Multi-face hermetic package ceramic enclosure, multi-face package device, and manufacturing method

Abstract

The present application belongs to the technical field of ceramic packaging. Provided are a multi-face hermetic package ceramic enclosure, a multi-face package device, and a manufacturing method. The multi-face hermetic package ceramic enclosure comprises a ceramic body which has the shape of a polyhedron, wherein at least one face of the ceramic body is provided with a common bonding pad, while the remaining faces are each provided with a sealing ring, a packaging cavity for packaging a chip being formed in each sealing ring. The ceramic body provided by the present application is a polyhedron, wherein the face provided with the common bonding pad serves as a bottom face, while the remaining faces are each provided with a chip mounting region, a bonding region and a seal ring. During packaging, the bottom face is mounted to a PCB by means of solder ball mounting or direct soldering, and mounting, bonding and sealing of a plurality of chips can be achieved on the side faces, thereby achieving three-dimensional interconnection and multi-face integration; all faces can be used for chip packaging and hermetic sealing can be achieved directly; thus, the present application enables three-dimensional integration of various types of signal chips in a same packaging body, so as to maximize the performance while reducing the device size, thereby providing strong technology support in packaging for the advancement and development of inertial measurement units and multi-signal package units towards higher integration, lighter weight and miniaturization.

Description

Multi-faceted hermetic packaging ceramic housing, multi-faceted packaging device and preparation method

[0001] This patent application claims priority to Chinese Patent Application No. CN202410407599.4, filed on April 7, 2024. The disclosure of the prior application is incorporated by reference in its entirety. TECHNICAL FIELD

[0002] The present application belongs to the technical field of ceramic packaging, and specifically relates to a multi-faceted hermetic packaging ceramic housing, a multi-faceted packaging device and a preparation method. BACKGROUND

[0003] The current ceramic packaging housing only has the function of packaging chips on the front and back surfaces, and cannot meet the needs of semiconductor device integration and miniaturization. TECHNICAL PROBLEM

[0004] The embodiments of the present application provide a multi-faceted hermetic packaging ceramic housing, a multi-faceted packaging device and a preparation method, aiming to realize multi-functional high integration of semiconductor devices, miniaturization and light weight of devices, and maximize performance while reducing device size, to solve the problem that the current ceramic packaging housing cannot meet the needs of semiconductor device integration and miniaturization. TECHNICAL SOLUTION

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is:

[0006] In a first aspect, the present application provides a multi-faceted hermetic packaging ceramic housing, comprising: a ceramic body shaped as a polyhedron; wherein the ceramic body is provided with a common pad on at least one surface, and each of the remaining surfaces is provided with a sealing ring, and a packaging cavity for packaging chips is formed in the sealing ring.

[0007] In an implementable manner in combination with the first aspect, a ceramic strip for bonding the chip is arranged in each of the sealing rings, the ceramic strip is arranged on the surface of the ceramic body, and a bonding finger pattern for bonding the chip is arranged on the ceramic strip; the bonding finger pattern is connected to the common pad through a metallized via in the ceramic body.

[0008] In an implementable manner in combination with the first aspect, the ceramic strip is arranged around the sealing ring to form a ceramic ring; or the ceramic strip is symmetrically arranged on a pair of opposite sides in the sealing ring.

[0009] In a second aspect, the present application further provides a preparation method of a multi-faceted hermetic packaging ceramic housing, for the multi-faceted hermetic packaging ceramic housing, the method comprising:

[0010] A multi-faceted green porcelain body is made, and a metallized through-hole is made on the green porcelain body, and a preset metallized pattern is printed on each facet;

[0011] A green porcelain strip is made, and a metallized through-hole is made on the green porcelain strip, and a preset bonding finger pattern is printed on the green porcelain strip;

[0012] The green porcelain strip is co-fired with each facet of the green porcelain body according to a preset requirement to form a nickel-plated part;

[0013] A sealing ring is welded on the surface corresponding to the nickel-plated part according to a preset requirement;

[0014] Alternatively, the green porcelain body is patterned, sintered, and nickel-plated to form a ceramic body, and the green porcelain strip is patterned, sintered, and nickel-plated to form a ceramic strip;

[0015] Then, the ceramic body, the ceramic strip, and the sealing ring are welded together according to a preset requirement.

[0016] In combination with the second aspect, in an implementable manner, welding a sealing ring on the surface corresponding to the nickel-plated part according to a preset requirement includes:

[0017] After the nickel-plated part is gold-plated, the gold-plated sealing ring is assembled by gold-tin welding.

[0018] In combination with the second aspect, in an implementable manner, welding a sealing ring on the surface corresponding to the nickel-plated part according to a preset requirement includes:

[0019] After the nickel-plated part and the sealing ring are assembled by brazing, gold plating is performed.

[0020] In combination with the second aspect, in an implementable manner, the green porcelain body is patterned, sintered, and nickel-plated to form a ceramic body, including:

[0021] The green porcelain body is sintered once;

[0022] The metallized pattern is printed on each side of the sintered green porcelain body, and the ceramic body is obtained after secondary sintering and nickel plating.

[0023] In combination with the second aspect, in an implementable manner, the ceramic body, the ceramic strip, and the sealing ring are welded together according to a preset requirement, including:

[0024] Silver-copper solder paste is placed on the metallized pattern of each facet of the ceramic body, and the ceramic strip is placed on the solder paste according to the assembly requirement, and gold plating is performed after welding.

[0025] In combination with the second aspect, in an implementable manner, the ceramic body, the ceramic strip, and the sealing ring are welded together according to a preset requirement, including;

[0026] First, the silver copper solder ring is placed on the metallized pattern of each face of the ceramic body, and then the sealing ring is placed on the silver copper solder ring according to the assembly requirements, and gold plating treatment is carried out after welding.

[0027] In a third aspect, the application further provides a multi-face sealed packaging device, comprising the multi-face hermetic packaging ceramic shell, wherein the ceramic body is a hexahedron, one face of which is provided with a solder pad for connecting a PCB, and the remaining five faces are respectively provided with a chip and a sealing ring. Advantages

[0028] The multi-face hermetic packaging ceramic shell, multi-face sealed packaging device and preparation method provided by the application have the following advantages compared with the prior art: the ceramic body is a polyhedron, one face of which is provided with a solder pad as a bottom face, and the remaining faces are respectively provided with a chip mounting area, a bonding area and a sealing ring; during packaging, the bottom face is ball-mounted or directly welded to a PCB, and the side faces can realize the mounting, bonding and sealing of multiple chips, three-dimensional interconnection and multi-face integration, and each face can be packaged with a chip and directly realize hermeticity, so that the packaging area is greatly improved and the module size is reduced.

[0029] Such a shell can be applied to packaging a gyroscope and an accelerometer, can satisfy the three-dimensional integration of multiple types of signal chips in the same packaging body, can maximize the performance while reducing the size of the device, and can provide strong packaging technology support for the upgrading and development of the inertial measurement unit and the multi-signal packaging unit in improving the integration degree, lightening and miniaturization. BRIEF DESCRIPTION OF DRAWINGS

[0030] FIG. 1 is a schematic diagram of the three-dimensional structure of the multi-face hermetic packaging ceramic shell according to the embodiment of the application;

[0031] FIG. 2 is a schematic diagram of the three-dimensional structure of the multi-face hermetic packaging ceramic shell according to the embodiment of FIG. 1 from different visual angles;

[0032] FIG. 3 is a schematic diagram of the three-dimensional structure of the multi-face hermetic packaging ceramic shell according to another embodiment of the application;

[0033] FIG. 4 is a schematic diagram of the three-dimensional structure of the multi-face hermetic packaging ceramic shell according to the embodiment of FIG. 3 from different visual angles;

[0034] FIG. 5 is a process flow chart of the preparation method of the multi-face hermetic packaging ceramic shell according to the first embodiment of the application;

[0035] FIG. 6 is a process flow chart of the preparation method of the multi-face hermetic packaging ceramic shell according to the embodiment of FIG. 5;

[0036] FIG. 7 is another process flow chart of the preparation method of the multi-face hermetic packaging ceramic shell according to the embodiment of FIG. 5;

[0037] FIG. 8 is a process flow chart of the preparation method of the multi-face hermetic packaging ceramic shell according to the second embodiment of the application;

[0038] BRIEF DESCRIPTION OF DRAWINGS

[0039] 1, ceramic body; 2, sealing ring; 3, chip mounting area; 4, ceramic ring; 5, bonding finger pattern; 6, common pad; 7, ceramic strip. Embodiment of the application

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved in the present application more clear and explicit, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and not to limit the present application.

[0041] Please refer to Figs. 1 to 4, now the multi-faceted hermetic packaging ceramic shell provided by the present application will be described. The multi-faceted hermetic packaging ceramic shell comprises a ceramic body 1 in the shape of a polyhedron; wherein the ceramic body 1 is provided with a common pad 6 on at least one face, and a sealing ring 2 is provided on each of the remaining faces, and a packaging cavity for packaging a chip is formed in the sealing ring 2.

[0042] The sealing ring 2 can form a packaging cavity for packaging a chip, and realize hermetic packaging of each face. If the cavity is directly machined on the side face of the ceramic body 1, the machining difficulty is great, the cavity is prone to deformation, the planarity inside the cavity is poor, and the subsequent chip packaging is affected. The structure of the sealing ring 2 can effectively solve the above problems, the sealing ring 2 is welded to the ceramic body 1 by solder, and the machining precision of the metal part is higher, so the overall structural size precision control is better.

[0043] The structure ensures the hermeticity of each face, does not need to be packaged twice, reduces the packaging complexity and the size of the overall system, and also reduces the weight of the device and the production cost.

[0044] The multi-faceted hermetic packaging ceramic shell provided by the present application has a ceramic body 1 in the shape of a polyhedron, one face with a common pad 6 as a bottom face, and each of the remaining faces has a chip mounting area 3, a bonding area, and a sealing ring 2; during packaging, the bottom face is ball-mounted or directly soldered to a PCB board, and the side face can realize mounting, bonding, and sealing of multiple chips, realize three-dimensional interconnection, multi-faceted integration, each face can package a chip and directly realize hermeticity, the packaging area is greatly improved, and the module size is reduced. This type of shell can be applied to packaging gyroscopes and accelerometers, meet the three-dimensional integration of multiple types of signal chips in the same packaging body, reduce the size of the device while maximizing performance, and provide strong packaging technology support for the upgrading and development of inertial measurement units and multi-signal packaging units in improving integration, lightweight, and miniaturization.

[0045] The bottom surface as a shared pad 6 shared by each surface can be a CLGA pad (a CLGA ceramic pad array with a circular pad shape), or a square pad. In application, ball mounting or surface mounting welding can be used to facilitate welding to a PCB.

[0046] The polyhedron as referred to herein refers to a solid surrounded by four or more polygons. The polyhedron has at least 4 surfaces, and the polyhedron is called tetrahedron, pentahedron, hexahedron, etc. according to the number of surfaces. The application preferably has a cube with six surfaces, and can be a regular octahedron, a regular dodecahedron, etc.

[0047] In some embodiments, as shown in FIGS. 3 and 4, a ceramic strip 7 for bonding a chip is arranged in each sealing ring 2, the ceramic strip 7 is arranged on the surface of the ceramic body 1, and the bonding finger pattern 5 for bonding the chip is arranged on the ceramic strip 7; the bonding finger pattern 5 is connected to the shared pad 6 through the metallized via in the ceramic body 1. The extension height of the ceramic strip 7 away from the ceramic body 1 is less than the extension height of the sealing ring 2 away from the ceramic body 1. Each surface of the ceramic body 1 except the bottom surface has a chip mounting area 3, and the bonding finger pattern 5 on the ceramic strip 7 is a bonding area, so that the chip is bonded to form signal communication with the PCB through the bonding finger, the metallized via and the shared pad 6.

[0048] The signal line is mainly located inside the ceramic body 1, the ceramic body 1 is formed by laminating and sintering multiple green ceramic sheets, the side surface metallized pattern of the ceramic body 1 needs to cover at least two green ceramic sheets and be interconnected with the metallized pattern on a certain layer of green ceramic sheet, and the metallized pattern on the green ceramic sheet is connected to the shared pad 6 through the metallized via inside the ceramic body 1. The metallized pattern inside the ceramic body 1 can be linear, curvilinear or polygonal.

[0049] In order to solve the bridging problem caused by solder dispersion due to too small spacing between the metallized patterns on the ceramic strip 7 when the ceramic strip 7 is welded to the ceramic body 1, a groove can be punched by laser between the metallized patterns on the ceramic strip 7 to block the solder dispersion.

[0050] In some embodiments, as shown in FIGS. 1 and 2, the ceramic strip 7 is arranged along the circumference of the sealing ring 2 to form a ceramic ring 4; or the ceramic strip 7 is symmetrically arranged on a pair of opposite sides of the sealing ring 2. The ceramic strip 7 is arranged on each surface of the ceramic body 1 for packaging chips, and a pair of symmetrically arranged ceramic strips 7 can be used as bonding fingers, or the ceramic ring 4 surrounded by the ceramic strips 7 can be used as a bonding finger. The ceramic strip 7 or the ceramic ring 4 can also be a special-shaped structure, which meets the use of bonding chips.

[0051] The ceramic strips 7 need to be placed inside the sealing ring 2, and can be arranged at will in the cavity formed by the sealing ring 2 according to the chip packaging requirements, but cannot be placed outside the sealing ring 2 or interfere with the sealing ring 2, so as to ensure the air tightness after sealing.

[0052] In some embodiments, as shown in FIGS. 1-4, the corners of the sealing ring 2 are all rounded. The rounded design can reduce product surface defects, appropriately disperse stress, improve the tensile, compressive and bending strength of the product, reduce scratches on other components, and increase the durability of the product.

[0053] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.

[0054] Based on the same inventive concept, the embodiments of the present application also provide a preparation method of the multi-face air-tight packaging ceramic shell, which is used for the multi-face air-tight packaging ceramic shell, and the method includes two processing routes, as shown in FIG. 5, and the first processing route is as follows:

[0055] Step one, making a multi-face green ceramic body, and making a metalized through hole and printing a preset metalized pattern on the green ceramic body; specifically, according to the preset packaging requirements of each face, preparing metalized patterns with the same or different shapes, for example, printing a common pad 6 on the surface as the bottom face, and on the other faces, according to the bonding chip condition, making a ring-shaped metalized pattern or a strip-shaped metalized pattern for the welding requirement of the ceramic strip 7 or the ceramic ring 4;

[0056] Step two, making a green ceramic strip, and making a metalized through hole and printing a preset bonding finger pattern 5 on the green ceramic strip;

[0057] Step three, co-firing the green ceramic strip and each face of the green ceramic body into one body according to the preset requirement, and then plating nickel to form a nickel-plated part;

[0058] Step four, welding the sealing ring 2 on the surface corresponding to the nickel-plated part according to the preset requirement.

[0059] It should be noted that for a multi-layer ceramic shell, before sintering, it is a green ceramic part, and after sintering, it is a ceramic part, so in the name, in order to distinguish the products before and after sintering, before sintering, it is called green ceramic, and after sintering, it is called ceramic.

[0060] After the green ceramic strip and each face of the green ceramic body are co-fired into one body in the embodiment, the fourth step of welding the sealing ring 2 on the preset surface of the nickel-plated part has two cases:

[0061] The first case includes that the nickel-plated part is changed into a gold-plated part after gold plating, and is assembled with the gold-plated sealing ring 2 by gold-tin soldering. The complete process flow based on the embodiment is shown in FIG. 6.

[0062] The second case includes that the nickel-plated part is assembled with the sealing ring 2 by soldering first, and then is gold-plated. The complete process flow based on the embodiment is shown in FIG. 7.

[0063] The application adopts two implementation manners for the soldering and co-firing of the nickel-plated part and the sealing ring 2. The preparation of the three-dimensional multi-surface co-fired part of the ceramic body 1 and the ceramic strip 7 or the ceramic ring 4 is completed in the green ceramic sintering stage. Then, in the first implementation manner, the three-dimensional multi-surface co-fired part, that is, the nickel-plated part, is assembled by gold-tin soldering after being gold-plated respectively. Alternatively, in the second implementation manner, the nickel-plated part is assembled with the sealing ring 2 by silver-copper soldering first, and then is gold-plated.

[0064] As shown in FIG. 8, the second processing route of the application is to manufacture the ceramic body monomer, the ceramic strip monomer or the ceramic ring monomer respectively, then weld the ceramic body 1, the ceramic strip 7 / ceramic ring 4 and the sealing ring 2 into one body, and finally perform gold plating treatment. Specifically, the green ceramic body is patterned and sintered and nickel-plated to form the ceramic body 1, which includes:

[0065] Sinter the green ceramic body once;

[0066] Print a metallized pattern on each side of the sintered ceramic body, and then perform secondary sintering to obtain the ceramic body 1 after nickel plating. The complete process flow based on the embodiment is shown in FIG. 8.

[0067] The ceramic body 1 of the application adopts a secondary sintering process. Compared with the conventional ceramic shell which is sintered only once, the size and precision of the side printed pattern can be improved. The method of printing the sintered side of the shell after the first sintering reduces the size shrinkage error caused by the sintering process. After printing, secondary sintering is performed. The sintering temperature of the secondary sintering is lower than that of the first sintering. The effect is to increase the bonding strength of the sintered side printed metallized pattern and the ceramic without causing secondary shrinkage of the shell and changing the size.

[0068] The welding of the ceramic body 1 and the ceramic strip 7 includes: placing silver-copper solder paste on the metallized pattern of each side of the ceramic body 1, and then placing the ceramic strip 7 on the silver-copper solder paste according to the assembly requirements. After welding, gold plating treatment is performed.

[0069] The welding of the ceramic body 1 and the sealing ring 2 includes: placing a silver-copper solder ring on the metallized pattern of each side of the ceramic body 1, and then placing the sealing ring 2 on the silver-copper solder ring according to the assembly requirements. After welding, gold plating treatment is performed.

[0070] The processing of the ceramic strip 7 of the application is carried out according to the conventional ceramic shell processing mode. After silver copper soldering and gold plating of the nickel-plated ceramic body 1 and the ceramic strip 7 / ceramic ring 4 / seal ring 2, the preparation of the multi-surface airtight packaging ceramic shell is completed. The multi-surface high-precision brazing is a process difficulty, and the conventional shell ceramic body and parts are welded by using silver copper solder sheets, which are mostly annular or strip-shaped.

[0071] Since the shell of the application involves multi-surface brazing, the outside is surrounded by the seal ring 2, and the bonding finger pattern 5 on the ceramic strip 7 has an interconnection relationship with the metallized pattern on the ceramic body 1, and the welding width is narrow; therefore, the control of the brazing paste amount, the welding precision and the welding strength have higher requirements. If the conventional solder ring or solder sheet is used, when the ceramic strip 7 / ceramic ring 4 and the ceramic body 1 are welded, the ceramic between the pads is not wetted by the silver copper solder after the solder is melted, and the solder may have solidified before it completely flows to the pad, which easily leads to bridging between the pads. At the same time, the multi-surface welding needs to be put into the furnace for multiple times, which will affect the solder angle, the size of the weld and the like of the welding position, thereby affecting the welding strength between the ceramic strip 7 / ceramic ring 4 and the ceramic part.

[0072] The application realizes high-precision brazing of three-dimensional packaging by combining silver copper solder paste and silver copper solder ring. The appropriate amount of silver copper solder paste is placed on the metallized pad or metallized pattern on the ceramic body 1, and then the ceramic strip 7 is placed on the silver copper solder paste according to the assembly requirements. The seal ring 2 is welded with the annular metallized pattern on the ceramic body 1 through the solder ring. The solder paste can accurately control the amount of solder, and only solidifies in the welding area, which can avoid the problems of bridging and low welding strength caused by solder sheet welding.

[0073] Based on the same inventive concept, as shown in FIGS. 1 to 4, the application also provides a multi-surface packaging device, which comprises the multi-surface airtight packaging ceramic shell, wherein the shape of the ceramic body 1 is a hexahedron, one of the six surfaces is provided with a pad for connecting a PCB, that is, a common pad 6, and the remaining five surfaces are respectively provided with a chip and a seal ring 2. After the remaining five surfaces are bonded with the chips, the cover plate can be welded on the seal ring 2.

[0074] The ceramic shell adopted by the application is a hexahedron, the bottom surface is a pad (CLGA pad or other square pad), and the remaining five surfaces are respectively provided with a chip mounting area 3, a bonding area and a seal ring 2. During packaging, the bottom surface is ball-mounted or directly welded to the PCB, and the side surfaces can realize chip mounting, bonding and sealing of the five surfaces.

[0075] The ceramic shell of the application overcomes the bottleneck of ceramic shell planar packaging, realizes three-dimensional interconnection and multi-surface integration by changing from two-dimensional packaging to three-dimensional packaging, and five surfaces can be packaged with chips and directly realize airtightness. The packaging area is more than 5 times that of the traditional shell, and the module volume can be reduced by more than 50%. The shell can be applied to package gyroscopes and accelerometers, and meet the three-dimensional integration of various types of signal chips in the same packaging body. The performance can be maximized while the device size is reduced, and the inertial measurement unit and multi-signal packaging unit provide strong packaging technology support for the upgrading development of improving integration, light weight and miniaturization.

[0076] The above only describes the preferred embodiments of the application and is not intended to limit the application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the application shall be included in the protection scope of the application.

Claims

1. A multi-faceted hermetic ceramic housing, characterized in that: include: A ceramic body (1) is in the shape of a polyhedron; wherein, at least one side of the ceramic body (1) is provided with a common solder pad (6), and each of the remaining sides is provided with a sealing ring (2), wherein a packaging cavity for packaging a chip is formed in the sealing ring (2).

2. The multi-sided hermetic sealed ceramic housing according to claim 1, wherein: A ceramic strip (7) for bonding the chip is provided in each sealing ring (2), the ceramic strip (7) is provided on the surface of the ceramic body (1), and a bonding finger pattern (5) for bonding the chip is provided on the ceramic strip (7); the bonding finger pattern (5) is connected to the common pad (6) through a metallized through-hole in the ceramic body (1).

3. The multi-faceted hermetic ceramic housing according to claim 2, wherein: The ceramic strips (7) are arranged around the inner periphery of the sealing ring (2) to form a ceramic ring (4); or, the ceramic strips (7) are symmetrically arranged on a pair of opposite sides of the sealing ring (2).

4. A method for preparing a multi-sided hermetic sealed ceramic housing, for preparing the multi-sided hermetic sealed ceramic housing according to any one of claims 1 to 3, characterized in that: The method comprises: Producing a multi-faceted raw porcelain body, making metallized through holes on the raw porcelain body, and printing a preset metallized pattern on each face; Making a green porcelain strip, making metallized through holes on the green porcelain strip, and printing a preset bonding finger pattern (5); According to preset requirements, the green porcelain strip and each surface of the green porcelain body are co-fired into one piece, and then nickel-plated to form a nickel-plated part; Welding a sealing ring (2) on the corresponding surface of the nickel-plated part according to preset requirements; Alternatively, the green ceramic body is patterned, sintered, and nickel-plated to form a ceramic body (1); the green ceramic strip is bonded with a finger pattern (5) and then nickel-plated to form a ceramic strip (7); Then, the ceramic body (1), the ceramic strip (7) and the sealing ring (2) are welded into one body according to preset requirements.

5. The method for preparing a multi-sided hermetic sealed ceramic housing according to claim 4, wherein: Welding a sealing ring (2) on the surface corresponding to the nickel-plated part according to preset requirements includes: After the nickel-plated part is gold-plated, it is assembled with the gold-plated sealing ring (2) by gold-tin welding.

6. The method for preparing a multi-sided hermetic sealed ceramic housing according to claim 4, wherein: Welding a sealing ring (2) on the surface corresponding to the nickel-plated part according to preset requirements includes: The nickel-plated part and the sealing ring (2) are assembled by brazing and then gold-plated.

7. The method for preparing a multi-sided hermetic sealed ceramic housing according to claim 4, wherein: The green ceramic body is patterned, sintered, and nickel-plated to form a ceramic body (1), comprising: The green porcelain body is sintered once; A metallized pattern is printed on each side of a mature ceramic body formed by primary sintering, and then secondary sintering is performed and nickel plating is performed to obtain a ceramic body (1).

8. The method for preparing a multi-sided hermetic sealed ceramic housing according to claim 4, wherein: The ceramic body (1), the ceramic strip (7) and the sealing ring (2) are welded into one body according to preset requirements, including: First, silver-copper solder paste is placed on the metallized patterns on each surface of the ceramic body (1), and then the ceramic strip (7) is placed on the solder paste according to assembly requirements, and gold plating is performed after soldering.

9. The method for preparing a multi-sided hermetic sealed ceramic housing according to claim 4, wherein: The ceramic body (1), the ceramic strip (7) and the sealing ring (2) are welded into one body according to preset requirements, including: First, a silver-copper solder ring is placed on the metallized pattern on each surface of the ceramic body (1), and then a sealing ring (2) is placed on the silver-copper solder ring according to assembly requirements, and gold plating is performed after welding.

10. A multi-sided packaging device, characterized in that: The multi-sided airtight ceramic housing comprises the multi-sided airtight ceramic housing as claimed in any one of claims 1 to 3, wherein the ceramic body (1) is in the shape of a regular hexahedron, one side of which is provided with a pad for connecting to a PCB board, and the remaining five sides are respectively provided with a chip and a sealing ring (2).

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