Immersion tank for signal integrity measurements

Abstract

A system for testing a computing device is provided. The system includes a container at least partially filled with immersion cooling liquid. The container may interface with a lid attached to a test article rack. The lid includes one or more passthroughs and a test article such as a graphics processing unit (GPU) server is attached to the test article rack. A measurement device such as an oscilloscope is communicatively and / or electronically coupled to the test article, and the measurement device is configured to test one or more operational parameters of the test article including signal integrity.

Description

IMMERSION TANK FOR SIGNAL INTEGRITY MEASUREMENTSCROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] This application claims the priority benefit of U.S. Application No. 63 / 575,335, filed April 5, 2024, the entirety of which is incorporated herein by reference for all purposes.BACKGROUND

[0002] As feature sizes and transistor sizes have decreased for integrated circuits (ICs), the amount of heat generated by a single IC, such as a microprocessor, has increased. ICs that were once air cooled have evolved to ICs needing more heat dissipation than can be provided by air alone. In some cases, immersion cooling of ICs in a tank containing a coolant liquid is employed to maintain ICs at appropriate operating temperatures.

[0003] One type of immersion cooling is two-phase immersion cooling, in which heat from an IC is high enough to boil the coolant liquid. The boiling creates a coolant-liquid vapor in the tank, which is condensed by cooling coils back to liquid form. Heat from the ICs can then be sunk into the liquid-to-gas and gas-to-liquid phase transitions of the coolant liquid. Immersion cooling systems can be very expensive to operate, and system downtime due to equipment malfunction, equipment failure, and signal integrity issues can cost hundreds of thousands or even millions of dollars. Testing components in situ or prior to installation may be difficult due to space or heat dissipation constraints.SUMMARY

[0004] Immersion cooling systems such as two-phase immersion cooling systems enable ever increasing performance of logic ICs such as central processing units (CPUs), graphics processing units (GPUs), and artificial intelligence (Al) accelerators. These logic ICs may generate tremendous amounts of heat that traditional air cooling is insufficient to remove. Signal integrity issues can present a significant impediment to the proper operation these logic ICs, and testing the logic ICs becomes difficult once they are installed in an immersion cooling tank due to limited space and the downtime required to remove the logic ICs from the tank.

[0005] However, testing the logic ICs in open air may present difficulties as they cannot be run at full power in open air due to insufficient heat dissipation. Some signal attenuation and degradation issues may not manifest if the logic ICs are not being run at full power, which increases the likelihood of installing a faulty logic IC, server, or similar computing component.

[0006] Accordingly, the inventors have recognized and appreciated the need for a system that allows for the rapid testing of signal integrity and similar issues for a logic IC and / or server in a test environment that emulates actual operational conditions. The present technology is directed toward a mobile signal integrity testing system including a container having a sealed inner volume capable of holding immersion cooling liquid. The sealed inner volume may enclose a test article such as a CPU or GPU server having one or more logic ICs. The test article may be operated in a manner similar to or the same as it will be operated under design use, and one or more signals, traces, connections, or other portions of the test article may be analyzed for proper operation using one or more test instruments.

[0007] In some aspects, the techniques described herein relate to a system for testing computing components, the system including: a container including an internal volume at least partially filled with an immersion cooling liquid; a lid configured to: interface with the container; and fluidically decouple the internal volume of the container from an ambient atmosphere outside of the container; and a test article rack attached to the lid and configured to hold one or more test articles.

[0008] In some aspects, the techniques described herein relate to a system, wherein the lid includes one or more passthroughs.

[0009] In some aspects, the techniques described herein relate to a system, wherein the lid further includes one or more handles.

[0010] In some aspects, the techniques described herein relate to a system, wherein the lid further includes one or more condenser coils.

[0011] In some aspects, the techniques described herein relate to a system, wherein the container further includes a window.

[0012] In some aspects, the techniques described herein relate to a system, wherein the container is attached to a base frame, the base frame including a plurality of wheels.

[0013] In some aspects, the techniques described herein relate to a system, wherein the plurality of wheels include castors.

[0014] In some aspects, the techniques described herein relate to a system, wherein the container further includes a drain disposed near a bottom of the container.

[0015] In some aspects, the techniques described herein relate to a system, further including a measurement device disposed in the ambient atmosphere outside of the container and communicatively coupled to a probe, the probe disposed within the container.

[0016] In some aspects, the techniques described herein relate to a system, wherein the measurement device is communicatively coupled to the probe through one or more passthroughs disposed in the lid.

[0017] In some aspects, the techniques described herein relate to a system, wherein the measurement device includes one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

[0018] In some aspects, the techniques described herein relate to a system, wherein the container includes a manipulator means configured to enable a physical interaction to be initiated with the one or more test articles from outside of the internal volume when the one or more test articles are disposed in the internal volume.

[0019] In some aspects, the techniques described herein relate to a system, wherein the manipulator means includes a glove box or a robotic manipulator.

[0020] In some aspects, the techniques described herein relate to a method for testing computing components, the method including: disposing a test article at least partially in an immersion cooling liquid in a container, the container including: an internal volume; and a lid that fluidically decouples the internal volume from an ambient atmosphere outside of the container; communicatively coupling the test article to a measurement device disposed in a portion of the ambient atmosphere outside of the container through a passthrough in the lid; assessing a signal integrity associated with the test article using the measurement device; and determining an operational status of the test article based on the signal integrity.

[0021] In some aspects, the techniques described herein relate to a method, further including: causing, by the test article, at least a portion of the immersion cooling liquid to boil and change phase into an immersion cooling vapor; and recondensing, by at least one condenser tube, the immersion cooling vapor into immersion cooling liquid.

[0022] In some aspects, the techniques described herein relate to a method, wherein the at least one condenser tube contains a coolant liquid.

[0023] In some aspects, the techniques described herein relate to a method, wherein the coolant liquid includes deionized water.

[0024] In some aspects, the techniques described herein relate to a method, further including: moving the container using a plurality of wheels attached to the container through a base frame.

[0025] In some aspects, the techniques described herein relate to a method, wherein the plurality of wheels include castors.

[0026] In some aspects, the techniques described herein relate to a method, wherein the measurement device includes one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

[0027] In some aspects, the techniques described herein relate to a method, wherein the measurement device is communicatively coupled to the test article through a probe disposed within the container.

[0028] In some aspects, the techniques described herein relate to a method, wherein the container further includes a manipulator means configured to enable a physical interaction to be initiated with the test article from outside of the internal volume when the test article is disposed in the internal volume.

[0029] In some aspects, the techniques described herein relate to a method, wherein the manipulator means includes a glove box or a robotic manipulator.

[0030] All combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are part of the inventive subject matter disclosed herein. In particular, all combinations of claimed subject matter appearing at the end of this disclosure are part of the inventive subject matter disclosed herein. The terminology used herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The skilled artisan will understand that the drawings primarily are for illustrative purposes and are not intended to limit the scope of the inventive subject matter described herein. The drawings are not necessarily to scale; in some instances, various aspects of the inventive subject matter disclosed herein may be shown exaggerated or enlarged in the drawings to facilitate an understanding of different features. In the drawings, like reference characters generally refer to like features (e.g., functionally similar and / or structurally similar elements).

[0032] FIG. 1 illustrates testing system in accordance with the present technology.

[0033] FIG. 2 illustrates a zoomed in view of a testing system in accordance with the present technology showing an exemplary test article mounted to a test article rack.

[0034] FIG. 3 depicts aspects of an immersion cooling system for dissipating heat from one or more heat-generating components such as semiconductor die packages via immersion cooling.

[0035] FIG. 4 illustrates a flowchart of a method for testing computing components in accordance with the present technology.DETAILED DESCRIPTION

[0036] FIG. 1 illustrates testing system 100 in accordance with the present technology. Testing system 100 may be used to evaluate one or more operational parameters of a test article 150 such as GPU server or CPU head node. Test article 150 may include one or more logic integrated circuits (ICs) configured to perform one or more processes, computations, or data storage functions. For example, a test article 150 in accordance with the present technology may include one or more processors or microprocessors, such as a system-on-a-chip (SoC), three-dimensional integrated circuit (3DIC) stack, central processing unit (CPU), graphics processing unit (GPU), tensor processing unit (TPU), data processing unit (DPU), voltage regulator (VR), high bandwidth memory (HBM), digital signal processor (DSP), artificial intelligence (Al) accelerator, application-specific integrated circuit (ASIC), field- programmable gate array (FPGA), and / or other densely patterned semiconductor die.

[0037] Logic ICs disposed on test article 150 may further include one or more memory modules such as a dynamic random access memory (DRAM), static random access memory (SRAM), flash memory, solid-state memory (SSD), non-volatile random access memory(NVRAM), read-only memory (ROM, such as a floating-gate ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), one-time programmable ROM (OTPROM), or the like), or any suitable type of memory module. A logic IC may include one or more registers, data buffers, inputs and / or outputs (e.g., inter-integrated circuit ports, serial ports, busses, parallel ports, wireless transmitters and receivers, universal serial bus (USB) ports, controller area network (CAN) busses, etc.), sensors (e.g., temperature, voltage, current, or similar sensors), and the like.

[0038] Testing system 100 may include container 110, which may be an immersion cooling tank or similar container. Container 110 may be made of a suitable material such as stainless steel, particularly a material selected for compatibility with immersion cooling fluid. Container 110 may be at least partially filled with immersion cooling liquid. This immersion cooling liquid may form a reservoir into which test article 150 may be placed. Container 110 may have outer dimensions of about 6 inches wide by about 2 feet long by about 4 feet high and be open at the top. Container 110 may be dimensioned to fit an exemplary test article 150 while utilizing a reduced amount of immersion cooling liquid as compared, e.g., to a full-sized immersion cooling tank used for providing on-demand remote computation, which may hold dozens of servers.

[0039] Container 110 may include a drain or drains at the bottom of the container. A drain may allow for a quick removal of old immersion cooling fluid, for example if excess contaminants are introduced as a result of one or more test articles disposed within the immersion cooling fluid.

[0040] Container 110 may further include a viewport such as window 112. Window 112 may allow a technician or other person observe an inner volume of container 110 during operation. Window 112 may provide a visual means for diagnosing an issue detected during a test. For example, a probe 142 may detect that a signal is not being properly transmitted across a wire or similar trace of test article 150. Window 112 may allow a technician to observe the wire or trace in question and determine why a signal may not be transmitted properly across the wire or trace. Window 112 may further allow for the use of a manipulator means (not shown) to interact with test article 150 while it is in container 110. Window 112 may be made of glass, transparent polycarbonate (e.g., acrylic), or other material having suitable transparency and compatibility with immersion cooling liquid.

[0041] A manipulator means in accordance with the present technology may include a glove box and / or robotic manipulator arm. For example, a glove box may include one or more gloves into which a person may insert one or more hands and / or arms. The gloves may enable a person located externally to container 110 (e.g., in an ambient atmosphere outside the container 110) to physically or mechanically interact with an internal volume 114 of container 110 while remaining fluidically decoupled from the immersion cooling liquid contained within container 110. A manipulator means may allow a technician or system operator to reposition a probe during testing, connect or disconnect one or more components before, during, or after testing, reposition an observation device (e.g., a camera, microscope, or similar device disposed within container 110) used to determine a status of test article 150 and / or diagnose a problem with test article 150, initiate a physical interaction with test article 150 from outside of the internal volume 114, or perform other useful actions.

[0042] Additionally or alternatively, a manipulator means may include a robotic arm, which may be controlled through one or more controls external to container 110. For example, a robotic arm may be disposed on a test article rack 130 or an inner surface of container 110. The robotic arm may be communicatively coupled to a joystick, mouse, keyboard, touch screen, or any suitable control mechanism allowing a person or device to transmit one or more inputs and control a motion of the robotic arm. A robotic arm may have any suitable number of degrees of freedom, such as three degrees of freedom, four degrees of freedom, five degrees of freedom, six degrees of freedom, or any suitable number of degrees of freedom.

[0043] A robotic arm may include a plurality of joints and segments that allow a robotic arm to articulate through space and interface with lid 132, e.g., by way of a suitable attachment mechanism such as one or more hooks, eyelets, slots. Additionally or alternatively, a robotic arm may include a suitable end effector configured to mechanically couple to lid 132 and lift or lower the servers into and out of the container 110.

[0044] A robotic arm may include one or more actuators for causing a movement and / or articulation of segments of a robotic arm. For example, a robotic system and / or a robotic arm may include one or more electric actuators, pneumatic actuators, hydraulic actuators, linear actuators, electric motors, or any suitable mechanism for causing a movement of a robotic arm.

[0045] A robotic system may include one or more sensors for controlling the movement and position of a robotic arm. A robotic system may include one or more position sensors, force sensors, torque sensors, proximity sensors, ultrasonic sensors, optical or visual sensors, hapticsensors, current sensors, voltage sensors, temperature sensors, inertial measurement units (IMUs), strain gauges, or the like.

[0046] A robotic system may further include one or more controllers for controlling a movement of a robotic arm. One or more controllers of a robotic system may be communicatively coupled with one or more sensors such as those outlined above. The one or more controllers may operate the robotic arm through the use of actuators of the robotic arm in combination with one or more sensors listed above in order to determine a position relative to one or more components of testing system 100 including container 110 and other components to ensure incidental contact is not made with incorrect portions of testing system 100.

[0047] In an aspect, a robotic system may be disposed on a top of container 110. Additionally or alternatively, a robotic system may be disposed on a side of container 110, on base frame 120, or in any suitable portion of testing system 100.

[0048] Container 110 may be attached to base frame 120. Base frame may provide a wider support than the base of container 110 and increase a stability of testing system 100 relative to a bottom portion of container 110. Base frame 120 may include a plurality of wheels 122 that allow testing system 100 to be transported and / or moved around as needed. In an embodiment, the plurality of wheels 122 may be embodied as castors that are configured to rotate or spin and therefore roll in any direction. Castors may assist with an ease of motion compared to static wheels.

[0049] Testing system 100 may further include a test article rack 130 configured to provide one or more attachment points for a test article 150. Test article rack may be made of stainless steel, copper, aluminum, titanium, polycarbonate, or any suitable material that is compatible with immersion cooling liquid. Test article rack 130 may have the form of a sheet, grid, mesh, or any suitable structure. Test article rack 130 may include one or more holes that act as mounting or attachment points for test article 150. These one or more holes may be open spaces between portions of a sheet, grid, or mesh. Additionally or alternatively, the one or more holes may be particularly shaped, cut, or stamped into test article rack 130, for example to match a hole or mounting pattern in a printed circuit board (PCB) included in test article 150.

[0050] Test article rack 130 may allow test article 150 to be mounted in an orientation matching or substantially analogous to an orientation that test article 150 would have when installed in an environment for which it was designed. This may provide the additional benefit of creating a dynamic environment analogous to one that test article 150 would be exposed to in practice.For example, an orientation of test article 150 may determine which direction vapor bubbles generated by one or more logic ICs will float, which may have an effect on a heat transfer from a different portion of test article 150. In such an example, if the orientation differs significantly from an orientation of test article 150 in normal operation, test article 150 may exhibit different or unrealistic behavior as compared to normal operation and a test may therefore be invalidated.

[0051] Test article rack 130 may be affixed to a lid 132. Lid 132 may be configured to interface with container 110 and fluidically decouple an internal volume 114 of container 110 from an ambient atmosphere outside of container 110 by providing a seal of an open portion of container 110 at the top of container 110. Lid 132 may include a locking mechanism (not shown) and / or may securely interface an open portion of container 110 at the top of container 110 through a tolerance fit such as a press fit.

[0052] Lid 132 may include one or more condenser coils (not shown). The one or more condenser coils may be affixed to an underside of lid 132 such that the condenser coils are disposed within the internal volume 114 of container 110 when lid 132 is attached to or disposed on container 110. The one or more condenser coils may be made of copper, stainless steel, or any suitable material. The one or more condenser coils may be hollow and may contain a coolant liquid such as deionized water. The coolant liquid may circulate through the one or more condenser coils and reduce a temperature of the one or more condenser coils as compared to a lack of circulating coolant liquid.

[0053] Test article 150 may cause at least a portion of the immersion cooling liquid to boil due to excess heat generated by the operation of the test article 150. This portion of the immersion cooling liquid may change phase into an immersion cooling vapor and may rise above the immersion cooling liquid. The immersion cooling vapor may then contact the one or more condenser coils and recondense back into an immersion cooling liquid. The recondensed immersion cooling liquid may subsequently drip back into the reservoir of immersion cooling liquid contained within container 110.

[0054] Lid 132 may further include one or more passthroughs 134. Passthroughs 134 may be circular holes cut in lid 132, or may have any suitable shape including ovular, square, oblong, or the like. Passthroughs 134 may be used to provide a path for a component such as a cable to extend from the inner volume of container 110 to an exterior environment of container 110. For example, a cable 144 may connect a probe 142 disposed within an internal volume 114 of container 110 to a measurement device disposed externally to the container 110 (e.g., in anambient atmosphere outside container 110). Passthroughs 134 may additionally or alternatively be used to provide power delivery, control and telemetry for particular protocols (e.g., peripheral component interconnect express (PCIe)), or any suitable electrical or communications protocols.

[0055] Passthroughs 134 may include a seal or may interface with a seal disposed on cable 144. For example, a seal included in passthroughs 134 may be a gasket made of rubber or similarly flexible material. Alternatively, a cable 144 may have two distinct portions, one disposed within the internal volume 114 of container 110 and the other disposed in an ambient atmosphere outside of container 110. The two portions may be communicatively coupled through the passthrough, which may be solid and include a wire or similar trace to communicatively couple the two portions of the cable.

[0056] Lid 132 may further include handles 136 configured to allow a person to lift lid 132 (as well as test article rack 130 and any attached test article 150) upwards off of container 110. Additionally or alternatively, a lifting mechanism such as a crane may interface with handles 136 to lift lid 132, test article rack 130, and / or test article 150 out of container 110.

[0057] Testing system 100 may include measurement device 140, which may be configured to analyze one or more operational parameters of test article 150 including signal integrity, connectivity, voltage, current, frequency, or any suitable operational parameter. Measurement device 140 may include one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

[0058] Measurement device 140 or a separate controller (not shown) may transmit one or more operational commands to test article 150 in order to determine if test article 150 is functioning properly. In an embodiment, a separate controller may transmit one or more operational commands to test article 150 and measurement device 140 may then be used to determine if test article 150 operates properly in response to the one or more operational commands by measuring a signal or parameter associated with test article 150.

[0059] For example, measurement device 140 or other controller may transmit one or more commands to the test article 150 to run a built-in self test (BIST) such as a memory BIST, one or more commands to the test article 150 to run a parametric test, one or more commands to the test article 150 to run a functionality test (such as a functional loopback test, a high-speed loopback test, etc.), one or more bios commands to the test article 150, one or more commandsto power cycle the test article 150, one or more commands to report a status of one or more registers of the test article 150, one or more commands causing the test article 150 to report a parameter or measurement such as current, frequency, or voltage, one or more commands causing the test article 150 to run a fault test, one or more commands causing the test article 150 to report a temperature, one or more commands causing the test article 150 to report a value (such as a stored bit value), or any suitable command.

[0060] A probe 142 may include one or more sensors such as a temperature sensor, voltage sensor, current sensor, charge sensor, acoustic sensor, or the like; one or more sockets, inputs, outputs, connectors; one or more power supply connectors; or may simply include a lead (e.g., a piece of copper or other metal) suitable for making electrical and / or communicative contact between test article 150 and measurement device 140. A probe 142 may provide connections for test signals, power, and other stimuli to test article 150. In an embodiment, a probe 142 may be communicatively coupled to automated test equipment (ATE) and provide connections between test article 150 and the ATE.

[0061] In an embodiment, measurement device 140 may include one or more ATEs communicatively coupled to a probe 142 and further communicatively coupled to test article 150 or portion of test article 150 such as a logic IC mounted thereon through one or more additional elements of testing system 100. An ATE is a device configured to quickly test a device or piece of equipment and determine its operational status. An operational status may include a normal status, a fault status, a zero status (when a response is not received or a response signal is zero), an error status, a soft bin, a hard bin, a data log, a pass / fail status, or a result of a data analysis. In an embodiment, measurement device 140 may be used to assess a signal integrity associated with test article 150. An operational status of test article 150 may then be determined based on the signal integrity.

[0062] An ATE may include one or more processors or similar controllers configured to provide or control stimulus signals to a test article 150. The ATE may send test signals and receive responses from a test article 150 through probe 142. An ATE may additionally provide power to any or all elements of testing system 100 and control a power level of a test article 150. An ATE may utilize a Joint Test Action Group (JTAG) standard for testing a test article 150, initiate a start-up or power-up sequence for a test article 150, activate a test mode for a test article 150, test one or more connections and / or components of test article 150 while test article 150 is in a powered-down state, and / or operate the test article 150 through one or more tests.

[0063] A measurement device 140 and / or an ATE in accordance with the present technology may further include one or more computer readable media containing instructions for configuring a processor to perform one or more processes, such as method 400 or any other whole or partial methods, steps, or blocks described herein. A measurement device 140 may include one or more memory modules having instructions thereon in the form of computer program code enabling measurement device 140 to communicate with, operate, and / or send and receive instructions from test article 150.

[0064] For example, computer program code embodied on one or more memory modules of measurement device 140 may cause test article 150 to execute one or more operations such as self-testing routines such as power-on self-testing (POST), boot sequence verification, peripheral device checks, memory checks, power and thermal checks, network connectivity checks, or the like. While test article 150 is performing these routines, measurement device 140 may receive, record, monitor, or otherwise analyze one or more signals received from probe 142 indicating a quality of signals emitted by or transmitted through test article 150. For example, measurement device 140 may receive an indication of a quality of one or more signals transmitted from a head node CPU of test article 150 to a NIC of test article 150. Based on these signals measured by measurement device 140, a user or system (including, but not limited to measurement device 140), may make a determination of a status of test article 150, such as if test article 150 is operating normally, if test article 150 has one or more communications errors, if a signal integrity of one or more components or communications paths of test article 150 are compromised, if one or more logic ICs of test article 150 are partially or wholly faulty, etc.

[0065] Additionally or alternatively, computer program code embodied on one or more memory modules of measurement device 140 may cause measurement device 140 to query test article 150 for one or more status codes indicating a status of test article 150, which may, for example, be generated by one or more self-tests run by test article 150. For example, measurement device 140 may receive a status code indicating normal operation of all systems of test article 150, a status code indicating a fault with one or more components of test article 150, one or more POST error codes, one or more component-specific codes (e.g., indicating a memory failure, a CPU failure, a communications component failure, a low voltage code, an excess temperature code, etc.),

[0066] FIG. 2 illustrates a zoomed in view of testing system 100 showing test article 150 mounted to test article rack 130. Probe 142 may be connected to any suitable portion of testarticle 150 in order to test that portion of test article 150, including one or more memory modules, logic ICs, connectors, input / output ports, wires, traces, leads, or any suitable component. In an embodiment, probe 142 may be or include a connector such as a serial connector, RS-232 connector, USB connector, ethernet connector, or other connector designed to interface with a corresponding input / output port. The corresponding input / output port may allow measurement device 140 to access one or more BIST or similar test protocols and determine an operational status of test article 150.

[0067] FIG. 3 depicts aspects of an immersion cooling system 300 for dissipating heat from one or more heat-generating components such as semiconductor die packages 305 via immersion cooling. Each package 305 can include one or more semiconductor dies that produce heat when the system is in operation. The immersion cooling system 300 in the illustrated example of FIG. 3 is a two-phase immersion cooling system, though the invention may also be implemented in a single-phase immersion cooling system. One or more semiconductor die packages 305 may be tested prior to installation in immersion cooling system 300 using testing system 100 to ensure proper operating function and signal integrity.

[0068] Immersion cooling system 300 includes a container such as tank 320 filled, at least in part, with immersion cooling liquid 364. The immersion cooling system 300 can further include at least one chiller 380 that flows a heat-transfer fluid through at least one condenser tube 370 that is disposed in the tank 320 and headspace 308. Condenser tubes 370 and chiller 380 may be part of a heat exchanger. The packages 305 can be mounted on one or more printed circuit boards (PCBs) 357 that are immersed, at least in part, in the immersion cooling liquid 364. Immersion-cooling system 300 may further include a filter 375 disposed adjacent to the tank 320.

[0069] Filter 375 may include a filtration media, a housing, and a pump configured to force immersion cooling liquid 364 through filter 375 to remove contaminants, particulates, or other impurities that may be added to immersion cooling liquid 364 during use. Filter 375 may be housed outside of tank 320 while being in fluidic communication with immersion cooling liquid 364 in tank 320. Alternatively, filter 375 may be submerged within immersion cooling liquid 364 inside of tank 320.

[0070] Immersion cooling liquid 364 may be a hydrocarbon, a fluoroketone, an oil, or a similar dielectric liquid that will act as an insulator while simultaneously transferring heat from package 305 more efficiently than air. Examples of immersion cooling liquid 364 are Novec™ 649, Novec™ 7000, and Novec™ 7100 produced by 3M™. An exemplaryimmersion cooling liquid 364 used in accordance with embodiments of the present invention may have a dielectric constant baseline value of about 1.8-2 at a frequency of about 1 kHz.

[0071] In an embodiment of the invention, immersion cooling liquid 364 may be considered unacceptably contaminated if the dielectric constant and / or dielectric loss tangent of immersion cooling fluid being used in an immersion cooling system 300 differs by a threshold amount as compared to unused or pure immersion cooling liquid 364. For example, immersion cooling liquid 364 may be considered unacceptably contaminated or degraded if the dielectric constant and / or dielectric loss tangent differs by a threshold of 10% or more as compared to unused or pure immersion cooling liquid 364. In an embodiment, a dielectric constant and / or dielectric loss tangent variation threshold may be 20%, 15%, 5%, 3%, 1%, or any suitable threshold.

[0072] Contamination of the immersion cooling liquid 364 and resulting changes to dielectric constant and / or dielectric loss tangent may alter or negatively impact operation of components within immersion cooling liquid 364 including semiconductor die(s) 350. An altered dielectric constant and / or dielectric loss tangent may result in undesirable cross-talk between components on a PCB, additional noise or reduction in signal strength transmitted along exposed wires of a PCB or semiconductor die(s) 350 submerged in immersion fluid, and / or signal dissipation through the immersion cooling liquid 364. Signal loss may be severe enough that two elements may be effectively represented as being separated by an open circuit despite being physically connected. In an embodiment, a dielectric constant and / or dielectric loss tangent variation threshold may be selected based on an observed or inferred effect on one or more submerged semiconductor die(s) 350. For example, an increase in PCIe bit error rate above an error rate baseline may be correlated with an increase in dielectric constant and / or dielectric loss tangent above a dielectric constant and / or dielectric loss tangent baseline. Accordingly, operation of semiconductor die(s) 350 may be throttled or suspended when a dielectric constant and / or dielectric loss tangent of immersion cooling liquid 364 exceeds a predetermined threshold.

[0073] Changes to dielectric constant and / or dielectric loss tangent may be caused by contaminants within immersion cooling liquid 364. In some cases, changes to dielectric constant and / or dielectric loss tangent may be reversed by filtering the contaminants from immersion cooling liquid 364. In some embodiments, upon detecting an increase in dielectric constant and / or dielectric loss tangent of immersion cooling liquid 364, controller 302 may instruct filter 375 to increase filtration throughput or notify a user that an immersion coolingliquid 364 filtration media may need to be replaced. If a dielectric constant and / or dielectric loss tangent exceeds a predetermined threshold, controller 302 may throttle or shut down one or more semiconductor die(s) 350, generate a notification that immersion cooling liquid 364 should be replaced, trigger an alarm, etc. A probe 142 in accordance with the present technology may additionally or alternatively measure dielectric constant and / or dielectric loss tangent in accordance with the above.

[0074] Further examples of sensors and methods for immersion cooling contamination monitoring may include probes for monitoring immersion cooling liquid parameters such as dielectric constant and dielectric loss tangent, and processors configured to identify trends in sensor data, model immersion cooling system behavior as a function of contamination, and alter operations of immersion cooling systems based on detected levels and / or states of contamination may be found in U.S. Provisional Patent Application 63 / 516,748, filed July 31, 2023 and entitled “Di-Electric Monitoring of Immersion Fluid During Cooling Operation,” the entirety of which is incorporated herein by reference.

[0075] The illustrated example of FIG. 3 is not intended to be to scale. The immersion cooling system 300 may house and provide immersion cooling liquid 364 to tens, hundreds, or even thousands of packages 305. In some cases, the immersion cooling system 300 can be small (e.g., the size of a floor unit air conditioner, approximately 1 meter high, 0.5 meter width, 0.5 meter depth or length). In some implementations, the immersion cooling system can be large (e.g., the size of a van or larger, approximately 2.5 meters high, 2.5 meters width, 4 meters depth or length).

[0076] The immersion cooling system 300 can also include a controller 302 (e.g., a microcontroller, programmable logic controller (PLC), microprocessor, field-programmable gate array, logic circuitry, memory, or some combination thereof) to manage system operation. Controller 302 can perform various system functions such as monitoring temperatures of system components, cooling fluid level, tank access, chiller operation etc. The controller 302 can further issue commands to control system operation such as executing a start-up sequence, executing a shut-down sequence, assigning workloads among the packages, changing cooling fluid level, changing the temperature of the heat-transfer fluid circulated by the chiller 380, etc. In some implementations, controller 302 can include (or itself be) a baseboard management controller (BMC) 304. That is, the BMC 304 may monitor and control all aspects of system operation for the immersion cooling system 300 in addition to monitoring and controlling workloads of the semiconductor dies 350 in the packages 305cooled by the system. The immersion cooling system 300 can also include a network interface controller (NIC 303) to allow the system to communicate over a network, such as a local area network or wide area network. The immersion cooling system 300 can further include a fluid sensor array 390 having a plurality of fluid sensors 310. Fluid sensors 310 may include one or more leak detection sensors at least partially submerged in immersion cooling liquid 364.

[0077] The semiconductor die(s) 350 and can be mounted on and attached to a printed circuit board (PCB) 355 (sometimes referred to as a substrate) in device package 305. The package 305 can be made commercially available as an off-the-shelf (OTS) product. The package 305 can be used for single-phase or two-phase immersion cooling of at least one semiconductor die 350, such as a microprocessor (e.g., a central processing unit (CPU) and / or graphics processing unit (GPU)), voltage regulator (VR), high bandwidth memory (HBM), a digital signal processing (DSP) die, an artificial intelligence (Al) accelerator, an application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), and / or other densely patterned semiconductor die.

[0078] In the two-phase immersion cooling system 300 of FIG. 3, heat flows from the semiconductor die 350 where it is generated into the heat spreader 352. The heat spreader 352 is in thermal contact with an immersion cooling liquid 364 that can flow over and extract heat from the heat spreader 352. The amount of heat delivered by the heat spreader 352 to the immersion cooling liquid 364 is enough to boil the immersion cooling liquid 364 that contacts the heat spreader 352 (creating bubbles 365 and potentially creating froth 367 when bubbles 365 reach the surface of immersion cooling liquid 364). The vapor 366 from the boiled immersion cooling liquid 364 can be cooled and condensed back to liquid droplets 368, for example, by the condenser tube 370. The heat-transfer fluid, such as chilled water, from the chiller 380 can be circulated through the condenser tube 370 to lower the temperature of the condenser tube 370 below the condensation point in the headspace 308 of the tank 320. As a result, vapor 366 condenses on exterior surfaces of the condenser tube 370 and liquid droplets 368 from the condensed vapor can drip and / or flow back to the immersion cooling liquid 364. There may be a plurality of condenser tubes 370 in tank 320 to condense the vapor 366 into droplets. Some or all of the condenser tubes 370 may or may not be located directly over the PCBs 357. Instead, the condenser tube(s) 370 can be located near one or more walls of the tank 320, such that the condenser tube(s) 370 are not directly over the PCBs 357 on which the packages 305 are mounted.

[0079] To improve thermal performance in two-phase immersion cooling system 300, the heat spreader 352 can include a boiling enhancement coating (BEC) on at least one surface. The BEC can be formed from copper or a copper alloy and can be porous, for example, though BECs can take various forms. In some cases, the BEC is a micro porous copper coating having a thickness from approximately or exactly 50 microns to 500 microns thick (which may be produced by electroplating and / or etching). In some implementations, the BEC comprises a mesh copper layer bonded (e.g., via resistance heating) to at least an outer surface of the heat spreader 352. In some cases, the BEC is applied as particulates to at least one smooth surface of the heat spreader 352 and then subsequently sintered to adhere to one another and to the heat spreader 352. The BEC provides an improved surface area to contact the immersion cooling liquid 364 and can increase the heat transfer coefficient from the heat spreader 352 to the immersion cooling liquid 364 by up to a factor of 15 versus a smooth surface on the heat spreader 352. Accordingly, BECs can increase thermal conductivity to, and accelerate the boiling of, the immersion cooling liquid 364.

[0080] Further implementations of boiling enhancement coatings and enclosures are possible. Additional arrangements, applications, and methods of use of boiling enhancement coatings and enclosures, including with semiconductor dies and 3DIC stacks, are described in the below U.S. Patent Applications.

[0081] U.S. Patent Application No. 18 / 327,615, filed June 1, 2023 and entitled "Boiler Enhancement Coatings with Active Boiling Management,” discloses heat spreader and boiling enhancement enclosure architectures thermally and / or mechanically coupled to one or more semiconductor dies or logic ICs that may be used for passive and / or active management of immersion cooling fluid boiling, including through the use of valves to control pressure of boiling immersion cooling fluid within a boiling enhancement chamber, particularly in paragraphs

[0018] -

[0039] and FIGS. 3-5B. The entirety of U.S. Patent Application No. 18 / 327,615 is incorporated herein by reference.

[0082] U.S. Provisional Patent Application No. 63 / 500,167, filed May 4, 2023 and entitled “Direct to Chip Heat Spreader and Boiler Enhancement Coatings for Microelectronics,” discloses heat spreader and BECs thermally and / or mechanically coupled to one or more semiconductor dies, logic ICs, and / or 3DIC stacks, particularly in paragraphs

[0015] -

[0033] and FIGS. 2A-4. BEC form factors may include graphite heat spreader architectures, vapor chambers, heat pipes, copper plates, fins, and the like. BEC form factors may be thermally and / or mechanically coupled to the one or more semiconductor dies, logic ICs, and / or 3DICstacks through a thermally conductive epoxy, and may have varying dimensions relative to a surface to which the semiconductor dies and / or logic ICs are mounted. The entirety of U.S. Provisional Patent Application No. 63 / 500,167 is incorporated herein by reference.

[0083] U.S. Patent Application No. 18 / 460,091, filed September 1, 2023 and entitled “Direct to Chip Application of Boiling Enhancement Coating,” discloses BECs and methods for applying BECs to semiconductor dies, logic ICs, and / or 3DIC stacks in accordance with the present technology. In particular, paragraphs

[0024] -

[0046] and FIGS. 2A-5 disclose embodiments of BEC layers, adhesives, solders, sintering, laser ablation, meshes, and other BECs and BEC application methods. The entirety of U.S. Patent Application No. 18 / 460,091 is incorporated herein by reference.

[0084] U.S. Provisional Patent Application No. 63 / 506,945, filed June 8, 2023 and entitled “Vapor- Shedding Structures for Boiler Plates in Two-Phase Immersion Cooling Systems,” discloses structures that may be thermally and / or mechanically coupled to computing hardware such as one or more semiconductor dies, logic ICs, and / or 3DIC stacks to enable the shedding of immersion cooling vapors generated from the boiling of immersion cooling fluid during operation of the computing hardware. In particular, paragraphs

[0021] -

[0039] and FIGS. 3A-5 disclose vapor-shedding structures including varying porosities, constituent materials, and geometries relative to the computing hardware on which they are mounted. The entirety of U.S. Provisional Patent Application No. 63 / 506,945 is incorporated herein by reference.

[0085] U.S. Provisional Application No. 63 / 513,828, filed July 14, 2023 and entitled “Grinding Apparatuses and Methods for Mechanically Modifying Surfaces of Processors to Promote Boiling of a Coolant Liquid,” discloses methods for creating boiling enhancement modifications to surfaces such as the surfaces of computing hardware such as one or more semiconductor dies, logic ICs, and / or 3DIC stacks, particularly in paragraphs

[0036] -

[0095] and FIGS. 2A-8. For example, grooves, patterns, gouges, trenches, or other structures may be added to a surface or lid of a processor, semiconductor die, logic IC, 3DIC stack component, and / or BEC to encourage nucleation sites for bubbles of immersion cooling vapor to form during a cooling process, thus decreasing the thermal resistance between the processor, semiconductor die, logic IC, and / or 3DIC stack component and the surrounding immersion cooling fluid. The entirety of U.S. Provisional Application No. 63 / 513,828 is incorporated herein by reference.

[0086] U.S. Provisional Patent Application No. 63 / 513,829, filed July 14, 2023 and entitled “Electrical Connector Having a Heater to Facilitate Boiling of a Coolant Liquid to Improve Signal Integrity in Immersion Cooling Environment,” discloses heaters for promoting boiling of immersion cooling fluid near electrical connectors such as connections between components of a 3DIC stack and enable improved impedances at those connectors, particularly in paragraphs

[0019] -

[0052] and FIGS. 1A-3B. The entirety of U.S. Provisional Patent Application No. 63 / 513,829 is incorporated herein by reference.

[0087] U.S. Provisional Patent Application No. 63 / 603,242, filed November 28, 2023 and entitled “Woven Boiler Enhancement Coatings,” provides additional examples of BECs including woven BECs with variable weave patterns, densities, attachment mechanisms, and materials (including copper and tungsten) that may be attached to computing hardware such as one or more semiconductor dies, logic ICs, and / or 3DIC stacks in order to promote more efficient heat transfer and immersion cooling vapor nucleation, particularly in paragraphs

[0031] -

[0055] and FIGS. 3-7. The entirety of U.S. Provisional Patent Application No. 63 / 603,242 is incorporated herein by reference.Example Method

[0088] FIG. 4 illustrates a flowchart of an example method 400 for testing computing components in accordance with the present technology. Method 400 includes blocks 410-440.

[0089] Block 410 includes disposing a test article at least partially in an immersion cooling liquid in a container. The container includes an internal volume and a lid that fluidically decouples the internal volume from an ambient atmosphere outside the container. The lid may include one or more passthroughs, one or more handles, or one or more condenser coils. The container may include one or more windows. The container may be attached to a base frame, the base frame including a plurality of wheels. The plurality of wheels may be castors. The container may further include a drain disposed near the bottom of the container. The container may further include a manipulator means configured to enable a physical interaction to be initiated with the one or more test articles from outside of the internal volume when the one or more test articles are disposed in the internal volume. The manipulator means may include a glove box or a robotic manipulator.

[0090] Block 420 includes communicatively coupling the test article to a measurement device disposed in the ambient atmosphere through the one or more passthroughs in the lid. The measurement device may be communicatively coupled to a probe through the one or morepassthroughs in the lid. The measurement device may include one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer, a digital acquisition device, a frequency counter, or a multimeter.

[0091] Block 430 includes assessing a signal integrity associated with the test article using the measurement device.

[0092] Block 440 includes determining an operational status of the test article based on the signal integrity.

[0093] Method 400 may additionally include blocks 450-470.

[0094] Block 450 includes causing, by the test article, at least a portion of the immersion cooling liquid to boil and change phase into an immersion cooling vapor.

[0095] Block 460 includes recondensing, by at least one condenser tube, the immersion cooling vapor into immersion cooling liquid. The at least one condenser tube may contain a coolant liquid. The coolant liquid may be deionized water or antifreeze.

[0096] Block 470 includes moving the container using a plurality of wheels attached to the container through a base frame.Claim Clauses

[0097] Clause 1. A system for testing computing components, the system comprising: a container comprising an internal volume at least partially filled with an immersion cooling liquid; a lid configured to: interface with the container; and fluidically decouple the internal volume of the container from an ambient atmosphere outside the container; and a test article rack attached to the lid and configured to hold one or more test articles.

[0098] Clause 2. The system of clause 1, wherein the lid comprises one or more passthroughs.

[0099] Clause 3. The system of any of the preceding clauses, wherein the lid further comprises one or more handles.

[0100] Clause 4. The system of any of the preceding clauses, wherein the lid further comprises one or more condenser coils.

[0101] Clause 5. The system of any of the preceding clauses, wherein the container further comprises a window.

[0102] Clause 6. The system of any of the preceding clauses, wherein the container is attached to a base frame, the base frame comprising a plurality of wheels.

[0103] Clause 7. The system of any of the preceding clauses, wherein the plurality of wheels comprise castors.

[0104] Clause 8. The system of any of the preceding clauses, wherein the container further comprises a drain disposed near a bottom of the container.

[0105] Clause 9. The system of any of the preceding clauses, further comprising a measurement device disposed in the ambient atmosphere and communicatively coupled to a probe disposed within the container.

[0106] Clause 10. The system of any of the preceding clauses, wherein the measurement device is communicatively coupled to the probe through one or more passthroughs disposed in the lid.

[0107] Clause 11. The system of any of the preceding clauses, wherein the measurement device comprises one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

[0108] Clause 12. The system of any of the preceding clauses, wherein the container comprises a manipulator means configured to enable a physical interaction to be initiated with the one or more test articles from outside of the internal volume when the one or more test articles are disposed in the internal volume.

[0109] Clause 13. The system of any of the preceding clauses, wherein the manipulator means comprises a glove box or a robotic manipulator.

[0110] Clause 14. A method for testing computing components, the method comprising: disposing a test article at least partially in an immersion cooling liquid in a container, the container comprising: an internal volume; and a lid that fluidically decouples the internal volume from an ambient atmosphere outside the container; communicatively coupling the test article to a measurement device disposed in the ambient atmosphere through a passthrough in the lid; assessing a signal integrity associated with the test article using the measurement device; and determining an operational status of the test article based on the signal integrity.

[0111] Clause 15. The method of clause 14, further comprising: causing, by the test article, at least a portion of the immersion cooling liquid to boil and change phase into an immersion cooling vapor; and recondensing, by at least one condenser tube, the immersion cooling vapor into immersion cooling liquid.

[0112] Clause 16. The method of clause 15, wherein the at least one condenser tube contains a coolant liquid.

[0113] Clause 17. The method of clause 16, wherein the coolant liquid comprises deionized water.

[0114] Clause 18. The method of any of clauses 14-17, further comprising: moving the container using a plurality of wheels attached to the container through a base frame.

[0115] Clause 19. The method of clause 18, wherein the plurality of wheels comprise castors.

[0116] Clause 20. The method of any of clauses 14-19, wherein the measurement device comprises one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

[0117] Clause 21. The method of any of clauses 14-20, wherein the measurement device is communicatively coupled to the test article through a probe disposed within the container.

[0118] Clause 22. The method of any of clauses 14-21, wherein the container further comprises a manipulator means configured to enable a physical interaction to be initiated with the test article from outside of the internal volume when the test article is disposed in the internal volume.

[0119] Clause 23. The method of clause 22, wherein the manipulator means comprises a glove box or a robotic manipulator.Conclusion

[0120] While various inventive embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and / or structures for performing the function and / or obtaining the results and / or one or more of the advantages described herein, and each of such variations and / or modifications is deemed to be within the scope of the inventive embodiments described herein. More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and / or configurations will depend upon the specific application or applications for which the inventive teachings is / are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific inventive embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims andequivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed. Inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and / or method described herein. In addition, any combination of two or more such features, systems, articles, materials, kits, and / or methods, if such features, systems, articles, materials, kits, and / or methods are not mutually inconsistent, is included within the inventive scope of the present disclosure.

[0121] Also, various inventive concepts may be embodied as one or more methods, of which an example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.

[0122] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0123] The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”

[0124] The phrase “and / or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and / or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and / or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and / or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[0125] As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when separating items in a list, “or” or “and / or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of’ or “exactlyone of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.

[0126] As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and / or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.

[0127] In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of’ and “consisting essentially of’ shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.

Claims

CLAIMS1. A system for testing computing components, the system comprising: a container comprising an internal volume at least partially filled with an immersion cooling liquid; a lid configured to: interface with the container; and fluidically decouple the internal volume of the container from an ambient atmosphere outside the container; and a test article rack attached to the lid and configured to hold one or more test articles.

2. The system of claim 1, wherein the lid comprises one or more passthroughs.

3. The system of any of the preceding claims, wherein the lid further comprises one or more handles.

4. The system of any of the preceding claims, wherein the lid further comprises one or more condenser coils.

5. The system of any of the preceding claims, wherein the container further comprises a window.

6. The system of any of the preceding claims, wherein the container is attached to a base frame, the base frame comprising a plurality of wheels.

7. The system of claim 6, wherein the plurality of wheels comprise castors.

8. The system of any of the preceding claims, wherein the container further comprises a drain disposed near a bottom of the container.

9. The system of any of the preceding claims, further comprising a measurement device disposed in the ambient atmosphere and communicatively coupled to a probe disposed within the container.

10. The system of claim 9, wherein the measurement device is communicatively coupled to the probe through one or more passthroughs disposed in the lid.

11. The system of any of claim 9 or 10, wherein the measurement device comprises one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

12. The system of any of the preceding claims, wherein the container comprises a manipulator means configured to enable a physical interaction to be initiated with the one or more test articles from outside of the internal volume when the one or more test articles are disposed in the internal volume.

13. The system of claim 12, wherein the manipulator means comprises a glove box or a robotic manipulator.

14. A method for testing computing components, the method comprising: disposing a test article at least partially in an immersion cooling liquid in a container, the container comprising: an internal volume; and a lid that fluidically decouples the internal volume from an ambient atmosphere outside the container; communicatively coupling the test article to a measurement device disposed in the ambient atmosphere through a passthrough in the lid; assessing a signal integrity associated with the test article using the measurement device; and determining an operational status of the test article based on the signal integrity.

15. The method of claim 14, further comprising: causing, by the test article, at least a portion of the immersion cooling liquid to boil and change phase into an immersion cooling vapor; and recondensing, by at least one condenser tube, the immersion cooling vapor into immersion cooling liquid.

16. The method of claim 15, wherein the at least one condenser tube contains a coolant liquid.

17. The method of claim 16, wherein the coolant liquid comprises deionized water.

18. The method of any of claims 14-17, further comprising: moving the container using a plurality of wheels attached to the container through a base frame.

19. The method of claim 18, wherein the plurality of wheels comprise castors.

20. The method of any of claims 14-19, wherein the measurement device comprises one or more of an oscilloscope, a power meter, a logic analyzer, a vector network analyzer (VNA), a digital acquisition (DAQ) device, a frequency counter, or a multimeter.

21. The method of any of claims 14-20, wherein the measurement device is communicatively coupled to the test article through a probe disposed within the container.

22. The method of any of claims 14-21, wherein the container further comprises a manipulator means configured to enable a physical interaction to be initiated with the test article from outside of the internal volume when the test article is disposed in the internal volume.

23. The method of claim 22, wherein the manipulator means comprises a glove box or a robotic manipulator.

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