Substrate for packaging redistribution layer and manufacturing method thereof

By using glass, ceramic, or high-temperature polymer substrate materials and selective laser etching technology to form a redistribution layer with rounded corners, the high cost and complexity of traditional redistribution layers are solved, achieving high-density interconnection and efficient heat dissipation.

CN121335570APending Publication Date: 2026-01-13HE CHOU TECH INC
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Patent Information

Application Number
CN202411216747.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-07-03
Filing Date
2024-09-02
Publication Date
2026-01-13

AI Technical Summary

Technical Problem

In existing semiconductor packaging technologies, traditional redistribution layer formation methods face challenges such as high cost, complexity, low thermal management efficiency, and high-density interconnection. In particular, redistribution layers formed on nonwoven or polyimide substrates present challenges related to resistance points and fine line/spacing resolution.

Method used

Glass, ceramic, or high-temperature polymers are used as substrate materials. Selective laser etching and 3D printing technologies are combined to form a redistribution layer with rounded corners, and conductive adhesives such as copper or silver paste are used for filling. The manufacturing process includes an annealing step to cure the conductive adhesive.

Benefits of technology

It improves electrical and thermal performance, simplifies the manufacturing process, reduces resistance points, enables high-density interconnection and signal integrity, and meets the high-performance requirements of modern electronic devices.

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Abstract

The invention relates to a novel substrate designed for a packaging redistribution layer in a semiconductor device and an innovative manufacturing method thereof. The substrate aims to improve electrical and heat dissipation performance in a semiconductor package by using materials such as glass, ceramic or high-temperature polymer, so as to achieve an effect of improving heat management. One characteristic of the invention is that the redistribution layer comprises the arc angle, so that smooth transition between redistribution lines is promoted, and the filling resistance of the conductive material is effectively reduced. The redistribution layer is filled with conductive adhesive, such as copper or silver adhesive, into channels formed by selective laser etching or a 3D line printing technology. The method of manufacturing the printed circuit board ensures accurate formation of the conductive vias having arcuate angles, and involves a subsequent annealing step to cure the conductive adhesive.
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