System and method for removing foreign substances from image sensors

Abstract

The present invention relates to a foreign substance removal system for image sensors, comprising: a foreign substance inspection device that generates optical images; a foreign substance removal device that removes foreign substances; and a moving device that transfers the image sensors. According to the present invention, it is possible to automatically remove foreign substances from the image sensors.

Description

System and method for removing foreign matter from an image sensor

[0001] The present invention relates to a foreign matter removal system and method for an image sensor, and more specifically, to a foreign matter removal system and method that performs detection and removal of foreign matters in one process by utilizing an optical image obtained by irradiating light onto an image sensor.

[0002] Camera modules are devices that capture and process images by assembling components such as image sensors and optical lenses. They are widely used in smartphones, tablets, automobiles, and various electronic devices. In particular, image sensors are a key component that converts external light into electrical signals to form images, directly impacting image quality.

[0003] During the manufacturing and assembly processes, microscopic foreign matter can adhere to the surface of image sensors. This can degrade image quality and cause defects, lowering product yields. Therefore, ongoing research is being conducted on technologies that effectively detect and remove foreign matter from the image sensor surface.

[0004] Conventional foreign matter detection methods primarily used vision inspection. This method involves capturing and analyzing foreign matter on the surface of an image sensor using a separate camera and optical device.

[0005] However, this vision method had the problem that the foreign body information obtained during the inspection process lacked a direct correlation with the actual operating data of the image sensor.

[0006] Additionally, there were limitations in detecting fine foreign substances due to physical limitations of optical equipment, such as the resolution of the vision camera.

[0007] Another issue is that conventional systems are configured to inspect only one image sensor at a time, making it difficult to inspect multiple image sensors simultaneously or process them in parallel. This limits production speed and makes them inefficient for mass production facilities.

[0008] Accordingly, the need for a system that can more accurately and quickly detect and simultaneously remove foreign substances on the surface of an image sensor has arisen.

[0009] The purpose of the present invention is to provide a foreign matter inspection and removal system of an image sensor capable of accurate foreign matter detection using image sensor data.

[0010] In addition, the present invention aims to provide a foreign matter inspection and removal system for an image sensor capable of simultaneously inspecting a plurality of image sensors and quickly removing foreign matters.

[0011] The problems to be solved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] A system for detecting and removing foreign substances existing on the surface of an image sensor is provided, comprising: a foreign substance inspection device that generates an optical image from the image sensor by irradiating light; a foreign substance removal device that removes the foreign substance based on the optical image; and a moving device that moves the image sensor from the foreign substance inspection device to the foreign substance removal device.

[0013] The foreign body inspection device may include a light source that irradiates the light; at least one lens that focuses the irradiated light onto the image sensor; and a socket board that drives the image sensor.

[0014] The above socket board may include circuitry for driving multiple image sensors simultaneously.

[0015] The above foreign substance removal device may include an adhesive stick having an adhesive portion for adhering the foreign substance and moving linearly in the axial direction.

[0016] The foreign matter removal device can determine the location of the foreign matter based on the optical image, and move the adhesive stick in a direction perpendicular to the axial direction based on the location of the foreign matter.

[0017] The above foreign substance removal device may include a stick replacement unit that automatically replaces the first adhesive stick among the adhesive sticks with the second adhesive stick when the first adhesive stick is used more than a preset number of times.

[0018] The above moving device includes a rotating plate having at least one mounting socket on which the image sensor is mounted, and can move the image sensor by rotating the rotating plate.

[0019] The above moving device may include a lifting member for lifting the mounting socket.

[0020] The moving device may include a supply portion for mounting the image sensor in the mounting socket; and a discharge portion for removing the image sensor from the mounting socket.

[0021] A method for detecting and removing foreign matter existing on the surface of an image sensor is provided, comprising: a step of irradiating light from a light source to the image sensor; a step of generating an optical image from the image sensor; a step of adjusting the position of a foreign matter removal device based on the optical image; and a step of removing the foreign matter using the foreign matter removal device.

[0022] The step of generating the optical image may include a step of moving a mounting socket equipped with the image sensor toward a socket board; a step of electrically connecting the image sensor to the socket board; and a step of driving the image sensor.

[0023] The step of adjusting the position of the foreign body removal device based on the optical image may include the steps of: receiving the optical image; analyzing the optical image to determine whether a foreign body exists; calculating the position of the foreign body if the foreign body exists; and moving the foreign body removal device to a position corresponding to the position of the foreign body.

[0024] The above foreign substance removal device may include an adhesive stick having an adhesive portion that adheres the foreign substance and moves linearly in the axial direction; and a stick replacement portion that automatically replaces a first adhesive stick among the adhesive sticks with a second adhesive stick when the first adhesive stick is used a preset number of times or more.

[0025] The method may further include a step of mounting the image sensor in a mounting socket; a step of rotating a rotating plate on which at least one mounting socket is arranged; and a step of removing the image sensor from the mounting socket.

[0026] The above mounting socket can mount multiple image sensors.

[0027] According to one embodiment of the present invention, the reliability of the inspection results can be secured by accurately detecting the location of a foreign object using data from an image sensor.

[0028] According to one embodiment of the present invention, the foreign matter inspection device and the foreign matter removal device are individually positioned through a moving device, so that the inspection and removal processes can be performed in parallel.

[0029] Additionally, production speeds can be improved by simultaneously inspecting and removing multiple image sensors.

[0030] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0031]

[0032] FIG. 1 is a block diagram of a foreign matter removal system of an image sensor according to one embodiment of the present invention.

[0033] FIG. 2 is a schematic diagram illustrating the concept of a foreign matter removal system of an image sensor according to one embodiment of the present invention.

[0034] FIG. 3 is a planar conceptual diagram of a foreign matter removal system of an image sensor according to one embodiment of the present invention.

[0035] FIG. 4 is a schematic diagram illustrating a foreign substance inspection device according to one embodiment of the present invention.

[0036] Figure 5 is a cross-sectional view of the foreign body inspection section along line AA'.

[0037] Figure 6 is an exploded perspective view of a foreign matter inspection unit and a mounting socket according to one embodiment of the present invention.

[0038] Fig. 7 illustrates an example configuration of a foreign matter inspection unit according to one embodiment of the present invention.

[0039] Figure 8 illustrates a circuit layout of a socket board according to one embodiment of the present invention.

[0040] FIG. 9 illustrates an example of an optical image according to one embodiment of the present invention.

[0041] Fig. 10 is a perspective view illustrating the configuration of a foreign substance removal device according to one embodiment of the present invention.

[0042] Fig. 11 is a perspective view of a moving device according to one embodiment of the present invention.

[0043] FIG. 12 is a flowchart illustrating a method for removing foreign substances from an image sensor according to one embodiment of the present invention.

[0044] Figure 13 is a flowchart illustrating an optical image generation process according to one embodiment of the present invention.

[0045] Fig. 14 is a flowchart illustrating a position control process of a foreign substance removal device according to one embodiment of the present invention.

[0046] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components are given the same reference numbers and redundant descriptions thereof will be omitted.

[0047] The suffixes "module" and "part" used in the following description are assigned or used interchangeably solely for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. Furthermore, when describing the embodiments disclosed herein, if a detailed description of a related known technology is deemed to obscure the gist of the embodiments disclosed herein, the detailed description will be omitted.

[0048] In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention.

[0049] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0050] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0051] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0052] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0053]

[0054] In addition, the terms “front end,” “rear end,” “upper end,” “lower end,” “top end,” and “bottom end” used in this specification are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0055] Hereinafter, a foreign matter removal system (10) (hereinafter, the present system) for an image sensor according to one embodiment of the present invention will be described with reference to FIGS. 1 and 2.

[0056] Referring to FIG. 1, the system (10) may include a foreign matter inspection device (100), a foreign matter removal device (200), a moving device (300), etc. The system (10) may include all of the components illustrated in FIG. 1, some of them, or more components. In addition, one component may perform two functions.

[0057] This system (10) can be included in a camera assembly facility and applied to a foreign matter inspection and removal process of an image sensor (s).

[0058] More specifically, image sensors (s) are components that convert light entering through optical lenses into electrical signals and output them as digital images. During manufacturing, assembly, handling, or transportation, image sensors may become contaminated with fine foreign matter, such as dust, metal particles, or fiber fragments. These foreign matter will appear as noise or defects in the images output by the image sensor.

[0059] In particular, as camera modules become increasingly high-resolution and miniaturized, even extremely small foreign matter can significantly impact image quality. Therefore, the present system (10) preliminarily inspects the surface of the image sensor to identify the presence of foreign matter and automatically removes it, thereby ensuring image quality of the final product and improving production yield.

[0060] The foreign matter inspection device (100) of this system can determine the presence or absence of a foreign matter and the location of the foreign matter by driving the image sensor (s) and analyzing the optical image acquired from the image sensor (s).

[0061] Since the foreign matter inspection device (100) detects foreign matter using the internal signal of the image sensor, inspection reliability can be secured based on the same criteria as the post-process inspection method. The foreign matter detection method and configuration will be described later with reference to FIGS. 4 to 9.

[0062] The foreign matter removal device (200) of the present system can remove a foreign matter (d) existing on the surface of the image sensor (s) by an adhesive method based on an optical image output from the foreign matter inspection device (100). The foreign matter removal device (200) can include an adhesive stick having an adhesive portion, and the adhesive stick can move linearly in the axial direction to approach the foreign matter, and then remove the foreign matter by contacting and adhering to it.

[0063] More specifically, the adhesive stick can move horizontally and then descend vertically to remove foreign matter based on coordinate information based on an optical image. The foreign matter removal operation and the configuration of the foreign matter removal device are described below with reference to FIGS. 3 and 10.

[0064] The moving device (300) of the present system can move the image sensor (s) from the foreign substance inspection device (100) to the foreign substance removal device (200). Referring to FIG. 2, the moving device (300) can include a rotatable disk-shaped moving plate (310).

[0065] More specifically, a plurality of mounting sockets for fixing image sensors may be arranged at regular intervals on a moving plate (310) included in a moving device (300), and each mounting socket may be capable of simultaneously accommodating a plurality of image sensors. For example, a single moving plate may have four, six, or eight mounting sockets arranged at regular intervals, and each socket may be configured to fix four image sensors.

[0066] The moving plate (310) can sequentially move the mounting socket to the foreign matter inspection device (100), the foreign matter removal device (200), or the discharge position through a rotational motion. Accordingly, while one image sensor is being inspected, another image sensor is undergoing foreign matter removal, and another sensor is placed in a discharge standby state, and thus the process can be performed in parallel. This structure can automate the inspection and removal process and improve processing efficiency. A more specific configuration and operation method of the moving device (300) will be described later with reference to FIG. 11.

[0067]

[0068] Fig. 2 is a conceptual diagram of a foreign matter removal system for an image sensor according to one embodiment of the present invention. Fig. 2 is a side schematic diagram that illustrates the arrangement of major components of the system in a simplified manner for convenience of explanation.

[0069] Referring to FIG. 2, the present system (10) may include a foreign matter inspection device (100), a foreign matter removal device (200), a moving device (300), etc. The moving device (300) may include a moving plate (310) formed to be rotatable, and a plurality of image sensors (s) may be mounted on the moving plate (310) in a fixed state in mounting sockets (340) arranged at regular intervals.

[0070] In Fig. 2, four mounting sockets (340) are illustrated to illustrate an example of a four-part structure, but this is only one embodiment, and depending on the processing efficiency and production volume of the system, it can also be designed as a six-part or eight-part structure including, for example, six or eight mounting sockets, and this can be optionally configured.

[0071] The moving plate (310) can sequentially move the image sensor (s) from the foreign matter inspection device (100) toward the foreign matter removal device (200) by rotating in the direction of the arrow shown in Fig. 2, for example. The rotation can be controlled as a step motion intermittently performed at a certain angle.

[0072] According to the division structure, the moving plate (310) rotates in steps in a manner of rotating by a certain angle unit, for example, 1 / 4 rotation in the case of 4 divisions with 90 degree intervals, and the process can be performed for the image sensor at each position in a stationary state between rotations.

[0073] Such rotation steps can be controlled by a position sensor or encoder, and the start of each process can be triggered by a rotation stop signal or a position alignment signal of the moving plate (310). Accordingly, the operation of the foreign matter inspection or removal device can be driven at the corresponding position.

[0074] The foreign matter inspection device (100) can acquire an optical image by driving the image sensor (s) that has reached the rotation while maintaining the alignment at a predetermined position. The foreign matter inspection device (100) can include a foreign matter inspection unit (110), and the foreign matter inspection unit (110) can be configured to inspect a plurality of image sensors simultaneously. The presence and location of the foreign matter can be analyzed based on the optical image output from the image sensor.

[0075] The image sensor(s) for which the inspection is completed can be transferred to the location of the foreign matter removal device (200) through the next rotation step of the moving plate (310). The foreign matter removal device (200) can remove foreign matter from the surface of the image sensor using an adhesive stick or other removal means by referring to the foreign matter location information transmitted from the inspection device (100).

[0076] In Fig. 2, the foreign matter inspection device (100) and the foreign matter removal device (200) are shown as being arranged opposite each other with respect to the moving plate (310), but this is only a schematic example for understanding the structure and movement line.

[0077] The actual device layout can vary depending on factors such as minimizing interference between equipment, space efficiency, and accessibility for maintenance. For example, Figure 3 illustrates an example configuration where the inspection device and removal device are placed parallel to each other on the same side. In this way, the process layout can be flexibly designed according to system requirements.

[0078] Fig. 3 is a conceptual diagram of a foreign matter removal system (10) of an image sensor according to another embodiment of the present invention. For convenience of explanation, Fig. 3 conceptually illustrates the system in a plan view direction looking down on a moving device (300).

[0079] Referring to FIG. 3, a foreign matter removal system (10) of an image sensor according to one embodiment of the present invention can be designed such that an inspection process, a foreign matter removal process, and an input / output process are configured in a circular arrangement centered on a circular moving plate (310) to enable parallel operation.

[0080] The moving plate (310) is formed in a structure that can rotate around the center, and a plurality of mounting sockets (340) can be radially arranged at regular intervals thereon. A plurality of image sensors (s) can be mounted on each mounting socket (340), and the image sensors (s) can be sequentially moved to an inspection position, a removal position, an unloading position, etc. according to the rotation of the moving plate (310).

[0081] On the outer periphery of the moving plate (310), a supply unit (320) for supplying and mounting image sensors (s), a discharge unit (330) for removing the image sensor, a foreign matter inspection device (100) for performing foreign matter inspection, and a foreign matter removal device (200) for removing foreign matters can be respectively arranged.

[0082] The supply unit (320) can receive the image sensor (s) from the standby carrier (410) and load it into the mounting socket (340). The standby carrier (410) can stand by with a plurality of image sensors (s) mounted thereon, and can transfer the image sensors (s) to the mounting socket (340) through the supply unit (320) at the loading position. Thereafter, the moving plate (310) can rotate to move the image sensors (s) to the foreign matter inspection device (100).

[0083] The transported image sensor can first be mounted on a work carrier (420) and wait in the work area (400), where preparations for process execution can be made. The work area (400) can be utilized as a section for checking the sensor status or performing position correction between loading and unloading, and the work carrier (420) can play a role in stably supporting the sensor and maintaining its alignment.

[0084] The foreign matter inspection device (100) can analyze the presence and location of foreign matter based on an optical image generated by driving an image sensor (s). Based on the analysis results, if a foreign matter is present, the corresponding location information can be transmitted to the foreign matter removal device (200).

[0085] The foreign substance removal device (200) is equipped with an adhesive stick that acts as a particle picker, and can remove foreign substances (d) located on the surface of the image sensor (s) by moving the adhesive stick based on the received location information.

[0086] The moving plate (310) can move the image sensor (s) for which the removal process has been completed to a discharge position, and the discharge unit (330) can take out the image sensor (s) from the mounting socket (340) and transfer it to a finished carrier (430). The finished carrier (430) can receive the image sensor (s) for which the removal of foreign substances has been completed and transfer it to a subsequent process.

[0087] In this way, the foreign matter removal system (10) of the image sensor according to the present embodiment can implement a parallel and automated process by sequentially transferring the image sensor (s) fixed to the mounting socket (340) to the inspection, removal, and discharge processes through the rotation of the moving plate (310). This structure improves the processing speed of the image sensor (s) and enables continuous operation without interference between processes.

[0088]

[0089] Hereinafter, a foreign substance inspection device (100) according to one embodiment of the present invention will be described with reference to FIGS. 4 to 8.

[0090] Fig. 4 is a schematic drawing illustrating the external appearance of a foreign substance inspection device (100). The foreign substance inspection device (100) may be configured to determine the presence and location of a foreign substance (d) present on the surface of an image sensor (s). The foreign substance inspection device (100) may include a foreign substance inspection unit (110).

[0091] Fig. 5 is a cross-sectional view taken along line AA' of the foreign matter inspection unit (110). Fig. 6 is an exploded perspective view of the foreign matter inspection unit and the mounting socket. Fig. 7 illustrates an example configuration of the foreign matter inspection unit (110) according to one embodiment of the present invention. Fig. 8 illustrates a socket board according to one embodiment of the present invention. Fig. 9 illustrates an optical image according to one embodiment of the present invention.

[0092] Referring to FIG. 5, the foreign substance inspection unit of the foreign substance inspection device may include a light source (111) and a master lens (114).

[0093] The light source (111) may be positioned so as to uniformly irradiate light over the entire surface of the image sensor (s). For example, the image sensor may be positioned at the bottom of the foreign matter inspection section, and the light source may irradiate light downward toward the image sensor.

[0094] At this time, the light source (111) may be configured as a surface light source, and the surface light source may be designed to provide a constant illuminance across the entire light-emitting surface.

[0095] The light source (111) according to the present embodiment may be configured to secure a sufficient irradiation area to simultaneously cover multiple image sensors (s) with a single surface light source. In particular, to enable inspection of multiple image sensors under the same illumination conditions, a single surface light source may include a light-emitting structure with even distribution, or may be formed as an integrated structure integrating multiple light-emitting units.

[0096] The master lens (114) may be an optical member for focusing light irradiated from a light source (111) onto a light-receiving surface of an image sensor (s). In addition, the master lens (114) may be placed in an optical path between the image sensor and the light source.

[0097] The master lenses (114) according to the present embodiment can be arranged to correspond to the positions of the image sensors, and each lens can focus light on the sensing surface of the corresponding image sensor.

[0098] In a structure in which multiple image sensors are installed in mounting sockets at regular intervals, the master lenses (114) can be arranged according to the intervals. Each lens can converge light irradiated from a surface light source (111) and transmit it to the sensing surface of the image sensor.

[0099] Figure 6 is an exploded perspective view of a foreign matter inspection unit (110) and a mounting socket (340) according to one embodiment of the present invention.

[0100] Referring to FIG. 6, the foreign body inspection unit (110) may be composed of a light source (111), a support frame (112), a socket board (113), a master lens (114), and an alignment block (115), and the mounting socket (340) may be positioned on the base (350).

[0101] As described above in Fig. 5, the light source (111) is positioned above the image sensor (s) and can irradiate light toward the surface of the sensor. The light source (111) is formed as a surface light source and has an area capable of irradiating multiple image sensors simultaneously, and can be configured to provide uniform illumination over the entire area.

[0102] This is a factor that affects the accuracy of foreign body detection, and the uniformity of the light intensity distribution must be ensured. It can be formed as a single surface light source structure or a structure in which multiple light-emitting units are integrated.

[0103] The support frame (112) may be a structure that combines and fixes upper components such as a light source (111), a socket board (113), and a master lens (114). An alignment reference may be provided so that each component can be maintained at a predetermined position. The support frame (112) may maintain an optical axis to prevent distortion of the optical path and may play a role in ensuring the mechanical stability of the entire module.

[0104] The socket board (113) is a circuit board for electrically driving the image sensor and may include a plurality of electrodes or pins electrically connected to the image sensor. When the mounting socket (340) comes into contact with the socket board (113), a driving signal is applied to the image sensor, so that the image sensor is driven and an optical image can be generated. In addition, the socket board (113) may be designed with a circuit so that it can drive a plurality of image sensors simultaneously.

[0105] The master lens (114) is an optical member for focusing light emitted from a light source (111) onto the light-receiving surface of an image sensor. It is arranged to correspond to the position of each image sensor and is placed on the optical path between the image sensor and the light source. Based on optical axis alignment, the master lens can efficiently focus light onto the sensor light-receiving surface, thereby contributing to the creation of a uniform optical image.

[0106] The alignment block (115) may be a structure that supports the mounting socket (340) in a vertical direction. The alignment block (115) may include a pin block, which may be configured to electrically contact the image sensor and transmit a driving signal. The pin block is positioned at the bottom of the alignment block to contact the image sensor and form an electrical connection with the image sensor.

[0107] The mounting socket (340) is a support structure for inserting or mounting multiple image sensors and transporting them to an inspection location. After being transported to the inspection location by a moving device, the image sensors can be raised and placed in a designated location. The mounting socket is formed to match the shape of the image sensor, thereby preventing mechanical movement of the sensor.

[0108] The base (350) is a lower support plate that supports the mounting socket and can perform a lifting operation when necessary during the process. For example, during the inspection process, the mounting socket can be raised to position the image sensor so that it makes electrical contact with the pin block of the alignment block (115).

[0109]

[0110] Fig. 7 is a side schematic diagram illustrating a connection structure for driving an image sensor in a foreign matter inspection device according to one embodiment of the present invention. Fig. 7(a) illustrates one embodiment corresponding to a structure in which the pin block is positioned at the top, and Fig. 7(b) illustrates another embodiment corresponding to a structure in which the pin block is positioned at the bottom.

[0111] Referring to Fig. 7(a), the image sensor (s) can be fixed to the base (350) while being mounted on the mounting socket (340). In this state, the base (350) is formed to be able to be lifted, so that it can perform an upward movement during the inspection process.

[0112] At this time, as the base (350) rises, the mounting socket (340) also rises, and the contact portion of the image sensor (s) can come into contact with the pin block (1151) positioned above. The pin block (1151) is included in the alignment block (115) and is formed so that it can be connected to the image sensor that is raised upward from a fixed position.

[0113] In this way, when the pin block is positioned on the upper side, the image sensor can be driven after an electrical connection is established through the upward movement of the base. After driving, light emitted from the light source (111) reaches the image sensor through the master lens (114), thereby generating an optical image.

[0114] Referring to FIG. 7(b), the light source (111) and the master lens (114) may be placed on the upper side of the base (350), and the pin block (1151) and the socket board (113) may be placed on the lower side of the base.

[0115] In the initial stage of the inspection process, the pin block (1151) is first raised while being included in the alignment block (115), and during the raising process, it can make contact with the contact portion of the image sensor (s) fixed to the mounting socket (340) to form an electrical connection. As a result, the image sensor (s) can be driven through the socket board (113).

[0116] After the electrical connection is completed, the base (350) can be moved upward together with the pin block (1151) and aligned to the irradiation position of the light source (111). In this state, light irradiated from the light source (111) can reach the image sensor (s) through the master lens (114) to generate an optical image.

[0117] That is, in a structure in which the pin block is placed on the lower side, a sequential structure can be configured in which the driving connection is first performed by raising the pin block, and then the entire base is raised to achieve alignment with the optical system.

[0118] The two embodiments of Fig. 7 can be selectively applied depending on the package type of the image sensor, the location and direction of the contacts, and the pin arrangement shape. The structure in which the pin block is positioned on the upper side can achieve connection and alignment simultaneously by a single rise of the base, and the structure in which the pin block is positioned on the lower side can sequentially perform electrical connection and optical alignment through the first rise of the pin block and the second rise of the base.

[0119] Fig. 8 is a plan view illustrating the wiring and component arrangement of a circuit board for driving an image sensor according to one embodiment of the present invention. The structure illustrated in Fig. 8 represents an example of a socket board (113) including a circuit for driving a plurality of image sensors simultaneously.

[0120] Parallel operation of image sensors requires independent power supply, control signal input, and signal output paths for each sensor. Consequently, the circuit board wiring design must be high-density. On the left side of Figure 8, a mounting area capable of mounting multiple image sensors is formed, with separate signal lines corresponding to each sensor. On the right side, circuitry for applying operating voltages and collecting output signals for each image sensor is arranged in multiple channels.

[0121] Simultaneously operating multiple image sensors on a single substrate requires wiring that takes electrical characteristics into account to prevent interference between sensors while maintaining stable signal quality. To achieve this, one embodiment of the present invention employs an electrically isolated circuit configuration for each sensor, with each channel designed to operate independently.

[0122] FIG. 9 illustrates an example of an optical image acquired from an image sensor according to one embodiment of the present invention. The image is a captured optical image generated by driving the image sensor in a foreign matter inspection device, and is configured to allow visual confirmation of the condition of the sensor surface.

[0123] In the image illustrated in Fig. 9, a circular dark area is indicated, which corresponds to a foreign substance (d) present on the surface of the image sensor. The foreign substance (d) may appear as a difference in brightness in the optical image depending on the irradiance of the light source and the light-receiving characteristics of the image sensor, and the foreign substance may be recognized as a pattern different from the general pixel response.

[0124] The foreign matter inspection device of the present invention can determine an abnormality on the surface of an image sensor using such an optical image, and can calculate the presence and location of a foreign matter by analyzing a pixel-unit signal of image data.

[0125] Foreign matter detection algorithms can extract and coordinate candidate foreign matter areas by analyzing brightness changes or contour differences exceeding a certain threshold. As shown in the example in Figure 9, once the location of the foreign matter (d) is identified, the corresponding coordinate information is transmitted to a foreign matter removal device in a subsequent process, allowing removal operations to be performed using methods such as adhesive removal.

[0126]

[0127] Fig. 10 is a schematic diagram illustrating the configuration of a foreign matter removal device (200) according to one embodiment of the present invention. The foreign matter removal device (200) has a structure capable of removing foreign matters existing on the surface of an image sensor (s) in an adhesive manner, and may include an adhesive stick (210) and an automatic stick replacement unit (220).

[0128] The foreign matter removal device (200) is configured to move an adhesive stick (210) based on the position of the image sensor and to remove foreign matter existing on the sensor surface by sticking it thereon. To this end, the adhesive stick (210) is equipped with a driving mechanism that can move linearly in the vertical direction (Z axis) and also adjust its position in the horizontal direction (X, Y axis).

[0129] When the coordinate information of the foreign body derived from the optical image analysis results is input, the adhesive stick (210) is moved to a corresponding position, aligned above the foreign body position of the image sensor, and then can come into contact with the foreign body through a downward movement. During this process, the adhesive stick (210) is controlled to a constant load or distance, thereby stably implementing the adhesive effect.

[0130] The adhesive stick (210) is a member that physically contacts and removes foreign substances by adhesion. An adhesive material is applied to the terminal portion, and foreign substances are attached and removed through this adhesive material. Since the adhesive stick may have reduced adhesive strength or deteriorated performance due to accumulated contamination with repeated use, it must be replaced after a certain number of uses.

[0131] To this end, the present embodiment may be equipped with an automatic stick replacement unit (220). The automatic stick replacement unit (220) is formed with a structure that stores a plurality of spare adhesive sticks, and can perform a function of automatically supplying a new adhesive stick or removing and replacing an adhesive stick being installed.

[0132] The control unit can count the number of times the adhesive stick has been used or determine a decline in adhesive performance based on sensor values, and then trigger automatic replacement. This device can be implemented, for example, as a structure with multiple stick holders or replacement slots arranged, and a carriage equipped with sticks can be moved or rotated to selectively supply new sticks.

[0133] The foreign matter removal device (200) can perform a position calibration procedure for the adhesive stick (210) before the start of the process or at regular intervals. At this time, the horizontal position and vertical descent depth of the adhesive stick are adjusted using a reference position or calibration target, thereby ensuring that the stick reaches an accurate position during foreign matter removal. This calibration process can be automatically performed based on a vision system or position sensor, and can contribute to ensuring process precision and repeatability reliability.

[0134] Fig. 11 illustrates a perspective view of a moving device (300) according to one embodiment of the present invention. The moving device (300) can perform a role of moving the image sensor (s) to each process position within the entire process including the inspection and foreign matter removal process.

[0135] The moving device (300) may include a rotatable moving plate (310), a plurality of mounting sockets (340) installed on the moving plate (310), and an elevating unit (390) that controls the elevation of the mounting sockets (340). The moving plate (310) has a circular plate-shaped structure, and a plurality of mounting sockets (340) may be radially arranged at regular intervals along its circumference. Each mounting socket (340) may be configured to fixally support an image sensor (s) and be maintained without displacement during a process.

[0136] The moving plate (310) can sequentially move the mounting sockets (340) to an inspection position, a foreign matter removal position, an ejection position, etc., through a rotational motion as indicated by the arrows in the drawing. For example, during one rotation cycle, the moving plate can rotate by a certain angle so that the image sensor mounted on each mounting socket can be transferred to the next process position. Accordingly, parallel process execution becomes possible, and the throughput of the entire system can be improved.

[0137] The lifting unit (390) is configured as a mechanism capable of raising or lowering the entire structure including the mounting socket (340), and can serve to adjust the height of the mounting socket in a process requiring specific positional alignment, such as an inspection process or a foreign matter removal process. For example, after moving the image sensor(s) to the inspection position, the image sensor can come into contact with the pin block of the inspection device or be aligned with the optical axis as the lifting unit (390) rises.

[0138]

[0139] Fig. 12 is a flowchart illustrating a method for removing foreign substances from an image sensor according to one embodiment of the present invention.

[0140] First, the image sensor can be mounted on the mounting socket (S1201). At this time, the image sensor (s) carried by the supply unit (320) can be mounted on the mounting socket (340) of the moving device (300). The mounting socket (340) can be formed with a structure for fixing one or more image sensors (s), and can be used as a reference for alignment and electrical connection in a subsequent process.

[0141] A moving plate (310) having a mounting socket (340) installed thereon can be rotated (S1202). The moving plate (310) can be formed to be rotatable about a central axis, and a plurality of mounting sockets (340) can be radially arranged. As the moving plate (310) rotates, the image sensor (s) can be sequentially transferred to the process positions of the foreign matter inspection device (100) and the foreign matter removal device (200).

[0142] Light can be irradiated from a light source (111) of a foreign body inspection device (100) to an image sensor (s) (S1203). The light source (111) may be configured as a surface light source and may have an irradiation area capable of simultaneously covering multiple image sensors (s). The irradiated light may be collected through a master lens (114) and transmitted to the light receiving portion of the image sensor (s).

[0143] An optical image can be generated from the image sensor(s) (S1204). The image sensor(s) can receive the irradiated light and generate an optical image through an internal circuit. The generated optical image can be transmitted to the control unit through the socket board (113) and used for foreign matter analysis.

[0144] The position of the adhesive stick (210) of the foreign substance removal device (200) can be adjusted based on the optical image analyzed by the control unit (S1205). The control unit can calculate the position coordinates of the foreign substance (d) from the optical image and move the adhesive stick (210) based on these coordinates. The movement can be performed in a direction corresponding to the position of the foreign substance, and can include an XY-axis plane movement and a Z-axis downward movement.

[0145] The adhesive stick (210) operates to remove foreign matter (d) present on the surface of the image sensor (s) (S1206). The adhesive stick (210) moves to an aligned position and then descends in the axial direction to come into contact with the foreign matter (d). Thereafter, the foreign matter (d) is removed by ascending while being attached through the adhesive layer.

[0146] The removed image sensor(s) can be removed from the mounting socket (340) (S1207). The image sensor(s) extracted from the mounting socket (340) can be transferred to the finished carrier (430) via the discharge unit (330). After the transfer is completed, the mounting socket (340) returns to its initial position to accommodate the next image sensor.

[0147] FIG. 13 is a flowchart illustrating a method for generating an optical image of an image sensor according to one embodiment of the present invention.

[0148] The method may consist of steps relating to electrical driving of the image sensor and optical image acquisition process.

[0149] First, the mounting socket (340) equipped with the image sensor can move toward the socket board (113) (S1301).

[0150] In this step, depending on the rotation of the moving device (300) or the lifting and lowering motion of the base (350), the mounting socket (340) can approach the position of the pin block (1151) and the socket board (113) on the alignment block (115).

[0151] Next, the image sensor(s) can be electrically connected to the socket board (113) (S1302).

[0152] At this time, the electrode of the image sensor (s) can be brought into contact with the contact point of the socket board (113) via the pin block (1151), and depending on the structure, the pin block (1151) can be raised or the base (350) can be raised to perform the connection.

[0153] Afterwards, the image sensor(s) can be electrically driven (S1303).

[0154] When power is applied through the socket board (113), the internal circuit of the image sensor (s) can be activated and put into an operating state. In this state, the image sensor can be ready to receive irradiated light from the light source (111).

[0155] Finally, an optical image can be generated from the image sensor(s) (S1304).

[0156] Light irradiated from a light source (111) passes through a master lens (114) and reaches an image sensor (s), and the image sensor receives the light and converts it into an internal signal, thereby generating an optical image. The generated optical image can be used as data for detecting foreign substances.

[0157] FIG. 14 is a flowchart illustrating a process for determining the location of a foreign object and moving a foreign object removal device in a foreign object removal process of an image sensor according to one embodiment of the present invention. This flowchart may include a series of steps for calculating the location of a foreign object based on an optical image generated by the image sensor and moving an adhesive device to that location.

[0158] First, an optical image output from an image sensor can be received (S1401).

[0159] At this time, the receiving device may be a control unit included in the foreign body inspection device (100) or an external image processing system, and may convert the optical image into digital data and store it in the internal memory.

[0160] Next, the presence or absence of a foreign object can be determined from the received optical image (S1402).

[0161] At this stage, the presence of a foreign object can be determined based on signals such as brightness changes, contrast differences, and outline distortions in the optical image by comparing and analyzing them with the reference area or reference pattern of the image sensor.

[0162] Afterwards, the location of the detected foreign body can be calculated (S1403).

[0163] The coordinates of the foreign body are set based on the center position of the foreign body on the optical image and can be converted to an absolute coordinate system on the image sensor or a coordinate system based on the mounting socket. The calculated coordinates can be used as reference information for the operation of the foreign body removal device (200).

[0164] Finally, the foreign body removal device can be moved to the calculated position (S1404).

[0165] The foreign body removal device is equipped with an adhesive stick (210), and the control unit sets a movement path of the adhesive stick based on position information and can perform a plane movement in the XY direction and an elevation movement in the Z direction. This step can be regarded as a position alignment operation immediately before the foreign body removal operation.

[0166] As described above, the foreign matter removal system and method of an image sensor according to one embodiment of the present invention may include a series of structures and operations for inspecting an image sensor based on an optical image and automatically removing foreign matters based on the inspection results.

[0167] The above system, which comprises a light source, a lens, a socket board, an adhesive device, a rotating plate, and the like, can be designed to determine the presence of foreign matter on the surface of an image sensor, remove the foreign matter through adhesive removal, and then transfer it to the next process. Each component can be arranged to operate in parallel for multiple image sensors, and the entire process can be controlled through an automated flow.

[0168] The present invention can be applied to various types of image sensors through these configurations and processes, and various modifications can be made depending on the structure and inspection method of the sensor.

[0169]

[0170] It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

[0171] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. In a system for detecting and removing foreign substances existing on the surface of an image sensor, A foreign matter inspection device that generates an optical image from the image sensor by irradiating light; A foreign body removal device for removing the foreign body based on the optical image; and A moving device for moving the image sensor from the foreign substance inspection device to the foreign substance removal device; A foreign matter removal system for an image sensor including:

2. In paragraph 1, The above foreign body inspection device A light source that irradiates the above light; At least one lens that focuses the light emitted from the image sensor; and A foreign matter removal system for an image sensor, characterized in that it includes a socket board that drives the image sensor.

3. In paragraph 2, The above socket board A foreign matter removal system for an image sensor, characterized in that it includes a circuit for driving a plurality of image sensors simultaneously.

4. In paragraph 1, The above foreign body removal device A foreign matter removal system for an image sensor, characterized in that it includes an adhesive stick having an adhesive portion for adhering the foreign matter and moving linearly in the axial direction.

5. In paragraph 4, The above foreign body removal device Based on the above optical image, the location of the foreign body is determined, A foreign matter removal system for an image sensor, characterized in that the adhesive stick is moved in a direction perpendicular to the axial direction based on the location of the foreign matter.

6. In paragraph 4, The above foreign body removal device A foreign matter removal system for an image sensor, characterized in that it includes a stick replacement unit that automatically replaces the first adhesive stick with the second adhesive stick when the first adhesive stick among the above adhesive sticks has been used a preset number of times or more.

7. In paragraph 1, The above moving device A foreign matter removal system for an image sensor, characterized in that it includes a rotating plate having at least one mounting socket on which the image sensor is mounted, and the image sensor is moved by rotating the rotating plate.

8. In paragraph 7, The above moving device A foreign matter removal system for an image sensor, characterized in that it includes a lifting unit for lifting the above-mentioned mounting socket.

9. In paragraph 7, The above moving device A supply unit for mounting the image sensor to the mounting socket; and A foreign matter removal system for an image sensor, characterized in that it includes a discharge unit for removing the image sensor from the mounting socket.

10. A method for detecting and removing foreign matter existing on the surface of an image sensor, A step of irradiating light from a light source to the image sensor; A step of generating an optical image from the image sensor; A step of adjusting the position of the foreign body removal device based on the above optical image; and A step of removing the foreign substance using the foreign substance removal device; A method for removing foreign matter from an image sensor including a .

11. In paragraph 10, The step of generating the above optical image is A step of moving a mounting socket equipped with the image sensor toward a socket board; A step in which the image sensor is electrically connected to the socket board; and A method for removing foreign substances from an image sensor, characterized in that it comprises a step of driving the image sensor.

12. In paragraph 10, The step of adjusting the position of the foreign body removal device based on the above optical image is A step of receiving the above optical image; A step of analyzing the above optical image to determine whether there is a foreign substance; A step of calculating the location of the foreign body when the foreign body exists; A method for removing foreign matter from an image sensor, characterized by comprising the step of moving the foreign matter removal device to a position corresponding to the position of the foreign matter.

13. In paragraph 10, The above foreign body removal device An adhesive stick having an adhesive portion for adhering the foreign substance and moving linearly in the axial direction; and A method for removing foreign substances from an image sensor, characterized in that it includes a stick replacement unit that automatically replaces the first adhesive stick among the above adhesive sticks with the second adhesive stick when the first adhesive stick is used more than a preset number of times.

14. In paragraph 10, A step of mounting the image sensor in a mounting socket; A step of rotating a turntable on which at least one of the above mounting sockets is arranged; and A method for removing foreign matter from an image sensor, characterized in that it further comprises a step of removing the image sensor from the mounting socket.

15. In paragraph 14, A method for removing foreign matter from an image sensor, characterized in that the above mounting socket mounts a plurality of image sensors.

16. A light source that irradiates light toward a plurality of image sensors; A plurality of lenses that focus the light irradiated onto each image sensor among the plurality of image sensors; A socket board including a circuit connected to the plurality of image sensors, and A foreign matter inspection device including a control unit that applies electricity to the socket board to drive the plurality of image sensors, receives an optical image generated by the image sensor, and calculates the location of a foreign matter existing on the surface of the image sensor based on the optical image.

17. Camera assembly equipment including a foreign matter removal system for an image sensor according to any one of claims 1 to 9.

Images