Heat dissipation module

Abstract

A heat dissipation module according to an embodiment of the present invention comprises: a heat sink that includes an upper surface having a plurality of heat sink fins, and a lower surface from which a portion corresponding to a heating component arranged on a substrate protrudes; a plate arranged to correspond to the protruding portion of the lower surface of the heat sink; a cover capable of insulating the heat sink and the heating component, which is arranged on the substrate; a coupling member for coupling the heat sink and the cover; and a fixing member for fixing the cover to the substrate, wherein thermal grease can be applied to the protruding portion of the lower surface of the heat sink.

Description

heat dissipation module

[0001] The present invention relates to a heat dissipation module, and more specifically, to the structure of a heat dissipation module.

[0002] Electronic components such as chip processors and MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) installed in devices like computers, set-top boxes, and charging modules typically generate heat due to the external power applied to operate the devices. To dissipate this heat, heat sinks are attached to these electronic components.

[0003] Heat sinks absorb heat through direct or indirect thermal contact with a heat-generating component, then release it. Heat sinks are typically made of metallic materials, such as aluminum or copper, which have relatively good thermal conductivity. Since heat is dissipated externally through their surface, various structures have been proposed to maximize their surface area.

[0004] However, the process of modifying the structure to increase the surface area of ​​the heat sink has resulted in an increase in the size and weight of the heat sink, which in turn increases the overall weight of the device containing the electronic components and heat sink. Furthermore, while the heat sink is placed in close contact with the heat-generating component for heat dissipation, the lack of insulation limits the placement of components mounted on the bottom of the heat sink and on the substrate.

[0005] The technical problem to be achieved by the present invention is to provide a heat dissipation module having a small heat sink size and light weight, but excellent heat dissipation efficiency.

[0006] The technical problem to be achieved by the present invention is to provide a heat dissipation module capable of arranging components at the bottom and around the heat dissipation module.

[0007] The technical problem to be achieved by the present invention is to provide a heat dissipation module capable of insulating between a heat sink and a component.

[0008] The technical problems to be solved by the present invention are not limited to the technical problems described above, and other technical problems can be inferred from the following examples.

[0009] A heat dissipation module according to an embodiment of the present invention includes a heat sink including an upper surface including a plurality of heat dissipation fins and a lower surface from which a portion corresponding to a heat-generating component disposed on a substrate protrudes, a plate disposed to correspond to the protruding portion of the lower surface of the heat sink, a cover capable of insulating the heat sink and the heat-generating component disposed on the substrate, a joining member for joining the heat sink and the cover, and a fixing member for fixing the cover to the substrate, and thermal grease may be applied to the protruding portion of the lower surface of the heat sink.

[0010] In a heat dissipation module according to an embodiment of the present invention, the cover may have a step formed in a portion corresponding to a protruding portion of the lower surface of the heat sink.

[0011] In a heat dissipation module according to an embodiment of the present invention, a portion of the cover in which a step is formed, which corresponds to the plate, is an opening, and the opening may be smaller in size than the plate.

[0012] In a heat dissipation module according to an embodiment of the present invention, the plate may be made of ceramic.

[0013] In a heat dissipation module according to an embodiment of the present invention, the joining member is a screw (or a screw), the heat sink and the cover include grooves at corresponding positions on the side surfaces, and the heat sink and the cover can be joined by the joining member.

[0014] In a heat dissipation module according to an embodiment of the present invention, the cover may be configured to surround a heat-generating component disposed on the substrate.

[0015] According to an embodiment of the present invention, an insulating case can be applied to a heat dissipation module to mount components around the heat dissipation module.

[0016] According to an embodiment of the present invention, the number of applicable heat generating components can be adjusted by changing the shape of the heat dissipation module.

[0017] According to an embodiment of the present invention, a plate may be placed between the heat sink and the heat generating component to enable insulation and heat transfer.

[0018] According to an embodiment of the present invention, external foreign substances cannot enter the inside of the heat dissipation module by the cover, thereby protecting the heat-generating component.

[0019] According to an embodiment of the present invention, the air flow by the fan can be concentrated on the fin portion where heat exchange is required.

[0020] FIG. 1 illustrates an assembled heat dissipation module according to an embodiment of the present invention, and FIG. 2 is an exploded view of a heat dissipation module according to an embodiment of the present invention.

[0021] FIG. 3 is a drawing showing the lower surface of a heat sink according to an embodiment of the present invention.

[0022] Fig. 4 is a cross-sectional view from the side of a heat dissipation module according to an embodiment of the present invention.

[0023] FIG. 5 is a drawing showing a heat-generating component (a) mounted on a portion of a substrate according to an embodiment of the present invention and a heat dissipation module (b) for heat dissipation thereof.

[0024] FIG. 6 is a drawing showing a state in which a heat dissipation module according to an embodiment of the present invention is applied from the top and bottom of a case.

[0025] FIG. 7 is a drawing showing a charging set included in an electronic device to which a heat dissipation module according to an embodiment of the present invention is applied, as an example.

[0026] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0027] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0028] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0029] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0030] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0031] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0032] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0033] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0034] Additionally, when described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below", it can include the meaning of a downward direction as well as an upward direction based on one component.

[0035] FIG. 1 illustrates an assembled heat dissipation module according to an embodiment of the present invention, and FIG. 2 is an exploded view of a heat dissipation module according to an embodiment of the present invention.

[0036] Referring to FIG. 1, the heat dissipation module (100) may include a heat sink (110), a cover (120), and a joining member (130) that joins them together. The heat sink (110) and the cover (120) may be joined at the sides by the joining member (130). In FIG. 1, the heat sink (110) and the cover (120) are shown joined at both sides, but the heat sink (110) and the cover (120) may be joined together by including the joining member (130) at all sides. In addition, in FIG. 1, only one joining member (130) is arranged on one side of the heat sink (110) and the cover (120), but a plurality of joining members may be arranged. According to one embodiment, the number of joining members may vary depending on the size of the heat dissipation module (100), and their positions may also vary. The components included in the heat dissipation module (100) are shown in more detail in FIG. 2.

[0037] Referring to FIG. 2, the heat dissipation module (200) may include a heat sink (210), a plate (220), a cover (230), a fixing member (240), and a joining member (250).

[0038] A heat sink (210) can dissipate heat from a heat-generating component placed on a substrate. The heat sink (210) can be placed on the top side of the heat-generating component to dissipate heat from the heat-generating component. To increase heat dissipation efficiency, a plurality of heat dissipation fins can be placed on the top side of the heat sink (210). The lower surface of the heat sink (210) is a portion that faces the heat-generating component and can be configured to advantageously dissipate heat from the heat-generating component. That is, a portion of the lower surface of the heat sink (210) can protrude to reduce the gap between the heat sink (210) and the heat-generating component even when tall components are placed around the heat-generating component. Thermal grease can be applied to the protruding portion of the lower surface of the heat sink (210) to increase the conductivity of heat generated from the heat-generating component. In addition, the lower surface of the heat sink (210) can be coupled to a cover to be insulated from other components on the substrate. The structure of the lower surface of the heat sink (210) is described in more detail in FIG. 3.

[0039] According to one embodiment, a hole may be formed on the side of the heat sink (210) into which a joining member (250) may be inserted to secure the heat sink (210) and the cover (230). Additionally, a step may be formed on one side of the heat sink (210), and the step may be formed to facilitate the placement of other configurations.

[0040] According to one embodiment, the size of the heat sink (210) may vary depending on the number and location of heat generating components arranged on the substrate.

[0041] The plate (220) can transfer heat from the heat generating component to the heat sink (210). When the heat generating component and the heat sink (210) are in direct contact, the heat from the heat generating component can be directly transferred to the heat sink (210). However, this can cause insulation problems with other components. In the present invention, the plate (220) is made of an insulating material, thereby solving the insulation problem and transferring the heat from the heat generating component to the heat sink (210).

[0042] According to one embodiment, the plate (220) may be composed of a ceramic. The ceramic may be, for example, Al2O3.

[0043] The plate (220) may not be directly fixed to the cover (230) or the heat sink (210). The plate (220) may be fixed by the shape of the cover. The cover (230) has a step, so the plate (220) can be placed on the step to prevent the plate (220) from moving.

[0044] The cover (230) may be placed on the lower surface of the heat sink (210). That is, the plate (220) and the heat sink (210) may be sequentially placed on the upper surface of the cover (230), and a substrate on which components are mounted may be placed on the lower surface. The substrate and the cover may be joined on the lower surface of the cover (230), and may be joined with a joining member (250) on the side.

[0045] The cover (230) can insulate between the heat sink (210) and the components mounted on the board. When the heat sink (210) is applied to dissipate heat from the heat-generating component mounted on the board in a top-side cooling manner, the gap between the heat-generating component and the heat sink (210) must be sufficiently narrow. However, in this case, the gap between the heat sink (210) and other components mounted on the board, in addition to the heat-generating component, may also narrow, resulting in an insulation problem. This can be resolved by using a cover (230) made of an insulating material.

[0046] According to one embodiment, the gap between the heat sink (210) and the heat generating component mounted on the substrate may be 7 mm or more to insulate the heat sink (210). The cover (230) may be composed of PA66 or PA66 + GF XX% for insulation.

[0047] The cover (230) can fix the plate (220) without any other configuration. The plate (220) is included for insulation and heat transfer between the heat sink (210) and the heat generating component, and the cover (230) can be used to fix the plate (220). When a step is formed in the cover (230) and the plate (220) is placed on the step portion, the plate (220) can be protected from external impact and the plate (220) can be guided. In addition, when the protruding portion of the heat sink (210) is placed on the step portion of the cover (230), the heat sink (210) can also be guided to be placed in the correct position.

[0048] The cover (230) may be formed in a square wall shape to surround the substrate portion at the bottom of the heat sink (210). In this case, the cover (230) can prevent various foreign substances from entering from the outside from penetrating into the heat generating module. This can protect the heat generating components positioned beneath the heat generating module.

[0049] In addition, the cover (230) can be formed in a structure that wraps the substrate portion at the bottom of the heat sink (210) in the form of a square wall, so that the air flow by the fan can be concentrated on the heat dissipation fin portion of the heat sink (210) that requires heat exchange. That is, the remaining area of ​​the heat dissipation module except for the heat dissipation fin portion of the heat sink (210) is blocked, so that the air flow can be concentrated on the heat dissipation fin, thereby maximizing the effect of the heat dissipation fin.

[0050] The fixing member (240) may be a member for fixing the cover (230) to the substrate. The fixing member (240) may be, for example, a spacer. The spacer may maintain a gap between the heat-generating component and the heat sink. The fixing member (240) may further include a screw, which may be inserted into the lower surface of the substrate and coupled to the spacer. The substrate and the cover (230) may be fixed by the coupling of the spacer and the screw.

[0051] The joining member (250) may be a member for joining the heat sink (210) and the cover (230). The joining member (250) may be, for example, a screw, but is not limited thereto. The joining member (250) may be fastened to the sides of the heat sink (210) and the cover (230). The size, shape, etc. of the joining member (250) may vary depending on the sizes and shapes of the heat sink (210) and the cover (230). For example, when the heat sink (210) and the cover (230) become larger, the size of the joining member (250) may also become larger in order to firmly join them.

[0052] According to one embodiment, the joining member (250) may be an adhesive member. When the joining member (250) is an adhesive member, the shapes of the heat sink (210) and the cover (230) may not be deformed. That is, since a groove for fastening a joining member such as a screw does not need to be formed, the shapes of the heat sink (210) and the cover (230) may not be deformed.

[0053] FIG. 3 is a drawing showing the lower surface of a heat sink according to an embodiment of the present invention.

[0054] Referring to FIG. 3, a portion of the lower surface of the heat sink may protrude. The protruding portion (310, 320) may be a portion (or area) corresponding to a heat-generating component. The heat sink should be positioned relatively close to the heat-generating component in order to dissipate heat from the heat-generating component. However, the heights of the components positioned on the board may all be different, so if the heat sink is positioned close to the heat-generating component, the components that can be positioned around the heat-generating component may be limited. In addition, if the heat sink is positioned close to the heat-generating component, the heat sink may also come close to other components other than the heat-generating component positioned on the board, which may cause an insulation problem. Therefore, in order to solve the insulation problem while positioning the heat sink close to the heat-generating component, a portion of the lower surface of the heat sink corresponding to the position of the heat-generating component may have a protruding shape.

[0055] In one embodiment, thermal grease may be applied to the protruding portion of the bottom surface of the heat sink. The thermal grease may fill the microscopic space between the heat sink and other components, thereby increasing thermal conductivity from the heat-generating component to the heat sink.

[0056] According to one embodiment, the protruding portion (310, 320) of the heat sink bottom surface may vary depending on the location, size and number of heat generating components arranged on the substrate.

[0057] In one embodiment, a portion of the lower surface of the heat sink may be recessed. The recessed portion (330) may be a corner of the heat sink, where a component for connecting the heat sink to another component is positioned. Referring to FIG. 3, a hole (340) may be formed in the recessed portion (330) of the lower surface of the heat sink. A fixing member, such as a screw or spacer, may be inserted into the hole (340).

[0058] According to one embodiment, the upper surface of the heat sink may include a plurality of heat dissipation fins, the height of which may be constant. The height of the heat dissipation fins may be varied depending on the shape of the lower surface of the heat sink, thereby maintaining the height of the upper surface of the heat sink constant.

[0059] Fig. 4 is a cross-sectional view from the side of a heat dissipation module according to an embodiment of the present invention.

[0060] Referring to FIG. 4, a heat dissipation module (400) may include a heat sink (410), thermal grease (420) applied to a protruding portion of the lower surface of the heat sink, a plate (430) placed on the protruding portion of the lower surface of the heat sink, a cover (440) that insulates the heat sink and a heat-generating component placed on the substrate, and a fixing member (450, 455) that fixes the cover to the substrate.

[0061] The heat sink (410) may include a plurality of heat dissipation fins on its upper surface. A portion of the lower surface of the heat sink (410) may protrude. The protruding portion may correspond to a portion of the substrate (460) where the heat-generating component (470) is disposed. The area of ​​the protruding portion of the lower surface of the heat sink may be larger than the area of ​​the portion of the substrate (460) where the heat-generating component (470) is disposed. The gap between the protruding portion of the lower surface of the heat sink and the heat-generating component is sufficiently small so that the heat sink (410) can dissipate heat from the heat-generating component.

[0062] According to one embodiment, thermal grease (420) may be applied to the protruding portion of the lower surface of the heat sink. The thermal grease (420) may fill the microscopic space between the protruding portion of the lower surface of the heat sink and the plate (430), thereby increasing thermal conductivity from the heat generating component to the heat sink (410).

[0063] The plate (430) may be placed on a protruding portion of the bottom surface of the heat sink. Since the plate (430) may be placed on a stepped portion of the cover (440), a separate fixing member for fixing the plate (430) may not be required. The plate (430) may transfer heat from the heat-generating component (470) to the heat sink (410). In addition, the plate (430) may insulate between the heat sink (410) and the heat-generating component (470). The plate (430) may be made of, for example, ceramic, more specifically, Al2O3.

[0064] In one embodiment, a gap filler may be applied to the upper surface of the heat generating component.

[0065] The cover (440) can be placed between the heat sink (410), the substrate (460), and the heat generating component (470) to prevent them from being electrically connected. The cover (440) can secure a gap of 7 mm or more between the heat sink (410) and the heat generating component (470) to insulate the heat sink (410) and the heat generating component (470). The cover (440) can be made of PA66 or PA66 + GF XX% to insulate the heat sink (410) and the substrate (460), the component mounted on the substrate (460), and the heat generating component (470).

[0066] According to one embodiment, the cover (440) can focus the airflow by the fan to the heat dissipation fin portion of the heat sink (410) that requires heat exchange. Specifically, since the cover (440) blocks the remaining portion of the heat sink (410) except for the heat dissipation fin portion, the airflow can be focused on the heat dissipation fin portion of the heat sink (410), thereby maximizing the effect of the heat dissipation fin.

[0067] According to one embodiment, the cover (440) may have a structure that surrounds the substrate portion at the bottom of the heat sink (410) in the form of a square wall. With this structure, foreign matter from the outside cannot penetrate into the heat dissipation module, thereby protecting the heat-generating components that are vulnerable to dust or foreign matter.

[0068] In one embodiment, the cover (440) may have a step and may place the plate (430) on the step. The cover (440) may not only secure the plate (430) by utilizing the step, but may also serve as a guide and protect the plate (430) from external impact. Since the plate (430) may be secured by the cover (440) without a separate securing member, the weight caused by the securing member may be reduced.

[0069] The fixing member (450, 455) may be a member for fixing the cover (440) to the substrate (460). Referring to FIG. 4, the fixing member (450, 455) may be composed of a spacer (450) and a screw (455). The spacer (450) may be included to maintain a gap between the heat generating component (470) and the heat sink (410). The gap between the heat generating component (470) and the plate (430) may be 0.25 to 0.45 mm. A gap filler may be applied between the heat generating component (470) and the heat sink (410). The screw (455) may fix the cover (440) to the substrate (460).

[0070] FIG. 5 is a drawing showing a heat-generating component (a) mounted on a portion of a substrate according to an embodiment of the present invention and a heat dissipation module (b) for heat dissipation thereof.

[0071] Figures 5 (a) and (b) illustrate a structure in which one heat dissipation module is applied to eight heat-generating components, for example, and a heat dissipation module is assembled on top of a top side cooling package MOSFET (QDPAK).

[0072] Figure 5 (a) illustrates a state in which a total of eight heat-generating components are mounted on a portion of a substrate. The heat-generating components may be, for example, MOSFETs. The heat-generating components may be arranged in a 2x2 arrangement, two by two, but this is not a limitation. The substrate may include grooves for securing the heat-dissipating modules.

[0073] FIG. 5 (b) illustrates a heat dissipation module according to the present invention. The heat dissipation module according to the present invention may include grooves at each corner. The positions of the grooves included in the heat dissipation module may correspond to the positions of the grooves included in the substrate. When a fixing member is inserted into the groove, the heat dissipation module can be fixed to the substrate. The fixing member may be, for example, a spacer and a screw. When the spacer is positioned between the groove included in the substrate and the groove included in the heat dissipation module, and the screw is fastened on the lower surface of the substrate, the heat dissipation module can be fixed to the substrate.

[0074] According to one embodiment, the size and shape of the heat dissipation module may vary depending on the location, number, and size of the heat-generating components positioned under the heat dissipation module. For example, the shape of the heat dissipation module may be square, but may also be rectangular, and its size is not limited.

[0075] Referring to (a) and (b) of FIG. 5, the area of ​​the heat dissipation module may be wider than the area of ​​the region including all heat-generating components.

[0076] FIG. 6 is a drawing showing a state in which a heat dissipation module according to an embodiment of the present invention is applied above and below a case.

[0077] Referring to FIG. 6, substrates (610, 620) may be placed on the upper and lower cases, and if a heat-generating component is placed on the substrate, a heat dissipation module may be fixed to the substrate. The heat-generating component may be, for example, a MOSFET.

[0078] In one embodiment, the heat dissipation modules may be arranged facing each other. When the heat dissipation modules are applied to the upper and lower portions of the case and arranged facing each other, the gap between the heat dissipation fins of the upper and lower heat sinks may need to be at least 7 mm. The gap between the heat dissipation fins may be a gap required for insulation.

[0079] Referring to FIG. 6, components may be mounted between the heat dissipation module and the substrate. Looking closely, heat-generating components may be placed on the lower portions (630, 640) of the plate, and other components may be placed on the lower portions (650, 660, 670) of the cover. The gap between the heat-generating components and the plate must be sufficiently small to ensure heat dissipation of the heat-generating components. For example, the gap between the heat-generating components and the plate may be 0.5 mm or less. On the other hand, other components placed on the lower portions (650, 660, 670) of the cover may not require heat dissipation. These components may vary, and may be higher in height than the heat-generating components. Accordingly, the cover may have a step between itself and the substrate to allow other components, other than the heat-generating components, to be placed thereon.

[0080] In one embodiment, the cover may be made of an insulating material to prevent short circuits of components mounted on the substrate.

[0081] FIG. 7 is a drawing showing a charging set included in an electronic device to which a heat dissipation module according to an embodiment of the present invention is applied, as an example.

[0082] Referring to FIG. 7, the charging set (700) may be composed of a first case (710) including a first substrate, a second case (720) including a second substrate, and a front panel (730). The first case (710) and the second case (720) may be coupled vertically, and the front panel (730) may be coupled at the front surfaces of the first case (710) and the second case (720). The first case (710), the second case (720), and the front panel (730) may include a plurality of grooves, and screws may be inserted into the plurality of grooves to be coupled.

[0083] According to one embodiment, a substrate (or board) may include a heat dissipation module according to an embodiment of the present invention. A single substrate may include multiple heat dissipation modules, and the number is not limited. The heat dissipation module may be positioned on the upper surface of a heat-generating component positioned on the substrate and fixed to the substrate. The heat dissipation module may be positioned to correspond to a plurality of heat-generating components, or may be positioned to correspond to a single heat-generating component.

[0084] Referring to FIG. 7, there may be two heat dissipation modules (712, 714, 722, 724) disposed on each of the first substrate and the second substrate. The heat dissipation modules (712, 714, 722, 724) disposed on each substrate may be the same heat dissipation module, but are not limited thereto. The size and shape of the heat dissipation module may be determined by considering the size and number of heat-generating components. The heat dissipation modules (712, 714, 722, 724) disposed on each substrate may be disposed to face each other, but are not limited thereto. The position at which the heat dissipation module is disposed may be determined by considering the size and shape of the heat dissipation module, other components disposed on the substrate, etc. As an example, the heat dissipation module may be disposed at a position where air can easily be drawn in from a fan coupled to the front panel (730).

[0085] Although the above description focuses on examples, these are merely examples and do not limit the present invention. Those skilled in the art will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present invention. For example, each component specifically shown in the examples can be modified and implemented. In addition, differences related to such modifications and applications should be construed as being included within the scope of the present invention defined in the appended claims.

Claims

1. A top surface including a plurality of heat dissipation fins, and A heat sink including a lower surface with a portion protruding corresponding to a heat generating component placed on a substrate; A plate positioned to correspond to the protruding portion of the lower surface of the heat sink; A cover capable of insulating the heat sink and the heat generating component placed on the substrate; A joining member for joining the heat sink and the cover; and Including a fixing member for fixing the cover to the substrate, A heat dissipation module with thermal grease applied to the protruding portion of the lower surface of the above heat sink.

2. In paragraph 1, The above cover is a heat dissipation module in which a step is formed in a portion corresponding to a protruding portion of the lower surface of the heat sink.

3. In paragraph 2, Among the steps formed in the above cover, the part corresponding to the plate is an opening, A heat dissipation module having an opening smaller than the plate.

4. In paragraph 3, The above plate is a heat dissipation module made of ceramic.

5. In paragraph 1, The above-mentioned connecting member is a screw, The above heat sink and the above cover include grooves at corresponding positions on the sides, A heat dissipation module in which the heat sink and the cover are joined by the above-mentioned joining member.

6. In paragraph 1, A heat dissipation module, wherein the cover is configured to surround a heat generating component placed on the substrate.

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