprising a substrate, an element placed on the substrate, and a sealant made of a cured product of the liquid compression molding material that seals the gap between the element and the substrate, at least through a compression molding process using the liquid compression molding material described in any one of claims 1 to 11.

16. The method for producing an electronic component according to claim 15, wherein the cured product contains aggregates having a maximum equivalent circle diameter of 4 μm or less.

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