Film thickness measurement method for adhesive and production method for joining member

Abstract

[Problem] To provide a film thickness measurement method which makes it possible to measure the film thickness of an adhesive that is separated from a first member and a second member after a curing step even when a crack occurs in the adhesive. [Solution] A film thickness measurement method for an adhesive comprises a disposition step, a curing step, a bonding step, and a measurement step. The disposition step is for disposing an adhesive (20) on surfaces of bonding sites of a first member and a second member with release sheets (64, 66) interposed therebetween. The release sheets are for preventing the first member and the second member from being bonded to each other by the adhesive. The curing step is for curing the adhesive. The bonding step is for taking out the cured adhesive and boding a film (70). On the film, a position where the thickness of the adhesive is to be measured is marked. The measurement step is for measuring the thickness of the adhesive at the marked position.

Description

Method for measuring film thickness of adhesive and method for manufacturing bonded member

[0001] The present disclosure relates to a method for measuring a film thickness of an adhesive and a method for manufacturing a bonded member.

[0002] For example, Non-Patent Document 1 below describes the bonding of a composite patch to a damaged area via a film-like adhesive for the purpose of repairing an aircraft.

[0003] "Development of a High-Speed ​​Repair Method for Aircraft Composite Structures," by Masayoshi Suhara et al., Mitsubishi Heavy Industries Technical Review, Vol. 53, No. 4 (2016), New Products and New Technologies

[0004] When bonding two components by placing an adhesive between them as described above, it is desirable that the adhesive be filled between the two components without excess or deficiency. Therefore, it is possible to measure the film thickness in advance using a sample of adhesive for measurement. This can be achieved, for example, by placing the sample of adhesive between the two components via a release sheet, then curing the adhesive and removing it. However, there is a risk of cracks occurring when the cured adhesive is separated from the bonded object. Cracking may hinder the measurement of the adhesive film thickness.

[0005] The means for solving the above problems and the effects thereof are described below. A method for measuring the thickness of an adhesive comprising a disposing step, a curing step, an attaching step, and a measuring step, wherein the disposing step is a step of disposing an adhesive on the surface of a bonding location between a first member and a second member via a release sheet, the release sheet being a sheet for preventing the first member and the second member from being bonded by the adhesive, the curing step is a step of curing the adhesive, the attaching step is a step of removing the cured adhesive and attaching a film, the film is marked with positions for measuring the thickness of the adhesive, and the measuring step is a step of measuring the thickness of the adhesive at the marked positions.

[0006] According to the above method, the markings on the film attached to the adhesive can be used as a guide to identify the measurement points for the adhesive's film thickness. Therefore, compared to directly marking the measurement points for the film thickness on the adhesive after the curing process, the man-hours required for marking can be reduced. Furthermore, by attaching a film to the adhesive, if cracks occur in the adhesive when it is separated from the first and second members after the curing process, the film can reinforce the adhesive.

[0007] FIG. 1 is a diagram showing an aircraft manufacturing system according to an embodiment; FIG. 2 is a flowchart showing some steps in an aircraft manufacturing process; FIG. 3 is a flowchart showing some steps in an aircraft manufacturing process; FIG. 4 is a cross-sectional view showing an adhesive placement process; FIG. 5 is a diagram illustrating a film template; FIG. 6 is a diagram illustrating a process of attaching a two-dimensional code to a film template; FIG. 7 is a diagram defining the relationship between the number of adhesives and the allowable film thickness range; and FIG. 8 is a plan view illustrating a process of changing the number and shape of adhesives.

[0008] An embodiment will now be described with reference to the drawings. "Configuration" FIG. 1 illustrates a partial configuration of an aircraft manufacturing system. An aircraft according to this embodiment is constructed using carbon fiber reinforced resin. The aircraft has portions where outer panels are bonded to structural components with adhesive. It is more difficult to achieve high dimensional processing accuracy with carbon fiber reinforced resin products than with metal products. Therefore, it is also difficult to precisely control the gap between the structural components and the outer panels through processing of the structural components and the outer panels. Therefore, in this embodiment, for each mass-produced aircraft, a sample of adhesive is placed between the structural components and the outer panels, the adhesive is cured, and the adhesive film thickness is measured and the adhesive is observed. This allows the gap between the structural components and the outer panels to be measured and the presence or absence of voids within the adhesive to be confirmed, thereby determining how much adhesive should be filled between the structural components and the outer panels.

[0009] The measuring device 10 shown in FIG. 1 is a device for measuring the film thickness of the adhesive. As an example, the positive direction of the z-axis shown in FIG. 1 indicates the vertically upward direction. The x-axis and y-axis are perpendicular to each other and perpendicular to the z-axis. As an example, the portion of the adhesive 20 whose film thickness is to be measured is desirably arranged parallel to the x-axis and y-axis. Then, the film thickness of the adhesive 20 is measured by contacting a pen-shaped probe 12 with both sides of the adhesive 20 in the z-axis direction. As an example, the measuring device 10 is configured so that the probe 12 located above in the z-axis direction is extendable and retractable. The amount of contraction of the probe 12 is the measured film thickness.

[0010] The adhesive 20 is displaced by the robot hand 30 to be positioned at an appropriate position for measurement by the measuring device 10. A camera 32 is disposed near the measuring device 10 to take an image of the adhesive 20.

[0011] The terminal 40 includes a PU 42 and a storage device 44. The PU 42 is a software processing device such as a CPU and a GPU. The storage device 44 may be an electrically non-rewritable non-volatile memory. Alternatively, the storage device 44 may be an electrically rewritable non-volatile memory or a storage medium such as a disk medium.

[0012] The terminal 40 operates the robot hand 30 and the measuring device 10 to measure the film thickness of the adhesive 20. The terminal 40 operates the cutting machine 50 to cut the adhesive based on the film thickness data obtained by the measurement. Such processing by the terminal 40 is realized by the PU 42 executing a program stored in the storage device 44.

[0013] Part of the Manufacturing Process Figures 2 and 3 show the steps of a part of the process for bonding an outer panel to a frame part of an aircraft.

[0014] 2 and 3, the PU 42 first operates the cutting machine 50 to cut out a sheet of adhesive (film adhesive) into a predetermined pattern (S10). The film adhesive is made of a thermosetting resin. If the PU 42 has not yet gone through step S44 (described later), it may simply set the predetermined pattern based on design data for the frame components and the outer panels, for example.

[0015] Next, the film adhesive cut out in step S10 is placed between the frame component and the outer panel (S12). This step may be performed by a worker, for example. Figure 4 illustrates step S12.

[0016] As shown in Figure 4, the adhesive 20 is disposed between the outer panel 60 and the frame component 62 via release sheets 64, 66. The release sheets 64, 66 are sheet-like members that are not adhered to the adhesive 20. The material of the release sheets 64, 66 may be, for example, fluororesin. The release sheet 64 prevents adhesion between the outer panel 60 and the adhesive 20. The release sheet 66 also prevents adhesion between the adhesive 20 and the frame component 62.

[0017] Returning to FIG. 2 , after the outer panel 60 and the frame component 62 are covered with the bag sheet, the inside of the bag sheet is evacuated (S14). This bag sheet covering process may be performed by a worker. Alternatively, the bag sheet covering process may be automated by a robot. Then, the adhesive 20 is cured in an autoclave (S16).

[0018] A film template is also produced in which positions on the adhesive 20 where the film thickness is to be measured are marked (S18). Fig. 5 shows an example of a film template 70. As an example, holes 72 are formed in the film template 70 at the positions where the film thickness is to be measured.

[0019] The marking locations may be set by a computer, for example, by referring to design data of the outer panel 60 and the frame component 62. In this case, the step of S18 may be automatically executed by automatic control of a device that punches holes in the film member.

[0020] Returning to Fig. 2, the PU 42 creates a two-dimensional code (part information two-dimensional code) having information about the application part of the adhesive 20 (S20). For example, if the skeleton part 62 is a port rudder stringer, the two-dimensional code has information specifying the adhesive part of the port rudder stringer on the outer panel 60 as the application part. Also, if the skeleton part 62 is a part of a tail unit, the two-dimensional code has information specifying whether the adhesive part is part of the upper surface or the lower surface of the outer panel 60, in addition to information about whether it is part of the left or right tail unit.

[0021] The PU 42 also creates, at different positions on the film template, two-dimensional codes (two-dimensional codes for posture recognition) that contain information indicating which position of the adhesive 20 the code is at (S22).

[0022] The two-dimensional code created in steps S20 and S22 is attached to the film template 70 (S24). Fig. 6 shows the completion of step S24. As shown in Fig. 6, a two-dimensional code 76 for body part information is attached to the center of the film template 70. In addition, two-dimensional codes 74 for posture recognition are attached to three different corners of the film template 70.

[0023] 2 , the film template 70 is attached to the adhesive 20 (S26). That is, the hardened adhesive 20 is removed from between the outer panel 60 and the frame component 62, which had been facing the adhesive 20 via the release sheet 64, and then the film template 70 is attached to the hardened adhesive 20.

[0024] 7 shows the process of attaching a film template 70 to the cured adhesive 20. This process may be performed manually by an operator, or may be automated using a robot.

[0025] 3 , the PU 42 reads the two-dimensional code 74 for posture recognition using the image captured by the camera 32 (S28). This allows the PU 42 to grasp the placement state of the film template 70. The PU 42 then operates the robot hand 30 to displace the hole 72 in the film template 70 to the position of the probe 12 of the measuring device 10 (S30). The PU 42 then operates the probe 12 of the measuring device 10 to measure the film thickness of the adhesive 20 (S32). Note that in the step of S32, the PU 42 may control the posture of the probe 12 so that the axis of the probe 12 is perpendicular to the surface of the adhesive 20 whose film thickness is to be measured. Incidentally, the axis of the probe 12 is parallel to the direction in which the probe 12 extends and retracts.

[0026] The PU 42 reads the part information two-dimensional code 76 using the image captured by the camera 32 (S34). Then, the PU 32 labels each of the film thickness measurement points to identify its position based on the posture recognition two-dimensional code 74 and the part information two-dimensional code 76 (S36). As a result, each film thickness measurement result of the adhesive 20 is associated with information on which part of the outer panel 60 the film thickness corresponds to.

[0027] Then, the PU 42 superimposes each of the film thickness measurement points of the adhesive 20 on the adhesion points of the outer panel 60 (S38). This step may be, for example, a step of superimposing the film thickness measurement results on the design data of the outer panel 60.

[0028] Next, the PU 42 evaluates the measured film thickness based on the number of film adhesives used at the measured location (S40). Figure 8 shows an example of the relationship between the number of film adhesives and the allowable film thickness range (average film thickness in the figure). Figure 8 shows an example where the film thickness of one film adhesive is assumed to be 0.25 mm.

[0029] For example, when three film adhesives are used, the thickness of the adhesive 20 is expected to be approximately 0.75 mm. When four film adhesives are used, the thickness of the adhesive 20 is expected to be approximately 1.00 mm. Therefore, in this embodiment, the allowable thickness range for four film adhesives is set to be greater than 0.75 mm and equal to or less than 1.00 mm. As a result, the PU 42 evaluates the thickness as normal if the measured thickness of the area where four film adhesives are used is within the range of greater than 0.75 mm and equal to or less than 1.00 mm. On the other hand, the PU 42 evaluates the thickness as abnormal if the measured thickness of the area where four film adhesives are used is greater than 0.75 mm and outside the range of equal to or less than 1.00 mm.

[0030] 3 , if the PU 42 evaluates that the film thickness is normal at all of the measurement locations defined by the film template 70, it determines that the adhesive 20 is acceptable (S42: YES). On the other hand, if the PU 42 evaluates that the film thickness is abnormal at one or more of the measurement locations defined by the film template 70, it determines that the adhesive 20 is unacceptable (S42: NO).

[0031] The PU 42 then changes the shape and number of film adhesives (S44). If the measured film thickness is greater than the allowable film thickness range, the PU 42 determines that the number of film adhesives is insufficient. For example, if the measured film thickness exceeds 1.00 mm in a location where four film adhesives are used, the PU 42 determines that the number of film adhesives is insufficient. That is, the adhesive film thickness in a location where four film adhesives are used should be approximately 1.00 mm. Nevertheless, if the measured film thickness exceeds 1.00 mm, it is considered that the film thickness exceeded 1.00 mm in step S16 due to the inflow of film adhesives that were placed in another location.

[0032] Furthermore, if the measured film thickness is smaller than the allowable film thickness range, PU42 determines that the number of film adhesives is excessive. For example, if the measured film thickness is 0.75 mm or less in a location where four film adhesives are used, PU42 determines that the number of film adhesives is excessive. In other words, the adhesive film thickness in a location where four film adhesives are used should be approximately 1.00 mm. Nevertheless, if the measured film thickness is 0.75 mm or less, it is considered that the film adhesive has leaked to another location in step S16, causing the film thickness to become smaller than 0.75 mm.

[0033] The PU 42 reduces the number of film adhesives in a location where it is determined that the number of film adhesives is excessive, and also increases the number of film adhesives in a location where it is determined that the number of film adhesives is insufficient.

[0034] 9 indicates a location where the film thickness exceeded the allowable range. In such a case, the PU 42 designs a film adhesive 20a in which the location marked with an X is hollowed out.

[0035] The measurement locations marked with a cross on the bottom of Figure 9 are locations where the film thickness is smaller than the allowable film thickness range. In such cases, PU 42 designs film adhesives 20c and 20d with shapes corresponding to the locations marked with a cross. These film adhesives 20c and 20d are placed over film adhesive 20b, which is also provided at measurement locations marked with a circle on the bottom of Figure 9 where the film thickness is within the allowable film thickness range.

[0036] Returning to Fig. 3, when step S44 is completed, the process returns to step S10 in Fig. 2. In step S10 in Fig. 2, PU 42 operates cutting machine 50 according to the shape of the film adhesive set in step S44. PU 42 also prepares the number of film adhesives set in step S44.

[0037] Steps S10 to S44 are repeated until a positive determination is made in step S42. If a positive determination is made in step S42, PU 42 determines the application conditions for the film adhesive (S46). That is, PU 42 determines the shape and number of film adhesives that were determined to be acceptable in step S42 as the shape and number of film adhesives that will actually be used.

[0038] The PU 42 then operates the cutting machine 50 in accordance with the determined application conditions for the film adhesive, thereby preparing the film adhesive to be used for bonding the outer panel 60 and the frame component 62 (S48).

[0039] As a result, the outer panel 60 and the frame component 62 are bonded together by the prepared adhesive (S50). This step corresponds to steps S12 to S16. However, instead of step S12, a step is adopted in which a film adhesive is placed in contact with the outer panel 60 and the frame component 62. In other words, the release sheets 64, 66 are not used.

[0040] Completion of step S50 completes the process of adhesively bonding the skin panels 60 and structural components 62 for one aircraft. The steps shown in FIGS. 2 and 3 are performed for each of the aircraft manufactured. Therefore, the application conditions determined by step S46 for each of the multiple skin panels 60 generally differ from one another. However, if the application conditions determined by step S46 for each aircraft are the same as a result of performing the steps shown in FIGS. 2 and 3 for each aircraft, the process may be modified as follows: That is, the process of adhesively bonding the skin panels 60 and structural components 62 using the stable application conditions is performed without performing a film thickness inspection using a sample. However, the appropriateness of the application conditions employed is monitored by performing the steps shown in FIGS. 2 and 3 on selected aircraft.

[0041] "Actions and Effects of the Present Embodiment" Prior to bonding the outer panel 60 and the frame components 62, a film adhesive is placed between the outer panel 60 and the frame components 62 via release sheets 64, 66. After the film adhesive hardens, a film template 70 is attached to the adhesive 20, which is a single mass of film adhesive. If the adhesive 20 is removed after the hardening process without bonding the outer panel 60 and the frame components 62, cracks are likely to occur in the adhesive 20 due to thermal shrinkage during the hardening process. In contrast, in the present embodiment, the film thickness is measured with the film template 70 attached to the adhesive 20. Therefore, in the film thickness measurement process, the adhesive 20 can be reinforced by the film template 70, which prevents cracks from interfering with the measurement process.

[0042] The film template 70 also has a plurality of holes 72. The holes 72 are positioned by a computer based on the design data of the outer panel 60, etc. This reduces the number of marking steps compared to marking the adhesive 20 itself with a pen or the like after the curing process. Marking the adhesive 20 itself requires re-marking each time the curing process is completed after returning to step S10 via step S44, which requires a significant amount of work time. Furthermore, because the outer panel 60 and the frame components 62 are mass-produced products, marking the adhesive 20 itself after the curing process requires marking each individual component. Therefore, not only is there a huge number of marking locations for each component, but marking each component individually also requires a significant amount of work time.

[0043] According to the present embodiment described above, the following further actions and effects can be obtained: (1) The measurement device 10 is provided with a plurality of probes 12. This allows film thicknesses at a plurality of measurement points to be measured simultaneously.

[0044] (2) The pair of probes 12 used for measuring one location are arranged independently of each other. This reduces restrictions on the size of the measurement target, compared to when a C-shaped micrometer is used.

[0045] <Correspondence> The correspondence between the matters in the above embodiment and the matters described in the "Notes" section below is as follows. Below, the correspondence is shown for each number of the solution means described in the "Notes" section. [1, 7, 9] The placement process corresponds to the process of S12 and the process shown in FIG. 4. The first member corresponds to the outer panel 60. The second member corresponds to the skeletal part 62. The hardening process corresponds to the process of S16. The pasting process corresponds to the process of S24. The measurement process corresponds to the process of S32. [2] The location information storage unit corresponds to the part information two-dimensional code 76. [3] The position storage unit corresponds to the posture recognition two-dimensional code 74. [4] The position reading process corresponds to the process of executing S28. The displacement process corresponds to the process of executing S30. The acquisition process corresponds to the process of executing S32. The measurement device corresponds to the measurement device 10. The control device corresponds to the terminal 40. The computer corresponds to the terminal 40. [5] The evaluation step corresponds to the step of performing the process of S40. The modification step corresponds to the step of performing the process of S44 and the steps illustrated in Figure 9. [6] The cutting step corresponds to the step of S10. [8] The bonding step corresponds to the step of S50.

[0046] <Other Embodiments> This embodiment can be modified as follows: This embodiment and the following modifications can be combined and implemented within the scope of technical compatibility.

[0047] Regarding the Film: In the above embodiment, holes 72 are provided in the film template 70 to mark the positions where the adhesive film thickness is measured, but this is not limited to this. For example, a colored mark may be added to the film template 70. In this case, the PU 42 may determine the film thickness as the value obtained by subtracting the thickness of the film template 70 from the measurement result obtained by the measurement device 10.

[0048] The marking locations for measuring the thickness of the adhesive on the film template 70 are not limited to a plurality of discrete positions. For example, the marking positions on the film template 70 may be specified by straight lines.

[0049] Regarding the location information storage unit: The location information storage unit is not limited to the two-dimensional location information code 76 attached to the film template 70. For example, it may be a two-dimensional code printed on the film template 70.

[0050] The location information storage unit is not limited to a two-dimensional code. For example, it may be a barcode. The location information storage unit does not necessarily have to represent information using a geometric pattern. For example, the location information storage unit may be an IC chip that stores information about the location to be bonded.

[0051] "Regarding the Position Memory Unit" The locations and number of the position memory units are not limited to the three corners of the film template 70. For example, the position memory units may be arranged at four corners of the film template 70. Furthermore, for example, the position memory units may be arranged at any two locations on the film template 70. Even in this case, for example, if the adhesive 20 is flat, the midpoint of a line segment connecting two position memory units can be used as the origin, and the position on a two-dimensional plane can be defined by the direction parallel to the line segment and the direction perpendicular to the line segment.

[0052] The position storage unit is not limited to the two-dimensional code 74 for posture recognition attached to the film template 70. For example, it may be a two-dimensional code printed on the film template 70.

[0053] The position memory unit is not limited to a two-dimensional code. For example, it may be a barcode. The position memory unit does not necessarily have to represent information using a geometric pattern. For example, the position memory unit may be an IC chip that stores information about the position in the adhesive.

[0054] The position storage unit and the location information storage unit do not necessarily have to be separate components. For example, the two-dimensional code 74 for posture recognition may include information about the location to be bonded.

[0055] Regarding the measuring device: The number of probes 12 provided in the measuring device 10 is not limited to the number illustrated in FIG. 1. It is not essential that the measuring device 10 is a device that measures the film thickness of the adhesive 20 by bringing a pair of probes 12 into contact with both sides of the adhesive 20. For example, the measuring device 10 may be a non-contact sensor. As the non-contact sensor, an optical sensor or an ultrasonic sensor may be used.

[0056] Regarding the measurement process: The measurement process is not limited to a process of measuring the film thickness of the adhesive 20 while displacing the adhesive 20 to which the film template 70 is attached relative to the measuring device 10 using the robot hand 30. For example, the measurement process may be a process of measuring the film thickness of the adhesive 20 while displacing the probe 12 relative to the film template 70 by the robot hand, with the adhesive 20 to which the film template 70 is attached being fixed.

[0057] The measurement process is not limited to an automated process. For example, it may be a process in which a person measures the film thickness using a micrometer or the like. "Regarding the adhesive" The adhesive is not limited to a sheet-like adhesive. In other words, it is not necessary to adjust the film thickness of the adhesive by adjusting the number of sheet-like film adhesives.

[0058] The adhesive does not necessarily have to be thermosetting. The adhesive may be thermoplastic. "Regarding the First Member and the Second Member" The first member does not necessarily have to be the outer panel 60 and the second member does not necessarily have to be the frame component 62. For example, the first member may be a reinforcing member provided between the outer panel 60 and the frame component 62. It is also not necessarily required that at least one of the first member and the second member be the outer panel 60 or the frame component 62.

[0059] The composite material constituting the members bonded with the adhesive 20 is not limited to carbon fiber reinforced resin. For example, it may be glass fiber reinforced resin. It is not essential that both of the two members bonded with the adhesive 20 be composite materials. For example, at least one of the two members may be a metal member.

[0060] The aircraft to be bonded with the adhesive is not limited to mass-produced products. For example, an adhesive used in repairing a single aircraft may be manufactured in the manner described in the above embodiment. The object to be bonded with the adhesive is not limited to an aircraft fuselage or aircraft parts. The object to be bonded with the adhesive may be, for example, a vehicle body.

[0061] Regarding the curing process: Fig. 2 illustrates the curing process as a process of curing the adhesive using an autoclave, but the curing process is not limited to this. For example, a curing oven may be used as a heating device for heating the adhesive. In this case, the curing process may be a process of heating the adhesive in a vacuum state.

[0062] "Regarding the control device" The control device is not limited to one that executes software processing. For example, it may be equipped with a dedicated hardware circuit, such as an ASIC, that executes at least part of the processing executed in the above embodiments. That is, the control device may include a processing circuit having any of the following configurations (a) to (c): (a) A processing circuit that includes a processing device that executes all of the above processing in accordance with a program, and a program storage device, such as a memory device, that stores the program. (b) A processing circuit that includes a processing device and program storage device that executes part of the above processing in accordance with a program, and a dedicated hardware circuit that executes the remaining processing. (c) A processing circuit that includes a dedicated hardware circuit that executes all of the above processing. Here, there may be multiple software execution devices that include a processing device and a program storage device. Also, there may be multiple dedicated hardware circuits.

[0063] Regarding the Computer: The control device and the computer do not necessarily have to be the same component, the terminal 40. The computer is not limited to one that executes software processing. For example, the computer may include a dedicated hardware circuit, such as an ASIC, that executes at least part of the processing executed in the above-described embodiment. That is, the computer may include a processing circuit having any of the following configurations (a) to (c): (a) A processing circuit that includes a processing device that executes all of the above processing in accordance with a program and a program storage device, such as a memory device, that stores the program. (b) A processing circuit that includes a processing device and program storage device that executes part of the above processing in accordance with a program, and a dedicated hardware circuit that executes the remaining processing. (c) A processing circuit that includes a dedicated hardware circuit that executes all of the above processing. Here, there may be multiple software execution devices that include a processing device and a program storage device. There may also be multiple dedicated hardware circuits.

[0064] <Supplementary Notes> The technical ideas that can be understood from the above embodiments and modified examples will be described below. 1. A method for measuring the thickness of an adhesive, comprising a disposing step, a curing step, an attaching step, and a measuring step, wherein the disposing step is a step of disposing an adhesive on the surface of a bonding location between a first member and a second member via a release sheet, the release sheet being a sheet for preventing the first member and the second member from being bonded by the adhesive, the curing step is a step of curing the adhesive, the attaching step is a step of removing the cured adhesive and attaching a film, the film is marked with positions for measuring the thickness of the adhesive, and the measuring step is a step of measuring the thickness of the adhesive at the marked positions.

[0065] According to the above method, the markings on the film attached to the adhesive can be used as a guide to identify the measurement points for the adhesive's film thickness. Therefore, compared to directly marking the measurement points for the film thickness on the adhesive after the curing process, the man-hours required for marking can be reduced. Furthermore, by attaching a film to the adhesive, if cracks occur in the adhesive when it is separated from the first and second members after the curing process, the film can reinforce the adhesive.

[0066] 2. The film thickness measurement method according to claim 1, wherein the film includes a location information storage unit that stores data containing information about the bonding location on the first member. In the method, the location information storage unit in the film makes it possible to identify where on the first member the adhesive to which the film is attached is to be bonded.

[0067] 3. The film thickness measuring method according to claim 1 or 2, wherein the film is provided with position memory units at a plurality of mutually different positions on the adhesive, and the position memory units store data indicating information about the positions.

[0068] In the above method, the position of the film template can be identified by the position memory units arranged at a plurality of different positions, and the positions of the measurement points on the adhesive can be identified.

[0069] 4. The adhesive film thickness measurement method according to claim 3, wherein the measurement step includes a position reading step, a displacement step, and an acquisition step, wherein the position reading step is a step in which a control device reads data from the position memory unit, the displacement step is a step in which the control device operates a robot to displace a probe of a measurement device relative to the adhesive based on the read data, and the acquisition step is a step in which a computer acquires the measurement result of the adhesive film thickness measured by the measurement device when the position of the probe coincides with the marked position in the displacement step.

[0070] In the above configuration, the data stored in the position memory unit is used to displace the probe relative to the adhesive by the robot, thereby automating the process of placing the probe at the location where the film thickness is to be measured.

[0071] 5. The adhesive film thickness measurement method according to any one of items 1 to 4 above, wherein the adhesive disposed in the disposing step is a sheet-like member, the disposing step is a step of disposing one or more sheets of the sheet-like adhesive, and includes an evaluation step and a change step, the evaluation step is a step of causing a computer to execute a process of evaluating that the number of sheets of the adhesive disposed in the disposing step is insufficient if the film thickness measured in the measurement step is greater than an allowable film thickness range corresponding to the number of sheets of the adhesive disposed in the disposing step, and evaluating that the number of sheets of the adhesive disposed in the disposing step is excessive if the film thickness measured in the measurement step is smaller than the allowable film thickness range corresponding to the number of sheets of the adhesive disposed in the disposing step, and the change step is a step of changing the number of sheets of the adhesive disposed in the disposing step.

[0072] The more sheets of adhesive used, the thicker the adhesive film will be after they harden. That is, the thickness of the hardened adhesive film can be adjusted by the number of sheet-like members. Therefore, in the above method, by stacking multiple sheets of adhesive, an adhesive film of an appropriate thickness can be placed in the gap between the first and second members.

[0073] However, if the number of sheets of adhesive is insufficient to fill the gap between the first and second members, adhesive will flow into the gap from other locations and harden. Therefore, in areas where the number of sheets of adhesive is insufficient compared to the appropriate number, the actual film thickness tends to be greater than the film thickness expected from the number of sheets of adhesive applied. In contrast, if the number of sheets of adhesive is excessive compared to the gap between the first and second members, adhesive will flow out from the excess areas to the surrounding area. Therefore, in areas where the number of sheets of adhesive is excessive compared to the appropriate number, the actual film thickness tends to be smaller than the film thickness expected from the number of sheets of adhesive applied.

[0074] Therefore, in the above method, if the actual film thickness falls outside the allowable film thickness range set based on the number of sheets of adhesive, it is possible to identify whether the number of sheets of adhesive is excessive or insufficient based on the relationship between the allowable film thickness range and the actual film thickness.

[0075] 6. The method for measuring a film thickness of an adhesive according to claim 5, further comprising a cutting step of cutting the sheet-like adhesive into a predetermined pattern, and the modifying step including a step of modifying the predetermined pattern.

[0076] In the above method, the changing step makes it possible to precisely adjust the number of sheets of adhesive used to an optimum number for each position on the first member. 7. The adhesive film thickness measurement method according to any one of 1 to 6 above, wherein at least one of the first member and the second member is a carbon fiber reinforced resin member.

[0077] Compared to metal products, carbon fiber reinforced resin members have lower dimensional controllability. Therefore, it is difficult to precisely control the gap between the first and second members. Therefore, it is particularly valuable to measure the thickness of the adhesive film as a measurement sample.

[0078] 8. A method for manufacturing a bonded member, comprising the steps of the adhesive film thickness measurement method described in any one of 5 to 7 above (excluding those not including the feature of 5 above), and a bonding step, wherein the bonding step is a step of bonding the first member and the second member by placing the appropriate number of sheets of adhesive between the first member and the second member and curing the adhesive when the evaluation step evaluates that the number of sheets of adhesive is appropriate at all film thickness measurement locations.

[0079] In the above method, the adhesive can be filled between the first member and the second member without excess or deficiency. 9. The method for manufacturing a bonded member according to the above 8, wherein the first member and the second member are parts of an aircraft.

[0080] REFERENCE SIGNS LIST 10... Measuring device 12... Probe 20... Adhesive 20a, 20b, 20, 20d... Film adhesive 40... Terminal 60... Machine body 62... Part 64, 66... ​​Release sheet 70... Film template 72... Hole 74... Two-dimensional code for posture recognition 76... Two-dimensional code for part information

Claims

1. A method for measuring the thickness of an adhesive, comprising a placement step, a curing step, an attachment step, and a measurement step, wherein the placement step is a step of placing an adhesive on the surface of the bonding point between a first member and a second member via a release sheet, the release sheet being a sheet for preventing the first member and the second member from being bonded together by the adhesive, the curing step is a step of curing the adhesive, the attachment step is a step of removing the cured adhesive and attaching a film, the film is marked with positions for measuring the thickness of the adhesive, and the measurement step is a step of measuring the thickness of the adhesive at the marked positions.

2. The film thickness measuring method according to claim 1, wherein the film is provided with a location information storage section for storing data containing information about the bonding location on the first member.

3. A film thickness measuring method according to claim 1, wherein the film is provided with position memory units at a plurality of different positions on the adhesive, and the position memory units store data indicating information relating to the positions.

4. A method for measuring the thickness of an adhesive film as described in claim 3, wherein the measurement process includes a position reading process, a displacement process, and an acquisition process, wherein the position reading process is a process in which a control device reads data from the position memory unit, the displacement process is a process in which the control device operates a robot to displace the probe of the measuring device relative to the adhesive based on the data read, and the acquisition process is a process in which a computer acquires the measurement result of the adhesive film thickness measured by the measuring device when the position of the probe coincides with the marked position in the displacement process.

5. The adhesive layer thickness measurement method according to claim 1, wherein the adhesive layer placed in the placing step is a sheet-like member, the placing step is a step of placing one or more sheets of the sheet-like adhesive, and the method comprises an evaluation step and a change step, the evaluation step is a step of causing a computer to execute a process of evaluating that the number of sheets of the adhesive layer placed in the placing step is insufficient if the film thickness measured in the measurement step is greater than the allowable film thickness range corresponding to the number of sheets of the adhesive layer placed in the placing step, and evaluating that the number of sheets of the adhesive layer placed in the placing step is excessive if the film thickness measured in the measurement step is less than the allowable film thickness range corresponding to the number of sheets of the adhesive layer placed in the placing step, and the change step is a step of changing the number of sheets of the adhesive layer placed in the placing step.

6. A method for measuring the thickness of an adhesive according to claim 5, further comprising a cutting step, wherein the cutting step is a step of cutting the sheet-like adhesive into a predetermined pattern, and the modifying step includes a step of modifying the predetermined pattern.

7. A method for measuring the thickness of an adhesive film according to claim 1, wherein at least one of the first member and the second member is a carbon fiber reinforced resin member.

8. A method for manufacturing a joining member, comprising the steps of the adhesive film thickness measurement method described in claim 5 and a bonding step, wherein the bonding step is a step of bonding the first member and the second member by placing the appropriate number of sheets of adhesive between the first member and the second member and hardening the adhesive when the evaluation step determines that the number of sheets of adhesive is appropriate at all film thickness measurement locations.

9. A method for manufacturing a joined member according to claim 8, wherein the first member and the second member are parts of an aircraft.

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