Waterproofing structure and electronic device including same

Abstract

According to an embodiment disclosed herein, an electronic device may comprise: a housing that forms at least a portion of the outer surface of the electronic device and includes a first through-hole; and a sensor module disposed inside the housing. The sensor module may include: a sensor configured to sense environmental conditions outside the electronic device via the first through-hole; a sensor housing that accommodates the sensor and includes an opening; and a circuit board that includes a first region facing the first through-hole and a second region facing the sensor. The circuit board may include a second through-hole that is at least partially aligned with the opening; and a signal line that is arranged to substantially surround the second through-hole, wherein the signal line may be configured to sense moisture that has flowed to the second through-hole or the vicinity of the second through-hole via the first through-hole. Various other embodiments may also be possible.

Description

Waterproof structure and electronic device including same

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, to a waterproof structure and an electronic device including the same.

[0002] Typically, electronic devices refer to devices that perform specific functions based on embedded software, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or in-car navigation systems. These electronic devices can output stored information as audio or video. With the increasing integration of electronic devices and the widespread adoption of high-speed, high-capacity wireless communications, a single mobile communication terminal is now equipped with a variety of functions.

[0003] For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0004] In addition, recent electronic devices have been proposed as wearable electronic devices of various shapes, such as glasses or watches, that can be worn on the body and used.

[0005] These electronic devices may be required to be thinner, smaller, and / or have a simpler appearance to enhance aesthetic appeal and provide convenience to users while integrating various functions.

[0006] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0007] According to one embodiment of the present disclosure, an electronic device includes a housing that forms at least a portion of an outer surface of the electronic device and includes a first through hole, and a sensor module disposed inside the housing, wherein the sensor module includes a sensor configured to detect an environmental condition outside the electronic device through the first through hole, a sensor housing that accommodates the sensor and includes an opening, and a circuit board that includes a first region facing the first through hole and a second region facing the sensor, wherein the circuit board includes a second through hole at least partially aligned with the opening, and a signal line that is arranged to substantially surround the second through hole, wherein the signal line can be configured to detect moisture that has entered the second through hole or the periphery of the second through hole through the first through hole.

[0008] According to one embodiment of the present disclosure, an electronic device includes a housing that forms at least a portion of an outer surface of the electronic device and includes a first through hole, a display disposed on the housing, a sensor module disposed inside the housing, the sensor module including a signal line configured to detect moisture flowing into the sensor module, at least one processor, and a memory storing at least one instruction, wherein the at least one instruction, when executed by the at least one processor, causes the electronic device to check a capacitance change value using the signal line, determine whether moisture flowing into the sensor module exists based on the capacitance change value, and output information about the inflow of moisture through the display based on the determination that moisture has flowed into the sensor module.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a front perspective view illustrating a wearable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a rear perspective view illustrating the wearable electronic device of FIG. 2 according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view illustrating the wearable electronic device of FIG. 2 according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view of a housing and a first sensor module according to one embodiment of the present disclosure.

[0014] FIG. 6 is a cross-sectional view of a housing and a first sensor module according to one embodiment of the present disclosure.

[0015] FIG. 7 is a cross-sectional view of a first sensor module according to one embodiment of the present disclosure.

[0016] FIG. 8 is an exploded view of a first sensor module according to one embodiment of the present disclosure.

[0017] FIG. 9A is a front view of a first circuit board according to one embodiment of the present disclosure.

[0018] FIG. 9b is a rear view of a first circuit board according to one embodiment of the present disclosure.

[0019] FIG. 10A is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0020] FIG. 10b is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0021] FIG. 11A is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0022] FIG. 11b is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0023] FIG. 11c is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0024] FIG. 12 is an exploded perspective view of a first sensor module according to one embodiment of the present disclosure.

[0025] FIG. 13 is a cross-sectional view illustrating an electronic device including a second sensor module according to one embodiment of the present disclosure.

[0026] FIG. 14 is a drawing for explaining a second sensor module according to one embodiment of the present disclosure.

[0027] FIG. 15 is a plan view illustrating a first sensor module, a second sensor module, and a first signal line according to one embodiment of the present disclosure.

[0028] FIG. 16 is a plan view illustrating a first sensor module, a second sensor module, and a first signal line according to one embodiment of the present disclosure.

[0029] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0054] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0055] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0056] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0057] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0058] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0059] FIG. 2 is a front perspective view illustrating a wearable electronic device according to one embodiment of the present disclosure.

[0060] FIG. 3 is a rear perspective view illustrating the wearable electronic device of FIG. 2 according to one embodiment of the present disclosure.

[0061] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 5 to 16.

[0062] In the detailed description below, the 'X-axis direction' in the orthogonal coordinate system of FIGS. 2 to 4 may be understood as the width direction of the electronic device (101) or the housing (210), the 'Y-axis direction' may be understood as the length direction of the electronic device (101) or the housing (210), and the 'Z-axis direction' may be understood as the thickness direction of the electronic device (101) or the housing (210). In one embodiment, the direction toward which the front side of the electronic device (101) or the housing (210) (e.g., the first side (210A) of FIG. 2) faces may be defined as the '+Z direction', and the direction toward which the rear side of the electronic device (101) or the housing (210) (e.g., the second side (210B) of FIG. 3) faces may be defined as the '-Z direction'.

[0063] Referring to FIGS. 2 and 3, a wearable electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (210) or a wearing member (250, 260). The housing (210) may include a first side (or front side) (210A), a second side (or back side) (210B), or a side surface (210C). The side surface (210C) may surround a space between the first side (210A) and the second side (210B).

[0064] According to one embodiment, the wearable member (250, 260) may be connected to at least a portion of the housing (210) and configured to detachably attach the electronic device (101) to a part of the user's body (e.g., wrist, ankle, etc.). For example, the wearable electronic device (101) may be in the form of a wristwatch. In one embodiment, the housing (210) may refer to a structure forming a first surface (210A) of FIG. 2, a second surface (210B) of FIG. 3, and a portion of the side surface (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (201) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second surface (210B) may be formed by a substantially opaque back plate (207). In one embodiment, when the electronic device (101) includes a sensor module (211) disposed on the second surface (210B), the back plate (207) may include at least a partially transparent area. The back plate (207) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (206) that is coupled to the front plate (201) and the back plate (207) and includes a metal and / or polymer. In one embodiment, the back plate (207) and the side bezel structure (206) may be formed integrally and include the same material (e.g., a metal material such as aluminum). The wearing members (250, 260) may be formed of various materials and shapes. The integral and multiple unit links can be formed to be movable with each other by a combination of at least two of the above materials, such as woven fabric, leather, rubber, urethane, metal, ceramic, or at least two of the above materials.

[0065] According to one embodiment, the electronic device (101) may include at least one of a display (e.g., the display (320) of FIG. 4), an audio module (205, 208) (e.g., the audio module (170) of FIG. 1), a sensor module (211) (e.g., the sensor module (176) of FIG. 1), a key input device (202, 203, 204) (e.g., the input module (150) of FIG. 1), or a connector hole (209) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (202, 203, 204), the connector hole (209), or the sensor module (211)) or may additionally include other components.

[0066] In one embodiment, a display (e.g., display (320) of FIG. 4) may be visually exposed, for example, through a substantial portion of the front plate (201). The shape of the display may correspond to the shape of the front plate (201), and may have various shapes, such as a circle, an oval, or a polygon. The display may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0067] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). The microphone hole (205) may have a microphone positioned therein for acquiring external sounds, and in one embodiment, multiple microphones may be positioned therein to detect the direction of sounds. The speaker hole (208) may be used as an external speaker and a receiver for calls. In one embodiment, a speaker may be included without a speaker hole (e.g., a piezo speaker).

[0068] The sensor module (211) can generate an electric signal or data value corresponding to the internal operating state of the electronic device (101) or the external environmental state. The sensor module (211) can include, for example, a biometric sensor module (211) (e.g., HRM sensor) arranged on the second surface (210B) of the housing (210). The electronic device (101) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0069] The key input devices (202, 203, 204) may include a wheel key (202) disposed on a first side (210A) of the housing (210) and rotatable in at least one direction, and / or a side key button (203, 204) disposed on a side surface (210C) of the housing (210). The wheel key (202) may have a shape corresponding to the shape of the front plate (201). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (202, 203, 204), and the key input devices (202, 203, 204) that are not included may be implemented in another form, such as a soft key, on the display. The connector hole (209) can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and may include another connector hole (not shown) for receiving a connector for transmitting and receiving audio signals with the external electronic device. The electronic device (101) may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (209) and blocks the inflow of external foreign substances into the connector hole.

[0070] The wearing member (250, 260) can be detachably fastened to at least a portion of the housing (210) using a locking member (251, 261). The locking member (251, 261) can include a fastening component such as a pogo pin, and can be replaced with a protrusion(s) or recess(es) formed in the wearing member (250, 260) according to an embodiment. For example, the wearing member (250, 260) can be coupled in a manner of engaging with a groove or a protrusion formed in the housing (210). The wearing member (250, 260) can include one or more of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fixing ring (255).

[0071] The fixing member (252) may be configured to fix the housing (210) and the wearing member (250, 260) to a part of the user's body (e.g., wrist, ankle, etc.). The fixing member fastening hole (253) may correspond to the fixing member (252) to fix the housing (210) and the wearing member (250, 260) to a part of the user's body. The band guide member (254) may be configured to limit the range of movement of the fixing member (252) when the fixing member (252) is fastened to the fixing member fastening hole (253), thereby allowing the wearing member (250, 260) to be fastened in close contact with a part of the user's body. The band fixing ring (255) may limit the range of movement of the wearing member (250, 260) when the fixing member (252) and the fixing member fastening hole (253) are fastened.

[0072] FIG. 4 is an exploded perspective view illustrating the wearable electronic device of FIG. 2 according to one embodiment of the present disclosure.

[0073] The embodiment of FIG. 4 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 5 to 16.

[0074] Referring to FIG. 4, a wearable electronic device (101) (e.g., the wearable electronic device (101) of FIGS. 2 to 3) may include a side bezel structure (310) (e.g., the side bezel structure (206) of FIGS. 2 to 3), a wheel key (330) (e.g., the wheel key (202) of FIGS. 2 to 3), a front plate (301) (e.g., the front plate (201) of FIG. 2), a display (320), a first antenna (350), a second antenna (e.g., an antenna included in a circuit board (355)), a support member (360) (e.g., a bracket), a battery (370), a printed circuit board (380), a sealing member (390), a rear plate (392), and a wearing member (395, 397) (e.g., the wearing member (250, 260) of FIG. 2 or 3). At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any overlapping description will be omitted below.

[0075] According to one embodiment, the support member (360) may be disposed inside the electronic device (101) and connected to the side bezel structure (310), or may be formed integrally with the side bezel structure (310). The support member (360) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The support member (360) may have a display (320) (e.g., the display module (160) of FIG. 1) coupled to one surface and a printed circuit board (380) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (380).

[0076] A processor (e.g., processor (120) of FIG. 1) may include, for example, one or more of a central processing unit, an application processor, a GPU (graphic processing unit), an application processor sensor processor, or a communication processor.

[0077] The memory (e.g., memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0078] An interface (e.g., interface (177) of FIG. 1) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0079] According to one embodiment, a battery (370) (e.g., battery (189) of FIG. 1) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (370) may be disposed substantially on the same plane as, for example, a printed circuit board (380). The battery (370) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0080] According to one embodiment, a first antenna (350) (e.g., antenna module (197) of FIG. 1) may be disposed between the display (320) and the support member (360). The first antenna (350) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The first antenna (350) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (310) and / or the support member (360).

[0081] In one embodiment, a circuit board (355) may be disposed between a printed circuit board (380) and a back plate (392). The circuit board (355) may include an antenna (e.g., an antenna module (197) of FIG. 1), for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The circuit board (355) may, for example, perform near-field communication with an external device, wirelessly transmit and receive power required for charging, and transmit magnetic-based signals including near-field communication signals or payment data. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (310) and / or the back plate (392). In one embodiment, when the electronic device (101) (e.g., the electronic device (101) of FIGS. 2 and 3) includes a sensor module (e.g., the sensor module (211) of FIG. 3), a sensor circuit disposed on the circuit board (355) or a sensor element (e.g., a photoelectric conversion element or an electrode pad) separate from the circuit board (355) may be disposed. For example, an electronic component provided as a sensor module may be disposed between the printed circuit board (380) and the back plate (392). The circuit board (255) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

[0082] According to one embodiment, a sealing member (390) may be positioned between the side bezel structure (310) and the front plate (301). The sealing member (390) may be configured to block or reduce moisture and foreign matter from entering the space surrounded by the side bezel structure (310) and the front plate (301) from the outside.

[0083] FIG. 5 is an exploded perspective view of a housing and a first sensor module according to one embodiment of the present disclosure.

[0084] The embodiment of FIG. 5 can be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 6 to 16.

[0085] According to one embodiment, a wearable electronic device (e.g., the wearable electronic device (101) of FIGS. 2 to 4) may include a housing (310) (e.g., the housing (210) of FIG. 2 or the side bezel member (310) of FIG. 4), or a first sensor module (400).

[0086] According to one embodiment, the housing (310) may form at least a portion of an exterior surface of the wearable electronic device. For example, at least a portion of the outer surface of the wearable electronic device may be defined by the exterior surface of the housing (310).

[0087] According to one embodiment, the first sensor module (400) may be disposed inside the housing (310). The first sensor module (400) may be configured to detect or sense environmental information for the wearable electronic device.

[0088] According to one embodiment, environmental information for a wearable electronic device may include information about an operating state inside the wearable electronic device or information about an environmental state outside the wearable electronic device.

[0089] According to one embodiment, the first sensor module (400) can generate an electrical signal or data value corresponding to environmental information for the wearable electronic device.

[0090] According to one embodiment, the first sensor module (400) may include a microphone (e.g., the input module (150) of FIG. 1). According to another embodiment, the first sensor module (400) (e.g., the sensor module (176) of FIG. 1) may include a pressure sensor, a temperature sensor, a humidity sensor, a gas sensor, or an acoustic sensor.

[0091] According to one embodiment, the housing (310) may include a recess (311) for mounting at least a portion of the first sensor module (400). The recess (311) may be recessed from at least a portion of an inner surface of the housing (310) (e.g., a surface facing the inside of the wearable electronic device).

[0092] According to one embodiment, the housing (310) may include a first through hole (312). The first through hole (312) may include a hole formed penetrating from an outer surface to an inner surface of the housing (310). According to an embodiment, the first through hole (312) may be defined and / or referred to as an opening.

[0093] According to one embodiment, the first through hole (312) may be at least partially aligned with holes of the first sensor module (400) or openings of the first sensor module (400).

[0094] According to one embodiment, when the first sensor module (400) includes at least a portion of a microphone or when the first sensor module (400) includes a microphone, sound generated from outside the wearable electronic device can reach a sensor component (410) (e.g., a microphone module) of the first sensor module (400) through the first through hole (312).

[0095] According to one embodiment, the first sensor module (400) may include holes or openings for micro sound to reach the module. The holes or openings may be at least partially aligned with the first through hole (312) of the housing (310).

[0096] According to one embodiment, the first sensor module (400) may be disposed or mounted on the inner surface of the housing (310).

[0097] According to one embodiment, the first sensor module (400) may include a sensor component (410). The sensor component (410) may include, for example, a microphone module. The sensor component (410) may include a diaphragm or circuitry for converting vibrations of the diaphragm into an electrical signal.

[0098] According to one embodiment, when the first sensor module (400) is mounted in the housing (310), the sensor component (410) may at least partially overlap with the first through hole (312).

[0099] According to one embodiment, the first sensor module (400) may include a fixing member (490). The fixing member (490) may include a bracket. The fixing member (490) may fix the first sensor module (400) to the housing (310). For example, the fixing member (490) may be configured to apply an external force toward the outside of the wearable electronic device to the first sensor module (400) such that the first sensor module (400) remains at least partially aligned with the first through hole (312).

[0100] According to one embodiment, the fixing member (490) may be fixed to the housing (310) by a fastening member (491) (e.g., a bolt or a pin). When the first sensor module (400) is coupled or assembled to the housing (310), the fixing member (490) may surround at least a portion of the first sensor module (400) and be fixed to the housing (310). The first sensor module (400) may be at least partially covered by the fixing member (490) so that its separation from the housing (310) may be limited and / or reduced. An external force or a pressing force formed by coupling the fixing member (490) to the housing (310) may allow the first sensor module (400) to remain in close contact with the recess (311).

[0101] FIG. 6 is a cross-sectional view of a housing and a first sensor module according to one embodiment of the present disclosure.

[0102] Figure 6 is a cross-sectional view taken along line AA' of Figure 5.

[0103] FIG. 7 is a cross-sectional view of a first sensor module according to one embodiment of the present disclosure.

[0104] The embodiments of FIGS. 6 and 7 can be combined with the embodiments of FIGS. 1 to 5, or the embodiments of FIGS. 8 to 16.

[0105] The configuration of the housing (310) and the first sensor module (400) of FIGS. 6 and 7 may be partially or entirely identical to the configuration of the housing (310) and the first sensor module (400) of FIG. 5.

[0106] Referring to FIG. 6, the housing (310) may include a recess (311) or a first through hole (312).

[0107] According to one embodiment, the recess (311) may include a first recess portion (311a) and a second recess portion (311b). The first recess portion (311a) may have a smaller size than the second recess portion (311b). In the first recess portion (311a), a first barrel portion (421) of a barrel (420) may be accommodated or placed. In the second recess portion (311b), a second barrel portion (423) of the barrel (420) may be accommodated or placed.

[0108] According to one embodiment, the second recessed portion (311b) may be disposed to be stepped with respect to the first recessed portion (311a).

[0109] According to one embodiment, the first through hole (312) may be spatially connected to the first recess portion (311a), but is not limited thereto. For example, the first through hole (312) may be formed to penetrate from the first recess portion (311a) toward the exterior of the wearable electronic device.

[0110] According to one embodiment, at least a portion of the first sensor module (400) may be placed in the recess (311).

[0111] According to one embodiment, the first sensor module (400) may include a sensor component (410), a barrel (420), a waterproof member (430), or a first circuit board (440).

[0112] According to one embodiment, the sensor component (410) may include a sensor housing (411), a first opening (412), or a microphone (413). The microphone (413) may also be defined and / or referred to as a sensor.

[0113] According to one embodiment, the sensor housing (411) can accommodate a microphone (413). For example, the microphone (413) can be placed or accommodated in the internal space of the sensor housing (411).

[0114] According to one embodiment, the microphone (413) may include a diaphragm that vibrates in response to sound generated from outside the wearable electronic device. The microphone (413) may include a microphone circuit configured to convert the vibration of the diaphragm into an electrical signal. The electrical signal generated by the microphone (413) may be transmitted to a processor (e.g., the processor (120) of FIG. 1) disposed on a second circuit board (e.g., the printed circuit board (380) of FIG. 4) via the first circuit board (440), but is not limited thereto.

[0115] According to one embodiment, the microphone (413) may be electrically connected to the first circuit board (440).

[0116] According to one embodiment, the sensor housing (411) may include a first opening (412). The first opening (412) may be defined as a through hole formed through the sensor housing (411), but is not limited thereto.

[0117] In one embodiment, the first opening (412) may be at least partially aligned with the first through hole (312). For example, when the first sensor module (400) is mounted in the housing (310), the first opening (412) may at least partially overlap the first through hole (312).

[0118] According to one embodiment, the microphone (413) may include a microphone hole (not shown). The microphone hole may be at least partially aligned with or overlapped with the first opening (412) or the first through hole (312).

[0119] According to one embodiment, the sensor component (410) may be disposed on the first circuit board (440). For example, the sensor housing (411) may be disposed or positioned on the rear side (e.g., the side facing the interior of the wearable electronic device) of the first circuit board (440).

[0120] According to one embodiment, the first circuit board (440) may be positioned between the sensor component (410) and the barrel (420).

[0121] According to one embodiment, the first circuit board (440) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB). According to an embodiment, the first circuit board (440) may include a board assembly in which a plurality of boards are laminated or combined.

[0122] According to one embodiment, the first circuit board (440) may include a board (441) including at least one conductive layer and at least one insulative layer.

[0123] According to one embodiment, the first circuit board (440) may include a second through hole (442) formed through the board (441). The second through hole (442) may be at least partially aligned with or overlapped with the first through hole (e.g., the first through hole (312) of FIG. 5) and / or the first opening (412).

[0124] According to one embodiment, a waterproofing member (430) may be disposed between the barrel (420) and the first circuit board (440). The waterproofing member (430) may include, for example, a membrane. The waterproofing member (430) may be disposed between a first through hole (e.g., the first through hole (312) of FIG. 5) and a first region (e.g., the first region (440A) of FIG. 9A) of the first circuit board (440).

[0125] According to one embodiment, the waterproof member (430) may include a waterproof membrane configured to block water or moisture from entering the sensor component (410) or microphone (413) from the outside of the wearable electronic device.

[0126] In one embodiment, the waterproof member (430) may include breathable gore-tex.

[0127] In one embodiment, the waterproof member (430) may allow sound generated from outside the wearable electronic device to be transmitted to the microphone (413). The waterproof member (430) may not allow water or moisture flowing in from outside the wearable electronic device to be transmitted to the microphone (413).

[0128] According to one embodiment, the barrel (420) may include a first barrel portion (421), a third through hole (422), a second barrel portion (423), or a seal (424).

[0129] In one embodiment, the barrel (420) may be a hollow cylindrical member. The barrel (420) may form at least a portion of the body of the first sensor module (400). In one embodiment, the barrel (420) may be referred to as a cylindrical case.

[0130] According to one embodiment, the first barrel portion (421) may be accommodated in the first recess portion (311a). A third through hole (422) may be formed in the first barrel portion (421). The third through hole (422) may be at least partially aligned with or overlapped with the first through hole (421). The third through hole (422) may be at least partially aligned with or overlapped with the first opening (412) or the second through hole (442).

[0131] According to one embodiment, the second barrel portion (423) may extend from one end (e.g., the bottom) of the first barrel portion (421). The second barrel portion (423) may be positioned perpendicular to the first barrel portion (421), but is not limited thereto.

[0132] According to one embodiment, the second barrel portion (423) can be accommodated in the second recess portion (311b). The second barrel portion (423) can be seated on the second recess portion (311b).

[0133] According to one embodiment, the second barrel portion (423) may include an at least partially sunken groove. A waterproofing member (430) may be received or positioned in the groove of the second barrel portion (423).

[0134] According to one embodiment, the seal (424) may be positioned on the outer surface of the first barrel portion (421). For example, the seal (424) may include, but is not limited to, an O-ring.

[0135] According to one embodiment, the seal (424) may be configured to seal a gap between the first recessed portion (311a) and the first barrel portion (421). For example, the seal (424) may be configured to limit and / or block foreign substances or moisture from outside the wearable electronic device from entering the interior of the wearable electronic device.

[0136] In one embodiment, the barrel (420) may be formed integrally with the seal (424). For example, the barrel (420) may be injection molded together with the seal (424), but is not limited thereto. The barrel (420) may be formed from a combination of metal and non-metal, but is not limited thereto.

[0137] Referring to FIG. 7, the first sensor module (400) may include a first plate (450), a first adhesive member (461), a second adhesive member (462), or a third adhesive member (463).

[0138] According to one embodiment, the first adhesive member (461) may be positioned between the second barrel portion (423) and the waterproof member (430). The first adhesive member (461) may be configured to adhere and / or secure the waterproof member (430) to the second barrel portion (423).

[0139] According to one embodiment, the first adhesive member (461) may include, but is not limited to, a waterproof tape.

[0140] According to one embodiment, the second adhesive member (462) may be disposed between the waterproof member (430) and the first plate (450). The second adhesive member (462) may allow the first plate (450) and the waterproof member (430) to be bonded to each other. The second adhesive member (462) may include, but is not limited to, a double-sided tape.

[0141] According to one embodiment, the third adhesive member (463) may be disposed between the first plate (450) and the first circuit board (440). The third adhesive member (463) may allow the first plate (450) and the first circuit board (440) to be bonded to each other. The third adhesive member (463) may include, but is not limited to, a double-sided tape.

[0142] According to one embodiment, each of the adhesive members (461, 462, 463) may include an opening that is at least partially aligned or overlaps with the first through hole (e.g., the first through hole (312) of FIG. 6) and / or the first opening (412).

[0143] According to one embodiment, a first plate (450) may be disposed between a second adhesive member (462) and a third adhesive member (463). The first plate (450) may include a first plate portion (451) having a wide flat plate shape. The first plate (450) may include a first plate opening (452) formed in the first plate portion (451). The first plate opening (452) may include a hole formed through the first plate portion (451). The first plate opening (452) may be at least partially aligned with or overlapped with the first through hole (e.g., the first through hole (312) of FIG. 6), the first opening (412), and / or the second through hole (442).

[0144] According to one embodiment, the first plate (450) may be placed between the first circuit board (440) and the waterproof member (430).

[0145] According to one embodiment, the first plate (450) may include, but is not limited to, stainless steel (STS). The first plate (450) may support the waterproof member (430) so that the waterproof member (430) remains flat.

[0146] Referring to FIGS. 6 and 7, a sound generated from the outside of the wearable electronic device may be sequentially transmitted to the microphone (413) by passing through the first through hole (312), the third through hole (422), the waterproof member (430), the first plate opening (452), the second through hole (442), and the first opening (412). Water or moisture from the outside of the wearable electronic device may be blocked by the waterproof member (430) and may not enter the microphone (413).

[0147] FIG. 8 is an exploded view of a first sensor module according to one embodiment of the present disclosure.

[0148] The embodiment of FIG. 8 can be combined with the embodiments of FIGS. 1 to 7, or the embodiments of FIGS. 9a to 16.

[0149] The configuration of the first sensor module (400) of FIG. 8 may be partially or entirely identical to the configuration of the first sensor module (400) of FIGS. 5 to 7.

[0150] Referring to FIG. 8, the first sensor module (400) may be an assembly in which a barrel (420), a waterproof member (430), a first plate (450), and a first circuit board (440) are sequentially aligned and assembled.

[0151] According to one embodiment, the third through hole (422) of the barrel (420), at least a part of the waterproof member (430), the first plate opening (452) of the first plate (450), and the second through hole (442) of the first circuit board (440) may overlap or be aligned with each other.

[0152] According to one embodiment, the barrel (420) may include a seal (424).

[0153] According to one embodiment, a first adhesive member (461) may be disposed on one surface of the waterproof member (430). A second adhesive member (462) may be disposed on the other surface of the waterproof member (430).

[0154] In one embodiment, the first support plate (450) may include a plurality of first plate openings (452). Some of the plurality of first plate openings (452) may be aligned with or overlap with the third through hole (422) and / or the second through hole (442). The remainder of the plurality of first plate openings (452) may not be aligned with or overlap with the third through hole (422) and / or the second through hole (442), but is not limited thereto.

[0155] According to one embodiment, a third adhesive member (463) may be disposed on one surface of the substrate (441).

[0156] According to one embodiment, a waterproof member (430) (e.g., a waterproof membrane) may be configured to block external water, moisture, or humidity from entering a sensor component (e.g., a sensor component (410) of FIG. 9B) disposed on a first circuit board (440).

[0157] If the waterproof member (430) is damaged or broken, moisture (10) may pass through the waterproof member (430) and enter the second through hole (442). If moisture (10) enters the second through hole (442), the moisture (10) may enter the sensor component (e.g., the sensor component (410) of FIG. 9b).

[0158] According to one embodiment of the present disclosure, the first sensor module (400) or the wearable electronic device may include a first signal line (e.g., the first signal line (445) of FIG. 9A) configured to detect that the waterproof member (430) is damaged and moisture (10) flows into the second through hole (442) or the surroundings of the second through hole (442).

[0159] FIG. 9A is a front view of a first circuit board according to one embodiment of the present disclosure.

[0160] FIG. 9b is a rear view of a first circuit board according to one embodiment of the present disclosure.

[0161] FIG. 10A is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0162] FIG. 10b is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0163] FIG. 11A is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0164] FIG. 11b is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0165] FIG. 11c is a schematic diagram illustrating a first signal line according to one embodiment of the present disclosure.

[0166] The embodiments of FIGS. 9A to 11C can be combined with the embodiments of FIGS. 1 to 8, or the embodiments of FIGS. 12 to 16.

[0167] Referring to FIGS. 9A and 9B, the first circuit board (440) (e.g., the first circuit board (440) or board (441) of FIG. 8) may include a second through hole (442).

[0168] Fig. 9a is a drawing showing the front side of the first circuit board (440), and Fig. 9b is a drawing showing the back side of the first circuit board (440) as viewed from the opposite direction to Fig. 9a.

[0169] Referring to FIG. 9A, the first circuit board (440) may include a first region (440A), a second through hole (442), a first signal line (445), and a third region (440C).

[0170] Referring to FIG. 9B, the first circuit board (440) may include a second region (440B), a second signal line (443), a connector (446), and a third region (440C).

[0171] Referring to FIGS. 9A and 9B, the first region (440A) and the second region (440B) may be formed integrally. The first region (440A) and the second region (440B) may be defined as a first portion of the first circuit board (440). The first region (440A) may form the front surface of the first portion. The second region (440B) may form the back surface of the first portion. The first region (440A) and the second region (440B) may face opposite directions.

[0172] In one embodiment, the first region (440A) may face the first through hole (e.g., the first through hole (312) of FIG. 5). The second region (440B) may face the sensor (e.g., the microphone (413) of FIG. 7).

[0173] According to one embodiment, the third adhesive member (463) may be placed or positioned in the first region (440A).

[0174] According to one embodiment, the sensor component (410) may be placed or positioned in the second region (440B).

[0175] According to one embodiment, the third region (440C) may include a front side (440C-1) and a back side (440C-2) facing in opposite directions. The front side (440C-1) of the third region (440C) may be continuous from the first region (440A), but is not limited thereto. The back side (440C-2) of the third region (440C) may be continuous from the second region (440B), but is not limited thereto.

[0176] According to one embodiment, a connector (446) may be disposed in the third region (440C). According to the illustrated embodiment, the connector (446) may be disposed on the rear surface (440C-2) of the third region (440C), but is not limited thereto. The connector (446) may also be disposed on the front surface (440C-1) of the third region (440C).

[0177] According to one embodiment, the first circuit board (440) may be formed integrally with a first portion including a first region (440A) and a second region (440B), and a second portion including a third region (440C).

[0178] According to one embodiment, the second portion including the third region (440C) may extend from the first portion including the first region (440A) and the second region (440B).

[0179] According to one embodiment, the first circuit board (440) may include, but is not limited to, a flexible printed circuit board (FPCB). For example, the first circuit board (440) may include a rigid-flexible PCB (RF-PCB). When the first circuit board (440) includes an RF-PCB, a first portion of the first circuit board (440) may form a rigid portion, and a second portion of the first circuit board (440) may form a flexible portion. According to an embodiment, the first circuit board (440) may be formed by assembling the first portion and the second portion formed as separate members. According to an embodiment, the first circuit board (440) may include a printed circuit board (PCB).

[0180] In one embodiment, the first portion of the first circuit board (440) may have a different elasticity than the second portion of the first circuit board (440). For example, the second portion may include, but is not limited to, a material that is more flexible than the first portion.

[0181] In one embodiment, the first portion of the first circuit board (440) may have a different thickness than the second portion of the first circuit board (440). For example, the second portion may be thinner than the first portion, but is not limited thereto.

[0182] According to one embodiment, the elasticity or thickness of the third region (440C) of the first circuit board (440) may be different from the elasticity or thickness of other parts or other regions of the first circuit board (440).

[0183] According to one embodiment, the connector (446) may be electrically and / or physically connected to a second circuit board (e.g., printed circuit board (380) of FIG. 4) of the wearable electronic device. A sensor component (410) positioned on the first circuit board (440) may be electrically connected to a processor (e.g., processor (120) of FIG. 1) positioned on the second circuit board via the connector (446).

[0184] According to one embodiment, the first signal line (445) may be disposed on the front surface of the first circuit board (440). The first signal line (445) may be disposed in the first region (440A) and the front surface (440C-1). The first signal line (445) may extend from the first region (440A) to the front surface (440C-1) of the third region (440C). At least a portion of the first signal line (445) may be electrically connected to a connector (446) through a conductive via. The first signal line (445) may be electrically connected to a processor located on the second circuit board through the conductive via and the connector (446).

[0185] According to one embodiment, at least a portion (445a) of the first signal line (445) may be disposed adjacent to the second through hole (442). For example, at least a portion (445a) of the first signal line (445) disposed in the first region (440A) may be disposed around the periphery of the second through hole (442). At least a portion (445a) of the first signal line (445) may be spaced apart from the first through hole (442). At least a portion (445a) of the first signal line (445) may surround the first through hole (442).

[0186] According to one embodiment, the first signal line (445) may be a line formed of copper foil, but is not limited thereto. At least a portion of the copper foil of the first signal line (445) disposed around the first through hole (442) may be exposed. The copper foil of another portion of the first through hole (442) may be covered by an insulating layer of the first circuit board (440) so as not to be exposed.

[0187] According to one embodiment, the first signal line (445) may be electrically connected to a touch sensor or touch circuitry (e.g., a touch integrated circuit (IC)) disposed on the second circuit board. The touch circuitry may be configured to establish or allocate an RX (receive) channel and a TX (transmit) channel. The first signal line (445) may be defined as an RX pattern of the touch circuitry, but is not limited thereto. The touch circuitry may be defined as a part of a processor (e.g., the processor (120) of FIG. 1), but is not limited thereto.

[0188] According to one embodiment, the touch circuit may be configured to assign an RX channel for transmitting and receiving an RX signal to the first signal line (445).

[0189] According to one embodiment, the first circuit board (440) may include a ground (e.g., ground (444) of FIG. 10A) arranged around the first signal line (445). A configuration in which a wearable electronic device detects moisture ingress using the first signal line (445) and the ground will be described later.

[0190] According to one embodiment, the second signal line (443) may be disposed on the rear surface of the first circuit board (440). The second signal line (443) may be disposed on the rear surface of the first circuit board (440). The second signal line (443) may be disposed in the second region (440B) and the rear surface (440C-1). The second signal line (443) may extend from the second region (440B) to the rear surface (440C-1) of the third region (440C).

[0191] According to one embodiment, one end of the second signal line (443) may be electrically connected to a microphone of the sensor component (410) (e.g., microphone (413) of FIG. 6). The other end of the second signal line (443) may be electrically connected to a connector (446). The microphone may be electrically connected to a processor through the second signal line (443) and the connector (446). An electrical signal generated by the microphone may be transmitted to a processor disposed on a second circuit board through the second signal line (443) and the connector (446).

[0192] According to one embodiment, the second signal line (443) may be electrically connected to a sensor (e.g., a microphone (413) of FIG. 6) and a second circuit board.

[0193] According to one embodiment, the second signal line (443) may be a line formed of copper foil, but is not limited thereto.

[0194] According to one embodiment, the first signal line (445) and the second signal line (443) may be arranged on different layers of the first circuit board (440), but are not limited thereto. For example, the first signal line (445) may be arranged on a first layer of the first circuit board (440), and the second signal line (443) may be arranged on a second layer of the second circuit board (440).

[0195] Referring to FIGS. 10A and 10B, a method or process for determining that moisture has entered the vicinity of a second through hole (442) of a wearable electronic device is described.

[0196] FIG. 10a and FIG. 10b illustrate a state in which a waterproof member (e.g., waterproof member (430) of FIG. 6) is damaged and moisture (10) flows into the second through hole (442) or the area around the second through hole (442).

[0197] Referring to FIGS. 10A and 10B, a wearable electronic device (e.g., the wearable electronic device (101) of FIGS. 4 and 5) may include a processor (e.g., the processor (120) of FIG. 1) disposed on a second circuit board (e.g., the printed circuit board (380) of FIG. 4)) or a memory (e.g., the memory (130) of FIG. 1) disposed on the second circuit board.

[0198] According to one embodiment, the memory may store at least one instruction. The at least one instruction, when executed by the processor, may cause the wearable electronic device or the processor to perform at least one operation. Hereinafter, a process or procedure for the processor to detect the inflow of moisture (10) will be described, but the description thereof may also be interpreted as a process or procedure for the wearable electronic device to detect the inflow of moisture (10).

[0199] According to one embodiment, the processor may be configured to control the operation of components of the wearable electronic device.

[0200] According to one embodiment, the processor may assign an RX channel of the touch circuit to the first signal line (445). Accordingly, an electrical capacitance may be formed between the first signal line (445) and the ground (444). According to one embodiment, the processor may be configured to detect or determine the inflow of moisture (10) into the second through hole (442) or the periphery of the second through hole (442) based on a change in the electrical capacitance. According to one embodiment, the processor may be configured to detect or determine the inflow of moisture (10) into the second through hole (442) or the periphery of the second through hole (442) based on a change in a resistance value formed due to a short between the first signal line (445) and the ground (444) by the introduced moisture (10). According to one embodiment, the processor may be configured to detect or determine the inflow of moisture (10) into the second through hole (442) or the surroundings of the second through hole (442) based on a change in the current value of the first signal line (445) formed by the introduced moisture (10) or a change in the voltage value of the first signal line (445). Hereinafter, for convenience of explanation, an operation of the processor detecting the inflow of moisture (10) based on a change in electrical capacitance will be described, but the present disclosure is not limited thereto.

[0201] According to one embodiment, an insulative portion may be disposed between the first signal line (445) and the ground (444). The insulative portion may be a non-metallic boundary formed between the first signal line (445) and the ground (444), and may prevent the first signal line (445) and the ground (444) from being electrically connected. The insulative portion may be defined as an etched portion between the first signal line (445) and the ground (444).

[0202] When moisture (10) flows into the second through hole (442) or the surroundings of the second through hole (442), the moisture (10) that comes into contact with the first signal line (445) and the ground (444) can change the electrical capacitance formed between the first signal line (445) and the ground (444). The processor can be set to determine, decide, or confirm that moisture (10) has flowed into or exists in the second through hole (442) or the surroundings of the second through hole (442) when the change value of the electrical capacitance formed between the first signal line (445) and the ground (444) exceeds a set threshold value.

[0203] According to one embodiment, the processor may provide information to a user of the wearable electronic device based on the determination or confirmation that moisture (10) has entered or exists in the second through hole (442) or around the second through hole (442). The information provided to the user may be output as a visual image on a display of the wearable electronic device (e.g., display (320) of FIG. 4). The information provided to the user may be output as an acoustic message through a speaker of the wearable electronic device. The information provided to the user may be output to the user through another device (e.g., electronic device (102) of FIG. 1) communicatively connected to the wearable electronic device. Accordingly, the user may recognize a state in which the waterproof member (e.g., waterproof member (430) of FIG. 6) is damaged and there is a risk that moisture (10) may enter the sensor component (410). Accordingly, replacement or repair of the waterproof member may be induced.

[0204] Referring to FIG. 10b, when moisture (11) flows into the second through hole (442) or the surroundings of the second through hole (442), the moisture (11) that comes into contact with the first signal line (445) and the first plate (450) can change the electrical capacitance formed between the first signal line (445) and the ground (444). The processor can be set to determine or confirm that moisture (11) has flowed into the second through hole (442) or the surroundings of the second through hole (442) when the change value of the electrical capacitance formed between the first signal line (445) and the first plate (450) exceeds a set threshold value.

[0205] Referring to FIGS. 11A to 11C, a first portion of a first circuit board (440) may include a plurality of layers and at least one conductive via (447). The conductive via (447) may be configured to transmit a signal from a circuit or component disposed in one layer to a circuit or component disposed in another layer, but is not limited thereto.

[0206] Referring to FIG. 11a, at least a portion of the first signal line (445) may be arranged to surround the periphery of the first through hole (442).

[0207] Referring to FIG. 11b, the first signal line (4451) (e.g., the first signal line (445) of FIG. 9a) may be arranged to spirally wrap around the periphery of the first through hole (442).

[0208] Referring to FIG. 11C, a plurality of first signal lines (4452, 4453) separated from each other (e.g., the first signal line (445) of FIG. 9A) may be arranged to surround the periphery of the first through hole (442). At least a portion of one first signal line (4452) may be located in a first region of the periphery of the first through hole (442). For example, the first signal line (4452) may be arranged in a first region of the first region (440A). At least a portion of another first signal line (4453) may be located in a second region of the periphery of the first through hole (442). For example, the first signal line (4453) may be arranged in a second region of the first region (440A). The first region and the second region may be different regions. The processor can assign one RX channel to the first signal line (4452) and another RX channel to the first signal line (4453).

[0209] The first signal line (4452) and the first signal line (4453) may be physically separated or spaced from each other.

[0210] According to one embodiment, the processor may be configured to identify a first signal line among the first signal lines (4452, 4453) that detects a capacitance change in which an electrical capacitance change value exceeds a set threshold value. The processor may be configured to determine, judge, or confirm, based on the capacitance change, which zone among the first zone of the first sensor module (400) or the second zone of the first sensor module (400) has introduced moisture. For example, the processor may be configured to determine, judge, or confirm, based on the identification of the first signal line that detects a capacitance change in which an electrical capacitance change value exceeds a threshold value, which zone among the first zone or the second zone around the first through hole (442) has introduced moisture.

[0211] The configuration in which the processor determines whether moisture is introduced into the second through hole based on a change in capacitance detected in the first signal line may be operated in a state of use of the wearable electronic device, but is not limited thereto. For example, during the manufacture of the wearable electronic device, when the first sensor module (e.g., the first sensor module (400) of FIG. 5) is assembled into a housing (e.g., the housing (310) of FIG. 5), the processor may be operated to determine whether damage to a waterproof member (e.g., the waterproof member (430) of FIG. 7) is present. For example, when the first sensor module is assembled into the housing, the processor may be operated to inject water into the first through hole (e.g., the first through hole (312) of FIG. 5) using a hydraulic pressure test device to determine whether an electrical capacitance change occurs in the first signal line.

[0212] FIG. 12 is an exploded perspective view of a first sensor module according to one embodiment of the present disclosure.

[0213] The embodiment of FIG. 12 can be combined with the embodiments of FIGS. 1 to 11c, or the embodiments of FIGS. 13 to 16.

[0214] The configuration of the first sensor module (400) of FIG. 12 may be partially or entirely identical to the configuration of the first sensor module (400) of FIGS. 5 to 8.

[0215] According to one embodiment, the first sensor module (400) may include a barrel (420) including a third through hole (422) and a seal (424).

[0216] According to one embodiment, the first sensor module (400) may include a first adhesive member (461) including an opening (461a) (e.g., a hole). The opening (461a) may be at least partially aligned with the third through hole (422).

[0217] According to one embodiment, the first sensor module (400) may include a waterproof member (430) including a waterproof membrane.

[0218] According to one embodiment, the first sensor module (400) may include a second adhesive member (462) including an opening (462a) (e.g., a hole). The opening (462a) may be at least partially aligned with the opening (461a).

[0219] According to one embodiment, the first sensor module (400) may include a second plate (470). The second plate (470) may be positioned between the second adhesive member (462) and the fourth adhesive member (464).

[0220] According to one embodiment, the second plate (470) can be coupled to the waterproof member (430) and the first plate (450) via adhesive members (462, 464).

[0221] According to one embodiment, the second plate (470) may include a plurality of second plate openings (472). The plurality of second plate openings (472) may include holes. The size of each of the plurality of second plate openings (472) may be smaller than, but is not limited to, the size of the first plate opening (452) of the first plate (450).

[0222] In one embodiment, some of the plurality of second plate openings (472) may overlap with the opening (463a). The remainder of the plurality of second plate openings (472) may not overlap with the opening (463a), but is not limited thereto.

[0223] According to one embodiment, the second plate (470) can support the waterproof member (430) so that the waterproof member (430) remains flat.

[0224] According to one embodiment, the second plate (470) may be positioned between the first plate (450) and the waterproof member (430).

[0225] According to one embodiment, the first sensor module (400) may include a fourth adhesive member (464). The fourth adhesive member (464) may include a double-sided tape. The fourth adhesive member (464) may be disposed between the first plate (450) and the second plate (470). The fourth adhesive member (464) may bind the first plate (450) and the second plate (470) to each other.

[0226] According to one embodiment, the fourth adhesive member (464) may include an opening (464a) (e.g., a hole). The opening (464a) may be at least partially aligned with or overlapped with the third through hole (422) or the second through hole (442).

[0227] According to one embodiment, the first plate (450) may be positioned between the fourth adhesive member (464) and the third adhesive member (463).

[0228] According to one embodiment, the first sensor module (400) may include a third adhesive member (463). The third adhesive member (463) may be disposed between the first plate (450) and the first circuit board (440). The third adhesive member (463) may include an opening (463a). The opening (463a) may be at least partially aligned with or overlapped with the second through hole (442) or the third through hole (422).

[0229] According to one embodiment, the third adhesive member (463) may be positioned between the first circuit board (440) and the waterproof member (430). The opening (463a) may be at least partially aligned with or overlapped with at least one of the first through hole (e.g., the first through hole (312) of FIG. 5) or the second through hole (442).

[0230] According to one embodiment, the first sensor module (400) may include a first circuit board (440). The first circuit board (440) may include a second through hole (442) and a first signal line (445). A third region (440C) of the first circuit board (440) may include a material that is at least partially foldable or bendable.

[0231] According to one embodiment, the first sensor module (400) may include a sensor component (410) disposed on a first circuit board (440). The sensor component (410) may include, for example, a microphone, but is not limited thereto. The sensor component (410) may include various sensors configured to detect an external environmental condition of the wearable electronic device.

[0232] According to one embodiment, the first sensor module (400) may include a fixing member (490) (e.g., the fixing member (490) of FIG. 5) or a fastening member (491) (e.g., the fastening member (491) of FIG. 9).

[0233] According to one embodiment, at least a portion of the third region (440C) of the first circuit board (440) may be disposed between the fixing member (490) and the sensor component (410). For example, at least a portion of the third region (440C) may be disposed between the fixing member (490) and a sensor (e.g., a microphone (413) of FIG. 6).

[0234] According to one embodiment, the first signal line (445) may extend from a first region (e.g., the first region (440A) of FIG. 9A) to the front surface of a third region (440C) (e.g., the front surface (440C-1) of FIG. 9A).

[0235] According to one embodiment, a sound generated from outside the wearable electronic device may sequentially pass through a first through hole (e.g., the first through hole (312) of FIG. 5), a third through hole (422), an opening (461a), a waterproof member (430), an opening (462a), a plurality of second plate openings (472), an opening (464a), a first plate opening (452), an opening (463a), a second through hole (442), and a microphone hole formed in a microphone (e.g., the microphone (413) of FIG. 6) to be transmitted to a diaphragm of the microphone.

[0236] According to one embodiment, the waterproof member (430) may be configured to block external moisture or humidity from entering the sensor component (410).

[0237] FIG. 13 is a cross-sectional view illustrating an electronic device including a second sensor module according to one embodiment of the present disclosure.

[0238] FIG. 14 is a drawing for explaining a second sensor module according to one embodiment of the present disclosure.

[0239] The embodiments of FIGS. 13 and 14 can be combined with the embodiments of FIGS. 1 to 12, or the embodiments of FIGS. 15 to 16.

[0240] Referring to FIGS. 13 and 14, a wearable electronic device (101) (e.g., the wearable electronic device (101) of FIGS. 2 to 4) may include a front plate (301), a display (320), a second circuit board (380) (e.g., the second circuit board (380) of FIG. 4), a support member (360), a side bezel member (310), or a second sensor module (500).

[0241] Referring to FIG. 13, the front plate (301), the support member (360), and / or the side bezel member (310) may be defined as a housing of the wearable electronic device (101).

[0242] According to one embodiment, the housing (310) (e.g., the side bezel member (310)) may include a fourth through hole (313). The fourth through hole (313) may include a hole formed through the housing (310) from the outer surface to the inner surface. The fourth through hole (313) may be spatially connected to the second sensor module (500).

[0243] According to one embodiment, the second sensor module (500) may be a different sensor module from the first sensor module (e.g., the first sensor module (400) of FIGS. 5 to 7). The second sensor module (500) may be disposed on the support member (360) and associated with the fourth through hole (313).

[0244] According to one embodiment, the second sensor module (500) (e.g., the sensor module (176) of FIG. 1) may be configured to detect an external environmental condition of the wearable electronic device (101). The second sensor module (500) may include, for example, a barometric pressure sensor, but is not limited thereto.

[0245] According to one embodiment, the second sensor module (500) may include a waterproof member (530). The waterproof member (530) may be configured to seal a gap between a hole of a support member (360) that accommodates the second sensor module (500) and an outer surface of the second sensor module (500).

[0246] According to one embodiment, the waterproof member (530) may include, but is not limited to, an O-ring. The waterproof member (530) may be configured to limit and / or block foreign substances or moisture from the outside of the wearable electronic device (101) from entering the inside of the wearable electronic device (101).

[0247] Referring to FIG. 14, the second sensor module (500) may include a waterproof member (530), a sensor component (510), a third circuit board (540), or a third signal line (545).

[0248] According to one embodiment, the sensor component (510) may include, but is not limited to, a barometric pressure sensor.

[0249] According to one embodiment, the sensor component (510) may be placed or positioned on a third circuit board (540). The third circuit board (540) may include at least one of a printed circuit board, a flexible printed circuit board, or an RF-PCB.

[0250] According to one embodiment, the third circuit board (540) may be electrically connected to a second circuit board (e.g., the second circuit board (380) of FIG. 13). For example, the third region (540C) of the third circuit board (540) may include a connector, and the connector of the third region may be physically and / or electrically connected to the second circuit board. The third region (540C) of the third circuit board (540) may include a plurality of layers and at least one conductive via (547). The conductive via (547) may be configured to transmit a signal from a circuit or component disposed in one layer to a circuit or component disposed in another layer, but is not limited thereto. The third region (540C) of the third circuit board (540) may include a member (548) disposed on one surface of the third region. The above-described member (548) may be positioned between the third region (540C) of the third circuit board (540) and the side bezel member (e.g., the side bezel member (310) of FIG. 13). The member (548) may include a buffer member including a sponge. The member (548) may include an adhesive member configured to adhere the third region (540C) of the third circuit board (540) and the side bezel member. The adhesive member may include, but is not limited to, at least one of a bond or a double-sided tape.

[0251] According to one embodiment, the third signal line (545) may be configured to detect moisture or humidity that has entered the third circuit board (540). The third signal line (545) may be electrically connected to a processor (e.g., the processor (120) of FIG. 1) disposed on the second circuit board. For example, the third signal line (545) may be electrically connected to the second circuit board via a connector disposed in the third region (540C) of the third circuit board (540). A description of a configuration in which the processor detects the inflow of moisture or humidity by using the third signal line (545) may refer to the description of a configuration in which the processor detects the inflow of moisture or humidity by using the first signal line (445) described with reference to FIGS. 10A and 10B as examples.

[0252] Although not shown, the wearable electronic device (101) may further include a speaker module. The speaker module may include a waterproof member or signal line. The processor may be configured to detect moisture or humidity entering the speaker module using the signal line.

[0253] FIG. 15 is a plan view illustrating a first sensor module, a second sensor module, and a first signal line according to one embodiment of the present disclosure.

[0254] FIG. 16 is a plan view illustrating a first sensor module, a second sensor module, and a first signal line according to one embodiment of the present disclosure.

[0255] The embodiments of FIGS. 15 and 16 can be combined with the embodiments of FIGS. 1 to 14.

[0256] Referring to FIGS. 15 and 16 , a wearable electronic device (101) (e.g., the wearable electronic device (101) of FIGS. 2 to 4 ) may include a housing (310), a second circuit board (380), a processor (120) (e.g., the processor (120) of FIG. 1 ), a first sensor module (400) (e.g., the first sensor module (500) of FIGS. 5 to 7 ), or a second sensor module (500) (e.g., the second sensor module (500) of FIGS. 13 to 14 ).

[0257] According to one embodiment, the first sensor module (400) and the second sensor module (500) may be spaced apart from each other. The first sensor module (400) and the second sensor module (500) may be configured to detect an external environmental condition of the wearable electronic device (101). The external environmental condition detected by the first sensor module (400) and the second sensor module (500) may be information about different types of environmental conditions.

[0258] According to one embodiment, the first sensor module (400) may include a microphone. The second sensor module (500) may include a pressure sensor.

[0259] According to one embodiment, the processor (120) may be electrically connected to the first sensor module (400) and the second sensor module (500) via signal lines (600, 700).

[0260] Referring to FIG. 15, the processor (120) can be electrically connected to the first sensor module (400) and the second sensor module (500) via a signal line (600).

[0261] According to one embodiment, the signal line (600) may include a first line (601) connected to the processor (120), and a second line (602) branched from the first line (601).

[0262] According to one embodiment, at least a portion of the second line (602) may be connected to the first line (601).

[0263] According to one embodiment, one end of the second line (602) may be electrically connected to a first signal line of the first sensor module (400) (e.g., the first signal line (445) of FIG. 9A). The other end of the sub-line (602) may be electrically connected to a third signal line of the second sensor module (500) (e.g., the second signal line (545) of FIG. 14).

[0264] According to one embodiment, the processor (120) may assign the RX channel of the touch circuit to the signal line (600). The processor (120) may detect, through the first line (601) and the second line (602), that moisture has entered the first sensor module (400) and a capacitance change has occurred, or that moisture has entered the second sensor module (500) and a capacitance change has occurred.

[0265] Referring to FIG. 16, the processor (120) can be electrically connected to the first sensor module (400) and the second sensor module (500) via a signal line (700).

[0266] According to one embodiment, the signal line (700) may include a first connection line (701) and a second connection line (702).

[0267] According to one embodiment, the first connection line (701) and the second connection line (702) may be separate lines. The first connection line (701) and the second connection line (702) may each be electrically connected to the processor (120).

[0268] According to one embodiment, the first connection line (701) may be electrically connected to a first signal line of the first sensor module (400) (e.g., the first signal line (445) of FIG. 9A).

[0269] According to one embodiment, the second connection line (702) may be electrically connected to a third signal line of the second sensor module (500) (e.g., the second signal line (545) of FIG. 14).

[0270] According to one embodiment, the processor (120) may assign one RX channel of the touch circuit to a first connection line (701). The processor (120) may assign another RX channel of the touch circuit to a second connection line (702).

[0271] According to one embodiment, the processor (120) can detect, through the first connection line (701), that moisture has entered the first sensor module (400) and a change in capacitance has occurred.

[0272] According to one embodiment, the processor (120) can detect, through the second connection line (702), that moisture has entered the second sensor module (500) and a change in capacitance has occurred.

[0273] According to one embodiment, the processor may be configured to determine or confirm that moisture has entered the sensor modules (400, 500) based on a change in capacitance. For example, the processor may provide information to a user of the wearable electronic device based on the determination or confirmation that moisture has entered or is present in at least one of the first sensor module (400) and the second sensor module (500). The information provided to the user may be output as a visual image on a display of the wearable electronic device (e.g., display (320) of FIG. 4). The information provided to the user may be output as an acoustic message through a speaker of the wearable electronic device. The information provided to the user may be output to the user through another device (e.g., electronic device (102) of FIG. 1) communicatively connected to the wearable electronic device. Accordingly, the user can recognize a state in which there is a risk that the waterproof member (e.g., the waterproof member (430) of FIG. 6 or the waterproof member (530) of FIG. 14) is damaged and moisture (10) may flow into the sensor component (410). Accordingly, replacement or repair of the waterproof member can be induced. For example, if it is determined or confirmed that moisture has flowed only into the first sensor module (400), the processor can output information to the user guiding that repair is necessary for the first sensor module (400) or the waterproof member associated with the first sensor module (400). For example, if it is determined or confirmed that moisture has flowed only into the second sensor module (500), the processor can output information to the user guiding that repair is necessary for the second sensor module (500) or the waterproof member associated with the second sensor module (500).For example, if it is determined or confirmed that moisture has entered both the first sensor module (400) and the second sensor module (500), the processor may output information to the user indicating that repair is required for the sensor modules (400, 500) or waterproofing components associated with the sensor modules (400, 500).

[0274] The wearable electronic devices described with reference to FIGS. 5 to 16 as examples may be smartwatches, but are not limited thereto. For example, the configuration for detecting moisture flowing into the sensor module described with reference to FIGS. 5 to 16 as examples may also be applied to other types of wearable electronic devices (e.g., augmented reality devices or virtual reality devices of the glasses type or head-mounted type). In addition, the configuration for detecting moisture flowing into the sensor module described with reference to FIGS. 5 to 16 as examples may also be applied to bar-type electronic devices (e.g., smartphones or tablet PCs). In addition, the configuration for detecting moisture flowing into the sensor module described with reference to FIGS. 5 to 16 as examples may also be applied to foldable electronic devices in which at least a portion of the display is foldable, or rollable electronic devices in which the area of ​​the display exposed to the outside is expandable.

[0275] A wearable electronic device may include a sensor module for sensing an external environmental condition of the wearable electronic device. The sensor module may obtain information from the outside of the wearable electronic device through a hole formed in the housing of the wearable electronic device. The wearable electronic device may include a waterproof member for preventing external moisture from entering the sensor of the sensor module.

[0276] Meanwhile, if the waterproof / dustproofing material is damaged, foreign substances or moisture may enter the interior of the wearable electronic device.

[0277] According to one embodiment of the present disclosure, an electronic device capable of detecting the inflow of external moisture or humidity into the interior of a sensor module or electronic device may be provided.

[0278] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0279] According to one embodiment of the present disclosure, a waterproof structure capable of blocking external moisture or humidity from entering the interior of a sensor module or an electronic device and an electronic device including the same can be provided.

[0280] According to one embodiment of the present disclosure, a signal line and an electronic device including the same can be provided that can detect that external moisture or humidity is flowing into a sensor module due to damage to a waterproof structure.

[0281] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0282] According to one embodiment of the present disclosure, the electronic device (101) may include a housing (310) that forms at least a portion of an outer surface of the electronic device (101) and includes a first through hole (312).

[0283] According to one embodiment, the electronic device (101) may include a sensor module (400) disposed inside the housing (310).

[0284] According to one embodiment, the sensor module (400) may include a sensor (413) configured to detect an external environmental condition of the electronic device (101) through the first through hole (312).

[0285] According to one embodiment, the sensor module (400) may include a sensor housing (411) that accommodates the sensor (413) and includes an opening (412).

[0286] According to one embodiment, it may include a circuit board (440) including a first region (440A) facing the first through hole (312) and a second region (440B) facing the sensor (413).

[0287] According to one embodiment, the circuit board (440) may include a second through hole (442) at least partially aligned with the opening (412).

[0288] According to one embodiment, the circuit board (440) may include a signal line (445) arranged substantially surrounding the second through hole (442).

[0289] According to one embodiment, the signal line (445) may be configured to detect moisture flowing into the second through hole (442) or the surroundings of the second through hole (442) through the first through hole (312).

[0290] According to one embodiment, the electronic device (101) may further include a processor (120).

[0291] According to one embodiment, the electronic device (101) may further include a memory (130) that stores at least one instruction.

[0292] According to one embodiment, the at least one instruction, when executed by the processor (120), may cause the electronic device (101) to: check a capacitance change value using the signal line (445), and determine, based on the capacitance change value, whether moisture is present in the second through hole (442) or the surroundings of the second through hole (442).

[0293] According to one embodiment, the sensor (413) may include a microphone and a microphone hole at least partially aligned with the opening (412).

[0294] According to one embodiment, the electronic device (101) may further include a membrane (430) disposed between the first through hole (312) and the first area (440A) of the circuit board (440).

[0295] According to one embodiment, the electronic device (101) may further include an adhesive member (463) disposed between the circuit board (440) and the membrane (430) and including an opening (463a) at least partially aligned with at least one of the first through hole (312) or the second through hole (442).

[0296] According to one embodiment, the electronic device (101) may further include a first plate (450) disposed between the circuit board (440) and the membrane (430) and including a first plate opening (452) at least partially aligned with at least one of the first through hole (312) or the second through hole (442).

[0297] According to one embodiment, the electronic device (101) may further include a second plate (470) disposed between the first plate (450) and the membrane (430) and including a plurality of second plate openings (472).

[0298] According to one embodiment, the size of each of the plurality of second plate openings (472) may be smaller than the size of the first plate opening (452).

[0299] According to one embodiment, the second through hole (442) may be at least partially aligned with the first through hole (312).

[0300] According to one embodiment, the electronic device (101) may further include a fixing member (490) coupled to the housing (310) so that the sensor module (400) is maintained aligned with the first through hole (312) of the housing (310).

[0301] According to one embodiment, the first through hole (312) may be formed on a lateral side of the housing (310).

[0302] According to one embodiment, the circuit board (440) may further include a third region (440C) extending from the first region (440A) and the second region (440B).

[0303] According to one embodiment, at least a portion of the third region (440C) may be disposed between the fixing member (490) and the sensor (413).

[0304] According to one embodiment, the signal line (445) may extend from the first region (440A) to the third region (440C).

[0305] According to one embodiment, the circuit board (440) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

[0306] According to one embodiment, the elasticity or thickness of the third region (440C) may be different from the elasticity or thickness of other regions of the circuit board (440).

[0307] According to one embodiment, the electronic device (101) may further include another circuit board (380) disposed inside the housing (310) and including a processor (120).

[0308] According to one embodiment, the circuit board (440) may further include another signal line (443) electrically connected to the sensor (413) and the other circuit board (380).

[0309] According to one embodiment, the signal line (445) may be arranged on a first layer of the circuit board (440). The other signal line (443) may be arranged on a second layer of the circuit board (440).

[0310] According to one embodiment of the present disclosure, the electronic device (101) may include a housing (310) that forms at least a portion of an outer surface of the electronic device (101) and includes a first through hole (312).

[0311] According to one embodiment, the electronic device (101) may include a display (320) disposed on the housing (310).

[0312] According to one embodiment, the electronic device (101) may include a sensor module (400, 500) disposed inside the housing (310), the sensor module (400, 500) including a signal line (445) configured to detect moisture flowing into the sensor module (400, 500).

[0313] According to one embodiment, the electronic device (101) may include at least one processor (120).

[0314] According to one embodiment, the electronic device (101) may include a memory (130) that stores at least one instruction.

[0315] According to one embodiment, the at least one instruction, when executed by the at least one processor (120), may cause the electronic device (101) to: check a capacitance change value using the signal line (445), determine whether moisture is flowing into the sensor module (400, 500) based on the capacitance change value, and output information about the inflow of moisture through the display (320) based on the determination that moisture has flowed into the sensor module (400, 500).

[0316] According to one embodiment, the sensor module (400, 500) may include a plurality of signal lines (4452, 4453) that are separated from each other.

[0317] According to one embodiment, any one of the plurality of signal lines (4452) may be arranged in a first region of the sensor module (400, 500).

[0318] According to one embodiment, another one (4453) of the plurality of signal lines may be arranged in a second zone of the sensor module (400).

[0319] According to one embodiment, the at least one instruction, when executed by the at least one processor (120), may cause the electronic device (101) to: check a capacitance change value using the plurality of signal lines (4452, 4453), determine whether moisture has entered the first zone or the second zone based on the capacitance change value, and output information about the zone into which moisture has entered through the display (320) based on the determination of the zone into which moisture has entered.

[0320] According to one embodiment, the sensor module (400, 500) may include a sensor (413) configured to detect an external environmental condition of the electronic device (101) through the first through hole (312).

[0321] According to one embodiment, the sensor module (400, 500) may include a sensor housing (411) that accommodates the sensor (413) and includes an opening (412).

[0322] According to one embodiment, the sensor module (400, 500) may include a circuit board (440) including a first region (440A) facing the first through hole (312) and a second region (440B) facing the sensor (413).

[0323] According to one embodiment, the sensor module (400, 500) may further include a waterproof member (430, 530) disposed between the circuit board (440) and the first through hole (312).

[0324] According to one embodiment, the waterproofing member (430, 530) may include at least one of a membrane (430) or an O-ring (530).

[0325] According to one embodiment, the sensor module (400, 500) may include a barrel (420) disposed on the inner surface of the housing (310).

[0326] According to one embodiment, the sensor module (400, 500) may include a third through hole (422) formed in the barrel (420) and at least partially aligned with the first through hole (312).

[0327] According to one embodiment, it may include a seal (424) disposed between the housing (310) and the outer surface of the barrel (420).

[0328] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), A housing (310) forming at least a portion of the outer surface of the electronic device (101) and including a first through hole (312); and It includes a sensor module (400) placed inside the housing (310), The above sensor module (400) is A sensor (413) configured to detect an external environmental condition of the electronic device (101) through the first through hole (312); A sensor housing (411) that accommodates the above sensor (413) and includes an opening (412); and A circuit board (440) including a first region (440A) facing the first through hole (312) and a second region (440B) facing the sensor (413), The above circuit board (440) is a second through hole (442) at least partially aligned with the above opening (412); and It includes a signal line (445) substantially arranged to surround the second through hole (442), The above signal line (445) is An electronic device configured to detect moisture flowing into the second through hole (442) or the surroundings of the second through hole (442) through the first through hole (312).

2. In paragraph 1, processor (120); and It further includes a memory (130) for storing at least one instruction, The at least one instruction, when executed by the processor (120), causes the electronic device (101) to: Check the capacitance change value using the above signal line (445), An electronic device configured to determine the presence of moisture flowing into the second through hole (442) or the surroundings of the second through hole (442) based on the capacitance change value.

3. In either of paragraphs 1 and 2, The above sensor (413) is an electronic device including a microphone and a microphone hole at least partially aligned with the opening (412).

4. In any one of paragraphs 1 to 3, An electronic device further comprising a membrane (430) disposed between the first through hole (312) and the first area (440A) of the circuit board (440).

5. In any one of paragraphs 1 to 4, An electronic device further comprising an adhesive member (463) disposed between the circuit board (440) and the membrane (430) and including an opening (463a) at least partially aligned with at least one of the first through hole (312) or the second through hole (442).

6. In any one of paragraphs 1 to 5, An electronic device further comprising a first plate (450) disposed between the circuit board (440) and the membrane (430) and including a first plate opening (452) at least partially aligned with at least one of the first through hole (312) or the second through hole (442).

7. In any one of paragraphs 1 to 6, Further comprising a second plate (470) disposed between the first plate (450) and the membrane (430) and including a plurality of second plate openings (472), An electronic device wherein each of the plurality of second plate openings (472) has a size smaller than the size of the first plate opening (452).

8. In any one of paragraphs 1 to 7, The above second through hole (442) is An electronic device at least partially aligned with the first through hole (312).

9. In any one of paragraphs 1 to 8, An electronic device further comprising a fixing member (490) coupled to the housing (310) so that the sensor module (400) is maintained aligned with the first through hole (312) of the housing (310).

10. In any one of paragraphs 1 to 9, The above first through hole (312) is An electronic device formed on the lateral side of the above housing (310).

11. In any one of paragraphs 1 to 9, The above circuit board (440) is Further comprising a third region (440C) extending from the first region (440A) and the second region (440B), At least a portion of the third area (440C) It is placed between the above fixed member (490) and the sensor (413), The above signal line (445) is an electronic device extending from the first region (440A) to the third region (440C).

12. In any one of paragraphs 1 to 11, The elasticity or thickness of the third region (440C) is Electronic devices having different elasticity or thickness in different areas of the circuit board (440).

13. In any one of paragraphs 1 to 12, It further includes another circuit board (380) disposed inside the housing (310) and including a processor (120), The above circuit board (440) is It further includes another signal line (443) electrically connected to the above sensor (413) and the other circuit board (380), The above signal line (445) is arranged on the first layer of the circuit board (440), The other signal line (443) is an electronic device arranged on the second layer of the circuit board (440).

14. In any one of paragraphs 1 to 13; The electronic device further includes a display (320) disposed on the housing (310); The electronic device is an electronic device that outputs information about the inflow of moisture through the display (320) based on the determination of moisture inflow.

15. In any one of paragraphs 1 to 14, The above sensor module (400, 500) A barrel (420) arranged on the inner surface of the above housing (310); a third through hole (422) formed in the barrel (420) and at least partially aligned with the first through hole (312); and An electronic device further comprising a seal (424) disposed between the housing (310) and the outer surface of the barrel (420).

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