Chip feeding apparatus and chip testing system

Abstract

A chip feeding apparatus and a chip testing system, relating to the technical field of semiconductor testing. An adsorption assembly is used for adsorbing a tested chip on a conveying assembly, a cantilever of a feeding assembly is provided with a first position for bearing the tested chip adsorbed by the adsorption assembly and a second position for placing the tested chip on a chip testing apparatus, and the cantilever is configured to be controlled to rotate so as to switch between the first position and the second position. By means of the rotation of the cantilever, the tested chip can be carried to the chip testing apparatus.

Description

A chip loading device and a chip testing system Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a chip loading device and a chip testing system. Background Technology

[0002] Electronic products require electronic components to have good performance and reliability, therefore, it is necessary to perform electrical performance testing on chips.

[0003] Existing testing equipment mainly includes chip loading equipment, chip testing equipment, and chip unloading equipment to achieve automated chip testing. After the chip under test (DUT) enters the chip loading equipment, it needs to be transferred from the loading equipment to the chip testing equipment for performance testing. Therefore, transfer devices need to be installed on both the chip loading and unloading equipment to handle the DUT. However, the transfer devices in existing technologies are complex in structure and occupy a large amount of space, so there is an urgent need to design a transfer device with a simple structure and small footprint.

[0004] Furthermore, after the wafer enters the chip loading equipment from the wafer cassette, a limiting component is needed to ensure the stability of the wafer during transport. In existing technologies, the limiting component can generally only limit wafers of one size, so the chip loading equipment can generally only load wafers of one size and cannot load wafers of different sizes, which is a limitation.

[0005] Summary of the Invention

[0006] One objective of the first aspect of the present invention is to provide a chip loading device that solves the technical problem that the chip handling device in the prior art has a complex structure and occupies a large space.

[0007] A further objective of the first aspect of the invention is to detach the chip under test from the blue film.

[0008] Another object of the first aspect of the present invention is to provide a chip testing system having the above-described chip loading equipment.

[0009] A second aspect of the present invention aims to provide a chip loading device that solves the technical problem that existing chip loading devices can only load wafers of one size.

[0010] A further objective of the second aspect of the present invention is to achieve wafer positioning adjustment.

[0011] Specifically, according to a first aspect of the present invention, the present invention provides a chip loading device, comprising:

[0012] Installation platform;

[0013] A delivery assembly, mounted on the mounting platform, is used to deliver the chip under test;

[0014] An adsorption component, mounted on the mounting platform, is used to adsorb the chip under test on the delivery component;

[0015] The loading assembly includes a cantilever having a first position for receiving the chip under test adsorbed by the adsorption assembly and a second position for placing the chip under test on a chip testing device. The cantilever is configured to rotate in a controlled manner to switch between the first and second positions, thereby transporting the chip under test adsorbed by the adsorption assembly to the chip testing device.

[0016] Optionally, the cantilever has an internal air channel for adsorbing the chip under test. The air channel is connected to a vacuum pumping device so that the chip under test can be adsorbed through the air channel when the vacuum pumping device is evacuated.

[0017] Optionally, the feeding assembly further includes:

[0018] A drive unit is connected to the cantilever, and the drive unit is configured to controllably drive the cantilever to rotate along a first plane, the first plane being perpendicular to the horizontal plane.

[0019] Optionally, the chip under test has a first surface;

[0020] During the process of switching the cantilever from the first position to the second position, the first surface of the chip under test is switched from facing upwards to facing downwards.

[0021] Optionally, the chip loading device also includes:

[0022] A first sliding component is disposed on top of the conveying component and connected to the adsorption component, for driving the adsorption component to move so that the adsorption component adsorbs the chip under test and transports the chip under test to the cantilever.

[0023] Optionally, the conveying assembly includes:

[0024] A pair of slide rails are mounted on the mounting platform and extend in a horizontal direction;

[0025] A support platform for carrying a wafer, with its two ends slidably connected to corresponding slide rails and configured to slide under the drive of the pair of slide rails to transport the wafer to a third position, the third position being located at the bottom of the adsorption assembly, and the wafer including at least one of the chips under test.

[0026] Optionally, the chip loading device also includes:

[0027] A stripping assembly is mounted on the mounting platform and is configured to detach the chip under test from the blue film on the wafer when the carrier slides to its top following the pair of slide rails.

[0028] Optionally, the demolding assembly includes:

[0029] A pin cap having at least one through hole at the top, the pin cap being configured to move in a controlled manner along a vertical direction;

[0030] At least one pin is located inside the pin cap, each pin corresponding to a through hole. The pin is configured to pass through the corresponding through hole of the pin cap when the pin cap moves downward, so as to lift the chip under test and thereby detach the chip under test from the blue film.

[0031] Optionally, the chip loading device also includes:

[0032] A heating component is disposed at the bottom of the mounting stage. The heating component is configured to heat the bottom of the wafer on the mounting stage when the carrier stage slides to the fourth position following the pair of slide rails, so that the chip under test is detached from the blue film of the wafer.

[0033] Optionally, the support platform includes:

[0034] Mounting plate;

[0035] A limiting component, detachably mounted on the mounting plate, is used to limit the position of the wafer.

[0036] Optionally, the chip loading device also includes:

[0037] A robotic arm is slidably mounted on the mounting platform. The robotic arm is configured to grasp the wafer in the wafer loading device and slide in a controlled manner to transport the wafer to the limiting component.

[0038] In particular, according to a second aspect of the present invention, a chip loading device is provided, comprising a mounting stage and a conveying mechanism slidably mounted on the mounting stage, the conveying mechanism comprising:

[0039] The support component includes a mounting plate, wherein at least one first mating member is provided on the mounting plate;

[0040] A limiting assembly includes a base plate and a top plate detachably mounted on the mounting plate, wherein a limiting space for limiting the wafer is defined between the base plate and the top plate, and at least one second mating member is provided at the bottom of the base plate so that the base plate can be detachably mounted on the mounting plate by the engagement of the second mating member with the first mating member.

[0041] Optionally, the base plate includes two spaced-apart support plates, each support plate having a horizontally arranged support surface and a vertically arranged abutment surface. The support surfaces of the two support plates jointly support the steel ring of the wafer, and the two abutment surfaces respectively abut against two opposite sides of the steel ring, thereby limiting the position of the steel ring.

[0042] Optionally, the top plate includes two pressure plates arranged at a first preset distance, each pressure plate being mounted on top of a support plate and spaced at a second preset distance from the corresponding support surface, and the wafer being located between the pressure plate and the support plate.

[0043] Optionally, the mounting plate has two mounting slots, each mounting slot is used to mount a support plate, the mounting slot is provided with the first mating member, and the bottom of the support plate is provided with the second mating member.

[0044] Optionally, the first mating component is a magnet, and the second mating component is a magnetic plate.

[0045] Optionally, the chip loading device also includes:

[0046] A robotic arm is slidably mounted on the mounting platform. The robotic arm is configured to grab the steel ring of the wafer from the material frame and slide in a controlled manner to drive the wafer to slide from the side of the limiting component between the support plate and the pressure plate of the mounting plate.

[0047] Optionally, the first preset distance is greater than the width of the robotic arm, so that after the robotic arm grasps the steel ring of the wafer, it moves between the two pressure plates, thereby driving the wafer to move horizontally between the pressure plate and the support plate.

[0048] Optionally, the carrier component further includes:

[0049] A first support platform, wherein the mounting plate is rotatably connected to the first support platform;

[0050] The second support platform is located below the first support platform;

[0051] A crossed roller bearing is mounted on the second bearing platform;

[0052] A timing pulley is connected to the crossed roller bearing and to the mounting plate via at least one guide shaft;

[0053] A timing belt is fitted onto the timing gear;

[0054] A driving component is connected to the timing belt. The driving component is configured to drive the timing belt to rotate the timing pulley, thereby driving the mounting plate to rotate relative to the first support platform via the guide shaft, thereby adjusting the position of the wafer.

[0055] Optionally, the mounting plate has an annular groove on its periphery, and the support assembly further includes:

[0056] Multiple follower wheels are mounted on the first support platform and located within the annular groove to follow the rotation of the mounting plate.

[0057] In particular, the present invention also provides a chip testing system, comprising:

[0058] Such as the chip loading equipment mentioned above;

[0059] A chip testing device is disposed on one side of the chip loading device. The chip testing device is used to receive the chip under test transported by the chip loading device and to perform performance testing on the chip under test.

[0060] A chip unloading device is located on the side of the chip testing device away from the chip loading device, and is used to receive the chip under test transported by the chip testing device and unload it.

[0061] According to some embodiments of the present invention, an adsorption component is used to adsorb the chip under test (DUT) on a transport component. The cantilever of the loading component has a first position for carrying the DUT adsorbed by the adsorption component and a second position for placing the DUT on a chip testing device. The cantilever is configured to rotate in a controlled manner to switch between the first and second positions. This technical solution, through the rotation of the cantilever, can transport the DUT to the chip testing device. Compared to the prior art's use of a moving method, it eliminates the need for multiple slide rails, thereby simplifying the structure and saving layout space.

[0062] Furthermore, the chip loading device of the present invention includes a stripping component mounted on a mounting platform. The stripping component is configured to detach the chip under test from the blue film on the wafer when the carrier slides to its top following a pair of slide rails, so that the adsorption component can easily adsorb the chip under test.

[0063] According to other embodiments of the present invention, the carrier component is mounted on a mounting plate, the mounting plate is provided with at least one first mating member, and the limiting component includes a bottom plate and a top plate detachably mounted on the mounting plate. A limiting space for limiting the wafer is defined between the bottom plate and the top plate. At least one second mating member is provided at the bottom of the bottom plate, so that the bottom plate can be detachably mounted on the mounting plate and the top plate can also be detachably mounted on the mounting plate through the cooperation of the second mating member and the first mating member. This allows the limiting component to be replaced according to wafers of different sizes, enabling the chip loading equipment to load wafers of different sizes and making the chip loading equipment universal.

[0064] Furthermore, the bearing assembly of the present invention also includes a first bearing platform rotatably connected to the mounting plate, a second bearing platform located below the first bearing platform, a crossed roller bearing mounted on the second bearing platform, a timing pulley connected to the crossed roller bearing and connected to the mounting plate through at least one guide shaft, a timing belt sleeved on a timing gear, a drive member connected to the timing belt, and the drive member configured to drive the timing belt to rotate the timing pulley, thereby driving the mounting plate to rotate along the first bearing platform through the guide shaft, thereby adjusting the position of the wafer.

[0065] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0066] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0067] Figure 1 is a schematic structural diagram of a chip loading device according to an embodiment of the present invention from one angle;

[0068] Figure 2 is a schematic structural diagram of a chip loading device according to an embodiment of the present invention from another angle;

[0069] Figure 3 is a schematic structural diagram of a chip feeding device according to an embodiment of the present invention, excluding the wafer feeding device and the chip feeding assembly, from one angle.

[0070] Figure 4 is a schematic structural diagram of a chip feeding device according to an embodiment of the present invention, excluding the wafer feeding device and the chip feeding assembly, from another angle.

[0071] Figure 5 is a schematic enlarged view of the adsorption component in a chip loading device according to an embodiment of the present invention;

[0072] Figure 6 is a schematic structural diagram of a feeding assembly according to an embodiment of the present invention;

[0073] Figure 7 is a schematic structural diagram of a demolding assembly according to an embodiment of the present invention;

[0074] Figure 8 is a schematic cross-sectional view of a demolding assembly according to an embodiment of the present invention;

[0075] Figure 9 is a schematic enlarged view of the robot arm, the stripping assembly, and the cantilever in a chip loading device according to an embodiment of the present invention;

[0076] Figure 10 is a schematic enlarged view of the limiting component and mounting plate in a chip loading device according to an embodiment of the present invention;

[0077] Figure 11 is a schematic structural diagram of a chip loading device according to an embodiment of the present invention from one angle;

[0078] Figure 12 is a schematic structural diagram of a chip loading device according to an embodiment of the present invention from another angle;

[0079] Figure 13 is a schematic structural diagram of a limiting component in a chip loading device according to an embodiment of the present invention;

[0080] Figure 14 is a schematic structural diagram of a mounting plate according to an embodiment of the present invention;

[0081] Figure 15 is a schematic structural diagram of a carrier component according to an embodiment of the present invention;

[0082] Figure 16 is a schematic connection block diagram of a chip testing system according to an embodiment of the present invention.

[0083] Figure label:

[0084] 1000-Chip testing system, 100-Chip loading equipment, 200-Wafer, 210-Steel ring, 300-Chip testing equipment, 400-Chip unloading equipment, 10-Mounting platform, 20-Conveying assembly, 30-Loading assembly, 40-Adsorption assembly, 50-First sliding assembly, 60-Removal assembly, 70-Wafer loading device, 90-Heating assembly, 21-Pair of slide rails, 22-Bearing platform, 23-Waste tray, 24-Limiting component, 241-Pressure plate, 242-Support plate, 25-Mounting plate, 26-Chip feeding assembly, 31-Cantilever, 32-Driver, 41-Nozzle, 61-Second sliding assembly, 62-Motor, 63-End face cam, 64-Roller, 65-Slider, 6 6-Ejector cap, 67-Ejector pin, 661-Through hole, 71-Bearing plate, 72-Limiting block, 81-Manipulator, 82-Third sliding assembly, 91-Air outlet, 101-Bearing assembly, 11-Mounting plate, 12-First bearing platform, 13-Second bearing platform, 14-Crossed roller bearing, 15-Synchronous pulley, 16-Synchronous pulley, 17-Drive component, 18-Guide shaft, 201-Base plate, 220-Top plate, 211-Support plate, 221-Pressure plate, 213-Abutting surface, 214-Supporting surface, 301-Mounting platform, 121-Mounting component, 401-Manipulator, 111-Mounting groove, 112-Mounting hole, 212-Second mating component, 122-Follower wheel, 113-Annular groove. Detailed Implementation

[0085] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0086] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0087] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0088] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0089] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0090] Figure 1 is a schematic structural diagram of a chip loading device 100 from one angle according to an embodiment of the present invention; Figure 2 is a schematic structural diagram of a chip loading device 100 from another angle according to an embodiment of the present invention; Figure 3 is a schematic structural diagram of a chip loading device 100 from one angle excluding the wafer loading device 70 and the chip feeding assembly 26 according to an embodiment of the present invention; Figure 4 is a schematic structural diagram of a chip loading device 100 from another angle excluding the wafer loading device 70 and the chip feeding assembly 26 according to an embodiment of the present invention; Figure 5 is a schematic enlarged view of the adsorption assembly 40 in the chip loading device 100 according to an embodiment of the present invention; and Figure 6 is a schematic structural diagram of the loading assembly 30 according to an embodiment of the present invention. As shown in Figures 1 to 6, in this embodiment, the chip loading device 100 includes a mounting stage 10, a conveying assembly 20, an adsorption assembly 40, and a loading assembly 30. The conveying assembly 20 is mounted on the mounting stage 10 and is used to convey the chip under test. The adsorption assembly 40 is mounted on the mounting stage 10 and is used to adsorb the chip under test on the conveying assembly 20. The loading assembly 30 includes a cantilever 31, which has a first position for receiving the chip under test adsorbed by the adsorption assembly 40 and a second position for placing the chip under test on the chip testing equipment. The cantilever 31 is configured to rotate in a controlled manner to switch between the first position and the second position, thereby transporting the chip under test adsorbed by the adsorption assembly 40 to the chip testing equipment.

[0091] This embodiment can move the chip under test to the chip testing equipment by rotating the cantilever 31. Compared with the moving method in the prior art, it does not require multiple slide rails, thus simplifying the structure and saving layout space.

[0092] In this embodiment, the cantilever 31 has an internal air channel for adsorbing the chip under test. The air channel is connected to a vacuum pump so that the chip under test can be adsorbed through the air channel when the vacuum pump is evacuated. Here, the air channel has an air inlet, and the adsorption assembly 40 simply places the adsorbed chip under test at the air inlet.

[0093] In this embodiment, the feeding assembly 30 further includes a drive member 32 connected to the cantilever 31. The drive member 32 is configured to controllably drive the cantilever 31 to rotate along a first plane, which is perpendicular to the horizontal plane. That is, the cantilever 31 rotates along a vertical plane, so the chip under test needs to be adsorbed through an air duct to prevent it from falling off the cantilever 31 during rotation. In some specific embodiments, the drive member 32 is a motor, and the cantilever 31 is connected to the output shaft of the motor. The rotation of the motor's output shaft drives the cantilever 31 to rotate, as shown in Figure 6.

[0094] In this embodiment, the chip under test has a first surface. During the transition from the first position to the second position, the cantilever 31 switches the first surface of the chip under test from facing upwards to facing downwards. That is, the cantilever 31 flips the chip under test during rotation. Here, the first surface is the functional surface of the chip under test. When the cantilever 31 is in the first position, the functional surface of the chip under test faces upwards; when the cantilever 31 is in the second position, the functional surface of the chip under test faces downwards. The adsorption assembly 40 adsorbs the functional surface of the chip under test, placing the chip under test directly on the cantilever 31 so that the functional surface of the chip under test faces upwards. Here, the adsorption assembly 40 has a suction nozzle 41 for adsorbing the chip under test.

[0095] Referring to Figure 6, when the cantilever 31 is in the first position, it extends horizontally, as shown at point A in Figure 6. The air inlet of the air passage faces upward to adsorb the chip under test. The adsorption assembly 40 places the chip under test at the air inlet from above the cantilever 31. After rotating 180° clockwise, the cantilever 31 is in the second position, as shown at point B in Figure 6. At this time, the air inlet of the air passage faces downward, and the chip under test is rotated 180°. The chip testing equipment has a receiving tray below point B to hold the chip under test adsorbed by the cantilever 31.

[0096] In some specific embodiments, the chip loading device 100 further includes a first sliding component 50. The first sliding component 50 is disposed on top of the conveying component 20 and connected to the adsorption component 40, for driving the adsorption component 40 to move so that the adsorption component 40 adsorbs the chip under test and transports the chip under test to the cantilever 31. Here, the first sliding component 50 has a first slide rail extending along the X direction and a second slide rail extending along the Z direction, the second slide rail being connected to the first slide rail. The first and second slide rails are configured to drive the adsorption component 40 to slide along the X and Z directions, so as to slide above the cantilever 31 and place the chip under test onto the cantilever 31.

[0097] In some specific embodiments, the first sliding component 50 further includes a third slide rail extending along the Z direction. The third slide rail is connected to the first slide rail and arranged side by side with the second slide rail. The third slide rail is connected to the drive member 32 to drive the cantilever 31 to slide along the X and Z directions.

[0098] In some embodiments, the transport assembly 20 includes a pair of slide rails 21 and a carrier stage 22. The pair of slide rails 21 are mounted on the mounting stage 10 and extend horizontally. The carrier stage 22 is used to carry the wafer 200. Both ends of the carrier stage 22 are slidably connected to the corresponding slide rails 21 and are configured to slide under the influence of the pair of slide rails 21 to transport the wafer 200 to a third position located at the bottom of the adsorption assembly 40. The wafer 200 includes at least one chip under test. Here, the pair of slide rails 21 extend along the Y direction to drive the carrier stage 22 to slide along the Y direction.

[0099] Figure 7 is a schematic structural diagram of a stripping assembly 60 according to an embodiment of the present invention, and Figure 8 is a schematic cross-sectional view of a stripping assembly 60 according to an embodiment of the present invention. As shown in Figures 7 and 8, and referring to Figures 1 to 4, in some specific embodiments, the chip loading device 100 further includes a stripping assembly 60, which is mounted on the mounting stage 10. The stripping assembly 60 is configured to detach the chip under test from the blue film on the wafer 200 when the carrier stage 22 slides to its top following a pair of slide rails 21, so that the adsorption assembly 40 can easily adsorb the chip under test.

[0100] In some specific embodiments, the stripping assembly 60 includes a pin cap 66 and at least one pin 67. The top of the pin cap 66 has at least one through hole 661, and the pin cap 66 is configured to move vertically in a controlled manner. The pins 67 are located inside the pin cap 66, and each pin 67 corresponds to a through hole 661. The pins 67 are configured to pass through the corresponding through hole 661 of the pin cap 66 when the pin cap 66 moves downward, so as to lift the chip under test, thereby removing the chip under test from the blue film. Here, the stripping assembly 60 also includes a motor 62, an end face cam 63, a roller 64, and a slider 65. The roller 64 is connected to the pin cap 66, the pin cap 66 is slidably connected to the slider 65, the end face cam 63 is connected to the motor 62, and has an inclined surface. The end face cam 63 is configured to rotate under the drive of the motor 62, so that the roller 64 rolls along the inclined surface, thereby driving the pin cap 66 to move up and down along the slider 65. In this embodiment, the cooperation between the end face cam 63 and the roller 64 allows the ejector cap 66 to move smoothly along the Z direction.

[0101] In some specific embodiments, the top of the pin cap 66 is provided with an adsorption port for adsorbing the blue film. When the pin cap 66 moves to the position where it contacts the blue film, it first adsorbs the blue film through the adsorption port. Then the pin cap 66 moves downward, so that the pin 67 protrudes out of the pin cap 66, thereby lifting the chip under test.

[0102] Referring to Figures 4 and 7, in some specific embodiments, the chip loading device 100 further includes a second sliding component 61. The second sliding component 61 is mounted on the bottom of the mounting platform 10 and connected to the stripping component 60 to drive the stripping component 60 to move vertically, thereby enabling the stripping component 60 to...

[0103] Referring to Figure 3, in some specific embodiments, the chip loading device 100 further includes a heating component 90 disposed at the bottom of the mounting stage 10. The heating component 90 is configured to heat the bottom of the wafer 200 on the carrier stage 22 when the carrier stage 22 slides to the fourth position following a pair of slide rails 21, so that the chip under test is removed from the blue film of the wafer 200. Here, both the third and fourth positions are in the Y direction, and the fourth position is upstream of the third position. That is, the carrier stage 22 first reaches the fourth position, is heated at the fourth position, and then continues to move to the third position for film removal. Here, the heating component 90 has an outlet 91 for discharging hot gas.

[0104] In this embodiment, visual inspection components are provided at both the third and fourth positions to detect scratches and other damage to the chip under test.

[0105] Figure 9 is a schematic enlarged view of the robot arm 81, the stripping assembly 60, and the cantilever 31 in a chip loading device 100 according to an embodiment of the present invention. As shown in Figure 9, and referring to Figure 2, in this embodiment, the chip loading device 100 further includes a robot arm 81, which is slidably mounted on the mounting stage 10. The robot arm 81 is configured to grasp a wafer 200 in the wafer loading device 70 and slide it in a controlled manner to transport the wafer 200 to the limiting member 24. The chip loading device 100 also includes a third sliding assembly 82, which is mounted on the mounting stage 10 and extends in the same direction as a pair of slide rails 21, i.e., along the Y direction. The robot arm 81 is mounted on the third sliding assembly 82 to move along the Y direction. A wafer loading device 70 is installed on one side of the chip loading equipment 100. The robot arm 81 can move along the Y direction to the wafer loading device 70 to grab the wafer 200 and move along the Y direction, thereby driving the wafer 200 to the carrier platform 22 to complete the loading of the wafer 200.

[0106] In a preferred embodiment, the chip loading device 100 further includes a chip feeding assembly 26 mounted on the mounting stage 10. The chip feeding assembly 26 is used to transport the chip under test (DUT) to the vicinity of the adsorption assembly 40, so that the adsorption assembly 40 can adsorb the DUT on the chip feeding assembly 26 and transport the DUT to the cantilever 31. It can be understood that there are two loading methods in this embodiment: wafer 200 loading and chip loading. The adsorption assembly 40 can adsorb chips on the wafer 200 and chips directly fed from the chip feeding assembly 26. The DUT fed from the chip feeding assembly 26 does not need to pass through the heating assembly 90 and the stripping assembly 60; the adsorption assembly 40 can directly adsorb it. The wafer 200 transported from the wafer loading device 70 needs to be heated and stripped before the adsorption assembly 40 can adsorb the DUT on the wafer 200. Here, the chip feeding assembly 26 is mounted beside a pair of slide rails 21. This embodiment is compatible with two feeding methods, making feeding more convenient and more universal.

[0107] The wafer loading device 70 includes a carrier plate 71 that carries a wafer frame, within which wafers 200 are stacked. The carrier plate 71 has two sets of limiting block groups, each group including multiple limiting blocks 72 for limiting the wafer frame. The carrier plate 71 can move vertically under drive to adjust the height of the wafer frame. Each set of limiting blocks 72 is used to limit a wafer frame of one size. Different sized wafer frames are used to hold wafers 200 of different sizes, allowing the wafer loading device 70 to be compatible with wafer frames of different sizes. It can load two different sizes of wafers 200 without disassembling the wafer loading device 70. A robotic arm 81 picks up the wafers 200 from the wafer frame.

[0108] Figure 10 is a schematic enlarged view of the limiting component 24 and the mounting plate 25 in a chip loading device 100 according to an embodiment of the present invention. As shown in Figure 10, in some specific embodiments, the support stage 22 includes a mounting plate 25 and a limiting component 24. The mounting plate 25 has mounting grooves, and the limiting component 24 is detachably mounted on the mounting plate 25 for limiting the wafer 200. The limiting component 24 includes two support plates 242 and two pressure plates 241. The mounting plate 25 is provided with two mounting grooves. Each support plate 242 corresponds to one pressure plate 241 and is mounted in one mounting groove. Each pressure plate 241 is mounted above the corresponding support plate 242. A limiting space for limiting the wafer 200 is formed between the support plate 242 and the corresponding pressure plate 241. The pressure plate 241 is semi-arc-shaped, and the two pressure plates 241 are arranged at intervals and together form a ring.

[0109] In a preferred embodiment, the mounting groove has at least one mounting hole for placing a magnet, and the bottom of the support plate 242 has a magnetic plate that attracts the magnet. The attraction between the magnetic plate and the magnet allows the limiting member 24 to be detachably mounted on the mounting plate 25. This embodiment enables the limiting member 24 to be detachable from the mounting plate 25, allowing for the replacement of limiting members 24 of different sizes to limit wafers 200 of different sizes. Here, each size of limiting member 24 limits a wafer 200 of one size; that is, each limiting member 24 corresponds to a feed frame of one size.

[0110] Referring to Figure 10, in this embodiment, the two pressure plates 241 are spaced by a preset distance, which is greater than the width of the robot arm 81. This allows the robot arm 81 to grasp the steel ring 210 of the wafer 200 and move along the Y direction, thereby moving the wafer 200 directly from the side of the support platform 22 to between the support plate 242 and the pressure plate 241, thus limiting the wafer 200. This embodiment can limit the wafer 200 while it is being transported, simplifying the structure and omitting the loading step. Here, the robot arm 81 grasps the steel ring 210 of the wafer 200. The pressure plate 241 is bolted to the top of the mounting plate 25. When disassembling the limiting component 24, the pressure plate 241 is first removed from the mounting plate 25, and then the support plate 242 is removed from the mounting plate 25. Since the support plate 242 is magnetically attached to the mounting plate 25, replacement is convenient and fast.

[0111] In some specific embodiments, at least one waste tray 23 is installed on the side of the support stage 22. When the visual inspection component detects that the chip under test has scratches or contamination, the scratched or contaminated chip under test can be transferred to the waste tray 23 by the adsorption component 40, without having to go through the chip testing equipment 300 for testing, thus saving testing resources.

[0112] Figure 11 is a schematic structural diagram of a chip loading device 100 from one angle according to an embodiment of the present invention; Figure 12 is a schematic structural diagram of a chip loading device 100 from another angle according to an embodiment of the present invention; Figure 13 is a schematic structural diagram of a limiting component in a chip loading device 100 according to an embodiment of the present invention; and Figure 14 is a schematic structural diagram of a mounting plate 11 according to an embodiment of the present invention. As shown in Figures 11 to 14, in this embodiment, the chip loading device 100 includes a mounting platform 301 and a conveying mechanism slidably mounted on the mounting platform 301. The conveying mechanism includes a carrying component 101 and a limiting component. The carrying component 101 includes a mounting plate 11, and at least one first mating member is provided on the mounting plate 11. The limiting assembly includes a base plate 201 and a top plate 220 detachably mounted on the mounting plate 11. A limiting space for limiting the wafer 200 is defined between the base plate 201 and the top plate 220. The bottom of the base plate 201 is provided with at least one second mating member 212, so that the base plate 201 can be detachably mounted on the mounting plate 11 through the engagement of the second mating member 212 with the first mating member. Here, the top plate 220 is mounted on the mounting plate 11 by bolts.

[0113] This embodiment allows the base plate 201 and the top plate 220 to be detachably mounted on the mounting plate 11, and the top plate 220 can also be detachably mounted on the mounting plate 11. This allows the corresponding limiting components to be replaced according to the wafers 200 of different sizes, enabling the chip loading equipment 100 to handle the loading of wafers 200 of different sizes, thus making the chip loading equipment 100 universal.

[0114] It should be noted that those skilled in the art will recognize that, although not shown in FIG11, in some embodiments, the chip loading device 100 may also include one or more components as shown in FIG1 to FIG10, such as at least one of the following: loading component 30, adsorption component 40, first sliding component 50, stripping component 60, wafer loading device 70, heating component 90, etc.

[0115] In this embodiment, the base plate 201 includes two spaced-apart support plates 211. Each support plate 211 has a horizontally arranged support surface 214 and a vertically arranged abutment surface 213. The support surfaces 214 of the two support plates 211 jointly support the steel ring 210 of the wafer 200, and the two abutment surfaces 213 respectively abut against two opposite sides of the steel ring 210, thereby limiting the position of the steel ring 210. It can be understood that the support plates 211 are stepped, as shown in Figure 11. The abutment surface 213 extends vertically, and the support surface 214 extends horizontally, with the support surface 214 and the abutment surface 213 perpendicular to each other.

[0116] In this embodiment, the top plate 220 includes two pressure plates 221 arranged at a first preset distance. Each pressure plate 221 is mounted on top of a support plate 211 and is spaced at a second preset distance from the corresponding support surface 214. The wafer 200 is located between the pressure plates 221 and the support plates 211, as shown in Figures 12 and 13. This embodiment, through the cooperation of the pressure plates 221 and the support plates 211, can limit the movement of the wafer 200 on both sides, top, and bottom, preventing the wafer 200 from moving during transportation.

[0117] In some specific embodiments, referring to Figures 14 and 15, the mounting plate 11 has two mounting slots 111, each mounting slot 111 mounting a support plate 211. A first mating component is provided in the mounting slot 111, and a second mating component 212 is provided at the bottom of the support plate 211. Specifically, the bottom surface of the mounting slot 111 is provided with a mounting hole 112 for mounting the first mating component.

[0118] In some specific embodiments, the first mating component is a magnet, and the second mating component 212 is a magnetic plate. The magnet is installed in the mounting hole 112 of the mounting groove 111. When the support plate 211 is installed into the corresponding mounting groove 111, the magnetic plate attracts the corresponding magnet, thereby installing the support plate 211 into the mounting groove 111. In a preferred embodiment, there are multiple first mating components and multiple second mating components 212, and each second mating component 212 is equipped with at least one first mating component. The first mating components are evenly distributed in the mounting groove 111 to improve the stability of the support plate 211 installation. In another preferred embodiment, at least one guide post is provided in the mounting groove 111, and at least one guide hole is provided on the support plate 211. The installation is guided by the cooperation of the guide post and the guide hole, which facilitates the quick installation of the support plate 211. Here, the pressure plate 221 is installed on the top of the mounting plate 11 by bolts to form a gap with the support plate 211.

[0119] In some specific embodiments, the pressure plate 221 is semi-arc-shaped, and the two pressure plates 221 together form a ring, as shown in Figure 13.

[0120] When the limit assembly needs to be replaced, first unscrew the bolts on the two pressure plates 221 and remove the pressure plates 221 from the mounting plate 11. Since the support plate 211 and the mounting plate 11 are connected by magnetic attraction, after removing the pressure plate 221, the two support plates 211 can be removed directly. Then, install the replacement support plate 211, and then install the replacement pressure plate 221. This embodiment uses a magnetic connection between the support plate 211 and the mounting plate 11, which can improve the replacement efficiency of the limit assembly.

[0121] In some specific embodiments, the chip loading device 100 further includes a robotic arm 401, which is slidably mounted on the mounting platform 301. The robotic arm 401 is configured to grip the steel ring 210 of the wafer 200 from the feed frame and slide in a controlled manner to drive the wafer 200 from the side of the limiting component to between the support plate 211 and the pressure plate 221 of the mounting plate 11. In other words, this embodiment can achieve the limiting of the wafer 200 while loading the wafer 200, without the need for other arrangements, simplifying the wafer 200 loading process and improving testing efficiency.

[0122] In some specific embodiments, the first preset distance is greater than the width of the robot arm 401, so that after the robot arm 401 grasps the steel ring 210 of the wafer 200, it moves between the two pressure plates 221, thereby driving the wafer 200 to move horizontally between the pressure plate 221 and the support plate 211, as shown in Figure 13. When the robot arm 401 pulls the steel ring 210 from the side of the limiting component to the limiting component, the steel ring 210 moves along the support surface 214 and the abutment surface 213 of the support plate 211 until it moves to the center position of the limiting component.

[0123] Figure 15 is a schematic structural diagram of a support assembly 101 according to an embodiment of the present invention. As shown in Figure 15, in some specific embodiments, the support assembly 101 further includes a first support platform 12, a second support platform 13, a crossed roller bearing 14, a synchronous pulley 15, a synchronous belt 16, and a drive member 17. A mounting plate 11 is rotatably connected to the first support platform 12. The second support platform 13 is located below the first support platform 12. The crossed roller bearing 14 is mounted on the second support platform. The synchronous pulley 15 is connected to the crossed roller bearing 14 and is connected to the mounting plate 11 via at least one guide shaft 18. The synchronous belt 16 is sleeved on a synchronous gear. The drive member 17 is connected to the synchronous belt 16 and is configured to drive the synchronous belt 16 to rotate the synchronous pulley 15, thereby rotating the mounting plate 11 relative to the first support platform 12 via the guide shaft 18, thereby adjusting the position of the wafer 200. This embodiment, through the aforementioned components, can meet the feeding requirements of wafer 200, which may need to rotate 90° or 180° for rotation. The position of wafer 200 can also be adjusted when it enters the chip loading equipment 100, making it more intelligent and capable of meeting more testing needs of the wafer. Here, the aforementioned components can drive wafer 200 to rotate 360°.

[0124] In some specific embodiments, there are multiple guide shafts 18, which can be arranged circumferentially along the mounting plate 11 to ensure the stability of the mounting plate 11 during rotation.

[0125] In this embodiment, the mounting plate 11 is circular, and an annular groove 113 is provided on its periphery. The bearing assembly 101 also includes a plurality of follower wheels 122, which are mounted on the first bearing platform 12 and located within the annular groove 113 to follow the rotation of the mounting plate 11. Here, a plurality of mounting members 121 are mounted on the first bearing platform 12, and each mounting member 121 is used to mount one follower wheel 122, as shown in Figures 13 and 15. In some specific embodiments, the number of follower wheels 122 is four, and the four follower wheels 122 are evenly arranged on the periphery of the mounting plate 11.

[0126] Figure 16 is a schematic connection block diagram of a chip testing system 1000 according to an embodiment of the present invention. As shown in Figure 16, this embodiment also provides a chip testing system 1000, which includes a chip loading device 100, a chip testing device 300, and a chip unloading device 400 according to any of the above embodiments. The chip loading device 100 will not be described in detail here. The chip testing device 300 is disposed on one side of the chip loading device 100, and is used to receive the chip under test transported by the chip loading device 100 and perform performance testing on the chip under test. The chip unloading device 400 is disposed on the side of the chip testing device 300 away from the chip loading device 100, and is used to receive the chip under test transported by the chip testing device 300 and unload it. In some embodiments, the chip testing device 300 can be used to receive the chip under test transported on the cantilever 31 of the chip loading device 100. In other embodiments, the chip testing device 200 can be used to receive the chip under test carried by the conveying mechanism of the chip loading device 100.

[0127] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A chip loading device, comprising: Installation platform; A delivery assembly, mounted on the mounting platform, is used to deliver the chip under test; An adsorption component, mounted on the mounting platform, is used to adsorb the chip under test on the delivery component; The loading assembly includes a cantilever having a first position for receiving the chip under test adsorbed by the adsorption assembly and a second position for placing the chip under test on a chip testing device. The cantilever is configured to rotate in a controlled manner to switch between the first and second positions, thereby transporting the chip under test adsorbed by the adsorption assembly to the chip testing device.

2. The chip loading device according to claim 1, wherein, The cantilever has an internal air channel for adsorbing the chip under test. The air channel is connected to a vacuum pumping device so that the chip under test can be adsorbed through the air channel when the vacuum pumping device draws a vacuum.

3. The chip loading device according to claim 2, wherein, The feeding assembly also includes: A drive unit is connected to the cantilever, and the drive unit is configured to controllably drive the cantilever to rotate along a first plane, the first plane being perpendicular to the horizontal plane.

4. The chip loading device according to claim 3, wherein, The chip under test has a first surface; During the process of switching the cantilever from the first position to the second position, the first surface of the chip under test is switched from facing upwards to facing downwards.

5. The chip loading device according to any one of claims 1-4, further comprising: A first sliding component is disposed on top of the conveying component and connected to the adsorption component, for driving the adsorption component to move so that the adsorption component adsorbs the chip under test and transports the chip under test to the cantilever.

6. The chip loading device according to any one of claims 1-4, wherein, The conveying assembly includes: A pair of slide rails are mounted on the mounting platform and extend in a horizontal direction; A support platform for carrying a wafer, with its two ends slidably connected to corresponding slide rails and configured to slide under the drive of the pair of slide rails to transport the wafer to a third position, the third position being located at the bottom of the adsorption assembly, and the wafer including at least one of the chips under test.

7. The chip loading device according to claim 6 further includes: A stripping assembly is mounted on the mounting platform and is configured to detach the chip under test from the blue film on the wafer when the carrier slides to its top following the pair of slide rails.

8. The chip loading device according to claim 7, wherein, The demulsification assembly includes: A pin cap having at least one through hole at the top, the pin cap being configured to move in a controlled manner along a vertical direction; At least one pin is located inside the pin cap, each pin corresponding to a through hole. The pin is configured to pass through the corresponding through hole of the pin cap when the pin cap moves downward, so as to lift the chip under test and thereby detach the chip under test from the blue film.

9. The chip loading device according to claim 6, further comprising: A heating component is disposed at the bottom of the mounting stage. The heating component is configured to heat the bottom of the wafer on the mounting stage when the carrier stage slides to the fourth position following the pair of slide rails, so that the chip under test is detached from the blue film of the wafer.

10. The chip loading device according to claim 6, wherein, The support platform includes: Mounting plate; A limiting component, detachably mounted on the mounting plate, is used to limit the position of the wafer.

11. The chip loading device according to claim 10, further comprising: A robotic arm is slidably mounted on the mounting platform. The robotic arm is configured to grasp the wafer in the wafer loading device and slide in a controlled manner to transport the wafer to the limiting component.

12. A chip loading device, comprising a mounting platform and a conveying mechanism slidably mounted on the mounting platform, the conveying mechanism comprising: The support component includes a mounting plate, wherein at least one first mating member is provided on the mounting plate; A limiting assembly includes a base plate and a top plate detachably mounted on the mounting plate, wherein a limiting space for limiting the wafer is defined between the base plate and the top plate, and at least one second mating member is provided at the bottom of the base plate so that the base plate can be detachably mounted on the mounting plate by the engagement of the second mating member with the first mating member.

13. The chip loading device according to claim 12, wherein, The base plate includes two support plates arranged at a distance from each other. Each support plate has a support surface arranged in a horizontal direction and an abutment surface arranged in a vertical direction. The support surfaces of the two support plates jointly support the steel ring of the wafer, and the two abutment surfaces respectively abut against two opposite sides of the steel ring, thereby limiting the position of the steel ring.

14. The chip loading device according to claim 13, wherein, The top plate includes two pressure plates arranged at a first preset distance. Each pressure plate is installed on top of a support plate and is spaced at a second preset distance from the corresponding support surface. The wafer is located between the pressure plate and the support plate.

15. The chip loading device according to claim 13, wherein, The mounting plate has two mounting slots, each mounting slot is used to mount a support plate, the mounting slot is provided with the first mating component, and the bottom of the support plate is provided with the second mating component.

16. The chip loading device according to claim 12, wherein, The first mating component is a magnet, and the second mating component is a magnetic plate.

17. The chip loading device according to claim 14, further comprising: A robotic arm is slidably mounted on the mounting platform. The robotic arm is configured to grab the steel ring of the wafer from the material frame and slide in a controlled manner to drive the wafer to slide from the side of the limiting component between the support plate and the pressure plate of the mounting plate.

18. The chip loading device according to claim 17, wherein, The first preset distance is greater than the width of the robotic arm, so that after the robotic arm grasps the steel ring of the wafer, it moves between the two pressure plates, thereby driving the wafer to move horizontally to the pressure plates and the support. Between the boards.

19. The chip loading device according to any one of claims 12-18, wherein, The carrier component also includes: A first support platform, wherein the mounting plate is rotatably connected to the first support platform; The second support platform is located below the first support platform; A crossed roller bearing is mounted on the second bearing platform; A timing pulley is connected to the crossed roller bearing and to the mounting plate via at least one guide shaft; A timing belt is fitted onto the timing gear; A driving component is connected to the timing belt. The driving component is configured to drive the timing belt to rotate the timing pulley, thereby driving the mounting plate to rotate relative to the first support platform via the guide shaft, thereby adjusting the position of the wafer.

20. The chip loading device according to claim 19, wherein, The mounting plate has an annular groove on its periphery, and the supporting assembly further includes: Multiple follower wheels are mounted on the first support platform and located within the annular groove to follow the rotation of the mounting plate.

21. A chip testing system, comprising: The chip loading device as described in any one of claims 1-20; A chip testing device is disposed on one side of the chip loading device. The chip testing device is used to receive the chip under test transported by the chip loading device and to perform performance testing on the chip under test. A chip unloading device is located on the side of the chip testing device away from the chip loading device, and is used to receive the chip under test transported by the chip testing device and unload it.

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