Antenna module and communication device equipped with same

Abstract

An antenna module (100) comprises: a dielectric substrate (130) having a multilayer structure; an antenna patch (122); a ground patch (GND2); and a power supply wiring (142). The ground patch is disposed facing the antenna patch. The antenna patch and the ground patch each include a plurality of strip electrodes stacked in the Z-axis direction, and a plurality of vias connecting the strip electrodes. The power supply wiring includes wirings (1421, 1422) and plate-shaped capacitor electrodes (CP1, CP2). The wiring (1421) penetrates the ground patch and extends in the X-axis direction. The wiring (1422) extends in the X-axis direction, and has one end connected to a power supply point (SP2) of the antenna patch. The capacitor electrode (CP1) is disposed at the end of the wiring line (1421), and the capacitor electrode (CP2) is connected to the other end of the wiring line (1422). In a plan view from the Z-axis direction, the capacitor electrodes (CP1, CP2) at least partially overlap.

Description

Antenna module and communication device equipped with same

[0001] The present disclosure relates to an antenna module and a communication device equipped with the same, and more particularly to a technique for improving the antenna characteristics of a patch antenna with a laminated structure.

[0002] U.S. Patent Application Publication No. 2020 / 0313300 (Patent Document 1) discloses a planar inverted-F antenna (PIFA) including an antenna patch consisting of a plurality of stacked strip electrodes and a plurality of vias connecting the electrodes. By using a patch antenna with such a configuration, radio waves can be radiated in a direction along the main surface of a multilayer substrate.

[0003] U.S. Patent Application Publication No. 2020 / 0313300

[0004] In U.S. Patent Application Publication No. 2020 / 0313300 (Patent Document 1), power is supplied to an antenna patch by capacitive coupling from a feed patch arranged opposite the antenna patch. The feed patch, like the antenna patch, is composed of multiple strip electrodes and multiple vias connecting them.

[0005] In the configuration of U.S. Patent Application Publication No. 2020 / 0313300 (Patent Document 1), the degree of coupling between the feed patch and the antenna patch is determined by the number of layers of the feed patch, i.e., the number of strip electrodes. This makes it difficult to finely adjust the degree of coupling between the feed patch and the antenna patch, and there may be cases where desired antenna characteristics cannot be obtained.

[0006] The present disclosure has been made to solve such problems, and its purpose is to improve the antenna characteristics of a patch antenna having a laminated structure in which multiple strip electrodes are stacked.

[0007] An antenna module according to an aspect of the present disclosure includes a dielectric substrate, an antenna patch and a ground patch provided on the dielectric substrate, and a first feed wiring. The dielectric substrate is configured by stacking multiple dielectric layers in a first direction. The ground patch is disposed opposite the antenna patch. The first feed wiring transmits a high-frequency signal to the antenna patch. The antenna patch and the ground patch include multiple strip electrodes and multiple vias. Each of the multiple strip electrodes is stacked in the first direction on different dielectric layers. The multiple vias electrically connect the multiple strip electrodes. The first feed wiring includes first and second wirings, and first and second capacitor electrodes. The first wiring passes through the ground patch and extends in a second direction from the ground patch toward the antenna patch. The second wiring extends in the second direction, and one end is connected to a first feed point of the antenna patch. The first capacitor electrode is disposed at an end of the first wiring between the ground patch and the antenna patch. The second capacitor electrode is disposed on a different dielectric layer from the first capacitor electrode and is connected to the other end of the second wiring. Each of the first capacitor electrode and the second capacitor electrode has a flat plate shape with the first direction as a normal direction. When viewed from above in the first direction, the first capacitor electrode and the second capacitor electrode at least partially overlap.

[0008] An antenna module according to another aspect of the present disclosure includes a dielectric substrate, a first antenna patch, a second antenna patch, a ground patch, and first and fourth feed lines. The dielectric substrate has a plurality of dielectric layers stacked in a first direction. The first and second antenna patches are arranged adjacent to each other on the dielectric substrate. The ground patch is arranged facing the first and second antenna patches on the dielectric substrate. The first feed line transmits a high-frequency signal to the first antenna patch. The second feed line transmits a high-frequency signal to the second antenna patch. The first antenna patch, the second antenna patch, and the ground patch each include a plurality of strip electrodes and a plurality of vias. Each of the plurality of strip electrodes is stacked in the first direction on different dielectric layers. The plurality of vias electrically connect the plurality of strip electrodes. The first and fourth feed lines include a first line and a second line, and a first and second capacitor electrode. The first wiring penetrates the ground patch and extends in a second direction from the ground patch toward the antenna patch. The second wiring extends in the second direction, with one end connected to a first feed point of the antenna patch. The first capacitor electrode is disposed at an end of the first wiring between the ground patch and the antenna patch. The second capacitor electrode is disposed on a dielectric layer different from the first capacitor electrode and is connected to the other end of the second wiring. Each of the first capacitor electrode and the second capacitor electrode has a flat plate shape with the first direction as its normal direction. When viewed in a plan view from the first direction, the first capacitor electrode and the second capacitor electrode at least partially overlap.

[0009] In the antenna module according to the present disclosure, the power supply wiring that transmits high-frequency signals to the antenna patch includes capacitive coupling between two flat capacitor electrodes facing each other. Each capacitor electrode is a flat electrode that extends along the main surface of the dielectric layer, and the strength of the capacitive coupling can be finely adjusted by adjusting the degree of overlap between the two capacitor electrodes. This improves the antenna characteristics of a patch antenna with a laminated structure in which multiple strip electrodes are stacked.

[0010] 8 is a block diagram of a communication device to which an antenna module according to a first embodiment is applied. FIG. 9 is a side perspective view of the antenna module of FIG. 1 as viewed from the Y-axis direction. FIG. 10 is a side perspective view of the antenna module of FIG. 1 as viewed from the X-axis direction. FIG. 11 is a perspective view for explaining the arrangement of electrodes in the antenna module of FIG. 1. FIG. 12 is a first diagram for explaining an example of the influence on antenna characteristics of the position of a capacitor electrode in a feed wiring. FIG. 13 is a second diagram for explaining an example of the influence on antenna characteristics of the position of a capacitor electrode in a feed wiring. FIG. 14 is a perspective view for explaining the arrangement of electrodes in an antenna module according to a second embodiment. FIG. 15 is a partial side perspective view of an antenna module according to a third embodiment. FIG. 16 is a block diagram showing the diplexer in FIG.

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0012] [First Embodiment] (Basic Configuration of Communication Device) Fig. 1 is a block diagram of a communication device 10 to which an antenna module 100 according to a first embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone, or tablet, or a personal computer with a communication function. An example of the frequency band of radio waves used in the antenna module 100 according to the first embodiment is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, but radio waves in other frequency bands are also applicable.

[0013] 1 , a communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110 that supplies a high-frequency signal, and an antenna device 120. The communication device 10 upconverts a signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates the signal from the antenna device 120, and downconverts a high-frequency signal received by the antenna device 120 and processes the signal in the BBIC 200.

[0014] The antenna device 120 includes antenna groups 130A and 130B arranged on a dielectric substrate 130. The antenna group 130A includes at least one radiating element 121, and the antenna group 130B includes at least one radiating element 122. As will be described later with reference to Fig. 2, the radiation direction of the radio waves radiated from the radiating element 121 and the radiation direction of the radio waves radiated from the radiating element 122 are different.

[0015] Although Fig. 1 shows an example in which four radiating elements are arranged in each of the antenna groups 130A and 130B, the number of radiating elements included in each antenna group is not limited to this. Also, Fig. 1 shows an example in which the radiating elements in each antenna group are arranged in a one-dimensional array in a line, but the radiating elements may be arranged in a two-dimensional array. Alternatively, each antenna group may include a single radiating element.

[0016] The RFIC 110 includes switches 111A to 111H, 113A to 113H, 117A, and 117B, power amplifiers 112AT to 112HT, low-noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase shifters 115A to 115H, signal combiners / dividers 116A and 116B, mixers 118A and 118B, and amplifier circuits 119A and 119B. Of these, the configuration of switches 111A to 111D, 113A to 113D, 117A, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, signal combiner / distributor 116A, mixer 118A, and amplifier circuit 119A constitutes a circuit for high-frequency signals radiated from radiating element 121 of antenna group 130A. In addition, the configuration of switches 111E to 111H, 113E to 113H, 117B, power amplifiers 112ET to 112HT, low-noise amplifiers 112ER to 112HR, attenuators 114E to 114H, phase shifters 115E to 115H, signal combiner / divider 116B, mixer 118B, and amplifier circuit 119B constitutes a circuit for high-frequency signals radiated from radiating element 122 of antenna group 130B.

[0017] When transmitting a high frequency signal, the switches 111A to 111H and 113A to 113H are switched to the power amplifiers 112AT to 112HT, and the switches 117A and 117B are connected to the transmission amplifiers of the amplifier circuits 119A and 119B. When receiving a high frequency signal, the switches 111A to 111H and 113A to 113H are switched to the low noise amplifiers 112AR to 112HR, and the switches 117A and 117B are connected to the reception amplifiers of the amplifier circuits 119A and 119B.

[0018] Signals transmitted from the BBIC 200 are amplified by amplifier circuits 119A and 119B and upconverted by mixers 118A and 118B. The upconverted high-frequency transmission signals are split into four by signal combiners / dividers 116A and 116B, pass through corresponding signal paths, and are fed to different radiating elements 121 and 122, respectively. By individually adjusting the phase shift of phase shifters 115A to 115H arranged on each signal path, the directivity of the radio waves output from the radiating elements in each antenna group can be adjusted. Furthermore, attenuators 114A to 114D adjust the strength of the transmission signals.

[0019] The received signals, which are high-frequency signals received by the radiating elements 121 and 122, are transmitted to the RFIC 110 and then combined in the signal combiners / dividers 116A and 116B via four different signal paths. The combined received signals are down-converted in the mixers 118A and 118B, and further amplified in the amplifier circuits 119A and 119B before being transmitted to the BBIC 200.

[0020] The RFIC 110 is formed as, for example, a one-chip integrated circuit component including the above circuit configuration. Alternatively, the devices (switches, power amplifiers, low-noise amplifiers, attenuators, phase shifters) corresponding to the radiating elements 121 and 122 in the RFIC 110 may be formed as one-chip integrated circuit components for each corresponding radiating element.

[0021] (Configuration of Antenna Module) Next, the configuration of the antenna module 100 according to the first embodiment will be described in detail with reference to Figures 2 to 4. Figures 2 and 3 are side perspective views of the antenna module 100 as viewed from different directions. Also, Figure 4 is a perspective view for explaining the arrangement of electrodes in the antenna module.

[0022] 2 to 4, the antenna module 100 includes, in addition to the dielectric substrate 130, the radiating elements 121 and 122, and the RFIC 110, power supply lines 141 and 142, and ground electrodes GND1 and GND2.

[0023] In the following description, the normal direction of the dielectric substrate 130 is referred to as the Z-axis direction, the arrangement direction of the radiating elements 121 as the X-axis direction, and the arrangement direction of the radiating elements 122 as the Y-axis direction. In each drawing, the positive direction of the Z-axis may be referred to as the upper side, and the negative direction as the lower side. In the following description, the radiating element 122 may also be referred to as the "antenna patch 122," and the ground electrode GND2 may also be referred to as the "ground patch GND2."

[0024] The dielectric substrate 130 is a substrate with a multilayer structure in which multiple dielectric layers are stacked in the Z-axis direction. The dielectric substrate 130 is, for example, a low-temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by stacking multiple resin layers made of resin such as epoxy or polyimide, a multilayer resin substrate formed by stacking multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by stacking multiple resin layers made of fluorine-based resin, or a ceramic multilayer substrate other than LTCC.

[0025] The dielectric substrate 130 includes two opposing main surfaces 131, 132. In the antenna module 100, four radiating elements 121 are arranged spaced apart from one another in a row in the X-axis direction inside a dielectric layer close to the upper main surface 131 (the surface in the positive direction of the Z-axis: the first main surface) of the dielectric substrate 130. The radiating elements 121 may be arranged so as to be exposed on the main surface 131 of the dielectric substrate 130.

[0026] The RFIC 110 is connected to a lower main surface 132 (the surface in the negative direction of the Z axis: the second main surface) of the dielectric substrate 130 by a connecting member 160 such as a solder bump. The RFIC 110 may be attached to the dielectric substrate 130 using a detachable connector. In the dielectric substrate 130, a ground electrode GND1 is arranged on the dielectric layer between the radiating element 121 and the main surface 132 so as to face the radiating element 121.

[0027] A high frequency signal is transmitted from the RFIC 110 to the radiating element 121 via the feed wiring 141. The feed wiring 141 passes from the RFIC 110 through the ground electrode GND1 and is connected to a feed point SP1 of the radiating element 121. By supplying a high frequency signal to the radiating element 121 via the feed wiring 141, a radio wave is radiated from the radiating element 121 in the positive direction of the Z axis (arrow AR1).

[0028] In the dielectric substrate 130, the ground electrode GND1 is electrically connected to the ground patch GND2. The ground patch GND2 is not a single flat plate electrode like the ground electrode GND1, but is a lattice-shaped electrode composed of multiple strip electrodes GP and multiple vias GV, as shown in FIG. 4. Each strip electrode GP is a long, narrow, belt-shaped flat plate electrode extending in the Y-axis direction and arranged on different dielectric layers. When viewed in a plan view from the Z-axis direction, the strip electrodes GP overlap each other. The vias GV are arranged between the dielectric layers and electrically connect the strip electrodes GP to each other. The ground patch GND2 faces the side surface 133 of the dielectric substrate 130 in the positive direction of the X-axis.

[0029] Four antenna patches 122 are spaced apart from one another and arranged in a row in the Y-axis direction between the side surface 133 of the dielectric substrate 130 and the ground patch GND2. Like the ground patch GND2, each antenna patch 122 is a lattice-shaped electrode made up of a plurality of strip electrodes 1221 extending in the Y-axis direction and a plurality of vias 1222 that electrically connect them.

[0030] A high frequency signal is supplied to each antenna patch 122 from the RFIC 110 via a power supply wiring 142. The power supply wiring 142 includes wirings 1421 and 1422 and capacitor electrodes CP1 and CP2.

[0031] The wiring 1421 extends from the RFIC 110 in the Z-axis direction, penetrating the ground electrode GND1 through a via, and further extends from there in the X-axis direction as a strip-shaped plate electrode, penetrating the ground patch GND2, and extending to a region between the antenna patch 122 and the ground electrode GND2 on the dielectric substrate 130. A capacitor electrode CP1 is connected to an end of the wiring 1421 in this region. The capacitor electrode CP1 is a substantially rectangular plate electrode whose normal direction is in the Z-axis direction.

[0032] The wiring 1422 is a strip-shaped flat electrode extending in the X-axis direction. One end of the wiring 1422 is connected to a feed point SP2 of the antenna patch 122. The other end of the wiring 1422 is connected to a capacitor electrode CP2 disposed in a region between the antenna patch 122 and the ground electrode GND2.

[0033] The capacitor electrode CP2 is a substantially rectangular flat plate electrode arranged on a different dielectric layer from the capacitor electrode CP1, with the Z-axis direction as its normal direction. When viewed from above in the Z-axis direction, the capacitor electrodes CP1 and CP2 are arranged so that at least a small portion of them overlap. This results in capacitive coupling between the capacitor electrodes CP1 and CP2.

[0034] Furthermore, the wiring 1421 of the power supply wiring 142 may be provided with a matching device MN, as needed, for adjusting the impedance between the power supply wiring 142 and / or the RFIC 110 and the antenna patch 122. As the matching device MN, for example, an open stub, a short stub, and / or a capacitance pattern is used.

[0035] When the antenna patch 122 is viewed from above in the positive direction of the X axis, the feed point SP2 is located at a position offset in the negative direction of the Y axis from the center of the antenna patch 122. When a high-frequency signal is supplied from the RFIC 110 to the antenna patch 122 via the feed wiring 142, a radio wave polarized in the Y axis direction is radiated in the positive direction of the X axis (arrow AR2 in FIG. 2).

[0036] In the configuration of the antenna patch 122 in the antenna module 100, the power supply wiring 142 includes flat plate-shaped capacitor electrodes CP1 and CP2, and capacitive coupling is formed by the capacitor electrodes CP1 and CP2.

[0037] As described above, the capacitor electrodes CP1 and CP2 are flat electrodes arranged on different dielectric layers, and the size of each electrode and / or the degree of overlap between the two electrodes can be designed relatively easily during the design stage. Therefore, compared to the power supply mode in U.S. Patent Application Publication No. 2020 / 0313300 cited as Patent Document 1, more detailed adjustments can be made, making it easier to achieve desired antenna characteristics.

[0038] In particular, if the distance between the antenna patch 122 and the ground patch GND2 needs to be increased, the inductance component of the wiring 1421, 1422 increases, tending to narrow the frequency bandwidth of the radiated radio waves. While this can be resolved by increasing the capacitance component of the power supply wiring 142, in the case of an embodiment such as that described in Patent Document 1, it is necessary to increase the number of layers of strip electrodes constituting the power supply patch and thereby increase the size of the power supply patch. However, changing the number of strip electrodes makes it difficult to finely adjust the degree of capacitive coupling. Furthermore, if the power supply patch is made larger, the area blocking the connection between the antenna patch and the ground patch increases when viewed in a planar view from the X-axis direction, which may have a significant impact on the antenna characteristics.

[0039] On the other hand, in the configuration of the power supply wiring 142 in the antenna module 100 of embodiment 1, the capacitor electrodes CP1 and CP2 are arranged along the main surfaces of the corresponding dielectric layers, so even if the degree of coupling between the capacitor electrodes CP1 and CP2 is increased, the change in the area blocking the gap between the antenna patch 122 and the ground patch GND2 is minimal when viewed in a plan view from the X-axis direction. Therefore, in the case of the antenna module 100, the effect of increased capacitive coupling on the antenna characteristics is smaller than in the embodiment of Patent Document 1. Therefore, the antenna characteristics can be improved.

[0040] (Changes in antenna characteristics depending on the position of capacitive coupling) In the antenna module 100 of embodiment 1, the impedance matching state between the power supply wiring 142 and the antenna patch 122 can be adjusted by changing the position of the capacitive coupling (i.e., capacitor electrodes CP1, CP2) in the power supply wiring 142.

[0041] 5 and 6 are diagrams illustrating an example of the effect on antenna characteristics of the positions of the capacitor electrodes CP1 and CP2 on the feed wiring 142. Fig. 5 shows the reflection loss when the distance L1 between the antenna patch 122 and the capacitor electrode CP2, i.e., the length of the wiring 1422, is changed. Fig. 6 is a Smith chart for each of the cases shown in Fig. 5.

[0042] 5 and 6, the two-dot chain lines LN11 and LN21 indicate the case where the distance L1 is 0.1 mm, the dashed lines LN12 and LN22 indicate the case where the distance L1 is 0.2 mm, the one-dot chain lines LN13 and LN23 indicate the case where the distance L1 is 0.3 mm, the solid lines LN14 and LN24 indicate the case where the distance L1 is 0.4 mm, and the dashed lines LN15 and LN25 indicate the case where the distance L1 is 0.5 mm.

[0043] 5 and 6, varying the distance L1 changes the position of the generating pole and the amount of loss, and therefore the frequency bandwidth. In this example, when the distance L1 is 0.2 mm (dashed lines LN12 and LN22), the frequency bandwidth that can achieve a return loss of 10 dB or less is widest. The magnitude of the distance L1 is designed appropriately depending on the desired frequency bandwidth and amount of loss.

[0044] Note that the "power supply wiring 142" and the "power supply wiring 141" in the first embodiment correspond to the "first power supply wiring" and the "second power supply wiring" in the present disclosure. The "wiring 1421" and the "wiring 1422" in the first embodiment correspond to the "first wiring" and the "second wiring" in the present disclosure. The "capacitor electrode CP1" and the "capacitor electrode CP2" in the first embodiment correspond to the "first capacitor electrode" and the "second capacitor electrode" in the present disclosure.

[0045] In the first embodiment, one of two adjacent “antenna patches 122” in the array arrangement corresponds to the “first antenna patch,” and the other corresponds to the “second antenna patch.” The power supply wiring 142 of the “first antenna patch” corresponds to the “first power supply wiring,” and the power supply wiring 142 of the “second antenna patch” corresponds to the “fourth power supply wiring.”

[0046] Second Embodiment In a second embodiment, a configuration of a dual-polarized antenna module capable of emitting radio waves in two different polarization directions from an antenna patch 122 will be described.

[0047] Fig. 7 is a perspective view for explaining the arrangement of electrodes in an antenna module 100A according to embodiment 2. In the antenna module 100A, a power supply wiring 144 is added to the configuration of the antenna module 100 shown in Fig. 4. In Fig. 7, the description of elements that overlap with Fig. 4 will not be repeated.

[0048] 7 , the power supply wiring 144 includes wirings 1441 and 1442 and capacitor electrodes CP3 and CP4. One end of the wiring 1441 passes through the ground patch GND2 and the ground electrode GND1 and is connected to the RFIC 110. The other end of the wiring 1441 is connected to the capacitor electrode CP3 in a region between the antenna patch 122 and the ground patch GND2.

[0049] One end of the wiring 1442 is connected to the feed point SP3 of the antenna patch 122, and the other end is connected to the capacitor electrode CP4 in the region between the antenna patch 122 and the ground patch GND2.

[0050] The capacitor electrodes CP3 and CP4 are disposed on different dielectric layers. Each of the capacitor electrodes CP3 and CP4 is a substantially rectangular plate electrode whose normal direction is the Z-axis direction. When viewed from above in the Z-axis direction, the capacitor electrodes CP3 and CP4 at least partially overlap. That is, a capacitive coupling is formed between the capacitor electrodes CP3 and CP4.

[0051] When viewed from above in the X-axis direction, the feed point SP3 is located at a position offset in the positive direction of the Z-axis from the center of the antenna patch 122. Therefore, when a high-frequency signal is supplied from the RFIC 110 to the antenna patch 122 via the feed wiring 144, a radio wave polarized in the Z-axis direction is radiated in the positive direction of the X-axis. On the other hand, when a high-frequency signal is supplied from the RFIC 110 to the antenna patch 122 via the feed wiring 142, a radio wave polarized in the Y-axis direction is radiated in the positive direction of the X-axis.

[0052] In this way, even in the case of a dual-polarized type antenna module, the antenna characteristics can be improved by forming capacitive coupling using a flat electrode along the dielectric layer in the power supply wiring to the antenna patch.

[0053] Note that the "power supply wiring 144" in the second embodiment corresponds to the "third power supply wiring" in the present disclosure. The "wiring 1441" and the "wiring 1442" in the second embodiment correspond to the "third wiring" and the "fourth wiring" in the present disclosure, respectively. The "capacitor electrode CP3" and the "capacitor electrode CP4" in the second embodiment correspond to the "third capacitor electrode" and the "fourth capacitor electrode" in the present disclosure, respectively. The "power supply point SP3" in the second embodiment corresponds to the "second power supply point" in the present disclosure.

[0054] Third Embodiment In a third embodiment, a configuration will be described in which the antenna patch 122 is a so-called dual-band type radiating element capable of radiating radio waves in two different frequency bands.

[0055] Fig. 8 is a partial side perspective view of the antenna module 100B according to embodiment 3 as seen from the Y-axis direction. In Fig. 8, the portion related to the radiating element 121 is omitted, and only the portion related to the antenna patch 122 is shown.

[0056] 8, in antenna module 100B, a diplexer 180 and wires 1420A and 1420B are provided instead of matching device MN in antenna module 100 of the first embodiment.

[0057] 9, the diplexer 180 has input terminals T1 and T2 and an output terminal T3. The diplexer 180 further has a filter 181 connected between the input terminal T1 and the output terminal T3, and a filter 182 connected between the input terminal T2 and the output terminal T3. The pass band of the filter 181 and the pass band of the filter 182 are different from each other.

[0058] One end of the wiring 1420A is connected to the RFIC 110, and the other end is connected to the input terminal T1 of the diplexer 180. One end of the wiring 1420B is connected to the RFIC 110, and the other end is connected to the input terminal T2 of the diplexer 180. The output terminal T3 of the diplexer 180 is connected to the wiring 1421. The configurations of the wirings 1421 and 1422 and the capacitor electrodes CP1 and CP2 are the same as those of the antenna module 100 of the first embodiment.

[0059] The radiating element 122 in the antenna module 100B is designed to have dimensions that enable it to emit high-frequency signals in a frequency band (first band) corresponding to the pass band of the filter 181 and high-frequency signals in a frequency band (second band) corresponding to the pass band of the filter 182 as radio waves.

[0060] This makes it possible to emit radio waves from the common radiating element 122 in both cases where a first band signal is supplied from RFIC 110 via wiring 1420A and where a second band signal is supplied from RFIC 110 via wiring 1420B.

[0061] The antenna module 100B may also be provided with a matching device MN for impedance matching as needed.

[0062] In this way, even in the case of a dual-band type antenna module, the antenna characteristics can be improved by forming capacitive coupling using a flat electrode along the dielectric layer in the power supply wiring to the antenna patch.

[0063] The "power supply wiring 142A" in the third embodiment corresponds to the "first power supply wiring" in the present disclosure.

[0064] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims.

[0065] 10 Communication device, 100, 100A, 100B Antenna module, 110 RFIC, 111A to 111H, 113A to 113H, 117A, 117B Switch, 112AR to 112HR Low noise amplifier, 112AT to 112HT Power amplifier, 114A to 114H Attenuator, 115A to 115H Phase shifter, 116A, 116B Signal generator / distributor, 118A, 118B Mixer, 119A, 119B Amplifier circuit, 120 Antenna device, 121 Radiating element, 122 Antenna patch, 130 Dielectric substrate, 130A, 130B Antenna group, 131, 132 Main surface, 133 Side surface, 141, 142, 142A, 144 Power supply wiring, 160 Connection member, 180 diplexer, 181, 182 filter, 1221, GP strip electrode, 1222, GV via, 1420A, 1420B, 1421, 1422, 1441, 1442 wiring, 200 BBIC, CP1 to CP4 capacitor electrodes, GND1 ground electrode, GND2 ground patch, MN matching device, SP1 to SP3 feeding points, T1, T2 input terminal, T3 output terminal.

Claims

1. A dielectric substrate having a plurality of dielectric layers stacked in a first direction; an antenna patch provided on the dielectric substrate; a ground patch disposed on the dielectric substrate opposite the antenna patch; and a first feed wiring for transmitting a high-frequency signal to the antenna patch, wherein the antenna patch and the ground patch each include a plurality of strip electrodes disposed on different dielectric layers and stacked in the first direction, and a plurality of vias electrically connecting the plurality of strip electrodes, wherein the first feed wiring includes: a first wiring that penetrates the ground patch and extends in a second direction from the ground patch to the antenna patch; a second wiring that extends in the second direction and has one end connected to a first feed point of the antenna patch; a first capacitor electrode disposed at an end of the first wiring between the ground patch and the antenna patch; and a second capacitor electrode that is disposed on a dielectric layer different from the first capacitor electrode and connected to the other end of the second wiring, wherein each of the first capacitor electrode and the second capacitor electrode has a flat plate shape with the first direction as its normal direction, The antenna module, wherein the first capacitor electrode and the second capacitor electrode at least partially overlap when viewed in a plan view from the first direction.

2. The antenna module according to claim 1, further comprising a matching device disposed on said first wiring and performing impedance matching with said antenna patch.

3. An antenna module as described in claim 1 or claim 2, wherein the antenna patch is capable of emitting radio waves in a first band and a second band which are different frequency bands, and the antenna module further comprises a diplexer configured to selectively transmit a high-frequency signal corresponding to the first band and a high-frequency signal corresponding to the second band to the first wiring.

4. The antenna module according to any one of claims 1 to 3, wherein the dielectric substrate includes first and second main surfaces facing each other and having the first direction as a normal direction, and the antenna module further comprises: a flat radiating element disposed on the dielectric substrate and having the first direction as a normal direction; a ground electrode disposed between the radiating element and the second main surface and facing the radiating element; and a second feed wiring for transmitting high frequency signals to the radiating element.

5. The antenna module according to any one of claims 1 to 4, further comprising a third feed wiring for transmitting a high-frequency signal to the antenna patch, wherein the third feed wiring includes: a third wiring that penetrates the ground patch and extends in the second direction; a fourth wiring that extends in the second direction and has one end connected to a second feed point of the antenna patch; a third capacitor electrode that is arranged at an end of the third wiring between the ground patch and the antenna patch; and a fourth capacitor electrode that is connected to the other end of the fourth wiring; each of the third capacitor electrode and the fourth capacitor electrode has a flat plate shape with the first direction as its normal direction; when viewed in a plane from the first direction, the third capacitor electrode and the fourth capacitor electrode at least partially overlap; and in the antenna patch, the direction from the center of the antenna patch toward the first feed point intersects with the direction from the center of the antenna patch toward the second feed point.

6. A dielectric substrate having a plurality of dielectric layers stacked in a first direction; a first antenna patch and a second antenna patch arranged adjacent to each other on the dielectric substrate; a ground patch arranged opposite the first antenna patch and the second antenna patch on the dielectric substrate; a first feed wiring for transmitting a high-frequency signal to the first antenna patch; and a fourth feed wiring for transmitting a high-frequency signal to the second antenna patch, wherein each of the first antenna patch, the second antenna patch, and the ground patch includes: a plurality of strip electrodes arranged on different dielectric layers and stacked in the first direction; and a plurality of vias electrically connecting the plurality of strip electrodes, wherein each of the first feed wiring and the fourth feed wiring includes: a first wiring that penetrates the ground patch and extends in a second direction from the ground patch toward the antenna patch; a second wiring that extends in the second direction and has one end connected to a first feed point of the antenna patch; and a first capacitor electrode arranged at an end of the first wiring between the ground patch and the antenna patch. an antenna module including a second capacitor electrode disposed on a dielectric layer different from the first capacitor electrode and connected to the other end of the second wiring, wherein the first capacitor electrode and the second capacitor electrode each have a flat plate shape with the first direction as a normal direction, and when viewed in a plane from the first direction, the first capacitor electrode and the second capacitor electrode at least partially overlap each other.

7. The antenna module according to any one of claims 1 to 6, further comprising a feeding circuit configured to supply a high frequency signal.

8. A communication device comprising the antenna module according to any one of claims 1 to 7.

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