Electronic device and air tightness test method for microphone

Abstract

The present application relates to the technical field of communication. Disclosed are an electronic device and an air tightness test method for a microphone. The electronic device comprises: a circuit board, the circuit board being provided with a first sound guide hole and having a first surface and a second surface arranged opposite each other; a reinforcing plate, the reinforcing plate being arranged on the first surface and located at the first sound guide hole, and the reinforcing plate being provided with a second sound guide hole; and a microphone, the microphone being arranged on the second surface and located at the first sound guide hole, wherein a sound cavity of the microphone is in communication with the second sound guide hole by means of the first sound guide hole.

Description

Air tightness detection method of electronic device and microphone

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202410478461.3, filed on April 19, 2024, and entitled "Air tightness detection method of electronic device and microphone", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0003] The present application belongs to the field of communication technology, and particularly relates to an air tightness detection method of electronic device and microphone. BACKGROUND

[0004] With the continuous development of communication technology, electronic devices have become an important carrier for human-computer interaction, and not only need to meet the basic functions of daily communication and entertainment, but also gradually improve the performance pursued by users. For example, for the microphone of an electronic device, it is necessary to record clearer details, sounds from a farther distance, and less noise to improve its performance.

[0005] In order to obtain a microphone with a higher signal-to-noise ratio, the current technical measure is to increase the diaphragm of the microphone to pick up finer sound vibration signals in the air. The diaphragm is usually made of silicon, and after its size is increased, the stress resistance is also decreased accordingly. For example, when the substrate of the microphone is bent due to the acting force or is impacted due to the falling of the electronic device, the diaphragm is easily broken due to the stress problem. Therefore, when the microphone is fixed on the circuit board by welding, the stress environment requirement is relatively strict, but there are usually many high-stress devices on the circuit board, which makes the setting of the microphone have many limitations. SUMMARY

[0006] The purpose of the embodiments of the present application is to provide an air tightness detection method of electronic device and microphone, which can solve the problem that the current microphone has a higher requirement for its stress environment.

[0007] In order to solve the above technical problems, the present application is implemented as follows:

[0008] In a first aspect, the present application provides an electronic device, comprising: a circuit board, the circuit board being provided with a first sound guide hole, the circuit board having a first surface and a second surface arranged oppositely; a reinforcing plate, the reinforcing plate being arranged on the first surface, and the reinforcing plate being located at the first sound guide hole, the reinforcing plate being provided with a second sound guide hole; and a microphone, the microphone being arranged on the second surface, and the microphone being located at the first sound guide hole, an acoustic cavity of the microphone being in communication with the second sound guide hole through the first sound guide hole.

[0009] In a second aspect, the present application provides a method for detecting air tightness of a microphone, applied to the electronic device described above. The method comprises: detecting that a pressure head of a detection device is pressed against one side of the reinforcing plate away from the circuit board, and a jig of the detection device is fixed to one side of the circuit board away from the reinforcing plate; inflating a gas head of the detection device into the second sound guide hole, the first sound guide hole and the sound cavity of the microphone to obtain a first pressure value; obtaining a second pressure value after a preset time period; and determining whether the air tightness of the microphone is qualified according to the first pressure value and the second pressure value.

[0010] In the embodiment of the present application, the reinforcing plate is arranged on the first surface of the circuit board, and the microphone is arranged on the second surface of the circuit board. The sound cavity of the microphone is connected with the second sound guide hole of the reinforcing plate through the first sound guide hole of the circuit board, so as to pick up sound. The scheme arranges the reinforcing plate on the circuit board at the position corresponding to the microphone, so as to enhance the structural strength of the circuit board, thereby reducing the requirement of the microphone on the stress environment, avoiding the diaphragm from being broken when the circuit board is bent due to the acting force or the electronic device is impacted due to falling, and thereby prolonging the service life of the microphone. Therefore, the embodiment of the present application can solve the problem that the microphone has a high requirement on the stress environment. BRIEF DESCRIPTION OF DRAWINGS

[0011] FIG. 1 is a partial structure schematic diagram of an electronic device disclosed by the embodiment of the present application;

[0012] FIGS. 2 and 3 are partial structure schematic diagrams of the electronic device disclosed by the embodiment of the present application in another perspective view;

[0013] FIG. 4 is a cross-sectional view of the partial structure of the electronic device disclosed by the embodiment of the present application;

[0014] FIG. 5 is an assembly structure schematic diagram of the microphone, the circuit board and the detection device disclosed by the embodiment of the present application;

[0015] FIG. 6 is a structure schematic diagram of the electronic device disclosed by the embodiment of the present application.

[0016] Explanation of reference signs: 100-circuit board, 110-first sound guide hole, 120-first surface, 130-second surface, 140-annular groove, 150-USB socket, 160-pressure spring, 170-radio frequency test seat, 180-antenna spring, 190-SIM card seat, 191-battery BTB connector; 200-stiffening plate, 210-second sound guide hole, 220-annular flange; 300-microphone; 400-annular sealing element; 500-connection bump; 600-frame, 610-sound guide channel, 620- accommodating groove; 700-battery cover plate; 800-sealing ring; 900-detection equipment, 910-pressing head, 911-ventilation hole, 920-jig, 921-avoidance groove, 930-inflatable head, 931-air guide channel. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without any creative work under the premise that the embodiments in the present application are within the scope of protection of the present application.

[0018] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a class, and are not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0019] The airtightness detection method of the electronic device and the microphone provided by the embodiments of the present application will be described in detail below in combination with the drawings, through specific embodiments and application scenarios.

[0020] As shown in FIGS. 1-6, the electronic device disclosed in the embodiments of the present application comprises a circuit board 100, a reinforcing plate 200 and a microphone 300. The circuit board 100 is provided with a first sound guide hole 110. The first sound guide hole 110 penetrates the circuit board 100, i.e. the central axis of the first sound guide hole 110 extends along the thickness direction of the circuit board 100. Optionally, the first sound guide hole 110 can be a circular hole, a rectangular hole, etc. The embodiments of the present application do not make specific limitations in this regard. The circuit board 100 has a first surface 120 and a second surface 130 arranged oppositely. The reinforcing plate 200 is arranged on the first surface 120, i.e. the reinforcing plate 200 is stacked on the circuit board 100, and the reinforcing plate 200 is located at the first sound guide hole 110. The reinforcing plate 200 is provided with a second sound guide hole 210. The second sound guide hole 210 penetrates the reinforcing plate 200, i.e. the central axis of the second sound guide hole 210 extends along the thickness direction of the reinforcing plate 200. Optionally, in the thickness direction of the circuit board 100, the orthographic projection of the first sound guide hole 100 can at least partially coincide with the orthographic projection of the second sound guide hole 210, so as to facilitate the propagation of sound. Optionally, the second sound guide hole 210 can be a circular hole, a rectangular hole, etc. The embodiments of the present application do not make specific limitations in this regard. The microphone 300 is arranged on the second surface 130, and the microphone 300 is located at the first sound guide hole 110. The sound cavity of the microphone 300 is connected with the second sound guide hole 210 through the first sound guide hole 110, so that sound propagates into the sound cavity of the microphone 300, thereby facilitating the microphone 300 to pick up sound. Optionally, the microphone 300 is sealingly connected with the circuit board 100, so as to avoid sound leakage, thereby improving the acoustic performance of the microphone 300.

[0021] In the embodiments of the present application, the reinforcing plate 200 is arranged on the first surface 120 of the circuit board 100, and the microphone 300 is arranged on the second surface 130 of the circuit board 100. The sound cavity of the microphone 300 is connected with the second sound guide hole 210 of the reinforcing plate 200 through the first sound guide hole 110 of the circuit board 100, so that the microphone 300 picks up sound. This scheme arranges the reinforcing plate 200 on the circuit board 100 at the position corresponding to the microphone 300, so as to enhance the structural strength of the circuit board 100, thereby reducing the requirement of the microphone 300 on the stress environment, avoiding the diaphragm from being broken when the circuit board 100 is bent due to external force or the electronic device is impacted due to falling, thereby improving the service life of the microphone 300. Therefore, the embodiments of the present application can solve the problem that the microphone 300 has a relatively high requirement on the stress environment.

[0022] In an optional embodiment, the projection of the reinforcing plate 200 in the direction perpendicular to the circuit board 100 can partially overlap the projection of the microphone 300; or in another embodiment, the projection of the reinforcing plate 200 in the direction perpendicular to the circuit board 100 covers the projection of the microphone 300, i.e., the projection area of the reinforcing plate 200 is greater than or equal to the projection area of the microphone 300, so as to further improve the structural strength of the position of the microphone 300 on the circuit board 100, thereby reducing the requirement of the microphone 300 on the stress environment.

[0023] In an optional embodiment, one of the reinforcing plate 200 and the circuit board 100 is provided with an annular flange 220, and the other is provided with an annular groove 140. At least part of the annular flange 220 is located in the annular groove 140, and the annular flange 220 cooperates with the annular groove 140. Both the annular flange 220 and the annular groove 140 surround the first sound guide hole 110. In this scheme, at least part of the annular flange 220 is located in the annular groove 140, i.e., the annular flange 220 forms a shielding part. When assembling other structures on the circuit board 100, the shielding part can prevent impurities from entering the sound cavity of the microphone 300, thereby ensuring good acoustic performance of the microphone 300. Of course, the opposite two faces of the reinforcing plate 200 and the circuit board 100 can also be flat surfaces, and the two are attached to prevent impurities from entering the sound cavity of the microphone 300.

[0024] Optionally, the annular flange 220 and the annular groove 140 described above can be formed by stamping, so that the continuity of the reinforcing plate 200 and the circuit board 100 is better.

[0025] In another optional embodiment, the reinforcing plate 200 and the first face 120 of the circuit board 100 can be directly attached; or the electronic device further includes an annular sealing member 400, which is arranged between the reinforcing plate 200 and the circuit board 100. The annular sealing member 400 is in sealing cooperation with the reinforcing plate 200 and the circuit board 100, respectively. The annular sealing member 400 surrounds the first sound guide hole 110 and is in communication with the second sound guide hole 210 through the inner hole of the annular sealing member 400. This scheme sets the annular sealing member 400 to avoid the assembly gap between the reinforcing plate 200 and the circuit board 100 from leaking sound, thereby improving the sealing performance of the sound transmission channel formed by the first sound guide hole 110 and the second sound guide hole 210, and further improving the acoustic performance of the microphone 300. In addition, the annular sealing member 400 can also act as a shielding member. When assembling other structures on the circuit board 100, the shielding member can prevent impurities from entering the sound cavity of the microphone 300, thereby ensuring good acoustic performance of the microphone 300.

[0026] Further, in some optional embodiments, at least one of the orthographic projection of the first sound guide hole 110 and the orthographic projection of the second sound guide hole 210 can partially coincide with the orthographic projection of the annular sealing member 400 in a direction perpendicular to the circuit board 100. In this case, the annular sealing member 400 will hinder the propagation of sound, and the energy loss will be large. Based on this, in other embodiments, the orthographic projection of the first sound guide hole 110 and the orthographic projection of the second sound guide hole 210 are both located within the inner contour line of the orthographic projection of the annular sealing member 400. That is, the cross-sectional area of the space surrounded by the inner annular surface of the annular sealing member 400, the cross-sectional area of the first sound guide hole 110, and the cross-sectional area of the second sound guide hole 210 are all greater than the cross-sectional area of the first sound guide hole 110 and the cross-sectional area of the second sound guide hole 210. Here, the cross-sectional area refers to the cross-sectional area of the space surrounded by the inner annular surface of the annular sealing member 400, the first sound guide hole 110, and the second sound guide hole 210 in a cross section parallel to the circuit board 100. By using this arrangement, the annular sealing member 400 can be prevented from hindering the propagation of sound, so as to ensure that the sound propagates smoothly from the second sound guide hole 210 to the first sound guide hole 110, thereby reducing the energy loss and improving the acoustic performance of the microphone 300.

[0027] Optionally, the reinforcing plate 200 and the circuit board 100 can be connected by screws, bolts, or other connecting members. Alternatively, in another embodiment, the electronic device further includes at least two connecting protrusions 500, each of which is connected between the reinforcing plate 200 and the circuit board 100, and each of which is arranged at intervals along the circumference of the first sound guide hole 110. By using multiple connecting protrusions 500 to connect the reinforcing plate 200 and the circuit board 100, the adhesion of the annular sealing member 400 can be improved, and the reinforcing plate 200 and the circuit board 100 can be prevented from being provided with connecting holes, thereby ensuring the structural strength of the reinforcing plate 200 and the circuit board 100.

[0028] Optionally, the annular sealing member 400 can be a deformable member. When the annular sealing member 400 is in sealing cooperation with the reinforcing plate 200 and the circuit board 100, the annular sealing member 400 can be in a deformed state, thereby improving the sealing performance of the annular sealing member 400. Further, the annular sealing member 400 can be a foam. Alternatively, in other embodiments, the annular sealing member 400 is an annular solder pad, which is soldered between the reinforcing plate 200 and the circuit board 100. This not only improves the adhesion and sealing performance of the annular sealing member 400, but also serves as a connecting member between the reinforcing plate 200 and the circuit board 100, thereby eliminating the need for additional connecting members. That is, the annular sealing member 400 has a dual-purpose effect.

[0029] In an optional embodiment, the at least one connecting bump 500 is a soldering bump, which is soldered between the reinforcing plate 200 and the circuit board 100, so as to further improve the connection reliability between the reinforcing plate 200 and the circuit board 100, and improve the adhesion and sealing performance of the annular sealing member 400. Of course, the connecting bump 500 can also be an adhesive bump.

[0030] Optionally, when the annular sealing member 400 is an annular soldering pad, and / or the at least one connecting bump 500 is a soldering bump, reflow soldering can be used for soldering, which has less thermal shock to the components, and only applies solder paste to the required position, so as to control the amount of solder paste applied, avoid the generation of defects such as bridging, and correct the slight deviation of the placement position of the components by the surface tension of the molten solder, so as to improve the position accuracy of the reinforcing plate 200.

[0031] In a further optional embodiment, one of the reinforcing plate 200 and the circuit board 100 is provided with an annular flange 220, and the other is provided with an annular groove 140, at least part of the annular flange 220 is located in the annular groove 140, and an annular air guide channel is formed between the outer circumferential surface of the annular flange 220 and the side wall of the annular groove 140, that is, the annular flange 220 and the annular groove 140 are in clearance fit, the annular flange 220 and the annular groove 140 are both arranged around the first sound guide hole 110, the annular sealing member 400 and the connecting bumps 500 are both arranged around the annular flange 220, and optionally, in the radial direction of the annular sealing member 400, the annular sealing member 400, the connecting bumps 500 and the annular flange 220 can be arranged in sequence. When the annular sealing member 400 is an annular soldering pad, and / or the at least one connecting bump 500 is a soldering bump, during the soldering process, there are bubbles in the soldering tin, which are broken after being heated, at which time the solder tin splashes outward, and the annular flange 220 acts as a shielding part to block the part of the solder tin from entering the sound cavity of the microphone 300 to affect the vibration of the diaphragm; at the same time, the annular air guide channel can meet the requirement of air ventilation during soldering. Of course, a shielding part can also be additionally arranged between the reinforcing plate 200 and the circuit board 100, which is arranged around the first sound guide hole 110.

[0032] In another optional embodiment, the annular sealing member 400 can be arranged adjacent to the central region of the reinforcing plate 200, or the annular sealing member 400 can be arranged adjacent to the edge of the reinforcing plate 200, and each connecting bump 500 is located inside the annular sealing member 400. In this case, the space surrounded by the reinforcing plate 200, the annular sealing member 400 and the circuit board 100 can be used to expand the volume of the sound transmission channel, thereby improving the acoustic performance of the microphone 300. When the annular sealing member 400 is arranged adjacent to the edge of the reinforcing plate 200, the reinforcing plate 100 and the circuit board 100 can be connected by the connecting bumps 500 during the assembly of the electronic device, and then the annular sealing member 400 is arranged outside the annular arrangement of the connecting bumps 500, so as to facilitate the arrangement of the annular sealing member 400 and ensure that the sound transmission channel formed by the first sound guide hole 110 and the second sound guide hole 210 has good sealing performance. Of course, each connecting bump 500 can also be located outside the annular sealing member 400.

[0033] In an optional embodiment, the circuit board 100 is a secondary board. Optionally, the thickness of the secondary board can be 0.4 mm, and the secondary board can be formed by laminating 4 or 6 sub-boards, of course, the thickness of the secondary board can also be selected according to actual needs, and the embodiments of the present application do not make specific limitations in this regard. Since the thickness of the secondary board is small, but there are many devices arranged around the microphone 300 on the secondary board, such as the USB socket 150, the loudspeaker, the plurality of pressure springs 160 of the motor, the radio frequency test seat 170, the antenna spring 180, the SIM card seat 190 and the battery B TB connector 191, etc. Among them, there are some devices that need to be frequently plugged and unplugged, such as the USB socket 150, which is usually assembled in a hidden manner on the middle frame of the electronic device, and then buckled with the board-to-board connector on the secondary board. When the user plugs and unplugs the data line, the USB socket 150 has a pushing and pulling force in the front and back directions of the secondary board, which is close to the microphone 300. The SIM card seat 190 and the card holder are generally interference fit, and have an upward lifting force on the secondary board after the card holder is inserted. Therefore, by arranging the reinforcing plate 200 on the secondary board, the structural strength of the secondary board can be improved to avoid deformation of the secondary board when plugging and unplugging the data line or installing the card holder. Of course, the circuit board 100 can also be a main board. Optionally, the thickness of the main board can be 0.7 mm, and the main board can be formed by laminating 10 or 12 sub-boards, of course, the thickness of the main board can also be selected according to actual needs, and the embodiments of the present application do not make specific limitations in this regard.

[0034] In an optional embodiment, the electronic device further comprises a frame 600 and a battery cover plate 700. The frame 600 is provided with a sound guide channel 610. The circuit board 100 is arranged in an accommodating space surrounded by the frame 600. The sound cavity of the microphone 300 is connected to the sound guide channel 610 through the first sound guide hole 110 and the second sound guide hole 210, and is used to transmit external sound into the sound cavity of the microphone 300, so that the microphone 300 can pick up sound. Optionally, at least one of the top of the frame 600 and the bottom of the frame 600 is provided with a sound transmission hole connected to the sound guide channel 610, which is used to transmit external sound into the sound cavity of the microphone 300. The battery cover plate 700 is arranged on the frame 600, and the battery cover plate 700 is provided with a sound pickup hole connected to the sound cavity of the microphone 300. Therefore, the microphone 300 can pick up sound through the sound guide channel 610 of the frame 600, and can also pick up sound through the sound pickup hole of the battery cover plate 700, so as to realize multi-directional sound acquisition, which is beneficial to improve the acoustic performance of the electronic device.

[0035] In an optional embodiment, the reinforcing plate 200 can be attached to the frame 600. Alternatively, the frame 600 is provided with an accommodating groove 620, and the electronic device further comprises a sealing ring 800. At least part of the sealing ring 800 is arranged in the accommodating groove 620. The sealing ring 800 surrounds the sound guide channel 610 and is sealingly connected to the accommodating groove 620 and the reinforcing plate 200, so as to avoid sound leakage at this position, thereby improving the sealing performance of the sound transmission channel formed by the sound guide channel 610, the second sound guide hole 210 and the first sound guide hole 110, and further improving the acoustic performance of the microphone 300. In addition, when the frame 600 is installed with the sealing ring 800 through the accommodating groove 620, the sealing ring 800 occupies less additional space, which is beneficial to the thin design of the electronic device.

[0036] Based on the electronic device disclosed in the embodiments of the present application, the embodiments of the present application further disclose a method for detecting the air tightness of a microphone. The method is applied to the electronic device described in any of the above embodiments, and comprises the following steps:

[0037] In S100, the pressure head 910 of the detection device 900 is pressed against the side of the reinforcing plate 200 away from the circuit board 100, and the jig 920 of the detection device 900 is fixed to the side of the circuit board 100 away from the reinforcing plate 200.

[0038] In this step, the pressing head 910 is used to fix the reinforcing plate 200, and the jig 920 is used to fix the circuit board 100, so as to avoid shaking of the circuit board 100 and the reinforcing plate 200 in the testing process. The microphone 300 arranged on the circuit board 100 is located in the avoiding groove 921 of the jig 920, and the air hole 911 of the pressing head 910 is arranged opposite to the second sound guide hole 210 of the reinforcing plate 200 and is in communication with the second sound guide hole 210. Optionally, the pressing head 910 can be made of flexible materials such as silica gel and foam, so that the pressing head 910 is pressed to the reinforcing plate 200 with a certain pre-pressure, so as to ensure that the pressing head 910 and the reinforcing plate 200 have good sealing performance.

[0039] S200, the inflation head 930 of the detection equipment 900 is inflated into the sound cavity of the second sound guide hole 210, the first sound guide hole 110 and the microphone 300, and a first pressure value is obtained.

[0040] The inflation head 930 is overlapped with the pressing head 910, the air guide channel 931 of the inflation head 930 is in communication with the air hole 911 of the pressing head 910, so that the gas in the air guide channel 931 enters the air hole 911, the second sound guide hole 210, the first sound guide hole 110 and the sound cavity of the microphone 300 in sequence, and when the gas is filled, the inflation is stopped, and the first pressure value is obtained.

[0041] S300, after a preset time length, a second pressure value is obtained, and whether the air tightness of the microphone 300 is qualified is judged according to the first pressure value and the second pressure value.

[0042] After the preset time length, the second pressure value is obtained, and the second pressure value is compared with the first pressure value. If the difference between the first pressure value and the second pressure value is greater than a preset value, it indicates that the gas leaks, and there may be tin defects, cracks and other welding defects, and further sealing measures need to be taken. If the difference between the first pressure value and the second pressure value is less than or equal to the preset value, it indicates that the sealing performance of the above-mentioned sound transmission channel is good, and the next process can be performed. It should be noted that the preset time length can be a period of time, which can be selected according to actual needs, and the present application embodiment does not make specific limitation.

[0043] The electronic device disclosed in the present application embodiment can be a smart phone, a tablet computer, an electronic book reader, a wearable device (such as a smart watch), an electronic game machine and the like, and the type of the electronic device is not limited in the present application embodiment.

[0044] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.

Claims

1. An electronic device, comprising: The electronic device comprises: a circuit board (100) provided with a first sound guide hole (110), the circuit board (100) having a first surface (120) and a second surface (130) arranged oppositely; a reinforcing plate (200) arranged on the first surface (120) and located at the first sound guide hole (110), the reinforcing plate (200) being provided with a second sound guide hole (210); a microphone (300) arranged on the second surface (130) and located at the first sound guide hole (110), an acoustic cavity of the microphone (300) being in communication with the second sound guide hole (210) through the first sound guide hole (110).

2. The electronic device of claim 1, wherein, In a direction perpendicular to the circuit board (100), the reinforcing plate (200) covers the microphone (300) in projection. 3.The electronic device of claim 1, wherein, One of the reinforcing plate (200) and the circuit board (100) is provided with an annular flange (220), and the other is provided with an annular groove (140), at least part of the annular flange (220) is located in the annular groove (140), the annular flange (220) is matched with the annular groove (140), and the annular flange (220) and the annular groove (140) are arranged around the first sound guide hole (110).

4. The electronic device of claim 1, wherein, The electronic device further comprises an annular sealing member (400) arranged between the reinforcing plate (200) and the circuit board (100), the annular sealing member (400) is sealingly matched with the reinforcing plate (200) and the circuit board (100) respectively, the annular sealing member (400) is arranged around the first sound guide hole (110), and the first sound guide hole (110) is in communication with the second sound guide hole (210) through an inner hole of the annular sealing member (400).

5. The electronic device of claim 4, wherein, In a direction perpendicular to the circuit board (100), the first sound guide hole (110) and the second sound guide hole (210) are located within an inner contour line of the annular sealing member (400) in projection.

6. The electronic device of claim 4, wherein, The electronic device further comprises at least two connecting bumps (500), each of the connecting bumps (500) is connected between the reinforcing plate (200) and the circuit board (100), and each of the connecting bumps (500) is arranged along a circumferential direction of the first sound guide hole (110).

7. The electronic device of claim 6, wherein, The annular sealing member (400) is an annular pad, and the annular sealing member (400) is welded between the reinforcing plate (200) and the circuit board (100). At least one of the connecting bumps (500) is a welding point, and the welding point is welded between the reinforcing plate (200) and the circuit board (100).

8. The electronic device of claim 7, wherein, One of the reinforcing plate (200) and the circuit board (100) is provided with an annular flange (220), and the other is provided with an annular groove (140), at least part of the annular flange (220) is located in the annular groove (140), an annular air guide channel is formed between the outer circumferential surface of the annular flange (220) and the side wall of the annular groove (140), the annular flange (220) and the annular groove (140) are both arranged around the first sound guide hole (110), and the annular sealing element (400) and each of the connecting protrusions (500) are both arranged around the annular flange (220).

9. The electronic device of claim 6, wherein, The annular sealing element (400) is arranged adjacent to the edge of the reinforcing plate (200), and each of the connecting protrusions (500) is located on the inner side of the annular sealing element (400). 10.The electronic device of claim 1, wherein, The circuit board (100) is a sub-board. 11.The electronic device of claim 1, wherein, The electronic device further comprises a frame (600) and a battery cover plate (700), the frame (600) is provided with a sound guide channel (610), the circuit board (100) is arranged in an accommodating space surrounded by the frame (600), the sound cavity of the microphone (300) is connected with the sound guide channel (610) through the first sound guide hole (110) and the second sound guide hole (210), and the battery cover plate (700) is arranged on the frame (600), the battery cover plate (700) is provided with a sound pickup hole, and the sound pickup hole is connected with the sound cavity of the microphone (300).

12. The electronic device of claim 11, wherein, The frame (600) is provided with an accommodating groove (620), and the electronic device further comprises a sealing ring (800), at least part of the sealing ring (800) is arranged in the accommodating groove (620), the sealing ring (800) is arranged around the sound guide channel (610), and the sealing ring (800) is in sealing cooperation with the accommodating groove (620) and the reinforcing plate (200) respectively.

13. A method for detecting air tightness of a microphone, applied to the electronic device of any one of claims 1 to 12, wherein, The air tightness detection method comprises: A pressure head (910) of a detection device (900) is pressed on a side of the reinforcing plate (200) away from the circuit board (100), and a jig (920) of the detection device (900) is fixed on a side of the circuit board (100) away from the reinforcing plate (200); An inflation head (930) of the detection device (900) inflates into the second sound guide hole (210), the first sound guide hole (110) and the sound cavity of the microphone (300), and a first pressure value is obtained; After a preset time period, a second pressure value is obtained, and whether the air tightness of the microphone (300) is qualified is determined according to the first pressure value and the second pressure value.

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