Heat dissipation mechanism, main unit, and display system

Abstract

A heat dissipation mechanism, a main unit, and a display system. The heat dissipation mechanism (11) comprises a housing assembly (111) and a heat dissipation assembly (112). The housing assembly (111) comprises a body (1111) and two oppositely arranged arms (1112). The two arms (1112) are respectively arranged on two opposite sides of the body (1111) and define a hanging space (100), and the hanging space (100) is configured to provide clearance for the neck (01) and enable the body (1111) to face a nape area (02). A mounting space (200) is formed in the body (1111), the heat dissipation assembly (112) is arranged in the mounting space (200) and is connected to the housing assembly (111), and the heat dissipation assembly (112) is configured to transfer heat, which is generated by a main control module (12) arranged in the mounting space (200), to the housing assembly (111).

Description

Heat dissipation mechanism, main machine and display system TECHNICAL FIELD

[0001] The present disclosure relates to, but is not limited to, the technical field of display, in particular to a heat dissipation mechanism, a main machine and a display system. BACKGROUND

[0002] With the continuous maturity of technologies such as Augmented Reality (AR), Virtual Reality (VR), Mix Reality (MR) and Extended Reality (XR), more and more users begin to use display systems (hereinafter referred to as display systems) with AR / VR / MR / XR functions for work, entertainment or socializing, and people's requirements for display systems are also getting higher and higher.

[0003] The wearing experience of a display system has always been the focus of users and developers, and in particular, the weight of a head-mounted display device (including but not limited to AR glasses, VR glasses, MR glasses and XR glasses, etc.) is one of the key points of wearing comfort. In order to further reduce the weight of the head-mounted display device on the market, the main control module and the power supply module are usually made into a main control box separately, and the common practice is to place the main control box at the waist.

[0004] In addition, there is also a mainstream wearing method, which is to design the display system as a headband type, and place the power supply module at the back of the head for balancing the weight.

[0005] SUMMARY

[0006] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0007] In one aspect, the present disclosure provides a heat dissipation mechanism, comprising:

[0008] a housing assembly comprising a body and two oppositely arranged arms, the two arms are arranged on opposite sides of the body and enclose a hanging space, the hanging space is arranged to avoid the neck and make the body face the neck region, and the body is provided with a mounting space; and

[0009] a heat dissipation assembly arranged in the mounting space and connected with the housing assembly, the heat dissipation assembly is arranged to transfer the heat generated by the main control module arranged in the mounting space to the housing assembly.

[0010] In some embodiments of the heat dissipation mechanism, the mounting space has a mounting position for mounting the main control module;

[0011] The heat dissipation component comprises a heat dissipation piece, which is located on the side of the mounting position away from the hanging space.

[0012] The heat dissipation piece comprises a plate body and a plurality of spaced fins, the plate body is arranged to face the mounting position, and the plurality of fins are arranged on the side of the plate body away from the mounting position.

[0013] In some embodiments of the heat dissipation mechanism, the side of the plate body facing the mounting position is provided with a heat conduction component and can be attached to the main control module;

[0014] The heat conduction component comprises a filler, which can be filled between the plate body and the main control module, and the thermal conductivity coefficient of the material of the filler is greater than 10 W / (m·k);

[0015] The heat conduction component further comprises a heat conduction piece, which is arranged on the heat dissipation component and partially located on the two arms.

[0016] In some embodiments of the heat dissipation mechanism, the two sides of the plate body are respectively provided with wing plates, the two wing plates correspond to the two arms one by one, and are deflected to the corresponding arms;

[0017] The heat conduction piece can be attached to the wing plate and deflected to the arm.

[0018] In some embodiments of the heat dissipation mechanism, the heat dissipation piece further comprises an attachment plate, which is spaced apart from the plate body, the plurality of fins are connected between the attachment plate and the plate body, and the side of the attachment plate away from the plurality of fins can be attached to the shell assembly.

[0019] In some embodiments of the heat dissipation mechanism, the heat dissipation mechanism further comprises a heat equalization component, which is installed in the shell assembly and can surround to form the mounting space, and the side of the heat equalization component away from the mounting space is attached to the shell assembly.

[0020] The horizontal thermal conductivity coefficient of the material of the heat equalization component is greater than or equal to 2000 W / (m·k).

[0021] In some embodiments of the heat dissipation mechanism, the arm has a cavity wall enclosing a receiving cavity, the receiving cavity is arranged to accommodate a power supply module, and the receiving cavity contains a heat equalization piece, and the side of the heat equalization piece away from the receiving cavity is attached to the arm.

[0022] The horizontal thermal conductivity coefficient of the material of the heat equalization piece is greater than or equal to 2000 W / (m·k).

[0023] In some embodiments of the heat dissipation mechanism, a plurality of air outlet holes are arranged on a side of the body away from the mounting space, the plurality of air outlet holes being in communication with the mounting space, and the plurality of air outlet holes being located above a plane perpendicular to the direction of gravity.

[0024] The body is further provided with a plurality of air inlet holes, the plurality of air inlet holes being in communication with the mounting space, and the plurality of air inlet holes being located below the plane.

[0025] In some embodiments of the heat dissipation mechanism, the heat dissipation mechanism further comprises a support assembly, the support assembly being accommodated in the mounting space and arranged on a side of the body facing the area.

[0026] The support assembly comprises a support and a flexible member, the support being arranged on the body, and the flexible member being arranged on a side of the support away from the body.

[0027] In some embodiments of the heat dissipation mechanism, the heat dissipation mechanism further comprises a heat insulation member, the heat insulation member being arranged on a side of the support facing the body.

[0028] In another aspect, the present disclosure further provides a host computer, comprising:

[0029] The heat dissipation mechanism as described above;

[0030] A host control module, the host control module being arranged in the mounting space, the host control module comprising a circuit board and a plurality of chips, the plurality of chips being arranged on a side of the circuit board facing the heat dissipation assembly and connected with the heat dissipation assembly; and

[0031] A power supply module, at least one of the two support arms being provided with the power supply module, the power supply module being arranged to supply power to the host control module.

[0032] In some embodiments of the host computer, the host computer further comprises a plurality of functional units, the plurality of functional units being arranged on the housing assembly and electrically connected with the host control module.

[0033] In another aspect, the present disclosure further provides a display system, comprising:

[0034] The host computer as described above; and

[0035] A head-mounted display device connected with the host control module of the host computer.

[0036] In some embodiments of the display system, at least one first connector is arranged on the host computer, the first connector being connected with the host control module, a second connector being arranged on the head-mounted display device and magnetically connected with the first connector in one-to-one correspondence, and the host control module and the head-mounted display device being connected through the first connector and the second connector.

[0037] Other aspects can become apparent from a review of the drawings and detailed description.

[0038] SUMMARY

[0039] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure, but are not intended to limit the present disclosure.

[0040] Fig. 1 is a structural schematic diagram of a display system in an embodiment of the present disclosure;

[0041] Fig. 2 is a schematic diagram of a host hung on a neck in a display system in an embodiment of the present disclosure;

[0042] Fig. 3 is a schematic diagram of a host connected with a second connector in a display system in an embodiment of the present disclosure;

[0043] Fig. 4 is another perspective schematic diagram of a host connected with a second connector in a display system in an embodiment of the present disclosure;

[0044] Fig. 5 is an exploded structural schematic diagram of a host connected with a second connector in a display system in an embodiment of the present disclosure;

[0045] Fig. 6 is an enlarged structural schematic diagram of part A in Fig. 5;

[0046] Fig. 7 is an enlarged structural schematic diagram of part B in Fig. 5;

[0047] Fig. 8 is an enlarged structural schematic diagram of part C in Fig. 5;

[0048] Fig. 9 is an enlarged structural schematic diagram of part D in Fig. 5;

[0049] Fig. 10 is an enlarged structural schematic diagram of part E in Fig. 5;

[0050] Fig. 11 is another perspective exploded structural schematic diagram of a host connected with a second connector in a display system in an embodiment of the present disclosure;

[0051] Fig. 12 is an enlarged structural schematic diagram of part F in Fig. 11;

[0052] Fig. 13 is an enlarged structural schematic diagram of part G in Fig. 11;

[0053] Fig. 14 is an enlarged structural schematic diagram of part H in Fig. 11;

[0054] Fig. 15 is an enlarged structural schematic diagram of part I in Fig. 11;

[0055] Fig. 16 is an exploded structural schematic diagram of a host connected with a second connector in a display system in another embodiment of the present disclosure;

[0056] Fig. 17 is another perspective view of the exploded structure of the display system of another embodiment of the present disclosure, showing the host connected to the second connector;

[0057] Fig. 18 is an enlarged view of portion J of Fig. 17;

[0058] Fig. 19 is a structural view of the heat dissipation assembly of the display system of another embodiment of the present disclosure;

[0059] Fig. 20 is another perspective view of the heat dissipation assembly of the display system of another embodiment of the present disclosure;

[0060] Fig. 21 is a schematic view of the heat transfer of the heat generated by the mainboard of the display system of another embodiment of the present disclosure;

[0061] Fig. 22 is an exploded view of the host of the display system of yet another embodiment of the present disclosure;

[0062] Fig. 23 is an exploded view of the host of the display system of still another embodiment of the present disclosure;

[0063] Fig. 24 is an exploded view of the host of the display system of still another embodiment of the present disclosure.

[0064] Explanation of reference signs: 01, neck; 02, nape region; 03, proper neck; 10, main machine; 11, heat dissipation mechanism; 111, shell assembly; 1111, body; 1112, support arm; 1113, front shell; 1114, rear shell; 1115, decorative ring; 112, heat dissipation assembly; 1121, heat dissipation piece; 11211, plate body; 112111, boss; 11212, fin; 11213, wing plate; 11214, clamping part; 11215, connecting piece; 11216, fitting plate; 113, heat conduction assembly; 1131, filling piece; 1132, heat conduction piece; 11321, platform surface; 114, heat equalization assembly; 1141, first heat equalization part; 1142, second heat equalization part; 115, heat equalization piece; 116, support assembly; 1161, support; 11611, first frame body; 11612, second frame body; 11613, second positioning part; 1162, flexible piece; 117, heat insulation piece; 12, main control module; 121, circuit board; 122, chip; 123, pressing plate; 124, first connector; 13, power supply module; 14, camera unit; 141, drive board; 142, connecting frame; 15, radio unit; 16, physical button; 161, first button circuit board; 162, indicator light; 17, touch button; 171, second button circuit board; 18, earphone interface; 19, charging interface; 20, head-mounted display device; 21, second connector; 22, external lead; 100, hanging space; 200, mounting space; 201, mounting position; 300, groove; 400, avoidance groove; 500, accommodating cavity; 600, air outlet hole; 700, air inlet hole; 800, through hole; 900, first positioning part; 1000, mounting hole.

[0065] Detailed description

[0066] To make the objectives, technical solutions and advantages of the present disclosure clearer, the following will describe embodiments of the present disclosure in detail with reference to the drawings. Note that the embodiments can be implemented in multiple different forms. One of ordinary skill in the art can easily understand that the manners and contents can be changed into various forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. The embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily without conflict.

[0067] The scale of the drawings in the present disclosure can be used as a reference in the actual process, but is not limited thereto. For example, the width-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted as needed. The number of pixels in the display substrate and the number of sub-pixels in each pixel are also not limited to the number shown in the drawings. The drawings described in the present disclosure are only schematic diagrams, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.

[0068] In the present disclosure, ordinal numbers such as "first", "second", "third" and the like are provided in order to avoid confusion of components, and are not intended to be limiting in terms of number.

[0069] In the present disclosure, for the convenience of explanation, words indicating the orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are used to explain the positional relationship of the components with reference to the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. The positional relationship of the components is appropriately changed according to the direction of describing each component. Therefore, it is not limited to the words explained in the specification, and can be appropriately changed according to the situation.

[0070] In the present disclosure, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be broadly understood. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0071] In the present disclosure, "electrically connected" includes the case where the components are connected together through an element having a certain electrical effect. The "element having a certain electrical effect" is not particularly limited as long as it can perform the transmission of electrical signals between the connected components. Examples of the "element having a certain electrical effect" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, other elements having various functions, and the like.

[0072] In the present disclosure, "parallel" means that the angle formed by two straight lines is -10° or more and 10° or less, and therefore also includes the case where the angle is -5° or more and 5° or less. In addition, "perpendicular" means that the angle formed by two straight lines is 80° or more and 100° or less, and therefore also includes the case where the angle is 85° or more and 95° or less.

[0073] The triangle, rectangle, trapezoid, pentagon or hexagon in the present disclosure is not strictly in the sense that it can be an approximate triangle, rectangle, trapezoid, pentagon or hexagon, etc. There can be some small deformation caused by tolerance, there can be a guide angle, an arc edge and deformation, etc.

[0074] The "about" in the present disclosure means not strictly limited to the limit, allowing the range of process and measurement error values.

[0075] In order to further reduce the weight of the head-mounted display device (including but not limited to AR glasses, VR glasses, MR glasses and XR glasses, etc.) in the market at present, the main control module and the power supply module are usually made into a main control box separately. The common practice at present is to design the main control box to be placed in the waist. The inventor of the present disclosure found that the design of placing in the waist would cause the data line between the main control box and the head-mounted display device to be too long. If high-speed MIPI signals are transmitted, the line length exceeding 40 cm would seriously affect the quality of the MIPI signals. At the same time, the design of placing in the waist would cause uneven weight distribution in the waist, affecting the wearing and use experience.

[0076] The inventor of the present disclosure also found that the head-mounted display system would have a total weight exceeding 500g. Although the ergonomic design of the head-mounted display system is very reasonable and advanced at present, it is still not friendly enough for long-term wearing and use. Therefore, splitting the weight to the neck can be the preferred means to reduce the pressure on the head. In order to reduce the total weight of the head-mounted display system, the capacity of the power supply module of the head-mounted display system is generally small, which can only maintain the endurance of 2 to 3 hours, and cannot meet the entertainment or work needs of all users.

[0077] In addition, the inventor of the present disclosure also noticed that if the main control module and the power supply module and other hardware modules are transplanted into the neck control device, the heat design of the neck control device is a key problem, otherwise it is easy to cause the skin to sweat when wearing, and even long-term wearing may cause skin burns. The human body burn temperature standard: according to the national standard GB / T 18153-200, and the material in contact with the skin is plastic (the material is selected to be plastic in order to reduce the weight of the neck control device), when the contact time is 10 min, the temperature is greater than 48℃, or when the contact time is more than 8h, the temperature is greater than 43℃, which will cause burns to the skin.

[0078] Please combine with FIGS. 1 to 6, 11, 16, 17 and 22 to 24, the present embodiment provides a display system. The display system comprises a host computer 10 and a head-mounted display device 20. The host computer 10 comprises a heat dissipation mechanism 11, a main control module 12 and a power supply module 13.

[0079] The heat dissipation mechanism 11 comprises a shell assembly 111 and a heat dissipation assembly 112. The shell assembly 111 comprises a body 1111 and two oppositely arranged supporting arms 1112. The two supporting arms 1112 are arranged on the opposite sides of the body 1111 respectively and enclose a hanging space 100. The hanging space 100 is arranged to avoid the neck 01 and make the body 1111 face the nape area 02. The upper boundary of the neck 01 is the line connecting the lower edge of the mandible, the posterior edge of the mandibular ramus, the mastoid process and the external occipital protuberance. The lower boundary is the line connecting the upper edge of the sternum, the clavicle, the acromion and the spinous process of the seventh cervical vertebra. The neck 01 is divided into the intrinsic neck 03 in front and the nape area 02 at the back by the anterior edge of the trapezius muscle. The inventors of the present disclosure find that the sensitivity of the neck 01 to weight is not as good as that of the head. If the hardware modules such as the main control module 12 and the power supply module 13 of the display system are transplanted into the host 10, the weight of the head-mounted display device 20 can be reduced, and the user experience will be greatly improved. In the embodiment of the present disclosure, the shell assembly 111 is arranged as above, which can conveniently hang the host 10 on the neck 01, so that the body 1111 faces the nape area 02, and the two supporting arms 1112 can be located in front of the acromion, thereby balancing the gravity of the host 10 and the supporting force of the human body on the host 10, so that the hardware modules such as the main control module 12 and the power supply module 13 can be stably hung on the neck 01 after being transplanted into the host 10.

[0080] The body 1111 is provided with a mounting space 200, and the heat dissipation assembly 112 is arranged in the mounting space 200 and connected with the shell assembly 111. The heat dissipation assembly 112 is arranged to transfer the heat generated by the main control module 12 arranged in the mounting space 200 to the shell assembly 111. In this way, the heat can be transferred to the shell assembly 111 by natural heat dissipation through the arrangement of the heat dissipation assembly 112, so as to avoid the temperature of the main control module 12 being too high to affect the normal work of the main control module 12. In addition, the temperature of the main control module 12 can be reduced to avoid the temperature of the part of the shell assembly 111 close to the main control module 12 being too high to cause burns on the skin. The host 10 adopts natural heat dissipation, which can avoid using active heat dissipation structures such as fans, thereby reducing the cost and avoiding noise generated in the heat dissipation process, thereby improving the user experience.

[0081] The main control module 12 is installed in the mounting space 200, and the main control module 12 comprises a circuit board 121 and a plurality of chips 122. The plurality of chips 122 include but are not limited to main chips, storage chips, power management chips and radio frequency chips, which mainly play the roles of signal transmission, signal conversion and signal processing. In addition, Bluetooth antennas and WIFI antennas can also be arranged on the circuit board 121 to enable the host 10 to have wireless communication function.

[0082] The plurality of chips 122 are arranged on the side of the circuit board 121 facing the heat dissipation assembly 112 and connected with the heat dissipation assembly 112. Since the heat of the main control module 12 mainly comes from the chips 122 during operation, the chips 122 are close to the heat dissipation assembly 112 and connected with the heat dissipation assembly 112, which is conducive to quickly transferring heat to the heat dissipation assembly 112. In the embodiment of the present disclosure, the plurality of chips 122 are arranged on the side of the circuit board 121 away from the hanging space 100, so that when the host computer 10 is hung on the neck 01, the chips 122 can be away from the neck 01, and the heat generated by the chips 122 can also be transferred to the side away from the neck 01 through the heat dissipation assembly 112.

[0083] At least one of the two arms 1112 is provided with a power supply module 13, and the power supply module 13 is arranged to supply power to the main control module 12. The power supply module 13 is arranged on the arm 1112, which can reduce the weight of the shell assembly 111 at the position of the body 1111, avoid the weight at the position of the body 1111 being too large, cause the arm 1112 to be warped, and affect the stability of the host computer 10 hung on the neck 01. Moreover, the power supply module 13 is arranged on the arm 1112 away from the main control module 12, which can avoid the heat generated by the power supply module 13 from being supplied to the main control module 12 and affecting the heat dissipation of the main control module 12.

[0084] In the embodiment of the present disclosure, the two arms 1112 are respectively provided with a power supply module 13 to improve the endurance of the display system, so that the endurance of the display system can reach more than 8 hours. Moreover, the two arms 1112 are respectively provided with a power supply module 13, so that the host computer 10 can be more easily balanced with the human body to ensure the stability of the host computer 10 hung on the neck 01. The connection position of the arm 1112 and the body 1111 has a groove 300, so that the connection position of the arm 1112 and the body 1111 is narrowed, the overall center of gravity of the arm 1112 and the power supply module 13 and other structures mounted on the arm 1112 moves away from the position of the body 1111, so that the host computer 10 part at the position of the arm 1112 can generate greater downward pressure, further improving the stability of the host computer 10 hung on the neck 01. The power supply module 13 can include a battery and a power supply circuit. The battery and the main control module 12 can be connected through the power supply circuit. The battery is selected to be a type with high energy density (power density greater than 600 Wh / kg), and the battery accounts for about 40% to 50% of the weight of the host computer 10, which can support a use endurance of more than 8 hours.

[0085] The head-mounted display device 20 is connected with the host control module 12 of the host 10, so that the head-mounted display device 20 and the host control module 12 can communicate and transmit electric energy. The head-mounted display device 20 can be an AR glasses, a VR glasses, an MR glasses or an XR glasses. By transplanting the hardware modules such as the host control module 12 and the power supply module 13 of the display system into the host 10, the weight of the XR glasses can be greatly reduced, the VR glasses can be reduced to below 100g, and the AR glasses can even be reduced to below 50g.

[0086] In the example embodiment, please refer to FIGS. 5, 6, 11, 16, 17 and 22-24, the mounting space 200 has a mounting position 201 for mounting the host control module 12. The host control module 12 is located in the mounting position 201 and connected with at least one of the housing assembly 111 or the heat dissipation assembly 112, and fixed to the housing assembly 111. In the embodiment of the present disclosure, the host control module 12 is fixed to the housing assembly 111 through the heat dissipation assembly 112, so as to ensure the stability of the connection between the host control module 12 and the heat dissipation assembly 112, and further ensure the stability of the heat transfer between the host control module 12 and the heat dissipation assembly 112.

[0087] The heat dissipation assembly 112 includes a heat dissipation piece 1121. The heat dissipation piece 1121 is located on the side of the mounting position 201 away from the hanging space 100, so as to transfer heat away from the hanging space 100, and avoid the temperature of the part of the housing assembly 111 in contact with the neck 01 being too high. The heat dissipation piece 1121 includes a plate body 11211 and a plurality of spaced fins 11212. The plate body 11211 is arranged to face the mounting position 201, so as to facilitate the plate body 11211 to be attached to the host control module 12, increase the heat exchange area between the heat dissipation piece 1121 and the host control module 12, and ensure the effective transfer of heat. The plurality of fins 11212 are arranged on the side of the plate body 11211 away from the mounting position 201, so as to ensure that the heat dissipation piece 1121 can be effectively attached to the host control module 12 through the plate body 11211, and further increase the heat exchange area between the heat dissipation piece 1121 and the air through the arrangement of the plurality of fins 11212, and improve the heat dissipation effect of the heat dissipation piece 1121. The fins 11212 are located in the mounting space 200, so as to avoid forming fin structures on the outer wall of the housing assembly 111 to improve the heat dissipation effect, which affects the appearance of the host 10. In the embodiment of the present disclosure, the plurality of fins 11212 are all plate structures and parallel to each other, and perpendicular to the plate body 11211. From the fins 11212 located in the middle of the plate body 11211 to the fins 11212 located on both sides of the plate body 11211, the distance from the side of the fins 11212 away from the plate body 11211 to the plate body 11211 gradually decreases. The side of the plurality of fins 11212 away from the plate body 11211 is attached to or equally spaced from the housing assembly 111, and matches the shape of the housing assembly 111. As shown in FIG. 7, the side of the fins 11212 away from the plate body 11211 is arc-shaped.

[0088] In an exemplary embodiment, please refer to FIGS. 6, 16-24, the plate body 11211 is provided with a heat conduction assembly 113 on the side facing the mounting site 201, and can be attached to the main control module 12. In this way, the heat conduction assembly 113 can further improve the heat transfer between the plate body 11211 and the main control module 12.

[0089] The heat conduction assembly 113 includes a filler 1131, which can be filled between the plate body 11211 and the main control module 12 to reduce the gap size between the plate body 11211 and the main control module 12. Since the thermal conductivity of air is 0.024 W / (m·k) at 0℃ and 0.031 W / (m·k) at 100℃, the air entering the gap between the plate body 11211 and the main control module 12 will affect the heat transfer between the plate body 11211 and the main control module 12. In the embodiment of the present disclosure, the thermal conductivity of the material of the filler 1131 is greater than 10 W / (m·k). The material of the filler 1131 includes, but is not limited to, one or a combination of heat-conducting silicone grease, heat-conducting silica gel sheet, heat-conducting silica gel paste, and heat-conducting foam. The filler 1131 can change its own shape according to the gap shape between the plate body 11211 and the main control module 12. In the embodiment of the present disclosure, the material of the filler 1131 is a heat-conducting silica gel sheet. In some embodiments, when there is a need for relative sliding between the plate body 11211 and the main control module 12, the material of the filler 1131 can be heat-conducting foam.

[0090] The heat conduction component 113 further comprises a heat conduction piece 1132 arranged on the heat dissipation component 112 and capable of transferring the heat generated by the main control module 12 to the heat dissipation component 112. In addition, part of the heat conduction piece 1132 is located at the two arms 1112, so that the heat conduction piece 1132 can also transfer the heat to the positions of the arms 1112, thereby increasing the heat transfer distance, increasing the heat dissipation area of the shell assembly 111, avoiding the heat concentration at the position of the main body 1111, reducing the temperature of the main body 1111, and avoiding the local temperature of the shell assembly 111 being too high. In the embodiment of the present disclosure, the heat conduction piece 1132 is a heat pipe, which is a kind of high-efficiency heat transfer element. The heat conduction piece 1132 is in a rod-shaped structure and bends and extends from the connection position with the heat dissipation component 112 to the two arms 1112. The basic principle of the heat pipe is to use the circulation of the liquid in the heat pipe to transfer the heat from the high-temperature area to the low-temperature area. The heat pipe is composed of a vacuum-sealed metal pipe, a working medium and a getter. It contains a certain working medium and getter inside. When one end of the heat pipe is heated, the working medium evaporates to form a high-pressure area, and the getter is forced to flow to the low-pressure area, so that the heat is transferred to the other end of the heat pipe. When the low-pressure area is heated, the working medium is liquefied again to form a liquid high-pressure area, and the getter will flow back to the low-pressure area from the high-pressure area, so that the heat continues to flow. It can be understood that in other embodiments, the heat conduction piece 1132 can also be made of other good heat conductors.

[0091] In the example embodiment, please refer to FIG. 18 and FIG. 20 together, the side of the plate body 11211 facing the mounting position 201 is provided with a boss 112111. The boss 112111 is provided with a avoiding slot 400 avoiding the heat conduction piece 1132. The filler 1131 is arranged on the boss 112111. The boss 112111 can be arranged according to the layout of the plurality of chips 122 on the circuit board 121 and the position of the heat conduction piece 1132 to ensure the clamping force of the plate body 11211 and the chips 122 on the filler 1131.

[0092] The heat conduction piece 1132 is arranged in the avoiding slot 400 and connected with the plate body 11211, and can be integrated by welding. The side of the heat conduction piece 1132 away from the plate body 11211 has a platform surface 11321, which can be arranged corresponding to the position of the main chip to improve the heat transfer efficiency of the main chip. The platform surface 11321 is parallel to the plate body 11211 and coplanar with the side of the boss 112111 away from the plate body 11211, so that the outer convex size of the platform surface 11321 and the boss 112111 relative to the plate body 11211 is consistent, ensuring that the filler 1131 is stably located between the plate body 11211 and the main control module 12, and ensuring the stability of heat transfer.

[0093] In an example embodiment, please refer to FIGS. 18-20, the plate body 11211 is provided with wing plates 11213 on two opposite sides, respectively. The two wing plates 11213 correspond to the two support arms 1112 one by one and are bent towards the corresponding support arms 1112. The heat conduction member 1132 can be attached to the wing plates 11213 and is bent towards the support arms 1112. In this way, through the arrangement of the wing plates 11213, on the one hand, the heat dissipation area of the heat dissipation member 1121 is further increased, and the heat dissipation member 1121 can be attached to the heat conduction member 1132, so that heat is transmitted to the wing plates 11213 through the heat conduction member 1132, and the heat dissipation effect is improved. On the other hand, the wing plates 11213 can provide certain support for the heat conduction member 1132, improve the structural stability of the heat conduction member 1132, and ensure that the heat conduction member 1132 can be stably extended to the support arms 1112. In the example embodiment, the heat dissipation member 1121 and the wing plates 11213 are integrally formed, which can be an extruded aluminum heat sink made of 6063 aluminum alloy. The extruded aluminum process has low cost and can be processed twice to increase the positioning hole and other structures. It can be understood that in other embodiments, the heat dissipation member 1121 and the wing plates 11213 can also be a split structure, and the material can also be other good heat conductors. The thickness of the wing plates 11213 is greater than the thickness of the plate body 11211, and the connection between the wing plates 11213 and the plate body 11211 is thickened to improve the structural strength of the wing plates 11213 and further improve the structural stability of the heat conduction member 1132.

[0094] In an example embodiment, please refer to FIGS. 18 and 20, the wing plates 11213 are provided with clamping portions 11214, and the heat conduction member 1132 is clamped in the clamping portions 11214. In this way, through the arrangement of the clamping portions 11214, the connection area between the wing plates 11213 and the heat conduction member 1132 can be improved, the connection stability can be improved, the heat transfer stability can be improved, and the structural stability of the heat conduction member 1132 can be further ensured. Moreover, the arrangement of the clamping portions 11214 can also facilitate the quick installation between the heat conduction member 1132 and the wing plates 11213, and improve the assembly efficiency. In the example embodiment, the clamping portions 11214 are protruded from the wing plates 11213 and have clamping grooves extending along the heat conduction member 1132.

[0095] In order to further ensure the structural stability of the heat conduction member 1132, the heat conduction member 1132 is provided with a connecting member 11215 connected to the shell assembly 111 at a position away from the heat dissipation member 1121 and close to the support arm 1112, which can avoid the heat conduction member 1132 from shaking and producing abnormal sound during use of the host 10.

[0096] In an exemplary embodiment, as shown in FIG. 22, the heat dissipation member 1121 further comprises a fitting plate 11216, which is spaced apart from the plate body 11211, and the plurality of fins 11212 are connected between the fitting plate 11216 and the plate body 11211, and the side of the fitting plate 11216 facing away from the plurality of fins 11212 can be fitted with the shell assembly 111. The fitting position of the fitting plate 11216 can match the fitting position of the shell assembly 111, so as to be fitted with the shell assembly 111, so that the heat dissipation member 1121 can directly transfer heat to the shell assembly 111. In the embodiment of the present disclosure, the heat dissipation member 1121 is located on the side of the main control module 12 facing away from the hanging space 100. The plate body 11211 faces the main control module 12, and the plurality of fins 11212 are arranged on the side of the plate body 11211 facing away from the mounting position 201, so that the fitting plate 11216 can be fitted with the shell assembly 111 away from the hanging space 100, avoiding direct heat transfer to the part of the shell assembly 111 located in the hanging space 100, reducing the risk of skin burns. The above-mentioned heat dissipation member 1121 in the embodiment of the present disclosure is suitable for low power demand (the total power consumption of the host 10 is less than 3W), and has the advantages of simple structure and convenient assembly.

[0097] In an exemplary embodiment, as shown in FIG. 23, the heat dissipation mechanism 11 further comprises a heat equalizing assembly 114, which is installed in the shell assembly 111 and can surround to form the mounting space 200, and the side of the heat equalizing assembly 114 facing away from the mounting space 200 is fitted with the shell assembly 111, so that the heat equalizing assembly 114 can be fitted with the shell assembly 111 according to the shape of the shell assembly 111, to ensure that heat can be evenly transferred to the shell assembly 111, improve the heat dissipation efficiency of the shell assembly 111, and prevent local overheating of the shell assembly 111. The heat equalizing assembly 114 can be a single-sided adhesive graphene sheet or graphite carbon copper sheet with ultra-high thermal conductivity. The horizontal thermal conductivity of the material of the heat equalizing assembly 114 is greater than or equal to 2000W / (m·k), which can significantly improve the uniform heat dissipation effect of the shell assembly 111 and significantly improve the phenomenon of local temperature overheating. It can be understood that in other embodiments, the way to improve the heat equalizing effect of the shell assembly 111 can also be to spray a high-heat-dissipation coating inside the shell assembly 111. The above-mentioned heat equalizing assembly 114 in the embodiment of the present disclosure is suitable for the case where the total power consumption of the host 10 is less than 5W.

[0098] In the embodiments of the present disclosure, the shell assembly 111 includes a front shell 1113 and a rear shell 1114. The front shell 1113 can enclose the hanging space 100. The rear shell 1114 is arranged on the side of the front shell 1113 away from the hanging space 100. The front shell 1113 and the rear shell 1114 can be connected through a buckle structure to reduce the use of threaded fasteners, and the positions where the threaded fasteners are arranged can be covered by screw plugs to hide the threaded fasteners and not expose them, thereby beautifying the appearance. The uniform heating assembly 114 is accommodated in the space enclosed by the front shell 1113 and the rear shell 1114, and includes a first uniform heating part 1141 attached to the front shell 1113 and a second uniform heating part 1142 attached to the rear shell 1114.

[0099] In the exemplary embodiments, please refer to FIGS. 9, 10, 13, 14, 16, 17, 22-24, the support arm 1112 has a cavity wall enclosing a receiving cavity 500, and the receiving cavity 500 is arranged to accommodate the power supply module 13. The power supply module 13 can be adhered to the support arm 1112 by foam and accommodated in the receiving cavity 500. As shown in FIGS. 16 and 17, the receiving cavity 500 accommodates a uniform heating element 115, and the side of the uniform heating element 115 away from the receiving cavity 500 is attached to the support arm 1112, so that the uniform heating element 115 can be attached to the shell assembly 111 according to the shape of the shell assembly 111, ensuring that heat can be uniformly transmitted to the shell assembly 111 and improving the heat dissipation effect of the power supply module 13. The uniform heating element 115 can be a graphene sheet or a graphite carbon copper sheet with single-sided adhesive and ultra-high thermal conductivity. The thermal conductivity of the material of the uniform heating element 115 in the horizontal direction is greater than or equal to 2000 W / (m·k), which can significantly improve the uniform heat dissipation effect of the shell assembly 111 and significantly improve the phenomenon of local overheating.

[0100] In an exemplary embodiment, as shown in FIG. 24, the body 1111 is provided with a plurality of air outlet holes 600 on the side away from the hanging space 100, the plurality of air outlet holes 600 being in communication with the installation space 200 and being located above the plane perpendicular to the direction of gravity. The body 1111 is also provided with a plurality of air inlet holes 700, the plurality of air inlet holes 700 being in communication with the installation space 200 and being located below the plane. Through the above arrangement of the air outlet holes 600 and the air inlet holes 700, cold air can enter the installation space 200 from the lower air inlet holes 700, and after being heated, the air rises and is discharged from the higher air outlet holes 600, which conforms to the movement law of the heated air, ensures the rapid discharge of hot air and the rapid entry of cold air, and improves the heat dissipation effect of the main machine 10. Moreover, the air outlet holes 600 are located on the side of the body 1111 away from the hanging space 100, so that the air outlet of the air outlet holes 600 does not directly act on the human body, further improving the wearing comfort of the user. In the embodiment of the present disclosure, the air inlet holes 700 are located on the lower side of the body 1111. It can be understood that in other embodiments, the air inlet holes 700 can also be arranged on the side of the body 1111 away from the hanging space 100, reducing the risk of the human body and clothes blocking the air inlet holes 700. The fin 11212 mentioned above can also be arranged according to the air flow path to ensure smooth air flow.

[0101] In an exemplary embodiment, please refer to FIGS. 2-5, 11, 16, 17 and 22-24, the heat dissipation mechanism 11 further comprises a support assembly 116, which is accommodated in the hanging space 100 and is arranged on the side of the body 1111 facing the neck area 02. Through the arrangement of the support assembly 116, the main machine 10 can be supported on the neck area 02, improving the comfort of the contact between the main machine 10 and the neck 01, and the arrangement of the support assembly 116 can also play a heat insulation role, avoiding the direct transmission of heat from the shell assembly 111 to the human body.

[0102] In the example embodiment, please refer to FIG. 8 and FIG. 11, the support assembly 116 includes a bracket 1161 and a flexible piece 1162, the bracket 1161 is arranged on the body 1111, and the flexible piece 1162 is arranged on the side of the bracket 1161 away from the body 1111. The bracket 1161 can ensure the support strength of the support assembly 116 as a whole and maintain the shape of the flexible piece 1162. The bracket 1161 has a certain elastic deformation capacity to adapt to the structure of the neck 01 and improve the comfort of the support assembly 116 supported on the nape area 02. In the embodiment of the present disclosure, the material of the bracket 1161 can be engineering plastic alloy (ABS / PC). The flexible piece 1162 can be a woven fabric to ensure that the flexible piece 1162 is breathable and skin-friendly, and is friendly to direct contact with the skin. The thermal conductivity coefficient of the material of the flexible piece 1162 is less than or equal to 0.05 W / (m·k). In order to further improve the breathability of the support assembly 116, a plurality of through holes 800 are further arranged on the bracket 1161. In addition, the arrangement of the through holes 800 can also improve the elastic deformation capacity of the bracket 1161, and further improve the comfort of the support assembly 116 supported on the nape area 02. The shape of the through holes 800 includes but is not limited to regular patterns such as triangle, rectangle, hexagon, circle, and ellipse, and can also be irregular patterns.

[0103] The bracket 1161 includes a first bracket body 11611 and a second bracket body 11612. The flexible piece 1162 is wrapped on the first bracket body 11611, and then the first bracket body 11611 and the second bracket body 11612 are connected as a whole by bonding, clamping or welding. In the embodiment of the present disclosure, the second bracket body 11612 can be partially embedded in the first bracket body 11611, and by setting the material and size of the first bracket body 11611 and the second bracket body 11612, the softness and hardness of the first bracket body 11611 and the second bracket body 11612 can be changed. For example, the first bracket body 11611 is set to be relatively soft, so that the support is more comfortable. The second bracket body 11612 is set to be relatively hard to ensure the overall strength of the bracket 1161. The first bracket body 11611 is provided with a plurality of curved surfaces according to the physiological structure of the nape area 02 to surround the nape area 02, further improving the comfort. The second bracket body 11612 is set according to the bending degree of the first bracket body 11611 to ensure that the bracket 1161 is overall streamlined and beautiful. The bracket 1161 is set in a split form, and the shape and size of the first bracket body 11611 can also be changed to meet the needs of different users for the comfort of the support assembly 116.

[0104] It can be understood that in other embodiments, the bracket 1161 can also be a one-piece structure.

[0105] In an exemplary embodiment, as shown in FIG. 8, the heat dissipation mechanism 11 further comprises a heat insulation piece 117 arranged on the side of the support 1161 facing the body 1111. In this way, the heat insulation piece 117 can further prevent heat from being transferred from the shell assembly 111 to the support assembly 116, reducing the heat received by the human body through the support assembly 116. The heat insulation piece 117 can be bonded to the support 1161 or the body 1111. The heat insulation piece 117 has a sheet structure and is attached to the second frame body 11612. The material of the heat insulation piece 117 can be heat insulation sponge, which has a thermal conductivity less than 0.1 W / (m·k).

[0106] In an exemplary embodiment, as shown in FIG. 8 and FIG. 10, the shell assembly 111 is provided with a first positioning part 900, and the support 1161 is provided with a second positioning part 11613 which is positioned and matched with the first positioning part 900. In this way, the first positioning part 900 and the second positioning part 11613 can facilitate the quick positioning of the shell assembly 111 and the support 1161, improving the assembly efficiency. One of the first positioning part 900 and the second positioning part 11613 is a groove structure, and the other is a protruding structure. In the embodiment of the present disclosure, the first positioning part 900 is a groove structure. The second positioning part 11613 is a protruding structure.

[0107] The shell assembly 111 and the support 1161 can be connected by magnetic attraction, facilitating the maintenance and replacement of the support assembly 116. The support 1161 and the shell assembly 111 are provided with magnetic attraction pieces. Moreover, the heat insulation piece 117 mentioned above can also play a buffering and heat insulation role during the magnetic attraction connection of the shell assembly 111 and the support 1161, reducing the assembly abnormal sound of the shell assembly 111 and the support 1161.

[0108] In an exemplary embodiment, as shown in FIG. 3, FIG. 4, FIG. 9 to FIG. 11, FIG. 13 to FIG. 15, the host 10 further comprises a plurality of functional units, which are arranged on the shell assembly 111 and electrically connected with the host control module 12. The plurality of functional units include but are not limited to keys, physical interfaces, camera units 14 and radio units 15, etc.

[0109] The keys include physical keys 16 and touch keys 17. The physical keys 16 are arranged on at least one of the two arms 1112 to facilitate a user to control the physical keys 16 after the host 10 is hung on the neck 01. The physical keys 16 include, but are not limited to, a power key, a volume key, a back key, a confirm key, and the like. The host 10 further includes a first key circuit board 161, and the physical keys 16 are capable of controlling the first key circuit board 161 to send a control signal to the circuit board 121. The host 10 further includes an indicator light 162 to prompt whether the power key turns on or off the host 10. The touch keys 17 are arranged on at least one of the two arms 1112 to facilitate a user to control the touch keys 17 after the host 10 is hung on the neck 01. The host 10 further includes a second key circuit board 171, and the touch keys 17 are capable of controlling the second key circuit board 171 to send a control signal to the circuit board 121. For example, an adjustment signal of display brightness of the head-mounted display device 20 can be sent to realize stepless adjustment of the display brightness. The second key circuit board 171 can be a PCB (Printed Circuit Board) circuit board and can be attached to the shell assembly 111. The length of the touch keys 17 can be about 40mm to 50mm, and the width of the touch keys 17 can be about 8mm to 12mm, so that the adjustment sensitivity of the display brightness is moderate and meets the operation requirement of the width of the finger. The length direction of the touch keys 17 can be consistent with the extension direction of the arm 1112. The width direction of the touch keys 17 can be perpendicular to the extension direction of the arm 1112. The first key circuit board 161 and the second key circuit board 171 can be a PCB (Printed Circuit Board) circuit board, a FPC (Flexible Printed Circuit board) circuit board, or a FPCB (Flexible Printed Circuit Board) circuit board.

[0110] The physical interface includes, but is not limited to, a headset interface 18 and a charging interface 19. The arrangement of the headset interface 18 can facilitate a user to use a wired headset. Since there is usually a delay of 40ms to 50ms in a Bluetooth headset, if a game with a higher requirement for delay is experienced, for example, a shooting game, the sensitivity and operability of the operation are affected, and the game experience is reduced. In the embodiment of the present disclosure, the headset interface 18 is a 3.5mm audio interface. The charging interface 19 can be externally connected to a power supply to charge the power supply module 13.

[0111] At least one of the two arms 1112 is equipped with a camera unit 14. The camera unit 14 is connected to the drive board 141 and to the arm 1112 via a connecting bracket 142, with the light-collecting surface of the camera unit 14 exposed to the arm 1112. The connecting bracket 142 strengthens the connection between the camera unit 14 and the drive board 141 and transfers heat generated by the camera unit 14 and the drive board 141 to the arm 1112. Furthermore, in some embodiments, the gaps between the camera unit 14, the drive board 141, and the connecting bracket 142 can be filled with thermally conductive silicone to improve thermal conductivity.

[0112] In the disclosed embodiment, each of the two arms 1112 is provided with a camera unit 14, which can simultaneously capture images to improve accuracy. The camera unit 14 can be a grayscale camera, primarily used for gesture recognition. This allows the host 10 to support interaction through gestures in addition to physical buttons 16 and touch buttons 17.

[0113] In the disclosed embodiment, the two arms 1112 are each provided with a radio unit 15. The dual radio units 15 provide the host 10 with noise reduction, echo cancellation, and automatic gain functions, which can significantly improve communication quality and allow users to communicate more clearly and smoothly.

[0114] In the embodiment of the present disclosure, the first key circuit board 161 and the second key circuit board 171 can both be FPC circuit boards. The indicator light 162, the physical interface, the driver board 141 and the radio unit 15 can also be connected to the circuit board 121 via the FPC circuit board. In order to improve the connection stability between the above-mentioned FPC circuit board and the circuit board 121, the host 10 is also provided with a pressing plate 123, which can press the above-mentioned FPC circuit board against the circuit board 121. Since the structure of the indicator light 162 is relatively small, the FPC circuit board connected to the indicator light 162 can be fixedly connected to the housing assembly 111 to improve the connection stability between the indicator light 162 and the housing assembly 111.

[0115] In the exemplary embodiment, please refer to Figs. 1-5, 7, 11 and 12, the host 10 is provided with at least one first connector 124 connected with the master module 12, and the head-mounted display device 20 is provided with a second connector 21 corresponding to the first connector 124 in magnetic attraction connection, and the master module 12 and the head-mounted display device 20 are connected through the first connector 124 and the second connector 21. Thus, through the magnetic attraction connection of the first connector 124 and the second connector 21, the master module 12 and the head-mounted display device 20 can be quickly connected, the communication connection between the master module 12 and the head-mounted display device 20 is realized, and the master module 12 supplies power to the head-mounted display device 20, so that the host 10 can complete the data processing and power supply functions in cooperation with the head-mounted display device 20. It can be understood that in other embodiments, the master module 12 and the head-mounted display device 20 can also realize communication connection through wireless transmission.

[0116] At least one of the host 10 and the head-mounted display device 20 is further provided with an external wire 22. For example, in the embodiment of the present disclosure, the head-mounted display device 20 is provided with the external wire 22, and the second connector 21 is arranged on the external wire 22, so as to adjust the wearing position of the host 10 and the head-mounted display device 20 within a certain range when the first connector 124 and the second connector 21 are connected, and improve the wearing comfort.

[0117] In the embodiment of the present disclosure, the number of the first connector 124 is two, and correspondingly, the number of the second connector 21 and the external wire 22 is consistent with the number of the first connector 124, forming two sets of communication connection structure and power supply structure. Since the head-mounted display device 20 generally includes two 4K display modules, tracking camera modules, see-through camera modules, distance sensors and gyroscopes, etc., the number of signals between the head-mounted display device 20 and the host 10 is large, and the number of signals is usually greater than 80. The two sets of communication connection structure and power supply structure are arranged, which on the one hand ensures the structural symmetry of the display system, and on the other hand can also avoid the size of a single connector being too large to affect the appearance.

[0118] In the embodiment of the present disclosure, the shell assembly 111 is provided with a mounting hole 1000. The first connector 124 is connected with the circuit board 121 through the FPC circuit board and is mounted in the mounting hole 1000 through the decorative ring 1115. The decorative ring 1115 is sleeved on the first connector 124 and connected with the shell assembly 111 to decorate the mounting hole 1000.

[0119] The second connector 21 includes a POGO PIN, a magnet and a connector circuit board, the POGO PIN is connected with the external wire 22 through the connector circuit board, and the POGO PIN, the magnet and the connector circuit board are wrapped in a connector structure with an outer mold, an inner mold and an LCP (liquid crystal polymer) glue seat, the connector structure is connected with the external wire 22, and the position stability of the POGO PIN, the magnet and the connector circuit board is ensured. The overall outer diameter of the external wire 22 is usually related to the number of internal wires, and is usually between 3.5 mm and 5 mm. The outer wall material of the external wire 22 can be, but is not limited to, TPE (thermoplastic elastomer), TPU (thermoplastic polyurethane elastomer) or PVC (polyvinyl chloride) and the like. The first connector 124 and the second connector 21 are magnetically connected, the communication connection between the host control module 12 and the head-mounted display device 20 is realized, and the host control module 12 supplies power to the head-mounted display device 20. After the display system is used, the host 10 and the head-mounted display device 20 can be separated by directly pulling the external wire 22, and the connection and disconnection operation is very convenient.

[0120] Although the embodiments disclosed in the present disclosure are as above, it should be noted that the above-mentioned embodiments are only exemplary and are not limiting. Therefore, the present disclosure is not limited to the specific embodiments shown and described herein. Various modifications, substitutions or omissions can be made to the forms and details of the embodiments without departing from the scope of the present disclosure.

Claims

1. A heat dissipation mechanism, comprising: The housing assembly includes a body and two oppositely disposed arms, the two arms being respectively disposed on opposite sides of the body and enclosing a hanging space, the hanging space being configured to avoid the neck and allow the body to face the nape area, and an installation space being provided within the body; and A heat dissipation component is arranged in the installation space and connected to the shell component. The heat dissipation component is configured to transfer heat generated by the main control module arranged in the installation space to the shell component.

2. The heat dissipation mechanism according to claim 1, wherein: The installation space has an installation position for installing the main control module; The heat dissipation assembly includes a heat dissipation element, and the heat dissipation element is located on a side of the installation position away from the hanging space; The heat sink includes a plate body and a plurality of fins arranged at intervals. The plate body is arranged facing the installation position, and the plurality of fins are arranged on a side of the plate body away from the installation position.

3. The heat dissipation mechanism according to claim 2, wherein: A heat-conducting component is provided on the side of the plate body facing the mounting position and can be fitted with the main control module; the heat-conducting component includes a filler and a heat-conducting component, the filler being able to be filled between the plate body and the main control module, and the thermal conductivity of the material of the filler is greater than 10W / (m·k); the heat-conducting component is provided on the heat dissipation component and is partially located on the two arms.

4. The heat dissipation mechanism according to claim 3, wherein: Wing plates are respectively provided on two opposite sides of the plate body, and the two wing plates correspond to the two support arms one by one and are bent toward the corresponding support arms; The heat conducting member can be fitted with the wing plate and deflected toward the support arm.

5. The heat dissipation mechanism according to any one of claims 2 to 4, wherein: The heat sink also includes a bonding plate, which is spaced apart from the plate body. The multiple fins are connected between the bonding plate and the plate body. The side of the bonding plate facing away from the multiple fins can be bonded to the shell assembly.

6. The heat dissipation mechanism according to any one of claims 2 to 4, wherein: The heat dissipation mechanism further includes a heat spreader assembly, which is installed in the housing assembly and can enclose the installation space, and the side of the heat spreader assembly facing away from the installation space is in contact with the housing assembly; The thermal conductivity of the material of the heat spreader assembly in the horizontal direction is greater than or equal to 2000 W / (m·k).

7. The heat dissipation mechanism according to claim 6, wherein: The support arm has a cavity wall enclosing a receiving cavity, the receiving cavity is configured to receive the power supply module, the receiving cavity houses a heat spreader, and the side of the heat spreader facing away from the receiving cavity is in contact with the support arm; The thermal conductivity of the material of the heat spreader in the horizontal direction is greater than or equal to 2000 W / (m·k).

8. The heat dissipation mechanism according to any one of claims 2 to 4, wherein: A plurality of air outlet holes are provided on a side of the body facing away from the hanging space, the plurality of air outlet holes are communicated with the installation space, and the plurality of air outlet holes are located above a plane perpendicular to the direction of gravity; The main body is further provided with a plurality of air inlet holes, the plurality of air inlet holes are communicated with the installation space, and the plurality of air inlet holes are located below the plane.

9. The heat dissipation mechanism according to claim 1, wherein: The heat dissipation mechanism also includes a support component, which is accommodated in the hanging space and is arranged on the side of the main body facing the neck area; the support component includes a bracket and a flexible part, the bracket is arranged on the main body, and the flexible part is arranged on the side of the bracket away from the main body.

10. The heat dissipation mechanism according to claim 9, wherein: The heat dissipation mechanism further includes a heat insulating member, which is arranged on a side of the bracket facing the main body.

11. A host comprising: The heat dissipation mechanism according to any one of claims 1 to 10; a main control module installed in the installation space, the main control module including a circuit board and a plurality of chips, the plurality of chips being arranged on a side of the circuit board facing the heat dissipation assembly and connected to the heat dissipation assembly; and A power supply module is provided on at least one of the two arms, and the power supply module is configured to supply power to the main control module.

12. The host according to claim 11, wherein: The host further includes a plurality of functional units, which are arranged in the housing assembly and electrically connected to the main control module.

13. A display system comprising: The host according to claim 11 or 12; and A head-mounted display device is connected to the main control module of the host.

14. The display system according to claim 13, wherein: The host is provided with at least one first connector, which is connected to the main control module. The head-mounted display device is provided with a second connector that is magnetically connected to the first connector in a one-to-one correspondence. The main control module and the head-mounted display device are connected through the first connector and the second connector.

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