High-reliability intelligent pressure sensor

Abstract

A high-reliability intelligent pressure sensor, comprising an intelligent sensor body (10), the intelligent sensor body (10) comprising a pressurizing port (11), a metal strain area (12) arranged on the side surface of the pressurizing port (11), a full-bridge pressure sensing chip (13), a conditioning chip circuit part PCB (112), a PCB support (15) and a metal housing (17). The side surface of the pressurizing port (11) is provided with the metal strain area (12), the interior of the pressurizing port (11) is a single-sided closed hollow configuration, the pressurizing port (11) is internally provided with a hole-shaped structure (14), and using a quasi-recessed contour bending structure (142) can create more deformation areas in the metal strain area (12).

Description

A highly reliable smart pressure sensor Technical Field

[0001] This invention relates to the field of sensor technology, and more specifically, to a highly reliable intelligent pressure sensor. Background Technology

[0002] This pressure sensor can be used in the Electronic Stability Control (ESC) or OneBox systems of autonomous vehicles. It monitors brake fluid pressure signals from the brake control unit and pressure signals from hydraulic brake-by-wire systems. The pressure sensor is electrically connected to the ECU to provide the brake fluid pressure measurement signal to the system controller. It is also used in automotive air suspension systems, CO2 air conditioning compressor systems, or other pressure measurement applications. Technical issues

[0003] In existing ESC or OneBox pressure sensor technologies, the effective area inside the sensor that can be used to detect pressure or deformation is small, which limits the sensor's sensitivity and measurement range. It also cannot be compatible with different types of sensing cores, resulting in low adaptability. In addition, most current probes are fixed to the PCB board by welding on both sides, which requires welding on both sides and top of the PCB board. This may require flipping the PCB board multiple times, which not only increases assembly time but also increases the possibility of errors in the production process and reduces production efficiency.

[0004] How to invent a highly reliable intelligent pressure sensor to improve these problems has become an urgent issue for those skilled in the art. Technical solutions

[0005] To overcome the above deficiencies, the present invention provides a highly reliable intelligent pressure sensor, which aims to improve the problems mentioned in the background.

[0006] This invention is implemented as follows:

[0007] This invention provides a high-reliability intelligent pressure sensor, comprising an intelligent sensor body, which includes a pressure port, a metal strain region disposed on the pressure port, a full-bridge pressure sensing chip, a conditioning chip circuit PCB, a PCB support, and a metal housing. The conditioning chip circuit PCB is soldered and fixed to the PCB support. A plastic spring support is disposed on the inner side of the top of the PCB support, and a spring is installed inside the plastic spring support. The bottom end of the spring is provided with a bent leg, and the spring is soldered to the conditioning chip circuit PCB through the bent leg. The bottom end of the PCB support is fixedly connected to the pressure port. A metal strain region is disposed on the side of the pressure port. The interior of the pressure port is a single-sided closed hollow structure with a perforated structure.

[0008] Preferably, the pressure port is integrally machined, and the hole structure is a single cylindrical hole or a U-shaped contour curved structure, wherein the U-shaped contour curved structure is symmetrically distributed along the center line of the metal strain region of the pressure port.

[0009] Preferably, when the hole structure is a single cylindrical hole, the full-bridge pressure sensing chip can be set in one area, which is closest to the outer wall of the metal strain area of ​​the single cylindrical hole. When the hole structure is a U-shaped contour bending structure, the full-bridge pressure sensing chip can be set in four areas, which are symmetrically distributed along the centerline of the metal strain area of ​​the pressurized port.

[0010] Preferably, the full-bridge pressure sensing chip is attached to the corresponding area on the outer wall of the metal strain region.

[0011] Preferably, the conditioning chip circuit section PCB is fixedly mounted on a PCB bracket, and the full-bridge pressure sensing chip is directly connected to the signal input terminal of the conditioning chip circuit section PCB via an aluminum bonding wire.

[0012] Preferably, the number of the full-bridge pressure sensing chip is at least one, and the number of springs is at least three.

[0013] Preferably, multiple full-bridge pressure sensing chips are connected in parallel. When the hole structure is a single cylindrical hole or a concave-shaped curved structure, the chip is a full-bridge pressure sensing chip. The full-bridge pressure sensing chip is a DAF MEMS (Direction Active Force MEMS) sensor, or it can be a single full-bridge or two half-bridge micro-strain gauge (MSG), a sputtered thin film sensing chip, a thick film resistive sensing chip, etc.

[0014] Preferably, the full-bridge pressure sensing chip is fabricated based on single-crystal silicon, polycrystalline silicon, or gallium nitride material and SOI process technology, wherein SOI is silicon on an insulating substrate, and this technology introduces a buried oxide layer between the top silicon layer and the back substrate.

[0015] Preferably, the full-bridge pressure sensing chip generates and transmits corresponding SENT or other digital output signals or analog signals.

[0016] Preferably, the SENT output or other digital or analog output signal uses three springs, and the dual analog output or I²C uses four springs. Beneficial effects

[0017] The beneficial effects of this invention are:

[0018] By dividing the perforated structure into single cylindrical perforations and U-shaped contour curved structures, the sensor can be adapted to different application environments. Mounting the full-bridge pressure sensing chip on the outer wall of the metal film increases the sensing area of ​​the intelligent sensor body, thereby improving the responsiveness to fluid pressure changes and the sensitivity of measurement. The innovative U-shaped contour curved structure can create more optimal strain points in the metal film. These points are more obvious under the action of fluid pressure, thereby enhancing the sensor's ability to detect slight deformations.

[0019] Users can selectively install the sensor according to their actual needs and the specifications of the sensing chip, resulting in better compatibility. This flexibility allows the smart sensor to cope with a wider range of usage conditions and environments. Different aperture structure designs enable the sensor to be suitable for different pressure ranges and environments, such as liquid and gas pressure measurement, improving the sensor's application flexibility. The new spring bottom bend structure design allows all springs to be welded on the same side, increasing production efficiency and welding reliability. By welding the bent feet and conditioning chip circuitry PCB on the same side, the number of PCB flips can be reduced, simplifying the assembly process and accelerating production. In summary, this sensor design provides users with higher quality data and enhances the product's competitiveness in the market. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 is a schematic diagram of the overall structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention;

[0022] Figure 2 is a schematic cross-sectional structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of the exploded structure of a high-reliability smart pressure sensor provided in an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of the internal structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0025] Figure 5 is a schematic diagram of a high-reliability intelligent pressure sensor bent-leg welding structure provided by an embodiment of the present invention.

[0026] Figure 6 is a schematic diagram of the installation structure of a single full-bridge DAF MEMS pressure sensing chip of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention when the cylindrical hole structure is a single cylindrical hole.

[0027] Figure 7 is a schematic diagram of the installation structure of two full-bridge DAF MEMS pressure sensing chips of a high-reliability intelligent pressure sensor provided in an embodiment of the present invention when the cylindrical hole structure is a concave-shaped curved structure.

[0028] Figure 8 is a schematic diagram of the installation structure of a single full-bridge DAF MEMS pressure sensing chip of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention when the cylindrical hole structure is a concave-shaped curved structure.

[0029] Figure 9 is a schematic diagram of the installation structure of a high-reliability intelligent pressure sensor full-bridge micro-fusion core MSG provided by an embodiment of the present invention when the cylindrical hole structure is a concave-shaped curved structure.

[0030] Figure 10 is a schematic diagram of the installation structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention, when the cylindrical hole structure is a concave-shaped curved structure. The two half-bridge micro-fusion cores (MSG, sputtered thin film sensing core, thick film resistive sensing core, etc.) are installed in a cylindrical hole structure with a concave-shaped contour.

[0031] Figure 11 is a schematic diagram of a single cylindrical perforated cross-sectional structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0032] Figure 12 is a schematic diagram of the strain region of a single cylindrical hole structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0033] Figure 13 is a schematic diagram of the optimal strain point location structure of a single cylindrical hole-shaped high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0034] Figure 14 is a schematic diagram of the mounting structure of a single cylindrical hole-shaped full-bridge pressure sensing chip for a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0035] Figure 15 is a schematic diagram of the stress analysis of the strain region of a single cylindrical perforated metal in a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0036] Figure 16 is a schematic diagram of the elastic strain curve of the strain region of a single cylindrical hole-shaped metal strain sensor provided by an embodiment of the present invention.

[0037] Figure 17 is a schematic diagram of the directional deformation curve of the strain region of a single cylindrical perforated metal strain sensor provided by an embodiment of the present invention.

[0038] Figure 18 is a schematic cross-sectional view of a concave-shaped curved structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0039] Figure 19 is a schematic diagram of the deformation region structure of a concave contour bending design for a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0040] Figure 20 is a schematic diagram of the optimal strain point distribution of a concave contour bending structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0041] Figure 21 is a schematic diagram of the mounting structure of a single full-bridge pressure sensing chip at a concave contour curved structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0042] Figure 22 is a schematic diagram of the mounting structure of two full-bridge pressure sensing chips at the concave contour curved structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0043] Figure 23 is a schematic diagram of the mounting structure of various cores provided by the embodiments of the present invention, including a full-bridge micro-fusion core and a half-bridge micro-fusion core MSG at the concave contour bending structure of a high-reliability intelligent pressure sensor, a sputtered thin film sensing core, and a thick film resistive sensing core.

[0044] Figure 24 is a schematic diagram of the stress analysis of the metal strain region of a concave contour bending structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0045] Figure 25 is a schematic diagram of the elastic strain curve of the metal strain region at the concave contour bending structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0046] Figure 26 is a schematic diagram of the directional deformation curve of the metal strain region at the concave contour bending structure of a high-reliability intelligent pressure sensor provided by an embodiment of the present invention.

[0047] In the diagram: 10. Smart sensor body; 11. Pressure port; 12. Metal strain area; 13. Full-bridge pressure sensing chip; 14. Hole structure; 15. PCB support; 16. Spring; 17. Metal housing; 18. Plastic spring support; 111. Aluminum bonding wire; 112. Conditioning chip circuit PCB; 113. Bent leg; 131. Core for full-bridge micro-fusion; 132. Core for half-bridge micro-fusion; 141. Single cylindrical hole; 142. U-shaped curved structure. Embodiments of the present invention

[0048] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] Example 1: Referring to Figures 1-6, a high-reliability intelligent pressure sensor includes an intelligent sensor body 10. The intelligent sensor body 10 includes a pressure port 11, a metal strain region 12 disposed on the pressure port 11, a full-bridge pressure sensing chip 13, a conditioning chip circuit PCB 112, a PCB bracket 15, and a metal housing 17. The conditioning chip circuit PCB 112 is soldered and fixed to the PCB bracket 15. A plastic spring bracket 18 is disposed on the inner side of the top of the PCB bracket 15. A spring 16 is installed inside the plastic spring bracket 18. A bent leg 113 is disposed at the bottom end of the spring 16. The spring 16 passes through the bent leg 113. 13 is soldered to the conditioning chip circuit PCB112, where two bent pins 113 are used to connect the positive and negative terminals of the conditioning chip circuit PCB112, and the other bent pin 113 is used to output the signal received by the conditioning chip circuit PCB112. The inside of the pressure port 11 is a single-sided closed hollow structure. The pressure port 11 has a hole structure 14 inside. The pressure port 11 is made by one-piece stamping. The hole structure 14 is a single cylindrical hole 141 or a U-shaped contour curved structure 142. The U-shaped contour curved structure 142 is symmetrically distributed along the center line of the metal strain area 12 of the pressure port 11.

[0050] With the above-mentioned design, the new spring 16 has a bent angle 113 structure at the bottom, and all springs 16 can be welded on the same side, which increases production efficiency and welding reliability. The bent feet 113 and the conditioning chip circuit PCB 112 can be welded on the same side. Welding on the same side reduces the number of times the PCB board is flipped, simplifies the assembly process, and speeds up production. Welding on the same side reduces defects that may occur during the welding process, such as cold solder joints and poor solder joints, thereby improving the overall reliability of the product. Compared with double-sided welding, welding on the same side can provide more uniform mechanical strength to the PCB, reduce deformation or damage caused by uneven welding stress, and help optimize the heat distribution of the PCB, reduce the risk of local hot spots, and improve the working stability and lifespan of the product.

[0051] Example 2: The full-bridge pressure sensing chip 13 is directly connected to the signal input terminal of the conditioning chip circuit section PCB 112 via aluminum bonding wire 111. The aluminum bonding wire 111 can provide a low resistance and low inductance connection, which helps to maintain the integrity of signal transmission and reduce signal attenuation or interference. The direct connection design simplifies the assembly process, reduces the possibility of assembly errors, and also shortens the production time and reduces the use of additional materials, such as wires and connectors, thereby reducing the overall cost of the system.

[0052] Furthermore, the bottom end of the PCB bracket 15 is fixedly connected to the pressure port 11. A metal strain area 12 is provided on the side of the pressure port 11 for attaching the full-bridge pressure sensing chip 13. The metal strain area 12 will deform after being impacted by the oil pressure. This deformation will be transmitted to the full-bridge pressure sensing chip 13 attached to it in time. The sensitivity of the metal strain area 12 to the oil pressure allows it to respond quickly to pressure changes. This instantaneous deformation can be transmitted to the full-bridge pressure sensing chip 13 in time, so that the whole system can quickly detect pressure changes. The metal strain area 12 can provide accurate deformation because it can produce very small displacements. These displacements are proportional to the applied force. The full-bridge pressure sensing chip 13 can convert these tiny deformations into electrical signals to provide high-precision pressure readings. The deformation of the metal strain area 12 usually has a good proportional relationship, that is, the relationship between deformation and force is linear. This is beneficial for the full-bridge pressure sensing chip 13 to perform linear transformation, thereby simplifying the signal processing process and improving the predictability of measurement results.

[0053] The number of full-bridge pressure sensing chips 13 is at least one, and the number of springs 16 is at least three. Multiple full-bridge pressure sensing chips 13 are connected in parallel. Chips with a single cylindrical hole 141 or a concave-shaped curved structure 142 in the hole structure 14 are full-bridge pressure sensing chips 13. The full-bridge pressure sensing chips 13 are DAF MEMS (Direction Active Force MEMS). MEMS (Mechanical, Electrical, and Mechanisms) sensors, with parallel full-bridge units connected by electronic circuitry, can have their output signals finely processed to more accurately calculate the final pressure reading. Any pressure sensing unit is susceptible to temperature-induced errors. If two full-bridge units are identically designed, their responses to temperature changes will be identical. Therefore, when connected in parallel, any resistance changes caused by temperature occur in both units, and their effects in the circuit can cancel each other out. Ideally, the two parallel units will evenly bear the applied pressure, minimizing any errors caused by uneven pressure distribution. Furthermore, each pressure sensing unit has its own inherent slight deviation; by connecting two units in parallel, these deviations can theoretically cancel each other out. Since the errors of the two units are typically random and independent, the overall error is reduced after averaging. In summary, configuring the outputs of two full-bridge units as a differential signal improves signal quality, and measuring the voltage difference between the two units further reduces noise and interference.

[0054] It should be noted that the full-bridge pressure sensing chip 13 generates and transmits corresponding SENT (Single Edge Digital Transmission) or other digital or analog output signals. SENT output is suitable for applications requiring high signal integrity and interference immunity, while dual analog output provides the flexibility of compatibility with traditional analog interfaces, making it suitable for a wide range of control systems. This choice of output method allows for better integration of the sensor into various electronic systems. SENT or other digital or analog output signals are output using three springs 16, while dual analog output or I²C uses four springs 16. The choice of the number and type of springs 16 not only provides the possibility of different types of signal output but also means that the sensor can... The full-bridge pressure sensing chip 13 is optimized for load, vibration, and installation requirements to improve performance and reliability in various environments. It is based on single-crystal silicon, polycrystalline silicon, or gallium nitride materials and SOI process technology. SOI stands for silicon on insulating substrate. This technology introduces a buried oxide layer between the top silicon layer and the back substrate, which effectively reduces interference between electronic components and improves the reliability and performance of the sensor. By using materials such as single-crystal silicon, polycrystalline silicon, or gallium nitride, combined with SOI process, the performance of the sensor can be customized according to different application requirements, such as sensitivity, temperature range, and chemical resistance. The selection of these materials provides the sensor with the ability to work in harsh environments.

[0055] Example 3: When the hole structure 14 is a single cylindrical hole 141 (refer to Figures 11-17), the area that the full-bridge pressure sensing chip 13 can be set in when the hole structure 14 is a single cylindrical hole 141 (i.e., the optimal strain point shown in the figure) is one place (at this time, only the full-bridge pressure sensing chip 13, i.e., DAF MEMS sensor, can be selected). This area is closest to the outer wall of the metal strain region 12 of the cylindrical hole 141. In this structure, only one full-bridge pressure sensing chip 13 is needed to monitor the pressure generated inside the metal strain region 12. At this time, the deformation of the surface of the metal strain region 12 is shown in Figure 15, which diverges outward from the center of the optimal strain point. The full-bridge pressure sensing chip 13 can capture the concentrated signal, which helps to improve the accuracy and repeatability of the measurement. This design is particularly suitable for applications that need to monitor small-range or concentrated pressure. At this time, the elastic strain and directional deformation curves at the metal strain region 12 are shown in Figures 16 and 17, respectively.

[0056] Example 4: When the perforated structure 14 is a U-shaped curved structure 142 (refer to Figures 18-26), the full-bridge pressure sensing chip 13 can be set in four areas when the perforated structure 14 is a U-shaped curved structure 142. The four areas (optimal strain points) are symmetrically distributed along the centerline of the metal strain area 12 of the pressurized port 11. At these four optimal strain points, the pressure signal value monitored by the full-bridge pressure sensing chip 13, i.e., the deformation force on the metal strain area 12 (refer to Figure 15), is the same (within the allowable error range). The full-bridge pressure sensing chip 13 is attached to the metal strain area 12. In the area corresponding to the outer wall of the strain region 12, the position of the full-bridge pressure sensing chip 13 can be flexibly adjusted according to the requirements, as long as it is at one of the four optimal strain points. For situations that require switching between multiple similar applications, this design can reduce the need to redesign the sensor for each application, thereby saving costs and time. By installing the full-bridge pressure sensing chip 13 at the four key optimal strain points, the sensor system can ensure that it provides stable and reliable pressure monitoring data throughout the entire operating range, while maintaining sufficient flexibility to adapt to changing application requirements.

[0057] The full-bridge pressure sensing chip 13 is distributed around the centerline of the pressurization port 11, which can provide more detailed pressure change data. This multi-point monitoring can improve pressure resolution, which is especially important for applications that require accurate pressure mapping. The symmetrical distribution of the four regions along the centerline of the pressurization port 11 helps to balance the signal under loading conditions, which can reduce offset error and provide more accurate pressure readings. Using multiple sensing units can maintain measurement function when one unit fails, thereby improving the reliability and stability of the system.

[0058] The concave-shaped curved structure 142 generates a complex stress distribution (refer to Figures 19-20). By installing full-bridge pressure sensing chips 13 at four key areas (optimal strain points), this complex stress distribution can be better monitored and analyzed. Especially when high-precision measurement is required, the four optimal strain points provide more data points when the loading conditions are uneven or changing, which helps to analyze the stress situation of the entire pressurization port 11.

[0059] Example 5: The full-bridge pressure sensing chip 13 can also be a single full-bridge or two half-bridge micro-strain gauge (MSG), i.e., a full-bridge micro-strain gauge 131 and a half-bridge micro-strain gauge 132, a sputtered thin film sensing gauge, a thick film resistive sensing gauge, etc. When the hole structure 14 is a U-shaped contour curved structure 142, a single full-bridge pressure sensing chip 13 can be replaced with a full-bridge micro-strain gauge 131 or two half-bridge micro-strain gauges 132. The installation is shown in Figures 9-10. By selecting different numbers of full-bridge pressure sensing chips 13 and springs 16, the sensor can be customized according to specific application requirements, resulting in stronger compatibility. This flexibility allows the sensor to be applied to pressure measurement scenarios ranging from simple to complex.

[0060] In the U-shaped contour bending structure 142, for multiple full-bridge pressure sensing chips 13, the full-bridge pressure sensing chips 13 can be divided into single-sided installation or double-sided installation (with the center line of the pressure port 11 as the dividing line). A schematic diagram of the bonding position of the full-bridge pressure sensing chip 13 on the strain surface of the U-shaped contour bending structure 142 can be seen in Figure 21, and a schematic diagram of the bonding position of the double full-bridge pressure sensing chip 13 on the strain surface of the U-shaped contour bending structure 142 can be seen in Figure 22.

[0061] Micro-fusion technology half-bridge strain gauges (i.e., half-bridge micro-fusion cores 132), full-bridge strain gauges (full-bridge micro-fusion cores 131), and other sensing cores with thick-film printed resistors for constructing strain regions (sputtered thin-film sensing cores, thick-film resistive sensing cores, etc.) can also be used in this contour bending structure (see Figure 23). A single full-bridge micro-fusion core 131 can span two or three optimal strain points. The specific installation method can be adjusted according to the length of the full-bridge micro-fusion core 131. Two half-bridge micro-fusion cores 132 span two optimal strain points on both sides of the centerline of the pressure port 11, thereby forming a signal path. In summary, this sensor can be compatible with sensing chips of different specifications as needed, greatly improving the universality of the equipment.

[0062] The working principle of this high-reliability intelligent pressure sensor is as follows: First, the intelligent sensor body 10 is installed in the working area. When external vibration or shaking occurs, the oil will enter the interior of the porous structure 14 through the pressurization port 11. At this time, the liquid will impact the metal strain area 12, which will cause the metal strain area 12 to deform. This deformation will be transmitted to the full-bridge pressure sensing chip 13 installed at the optimal strain point. The full-bridge pressure sensing chip 13 will transmit the signal to the conditioning chip circuit PCB 112 through the aluminum bonding wire 111. Finally, the pressure signal is output through the bent pin 113 and the spring 16 to achieve accurate pressure measurement. The spring 16 is soldered to the conditioning chip circuit PCB 112 through the bent pin 113. Two bent pins 113 are used to connect the positive and negative terminals of the conditioning chip circuit PCB 112 to provide power. The other bent pin 113 is used to output the signal received by the conditioning chip circuit PCB 112.

[0063] With the new spring having a bent-corner structure at the bottom, all springs can be welded on the same side, increasing production efficiency and welding reliability. With the setting of spring 16 and plastic spring bracket, the bent foot 113 and the conditioning chip circuit PCB 112 can be welded on the same side, which can reduce the number of times the PCB board is flipped, simplify the assembly process, and thus speed up production.

[0064] By dividing the aperture structure 14 into a single cylindrical aperture 141 and a U-shaped contour bending structure 142, the sensor can be adapted to different application environments. Mounting the full-bridge pressure sensing chip 13 on the outer wall of the metal strain region 12 increases the sensing area of ​​the intelligent sensor body 10, thereby improving the responsiveness to pressure changes and measurement sensitivity. The innovative U-shaped contour bending structure 142 creates more optimal strain points in the metal strain region 12, which are more pronounced under pressure, thus enhancing the intelligent sensor body 10's ability to detect slight deformations. Users can selectively install the sensor according to actual needs and the specifications of the sensing chip, resulting in better compatibility. This flexibility allows the intelligent sensor body 10 to cope with a wider range of usage conditions and environments. Different aperture structure designs 14 allow the sensor to be adapted to different pressure ranges and environments, such as liquid and gas pressure measurements, improving the sensor's application flexibility. In summary, this sensor design can provide users with higher quality data and enhance the product's competitiveness in the market.

[0065] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0066] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A high-reliability intelligent pressure sensor, comprising an intelligent sensor body (10), characterized in that, The intelligent sensor body (10) includes a pressure port (11), a metal strain area (12) provided on the pressure port (11), a full-bridge pressure sensing chip (13), a conditioning chip circuit PCB (112), a PCB bracket (15), and a metal shell (17). The conditioning chip circuit PCB (112) is soldered and fixed to the PCB bracket (15). A plastic spring bracket (18) is provided on the inner side of the top of the PCB bracket (15). The inner side of the plastic spring bracket (18) A spring (16) is installed in the part, and a bent foot (113) is provided at the bottom end of the spring (16). The spring (16) is soldered to the conditioning chip circuit part PCB (112) through the bent foot (113). The bottom end of the PCB bracket (15) is fixedly connected to the pressure port (11). A metal strain area (12) is provided on the side of the pressure port (11). The inside of the pressure port (11) is a single-sided closed hollow structure. A hole structure (14) is provided inside the pressure port (11).

2. The high-reliability intelligent pressure sensor according to claim 1, characterized in that, The pressurized port (11) is machined as a single piece. The hole structure (14) is a single cylindrical hole (141) (see Figure 12) or a U-shaped contour curved structure (142) (see Figure 19). The U-shaped contour curved structure is symmetrically distributed along the center line of the metal strain region (12) of the pressurized port (11).

3. A high-reliability intelligent pressure sensor according to claim 2, characterized in that, When the hole structure (14) is a single cylindrical hole (141), the full-bridge pressure sensing chip (13) can be set in one area, which is closest to the outer wall of the metal strain region (12) of the single cylindrical hole (141). When the hole structure (14) is a U-shaped contour bending structure (142), the full-bridge pressure sensing chip (13) can be set in four areas, which are symmetrically distributed along the centerline of the metal strain region (12) of the pressurization port (11).

4. A high-reliability intelligent pressure sensor according to claim 3, characterized in that, The full-bridge pressure sensing chip (13) is attached to the corresponding area on the outer wall of the metal strain region (12).

5. A high-reliability intelligent pressure sensor according to claim 1, characterized in that, The full-bridge pressure sensing chip (13) is directly connected to the signal input terminal of the conditioning chip circuit section PCB (112) via an aluminum bonding wire (111).

6. A high-reliability intelligent pressure sensor according to claim 1, characterized in that, The number of the full-bridge pressure sensing chip (13) is at least one, and the number of springs (16) is at least three.

7. A high-reliability intelligent pressure sensor according to claim 1, characterized in that, Multiple full-bridge pressure sensing chips (13) are connected in parallel. When the hole structure (14) is a single cylindrical hole (141) or a concave contour curved structure (142), the chip is a full-bridge pressure sensing chip (13). The full-bridge pressure sensing chip (13) is a DAF MEMS (Direction Active Force MEMS) sensor, or it can be a single full-bridge or two half-bridge micro-strain gauge (MSG), a sputtered thin film sensing core, a thick film resistive sensing core, etc.

8. A high-reliability intelligent pressure sensor according to claim 1, characterized in that, The full-bridge pressure sensing chip (13) is fabricated based on single-crystal silicon, polycrystalline silicon or gallium nitride material and SOI process technology. SOI is silicon on an insulating substrate, with a buried oxide layer introduced between the top silicon and the back substrate.

9. A high-reliability intelligent pressure sensor according to claim 1, characterized in that, The full-bridge pressure sensing chip (13) generates and transmits corresponding SENT or other digital output signals or analog signals.

10. A high-reliability intelligent pressure sensor according to claim 1, characterized in that, SENT output or other digital or analog output signals are provided with three springs (16), while dual analog outputs or I²C outputs are provided with four springs (16).

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