Rubber member, and semiconductor manufacturing–related device

Abstract

The present invention provides a rubber member having excellent corrosion resistance and a semiconductor manufacturing–related device using the same. Provided is a rubber member that includes an olefin-based rubber, the rubber member being at least one member selected from the group consisting of building material members, mobility members, aerospace members, semiconductor members, and information communication members, and the rubber member coming into contact with a corrosive substance.

Description

Rubber materials and semiconductor manufacturing related equipment

[0001] The present disclosure relates to a rubber member and a semiconductor manufacturing-related device.

[0002] It has been proposed to use a mixture of a specific resin and rubber as a packing for a sealed battery (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2008-7671

[0004] An object of the present disclosure is to provide a rubber member having excellent corrosion resistance and a semiconductor manufacturing-related device using the same.

[0005] The present disclosure (1) provides a rubber member containing an olefin-based rubber, the rubber member being at least one selected from the group consisting of building materials, mobility materials, aerospace materials, semiconductor materials, and information and communication materials, and being a rubber member that comes into contact with a corrosive substance.

[0006] The present disclosure (2) is the rubber member according to the present disclosure (1), wherein the olefin-based rubber is at least one selected from the group consisting of ethylene-propylene-diene rubber, ethylene-propylene rubber, and butyl rubber.

[0007] The present disclosure (3) is the rubber member according to the present disclosure (2), wherein the ethylene amount of the ethylene-propylene-diene rubber and the ethylene-propylene rubber is 50 to 70 mass %.

[0008] The present disclosure (4) is a rubber member in any combination with any of the present disclosures (1) to (3), in which the amount of diene monomer in the olefin-based rubber is 0 to 5 mass %.

[0009] The present disclosure (5) is a method for manufacturing a polymeric rubber using the Mooney viscosity (ML １＋４ (100°C)) is 10 to 200.

[0010] The present disclosure (6) is a rubber member of any combination with any of the present disclosures (1) to (5), in which the olefin-based rubber contains 1 to 60% by mass of an olefin resin.

[0011] The present disclosure (7) is a rubber member in any combination with any of the present disclosures (1) to (5), in which the olefin-based rubber contains 45 to 55% by mass of an olefin resin.

[0012] The present disclosure (8) is the rubber member according to the present disclosure (6) or (7), wherein the olefin resin is a polyethylene resin.

[0013] The present disclosure (9) is a method for manufacturing a polymeric resin having a density of 0.94 to 0.97 g / m ３ and a high-density polyethylene having a weight average molecular weight of 1.0 × 10 ６ ~1.0 x 10 ７ and any combination of any of the rubber members (6) to (8) of the present disclosure, which is at least one selected from the group consisting of ultra-high molecular weight polyethylenes.

[0014] The present disclosure (10) is a rubber member in any combination with any of the present disclosures (1) to (9), in which the olefin-based rubber is crosslinked with a peroxide crosslinking agent and / or a sulfur-based crosslinking agent.

[0015] The present disclosure (11) is a rubber member in any combination with any of the present disclosures (1) to (10), wherein the rubber member is at least one selected from the group consisting of a container, a pipe, a nozzle, a tube, a tank, a joint, a valve, a pump, a spin chuck, an O-ring, a packing, a gasket, a washer, and a sealing material.

[0016] The present disclosure (12) is a rubber member in any combination with any of the present disclosures (1) to (11), in which the corrosive substance has a pH of 6 or less or 8 or more.

[0017] The present disclosure (13) is a rubber member in any combination with any of the present disclosures (1) to (12), in which the oxidation-reduction potential (vs. NHE) of the corrosive substance is −2.0 to 3.0 V.

[0018] The present disclosure (14) is a rubber member in any combination with any of the present disclosures (1) to (13), wherein the corrosive substance is at least one selected from the group consisting of an acidic substance, a basic substance, an oxidizing substance, an organic solvent, and salt water.

[0019] The present disclosure (15) is the rubber member according to the present disclosure (14), wherein the acidic substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid.

[0020] The present disclosure (16) is directed to a method for preparing a tetrahydrofuran (TMAH)-based tertiary ammonium hydroxide solution, wherein the basic substance is TMAH([(CH ３ ) ４ N] ＋ [OH] － ), a sodium hydroxide aqueous solution, ammonia water, and a mixed chemical solution of hydrogen peroxide water and ammonia water.

[0021] The present disclosure (17) is directed to a method for treating a corrosive substance, which is characterized in that the corrosive substance is hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), a sodium hydroxide aqueous solution, a mixed chemical solution of hydrogen peroxide and ammonia water, and at least one selected from the group consisting of isopropyl alcohol. Any combination of any of (1) to (16) of the present disclosure is used as a rubber member.

[0022] The present disclosure (18) is a rubber member in any combination with any of the present disclosures (1) to (17), wherein the rubber member is a member for semiconductor manufacturing related equipment.

[0023] The present disclosure (19) is the rubber member according to the present disclosure (18), wherein the semiconductor manufacturing related device is a device in which a chemical is used.

[0024] The present disclosure (20) is a rubber member obtained by any combination with any of the present disclosures (1) to (19), in which a test piece (size: 10 mm x 50 mm x 2 mm) of the rubber member is immersed in each of the following four chemical solutions for one week, and the relative value of the mass after immersion, where the mass before immersion is 100, is 50 to 150 in all cases. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH]－ ) (80°C) 49% by mass hydrofluoric acid (70°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69-71% by mass nitric acid in a volume ratio of 1:100) (20°C) SPM (a mixture of 98% by mass sulfuric acid and 30-36% by mass hydrogen peroxide in a volume ratio of 2:1) (80°C)

[0025] The present disclosure (21) is a rubber member in any combination with any of the present disclosures (1) to (20), in which a test piece (size: 10 mm x 50 mm x 2 mm) of the rubber member is immersed in each of the following nine chemical solutions for one week, and the relative values ​​of the mass after immersion are calculated, with the mass before immersion being set to 100. The average of the relative values ​​for the nine chemical solutions is 80 to 120, and the standard deviation is 20 or less. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) 100% by mass isopropyl alcohol (80°C) 49% by mass hydrofluoric acid (70°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) SPM (a mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) SC1 (a mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:5) (70°C) SC2 (a mixture of 35 to 37% by mass hydrochloric acid, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:4) (70°C) 85% by mass phosphoric acid (80°C)

[0026] The present disclosure (22) is a rubber member in any combination with any of the present disclosures (1) to (21), in which when a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution of 15 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Ag, Cd, Pb) is 30 ppb or less.

[0027] The present disclosure (23) is a rubber member in any combination with any of the present disclosures (1) to (22), in which the amount of Zn metal elution is 150 ppb or less when a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member is immersed in 3.6 mass % hydrochloric acid at 23°C for one week.

[0028] The present disclosure (24) is a rubber member in any combination with any of the present disclosures (1) to (23), in which when a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is 150 ppb or less.

[0029] The present disclosure (25) is a semiconductor manufacturing-related device equipped with a rubber member in any combination with any of the present disclosures (1) to (24).

[0030] The present disclosure (26) is a semiconductor manufacturing related device of the present disclosure (25), which is at least one selected from the group consisting of semiconductor manufacturing devices and devices related to semiconductor manufacturing devices.

[0031] The present disclosure (27) is the semiconductor manufacturing-related equipment of the present disclosure (26), wherein the semiconductor manufacturing equipment is at least one selected from the group consisting of a photolithography process equipment, a thin film formation / etching / cleaning / drying equipment, an inspection / evaluation equipment / manufacturing equipment, a resist processing equipment, an etching equipment, a cleaning / drying equipment, a CVD equipment, a thin film formation equipment, a CMP equipment, a processing equipment, an aging equipment, and an inspection equipment, and the semiconductor manufacturing equipment-related equipment is at least one selected from the group consisting of a pure water / chemical equipment, a gas equipment, a clean room equipment, and a manufacturing-related equipment.

[0032] The present disclosure (28) is directed to a photolithography process apparatus in which the photolithography process apparatus is at least one selected from the group consisting of a coating apparatus, a resist stripping apparatus, a developing apparatus (developer), and a descum apparatus, the thin film formation / etching / cleaning / drying apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a cleaning apparatus, a drying apparatus, and a scrub cleaning apparatus, the inspection / evaluation apparatus / manufacturing apparatus is a defect repair apparatus, the resist processing apparatus is at least one selected from the group consisting of a coating apparatus, a developing apparatus, a resist stripping apparatus, and an ashing apparatus, the etching apparatus is at least one selected from the group consisting of a dry etching apparatus and a wet etching apparatus, the cleaning / drying apparatus is at least one selected from the group consisting of a wet cleaning apparatus, a scrub cleaning apparatus, and a drying apparatus, the CVD apparatus is at least one selected from the group consisting of a high-pressure CVD apparatus, a SACVD apparatus, a low-pressure CVD apparatus, a plasma CVD apparatus, a metal CVD apparatus, and an ALD apparatus, the thin film forming apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus; the CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus; the processing apparatus is a bump plating apparatus; the aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus; the inspection apparatus is a life test apparatus; the pure water / chemical liquid apparatus is at least one selected from the group consisting of a chemical supply apparatus, a slurry supply apparatus, a chemical purification apparatus, and a waste liquid treatment apparatus; the gas apparatus is at least one selected from the group consisting of a gas generation apparatus, a gas purification apparatus, a gas mixing apparatus, a gas detection apparatus, and an exhaust gas treatment apparatus; the clean room apparatus is at least one selected from the group consisting of a thermal chamber and an environmental test apparatus; The manufacturing-related equipment is at least one selected from the group consisting of a jig cleaning / drying device, a flow control device, a packaging device, and a measuring device for liquids and gases.

[0033] According to the present disclosure, it is possible to provide a rubber member having excellent corrosion resistance and a semiconductor manufacturing-related device using the same.

[0034] The present disclosure will be specifically described below.

[0035] The present disclosure relates to a rubber member containing an olefin-based rubber, the rubber member being at least one selected from the group consisting of construction materials, mobility materials, aerospace materials, semiconductor materials, and information and communication materials, and being a rubber member that comes into contact with corrosive substances. The rubber member of the present disclosure has excellent corrosion resistance (particularly chemical resistance).

[0036] The rubber member of the present disclosure also has excellent compression set characteristics and can suppress metal elution.

[0037] The rubber member of the present disclosure includes an olefin-based rubber, which is a rubber containing structural units derived from an olefin as its main structural units.

[0038] Examples of the olefin-based rubber include ethylene-α-olefin-non-conjugated diene rubbers such as ethylene-propylene-diene rubber (EPDM); ethylene-α-olefin rubbers such as ethylene-propylene rubber (EPM); butyl rubber (IIR); isoprene rubber (IR); cyclopentene rubber (CR); butadiene rubber (BR); natural rubber (NR); styrene-butadiene rubber (SBR), and the like, and one or more of these may be used. As the olefin-based rubber, from the viewpoints of further improving corrosion resistance and compression set properties and further suppressing metal elution, at least one selected from the group consisting of ethylene-α-olefin-non-conjugated diene rubber, ethylene-α-olefin rubber, and butyl rubber is preferred, and at least one selected from the group consisting of ethylene-α-olefin-non-conjugated diene rubber and ethylene-α-olefin rubber is more preferred, with ethylene-α-olefin rubber being even more preferred. From the same viewpoint, at least one selected from the group consisting of ethylene-propylene-diene rubber, ethylene-propylene rubber, and butyl rubber is preferable, at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber is more preferable, and ethylene-propylene rubber is even more preferable.

[0039] Examples of the α-olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, and 1-decene, and one or more of these can be used. Of these, propylene, 1-butene, and 1-hexene are preferred.

[0040] Examples of the non-conjugated dienes include linear non-conjugated dienes such as 1,4-hexadiene, 1,6-octadiene, 2-methyl-1,5-hexadiene, 6-methyl-1,5-heptadiene, and 7-methyl-1,6-octadiene; dicyclopentadiene, vinylcyclohexene, cyclohexadiene, methyltetrahydroindene, 5-vinylnorbornene, 5-ethylidene-2-norbornene, and 5-methylene-2-norbornene. cyclic non-conjugated dienes such as 5-isopropylidene-2-norbornene and 6-chloromethyl-5-isopropenyl-2-norbornene; and trienes such as 2,3-diisopropylidene-5-norbornene, 2-ethylidene-3-isopropylidene-5-norbornene, 2-propenyl-2,2-norbornadiene, 1,3,7-octatriene and 1,4,9-decatriene, and the like, of which one or more can be used. Among these, cyclic non-conjugated dienes and 1,4-hexadiene are preferred.

[0041] In order to further improve corrosion resistance and compression set properties and further suppress metal elution, the olefinic rubber preferably contains a diene monomer content of 20% by mass or less, more preferably 10% by mass or less, even more preferably 7% by mass or less, even more preferably 5% by mass or less, and may also contain 0% by mass or more. It is also preferable that the diene monomer content is 0% by mass (no diene monomer is contained). The diene monomer content is measured in accordance with ASTM D 6047.

[0042] When the olefinic rubber is a rubber containing ethylene units, the ethylene content in the olefinic rubber is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 45% by mass or more, even more preferably 50% by mass or more, even more preferably 55% by mass or more, and particularly preferably 60% by mass or more, in order to further improve corrosion resistance and compression set properties and further suppress metal elution. The ethylene content may be 90% by mass or less, preferably 85% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, and particularly preferably 70% by mass or less. The ethylene content is measured in accordance with ASTM D 3900.

[0043] The olefin rubber has a Mooney viscosity (ML １＋４ (100°C)) is preferably 10 or more, more preferably 20 or more, even more preferably 30 or more, and is preferably 40, more preferably 200 or less, even more preferably 170 or less. １＋４ The Mooney viscosity (125°C) is preferably 10 or more, more preferably 20 or more, and even more preferably 30 or more, and is preferably 40, more preferably 200 or less, and even more preferably 170 or less. The Mooney viscosity is measured in accordance with ASTM D 1646.

[0044] The olefinic rubber is usually crosslinked. Although the crosslinking method is not limited, it is preferably crosslinked with a peroxide crosslinking agent and / or a sulfur-based crosslinking agent, more preferably with a peroxide crosslinking agent, in order to further improve corrosion resistance and compression set properties and further suppress metal elution.

[0045] As the peroxide crosslinking agent, known peroxides can be used, and organic peroxides are preferred. Examples of the organic peroxides include diacyl peroxides such as benzoyl peroxide, dibenzoyl peroxide, and p-chlorobenzoyl peroxide; peroxy esters such as 1-butyl peroxyacetate, t-butyl peroxybenzoate, and t-butyl peroxyphthalate; methyl ethyl ketone peroxide, 2,2-bis(t-butylperoxy)octane, 1,1-bis(t-butylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, and 4,4-di(t-butylperoxy)-n-butylvalerate. peroxyketals such as di-t-butyl peroxybenzoate, 1,3-bis(1-butylperoxyisopropyl)benzene, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide, di-t-amyl peroxide, 1,3-bis(t-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, and other dialkyl peroxides; hydroperoxides such as t-butyl hydroperoxide, and the like.

[0046] Among these, organic peroxides having a half-life of 1 minute at temperatures in the range of 130° C. to 200° C. are preferred, and dialkyl peroxides are preferably used.

[0047] As the sulfur-based crosslinking agent, known agents can be used, such as elemental sulfur and sulfur compounds.

[0048] The amount of the crosslinking agent used is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, and even more preferably 3.0% by mass or more, relative to the uncrosslinked olefin-based rubber, and is preferably 10% by mass or less, more preferably 8.0% by mass or less, and even more preferably 6.0% by mass or less.

[0049] The rubber member of the present disclosure preferably further contains an olefin resin. This can further improve corrosion resistance. When the olefin-based rubber is an ethylene-α-olefin rubber (preferably EPM), it is particularly preferable to use an olefin resin in combination.

[0050] The olefin resin is a resin obtained by polymerizing at least one kind of olefin, and may be a homopolymer or a copolymer.

[0051] Examples of the olefin resin include polyethylene resin, polypropylene resin, amorphous cyclic olefin resin, crystalline cyclic olefin resin, polymethylpentene resin, amorphous polystyrene resin, crystalline polystyrene resin, etc., and one or more of these can be used. Among these, polyethylene resin is preferred from the viewpoints of corrosion resistance and dispersibility.

[0052] Examples of the polyethylene resin include high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), very low-density polyethylene (VLDPE), ultra-high molecular weight polyethylene (UHPE), cross-linked polyethylene (PEX), etc. Among these, at least one selected from the group consisting of high-density polyethylene and ultra-high molecular weight polyethylene is preferred from the viewpoint of corrosion resistance.

[0053] The high-density polyethylene has a density of 0.940 g / m ３ It is preferable that the density is 0.945 g / cm or more. ３ More preferably, it is 0.970 g / m or more. ３ Preferably, the content is 0.965 g / m or less. ３ The density of polyethylene is measured in accordance with JIS K7112.

[0054] The ultra-high molecular weight polyethylene has a weight average molecular weight of 1.0 × 10 ６ It is preferable that the ratio is 1.2×10 or more. ６ More preferably, it is 7.0 × 10 or more. ７ Preferably, it is 1.0 x 10 or less. ７More preferably, it is 7.0 × 10 or less. ６ The molecular weight of polyethylene is measured by gel permeation chromatography (GPC) in terms of polystyrene, and the molecular weight of ultra-high molecular weight polyethylene is measured by conversion from the intrinsic viscosity by a viscometric method.

[0055] The content of the olefin resin relative to the olefin-based rubber is preferably 1% by mass or more, more preferably 15% by mass or more, even more preferably 30% by mass or more, and even more preferably 45% by mass or more, and is preferably 60% by mass or less, and more preferably 55% by mass or less.

[0056] The rubber member of the present disclosure is one that comes into contact with a corrosive substance. A part of the rubber member may come into contact with the corrosive substance, or the entire rubber member may come into contact with the corrosive substance.

[0057] The corrosive substance may be any substance that is corrosive to rubber, resin, metal, etc. The corrosive substance may be liquid, solid, or gaseous. In order to more significantly exhibit the effects of the present disclosure, the corrosive substance is preferably liquid.

[0058] The redox potential (vs. NHE) of the corrosive substance is preferably −2.0 V or higher, more preferably −1.0 V or higher, and even more preferably −0.5 V or higher, and is preferably 3.0 V or lower, more preferably 2.5 V or lower, and even more preferably 2.1 V or lower.

[0059] Examples of the corrosive substance include acidic substances, basic substances, oxidizing substances, organic solvents, and salt water.

[0060] The acidic substance may be a chemical solution having a pH of 6 or less, preferably 5 or less, and more preferably 4 or less. Specific examples include acids such as sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, and hydrochloric acid; mixtures of these acids; and mixtures of these acids with other substances (such as hydrogen peroxide). Among these, at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid is preferred, and at least one selected from the group consisting of hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid is more preferred.

[0061] The basic substance may be a chemical solution having a pH of 8 or more, preferably 9 or more, and more preferably 10 or more. Specifically, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), aqueous sodium hydroxide solution, ammonia, and the like; mixtures of these bases; mixtures of these bases with other substances (hydrogen peroxide, etc.). Among these, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), at least one selected from the group consisting of aqueous sodium hydroxide solution, aqueous ammonia, and a mixed solution of aqueous hydrogen peroxide and aqueous ammonia is preferred.

[0062] The basic substance may also be a chemical solution having an oxidation-reduction potential (vs. NHE) of −2.0 to 0 V, preferably −1.0 to 0 V, more preferably −0.5 to 0 V. Specifically, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), aqueous sodium hydroxide solution, aqueous ammonia, hydroxylamine, hydrazine, hydrogen water, sodium sulfite, and other basic substances; and mixtures of these basic substances with other substances. ３ ) ４ N] ＋ [OH] －), ammonia water, and a mixed chemical solution of hydrogen peroxide water and ammonia water are preferred.

[0063] The oxidizing substance may be a chemical solution having an oxidation-reduction potential (vs. NHE) of 0 to 3.0 V, preferably 0.5 to 2.5 V, and more preferably 1.0 to 2.1 V. Specific examples include sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide solution, and mixtures of these oxidizing substances with other substances (such as hydrofluoric acid). Among these, at least one selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide solution, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid is preferred, and at least one selected from the group consisting of nitric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid is more preferred.

[0064] Examples of the organic solvent include esters such as methyl acetate, ethyl acetate, propyl acetate, n-butyl acetate, and tert-butyl acetate; ketones such as acetone, methyl ethyl ketone, and cyclohexanone; aliphatic hydrocarbons such as hexane, cyclohexane, octane, nonane, decane, undecane, dodecane, and mineral spirits; aromatic hydrocarbons such as benzene, toluene, xylene, naphthalene, and solvent naphtha; alcohols such as methanol, ethanol, isopropyl alcohol, tert-butanol, and ethylene glycol monoalkyl ether; cyclic ethers such as tetrahydrofuran, tetrahydropyran, and dioxane; nitriles such as acetonitrile and propionitrile; amides such as dimethyl sulfoxide, N,N-dimethylformamide, and N,N-dimethylacetamide; halogenated hydrocarbons such as dichloromethane, dichloroethane, and chloroform; and mixtures thereof. Among these, alcohols are preferred, and isopropyl alcohol is more preferred.

[0065] The corrosive substance is preferably at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, organic solvents, and brine, more preferably at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, and organic solvents, and even more preferably at least one selected from the group consisting of acidic substances and basic substances.

[0066] The corrosive substance is preferably at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH, a sodium hydroxide aqueous solution, ammonia water, a mixed chemical solution of hydrogen peroxide and ammonia water, isopropyl alcohol, and salt water; more preferably at least one selected from the group consisting of hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH, a sodium hydroxide aqueous solution, a mixed chemical solution of hydrogen peroxide and ammonia water, and isopropyl alcohol; and even more preferably at least one selected from the group consisting of hydrofluoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, and TMAH.

[0067] The rubber member of the present disclosure may have only a portion (layer) containing the olefin-based rubber, or may have a portion (layer) containing the olefin-based rubber and other portions (layers). However, in order to ensure corrosion resistance, it is preferable that at least a portion of the surface that comes into contact with the corrosive substance is composed of a portion (layer) containing the olefin-based rubber, and it is more preferable that the entire surface that comes into contact with the corrosive substance is composed of a portion (layer) containing the olefin-based rubber.

[0068] The rubber member of the present disclosure is used as at least one member selected from the group consisting of building materials, mobility members, aerospace members, medical members, semiconductor members, and information and communications members. As the member, a semiconductor member is preferred because of its excellent corrosion resistance and low metal elution amount, and a semiconductor manufacturing-related equipment member (an article for semiconductor manufacturing-related equipment) is more preferred.

[0069] Examples of the building materials (construction materials) include interior architectural materials such as baseboards, ceiling materials, and plumbing materials, and exterior architectural materials such as waterproof sheets, waterproofing materials, exterior wall materials, and roofing materials. Examples of the mobility components include parts used in ferries, trains, automobiles, motorcycles, drones, robots, and the like. Examples of the aerospace components include exterior and interior materials for aircraft, rockets, and the like, wire coating materials, cable protection materials, jet engines, cabin interior materials, and parts thereof. Examples of the medical components include piping materials, chemical containers, sterilization containers, medical tools, laboratory and analytical instruments, and packaging. Examples of the semiconductor components include process materials used in semiconductor manufacturing and parts for semiconductor manufacturing-related equipment. Examples of the information and communication components include parts for devices such as wireless LAN transmission and reception circuits, circuit boards, and parts for optical communication devices.

[0070] Examples of components according to the present disclosure include containers, piping, nozzles, tubes, tanks, joints, valves, pumps, housings, spin chucks, O-rings, packings, gaskets, washers, sealing materials, nuts, bolts, films, bottles, wire coatings, hoses, pipes, sheets, rollers, cocks, connectors, filter housings, filter cages, flow meters, wafer carriers, and wafer boxes.

[0071] Because the rubber member of the present disclosure requires corrosion resistance, it can be suitably applied to at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, washers, and sealing materials. In particular, it can be suitably applied to at least one selected from the group consisting of O-rings, packings, gaskets, and sealing materials, and is particularly suitably applied to O-rings. It can also be suitably used in the above-mentioned piping, nozzles, tubes, O-rings, packings, gaskets, and sealing materials (preferably O-rings, packings, gaskets, and sealing materials, more preferably O-rings) in semiconductor manufacturing-related equipment.

[0072] The piping is not particularly limited, but its shape preferably has an inner diameter of 2 mm to 400 mm, more preferably 2 mm to 100 mm, and particularly preferably 2 mm to 25 mm. Examples include a robust pipe type, a flexible hose that can be incorporated to fit the installation space, and a bellows pipe with a large diameter that can be bent. The inside of the piping is made of a clean material (low contamination of the chemical solution by extracted ions) and chemical-resistant, and may be polished with high precision to prevent dust generation and to prevent disturbance of the liquid or gas flow. Depending on the chemical solution being passed through, such as an organic solvent, antistatic properties may be required to prevent static electricity buildup. Conductive fillers (carbon black, carbon nanotubes, etc.) may be added to the piping to the extent that cleanliness is not impaired.

[0073] The nozzle is not particularly limited, but the tip may be precisely machined to match the size and shape of the part, and in addition, since it comes into contact with the part, it can be made of a highly hard and durable material that is resistant to friction and bending.

[0074] The tube is not particularly limited, but the tube diameter is preferably 2 mm to 400 mm, more preferably 2 mm to 100 mm, and particularly preferably 2 to 25 mm. Materials having stress crack resistance, chemical resistance, excellent mechanical strength, and cleanliness (less contamination of the chemical solution by extracted ions) are used. Depending on the chemical solution being passed through, such as an organic solvent, antistatic properties may be required to prevent static electricity buildup. Conductive fillers (carbon black, carbon nanotubes, etc.) may be added to the tube to the extent that cleanliness is not impaired, thereby providing antistatic properties.

[0075] The containers and tanks are not particularly limited, but may be precision cleaned (water washing, acetic acid immersion, hydrochloric acid immersion, nitric acid immersion, wiping cleaning, pure water cleaning, etc.) to remove dirt and residues. Packaging after cleaning may be carried out in a clean room or clean booth environment.

[0076] The joints and valves are not particularly limited, but are required to be oil-free, particle-free, dead space-free, and external leak-free, and the size is preferably in the range of Φ3.2 mm to 40 mm, and more preferably in the range of Φ3.2 to 12.7 mm.

[0077] The pump is not particularly limited, but may be required to have retractability.

[0078] The spin chuck is not particularly limited, but may be required to have hardness, corrosion resistance, and dimensional stability, and may be provided with electrical conductivity.

[0079] O-rings and sealing materials are not particularly limited, but the material properties required are excellent elasticity, good compression set, excellent wear resistance, excellent heat resistance, resistance to corrosion by applied liquids and gases, and a long life. In particular, O-rings used in semiconductor manufacturing-related equipment are used in harsh chemical environments, such as being exposed to various plasmas, and therefore are required to have high heat resistance, chemical resistance, and plasma resistance. The compression set at 100°C for 72 hours is preferably 25% or less, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less.

[0080] The packing and gasket are not particularly limited, but may be required to have a good compression set, a low coefficient of friction, and excellent abrasion resistance, and may also be required to have heat resistance, cold resistance, pressure resistance, and chemical resistance to prevent leakage. The compression set at 100°C for 72 hours is preferably 25% or less, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less.

[0081] The washer is not particularly limited, but is expected to be used in a clean room or the like and may be required to have durability, corrosion resistance, and rust prevention properties.

[0082] The members of the present disclosure can be used, for example, in the following applications: <Building materials> Exterior materials for furniture, and architectural interior materials such as walls, ceilings, and floors; Exterior materials for buildings such as exterior walls such as siding, fences, roofs, gates, and gable boards; Surface decorative materials such as window frames, doors, handrails, thresholds, and lintels; Membrane materials (roofing materials, ceiling materials, exterior wall materials, interior wall materials, covering materials, etc.) for membrane structure buildings (sports facilities, horticultural facilities, atriums, etc.); Plate materials for outdoor use (soundproof walls, windbreak fences, wave fences, garage canopies, shopping malls, walkway walls, roofing materials); Building materials such as tent materials for tent warehouses, sunshade membrane materials, partial roofing materials for letting in light, window materials in place of glass, membrane materials for fire-retardant partitions, curtains, exterior wall reinforcement, waterproof membranes, smoke-proof membranes, non-flammable transparent partitions, and road reinforcement; Agricultural films, weather-resistant covers for various roofing materials and side walls, etc.; Covering materials for glass such as non-flammable fire-resistant safety glass; etc. Among these, because corrosion resistance is required, the rubber is particularly suitable for use in membrane materials for membrane structure buildings, outdoor use boards, tent materials for tent warehouses, sunshade membrane materials, partial roof materials for lighting, window materials replacing glass, flame retardant partition membrane materials, curtains, building materials such as exterior wall reinforcement, waterproof membranes, smokeproof membranes, non-flammable transparent partitions, road reinforcement, agricultural films, and weather-resistant covers for various roofing materials and side walls, etc. When the member of the present disclosure is used for the above applications, from the viewpoints of corrosion resistance and weather resistance, the olefin-based rubber is preferably at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber.

[0083] <Mobility> O-rings, tubes, packings, valve core materials, hoses, seals, and diaphragms used in automotive fuel systems and peripheral devices (for example, injector O-rings, injector packings, fuel pump O-rings, diaphragms, fuel hoses, filler hoses, and evaporation hoses) (these may be for sour gasoline resistance, alcohol resistance, or resistance to fuels containing gasoline additives such as methyl tertiary butyl ether or amine resistance). Hoses and seals used in automotive automatic transmissions (for example, ATF hoses). Gaskets, shaft seals, valve stem seals, seals, and hoses used in automotive engines and peripheral devices (for example, carburetor flange gaskets, engine head gaskets, metal gaskets, crankshaft seals, camshaft seals, valve stem seals, manifold packing, and oil hoses). Oxygen sensors for automotive engines. Other automotive components such as automotive brake hoses, air conditioning hoses, radiator hoses, radiator tanks, chemical tanks, bellows, spacers, rollers, gasoline tanks, bumpers, door trim, instrument panels, and electrical wire coating materials; O-rings, tubes, packings, valve core materials, hoses, sealants, and diaphragms used in marine fuel systems and peripheral devices; Anticorrosion tapes for piping, such as tapes wrapped around piping on marine decks, etc. Among these, because corrosion resistance is required, the composition is particularly suitable for O-rings, tubes, packings, hoses, and sealants used in marine fuel systems and peripheral devices; hoses and sealants used in automotive automatic transmission systems; automotive brake hoses, air conditioning hoses, radiator hoses, bellows, spacers, rollers, bumpers, door trim, and electrical wire coating materials; and O-rings, tubes, packings, valve core materials, hoses, sealants, and diaphragms used in marine fuel systems and peripheral devices. When the member of the present disclosure is used for the above-mentioned applications, from the viewpoint of corrosion resistance and oil resistance, the olefin-based rubber is preferably at least one selected from the group consisting of ethylene-propylene-diene rubber, ethylene-propylene rubber, and butyl rubber.

[0084] <Aerospace> O-rings, tubes, packing, valve core materials, hoses, seals, diaphragms, etc. used in fuel systems and peripheral devices of aircraft and rockets. Among these, the O-rings, tubes, packing, hoses, and seals used in fuel systems and peripheral devices of aircraft and rockets are particularly suitable because corrosion resistance is required. When the member of the present disclosure is used for the above applications, from the viewpoints of corrosion resistance and weather resistance, the olefin-based rubber is preferably at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber.

[0085] <Medical> Piping materials such as medical infusion tubes, blood collection tubes, drain tubes, catheters, catheter connection parts, stents, piping, joints, tube connectors, valves, and filters; liquid, powder, and solid drug containers such as packaging, bottles, bottle caps, vials, ampoules, prefilled syringes, infusion bags, infusion bag connection parts, sealed medicine bags, press-through packages, and eye drop containers; sample containers such as urine collection bags, blood test tubes for sampling, blood collection tubes, test cells, and specimen containers; sterilized containers for medical equipment such as scalpels, forceps, gauze, and contact lenses; housings for electronic devices such as medical sensors, cardiac devices, and pacemakers; medical equipment such as inhalation masks, syringes, syringe rods, injection needles, surgical trays, protective stoppers, rubber stoppers, and endoscopes; laboratory and analytical equipment such as beakers, petri dishes, flasks, test tubes, and centrifuge tubes; medical optical components such as plastic lenses for medical testing; Artificial organs and parts thereof, such as denture bases, dentures, artificial hearts, artificial tooth roots, artificial bones, and artificial joints; etc. Among these, from the viewpoint of chemical resistance and heat resistance, the olefin-based rubber is particularly suitable for medical infusion tubes, blood collection tubes, drainage tubes, catheters, piping, joints, tube connectors, valves, bottles, bottle caps, vials, ampoules, prefilled syringes, infusion bags, urine collection bags, sampling test tubes for blood tests, blood collection tubes, test cells, specimen containers, sterilization containers, syringes, syringe rods, surgical trays, and protective stoppers. When the member of the present disclosure is used for the above applications, from the viewpoint of chemical resistance and heat resistance, the olefin-based rubber is preferably at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber.

[0086] <Information and Communications> Insulating plates for high-frequency circuits, insulating materials for connecting parts, printed wiring boards; bases and antenna covers for high-frequency vacuum tubes; wire coating materials for coaxial cables, LAN cables, etc.; optical fiber coating materials; displays such as liquid crystal displays; mobile phone components; etc. Among these, because corrosion resistance is required, the rubber is particularly suitable for insulating plates for high-frequency circuits, insulating materials for connecting parts, printed wiring boards; bases and antenna covers for high-frequency vacuum tubes; wire coating materials for coaxial cables, LAN cables, etc.; and optical fiber coating materials. When the member of the present disclosure is used for the above applications, from the viewpoint of corrosion resistance, the olefin-based rubber is preferably at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber.

[0087] <Semiconductors> Chemical solution transfer components such as chemical solution tanks, containers, housings, piping, O-rings, tubes, packing, valve core materials, hoses, seals, rolls, gaskets, washers, diaphragms, nozzles, joints, coatings, and linings on the inner surfaces of pipes used in semiconductor factories and semiconductor manufacturing-related equipment; chemical stoppers and packaging films; waste liquid transport components such as tanks, containers, tubes, hoses, joints, and nozzles used for waste liquid transport; high-temperature liquid transport components such as containers, tubes, and hoses for high-temperature liquid transport; steam piping components such as tubes and hoses for steam piping; etc. Among these, due to the requirement for corrosion resistance, the olefin-based rubber is particularly suitable for use in O-rings, tubes, packing, hoses, seals, rolls, gaskets, diaphragms, and joints used in semiconductor manufacturing-related equipment. When the members of the present disclosure are used for the above applications, the olefin-based rubber is preferably at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber.

[0088] The semiconductor manufacturing equipment of the above-mentioned semiconductor manufacturing related equipment includes photolithography process equipment (coating equipment, resist stripping equipment, developing equipment (developer), baking equipment, descum equipment), thin film formation, etching, cleaning and drying equipment (vacuum deposition equipment, sputtering equipment, CVD equipment, cleaning equipment, etching equipment, drying equipment, scrub cleaning equipment), inspection and evaluation equipment and other manufacturing equipment (defect repair equipment), wafer processing equipment (wafer marking equipment), resist processing equipment (coating equipment, developing equipment, resist stripping equipment, ashing equipment, baking equipment), etching Equipment (dry etching equipment, wet etching equipment), cleaning and drying equipment (dry cleaning equipment, wet cleaning equipment, scrub cleaning equipment, drying equipment), heat treatment equipment (oxidation equipment, diffusion equipment, annealing equipment), ion implantation equipment (high current ion implantation equipment, medium current ion implantation equipment, high energy ion implantation equipment), thin film formation equipment, CVD equipment (high pressure CVD equipment, SACVD, low pressure CVD, plasma CVD equipment, metal CVD equipment, ALD equipment), sputtering equipment, other thin film formation equipment (vacuum deposition equipment, silicon epitaxial growth equipment, compound semiconductor conductor epitaxial equipment (MOCVD equipment, MBE equipment), plating equipment), inspection and evaluation equipment (Auger electron spectroscopy equipment), CMP equipment (CMP equipment, CMP cleaning equipment), other processing equipment (wafer marking equipment, back grinding machines, bump plating equipment, back grinder tape applicators, back grinders, back grinder tape peelers), dicing equipment (dicing equipment, wafer mounting equipment), bonding equipment (die bonding equipment, hybrid bonding equipment, wire bonding equipment, inner lead bonding equipment, outer lead bonding equipment, flip chip bonding equipment), packaging equipment (molding equipment, deburring equipment, solder processing equipment), other testing equipment (electron beam testing equipment, laser beam testing equipment), probing equipment (proppers), handlers, aging equipment (aging equipment, burn-in equipment, IC insertion equipment, IC extraction equipment), other inspection equipment (cold-heat testing equipment, temperature and humidity testing equipment, pressure cooker equipment, laser processing systems, various life test equipment), etc.Equipment related to semiconductor manufacturing equipment includes various transport devices (intra-process wafer transport devices, inter-process wafer transport devices, stockers), pure water and chemical liquid equipment (pure water production equipment, ultrafiltration equipment, reverse osmosis equipment, sterilization equipment, chemical supply equipment, slurry supply equipment, chemical purification equipment, waste liquid treatment equipment), various gas equipment (gas generators, gas purification equipment, gas mixing equipment, gas detection equipment, exhaust gas treatment equipment), clean room equipment (clean benches, clean tunnels, thermal chambers, environmental testing equipment, air showers, pass boxes), and other manufacturing-related equipment (various jig cleaning and drying equipment, flow control equipment, various taping equipment, various packaging equipment, measuring equipment for liquids and various gases).

[0089] Among these, semiconductor manufacturing equipment in which corrosive substances are used within the equipment is not particularly limited, but from the viewpoint of making use of the physical properties of chemical resistance, photolithography process equipment (coating equipment, resist stripping equipment, developing equipment (developer), descum equipment), thin film formation / etching / cleaning / drying equipment (vacuum deposition equipment, CVD equipment, cleaning equipment, etching equipment, drying equipment, scrub cleaning equipment), inspection evaluation equipment and other manufacturing equipment (defect repair equipment), resist processing equipment (coating equipment, developing equipment, resist stripping equipment, ashing equipment), etching equipment (dry etching equipment, wet etching equipment), cleaning Preferred are cleaning / drying equipment (wet cleaning equipment, scrub cleaning equipment, drying equipment), CVD equipment (high-pressure CVD equipment, SACVD, low-pressure CVD, plasma CVD equipment, metal CVD equipment, ALD equipment), other thin film formation equipment (vacuum deposition equipment, silicon epitaxial growth equipment, compound semiconductor epitaxial equipment (MOCVD equipment, MBE equipment), plating equipment), CMP equipment (CMP equipment, CMP cleaning equipment), other processing equipment (bump plating equipment), aging equipment (aging equipment, burn-in equipment, IC insertion equipment, IC extraction equipment), and other inspection equipment (various life test equipment). Preferred examples of equipment related to semiconductor manufacturing equipment include pure water / chemical liquid equipment (chemical supply equipment, slurry supply equipment, chemical purification equipment, waste liquid treatment equipment), various gas equipment (gas generators, gas purification equipment, gas mixing equipment, gas detection equipment, exhaust gas treatment equipment), clean room equipment (thermal chambers, environmental testing equipment), and other manufacturing-related equipment (various jig cleaning / drying equipment, flow control equipment, various packaging equipment, measuring equipment for liquids and various gases).

[0090] As described above, the rubber member of the present disclosure can be suitably used as a semiconductor manufacturing-related equipment component (semiconductor manufacturing-related equipment article), but because of its excellent chemical resistance, it is more suitable as a component constituting semiconductor manufacturing-related equipment in which chemicals are used within the equipment, in particular as a component that comes into contact with chemicals.

[0091] The chemicals are not particularly limited, but include chemicals used in semiconductor manufacturing related equipment, etc. The chemicals can be used alone or in combination of two or more.

[0092] Specific examples of the chemical include TMAH ([(CH３ ) ４ N] ＋ [OH] － ), sulfuric acid, sodium hydroxide solution, isopropyl alcohol, hydrofluoric acid, mixed acid of hydrofluoric acid and nitric acid, SPM (Sulfuric Acid Hydrogen Peroxide Mixture), SC1 (NH ４ OH, H ２ O ２ and H ２ O mixture), SC2 (HCl, H ２ O ２ and H ２ Among these, TMAH, isopropyl alcohol, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, SPM, SC1, SC2, phosphoric acid, and hydrochloric acid are preferred, and TMAH, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, and SPM are more preferred.

[0093] Other examples of the chemical include at least one selected from the group consisting of silicon-based gases, arsenic-based gases, phosphorus-based gases, boron-based gases, metal hydride gases, metal alkyl gases, halogenated hydrocarbon gases, halogen-halide gases, nitrogen oxide gases, hydrogen sulfide gases, ammonia gas, trimethylamine gas, propane gas, trimethylaluminum gas, hydrogen gas, helium gas, nitrogen gas, oxygen gas, argon gas, and carbon dioxide gas. Also preferred as the chemical is at least one selected from the group consisting of silicon-based gases, arsenic-based gases, phosphorus-based gases, boron-based gases, metal hydride gases, metal alkyl gases, halogenated hydrocarbon gases, halogen-halide gases, nitrogen oxide gases, hydrogen sulfide gas, ammonia gas, trimethylamine gas, propane gas, trimethylaluminum gas, hydrogen gas, helium gas, nitrogen gas, oxygen gas, argon gas, and carbon dioxide gas.

[0094] Examples of the silicon-based gas include monosilane, dichlorosilane, trichlorosilane, silicon tetrachloride, silicon tetrafluoride, and disilane. Examples of the arsenic-based gas include arsine, arsenic(III) fluoride, arsenic(V) fluoride, arsenic(III) chloride, and arsenic(V) chloride. Examples of the phosphorus-based gas include phosphine, phosphorus(III) fluoride, phosphorus(V) fluoride, phosphorus(III) chloride, phosphorus(V) chloride, and phosphorus oxychloride. Examples of the boron-based gas include diborane, boron trifluoride, boron trichloride, and boron tribromide. Examples of the metal hydride gas include hydrogen selenide, monogermane, hydrogen telluride, stibine, and tin hydride. Examples of the metal alkyl gas include trialkylgallium and trialkylindium. Examples of the halogenated hydrocarbon gas include tetrafluoromethane, trifluoromethane, difluoromethane, hexafluoropropane, octafluoropropane, and octafluorocyclobutane. Examples of the halogen / halide gas include fluorine, hydrogen fluoride, chlorine, hydrogen chloride, carbon tetrachloride, hydrogen bromide, sulfur hexafluoride, nitrogen trifluoride, sulfur tetrafluoride, tungsten(VI) fluoride, molybdenum(VI) fluoride, germanium tetrachloride, tin(IV) chloride, antimony(V) chloride, tungsten(VI) chloride, and molybdenum hexachloride. Examples of the nitrogen oxide gas include nitric oxide, nitrogen dioxide, and dinitrogen monoxide. Among these, ammonia gas, nitrogen trifluoride, dinitrogen monoxide, monosilane, and octafluorocyclobutane are preferred, and ammonia gas, nitrogen trifluoride, and dinitrogen monoxide are more preferred.

[0095] The semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) may have only a portion (layer) containing the olefin-based rubber, or may have a portion (layer) containing the olefin-based rubber and other portions (layers). However, in order to ensure chemical resistance, it is preferable that at least a portion of the surface that comes into contact with the chemicals is composed of a portion (layer) containing the olefin-based rubber, and it is more preferable that the entire surface that comes into contact with the chemicals is composed of a portion (layer) containing the olefin-based rubber.

[0096] The rubber member of the present disclosure is preferably prepared by immersing a test piece (size: 10 mm x 50 mm x 2 mm) of the rubber member in each of the four chemical solutions (1), (3), (5), and (6) described below for one week, and determining that the mass before immersion is 100, the relative mass after immersion is preferably 50 to 150 in all cases. A member that satisfies this requirement has excellent corrosion resistance. The relative value is more preferably 85 or more, even more preferably 90 or more, even more preferably 95 or more, and particularly preferably 98 or more, and more preferably 120 or less, even more preferably 115 or less, even more preferably 110 or less, and particularly preferably 108 or less. Ideally (most preferably), it is 100.

[0097] It is more preferable that the rubber member of the present disclosure is obtained by immersing a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member in each of the nine chemical solutions (1) to (9) described below for one week, and that the relative values ​​of the mass after immersion, where the mass before immersion is taken as 100, are all within the above-mentioned range.

[0098] In the rubber member of the present disclosure, test pieces (size: 10 mm x 50 mm x 2 mm) of the rubber member are immersed in each of nine chemical solutions (1) to (9) described below for one week, and the relative values ​​of the mass after immersion are calculated, with the mass before immersion being set to 100. Preferably, the average of the relative values ​​for the nine chemical solutions is 80 to 120, and the standard deviation is 20 or less. This can further improve corrosion resistance. The average of the relative values ​​is more preferably 85 or more, even more preferably 90 or more, even more preferably 95 or more, and particularly preferably 97 or more, and more preferably 115 or less, even more preferably 110 or less, even more preferably 105 or less, and particularly preferably 103 or less. Ideally (most preferably), it is 100. The standard deviation of the relative values ​​is more preferably 15 or less, even more preferably 10 or less, even more preferably 8 or less, particularly preferably 5 or less, and particularly preferably 4.5 or less. It may be 0 or more, 1 or more, or 3 or more. Ideally (most preferably) it is 0.

[0099] The chemical solutions used for immersing the test pieces are as follows: (1) 25% by mass TMAH ([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) (2) 100% by mass isopropyl alcohol (80°C) (3) 49% by mass hydrofluoric acid (70°C) (4) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) (5) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) (6) SPM (a mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) (7) SC1 (a mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:5) (70°C) (8) SC2 (a mixture of 35 to 37% by mass hydrochloric acid, 30 to 36% by mass hydrogen peroxide, and deionized water in a volume ratio of 1:1:4) (70°C) (9) 85% by mass phosphoric acid (80°C)

[0100] In the rubber member of the present disclosure, when a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution (by mass) of each of 15 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Ag, Cd, Pb) is preferably 30 ppb or less, more preferably 25 ppb or less, and even more preferably 20 ppb or less.

[0101] In the rubber member of the present disclosure, when a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of Zn metal elution (by mass) is preferably 150 ppb or less, more preferably 100 ppb or less, even more preferably 90 ppb or less, and particularly preferably 75 ppb or less.

[0102] In the rubber member of the present disclosure, when a test piece (size: 10 mm × 50 mm × 2 mm) of the rubber member is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution (by mass) of each of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is preferably 150 ppb or less, more preferably 100 ppb or less, and even more preferably 90 ppb or less.

[0103] The amount of elution of any of the above elements is ideally (most preferably) 0 ppb, but may be an amount below the detection limit or more.

[0104] The rubber member of the present disclosure preferably has a compression set of 25% or less, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less, at 100°C for 72 hours. The lower the compression set, the better, but it may be 1% or more. The compression set is measured in accordance with the test standard of JIS B2401 "O-rings - Part 1: O-rings" EPDM-70.

[0105] The rubber member of the present disclosure can be produced, for example, by crosslinking a rubber composition obtained by kneading an uncrosslinked olefin-based rubber, a crosslinking agent, and, if necessary, the above-mentioned olefin resin and other components.

[0106] Examples of the other components include known additives used in rubber compositions, such as vulcanization accelerators (e.g., zinc oxide), vulcanization accelerator aids (e.g., stearic acid), fillers, antioxidants, crosslinking aids, processing aids, acid acceptors, ultraviolet absorbers, flame retardants, colorants, foaming agents, coupling agents, dispersants, and mold release agents.

[0107] Lubricants, tackifiers, etc. can be used as processing aids. Examples of lubricants include paraffin and hydrocarbon resins such as paraffin wax, microcrystalline wax, and polyethylene wax; fatty acids such as stearic acid; fatty acid amides such as stearic acid amide; fatty acid esters such as butyl stearate and ester wax; higher aliphatic alcohols such as stearyl alcohol; partial esters of fatty acids and polyhydric alcohols such as glycerin fatty acid esters; and fatty acid metal salts such as zinc stearate. Examples of tackifiers include coumarone resins such as coumarone-indene resins; phenol- and terpene-based resins such as phenol-formaldehyde resins, terpene-phenol resins, and alkylphenol-formaldehyde resins; petroleum-based hydrocarbon resins such as synthetic polyterpene resins, aromatic hydrocarbon resins, aliphatic hydrocarbon resins, and polybutene; and rosin derivatives such as rosin esters and various esters of hydrogenated rosin.

[0108] As the filler, those generally used in rubber compositions, such as carbon black, silicic acid, silica, silicates, alumina, alumina hydrate, calcium carbonate, magnesium carbonate, barium sulfate, magnesium sulfate, clay, talc, kaolin, short fibers (synthetic fibers, glass fibers, carbon fibers, etc.), conductive oxides (zinc oxide, etc.), ferrites, metal powders, mica, graphite, molybdenum disulfide, barium titanate, and boron nitride, can be used.

[0109] Examples of colorants include inorganic pigments such as white pigments (titanium oxide, zinc oxide, gypsum, etc.), black pigments (carbon black, etc.), red pigments, and blue pigments; organic pigments such as azo pigments and phthalocyanine pigments; and dyes.

[0110] Examples of the foaming agent include inorganic foaming agents such as sodium bicarbonate and ammonium bicarbonate, and organic foaming agents such as p,p'-oxybis(benzenesulfonylhydrazide), azodicarbonamide, and dinitrosopentamethylenetetramine.

[0111] Examples of the coupling agent include coupling agents for white fillers such as vinyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, and bis(3-(triethoxysilyl)propyl)tetrasulfide; and coupling agents for carbon black such as N,N'-bis(2-methyl-2-nitropropyl)-1,6-diaminohexane.

[0112] The content of the other components is preferably 0.1% by mass or more, more preferably 1.0% by mass or more, and is preferably 150% by mass or less, more preferably 100% by mass or less, based on the olefin-based rubber.

[0113] The use of an antioxidant as the other component is one preferred embodiment. Examples of the antioxidant include amine-based antioxidants, phenol-based antioxidants, and the like as primary antioxidants, and one or more of these can be used. Examples of the secondary antioxidant include sulfur-based antioxidants, phosphorus-based antioxidants, and the like. The combined use of a primary antioxidant and a secondary antioxidant is preferred, and a combination of an amine-based antioxidant and a sulfur-based antioxidant is particularly preferred.

[0114] The content of the antioxidant is preferably 0% by mass or more, more preferably 0.1% by mass or more, and particularly preferably 0.5% by mass or more, relative to the olefin rubber, and is preferably 30% by mass or less, particularly preferably 10% by mass or less. If the content exceeds 30% by mass, blooming occurs, which is not preferred.

[0115] The kneading method is not particularly limited, and can employ known methods using an internal mixer, a roll kneader, etc. When the above-mentioned olefin resin is blended, a method including a kneading step at a temperature equal to or higher than the melting point of the olefin resin is preferred from the viewpoint of more uniform mixing.

[0116] The crosslinking method is not particularly limited, and known methods such as heat pressing can be used. The crosslinking temperature is preferably 100° C. or higher, more preferably 130° C. or higher, and preferably 250° C. or lower, more preferably 200° C. or lower. The crosslinking time is preferably 5 minutes or longer, more preferably 15 minutes or longer, and preferably 120 minutes or shorter, more preferably 60 minutes or shorter.

[0117] The present disclosure also relates to semiconductor manufacturing-related equipment equipped with the rubber member of the present disclosure. The use of the member of the present disclosure can impart excellent corrosion resistance to the equipment.

[0118] The semiconductor manufacturing-related device of the present disclosure is preferably one of the semiconductor manufacturing devices and related devices described above. Also, the semiconductor manufacturing-related device of the present disclosure is preferably at least one selected from the group consisting of semiconductor manufacturing devices and related devices for semiconductor manufacturing devices.

[0119] The semiconductor manufacturing equipment is preferably at least one selected from the group consisting of photolithography process equipment, thin film formation / etching / cleaning / drying equipment, inspection / evaluation equipment / manufacturing equipment, resist processing equipment, etching equipment, cleaning / drying equipment, CVD equipment, thin film formation equipment, CMP equipment, processing equipment, aging equipment, and inspection equipment, and the semiconductor manufacturing equipment-related equipment is preferably at least one selected from the group consisting of pure water / chemical equipment, gas equipment, clean room equipment, and manufacturing-related equipment.

[0120] the photolithography process equipment is at least one selected from the group consisting of a coating equipment, a resist stripping equipment, a developing equipment (developer), and a descum equipment; the thin film formation / etching / cleaning / drying equipment is at least one selected from the group consisting of a vacuum deposition equipment, a cleaning equipment, a drying equipment, and a scrub cleaning equipment; the inspection / evaluation equipment / manufacturing equipment is a defect repair equipment; the resist processing equipment is at least one selected from the group consisting of a coating equipment, a developing equipment, a resist stripping equipment, and an ashing equipment; the etching equipment is at least one selected from the group consisting of a dry etching equipment and a wet etching equipment; the cleaning / drying equipment is at least one selected from the group consisting of a wet cleaning equipment, a scrub cleaning equipment, and a drying equipment; the CVD equipment is at least one selected from the group consisting of a high-pressure CVD equipment, a SACVD equipment, a low-pressure CVD equipment, a plasma CVD equipment, a metal CVD equipment, and an ALD equipment; the thin film forming apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus; the CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus; the processing apparatus is a bump plating apparatus; the aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus; the inspection apparatus is a life test apparatus; the pure water / chemical liquid apparatus is at least one selected from the group consisting of a chemical supply apparatus, a slurry supply apparatus, a chemical purification apparatus, and a waste liquid treatment apparatus; the gas apparatus is at least one selected from the group consisting of a gas generation apparatus, a gas purification apparatus, a gas mixing apparatus, a gas detection apparatus, and an exhaust gas treatment apparatus; the clean room apparatus is at least one selected from the group consisting of a thermal chamber and an environmental test apparatus; The manufacturing-related equipment is preferably at least one selected from the group consisting of jig cleaning / drying equipment, flow rate control equipment, packaging equipment, and liquid / gas measuring equipment.

[0121] Although the embodiments have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the claims.

[0122] The present disclosure will now be described in more detail with reference to examples, but the present disclosure is not limited to these examples.

[0123] Various physical properties were measured by the following methods.

[0124] <Chemical Resistance (Corrosion Resistance) Test> The rubber sheets obtained in the Examples and Comparative Examples were cut into a size of 10 mm x 50 mm x 2 mm to prepare test specimens. The test specimens were dried at 60°C for 2 hours. After drying, the mass of the test specimens before immersion was measured at room temperature (20°C). After measurement, the test specimens were completely immersed in each of the chemical solutions (1) to (9) below and held for 1 week (168 hours). After holding, the test specimens were washed with pure water, water droplets on the surface were wiped off, and the specimens were dried at 60°C for 12 hours. The mass of the test specimens after immersion was measured at room temperature (20°C). From the measured masses before and after immersion, the relative value of the mass after immersion was calculated, with the mass before immersion being set at 100. The average and standard deviation of the masses (relative values) after immersion for the nine types (1) to (9) were also calculated. (Chemical Solutions) (1) 25% by mass TMAH([(CH ３ ) ４ N] ＋ [OH] －) (80°C) (2) 100% by mass IPA (isopropyl alcohol) (80°C) (3) 49% by mass hydrofluoric acid (70°C) (4) Mixed acid of hydrofluoric acid and nitric acid (mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) (5) Mixed acid of hydrofluoric acid and nitric acid (mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) (6) SPM (mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) Oxidation-reduction potential (vs NHE): 1.8V (7) SC1 (mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution and deionized water in a volume ratio of 1:1:5) (70°C) Oxidation-reduction potential (vs. NHE): 1.2 V (8) SC2 (a mixture of 35-37% by mass hydrochloric acid, 30-36% by mass hydrogen peroxide, and deionized water in a volume ratio of 1:1:4) (70 ° C) Oxidation-reduction potential (vs. NHE): 1.6 V (9) 85% by mass phosphoric acid (80 ° C)

[0125] <Metal Elution Test> The rubber sheets obtained in the Examples and Comparative Examples were cut into test specimens measuring 10 mm x 50 mm x 2 mm. As a pre-cleaning step, the test specimens were immersed in 3.6% by mass hydrochloric acid for 1 hour, and then rinsed with running pure water. The test specimens were then immersed in 100 mL of 3.6% by mass hydrochloric acid at 23°C. One week (168 hours) after the start of immersion, a portion of each immersion solution was extracted, and the metal concentrations of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, and Pb) were measured using ICP-MSI (Agilent 8900, manufactured by Agilent Technologies) to determine the amount of metal elution.

[0126] <Compression Set Test> The compression set test was carried out in accordance with the test standard of JIS B2401 "O-rings - Part 1: O-rings" EPDM-70.

[0127] The materials used in the examples and comparative examples are as follows: (Rubber) EPT3045: EPDM manufactured by Mitsui Chemicals, Inc., Mooney viscosity ML １＋４ (100°C): 40, diene monomer content: 4.7 mass%, ethylene content: 54 mass% EP93: EPDM manufactured by ENEOS Materials Corporation, Mooney viscosity ML １＋４(125°C): 31, diene monomer content: 2.7 mass%, ethylene content: 55 mass% EPT0045: EPM manufactured by Mitsui Chemicals, Inc., Mooney viscosity ML １＋４ (100°C): 40, ethylene content: 55 mass% EP27: EPDM manufactured by ENEOS Materials, Mooney viscosity ML １＋４ (125°C): 70, diene monomer content: 4.0 mass%, ethylene content: 56 mass% EP57C: EPDM manufactured by ENEOS Materials Corporation, Mooney viscosity ML １＋４ (125°C): 58, diene monomer content: 4.5 mass%, ethylene content: 67 mass% Butyl 065: IIR manufactured by Japan Butyl Co., Ltd., Mooney viscosity ML １＋８ (125°C): 32, diene monomer content: 1.1 mass% Butyl 365: IIR manufactured by Japan Butyl Co., Ltd., Mooney viscosity ML １＋８ (125 ° C): 33, diene monomer content: 2.3 mass% Zetpol 2001L: hydrogenated nitrile rubber (HNBR) manufactured by Zeon Corporation KE-951-U: silicone rubber (Q) (resin) manufactured by Shin-Etsu Chemical Co., Ltd. HDPE: "Novatec HD HJ490" manufactured by Japan Polyethylene Corporation, density: 0.958 g / m ３ UHPE: "Lubmer L4000" manufactured by Mitsui Chemicals, Inc., weight average molecular weight: 1.5 × 10 ６g / mol (Carbon black) SEAST G-SO: FEF carbon black manufactured by Tokai Carbon Co., Ltd. SEAST 3: HAF carbon black manufactured by Tokai Carbon Co., Ltd. (Crosslinking agent) Percumyl D-40: Dicumyl peroxide manufactured by NOF Corporation Peroximon F-40: α,α'-bis(t-butylperoxy)diisopropylbenzene manufactured by NOF Corporation C-8: 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane manufactured by Shin-Etsu Chemical Co., Ltd. Sulfur: Sulfur powder 1000 μm manufactured by Hosoi Chemical Industry Co., Ltd. (Vulcanization accelerator) Zinc oxide type 2: Zinc oxide type 2 manufactured by Sakai Chemical Industry Co., Ltd. (Vulcanization accelerator aid) Stearic acid: Powdered stearic acid Sakura manufactured by NOF Corporation (Crosslinking aid) TAIC (triallyl isocyanurate): TAIC manufactured by Mitsubishi Chemical Corporation Nocrac CD: 4,4'-bis(α,α-dimethylbenzyl)diphenylamine, manufactured by Ouchi Shinko Chemical Industry Co., Ltd. Nocrac MBZ: zinc salt of 2-mercaptobenzimidazole (anti-aging agent), manufactured by Ouchi Shinko Chemical Industry Co., Ltd. Antage RD: 2,4-trimethyl-1,2-dihydroquinoline polymer (TMQ), manufactured by Kawaguchi Chemical Industry Co., Ltd. Noccela TT: tetramethylthiuram disulfide (TMTD), manufactured by Ouchi Shinko Chemical Industry Co., Ltd.

[0128] Examples 1 to 9 and Comparative Example 1 According to the compounding ratios shown in Tables 1 to 3, kneading in an internal mixer (kneading A) was carried out using a Laboplastomill Banbury-type mixer B-250 (manufactured by Toyo Seiki Seisakusho, Ltd.) for 5 minutes from a predetermined starting temperature. Next, kneading with a roll (kneading B) was carried out at 50±10°C using an electrically heated high-temperature roll machine (manufactured by Ikeda Machinery Industry Co., Ltd.). After kneading, crosslinking was carried out for 20 minutes at 170°C in an electric heating press (manufactured by Ohtake Machinery Industry Co., Ltd.) to produce rubber sheets (rubber members). Chemical resistance tests were carried out using the obtained rubber sheets. Compression set tests and metal elution tests were also carried out for Examples 1 to 7. The results are shown in Tables 1 to 3.

[0129] Example 10 According to the compounding ratios shown in Table 2, kneading in an internal mixer (kneading A) was carried out using a Laboplastomill Banbury type mixer B-250 (manufactured by Toyo Seiki Seisakusho, Ltd.) for 5 minutes from a predetermined starting temperature. Next, kneading with a roll (kneading B) was carried out at 50±10°C using an electrically heated high-temperature roll machine (manufactured by Ikeda Machine Industry Co., Ltd.). After kneading, crosslinking was carried out for 25 minutes at 160°C in an electric heating press (manufactured by Ohtake Machine Industry Co., Ltd.) to produce a rubber sheet (rubber member). A chemical resistance test was carried out using the obtained rubber sheet. The results are shown in Table 2.

[0130] Comparative Example 2 According to the compounding ratios shown in Table 4, roll kneading (kneading B) was carried out at 50±10°C using an electrically heated high-temperature roll machine (manufactured by Ikeda Machinery Co., Ltd.). After kneading, the mixture was pressed at 165°C for 10 minutes using an electric heating press (manufactured by Ohtake Machinery Co., Ltd.), and then secondary vulcanization was carried out at 200°C for 4 hours to produce a rubber sheet (rubber member). A chemical resistance test was carried out using the obtained rubber sheet. The results are shown in Table 4.

[0131]

[0132]

[0133]

[0134]

[0135] The rubber members of the examples were suitable for use as members (components) in semiconductor manufacturing related equipment where chemicals are used.

Claims

1. A rubber member containing an olefin-based rubber, the rubber member being at least one selected from the group consisting of building materials, mobility materials, aerospace materials, semiconductor materials, and information and communications materials, and which comes into contact with corrosive substances.

2. The rubber member according to claim 1, wherein the olefinic rubber is at least one selected from the group consisting of ethylene-propylene-diene rubber, ethylene-propylene rubber, and butyl rubber.

3. The rubber member according to claim 2, wherein the ethylene content of the ethylene-propylene-diene rubber and the ethylene-propylene rubber is 50 to 70% by mass.

4. The rubber member according to any one of claims 1 to 3, wherein the amount of diene monomer in the olefin-based rubber is 0 to 5% by mass.

5. Mooney viscosity (ML) of the olefin rubber １＋４ The rubber member according to any one of claims 1 to 4, wherein the thermal expansion coefficient (Tc) (at 100°C)) is 10 to 200.

6. The rubber member according to any one of claims 1 to 5, wherein the olefin-based rubber contains 1 to 60 mass % of an olefin resin.

7. A rubber member according to any one of claims 1 to 5, wherein the olefin-based rubber contains 45 to 55 mass % of an olefin resin.

8. The rubber member according to claim 6 or 7, wherein the olefin resin is a polyethylene resin.

9. The olefin resin has a density of 0.94 to 0.97 g / m ３ and a high-density polyethylene having a weight average molecular weight of 1.0 × 10 ６ ~1.0 x 10 ７ 9. The rubber member according to claim 6, wherein the rubber member is at least one selected from the group consisting of ultra-high molecular weight polyethylenes represented by the formula:

10. The rubber member according to any one of claims 1 to 9, wherein the olefin-based rubber is crosslinked with a peroxide crosslinking agent and / or a sulfur-based crosslinking agent.

11. The rubber member according to any one of claims 1 to 10, which is at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, washers, and sealing materials.

12. The rubber member according to any one of claims 1 to 11, wherein the corrosive substance has a pH of 6 or less or 8 or more.

13. The rubber member according to any one of claims 1 to 12, wherein the oxidation-reduction potential (vs. NHE) of the corrosive substance is -2.0 to 3.0 V.

14. The rubber member according to any one of claims 1 to 13, wherein the corrosive substance is at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, organic solvents, and salt water.

15. The rubber member according to claim 14, wherein the acidic substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid.

16. The basic substance is TMAH([(CH ３ ) ４ N] ＋ [OH] － 16. The rubber member according to claim 14, wherein the chemical agent is at least one selected from the group consisting of an aqueous solution of sodium hydroxide, aqueous ammonia, and a mixed solution of aqueous hydrogen peroxide and aqueous ammonia.

17. The corrosive substance is hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed solution of hydrogen peroxide and hydrochloric acid, a mixed solution of hydrogen peroxide and sulfuric acid, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), a sodium hydroxide aqueous solution, a mixed chemical solution of hydrogen peroxide and ammonia water, and isopropyl alcohol.

18. The rubber member according to any one of claims 1 to 17, which is a member for semiconductor manufacturing related equipment.

19. The rubber member according to claim 18, wherein the semiconductor manufacturing related equipment is an equipment in which chemicals are used.

20. The rubber member according to any one of claims 1 to 19, wherein a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in each of the following four chemical solutions for one week, and the relative mass after immersion, with the mass before immersion being 100, is 50 to 150 in all cases. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) 49% by mass hydrofluoric acid (70°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69-71% by mass nitric acid in a volume ratio of 1:100) (20°C) SPM (a mixture of 98% by mass sulfuric acid and 30-36% by mass hydrogen peroxide in a volume ratio of 2:1) (80°C) 21. The rubber member according to any one of claims 1 to 20, wherein a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in each of the following nine chemical solutions for one week, and the relative values ​​of the mass after immersion are calculated, with the mass before immersion being 100. The average of the relative values ​​for the nine chemical solutions is 80 to 120, and the standard deviation is 20 or less. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) 100% by mass isopropyl alcohol (80°C) 49% by mass hydrofluoric acid (70°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) SPM (a mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) SC1 (a mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:5) (70°C) SC2 (a mixture of 35 to 37% by mass hydrochloric acid, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:4) (70°C) 85% by mass phosphoric acid (80°C) 22. A rubber member according to any one of claims 1 to 21, in which when a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution of 15 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Ag, Cd, Pb) is 30 ppb or less for each.

23. A rubber member according to any one of claims 1 to 22, in which the amount of Zn eluted is 150 ppb or less when a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in 3.6 mass % hydrochloric acid at 23°C for one week.

24. A rubber member according to any one of claims 1 to 23, wherein when a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is 150 ppb or less for each.

25. A semiconductor manufacturing related device equipped with the rubber member according to any one of claims 1 to 24.

26. The semiconductor manufacturing related equipment according to claim 25, which is at least one selected from the group consisting of semiconductor manufacturing equipment and equipment related to semiconductor manufacturing equipment.

27. The semiconductor manufacturing related equipment according to claim 26, wherein the semiconductor manufacturing equipment is at least one selected from the group consisting of photolithography process equipment, thin film formation / etching / cleaning / drying equipment, inspection / evaluation equipment / manufacturing equipment, resist processing equipment, etching equipment, cleaning / drying equipment, CVD equipment, thin film formation equipment, CMP equipment, processing equipment, aging equipment, and inspection equipment, and the semiconductor manufacturing equipment related equipment is at least one selected from the group consisting of pure water / chemical equipment, gas equipment, clean room equipment, and manufacturing related equipment.

28. The photolithography process equipment is at least one selected from the group consisting of a coating equipment, a resist stripping equipment, a developing equipment (developer), and a descum equipment; the thin film formation / etching / cleaning / drying equipment is at least one selected from the group consisting of a vacuum deposition equipment, a cleaning equipment, a drying equipment, and a scrub cleaning equipment; the inspection / evaluation equipment / manufacturing equipment is a defect repair equipment; the resist processing equipment is at least one selected from the group consisting of a coating equipment, a developing equipment, a resist stripping equipment, and an ashing equipment; the etching equipment is at least one selected from the group consisting of a dry etching equipment and a wet etching equipment; the cleaning / drying equipment is at least one selected from the group consisting of a wet cleaning equipment, a scrub cleaning equipment, and a drying equipment; the CVD equipment is at least one selected from the group consisting of a high-pressure CVD equipment, a SACVD equipment, a low-pressure CVD equipment, a plasma CVD equipment, a metal CVD equipment, and an ALD equipment; the thin film forming apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus; the CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus; the processing apparatus is a bump plating apparatus; the aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus; the inspection apparatus is a life test apparatus; the pure water / chemical liquid apparatus is at least one selected from the group consisting of a chemical supply apparatus, a slurry supply apparatus, a chemical purification apparatus, and a waste liquid treatment apparatus; the gas apparatus is at least one selected from the group consisting of a gas generation apparatus, a gas purification apparatus, a gas mixing apparatus, a gas detection apparatus, and an exhaust gas treatment apparatus; the clean room apparatus is at least one selected from the group consisting of a thermal chamber and an environmental test apparatus; 28. The semiconductor manufacturing related equipment according to claim 27, wherein the manufacturing related equipment is at least one selected from the group consisting of a jig cleaning / drying device, a flow control device, a packaging device, and a liquid / gas measuring device.

Images