Cooling assembly and power conversion assembly comprising such a cooling assembly

The cooling arrangement for wireless charging devices in battery electric vehicles addresses inefficiencies by using a heat sink with conductive elements and a fan for enhanced heat dissipation, improving reliability and simplifying maintenance, while reducing weight and costs.

WO2025224227A1PCT designated stage Publication Date: 2025-10-30BRUSA ELEKTRONIK AG
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Patent Information

Application Number
PCT/EP2025/061182
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-25
Filing Date
2025-04-24
Publication Date
2025-10-30

AI Technical Summary

Technical Problem

Existing cooling arrangements for wireless charging devices in battery electric vehicles are inefficient and complex, leading to potential functional impairment or damage from waste heat generated during inductive energy transfer.

Method used

A cooling arrangement featuring a heat sink with thermally conductive elements projecting into an air duct, a fan for airflow, and a detachable or bonded connection to a housing, optimized for heat dissipation and space efficiency, using materials with high thermal conductivity and potentially incorporating heat pipes for passive cooling.

Benefits of technology

Enhances heat dissipation efficiency, improves reliability, and simplifies maintenance, while reducing weight and manufacturing costs, ensuring effective thermal management and extended service life of power components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a cooling assembly (10) for cooling heat-generating power components, in particular in a wireless charging device for charging a battery-powered electric vehicle, comprising at least one heat-generating power component (11) and a cooling device (12) comprising a housing (1) having at least one air inlet opening (2) and at least one air outlet opening (3), an air channel (4) being formed between the air inlet opening (2) and the air outlet opening (3), and a heat sink (5) having a plurality of thermally conductive elements (6), the heat sink (5) being thermally conductively connected to the at least one power component (11) to absorb heat from the at least one power component (11), and the thermally conductive elements (6) being designed to dissipate the heat to a medium surrounding the heat sink (5), the thermally conductive elements (6) of the heat sink (5) projecting into the air channel (4) at least in part, and a cooling fan (7) being arranged in the air channel (4) and being designed to move cooling air through the air channel (4) and past the thermally conductive elements (6).
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Description

[0001] COOLING ARRANGEMENT AND SUCH A COMPREHENSIVE

[0002] POWER CONVERSION ORDER

[0003] The present invention relates to a cooling arrangement for cooling heat-generating power components, in particular in a wireless charging device for charging a battery electric vehicle, and to a power conversion arrangement comprising such a cooling arrangement.

[0004] Electric vehicle batteries can be charged with alternating current (AC) or direct current (DC). Typical AC chargers can provide a charging power of up to 22 kW. AC charging systems can be divided into wired and wireless charging systems, with wireless charging systems primarily implemented as inductive charging systems (ICS). An ICS typically consists of two separate modules, often referred to as the ground pad module (GPM) and the car pad module (CPM).The GPM, which can also be described as a power conversion device for converting the electrical power of an electric supply current into the electromagnetic power of an oscillating electromagnetic field, is installed outside the electric vehicle and comprises at least one electromagnetic (transmitter) coil, while the CPM is located inside, usually on the underside of the electric vehicle, and comprises at least one electromagnetic (receiver) coil electrically connected to the electric vehicle's battery. The electromagnetic interaction between the GPM and the CPM enables energy transfer from the GPM to the CPM and vice versa, and the CPM is then used to charge the electric vehicle's battery. Wireless charging systems are often more convenient for the user, as they typically do not require any manual intervention to initiate battery charging beyond placing the vehicle over the GPM.In the operation of such a power conversion arrangement, i.e., in the inductive transfer of electrical energy between GPM and electric vehicle, waste heat is typically generated, which can lead to functional impairment or even damage to heat-generating power components and / or other heated components of the power conversion arrangement.

[0005] In the prior art, it is known to provide a cooling arrangement in connection with electrical appliances in which a heat-generating component is thermally connected to a heat sink for cooling purposes. Furthermore, it is known to direct a flow of cooling medium along the component for cooling.

[0006] The object of the present invention is to further develop a cooling arrangement of the type mentioned above and a power conversion arrangement comprising such a cooling arrangement, wherein the cooling effect is to be implemented more effectively, and wherein the cooling arrangement is preferably to be simpler in manufacture and / or more reliable in cooling operation.

[0007] The problem is solved by the cooling arrangement with the features of independent claim 1. The dependent claims, the description, and the figures describe further developments and special embodiments of the invention.

[0008] According to a first aspect, the present invention relates to a cooling arrangement for cooling heat-generating power components, particularly in a wireless charging device for charging a battery electric vehicle. The cooling arrangement comprises at least one heat-generating power component and a cooling device. The cooling device includes a housing with at least one air inlet opening and at least one air outlet opening, wherein an air duct is formed between the air inlet opening and the air outlet opening. A heat sink with a plurality of thermally conductive elements is provided. The heat sink is thermally connected to the at least one power component to absorb heat, and the thermally conductive elements are designed to dissipate the heat to a medium surrounding the heat sink. The thermally conductive elements of the heat sink project at least partially into the air duct.The cooling arrangement also includes a fan located in the air duct, which is designed to move cooling air through the air duct and past the heat conducting elements.

[0009] The term “cooling arrangement” in the context of the present invention can be understood as a system comprising a combination of at least one heat-generating power component and a cooling device with a heat sink as described herein.

[0010] The term "heat-generating power component" can refer to any component that generates heat as a byproduct of its function, especially those used in wireless charging devices for electric vehicles.

[0011] The term "housing" can refer to a structural part that encloses other components, usually for protection or to ensure proper airflow.

[0012] The term "air duct" can be considered a path through which air flows within the housing, thus facilitating heat exchange.

[0013] The term "heat-conducting elements" can refer to structures that conduct heat well and extend from the heat sink to transfer thermal energy into the medium surrounding the heat sink.

[0014] The heat-conducting elements projecting into the air duct improve heat dissipation from the power components and increase cooling efficiency. Because the power components are thermally connected to the heat sink, direct and effective heat transfer is ensured. The fan in the air duct enables a uniform airflow and facilitates the removal of stale air from the cooling unit. Overall, this results in a compact cooling system design that can be installed in a space-saving manner, particularly with optimal space utilization within the vehicle structure.The cooling device is further characterized by the fact that the arrangement and design of the heat-conducting elements in the airflow can be specifically adapted to the thermal requirements of various power components, thus enabling particularly effective thermal management, which can lead to increased reliability and service life of the power components.

[0015] In embodiments, the housing may have an opening, in particular a milled recess, for at least partial reception of the heat sink in the opening.

[0016] The term “opening”, in the context of the present invention, may be understood as an interruption in the continuity of the housing, which is designed to accommodate or allow other components to pass through.

[0017] The term "milling" can be considered a special type of opening, which is created, for example, by removing material from the housing and serves to adapt to the shape or contour of other components, such as the heat sink.

[0018] By providing an opening in the housing to at least partially accommodate the heatsink, the heatsink's installation and removal are facilitated, thus simplifying maintenance. Positioning the heatsink within an opening, particularly a milled recess, can also contribute to improved mechanical integration and stabilization of the heatsink within the housing. Designing the opening as a milled recess is simple to manufacture and allows its shape to be precisely adapted to the heatsink being accommodated. The precise fit between the heatsink and the housing can help prevent vibrations that can be caused by looser fits.

[0019] In some embodiments, the heat sink may be detachably connected to the housing.

[0020] The term “detachably connected” may be understood in the context of the present invention as a method of connection between two components which allows for easy separation of the connection without damaging the parts involved.

[0021] A detachable connection between the heat sink and the housing allows for easy installation, maintenance, and / or replacement of the heat sink during manufacturing, repairs, or technological advancements, thus increasing the serviceability and user-friendliness of the cooling system. The detachable connection to the housing can also potentially provide better access to other components within the housing, simplifying inspections and repairs.

[0022] In some embodiments, the heat sink may be materially bonded to the housing.

[0023] The bonded connection ensures a robust and durable bond between the heat sink and the housing, withstanding high thermal and mechanical stresses, which can lead to a longer service life for the cooling device and / or cooling assembly. Furthermore, a bonded connection between the heat sink and housing can improve thermal conductivity at the interface, thus contributing to increased heat dissipation efficiency. The elimination of additional fasteners, such as screws or rivets, in a bonded connection results in a simpler design and reduced complexity. In particular, the heat sink can be friction-welded to the housing.

[0024] The term "friction welded" can be considered a specific type of material-bonded connection in which heat generated by friction and pressure is used to weld the parts to be joined.

[0025] Friction welding as a method for producing the material-jointed connection can reduce manufacturing costs, as it is usually faster and requires less material compared to other material-jointed connection methods.

[0026] In embodiments, it may be provided that the heat sink forms at least a section of the air duct or completes it together with the housing.

[0027] The term “section” may be understood in the context of the present invention as a part or segment of the air duct.

[0028] The term "completed" can be understood as the completion or finishing of an object by adding missing parts, here specifically the at least partial completion of the air duct by the heat sink, possibly together with the housing.

[0029] The functional and spatial integration of the heat sink into the air duct can save space and reduce the overall weight of the cooling arrangement.

[0030] In some embodiments, the heat sink may have a base plate on which the heat-conducting elements are arranged. In the context of the present invention, the term "base plate" may be understood as the base or framework of a heat sink on which other elements, such as heat-conducting elements, are mounted or attached.

[0031] The presence of a base plate on the heat sink can contribute to a more even distribution of the heat generated by the power components, thus improving thermal efficiency. Furthermore, the base plate can also serve as a mounting surface for the heat sink, simplifying its installation and maintenance within the cooling system. The base plate can also ensure the mechanical stability of the heat-conducting elements, potentially increasing the lifespan and reliability of the cooling arrangement. Finally, a base plate allows for easier connection of heat-conducting elements of varying shapes and / or sizes, improving the heat sink's adaptability to specific requirements.

[0032] In some designs, the heat-conducting elements can be arranged on the side of the base plate facing away from the power components. This allows for particularly effective heat dissipation from the power components.

[0033] In embodiments, it may be provided that the heat-conducting elements are designed in the form of cooling fins extending in the longitudinal direction of the air duct, which at least partially delimit one or more cooling channels.

[0034] The term "cooling fins" in the context of the present invention may be understood as elongated elevations or projections that increase the surface area of ​​a heat sink. This improves heat transfer to the ambient air.

[0035] Such a heat sink has a comb-shaped cross-section and is particularly easy and therefore cost-effective to manufacture. Compared to a cooling plate with a smaller surface area, the heat from the heat sink can be dissipated or transferred more effectively to the cooling medium flow. Furthermore, the extension of the cooling fins along the air duct can help maintain a laminar flow of the cooling air, which may further improve heat transfer.

[0036] In embodiments, it can be provided that the cooling fins extend over at least 75%, preferably over at least 95%, particularly preferably over substantially the entire size of the clear height of the air duct in the area of ​​the heat sink.

[0037] The term “clear height” may be understood in the context of the present invention as the inner, free vertical dimension of the air duct, in particular orthogonal to the extent of the base plate of the heat sink, which is available for the airflow.

[0038] If the cooling fins extend far into the cooling air duct, the surface area available for heat transfer is larger, which increases the efficiency of the heat exchange. Furthermore, by almost or completely filling the clear height of the air duct with cooling fins, a uniform heat input into the airflow can be ensured, resulting in consistent cooling performance.

[0039] In some embodiments, the heat sink may be designed as a continuous cast profile or an extruded molded part.

[0040] The term "continuous cast profile" may be understood in the context of the present invention as a profile produced by a continuous casting process, in which the metal is poured into a permanent mold to obtain continuous sections with a specific cross-section. Continuous cast profiles and extruded parts are often very cost-efficient to produce because they generate little material waste and are well suited for mass production. For example, the continuous casting process is a particularly advantageous method for manufacturing a heat sink with cooling fins because it allows for simple and cost-effective production of the heat sink in a single operation.

[0041] The term "extruded part" can be understood as a component that is created by the process of extrusion, in which a material, typically metal, is forced through a die or mold to produce more complex shapes and profiles.

[0042] Advantages of extrusion include the ability to produce profiles in complex shapes and from materials that are difficult to form.

[0043] In some embodiments, the heat-conducting elements and the base plate may be made of different materials.

[0044] Using different materials for the heat sink elements and the base plate allows each of these components to be optimized for specific thermal or mechanical requirements, thus improving the overall performance of the cooling system. In particular, materials with higher thermal conductivity than the base plate can be used for the heat sink elements, enabling faster and more efficient heat transfer from the base plate to the surrounding air via the heat sink elements. A base plate made of a material with higher mechanical strength can reinforce the heat sink structure and increase the cooling system's lifespan. Furthermore, using different materials for one, several, or all of the heat sink elements and the base plate allows for adaptation to varying environmental conditions, such as humidity or corrosive atmospheres.This increases the reliability of the cooling system.

[0045] In some embodiments, the fan may be a radial fan.

[0046] The term “radial fan” may be understood in the context of the present invention as a design of a fan in which the air is conveyed radially, i.e. at an angle to the drive axis of the fan.

[0047] Due to their design, radial fans are particularly suitable for use in harsh and / or dirty environments, such as those potentially encountered in the operation of battery-electric vehicles. They can also generate high static pressure and are therefore especially well-suited for forcing air through narrow and convoluted heat sink designs.

[0048] In embodiments, the heat sink may comprise at least one heat conducting device, wherein a working medium is contained within the heat conducting device. This medium is circulated by undergoing a phase transition between a hot zone, a cold zone, and a transport zone of the heat conducting device connecting the hot zone and the cold zone. The hot zone is arranged in the area of ​​the power components to accommodate the housings of the at least one power component, and the cold zone is thermally connected to the heat conducting elements to dissipate the absorbed heat.

[0049] In particular, the at least one heat conduction device is at least partially arranged in the base plate of the heat sink. Specifically, the at least one heat conduction device extends longitudinally along the air duct, with the cold zone arranged upstream of the hot zone.

[0050] Such a heat conducting device is also known in principle as a "heat pipe". 1(English "heatpipe") is known and capable of dissipating heat in the base plate of the heat sink over longer distances without the need for an external pump, and more effectively than the heat conductors typically used as base plate materials. The heat dissipation mechanism is based on a phase transition, i.e., from the liquid to the gaseous state, and the transport of mass. The tubular structure is tightly sealed at both ends and contains a liquid as the working medium, in which very low pressure is maintained. In some embodiments, the pipe is made of copper, and water is used as the liquid. When one end of the pipe is heated, the water evaporates, i.e., it changes from the liquid to the gaseous phase. Due to the associated pressure increase, the water vapor flows to the cold end of the pipe. There, the water vapor releases energy and condenses back into a liquid.Capillary action transports the liquid water back to the heated end of the tube. This dynamic process repeats itself, resulting in heat dissipation that is many times greater, in particular hundreds to several thousand times greater, than that of a conventional heat conductor of comparable dimensions used as a base plate material. Because the heat pipe is hollow, it offers the additional advantage of being significantly lighter than a comparable solid profile. Furthermore, such a heat-conducting device enables passive cooling, requiring no moving parts and thus offering low maintenance and long-term reliability.

[0051] In some embodiments, the heat sink may be made of a material whose thermal conductivity 1 is at least equal to, and preferably greater than, the thermal conductivity of a material used in the housing. The term "thermal conductivity" in the context of the present invention may be understood as a measure of a material's ability to transfer heat by conduction. Thermal conductivity is usually expressed in watts per meter Kelvin (W / mK).

[0052] Using a heatsink material with a higher thermal conductivity than the housing material can help the housing act as a reliable thermal barrier, preferentially dissipating heat through the designated cooling structures. In other words, the heatsink acts as a heat sink, absorbing heat from the housing and thus exerting a cooling effect on it. This allows the heat generated by the power components to be more effectively contained locally, i.e., within the area of ​​the heatsink, preventing or at least significantly reducing the heating of the housing.

[0053] In embodiments, it may be provided that the heat-conducting elements are made of a material with a thermal conductivity 1 of at least 200 W / mK.

[0054] In some embodiments, the heat-conducting elements may be made of a metal. Preferably, the heat-conducting elements are made of aluminum, in particular anodized aluminum, or of copper.

[0055] Compared to ceramic materials, for example, metallic materials have good thermal conductivity and are easy to process. Anodized aluminum has particularly good heat dissipation and is less expensive than copper.

[0056] In some embodiments, the heat sink may be designed to dissipate a power loss density of more than 100,000 W / m². 2This is designed to reliably cool the power components of a wireless charging device for charging a battery-electric vehicle. In some embodiments, the cooling arrangement may include a temperature sensor that is thermally connected to the heat sink. Alternatively or additionally, the cooling arrangement may include a temperature sensor that is connected to at least one of the power components.

[0057] The integration of temperature sensors allows for the measurement of the heatsink and power components' temperatures. This enables, for example, the control of fan speed based on the measured temperature of the heatsink and / or power components. This can positively impact the reliability of the cooling system and the lifespan of the power components.

[0058] In some embodiments, the cooling arrangement may include at least two heat-generating power components, which are arranged on the side of a base plate of the heat sink facing the power components in such a way that the distance d between two adjacent power components is at least twice the thickness h of the base plate. This ensures optimal and uniform utilization of the cooling surface of the heat sink and prevents the formation of hot spots.

[0059] In some embodiments, thermal insulation may be arranged between the heat sink and a heat-sensitive component of the cooling arrangement to protect the heat-sensitive component from the heat of the at least one power component. The thermal insulation may, in particular, be a heat shield, which is made of aluminum, for example.

[0060] According to a second aspect, the present invention relates to a power conversion arrangement for converting the electrical power of an electrical supply current into the electromagnetic power of an oscillating electromagnetic field. The power conversion arrangement comprises a magnetic assembly for receiving an alternating electrical current and for emitting an oscillating electromagnetic field, an electronic assembly for receiving or supplying the electrical supply current and for converting it into an alternating electrical current to supply the magnetic assembly, and at least one cooling arrangement according to one of the previously described embodiments for dissipating heat generated by at least one power component of the magnetic assembly and / or by at least one power component of the electronic assembly during their respective power conversion operation.

[0061] Such a power conversion arrangement is characterized by the respective advantages as described in relation to the respective embodiments described above.

[0062] The invention will now be explained in more detail with reference to exemplary embodiments illustrated in the accompanying figures. These figures schematically show:

[0063] Figure 1 shows a cooling arrangement in a perspective view;

[0064] Figure 2 shows the cooling arrangement from Figure 1 in a side view;

[0065] Figure 3 shows another embodiment of a cooling arrangement in a perspective view;

[0066] Figure 4 shows a cross-section of the cooling arrangement from Figure 3 along line AA in Figure 3;

[0067] Figure 5 shows a power conversion arrangement and a cooling arrangement. The embodiments described below are merely examples of the invention and do not limit its scope. In principle, identical parts in the figures are designated with the same reference numerals.

[0068] Figure 1 shows a cooling arrangement 10 comprising two heat-generating power components 11 and a cooling device 12 in a perspective view. The cooling device 12 itself comprises a housing 1 with an air inlet opening (not shown in Figure 1), an air outlet opening 3, and an air duct 4 formed between the air inlet opening and the air outlet opening 3. A fan 7 is arranged in the air duct 4, which in the embodiment shown in Figure 1 is a radial fan. The radial fan 7 is designed to move cooling air through the air duct 4. The air inlet opening (not shown in Figure 1) can be the air supply arranged in the axial direction of the radial fan 7, which, viewed in the direction of flow of the cooling air through the air duct 4, defines the beginning of the air duct 4.The cooling device 12 further comprises a heat sink 5 with a plurality of heat-conducting elements 6, which are designed in the form of cooling fins extending longitudinally L along the air duct 4 and between which several cooling channels are defined. The heat sink 5, for absorbing heat from the two power components 11, is thermally connected to them. The heat-conducting elements 6 of the heat sink 5 project into the air duct 4. Thus, the radial fan 7 is also designed to move the cooling air past the heat-conducting elements 6 of the heat sink 5. The heat-conducting elements 6 are designed to dissipate the heat to a medium surrounding the heat sink 5, i.e., the cooling air.

[0069] Figure 2 shows the cooling arrangement 10 from Figure 1 in a side view of the air outlet opening 3. The housing 1 has an opening 8 in which the heat sink 5 is at least partially received. The heat sink 5 has a base plate 5a, with the two heat-generating power components 11 arranged on the side 5b of the base plate 5a facing the power components, and the heat-conducting elements designed as cooling fins 6, 6' on the side 5c of the base plate 5a facing away from the power components. In the embodiment shown in Figure 2, the cooling fins 6, 6' extend over substantially the entire height of the air duct in the area of ​​the heat sink 5, with adjacent cooling fins 6, 6' each defining a cooling channel 4a between them.

[0070] Figure 3 shows another embodiment of a cooling arrangement 10 comprising a cooling device 12 and four heat-generating power components 11. The cooling device 12 has a housing 1 with an air inlet opening 2 and an air outlet opening 3, as well as a fan 7 arranged between the air inlet opening 2 and the air outlet opening 3, which is designed to move cooling air through the air duct 4 extending between the air inlet opening 2 and the air outlet opening 3. Upstream of the air outlet opening 3, a heat sink 5 is arranged in the air duct 4, which is at least partially received in a recess in the housing 1, such that the heat-conducting elements 6 of the heat sink 5 project at least partially into the air duct 4.In the embodiment shown in Figure 3, the heat sink 5 comprises two heat conduction devices 9, each arranged in the base plate 5a of the heat sink 5 and extending longitudinally L of the air duct 4. Each heat conduction device 9 contains a working medium which is circulated by undergoing a phase transition between a hot zone 9a, a cold zone 9c, and a transport zone 9b connecting the hot zone 9a and the cold zone 9c of the respective heat conduction device 9. The hot zones 9a of the two heat conduction devices 9 are arranged in the area of ​​the four power components 11 to absorb the heat from the power components 11. In other words, the hot zones 9a of the respective heat conduction devices 9 extend, viewed longitudinally L of the air duct 4, over the section of the heat sink 5 or the air duct 4 in which the four heat-generating power components 11 are arranged.The cold zones 9c of the two heat conducting devices 9 are arranged upstream of the hot zones 9a and are thermally connected to the heat conducting elements 6 to dissipate the absorbed heat, as can be seen in more detail in the following figure 4.

[0071] Figure 4 shows the cooling arrangement 10 from Figure 3 in a cross-section through the air duct 4 along the dashed line AA in Figure 3. The heat pipes 9, 9' are each designed as heat pipes and run within the base plate 5a of the heat sink 5. The two heat pipes 9, 9' are thermally connected to the power components 11, 11' on the side 5b of the base plate 5a of the heat sink 5 facing the power components 11, 11' to absorb heat from the power components 11, 11'. On the other hand, the two heat pipes 9, 9' are thermally connected to the heat conductors 6 arranged on the side 5c of the base plate 5a facing away from the power components 11, 11' to dissipate the absorbed heat, in particular via the base plate 5a.The two heat-conducting devices 9, 9' can absorb the heat generated by the power components 11, 11' in their hot zones, transport it upstream of the air duct 4 towards the cold zones, and ultimately dissipate it to the cooling air in the air duct 4 via the base plate 5a and the heat-conducting elements 6. In embodiments comprising at least two heat-generating power components 11, 11', it is conceivable, as shown in Figure 4, that the power components 11, 11' are arranged on the side 5b of the base plate 5a of the heat sink 5 facing the power components 11, 11' such that the distance d between two adjacent power components 11, 11' corresponds to at least twice the thickness h of the base plate 5a.

[0072] Figure 5 shows a cutaway view of a power conversion arrangement 100 according to an embodiment of the present invention. A magnetic assembly 20 with a main coil assembly and magnetic flux guide elements 21, which are arranged in a housing 22, forms a first device section 110. A second device section 120 comprises an electronic assembly 30 with a power electronics unit. This unit supplies power to the main coil of the magnetic assembly 20 or is supplied by it, depending on the direction of the energy flow.The second device area 120 has a cooling arrangement 10 with a cooling device according to one of the embodiments described above, wherein the cooling arrangement 10 is designed to dissipate heat generated by at least one power component of the magnetic assembly 20 and / or by at least one power component of the electronic assembly 30 during their respective power conversion operation.

[0073] REFERENCE MARK LIST

[0074] 1 case

[0075] 2 air intake openings

[0076] 3 air outlet openings

[0077] 4 air duct

[0078] 4a Cooling channel

[0079] 5 heat sinks

[0080] 5a Base plate of the heat sink

[0081] 5b Side of the heat sink facing the power components

[0082] 5 c Side of the base plate facing away from the power components

[0083] 6 Heat conducting element

[0084] 7 fans

[0085] 8 Housing opening

[0086] 9 Heat conducting device

[0087] 9a Warm zone

[0088] 9b Transport Zone

[0089] 9 c Cold zone

[0090] 10 Cooling arrangement

[0091] 11 Power component

[0092] 12 Cooling unit 13 Temperature sensor

[0093] 20 Magnetic assembly

[0094] 30 Electronic assembly

[0095] 100 Power conversion arrangement d Distance between two adjacent power components h Thickness of the base plate

[0096] L Longitudinal direction of the cooling channel

Claims

PATENT CLAIMS 1. Cooling arrangement (10) for cooling heat-generating power components, in particular in a wireless charging device for charging a battery electric vehicle, comprising at least one heat-generating power component (11) and a cooling device (12) comprising a housing (1) with at least one air inlet opening (2) and at least one air outlet opening (3), wherein an air duct (4) is formed between the air inlet opening (2) and the air outlet opening (3), and a heat sink (5) with a plurality of heat-conducting elements (6), wherein the heat sink (5) is thermally connected to the at least one power component (11) for absorbing heat from the power component (11), and wherein the heat-conducting elements (6) are designed for dissipating the heat to a medium surrounding the heat sink (5), characterized in that the heat-conducting elements (6) of the heat sink (5) project at least partially into the air duct (4),and that a fan (7) is arranged in the air duct (4) which is designed to move cooling air through the air duct (4) and past the heat conducting elements (6), 2, The cooling arrangement (10) according to claim 1, characterized in that the housing (1) has an opening (8), in particular a milled recess, for at least partial reception of the cooling element (5) in the opening (8).

3. The cooling arrangement (10) according to claim 1 or 2, characterized in that the heat sink (5) is detachably connected to the housing (1).

4. The cooling arrangement (10) according to claim 1 or 2, characterized in that the heat sink (5) is materially bonded to the housing (1), in particular the heat sink (5) is friction welded to the housing (1).

5. The cooling arrangement (10) according to one of the preceding claims, characterized in that the cooling element (5) forms at least a section of the air duct (4) or completes it together with the housing (1).

6. The cooling arrangement (10) according to one of the preceding claims, characterized in that the heat sink (5) has a base plate (5a) on which the heat conducting elements (6) are arranged.

7. The cooling arrangement (10) according to claim 6, characterized in that the heat conducting elements (6) are designed in the form of cooling fins (6) extending in the longitudinal direction L of the air duct (4), which at least partially delimit one or more cooling ducts (4a).

8. The cooling arrangement (10) according to claim 7, characterized in that the cooling fins (6) extend over at least 75%, preferably over at least 95%, particularly preferably over substantially the entire size of the clear height of the air duct (4) in the area of ​​the cooling body (5).

9. The cooling arrangement (10) according to one of claims 6 to 8, characterized in that the cooling element (5) is designed as a continuous cast profile or extruded molded part. 10, The cooling arrangement (10) according to one of claims 6 to 8, characterized in that the heat conducting elements (6) and the base plate (5a) are made of different materials.

11. The cooling arrangement (10) according to claim 10, characterized in that the heat conducting elements (6), the base plate (5a) and the housing (1) are made of different materials.

12. The cooling arrangement (10) according to one of the preceding claims, characterized in that the fan (7) is a radial fan.

13. The cooling arrangement (10) according to one of the preceding claims, characterized in that the cooling element (5) comprises at least one heat conducting device (9), wherein a working medium is contained within the heat conducting device (9), which is circulatory by undergoing a phase transition between a hot zone (9a), a cold zone (9c), and a transport zone (9b) of the heat conducting device (9) connecting the hot zone (9a) with the cold zone (9c), wherein the hot zone (9a) is arranged in the area of ​​the power components (11) for absorbing the heat of the at least one power component (11), and wherein the cold zone (9c) is thermally connected to the heat conducting elements (6) for dissipating the absorbed heat.

14. The cooling arrangement (10) according to one of the preceding claims, characterized in that the heat sink (5) consists of a material whose thermal conductivity X is at least equal to, preferably greater than, the thermal conductivity of a material of the housing (1).

15. Power conversion arrangement (100) for converting the electrical power of an electrical supply current into electromagnetic power of an oscillating electromagnetic field, comprising a magnetic assembly (20) for receiving an alternating electric current and for emitting an oscillating electromagnetic field, an electronic assembly (30) for receiving / releasing the electric supply current and for converting it into an electrical Alternating current for supplying the magnetic assembly (20), and at least one cooling arrangement (10) according to one of claims 1 to 14 for dissipating heat generated by at least one power element (1) of the magnetic assembly (20) and / or by at least one power element (11) of the electronic assembly (30) during their respective power conversion operation.

Citation Information

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