Sensor substrate

Abstract

Provided is a sensor substrate capable of suppressing the effect of a component provided to a substrate on output data of a sensor chip.　The sensor substrate comprises: a substrate; a sensor chip provided to the substrate; a plurality of components that are provided on the substrate and affect output data of the sensor chip by at least one among vibration and stress; and a slit formed at a prescribed position between the sensor chip and at least one among the plurality of components on the substrate.

Description

Sensor Board

[0001] The present technology relates to a sensor substrate.

[0002] 2. Description of the Related Art Various electronic devices are equipped with sensors such as acceleration sensors, and various processes are executed using output data from the sensors.

[0003] In electronic devices equipped with various sensors such as acceleration sensors and circuit boards used in such electronic devices, there is a problem that errors occur in output data due to influences from the outside or from other components.

[0004] Therefore, an electronic pedometer has been proposed that includes a vibration blocking means for blocking vibrations generated by the operation of an external operating member on the board so that the vibrations are not transmitted to the acceleration sensor (Patent Document 1).

[0005] Japanese Patent Application Laid-Open No. 2008-198051

[0006] The technique described in Patent Document 1 has a problem in that it is not possible to suppress the influence of vibrations and stresses that occur when attaching a board fixing screw to a board on the acceleration sensor.

[0007] The present technology has been developed in consideration of such problems, and aims to provide a sensor substrate that can suppress the influence of components mounted on the substrate on the output data of the sensor chip.

[0008] In order to solve the above-mentioned problems, the first technology is a sensor substrate including a substrate, a sensor chip provided on the substrate, a plurality of components provided on the substrate that affect the output data of the sensor chip through at least one of vibration and stress, and a slit formed in a predetermined position on the substrate between at least one of the plurality of components and the sensor chip.

[0009] The second technology is a sensor substrate including a substrate, a sensor chip provided on the substrate, a fixing component provided on the substrate, a connecting component provided on the substrate, and a slit formed at a predetermined position on the substrate between the sensor chip and at least one of the fixing component and the connecting component.

[0010] 1A and 1B are diagrams showing a sensor substrate 100 in the present embodiment, with FIG. 1A being a plan view of the sensor substrate 100 and FIG. 1B being a side view of the sensor substrate 100. FIG. 1B is a diagram explaining that the slit 60 is asymmetrical with respect to an axis. FIG. 1C is a diagram explaining that the slit 60 is asymmetrical with respect to a point. FIG. 1D is a diagram explaining the position of the slit 60. FIG. 5A is a plan view of the sensor substrate 100 and FIG. 5B is a cross-sectional view taken along line 5B-5B of FIG. 5A explaining a problem when the slit 60 is not present. FIG. 5B is a cross-sectional view taken along line 5B-5B of FIG. 5A explaining the effect of the slit 60. FIG. 6A is a plan view of the sensor substrate 100 and FIG. 6B is a cross-sectional view taken along line 6B-6B of FIG. 6A explaining the effect of the slit 60. FIG. 6D is a diagram explaining another example of the shape of the slit 60. FIG. 6E is a diagram explaining another example of the shape of the slit 60. FIG. 6F is a diagram explaining the case where there are three or more screws. FIG. 6G is a diagram explaining the case where there is one screw.

[0011] Hereinafter, embodiments of the present technology will be described with reference to the drawings. The description will be made in the following order: <Embodiment> [Configuration of sensor substrate 100] [Effect of slit 60] [Other examples of the shape of slit 60] <Modification>

[0012] <Embodiment> [Configuration of Sensor Substrate 100] The configuration of a sensor substrate 100 according to the present technology will be described with reference to Fig. 1. The sensor substrate 100 constitutes a MEMS (Micro Electro Mechanical System), and is mounted and used in electronic devices such as smartphones, tablet terminals, cameras, and robots, and in mobile objects such as automobiles, drones, personal mobility devices, and ships (collectively referred to as external devices). However, the external device is not limited to these, and may be any device in which the sensor substrate 100 can function.

[0013] The substrate 10 is a silicon substrate, a glass substrate, or the like, on which various circuits, elements, signal lines, IC chips, etc. are mounted. In this embodiment, the substrate 10 is configured as a rectangular flat plate in a plan view, but the shape of the substrate 10 is not limited to this and may be any shape.

[0014] The sensor chip 20 is a chip equipped with the function of an IMU (Inertial Measurement Unit). The IMU is a sensor that can detect the attitude, tilt, movement, rotation, etc. of an external device on which the sensor substrate 100 is mounted using a two-axis or three-axis acceleration sensor, an angular velocity sensor, a gyro sensor, etc.

[0015] The screws 30 are fixing parts used to fix the sensor board 100 to the chassis of an external device or the like. Fixing parts are parts for fixing the sensor board 100 to an external device. It is preferable to minimize the vibration and stress transmitted from the screws 30 to the sensor chip 20, so it is desirable to use as few screws 30 as possible.

[0016] 1, the sensor board 100 is fixed to an external device using a first screw 31 and a second screw 32. As shown in Fig. 1B, a first mounting boss 41 is used to connect the sensor board 100 to an external device using the first screw 31, and a second mounting boss 42 is used to connect the sensor board 100 to an external device using the second screw 32. When there is no need to distinguish between the first screw 31 and the second screw 32, they will be simply referred to as screws 30.

[0017] The connector 50 is a connecting component that connects a harness to connect the sensor board 100 to an external device, and is used for transmitting and receiving electrical signals, supplying power, etc. A connecting component is a component that electrically connects the sensor board 100 to any external device.

[0018] Examples of the connector 50 include an FPC (Flexible Printed Circuits) connector, an FFC (Flexible Flat Cables) connector, an IDC (Insulation Displacement Contact) connector, an LVDS (Low Voltage Differential Signaling) connector, an edge socket connector, and a short-circuit connector, but the present technology does not limit the type of connector 50.

[0019] The first screw 31, the second screw 32, and the connector 50 are components that are subject to vibration and / or stress and affect the output data of the sensor chip 20. This effect causes errors in the output data of the sensor chip 20.

[0020] Vibration is a phenomenon in which an object repeatedly changes position up and down or left and right over time, and the closer the component generating the vibration is to the sensor chip 20, the greater the impact. Stress is a force that occurs inside an object when the object is subjected to an external force, and the closer the object is to the component generating the stress, the greater the impact it receives.

[0021] The slits 60 are grooves that penetrate from one surface to the other surface of the substrate 10 and are formed between the sensor chip 20 and the first screw 31, between the sensor chip 20 and the second screw 32, and further between the sensor chip 20 and the connector 50 on the substrate 10. The width of the slits 60 is, for example, 2 mm, but the slits 60 of the present technology are not limited to a particular width.

[0022] When the substrate 10 is fixed to an external device using the first screw 31 and the second screw 32 as shown in FIG. 1, it is preferable that the slit 60 be formed between the first screw 31 and the sensor chip 20 and between the second screw 32 and the sensor chip 20.

[0023] The slit 60 is formed to surround the sensor chip 20. However, the slit 60 does not surround the entire periphery of the sensor chip 20, but is divided at multiple locations. In the example of FIG. 1 , the slit 60 is divided at two locations, a first dividing location Q1 and a second dividing location Q2, which are surrounded by dashed circles. Therefore, the slit 60 is composed of two slits: a first slit 61 formed between the first screw 31 and the sensor chip 20, and a second slit 62 formed between the second screw 32 and the sensor chip 20. It is desirable that the first dividing location Q1 and the second dividing location Q2 that divide the slit 60 face each other. Note that a signal line can be provided at the location where the slit 60 is divided in the substrate 10 to allow a signal to pass through.

[0024] 2, the slit 60 is formed so as to be asymmetrical with respect to an arbitrary line passing through the approximate center position or center of gravity position (hereinafter referred to as position 20P) of the sensor chip 20 in a plan view. In Fig. 2, lines L1, L2, L3, and L4 are shown as the arbitrary lines passing through position 20P, and the slit 60 is asymmetrical with respect to all of the lines L1, L2, L3, and L4.

[0025] In this embodiment, the first slit 61 and the second slit 62 are made to have different lengths, only one end of each of the first slit 61 and the second slit 62 is formed in an L-shape, and the dividing position of the first slit 61 and the second slit 62 is shifted from the line L4, so that the slit 60 is asymmetrical with respect to any of the lines L1, L2, L3, and L4. Note that the lines L1, L2, L3, and L4 are merely examples, and the slit 60 is asymmetrical with respect to any line passing through the position 20P.

[0026] Furthermore, as shown by the dashed line in Figure 3, the slit 60 does not overlap with the result of rotating the slit 60 180 degrees based on position 20P of the sensor chip 20, and is formed so as to be asymmetrical about a point with respect to position 20P in a planar view.

[0027] In this embodiment, the first slit 61 and the second slit 62 are formed in an L-shape only on one end side, so that the entire slit 60 is formed asymmetrically with respect to the position 20P of the sensor chip 20.

[0028] The slit 60 is formed at a position spaced a predetermined distance from the sensor chip 20 .

[0029] As shown in Figure 4, the first slit 61 is formed so that the ratio of the distance D1a from position 20P of the sensor chip 20 to the first slit 61 on a straight line D1 connecting the approximate center position or center of gravity position of the first screw 31 (hereinafter referred to as position 31P) to the distance D1b from position 31P of the first screw 31 to the first slit 61 is within the range of 6:4 to 4:6.

[0030] Furthermore, the first slit 61 is formed so that the ratio of the distance D2a from the position 20P of the sensor chip 20 to the first slit 61 on the straight line D2 connecting the approximate center position or center of gravity position of the connector 50 (hereinafter referred to as position 50P) to the distance D2b from the position 50P of the connector 50 to the first slit 61 is within the range of 6:4 to 4:6.

[0031] Furthermore, the second slit 62 is formed so that the ratio of the distance D3a from the position 20P of the sensor chip 20 to the second slit 62 on the straight line D3 connecting the approximate center position or center of gravity position of the second screw 32 (hereinafter referred to as position 32P) to the distance D3b from the position 32P of the second screw 32 to the second slit 62 is within the range of 6:4 to 4:6.

[0032] In Figure 4, the reference positions in the first slit 61 and the second slit 62 for determining the distances D1a, D1b, D2a, D2b, D3a, and D1b are set to approximately the center positions in the width direction, but may be set to other positions.

[0033] The slits 60 do not need to be formed between the sensor chip 20 and all components provided on the substrate 10 that affect the output data of the sensor chip 20 due to either vibration or stress, but only need to be formed between at least those components that are provided closest to the sensor chip 20. However, by forming the slits 60 between the sensor chip 20 and multiple or all components that affect the output data of the sensor chip 20 due to either vibration or stress, it is possible to suppress errors in the output data of the sensor chip 20 caused by the influence of those components.

[0034] The sensor substrate 100 of the present technology is configured as described above.

[0035] [Effect of Slits 60] Next, the effect of the slits 60 in the sensor substrate 100 configured as described above will be described.

[0036] As shown in Figure 5, if there is no slit 60 between the sensor chip 20 and the first screw 31, vibration V1 from an external device, as indicated by the arrow, will be transmitted to the sensor chip 20 via the first screw 31 and the substrate 10, causing an error in the output data of the sensor chip 20.

[0037] Furthermore, if there is no slit 60 between the sensor chip 20 and the second screw 32, vibration V2 from an external device, as indicated by the arrow, will be transmitted to the sensor chip 20 via the second screw 32 and the substrate 10, causing an error in the output data of the sensor chip 20.

[0038] Furthermore, stress S due to the difference in level or tightening between the first screw 31 and the second screw 32, as shown by the broken line, is transmitted to the sensor chip 20 via the substrate 10, causing an error in the output data of the sensor chip 20.

[0039] Furthermore, if the vibrations and stresses generated by tightening the first screw 31 and the second screw 32 when fixing the sensor substrate 100 to an external device are transmitted to the sensor chip 20 via the substrate 10, the characteristics of the sensor chip 20 will change, resulting in a discrepancy in the output data of the sensor chip 20 before and after fixing the sensor substrate 100 to the external device.

[0040] Furthermore, if the vibrations and stresses generated when connecting the harness to the connector 50 are transmitted to the sensor chip 20 via the substrate 10, the characteristics of the sensor chip 20 will change, resulting in a discrepancy in the output data of the sensor chip 20 before and after connecting the harness to the connector 50.

[0041] In contrast, in the present technology, as shown in Fig. 6 , slits 60 are formed on the substrate 10 between the sensor chip 20 and the first screw 31 and between the sensor chip 20 and the second screw 32, thereby making it possible to suppress vibrations generated by an external device or vibrations generated when force is applied to the external device from being transmitted to the sensor chip 20 via the first screw 31, the second screw 32, and the substrate 10. In addition, it is possible to suppress stress S caused by a step or a tightening difference between the first screw 31 and the second screw 32 from being transmitted to the sensor chip 20 via the substrate 10. Furthermore, it is possible to suppress transmission of vibrations and stresses generated when tightening the first screw 31 and the second screw 32 to fix the sensor substrate 100 to an external device from being transmitted to the sensor chip 20 via the substrate 10.

[0042] Furthermore, by forming the slit 60 between the sensor chip 20 and the connector 50, it is possible to suppress the transmission of vibrations and stresses that occur when connecting the harness to the connector 50 to the sensor chip 20 via the substrate 10. It is also possible to suppress the transmission of vibrations generated by an external device or vibrations that occur when force is applied to an external device to the sensor chip 20 via the connector 50 and the substrate 10.

[0043] This prevents errors from occurring between the output data of the sensor chip 20 when the sensor substrate 100 is alone before being fixed to an external device with the screws 30 and the output data of the sensor chip 20 when the sensor substrate 100 is fixed to an external device with the screws 30, enabling accurate sensing even after the sensor substrate 100 is fixed to an external device.

[0044] Furthermore, by forming the slits 60 to be asymmetrical with respect to a line and a point, it is possible to prevent vibrations transmitted from the screws 30 and the connectors 50 to the sensor chip 20 from resonating, thereby suppressing vibration of the sensor chip 20. This makes it possible to suppress errors in the output data of the sensor chip 20, thereby enabling accurate sensing. It is also possible to stabilize the operation of the sensor substrate 100 and the operation of an external device on which the sensor substrate 100 is mounted.

[0045] In addition, the slit 60 is formed to surround the sensor chip 20, but rather than surrounding the entire periphery of the sensor chip 20, it is divided at multiple locations (two locations in this embodiment) and formed as a first slit 61 and a second slit 62.

[0046] By forming the slit 60 in this manner, in addition to the above-mentioned effect of reducing the vibrations and stresses transmitted from the screw 30 and the connector 50 to the sensor chip 20 via the substrate 10, it is also possible to achieve the effect of reducing vibrations in the area surrounding the sensor chip 20 on the substrate 10 (hereinafter sometimes referred to as the surrounding area).

[0047] The peripheral region of the sensor chip 20 on the substrate 10 is the region inside the slit 60 that is surrounded by the slit 60 and in which the sensor chip 20 is provided. For example, if the peripheral region is surrounded by a single slit 60 that is divided at only one point, as shown in Figures 7A and 7B, the peripheral region will be supported at only that one point, making it unstable and prone to vibration. Furthermore, if the slit 60 is divided at only one point, there is also the problem that it is difficult to pass a wiring pattern to the sensor chip 20.

[0048] In this technology, the slit 60 is divided at multiple locations, namely the first dividing location Q1 and the second dividing location Q2, and the surrounding area is supported at these multiple dividing locations, thereby stabilizing the surrounding area and suppressing vibration of the sensor chip 20.

[0049] Furthermore, by arranging the first dividing portion Q1 and the second dividing portion Q2 that divide the slit 60 to face each other, the surrounding area can be made more stable, and vibration of the sensor chip 20 can be suppressed.

[0050] If the slit 60 is too close to the sensor chip 20, the area of ​​the surrounding region that supports the sensor chip 20 becomes small, making the sensor chip 20 unstable and prone to vibration.

[0051] Therefore, in the present technology, as described above, the ratio of the distance from position 20P of the sensor chip 20 to the slit 60 to the distance from position 31P of the first screw 31 to the slit 60 is formed to be within a range of 6:4 to 4:6. Also, the ratio of the distance from position 20P of the sensor chip 20 to the slit 60 to the distance from position 32P of the second screw 32 to the slit 60 is formed to be within a range of 6:4 to 4:6. As a result, the slit 60 is formed at a position spaced a predetermined distance from the sensor chip 20, and the area of ​​the peripheral region of the substrate 10 that supports the sensor chip 20 around the sensor chip 20 is increased, thereby stabilizing the sensor chip 20. Therefore, vibration of the sensor chip 20 can be suppressed.

[0052] By suppressing vibrations of the sensor chip 20, unintended performance degradation of the sensor chip 20 and calibration failures can be reduced.

[0053] Although there is a method of placing the sensor substrate 100 in a separate box and providing that box in an external device to suppress vibration of the sensor chip 20, the present technology does not require the manufacture of such a box, nor does it require a process of placing the sensor substrate 100 in a box. Therefore, it is possible to reduce manufacturing costs compared to that method, improve manufacturing efficiency, and reduce the number of steps.

[0054] Another method is to provide an elastic material such as gel on the sensor substrate 100 to suppress vibration of the sensor chip 20, but this technology simply involves forming a slit 60 in the substrate 10, which reduces manufacturing costs compared to that method, improves manufacturing efficiency, and reduces labor costs.

[0055] Furthermore, while there are methods for suppressing vibration of the sensor chip 20, such as increasing the size of the substrate 10 or increasing the rigidity of the substrate 10 by giving it a multi-layer structure, such as a two-story structure, this technology only requires forming slits 60 in the substrate 10, making it possible to reduce the size of the substrate 10 and eliminating the need for a complex structure. This technology can reduce manufacturing costs and improve manufacturing efficiency compared to these methods.

[0056] Furthermore, although there is a method of using a soft harness or ribbon cable to reduce the stress applied to the sensor chip 20, the present technology does not require any limitations on the harness or cable to be used.

[0057] In addition, instead of screwing, there is also a method of directly adhering the sensor substrate 100 to a rigid member or the like using adhesive, etc., but with this technology, the sensor substrate 100 can be fixed to a rigid member or an external device with simple screwing, which reduces manufacturing costs and improves manufacturing efficiency.

[0058] Conventionally, deviations in output data tend to occur before and after the sensor substrate 100 is fixed to an external device, requiring a great deal of man-hours to introduce calibration equipment, take measures such as vibration absorption, etc. However, with this technology, there is little or no deviation in the output data before and after fixation, making calibration easier.

[0059] [Other Examples of Shapes of Slit 60] The shape of the slit 60 is not limited to that shown in the above-described embodiment. The slit 60 may have any shape as long as it satisfies the following conditions: it is formed between the sensor chip 20 and a component that affects the output data of the sensor chip 20 due to at least one of vibration and stress; it is asymmetrical about a line or a point; and it is formed at a position separated by a predetermined distance from the sensor chip 20.

[0060] For example, as shown in Fig. 8A, one end of the first slit 61 and the second slit 62 constituting the slit 60 may be curved rather than bent into a substantially L-shape. Also, as shown in Fig. 8B, the slit 60 may be bent at a shallower angle than in the embodiment. Even with such a shape, all of the conditions for the slit 60 described above are satisfied.

[0061] 9A to 9C, the slit 60 can be made non-linearly symmetrical and non-point-symmetrical by making the widths (thickness) of the first slit 61 and the second slit 62 different. In FIG. 9A, the second slit 62 is formed wider (thicker) than the first slit 61. In FIGS. 9B and 9C, the first slit 61 is formed wider (thicker) than the second slit 62. Such a configuration can also achieve the effects of the present technology. There is no limit to the width (thickness) of the slit 60, and it can be any width (thickness) as long as the strength of the substrate 10 is maintained.

[0062] 10A, 10B, and 10C, there are cases where it is not possible to form a slit 60 between the sensor chip 20 and the connector 50 due to the wiring pattern between the sensor chip 20 and the connector 50. In such cases, the slit 60 may not be formed between the sensor chip 20 and the connector 50, but may be formed only between the sensor chip 20 and the screw 30. In this case, too, as shown in FIG. 10B, the slit 60 can be made non-linearly and non-point-symmetrical by changing the lengths of the first slit 61 and the second slit 62. Furthermore, as shown in FIG. 10C, the slit 60 can also be made non-linearly and non-point-symmetrical by changing the widths (thicknesses) of the first slit 61 and the second slit 62.

[0063] <Modifications> Although the embodiments of the present technology have been specifically described above, the present technology is not limited to the above-described embodiments, and various modifications based on the technical ideas of the present technology are possible.

[0064] The sensor is not limited to an IMU, but may be an acceleration sensor, a gyro sensor, etc. The present technology can be applied to any sensor that detects distortion.

[0065] In the embodiment, the slit 60 is divided into two parts, the first slit 61 and the second slit 62, but the number of divisions is not limited to two and may be three or more. When the slit 60 is divided into three parts, the slit 60 is composed of three slits.

[0066] In the embodiment, the description has been given assuming that there are two screws 30, but the present technology is not limited to the number of screws 30. Since the screws 30 transmit vibrations and stress to the sensor chip 20, it is desirable to have a small number of screws 30, but in order to fix the sensor substrate 100 to an external device in a stable state and reduce vibrations of the sensor substrate 100 itself, it is effective to increase the number of screws 30.

[0067] 11 , the number of screws 30 may be three, in which case a slit 60 is also formed between a third screw 33 and the sensor chip 20. This slit 60 may be connected to the slits 60 formed between the other screws and the sensor chip 20. Note that the number of screws 30 may be four or more. Regardless of the number of screws 30, it is necessary to form a slit 60 between the screws 30 and the sensor chip 20 in order to suppress transmission of vibration and stress from the screws 30 to the sensor chip 20.

[0068] Alternatively, the number of screws 30 may be one. In that case, however, it is necessary to use a positioning boss 70 as shown in FIGS. 12A and 12B . Like the screws 30, the positioning boss 70 is a component that affects the output data of the sensor chip 20 through at least one of vibration and stress. Therefore, a slit 60 must also be formed between the positioning boss 70 and the sensor chip 20. As shown in FIG. 12B , the positioning boss 70 is particularly effective when the sensor board 100 is directly attached to a flat housing (rigid body) 200 that can be stably positioned with the entire back surface of the sensor board 100 in contact with it. Using the positioning boss 70 reduces the number of screws to one, thereby reducing the manufacturing cost of the sensor board 100.

[0069] In addition to the screws 30, connectors 50, and positioning bosses 70, the present technology is also effective for any component that affects the output data of the sensor chip 20 due to vibration or stress, or that bends the substrate 10 due to its weight and affects the output data of the sensor chip 20. Specifically, these components include coils, capacitors, resistors, heat sinks, fans, heat dissipation sheets, springs, etc. However, since the sensor substrate 100 cannot be used without the screws 30 or connectors 50, the present technology is effective for a sensor substrate 100 that includes the screws 30 or connectors 50 as well as the other components described above.

[0070] When the substrate 10 is attached to an external device using adhesive or adhesive tape, the screws 30 are not required, and the above-mentioned problems of vibration and stress caused by the screws 30 do not occur. However, even when the screws 30 are not required, the connector 50 is still required to connect the sensor substrate 100 to an external device, so the slit 60 must be formed between the connector 50 and the sensor chip 20.

[0071] The number of connectors 50 is not limited to one, and may be multiple. When multiple connectors 50 are used, it is necessary to form slits 60 between each connector 50 and the sensor chip 20 in order to prevent vibrations and stress from each connector 50 from being transmitted to the sensor chip 20.

[0072] The present technology can also be configured as follows. (1) A sensor substrate comprising: a substrate; a sensor chip provided on the substrate; a plurality of components provided on the substrate that affect output data of the sensor chip through at least one of vibration and stress; and a slit formed in a predetermined position on the substrate between at least one of the plurality of components and the sensor chip. (2) The sensor substrate according to (1), in which the slit is formed between the sensor chip and at least one of the plurality of components that is provided closest to the sensor chip. (3) The sensor substrate according to (1) or (2), in which the slit is formed between all of the components and the sensor chip. (4) The sensor substrate according to any of (1) to (3), in which the slit is formed so as to be asymmetrical with respect to an arbitrary line passing through an approximate center position or center of gravity of the sensor chip. (5) The sensor substrate according to any of (1) to (4), in which the slit is formed so as to be asymmetrical with respect to an approximate center position or center of gravity of the sensor chip. (6) The sensor substrate according to any one of (1) to (5), wherein the predetermined position is a position spaced a predetermined distance from the sensor chip. (7) The sensor substrate according to any one of (1) to (6), wherein the predetermined position is a position on a line connecting the approximate center or center of gravity of the sensor chip and the approximate center or center of gravity of the component, where the ratio of the distance from the approximate center or center of gravity of the sensor chip to the slit to the distance from the approximate center or center of gravity of the component to the slit is within a range of 6:4 to 4:6. (8) The sensor substrate according to any one of (1) to (7), wherein the slit is formed to surround the sensor chip, and the slit is divided at a plurality of locations. (9) The sensor substrate according to (8), wherein the plurality of locations dividing the slit face each other. (10) The sensor substrate according to any one of (1) to (9), wherein the sensor is an IMU. (11) The sensor substrate according to any one of (1) to (10), wherein the component is a screw. (12) The sensor board according to any one of (1) to (11), wherein the component is a connector.(13) The sensor substrate according to any one of (1) to (12), wherein the component is a positioning boss. (14) A sensor substrate comprising: a substrate, a sensor chip provided on the substrate, a fixing component provided on the substrate, a connection component provided on the substrate, and a slit formed in the substrate at a predetermined position between the sensor chip and at least one of the fixing component and the connection component.

[0073] 10: Substrate 20: Sensor chip 31: First screw 32: Second screw 50: Connector 60: Slit 70: Positioning boss 100: Sensor substrate

Claims

1. A sensor substrate comprising: a substrate; a sensor chip provided on the substrate; a plurality of components provided on the substrate that affect output data from the sensor chip through at least one of vibration and stress; and a slit formed in the substrate at a predetermined position between at least one of the plurality of components and the sensor chip.

2. The sensor substrate according to claim 1, wherein the slit is formed at least between the sensor chip and one of the plurality of components that is located closest to the sensor chip.

3. The sensor substrate according to claim 1, wherein the slits are formed between all of the components and the sensor chip.

4. The sensor substrate according to claim 1, wherein the slit is formed so as to be asymmetrical with respect to an arbitrary line passing through the approximate center or center of gravity of the sensor chip.

5. The sensor substrate according to claim 1, wherein the slit is formed asymmetrically with respect to a center or center of gravity of the sensor chip.

6. The sensor substrate according to claim 1, wherein the predetermined position is a position that is a predetermined distance away from the sensor chip.

7. The sensor substrate according to claim 1, wherein the predetermined position is a position on a line connecting the approximate center or center of gravity of the sensor chip and the approximate center or center of gravity of the component, where the ratio of the distance from the approximate center or center of gravity of the sensor chip to the slit to the distance from the approximate center or center of gravity of the component to the slit is within a range of 6:4 to 4:

6.

8. The sensor substrate according to claim 1, wherein the slit is formed so as to surround the sensor chip, and the slit is divided at a plurality of locations.

9. The sensor substrate according to claim 8, wherein the plurality of locations that divide the slits are opposed to each other.

10. The sensor board according to claim 1, wherein the sensor is an IMU.

11. The sensor substrate according to claim 1, wherein the component is a screw.

12. The sensor board according to claim 1, wherein the component is a connector.

13. The sensor board according to claim 1, wherein the component is a positioning boss.

14. A sensor substrate comprising: a substrate; a sensor chip provided on the substrate; a fixing component provided on the substrate; a connecting component provided on the substrate; and a slit formed in the substrate at a predetermined position between the sensor chip and at least one of the fixing component and the connecting component.

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