Electrically insulating resin composition, sheet-shaped uncured product for interlayer insulation, laminate for circuit board, circuit board, and method for manufacturing circuit board

The use of an acid-modified fully hydrogenated styrene-based elastomer in an insulating resin composition for circuit boards addresses flexibility and thermal cycling issues, ensuring stable performance and voltage resistance in harsh environments.

WO2025206042A1PCT designated stage Publication Date: 2025-10-02NHK SPRING CO LTD
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Patent Information

Application Number
PCT/JP2025/012220
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-29
Filing Date
2025-03-26
Publication Date
2025-10-02

AI Technical Summary

Technical Problem

Existing electrically insulating layers in metal-based circuit boards for DC-DC converters in electric vehicles suffer from reduced flexibility, brittleness, and poor thermal cycling resistance due to high inorganic filler blending ratios, leading to cracks and decreased voltage resistance.

Method used

An electrically insulating resin composition containing an acid-modified fully hydrogenated styrene-based elastomer, a polymerizable monomer with reactive double bonds, a thermally conductive inorganic filler, and a mixture of aromatic hydrocarbon and low-molecular-weight alcohol solvents, which enhances flexibility, thermal stability, and resistance to cold-heat cycles.

Benefits of technology

The composition provides a cured product with low storage modulus over a wide temperature range, maintaining flexibility and thermal stability, while reducing water absorption and preventing sudden voltage drops.

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Abstract

Provided are: an electrically insulating resin composition capable of providing an electrically insulating cured product having a low storage elastic modulus in a wide temperature range, excellent thermal cycle resistance, and capable of maintaining flexibility and thermal stability over a long period of time; and a laminate for a circuit board and a circuit board using same. The electrically insulating resin composition contains: an acid-modified, fully hydrogenated styrene-based elastomer; a polymerizable monomer containing a reactive double bond; a thermally conductive inorganic filler; and an organic solvent.
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Citation Information

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