Semiconductor product packaging device

Abstract

The present invention relates to the field of semiconductor product packaging, and specifically to a semiconductor product packaging device. The device comprises a plurality of chambers sequentially communicated with each other, a transport mechanism, a frame structure, a hot-pressing and sintering-based coating mechanism, and a pressing mechanism. The plurality of chambers sequentially comprise a front sealed transfer chamber, a pre-heating chamber, a sintering chamber, a cooling chamber, and a rear sealed transfer chamber. The transport mechanism is used for driving tools to transfer among the chambers. The frame structure comprises an outer fixing frame, a flexible connection ring and an inner lifting / lowering frame which are sequentially connected from outside to inside, and lifting / lowering driving mechanisms connected to the inner lifting / lowering frame to drive the inner lifting / lowering frame to lift / lower, wherein the inner lifting / lowering frame surrounds the top opening of the sintering chamber. The hot-pressing and sintering-based coating mechanism comprises an unwinding assembly and a winding assembly, wherein a coating unwound by the unwinding assembly sealingly passes through the inner lifting / lowering frame and then is wound by the winding assembly. The present invention can guarantee a low-oxygen environment of a sintering chamber, and can conveniently achieve coating supply with high quality, thereby simplifying the structure of the device, and improving sintering quality and efficiency.

Description

Semiconductor product packaging device TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor product packaging, in particular to a semiconductor product packaging device. BACKGROUND

[0002] Semiconductor product packaging needs to go through preheating, sintering and cooling three processes. In the sintering process, the chip on the semiconductor product is pressed by the pressure head of the pressing mechanism. In general, a layer of film is needed to be interposed between the pressing device and the semiconductor product to prevent damage to the chip. New film is used for each hot pressing. In addition, the oxygen content in the sintering environment is strictly limited to reduce the oxygen content as much as possible to avoid oxidation.

[0003] In the patent with the patent name of chip packaging system and the application number of CN202311727181.3, in order to interpose new film between the pressure head and the semiconductor product during each sintering, a film interposing device and a film removing device are provided. The working process of the film interposing device is that the film discharge unit discharges the strip film, the film cutting unit cuts the strip film to form the film material, the holding unit adsorbs the film material, and then the film carrying unit drives the holding unit and the film material adsorbed by the holding unit to move to realize film interposition. After hot pressing, the film material is removed by the film removing device. The working process of the film removing device is that the cover plate on the tool placed on the film removing table is removed in advance, the film removing unit is driven by the film removing moving unit to move downward, the sealing seat presses the film material on the bottom plate to form a sealed cavity again, then gas is filled into the sealed cavity, the film material in the separation cavity moves upward and bulges, and the film material is pressed by the pressing rod at the position opposite to the limiting area of the chip to prevent the chip and the film material from moving upward together, so as to realize the separation of the film material and the chip.

[0004] Therefore, in the patent with the patent name of chip packaging system, the structure of the film interposing device and the film removing device which continuously interpose new film between the pressure head and the semiconductor product is very complex, and the process is very complicated, resulting in a complex and large structure of the whole chip packaging system and low production efficiency. In addition, due to the existence of the film interposing device and the film removing device, the probability of outside air entering the sintering chamber is also greater, and it is difficult to maintain a low-oxygen environment.

[0005] In the patent with the patent name of online hot pressing equipment with vacuum function and the application number of CN202311341007.5, a film unwinding end and a film winding end are arranged in the sintering cavity. The film unwinding end and the film winding end are located on both sides of the pressing device and move up and down synchronously with the pressing device. The film unwound by the film unwinding end enters the film winding end after passing through the lower surface of the pressing device.

[0006] In the patent of the online hot-pressing equipment with vacuum function, although the continuous supply of the film can be realized and the structure is simplified to a certain extent, there are still many problems: the winding end and the unwinding end are lifted synchronously with the pressing device, share a lifting power mechanism, and the load of the lifting power mechanism is increased; the winding end and the unwinding end are lifted in the sintering cavity, the space of the sintering cavity must be increased, and the volume of the entire packaging equipment is also increased; the unused film roll on the winding end is deformed and has low strength due to being in the high temperature of the sintering cavity for a long time; and the winding end and the unwinding end are inconvenient to change the roll.

[0007] Therefore, it is urgent to design a better semiconductor product packaging equipment to solve the above technical problems. SUMMARY

[0008] The technical problem to be solved by the present application is to overcome the defects of the prior art, provide a semiconductor product packaging equipment which can guarantee a low-oxygen environment of a sintering chamber, and can conveniently and high-quality realize film supply, simplify the equipment structure, and improve the sintering quality and efficiency.

[0009] In order to solve the above technical problems, the technical scheme of the present application is as follows: a semiconductor product packaging equipment, comprising:

[0010] A plurality of chambers are sequentially communicated, and are sequentially a front sealing transfer chamber, a preheating chamber, a sintering chamber, a cooling chamber and a rear sealing transfer chamber;

[0011] A conveying mechanism is used to drive the tooling to transfer between the chambers;

[0012] A frame structure comprises an outer fixed frame, a flexible connecting ring and an inner lifting frame which are sequentially connected from outside to inside, and a lifting driving mechanism connected with the inner lifting frame to drive the inner lifting frame to lift, the flexible connecting ring is used to seal the gap between the outer fixed frame and the inner lifting frame, and the inner lifting frame surrounds the outer periphery of the top opening of the sintering chamber;

[0013] A hot-pressing and sintering film mechanism comprises a unwinding assembly and a winding assembly, the film unwound by the unwinding assembly is wound by the winding assembly after passing through the inner lifting frame;

[0014] A pressure bonding mechanism is used to press the semiconductor product through the film after the inner lifting frame drives the film to move downward to a preset position.

[0015] Further, in order to facilitate the firm connection between the flexible connecting ring and the outer fixed frame and the inner lifting frame, the outer fixed frame and the inner lifting frame are at least two layers of structure stacked up and down, the outer ring part of the flexible connecting ring is press-bonded between two layers of the outer fixed frame, and the inner ring part is press-bonded between two layers of the inner lifting frame.

[0016] Further, in order to improve the sealing and the connection strength between the flexible connecting ring and the outer fixed frame and the inner lifting frame, the outermost edge of the outer ring part and the innermost edge of the inner ring part are thickened parts, and the gap formed between two layers of the outer fixed frame and the inner lifting frame has a widened part, and the thickened parts are sealed and extruded between the corresponding widened parts.

[0017] Further, the inner lifting frame is a three-layer structure arranged in layers, i.e., an upper layer, an intermediate layer, and a lower layer, the inner ring part is crimped between the intermediate layer and the lower layer, the film passes through the gap between the upper layer and the intermediate layer, and the two side edges of the film extend outward beyond the inner sides of the intermediate layer and the lower layer and do not reach the outer sides of the intermediate layer and the lower layer.

[0018] Further, in order to reduce the amount of oxygen entering the sintering chamber as much as possible along with the film, the structure formed by the upper layer and the intermediate layer is provided with an anti-permeation structure at the front half of the front end and the rear half of the rear end, respectively, the anti-permeation structure includes a protruding rib provided on one of the upper layer and the intermediate layer and a groove provided on the other, and the film passes through the gap between the protruding rib and the groove.

[0019] Further, the semiconductor product packaging device further comprises a crimping plate connected to the inner lifting frame through a plurality of elastic connection structures and located below the inner lifting frame, the crimping plate has a crimping frame corresponding to each of the cavities of the tool, and the crimping frame is used for crimping the non-chip part of the edge of the semiconductor product; wherein,

[0020] During the descent of the inner lifting frame, the crimping plate is first driven to descend by the elastic connection structure, so that the crimping frame is pressed against the non-chip part of the edge of the semiconductor product, and then the elastic connection structure is compressed and continues to descend to make the film tightly adhere to the crimping plate.

[0021] Further, in order to prevent the deformation of the tool from affecting the hot-pressing sintering, the bottom of each cavity of the tool is hollowed out, the tool support plate of the sintering chamber has a protruding part corresponding to each cavity of the tool, and when the tool is transferred to the tool support plate by the conveying mechanism, the protruding part supports the semiconductor product on the tool from the hollowed-out part of the bottom.

[0022] Further, the front sealing transfer chamber and the rear sealing transfer chamber respectively comprise:

[0023] The cabinet has a transfer cavity inside, the transfer cavity has a first transfer port at the end away from other cavities and a second transfer port at the end close to other cavities, and the first transfer port and / or the second transfer port is provided with a gate mechanism for opening or blocking the same;

[0024] A plurality of air curtains are arranged in the cabinet in a direction from the first transfer port to the second transfer port and above the first transfer port;

[0025] A suction box is arranged below the bottom of the transfer chamber. The suction box forms a suction chamber separated from the transfer chamber and below the first transfer port. The top of one end of the suction chamber is closed, and the top of the other end is provided with an air flow port in communication therewith. The air flow port is located at the end of the first transfer port of the transfer chamber and at the bottom of the transfer chamber. The end of the top of the suction chamber is provided with a suction port for connecting to a suction device.

[0026] A gas blowing assembly includes a first gas blowing pipe and a second gas blowing pipe, both of which are used to communicate with a gas source for supplying protective gas. The first gas blowing pipe is arranged in the transfer chamber at the end of the first transfer port. The first gas blowing pipe is provided with a plurality of first air holes facing the first transfer port. The second gas blowing pipe is arranged in the chamber at the end of the second transfer port. The second gas blowing pipe is provided with a plurality of second air holes.

[0027] Further, the unwinding assembly includes an unwinding end, an unwinding sliding roller, and at least one unwinding guide roller.

[0028] The winding assembly includes a winding end, a winding sliding roller, and at least one winding guide roller. Wherein,

[0029] The film unwound by the unwinding end passes through the unwinding sliding roller, the unwinding guide roller, the winding guide roller, and the winding sliding roller in sequence and is wound by the winding end. A part of the film between the unwinding assembly and the winding assembly is sealed through the inner lifting frame as an effective area.

[0030] The unwinding sliding roller and the winding sliding roller are respectively located above the film and are configured to be able to slide up and down. In the case where the effective area does not move down to the preset position, the unwinding sliding roller and the winding sliding roller have an up-sliding space.

[0031] Further, the conveying mechanism includes:

[0032] A conveying rod is used to transfer a tool. The tool and the conveying rod are provided with a positioning pin and a positioning groove, respectively.

[0033] An X-axis moving unit is arranged on the rack and has an output end moving in the X-axis direction.

[0034] A first decoupling structure is movably connected to the output end of the X-axis moving unit in the Z-axis direction and enables the output end of the X-axis moving unit to drive the first decoupling structure and the conveying rod to move in the X-axis direction.

[0035] A Z-axis moving unit is arranged on the frame and has an output end moving along the Z-axis direction;

[0036] A second decoupling structure is movably connected to the output end of the Z-axis moving unit along the X-axis direction and enables the output end of the Z-axis moving unit to drive the second decoupling structure and the carrying rod to move along the Z-axis direction.

[0037] The Z-axis moving unit drives the carrying rod to move upward so that the positioning pin is inserted into the positioning groove, and when the carrying rod holds the bottom of the tooling, the X-axis moving unit drives the tooling to move along the X-axis direction through the carrying rod.

[0038] After the above technical scheme is adopted, the front sealing transfer chamber of the first lane and the rear sealing transfer chamber of the last lane are used to reduce the amount of external air entering the sintering chamber from the inlet and outlet of the equipment as much as possible, the hot-pressing sintering film covering mechanism is used to realize the connection and film feeding, and the entire frame structure is used to ensure the sealing of the entire sintering chamber even if the film roll is externally arranged, so as to ensure the low-oxygen environment of the sintering chamber and conveniently supply high-quality film to the sintering chamber, thereby simplifying the structure of the equipment and improving the sintering quality and efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0039] Fig. 1 is a structural schematic diagram of a semiconductor product packaging equipment according to the present application;

[0040] Fig. 2 is a structural schematic diagram of a frame structure and a sintering chamber according to the present application;

[0041] Fig. 3 is a sectional view of Fig. 2;

[0042] Fig. 4 is an enlarged view of part A of Fig. 3;

[0043] Fig. 5 is a structural schematic diagram of a front sealing transfer chamber and a preheating chamber according to the present application;

[0044] Fig. 6 is a sectional view of Fig. 5;

[0045] Fig. 7 is a structural schematic diagram of a hot-pressing sintering film covering mechanism according to the present application;

[0046] Fig. 8 is a structural schematic diagram of a carrying mechanism according to the present application;

[0047] Fig. 9 is an enlarged view of part A of Fig. 8;

[0048] Fig. 10 is an enlarged view of part B of Fig. 8;

[0049] Fig. 11 is a three-dimensional schematic diagram of a carrying rod, a first decoupling structure and a second decoupling structure according to the present application;

[0050] Fig. 12 is a structural schematic diagram of a tooling according to the present application;

[0051] In the figure: 1, front sealing transfer chamber; 11, machine box; 12, transfer cavity; 121, first transfer port; 122, second transfer port; 13, air curtain; 14, suction box; 141, air flow port; 142, suction port; 15, suction cavity; 16, first blowing pipe; 17, second blowing pipe; 18, gate mechanism; 2, preheating chamber; 3, sintering chamber; 31, tool support plate; 311, protruding part; 4, cooling chamber; 5, rear sealing transfer chamber; 6, carrying mechanism; 61, carrying rod; 611, positioning pin; 62, X-axis moving unit; 63, first decoupling structure; 631, first decoupling seat; 632, sliding block; 633, guide rail; 64, Z-axis moving unit; 65, second decoupling structure; 651, second decoupling seat; 6511, slide; 7, frame structure; 71, outer fixed frame; 72, flexible connecting ring; 721, thickened part; 73, inner lifting frame; 731, upper layer; 7311, protruding rib; 732, middle layer; 7321, groove; 733, lower layer; 74, lifting driving mechanism; 701, widened part; 8, hot-pressing sintering film coating mechanism; 81, unwinding assembly; 811, unwinding end; 812, unwinding sliding roller; 813, unwinding guide roller; 82, winding assembly; 821, winding end; 822, winding sliding roller; 823, winding guide roller; 83, film coating; 84, winding length detection device; 9, pressure bonding mechanism; 10, tooling; 101, positioning groove; 110, pressure bonding plate; 1101, pressure bonding frame; 120, elastic connecting structure; 130, machine frame. DETAILED DESCRIPTION

[0052] In order to make the content of the present application more easily understood, the present application will be further described in detail below according to specific embodiments and in conjunction with the accompanying drawings.

[0053] Embodiment one

[0054] As shown in FIGS. 1-12, a semiconductor product packaging device comprises:

[0055] A plurality of chambers in sequence, in sequence, front sealing transfer chamber 1, preheating chamber 2, sintering chamber 3, cooling chamber 4 and rear sealing transfer chamber 5;

[0056] Carrying mechanism 6 for driving tooling 10 to transfer between chambers;

[0057] Frame structure 7, comprising outer fixed frame 71, flexible connecting ring 72 and inner lifting frame 73 connected in sequence from outside to inside, and lifting driving mechanism 74 connected with inner lifting frame 73 to drive inner lifting frame 73 to lift, flexible connecting ring 72 is used to seal the gap between outer fixed frame 71 and inner lifting frame 73, and inner lifting frame 73 surrounds the outer periphery of the top opening of sintering chamber 3;

[0058] The hot-pressing sintering film coating mechanism 8 comprises a film unwinding assembly 81 and a film winding assembly 82. The film 83 unwound by the film unwinding assembly 81 is wound by the film winding assembly 82 after passing through the inner lifting frame 73.

[0059] The pressure joint mechanism 9 is used to press the film 83 tightly against the semiconductor product after the inner lifting frame 73 drives the film 83 to move downward to the preset position.

[0060] The working process of the whole semiconductor product packaging equipment is as follows. The tooling 10 carrying the semiconductor product enters the front sealing transfer chamber 1 from the equipment entrance under the action of the conveying mechanism 6, and then passes through the front sealing transfer chamber 1 to the preheating chamber 2. After preheating in the preheating chamber 2, the tooling 10 reaches the sintering chamber 3 under the action of the conveying mechanism 6. The lifting drive mechanism 74 first drives the inner lifting frame 73 to drive the film 83 to move downward to the preset position. The pressure joint mechanism 9 then presses the film 83 tightly on the chip of the semiconductor product through the pressure head. After hot-pressing sintering, the pressure joint mechanism 9 and the inner lifting frame 73 are reset, the film winding assembly 82 winds the used film 83, and the conveying mechanism 6 conveys the tooling 10 to the cooling chamber 3. After cooling is completed in the cooling chamber 3, the tooling 10 is conveyed out of the equipment from the rear sealing transfer chamber 5.

[0061] Specifically, the front sealing transfer chamber 1 at the first stage and the rear sealing transfer chamber 5 at the last stage are used to reduce the amount of external air entering the sintering chamber 3 as much as possible from the entrance and exit of the equipment. The hot-pressing sintering film coating mechanism 8 is used to realize the connection and film feeding. The whole frame structure 7 is used to ensure the sealing of the sintering chamber 3 even if the film roll is outside, so as to ensure the low-oxygen environment of the sintering chamber 3 and conveniently supply high-quality film 83 to the sintering chamber 3. The equipment structure is simplified, and the sintering quality and efficiency are improved.

[0062] The flexible connecting ring 72 can be a silica gel sealing cover, which can seal the gap between the outer fixed frame 71 and the inner lifting frame 73 and will not interfere with the lifting of the inner lifting frame 73.

[0063] Embodiment Two

[0064] Based on the embodiment one, as shown in FIGS. 3 and 4, the outer fixed frame 71 and the inner lifting frame 73 are at least two layers stacked in an up-down manner. The outer ring part of the flexible connecting ring 72 is pressure jointed between two layers of the outer fixed frame 71, and the inner ring part is pressure jointed between two layers of the inner lifting frame 73.

[0065] In this way, the connection between the flexible connecting ring 72 and the outer fixed frame 71 and the inner lifting frame 73 is facilitated. Bonding, welding or other connection methods can also be used or added.

[0066] Embodiment Three

[0067] On the basis of embodiment two, as shown in FIGS. 3, 4, the outermost edge of the outer ring portion and the innermost edge of the inner ring portion are thickened portions 721, and the gap between two layers of the outer fixed frame 71 and the inner lifting frame 73 has a widened portion 701, and the thickened portion 721 is sealed and extruded between the corresponding widened portion 701.

[0068] Specifically, through the cooperation of the thickened portion 721 and the widened portion 701, the sealing and the firmness of the connection between the outer ring portion and the outer fixed frame 71 and between the inner ring portion and the inner lifting frame 73 can be improved, and the entry of external gas into the sintering chamber 3 from the connection can be prevented.

[0069] Embodiment four

[0070] On the basis of embodiment two or embodiment three, as shown in FIGS. 3, 4, the inner lifting frame 73 is a three-layer structure arranged in layers, which is an upper layer 731, an intermediate layer 732 and a lower layer 733 in turn, the inner ring portion is crimped between the intermediate layer 732 and the lower layer 733, the film 83 passes through the gap between the upper layer 731 and the intermediate layer 732, and the two side edges of the film 83 outwardly exceed the inner side of the intermediate layer 732 and the lower layer 733, and do not reach the outer side of the intermediate layer 732 and the lower layer 733.

[0071] Specifically, the three-layer structure of the inner lifting frame 733 facilitates assembly and can facilitate cooperation between the film 83 and the flexible connecting ring 72.

[0072] It should be noted that the three-layer structure of the inner lifting frame 73 can be connected as a whole by bolt connection or bonding, welding. When connected by bolts, the bolts can be arranged at the four corner portions of the inner lifting frame 73, outwardly exceeding the film 83 and avoiding the flexible connecting ring 72, so as not to interfere with the passage of the film 83 from the gap between the upper layer 731 and the intermediate layer 732, and also not to affect the sealing connection between the inner ring portion and the inner lifting frame 73.

[0073] Embodiment five

[0074] On the basis of embodiment four, as shown in FIGS. 3, 4, the structure formed by the upper layer 731 and the intermediate layer 732 is provided with a gas-proof structure at the front half of the front end and the rear half of the rear end, respectively, the gas-proof structure includes a protruding rib 7311 arranged on one of the upper layer 731 and the intermediate layer 732 and a groove 7321 arranged on the other, and the film 83 passes through the gap between the protruding rib 7311 and the groove 7321.

[0075] In this way, the contact area between the film and the inner lifting frame 73 can be increased, the passage path can be prolonged, and the passage path has a certain tortuosity, which can reduce the amount of air entering the sintering chamber 3 along with the film 83 from the gap between the upper layer 731 and the intermediate layer 732 as much as possible.

[0076] Embodiment Six

[0077] On the basis of any one of Embodiment One to Embodiment Five, as shown in FIG. 2, FIG. 3 and FIG. 4, the semiconductor product packaging device further comprises a pressure plate 110 connected to the inner lifting frame 73 through a plurality of elastic connecting structures 120 and located below the inner lifting frame 73, the pressure plate 110 has a pressure frame 1101 corresponding to each hole of the tool 10, and the pressure frame 1101 is used to press the non-chip part of the edge of the semiconductor product; wherein,

[0078] In the process of descending the inner lifting frame 73, the pressure plate 110 is first driven to descend by the elastic connecting structure 120, so that the pressure frame 1101 is pressed tightly against the non-chip part of the edge of the semiconductor product, and then the elastic connecting structure 120 is compressed and continues to descend to make the film 83 tightly adhere to the pressure plate 110.

[0079] Specifically, before the pressing head of the pressure mechanism 9 presses the chip on the semiconductor product, the non-chip part of the edge of the semiconductor product is pressed by the pressure plate 110, which can achieve the purpose of positioning the semiconductor product and prevent the semiconductor product from shifting during the process of pressing the chip of the semiconductor product by the pressing head. In addition, the pressure plate 110 also isolates the film 83 from the semiconductor product, leaving a gap between them with the same thickness as the pressure plate 110, avoiding the occurrence of bubbles, wrinkles and other situations caused by the large-area adhesion of the film 83 on the semiconductor product.

[0080] Among them, the elastic connecting structure 120 can play a buffering role in the process of pressing the semiconductor product by the pressure plate 110, avoiding the non-chip part of the edge of the semiconductor product from being damaged. The structure of the elastic connecting structure 120 can be composed of a connecting column, a blocking part and a spring. The upper end of the connecting column is fixedly connected with the inner lifting frame 73, the lower end is slidably connected through the hole on the bending part of the side of the pressure plate 110, the spring is sleeved on the connecting column, the upper end is in abutment with the inner lifting frame 73, and the lower end is in abutment with the bending part of the side of the pressure plate 110. The blocking part is connected to the bottom end of the connecting column, which is used to prevent the pressure plate 110 from being separated from the lower end of the connecting column, and to lift the pressure plate 110 together in the process of lifting the inner lifting frame 73.

[0081] Embodiment Seven

[0082] On the basis of any one of Embodiment One to Embodiment Six, as shown in FIG. 2, FIG. 3 and FIG. 4, the bottom of each hole of the tool 10 is hollow, and the tool support plate 31 of the sintering chamber 3 has a protruding part 311 corresponding to each hole of the tool 10. When the tool 10 is transferred to the tool support plate 31 by the handling mechanism 6, the protruding part 311 lifts the semiconductor product on the tool 10 from the bottom hollow part.

[0083] Specifically, the semiconductor product is held up by the protrusion 311, and is supported by the protrusion 311 during the process that the pressing head of the pressing mechanism 9 hot-presses the chip of the semiconductor product. Thus, even if the tool 10 is deformed or the like, the hot-press sintering of the semiconductor product is not affected, and the semiconductor product is not dependent on the tool 10.

[0084] Embodiment Eight

[0085] On the basis of any one of Embodiments One to Seven, as shown in Figs. 5 and 6, the front sealing transfer chamber 1 and the rear sealing transfer chamber 5 respectively comprise:

[0086] A cabinet 11 has a transfer cavity 12 inside, the transfer cavity 12 has a first transfer port 121 at a far end from other chambers and a second transfer port 122 at a close end to other chambers, and a gate mechanism 13 is arranged at the first transfer port 121 and the second transfer port 122 for opening or blocking the same;

[0087] A plurality of air curtains 13 are distributed in the cabinet 11 in the direction from the first transfer port 121 to the second transfer port 122, and are located above the first transfer port 121;

[0088] An air extraction box 14 is arranged below the cavity bottom of the transfer cavity 12, the air extraction box 14 forms an air extraction cavity 15 which is separated from the transfer cavity 12 and is located below the first transfer port 121, the top of one end of the air extraction cavity 15 is blocked, the top of the other end is provided with an air flow port 141 which is in communication with the air extraction cavity 15, the air flow port 141 is located at the end of the first transfer port 121 of the transfer cavity 12, and is located at the cavity bottom of the transfer cavity 12, the one end of the top of the air extraction cavity 15 is provided with an air extraction port 142 for connecting with an air extraction device;

[0089] A gas blowing assembly comprises a first gas blowing pipe 16 and a second gas blowing pipe 17, both of which are used for communicating with a gas source for supplying protective gas; the first gas blowing pipe 16 is arranged in the transfer cavity 12 at the end of the first transfer port 121, and the first gas blowing pipe 16 is provided with a plurality of first air holes facing the first transfer port 121; the second gas blowing pipe 17 is arranged in the cavity at the end of the second transfer port 122, and the second gas blowing pipe 17 is provided with a plurality of second air holes. The air extraction device extracts the gas in the air extraction cavity 15 through the air extraction port 142, and the air extraction device can be but is not limited to an air extractor or a vacuum pump.

[0090] The front seal transfer chamber 1 and the rear seal transfer chamber 5 in the embodiment are blocked by the shutter mechanism 13 when the first transfer port 121 and the second transfer port 122 do not need to transfer products, so as to prevent outside air from flowing through. It should be noted that the shutter mechanism 13 of the first transfer port 121 and the second transfer port 122 cannot be opened at the same time, so as to minimize the outside air entering other chambers through the front seal transfer chamber 1 or the rear seal transfer chamber 5.

[0091] When the first transfer port 121 is opened for semiconductor product transfer, outside air enters the transfer chamber 12 through the first transfer port 121. At this time, the air curtain 13 is designed to prevent air from spreading from the first transfer port 121 to the second transfer port 122. The air curtains 13 spaced apart in the direction from the first transfer port 121 to the second transfer port 122 form multiple barriers to air flow, prolong the path of air spreading from the first transfer port 121 to the second transfer port 122, and can make most of the air entering the first transfer port 121 be limited in the vicinity of the first transfer port 121, especially prevent air from spreading to the area where the second transfer port 122 is located;

[0092] The air extraction chamber 15 is arranged below the first transfer port 121 to provide a larger accumulation space for air near the first transfer port 121, so that oxygen accumulates in the air extraction chamber 15 and helps to extract more gas in a short time. Once the oxygen enters the air extraction chamber 15 from the air flow port 141, it will flow to the air extraction port 142. The top of the air extraction chamber 15 at the end of the air extraction port 142 is blocked, which can prevent oxygen from returning to the transfer chamber 12 upward, thereby enhancing the control effect of oxygen;

[0093] The air flow port 142 is located at the end of the first transfer port 121 of the air extraction chamber 15, and the air flow port 142 is close to the bottom of the transfer chamber 12. When air is extracted, a negative pressure is formed at the air flow port 142, so as to guide the gas at the bottom of the air extraction chamber 15 to flow to the air flow port 142 and then be discharged from the air extraction chamber 15. This design helps to remove oxygen and other impurities at the bottom of the transfer chamber 12, and effectively controls the oxygen content in the cabinet 11.

[0094] The first blowing pipe 16 and the second blowing pipe 17 are arranged close to the first transfer port 121 and the second transfer port 122 respectively, so that the protective gas blown can directly act on the two key areas. The nitrogen gas blown by the first blowing pipe 16 can form an air flow barrier to prevent external oxygen from entering the transfer cavity 12 through the first transfer port 121, especially when the first transfer port 121 is opened for semiconductor product transfer. The first blowing pipe 16 can quickly blow away the air that may enter, ensuring that the oxygen content in the transfer cavity 12 remains stable. In addition, the first blowing pipe 16 is arranged at the first transfer port 121, so that the tooling 10 carrying the semiconductor product first passes through the nitrogen gas blown by the first blowing pipe 16 for flushing, and then is conveyed backward. In this way, the air carried in the internal gap of the tooling 10 can be blown away, further improving the oxygen content control effect in the transfer cavity 12.

[0095] The second blowing pipe 17 can blow nitrogen gas from the end of the transfer cavity 12 close to the second transfer port 122 to help further displace the oxygen in the transfer cavity 12, so as to ensure that the oxygen content at the end of the second transfer port 122 is effectively controlled, and improve the use efficiency of nitrogen gas.

[0096] In addition, the entire transfer cavity 12 is in a micro-positive pressure environment, thereby reducing the amount of air entering it.

[0097] Embodiment Nine

[0098] On the basis of any one of the embodiments one to eight, as shown in FIG. 7, the unwinding assembly 81 includes an unwinding end 811, an unwinding sliding roller 812, and at least one unwinding guide roller 813.

[0099] The winding assembly 82 includes a winding end 821, a winding sliding roller 822, and at least one winding guide roller 823; wherein,

[0100] The film 83 unwound by the unwinding end 811 is wound by the winding end 821 after passing through the unwinding sliding roller 812, the unwinding guide roller 813, the winding guide roller 823, and the winding sliding roller 822 in sequence. A part of the film 83 between the unwinding assembly 81 and the winding assembly 82 is sealed through the inner lifting frame 73 as an effective area.

[0101] The unwinding sliding roller 812 and the winding sliding roller 822 are respectively located above the film 83 and are configured to be able to slide up and down. In the case that the effective area does not move down to the preset position, the unwinding sliding roller 812 and the winding sliding roller 822 have an upper sliding space.

[0102] Specifically, the embodiment provides the film tension for the unwinding assembly 81 by the gravity of the unwinding sliding roller 812 and provides the film tension for the winding assembly 82 by the winding sliding roller 822. During the process that the pressing mechanism 9 of the hot-pressing sintering station presses the effective area to move downwards, the unwinding sliding roller 812 and the winding sliding roller 822 slide upwards, the film 83 between the unwinding assembly 81 and the winding assembly 82 is lengthened, the effective area can move downwards with the inner lifting frame 73 under the pressing of the lifting driving mechanism 73, reaches the preset position, and then is tightly attached to the chip of the semiconductor product under the pressing of the pressing head of the pressing mechanism 9, thereby protecting the chip. The embodiment can make the effective area move downwards by the upward sliding of the unwinding sliding roller 812 and the winding sliding roller 822 while keeping the height of the unwinding end 811 and the winding end 821 unchanged. The embodiment does not need to place the unwinding end 811 and the winding end 821 in the sintering chamber 3, or even does not need to place the unwinding assembly 81 and the winding assembly 82 in the sintering chamber 3, thereby reducing the space of the sintering chamber 3. In addition, the unused film 83 does not need to be in the high-temperature environment of the sintering chamber 3 for a long time, thereby avoiding the deformation and damage of the film 83. After the film 83 at the unwinding end 811 is used up, the film can be conveniently replaced.

[0103] As shown in FIG. 7, the hot-pressing sintering film coating mechanism further includes two mounting frames, the two mounting frames are respectively provided with sliding rails extending in the up-down direction, the roller seats of the unwinding sliding roller 812 and the winding sliding roller 822 are slidingly installed on the sliding rails of the corresponding mounting frames, the unwinding guide roller 813 is rotationally supported on the mounting frame where the unwinding sliding roller 812 is located, and the winding guide roller 823 is rotationally supported on the mounting frame where the winding sliding roller 822 is located. Of course, the two mounting frames can also be connected as an integral structure.

[0104] As shown in FIG. 7, the hot-pressing sintering film coating mechanism further includes:

[0105] A position detection device for detecting the position of the unwinding sliding roller 812;

[0106] A winding length detection device 84 for detecting the winding length of the winding end 821;

[0107] A control device connected with the displacement detection device, the winding length detection device 84, the unwinding end 811 and the winding end 821 respectively, for:

[0108] The controller controls the winding end 821 to start winding first, and during the winding process of the winding end 821, the film 83 first drives the winding sliding roller 822 to slide upwards, and then drives the unwinding sliding roller 812 to slide upwards. When the unwinding sliding roller 812 slides to a first preset position, the controller controls the unwinding end 811 to start unwinding. When the winding length reaches a preset length, the controller controls the winding end 821 to stop winding, and the unwinding sliding roller 812 slides downwards. When the unwinding sliding roller 812 slides to a second preset position, the controller controls the unwinding end 811 to stop unwinding.

[0109] Specifically, in this way, the length of the film 83 between the unwinding end 811 and the winding end 821 can be ensured to be equal each time the material is fed, and after the unwinding end 811 stops unwinding each time, the unwinding sliding roller 812 is at the same position, which is beneficial to the long-term stable work of the entire film mechanism and even the hot-pressing sintering station.

[0110] The controller is also used to control the unwinding speed of the unwinding end 811 according to the position of the unwinding sliding roller 812 during the winding process of the winding end 821 and the unwinding process of the unwinding end 811. Specifically, the preset stroke interval of the unwinding sliding roller 812 is divided into at least two continuous position intervals. In the same position interval, the same unwinding speed is executed, and in different position intervals, the higher the position, the faster the unwinding speed.

[0111] In this way, the unwinding sliding roller 812 can be well ensured to slide within a certain range, and the relative consistency of the unwinding speed and the winding speed can also be ensured.

[0112] Embodiment Ten

[0113] Based on any one of the embodiments one to nine, as shown in FIG. 8, the conveying mechanism 6 comprises:

[0114] The conveying rod 61 is used to transfer the tooling 10. One of the tooling 10 and the conveying rod 61 is provided with a positioning pin 611, and the other is provided with a positioning groove 101.

[0115] The X-axis moving unit 62 is arranged on the rack 130 and has an output end moving along the X-axis direction.

[0116] The first decoupling structure 63 is movably connected to the output end of the X-axis moving unit 62 along the Z-axis direction, and enables the output end of the X-axis moving unit 62 to drive the first decoupling structure 63 and the conveying rod 61 to move along the X-axis direction.

[0117] The Z-axis moving unit 64 is arranged on the rack 130 and has an output end moving along the Z-axis direction.

[0118] The second decoupling structure 655 movably connects the carrying rod 61 along the X-axis direction to the output end of the Z-axis moving unit 64, and enables the output end of the Z-axis moving unit 64 to drive the second decoupling structure 655 and the carrying rod 61 to ascend and descend along the Z-axis direction;

[0119] The Z-axis moving unit 64 drives the carrying rod 61 to ascend, so that the positioning pin 611 is inserted into the positioning groove 101, and when the carrying rod 61 holds the bottom of the tooling 10, the X-axis moving unit 62 drives the tooling 10 to move along the X-axis direction through the carrying rod 61.

[0120] For the convenience of description, in the embodiment, the X-axis direction can be the left-right direction, the Y-axis direction can be the front-rear direction, and the Z-axis direction can be the up-down direction.

[0121] The carrying mechanism 6 movably installs the carrying rod 61 along the up-down direction to the output end of the X-axis moving unit 62 through the first decoupling structure 63, so that when the output end of the Z-axis moving unit 64 drives the second decoupling structure 65 and the carrying rod 61 to move up and down, the displacement of the up-down movement is not transmitted to the X-axis moving unit 62, thereby reducing the load of the Z-axis moving unit 64. The carrying rod 61 is movably installed along the X-axis direction to the output end of the Z-axis moving unit 64 through the second decoupling structure 65, so that when the output end of the X-axis moving unit 62 drives the first decoupling structure 63 and the carrying rod 61 to move along the X-axis direction, the displacement along the X-axis direction is not transmitted to the Z-axis moving unit 64, thereby reducing the load of the X-axis moving unit 62. The displacement of the lifting rod 63 along the X-axis direction and the Z-axis direction can be independent of each other, the displacement of the X-axis moving unit 62 and the Z-axis moving unit 64 can be individually transmitted to the carrying rod 61, thereby avoiding cumulative errors, improving the precision of the tooling 10 transfer, and meeting the requirements of the automatic production of the semiconductor packaging;

[0122] The layout of the X-axis moving unit 62 and the Z-axis moving unit 64 of the carrying mechanism 6 is also more flexible, and can be arranged separately, so as to fully utilize the space of the semiconductor product packaging equipment. The two are connected together through the carrying rod 61, and the carrying rod 61 can automatically position the tooling 10 on the carrying rod 61 through the process of upward displacement, that is, the positioning pin 611 is automatically inserted into the positioning groove 101. At this time, the tooling 10 cannot be displaced along the X-axis direction relative to the carrying rod 61, so as to realize the synchronous movement of the tooling 10 along the X-axis direction with the carrying rod 61, thereby achieving the purpose of transfer. Therefore, the clamping mechanism for clamping the tooling 10 can be omitted, thereby having the advantages of simplified structure and reduced space requirement.

[0123] As shown in FIG. 9 and FIG. 11, the first decoupling structure 63 comprises a first decoupling seat 631, a sliding block 632 and a guide rail 633, the carrying rod 61 and the first decoupling seat 631 are fixedly connected, the axis of the carrying rod 61 extends in the X-axis mode, the first decoupling seat 631 can be fixedly connected with one end of the carrying rod 61, specifically, the first decoupling seat 631 is fixed to the left end of the carrying rod 61, which is beneficial to expand the distance between the first decoupling seat 631 and the second decoupling seat 651, so as to avoid interference; the sliding block 632 is slidingly installed on the guide rail 633 in the Z-axis direction, one of the guide rail 633 and the sliding block 632 is fixedly connected with the first decoupling seat 631, and the other is fixedly connected with the output end of the X-axis moving unit 62, that is, the guide rail 633 is fixedly connected with the first decoupling seat 631, and the sliding block 632 is fixedly connected with the output end of the X-axis moving unit 62; or, the sliding block 632 is fixedly connected with the first decoupling seat 631, and the guide rail 633 is fixedly connected with the output end of the X-axis moving unit 62; specifically, the embodiment adopts that the sliding block 632 is fixedly connected with the first decoupling seat 631, and the guide rail 633 is fixedly connected with the output end of the X-axis moving unit 62; so as to realize that the carrying rod 61 is connected to the output end of the X-axis moving unit 62 in a mode that can only move up and down, and the X-axis moving unit 62 can drive the carrying rod 61 to move in the X-axis direction.

[0124] As shown in FIG. 10 and FIG. 11, the second decoupling structure 65 comprises a second decoupling seat 651, a slide 6511 is formed in the second decoupling seat 651, the carrying rod 61 is slidingly installed in the slide 6511 in the X-axis direction, the second decoupling seat 651 is fixedly connected with the output end of the Z-axis moving unit 64, and the carrying rod 61 passes through the slide 6511 of the second decoupling seat 651, which means that the carrying rod 61 is limited in the Z-axis direction and the Y-axis direction, the carrying rod 61 is connected to the output end of the Z-axis moving unit 64 in a mode that can only move left and right, and the Z-axis moving unit 64 can drive the carrying rod 61 to move up and down in the Z-axis direction.

[0125] Based on the above ideal embodiments according to the present application, the related personnel can make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the contents in the specification, and must be determined according to the scope of claims.

Claims

1. A semiconductor product packaging device, comprising: a plurality of chambers connected in sequence, in sequence, a front sealing transfer chamber (1), a preheating chamber (2), a sintering chamber (3), a cooling chamber (4) and a rear sealing transfer chamber (5); a conveying mechanism (6) for transferring a tooling (10) between the chambers; a frame structure (7) comprising an outer fixed frame (71), a flexible connecting ring (72) and an inner lifting frame (73) connected in sequence from outside to inside, and a lifting driving mechanism (74) connected to the inner lifting frame (73) to drive the inner lifting frame (73) to lift, the flexible connecting ring (72) is used to seal the gap between the outer fixed frame (71) and the inner lifting frame (73), and the inner lifting frame (73) surrounds the outer periphery of the top opening of the sintering chamber (3); a hot-pressing sintering film coating mechanism (8) comprising an unwinding assembly (81) and a winding assembly (82), the film (83) unwound by the unwinding assembly (81) is wound by the winding assembly (82) after passing through the inner lifting frame (73); a pressure bonding mechanism (9) for pressing the semiconductor product through the film (83) after the inner lifting frame (73) drives the film (83) to move downward to a predetermined position. 2.The semiconductor product packaging device according to claim 1, wherein the outer fixed frame (71) and the inner lifting frame (73) are at least two layers stacked in sequence, and the outer ring part of the flexible connecting ring (72) is pressed between the two layers of the outer fixed frame (71), and the inner ring part is pressed between the two layers of the inner lifting frame (73). 3.The semiconductor product packaging device according to claim 2, wherein the outermost edge of the outer ring part and the innermost edge of the inner ring part are thickened parts (721), and the gap between the two layers of the outer fixed frame (71) and the inner lifting frame (73) has a widened part (701), and the thickened parts (721) are sealed and pressed between the corresponding widened parts (701). 4.The semiconductor product packaging device according to claim 2, wherein the inner lifting frame (73) is a three-layer structure stacked in sequence, comprising an upper layer (731), an intermediate layer (732) and a lower layer (733), the inner ring part is pressed between the intermediate layer (732) and the lower layer (733), the film (83) passes through the gap between the upper layer (731) and the intermediate layer (732), and the two side edges of the film (83) extend outward beyond the inner side of the intermediate layer (732) and the lower layer (733), and do not reach the outer side of the intermediate layer (732) and the lower layer (733). 5.The semiconductor product packaging device according to claim 4, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ The structure formed by the upper layer (731) and the intermediate layer (732) is provided with a front half portion of the front end portion and a rear half portion of the rear end portion, respectively, with a gas permeation prevention structure, which includes a protrusion (7311) provided on one of the upper layer (731) and the intermediate layer (732) and a groove (7321) provided on the other, and the film (83) passes through a gap between the protrusion (7311) and the groove (7321).

6. The semiconductor product packaging apparatus according to claim 1, wherein Further comprising a crimping plate (110) connected to the inner lifting frame (73) through a plurality of elastic connecting structures (120) and located below the inner lifting frame (73), the crimping plate (110) has a crimping frame (1101) corresponding to each of the cavities of the tooling (10), and the crimping frame (1101) is used for crimping with the non-chip part of the edge of the semiconductor product; wherein During the descending of the inner lifting frame (73), the crimping plate (110) is first driven to descend by the elastic connecting structure (120), so that the crimping frame (1101) is pressed against the non-chip part of the edge of the semiconductor product, and then the elastic connecting structure (120) is compressed and continues to descend to make the film (83) tightly adhere to the crimping plate (110).

7. The semiconductor product packaging apparatus according to claim 1, wherein The bottom of each cavity of the tooling (10) is hollowed out, and the tooling support plate (31) of the sintering chamber (3) has a protrusion (311) corresponding to each cavity of the tooling (10), and when the tooling (10) is transferred to the tooling support plate (31) by the conveying mechanism (6), the protrusion (311) supports the semiconductor product on the tooling (10) from the hollowed-out bottom.

8. The semiconductor product packaging apparatus according to claim 1, wherein The front sealing transfer chamber (1) and the rear sealing transfer chamber (5) respectively comprise: A cabinet (11) having a transfer cavity (12) inside, the transfer cavity (12) has a first transfer port (121) away from other cavities and a second transfer port (122) close to other cavities, and the first transfer port (121) and / or the second transfer port (122) are provided with a gate mechanism (18) for opening or blocking them; A plurality of air curtains (13) are distributed in the cabinet (11) in the direction from the first transfer port (121) to the second transfer port (122) and located above the first transfer port (121); An air suction box (14) is arranged below the bottom of the transfer cavity (12), the air suction box (14) is formed with an air suction cavity (15) separated from the transfer cavity (12) and located below the first transfer port (121), the top of one end of the air suction cavity (15) is sealed, and the top of the other end is provided with an air flow port (141) in communication therewith, the air flow port (141) is located at the end of the first transfer port (121) of the transfer cavity (12) and at the bottom of the transfer cavity (12), and the end of the top of the air suction cavity (15) is provided with an air suction port (142) for connecting with an air suction device; The air blowing assembly includes a first air blowing pipe (16) and a second air blowing pipe (17), both of which are used to communicate with a gas source for supplying protective gas; the first air blowing pipe (16) is arranged in the transfer cavity (12) at the end of the first transfer port (121), and the first air blowing pipe (16) is provided with a plurality of first air holes facing the first transfer port (121); the second air blowing pipe (17) is arranged in the cavity at the end of the second transfer port (122), and the second air blowing pipe (17) is provided with a plurality of second air holes.

9. The semiconductor product packaging device according to claim 1, wherein, The unwinding assembly (81) comprises an unwinding end (811), an unwinding sliding roller (812) and at least one unwinding guide roller (813); The winding assembly (82) comprises a winding end (821), a winding sliding roller (822) and at least one winding guide roller (823); wherein, The film (83) unwound by the unwinding end (811) sequentially passes through the unwinding sliding roller (812), the unwinding guide roller (813), the winding guide roller (823) and the winding sliding roller (822) and is then wound by the winding end (821), and a part of the film (83) between the unwinding assembly (81) and the winding assembly (82) is sealed through the inner lifting frame (73) as an effective area; The unwinding sliding roller (812) and the winding sliding roller (822) are respectively located above the film (83) and are configured to be able to slide up and down, and the unwinding sliding roller (812) and the winding sliding roller (822) have an up-sliding space in the case that the effective area does not move down to a preset position.

10. The semiconductor product packaging device according to claim 1, wherein, The conveying mechanism (6) comprises: A conveying rod (61) for transferring a tooling (10), the tooling (10) and the conveying rod (61) are respectively provided with a positioning pin (611) and a positioning groove (101); An X-axis moving unit (62) is arranged on the rack (130) and has an output end moving along the X-axis direction; A first decoupling structure (63) is movably connected to the output end of the X-axis moving unit (62) along the Z-axis direction, and the output end of the X-axis moving unit (62) can drive the first decoupling structure (63) and the conveying rod (61) to move along the X-axis direction. A Z-axis moving unit (64) is arranged on the frame (130) and has an output end moving along the Z-axis direction; A second decoupling structure (65) is movably connected to the output end of the Z-axis moving unit (64) along the X-axis direction, and enables the output end of the Z-axis moving unit (64) to drive the second decoupling structure (65) and the carrying rod (61) to ascend and descend along the Z-axis direction; When the Z-axis moving unit (64) drives the carrying rod (61) to ascend so that the positioning pin (611) is embedded into the positioning groove (101), and the carrying rod (61) holds the bottom of the tooling (10), the X-axis moving unit (62) drives the tooling (10) to move along the X-axis direction through the carrying rod (61).

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