Chip conveyance means and mounting device

Abstract

Provided are a chip conveyance means and a mounting device that enable reduction in device cost and installation space in conveyance and mounting of a semiconductor chip without causing an electrode surface of the semiconductor chip to come into contact with other substances. Specifically, provided is a chip conveyance means comprising: a tool slider for receiving at a chip supply part and holding a semiconductor chip in a state of being held by an attachment tool, together with the attachment tool; and a conveyance rail for conveying the tool slider to a mounting part. The tool slider: has a function of delivering the semiconductor chip together with the attachment tool to a mounting head of the mounting part, and a function of receiving only the attachment tool after the semiconductor chip is mounted by the mounting head; and is capable of conveying only the attachment tool to the chip supply part along the conveyance rail.

Description

Chip transport means and mounting device

[0001] The present invention relates to a mounting apparatus for mounting a semiconductor chip on a substrate, and more particularly to a mounting apparatus for mounting a semiconductor chip with the electrode surface of the semiconductor chip facing the electrode surface of the substrate.

[0002] In face-down mounting, where the electrode surface of the semiconductor chip faces the electrode surface of the substrate, the electrodes of the semiconductor chip and the electrodes of the substrate are aligned and connected. The main method for joining is to heat and melt one of the electrodes and press the semiconductor chip against the substrate to form a bond.

[0003] However, with the recent trend toward miniaturization of semiconductors, the heating generated when mounting a semiconductor chip to a substrate can cause dimensional changes in the semiconductor chip (or substrate), resulting in mounting errors that do not meet specifications even with highly accurate alignment. In this situation, a technique called hybrid bonding, which can reduce the temperature during mounting and suppress dimensional changes, is attracting attention.

[0004] In hybrid bonding, the height of the electrode tip on the electrode surface is lower than the height of the insulating part (which occupies most of the area other than the electrode), and the insulating parts of the semiconductor chip and substrate are also bonded together.By adding functional groups such as hydroxyl groups to the surface of the insulating part (activating it), bonding can be achieved at relatively low temperatures.

[0005] Here, the insulating parts of the semiconductor chip and the substrate are formed of insulating films such as SiO2 (silicon oxide) films, and are activated by plasma treatment, etc. However, even in an activated state, if they come into contact with other substances, the activation state decreases, making it difficult to bond the insulating parts together.

[0006] Therefore, the inventors have discovered a method for transporting a semiconductor chip without the electrode surface coming into contact with other substances and transferring it to the mounting head of a mounting device. That is, the inventors have discovered that by configuring a chip slider 62 together with an attachment tool 42 that holds the semiconductor chip from the opposite side of the electrode surface, a tool slider 61 that moves along a transport rail 60 shown in Fig. 17(a) can transport the semiconductor chip without the electrode surface coming into contact with other substances (Patent Document 1).

[0007] 18(b) and 18(c), the attachment tool 42 having the appearance shown in FIG. 18(a) has a first decompression flow path 421P leading from the suction hole 421H to the exhaust hole 421V and a second decompression flow path 422P leading from the suction hole 422H to the exhaust hole 422V, and can hold a semiconductor chip C by reducing the pressure through at least one of the exhaust hole 421V and the exhaust hole 422V. Also, as shown in FIG. 18(c), if the attachment tool 42 is designed so that the exhaust hole 422V and the chip suction hole 61H of the tool slider 61 are aligned, the attachment tool 42 holding the semiconductor chip C can be held by reducing the pressure from the exhaust hole 61V side of the tool slider 61. That is, by holding the attachment tool 42 with the tool slider 61, the attachment tool 42 can function as a chip slider 62.

[0008] 19 shows a mounting apparatus in this manner that uses a tool slider 61 to transport semiconductor chips C. The mounting apparatus 1 in Fig. 19 is broadly composed of a chip supply unit 1A and a mounting unit 1B, and chip transport means 6 transports semiconductor chips C picked up by chip supply unit 1A to mounting unit 1B, and the configuration that includes the tool slider 61 enables the chip transport means 6 to transport semiconductor chips C without their electrode surfaces coming into contact with other substances.

[0009] However, conventionally, when the chip supply unit 1A picks up the semiconductor chip C attached to the dicing tape DT, as shown in Fig. 20, the collet 143 holds the electrode surface (the surface on which the electrode B is provided) of the semiconductor chip C, and therefore it was unavoidable for the electrode surface to come into contact with the collet 143. For this reason, even if the electrode surface attached to the dicing tape DT was active, the activity was reduced by contact with the collet 143, making it difficult for the chip transport means 6 to transport the semiconductor chip C in a manner that would prevent the electrode surface from coming into contact with other substances.

[0010] However, in recent years, development has progressed in collets that hold semiconductor chips C without contact, as shown in Patent Documents 2 and 3. For this reason, if a type that holds semiconductor chips C without contact is used as collet 143 of the mounting device 1 shown in Fig. 19, the electrode surfaces of the semiconductor chips C can be prevented from coming into contact with other substances from the time they are attached to the dicing tape DT until they are transferred to the mounting head 4 of the mounting unit 1B. In other words, if the electrode surfaces are activated while they are attached to the dicing tape DT, using the mounting device 1 of Fig. 19 for hybrid bonding makes it possible to bond the semiconductor chips C to the substrate at a relatively low temperature.

[0011] 21 to 23 show the operation of the mounting apparatus 1 shown in FIG. 19 , from when the collet 143 picks up the semiconductor chip C in a non-contact manner to when the semiconductor chip C is mounted on the substrate S. First, FIGS. 21( a ) to 21 ( c ) show the process of the collet 143 transferring the semiconductor chip C to the relay head 8 holding the attachment tool 42. In the state shown in FIG. 21( c ), the relay head 8 suction-holds the semiconductor chip C via the attachment tool 42 from the suction hole 421H through the first decompression flow path 421P. FIGS. 21( d ) and 21 ( e ) show the process of reversing the orientation of the relay head 8 so as to transfer the attachment tool 42 (holding the semiconductor chip C) to the tool slider 61, as shown in FIG. 17( b ). It is also possible to configure the collet 143 to be inverted and then transfer the semiconductor chip C to the relay head 8 with its orientation fixed (via the attachment tool 42). However, since there is a concern of problems occurring when inverting the collet 143 while it is holding the semiconductor chip C in a non-contact state, it is preferable to configure the relay head 8 to be inverted.

[0012] After the relay head 8 is inverted as shown in Fig. 21(e), Fig. 21(f) shows the state in which the tool slider 61 is placed below the attachment tool 42. Thereafter, as shown in Fig. 21(f), the exhaust holes 422V and the chip suction holes 61H are aligned, and then the attachment tool 42 is mounted on the tool slider 61 as shown in Fig. 22(a). The pressure is then reduced through the flow path connecting the chip suction holes 61H to the outside, so that the semiconductor chip C is suction-held at the suction holes 422H via the second decompression flow path 422P. When the suction of the attachment tool 42 by the relay head 8 and the suction of the semiconductor chip via the attachment tool 42 are released, the attachment tool 42 holding the semiconductor chip C is transferred to the tool slider 61 as shown in Fig. 22(b).

[0013] The attachment tool 42 and the semiconductor chip C released from the relay head 8 as shown in FIG. 22(b) become movable in the X direction along the transport rail 60 together with the tool slider 61 (FIG. 22(c)).

[0014] After this, the chip slider 62, which is composed of the tool slider 61 and the attachment tool 42, transports the semiconductor chip C to directly below the mounting head 4. Figures 22(d) to 22(f) are views showing the process in which the tool slider 61, which has reached directly below the mounting head 4, transfers the semiconductor chip C together with the attachment tool 42 to the mounting head 4. Here, the head suction block 41 of the mounting head 4 is the transfer destination for the attachment tool 42 holding the semiconductor chip C. Figure 22(d) shows the state in which the tool slider 61 has reached directly below the mounting head 4 (its head suction block 41). In Figure 22(d), the suction hole 410H depressurizes the pressure-reducing flow path 410P to adsorb the attachment tool 42 to the head suction block 41. Furthermore, if the suction hole 411H is aligned with the first exhaust hole 421V, the semiconductor chip C can be adsorbed to the attachment tool 42 by depressurizing the pressure-reducing flow path 411P.

[0015] 22(f), the mounting head 4 is lowered (or the tool slider 61 is raised) to align the suction holes 411H with the first exhaust holes 421V, and the attachment tool 42 is brought into close contact with the head suction block 41. In this state, the pressure reduction paths 410P and 411P are reduced, as shown in FIG. 22(e), and the attachment tool 42 is suctioned at the suction holes 410H and fixed to the head suction block 41, and the semiconductor chip C is also suctioned via the first pressure reduction path 421P at the suction holes 421H of the attachment tool 42. Therefore, if the reduced pressure in the path communicating with the chip suction holes 61H of the tool slider 61 is released to atmospheric pressure (or a pressure slightly higher than atmospheric pressure) and the mounting head 4 is raised, the attachment tool 42 holding the semiconductor chip C is released from the tool slider 61 and rises in close contact with the head suction block 41 (FIG. 22(f)).

[0016] Thereafter, as shown in Fig. 23(a), the tool slider 61 is retracted from directly below the mounting head 4, and then, as shown in Fig. 23(b), the mounting head 4 is lowered to bring the semiconductor chip C close to the substrate S, and the substrate S and the semiconductor chip C are aligned. Once alignment is complete, the mounting process begins. In the mounting process, the semiconductor chip C and the substrate S are bonded in close contact, as shown in Fig. 23(c), so that the semiconductor chip C is mounted on the substrate S.

[0017] 23D, after the mounting is completed, the mounting head 4 releases the reduced pressure in the reduced pressure flow path 411P while holding the attachment tool 42, and then rises. In this way, the semiconductor chip C is released from the attachment tool 42 and fixed to the substrate S.

[0018] Japanese Patent Application No. 2023-049126 Japanese Patent Application Laid-Open No. 2022-072566 Japanese Patent Application Laid-Open No. 2022-157318

[0019] 19, there is a problem of how to deal with the attachment tool 42 held by the mounting head 4 (in a state where it does not hold a semiconductor chip C) as shown in Fig. 23(d). For example, if recovery means for recovering the attachment tool 42 removed from the mounting head 4 is provided, then at the stage where the attachment tool 42 (holding a semiconductor chip C) as shown in Fig. 22(f) is handed over to the mounting head 4 (the head suction block 41 thereof), the tool slider 61 can be moved to the chip supply unit 1A side to receive the next semiconductor chip C to be mounted, which is considered preferable from the standpoint of takt time.

[0020] However, in addition to the need for a tool recovery means for receiving the attachment tool 42 from the mounting head 4, a tool supply means for delivering the attachment tool 42 to the relay head 8 is also required. Furthermore, since it is difficult to immediately supply the recovered attachment tool 42 to the relay head 8, a large number of attachment tools 42 are required. For these reasons, in addition to an increase in the cost of the equipment and the cost of materials, an increase in the size of the equipment due to the addition of the tool recovery means and tool supply means is unavoidable.

[0021] The present invention has been made in consideration of the above problems, and provides a chip transport means and mounting device that can reduce equipment costs and installation space when transporting and mounting semiconductor chips without the electrode surfaces of the chips coming into contact with other substances.

[0022] In order to solve the above problem, the invention described in claim 1 is a chip transport means for transporting a semiconductor chip from a chip supply section to a mounting section, comprising: a tool slider that receives and holds the semiconductor chip held by an attachment tool in the chip supply section together with the attachment tool; and a transport rail for transporting the tool slider to the mounting section, wherein the tool slider has a function of transferring the semiconductor chip together with the attachment tool to a mounting head of the mounting section, and a function of receiving only the attachment tool after the mounting head has mounted the semiconductor chip, and the chip transport means is capable of transporting only the attachment tool to the chip supply section along the transport rail.

[0023] The invention described in claim 2 is the chip transport means described in claim 1, wherein the tool slider has a frame body that supports the edge of the surface of the attachment tool that holds the semiconductor chip, and the frame body has suction holes that communicate with a pressure reduction flow path on the surface that comes into contact with the attachment tool, and the chip transport means is shaped so that the semiconductor chip fits inside the frame.

[0024] The invention described in claim 3 is the chip transport means described in claim 2, wherein the attachment tool has a first chip suction flow path that communicates with the reduced pressure flow path of the mounting head and adsorbs the semiconductor chip, and a second chip suction flow path that is provided independently of the first chip suction flow path and is capable of adsorbing the semiconductor chip, and the chip transport means has, as suction holes in the frame body, a chip suction hole that connects to the second chip suction flow path of the attachment tool, and a tool suction hole that adsorbs and holds the attachment tool.

[0025] A fourth aspect of the present invention provides the chip transport means according to the second aspect, wherein one tool slider is a chip transport means having a plurality of connected frame bodies.

[0026] The invention described in claim 5 is a mounting device comprising a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side and a relay head that holds the semiconductor chip held by the collet from the opposite side of the electrode surface via the attachment tool, a chip transport means described in any of claims 1 to 3, and a mounting head that receives the semiconductor chip transported by the chip transport means together with the attachment tool.

[0027] The invention described in claim 6 is a mounting device comprising a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side and a relay head that holds the semiconductor chip held by the collet from the opposite side of the electrode surface via the attachment tool, the chip transport means described in claim 4, and a mounting head that receives the semiconductor chip transported by the chip transport means together with the attachment tool.

[0028] A seventh aspect of the present invention is the mounting apparatus according to the sixth aspect, wherein a plurality of the relay heads are arranged at the same intervals as the intervals at which the plurality of frame bodies are arranged.

[0029] An eighth aspect of the present invention is the mounting apparatus according to the seventh aspect, wherein the number of the frames is greater than the number of the relay heads.

[0030] The invention described in claim 9 is a mounting apparatus described in any one of claims 6 to 8, in which the attachment tool is simultaneously placed in at least two locations on the relay head, the tool slider, and the relay head.

[0031] A tenth aspect of the present invention is the mounting apparatus according to the fifth aspect, wherein the collet holds the semiconductor chip in a non-contact manner.

[0032] An eleventh aspect of the present invention is the mounting apparatus according to any one of the sixth to eighth aspects, wherein the collet holds the semiconductor chip in a non-contact manner.

[0033] The present invention makes it possible to transport and mount a semiconductor chip without the electrode surface of the semiconductor chip coming into contact with other substances, while also shortening the takt time without sacrificing the equipment cost and installation space of the chip transport means and mounting device.

[0034] 1A and 1B are diagrams illustrating a chip transport means capable of transporting only the attachment tool in the first embodiment of the present invention.

[0024] FIGS. 1A and 1B are diagrams illustrating the state of the attachment tool after mounting a semiconductor chip according to the first embodiment of the present invention, showing (a) a state in which the attachment tool is raised together with the mounting head, (b) a state in which the tool slider is approaching, (c) a state in which the tool slider is in close contact with the attachment tool, (d) a state in which the attachment tool is handed over to and held by the tool slider, (e) a state in which the attachment tool is transported to the chip supply unit side by the tool slider, and (f) a state in which the attachment tool has moved to the underside of the relay head.

[0025] FIGS. 1A and 1B are diagrams illustrating the state of the attachment tool after mounting a semiconductor chip according to the first embodiment of the present invention, showing (a) a state in which the relay head is in close contact with the attachment tool, (b) a state in which the attachment tool is held by the relay head from the tool slider, and (c) a state in which the relay head has been inverted from the same state.

[0026] FIGS. 1A and 1B are diagrams illustrating step diagrams (part 1) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the first embodiment of the present invention.

[0027] FIGS. 1A and 1B are diagrams illustrating step diagrams (part 2) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the first embodiment of the present invention. FIG. 1 is a step diagram (part 3) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the first embodiment of the present invention. FIG. 2 is an external view of a mounting device equipped with a tool slider according to the second embodiment of the present invention. FIG. 3 is an external view illustrating the tool slider according to the second embodiment of the present invention. FIG. 4 is a step diagram (part 1) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the second embodiment of the present invention. FIG. 5 is a step diagram (part 2) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the second embodiment of the present invention. FIG. 6 is a step diagram illustrating a characteristic part of the operation of a modified example of the second embodiment of the present invention. FIG. 7 is a step diagram illustrating the operation of transferring the attachment tool from the mounting head to the tool slider in a modified example of the second embodiment of the present invention. FIG. 8 is a step diagram illustrating an operation in which the effect of using multiple relay heads is not realized in a modified example of the second embodiment of the present invention. FIG. 9 is an external view illustrating a tool slider according to a third embodiment of the present invention.FIG. 1 is a step diagram (part 1) illustrating a characteristic part of the operation of embodiment 3 of the present invention. FIG. 2 is a step diagram (part 2) illustrating a characteristic part of the operation of embodiment 3 of the present invention. FIG. 1 is a diagram illustrating a tool slider related to chip transport means that transports semiconductor chips without contacting electrode surfaces, and FIG. 1 is a diagram illustrating a chip slider in which the tool slider holds an attachment tool. FIG. 1 is a diagram illustrating the configuration as a chip slider, and FIG. 1 is a diagram showing the appearance of the tool slider, and FIG. 1 is a cross-sectional view of the attachment tool and the tool slider, and FIG. 1 is a cross-sectional view of the tool slider when it holds the attachment tool and functions as a chip slider. FIG. 1 is a schematic diagram of a mounting device equipped with chip transport means that transports semiconductor chips without contacting electrode surfaces. 1A and 1B are diagrams illustrating the operation of picking up semiconductor chips from a dicing tape, the diagram illustrating (a) a state in which a wafer attached to a dicing tape has been diced and separated into multiple semiconductor chips, (b) a state in which the semiconductor chips are being pushed up from the opposite side of the dicing tape, (c) a state in which a collet is adsorbed onto the electrode surface of the semiconductor chip in the same state and rising, and (d) a state in which the semiconductor chip has been peeled off from the dicing tape and held by the collet. 1B are diagrams illustrating the operation of a mounting device equipped with chip transport means for transporting semiconductor chips without contacting the electrode surface, the diagram illustrating (a) a state in which a collet holding a semiconductor chip and a relay head are brought close to each other, (b) a state in which an attachment tool held by the relay head is in close contact with the semiconductor chip held by the collet, (c) a state in which the semiconductor chip has been transferred to the relay head via the attachment tool, (d) a state in which the semiconductor chip is held by the relay head together with the attachment tool, (e) a state in which the relay head has been inverted from the same state, and (f) a state in which the relay head and a tool slider are brought close to each other in the same state.FIG. 1 illustrates the operation of a mounting device equipped with a chip transport means for transporting a semiconductor chip without contacting the electrode surface, and shows (a) a state in which a tool slider is in close contact with an attachment tool holding a semiconductor chip, (b) a state in which the attachment tool holding a semiconductor chip has been transferred from a relay head to the tool slider, (c) a state in which the tool slider transports the attachment tool holding a semiconductor chip, (d) a state in which the tool slider has transported the attachment tool holding a semiconductor chip to directly below the mounting head, (e) a state in which the attachment tool holding a semiconductor chip has been in close contact with a head suction block of the mounting head, and (f) a state in which the attachment tool holding a semiconductor chip has been transferred to the mounting head. This explains the operation of a mounting device equipped with a chip transport means for transporting a semiconductor chip without contacting the electrode surface, and shows (a) a mounting head holding a semiconductor chip via an attachment tool that holds the semiconductor chip, (b) a state in which the semiconductor chip held by the attachment tool approaches the substrate as the mounting head descends, (c) a state in which the semiconductor chip is in close contact with the substrate after the semiconductor chip and substrate have been aligned, and (d) a state in which the attachment tool, which has released its hold on the semiconductor chip, rises together with the mounting head after the semiconductor chip and substrate have been bonded.

[0035] An embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a tool slider 61S used in embodiment 1 of the present invention, which is used in place of the tool slider 61 in the mounting apparatus 1 of Fig. 19 to constitute the chip transport means 6. Note that the division into the chip supply section 1A and the mounting section 1B in the mounting apparatus 1 shown in Fig. 19 is merely for convenience. For this reason, the relay head 1A may be considered to belong to the mounting section 1B, in which case the chip transport means 6 can be said to be located within the mounting section 1B.

[0036] Unlike the tool slider 61 shown in FIG. 17A, the tool slider 61S shown in FIG. 1 is capable of holding only the attachment tool 42. That is, in the configuration of the tool slider 61 shown in FIG. 17A, when no chip component C is present, the second suction holes 422H shown in FIG. 18B are not blocked, making it difficult to suction only the attachment tool 42 even when the pressure-reducing flow path 61P is reduced. For this reason, the tool slider 61S shown in FIG. 1 has tool suction holes 611H in the frame 611 as suction holes for suction-retaining the attachment tool 42. The tool suction holes 611H do not overlap with either the first suction holes 421H or the second suction holes 422H of the attachment tool 42. Furthermore, the tool pressure-reducing flow path 611P, which communicates with the tool suction holes 611H, is independent of the pressure-reducing flow path 61P.

[0037] In the tool slider 61S, the positional relationship between the tip suction hole 61H and the tool suction hole 611H is not limited to that shown in Fig. 1, and they may be arranged on the same straight line. In short, it is sufficient that the tool suction hole 611H is arranged in a position where it can suck the attachment tool 42 without overlapping with either the first suction hole 421H or the second suction hole 422H of the attachment tool 42.

[0038] If the tool slider 61S has a tool suction hole 611H in addition to the suction hole 61H as shown in Figure 1, with the configuration of the mounting device 1 shown in Figure 19, it is possible to transport the attachment tool 42 held by the mounting head 4 as shown in Figure 23 (d) from the mounting section 1B side to the chip supply section 1A side and return it to the state where it is held by the relay head 8 (Figure 21 (a)).

[0039] 2 and 3 explain the state changes that occur when the attachment tool 42, which is held by the mounting head 4 as shown in Fig. 23(d), is held by the relay head 8 shown in Fig. 21(a). Here, in order to explain the situation assuming that the arrangement of the chip suction holes 61H and the tool suction holes 611H is in the positional relationship as shown in Fig. 1, Figs. 21 to 23 are views seen from the X direction in which the chip suction holes 61H enter the cross section, while Figs. 2 and 3 are views seen from the Y direction in which the tool suction holes 611H enter the cross section.

[0040] Fig. 2(a) shows a state in which the mounting head 4 has been further raised from the state shown in Fig. 23(d). After this, Fig. 2(b) shows a state in which the tool slider 61S, which had been retracted to another position from the state shown in Fig. 22(f), is positioned close to and directly below the mounting head 4. From this state, the mounting head 4 is lowered to bring the tool slider 61S into close contact with the attachment tool 42, as shown in Fig. 2(c). In this state, the tool suction hole 611H of the tool slider 61S faces the flat surface of the attachment tool 42, and therefore, by depressurizing the tool decompression flow path 611P, the attachment tool 42 is sucked and held by the tool slider 61.

[0041] By releasing the suction hold by the head suction block 41 and raising the mounting head 4, the attachment tool 42 is transferred to the tool slider 61S and fixed thereto, as shown in FIG. 2(d). Therefore, if the tool slider 61S is configured to be able to reciprocate along the transport rail, it becomes possible to transport the tool slider 61S toward the chip supply unit 1A (in the −X direction), as shown in FIG. 2(e). After the attachment tool 42 is moved to the lower side of the relay head 8, as shown in FIG. 2(f), the relay head 8 is lowered to come into close contact with the attachment tool 42 and hold it by suction, as shown in FIG. 3(a). Then, by releasing the suction hold by the tool slider 61S (by opening the tool pressure reduction channel 611P), the relay head 8 is raised (FIG. 3(b)). The attachment tool 42 transferred from the tool slider 61S is held by the relay head 8, as shown in FIG. 3(c).

[0042] After the attachment tool 42 is held by the relay head 8 in this manner, the relay head 8 is turned over and is ready for use at the stage shown in FIG. 21(a).

[0043] Here, the tool slider 61S shown in FIG. 1 has the function of holding a semiconductor chip C via an attachment tool 42, similar to the tool slider 61 (shown in FIG. 17(a)). Therefore, there is no problem in using the tool slider 61S instead of the tool slider 61 in the processes shown in FIGS. 21 to 23. That is, the tool slider 61S, which has the added function of holding only the attachment tool 42 and the ability to move the tool slider 61S from the mounting unit 1B to the chip supply unit 1A, allows one attachment tool 42 to be used repeatedly. Here, adding the function of holding only the attachment tool 42 to the tool slider 61S and adding the ability to move the tool slider 61S from the mounting unit 1B to the chip supply unit 1A have almost no effect on the size of the device. Furthermore, since one attachment tool 42 can be used repeatedly, there is no need to own multiple attachment tools 42 of the same shape.

[0044] 21 to 23 and 2 to 3 mainly explain the tool slider 61S (in FIGS. 21 to 23, the tool slider 61 is read as the tool slider 61S), but FIGS. 4 to 6 show the state transitions of each part within the movable range of the tool slider 61S in the mounting device.

[0045] 4 to 6 are step diagrams showing the positional changes of the tool slider 61S, attachment tool 42, and semiconductor chip C in the relay head 8 of the chip supply unit 1A, the mounting head 4 of the mounting unit 1B, and the transport rail 60. In each figure, each component is shown in a simplified form, and the relay head 8 is shaped so that it is clear whether the surface holding the attachment tool 42 is facing up or down.

[0046] Since the tool slider 61S is repeatedly used while reciprocating between the relay head 8 and the mounting head 4, any process may be set as STEP 1, but in FIG. 4, the start state corresponds to FIG. 3(d).

[0047] 4, the collet 143 is omitted, and therefore STEP 2 shows the state achieved in Figures 21(a) to 21(d). That is, STEP 2 shown in Figure 4 is the state in which the relay head 8 holds the semiconductor chip C via the attachment tool 42, and the next STEP 3 is the state in which the relay head 8 is turned over.

[0048] 4, the attachment tool 42 holding the semiconductor chip C is transferred from the relay head 8 to the tool slider 61S as shown in FIGS. 21(f) to 22(b). Then, in STEP 6, the attachment tool 42 holding the semiconductor chip C moves along the transport rail 60 toward the mounting head 4 (corresponding to FIG. 22(C)).

[0049] The tool slider 61S, which is positioned directly below the mounting head 4, transfers the attachment tool 61S holding the semiconductor chip C to the mounting head 4 (head suction block 41) in steps 7 to 9 shown in Figure 5 (corresponding to Figures 22(d) to 22(f)).

[0050] The mounting head 4, which has been handed the attachment tool 42 holding the semiconductor chip C, places the substrate S directly below it after the tool slider 61S has retracted (corresponding to Figure 23(b)), and then in STEP 11, mounts the semiconductor chip C by closely adhering it to the substrate S (corresponding to Figure 23(c)).In STEP 12, the attachment tool 42 releases the suction of the semiconductor chip C while still holding it and rises (corresponding to Figure 23(d)).

[0051] As described above, the semiconductor chip C picked up in the chip supply section 1A is transported to the mounting section 1B together with the attachment tool 42, and after the mounting head 4 mounts the semiconductor chip C on the substrate S, only the attachment tool 42 is transported toward the relay head 8.

[0052] Therefore, as shown in STEP 13 in FIG. 5, the tool slider 61S is placed (as shown in FIG. 2(b)) directly below the mounting head 4 (as shown in FIG. 2(a)) after the semiconductor chip C has been mounted, and then, as shown in STEP 14 and STEP 15 in FIG. 6 (corresponding to FIGS. 2(c) and 2(d)), the attachment tool 42 is transferred from the mounting head 4 to the tool slider 61S.

[0053] The tool slider 61S, to which the attachment tool 42 has been handed over, moves along the conveying rail 60 toward the relay head 8 as in STEP 16 (corresponding to Figure 2(e)), and is positioned directly below the relay head 8 in STEP 17 (corresponding to Figure 2(f)).

[0054] The tool slider 61S disposed directly below the relay head 8 passes through STEP 17 to STEP 19 (corresponding to FIGS. 2(f) to 3(b)), and delivers the attachment tool 42 to the relay head 8. Thereafter, the relay head 8 is turned over, thereby reaching the state of STEP 1 shown in FIG.

[0055] Incidentally, even if a tool slider 61 that cannot adsorb the attachment tool 42 without holding the semiconductor chip C is used, the attachment tool 42 can be mounted on the frame body 611, but cannot be held (fixed). This results in a large positional deviation when the attachment tool 42 is transferred to the relay head 8. This makes it difficult to hold the semiconductor chip C in the predetermined position of the attachment tool 42 at the stage of STEP 2 shown in Figure 9, making this method unsuitable for mounting that requires high-precision alignment.

[0056] As described above, by using the tool slider 61S, it is clear that the attachment tool 42 can be used repeatedly. On the other hand, as can be seen from Figures 4 to 6, components other than the one holding the attachment tool 42 rarely operate. For example, the mounting head 4 does not operate from STEP 1 to STEP 6, and the relay head 8 does not operate from STEP 6 to STEP 16. This is disadvantageous from the viewpoint of takt time.

[0057] For this reason, it was thought that takt time could be improved by arranging multiple attachment tools 42 within the range from the relay head 8 to the mounting head 4, but it was found that this was not possible with the configuration of the mounting apparatus 1 shown in Figure 19. Therefore, various studies were conducted and it was decided that the tool slider 61D, which is embodiment 2 of the present invention, significantly improved the takt time. Figure 7 is an external view of a mounting apparatus 1001 equipped with the tool slider 61D, and other than the use of the tool slider 61D, the basic configuration is the same as embodiment 1 using the tool slider 61S. In other words, the tool slider 61D constitutes the chip transport means in the mounting apparatus 1001 of Figure 7.

[0058] 7, the tool slider 61D of the mounting device 1001 has a configuration in which two tool sliders 61S are connected along the transport rail 60. That is, as shown in Fig. 8, the external appearance of the tool slider 61D is such that frame bodies 611A and 611B, which are the same frame bodies as the frame body 611 of the tool slider 61S, are connected along the transport rail 60. Furthermore, the frame bodies 611A and 611B have chip suction holes 61AH and 61BH that have the same function as the chip suction hole 61H provided in the frame body 611, and also have tool suction holes 611AH and 611BH that have the same function as the tool suction hole 611H.

[0059] The tool slider 61D can hold two attachment tools 42 at the same time, but the mounting apparatus 1001 can handle three attachment tools 42 at the same time. Therefore, FIGS. 9 and 10 are step diagrams that show the state transitions of the attachment tools 42 within the mounting apparatus 1001. While the step diagrams of FIGS. 4 to 6 show the presence or absence of the tool slider 61S midway along the conveyor rail 60, this is omitted in the step diagrams of FIGS. 9 and 10. This is because, when the tool slider 61D is used, a state in which the tool slider 61S waits midway along the conveyor rail 60, such as in STEP 10 to STEP 12 shown in FIG. 5, is unnecessary, and the movement between below the relay head 8 and below the mounting head 4 can be seen from the difference between the diagrams of the steps.

[0060] The operations of the relay head 8, the mounting head 4, and the tool slider 61D in the mounting apparatus 1001 will be described below using examples of each step shown in FIGS.

[0061] First, in STEP 1 shown in Figure 9, the relay head 8 holds the attachment tool 42 and waits for the semiconductor chip C to be handed over, while the tool slider 61D moves under the head suction block 41 (of the mounting head 4), allowing the mounting head 4 to hand over the attachment tool 42 to the frame body 611B side.

[0062] Next, in STEP 2 shown in FIG. 9, the semiconductor chip C is delivered to the relay head 8, while the mounting head 4, which has delivered the attachment tool 42 to the frame 611B side, is raised.

[0063] After this, while the relay head 8 is inverted between STEP 3 and STEP 5 shown in Figure 9, the frame body 611A side is positioned directly below the head suction block 41 of the mounting head 4, and then the attachment tool 42 holding the semiconductor chip C can be transferred from the frame body 611A side to the mounting head 4.

[0064] In STEP 5, after the attachment tool 42 is transferred from the frame body 611A side to the mounting head 4, the tool slider 61D (not shown in Figure 9) moves from below the mounting head 4 to below the relay head 8, and the mounting location of the substrate S is positioned below the mounting head 4.

[0065] Therefore, from STEP 6 shown in Figure 9 to STEP 8 shown in Figure 10, the relay head 8 passes the attachment tool 42 holding the semiconductor chip C to the frame body 611A side of the tool slider 61D, while the mounting head 4 can mount the semiconductor chip C on the substrate S.

[0066] 10, the frame 611B side of the tool slider 61D is moved to directly below the relay head 8, and then the attachment tool 42 is handed over from the frame 611B side to the relay head 8 in STEPs 10 and 11. In STEPs 9 to 11 shown in Fig. 10, the mounting head 4 is in a standby state holding the attachment tool 42, but if the time required for mounting is long, the mounting work described in STEPs 6 to 8 may be performed in STEPs 6 to 10.

[0067] 1, the tool slider 61D (not shown) moves from below the relay head 8 to below the mounting head 4, and in STEP 12 the relay head 8 holding the attachment tool 42 is turned over to prepare for the transfer of the semiconductor chip C, while the tool slider 61D moves below the head suction block 41 (of the mounting head 4). After this, the state can be shifted to STEP 1 in FIG. 9, making repeated operations possible.

[0068] Incidentally, as explained regarding the mounting head 4 in STEPs 9 to 11 shown in FIG. 10, the operations of the relay head 8, the mounting head 4, and the tool slider 61D do not necessarily have to have the relationship shown in FIGS. 9 and 10, but may be adjusted according to the operating time of each part.

[0069] In any case, by using the tool slider 61D capable of holding two attachment tools 42, the standby time of both the relay head 8 and the mounting head 4 is shortened. Since the standby time of the mounting head 4 is shortened, the takt time for mounting is shortened and productivity is improved. Note that even if the tool slider 61D is used for the chip transport means 6, the size of the mounting apparatus as a whole remains almost unchanged. Therefore, productivity can be improved with a compact shape compared to the device configuration that retrieves the attachment tool 42 from the mounting head 4.

[0070] Incidentally, with regard to the state of the mounting head 4 from STEP 9 to STEP 11 shown in Fig. 10, it was explained that if the time required for mounting is long, the head will not enter a standby state, but hybrid bonding, which does not require much temperature increase or decrease like solder bonding, can be completed in a short time. Therefore, shortening the operation from STEP 6 shown in Fig. 9 to STEP 11 shown in Fig. 10 as much as possible will further improve the takt time.

[0071] Therefore, as a modification of the second embodiment, a method using a plurality of relay heads 8 has been considered. That is, a method using relay heads 8A and 8B has been considered. Furthermore, when the relay heads 8A and 8B face the tool slider 61D, the interval at which they hold the attachment tools 42 is made equal to the interval at which the frame bodies 611A and 611B hold the attachment tools 42, thereby enabling simultaneous transfer.

[0072] Specifically, as shown in STEPRD1 to STEPRD3 in Figure 11, the attachment tool 42 holding the semiconductor chip C can be transferred from the relay head 8A to the frame portion 611A side, and at the same time, the attachment tool 42 held by the frame portion 611B side can be transferred to the relay head 8B, thereby shortening the takt time.

[0073] However, after the tool slider 61D moves in the STEPRD3 state, the attachment tool 42 is transferred to the frame portion 611B by the operations STEPBI to STEPBI shown in Fig. 12, so when the tool slider 61D returns to the relay head side, the semiconductor chip C and attachment tool 42 held by the relay head 8B cannot be transferred to the frame portion 611B side. For this reason, the operations STEPRS1 to STEPRS6 shown in Fig. 13 must be performed, and the advantage of having two relay heads 8 cannot be said to be sufficient.

[0074] Therefore, in embodiment 3 of the present invention, it was discovered that in order to achieve the effect of having two relay heads 8 (relay head 8A and relay head 8B), it is effective to use a tool slider 61T having three frame bodies as a chip transport means.

[0075] Figure 14 is an external view of a tool slider 61T according to embodiment 3 of the present invention, in which a frame body 611C, which is the same as the frame body 611A and frame body 611B constituting the tool slider 61D shown in Figure 8, is connected (to the tool slider 61D) in a direction along the transport rail 60.

[0076] 15, when the attachment tool 42 holding the semiconductor chip C on the frame 611B side is moved below the mounting head 4, the attachment tool 42 held by the mounting head 4 can be transferred to the frame 611A instead of the frame 611C. Therefore, by setting the tool slider 61T moved below the relay head 8 after transfer with the mounting head 4 as shown in STEPRA1 in Fig. 16, the attachment tool 42 can be transferred from the frame 611A side to the relay head 8A, and the semiconductor chip C and attachment tool 42 can be transferred from the relay head 8B to the frame 611B side simultaneously by STEPRA1 to STEPRA3 in Fig. 16.

[0077] As described above, by using the tool slider 61T in which three frames 611 are connected, the effect of using two relay heads 8 can be fully realized, and the time required for transfer at the chip supply unit 1B can be shortened. This effect is particularly effective in shortening the takt time for hybrid bonding, which requires a short time to mount the semiconductor chip C on the substrate S.

[0078] REFERENCE SIGNS LIST 1, 1001 Mounting device 1A, 1001A Chip supply unit 1B, 1001B Mounting unit 2 Substrate stage 3 Elevating means 4 Mounting head 5 Upper and lower two-view camera 6 Chip transport means 8 Relay head 10 Wafer ring 11 Wafer transport means 12 Pickup stage 13 Push-up means 14 Pickup unit 15 Chip relay unit 20 Stage movement control means 21 X-direction stage movement control means 22 Y-direction stage movement control means 23 Suction table 40 Head main body 41 Head suction block 42 Attachment tool 43 Tool position control means 60 Transport rail 61, 61S, 61D, 61T Tool slider 61H, 61AH, 61BH, 61CH Chip suction hole 61V Exhaust hole 62 Chip slider 100 Wafer rack 120 Frame 131 Needle 140 Horizontal rail 141 Upper and lower rails 142 Pick-up head 143 Collet 150 Horizontal rail 151 Upper and lower rails 200 Base 420H Suction hole 420V Exhaust hole 421H First suction hole 421P First pressure reduction flow path 421V First exhaust hole 422H Second suction hole 422P Second pressure reduction flow path 422V Second exhaust hole 610, 610A, 610B, 610C Opening 611, 611A, 611B, 611C Frame 611H, 611AH, 611BH, 611CH Tool suction hole B Electrode C Semiconductor chip DT Dicing tape S Substrate

Claims

1. A chip transport means for transporting semiconductor chips from a chip supply section to a mounting section, comprising: a tool slider in the chip supply section that receives and holds the semiconductor chip held by an attachment tool together with the attachment tool; and a transport rail for transporting the tool slider to the mounting section, wherein the tool slider has the function of transferring the semiconductor chip together with the attachment tool to a mounting head of the mounting section and the function of receiving only the attachment tool after the mounting head has mounted the semiconductor chip, and the chip transport means is capable of transporting only the attachment tool along the transport rail to the chip supply section.

2. A chip transport means as claimed in claim 1, wherein the tool slider has a frame that supports the edge of the surface of the attachment tool that holds the semiconductor chip, and the frame has suction holes that communicate with a pressure reduction flow path on the surface that comes into contact with the attachment tool, and the chip transport means is shaped so that the semiconductor chip fits inside the frame.

3. A chip transport means as set forth in claim 2, wherein the attachment tool has a first chip suction flow path that communicates with the reduced pressure flow path of the mounting head and suctions the semiconductor chip, and a second chip suction flow path that is provided independently of the first chip suction flow path and is capable of suctioning the semiconductor chip, and the chip transport means has, as suction holes in the frame, chip suction holes that connect to the second chip suction flow path of the attachment tool, and tool suction holes that suction and hold the attachment tool.

4. A chip transport means according to claim 2, wherein one of said tool sliders has a plurality of said frame bodies connected thereto.

5. A mounting device comprising: a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side and a relay head that holds the semiconductor chip held by the collet from the side opposite the electrode surface via the attachment tool; chip transport means according to any one of claims 1 to 3; and a mounting head that receives the semiconductor chip transported by the chip transport means together with the attachment tool.

6. A mounting device comprising: a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side and a relay head that holds the semiconductor chip held by the collet from the side opposite the electrode surface via the attachment tool; chip transport means according to claim 4; and a mounting head that receives the semiconductor chip transported by the chip transport means together with the attachment tool.

7. A mounting device according to claim 6, wherein a plurality of said relay heads are arranged at the same intervals as the intervals at which a plurality of said frame bodies are arranged.

8. A mounting apparatus according to claim 7, wherein the number of said frames is greater than the number of said relay heads.

9. A mounting apparatus according to any one of claims 6 to 8, wherein the attachment tool is simultaneously placed at least at two locations on the relay head, the tool slider and the relay head.

10. A mounting device according to claim 5, wherein the collet holds the semiconductor chip in a non-contact manner.

11. A mounting device according to any one of claims 6 to 8, wherein the collet holds the semiconductor chip in a non-contact manner.

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