Laser etching device and method

Abstract

The present invention relates to a laser etching device and method for forming a pattern on a ceramic sintered body or a pre-sintered body of a prosthesis. The laser etching device according to one embodiment of the present invention comprises: a laser light-emitting unit for generating a laser beam; a laser scan head for controlling or moving the direction of the laser beam generated by the laser light-emitting device; and a tray on which the ceramic block is mounted and of which the location or angle can be changed.

Description

Laser etching device and method

[0001] The present invention relates to a laser etching device and method for forming a pattern on a ceramic material, and more particularly, to a laser etching device and method for forming a pattern on a ceramic sintered body or a pre-sintered body of a prosthesis used for restoring the function and aesthetics of teeth.

[0002] Generally, prosthetics are used to protect and restore function to teeth damaged by caries, accidents, or other causes. These prosthetics can be made from ceramic materials, particularly zirconia.

[0003] Fig. 1 is a schematic diagram showing a manufacturing process of a typical zirconia ceramic prosthesis. Referring to Fig. 1, the prosthesis manufacturing process can be divided into (i) a patient model scan design model input step, (ii) a processing step of making a disk-shaped block of a pre-sintered body stage into a model shape by CAD / CAM processing, (iii) a sintering step of finally sintering the pre-sintered zirconia workpiece, (iv) a glazing and staining step of processing to make it look similar to the color and surface gloss of natural teeth, and (v) a bonding step of bonding to a prep (a tooth that has been prepared in advance to fit the shape of the prosthesis) using bonding cement.

[0004] Meanwhile, if the bond between the prosthesis and the adhesive cement is weak, the prosthesis may frequently fall out after the procedure. This problem not only causes psychological discomfort to the patient, but also reduces the effectiveness of the treatment and may require further treatment.

[0005] Conventional zirconia restorations have poor bonding strength with adhesive resins due to zirconia's corrosion resistance and high surface roughness. In particular, compared to glass / resin restorations, their bonding strength is lower, making them difficult to apply to applications such as anterior laminates.

[0006] As a means of improving the bonding strength of zirconia prosthetics, a treatment method has been proposed in the past to increase the bonding area by sandblasting the bonding surface, silica coating, hydrofluoric acid etching, etc.

[0007] However, this type of treatment can cause cracks or breakage in the sintered tooth, and the physical impact generated during the sandblasting or coating process can damage the sintered tooth. This can significantly reduce the durability and lifespan of the prosthesis. Furthermore, the difference in coefficients of thermal expansion between ceramic and cement can gradually weaken the bonding strength of the sandblasted bonding surface. Consequently, the ceramic bonding interface formed by sandblasting may become less stable.

[0008] In addition, zirconia prostheses processed with CAD / CAM can be used stably after restoration only when the preparation tooth is accurately fitted. However, (i) over-milling of the CAD / CAM equipment to reduce interference with the preparation tooth, (ii) dimensional deformation due to shrinkage error of the ceramic disk block, (iii) dimensional error due to CAD / CAD processing tool size limitations, and (iv) scanning data error may cause inaccurate fitting of the inner surface of the prosthesis, and crown damage due to empty space or detachment due to reduced bonding strength may occur.

[0009] In particular, if delamination occurs at the interface due to reduced adhesive strength, additional caries or damage to the teeth can occur. To prevent this phenomenon, a process is required to enhance the adhesive strength of the ceramic block's adhesive interface.

[0010] The problem to be solved by the present invention is to provide a laser etching device and method for forming a pattern in a ceramic material, which increases the surface area of ​​the adhesive interface of a ceramic prosthesis to provide optimized adhesive strength, thereby enabling restorative treatment using a stable zirconia material prosthesis.

[0011] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0012] In order to achieve the above task, a laser etching device according to an embodiment of the present invention includes a laser emitting unit that generates a laser beam, a laser scan head that controls or moves the direction of the laser beam generated from the laser emitting unit, and a tray on which the ceramic block is mounted and whose position or angle can be changed.

[0013] In order to achieve the above object, a laser etching device according to an embodiment of the present invention includes: a tray on which a prosthesis is placed; a tray stage for changing an angle or position of the tray; a laser scan head for irradiating a laser onto the prosthesis to form a pattern; a laser stage for changing an angle or position of the laser scan head; and a control unit for controlling the tray stage, the laser scan head, and the laser stage, wherein the control unit controls the laser scan head to irradiate a laser onto an etching area in a first pattern, controls the tray stage to change an angle or position of the tray, controls the laser stage to change an angle or position of the laser scan head, and controls the laser scan head to irradiate a laser onto the etching area in a second pattern different from the first pattern.

[0014] In order to achieve the above object, a laser etching device according to an embodiment of the present invention includes: a tray on which a prosthesis is placed; a tray stage for changing an angle or position of the tray; a laser scan head for irradiating a laser onto the prosthesis to form a pattern; a laser stage for changing an angle or position of the laser scan head; and a control unit for controlling the tray stage, the laser scan head, and the laser stage, wherein the control unit controls the laser scan head to irradiate a laser onto a first etching area, controls the tray stage to change an angle or position of the tray, controls the laser stage to change an angle or position of the laser scan head, and controls the laser scan head to irradiate a laser onto a second etching area different from the first etching area.

[0015] In order to achieve the above task, a laser etching method according to an embodiment of the present invention includes a step of irradiating a laser with a first pattern by a laser scan head to an etching area including a prosthesis mounted on a tray, a step of changing an angle or position of the tray and changing the angle or position of the laser scan head, and a step of irradiating a laser with a second pattern different from the first pattern by the laser scan head to the etching area.

[0016] In order to achieve the above task, a laser etching method according to an embodiment of the present invention includes a step of irradiating a laser by a laser scan head to a first etching area including a prosthesis mounted on a tray, a step of changing an angle or position of the tray and changing the angle or position of the laser scan head, and a step of irradiating a laser by a laser scan head to a second etching area different from the first etching area.

[0017] Specific details of other embodiments are included in the detailed description and drawings.

[0018] According to the laser etching device and method of the present invention, one or more of the following effects are achieved.

[0019] First, by introducing a laser etching device in forming an adhesive pattern on a ceramic block made of a ceramic sintered body or a pre-sintered body for artificial teeth, the surface area of ​​the adhesive interface of the ceramic prosthesis is increased to provide optimized adhesive strength, thereby enabling restorative treatment using a stable zirconia material prosthesis, which has the advantage of being able to form a pattern on the ceramic material.

[0020] Second, by applying a laser etching device, the contact area can be expanded during the process of bonding cement to the prepared tooth, which also has the advantage of improving mechanical bonding strength.

[0021] Third, since the pattern portion is formed through a laser etching process, there is also the advantage of being able to precisely form small patterns of a few millimeters or less.

[0022] Fourth, there is also the advantage of being able to prevent damage such as cracks by evenly irradiating the ceramic block, which is a sintered body, with a laser multiple times.

[0023] Fifth, there is also the advantage of being able to evenly form a pattern on a three-dimensional prosthesis by changing the position of the laser scan head, changing the angle of the tray on which the ceramic block is mounted, and irradiating the laser multiple times.

[0024] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0025] Figure 1 is a schematic drawing showing the manufacturing process of a typical zirconia ceramic prosthesis.

[0026] Figure 2 is a block diagram of a laser etching device according to a first embodiment of the present invention.

[0027] Figure 3 is a block diagram of a laser etching device according to a second embodiment of the present invention.

[0028] Figure 4 is a block diagram of a laser etching device according to a third embodiment of the present invention.

[0029] FIG. 5 is a block diagram of a milling device integrally equipped with a laser etching device according to an embodiment of the present invention.

[0030] Figure 6 is an internal structural diagram of a laser etching device according to a fourth embodiment of the present invention.

[0031] Fig. 7 is a cross-sectional view of the laser etching device of Fig. 6.

[0032] Fig. 8 is a partial structural diagram of the laser etching device of Fig. 6.

[0033] Fig. 9 is a block diagram of the laser etching device of Fig. 6.

[0034] Fig. 10 is an example of the operation of the laser etching device of Fig. 6.

[0035] Figure 11 is a flowchart for a laser etching method according to a fifth embodiment of the present invention.

[0036] Figure 12 is a flowchart for a laser etching method according to the sixth embodiment of the present invention.

[0037] FIG. 13 is a drawing of a continuous pattern according to an example formed by the laser etching device and method of FIGS. 2 to 12.

[0038] FIG. 14 is a drawing of a discontinuous pattern according to another example formed by the laser etching device and method of FIGS. 2 to 12.

[0039] FIG. 15 is a schematic drawing of a prosthesis manufacturing process using a laser etching device and method according to an embodiment of the present invention.

[0040] FIG. 16 is a drawing showing an adhesive interface laser pattern formed by the laser etching device and method of FIGS. 2 to 12 at magnifications of 40 and 150 times.

[0041] Fig. 17 is a cross-sectional view of an adhesive interface laser pattern formed by the laser etching device and method of Figs. 2 to 12.

[0042] Figure 18 is a scanning electron microscope (SEM) photograph at magnifications of 500x, 2500x, and 5000x of the result of patterning with a pattern spacing of 0.2 mm and a depth condition of 0.03 mm using a fiber laser etching device with an output of 50 W.

[0043] Fig. 19 is an image showing the contact angle (hydrophilicity) measurement results depending on whether or not the surface is treated by the laser etching device and method of Figs. 2 to 12.

[0044] Fig. 20 shows the results of a resin cement shear bond strength experiment depending on whether or not the surface was treated using the laser etching device and method of Figs. 2 to 12.

[0045] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals designate like elements throughout the specification.

[0046] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a "first" component may also be a "second" component.

[0047] Throughout the specification, unless otherwise specifically stated, each element may be singular or plural.

[0048] Hereinafter, the phrase "any configuration is placed on (or below)" a component or "on (or below)" a component may mean that any configuration is placed in contact with the upper surface (or lower surface) of said component, and that other configurations may be interposed between said component and any configuration placed on (or below) said component.

[0049] Additionally, when it is described that a component is "connected," "coupled," or "connected" to another component, it should be understood that the components may be directly connected or connected to one another, but that other components may also be "interposed" between the components, or that each component may be "connected," "coupled," or "connected" through another component.

[0050] As used herein, singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consisting of" or "comprising" should not necessarily be construed to include all of the components or steps described in the specification, and should be construed to mean that some of the components or steps may not be included, or that additional components or steps may be included.

[0051] Throughout the specification, when we refer to "A and / or B", this means A, B, or A and B, unless otherwise stated, and when we refer to "C to D", this means C or more and D or less, unless otherwise stated.

[0052] Hereinafter, the present invention will be described with reference to drawings for explaining a laser etching device and method according to embodiments of the present invention.

[0053] FIGS. 2 to 4 are block diagrams of laser etching devices according to the first to third embodiments of the present invention, respectively.

[0054] Referring to FIG. 2, a laser etching device according to a first embodiment of the present invention forms an adhesive pattern on a ceramic block made of a ceramic sintered body or a pre-sintered body for artificial teeth, and includes a laser scan head (8) that irradiates laser light, a tray (5), a laser light emitting unit (7), a camera (6), and laser software (2).

[0055] The laser emitting unit (7) generates a laser beam. If the laser etching depth is less than 10 nm, the surface treatment effect is reduced, and if it is more than 2 mm, the overall strength of the product is reduced, which may lower the usability. Therefore, it is preferable that the laser light output of the laser emitting unit (7) be controlled so that the laser etching depth is formed within the range of 10 nm to 2 mm. The laser emitting unit (7) may be formed of any one of a fiber laser, a UV laser, a femtosecond laser, a nanosecond laser, and a picosecond laser.

[0056] The laser scan head (8) controls or moves the direction of the laser beam generated from the laser emitting unit (7) according to a set pattern.

[0057] The etching area (9) is an area where a predetermined pattern is formed on the ceramic block by light irradiated from the laser scan head (8). The tray (5) is a type of jig or work stage on which the ceramic block is mounted. The tray (5) can be positioned or angled. The camera (6) photographs the ceramic block and / or the laser marking portion. The laser software (2) sets the laser patterning area based on the image captured by the camera, sets the laser conditions, and transmits patterning / etching processing information.

[0058] Referring to FIG. 3, the tray (5) of the laser etching device according to the present invention may further include a control module. The control module rotates or moves the tray (5) so that the laser scan head (8) can perform laser patterning and etching processing along a two-dimensional or three-dimensional surface.

[0059] If the laser beam is irradiated at an angle of less than 10 degrees relative to the adhesive interface, the pattern formed will have a high inclination angle and the projection area will be wide, thereby reducing the effectiveness of the surface treatment. Therefore, it is preferable that the control module rotate or move the tray (5) so that the laser beam is irradiated at an angle of 10 to 90 degrees relative to the adhesive interface of the ceramic block.

[0060] FIG. 5 is a block diagram of a milling device integrally equipped with a laser etching device according to an embodiment of the present invention.

[0061] Referring to FIG. 5, the milling device may include a milling unit (or a 3D printer that prints a ceramic block to fit a predetermined 3D model) that mills a ceramic block to fit a predetermined 3D model, and a laser etching device (3) that forms an adhesive pattern on the ceramic block milled by the milling unit. Here, the laser etching device (3) may be formed by the laser etching device described with reference to FIGS. 2 to 4.

[0062] FIG. 6 is an internal structural diagram of a laser etching device according to a fourth embodiment of the present invention, FIG. 7 is a cross-sectional view of the laser etching device of FIG. 6, FIG. 8 is a partial structural diagram of the laser etching device of FIG. 6, FIG. 9 is a block diagram of the laser etching device of FIG. 6, and FIG. 10 is an operation example diagram of the laser etching device of FIG. 6.

[0063] A laser etching device (11) according to a fourth embodiment of the present invention includes a tray (16) on which a prosthesis is placed, a tray stage (15) for changing the angle or position of the tray (16), a laser scan head (18) for irradiating a laser to the prosthesis to form a pattern, a laser stage (14) for changing the angle or position of the laser scan head (18), a laser emitting unit (17) for generating a laser irradiated from the laser scan head (18), an exhaust unit (13) for discharging gas, particles, etc. generated by the laser irradiation to the outside, and a control unit (12).

[0064] The laser emitting unit (17) may be any one of a fiber laser, a UV laser, a femtosecond laser, a nanosecond laser, and a picosecond laser. It is preferable that the laser emitting unit (17) outputs a laser of 200 W or less.

[0065] The laser scan head (18) changes the direction of the laser generated from the laser emitting unit (17) to form a pattern in the etching area (E). The laser scan head (18) forms a pattern by scanning the laser in the etching area (E) of a set size.

[0066] It is preferable that the laser scan head (18) etch with a line width of 1 µm to 20 mm and a depth of 10 nm to 2 mm. It is preferable that the laser scan head (18) forms a grid-shaped pattern so that the grid spacing is 10 µm to 200 mm.

[0067] The laser stage (14) moves the laser scan head (18) in translational and / or rotational motions, and can move the laser scan head (18) in at least one direction among the six axes (X, Y, Z, Xθ, Yθ, Zθ). As shown in Fig. 10, the laser stage (14) in the present embodiment is a Z-stage that moves the laser scan head (18) in the up-and-down direction.

[0068] The laser stage (14) changes the angle or position of the laser scan head (18) when the tray stage (15) changes the angle or position of the tray (16).

[0069] The tray stage (15) can move the tray (16) in at least one direction among the six axes (X, Y, Z, Xθ, Yθ, Zθ) by translating and / or rotating the tray (16). As shown in Fig. 10, the tray stage (15) in the present embodiment is an Xθ-stage that rotates the tray (16) in a direction orthogonal to the moving direction of the laser scan head (18) (front-back direction) with the rotation axis as the axis. It is preferable that the tray stage (15) rotates the tray (16) by 5 to 90 degrees.

[0070] The tray stage (15) changes the angle or position of the tray (16) when the laser stage (14) changes the angle or position of the laser scan head (18).

[0071] The exhaust section (13) discharges gas, particles, etc. generated when the laser scan head (18) etches the prosthesis to the outside. The exhaust section (13) discharges gas, particles, etc. in a direction (y direction) orthogonal to the rotation axis of the tray stage (15) rotating the tray (16).

[0072] Referring to Fig. 8, a tray (16) is provided for mounting prosthetics. A disk-shaped block formed by cutting a plurality of prosthetics is mounted thereon, or individual prosthetics are mounted thereon using a separate jig. A prosthetic mounting portion (16a) for mounting prosthetics is formed on the tray (16). The tray (16) is moved in translation and / or rotation by the tray stage (15) to change its position or angle.

[0073] Referring to FIG. 9, the control unit (12) controls the tray stage (15), the laser emitting unit (17), the laser scan head (18), and the laser stage (14). The control unit (12) controls the laser emitting unit (17) to generate a laser, and controls the laser scan head (18) to form a pattern with the laser in the etching area (E). The control unit (12) controls the laser stage (14) to change the position or angle of the laser scan head (18), and controls the tray stage (15) to change the position or angle of the tray (16). The control unit (12) controls the laser scan head (18) to irradiate the laser to the etching area (E), then controls the tray stage (15) to change the angle or position of the tray (16), and controls the laser stage (14) to change the angle or position of the laser scan head (18), and then controls the laser scan head (18) to irradiate the laser to the etching area (E).

[0074] Figure 11 is a flowchart for a laser etching method according to a fifth embodiment of the present invention.

[0075] The laser etching device in this embodiment is the laser etching device of FIGS. 6 to 10.

[0076] A laser etching method according to a fifth embodiment of the present invention includes a step (S210) in which a laser scan head (18) irradiates a laser to an etching area (E) with a first pattern (P1), a step (S220) in which a tray stage (15) changes an angle or position of a tray (16) and a laser stage (14) changes an angle or position of a laser scan head (18), and a step (S230) in which the laser scan head (18) irradiates a laser to the etching area (E) with a second pattern (P2) different from the first pattern (P1).

[0077] After installing the prosthesis (ceramic block) on the prosthesis mounting portion (16a) of the tray (16), an etching area (E) is set. The tray stage (15) rotates the tray (16) at the set initial angle (Xθ). The laser stage (14) adjusts the height of the laser scan head (18) so that the laser can be focused on the etching area (E).

[0078] In step S210, the laser scan head (18) irradiates the etching area (E) with a laser several times according to the first pattern (P1). In the present embodiment, the laser scan head (18) forms a grid-shaped pattern, and the first pattern (P1) is a straight line pattern in the first direction among the grid shapes. In the present embodiment, the laser scan head (18) irradiates the laser several times in a straight line pattern in the first direction.

[0079] At step S220, the tray stage (15) changes the angle (Xθ) of the tray (16) by 20 to 30 degrees, and the laser stage (14) adjusts the height of the laser scan head (18) so that the laser can be focused on the etching area (E).

[0080] In step S230, the laser scan head (18) irradiates the etching area (E) with a laser several times according to a second pattern. In step S230, the etching area (E) may be the same as the etching area (E) in step S210 or may differ only in height. The second pattern (P2) is a pattern different from the first pattern (P1), and in the present embodiment, the second pattern (P2) is a straight line pattern in a second direction orthogonal to the first direction of the first pattern. In the present embodiment, the laser scan head (18) irradiates the laser several times in a straight line pattern in the second direction.

[0081] Figure 12 is a flowchart for a laser etching method according to the sixth embodiment of the present invention.

[0082] The laser etching device in this embodiment is the laser etching device of FIGS. 6 to 10.

[0083] A laser etching method according to a sixth embodiment of the present invention includes a step (S310) in which a laser scan head (18) irradiates a laser to a first etching area (E1) according to a pattern, a step (S320) in which a tray stage (15) changes an angle or position of a tray (16) and a laser stage (14) changes an angle or position of a laser scan head (18), and a step (S330) in which a laser scan head (18) irradiates a laser to a second etching area (E2) different from the first etching area (E1) according to a pattern.

[0084] After installing the prosthesis (ceramic block) on the prosthesis mounting portion (16a) of the tray (16), an etching area (E) is set. The tray stage (15) rotates the tray (16) at the set initial angle (Xθ). The laser stage (14) adjusts the height of the laser scan head (18) so that the laser can be focused on the first etching area (E1).

[0085] In step S310, the laser scan head (18) irradiates the first etching area (E1) with a laser several times. The laser scan head (18) irradiates the laser several times in a grid-shaped pattern or the first pattern (P1).

[0086] At step S320, the tray stage (15) changes the angle (Xθ) of the tray (16) by 20 to 30 degrees, and the laser stage (14) adjusts the height of the laser scan head (18) so that the laser can be focused on the second etching area (E2).

[0087] In step S330, the laser scan head (18) irradiates the second etching area (E2) with a laser several times. The second etching area (E2) is a different area from the first etching area (E1) on the prosthesis mounting portion (16a) of the tray (16). The second etching area (E2) may partially overlap with the first etching area (E1), but it is preferable that the second etching area (E2) does not overlap when projected at the same height. The laser scan head (18) irradiates the laser several times in a grid-shaped pattern or the second pattern (P2).

[0088] FIG. 13 is a drawing of a continuous pattern according to an example formed by the laser etching device and method of FIGS. 2 to 12, and FIG. 14 is a drawing of a discontinuous pattern according to another example formed by the laser etching device and method of FIGS. 2 to 12.

[0089] The etching pattern formed by the laser etching device of FIGS. 2 to 12 can be formed as a continuous pattern as shown in FIG. 13. That is, in the continuous case, it can be formed in a square grid shape.

[0090] The etching pattern formed by the laser etching device of FIGS. 2 to 12 can be formed as a discontinuous pattern as exemplarily shown in FIG. 14. In this case, a pattern having a polygonal structure shape including a circle, square, or hexagon can be arranged.

[0091] FIG. 15 is a schematic drawing of a prosthesis manufacturing process using a laser etching device and method according to an embodiment of the present invention.

[0092] Referring to FIG. 15, a method for manufacturing a prosthesis according to an embodiment of the present invention may include a milling step, a laser etching step, and a sintering step. The milling step processes a ceramic block into a patient-specific prosthesis shape using a milling device. Here, the ceramic block used in the milling may be composed of a sintered body of zirconia material having a density range of 97% or less.

[0093] The laser etching step is a step of etching a predetermined adhesive pattern using a laser etching device as described above on a ceramic block processed by a milling device. The sintering step sinters the ceramic block under predetermined temperature conditions after the laser etching step. This laser etching step can etch the sintered ceramic block with an etching line width of 1 micron or less. When performing the etching process, the laser etching device can be controlled so that the output of its light source is performed at 50 W or less.

[0094] This laser etching step can be performed by dividing the bonding portion of each prosthesis into multiple sections or etching continuously when forming the bonding pattern.

[0095] The method for manufacturing a prosthesis according to the present invention may further include a glazing step of separating a sintered ceramic block into individual prostheses and processing the surface color and gloss.

[0096] Additionally, prior to the glazing step, a laser etching step may be further included to improve the bonding stability with the glazing solution that creates staining and gloss to create color on the surface of the ceramic artificial tooth.

[0097] FIG. 16 is a drawing showing an adhesive interface laser pattern formed by the laser etching device and method of FIGS. 2 to 12 at magnifications of 40 times and 150 times, FIG. 17 is a cross-sectional view of an adhesive interface laser pattern formed by the laser etching device and method of FIGS. 2 to 12, and FIG. 18 is a scanning electron microscope (SEM) photograph at magnifications of 500 times, 2500 times, and 5000 times for the result of patterning with a pattern interval of 0.2 mm and a depth condition of 0.03 mm using a fiber laser etching device with an output of 50 W.

[0098] Referring to the drawings, it can be seen that the laser pattern formed on the adhesive interface of the sintered body is uniformly formed with a depth of 0.07 mm and an angle spacing of 0.25 mm. Furthermore, when examining the SEM image, it can be seen that the contact area of ​​the adhesive interface is maximized. Accordingly, the bonding strength can be increased during bonding of the adhesive interface.

[0099] Fig. 19 is an image showing the contact angle (hydrophilicity) measurement results depending on whether or not the surface is treated by the laser etching device and method of Figs. 2 to 12.

[0100] It can be confirmed that the contact angle of water droplets on the surface of surface-treated zirconia is lower, indicating that a hydrophilic surface is formed.

[0101] Fig. 20 shows the results of a resin cement shear bond strength experiment depending on whether or not the surface was treated using the laser etching device and method of Figs. 2 to 12.

[0102] In the case of the example in which the surface was treated by laser etching on the zirconia specimen, the average shear bond strength of the resin cement was 16.6 ± 3.3 MPa, whereas in the case of the comparative example in which the surface was not treated, the average shear bond strength of the resin cement was 1.7 MPa ± 2 MPa, showing a very large difference.

[0103] Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above, and various modifications may be made by a person skilled in the art without departing from the gist of the present invention as claimed in the claims. Furthermore, such modifications should not be understood individually from the technical idea or prospect of the present invention.

Claims

1. In a laser etching device for forming an adhesive pattern on a ceramic block made of a ceramic sintered body or a pre-sintered body for artificial teeth, A laser emitter that generates a laser beam; A laser scan head that controls or moves the direction of a laser beam generated from the laser light emitting device; and A laser etching device comprising a tray on which the above ceramic block is mounted and whose position or angle can be changed.

2. In paragraph 1, A laser etching device including an adjustment module that rotates or moves the tray so as to adjust the etching area according to the shape of the ceramic block.

3. In paragraph 2, The above control module is a laser etching device that rotates or moves the tray so that the laser beam is irradiated at an angle ranging from 10 degrees to 90 degrees based on the adhesive interface of the ceramic block.

4. In paragraph 1, The above laser emitting unit is a laser etching device in which the laser light output is controlled so that the laser etching depth is formed within a range of 10 nm to 2 mm.

5. In paragraph 1, A laser etching device in which the above laser emitting unit is composed of any one of a fiber laser, a UV laser, a femtosecond laser, a nanosecond laser, and a picosecond laser.

6. A molding unit that forms the above ceramic block according to a predetermined 3D model; and A milling device comprising a laser etching device according to any one of claims 1 to 5 for forming an adhesive pattern on the ceramic block.

7. Milling step of processing a ceramic block into a patient-specific prosthesis shape using a CAD / CAM milling device; A laser etching step of etching a predetermined adhesive pattern on the ceramic block processed by the milling device using a laser etching device according to any one of claims 1 to 5; and A method for manufacturing a prosthesis, comprising a sintering step of sintering the ceramic block formed on the above adhesive pattern under a predetermined temperature condition.

8. In paragraph 7, A method for manufacturing a prosthesis, comprising a laser etching step for improving the bonding stability with a glazing solution for creating a color and gloss in the ceramic block.

9. Tray on which the prosthesis is placed; A tray stage for changing the angle or position of the tray; A laser scan head that forms a pattern by irradiating a laser onto the above prosthesis; A laser stage for changing the angle or position of the laser scan head; and It includes a control unit that controls the tray stage, the laser scan head, and the laser stage, The above control unit, Controlling the above laser scan head to irradiate the laser in the etching area with the first pattern, Controlling the tray stage to change the angle or position of the tray and controlling the laser stage to change the angle or position of the laser scan head, A laser etching device that controls the laser scan head to irradiate a laser to the etching area in a second pattern different from the first pattern.

10. Tray on which the prosthesis is placed; A tray stage for changing the angle or position of the tray; A laser scan head that forms a pattern by irradiating a laser onto the above prosthesis; A laser stage for changing the angle or position of the laser scan head; and It includes a control unit that controls the tray stage, the laser scan head, and the laser stage, The above control unit, Controlling the above laser scan head to irradiate the laser to the first etching area, Controlling the tray stage to change the angle or position of the tray and controlling the laser stage to change the angle or position of the laser scan head, A laser etching device that controls the laser scan head to irradiate a laser to a second etching area different from the first etching area.

11. A step of the laser scan head irradiating a laser in a first pattern to an etching area including a prosthesis mounted on a tray; A step of changing the angle or position of the tray and changing the angle or position of the laser scan head; and A laser etching method comprising a step of irradiating a laser with a second pattern different from the first pattern to the etching area using a laser scan head.

12. A step of the laser scan head irradiating a laser to the first etching area including the prosthesis mounted on the tray; A step of changing the angle or position of the tray and changing the angle or position of the laser scan head; and A laser etching method comprising a step of a laser scan head irradiating a laser to a second etching area different from the first etching area.

Images