Substrate conveyance method

Abstract

The present invention provides a substrate conveyance method for conveying a substrate between a cleaning processing unit and a printing processing unit to process both sides of the substrate by using a gripping means that is disposed above the cleaning processing unit for the substrate and moves in the vertical direction, and a robot arm that is provided with an end effector rotating about a central axis.　The end effector of the robot arm causes the gripping means to grip, in a vertically inverted state, the substrate for which the printing processing of one side has been completed. The gripping means moves the substrate to the cleaning processing unit. This conveyance method uses an end effector having two holding parts to convey substrates in sets of two.

Description

Substrate transport method

[0001] The present invention relates to a substrate transport method for efficiently transporting a substrate.

[0002] Circuit boards incorporating electronic components are widely used in computers and related equipment, medical equipment, industrial robots, transportation equipment, etc. In recent years, the density of electronic components and wiring mounted on circuit boards has increased significantly, and double-sided circuit boards with electronic components and wiring on both sides and multi-layer circuit boards with electronic components arranged on multiple layers have become widespread. Double-sided circuit boards and multi-layer circuit boards are manufactured by performing many precise manufacturing processes on both sides of the board.

[0003] The manufacturing process of circuit boards must be carried out in an extremely clean environment with little dust to prevent the intrusion of foreign matter. In particular, the manufacturing process of double-sided and multilayer circuit boards requires multiple cleaning processes to clean the surface of the board. For this reason, efficient transportation from the cleaning equipment to other manufacturing equipment is important.

[0004] Patent Document 1 discloses a printed wiring board manufacturing apparatus equipped with a cleaning device that can improve the reliability of printed wiring boards. Patent Document 2 discloses a substrate inversion device equipped with a transport mechanism and an inversion mechanism. As such, there are many elemental technologies targeting each manufacturing process of circuit boards. However, a transport method for automatically and efficiently transporting substrates from a cleaning processing device to another manufacturing device has not been disclosed so far.

[0005] JP 2007-294938 A JP 2021-158196 A

[0006] The present invention has been made in view of the above-mentioned current situation, and aims to provide a transport method for transporting substrates more efficiently than conventional methods. In particular, the present invention aims to provide a transport method for efficiently and automatically transporting substrates from a cleaning processing device to a printing processing device, which is the next manufacturing device.

[0007] The present invention relates to a substrate transport method that uses a robot arm and a gripping device to transport a substrate between a cleaning processing section and a printing processing section, and to perform processing on both sides of the substrate. The robot arm used in the present invention is equipped with an end effector that rotates around a central axis. The gripping device used in the present invention is disposed above the cleaning processing section of the substrate and can move in the vertical direction. The substrate transport method of the present invention includes a carry-in step in which an end effector of a robot arm receives a substrate from a carry-in means; a first transport step in which the end effector places the substrate on a cleaning processing section; a first holding step in which the end effector lifts the substrate after cleaning from the cleaning processing section and holds it; a second transport step in which the end effector moves the substrate after cleaning to a printing processing section; a second holding step in which the end effector lifts the substrate after printing from the printing processing section and holds it; an inversion step in which the end effector inverts the lifted substrate after printing and causes it to be held by a holding means; a third transport step in which the holding means places the held substrate on the cleaning processing section; a third holding step in which the end effector lifts the substrate after cleaning from the cleaning processing section and holds it; and a fourth transport step in which the end effector moves the substrate after cleaning onto the printing processing section. and a carrying-out step in which the end effector moves the substrate after the printing process from the printing processing section to the carrying-out means.

[0008] The inverting step of the substrate transfer method of the present invention preferably includes rotating the end effector, which has lifted the substrate, by 180 degrees about the central axis to turn the substrate upside down.

[0009] The substrate transfer method of the present invention can transfer two substrates as a set. The substrate transfer method of the present invention can transfer the substrates using a robot arm and a gripping means, and can perform processing on both sides of the two substrates.

[0010] The end effector of the robot arm that transfers two substrates as a set is equipped with two holders that have two-fold rotational symmetry. When transferring two substrates as a set, the substrate transfer method of the present invention transfers the substrates in a state where each of the two holders holds one substrate during at least a portion of the first, second, and third holding steps.

[0011] The process of transporting two substrates as a set to the cleaning processing section and the printing processing section by the robot arm and the gripping means preferably involves carrying out the following steps in the following order. That is, by sequentially performing a carry-in process for the first substrate, a first transport process for the first substrate, a carry-in process for the second substrate, a first holding process for the first substrate, a first transport process for the second substrate, a second transport process for the first substrate, a first holding process for the second substrate, a second holding process for the first substrate, a second transport process for the second substrate, an inversion process for the first substrate, a third transport process for the first substrate, a third holding process for the first substrate, a second holding process for the second substrate, a fourth transport process for the first substrate, an inversion process for the second substrate, a third transport process for the second substrate, a third holding process for the second substrate, a carry-out process for the first substrate, a fourth transport process for the second substrate, and an carry-out process for the second substrate, two substrates can be transported to the cleaning processing section and the printing processing section.

[0012] The substrate transport method of the present invention may further include an alignment step in which the carry-in device aligns the substrate before the carry-in step. The alignment step may be performed by detecting the center position of the substrate with a photoelectric sensor provided in the carry-in device.

[0013] The end effector and gripping means of the robot arm preferably grips or suctions a range of 10 mm in width from the periphery of the substrate and transports it.

[0014] The substrate transport method of the present invention includes an inversion step using a robot arm and a gripping means. The inversion step allows the substrate to be easily turned upside down during transport. Therefore, there is no need to provide a mechanism for inversion in the processing device, and both sides of the substrate can be processed easily and efficiently.

[0015] The substrate transfer method of the present invention allows two substrates to be transferred as a set. By transferring two substrates as a set, the operating distance of the transfer device can be shortened compared to transferring the substrates one by one, thereby reducing the time required for transfer. In addition, the next substrate to be processed can be made to wait in front of a device that takes a long time to process, allowing for more efficient substrate processing.

[0016] In the substrate transfer method of the present invention, the substrate can be transferred in a state where it is accurately positioned by the positioning step, which allows for more efficient and accurate transfer.

[0017] Fig. 1 is a top view schematically showing a substrate manufacturing apparatus in which a substrate transfer method of the present invention is implemented. Fig. 2 is a side view schematically showing a substrate manufacturing apparatus in which a substrate transfer method of the present invention is implemented. Fig. 3 is a side view of a robot arm used in the substrate transfer method. Fig. 4 is a front view of a robot arm used in the substrate transfer method. Fig. 5 is a front view of a gripping means used in the substrate transfer method. Fig. 6 is a top view of a positioning means used in the substrate transfer method.

[0018] The "substrate" transported by the transport method of this embodiment is a plate-shaped component used in electronic devices. The transport method of this embodiment can be particularly suitably applied to part of the manufacturing process of printed wiring boards. The transport method of this embodiment can be applied to substrates made of various materials, such as glass epoxy substrates, ceramic substrates, and metal substrates. Furthermore, the transport method of this embodiment can be applied to the manufacture of double-sided substrates and multilayer substrates, and is not limited by the size of the substrate.

[0019] The following describes a method for applying the substrate transport method of the present invention to carry in a substrate, transport the substrate between a cleaning processing unit and a printing processing unit, and carry out the substrate after processing has been completed. The following embodiments are merely examples of the present invention and are not intended to limit the present invention.

[0020] In the description of this embodiment, descriptions of relative positions and directions such as "left and right," "vertical and horizontal," and "front and back" correspond to the positions and directions on the drawings used in the description. In addition, regarding the vertical positional relationship, something that is relatively higher in the vertical direction is referred to as "upper," and something that is relatively lower is referred to as "lower."

[0021] Configuration of the substrate manufacturing apparatus An embodiment of a substrate manufacturing apparatus 1 to which the substrate transfer method of the present invention is applied is shown. The substrate manufacturing apparatus 1 described in this embodiment is part of a manufacturing apparatus for printed wiring boards. FIG. 1 is a top view showing part of the substrate manufacturing apparatus 1. FIG. 2 is a side view showing part of the substrate manufacturing apparatus 1. The substrate manufacturing apparatus 1 includes a robot arm 2, a gripping means 3, a carry-in means 4, a cleaning processing section 5, a printing processing section 6, and a carry-out means 7.

[0022] The carry-in means 4 is a transport device that carries in the substrate B before cleaning processing and supplies it to the robot arm 2. The carry-out means 7 is a transport device that receives the substrate B after cleaning processing and printing processing from the robot arm 2 and carries it out to the next process. It is preferable that the carry-in means 4 and the carry-out means 7 hold only the outer periphery of the substrate B and hold the substrate B in a vertical position when transferring the substrate B to the robot arm 2. The carry-in means 4 and the carry-out means 7 can be used in combination with a conveyor, an elevator, or the like.

[0023] Although not essential, the carry-in means 4 can accurately position and supply the substrate B by providing a positioning means at the supply position of the substrate B to the robot arm 2. An example of the positioning means is a pair of photoelectric sensors 8 arranged on both ends of the supply position of the substrate B of the carry-in means 4. By detecting whether or not the substrate B blocks the light of the photoelectric sensors, it is possible to accurately measure the center position of the substrate B and perform positioning.

[0024] The cleaning processing unit 5 is a device that removes foreign matter and dust from the surface of the substrate B by using air blowing, a brush, or the like. The cleaning processing unit 5 of this embodiment performs cleaning while the substrate B is placed on a horizontal processing table 51. Note that, in this embodiment, the cleaning processing unit 5 is described as a standalone device that performs only the cleaning process, but it may be integrated with other devices, or may perform processes other than cleaning simultaneously.

[0025] Although not essential, the cleaning processing unit 5 can include positioning means on the processing stage 51 for the substrate B. An example of the positioning means of the cleaning processing unit 5 is shown in Fig. 6. One example of the positioning means is a plurality of grooves 52 that open into the processing stage 51 at positions corresponding to the four sides of the substrate B, and abutting means 53 that can move within the grooves. By supporting the four sides of the substrate B with the plurality of abutting means 53, the position of the substrate B can be determined with high precision.

[0026] The printing processing section 6 is a device that manufactures a printed wiring board by performing a printing process on the surface of the substrate B. The process of manufacturing a printed wiring board includes many steps, including the application of a dry film, and the printing processing section 6 of this embodiment is a manufacturing device that carries out one or more of these manufacturing steps. The printing processing section 6 of this embodiment has a substrate input conveyor 6a that moves horizontally, and the robot arm 2 inputs the substrate B onto the substrate input conveyor 6a of the printing processing section 6.

[0027] The robot arm 2 is a device that receives a substrate B from any device included in the substrate manufacturing apparatus 1, transports it, and hands it over to another device. The robot arm 2 is a robot that includes an end effector 21 that can hold and transport a substrate B, and an articulated arm unit 25. Fig. 3 shows a side view of the robot arm 2, and Fig. 4 shows a front view of the robot arm 2. The robot arm 2 has its transport operation automatically controlled by a program stored in a control computer (not shown).

[0028] An arm 25a at the tip of the arm section 25 rotatably supports the end effector 21. The end effector 21 can rotate around the central axis R of the arm 25a and can be stopped at any angle.

[0029] The end effector 21 includes two holding portions 22a and 22b having two-fold rotational symmetry. The end effector 21 can transport one or two substrates B held by the holding portions 22a and 22b. In this embodiment, the holding portions 22a and 22b are frames arranged parallel to each other. The holding portions 22a and 22b include multiple holding members 23, which can hold the outer periphery of the substrate B along at least two sides. In this embodiment, clamps 23 that grip the outer periphery of the substrate are used as the most suitable holding members 23. The arrangement of the clamps 23 can be adjusted appropriately depending on the size of the substrate B. FIG. 3 shows five clamps 23 arranged along one side of the substrate B. In order to keep the surface of the substrate B, where wiring is to be performed, clean and free of scratches, it is preferable that the clamps 23 hold a 10 mm wide range from the periphery of the substrate B while transporting it.

[0030] The gripping means 3 is a transport means that transports the substrate B between the robot arm 2 and the cleaning processing section 5. The gripping means 3 is disposed above the cleaning processing section 5 and is movable in the vertical direction. The gripping means 3 has its transport operation automatically controlled by a program stored in a control computer (not shown).

[0031] The gripping means 3 has a gripping section 31 for gripping and transporting the substrate B. The gripping section 31 has a plurality of gripping members 32 that can grip the vicinity of the outer periphery of the substrate B. The arrangement of the gripping means can be adjusted according to the size and hardness of the substrate B. In order to keep the surface of the substrate B clean without scratching it, it is preferable that the gripping members 32 also hold a range of 10 mm wide from the periphery of the substrate B while transporting it. In this embodiment, clamps 32 that grip the outer periphery of the substrate B are used as the most suitable gripping section.

[0032] In this embodiment, an example has been shown in which clamps are used for the holding member 23 and the gripping member 32. However, depending on the type and size of the substrate B, it may be more suitable to use suction pads for either or both of the holding member 23 and the gripping member 32 and transport the substrate by suction.

[0033] Basic Configuration of the Substrate Transfer Method The substrate manufacturing process, including the substrate transfer method of this embodiment, will be described in order of steps. (Step 1) to (Step 10) are the respective steps of the substrate transfer method of this embodiment. The following description also includes the substrate manufacturing process carried out in the cleaning processing unit 5 and the printing processing unit 6, in addition to the substrate transfer method.

[0034] (Step 1) Carry-in Process In the carry-in process, the end effector 21 of the robot arm 2 receives the substrate B from the carry-in means 4. (Step 2) First Transport Process In the first transport process, the end effector 21 moves the substrate B onto the processing stage 51 of the cleaning processing unit 5. After the first transport process, the cleaning processing unit 5 performs a cleaning process on the substrate B. (Step 3) First Holding Process In the first holding process, the end effector 21 lifts and holds the substrate B after the cleaning process from the cleaning processing unit 5. (Step 4) Second Transport Process In the second transport process, the end effector 21 moves the lifted substrate B to the printing processing unit 6. After the second transport process, the printing processing unit 6 performs a printing process on the substrate B. (Step 5) Second Holding Process In the second holding process, the holding unit 22 below the end effector 21 lifts and holds the substrate B after the printing process from the printing processing unit 6. (Step 6) Inversion Process In the inversion process, the robot arm 2 rotates the end effector 21 180 degrees around the central axis R of the arm 25a. As a result of the end effector rotating 180 degrees, the substrate B, which was held by the lower holder 22 before the rotation, is turned upside down. The substrate B is held above the holder 22 with the surface that was the bottom surface during the printing process now the top surface. The end effector 21 causes the gripping portion 31 of the gripping means 3 to grip the substrate B it is holding. (Step 7) Third Transport Process In the third transport process, the gripping means 3 descends and moves the gripped substrate B onto the processing stage 51 of the cleaning processing unit 5. After the third transport process, the cleaning processing unit 5 performs a cleaning process on the substrate B. (Step 8) Third Holding Process In the third holding process, the end effector 21 lifts the substrate B from the cleaning processing unit 5 and holds it after the cleaning process. (Step 9) Fourth Transport Step In the fourth transport step, the end effector 21 moves the lifted substrate B to the print processing unit 6. After the fourth transport step, the print processing unit 6 performs printing processing on the substrate B. (Step 10) Transport Step The end effector 21 moves the substrate B after printing processing from the print processing unit 6 to the transport means 7, which transports the substrate to the outside.

[0035] In the substrate transport method of this embodiment, the substrate B can be easily turned upside down during transport by the inversion step (step 6) using the robot arm 2 and the gripping means 3. Therefore, there is no need to provide a mechanism for turning over the substrate B in the cleaning processing unit 5 and the printing processing unit 6, and both sides of the upside-down inverted substrate B can be efficiently processed.

[0036] A preferred embodiment for transporting substrates in pairs will be described as the most preferred embodiment of the transport method. By transporting substrates in pairs, the time required for transport can be reduced compared to transporting substrates one by one, allowing for more efficient transport operations.

[0037] In order to distinguish between the substrates transported in pairs, the first substrate will be referred to as substrate B1 and the second substrate as substrate B2 in the following description. Substrates B1 and B2 are identical, and only the order of transport differs. When substrates are transported in pairs, the two holders 22a and 22b each hold one substrate B1 and one substrate B2 during at least part of the first holding step, second holding step, and third holding step. In reality, at least some of the processes for substrate B1 are carried out simultaneously with at least some of the processes for substrate B2.

[0038] The steps from (Step 1′) to (Step 20′) will be described below in the order in which the substrate transport steps are performed. Steps with the same names as those in the basic configuration of the substrate transport method in the upper column represent the same processing.

[0039] (Step 1') Substrate B1 Loading Process The loading means 4 detects the center position of the substrate B using the photoelectric sensor 8, aligns the substrate, and hands the substrate over to the end effector 21 of the robot arm 2. The end effector 21 receives the substrate B1 from the loading means 4. (Step 2') First Transport Process for Substrate B1 The end effector 21 places the substrate B1 on the processing stage 51 of the cleaning processing unit 5. After the first transport process for the substrate B1, the abutment means 53 on the processing stage 51 of the cleaning processing unit 5 moves to position the substrate B1. Subsequently, the cleaning processing unit 5 performs cleaning processing. (Step 3') Substrate B2 Loading Process The loading means 4 detects the center position of the substrate B2 using the photoelectric sensor 8, aligns the substrate, and hands the substrate B2 over to the end effector 21 of the robot arm 2. The holder 22a of the end effector 21 receives the substrate B2 from the loading means 4. (Step 4') First Holding Process of Substrate B1 The holding portion 22b of the end effector 21 lifts and holds the substrate B1 after the cleaning process from the cleaning processing unit 5. At this time, the holding portion 22a holds the received substrate B2. (Step 5') First Transport Process of Substrate B2 The holding portion 22a places the substrate B2 on the processing stage 51 of the cleaning processing unit 5. During the first transport process of substrate B2, the holding portion 22b holds the lifted substrate B1. After the first transport process of substrate B2, the abutment means 53 on the processing stage 51 of the cleaning processing unit 5 moves to position the substrate B1. The cleaning process continues by the cleaning processing unit 5. (Step 6') Second Transport Process of Substrate B1 The end effector 21 moves the held substrate B1 to the printing processing unit 6. After the second transport process, the printing processing unit 6 performs printing on the substrate B1. (Step 7') First holding process for substrate B2 The holding portion 22a of the end effector 21 lifts and holds the substrate B2 after the cleaning process from the cleaning processing portion 5. (Step 8') Second holding process for substrate B1 The holding portion 22b of the end effector 21 lifts and holds the substrate B1 after the printing process from the printing processing portion 6. At this time, the holding portion 22a holds the lifted substrate B2.(Step 9') Second Transport Process of Substrate B2 The holding portion 22a of the end effector 21 moves the held substrate B2 to the printing processing portion 6. At this time, the holding portion 22b holds the lifted substrate B1. After the second transport process, the printing processing portion 6 performs printing processing on the substrate B2. (Step 10') Inversion Process of Substrate B1 The robot arm 2 rotates the end effector 21 180 degrees to turn the substrate B1 upside down, and causes the gripping portion 31 of the gripping means 3 to grip the substrate B1. (Step 11') Third Transport Process of Substrate B1 The gripping means 3 descends and places the gripped substrate B1 on the cleaning processing portion 5. After the third transport process of the substrate B1, the cleaning processing portion 5 positions the substrate B1, and the cleaning processing continues. This cleaning processing is performed on the side of the substrate B1 that has not been subjected to cleaning processing. (Step 12') Third holding process for substrate B1 The holding portion 22a of the end effector 21 lifts and holds the substrate B1 from the cleaning processing portion 5. (Step 13') Second holding process for substrate B2 The holding portion 22b of the end effector 21 lifts and holds the printed substrate B2 from the printing processing portion 6. At this time, the holding portion 22a holds the lifted substrate B1. (Step 14') Fourth transport process for substrate B1 The holding portion 22a of the end effector 21 moves the held substrate B1 to the printing processing portion 6. At this time, the holding portion 22b holds the lifted substrate B2. After the fourth transport process for substrate B1, the printing processing portion 6 performs printing processing on the substrate B1. At this time, the printing processing is performed on the side of the substrate B1 that has not been subjected to printing processing. (Step 15') Inversion process of substrate B2 The robot arm 2 rotates the end effector 21 180 degrees to invert the substrate B2 held by the holder 22b upside down, and causes the gripping portion 31 of the gripping means 3 to grip the substrate B2. (Step 16') Third transport process of substrate B2 The gripping means 3 descends and places the gripped substrate B2 on the cleaning processing unit 5. After the third transport process of substrate B2, the cleaning processing unit 5 positions the substrate B2, and then performs the cleaning process.The cleaning process at this time is performed on the side of substrate B2 that has not been subjected to the cleaning process. (Step 17') Third holding process of substrate B2 The holding portion 22a of the end effector 21 lifts and holds substrate B2 from the cleaning processing portion 5. (Step 18') Unloading process of substrate B1 The holding portion 22b of the end effector 21 lifts the printed substrate B1 from the printing processing portion 6 and hands it over to the unloading means. At this time, the holding portion 22a holds the lifted substrate B2. (Step 19') Fourth transport process of substrate B2 The holding portion 22a of the end effector 21 moves the held substrate B2 to the printing processing portion 6. After the fourth transport process of substrate B2, the printing processing portion 6 performs printing on substrate B2. The printing process at this time is performed on the side of substrate B2 that has not been subjected to printing. (Step 20') Process of carrying out substrate B2 The holding portion 22a of the end effector 21 lifts the printed substrate B2 from the print processing portion 6 and hands it over to the carrying-out means. Through the above process, the method of transporting the first substrate B1 and the second substrate B2 as a set is completed.

[0040] In this embodiment, while steps 4', 8', 9', 13', and 18' are being performed, the substrates are transported while being held by holders 22a and 22b of robot arm 2, one each of which holds substrates B1 and B2. This reduces the amount of movement required of robot arm 2 compared to when substrates are transported one by one, enabling efficient substrate transport.

[0041] Furthermore, in step 8', when holding unit 22a lifts substrate B1 from the printing processing unit 6, holding unit 22b is waiting while holding substrate B2, and after completion of step 8', substrate B2 can be quickly supplied to the printing processing unit 6 in step 9'. Similarly, after completion of step 13', substrate B2 has been moved, and then substrate B1 can be quickly supplied to the printing processing unit in step 14'. In this way, the substrate transport method of this embodiment can efficiently transport substrates in accordance with the operating state of the manufacturing equipment.

[0042] Preferred embodiment for continuously carrying out a transfer method for transferring substrates in pairs When transferring substrates in pairs repeatedly, i.e., when transferring substrates continuously, it is efficient to incorporate part of the transfer process for the next pair of substrates B3 and B4 into the process of transferring the previously loaded substrates B1 and B2. An embodiment in which part of the transfer process for substrates B3 and B4 is incorporated into the transfer process for substrates B1 and B2 will be described. In the following description, steps with the same numbers as previously described steps indicate the same content, and duplicate explanations will be omitted.

[0043] The carry-in step of substrate B3 can be incorporated between the third transport step of substrate B2 in step 16' and the third holding step of substrate B2 in step 17'. During the period from the end of step 16' to the start of step 17', substrate B is not held by holders 22a and 22b. Therefore, during this time, the carry-in step of receiving substrate B3 from carry-in means 4 by holder 22b can be executed.

[0044] The first transport step for substrate B3 can be incorporated between the third holding step for substrate B2 in step 17' and the unloading step for substrate B1 in step 18'. While step 17' is being performed, holding unit 22b holds substrate B3. After step 17' is completed, holding unit 22b can place the substrate B3 it was holding on the processing stage 51 of the cleaning processing unit 5. After the first transport step for substrate B3 is completed, the unloading step for substrate B1 in step 18' is performed.

[0045] Furthermore, the loading step of substrate B4, the first holding step of substrate B3, and the first transport step of substrate B4 can be interleaved between the fourth transport step of substrate B2 in step 19' and the unloading step of substrate B2 in step 20'. During the period from the end of step 19' to the start of step 20', no substrates are held in the holders 22a and 22b. Therefore, during this time, the transport steps for substrates B3 and B4 can be carried out. In other words, the start of the unloading step for substrate B2, which was processed last among substrates B1 and B2, can be delayed until the next substrate B4 has been transported to the cleaning processing unit.

[0046] In this way, by incorporating part of the process of the substrate transport method to be started next into the process of the substrate transport method that has already started, the substrate transport can be carried out more efficiently.

[0047] In addition, the amount of processing for the substrate to be introduced later and between each step of the previous substrate transport method can be changed as appropriate, taking into consideration the efficiency of the operation of the robot arm 2 and the reduction of the standby time of the entire substrate manufacturing apparatus.

[0048] While specific examples of the present invention have been described in detail above based on the embodiments, these are merely examples and do not limit the scope of the claims. The claimed technology includes various modifications and variations of the specific examples exemplified above. The order of the steps can be changed depending on the steps of each transport method, the arrangement of the transport device and manufacturing device, and the time required for the manufacturing process. Furthermore, if the number of manufacturing devices is increased, the number of transport steps can be increased accordingly.

[0049] REFERENCE SIGNS LIST 1 Substrate manufacturing apparatus 2 Robot arm 3 Grip means 4 Carry-in means 5 Cleaning processing section 6 Printing processing section 7 Carry-out means 21 End effector 22 Holding section 23 Holding member (clamp) 25 Arm section 31 Grip section 32 Grip member (clamp) B, B1, B2 Substrate R Central axis of robot arm

Claims

1. A substrate transport method for transporting a substrate between a cleaning processing section and a printing processing section by using a robot arm equipped with an end effector that rotates around a central axis and a gripping means that is arranged above a cleaning processing section of the substrate and moves up and down, and for processing both sides of the substrate, the method comprising: a carrying-in step in which the end effector of the robot arm receives the substrate from a carrying-in means; a first transport step in which the end effector places the substrate on the cleaning processing section; a first holding step in which the end effector lifts the substrate after the cleaning processing from the cleaning processing section and holds it; a second transport step in which the end effector moves the substrate after the cleaning processing to the printing processing section; a second holding step in which the end effector lifts the substrate after the printing processing from the printing processing section and holds it; an inversion step in which the end effector inverts the lifted substrate after the printing processing and has it gripped by the gripping means; and a third transport step in which the gripping means places the substrate gripped by the gripping means on the cleaning processing section. a third holding step in which the end effector lifts and holds the substrate after the cleaning process from the cleaning processing section; a fourth transport step in which the end effector moves the substrate after the cleaning process onto the printing processing section; and a carry-out step in which the end effector moves the substrate after the printing process from the printing processing section to a carry-out means.

2. The substrate transfer method according to claim 1, wherein the inverting step involves rotating the end effector holding the substrate by 180 degrees around the central axis to invert the substrate upside down.

3. A substrate transport method using the robot arm and the gripping means to transport two substrates as a set and perform processing on both sides of the two substrates, characterized in that the end effector of the robot arm is equipped with two holding parts having two-fold rotational symmetry, and the substrates are transported in a state where each of the two holding parts holds one substrate during at least a portion of the first holding step, the second holding step, and the third holding step.

4. The process of transporting two substrates as a set to the cleaning processing section and the printing processing section by the robot arm and the gripping means includes the carry-in process for a first substrate, the first transport process for the first substrate, the carry-in process for a second substrate, the first holding process for the first substrate, the first transport process for the second substrate, the second transport process for the first substrate, the first holding process for the second substrate, the second holding process for the first substrate, the second transport process for the second substrate, the inversion process for the first substrate, the third transport process for the first substrate, the third holding process for the first substrate, the second holding process for the second substrate, the fourth transport process for the first substrate, the inversion process for the second substrate, and the third transport process for the second substrate.

4. The substrate transfer method according to claim 3, wherein the substrate transfer method sequentially performs the following steps: the third holding step for the second substrate; the unloading step for the first substrate; the fourth transfer step for the second substrate; and the unloading step for the second substrate.

5. A substrate transport method according to claim 1, further comprising an alignment step in which the loading means aligns the substrate before the loading step, wherein the alignment step detects the center position of the substrate using a photoelectric sensor of the loading means.

6. A substrate transport method according to claim 1, characterized in that the end effector and the gripping means of the robot arm grip or suction-hold a range of 10 mm from the periphery of the substrate and transport it.

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