Refrigerant circuit, support plate, and vehicle

Abstract

The invention relates to a refrigerant circuit (100) comprising: a compressor (150) for compressing a refrigerant, in particular a gaseous refrigerant, which in particular contains propane, from a suction-side low-pressure level to a pressure-side high-pressure level; at least two heat exchangers (110, 120, 130), of which a first heat exchanger (110) and a second heat exchanger (120) are designed to transfer heat between the refrigerant and a temperature-control medium, in particular a liquid temperature-control medium; and at least one expansion valve (122, 132, 142) for expanding refrigerant compressed by the compressor (150), wherein at least one of the at least two heat exchangers (110, 120, 130) is supported by a carrier plate (180), and wherein at least one refrigerant channel (182) extends within the carrier plate (180) and is designed to direct refrigerant to or from at least one of the at least two heat exchangers (110, 120, 130) and / or to or from at least one of the at least one expansion valves (122, 132, 142). The invention also relates to a carrier plate (180) for such a refrigerant circuit (100) and to a vehicle comprising such a refrigerant circuit (100).

Description

[0001] Description

[0002] title

[0003] Refrigerant circuit, carrier plate and vehicle

[0004] The present invention relates to a refrigerant circuit and a vehicle with such a refrigerant circuit.

[0005] Background of the invention

[0006] Typical refrigerant circuits comprise, in addition to a compressor for compressing a suitable refrigerant, a first heat exchanger (e.g., air-cooled and / or liquid-cooled) for dissipating the heat of compression and for at least partially condensing the compressed refrigerant, and a second heat exchanger for heating and re-evaporating the refrigerant before it is returned to the compressor. An expansion valve is typically located between the first and second heat exchangers to expand the compressed (and possibly partially condensed) refrigerant. Depending on the specific application, such a refrigerant circuit can be used as a heat source and / or a heat sink. Useful heat can be extracted from the first heat exchanger and / or waste heat can be supplied to the second heat exchanger (or "useful cooling" can be extracted).The various components (first heat exchanger, expansion valve, second heat exchanger, compressor) can be fluidically connected to each other via pipes.

[0007] The first and / or second heat exchanger can be mounted separately from the compressor and connected to the compressor by means of pipes or hoses. Disclosure of the invention

[0008] According to the invention, a refrigerant circuit, a carrier plate for such a refrigerant circuit, and a vehicle with the features of the independent claims are proposed. Advantageous embodiments are the subject of the dependent claims and the following description.

[0009] The refrigerant circuit according to the invention comprises a compressor for compressing a refrigerant, in particular gaseous, which in particular contains propane (R290), from a suction-side low-pressure level to a discharge-side high-pressure level, at least two heat exchangers, of which a first heat exchanger and a second heat exchanger are configured for transferring heat between the refrigerant and a, in particular liquid, temperature control medium, and at least one expansion valve for expanding the refrigerant compressed by the compressor. At least one of the at least two heat exchangers is supported by a carrier plate, wherein at least one refrigerant channel extends within the carrier plate, which is configured to convey refrigerant to or from at least one of the at least two heat exchangers and / or to or from at least one of the at least one expansion valve.

[0010] According to at least one embodiment, the at least two heat exchangers comprise a third heat exchanger for transferring heat between the expanded and compressed refrigerant, wherein the at least one expansion valve comprises a first expansion valve and a second expansion valve. In these embodiments, the second heat exchanger is arranged downstream of the first expansion valve, while the third heat exchanger is arranged upstream of the first expansion valve on the warm side and upstream of the compressor on the cold side. The second expansion valve is configured for the expansion of at least partially condensed refrigerant and is arranged downstream of the first heat exchanger on the warm side and upstream of the third heat exchanger on the cold side.This means the refrigerant circuit is designed to use a portion of the condensed refrigerant to subcool another portion of the refrigerant and return it to the compressor. This process, also known as vapor injection, increases the compressor's efficiency and extends its thermal operating range, typically allowing the compressor to operate continuously for longer periods. This has a positive impact on the compressor's service life and the controllability of the refrigerant circuit.

[0011] In at least one embodiment, the compressor has a first inlet port on the suction side for expanded refrigerant flowing out of at least one second heat exchanger on the cold side, and a second inlet port, separate from the first inlet port, for expanded refrigerant exiting the third heat exchanger on the cold side. This allows the vapor injection to be controlled essentially independently of the rest of the refrigerant circuit operation. In particular, the second inlet port is arranged between the first inlet port and a pressure-side outlet port of the compressor and is configured to feed the refrigerant exiting the third heat exchanger into the compressor at an intermediate pressure level between the low-pressure and high-pressure levels.In other words, in this configuration, the refrigerant expanded via the second expansion valve is less expanded than the refrigerant expanded via the first expansion valve. This is advantageous in terms of the overall efficiency of the refrigerant circuit and offers additional design flexibility.

[0012] Within the scope of this invention, the term "cold-side" refers to a subsystem of a heat exchanger within which a medium is guided that absorbs heat in the heat exchanger. Conversely, a medium that releases heat in the heat exchanger is guided on the "hot-side" with respect to the heat exchanger.

[0013] According to at least one embodiment, the at least one expansion valve comprises a third expansion valve, which has a direct fluid connection to a pressure-side outlet port of the compressor and is configured to expand the refrigerant compressed by the compressor. A valve outlet of the third expansion valve has a direct fluid connection to a suction-side outlet of the second heat exchanger and / or a suction-side inlet port of the compressor. This allows the refrigerant circuit to return a portion of the compressed refrigerant directly to the compressor, bypassing the first and second heat exchangers.

[0014] This method, also known as hot gas bypass (HGB), increases system efficiency in the hot gas cycle of the refrigerant circuit. This ensures the heating capacity of the refrigerant circuit even under low ambient conditions. The compressor is subjected to a higher load due to the hydraulic short circuit of the hot gas bypass, with the aim of converting electrical energy into heat. This eliminates the need for a separate heating element, such as a high-voltage heater, in the refrigerant circuit.

[0015] During hot gas bypass operation, refrigerant exiting the compressor's pressure-side outlet at high pressure is expanded by means of an additional expansion valve. This reduces the pressure and consequently the temperature of the refrigerant. However, downstream of the additional expansion valve, the refrigerant remains in a gaseous state. This expanded refrigerant has a higher temperature than the refrigerant flowing from the second heat exchanger (evaporator) towards the compressor's suction-side inlet at lower temperatures (e.g., -20°C).

[0016] Since no warm coolant is available when a cold vehicle is started, and therefore insufficient energy transfer to the refrigerant cannot yet occur, the refrigerant is typically not completely evaporated before entering the compressor. This would result in a certain percentage of liquid refrigerant entering the compressor, potentially damaging it. The refrigerant entering from the heat exchanger (HGB) at a higher temperature warms the refrigerant coming from the second heat exchanger (evaporator), which is not yet completely evaporated, thus converting it entirely into the gaseous phase.

[0017] Once sufficient energy is available in the coolant circuit (e.g., after a certain operating time of the vehicle) due to the vehicle having heated up in the meantime, the HGB branch can be closed by the additional expansion valve.

[0018] According to at least one embodiment, the refrigerant circuit comprises a first refrigerant distributor for receiving and forwarding refrigerant compressed by the compressor and at least partially condensed by the first heat exchanger, and a second refrigerant distributor for receiving and forwarding refrigerant that has been forwarded by the first refrigerant distributor and is at least partially condensed. The first and second refrigerant distributors are provided as separate components. This offers advantages for the manufacture and assembly of the refrigerant distributors and the directly connected components, since if the first and second refrigerant distributors were integrated, a large number of connections would have to fit together precisely, potentially resulting in high dimensional accuracy requirements. Separate provision allows for more generous tolerances.A fluid-conducting connection exists between the first and second refrigerant distributors, with this connection being formed at least partially by the at least one refrigerant channel running within the support plate. This represents a particularly space-saving solution and contributes very little to the overall volume of the refrigerant circuit. Thus, the internal volume of the refrigerant circuit can be kept small, which is particularly advantageous for safety reasons when using flammable refrigerants.

[0019] In particular, the first refrigerant distributor and / or the second refrigerant distributor have a receptacle, especially a valve seat, and a valve outlet for at least one expansion valve. This allows for even greater integration and thus a reduction in the number of sealing points, with corresponding advantages in terms of leak tightness and the overall volume of the refrigerant circuit.

[0020] In at least one embodiment, the support plate is bonded to the at least one heat exchanger it supports and / or, if present, to the first and / or second refrigerant distributors. This eliminates the need for corresponding seals, which would otherwise typically be provided in the form of elastomer elements and thus be susceptible to embrittlement and leakage. Therefore, such designs also offer an advantage with regard to the tightness and service life of the refrigerant circuit.

[0021] According to at least one embodiment, the carrier plate supports all heat exchangers and / or all refrigerant distributors used in the refrigerant circuit. This allows essentially all components required for the refrigerant circuit, besides the compressor, to be provided as a single unit, offering advantages in terms of assembly and the overall system's leak tightness.

[0022] According to at least one embodiment, the refrigerant circuit downstream of the first heat exchanger includes a refrigerant storage tank for at least partially condensed refrigerant. The support plate carries at least the first heat exchanger, and a subcooling channel runs within the support plate. This channel is arranged downstream of the refrigerant storage tank and upstream of the at least one expansion valve (in particular, upstream of the first expansion valve) and is configured to subcool the condensed refrigerant from the storage tank against the temperature control medium flowing through the first heat exchanger. This allows the at least one expansion valve to be supplied with colder refrigerant compared to other embodiments, thereby increasing the achievable cooling capacity. Consequently, the same cooling capacity can be achieved with a lower refrigerant mass flow rate as without such a subcooling channel.In other words, this measure increases the overall efficiency of the refrigerant circuit. A carrier plate according to the invention for a refrigerant circuit according to the invention has a base layer, a cover layer, and a conduction layer arranged between the base layer and the cover layer, wherein the at least one refrigerant channel is formed as a recess in the conduction layer. The cover layer and / or the base layer have at least one bore that opens into the at least one refrigerant channel of the conduction layer, wherein the base layer and the cover layer are each materially bonded to the conduction layer. For example, the cover layer and / or the base layer and / or the conduction layer can each be provided in the form of a sheet, a stamped part, or a plate. Each of the layers can also be formed by several such sheets or plates. The materially bonded connection between the layers on the one hand and, if applicable,The joining of the sheets or plates within a layer can be achieved in particular by soldering (e.g., soft soldering, hard soldering, vacuum brazing, etc.), welding (e.g., friction stir welding or another welding process), or by another material joining process. The carrier plate is thus, in particular, designed as a laminate. The carrier plate enables the realization of the refrigerant circuit according to the invention using simple means. According to at least one embodiment, the refrigerant circuit comprises a carrier plate according to the invention.

[0023] According to at least one embodiment, the support plate is configured to support at least the first heat exchanger and includes a subcooling channel configured to subcool condensed refrigerant against temperature control medium flowing through the first heat exchanger, wherein the subcooling channel is designed as a recess in the conductor layer and can be connected to a refrigerant storage tank and the at least one expansion valve by means of at least one refrigerant channel and / or at least one bore.

[0024] The vehicle according to the invention comprises a refrigerant circuit according to the invention and at least one component to be temperature-controlled, e.g., a cabin and / or a battery, which is thermally connected to the at least one first and / or second heat exchanger. The vehicle thus benefits from the advantages of the refrigerant circuit according to the invention in a corresponding manner.

[0025] Further advantages and embodiments of the invention will become apparent from the description and the accompanying drawing.

[0026] The invention is schematically illustrated in the drawing using an exemplary embodiment and is described below with reference to the drawing.

[0027] Brief description of the drawings

[0028] Figure 1A schematically shows a refrigerant circuit according to a first embodiment of the invention in perspective view.

[0029] Figure 1B schematically shows the refrigerant cycle depicted in Figure 1A in exploded view.

[0030] Figures 2 and 3 each show a part of the refrigerant circuit depicted in Figures 1A and 1B using further exploded views.

[0031] Figures 4, 5 and 6 each show schematic sectional views through a part of the refrigerant circuit shown in Figures 1A and 1B.

[0032] Figure 7 schematically shows a carrier plate according to one embodiment of the invention.

[0033] Figure 8 schematically shows a second embodiment of a part of a refrigerant circuit according to the invention.

[0034] Figure 9 schematically shows a section of the refrigerant circuit depicted in Figure 8. Figure 10 schematically shows a support plate as it can be used in the configuration of the refrigerant circuit shown in Figures 8 and 9.

[0035] embodiment(s) of the invention

[0036] Figure 1A schematically shows a refrigerant circuit according to one embodiment of the invention in a perspective view and is designated as 100. Figure 1B shows an exploded view of the refrigerant circuit 100 shown in Figure 1A. Figures 2 and 3 each show a portion of the refrigerant circuit shown in Figures 1A and 1B by means of further exploded views, while Figures 4, 5, and 6 each show sectional views through a portion of the refrigerant circuit 100. Finally, Figure 7 schematically shows a support plate, such as can be used in embodiments of refrigerant circuits according to the invention, in a top view and is designated as 180. The support plate 180 is also part of the refrigerant circuit 100 shown in Figures 1A, 1B, and 2 to 6. Figures 1 to 7 are described together below.

[0037] The refrigerant circuit 100 has a compressor 150 which is configured to compress a refrigerant, in particular one containing or consisting of propane (R290), from a suction-side low-pressure level, which may be selected, for example, from an interval between 120 kPa and 1,000 kPa, to a discharge-side high-pressure level, which may be selected, for example, from an interval between 1,400 and 3,600 kPa.

[0038] The refrigerant circuit 100 has a first heat exchanger 110 downstream of the compressor 150, in which the refrigerant compressed by the compressor 150 is cooled against a temperature control medium, in particular a liquid, e.g., water and / or a thermal oil, and thereby at least partially condensed. Downstream of the heat exchanger 110, the refrigerant is received and routed through a first refrigerant distributor 124. In the example shown, the first refrigerant distributor 124 includes a refrigerant storage tank 300 for storing the condensed refrigerant and a valve seat for a first expansion valve 122.

[0039] The refrigerant storage tank 300 also contains a dryer and / or filter 320 for removing impurities and / or water or moisture from the refrigerant. In the example shown here, the first refrigerant distributor also has a connection for a filling valve 162, by means of which the refrigerant circuit 100 can be filled with refrigerant. If necessary, the refrigerant can also be replaced via this filling valve 162.

[0040] The condensed refrigerant is expanded into a second heat exchanger 120 via the first expansion valve 122. In the second heat exchanger 120, the expanded refrigerant is heated against a (further), in particular liquid, temperature control medium, for example water or thermal oil, and thereby at least partially evaporates. A first sensor 145, for example a temperature and / or pressure sensor, is provided at an outlet 126 of the second heat exchanger 120 to monitor its operation. Downstream of the outlet 126 of the second heat exchanger 120, the refrigerant is returned to the compressor 150 (into a first inlet port 152), in particular via the first refrigerant distributor 124.

[0041] The first refrigerant distributor 124 has an outlet connection by means of which the first expansion valve 122 and the second heat exchanger 120 can be bypassed, and which is fluid-conductingly connected to a second refrigerant distributor 134. In the example shown here, the fluid lines connecting the first refrigerant distributor 124 to the second refrigerant distributor 124 are formed by the channels 182, which run within a support plate 180 that supports the second heat exchanger 120. In the example shown, the support plate 180 supports the first refrigerant distributor 124 as well as the second refrigerant distributor 134. In a different configuration than shown here, it is also possible for the support plate 180 to also support the first heat exchanger 110. In the example shown here, the carrier plate 180 has a base layer 181, a cover layer 185 and a conductor layer 183.In particular, each of the layers 181, 183, 185 can be formed by one or more sheets and / or stamped parts that are bonded together. In the example shown, the conduction layer 183 has several recesses that form the refrigerant channels 182. For example, these recesses can be formed in the material of the conduction layer 183 by stamping and / or machining processes. In the example shown, the base layer 181 has four bores 184, each of which opens into one of the refrigerant channels 182 and thus each forms a connection of the refrigerant channel 182. The cover layer 185 also has such a bore 186, which opens into one of the refrigerant channels 182.In the example shown, the bores 184 in the base layer 181 serve to connect the first refrigerant distributor 124 and third heat exchanger 130 to the refrigerant channels 182, while the bore 186 in the top layer 185 forms the connection of the second refrigerant distributor 134 to the refrigerant channel 182, and thus indirectly to the first refrigerant distributor 124.

[0042] The second refrigerant distributor 134 is designed to receive condensed refrigerant from the first refrigerant distributor 124 and, via a second expansion valve 132 (whose valve seat is integrated into the second refrigerant distributor 134 in the example shown), to a third heat exchanger 130, which in the example shown is also supported by the carrier plate 180. In this process, the refrigerant is expanded by the second expansion valve 132 from the high-pressure level to an intermediate pressure level, which lies between the low-pressure and high-pressure levels. In the third heat exchanger 130, the refrigerant, expanded by the second expansion valve 132, is heated against compressed refrigerant upstream of the first expansion valve 122 and is at least partially evaporated. At the same time, the compressed refrigerant upstream of the first expansion valve 122 is supercooled (i.e., cooled further below its condensation temperature).Liquidus line cooled).

[0043] In the example shown here, the warm-side supply and discharge of the compressed refrigerant from the first refrigerant distributor 124 to the third heat exchanger 130, as well as the supply of the compressed refrigerant from the first refrigerant distributor 124 to the second refrigerant distributor 134 (and thus to the second expansion valve 132), takes place through the refrigerant channels 182 already described within the carrier plate 180.

[0044] The operation of the third heat exchanger 130 and / or the second expansion valve 132 can be monitored by means of a second sensor 170, for example a temperature and / or pressure sensor (here on the cold side downstream of the third heat exchanger 130). A further sensor 175, which can also be configured as a temperature and / or pressure sensor, is provided for monitoring the operation of the compressor 150 or the entire refrigerant circuit 100.

[0045] Refrigerant flowing out of the third heat exchanger 130 on the cold side (evaporated) is received by the second refrigerant distributor 134 and forwarded to the compressor 150. In the example shown here, the connection of the second refrigerant distributor 134 to the compressor 150 is implemented by means of a pipe and / or hose line, which leads into a second inlet port 154 (in the example shown, near a pressure-side outlet port 156) in a housing of the compressor 150. This is also referred to as vapor injection.

[0046] As mentioned at the outset, the third heat exchanger 130 can be used, in particular, to extend the thermal operating range of the refrigeration circuit 100, for example, in the case of inefficient cooling of the refrigerant in the first heat exchanger 110. This can be the case especially at high ambient temperatures. To extend the thermal operating range of the refrigerant circuit in the opposite direction, i.e., in the case of excessive cooling in the first heat exchanger 110 (for example, at very low ambient temperatures) and / or low thermal load at the second heat exchanger 120, the refrigerant circuit 100 in the example shown here is equipped with a third expansion valve 142. This valve serves to return compressed refrigerant directly to the inlet port 152 of the compressor 150, bypassing the first and second heat exchangers 110 and 120. This is also referred to as a hot gas bypass.

[0047] For this purpose, an inlet 141 of the third expansion valve 142 is directly connected to the outlet port 156 of the compressor 150. In the example shown, this fluid connection is realized by means of a pipe or hose; however, in embodiments of the invention, it can also be provided that this fluid connection of the outlet port 156 of the compressor with the inlet 141 of the third expansion valve 142 is at least partially provided by one of the refrigerant channels 182 of the carrier plate 180. In the example shown here, a valve seat of the third expansion valve 142 is integrated into the first refrigerant distributor 124. An outlet of the third expansion valve leads into the outlet 126 of the second heat exchanger 120. Thus, the first sensor 145 can also be used to monitor the operation of the third expansion valve.

[0048] Figures 8 and 9 schematically show a second embodiment of a part of a refrigerant circuit according to the invention. The second embodiment has essentially functionally identical components to the first embodiment. Therefore, the components are designated with the same reference numerals as in the preceding figures. The second embodiment of the refrigerant circuit 100 differs from the first embodiment in particular in that the carrier plate 180 has a subcooling channel 188 in addition to the refrigerant channels 182 already described. The carrier plate 180 of the second embodiment is shown schematically in Figure 10. Figures 8 to 10 are explained together below, with explicit reference to the above descriptions of Figures 1 to 7 for an explanation of the basic function of the refrigerant circuit 100 and its components.

[0049] In the second embodiment, the support plate 180 carries at least the first heat exchanger 110, which is connected here to the compressor 150 and the refrigerant channel 182 of the support plate 180 by means of a pipe-in-pipe connection. Thus, in the example shown, the inlet and outlet of the first heat exchanger 110 are located at the same position. In the example shown, it also carries the second heat exchanger 120 and a refrigerant storage tank 300, which is arranged separately from the first refrigerant distributor 124. The subcooling channel 188, like the other refrigerant channels 182 that run within the support plate, is provided in the form of a recess in the conductor layer 183 and is connected to the refrigerant storage tank 300 on the one hand and to the first refrigerant distributor 124 on the other hand using the refrigerant channels 182.

[0050] The subcooling channel 188 is located at a position where the first heat exchanger 110 is mounted on the support plate 180, so that the temperature control medium flowing through the first heat exchanger 110 also absorbs heat to subcool the refrigerant in the subcooling channel 188. As the compressed refrigerant flows through the first heat exchanger 110, it condenses, releasing heat to the temperature control medium. This process releases heat of condensation, which largely prevents a decrease in the refrigerant's temperature until the refrigerant is completely condensed (and thus no further heat of condensation can be released). Typically, such a completely condensed state is only reached near an outlet 116 of the first heat exchanger 110, or a small proportion of the refrigerant remains in the gas phase.As a result, the condensed refrigerant at outlet 116 of the first heat exchanger 110 typically has almost the same temperature as at outlet 156 of the compressor. However, phase separation takes place in the refrigerant storage tank 300 (the refrigerant, particularly the gaseous refrigerant, collects at the top of the storage tank 300, while the condensed refrigerant sinks to the bottom). Therefore, even during an operating phase of the refrigerant circuit 100, in which the refrigerant is fed as a phase mixture into an inlet 302 of the storage tank 300, purely liquid refrigerant can be drawn from an outlet 306, which is geodesically located at the bottom of the storage tank 300.This allows the temperature of the condensed refrigerant to be lowered as it flows through the refrigerant channel 188, during which further heat is transferred from the refrigerant to the temperature control medium of the first heat exchanger 110, since there is no longer any refrigerant, particularly gaseous refrigerant, present to compensate for the heat loss by the temperature control medium through the release of condensation heat. In other words, as the refrigerant flows through the subcooling channel 188, it leaves the liquidus line of its phase diagram.

[0051] In the example shown here, the first refrigerant distributor 124 also includes the dryer and / or filter 320 for removing impurities and / or water or moisture from the refrigerant. Downstream of the dryer / filter 320 is the first expansion valve 122, which expands the subcooled refrigerant into the second heat exchanger 120. As explained earlier, the refrigerant can absorb more heat (in the second heat exchanger 120) due to the subcooling, so that a smaller quantity of refrigerant is required to achieve the same thermal output. This reduces the load on the compressor 150, enabling higher efficiency and / or a smaller size with corresponding cost advantages.

[0052] It is understood that the second embodiment can also be extended with a hot gas bypass and / or with steam injection, although this is not explicitly shown in Figures 8 to 10. In particular, the support plate 180 can support not only the first heat exchanger 110 but also the second heat exchanger 120 and / or (if steam injection is provided) the third heat exchanger 130.

[0053] Typically, in operating phases where the second expansion valve 132 is active, the third expansion valve 142 is not used. Conversely, in operating phases where the third expansion valve 142 is active, the second expansion valve 132 is typically not used. In other words, typically either a hot gas bypass or a steam injection is performed, but not both simultaneously, although this is not excluded for all operating conditions and embodiments. However, in some operating phases, neither the hot gas bypass nor the steam injection may be active. In these latter operating phases, therefore, neither the second expansion valve 132 nor the third expansion valve 142 is active. As mentioned at the outset, the support plate 180 (regardless of its specific configuration, i.e.,with or without subcooling channel 188) with the components it carries (in the examples shown, these are the first refrigerant distributor 124, the second refrigerant distributor 134, the second heat exchanger 120, and / or the third heat exchanger 130) by means of a material bond. In particular, this material bond can be produced in one and the same manufacturing step as the material bond already described between the layers 181, 183, 185 of the carrier plate 180, so that a large part of the entire refrigerant circuit 100 can be connected and thus also sealed in a single manufacturing step. Preferably, the material bond is achieved in particular by soldering, bonding, or welding. Preferably, the material bond is a soldered joint, a bonded joint, or a welded joint.

[0054] The refrigerant circuit 100 can be used, in particular in a vehicle, to heat and / or cool components requiring temperature control (e.g., a traction battery of an electric vehicle, a drive unit, the vehicle cabin, or the like). For this purpose, components requiring temperature control can be thermally connected to the first heat exchanger 110 and / or the second heat exchanger 120. This can be achieved, in particular, via secondary temperature control media circuits (e.g., using water and / or a thermal oil as the temperature control medium or heat transfer medium). In this process, useful heat can be extracted from the first heat exchanger (i.e., a connected component requiring temperature control can be heated), and / or useful heat can be supplied to the second heat exchanger 120 (i.e., a connected component requiring temperature control can be cooled).

[0055] Preferably, the second heat exchanger 120 and the third heat exchanger 130 are arranged on opposite surfaces of the base plate 180. In particular, the second heat exchanger 120 and the third heat exchanger 130 are arranged opposite each other with respect to the base plate 180. Preferably, the base plate 180 extends between the second heat exchanger 120 and the third heat exchanger 130. In particular, the second heat exchanger 120 and the third heat exchanger 130 are connected to the base plate 180, especially directly, by a material bond. Preferably, the first refrigerant distributor 124, the second refrigerant distributor 134, and / or the third heat exchanger 130 are arranged on one side of the base plate 180, especially on the base plate 180. The second heat exchanger 120 is arranged on the opposite side of the base plate 180.

[0056] It is understood that the features described here need not necessarily be present in the specific combination described. Rather, other combinations of features, and possibly even individual features on their own, can also be advantageously used. The embodiment of the invention described here is therefore not to be understood as limiting the scope of protection defined in the claims.

[0057] The refrigerant can be, in particular, propane (R290), CO2 (R744), R-1234yf, or a refrigerant blend, preferably comprising propane. Preferably, it is a propane-containing refrigerant consisting, for example, of at least 90%, 95%, 98%, or 99% propane.

Claims

Claims 1. Refrigerant circuit (100) with - a compressor (150) for compressing a refrigerant, in particular gaseous, which in particular contains propane, from a suction-side low-pressure level to a discharge-side high-pressure level, - at least two heat exchangers (110, 120, 130), of which a first heat exchanger (110) and a second heat exchanger (120) are designed to transfer heat between the refrigerant and a temperature control medium, in particular a liquid, and - at least one expansion valve (122, 132, 142) for expanding refrigerant compressed by the compressor (150), wherein at least one of the at least two heat exchangers (110, 120, 130) is supported by a carrier plate (180), wherein at least one refrigerant channel (182) runs within the carrier plate (180) which is configured to convey refrigerant from or to at least one of the at least two heat exchangers (110, 120, 130) and / or from or to at least one of the at least one expansion valve (122, 132, 142).

2. Refrigerant circuit (100) according to claim 1, wherein the at least two heat exchangers (110, 120, 130) comprise a third heat exchanger (130) for transferring heat between expanded and compressed refrigerant, wherein the at least one expansion valve (122, 132, 142) comprises a first expansion valve (122) and a second expansion valve (132), wherein the second heat exchanger (120) is arranged downstream of the first expansion valve (122), and wherein the third heat exchanger (130) is arranged upstream of the first expansion valve (122) on the hot side and upstream of the compressor (150) on the cold side. wherein the second expansion valve (132) is designed to expand at least partially condensed refrigerant and is arranged on the warm side downstream of the first heat exchanger (110) and on the cold side upstream of the third heat exchanger (130).

3. Refrigerant circuit (100) according to claim 2, wherein the compressor (150) has on the suction side a first inlet port (152) for expanded refrigerant flowing out on the cold side from the at least one second heat exchanger (120), and a second inlet port (154) separate from the first inlet port (152) for expanded refrigerant leaving the third heat exchanger (130) on the cold side.

4. Refrigerant circuit (100) according to claim 3, wherein the second inlet port (154) is arranged between the first inlet port (152) and a pressure-side outlet port (156) of the compressor (150) and is configured to feed the refrigerant leaving the third heat exchanger (130) into the compressor (150) at an intermediate pressure level that lies between the low-pressure level and the high-pressure level.

5. Refrigerant circuit (100) according to one of the preceding claims, wherein the at least one expansion valve (122, 132, 142) comprises a third expansion valve (142) which has a direct fluid connection (141) to a pressure-side outlet port (156) of the compressor (150) and is configured to expand the refrigerant compressed by the compressor (150), and wherein a valve outlet of the third expansion valve (142) has a direct fluid connection to a suction-side outlet (126) of the second heat exchanger (120) and / or a suction-side inlet port (152) of the compressor (150).

6. Refrigerant circuit (100) according to one of the preceding claims, comprising a first refrigerant distributor (124) for receiving and conveying refrigerant compressed by the compressor (150) and at least partially condensed by the first heat exchanger (110), and a second refrigerant distributor (134) for receiving and conveying refrigerant that has been conveyed by the first refrigerant distributor (124) and has at least partially condensed, wherein the first refrigerant distributor (124) and the second refrigerant distributor (134) are provided as separate components, wherein a fluid-conducting connection exists between the first refrigerant distributor (124) and the second refrigerant distributor (134), wherein the fluid-conducting connection is formed at least partially by the at least one refrigerant channel (182) which runs within the support plate (180).

7. Refrigerant circuit (100) according to claim 6, wherein the first refrigerant distributor (124) and / or the second refrigerant distributor (134) have a receptacle, in particular a valve seat, and a valve outlet for the at least one expansion valve (122, 132, 142).

8. Refrigerant circuit (100) according to one of the preceding claims, wherein the support plate (180) is metallurgically connected to the at least one heat exchanger (110, 120, 130) supported by it and / or, if referred back to claim 6 at least, to the first refrigerant distributor (124) and / or the second refrigerant distributor (134).

9. Refrigerant circuit (100) according to one of the preceding claims, wherein the support plate (180) supports all heat exchangers (110, 120, 130) used in the refrigerant circuit (100) and / or all refrigerant distributors (124, 134) used in the refrigerant circuit (100).

10. Refrigerant circuit (100) according to one of the preceding claims, comprising a refrigerant storage (300) for at least partially condensed refrigerant downstream of the first heat exchanger (110), wherein the support plate supports at least the first heat exchanger (110) and wherein a subcooling channel (188) runs within the support plate (180), which is arranged downstream of the refrigerant storage (300) and upstream of the at least one expansion valve (122) and is configured to subcool the condensed refrigerant from the refrigerant storage (300) against the temperature control medium flowing through the first heat exchanger (110).

11. Carrier plate (180) for a refrigerant circuit (100) according to one of the preceding claims, comprising a base layer (181), a cover layer (185) and a conduction layer (183) arranged between the base layer (181) and the cover layer (185), wherein the at least one refrigerant channel (182) is formed as a recess in the conduction layer (183), and wherein the cover layer (185) and / or the base layer (181) have at least one bore (184, 186) which opens into the at least one refrigerant channel (182) of the conduction layer (183), wherein the base layer (181) and the cover layer (185) are each materially bonded to the conduction layer (183).

12. Support plate (180) according to claim 11, which is configured to support at least the first heat exchanger (110), and which comprises a subcooling channel (188) configured to subcool condensed refrigerant against temperature control medium flowing through the first heat exchanger (110), wherein the subcooling channel (188) is designed as a recess in the conductor layer (183) and is connectable to a refrigerant storage tank (300) and the at least one expansion valve (122) by means of at least one refrigerant channel (182) and / or by means of at least one bore (184, 186).

13. Vehicle with a refrigerant circuit (100) according to one of claims 1 to 10 and at least one component to be tempered, which is thermally connected to the at least one first and / or second heat exchanger (110, 120).

14. Vehicle according to claim 13 with a carrier plate (180) according to claim 11 or 12.

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